JP2003283161A - Structure of driving unit or control unit of motor - Google Patents
Structure of driving unit or control unit of motorInfo
- Publication number
- JP2003283161A JP2003283161A JP2002087606A JP2002087606A JP2003283161A JP 2003283161 A JP2003283161 A JP 2003283161A JP 2002087606 A JP2002087606 A JP 2002087606A JP 2002087606 A JP2002087606 A JP 2002087606A JP 2003283161 A JP2003283161 A JP 2003283161A
- Authority
- JP
- Japan
- Prior art keywords
- driver
- electric motor
- electronic components
- control device
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電動機の駆動装
置、又は、電動機又は電動機の駆動装置を制御する制御
装置等の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a drive device for an electric motor, or a control device for controlling the electric motor or the drive device for the electric motor.
【０００２】[0002]
【従来の技術】従来、この種の電動機の駆動装置又は前
記制御装置(以下、総称してドライバという)としては、
例えば、図１２に示すようなものがある。前記ドライバ
１０１は、前記電動機１０２を駆動する駆動回路、又は
前記電動機を制御する制御回路を構成する複数の電子部
品を取り付けた誘電体基板を備える、すなわち実装基板
を有する実装基板型の図示しないドライバ本体１０３
と、それを収容するドライバケース１０４とからなって
おり、該ドライバ１０１の大きさは、電動機１０２と比
較して同等以上である。そして、該ドライバ１０１と前
記電動機１０２とは、通常、リード線やケーブル１０５
などにより相互に接続されている。2. Description of the Related Art Conventionally, as a drive device for the electric motor of this type or the control device (hereinafter collectively referred to as a driver),
For example, there is one as shown in FIG. The driver 101 includes a dielectric substrate on which a plurality of electronic components forming a drive circuit for driving the electric motor 102 or a control circuit for controlling the electric motor are mounted, that is, a mounting board type driver (not shown) having a mounting board. Body 103
The size of the driver 101 is equal to or larger than that of the electric motor 102. The driver 101 and the electric motor 102 are normally connected to each other through a lead wire or a cable 105.
Are connected to each other.
【０００３】前記ドライバ１０１の出力部が端子構造の
場合は、前記電動機１０２のリード線は端子ねじにより
接続され、該ドライバ１０１の出力部がコネクタ構造の
場合は、前記電動機１０２のケーブル１０５は一対のコ
ネクタ（プラグ及びレセプタクル）１０６を介して接続
されている。When the output part of the driver 101 has a terminal structure, the lead wires of the electric motor 102 are connected by terminal screws, and when the output part of the driver 101 has a connector structure, the cable 105 of the electric motor 102 is paired. Connector (plug and receptacle) 106.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の前記ドライバ１０１にあっては、サイズ（外
形寸法）が大きく、またリード線やケーブル１０５など
を用いて、前記ドライバ１０１と前記電動機１０２とを
接続する必要があったため、結果として、かなりのスペ
ースを要するという問題点があった。However, in such a conventional driver 101 as described above, the size (outer dimension) is large, and the driver 101 and the electric motor 102 are provided by using the lead wire, the cable 105 and the like. Since it was necessary to connect and, as a result, there was a problem that a considerable space was required.
【０００５】他方、制御装置や駆動装置を必要とする、
ステッピングモータやサーボモータなどの制御用モータ
は、何らかの装置（例えば、ユーザ側の装置）内部の動
力源として用いられることが多い。そのため、これらの
電動機の駆動装置や制御装置（前記ドライバと同じ）
は、ユーザ側の大本（おおもと）の装置の制御系に組み
込まれて、使用されるのが理想的である。換言すれば、
前記大本の装置自体の回路基板に実装されるような使用
法が、理想的である。On the other hand, it requires a control device and a drive device,
A control motor such as a stepping motor or a servo motor is often used as a power source inside some device (for example, a device on the user side). Therefore, drive devices and control devices for these motors (the same as the driver)
Ideally, is used by being incorporated in the control system of the main device on the user side. In other words,
Ideally, the usage is such that it is mounted on the circuit board of the main device itself.
【０００６】しかしながら、このような前記ドライバ１
０１にあっては、通常、該ドライバ１０１は、あくまで
電動機１０２を駆動するための独立した装置であるとい
う、固定的な発想でできており、前記何らかの装置に組
み込まれる場合の利便性は、考慮されていなかった。し
たがって、前記何らかの装置に組み込まれる場合、前記
ドライバ１０１を大本の装置自体の回路基板に実装する
ことができず、使い勝手が悪いという問題点があった。However, such a driver 1
In 01, the driver 101 is usually based on a fixed idea that it is an independent device for driving the electric motor 102, and the convenience when incorporated in any of the above devices is considered. Was not done. Therefore, when incorporated into any of the above devices, the driver 101 cannot be mounted on the circuit board of the main device itself, and there is a problem that the usability is poor.
【０００７】本発明はかかる点に鑑みなされたもので、
その目的は前記問題点を解消し、サイズ（外形寸法）が
コンパクトで、ユーザ側の装置に組み込まれる場合、占
有するスペースが小さい電動機の駆動装置又は制御装置
の構造を提供することにある。The present invention has been made in view of the above points,
It is an object of the present invention to solve the above problems and provide a structure of a drive device or a control device for an electric motor which is compact in size (outer dimension) and occupies a small space when incorporated in a device on the user side.
【０００８】本発明の他の目的は前記問題点を解消し、
ユーザ側の装置に組み込まれる場合の利便性が考慮さ
れ、かつ実装においても、使い勝手の良い電動機の駆動
装置又は制御装置の構造を提供することにある。Another object of the present invention is to solve the above problems,
It is an object of the present invention to provide a structure of a drive device or a control device of an electric motor, which is easy to use when it is incorporated into a device on the user side and is easy to install.
【０００９】[0009]
【課題を解決するための手段】前記目的を達成するため
の本発明の構成は、電子回路を構成する複数の電子部品
を備える、電動機の駆動装置又は制御装置の構造におい
て、次のとおりである。The structure of the present invention for achieving the above object is as follows in the structure of a drive device or a control device for an electric motor, which is equipped with a plurality of electronic components forming an electronic circuit. .
【００１０】前記装置内のほぼ中央位置に配設される誘
電体基板の両面側に、前記複数の電子部品が、それぞれ
配設されるとともに、それぞれの面側に配設される前記
複数の電子部品の重量の和が、ほぼ均等である電動機の
駆動装置又は制御装置の構造である。The plurality of electronic components are respectively disposed on both sides of the dielectric substrate disposed at a substantially central position in the apparatus, and the plurality of electronic components disposed on the respective surface sides. This is the structure of the drive device or control device of the electric motor in which the sum of the weights of the parts is substantially equal.
【００１１】さらに、前記装置の外箱に金属材を使用
し、前記装置内に配設され又は前記誘電体基板の両面に
配設される前記電子部品で、発熱する該電子部品を、前
記外箱の金属材に密着させ、前記発熱する電子部品の熱
を該外箱の金属材に放出させるようにする電動機の駆動
装置又は制御装置の構造である。Further, a metal material is used for the outer box of the device, and the electronic parts which generate heat are disposed in the device or on both surfaces of the dielectric substrate. It is a structure of a drive device or a control device of an electric motor which is brought into close contact with the metal material of the box and causes the heat of the heat-generating electronic component to be released to the metal material of the outer box.
【００１２】前記装置内の前記誘電体基板を間にした両
側にそれぞれ配設され、又は前記誘電体基板の両面にそ
れぞれ配設される、前記複数の電子部品のうち、発熱す
る該電子部品の発熱量の和がほぼ均等になるように配設
される電動機の駆動装置又は制御装置の構造である。Of the plurality of electronic components, which are respectively disposed on both sides of the dielectric substrate in the device, or on both sides of the dielectric substrate, one of the electronic components that generate heat is This is the structure of the drive device or control device of the electric motor that is arranged so that the sum of the calorific values becomes substantially equal.
【００１３】前記電動機の駆動装置又は制御装置に、該
装置を他の外部装置に装着するときに使用される位置決
め機構が設けられる電動機の駆動装置又は制御装置の構
造である。A structure of a drive device or control device for an electric motor, wherein the drive device or control device for the electric motor is provided with a positioning mechanism used when the device is mounted on another external device.
【００１４】前記電動機の駆動装置又は制御装置の前記
誘電体基板に、該装置を他の外部装置に装着するときに
電気的接続に使用される、中継接続部材が設けられる電
動機の駆動装置又は制御装置の構造である。An electric motor drive device or control is provided on the dielectric substrate of the electric motor drive device or control device, which is provided with a relay connection member used for electrical connection when the device is mounted on another external device. This is the structure of the device.
【００１５】前記装置内に配設される誘電体基板の面
に、配設される前記電子回路を構成する電子部品で、そ
の接続リードが複数、ほぼ直線的に配列されたものの、
両端部近傍に配置されるそれぞれ１つの前記接続リード
を、他の接続リードより長くし、かつ前記誘電体基板に
設けられる位置決め穴に挿入して、該電子部品を位置決
め可能な形状に形成し、前記電子部品を前記誘電体基板
に配設するとき、前記それぞれ１つの接続リードが、該
電子部品の位置決めに使用される電動機の駆動装置又は
制御装置の構造である。On the surface of the dielectric substrate arranged in the device, a plurality of connecting leads of the electronic parts constituting the electronic circuit arranged are arranged substantially linearly.
Each one of the connection leads arranged in the vicinity of both ends is made longer than the other connection leads and is inserted into a positioning hole provided in the dielectric substrate to form the electronic component in a positionable shape, When arranging the electronic component on the dielectric substrate, each one of the connection leads is a structure of a driving device or a control device of a motor used for positioning the electronic component.
【００１６】本発明の前記構造は、以上のように構成さ
れているので、サイズ（外形寸法）がコンパクトで、ユ
ーザ側の装置に組み込まれる場合、占有するスペースが
小さくてすみ、かつ何らかの装置、例えば、ユーザ側の
装置に組み込まれる場合の利便性が考慮されるととも
に、実装においても、使い勝手を良くすることができ
る。Since the structure of the present invention is configured as described above, it is compact in size (outer dimension) and occupies a small space when incorporated in a device on the user side, and some device, For example, it is possible to consider the convenience when incorporated in the device on the user side and improve the usability in mounting.
【００１７】また、前記駆動装置又は制御装置の内のほ
ぼ中央位置に配設される誘電体基板に、その両面側に配
設される、前記複数の電子部品の重量の和がほぼ均等な
重量がかかるので、該誘電体基板が、機械的に大きく歪
むことがなくなり、稼働中、特に走行中などにおける連
続的な振動に対して、前記装置の耐震性が向上する。ま
た、前記誘電体基板の両面側に配設される発熱電子部品
の発熱量がほぼ均等になるので、該誘電体基板及び前記
装置全体に、熱的歪みが軽減されるため、稼働中におけ
る前記装置の環境、特に温度の環境に対して耐久性が向
上する。In addition, the dielectric substrates arranged in substantially the central position of the drive unit or the control unit have the weights of the plurality of electronic components arranged on both sides thereof substantially equal to each other. Therefore, the dielectric substrate is prevented from being mechanically significantly distorted, and the earthquake resistance of the device is improved against continuous vibration during operation, particularly during traveling. Further, since the heat generation amount of the heat-generating electronic components arranged on both sides of the dielectric substrate is substantially equalized, thermal distortion is reduced in the dielectric substrate and the entire device, so The durability is improved with respect to the environment of the device, particularly the temperature environment.
【００１８】[0018]
【発明の実施の形態】以下、図面に基づいて、本発明の
好適な実施の形態を例示的に詳しく説明する。図１及び
図２は、本発明の電動機の駆動装置又は制御装置（前記
同様に、ドライバという）１の構造の一実施の形態を示
す図で、図１は、両面側に電子部品が取り付けられたド
ライバ基板２を装着した実装型のドライバ１の構造を示
す断面図、図２は、説明のため、前記ドライバ基板２の
みを装着したときの、前記ドライバ１の構造を示す断面
図である。BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will now be illustratively described in detail with reference to the drawings. 1 and 2 are views showing an embodiment of the structure of a drive device or control device (also referred to as a driver, similarly) of a motor according to the present invention. In FIG. 1, electronic parts are attached on both sides. 2 is a cross-sectional view showing the structure of the mounting type driver 1 having the driver board 2 mounted thereon, and FIG. 2 is a cross-sectional view showing the structure of the driver 1 when only the driver board 2 is mounted for the sake of explanation.
【００１９】図１及び図２において、図示しない電動機
を駆動又は制御するために、電子回路から構成される駆
動装置又は制御装置としてのドライバ１は、誘電体から
なるドライバ取付基板１０に、ほぼ垂直に取り付けられ
る。また、誘電体からなるドライバ基板２は、金属材か
らなるドライバケース３内のほぼ中央位置に垂設され、
その両側面に前記電子回路を構成する複数の電子部品４
ａ，４ｂをはんだ付けするとともに、中継部材５を介し
て、はんだ付けされる入出力用ピン（複数）群６が前記
ドライバケース３から、前記ドライバ取付基板１０側に
突出されている。さらに、前記ドライバ１の前記ドライ
バケース３の、前記ドライバ取付基板１０との取付面側
には、複数のドライバ位置決めピン７，７が配設され
る。In FIGS. 1 and 2, a driver 1 as a driving device or a control device composed of an electronic circuit for driving or controlling an electric motor (not shown) is substantially perpendicular to a driver mounting substrate 10 made of a dielectric material. Attached to. Further, the driver substrate 2 made of a dielectric material is vertically provided at a substantially central position in the driver case 3 made of a metal material.
A plurality of electronic components 4 forming the electronic circuit on both sides thereof
A group of input / output pins (plurality) 6 to be soldered with a and 4b are soldered, and are soldered via a relay member 5 so as to project from the driver case 3 toward the driver mounting board 10 side. Further, a plurality of driver positioning pins 7, 7 are arranged on the mounting surface side of the driver case 3 of the driver 1 with the driver mounting substrate 10.
【００２０】前記ドライバ１と前記ドライバ取付基板１
０との接続は、まず、該ドライバ１から突出された前記
入出力用ピン群６の配列位置に合わせて、前記ドライバ
取付基板１０に、前記入出力用ピン群６のそれぞれのピ
ンと同一軸線上に、前記ピン群６と少なくとも同数のス
ルーホール１１，１１が貫通、形成される。同様に、前
記ドライバ１の前記位置決めピン７，７の配列位置に合
わせて、前記ドライバ取付基板１０に、前記位置決めピ
ン７，７のそれぞれと同一軸線上に、前記位置決めピン
７，７を挿入するため、該ピン７，７と同数の位置決め
用貫通穴１２，１２が設けられる。The driver 1 and the driver mounting board 1
For connection with 0, first, on the same axis as the respective pins of the input / output pin group 6 on the driver mounting substrate 10 according to the arrangement position of the input / output pin group 6 protruding from the driver 1. Further, at least the same number of through holes 11, 11 as the pin group 6 are formed so as to penetrate therethrough. Similarly, the positioning pins 7, 7 are inserted into the driver mounting board 10 on the same axis as the positioning pins 7, 7 according to the arrangement position of the positioning pins 7, 7 of the driver 1. Therefore, the same number of positioning through holes 12, 12 as the pins 7, 7 are provided.
【００２１】前記ドライバ１を前記ドライバ取付基板１
０に取り付けるときは、該ドライバ取付基板１０の前記
ピン群６用のスルーホール１１，１１と、前記位置決め
用貫通穴１２，１２とに、前記ドライバ１の前記入出力
用ピン群６と前記位置決めピン７，７とを、それぞれ挿
通し、前記入出力用ピン群６を該ドライバ取付基板１０
のそれぞれのランドにはんだ付けして電気的に接続す
る。The driver 1 is mounted on the driver mounting substrate 1
0, the driver mounting board 10 has the through holes 11, 11 for the pin group 6 and the through holes 12, 12 for positioning, and the input / output pin group 6 of the driver 1 and the positioning. The pins 7 and 7 are respectively inserted, and the input / output pin group 6 is connected to the driver mounting board 10.
Solder to each land and connect electrically.
【００２２】なお、前記ドライバケース３には通常、樹
脂材が使用される。しかし、本実施の形態は、ドライバ
ケース３に、ほぼ全部に金属材（一部に樹脂材を使用）
を使用し、前記ドライバ１内に取り付けられる電子部品
の放熱を可能な構造にしている。使用目的により、一部
又は全部に金属材を使用することも、放熱が可能な構造
として好ましい。A resin material is usually used for the driver case 3. However, in the present embodiment, the driver case 3 has a metal material almost entirely (a resin material is partially used).
Is used to make it possible to dissipate heat from the electronic components mounted in the driver 1. Depending on the purpose of use, it is also preferable to use a metal material partly or wholly as a structure capable of radiating heat.
【００２３】図１に示すように、前記ドライバ１におい
て、前記ドライバ基板２の両側面に、前記電子回路を構
成する複数の電子部品４ａ，４ｂを、それぞれはんだ付
けなどにより実装する際に、前記ドライバ基板２の両側
面に、それぞれ取り付けられる前記複数の電子部品４
ａ，４ｂの重量の和が、ほぼ均等に配設されるのが好ま
しい。As shown in FIG. 1, in the driver 1, when a plurality of electronic components 4a and 4b constituting the electronic circuit are mounted on both side surfaces of the driver substrate 2 by soldering or the like, respectively, The plurality of electronic components 4 respectively attached to both side surfaces of the driver board 2.
It is preferable that the sum of the weights of a and 4b is arranged substantially evenly.
【００２４】また、同様に、前記ドライバ１内の前記ド
ライバ基板２を間にした両側の空間部分、又は前記ドラ
イバ基板２の両側面に、前記電子回路を構成する前記複
数の電子部品４ａ，４ｂのうち、特に、発熱する電子部
品４ｃ，４ｄを実装する場合は、該電子部品４ｃ，４ｃ
を、前記ドライバ基板２とはできれば別に、前記ドライ
バケース３の金属材に密着させる。すなわち、前記発熱
する電子部品４ｃ，４ｄを、前記ドライバケース３の金
属板面３ａに放熱性のよい絶縁材（例えば、絶縁シー
ト）を介して実装し、放熱を必要とする前記発熱する電
子部品４ｃ，４ｄの放熱面４ｅ，４ｆを前記ドライバケ
ース３の金属板面３ａにそれぞれ密着させる。それによ
り、前記ドライバ基板２の両側に配設された前記発熱す
る電子部品４ｃ，４ｄの放熱性を向上させる。Similarly, the plurality of electronic components 4a and 4b forming the electronic circuit are provided on the space portions on both sides of the driver 1 with the driver substrate 2 interposed therebetween or on both side surfaces of the driver substrate 2. Of these, particularly when mounting the electronic components 4c and 4d which generate heat, the electronic components 4c and 4c are mounted.
Is adhered to the metal material of the driver case 3 separately from the driver substrate 2 if possible. That is, the heat-generating electronic components 4c and 4d are mounted on the metal plate surface 3a of the driver case 3 via an insulating material (for example, an insulating sheet) having a good heat radiation property, and the heat-generating electronic components that require heat radiation. The heat radiation surfaces 4e and 4f of 4c and 4d are brought into close contact with the metal plate surface 3a of the driver case 3, respectively. This improves the heat dissipation of the electronic components 4c and 4d that generate heat and are disposed on both sides of the driver substrate 2.
【００２５】この場合、前記ドライバ基板２の両側の前
記ドライバ１内の空間部分、又は前記ドライバ基板２の
両側面にそれぞれ配設される、前記複数の電子部品４
ａ，４ｂのうち、放熱を必要とする前記発熱する電子部
品４ｃ，４ｄの群の発熱量の和が、ほぼ均等になるよう
に配設されるのが好ましい。In this case, the plurality of electronic components 4 are disposed on the space portions in the driver 1 on both sides of the driver board 2 or on both side surfaces of the driver board 2, respectively.
Of the a and 4b, it is preferable that the sum of the heat generation amounts of the groups of the electronic components 4c and 4d that generate heat and that require heat dissipation be substantially equal.
【００２６】次いで、前記ドライバ１を前記ドライバ取
付基板１０への取付を、説明する。図３は、前記ドライ
バ１と前記ドライバ取付基板１０との配置関係を示す斜
視図である。図３において、前記ドライバ１への信号の
入出力用ピン群６は、はんだ付け用として、図示しない
電動機を駆動又は制御するのに必要な信号数を確保でき
る数以上とし、前記入出力用ピン群６のそれぞれのピン
が挿通される、前記ドライバ取付基板１０の前記スルー
ホール１１，１１は、前記ピン群６のそれぞれのピンの
外径より若干大きい内径を有し、前記ピン群６のそれぞ
れのピンが容易に挿通される形状及び配置とし、かつ容
易にはんだ付けできるようにランドが設けられる。Next, the mounting of the driver 1 on the driver mounting board 10 will be described. FIG. 3 is a perspective view showing a positional relationship between the driver 1 and the driver mounting board 10. In FIG. 3, the input / output pin group 6 for inputting / outputting signals to / from the driver 1 is provided for soldering, and the number of signals required to drive or control an electric motor (not shown) is equal to or larger than the number. The through holes 11, 11 of the driver mounting substrate 10 through which the respective pins of the group 6 are inserted have an inner diameter slightly larger than the outer diameter of the respective pins of the pin group 6, and each of the pin groups 6 is Has a shape and arrangement so that the pins can be easily inserted, and lands are provided for easy soldering.
【００２７】前記ドライバ位置決めピン７，７は、その
外径が前記ドライバ取付基板１０の前記ドライバ位置決
め貫通穴１２，１２の内径よりも若干小さな外径とし、
その配列位置は同一の配列位置になるようにされてい
る。前記ドライバケース３に設けられた前記位置決めピ
ン７，７を基に、前記入出力用ピン群６と合わせて、前
記ドライバ取付基板１０に結合する構造とすることによ
り、前記入出力信号用ピン群６のみで、前記ドライバ取
付基板１０に固定するよりも、前記ドライバ１を該取付
基板１０に確実に固定できるようになり、外部からの振
動等に強い構造とすることができる。The driver positioning pins 7, 7 have an outer diameter slightly smaller than the inner diameter of the driver positioning through holes 12, 12 of the driver mounting board 10.
The array positions are arranged to be the same array position. Based on the positioning pins 7 and 7 provided in the driver case 3, the input / output pin group 6 and the input / output signal pin group 6 are combined with the driver mounting board 10 to form the input / output signal pin group. The driver 6 can be fixed more securely to the mounting board 10 than to the driver mounting board 10 only by 6, and the structure can be made stronger against external vibration and the like.
【００２８】以上の説明により、前記基板実装型ドライ
バ１と前記ドライバ取付基板１０とを、前記ドライバケ
ース３側に配設される中継部材５に設けられた入出力用
ピン群６と前記ドライバ取付基板１０に設けられたスル
ーホール１１，１１にはんだ付けすることにより、互い
に強固に固定することができる。また、前記基板実装型
ドライバ１をケース構造とし、前記ドライバケース３に
位置決めピン７，７を設けることにより、基板実装型ド
ライバ１の小型化と、前記ドライバ基板１０への位置決
めとともに、互いに確実に固定される。From the above description, the board mounted driver 1 and the driver mounting board 10 are mounted on the driver case 3 and the input / output pin group 6 provided on the relay member 5 and the driver mounting board 10. By soldering to the through holes 11 provided in the substrate 10, they can be firmly fixed to each other. In addition, the board-mounted driver 1 has a case structure, and the driver case 3 is provided with the positioning pins 7 and 7, whereby the board-mounted driver 1 is downsized, and the driver board 10 is positioned. Fixed.
【００２９】次いで、図４（ａ）は、前記複数の電子部
品４ａ，４ｂが配設された（該複数の電子部品４ａが上
面に配設）前記ドライバ基板２の、前記ドライバケース
３ヘの装着状態を示す斜視図、図４（ｂ）は、図４
（ａ）のＡ部拡大図、図４（ｃ）は、図４（ｂ）のｃ−
ｃ線による断面図である。Next, in FIG. 4A, the driver case 3 of the driver board 2 on which the plurality of electronic components 4a and 4b are disposed (the plurality of electronic components 4a is disposed on the upper surface) is shown. 4 is a perspective view showing a mounted state, and FIG.
4A is an enlarged view of part A of FIG. 4A, and FIG.
It is sectional drawing by the c line.
【００３０】図４（ａ）ないし図４（ｃ）において、前
記ドライバケース３の一部に樹脂材からなる基板固定部
３ｂを形成し、該基板固定部３ｂに、前記複数の電子部
品４ａ，４ｂを実装した前記ドライバ基板２を配置、固
定するとき、該基板固定部３ｂの係合部３ｃにより前記
ドライバ基板２の一端を係合させて固定する。同時に、
前記基板固定部３ｂには、前記ドライバ基板２に配設さ
れる主要電子部品４ｇの取付高さＨに対応できるよう
に、前記ドライバ基板２の平面に対して断面が鈍角な傾
斜面になるようにな傾斜面３ｄを、前記係合部３ｃ側に
形成させておく。そして、該傾斜面３ｄと、前記主要電
子部品４ｇの下端部との接触により、該主要電子部品４
ｇの取付時における取付高さＨの調整が行える構造にし
ている。4A to 4C, a board fixing portion 3b made of a resin material is formed on a part of the driver case 3, and the board fixing portion 3b is provided with the plurality of electronic components 4a, When disposing and fixing the driver board 2 on which the 4b is mounted, one end of the driver board 2 is engaged and fixed by the engaging portion 3c of the board fixing portion 3b. at the same time,
The board fixing portion 3b has an obtuse angled cross section with respect to the plane of the driver board 2 so as to correspond to the mounting height H of the main electronic component 4g arranged on the driver board 2. The inclined surface 3d is formed on the side of the engaging portion 3c. The contact between the inclined surface 3d and the lower end of the main electronic component 4g causes the main electronic component 4 to
The structure is such that the mounting height H can be adjusted when mounting g.
【００３１】図５（ａ）は、前記ドライバ基板２の一方
の面に配設する前記主要電子部品４ｈで、その接続リー
ドが複数、ほぼ直線的に配置された該主要電子部品４ｈ
を実装する方法を示す斜視図、図５（ｂ）は、図５
（ａ）の最も右端にある接続リード２１を示すＡ部拡大
図である。図６は、図５（ａ）に示す前記ドライバ基板
２の一方の面に、前記主要電子部品４ｈを実装したとき
の斜視図である。FIG. 5 (a) shows the main electronic component 4h arranged on one surface of the driver substrate 2, and the main electronic component 4h having a plurality of connection leads arranged substantially linearly.
FIG. 5B is a perspective view showing a method of mounting
It is an A section enlarged view showing connection lead 21 in the rightmost end of (a). FIG. 6 is a perspective view when the main electronic component 4h is mounted on one surface of the driver substrate 2 shown in FIG.
【００３２】図５（ａ）及び図５（ｂ）において、前記
ドライバ基板２へ前記主要電子部品４ｈを実装する際
に、該主要電子部品４ｈの複数本で、ほぼ直線的に配置
され、それぞれ階段状に２個所がほぼ９０度に曲げられ
た接続リード群２０のうち、ある接続リード、例えば、
両端部に配置されるそれぞれ１つの接続リード２１，２
２を、他の接続リードの先端より長く形成する。そし
て、該長く形成された部分を、前記ドライバ基板２に形
成される位置決め穴２ａ，２ａに挿入できるように、前
記ドライバ基板２を貫通する方向（前記基板側方向）に
折り曲げ、該電子部品４ｈを位置決め可能な形状に形成
しておく。5 (a) and 5 (b), when the main electronic component 4h is mounted on the driver board 2, a plurality of the main electronic components 4h are arranged substantially linearly, respectively. Of the connecting lead group 20 in which two places are bent at approximately 90 degrees in a stepwise manner, a certain connecting lead, for example,
One connecting lead 21, 2 arranged at each end
2 is formed longer than the tips of the other connection leads. Then, the long portion is bent in a direction penetrating the driver substrate 2 (the substrate side direction) so that it can be inserted into the positioning holes 2a formed in the driver substrate 2, and the electronic component 4h is bent. Is formed in a positionable shape.
【００３３】これにより、前記主要電子部品４ｈを前記
ドライバ基板２に配設するとき、前記両端部に配置され
たそれぞれ１つの接続リード２１，２２により、位置決
めすることができる。その結果、前記両端部に配置され
るそれぞれ１つの前記接続リード２１，２２が、前記位
置決め用穴２ａ，２ａに挿入され、前記ドライバ基板２
の裏面へ貫通した状態となるので、前記主要電子部品４
ｈの前記ドライバ基板２への実装、位置決めが、確実か
つ容易に行うことができる。As a result, when the main electronic component 4h is arranged on the driver board 2, the main electronic component 4h can be positioned by the connection leads 21 and 22 arranged at both ends. As a result, the connection leads 21 and 22 arranged at both ends are inserted into the positioning holes 2a and 2a, respectively.
Since it penetrates to the back surface of the
Mounting and positioning of h on the driver board 2 can be performed reliably and easily.
【００３４】また、他の接続リード２０については、図
６ないし図８に示すとおり、前記ドライバ基板２を貫通
しないで、該ドライバ基板２上のストリップにはんだ付
けされるため、該ドライバ基板２の裏面にスペースを確
保する必要がなく、前記ドライバ基板２の面積を有効に
利用することができる構造となる。The other connecting leads 20 are soldered to the strips on the driver board 2 without penetrating the driver board 2, as shown in FIGS. There is no need to secure a space on the back surface, and the area of the driver substrate 2 can be effectively used.
【００３５】前記位置決め用の接続リードとして、前記
主要電子部品４ｈのほぼ直線的に配置された複数の接続
リード２０にうち、両端部に配置される前記接続リード
２１，２２を使用したが、前記両端部に配置される前記
接続リード２１，２２に限らず、前記両端部の近傍にあ
る他の接続リードを使用してもよい。As the connection leads for positioning, the connection leads 21 and 22 arranged at both ends of the plurality of connection leads 20 arranged substantially linearly of the main electronic component 4h are used. Not limited to the connection leads 21 and 22 arranged at both ends, other connection leads near the both ends may be used.
【００３６】次に、図９は、前記ドライバ１を構成する
ドライバ本体８とドライバケース３１との構造の一例を
示す展開構成図であり、前記ドライバケース３０をケー
ス体３１，上面部材３２及び下面部材３３の３ピースか
らなる構造とし、前記複数の電子部品４ａ，４ｂが配設
された前記ドライバ基板２を含む前記ドライバ本体８と
組み立てる構造である。Next, FIG. 9 is a developed configuration view showing an example of the structure of the driver body 8 and the driver case 31 which constitute the driver 1, and the driver case 30 is constructed with the case body 31, the upper surface member 32 and the lower surface. The structure is made up of three pieces of the member 33, and is assembled with the driver body 8 including the driver board 2 on which the plurality of electronic components 4a and 4b are arranged.
【００３７】図１０は、前記ドライバ１を構成するドラ
イバ本体８とドライバケース３４との構造の他の例を示
す展開構成図であり、前記ドライバケース３４をケース
体３５，上下面体３６の２ピースからなる構造とし、前
記複数の電子部品４ａ，４ｂが配設された前記ドライバ
基板２を含む前記ドライバ本体８と、組み立てる構造で
ある。FIG. 10 is a development configuration diagram showing another example of the structure of the driver main body 8 and the driver case 34 which constitute the driver 1. The driver case 34 is a two-piece case body 35 and an upper and lower surface body 36. And a structure for assembling with the driver body 8 including the driver board 2 on which the plurality of electronic components 4a and 4b are arranged.
【００３８】図１１は、前記ドライバ１を構成するドラ
イバ本体８とドライバケース４０との構造のさらに他の
例を示す展開構成図であり、前記ドライバケース４０を
ケース体３７，上面部材３８及び下面部材３９の３ピー
スからなる構造とし、前記複数の電子部品４ａ，４ｂが
配設された前記ドライバ基板２を含む前記ドライバ本体
８と、組み立てる構造である。FIG. 11 is a developed configuration view showing still another example of the structure of the driver main body 8 and the driver case 40 which compose the driver 1, in which the driver case 40 is covered with the case body 37, the upper surface member 38 and the lower surface. The structure is made up of three pieces of the member 39, and is assembled with the driver body 8 including the driver substrate 2 on which the plurality of electronic components 4a and 4b are arranged.
【００３９】なお、本実施の形態の説明は、電動機のド
ライバ（前記駆動装置又は制御装置）を例に挙げたが、
本発明の技術は前記実施の形態における技術に限定され
るものではなく、電動機として、ステッピングモータや
サーボモータなどの制御用モータなどを含む各種の電動
機に、またドライバとしては、各種制御装置にも適用で
き、同様な機能を果たす他の態様の手段によってもよ
く、また本発明の技術は前記構成の範囲内において種々
の変更、付加が可能である。In the description of this embodiment, the driver of the electric motor (the driving device or the control device) is taken as an example.
The technique of the present invention is not limited to the technique in the above-described embodiment, and as an electric motor, various electric motors including a control motor such as a stepping motor or a servo motor can be used, and as a driver, various control devices can be used. It may be applied and may be achieved by means of other modes that perform the same function, and the technology of the present invention can be variously modified and added within the scope of the above configuration.
【００４０】[0040]
【発明の効果】以上の説明から明らかなように本発明の
電動機の駆動装置又は制御装置の構造によれば、前記装
置内のほぼ中央位置に配設される誘電体基板の両面側
に、前記複数の電子部品が、それぞれ配設されるととも
に、それぞれの面側に配設される前記複数の電子部品の
重量の和が、ほぼ均等であるので、サイズ（外形寸法）
がコンパクトで、ユーザ側の装置に組み込まれる場合、
占有するスペースが小さくなっているとともに、ユーザ
側の装置に組み込まれる場合の利便性が考慮され、かつ
実装においても、使い勝手が良いという優れた効果を奏
する。As is apparent from the above description, according to the structure of the drive device or the control device for the electric motor of the present invention, the above-mentioned structure is provided on both sides of the dielectric substrate disposed at the substantially central position in the device. Since the plurality of electronic components are respectively arranged and the sum of the weights of the plurality of electronic components arranged on the respective surface sides is substantially equal, the size (outer dimension)
Is compact and installed in the user's device,
It has an excellent effect that it occupies a small space, considers the convenience when incorporated in a device on the user side, and is easy to use in mounting.
【００４１】また、前記装置内の前記誘電体基板を間に
した両側にそれぞれ配設され、又は前記誘電体基板の両
面にそれぞれ配設される、前記複数の電子部品のうち、
発熱する該電子部品を、前記外箱の金属材に密着させ、
かつ発熱する該電子部品の発熱量の和がほぼ均等になる
ように配設されるので、基板実装型の前記装置内の発熱
する前記電子部品からの放熱性を向上する上に、基板実
装型の前記装置を小型化することができ、稼働中におけ
る前記装置の環境、特に温度の環境に対して耐久性が向
上するという優れた効果をも奏する。In addition, among the plurality of electronic components, the electronic components are disposed on both sides of the dielectric substrate in the device, or on both sides of the dielectric substrate.
The electronic parts that generate heat are brought into close contact with the metal material of the outer box,
In addition, since the heat generating electronic components are arranged so that the sum of the calorific values of the electronic components is substantially equal, the heat dissipation from the heat generating electronic components in the device of the board mounting type is improved and the board mounting type is improved. The device can be downsized, and the excellent effect that the durability is improved against the environment of the device during operation, particularly the temperature environment, is also exhibited.
【図１】本発明の電動機の駆動装置又は制御装置（前記
同様に、ドライバという）の構造の一実施の形態を示す
図で、両面側に複数の電子部品が取り付けられたドライ
バ基板を装着した実装型の前記ドライバの構造を示す断
面図である。FIG. 1 is a diagram showing an embodiment of the structure of a drive device or a control device (also referred to as a driver) of an electric motor according to the present invention, in which a driver board having a plurality of electronic components mounted on both sides is mounted. It is sectional drawing which shows the structure of the said mounting type driver.
【図２】説明のため、前記ドライバ基板のみを装着した
ときの、前記ドライバの構造を示す断面図である。FIG. 2 is a cross-sectional view showing the structure of the driver when only the driver board is mounted for the sake of explanation.
【図３】前記ドライバとドライバ取付基板との配置関係
を示す斜視図である。FIG. 3 is a perspective view showing a positional relationship between the driver and a driver mounting board.
【図４】図４（ａ）は、複数の電子部品４ａ，４ｂが配
設された前記ドライバ基板２の前記ドライバケース３ヘ
の装着状態を示す斜視図、図４（ｂ）は、図４（ａ）の
Ａ部拡大図、図４（ｃ）は、図４（ｂ）のｃ−ｃ線によ
る断面図である。4 (a) is a perspective view showing a mounting state of the driver board 2 on which a plurality of electronic components 4a and 4b are arranged in the driver case 3, and FIG. 4 (b) is FIG. 4A is an enlarged view of part A of FIG. 4A, and FIG. 4C is a sectional view taken along line cc of FIG. 4B.
【図５】図５（ａ）は、ドライバ基板の一方の面に配設
する前記電子部品の主要電子部品で、その接続リードが
複数、ほぼ直線的に配置された該主要電子部品を実装す
る方法を示す斜視図、図５（ｂ）は、図５（ａ）の最も
右端にある接続リードを示すＡ部拡大図である。FIG. 5 (a) is a main electronic component of the electronic component disposed on one surface of a driver board, and the main electronic component having a plurality of connection leads arranged substantially linearly is mounted. FIG. 5B is a perspective view showing the method, and FIG. 5B is an enlarged view of part A showing the connection lead at the rightmost end of FIG. 5A.
【図６】図５（ａ）に示す、ドライバ基板の一方の面
に、前記主要電子部品を実装したときの斜視図である。FIG. 6 is a perspective view of the main electronic component mounted on one surface of the driver substrate shown in FIG.
【図７】図６に示す電子部品が実装されたドライバ基板
の斜視図の、左下から右上方向にみた側面図である。7 is a side view of a perspective view of a driver board on which the electronic component shown in FIG. 6 is mounted, viewed from the lower left to the upper right.
【図８】図６に示す電子部品が実装されたドライバ基板
の斜視図の、右下から左上方向にみた側面の左端部の断
面拡大図である。8 is an enlarged cross-sectional view of the left end portion of the side surface of the driver board on which the electronic component shown in FIG. 6 is mounted, viewed from the lower right to the upper left.
【図９】前記ドライバ１を構成するドライバ本体とドラ
イバケースとの構造を示す展開構成図である。FIG. 9 is a development configuration diagram showing a structure of a driver main body and a driver case constituting the driver 1.
【図１０】ドライバを構成するドライバ本体とドライバ
ケースとの構造の他の例を示す展開構成図である。FIG. 10 is a development configuration diagram showing another example of the structure of the driver main body and the driver case that constitute the driver.
【図１１】ドライバを構成するドライバ本体とドライバ
ケースとの構造のさらに他の例を示す展開構成図であ
る。FIG. 11 is a development configuration diagram showing still another example of the structure of the driver main body and the driver case that constitute the driver.
【図１２】従来の基板実装型ドライバと電動機との接続
を示す斜視図である。FIG. 12 is a perspective view showing a connection between a conventional board-mounted driver and an electric motor.
１ ドライバ（駆動装置又は制御装置） ２ ドライバ基板 ２ａ 位置決め用穴 ３，３０，３４，４０ ドライバケース ３ａ 金属板面 ４ａ，４ｂ 複数の電子部品 ４ｃ，４ｄ 発熱する電子部品 ４ｅ，４ｆ 放熱面 ４ｇ，４ｈ 主要電子部品 ５ 中継部材 ６ 入出力用ピン群 ７ ドライバ位置決めピン ８ ドライバ本体 １０ ドライバ取付基板 １１ スルーホール １２ 位置決め用貫通穴 ２０ 接続リード群 ２１ 最も右端にある接続リード ２２ 最も左端にある接続リード 1 driver (driving device or control device) 2 driver board 2a Positioning hole 3,30,34,40 Driver case 3a Metal plate surface 4a, 4b Multiple electronic components 4c, 4d Electronic components that generate heat 4e, 4f Heat dissipation surface 4g, 4h Main electronic components 5 Relay member 6 Input / output pin group 7 Driver positioning pin 8 Driver body 10 Driver mounting board 11 through holes 12 Through hole for positioning 20 Connection lead group 21 Connection lead at the right end 22 leftmost connection lead
───────────────────────────────────────────────────── フロントページの続き (72)発明者 後藤 浩之 千葉県柏市篠籠田1400 オリエンタルモー ター株式会社内 Ｆターム(参考） 5E322 AA03 AB07 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Hiroyuki Goto 1400 Oriental Kamo, Kashiwa City, Chiba Prefecture Tar Co., Ltd. F-term (reference) 5E322 AA03 AB07
Claims (6)
える、電動機の駆動装置又は制御装置の構造において、 前記装置内のほぼ中央位置に配設される誘電体基板の両
面側に、前記複数の電子部品が、それぞれ配設されると
ともに、それぞれの面側に配設される前記複数の電子部
品の重量の和が、ほぼ均等であることを特徴とする電動
機の駆動装置又は制御装置の構造。1. A structure of a drive device or a control device for an electric motor, which comprises a plurality of electronic components constituting an electronic circuit, wherein the plurality of electronic components are provided on both sides of a dielectric substrate disposed at a substantially central position in the device. Of the electronic components are respectively arranged, and the sum of the weights of the plurality of electronic components disposed on the respective surface sides is substantially equal, and the structure of the drive device or the control device of the electric motor. .
し、前記装置内に配設され又は前記誘電体基板の両面に
配設される前記電子部品で、発熱する該電子部品を、前
記外箱の金属材に密着させ、前記発熱する電子部品の熱
を該外箱の金属材に放出させるようにすることを特徴と
する請求項１に記載の電動機の駆動装置又は制御装置の
構造。2. The electronic component, which uses a metal material for an outer box of the device and is disposed inside the device or on both surfaces of the dielectric substrate, wherein the electronic component generates heat, The structure of a drive device or a control device for an electric motor according to claim 1, wherein the metal material of the outer box is brought into close contact with the metal material of the outer box to radiate the heat of the heat-generating electronic component. .
両側にそれぞれ配設され、又は前記誘電体基板の両面に
それぞれ配設される、前記複数の電子部品のうち、発熱
する該電子部品の発熱量の和がほぼ均等になるように配
設されることを特徴とする請求項２に記載の電動機の駆
動装置又は制御装置の構造。3. The electronic device that generates heat among the plurality of electronic components, which are arranged on both sides of the dielectric substrate in the device, or on both sides of the dielectric substrate, respectively. The structure of a drive device or a control device for an electric motor according to claim 2, wherein the components are arranged so that the sum of the heat generation amounts of the components is substantially equal.
該装置を他の外部装置に装着するときに使用される位置
決め機構が設けられることを特徴とする請求項１ないし
請求項３のいずれかに記載の電動機の駆動装置又は制御
装置の構造。4. A drive device or a control device for the electric motor,
The structure of a drive device or a control device for an electric motor according to any one of claims 1 to 3, further comprising a positioning mechanism used when the device is mounted on another external device.
記誘電体基板に、該装置を他の外部装置に装着するとき
に電気的接続に使用される、中継接続部材が設けられる
ことを特徴とする請求項１ないし請求項３のいずれかに
記載の電動機の駆動装置又は制御装置の構造。5. A relay connection member, which is used for electrical connection when the device is mounted on another external device, is provided on the dielectric substrate of the drive device or control device of the electric motor. The structure of a drive device or a control device for an electric motor according to any one of claims 1 to 3.
える、電動機の駆動装置又は制御装置の構造において、 前記装置内に配設される誘電体基板の面に、配設される
前記電子回路を構成する電子部品で、その接続リードが
複数、ほぼ直線的に配列されたものの、両端部近傍に配
置されるそれぞれ１つの前記接続リードを、他の接続リ
ードより長くし、かつ前記誘電体基板に設けられる位置
決め穴に挿入して、該電子部品を位置決め可能な形状に
形成し、前記電子部品を前記誘電体基板に配設すると
き、前記それぞれ１つの接続リードが、該電子部品の位
置決めに使用されることを特徴とする電動機の駆動装置
又は制御装置の構造。6. A structure of a drive device or a control device for an electric motor, which comprises a plurality of electronic components forming an electronic circuit, wherein the electronic circuit is provided on a surface of a dielectric substrate provided in the device. A plurality of connection leads arranged substantially linearly, each one of the connection leads arranged near both ends is longer than other connection leads, and the dielectric substrate When the electronic component is formed into a shape capable of being positioned by being inserted into a positioning hole provided in the electronic component and the electronic component is disposed on the dielectric substrate, each of the one connection lead is used to position the electronic component. A structure of a drive device or a control device of an electric motor characterized by being used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002087606A JP4290377B2 (en) | 2002-03-27 | 2002-03-27 | Structure of electric motor drive control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002087606A JP4290377B2 (en) | 2002-03-27 | 2002-03-27 | Structure of electric motor drive control device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003283161A true JP2003283161A (en) | 2003-10-03 |
| JP2003283161A5 JP2003283161A5 (en) | 2005-08-25 |
| JP4290377B2 JP4290377B2 (en) | 2009-07-01 |
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ID=29233743
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002087606A Expired - Lifetime JP4290377B2 (en) | 2002-03-27 | 2002-03-27 | Structure of electric motor drive control device |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155954U (en) * | 1977-05-12 | 1977-11-26 | ||
| JPS56116698A (en) * | 1980-02-20 | 1981-09-12 | Hitachi Ltd | Box for containing electronic device |
| JPS6052629U (en) * | 1983-09-16 | 1985-04-13 | ソニー株式会社 | Hybrid integrated circuit device |
| JPS63157634A (en) * | 1986-12-19 | 1988-06-30 | Fanuc Ltd | Motor drive unit |
| JPH05283876A (en) * | 1992-01-21 | 1993-10-29 | Robert Bosch Gmbh | Changeover/control machine for electrical machine, especially automobile |
| JPH06169549A (en) * | 1992-06-30 | 1994-06-14 | Sgs Thomson Microelettronica Spa | Control interface device for electric load |
| JPH07231187A (en) * | 1994-02-16 | 1995-08-29 | Murata Mfg Co Ltd | Cover structure of circuit module |
| JPH0955459A (en) * | 1995-06-06 | 1997-02-25 | Seiko Epson Corp | Semiconductor device |
-
2002
- 2002-03-27 JP JP2002087606A patent/JP4290377B2/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155954U (en) * | 1977-05-12 | 1977-11-26 | ||
| JPS56116698A (en) * | 1980-02-20 | 1981-09-12 | Hitachi Ltd | Box for containing electronic device |
| JPS6052629U (en) * | 1983-09-16 | 1985-04-13 | ソニー株式会社 | Hybrid integrated circuit device |
| JPS63157634A (en) * | 1986-12-19 | 1988-06-30 | Fanuc Ltd | Motor drive unit |
| JPH05283876A (en) * | 1992-01-21 | 1993-10-29 | Robert Bosch Gmbh | Changeover/control machine for electrical machine, especially automobile |
| JPH06169549A (en) * | 1992-06-30 | 1994-06-14 | Sgs Thomson Microelettronica Spa | Control interface device for electric load |
| JPH07231187A (en) * | 1994-02-16 | 1995-08-29 | Murata Mfg Co Ltd | Cover structure of circuit module |
| JPH0955459A (en) * | 1995-06-06 | 1997-02-25 | Seiko Epson Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4290377B2 (en) | 2009-07-01 |
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