JP2003280541A - Electro-optical device, semiconductor element and electronic equipment - Google Patents
Electro-optical device, semiconductor element and electronic equipmentInfo
- Publication number
- JP2003280541A JP2003280541A JP2002084338A JP2002084338A JP2003280541A JP 2003280541 A JP2003280541 A JP 2003280541A JP 2002084338 A JP2002084338 A JP 2002084338A JP 2002084338 A JP2002084338 A JP 2002084338A JP 2003280541 A JP2003280541 A JP 2003280541A
- Authority
- JP
- Japan
- Prior art keywords
- electro
- optical panel
- driver
- bumps
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、パーソナルコン
ピュータ等の電子機器に好適であり、両面表示を行う構
成の場合において電気光学装置の部品点数および実装工
程を削減できる電気光学装置および半導体素子、並びに
電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is suitable for electronic equipment such as a personal computer, and in the case of a double-sided display, the number of components of the electro-optical device and the mounting process can be reduced, and an electro-optical device and a semiconductor element. Regarding electronic devices.
【０００２】[0002]
【従来の技術】図１５は、従来の液晶表示装置を用いた
携帯電子機器の一例を示す構成図である。この携帯電子
機器９００は、表示部分９０１と本体部分９０２とがヒ
ンジ９０３によりフリップ開閉する構成であり、本体部
分９０２の上面にはキーボード９０４が設置されており
且つその内部には図示しないＣＰＵ等が収納されてい
る。また、表示部分９０１は、筐体９０５内に液晶表示
装置９０６を収納した構成であり、この液晶表示装置９
０６は、メタルベゼル９０７により液晶パネル９０８が
固定され、その両面にはカバーガラス９０９が取り付け
られている。2. Description of the Related Art FIG. 15 is a block diagram showing an example of a portable electronic device using a conventional liquid crystal display device. This portable electronic device 900 has a configuration in which a display portion 901 and a main body portion 902 are flip-opened and closed by a hinge 903, a keyboard 904 is installed on the upper surface of the main body portion 902, and a CPU (not shown) or the like is provided inside the keyboard 904. It is stored. The display portion 901 has a configuration in which a liquid crystal display device 906 is housed in a housing 905.
A liquid crystal panel 908 is fixed to the 06 by a metal bezel 907, and cover glasses 909 are attached to both surfaces thereof.
【０００３】液晶パネル９０８は、２枚のガラス基板９
１０を対向させてその間に液晶９１１を封入し、更に合
わせたガラス基板９１０の両側に偏光板９１２を積層
し、一方のガラス基板９１０上の額縁部分に実装された
ドライバＩＣ９１３とからなり、当該液晶パネル９０８
は筐体両面側にそれぞれ配置されている。また、液晶パ
ネル９０８と液晶パネル９０８の間には、冷陰極管９１
４を端部に設けた透明の導光板９１５からなる照明装置
が配置されている。The liquid crystal panel 908 comprises two glass substrates 9
10 are opposed to each other, a liquid crystal 911 is sealed between them, polarizing plates 912 are laminated on both sides of the combined glass substrate 910, and a driver IC 913 mounted on a frame portion on one glass substrate 910 is used. Panel 908
Are arranged on both sides of the housing. Further, a cold cathode tube 91 is provided between the liquid crystal panels 908 and 908.
An illuminating device including a transparent light guide plate 915 provided with 4 at its end is arranged.
【０００４】この液晶表示装置を備えた携帯電子機器９
００では、表示部分９０１の両面に液晶パネル９０８を
設けているので、使用する際に表示部分９０１をフリッ
プアップし、その表示部分９０１の両側に所望の画像を
表示できる。係る構成は、例えばノート型パーソナルコ
ンピュータや携帯電話等に好適である。Portable electronic equipment 9 equipped with this liquid crystal display device
In 00, since the liquid crystal panels 908 are provided on both sides of the display portion 901, the display portion 901 can be flipped up when used, and desired images can be displayed on both sides of the display portion 901. Such a configuration is suitable for, for example, a notebook personal computer or a mobile phone.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記従
来の携帯電子機器９００では、表示部分９０１で両面表
示するにあたり、液晶パネル９０８を２枚用い、それぞ
れの液晶パネル９０８、９０８に駆動用のドライバＩＣ
９１３、９１３を実装している。このため、片面表示の
液晶パネルに比べて倍の数のドライバＩＣ９１３が必要
となり、部品点数および実装工程が増えてしまうという
問題点があった。However, in the above-mentioned conventional portable electronic device 900, when performing double-sided display on the display portion 901, two liquid crystal panels 908 are used, and a driver IC for driving each of the liquid crystal panels 908 and 908.
913 and 913 are mounted. Therefore, the number of driver ICs 913 required is twice as large as that of a single-sided display liquid crystal panel, which causes a problem that the number of components and the mounting process increase.
【０００６】そこで、この発明は、上記に鑑みてなされ
たものであって、両面表示を行う構成の場合において電
気光学装置の部品点数および実装工程を削減できる電気
光学装置および半導体素子、並びに電子機器を提供する
ことを目的とする。Therefore, the present invention has been made in view of the above, and in the case of a double-sided display configuration, the number of components of the electro-optical device and the mounting process can be reduced, and the electro-optical device, the semiconductor element, and the electronic device. The purpose is to provide.
【０００７】[0007]
【課題を解決するための手段】上述の目的を達成するた
めに、この発明による電気光学装置は、電気光学パネル
に電気信号を送出し且つ筐体の表裏面に複数のバンプを
設けた半導体素子と、この半導体素子を表裏から電気光
学パネルで挟み、前記半導体素子のバンプと電気光学パ
ネルの配線パターンとを直に接続した当該電気光学パネ
ルとを備えたものである。In order to achieve the above object, an electro-optical device according to the present invention is a semiconductor device in which an electric signal is sent to an electro-optical panel and a plurality of bumps are provided on the front and back surfaces of a housing. And the electro-optical panel in which the semiconductor element is sandwiched between the front and back sides by the electro-optical panel and the bumps of the semiconductor element and the wiring pattern of the electro-optical panel are directly connected.
【０００８】この発明では、少なくとも２つの電気光学
パネルで半導体素子を挟み、この半導体素子から電気信
号を受けて電気光学パネルに画像を表示する。半導体素
子のバンプは、電気光学素子の配線パターンに対応して
設ければよい。これにより、電気光学パネル毎に半導体
素子を設ける必要がなくなるので、部品点数を削減し且
つ半導体素子の実装工程を簡略化できる。なお、半導体
素子には、電気光学パネルを駆動するドライバＩＣや、
パワーＩＣ、キャパシタ等が含まれる。また、直に接続
するとは、導電性の接着層である異方性導電膜（ＡＣ
Ｆ：AnisotropicConductive Film）等を介在させて接続
する場合を含む（以下同じ）。In the present invention, the semiconductor element is sandwiched between at least two electro-optical panels, and an electric signal is received from the semiconductor elements to display an image on the electro-optical panel. The bumps of the semiconductor element may be provided corresponding to the wiring pattern of the electro-optical element. This eliminates the need to provide a semiconductor element for each electro-optical panel, so that the number of parts can be reduced and the semiconductor element mounting process can be simplified. The semiconductor element includes a driver IC for driving the electro-optical panel,
A power IC, a capacitor, etc. are included. Further, “to connect directly” means that an anisotropic conductive film (AC
F: Anisotropic Conductive Film) and the like are included (the same applies hereinafter).
【０００９】つぎの発明による電気光学装置は、電気光
学パネルに電気信号を送出し且つ筐体の表裏面に複数の
バンプを設けた半導体素子と、この半導体素子を表裏か
ら電気光学パネルで挟み、半導体素子の表裏一面のバン
プと電気光学パネルの配線パターンとを直に接続し、他
面の前記半導体素子のバンプは、所定厚さを持つ表裏が
導電性のスペーサを介して前記電気光学パネルの配線パ
ターンと接続する当該電気光学パネルとを備えたもので
ある。In the electro-optical device according to the next invention, a semiconductor element that sends an electric signal to the electro-optical panel and has a plurality of bumps provided on the front and back surfaces of the housing, and the semiconductor element is sandwiched between the front and back surfaces by the electro-optical panel, The bumps on the front and back surfaces of the semiconductor element are directly connected to the wiring pattern of the electro-optical panel, and the bumps on the other surface of the semiconductor element have the front and back surfaces of the electro-optical panel having a predetermined thickness via a conductive spacer. The electro-optical panel is connected to the wiring pattern.
【００１０】前記スペーサは、電気光学パネル同士の間
隔に対応して所定の厚さを持つので、電気光学パネルの
配置間隔に自由度を与える。両側表示を行う場合、電気
光学パネルは筐体の両面近傍に設けられるので、当該電
気光学パネルの配置間隔は、筐体の厚さに依存する。一
方、半導体素子の厚さを電気光学パネルの配置間隔に合
わせて変更すると、半導体素子に汎用性がなくなってし
まう。そこで、スペーサを介して電気光学パネルと半導
体素子を通電させるようにすれば、異なる厚さの半導体
素子を製造する必要がない。また、スペーサは、表裏に
導電性を持たせるだけの簡単な構成で済む。Since the spacer has a predetermined thickness corresponding to the distance between the electro-optical panels, the spacer has a degree of freedom in the arrangement distance of the electro-optical panels. When performing double-sided display, the electro-optical panel is provided in the vicinity of both surfaces of the housing, so the arrangement interval of the electro-optical panel depends on the thickness of the housing. On the other hand, if the thickness of the semiconductor element is changed according to the arrangement interval of the electro-optical panel, the semiconductor element loses versatility. Therefore, if the electro-optical panel and the semiconductor element are energized via the spacer, it is not necessary to manufacture semiconductor elements having different thicknesses. Further, the spacer may have a simple structure in which the front and back surfaces have conductivity.
【００１１】つぎの発明による電気光学装置は、電気光
学パネルに電気信号を送出し且つ筐体の表裏面に複数の
バンプを設けた半導体素子と、この半導体素子を表裏か
ら電気光学パネルで挟み、前記半導体素子のバンプと電
気光学パネルの配線パターンとを、所定厚さを持ち且つ
表裏が電気的に導通しているスペーサを介して接続した
当該電気光学パネルとを備えたものである。このよう
に、半導体素子の筐体の表裏側にスペーサを設けても良
い。In the electro-optical device according to the next invention, a semiconductor element which sends an electric signal to the electro-optical panel and has a plurality of bumps provided on the front and back surfaces of the housing, and the semiconductor element is sandwiched between the front and back surfaces by the electro-optical panel, The electro-optical panel includes bumps of the semiconductor element and a wiring pattern of the electro-optical panel, which are connected to each other through a spacer having a predetermined thickness and electrically conducting from the front to the back. In this way, spacers may be provided on the front and back sides of the housing of the semiconductor element.
【００１２】つぎの発明による電気光学装置は、電気光
学パネルに電気信号を送出し且つ筐体の表裏面に複数の
バンプを設けた半導体素子と、この半導体素子を表裏か
ら電気光学パネルで挟み、半導体素子の表裏一面側のバ
ンプと電気光学パネルの配線パターンとを直に接続し、
他面のバンプは、ＦＰＣ（Flexible Printed Circuit）
を介して前記電気光学パネルの配線パターンと接続する
当該電気光学パネルとを備えたものである。In the electro-optical device according to the next invention, a semiconductor element that sends an electric signal to the electro-optical panel and has a plurality of bumps on the front and back surfaces of the housing, and the semiconductor element is sandwiched between the front and back surfaces by the electro-optical panel, Directly connect the bumps on the front and back surfaces of the semiconductor element to the wiring pattern of the electro-optical panel,
Bump on the other side is FPC (Flexible Printed Circuit)
And the electro-optical panel connected to the wiring pattern of the electro-optical panel via.
【００１３】ＦＰＣにより、他面のバンプと電気光学パ
ネルの配線パターンとを接続するようにすれば、例えば
電気光学パネルの間に導光板等の所定寸法を有する部材
を介在させる場合、当該部材の厚さと半導体素子との厚
さとの寸法公差を一定にする必要があるが、ＦＰＣが寸
法差を許容するので設計および製造が容易となる。ま
た、電気光学パネルの配置間隔が異なる場合でも同じ半
導体素子を使用できるので、半導体素子に汎用性を持た
せることができる。By connecting the bumps on the other surface to the wiring pattern of the electro-optical panel by FPC, for example, when a member having a predetermined size such as a light guide plate is interposed between the electro-optical panels, Although the dimensional tolerance between the thickness and the thickness of the semiconductor element needs to be constant, the FPC allows the dimensional difference, which facilitates designing and manufacturing. Further, since the same semiconductor element can be used even when the arrangement intervals of the electro-optical panels are different, it is possible to give the semiconductor element versatility.
【００１４】つぎの発明による電気光学装置は、上記構
成において、更に、前記ＦＰＣの一部から配線パターン
が外部に導出する導出部を設け、この導出部の配線パタ
ーンを外部の回路基板に接続したものである。In the electro-optical device according to the next invention, in the above structure, a lead-out portion for leading out a wiring pattern from a part of the FPC is further provided, and the wiring pattern of the lead-out portion is connected to an external circuit board. It is a thing.
【００１５】前記ＦＰＣの一部は、半導体素子のバンプ
に接続されているから、ＦＰＣの一部を外部に導出し、
この導出部に配線パターンを形成すると共に、当該配線
パターンを外部の回路基板に接続することで、一枚のＦ
ＰＣにより半導体素子および複数の電気光学パネルを回
路基板と接続できる。このため、部品点数や接続工程を
削減でき、構造が簡単になる。Since a part of the FPC is connected to the bump of the semiconductor element, a part of the FPC is led to the outside,
By forming a wiring pattern on the lead-out portion and connecting the wiring pattern to an external circuit board, a single F
The PC can connect the semiconductor element and the plurality of electro-optical panels to the circuit board. Therefore, the number of parts and the connecting process can be reduced, and the structure is simplified.
【００１６】つぎの発明による電気光学装置は、電気光
学パネルに電気信号を送出し且つ筐体の表裏面に複数の
バンプを設けたドライバＩＣと、電気光学パネルの信号
制御回路や電源回路等の周辺回路を集積化し且つ筐体の
表裏面に複数のバンプを設けた周辺回路ＩＣと、前記ド
ライバＩＣおよび周辺回路ＩＣを表裏から電気光学パネ
ルで挟み、前記ドライバＩＣの駆動信号用のバンプと電
気光学パネルの配線パターンとを接続し、且つ周辺回路
ＩＣのバンプとドライバＩＣのバンプとを電気光学パネ
ルの配線パターンに直に接続する当該電気光学パネルと
を備えたものである。An electro-optical device according to the next invention includes a driver IC for transmitting an electric signal to the electro-optical panel and having a plurality of bumps on the front and back surfaces of the housing, a signal control circuit of the electro-optical panel, a power supply circuit and the like. A peripheral circuit IC in which peripheral circuits are integrated and a plurality of bumps are provided on the front and back surfaces of the housing, the driver IC and the peripheral circuit IC are sandwiched between the front and back by an electro-optical panel, and bumps for driving signals of the driver IC The electro-optical panel includes a wiring pattern of the optical panel and a bump of the peripheral circuit IC and a bump of the driver IC that are directly connected to the wiring pattern of the electro-optical panel.
【００１７】この発明では、周辺回路を構成するＩＣチ
ップをドライバＩＣと共に電気光学パネルの間に挟持
し、この周辺回路ＩＣとドライバＩＣをガラス基板上の
配線パターンにより接続する。これにより、電気光学パ
ネルのモジュール化を促進し、且つ電気光学パネルのコ
ンパクト化を図ることができる。なお、周辺回路ＩＣ
は、信号制御回路や電源回路等の各種回路を全てワンチ
ップに集積したものであってもよいし、信号制御回路の
み、或いは電源回路のみをＩＣチップとしたものであっ
ても良い。また、周辺回路ＩＣの個数は複数であっても
良い。In the present invention, the IC chip forming the peripheral circuit is sandwiched between the driver IC and the electro-optical panel, and the peripheral circuit IC and the driver IC are connected by the wiring pattern on the glass substrate. As a result, the modularization of the electro-optical panel can be promoted and the electro-optical panel can be made compact. In addition, peripheral circuit IC
May be a circuit in which various circuits such as a signal control circuit and a power supply circuit are all integrated on one chip, or may be an IC chip in which only the signal control circuit or only the power supply circuit is formed. Further, the number of peripheral circuit ICs may be plural.
【００１８】つぎの発明による電気光学装置は、電気光
学パネルに電気信号を送出し且つ筐体の表裏面に駆動信
号用および受電用の複数のバンプを設けたドライバＩＣ
と、ドライバＩＣに電力を供給し且つ筐体の表裏面に給
電用の複数のバンプを設けた電力用ＩＣと、前記ドライ
バＩＣおよび電力用ＩＣを表裏から電気光学パネルで挟
み、前記ドライバＩＣの駆動信号用のバンプと電気光学
パネルの配線パターンとを接続し、且つ電力用ＩＣの給
電用のバンプとドライバＩＣの受電用のバンプとを電気
光学パネルの給電用配線パターンに直に接続する当該電
気光学パネルとを備えたものである。An electro-optical device according to the next invention is a driver IC which sends an electric signal to an electro-optical panel and has a plurality of bumps for driving signals and for receiving electric power provided on the front and back surfaces of a housing.
And a power IC that supplies power to the driver IC and has a plurality of bumps for power supply provided on the front and back surfaces of the housing, and the driver IC and the power IC are sandwiched between the front and back by an electro-optical panel, and the driver IC The bump for the drive signal and the wiring pattern of the electro-optical panel are connected, and the bump for the power supply of the power IC and the bump for the power reception of the driver IC are directly connected to the power supply wiring pattern of the electro-optical panel. And an electro-optical panel.
【００１９】電気光学パネル同士の配置間隔は比較的広
くとれるので、電力用ＩＣ等の比較的大型のハイブリッ
ドＩＣを挟み込むことができる。その場合、電気光学パ
ネルに給電量の配線パターンを形成し、電力用ＩＣの給
電用バンプとドライバＩＣの受電用バンプとを当該配線
パターンに接続することで、電力用ＩＣからドライバＩ
Ｃに電力を供給できる。これにより、電気光学装置のモ
ジュール化を更に進めることができる。Since the electro-optical panels can be arranged at relatively large intervals, a relatively large hybrid IC such as a power IC can be sandwiched. In that case, a wiring pattern for the amount of power supply is formed on the electro-optical panel, and the power supply bumps of the power IC and the power reception bumps of the driver IC are connected to the wiring pattern, so that the driver IC can be connected from the power IC.
Power can be supplied to C. Thereby, modularization of the electro-optical device can be further advanced.
【００２０】つぎの発明による電気光学装置は、上記構
成において、前記半導体素子は、電気光学パネルを駆動
するドライバ回路と、電気光学パネルの信号制御回路や
電源回路等の周辺回路とが一体化したものである。In the electro-optical device according to the next invention, in the above structure, the semiconductor element is integrated with a driver circuit for driving the electro-optical panel and peripheral circuits such as a signal control circuit and a power supply circuit of the electro-optical panel. It is a thing.
【００２１】電気光学パネルの間隔が大きい場合は、そ
れに伴いＩＣチップを大きくできる。このため、ＩＣチ
ップ内にドライバ回路のみならず、その他の周辺回路を
集積できる。このため、電気光学装置のモジュール化、
コンパクト化を促進できる。When the distance between the electro-optical panels is large, the IC chip can be enlarged accordingly. Therefore, not only the driver circuit but also other peripheral circuits can be integrated in the IC chip. Therefore, modularization of the electro-optical device,
The compactness can be promoted.
【００２２】つぎの発明による電気光学装置は、上記構
成において、更に、電気光学パネルと電気光学パネルと
の間に接着層を介して照明装置の導光板を挟持し、この
接着層が、半導体素子を電気光学パネルに接続するとき
の接着層より、軟らかいものである。In the electro-optical device according to the next invention, in the above-mentioned structure, the light guide plate of the illuminating device is further sandwiched between the electro-optical panel and the electro-optical panel with the adhesive layer sandwiching the semiconductor element. Is softer than the adhesive layer when connecting to the electro-optical panel.
【００２３】電気光学パネルの間に導光板を介在させる
場合、当該導光板の厚さと半導体素子との厚さとの寸法
公差を一定にする必要があるため、一定の製造精度が要
求される。通常、半導体素子と電気光学パネルの配線パ
ターンとを接続する場合は、導電性を有するＡＣＦ等の
接着層を介在させ、また導光板と電気光学パネルとの間
にも同様に接着層が介在する。一方、半導体素子と電気
光学パネルの配線パターンは、確実に接触している必要
がある。このため、導光板側の接着層を半導体素子側の
接着層より軟らかいものにし、導光板と半導体素子とを
加えた公差を吸収すると共に半導体素子と配線パターン
との接触を確実に行うようにした。When the light guide plate is interposed between the electro-optical panels, the dimensional tolerance between the thickness of the light guide plate and the thickness of the semiconductor element needs to be constant, so that a certain manufacturing accuracy is required. Usually, when connecting a semiconductor element and a wiring pattern of an electro-optical panel, an adhesive layer such as a conductive ACF is interposed, and an adhesive layer is similarly interposed between the light guide plate and the electro-optical panel. . On the other hand, the wiring patterns of the semiconductor element and the electro-optical panel need to be surely in contact with each other. For this reason, the adhesive layer on the light guide plate side is made softer than the adhesive layer on the semiconductor element side to absorb the added tolerance of the light guide plate and the semiconductor element and to ensure the contact between the semiconductor element and the wiring pattern. .
【００２４】つぎの発明による半導体素子は、電気光学
パネルを駆動するドライバＩＣその他の半導体素子の筐
体の表裏面に、電気光学パネルの配線パターンに対応し
且つこれに接続し得る複数のバンプを有するものであ
る。また、つぎの発明による電気光学装置は、上記電気
光学装置を表示手段として用いたものである。In the semiconductor device according to the next invention, a plurality of bumps corresponding to the wiring pattern of the electro-optical panel and connectable to the wiring pattern of the electro-optical panel are provided on the front and back surfaces of the casing of the semiconductor device such as a driver IC for driving the electro-optical panel. I have. An electro-optical device according to the next invention uses the electro-optical device as display means.
【００２５】[0025]
【発明の実施の形態】以下、この発明につき図面を参照
しつつ詳細に説明する。なお、この実施の形態によりこ
の発明が限定されるものではない。また、この実施の形
態の構成要素には、当業者により置換可能かつ容易なも
の、或いは実質的に同一のものが含まれる。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail with reference to the drawings. The present invention is not limited to this embodiment. Further, the constituent elements of this embodiment include those that can be easily replaced by those skilled in the art, or those that are substantially the same.
【００２６】（実施の形態１）図１は、この発明の実施
の形態１に係る液晶表示装置を示す断面図である。図２
は、図１に示した液晶表示装置の一部拡大図である。こ
の液晶表示装置１００では、２枚のガラス基板１、２の
対向面にＩＴＯ（Indium Tin Oxide）による透明電極の
配線パターンを形成し、当該ガラス基板１、２の間に液
晶３を封止し、更にガラス基板１、２の両面に偏光板
４、５を貼り付けることで液晶パネル６を構成してい
る。また、この液晶パネル６は電子機器の筐体７内に２
枚重ねて収納され、第一の液晶パネル６ａと第二の液晶
パネル６ｂとの間には、照明装置８を構成する導光板９
が挟持されている。なお、照明装置８は、当該導光板９
と、導光板９の端部に設けたＬＥＤ１０とから構成され
ている。(Embodiment 1) FIG. 1 is a sectional view showing a liquid crystal display device according to Embodiment 1 of the present invention. Figure 2
FIG. 2 is a partially enlarged view of the liquid crystal display device shown in FIG. 1. In this liquid crystal display device 100, a wiring pattern of transparent electrodes made of ITO (Indium Tin Oxide) is formed on the opposing surfaces of the two glass substrates 1 and 2, and the liquid crystal 3 is sealed between the glass substrates 1 and 2. Further, the liquid crystal panel 6 is constructed by attaching the polarizing plates 4 and 5 to both surfaces of the glass substrates 1 and 2. In addition, the liquid crystal panel 6 is mounted inside the housing 7 of the electronic device.
A light guide plate 9 which is housed in a stack and constitutes the lighting device 8 is provided between the first liquid crystal panel 6a and the second liquid crystal panel 6b.
Are pinched. Note that the lighting device 8 includes the light guide plate 9
And an LED 10 provided at the end of the light guide plate 9.
【００２７】また、第一の液晶パネル６ａの額縁部分１
ａと対向する第二の液晶パネル６ｂの額縁部分１ｂとの
間には、ドライバＩＣ／ＬＳＩ（以下、ドライバＩＣ２
０という）がＣＯＧ(Chip On Glass)により実装挟持さ
れている。ドライバＩＣ２０の筐体２１の表面２１ａお
よび裏面２１ｂには、信号出力用の複数のバンプ２２が
設けられている。このバンプ２２は、ドライバＩＣ内に
集積したドライバ回路の出力と繋がっており、ドライバ
ＩＣ２０を挟持した状態でガラス基板１上の透明電極２
３に接続される。ドライバＩＣ２０のバンプ２２と透明
電極２３とはＡＣＦ２４により接続される。ＡＣＦ２４
は、樹脂上にニッケルや金等のメッキ層を形成した構
造、或いはニッケルや半田等の直径が５μｍ程の導電粒
子を樹脂中に混入した構造のフィルムである。The frame portion 1 of the first liquid crystal panel 6a
The driver IC / LSI (hereinafter referred to as the driver IC2) is provided between the frame portion 1b of the second liquid crystal panel 6b and the frame portion 1b of the second liquid crystal panel 6b.
0) is mounted and sandwiched by COG (Chip On Glass). A plurality of bumps 22 for signal output are provided on the front surface 21a and the back surface 21b of the housing 21 of the driver IC 20. The bump 22 is connected to the output of the driver circuit integrated in the driver IC, and the transparent electrode 2 on the glass substrate 1 is sandwiched with the driver IC 20.
3 is connected. The bump 22 of the driver IC 20 and the transparent electrode 23 are connected by the ACF 24. ACF24
Is a film having a structure in which a plating layer of nickel, gold or the like is formed on a resin, or a structure in which conductive particles having a diameter of about 5 μm such as nickel or solder are mixed in the resin.
【００２８】このドライバＩＣ２０は、アクティブマト
リクス方式の液晶表示装置を駆動するゲートドライバお
よびソースドライバとをワンチップに一体化したもので
ある。また、第一の液晶パネル６ａを駆動する第一のド
ライバ回路と、第二の液晶パネル６ｂを駆動する第二の
ドライバ回路とが一体化しており、筐体２１の表面２１
ａに第一のドライバ回路の出力数に応じたバンプ２２ａ
が、筐体２１の裏面２１ｂに第二のドライバ回路の出力
数に応じたバンプ２２ｂが形成されている。この他、筐
体２１の表裏面には、入力用の複数のバンプ２２が形成
されている。なお、図中では、出力用のバンプ２２と入
力用のバンプ２２とは区別していない。The driver IC 20 has a gate driver and a source driver for driving an active matrix type liquid crystal display device integrated into one chip. Further, the first driver circuit that drives the first liquid crystal panel 6a and the second driver circuit that drives the second liquid crystal panel 6b are integrated, and the surface 21 of the housing 21 is formed.
bumps 22a corresponding to the number of outputs of the first driver circuit
However, bumps 22b corresponding to the number of outputs of the second driver circuit are formed on the back surface 21b of the housing 21. In addition, a plurality of input bumps 22 are formed on the front and back surfaces of the housing 21. In the figure, the output bumps 22 and the input bumps 22 are not distinguished.
【００２９】外部の回路基板３０には、データ信号、同
期信号、クロック信号等の信号制御を行う信号制御回
路、電圧を印加するための電源回路部、中間調を表示す
るための階調電圧回路部、コモン電圧を印加する対向電
極駆動回路等が形成されている。この回路基板３０は、
第一の液晶パネル６ａ（または第二の液晶パネル６ｂ）
の額縁部分１ａ（または額縁部分１ｂ）に形成した入力
端子３１に対してＦＰＣ３２をＡＣＦ接続することで、
上記液晶モジュールと電気的接続を得る。また、これら
複数の入力端子３１は、ドライバＩＣ２０の入力用のバ
ンプ２２とＡＣＦ接続されている。On the external circuit board 30, a signal control circuit for controlling a signal such as a data signal, a synchronizing signal, a clock signal, a power supply circuit section for applying a voltage, and a gradation voltage circuit for displaying a halftone. And a counter electrode drive circuit for applying a common voltage. This circuit board 30 is
First liquid crystal panel 6a (or second liquid crystal panel 6b)
By connecting the FPC 32 to the input terminal 31 formed in the frame portion 1a (or the frame portion 1b) of ACF by ACF,
An electrical connection is obtained with the liquid crystal module. The plurality of input terminals 31 are ACF-connected to the input bumps 22 of the driver IC 20.
【００３０】ここで、前記入力端子３１は、第一の液晶
パネル６ａおよび第二の液晶パネル６ｂの双方に設け、
回路基板３０に近いほうの入力端子３１を用いるように
しても良い。このようにすれば、電子機器内の配線長を
短くできる。逆に、ＦＰＣ３２の長さがある程度確保し
たい場合等は、回路基板３０に遠いほうの入力端子３１
を用いることもできる。要するに、設計上や製造上の観
点から好ましいほうを選択すれば良い。Here, the input terminal 31 is provided on both the first liquid crystal panel 6a and the second liquid crystal panel 6b,
The input terminal 31 closer to the circuit board 30 may be used. By doing so, the wiring length in the electronic device can be shortened. On the contrary, when it is desired to secure a certain length of the FPC 32, the input terminal 31 farther from the circuit board 30
Can also be used. In short, the preferable one may be selected from the viewpoint of design and manufacturing.
【００３１】この液晶表示装置１００を製造する場合、
まず通常の工程を経て液晶パネル６を製作し、第一の液
晶パネル６ａに導光板９を展着し、略同時に粘着性を有
するＡＣＦ２４ａによりドライバＩＣ２０を透明電極２
３ａに仮固定する。次に、第二の液晶パネル６ｂを前記
導光板９に対して貼り付け、且つ第二の液晶パネル６ｂ
の額縁部分１ｂが、第一の液晶パネル６ａの額縁部分１
ａに対向するように配置する。また、ドライバＩＣ２０
と第二の液晶パネル６ｂの透明電極２３ｂはＡＣＦ２４
ｂにより仮固定する。When manufacturing the liquid crystal display device 100,
First, the liquid crystal panel 6 is manufactured through a normal process, the light guide plate 9 is spread on the first liquid crystal panel 6a, and at the same time, the driver IC 20 is attached to the transparent electrode 2 by the adhesive ACF 24a.
Temporarily fix to 3a. Next, the second liquid crystal panel 6b is attached to the light guide plate 9, and the second liquid crystal panel 6b is attached.
Is the frame portion 1b of the first liquid crystal panel 6a.
It is arranged so as to face a. In addition, the driver IC 20
And the transparent electrode 23b of the second liquid crystal panel 6b is the ACF 24.
Temporarily fix with b.
【００３２】そして、ガラス基板１、ドライバＩＣ２０
およびガラス基板１を加圧してＡＣＦ２４を所定の温度
まで加熱すると、ＡＣＦ２４が押されて内部の導電粒子
が接触し、バンプ２２とガラス基板１の透明電極２３と
が電気的に接続する。即ち、第一の液晶パネル６ａの透
明電極２３ａに対して、ドライバＩＣ２０の第一のドラ
イバ回路に係るバンプ２２ａが電気的に接続され、同様
に、第二の液晶パネル６ｂの透明電極２３ｂに対して、
ドライバＩＣ２０の第二のドライバ回路に係るバンプ２
２ｂが電気的に接続される。この結果、ドライバＩＣ２
０が表裏の液晶パネル６ａ、６ｂの両方に直に実装され
ることになるから、液晶表示装置１００の部品点数を削
減でき、且つ実装工程を簡略化できる。Then, the glass substrate 1 and the driver IC 20
When the glass substrate 1 is pressurized and the ACF 24 is heated to a predetermined temperature, the ACF 24 is pressed and the conductive particles inside contact with each other, and the bumps 22 and the transparent electrodes 23 of the glass substrate 1 are electrically connected. That is, the bump 22a relating to the first driver circuit of the driver IC 20 is electrically connected to the transparent electrode 23a of the first liquid crystal panel 6a, and similarly, to the transparent electrode 23b of the second liquid crystal panel 6b. hand,
Bump 2 relating to the second driver circuit of the driver IC 20
2b is electrically connected. As a result, the driver IC2
Since 0 is directly mounted on both the front and back liquid crystal panels 6a and 6b, the number of components of the liquid crystal display device 100 can be reduced and the mounting process can be simplified.
【００３３】なお、上記実施の形態の構成は、透過型液
晶パネルおよび反射型液晶パネルのいずれにも適用でき
る。また、ＣＯＧ実装を行うドライバＩＣを有するもの
であれば、アクティブマトリックス型、パッシブマトリ
ックス型のいずれにも適用できる。また、図１および図
２ではカラーフィルタを省略しているが、上記実施の形
態の構成がカラー液晶パネルに適用できるのは言うまで
もない。また、上記照明装置８は、ＥＬ（Electro-Lumi
nescence）パネルであっても良い。The structure of the above embodiment can be applied to both a transmissive liquid crystal panel and a reflective liquid crystal panel. Further, as long as it has a driver IC for COG mounting, it can be applied to both active matrix type and passive matrix type. Although the color filter is omitted in FIGS. 1 and 2, it goes without saying that the configuration of the above-described embodiment can be applied to the color liquid crystal panel. Further, the lighting device 8 is an EL (Electro-Lumi
nescence) panel.
【００３４】（実施の形態２）図３は、この発明の実施
の形態２に係る液晶表示装置を示す断面図である。この
実施の形態２の液晶表示装置２００は、ドライバＩＣ２
０とガラス基板１との間にスペーサ２０１を介在させた
点に特徴がある。その他の構成は、上記実施の形態１と
同じであるからその説明を省略し、同一構成要素には同
一符号を付する。スペーサ２０１は、第二の液晶パネル
６ｂの額縁部分１ｂとドライバＩＣ２０とに挟まれてい
る。また、スペーサ２０１の表裏面には複数のバンプ２
０２が設けられている。バンプ２０２は、スペーサ２０
１の表裏面でそれぞれ一対設けられており、当該一対の
バンプ２０２ａ、２０２ｂはスペーサ内部に設けた配線
２０３により接続されている。ドライバＩＣ２０の第二
の液晶パネル６ｂ側のバンプ２２ｂとスペーサ２０１の
バンプ２０２ａとは、ＡＣＦ２０４ａにより接続されて
いる。一方、第二の液晶パネル６ｂの透明電極２３ｂと
スペーサ２０１のバンプ２０２ｂとは、同様にＡＣＦ２
０４ｂにより接続されている。(Second Embodiment) FIG. 3 is a sectional view showing a liquid crystal display device according to a second embodiment of the present invention. The liquid crystal display device 200 according to the second embodiment includes a driver IC 2
It is characterized in that a spacer 201 is interposed between 0 and the glass substrate 1. Since other configurations are the same as those in the first embodiment, description thereof will be omitted, and the same components will be denoted by the same reference numerals. The spacer 201 is sandwiched between the frame portion 1b of the second liquid crystal panel 6b and the driver IC 20. In addition, a plurality of bumps 2 are formed on the front and back surfaces of the spacer 201.
02 is provided. The bumps 202 are the spacers 20.
A pair of bumps 202a and 202b are provided on each of the front and back sides of the first wiring, and the pair of bumps 202a and 202b are connected by a wiring 203 provided inside the spacer. The bump 22b on the second liquid crystal panel 6b side of the driver IC 20 and the bump 202a of the spacer 201 are connected by the ACF 204a. On the other hand, the transparent electrode 23b of the second liquid crystal panel 6b and the bump 202b of the spacer 201 are similarly formed by the ACF2.
It is connected by 04b.
【００３５】この液晶表示装置２００を組み立てる場
合、ドライバＩＣ２０およびスペーサ２０１をＡＣＦ２
０４により接着して仮固定し、その後、第一のガラス基
板１、ドライバＩＣ２０、スペーサ２０１および第二の
ガラス基板１を加圧してＡＣＦ２４、２０４を所定温度
まで加熱し、第一のガラス基板１の透明電極２３ａとド
ライバＩＣ２０のバンプ２２ａ、ドライバＩＣ２０のバ
ンプ２２ｂとスペーサ２０１のバンプ２０２ａ、スペー
サ２０１のバンプ２０２ｂと第二の液晶パネル６ｂの透
明電極２３ｂの接続を行う。前記スペーサ２０１は、ド
ライバＩＣ２０の筐体２１と同じか類似のプラスチック
等の材料により成形される。また、スペーサ２０１の厚
さは、ドライバＩＣ２０の厚さとガラス基板１同士の間
隔との差により決定する。なお、スペーサ２０１には、
方形断面の表裏側が導通した導電性ゴムコネクタを用い
ても良い（図示省略）。When the liquid crystal display device 200 is assembled, the driver IC 20 and the spacer 201 are attached to the ACF2.
The first glass substrate 1, the driver IC 20, the spacer 201, and the second glass substrate 1 are pressed to heat the ACFs 24 and 204 to a predetermined temperature, and the first glass substrate 1 is attached. The transparent electrode 23a and the bump 22a of the driver IC 20, the bump 22b of the driver IC 20, the bump 202a of the spacer 201, the bump 202b of the spacer 201 and the transparent electrode 23b of the second liquid crystal panel 6b are connected. The spacer 201 is formed of a material such as plastic which is the same as or similar to the case 21 of the driver IC 20. The thickness of the spacer 201 is determined by the difference between the thickness of the driver IC 20 and the distance between the glass substrates 1. The spacer 201 includes
A conductive rubber connector in which the front and back sides of the rectangular cross section are electrically connected may be used (not shown).
【００３６】また、図４に示すように、ドライバＩＣの
両側にスペーサ２０５、２０６を介装するようにしても
良い。上記同様に各スペーサ２０５、２０６の表裏面に
設けたバンプ２０７、２０８は内部の配線２０９、２１
０により導通している。スペーサ２０５、２０６のバン
プ２０７、２０８とガラス基板１の透明電極２３、スペ
ーサ２０５、２０６のバンプ２０７、２０８とドライバ
ＩＣ２０のバンプ２２とは、ＡＣＦ２１１により接続さ
れる。ガラス基板１とドライバＩＣ２０との間にスペー
サ２０１、２０５、２０６を介在させることで、ガラス
基板１の間隔に合わせて異なる厚さのドライバＩＣ２０
を用意しなくても良くなる。このため、ドライバＩＣ２
０に汎用性を与えることができる。Further, as shown in FIG. 4, spacers 205 and 206 may be provided on both sides of the driver IC. Similarly to the above, the bumps 207 and 208 provided on the front and back surfaces of the spacers 205 and 206 are the internal wirings 209 and 21.
Conducted by 0. The bumps 207 and 208 of the spacers 205 and 206 and the transparent electrode 23 of the glass substrate 1, the bumps 207 and 208 of the spacers 205 and 206, and the bumps 22 of the driver IC 20 are connected by the ACF 211. By interposing the spacers 201, 205, and 206 between the glass substrate 1 and the driver IC 20, the driver ICs 20 having different thicknesses according to the intervals of the glass substrate 1 are provided.
You don't have to prepare. Therefore, the driver IC2
0 can be given versatility.
【００３７】（実施の形態３）図５は、この発明の実施
の形態３に係る液晶表示装置を示す構成図である。この
液晶表示装置３００は、ドライバＩＣ２０と第二の液晶
パネル６ｂとの間の接続をＦＰＣ３０１により行う点に
特徴がある。ＦＰＣ３０１の一端部の配線パターンはド
ライバＩＣ２０のバンプ２２ｂとＡＣＦ接続され、中央
部分が湾曲し、ＦＰＣ３０１の他端部の配線パターンは
液晶パネル６ｂの額縁部分の透明電極２３ａにＡＣＦ接
続されている。(Third Embodiment) FIG. 5 is a block diagram showing a liquid crystal display device according to a third embodiment of the present invention. The liquid crystal display device 300 is characterized in that the driver IC 20 and the second liquid crystal panel 6b are connected by the FPC 301. The wiring pattern at one end of the FPC 301 is ACF-connected to the bump 22b of the driver IC 20, the central portion is curved, and the wiring pattern at the other end of the FPC 301 is ACF-connected to the transparent electrode 23a in the frame portion of the liquid crystal panel 6b.
【００３８】即ち、第二の液晶パネル６ｂの透明電極２
３ｂは、ＦＰＣ３０１を介してドライバＩＣ２０のバン
プ２２ｂと接続することになる。一方、ドライバＩＣ２
０のバンプ２２ａと第一の液晶パネル６ａの透明電極２
３ａとは、直に接続される。第二の液晶パネル６ｂとの
接続をＦＰＣ３０１により行えば、第一の液晶パネル６
ａと第二の液晶パネル６ｂとの間隔が比較的大きい場合
でも、ドライバＩＣ２０の筐体厚さを無用に大きくする
必要がなくなる。That is, the transparent electrode 2 of the second liquid crystal panel 6b.
3b will be connected to the bump 22b of the driver IC 20 via the FPC 301. On the other hand, the driver IC2
0 bumps 22a and transparent electrodes 2 of the first liquid crystal panel 6a
3a is directly connected. If the connection with the second liquid crystal panel 6b is made by the FPC 301, the first liquid crystal panel 6
Even if the distance between a and the second liquid crystal panel 6b is relatively large, there is no need to unnecessarily increase the thickness of the housing of the driver IC 20.
【００３９】また、図６に示すように、ＦＰＣ３０１の
一部から外部の回路基板３０に接続する導出部３０２を
設けても良い。図７は、そのようなＦＰＣの実装状態を
示す説明図である。係る構成ではＦＰＣ３０１の一部に
切り込み３０３を入れ、切り込みを入れた部分を前記導
出部３０２とする。導出部３０２には、信号制御回路や
電源回路等を形成した回路基板３０に接続する配線パタ
ーン３０４が形成されている。この配線パターン３０４
は、湾曲部となるＦＰＣ３０１上の配線パターン３０５
を介してドライバＩＣ２０に接続される。Further, as shown in FIG. 6, a lead-out portion 302 for connecting a part of the FPC 301 to the external circuit board 30 may be provided. FIG. 7 is an explanatory diagram showing a mounting state of such an FPC. In such a configuration, the notch 303 is made in a part of the FPC 301, and the notched portion is the lead-out portion 302. The lead-out portion 302 has a wiring pattern 304 connected to the circuit board 30 on which a signal control circuit, a power supply circuit, etc. are formed. This wiring pattern 304
Is a wiring pattern 305 on the FPC 301 that becomes a curved portion.
Is connected to the driver IC 20 via.
【００４０】この実施の形態の構成によれば、第一また
は第二のガラス基板１の入力端子３１に別途ＦＰＣを接
続する必要がないので、部品点数および製造工程を削減
できる。なお、図中点線で示すように、前記導出部３０
２は第一の液晶パネル６ａ側から導出するようにしても
良い。第一の液晶パネル６ａ側から導出するか、第二の
液晶パネル６ｂ側から導出するかは、この液晶表示装置
を収納した電子機器の筐体中における回路基板３０の配
置位置により決定するのが好ましい。即ち、回路基板３
０に近い方の液晶パネル側から導出することで、配線長
を短くすることができる。図６の例では、第二の液晶パ
ネル６ｂのほうが回路基板３０に近いので、当該第二の
液晶パネル６ｂ側に導出部３０２を設ける。また、これ
とは逆に、回路基板３０から遠いほうの液晶パネル側に
導出部３０２を設けても良い。要するに、設計上や製造
上の観点から好ましいほうを選択すれば良い。According to the structure of this embodiment, since it is not necessary to separately connect the FPC to the input terminal 31 of the first or second glass substrate 1, the number of parts and the manufacturing process can be reduced. As shown by the dotted line in the figure, the derivation unit 30
2 may be led out from the first liquid crystal panel 6a side. Whether to lead out from the first liquid crystal panel 6a side or the second liquid crystal panel 6b side is determined by the arrangement position of the circuit board 30 in the housing of the electronic device accommodating the liquid crystal display device. preferable. That is, the circuit board 3
The wiring length can be shortened by deriving from the liquid crystal panel side closer to 0. In the example of FIG. 6, since the second liquid crystal panel 6b is closer to the circuit board 30, the lead-out portion 302 is provided on the second liquid crystal panel 6b side. On the contrary, the lead-out portion 302 may be provided on the liquid crystal panel side farther from the circuit board 30. In short, the preferable one may be selected from the viewpoint of design and manufacturing.
【００４１】（実施の形態４）図８は、この発明の実施
の形態４に係る液晶表示装置を示す断面図である。図９
は、図８に示した液晶表示装置の平面図である。図１０
は、図８の液晶表示装置の概略構成図である。この液晶
表示装置４００は、電源回路４０２、好ましくは階調電
圧回路４０３、対向電極駆動回路４０４を集積したパワ
ーＩＣ／ＬＳＩ（以下パワーＩＣという）４０１と、ド
ライバＩＣ２０とを第一の液晶パネル６ａと第二の液晶
パネル６ｂとの間に挟持した構成である。(Fourth Embodiment) FIG. 8 is a sectional view showing a liquid crystal display device according to a fourth embodiment of the present invention. Figure 9
FIG. 9 is a plan view of the liquid crystal display device shown in FIG. 8. Figure 10
FIG. 9 is a schematic configuration diagram of the liquid crystal display device of FIG. 8. The liquid crystal display device 400 includes a power supply circuit 402, preferably a gradation voltage circuit 403, a power IC / LSI (hereinafter referred to as a power IC) 401 in which a counter electrode drive circuit 404 is integrated, and a driver IC 20 as a first liquid crystal panel 6a. And the second liquid crystal panel 6b.
【００４２】パワーＩＣ４０１のチップ筐体の表裏面に
は、第一および第二の液晶パネル６にコモン電圧などの
駆動用電圧を供給するバンプが設けられている（図示省
略）。このパワーＩＣ４０１のバンプは、第一の液晶パ
ネル６ａおよび第二の液晶パネル６ｂの給電用配線パタ
ーン４０５にＡＣＦ接続される。一方、ドライバＩＣ２
０のバンプは前記給電用の配線パターン４０５にＡＣＦ
接続され、当該ドライバＩＣ２０に対する、パワーＩＣ
４０１の電源回路４０２、階調電圧回路４０３からの所
定電圧の印加が可能となっている。ドライバＩＣ２０の
表裏面に設けた信号用のバンプは、それぞれ第一および
第二の液晶パネル６の透明電極２３にＡＣＦ接続され
る。なお、ガラス基板１の額縁部分１ａ、１ｂには電源
用の電源入力端子４０６、および信号制御回路４０８を
形成した回路基板３０と接続する信号入力端子４０７が
設けられる。Bumps (not shown) for supplying a driving voltage such as a common voltage to the first and second liquid crystal panels 6 are provided on the front and back surfaces of the chip case of the power IC 401. The bumps of the power IC 401 are ACF-connected to the power supply wiring patterns 405 of the first liquid crystal panel 6a and the second liquid crystal panel 6b. On the other hand, the driver IC2
The bumps of 0 are ACF on the wiring pattern 405 for feeding.
Power IC connected to the driver IC 20
A predetermined voltage can be applied from the power supply circuit 402 and the gradation voltage circuit 403 of 401. The signal bumps provided on the front and back surfaces of the driver IC 20 are ACF-connected to the transparent electrodes 23 of the first and second liquid crystal panels 6, respectively. The frame portions 1a and 1b of the glass substrate 1 are provided with power source input terminals 406 for power source and signal input terminals 407 connected to the circuit board 30 having the signal control circuit 408 formed therein.
【００４３】通常、電源回路３０をＩＣに集積すると筐
体容量が比較的大きなものになるが、第一の液晶パネル
６ａと第二の液晶パネル６ｂとの間隔が導光板を挟持す
ること等で比較的大きくなれば、パワーＩＣ４０１をガ
ラス基板１、１の間に挟み込むこともできる。係る構成
によれば、液晶表示装置４００のモジュール化をより進
めることができる。また、回路基板３０に搭載するＩＣ
の数を減らせるから、液晶表示装置４００をよりコンパ
クト化できる。Normally, when the power supply circuit 30 is integrated in an IC, the capacity of the housing becomes relatively large, but the space between the first liquid crystal panel 6a and the second liquid crystal panel 6b sandwiches the light guide plate. If the size is relatively large, the power IC 401 can be sandwiched between the glass substrates 1 and 1. With this configuration, the liquid crystal display device 400 can be further modularized. Further, an IC mounted on the circuit board 30
Therefore, the liquid crystal display device 400 can be made more compact.
【００４４】また、図示しないが上記電源回路４０２の
みならず、信号制御回路４０８、インタフェース回路、
メモリ等の周辺回路のＩＣ／ＬＳＩを挟み込むこともで
きる。この場合、ガラス基板１の額縁部分１ａに配線パ
ターンとして信号線が形成され、この配線パターンに周
辺回路ＩＣの信号出力用のバンプ、およびドライバＩＣ
２０のバンプ２２を接続することで、周辺回路ＩＣとド
ライバＩＣ２０とを接続できる。なお、図示しないが、
パワーＩＣ４０１や周辺回路ＩＣと液晶パネルの透明電
極２３とは、ＦＰＣを介して接続しても良い。Although not shown, not only the power supply circuit 402 but also a signal control circuit 408, an interface circuit,
It is also possible to sandwich an IC / LSI of peripheral circuits such as a memory. In this case, signal lines are formed as a wiring pattern on the frame portion 1a of the glass substrate 1, and the bumps for signal output of the peripheral circuit IC and the driver IC are formed on this wiring pattern.
By connecting the bumps 22 of 20, the peripheral circuit IC and the driver IC 20 can be connected. Although not shown,
The power IC 401 or the peripheral circuit IC and the transparent electrode 23 of the liquid crystal panel may be connected via an FPC.
【００４５】また、図１１に示すように、ドライバＩＣ
２０とパワーＩＣ４０１とを積層するようにしても良
い。簡単に説明すると、ドライバＩＣ２０の受電用のバ
ンプ２２ｃとパワーＩＣ４０１の給電用のバンプ４０９
とは、ＡＣＦ４１０により接続される。これにより、ド
ライバＩＣは、パワーＩＣからの電力供給を受けること
ができる。パワーＩＣは、バンプ４０９が液晶パネル６
ｂの透明電極２３に接続しており、この透明電極２３に
導通している電源４１４から電力を得る。Further, as shown in FIG. 11, a driver IC
20 and the power IC 401 may be laminated. Briefly described, the power receiving bump 22c of the driver IC 20 and the power feeding bump 409 of the power IC 401.
And are connected by the ACF 410. As a result, the driver IC can receive the power supply from the power IC. The bump 409 of the power IC is the liquid crystal panel 6
Power is obtained from a power source 414 connected to the transparent electrode 23 of FIG.
【００４６】また、パワーＩＣ４０１の筐体４１１は、
表裏で配線４１３により電気的に導通しているバンプ４
１２が存在し、このバンプ４１２とドライバＩＣ２０の
信号出力用のバンプ２２ｄとがＡＣＦ接続される。これ
により、ドライバＩＣの出力信号は、パワーＩＣを経由
して液晶パネル６ｂの透明電極２３に伝送される。The housing 411 of the power IC 401 is
Bumps 4 electrically connected by wiring 413 on the front and back
12 are present, and the bump 412 and the signal output bump 22d of the driver IC 20 are ACF-connected. As a result, the output signal of the driver IC is transmitted to the transparent electrode 23 of the liquid crystal panel 6b via the power IC.
【００４７】また、電源回路４０２、信号制御回路４０
８、インタフェース回路、メモリ等を一体化して、液晶
パネル６ａ、６ｂの間に挟持させるようにしても良い。
係る構成は、特に第一の液晶パネル６ａと第二の液晶パ
ネル６ｂとの間隔が大きい場合に好適である。即ち、ド
ライバ回路のみならず、電源回路４０２や信号制御回路
４０８等を収めたＩＣは筐体容積が大きくなりがちであ
るが、液晶パネル６ａ、６ｂの間隔が大きければＩＣの
筐体容積が大きくなっても当該液晶パネル６ａ、６ｂの
間に挟持できるからである。Further, the power supply circuit 402 and the signal control circuit 40
8, the interface circuit, the memory and the like may be integrated and sandwiched between the liquid crystal panels 6a and 6b.
Such a configuration is particularly suitable when the distance between the first liquid crystal panel 6a and the second liquid crystal panel 6b is large. That is, an IC housing not only the driver circuit but also the power supply circuit 402, the signal control circuit 408, and the like tends to have a large housing volume, but if the distance between the liquid crystal panels 6a and 6b is large, the IC housing volume is large. This is because the liquid crystal panels 6a and 6b can be held between them.
【００４８】（実施の形態５）図１２は、この発明の実
施の形態５に係る液晶表示装置を示す一部拡大図であ
る。この液晶表示装置５００では、ドライバＩＣ２０お
よび導光板９を第一の液晶パネル６ａおよび第二の液晶
パネル６ｂの間に挟持する構成であるから、ドライバＩ
Ｃ２０と導光板９には所定の寸法公差が要求される。ま
た、ドライバＩＣ２０は、ガラス基板１の透明電極２３
に確実に接続する必要がある。この実施の形態の構成で
は、導光板９と液晶パネル６の偏光板５との接着層９
ａ、９ｂを、硬化したＡＣＦ層２４よりも軟らかい材料
とし、ＡＣＦ２４によるドライバＩＣ２０のバンプ２２
とガラス基板１の透明電極２３との電気的接続を確実な
ものとしている。(Fifth Embodiment) FIG. 12 is a partially enlarged view showing a liquid crystal display device according to a fifth embodiment of the present invention. In this liquid crystal display device 500, the driver IC 20 and the light guide plate 9 are sandwiched between the first liquid crystal panel 6a and the second liquid crystal panel 6b.
Predetermined dimensional tolerances are required for C20 and the light guide plate 9. In addition, the driver IC 20 includes the transparent electrode 23 of the glass substrate 1.
Need to be securely connected to. In the configuration of this embodiment, the adhesive layer 9 between the light guide plate 9 and the polarizing plate 5 of the liquid crystal panel 6 is formed.
a and 9b are made of a material softer than the hardened ACF layer 24, and the bumps 22 of the driver IC 20 formed by the ACF 24 are used.
The electrical connection between the transparent electrode 23 and the transparent electrode 23 of the glass substrate 1 is ensured.
【００４９】この構成では、導光板９とドライバＩＣ２
０の筐体２１との寸法公差は軟らかい接着層９ａ、９ｂ
で吸収されるから、ＡＣＦ層２４に発生する応力を低減
できる。In this structure, the light guide plate 9 and the driver IC 2 are
Adhesive layers 9a and 9b having a dimensional tolerance of 0 with the housing 21 are soft.
Therefore, the stress generated in the ACF layer 24 can be reduced.
【００５０】この実施の形態５に係る構成によれば、ド
ライバＩＣ２０、導光板９の寸法公差の精度を緩くして
も導光板９と偏光板５との間の接着層９ａ、９ｂで公差
を十分吸収できるから、設計および製作が容易になる。
また、ドライバＩＣ２０のバンプ２２とガラス基板１の
透明電極２３とのＡＣＦ接続を良好に行うことができ
る。また、ドライバＩＣ２０とガラス基板１との間にス
ペーサを介在させる場合も、スペーサのバンプとガラス
基板１の透明電極２３とを接続するＡＣＦ層より、導光
板９と偏光板５との接着層９ａ、９ｂを軟らかくするこ
とで、上記同様の効果が得られる。According to the configuration of the fifth embodiment, even if the accuracy of the dimensional tolerances of the driver IC 20 and the light guide plate 9 is loosened, the tolerance is maintained in the adhesive layers 9a and 9b between the light guide plate 9 and the polarizing plate 5. Since it can be sufficiently absorbed, it is easy to design and manufacture.
Further, the ACF connection between the bump 22 of the driver IC 20 and the transparent electrode 23 of the glass substrate 1 can be excellently performed. Also, when a spacer is interposed between the driver IC 20 and the glass substrate 1, the adhesive layer 9a between the light guide plate 9 and the polarizing plate 5 is formed by the ACF layer connecting the bump of the spacer and the transparent electrode 23 of the glass substrate 1. , 9b are softened to obtain the same effect as described above.
【００５１】（実施の形態６）次に、本発明に係る液晶
表示装置（電気光学装置）を用いた電子機器について説
明する。まず、本発明に係る液晶表示装置を、可搬型の
パーソナルコンピュータ（所謂ノート型パソコン）の表
示部に適用した例について説明する。図１３は、パーソ
ナルコンピュータの構成を示す斜視図である。同図に示
すように、パーソナルコンピュータ６００は、キーボー
ド６０１を備えた本体部６０２と、本発明に係る液晶表
示装置１００〜５００を適用した表示部６０３とを備え
ている。(Embodiment 6) Next, electronic equipment using a liquid crystal display device (electro-optical device) according to the present invention will be described. First, an example in which the liquid crystal display device according to the present invention is applied to a display unit of a portable personal computer (so-called notebook computer) will be described. FIG. 13 is a perspective view showing the configuration of a personal computer. As shown in the figure, the personal computer 600 includes a main body portion 602 having a keyboard 601 and a display portion 603 to which the liquid crystal display devices 100 to 500 according to the present invention are applied.
【００５２】続いて、本発明に係る液晶表示装置を、携
帯電話機の表示部に適用した例について説明する。図１
４は、携帯電話機の構成を示す斜視図である。同図に示
すように、携帯電話機６５０は、複数の操作ボタン６５
１のほか、受話口６５２、送話口６５３とともに、本発
明に係る電気光学装置１００〜５００を適用した表示部
６５４を備える。Next, an example in which the liquid crystal display device according to the present invention is applied to the display portion of a mobile phone will be described. Figure 1
4 is a perspective view showing the configuration of the mobile phone. As shown in the figure, the mobile phone 650 has a plurality of operation buttons 65.
1, an earpiece 652, a mouthpiece 653, and a display unit 654 to which the electro-optical devices 100 to 500 according to the present invention are applied.
【００５３】なお、本発明に係る液晶表示装置を適用可
能な電子機器としては、図１３に示したパーソナルコン
ピュータ６００や、図１４に示した携帯電話機６５０の
他にも、液晶テレビ、ビューファインダ型・モニタ直視
型のビデオテープレコーダ、カーナビゲーション装置、
ページャ、電子手帳、電卓、ワードプロセッサ、ワーク
ステーション、テレビ電話、ＰＯＳ端末、ディジタルス
チルカメラなどが挙げられる。As the electronic equipment to which the liquid crystal display device according to the present invention can be applied, in addition to the personal computer 600 shown in FIG. 13 and the mobile phone 650 shown in FIG.・ Monitor direct-view video tape recorder, car navigation system,
A pager, an electronic notebook, a calculator, a word processor, a workstation, a videophone, a POS terminal, a digital still camera and the like can be mentioned.
【００５４】また、上記実施の形態１〜５では、電気光
学装置として液晶表示装置を例に挙げて説明したが、こ
の発明は、ＥＬディスプレイ、プラズマディスプレイな
どの電気光学装置にも適用できる。Further, in the above-described first to fifth embodiments, the liquid crystal display device has been described as an example of the electro-optical device, but the present invention can also be applied to electro-optical devices such as EL displays and plasma displays.
【００５５】[0055]
【発明の効果】以上説明したように、この発明の電気光
学装置では、電気光学パネルに電気信号を送出し且つ筐
体の表裏面に複数のバンプを設けた半導体素子と、この
半導体素子を表裏から電気光学パネルで挟み、前記半導
体素子のバンプと電気光学パネルの配線パターンとを直
に接続した当該電気光学パネルとを備えたので、部品点
数を削減し且つ半導体素子の実装工程を簡略化できる。As described above, in the electro-optical device of the present invention, a semiconductor element for sending an electric signal to the electro-optical panel and having a plurality of bumps on the front and back surfaces of the housing, and the semiconductor element on the front and back surfaces are provided. Since it is provided with the electro-optical panel sandwiched by the electro-optical panel and the bumps of the semiconductor element and the wiring pattern of the electro-optical panel are directly connected, the number of components can be reduced and the mounting process of the semiconductor element can be simplified. .
【００５６】また、この発明の電気光学装置では、電気
光学パネルに電気信号を送出し且つ筐体の表裏面に複数
のバンプを設けた半導体素子と、この半導体素子を表裏
から電気光学パネルで挟み、半導体素子の表裏一面のバ
ンプと電気光学パネルの配線パターンとを直に接続し、
他面の前記半導体素子のバンプは、所定厚さを持つ表裏
が導電性のスペーサを介して前記電気光学パネルの配線
パターンと接続する当該電気光学パネルとを備えたの
で、電気光学パネルの配置間隔が異なる場合でも、同じ
半導体素子を使用できるので製造コストを抑えることが
でき、また簡単な構成により異なる電気光学装置に対応
できる。In the electro-optical device of the present invention, a semiconductor element that sends an electric signal to the electro-optical panel and has a plurality of bumps on the front and back surfaces of the housing, and the semiconductor element is sandwiched between the front and back surfaces by the electro-optical panel. , Directly connect the bumps on the front and back surfaces of the semiconductor element to the wiring pattern of the electro-optical panel,
Since the bumps of the semiconductor element on the other surface are provided with the electro-optical panel that is connected to the wiring pattern of the electro-optical panel through spacers having front and back surfaces having a predetermined thickness, the arrangement interval of the electro-optical panel. Even if they are different, the same semiconductor element can be used, so that the manufacturing cost can be suppressed, and a simple configuration can be applied to different electro-optical devices.
【００５７】また、この発明の電子光学装置では、電気
光学パネルに電気信号を送出し且つ筐体の表裏面に複数
のバンプを設けた半導体素子と、この半導体素子を表裏
から電気光学パネルで挟み、前記半導体素子のバンプと
電気光学パネルの配線パターンとを、所定厚さを持ち且
つ表裏が電気的に導通しているスペーサを介して接続し
た当該電気光学パネルとを備えたので、電気光学パネル
の配置間隔が異なる場合でも、同じ半導体素子を使用で
きるので製造コストを抑えることができ、また簡単な構
成により異なる電気光学装置に対応できる。Further, in the electro-optical device of the present invention, a semiconductor element that sends an electric signal to the electro-optical panel and is provided with a plurality of bumps on the front and back surfaces of the housing, and the semiconductor element is sandwiched between the front and back surfaces by the electro-optical panel. Since the bump of the semiconductor element and the wiring pattern of the electro-optical panel are connected via the spacer having a predetermined thickness and a front surface and a back surface electrically connected to each other, the electro-optical panel is provided. Since the same semiconductor element can be used even when the arrangement intervals of are different, the manufacturing cost can be suppressed, and a simple configuration can be applied to different electro-optical devices.
【００５８】また、この発明の電気光学装置では、電気
光学パネルに電気信号を送出し且つ筐体の表裏面に複数
のバンプを設けた半導体素子と、この半導体素子を表裏
から電気光学パネルで挟み、半導体素子の表裏一面側の
バンプと電気光学パネルの配線パターンとを直に接続
し、他面のバンプは、ＦＰＣ（Flexible Printed Circu
it）を介して前記電気光学パネルの配線パターンと接続
する当該電気光学パネルとを備えたので、電気光学パネ
ルの配置間隔が異なる場合でも、同じ半導体素子を使用
できるので製造コストを抑えることができ、設計および
製造が簡単になる。In the electro-optical device of the present invention, a semiconductor element that sends an electric signal to the electro-optical panel and has a plurality of bumps on the front and back surfaces of the housing, and the semiconductor element is sandwiched between the front and back surfaces by the electro-optical panel. , The bumps on the front and back surfaces of the semiconductor element are directly connected to the wiring pattern of the electro-optical panel, and the bumps on the other surface are connected to the FPC (Flexible Printed Circu).
Since it is provided with the electro-optical panel connected to the wiring pattern of the electro-optical panel via it), the same semiconductor element can be used even when the arrangement intervals of the electro-optical panel are different, so that the manufacturing cost can be suppressed. , Easy to design and manufacture.
【００５９】また、この発明の電気光学装置では、ＦＰ
Ｃの一部から配線パターンが外部に導出する導出部を設
け、この導出部の配線パターンを外部の回路基板に接続
したので、部品点数や接続工程を削減でき、構造が簡単
になる。In the electro-optical device of the present invention, the FP
Since the lead-out portion for leading out the wiring pattern from a part of C is provided and the wiring pattern of the lead-out portion is connected to the external circuit board, the number of parts and the connecting process can be reduced, and the structure is simplified.
【００６０】また、この発明の電気光学装置では、電気
光学パネルに電気信号を送出し且つ筐体の表裏面に複数
のバンプを設けたドライバＩＣと、電気光学パネルの信
号制御回路や電源回路等の周辺回路を集積化し且つ筐体
の表裏面に複数のバンプを設けた周辺回路ＩＣと、前記
ドライバＩＣおよび周辺回路ＩＣを表裏から電気光学パ
ネルで挟み、前記ドライバＩＣの駆動信号用のバンプと
電気光学パネルの配線パターンとを接続し、且つ周辺回
路ＩＣのバンプとドライバＩＣのバンプとを電気光学パ
ネルの配線パターンに直に接続する当該電気光学パネル
とを備えたので、電気光学パネルのモジュール化を促進
し、且つ電気光学パネルのコンパクト化を図ることがで
きる。Further, in the electro-optical device of the present invention, a driver IC which sends out an electric signal to the electro-optical panel and has a plurality of bumps provided on the front and back surfaces of the casing, a signal control circuit of the electro-optical panel, a power supply circuit, etc. Peripheral circuit IC in which peripheral circuits are integrated and a plurality of bumps are provided on the front and back surfaces of the housing, and the driver IC and the peripheral circuit IC are sandwiched between the front and back by an electro-optical panel to form a bump for a drive signal of the driver IC. The module of the electro-optical panel is provided because the electro-optical panel is connected to the wiring pattern of the electro-optical panel, and the bumps of the peripheral circuit IC and the driver IC are directly connected to the wiring pattern of the electro-optical panel. The electro-optical panel can be made compact.
【００６１】また、この発明の電気光学装置では、電気
光学パネルに電気信号を送出し且つ筐体の表裏面に駆動
信号用および受電用の複数のバンプを設けたドライバＩ
Ｃと、ドライバＩＣに電力を供給し且つ筐体の表裏面に
給電用の複数のバンプを設けた電力用ＩＣと、前記ドラ
イバＩＣおよび電力用ＩＣを表裏から電気光学パネルで
挟み、前記ドライバＩＣの駆動信号用のバンプと電気光
学パネルの配線パターンとを接続し、且つ電力用ＩＣの
給電用のバンプとドライバＩＣの受電用のバンプとを電
気光学パネルの給電用配線パターンに直に接続する当該
電気光学パネルとを備えたので、電気光学装置のモジュ
ール化をより進めることができる。Further, in the electro-optical device of the present invention, the driver I which sends out an electric signal to the electro-optical panel and has a plurality of bumps for driving signals and for receiving electric power provided on the front and back surfaces of the housing.
C, a power IC that supplies power to the driver IC and has a plurality of bumps for power supply provided on the front and back surfaces of the housing, the driver IC and the power IC sandwiched between the front and back by an electro-optical panel, and the driver IC Drive signal bumps are connected to the electro-optical panel wiring pattern, and the power IC power feeding bumps and the driver IC power receiving bumps are directly connected to the electro-optical panel power feeding wiring pattern. Since the electro-optical panel is provided, the electro-optical device can be further modularized.
【００６２】また、この発明の電気光学装置では、半導
体素子を、電気光学パネルを駆動するドライバ回路と、
電気光学パネルの信号制御回路や電源回路等の周辺回路
とが一体化したものとしたので、電気光学装置のモジュ
ール化、コンパクト化を促進できる。In the electro-optical device of the present invention, the semiconductor element is provided with a driver circuit for driving the electro-optical panel,
Since the peripheral circuits such as the signal control circuit and the power supply circuit of the electro-optical panel are integrated, it is possible to promote modularization and downsizing of the electro-optical device.
【００６３】また、この発明の電気光学装置では、電気
光学パネルと電気光学パネルとの間に接着層を介して照
明装置の導光板を挟持し、この接着層が、半導体素子を
電気光学パネルに接続するときの接着層より、軟らかい
ものとしたので、導光板と半導体素子とを加えた公差を
吸収して両者に要求される製造精度を緩和し、半導体素
子と配線パターンとの接触を確実に行うようにできる。Further, in the electro-optical device of the present invention, the light guide plate of the illuminating device is sandwiched between the electro-optical panel and the electro-optical panel with the adhesive layer sandwiching the semiconductor element to the electro-optical panel. Since it is softer than the adhesive layer at the time of connection, it absorbs the tolerance that the light guide plate and the semiconductor element are added to relax the manufacturing accuracy required for both, and ensures the contact between the semiconductor element and the wiring pattern. You can do it.
【図１】この発明の実施の形態１に係る液晶表示装置を
示す断面図である。FIG. 1 is a sectional view showing a liquid crystal display device according to a first embodiment of the present invention.
【図２】図１に示した液晶表示装置の一部拡大図であ
る。2 is a partially enlarged view of the liquid crystal display device shown in FIG.
【図３】この発明の実施の形態２に係る液晶表示装置を
示す断面図である。FIG. 3 is a sectional view showing a liquid crystal display device according to Embodiment 2 of the present invention.
【図４】図３の液晶表示装置の変形例を示す断面図であ
る。FIG. 4 is a cross-sectional view showing a modified example of the liquid crystal display device of FIG.
【図５】この発明の実施の形態３に係る液晶表示装置を
示す構成図である。FIG. 5 is a configuration diagram showing a liquid crystal display device according to a third embodiment of the present invention.
【図６】図５の液晶表示装置の変形例を示す構成図であ
る。6 is a configuration diagram showing a modification of the liquid crystal display device of FIG.
【図７】図６に示したＦＰＣを示す斜視図である。7 is a perspective view showing the FPC shown in FIG.
【図８】この発明の実施の形態４に係る液晶表示装置を
示す断面図である。FIG. 8 is a sectional view showing a liquid crystal display device according to Embodiment 4 of the present invention.
【図９】図８に示した液晶表示装置の平面図である。9 is a plan view of the liquid crystal display device shown in FIG.
【図１０】図８の液晶表示装置の概略構成図である。10 is a schematic configuration diagram of the liquid crystal display device of FIG.
【図１１】図８の液晶表示装置の変形例を示す構成図で
ある。11 is a configuration diagram showing a modified example of the liquid crystal display device of FIG.
【図１２】この発明の実施の形態５に係る液晶表示装置
を示す一部拡大図である。FIG. 12 is a partially enlarged view showing a liquid crystal display device according to Embodiment 5 of the present invention.
【図１３】この発明の液晶表示装置を用いたパーソナル
コンピュータの構成を示す斜視図である。FIG. 13 is a perspective view showing a configuration of a personal computer using the liquid crystal display device of the present invention.
【図１４】この発明の液晶表示装置を用いた携帯電話機
の構成を示す斜視図である。FIG. 14 is a perspective view showing a configuration of a mobile phone using the liquid crystal display device of the present invention.
【図１５】従来の液晶表示装置を用いた携帯電子機器の
一例を示す構成図である。FIG. 15 is a configuration diagram showing an example of a portable electronic device using a conventional liquid crystal display device.
１００ 液晶表示装置 １、２ ガラス基板 ３ 液晶 ４、５ 偏光板 ６ 液晶パネル ７ 筐体 ９ 導光板 ２０ ドライバＩＣ ２２ バンプ ２３ 透明電極 ２４ ＡＣＦ ３０ 回路基板 100 liquid crystal display 1, 2 glass substrate 3 liquid crystal 4, 5 Polarizer 6 LCD panel 7 housing 9 Light guide plate 20 Driver IC 22 bump 23 Transparent electrode 24 ACF 30 circuit board
Claims (11)
筐体の表裏面に複数のバンプを設けた半導体素子と、 この半導体素子を表裏から電気光学パネルで挟み、前記
半導体素子のバンプと電気光学パネルの配線パターンと
を直に接続した当該電気光学パネルと、を備えたことを
特徴とする電気光学装置。1. A semiconductor element that sends an electric signal to an electro-optical panel and has a plurality of bumps provided on the front and back surfaces of a housing, and the semiconductor element is sandwiched between the front and back by an electro-optical panel, and the bumps of the semiconductor element are electrically connected to each other. An electro-optical device comprising: the electro-optical panel in which a wiring pattern of the optical panel is directly connected.
筐体の表裏面に複数のバンプを設けた半導体素子と、 この半導体素子を表裏から電気光学パネルで挟み、半導
体素子の表裏一面のバンプと電気光学パネルの配線パタ
ーンとを直に接続し、他面の前記半導体素子のバンプ
は、所定厚さを持つ表裏が導電性のスペーサを介して前
記電気光学パネルの配線パターンと接続する当該電気光
学パネルと、を備えたことを特徴とする電気光学装置。2. A semiconductor element for transmitting an electric signal to an electro-optical panel and having a plurality of bumps on the front and back surfaces of a housing, and a bump on one surface of the semiconductor element sandwiching the semiconductor element from the front and back surfaces. And the wiring pattern of the electro-optical panel are directly connected to each other, and the bumps of the semiconductor element on the other surface are connected to the wiring pattern of the electro-optical panel through a spacer having a predetermined thickness and having conductive sides. An electro-optical device comprising: an optical panel.
筐体の表裏面に複数のバンプを設けた半導体素子と、 この半導体素子を表裏から電気光学パネルで挟み、前記
半導体素子のバンプと電気光学パネルの配線パターンと
を、所定厚さを持ち且つ表裏が電気的に導通しているス
ペーサを介して接続した当該電気光学パネルと、を備え
たことを特徴とする電気光学装置。3. A semiconductor element that sends an electric signal to an electro-optical panel and has a plurality of bumps on the front and back surfaces of a housing, and the semiconductor element is sandwiched between the front and back by the electro-optical panel, and the bumps of the semiconductor element are electrically connected to each other. An electro-optical device comprising: a wiring pattern of the optical panel, the electro-optical panel being connected to the wiring pattern via a spacer having a predetermined thickness and being electrically connected to the front and back.
筐体の表裏面に複数のバンプを設けた半導体素子と、 この半導体素子を表裏から電気光学パネルで挟み、半導
体素子の表裏一面側のバンプと電気光学パネルの配線パ
ターンとを直に接続し、他面のバンプは、ＦＰＣを介し
て前記電気光学パネルの配線パターンと接続する当該電
気光学パネルと、を備えたことを特徴とする電気光学装
置。4. A semiconductor element that sends an electric signal to an electro-optical panel and has a plurality of bumps provided on the front and back surfaces of a casing, and the semiconductor element is sandwiched between the front and back by the electro-optical panel, and the semiconductor element on one surface side The bump and the wiring pattern of the electro-optical panel are directly connected, and the bump on the other surface is provided with the electro-optical panel that is connected to the wiring pattern of the electro-optical panel via the FPC. Optical device.
ンが外部に導出する導出部を設け、この導出部の配線パ
ターンを外部の回路基板に接続したことを特徴とする請
求項４に記載の電気光学装置。5. The wiring board according to claim 4, further comprising: a lead-out portion for leading out a wiring pattern from a part of the FPC, and the wiring pattern of the lead-out portion is connected to an external circuit board. Electro-optical device.
筐体の表裏面に複数のバンプを設けたドライバＩＣと、 電気光学パネルの信号制御回路や電源回路等の周辺回路
を集積化し且つ筐体の表裏面に複数のバンプを設けた周
辺回路ＩＣと、 前記ドライバＩＣおよび周辺回路ＩＣを表裏から電気光
学パネルで挟み、前記ドライバＩＣの駆動信号用のバン
プと電気光学パネルの配線パターンとを接続し、且つ周
辺回路ＩＣのバンプとドライバＩＣのバンプとを電気光
学パネルの配線パターンに直に接続する当該電気光学パ
ネルと、を備えたことを特徴とする電気光学装置。6. A driver IC, which transmits an electric signal to the electro-optical panel and has a plurality of bumps provided on the front and back surfaces of the housing, and a peripheral circuit such as a signal control circuit and a power supply circuit of the electro-optical panel, which are integrated with each other. A peripheral circuit IC having a plurality of bumps on the front and back of the body, the driver IC and the peripheral circuit IC are sandwiched between the front and back by an electro-optical panel, and a bump for a drive signal of the driver IC and a wiring pattern of the electro-optical panel are formed. An electro-optical device comprising: an electro-optical panel that connects the bumps of the peripheral circuit IC and the bumps of the driver IC directly to a wiring pattern of the electro-optical panel.
筐体の表裏面に駆動信号用および受電用の複数のバンプ
を設けたドライバＩＣと、 ドライバＩＣに電力を供給し且つ筐体の表裏面に給電用
の複数のバンプを設けた電力用ＩＣと、 前記ドライバＩＣおよび電力用ＩＣを表裏から電気光学
パネルで挟み、前記ドライバＩＣの駆動信号用のバンプ
と電気光学パネルの配線パターンとを接続し、且つ電力
用ＩＣの給電用のバンプとドライバＩＣの受電用のバン
プとを電気光学パネルの給電用配線パターンに直に接続
する当該電気光学パネルと、を備えたことを特徴とする
電気光学装置。7. A driver IC that sends an electric signal to an electro-optical panel and has a plurality of bumps for driving signals and power reception on the front and back surfaces of the housing, and a surface of the housing that supplies power to the driver IC. A power IC having a plurality of power supply bumps on the back surface, the driver IC and the power IC sandwiched from the front and back by an electro-optical panel, and a bump for a drive signal of the driver IC and a wiring pattern of the electro-optical panel are provided. And an electro-optical panel for connecting the power-supplying bumps of the power IC and the power-receiving bumps of the driver IC directly to the power-supplying wiring pattern of the electro-optical panel. Optical device.
動するドライバ回路と、電気光学パネルの信号制御回路
や電源回路等の周辺回路とが一体化したものであること
を特徴とする請求項１〜５のいずれか一つに記載の電気
光学装置。8. The semiconductor device is a device in which a driver circuit for driving the electro-optical panel and peripheral circuits such as a signal control circuit and a power supply circuit of the electro-optical panel are integrated. The electro-optical device according to any one of items 1 to 5.
との間に接着層を介して照明装置の導光板を挟持し、こ
の接着層が、半導体素子を電気光学パネルに接続すると
きの接着層より、軟らかいことを特徴とする請求項１ま
たは２に記載の電気光学装置。9. Further, the light guide plate of the lighting device is sandwiched between the electro-optical panel and the electro-optical panel via an adhesive layer, and the adhesive layer is used for connecting the semiconductor element to the electro-optical panel. The electro-optical device according to claim 1, wherein the electro-optical device is softer.
Ｃその他の半導体素子の筐体の表裏面に、電気光学パネ
ルの配線パターンに対応し且つこれに接続し得る複数の
バンプを有することを特徴とする半導体素子。10. A driver I for driving an electro-optical panel.
A semiconductor element having a plurality of bumps corresponding to the wiring pattern of the electro-optical panel and connectable to the wiring pattern of the electro-optical panel on the front and back surfaces of the casing of the semiconductor element such as C.
気光学装置を表示手段として用いたことを特徴とする電
子機器。11. An electronic apparatus using the electro-optical device according to claim 1 as display means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002084338A JP4122807B2 (en) | 2002-03-25 | 2002-03-25 | ELECTRO-OPTICAL DEVICE, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002084338A JP4122807B2 (en) | 2002-03-25 | 2002-03-25 | ELECTRO-OPTICAL DEVICE, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003280541A true JP2003280541A (en) | 2003-10-02 |
| JP2003280541A5 JP2003280541A5 (en) | 2005-09-08 |
| JP4122807B2 JP4122807B2 (en) | 2008-07-23 |
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|---|---|---|---|
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| JP (1) | JP4122807B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004287405A (en) * | 2003-03-20 | 2004-10-14 | Hynix Semiconductor Inc | Display device |
| JP2005196212A (en) * | 2004-01-09 | 2005-07-21 | Samsung Electronics Co Ltd | Display device |
| JP2007033564A (en) * | 2005-07-22 | 2007-02-08 | Sanyo Epson Imaging Devices Corp | Display device |
| US7518589B2 (en) | 2004-03-05 | 2009-04-14 | Nec Lcd Technologies, Ltd. | Liquid crystal display device and method for driving the same |
| US7592701B2 (en) | 2004-12-28 | 2009-09-22 | Toshiba Matsushita Display Technology Co., Ltd. | Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure |
| WO2011105062A1 (en) * | 2010-02-23 | 2011-09-01 | パナソニック株式会社 | Image display device |
| US9001054B2 (en) | 2010-10-26 | 2015-04-07 | Japan Display Inc. | Image display device |
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