JP2003258310A - Surface mounting light emitting diode and its producing method - Google Patents

Surface mounting light emitting diode and its producing method

Info

Publication number
JP2003258310A
JP2003258310A JP2002056667A JP2002056667A JP2003258310A JP 2003258310 A JP2003258310 A JP 2003258310A JP 2002056667 A JP2002056667 A JP 2002056667A JP 2002056667 A JP2002056667 A JP 2002056667A JP 2003258310 A JP2003258310 A JP 2003258310A
Authority
JP
Japan
Prior art keywords
led
light emitting
fluorescent substance
electrode
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002056667A
Other languages
Japanese (ja)
Other versions
JP4039552B2 (en
Inventor
Koichi Fukazawa
孝一 深澤
Kosuke Tsuchiya
康介 土屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Electronics Co Ltd filed Critical Citizen Electronics Co Ltd
Priority to JP2002056667A priority Critical patent/JP4039552B2/en
Publication of JP2003258310A publication Critical patent/JP2003258310A/en
Application granted granted Critical
Publication of JP4039552B2 publication Critical patent/JP4039552B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an LED emitting a white color or pastel tone light easily and suitable for mass production, and its producing method. <P>SOLUTION: In the surface mounting LED 10, one wiring pattern, i.e, an electrode pattern 52, leading from an upper surface electrode through a side surface electrode to a lower surface electrode and the other wiring pattern, i.e, an electrode pattern 53, are formed on the opposite sides of a printed wiring board 51. The other electrode of an LED element 54 is connected with the upper surface electrode by means of a wire 55. At least the circumferential surface of the LED element 54 on the printed wiring board 51 is coated uniformly with a predetermined quantity of fluorescent substance 57 by ink jet system, or the like. Finally, it is sealed with a sealing resin 56, e.g. transparent epoxy resin, in order to protect the joints and wires 55 of the LED element 54 and to ensure effective emission of the LED element 54. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、表面実装型発光ダ
イオード（以下ＬＥＤと略記する）、特に白色ＬＥＤや
パステル調ＬＥＤ及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount light emitting diode (hereinafter abbreviated as LED), particularly a white LED or a pastel LED and a method for manufacturing the same.

【０００２】[0002]

【従来の技術】ＬＥＤはＧａＰやＧａＮ等の化合物半導
体ウエハ上にＰＮ接合を形成し、これに順方向電流を通
じて可視光又は近赤外光の発光を得るものであり、近年
表示、通信、計測、制御等に広く応用されている。しか
し、このような従来のＬＥＤの発光色は限られた色調の
ものしか存在しない。そこで、所望のカラー光源を得よ
うと、エポキシ樹脂やシリコーン樹脂等の封止樹脂中に
蛍光物質や着色剤を含有させる試みがあった。このよう
な従来のＬＥＤの一例を、図面により説明する。2. Description of the Related Art An LED is one in which a PN junction is formed on a compound semiconductor wafer such as GaP or GaN, and a visible light or near infrared light is emitted through a forward current flowing through it. Widely applied to control, etc. However, the emission color of such a conventional LED has only a limited color tone. Therefore, in order to obtain a desired color light source, there has been an attempt to incorporate a fluorescent substance or a coloring agent into a sealing resin such as an epoxy resin or a silicone resin. An example of such a conventional LED will be described with reference to the drawings.

【０００３】図３は従来のＬＥＤ５０の縦断面図であ
る。５１は両面銅箔張りのガラスエポキシ樹脂等より成
る配線基板であり、配線基板５１の両面銅箔部にはメッ
キレジストをラミネートし、露光現像して配線パターン
を形成し、更にその上に金メッキ等の表面処理を施して
ある。５２は、上面電極５２ａから側面電極５２ｂを経
由して下面電極５２ｃに至る配線パターンである一方の
電極パターンであり、５３は、同じく上面電極５３ａか
ら側面電極５３ｂを経由して下面電極５３ｃに至る他方
の電極パターンである。FIG. 3 is a vertical sectional view of a conventional LED 50. Reference numeral 51 is a wiring board made of glass epoxy resin or the like with double-sided copper foil clad, and a plating resist is laminated on the double-sided copper foil portion of the wiring board 51, exposed and developed to form a wiring pattern, and gold plating or the like is further formed thereon. Has been surface treated. Reference numeral 52 is one electrode pattern which is a wiring pattern extending from the upper surface electrode 52a to the lower surface electrode 52c via the side surface electrode 52b, and 53 is similarly extending from the upper surface electrode 53a to the lower surface electrode 53c via the side surface electrode 53b. It is the other electrode pattern.

【０００４】５４は、上面電極５２ａに一方の電極を銀
ペーストによりダイボンディングしたＧａＮ系の青色Ｌ
ＥＤ素子である。５５はＡｕ線等より成るワイヤであ
り、ワイヤ５５によりＬＥＤ素子５４の他方の電極と上
面電極５３ａとがワイヤボンディングにより接続されて
いる。５６は、ＬＥＤ素子５４、ＬＥＤ素子５４の接続
部及びワイヤ５５等の保護と、ＬＥＤ素子５４の発光を
効果的にすることのために封止している、透光性のエポ
キシ樹脂等から成る封止樹脂である。封止樹脂５６には
予め５７の蛍光物質（ＹＡＧ蛍光体）を含有させてあ
る。Reference numeral 54 is a GaN-based blue L in which one electrode is die-bonded to the upper surface electrode 52a with silver paste.
It is an ED element. Reference numeral 55 denotes a wire made of an Au wire or the like, and the wire 55 connects the other electrode of the LED element 54 and the upper surface electrode 53a by wire bonding. Reference numeral 56 is made of a translucent epoxy resin or the like, which is sealed to protect the LED element 54, the connection portion of the LED element 54 and the wire 55, and to make the LED element 54 emit light effectively. It is a sealing resin. The sealing resin 56 contains 57 fluorescent substances (YAG fluorescent substance) in advance.

【０００５】ＬＥＤ５０を発光させると、ＬＥＤ素子５
４を発して封止樹脂５６の中で蛍光物質に当たった青色
光は黄色に変化して出射し、蛍光物質に当たらなかった
光は青色のまま出射することになるため、これら黄色と
青色とが混色となって白色光となる。また、封止樹脂中
に蛍光物質を含有させることにより白色光をフィルター
することで、パステル調の発光色を得ることができると
いうものである。When the LED 50 is made to emit light, the LED element 5
The blue light that has emitted 4 and has hit the fluorescent material in the sealing resin 56 changes to yellow and is emitted, and the light that has not hit the fluorescent material is emitted as blue. Become a mixed color and become white light. Further, it is possible to obtain a pastel-like luminescent color by filtering white light by including a fluorescent substance in the sealing resin.

【０００６】[0006]

【発明が解決しようとする課題】しかしながら、従来の
このようなＬＥＤでは、蛍光物質は、封止樹脂よりも比
重が大きいために、樹脂に混入後キュアー炉で樹脂を硬
化させる過程において蛍光物質が沈殿してしまい、樹脂
内に均一に拡散させることが困難であった。また、蛍光
物質を定量塗布することが困難であるため、その量のバ
ラツキによって発光色の色調のバラツキが発生し、量産
上不良品の選別工程が欠かせなかった。従ってコストア
ップを招くので、ＬＥＤの色調のバラツキをいかに少な
くしてコストを押さえるかが課題であった。However, in such a conventional LED, since the fluorescent substance has a larger specific gravity than the encapsulating resin, the fluorescent substance is mixed in the resin and then cured in a curing oven. It was precipitated, and it was difficult to diffuse it uniformly in the resin. In addition, since it is difficult to apply the fluorescent substance in a fixed amount, variations in the amount of the fluorescent substance cause variations in the color tone of the emission color, and the step of selecting defective products is essential for mass production. Therefore, the cost is increased, and the problem is how to reduce the variation in the color tone of the LED to suppress the cost.

【０００７】上記発明は、このような従来の問題を解決
するためになされたものであり、その目的は、発光色の
バラツキを改良して量産に適するＬＥＤ及びその製造方
法を提供することである。The above invention has been made in order to solve such a conventional problem, and an object thereof is to provide an LED suitable for mass production by improving the variation of emission color and a manufacturing method thereof. .

【０００８】[0008]

【課題を解決するための手段】前述した目的を達成する
ための本発明の手段は、外部接続端子を有する配線基板
上に青色の発光素子を搭載し、該発光素子を蛍光物質を
含有した樹脂で封止した表面実装型発光ダイオードにお
いて、前記配線基板上の少なくとも前記発光素子の周面
に蛍光物質が塗布されており、その上から樹脂により成
形封止したことを特徴とする。[Means for Solving the Problems] The means of the present invention for achieving the above-mentioned object is to mount a blue light emitting element on a wiring board having an external connection terminal, and to make the light emitting element a resin containing a fluorescent substance. In the surface-mounted light-emitting diode sealed with, the fluorescent material is applied to at least the peripheral surface of the light-emitting element on the wiring board, and the resin is molded and sealed from above.

【０００９】また、前述した目的を達成するための本発
明の他の手段は、請求項１記載の表面実装型ダイオード
を製造する方法において、前記配線基板上の少なくとも
前記発光素子の周面に、前記蛍光物質を含有した液体を
インクジェット方式により塗布する工程と、前記蛍光物
質を塗布した配線基板を樹脂で成形封止する工程を有す
ることを特徴とする。Another aspect of the present invention for achieving the above object is to provide a method for manufacturing a surface mount diode according to claim 1, wherein at least the peripheral surface of the light emitting element on the wiring board is provided with: The method is characterized by including a step of applying a liquid containing the fluorescent substance by an inkjet method and a step of molding and sealing the wiring substrate coated with the fluorescent substance with a resin.

【００１０】[0010]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて詳細に説明する。まず、この実施の形態の構
成について説明する。図１は本発明の実施の形態である
ＬＥＤの断面図、図２はこのＬＥＤの製造方法を示す断
面図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. First, the configuration of this embodiment will be described. FIG. 1 is a sectional view of an LED according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a method for manufacturing this LED.

【００１１】図１において、１０は表面実装型ＬＥＤで
ある。ＬＥＤ１０が従来のＬＥＤ５０と異なるところ
は、蛍光物質の塗布形態及び蛍光物質の塗布方法であ
る。その他の構成はＬＥＤ５０と同じなので、同じ構成
要素にはＬＥＤ５０と同じ符号と名称を付して詳細な説
明を省略する。蛍光物質５７は予めＬＥＤ５４の周面及
び配線基板５１上に均一に定量塗布されている。In FIG. 1, reference numeral 10 is a surface mount type LED. The LED 10 is different from the conventional LED 50 in the form of applying the fluorescent material and the method of applying the fluorescent material. Since other configurations are the same as those of the LED 50, the same components and elements are given the same reference numerals and names as the LED 50, and detailed description thereof will be omitted. The fluorescent substance 57 is uniformly applied on the peripheral surface of the LED 54 and the wiring substrate 51 in advance in a fixed amount.

【００１２】次に、この実施の形態の作用を説明する。
ＧａＮ系のＬＥＤ素子５４を発した青色光は、ＬＥＤ素
子５４の表面に均一に一定量存在する蛍光物質５７に当
たったものは黄色に変化して出射し、蛍光物質５７に当
たらなかった光は青色のまま出射することになるため、
これら黄色と青色が混色することにより白色光となる。
この場合に、蛍光物質がＬＥＤ素子５４の周面に均一
に、一定量塗布されているために、その量による色調の
バラツキが生じない。また、蛍光物質の量、即ち厚みを
精密に制御できることから、青みがかった白色、黄みが
かった白色等、所望の白色光を得ることができる。ま
た、パステル色についても同様である。Next, the operation of this embodiment will be described.
The blue light emitted from the GaN-based LED element 54, which hits the fluorescent substance 57 that is uniformly present on the surface of the LED element 54, changes to yellow and is emitted, and the light which does not hit the fluorescent substance 57 is emitted. Since it will be emitted as blue,
White light is obtained by mixing these yellow and blue colors.
In this case, since the fluorescent substance is uniformly applied to the peripheral surface of the LED element 54 in a constant amount, variations in color tone due to the amount do not occur. Further, since the amount of the fluorescent substance, that is, the thickness can be precisely controlled, desired white light such as bluish white or yellowish white can be obtained. The same applies to pastel colors.

【００１３】次に、このＬＥＤ１０の製造方法につい
て、中でもインクジェット方式を採用して蛍光物質５７
を塗布する工程について説明する。図２において、２０
はインクジェット方式により蛍光物質５７を吐出するノ
ズルである。まず、ＬＥＤ素子５４を搭載後の配線基板
５１に対して、ノズル２０をＬＥＤ素子５４の上面に近
接させて蛍光物質５７を吐出する。このとき、ノズル２
０は揺動動作をする。蛍光物質５７の吐出を容易にする
ために、蛍光物質５７は蛍光物質５７の比重と近似した
比重を持つ媒体に予め混合しておく。ＬＥＤ１０を製造
する全体の工程には、配線基板５１の多数個取りが可能
な、集合状態の配線基板を用いて、配線基板上で同時多
数個の製造方式がとられる。Next, regarding the manufacturing method of this LED 10, the fluorescent material 57 is adopted by adopting the ink jet method among others.
The step of applying is described. In FIG. 2, 20
Is a nozzle for ejecting the fluorescent substance 57 by an inkjet method. First, the fluorescent material 57 is ejected to the wiring board 51 on which the LED element 54 is mounted by bringing the nozzle 20 close to the upper surface of the LED element 54. At this time, the nozzle 2
0 swings. In order to facilitate the discharge of the fluorescent substance 57, the fluorescent substance 57 is mixed in advance with a medium having a specific gravity similar to that of the fluorescent substance 57. In the entire process of manufacturing the LEDs 10, a wiring board in a collective state capable of taking a large number of wiring boards 51 is used, and a simultaneous manufacturing method for a large number of wiring boards is adopted.

【００１４】次に、本実施の形態であるＬＥＤ１０の効
果について説明する。蛍光物質５７の塗布と封止成形と
を別工程にしたので、封止作業中の蛍光物質の沈殿が無
くなった。また、インクジェット方式を採用して、直接
ＬＥＤ素子５４周面に蛍光物質５７を塗布するようにし
たので、蛍光物質５７を均一に定量塗布にすることがで
きる。従って、蛍光物質の量を微調整することが可能と
なり、微妙な色調の調整が容易になって、白色は無論の
こと、中間色であるパステル調の発光色も容易に得られ
るようになった。そして、従来必要であった色調の選別
工程を廃止できた。なお、多数個取りのできる集合基板
である配線基板を用いて、同時多数個の処理ができるの
で、製造コストを削減できる。Next, the effect of the LED 10 according to the present embodiment will be described. Since the application of the fluorescent substance 57 and the sealing molding were performed in separate steps, the precipitation of the fluorescent substance during the sealing work was eliminated. Further, since the inkjet method is adopted and the fluorescent substance 57 is directly applied to the peripheral surface of the LED element 54, the fluorescent substance 57 can be uniformly applied in a fixed amount. Therefore, it becomes possible to finely adjust the amount of the fluorescent substance, facilitating the fine adjustment of the color tone, and of course, white is easily obtained, and the pastel emission color which is an intermediate color can be easily obtained. And, it was possible to eliminate the conventionally required color tone selection process. It should be noted that a wiring board, which is a collective board capable of taking a large number of pieces, can be used to perform a large number of pieces at the same time, so that the manufacturing cost can be reduced.

【００１５】[0015]

【発明の効果】以上説明したように、本発明によれば、
配線基板上に青色の発光素子を搭載し、該発光素子を蛍
光物質を含有した樹脂で封止した表面実装型発光ダイオ
ードにおいて、前記配線基板上の少なくとも前記発光素
子の周面に蛍光物質が塗布されており、その上から樹脂
により成形封止したので、蛍光物質の量と分布が均一と
なり、バラツキが減って、白色やパステル調の発光色を
有するＬＥＤが安定して量産できるようになった。As described above, according to the present invention,
In a surface mount type light emitting diode in which a blue light emitting element is mounted on a wiring board and the light emitting element is sealed with a resin containing a fluorescent material, a fluorescent material is applied to at least the peripheral surface of the light emitting element on the wiring board. Since it was molded and sealed with resin from above, the amount and distribution of the fluorescent substance became uniform, the variation was reduced, and it became possible to stably mass-produce LEDs with white or pastel color. .

【００１６】蛍光物質を発光素子に塗布するのに、イン
クジェット方式を採用したので、蛍光物質を均一に塗布
でき、蛍光物質の量を微調整することが可能となって、
容易に白色、パステル色調の発光を得ることができるよ
うになった。Since the ink jet method is used to apply the fluorescent substance to the light emitting element, the fluorescent substance can be uniformly applied and the amount of the fluorescent substance can be finely adjusted.
It is now possible to easily obtain white and pastel color tones.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施の形態であるＬＥＤの断面図であ
る。FIG. 1 is a cross-sectional view of an LED that is an embodiment of the present invention.

【図２】本発明の実施の形態であるＬＥＤの製造方法を
示す断面図である。FIG. 2 is a cross-sectional view showing a method of manufacturing an LED that is an embodiment of the present invention.

【図３】従来のＬＥＤの縦断面図である。FIG. 3 is a vertical sectional view of a conventional LED.

【符号の説明】[Explanation of symbols]

１０ 発光ダイオード（ＬＥＤ） ５１ 配線基板 ５２、５３ 電極パターン ５４ ＬＥＤ素子（発光素子） ５６ 封止樹脂 ５７ 蛍光物質 10 Light emitting diode (LED) 51 wiring board 52, 53 electrode pattern 54 LED element (light emitting element) 56 sealing resin 57 Fluorescent substance

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 外部接続端子を有する配線基板上に青色
の発光素子を搭載し、該発光素子を蛍光物質を含有した
樹脂で封止した表面実装型発光ダイオードにおいて、前
記配線基板上の少なくとも前記発光素子の周面に蛍光物
質が塗布されており、その上から樹脂により成形封止し
たことを特徴とする表面実装型発光ダイオード。1. A surface-mount type light emitting diode in which a blue light emitting element is mounted on a wiring board having an external connection terminal, and the light emitting element is sealed with a resin containing a fluorescent substance, wherein at least the wiring board is provided. A surface mount type light emitting diode characterized in that a fluorescent material is applied to the peripheral surface of a light emitting element, and the resin is molded and sealed from above. 【請求項２】 請求項１記載の表面実装型ダイオードを
製造する方法において、前記配線基板上の少なくとも前
記発光素子の周面に、前記蛍光物質を含有した液体をイ
ンクジェット方式により塗布する工程と、前記蛍光物質
を塗布した配線基板を樹脂で成形封止する工程を有する
ことを特徴とする表面実装型発光ダイオードの製造方
法。2. The method for manufacturing a surface mount diode according to claim 1, wherein a liquid containing the fluorescent substance is applied to at least a peripheral surface of the light emitting element on the wiring board by an inkjet method. A method for manufacturing a surface-mounted light emitting diode, comprising a step of molding and sealing the wiring substrate coated with the fluorescent material with a resin.
JP2002056667A 2002-03-01 2002-03-01 Manufacturing method of surface mount type light emitting diode Expired - Fee Related JP4039552B2 (en)

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