JP2003249585A - Package for storing electronic component - Google Patents

Package for storing electronic component

Info

Publication number
JP2003249585A
JP2003249585A JP2002048671A JP2002048671A JP2003249585A JP 2003249585 A JP2003249585 A JP 2003249585A JP 2002048671 A JP2002048671 A JP 2002048671A JP 2002048671 A JP2002048671 A JP 2002048671A JP 2003249585 A JP2003249585 A JP 2003249585A
Authority
JP
Japan
Prior art keywords
electronic component
recess
resin
package
striped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002048671A
Other languages
Japanese (ja)
Inventor
Kazuhiro Matsuo
一博 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2002048671A priority Critical patent/JP2003249585A/en
Publication of JP2003249585A publication Critical patent/JP2003249585A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the problem that, with the reduction in size of an electronic component, the electronic component cannot be firmly adhered and secured to a package and bonding wires cannot be reliably connected to electrodes. <P>SOLUTION: The package for storing the electronic component comprises an insulation base substance 1 having a concave section 1a to store the electronic component 3, and a cover body 2. The electronic component 3 is adhered and secured to the bottom face of the concave section 1a of the insulation base substance 1 via a resin 5, and the concave section 1a is sealed by the cover body 2. The bottom face of the concave section 1a of the insulation base substance 1 is formed in a circular arc shape, with the top at the center of the bottom face of the concave section 1a. The bottom face of the concave section 1a is formed with a plurality of striped projections 6. Some 6a of the striped projections 6 formed in the most outer part are higher than the other projections. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体素子や弾性
表面波素子等の電子部品を収容する電子部品収納用パッ
ケージに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage package for storing electronic components such as semiconductor devices and surface acoustic wave devices.

【０００２】[0002]

【従来技術】従来、半導体素子や表面弾性波素子等の電
子部品を収容するための電子部品収納用パッケージは、
酸化アルミニウム質焼結体等の電気絶縁材料から成り、
その上面の略中央部に電子部品を収容するための凹部及
び該凹部周辺から外表面にかけて導出されたタングステ
ン、モリブデン、マンガン等の高融点金属粉末から成る
メタライズ配線層を有する絶縁基体と、蓋体とから構成
されており、絶縁基体の凹部底面に電子部品をエポキシ
樹脂等の接着用の樹脂を介して接着固定するとともに電
子部品の各電極をボンディングワイヤを介して電気的に
接続し、最後に絶縁基体上面に蓋体をガラス、樹脂等の
封止部材により接合させ、内部に電子部品を気密封止す
ることによって最終製品としての電子装置となる。2. Description of the Related Art Conventionally, electronic component storage packages for storing electronic components such as semiconductor devices and surface acoustic wave devices have been
Made of an electrically insulating material such as an aluminum oxide sintered body,
An insulating substrate having a recess for accommodating an electronic component substantially in the center of its upper surface and a metallized wiring layer made of a refractory metal powder of tungsten, molybdenum, manganese, etc. drawn from the periphery of the recess to the outer surface, and a lid. The electronic component is adhered and fixed to the bottom surface of the concave portion of the insulating substrate through an adhesive resin such as epoxy resin, and each electrode of the electronic component is electrically connected through a bonding wire. The lid is joined to the upper surface of the insulating base by a sealing member such as glass or resin, and the electronic components are hermetically sealed inside, so that an electronic device as a final product is obtained.

【０００３】なお、電子部品の凹部底面への接着は、例
えば、まず凹部底面に未硬化のエポキシ樹脂等の接着用
の樹脂を塗布し、次に凹部底面上に電子部品を位置決め
載置するとともに電子部品に適当な荷重を印加し、電子
部品の下面と凹部底面との間に樹脂を濡れ広がらせて充
填し、最後にこの未硬化の樹脂を加熱硬化することによ
り行なわれる。In order to bond the electronic component to the bottom surface of the recess, for example, an adhesive resin such as an uncured epoxy resin is first applied to the bottom surface of the recess, and then the electronic component is positioned and placed on the bottom surface of the recess. A suitable load is applied to the electronic component, the resin is wetted and spread between the lower surface of the electronic component and the bottom surface of the concave portion, and finally the uncured resin is heat-cured.

【０００４】また、近時、電子部品は数ｍｍ角以下の小
型化されたものが多用され、この場合、電子部品と凹部
底面との接着面積が狭く接着強度が低下しやすいことか
ら、凹部底面に縞状の突起部を設け、この縞状の突起部
上に跨らせて電子部品を載置することにより電子部品の
下面と凹部底面との間に一定のスペースを確保し、この
スペース内に樹脂を充填することにより樹脂のボリュー
ムを確保し、電子部品の接着強度が低下することを防止
するようにした構造が多用されつつある。In recent years, electronic components that are smaller than a few mm square are often used. In this case, the adhesive area between the electronic component and the bottom surface of the recess is small, and the adhesive strength is likely to decrease. A striped protrusion is provided on the electronic component, and an electronic component is placed on the striped protrusion so that a certain space is secured between the lower surface of the electronic component and the bottom surface of the recess. A structure is often used in which the volume of the resin is secured by filling the resin into the resin to prevent the adhesive strength of the electronic component from being lowered.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、この従
来の電子部品収納用パッケージにおいては、酸化アルミ
ニウム質焼結体等から成る絶縁基体の表面に数μｍ程度
の多数の凹凸が存在し、また絶縁基体の凹部底面が平坦
であることから、接着用の樹脂が流れ難く、電子部品と
凹部底面との間に樹脂を均一に濡れ広がらせることが難
しく、接着強度が部分的にばらついてしまい、電子部品
を凹部底面に強固に接着固定することができないという
問題があった。However, in this conventional package for accommodating electronic components, the insulating base made of an aluminum oxide sintered body or the like has a large number of irregularities of about several μm, and the insulating base is made. Since the bottom surface of the recess is flat, it is difficult for the adhesive resin to flow, it is difficult to evenly spread the resin between the electronic component and the bottom surface of the recess, and the adhesive strength partially varies, resulting in an electronic component However, there is a problem in that it cannot be firmly adhered and fixed to the bottom surface of the recess.

【０００６】また同時に接着用の樹脂が流れ難いことか
ら、樹脂中に抱き込まれた気泡等の外部への移動が困難
で樹脂中に残留してボイド（空隙部）等の欠陥を生じ、
電子部品を凹部底面に強固に接着固定することができな
いという問題もあった。At the same time, since the adhesive resin does not easily flow, it is difficult for bubbles or the like entrapped in the resin to move to the outside, and they remain in the resin to cause defects such as voids (voids).
There is also a problem that the electronic component cannot be firmly adhered and fixed to the bottom surface of the recess.

【０００７】また、前記突起部の高さがほぼ同じである
ことから、電子部品を突起部の上面に跨らせて載置、接
着したとき、電子部品の外縁部で、電子部品と突起部と
の間の狭い隙間から押し出されるようにしてはみ出た接
着用の樹脂の一部が電子部品の側面を伝って上面に這い
上がり、電子部品の電極を覆ってしまい、電子部品の電
極にボンディングワイヤを接続することができなくなる
という問題もあった。Further, since the heights of the protrusions are substantially the same, when the electronic component is placed and adhered while straddling the upper surface of the protrusion, the electronic component and the protrusion are at the outer edge of the electronic component. Part of the adhesive resin that protrudes as if it is pushed out from the narrow gap between There was also a problem that could not be connected.

【０００８】本発明は上記従来技術における問題点に鑑
みてなされたものであり、その目的は、電子部品と凹部
底面との間に樹脂を、均一、かつボイド等の欠陥を生じ
ることなく充填させることができ、電子部品を凹部底面
に強固に接着固定することが可能であり、かつ電子部品
の電極にボンディングワイヤを確実に接続することが可
能な電子部品収納用パッケージを提供することにある。The present invention has been made in view of the above problems in the prior art, and an object thereof is to fill a resin between the electronic component and the bottom surface of the recess uniformly and without causing defects such as voids. An object of the present invention is to provide an electronic component storage package capable of firmly adhering and fixing an electronic component to the bottom surface of a concave portion and reliably connecting a bonding wire to an electrode of the electronic component.

【０００９】[0009]

【課題を解決するための手段】本発明の電子部品収納用
パッケージは、電子部品を収容するための凹部を有する
絶縁基体と蓋体とから成り、絶縁基体の凹部底面に電子
部品を樹脂を介して接着固定するとともに凹部を前記蓋
体で封止するようになした電子部品収納用パッケージで
あって、前記絶縁基体の凹部底面を、該凹部底面の中心
を頂点とする円弧状とするとともに凹部底面に縞状の複
数の突起部を設け、かつ前記縞状の突起部のうち最外部
に形成されたものの高さが、その他のものの高さよりも
低いことを特徴とするものである。An electronic component storing package according to the present invention comprises an insulating base having a recess for accommodating an electronic component and a lid, and the electronic component is provided on the bottom of the recess of the insulating base with a resin interposed therebetween. A package for storing electronic parts, wherein the recess is sealed with the lid, and the bottom of the recess of the insulating base is arcuate with the center of the bottom of the recess as an apex. A plurality of striped projections are provided on the bottom surface, and the height of the striped projection formed at the outermost part is lower than the height of the other striped projections.

【００１０】また本発明の電子部品収納用パッケージ
は、前記円弧状をなす凹部底面の最大高低差が５μｍ乃
至１５μｍであることを特徴とするものである。The electronic component storage package of the present invention is characterized in that the maximum height difference of the bottom surface of the arc-shaped recess is 5 μm to 15 μm.

【００１１】また本発明の電子部品収納用パッケージ
は、前記縞状の突起部のうち最外部に形成されたもの
と、その他のものの高さの差が、５μｍ〜２５μｍであ
ることを特徴とするものである。Further, the electronic component storing package according to the present invention is characterized in that the height difference between the outermost one of the striped protrusions and the other is 5 μm to 25 μm. It is a thing.

【００１２】本発明の電子部品収納用パッケージによれ
ば、絶縁基体の凹部底面を、該凹部底面の中心を頂点と
する円弧状とするとともに凹部底面に縞状の突起部を設
けたことから、電子部品接着用の樹脂を凹部底面の中心
から外周に向かって流れ易くし電子部品と凹部底面との
間に均一に樹脂を充填させて接着強度を均一なものとす
ることができるとともに、この外周に向かう接着用の樹
脂の流れにより樹脂中に抱き込まれた気泡等を外部に容
易に移動、排出させることができ、気泡等に起因する樹
脂中の空隙等の欠陥が生じることを効果的に防ぐことが
でき、電子部品を凹部底面に強固に接着固定することが
できる。According to the electronic component storage package of the present invention, since the bottom surface of the recess of the insulating substrate is formed in an arc shape having the center of the bottom surface of the recess as an apex, and the bottom surface of the recess is provided with striped projections, The resin for bonding electronic components can be made to easily flow from the center of the bottom surface of the recess toward the outer periphery, and the resin can be uniformly filled between the electronic component and the bottom surface of the recess to make the adhesive strength uniform. It is possible to easily move and discharge the air bubbles and the like entrapped in the resin by the flow of the adhesive resin toward the outside, and it is possible to effectively generate defects such as voids in the resin due to the air bubbles and the like. This can be prevented, and the electronic component can be firmly adhered and fixed to the bottom surface of the recess.

【００１３】また本発明の電子部品収納用パッケージに
よれば、前記縞状の複数の突起部のうち、最外部に形成
されたものの高さを他のものの高さよりも低くしたこと
から、突起部上に電子部品を跨らせて載せ、接着用の樹
脂で接着したとき、電子部品の外縁部で、電子部品と突
起部との間に適度な間隔を確保して接着用の樹脂を適量
留めておくことができ、接着用の樹脂が電子部品の側面
から上面にかけて這い上がることを効果的に抑えること
ができる。その結果、電子部品の電極が樹脂で覆われて
しまうことを防止し、ボンディングワイヤを電極に確実
に接続することが可能となる。According to the electronic component storing package of the present invention, the height of the outermost one of the plurality of striped protrusions is lower than the height of the other protrusions. When the electronic components are placed on top of each other and adhered with the resin for adhesion, an appropriate distance is secured between the electronic components and the protrusions at the outer edge of the electronic components, and the appropriate amount of resin for adhesion is retained. Therefore, it is possible to effectively prevent the adhesive resin from creeping up from the side surface to the upper surface of the electronic component. As a result, the electrodes of the electronic component can be prevented from being covered with the resin, and the bonding wires can be reliably connected to the electrodes.

【００１４】[0014]

【発明の実施の形態】次に本発明を添付図面に基づき詳
細に説明する。DETAILED DESCRIPTION OF THE INVENTION The present invention will now be described in detail with reference to the accompanying drawings.

【００１５】図１および図３は本発明の電子部品収納用
パッケージの一実施例を示し、１は電気絶縁材料から成
る絶縁基体、２は蓋体である。この絶縁基体１と蓋体２
とで半導体素子や表面弾性波素子等の電子部品３を収容
するための容器４が構成される。FIGS. 1 and 3 show an embodiment of a package for housing electronic parts according to the present invention, in which 1 is an insulating base made of an electrically insulating material and 2 is a lid. This insulating substrate 1 and lid 2
Together, a container 4 for housing an electronic component 3 such as a semiconductor element or a surface acoustic wave element is configured.

【００１６】前記絶縁基体１は酸化アルミニウム質焼結
体、ムライト質焼結体、窒化アルミニウム質焼結体等の
電気絶縁材料から成り、例えば、酸化アルミニウム質焼
結体から成る場合、酸化アルミニウム、酸化珪素、酸化
マグネシウム、酸化カルシウム等の原料粉末に適当な有
機バインダー、溶剤等を添加混合して泥漿物を作るとと
もに該泥漿物をドクターブレード法やカレンダーロール
法等によりシート状に成形してセラミックグリーンシー
トを得、しかる後、前記セラミックグリーンシートに適
当な打ち抜き加工を施すとともにこれを複数枚積層し、
約１６００℃の高温で焼成することによって製作され
る。The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, or an aluminum nitride sintered body. For example, in the case of an aluminum oxide sintered body, aluminum oxide, A raw material powder of silicon oxide, magnesium oxide, calcium oxide, etc. is mixed with an appropriate organic binder, a solvent, etc. to prepare a sludge, and the sludge is formed into a sheet by a doctor blade method or a calendar roll method, etc. Obtain a green sheet, after that, perform appropriate punching processing on the ceramic green sheet and stack a plurality of this,
It is manufactured by firing at a high temperature of about 1600 ° C.

【００１７】前記絶縁基体１はその上面中央部に電子部
品３を収容するための四角形状の凹部１ａが設けてある
とともに該凹部１ａの底面には縞状の複数の突起部６が
形成されており、電子部品３がこの縞状の突起部６に跨
るようにして載置されエポキシ樹脂等の樹脂５を介して
凹部１ａ底面に接着固定される。The insulating base 1 is provided with a rectangular recess 1a for accommodating the electronic component 3 in the center of its upper surface, and a plurality of striped projections 6 are formed on the bottom of the recess 1a. Then, the electronic component 3 is mounted so as to straddle the striped protrusion 6 and is adhesively fixed to the bottom surface of the recess 1 a via a resin 5 such as an epoxy resin.

【００１８】前記電子部品３の凹部１ａ底面への接着固
定は、まず縞状の突起部６が形成されている凹部１ａ底
面に未硬化の熱硬化性エポキシ樹脂等の接着用の樹脂を
塗布し、次に電子部品３を縞状の突起部６上に跨らせて
位置決め載置するとともに電子部品３に適当な荷重を印
加し、接着用の樹脂を電子部品３の下面と凹部１ａ上面
との間に濡れ広がらせ、その後、熱等で接着用の樹脂を
硬化させることにより行なわれる。In order to bond and fix the electronic component 3 to the bottom surface of the concave portion 1a, first, an adhesive resin such as an uncured thermosetting epoxy resin is applied to the bottom surface of the concave portion 1a in which the striped protrusions 6 are formed. Next, the electronic component 3 is positioned and placed so as to straddle the striped protrusions 6 and an appropriate load is applied to the electronic component 3, and the adhesive resin is applied to the lower surface of the electronic component 3 and the upper surface of the recess 1a. It is spread by wetting between the two, and then the resin for adhesion is cured by heat or the like.

【００１９】なお前記縞状の突起部６は、電子部品３と
凹部１ａ底面との間に一定のスペースを確保するための
スペーサーとして作用し、このスペース内に樹脂５を充
填させることにより電子部品３を絶縁基体１に接着する
樹脂量を十分なものとし、電子部品３の接着強度を確保
するようになっている。The striped protrusion 6 acts as a spacer for ensuring a certain space between the electronic component 3 and the bottom surface of the recess 1a, and the resin 5 is filled in this space to fill the electronic component. A sufficient amount of resin is used to adhere 3 to the insulating substrate 1 to ensure the adhesive strength of the electronic component 3.

【００２０】また前記縞状の突起部６は、例えば、タン
グステン、モリブデン、マンガン等の高融点金属粉末か
ら成り、該高融点金属粉末に適当な有機溶剤、溶媒を添
加混合して得た金属ペーストを従来周知のスクリーン印
刷法等の厚膜手法を採用し、絶縁基体１の凹部１ａ底面
となるセラミックグリーンシートに所定厚みに印刷塗布
しておくことによって絶縁基体１の凹部１ａ底面に被着
形成される。The striped protrusions 6 are made of a refractory metal powder such as tungsten, molybdenum, or manganese, and a metal paste obtained by adding and mixing a suitable organic solvent or solvent to the refractory metal powder. Is formed on the bottom surface of the concave portion 1a of the insulating substrate 1 by printing and applying a predetermined thickness to a ceramic green sheet that will be the bottom surface of the concave portion 1a of the insulating substrate 1 by using a well-known thick film method such as screen printing. To be done.

【００２１】前記縞状の突起部６は、その最大高さが約
２５μｍ〜３５μｍの高さとなるように形成しておくこ
とが好ましく、凹部１ａ底面と電子部品３との間に十分
なスペースを確保することができるとともに、縞状の突
起部６にカケ、剥離等の不具合が生じることを効果的に
防止することができる。It is preferable that the striped protrusion 6 has a maximum height of about 25 μm to 35 μm, and a sufficient space is provided between the bottom surface of the recess 1 a and the electronic component 3. This can be ensured, and at the same time, it is possible to effectively prevent defects such as chipping and peeling of the striped protrusions 6.

【００２２】更に前記縞状の突起部６は、タングステ
ン、モリブデン、マンガン等の高融点金属粉末から成る
場合、その表面にニッケル、金等のめっき層を１〜２０
μｍ程度の厚みに被着させておくと、その酸化腐食を効
果的に防止し、電子部品３をより一層容易かつ確実に接
着することができる。従って、前記縞状の突起部６は、
その表面にニッケル、金等のめっき層を１〜２０μｍの
厚みに被着させておくことが好ましい。Further, when the striped protrusions 6 are made of refractory metal powder such as tungsten, molybdenum, manganese, etc., a plating layer of nickel, gold, etc. is formed on the surface of the protrusions 1-20.
If it is adhered to a thickness of about μm, its oxidative corrosion can be effectively prevented, and the electronic component 3 can be bonded more easily and reliably. Therefore, the striped protrusion 6 is
It is preferable to deposit a plating layer of nickel, gold or the like on the surface to a thickness of 1 to 20 μm.

【００２３】本発明の電子部品収納用パッケージにおい
ては、図３に示すように、縞状の複数の突起部６のう
ち、最外部のもの６ａの高さを他のものの高さよりも低
くしておくことが重要である。In the package for storing electronic parts of the present invention, as shown in FIG. 3, the height of the outermost one 6a of the plurality of striped projections 6 is made lower than that of the other. It is important to keep it.

【００２４】前記突起部６のうち、最外部のもの６ａの
高さを他のものの高さよりも低くしておくと、突起部６
上に電子部品３を跨らせて載せ、接着用の樹脂で接着し
たとき、電子部品３の外縁部で、電子部品３と突起部６
ａとの間に適度な間隔を確保して接着用の樹脂を適量留
めておくことができ、接着用の樹脂が電子部品の側面か
ら上面にかけて這い上がることを効果的に抑えることが
できる。その結果、電子部品３の電極が樹脂５で覆われ
てしまうことを防止し、後述するボンディングワイヤの
接続が樹脂５で妨げられることはなく、確実に接続する
ことが可能となる。If the height of the outermost one 6a of the protrusions 6 is set lower than the height of the other ones, the protrusions 6
When the electronic component 3 is placed on the top of the electronic component 3 and is bonded with a resin for bonding, the electronic component 3 and the protrusion 6 are formed at the outer edge of the electronic component 3.
An appropriate amount of the adhesive resin can be retained by securing an appropriate distance between the adhesive resin and a, and it is possible to effectively prevent the adhesive resin from creeping up from the side surface to the upper surface of the electronic component. As a result, it is possible to prevent the electrode of the electronic component 3 from being covered with the resin 5, and the connection of the bonding wire described later is not hindered by the resin 5, and the connection can be reliably performed.

【００２５】また、前記縞状の突起部６のうち、最外部
のもの６ａの高さをその他のものの高さよりも低くする
には、例えば、まず縞状の突起部６が全部形成されるよ
うにして金属ペーストをセラミックグリーンシートに印
刷塗布した後、最外部以外の突起部のみが印刷されるよ
うな製版を使用して再度金属ペーストを印刷塗布する等
の方法を用いることができる。In order to make the height of the outermost one 6a of the striped projections 6 lower than the height of the other striped projections 6, first, all the striped projections 6 are formed. Then, after applying the metal paste by printing to the ceramic green sheet, the metal paste can be applied again by printing using a plate making such that only the protrusions other than the outermost part are printed.

【００２６】また、縞状の突起部６のうち、最外部のも
の６ａの高さと、他のものの高さの差が５μｍ未満では
接着用の樹脂の這い上がりを効果的に防止することが難
しくなり、２５μｍを超えると、電子部品３が傾いて接
着される危険性が大きくなる傾向がある。したがって、
前記縞状の突起部６のうち、最外部のもの６ａの高さ
と、その他のものの高さの差は５μｍ〜２５μｍの範囲
としておくことが好ましい。If the difference between the height of the outermost portion 6a of the striped protrusions 6a and the height of the other ones is less than 5 μm, it is difficult to effectively prevent the adhesive resin from creeping up. When it exceeds 25 μm, there is a tendency that the risk that the electronic component 3 is inclined and adhered increases. Therefore,
Of the striped protrusions 6, it is preferable that the difference in height between the outermost one 6a and the other ones is in the range of 5 μm to 25 μm.

【００２７】また本発明の電子部品収納用パッケージに
おいては、絶縁基体１の凹部１ａの底面に上記のような
突起部６を設けるとともに、凹部１ａ底面を、該凹部１
ａ底面の中心を頂点とする円弧状とすることが重要であ
る。In addition, in the package for storing electronic parts of the present invention, the above-described protrusion 6 is provided on the bottom surface of the recess 1a of the insulating substrate 1, and the bottom surface of the recess 1a is provided with the recess 1a.
It is important to make an arc shape with the center of the bottom surface a as the apex.

【００２８】前記凹部１ａ底面を、該凹部１ａの中心を
頂点とする円弧状とすることにより、凹部１ａ底面は中
心から外側に向かって下るように傾斜した形状とするこ
とができ、電子部品３を凹部１ａ底面に接着する際、こ
の傾斜面に沿って接着用樹脂を中心から外周に向かって
容易に流れるようにすることができる。その結果、電子
部品３と凹部１ａ底面との間に均一に樹脂５を充填させ
て接着強度を均一なものとすることができるとともに、
外周に向かう接着用の樹脂の流れにより樹脂中に抱き込
まれた気泡等を外部に容易に移動、排出させることがで
き、気泡等に起因する樹脂５中の空隙等の欠陥が生じる
ことを効果的に防ぐことができ、電子部品３を凹部１ａ
底面に強固に接着固定することができる。By forming the bottom surface of the recess 1a into an arc shape having the center of the recess 1a as an apex, the bottom surface of the recess 1a can be inclined downward from the center toward the outside, and the electronic component 3 When the adhesive is adhered to the bottom surface of the concave portion 1a, the adhesive resin can easily flow along the inclined surface from the center toward the outer periphery. As a result, the resin 5 can be uniformly filled between the electronic component 3 and the bottom surface of the recess 1a to make the adhesive strength uniform, and
By the flow of the adhesive resin toward the outer periphery, bubbles and the like entrapped in the resin can be easily moved to the outside and discharged, and it is effective that defects such as voids in the resin 5 caused by the bubbles and the like occur. The electronic component 3 is recessed 1a.
It can be firmly bonded and fixed to the bottom surface.

【００２９】この場合、凹部１ａ底面の最大高低差が５
μｍ未満では凹部１ａ底面の中心から外周にかけての傾
斜が不十分となり、接着用の樹脂を外周に向かって効果
的に流れ易くすることが困難となり、１５μｍを超える
と傾斜が強くなり過ぎ、この凹部１ａ底面に電子部品３
を水平に接着固定することが困難となり、電子部品３が
傾いて接着強度が劣化する傾向にあり、また後述するボ
ンディングワイヤを正確に電子部品３の電極に接続させ
ることが困難となる。従って、前記凹部１ａ底面は、そ
の最大高低差が５μｍ乃至１５μｍの範囲であることが
好ましい。In this case, the maximum height difference of the bottom surface of the recess 1a is 5
If it is less than μm, the inclination from the center of the bottom surface of the concave portion 1a to the outer periphery becomes insufficient, and it becomes difficult to effectively flow the adhesive resin toward the outer periphery, and if it exceeds 15 μm, the inclination becomes too strong. Electronic component 3 on the bottom of 1a
Is difficult to horizontally bond and fix, the electronic component 3 tends to be inclined and the adhesive strength is deteriorated, and it is difficult to accurately connect a bonding wire described later to an electrode of the electronic component 3. Therefore, it is preferable that the maximum height difference of the bottom surface of the recess 1a is in the range of 5 μm to 15 μm.

【００３０】なお、前記凹部１ａ底面を、該凹部１ａ底
面の中心を頂点とする円弧状とするには、セラミックグ
リーンシートの凹部１ａ底面となる領域の外周部に中心
よりも大きな荷重をかけて焼成し凹部１ａ底面全体を円
弧状に反った形状とする方法や、セラミックグリーンシ
ートの凹部１ａ底面となる領域の中心から外周にかけて
円弧状の断面となるようにセラミックペーストを塗布し
ておく方法を用いることができる。In order to make the bottom surface of the recess 1a into an arc shape having the center of the bottom surface of the recess 1a as an apex, a larger load than the center is applied to the outer peripheral portion of the area of the bottom surface of the recess 1a of the ceramic green sheet. A method of firing to form the entire bottom surface of the concave portion 1a into an arc shape or a method of applying the ceramic paste so as to form an arc-shaped cross section from the center to the outer periphery of the area of the ceramic green sheet which becomes the bottom surface of the concave portion 1a. Can be used.

【００３１】更に前記絶縁基体１はその凹部１ａ周辺か
ら容器４の外部にかけてメタライズ配線層７が被着形成
されており、該メタライズ配線層７の凹部１ａ周辺部は
電子部品３の各電極がボンディングワイヤ８を介し電気
的に接続され、また容器４の外部に導出された部位は錫
−鉛半田等の低融点ロウ材を介して外部電気回路と接続
される。Further, a metallized wiring layer 7 is formed on the insulating substrate 1 from the periphery of the recess 1a to the outside of the container 4, and the electrodes of the electronic component 3 are bonded to the periphery of the recess 1a of the metallized wiring layer 7. The portion electrically connected through the wire 8 and led out to the outside of the container 4 is connected to an external electric circuit through a low melting point brazing material such as tin-lead solder.

【００３２】前記メタライズ配線層７はタングステン、
モリブデン、マンガン等の高融点金属粉末から成り、該
高融点金属粉末に適当な有機溶剤、溶媒を添加混合して
得た金属ペーストを従来周知のスクリーン印刷法等の厚
膜手法を採用し、絶縁基体１となるセラミックグリーン
シートに予め印刷塗布しておくことによって絶縁基体１
の凹部１ａ周辺から容器４内部にかけて被着形成され
る。The metallized wiring layer 7 is made of tungsten,
A metal paste made of high-melting point metal powder such as molybdenum and manganese, which is obtained by adding and mixing an appropriate organic solvent and solvent to the high-melting point metal powder, adopts a thick film technique such as a well-known screen printing method to insulate Insulating substrate 1 is obtained by printing and applying it to the ceramic green sheet that becomes substrate 1 in advance.
From the periphery of the concave portion 1a to the inside of the container 4, the coating is formed.

【００３３】前記絶縁基体１は更にその上面に蓋体２が
封止部材９を介して接合され、これによって絶縁基体１
の凹部１ａはその内部が蓋体２によって気密に封止され
る。The insulating base 1 is further joined to the upper surface of the lid 2 via the sealing member 9, whereby the insulating base 1 is formed.
The inside of the recess 1a is hermetically sealed by the lid 2.

【００３４】前記蓋体２は、鉄−ニッケル−コバルト合
金、酸化アルミニウム質焼結体、ムライト質焼結体、窒
化アルミニウム質焼結体等から成り、例えば酸化アルミ
ニウム質焼結体から成る場合、酸化アルミニウム、酸化
マグネシウム、酸化カルシウム等の原料粉末を従来周知
のプレス成形法を採用することによって成形するととも
にこれを約１５００℃の温度で焼成することによって形
成される。The lid 2 is made of an iron-nickel-cobalt alloy, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or the like. It is formed by molding a raw material powder of aluminum oxide, magnesium oxide, calcium oxide or the like by adopting a conventionally known press molding method and firing the powder at a temperature of about 1500 ° C.

【００３５】かくしてこの電子部品収納用パッケージに
よれば、絶縁基体１の凹部１ａ底面に電子部品３をエポ
キシ樹脂等から成る樹脂５を介して接着し、次に前記電
子部品３の各電極をメタライズ配線層７にボンディング
ワイヤ８を介して電気的に接続させ、最後に絶縁基体１
の上面に蓋体２をガラス、樹脂等から成る封止部材９を
介して接合させ、絶縁基体１と蓋体２とから成る容器４
内部に電子部品３を気密に収容することによって最終製
品としての電子装置となる。Thus, according to this electronic component storing package, the electronic component 3 is adhered to the bottom surface of the concave portion 1a of the insulating substrate 1 through the resin 5 made of epoxy resin or the like, and then each electrode of the electronic component 3 is metallized. The wiring layer 7 is electrically connected via a bonding wire 8, and finally the insulating substrate 1
The lid 2 is bonded to the upper surface of the container via a sealing member 9 made of glass, resin or the like, and the container 4 made up of the insulating base 1 and the lid 2 is joined.
An electronic device as a final product is obtained by hermetically housing the electronic component 3 inside.

【００３６】なお、本発明は上記実施例に限定されるも
のではなく、本発明の要旨を逸脱しない範囲での種々の
変更・改良を加えることは何ら差し支えない。例えば、
上記実施例においては絶縁基体を酸化アルミニウム質焼
結体等を用いた場合について説明したが、絶縁基体とし
てプラスチック等の樹脂材料製や有機材料と無機材料と
の複合材料製のものを用いてもよい。The present invention is not limited to the above embodiments, and various modifications and improvements can be added without departing from the gist of the present invention. For example,
In the above embodiments, the case where the insulating substrate is an aluminum oxide sintered body or the like has been described, but an insulating substrate made of a resin material such as plastic or a composite material of an organic material and an inorganic material may be used. Good.

【００３７】[0037]

【発明の効果】本発明の電子部品収納用パッケージによ
れば、絶縁基体の凹部底面を、該凹部底面の中心を頂点
とする円弧状とするとともに凹部底面に縞状の突起部を
設けたことから、電子部品接着用の樹脂を凹部底面の中
心から外周に向かって流れ易くし電子部品と凹部底面と
の間に均一に樹脂を充填させて接着強度を均一なものと
することができるとともに、この外周に向かう接着用の
樹脂の流れにより樹脂中に抱き込まれた気泡等を外部に
容易に移動、排出させることができ、気泡等に起因する
樹脂中の空隙等の欠陥が生じることを効果的に防ぐこと
ができ、電子部品を凹部底面に強固に接着固定すること
ができる。According to the electronic component storing package of the present invention, the bottom surface of the recess of the insulating base is formed in an arc shape having the center of the bottom surface of the recess as an apex, and the bottom surface of the recess is provided with a striped projection. Therefore, the resin for bonding electronic components can be made to easily flow from the center of the recess bottom surface toward the outer periphery, and the resin can be uniformly filled between the electronic components and the recess bottom surface to make the adhesive strength uniform, By the flow of the adhesive resin toward the outer periphery, bubbles and the like entrapped in the resin can be easily moved to the outside and discharged, and it is effective that defects such as voids in the resin caused by the bubbles occur. The electronic component can be firmly adhered and fixed to the bottom surface of the recess.

【００３８】また本発明の電子部品収納用パッケージに
よれば、前記縞状の複数の突起部のうち、最外部に形成
されたものの高さを他のものの高さよりも低くしたこと
から、突起部上に電子部品を跨らせて載せ、接着用の樹
脂で接着したとき、電子部品の外縁部で、電子部品と突
起部との間に適度な間隔を確保して接着用の樹脂を適量
留めておくことができ、接着用の樹脂が電子部品の側面
から上面にかけて這い上がることを効果的に抑えること
ができる。そしてその結果、電子部品の電極が樹脂で覆
われてしまうことを防止し、ボンディングワイヤを電極
に確実に接続することが可能となる。Further, according to the electronic component storing package of the present invention, the height of the outermost one of the plurality of striped projections is made lower than the height of the other projections. When the electronic components are placed on top of each other and adhered with the resin for adhesion, an appropriate distance is secured between the electronic components and the protrusions at the outer edge of the electronic components, and the appropriate amount of resin for adhesion is retained. Therefore, it is possible to effectively prevent the adhesive resin from creeping up from the side surface to the upper surface of the electronic component. As a result, the electrodes of the electronic component can be prevented from being covered with the resin, and the bonding wires can be reliably connected to the electrodes.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.

【図２】本発明の一実施例を示す平面図である。FIG. 2 is a plan view showing an embodiment of the present invention.

【図３】図２のＲ−Ｒ´断面図である。FIG. 3 is a sectional view taken along line RR ′ of FIG.

【符号の説明】[Explanation of symbols]

１・・・・絶縁基体 １ａ・・・凹部 ２・・・・蓋体 ３・・・・電子部品 ４・・・・容器 ５・・・・樹脂 ６・・・・縞状の突起部 ６ａ・・・縞状の突起部のうち最外部のもの ７・・・・メタライズ配線層 ８・・・・ボンディングワイヤ ９・・・・封止部材 1 ... Insulating substrate 1a ... recess 2 ... Lid 3 ... Electronic parts 4 ... Container 5 ... Resin 6 ... Striped protrusions 6a: Outermost one of striped protrusions 7 ... Metallized wiring layer 8 ... Bonding wire 9 ... Sealing member

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】電子部品を収容するための凹部を有する絶
縁基体と蓋体とから成り、絶縁基体の凹部底面に電子部
品を樹脂を介して接着固定するとともに凹部を前記蓋体
で封止するようになした電子部品収納用パッケージであ
って、 前記絶縁基体の凹部底面を、該凹部底面の中心を頂点と
する円弧状とするとともに凹部底面に縞状の複数の突起
部を設け、 かつ前記縞状の突起部のうち最外部に形成されたものの
高さが、その他のものの高さよりも低いことを特徴とす
る電子部品収納用パッケージ。1. An insulating base having a recess for accommodating an electronic component and a lid, wherein an electronic component is adhesively fixed to the bottom of the recess of the insulating base via a resin and the recess is sealed by the lid. A package for storing electronic parts configured as described above, wherein the recess bottom surface of the insulating base is arcuate with the center of the recess bottom surface as an apex, and a plurality of striped projections are provided on the recess bottom surface, A package for storing electronic parts, characterized in that the height of the outermost one of the striped protrusions is lower than the height of the other ones. 【請求項２】前記円弧状をなす凹部底面の最大高低差が
５μｍ乃至１５μｍであることを特徴とする請求項１に
記載の電子部品収納用パッケージ。2. The package for storing electronic components according to claim 1, wherein the maximum height difference of the bottom surface of the arc-shaped recess is 5 μm to 15 μm. 【請求項３】前記縞状の突起部のうち最外部に形成され
たものと、その他のものの高さの差が、５μｍ〜２５μ
ｍであることを特徴とする請求項１に記載の電子部品収
納用パッケージ。3. The height difference between the outermost one of the striped protrusions and the other is 5 μm to 25 μm.
The package for storing electronic components according to claim 1, wherein the package is m.
JP2002048671A 2002-02-25 2002-02-25 Package for storing electronic component Pending JP2003249585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002048671A JP2003249585A (en) 2002-02-25 2002-02-25 Package for storing electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002048671A JP2003249585A (en) 2002-02-25 2002-02-25 Package for storing electronic component

Publications (1)

Publication Number Publication Date
JP2003249585A true JP2003249585A (en) 2003-09-05

Family

ID=28661405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002048671A Pending JP2003249585A (en) 2002-02-25 2002-02-25 Package for storing electronic component

Country Status (1)

Country Link
JP (1) JP2003249585A (en)

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