JP2003249414A5 - - Google Patents
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- JP2003249414A5 JP2003249414A5 JP2002048834A JP2002048834A JP2003249414A5 JP 2003249414 A5 JP2003249414 A5 JP 2003249414A5 JP 2002048834 A JP2002048834 A JP 2002048834A JP 2002048834 A JP2002048834 A JP 2002048834A JP 2003249414 A5 JP2003249414 A5 JP 2003249414A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002048834A JP4530605B2 (en) | 2002-02-25 | 2002-02-25 | Multi-layer wiring board with built-in capacitor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002048834A JP4530605B2 (en) | 2002-02-25 | 2002-02-25 | Multi-layer wiring board with built-in capacitor element |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006076659A Division JP2006222440A (en) | 2006-03-20 | 2006-03-20 | Capacitor element |
| JP2007166465A Division JP2007311812A (en) | 2007-06-25 | 2007-06-25 | Capacitor element and multi-layer circuit board with built-in capacitor element |
| JP2007263951A Division JP4467612B2 (en) | 2007-10-10 | 2007-10-10 | Multi-layer wiring board with built-in capacitor element |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003249414A JP2003249414A (en) | 2003-09-05 |
| JP2003249414A5 true JP2003249414A5 (en) | 2006-05-18 |
| JP4530605B2 JP4530605B2 (en) | 2010-08-25 |
Family
ID=28661501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002048834A Expired - Fee Related JP4530605B2 (en) | 2002-02-25 | 2002-02-25 | Multi-layer wiring board with built-in capacitor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4530605B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100837147B1 (en) * | 2004-10-29 | 2008-06-11 | 가부시키가이샤 무라타 세이사쿠쇼 | Multilayer substrate incorporating chip type electronic component |
| JP4844487B2 (en) * | 2006-08-09 | 2011-12-28 | 株式会社村田製作所 | Multilayer capacitor, circuit board, circuit module, and multilayer capacitor manufacturing method |
| JP5007746B2 (en) * | 2007-06-15 | 2012-08-22 | 株式会社村田製作所 | Component built-in board |
| JP2008306227A (en) * | 2008-09-25 | 2008-12-18 | Panasonic Electric Works Co Ltd | Uneveness shaped multilayer circuit board module and method of manufacturing the same |
| WO2010103723A1 (en) * | 2009-03-11 | 2010-09-16 | 日本電気株式会社 | Board with built-in function element, method of producing same, and electronic equipment |
| JP5038360B2 (en) * | 2009-06-22 | 2012-10-03 | 京セラ株式会社 | Manufacturing method of multilayer wiring board with built-in capacitor element |
| KR101698167B1 (en) * | 2015-01-02 | 2017-01-19 | 삼화콘덴서공업주식회사 | Multi-layer ceramic capacitor |
| CN106847504A (en) * | 2017-03-23 | 2017-06-13 | 日新电机（无锡）有限公司 | Capacitor sound insulation cavity configuration |
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2002
- 2002-02-25 JP JP2002048834A patent/JP4530605B2/en not_active Expired - Fee Related