JP2003219235A - Solid-state image pickup device - Google Patents
Solid-state image pickup deviceInfo
- Publication number
- JP2003219235A JP2003219235A JP2002017990A JP2002017990A JP2003219235A JP 2003219235 A JP2003219235 A JP 2003219235A JP 2002017990 A JP2002017990 A JP 2002017990A JP 2002017990 A JP2002017990 A JP 2002017990A JP 2003219235 A JP2003219235 A JP 2003219235A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lens holder
- image pickup
- pickup device
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、固体撮像装置、と
りわけ携帯電話機やノート型パソコン等の携帯機器に搭
載される固体撮像装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device, and more particularly to a solid-state image pickup device mounted on a portable device such as a mobile phone or a notebook computer.
【０００２】[0002]
【従来の技術】従来、この種の固体撮像装置では、図７
に示すように、基板Ａに撮像素子Ｂが接続されていると
共に、基板ＡにはレンズホルダＣが搭載されている。そ
してレンズホルダＣは、レンズ等の光学部材Ｄを保持す
るとともに、撮像素子Ｂの中心に設けてある受光部ｂに
対向して光学フィルタＥを保持している。レンズホルダ
Ｃは、筒状部ｃの端面で基板Ａに当接し、不図示の接着
剤を用いて接着されるものである。2. Description of the Related Art Conventionally, in this type of solid-state image pickup device, as shown in FIG.
As shown in, the image pickup device B is connected to the substrate A, and the lens holder C is mounted on the substrate A. The lens holder C holds the optical member D such as a lens and holds the optical filter E facing the light receiving portion b provided at the center of the image sensor B. The lens holder C is in contact with the substrate A at the end face of the tubular portion c and is bonded using an adhesive agent (not shown).
【０００３】[0003]
【発明が解決しようとする課題】このような構成の場
合、筒状部ｃの端面が平面となっており、この筒状部ｃ
の端面のみに接着剤を塗布する構成となっていた。この
ため、レンズホルダＣと基板Ａとの接着面積が狭く、レ
ンズホルダＣと基板Ａとの接着強度が十分に得られない
という問題が生じていた。In the case of such a structure, the end face of the tubular portion c is a flat surface, and the tubular portion c
The adhesive was applied only to the end faces of the. Therefore, there is a problem in that the adhesive area between the lens holder C and the substrate A is small and the adhesive strength between the lens holder C and the substrate A cannot be sufficiently obtained.
【０００４】そこで本発明は、レンズホルダと基板との
接着面積を拡大して、レンズホルダと基板との接着強度
を向上可能な固体撮像装置を提供することを目的とす
る。Therefore, an object of the present invention is to provide a solid-state image pickup device capable of increasing the bonding area between the lens holder and the substrate to improve the bonding strength between the lens holder and the substrate.
【０００５】[0005]
【課題を解決するための手段】本発明の固体撮像装置
は、撮像素子と、当該撮像素子を保持する基板と、前記
撮像素子に被写体像を結像するレンズと、当該レンズを
保持するレンズホルダとを有し、前記レンズホルダは、
筒状部を有し、当該筒状部の端面で接着剤を介して前記
基板に接着されており、前記端面には、凹部が形成され
ており、前記凹部の表面は、凹凸面となっている。この
ような構成によれば、レンズホルダの筒状部の端面に凹
部が形成されており、さらに凹部の表面が凹凸面となっ
ているので、凹部及び凹部表面の凹みによってレンズホ
ルダと基板との接着面積が拡大し、レンズホルダと基板
との接着強度を向上できる。A solid-state image pickup device according to the present invention includes an image pickup device, a substrate holding the image pickup device, a lens for forming a subject image on the image pickup device, and a lens holder for holding the lens. And the lens holder has
It has a tubular portion, and is bonded to the substrate via an adhesive at the end surface of the tubular portion, a recess is formed in the end surface, and the surface of the recess is an uneven surface. There is. According to such a configuration, the concave portion is formed on the end surface of the cylindrical portion of the lens holder, and the surface of the concave portion is an uneven surface. The adhesive area is enlarged, and the adhesive strength between the lens holder and the substrate can be improved.
【０００６】前記基板の前記レンズホルダとの接着部に
は、当該基板上の回路パターンと接続される接続パター
ンの配設用孔が、前記接着剤を受容可能に形成されてい
るので、接続パターン配設用の孔によってレンズホルダ
と基板との接着面積がさらに拡大し、レンズホルダと基
板との接着強度をより向上できる。また、基板上の回路
パターンと接続される接続パターン配設用の孔がレンズ
ホルダと基板との接着力の強化用として兼用されるの
で、構成が複雑化することがない。[0006] In the bonding portion of the substrate with the lens holder, the connection pattern arranging hole for connecting with the circuit pattern on the substrate is formed so as to be able to receive the adhesive. The mounting hole further expands the bonding area between the lens holder and the substrate, and the bonding strength between the lens holder and the substrate can be further improved. Further, the hole for disposing the connection pattern, which is connected to the circuit pattern on the substrate, is also used for strengthening the adhesive force between the lens holder and the substrate, so that the structure is not complicated.
【０００７】また、本発明の固体撮像装置は、撮像素子
と、当該撮像素子を保持する基板と、前記撮像素子に被
写体像を結像するレンズと、当該レンズを保持するレン
ズホルダとを有し、前記レンズホルダは、筒状部を有
し、当該筒状部の端面で接着剤を介して前記基板に接着
されており、前記基板の前記レンズホルダとの接着部に
は、当該基板上の回路パターンと接続される接続パター
ンの配設用孔が、前記接着剤を受容可能に形成されてい
る。このような構成によれば、基板に設けられた接続パ
ターン配設用の孔によってレンズホルダと基板との接着
面積が拡大し、レンズホルダと基板との接着強度を向上
できる。また、基板上の回路パターンと接続される接続
パターン配設用の孔がレンズホルダと基板との接着力の
強化用として兼用されるので、構成が複雑化することが
ない。Further, the solid-state image pickup device of the present invention has an image pickup element, a substrate holding the image pickup element, a lens for forming a subject image on the image pickup element, and a lens holder for holding the lens. The lens holder has a tubular portion, and the end surface of the tubular portion is adhered to the substrate via an adhesive. The adhesive portion of the substrate with the lens holder is on the substrate. A hole for disposing the connection pattern, which is connected to the circuit pattern, is formed so as to receive the adhesive. With such a configuration, the bonding area between the lens holder and the substrate is enlarged by the hole for disposing the connection pattern provided on the substrate, and the bonding strength between the lens holder and the substrate can be improved. Further, the hole for disposing the connection pattern, which is connected to the circuit pattern on the substrate, is also used for strengthening the adhesive force between the lens holder and the substrate, so that the structure is not complicated.
【０００８】[0008]
【発明の実施の形態】本発明の実施の一形態を図面に示
す実施例に基づき具体的に説明する。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be specifically described based on an embodiment shown in the drawings.
【０００９】図１及び図２に示すように、本発明の固体
撮像装置は、基板１、撮像素子２及びレンズ３１等を備
えたレンズホルダ３から構成されている。As shown in FIGS. 1 and 2, the solid-state image pickup device of the present invention comprises a substrate 1, an image pickup element 2, and a lens holder 3 having a lens 31 and the like.
【００１０】図１に示すように、基板１の端面に複数の
接続端子部１１が整列して形成してある。この接続端子
部１１は、基板１の表面及び裏面に配線パターンを形成
し、この配線パターンの端部に端面スルーホールを形成
し、端面スルーホールの中に、導電部材である例えば銅
ペーストを埋め込み、表面及び裏面の配線パターンと銅
ペーストの表面に金めっき層を形成して接続端子部１１
としたものである。このために接続端子部１１は、基板
１の端面に凹部とならないで平坦面に整列して形成して
なる。接続端子部１１は、不図示の他の電子回路の接続
端子に接続されている。As shown in FIG. 1, a plurality of connection terminal portions 11 are formed in line on the end surface of the substrate 1. The connection terminal portion 11 has a wiring pattern formed on the front and back surfaces of the substrate 1, end face through holes are formed at the ends of the wiring pattern, and a conductive member such as copper paste is embedded in the end face through holes. , A gold plating layer is formed on the front and back wiring patterns and the surface of the copper paste to form the connection terminal portion 11
It is what Therefore, the connection terminal portion 11 is formed on the end surface of the substrate 1 so as to be aligned with a flat surface without forming a recess. The connection terminal portion 11 is connected to a connection terminal of another electronic circuit (not shown).
【００１１】基板１の上面中央部には、撮像素子２を収
納する凹部１ａが設けてある。凹部１ａ内には撮像素子
２が収納固定され、撮像素子２の上面の中心部には、受
光部２ａが設けてある。撮像素子２の不図示の端子部と
基板１の接続端子部１１とは、図２に示すワイヤ２ｂを
用いてワイヤボンディングされている。A concave portion 1a for accommodating the image pickup device 2 is provided in the center of the upper surface of the substrate 1. The image sensor 2 is housed and fixed in the recess 1a, and a light receiving section 2a is provided in the center of the upper surface of the image sensor 2. The terminal portion (not shown) of the image pickup device 2 and the connection terminal portion 11 of the substrate 1 are wire-bonded using the wire 2b shown in FIG.
【００１２】図２に示すように、レンズホルダ３は、レ
ンズ３１等の光学部材を保持する第１ホルダ３２、第２
ホルダ３３及びこれらとレンズ３１を押える押え部材３
４とからなり、第１ホルダ３２と第２ホルダ３３とを螺
合して光軸方向の長さを調整可能にしている。即ち、第
１ホルダ３２にレンズ３１を保持させ、第１ホルダ３２
の上面から上方に突出させた連結片３２ａに押え部材３
４の凹部３４ａを嵌合させ相互に係止させることにより
レンズ３１を脱出不能に押えている。押え部材３４の上
面中央には絞り部３４ｂが設けてある。第１ホルダ３２
の外周部には円筒部３２ｂを下方に突出して設けてあ
り、円筒部３２ｂの内周面には雌ねじ部３２ｃが形成し
てある。As shown in FIG. 2, the lens holder 3 includes a first holder 32 and a second holder 32 for holding optical members such as the lens 31.
Holder 33 and pressing member 3 for pressing these and lens 31
4, the first holder 32 and the second holder 33 are screwed together so that the length in the optical axis direction can be adjusted. That is, the lens 31 is held by the first holder 32, and the first holder 32
To the connecting piece 32a protruding upward from the upper surface of the pressing member 3
The concave portion 34a of No. 4 is fitted and locked to each other, so that the lens 31 is pressed so that it cannot be removed. A throttle portion 34b is provided at the center of the upper surface of the pressing member 34. First holder 32
A cylindrical portion 32b is provided so as to project downward on the outer peripheral portion of the, and a female screw portion 32c is formed on the inner peripheral surface of the cylindrical portion 32b.
【００１３】第１ホルダ３２に螺合する第２ホルダ３３
は、上方に円筒部３３ａを突出して設け、円筒部３３ａ
の外周面に、雌ねじ部３２ｃとねじ合わされる雄ねじ部
３３ｂが形成してある。第１ホルダ３２の雌ねじ部３２
ｃと第２ホルダ３３の雄ねじ部３３ｂとのねじ合わせ量
を加減することで、レンズ３１と受光部２ａとの間の距
離を調整することができ、所謂ピントの合わせ込みが可
能である。A second holder 33 screwed into the first holder 32.
Is provided by projecting a cylindrical portion 33a upward,
A male screw portion 33b screwed with the female screw portion 32c is formed on the outer peripheral surface of the. Female thread portion 32 of the first holder 32
By adjusting the amount of screwing between c and the male screw portion 33b of the second holder 33, the distance between the lens 31 and the light receiving portion 2a can be adjusted, and so-called focusing can be performed.
【００１４】第２ホルダ３３により、レンズ３１と対向
しかつ撮像素子２と対向するように赤外線カットフィル
タ等の光学フィルタ３５が保持されている。第２ホルダ
３３にはレンズ３１と対向して開口３３ｃが設けてあ
り、開口３３ｃの周囲の下面側にフィルタ収納部３３ｄ
を設け、ここに光学フィルタ３５を収納し接着剤を用い
て接着されている。また、第２ホルダ３３からは下方に
筒状部３３ｅが突出しており、レンズホルダ３は筒状部
３３ｅの端面３３ｆで後述する接着剤３６を介して基板
１に接着されている。An optical filter 35 such as an infrared cut filter is held by the second holder 33 so as to face the lens 31 and the image pickup device 2. The second holder 33 is provided with an opening 33c facing the lens 31, and the filter housing portion 33d is provided on the lower surface side around the opening 33c.
Is provided, the optical filter 35 is housed therein, and is adhered using an adhesive. Further, a tubular portion 33e projects downward from the second holder 33, and the lens holder 3 is bonded to the substrate 1 via an adhesive 36, which will be described later, on the end surface 33f of the tubular portion 33e.
【００１５】次に、レンズホルダ３と基板１との接着部
の構造について、図３乃至図５を参照しながら説明す
る。Next, the structure of the bonding portion between the lens holder 3 and the substrate 1 will be described with reference to FIGS. 3 to 5.
【００１６】図３及び図４に示すように、筒状部３３ｅ
の端面３３ｆには、その全周にわたって複数の凹部３３
ｇが設けられており、これらの各凹部３３ｇの内部には
接着剤３６が充填されている。図５に示すように、端面
３３ｆ及び凹部３３ｇの表面には、微細な複数の凹凸３
３ｈが形成されて凹凸面となっており、凹凸３３ｈの凹
みには接着剤３６が充填されている。As shown in FIGS. 3 and 4, a cylindrical portion 33e.
End face 33f has a plurality of concave portions 33f all around its circumference.
g is provided, and an adhesive 36 is filled inside each of the recesses 33g. As shown in FIG. 5, on the surfaces of the end face 33f and the recess 33g, a plurality of fine irregularities 3 are formed.
3h is formed to form an uneven surface, and the concave portion of the unevenness 33h is filled with the adhesive 36.
【００１７】このように、レンズホルダ３の筒状部３３
ｅの端面３３ｆに凹部３３ｇが形成されており、さらに
端面３３ｆ及び凹部３３ｇの表面には、微細な複数の凹
凸３３ｈが形成されているので、凹部３３ｇ及び凹凸３
３ｈの凹みによってレンズホルダ３と基板１との接着面
積が拡大し、レンズホルダ３と基板１との接着強度を向
上できる。Thus, the cylindrical portion 33 of the lens holder 3
Since the concave portion 33g is formed on the end surface 33f of the groove e and the plurality of fine irregularities 33h are formed on the surfaces of the end surface 33f and the concave portion 33g, the concave portion 33g and the irregularity 3 are formed.
Due to the depression of 3h, the adhesion area between the lens holder 3 and the substrate 1 is enlarged, and the adhesion strength between the lens holder 3 and the substrate 1 can be improved.
【００１８】また、端面３３ｆには、基板１に向かって
突出する３個の円柱状の突起部３３ｉが設けられてお
り、これらの各突起部３３ｉに基板１が当接している。
したがって、突起部３３ｉによってレンズホルダ３と基
板１とが３箇所で確実に当接するので、レンズホルダ３
の姿勢が安定し、レンズ３１の光軸が傾くことを防止で
きる。なお、突起部３３ｉの個数は３個に限らず、それ
以上設けても良い。Further, the end face 33f is provided with three columnar protrusions 33i protruding toward the substrate 1, and the substrate 1 is in contact with each of these protrusions 33i.
Therefore, the lens holder 3 and the substrate 1 are surely brought into contact with each other at the three locations by the protrusions 33i, so that the lens holder 3
Is stable, and the optical axis of the lens 31 can be prevented from tilting. The number of protrusions 33i is not limited to three, and more may be provided.
【００１９】なお、凹部３３ｇの個数及び設置箇所は図
３に記載された構成に限らず、適宜変更可能である。The number of the recesses 33g and the installation locations are not limited to those shown in FIG. 3, but can be changed as appropriate.
【００２０】また、本実施例では、筒状部３３ｅの端面
３３ｆ及び凹部３３ｇの表面に凹凸３３ｉを形成した
が、凹部３３ｇの表面のみに凹凸３３ｉを形成しても良
い。In the present embodiment, the unevenness 33i is formed on the end surface 33f of the cylindrical portion 33e and the surface of the recess 33g, but the unevenness 33i may be formed only on the surface of the recess 33g.
【００２１】図６は本発明の他の実施例を示すもので、
図５に示す基板１を多層基板としている。なお、同図に
おいて、図５と同一構成のものには同一の符号を附し、
その説明を省略する。図６に示すように、基板１は絶縁
層１ｂ、１ｃ、１ｄ、１ｅ及び１ｆが順次積層された多
層基板となっており、絶縁層１ｂ乃至１ｅ上には不図示
の回路パターンが設けてあり、最上部に積層されている
絶縁層１ｆ上には不図示の回路パターン及びレジスト層
が設けてある。絶縁層１ｆには、絶縁層１ｆ上の回路パ
ターンとその背面側の絶縁層１ｅ上の回路パターンとを
電気的に接続する接続パターン１ｈの配設用の孔１ｇが
形成されている。この孔１ｇは接続パターン１ｈ上に接
着剤３６を受容可能な凹み１ｉが形成されるように設け
られ、この凹み１ｉの内部には接着剤３６が充填されて
いる。このような構成によれば、孔１ｇの凹み１ｉによ
ってレンズホルダ３と基板１との接着面積が拡大し、レ
ンズホルダ３と基板１との接着強度をより向上できる。
また、基板１上の回路パターンと接続される接続パター
ン１ｈの配設用の孔１ｇが接着力の強化用として兼用さ
れるので、構成が複雑化することもない。なお、孔１ｇ
の個数は２個に限らず、適宜変更可能である。FIG. 6 shows another embodiment of the present invention.
The substrate 1 shown in FIG. 5 is a multilayer substrate. In the figure, the same components as those in FIG. 5 are designated by the same reference numerals,
The description is omitted. As shown in FIG. 6, the substrate 1 is a multi-layer substrate in which insulating layers 1b, 1c, 1d, 1e and 1f are sequentially laminated, and a circuit pattern (not shown) is provided on the insulating layers 1b to 1e. A circuit pattern and a resist layer (not shown) are provided on the uppermost insulating layer 1f. The insulating layer 1f is provided with holes 1g for arranging a connection pattern 1h for electrically connecting the circuit pattern on the insulating layer 1f and the circuit pattern on the insulating layer 1e on the back side thereof. The hole 1g is provided so that a recess 1i capable of receiving the adhesive 36 is formed on the connection pattern 1h, and the adhesive 36 is filled inside the recess 1i. With such a configuration, the recessed area 1i of the hole 1g expands the adhesive area between the lens holder 3 and the substrate 1, and the adhesive strength between the lens holder 3 and the substrate 1 can be further improved.
Further, since the hole 1g for disposing the connection pattern 1h connected to the circuit pattern on the substrate 1 is also used for strengthening the adhesive force, the structure is not complicated. 1g hole
Is not limited to two, but can be changed as appropriate.
【００２２】[0022]
【発明の効果】本発明の固体撮像装置は、撮像素子と、
当該撮像素子を保持する基板と、撮像素子に被写体像を
結像するレンズと、レンズを保持するレンズホルダとを
有し、レンズホルダは筒状部を有し、筒状部の端面で接
着剤を介して前記基板に接着されており、端面には凹部
が形成されており、凹部の表面は凹凸面となっているの
で、凹部及び凹部表面の凹みによってレンズホルダと基
板との接着面積が拡大し、レンズホルダと基板との接着
強度を向上できる。The solid-state image pickup device of the present invention comprises an image pickup element,
A substrate that holds the image pickup device, a lens that forms a subject image on the image pickup device, and a lens holder that holds the lens are provided. The lens holder has a tubular portion, and an adhesive agent is provided on the end surface of the tubular portion. It is adhered to the substrate through the end face, and a concave portion is formed on the end face, and the surface of the concave portion is an uneven surface. Therefore, the concave portion and the concave surface of the concave portion increase the adhesion area between the lens holder and the substrate. However, the adhesive strength between the lens holder and the substrate can be improved.
【００２３】また、前記基板の前記レンズホルダとの接
着部には、当該基板上の回路パターンと接続される接続
パターンの配設用孔が、前記接着剤を受容可能に形成さ
れているので、接続パターン配設用の孔によってレンズ
ホルダと基板との接着面積がさらに拡大し、レンズホル
ダと基板との接着強度をより向上できる。また、基板上
の回路パターンと接続される接続パターン配設用の孔が
レンズホルダと基板との接着力の強化用として兼用され
るので、構成が複雑化することもない。Further, since a hole for disposing a connection pattern to be connected to a circuit pattern on the substrate is formed in the adhesive portion of the substrate to the lens holder so that the adhesive can be received, The bonding area between the lens holder and the substrate is further expanded by the hole for disposing the connection pattern, and the bonding strength between the lens holder and the substrate can be further improved. Further, since the hole for disposing the connection pattern, which is connected to the circuit pattern on the substrate, is also used for strengthening the adhesive force between the lens holder and the substrate, the structure is not complicated.
【図１】本発明の一実施例を示したレンズホルダを取り
外した状態の平面図。FIG. 1 is a plan view showing a state where a lens holder according to an embodiment of the present invention is removed.
【図２】図１の中央縦断面図。FIG. 2 is a central longitudinal sectional view of FIG.
【図３】図２に示したレンズホルダをＡ方向から見た平
面図。FIG. 3 is a plan view of the lens holder shown in FIG. 2 viewed from the direction A.
【図４】図３のＢ−Ｂ線断面図。FIG. 4 is a sectional view taken along line BB of FIG.
【図５】図４の要部の拡大断面図。5 is an enlarged cross-sectional view of the main part of FIG.
【図６】本発明の他の実施例を図５に対応して示した要
部の拡大断面図。FIG. 6 is an enlarged cross-sectional view of the main part, showing another embodiment of the present invention in correspondence with FIG.
【図７】従来例を示した中央縦断面図。FIG. 7 is a central longitudinal sectional view showing a conventional example.
１ 基板 １ｇ 孔 １ｈ 接続パターン ２ 撮像素子 ３ レンズホルダ ３１ レンズ ３３ｅ 筒状部 ３３ｆ 端面 ３３ｇ 凹部 ３３ｉ 凹凸 ３６ 接着剤 1 substrate 1g hole 1h connection pattern 2 image sensor 3 lens holder 31 lens 33e Cylindrical part 33f end face 33g recess 33i unevenness 36 Adhesive
Claims (3)
板と、前記撮像素子に被写体像を結像するレンズと、当
該レンズを保持するレンズホルダとを有し、 前記レンズホルダは、筒状部を有し、当該筒状部の端面
で接着剤を介して前記基板に接着されており、 前記端面には、凹部が形成されており、 前記凹部の表面は、凹凸面となっていることを特徴とす
る固体撮像装置。1. An image pickup device, a substrate holding the image pickup device, a lens for forming a subject image on the image pickup device, and a lens holder holding the lens, wherein the lens holder has a tubular shape. The end portion of the tubular portion is adhered to the substrate via an adhesive agent, a recess is formed in the end surface, and the surface of the recess is an uneven surface. A solid-state image pickup device comprising:
ズホルダとの接着部には、当該基板上の回路パターンと
接続される接続パターンの配設用孔が、前記接着剤を受
容可能に形成されていることを特徴とする固体撮像装
置。2. The mounting hole of a connection pattern, which is connected to a circuit pattern on the substrate, is formed in the bonding portion of the substrate to the lens holder so that the adhesive can be received. A solid-state imaging device characterized by being provided.
板と、前記撮像素子に被写体像を結像するレンズと、当
該レンズを保持するレンズホルダとを有し、 前記レンズホルダは、筒状部を有し、当該筒状部の端面
で接着剤を介して前記基板に接着されており、 前記基板の前記レンズホルダとの接着部には、当該基板
上の回路パターンと接続される接続パターンの配設用孔
が、前記接着剤を受容可能に形成されていることを特徴
とする固体撮像装置。3. An image pickup device, a substrate holding the image pickup device, a lens for forming a subject image on the image pickup device, and a lens holder holding the lens, wherein the lens holder has a tubular shape. Has a portion and is adhered to the substrate through an adhesive at the end surface of the tubular portion, and a connection pattern to be connected to a circuit pattern on the substrate at an adhesion portion of the substrate with the lens holder. 2. The solid-state imaging device, wherein the mounting hole is formed so as to receive the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002017990A JP3821718B2 (en) | 2002-01-28 | 2002-01-28 | Solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002017990A JP3821718B2 (en) | 2002-01-28 | 2002-01-28 | Solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003219235A true JP2003219235A (en) | 2003-07-31 |
| JP3821718B2 JP3821718B2 (en) | 2006-09-13 |
Family
ID=27653489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002017990A Expired - Fee Related JP3821718B2 (en) | 2002-01-28 | 2002-01-28 | Solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3821718B2 (en) |
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| JP2010252307A (en) * | 2009-03-25 | 2010-11-04 | Kyocera Corp | Image capturing apparatus and imaging module |
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