JP2003218586A - Component supply method and component mounting apparatus - Google Patents
Component supply method and component mounting apparatusInfo
- Publication number
- JP2003218586A JP2003218586A JP2002015111A JP2002015111A JP2003218586A JP 2003218586 A JP2003218586 A JP 2003218586A JP 2002015111 A JP2002015111 A JP 2002015111A JP 2002015111 A JP2002015111 A JP 2002015111A JP 2003218586 A JP2003218586 A JP 2003218586A
- Authority
- JP
- Japan
- Prior art keywords
- component
- storage unit
- electronic
- taping
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、主として、回路基
板に実装すべき種々の電子部品を連続的に供給する方法
および供給される電子部品を回路基板に実装する部品実
装装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a method for continuously supplying various electronic components to be mounted on a circuit board and a component mounting apparatus for mounting the supplied electronic components on a circuit board.
【０００２】[0002]
【従来の技術】従来、部品実装装置における電子部品の
供給方式としては、テーピング方式、バルク方式および
トレイ方式などが知られているが、高速実装装置には主
にテーピング方式が採用されている。テーピング方式に
より電子部品を供給される部品実装装置は一般に図８に
示すような構成になっている。2. Description of the Related Art Conventionally, as a method of supplying electronic components in a component mounting apparatus, a taping method, a bulk method, a tray method and the like are known, but a high-speed mounting apparatus mainly uses the taping method. A component mounting apparatus to which electronic components are supplied by the taping method is generally configured as shown in FIG.
【０００３】すなわち、この部品実装装置は、装置本体
１の部品供給部２に、部品収納部（テープリール）４を
有する複数の部品供給カセット３が並列配置で搭載され
る。これら部品供給カセット３から電子部品を吸着保持
するための吸着ノズル１０を備えた実装ヘッド９は、Ｘ
Ｙロボットに取り付けられて、Ｘ軸ガイドバー７および
Ｙ軸ガイドバー８によってＸ軸方向ＸおよびＹ軸方向Ｙ
に沿ってそれぞれ移動されることにより、所要の電子部
品を取り出すべき部品供給カセット３における後述の部
品供給口の真上に位置決めされる。位置決めされた実装
ヘッド９では、吸着ノズル１０が下降して部品供給カセ
ット３から電子部品を吸着保持して上昇する。そのの
ち、実装ヘッド９は、回路基板１１の上方まで移動され
て、その回路基板１１の電子部品を実装すべき位置の真
上に位置決め停止され、吸着ノズル１０に吸着保持して
いる電子部品を回路基板１１に実装する。That is, in this component mounting apparatus, a plurality of component supply cassettes 3 each having a component storage section (tape reel) 4 are mounted in parallel on a component supply section 2 of an apparatus main body 1. The mounting head 9 provided with a suction nozzle 10 for sucking and holding electronic components from these component supply cassettes 3
It is attached to the Y robot and is moved by the X-axis guide bar 7 and the Y-axis guide bar 8 in the X-axis direction X and the Y-axis direction Y.
Each of them is moved along with, and is positioned right above a component supply port, which will be described later, in the component supply cassette 3 from which a required electronic component is to be taken out. In the mounted head 9 that has been positioned, the suction nozzle 10 descends and suctions and holds the electronic component from the component supply cassette 3, and rises. After that, the mounting head 9 is moved to a position above the circuit board 11, positioned and stopped immediately above the position where the electronic component of the circuit board 11 is to be mounted, and the electronic component sucked and held by the suction nozzle 10 is held. It is mounted on the circuit board 11.
【０００４】図９に示すように、上記部品供給カセット
３では電子部品１２がテーピング部品１５として取り扱
われる。すなわち、テーピング部品１５は、キャリアテ
ープ１３の長手方向に沿って所定間隔で設けられた部品
収納凹所１４内に電子部品１２を収納し、且つカバーテ
ープ１７を貼着して部品収納凹所１４を閉塞することに
より、電子部品１２が部品収納凹所１４内に封入された
形態になっている。キャリアテープ１３には、一側辺に
沿って送り用穴１６が一定間隔で穿設されている。As shown in FIG. 9, in the component supply cassette 3, the electronic component 12 is handled as a taping component 15. That is, the taping component 15 accommodates the electronic components 12 in the component accommodating recesses 14 provided at a predetermined interval along the longitudinal direction of the carrier tape 13, and attaches the cover tape 17 to the component accommodating recesses 14. The electronic component 12 is sealed in the component housing recess 14 by closing the. Feed holes 16 are formed in the carrier tape 13 along one side at regular intervals.
【０００５】上記テーピング部品１５は、図１０に示す
ように、リールに巻き取られて上記部品収納部４とさ
れ、部品供給カセット３の支軸１８に回転自在、且つ着
脱自在に装着される。この部品供給カセット３に装着さ
れたテーピング部品１５は、図１０ないし図１２に示す
ように、部品収納部４から引き出されて押さえカバー１
９の下面に沿ってガイドされながら部品供給口２０に向
け移送され、部品供給口２０に位置した電子部品１２が
上記吸着ノズル１０で吸着保持されて取り出される。テ
ーピング部品１５の移送は、図１１にも示すように、移
送手段としてのスプロケット２１の送り爪２１ａが図９
（ａ）に示した送り用穴１６に嵌まり込んだ状態でスプ
ロケット２１が回転することによって行われる。As shown in FIG. 10, the taping component 15 is wound around a reel to form the component storage unit 4, which is rotatably and detachably mounted on the spindle 18 of the component supply cassette 3. The taping component 15 mounted on the component supply cassette 3 is pulled out from the component storage unit 4 and is pressed down as shown in FIGS.
The electronic component 12 positioned at the component supply port 20 is sucked and held by the suction nozzle 10 and taken out while being guided along the lower surface of the component 9 toward the component supply port 20. As shown in FIG. 11, when the taping component 15 is transferred, the feed claw 21a of the sprocket 21 as a transfer means is moved as shown in FIG.
This is performed by rotating the sprocket 21 while being fitted in the feed hole 16 shown in (a).
【０００６】上記テーピング部品１５のカバーテープ１
７は、上記テーピング部品１５が移送される過程におい
て、図１０および図１２に示すように、押さえカバー１
９における部品供給口２０の手前側に設けられた剥離手
段としてのスリット２２から引き出されてキャリアテー
プ１３から剥離して分離されたのちに、図１０に示す巻
き取りリール２３に巻き取られていく。巻き取りリール
２３は、支軸２４に回転自在に取り付けられて、エアシ
リンダなどの作動機構２７によって作動されるリンク状
レバー２８で押動されることにより、カバーテープ１７
の巻き取り方向Ａのみに間欠回転される。また、上記ス
プロケット２１は、上記リンク状レバー２８を押動する
作動機構２７の作動に連動して押動されるフィードレバ
ー２９によって間欠回転される。Cover tape 1 for the taping component 15
7 is a pressing cover 1 as shown in FIGS. 10 and 12 in the process of transferring the taping component 15.
9 is pulled out from a slit 22 as a peeling means provided on the front side of the component supply port 20 and is peeled off from the carrier tape 13 to be separated, and then wound on a take-up reel 23 shown in FIG. . The take-up reel 23 is rotatably attached to the support shaft 24, and is pushed by a link lever 28 operated by an operating mechanism 27 such as an air cylinder, whereby the cover tape 17
Is intermittently rotated only in the winding direction A. Further, the sprocket 21 is intermittently rotated by a feed lever 29 that is pushed in conjunction with the operation of an actuating mechanism 27 that pushes the link lever 28.
【０００７】すなわち、作動機構２７は、駆動機構を介
しスプロケット２１を間欠回転させることによってテー
ピング部品１５を所定量だけ移送して１個の電子部品１
２を部品供給口２０に供給すると同時に、リンク状レバ
ー２８およびラチェット機構を介し巻き取りリール２３
を所定角度だけ回転させてカバーテープ１７を所定量だ
け巻き取るように作動制御する。これにより、部品供給
口２０には、カバーテープ１７が剥離されて部品収納凹
所１４内で露呈された状態の電子部品１２が位置決めさ
れ、下降した吸着ノズル１０が部品供給口２０を通じて
電子部品１２を吸着保持して部品収納凹所１４から取り
出すようになっている。That is, the actuating mechanism 27 transfers the taping component 15 by a predetermined amount by intermittently rotating the sprocket 21 via the drive mechanism to transfer one electronic component 1 to the electronic component 1.
2 is supplied to the component supply port 20, and at the same time, the take-up reel 23 is connected via the link lever 28 and the ratchet mechanism.
Is rotated by a predetermined angle to control the operation so that the cover tape 17 is wound by a predetermined amount. As a result, the electronic component 12 in a state where the cover tape 17 is peeled off and exposed in the component storage recess 14 is positioned in the component supply port 20, and the suction nozzle 10 that has descended is moved to the electronic component 12 through the component supply port 20. Is suction-held and taken out from the component storage recess 14.
【０００８】また、図１１および図１２に示すように、
押さえカバー１９には、電子部品１２の部品供給口２０
への供給動作に連動して部品供給口２０を開閉すること
により、電子部品１２が部品供給口２０から不用意に飛
び出すのを防止するためのシャッタ３０が設けられてい
る。このシャッタ３０は、押さえカバー１９の側面に固
定された２本のガイドピン３１が自体のガイド長孔３２
に挿通されて、図１２の矢印方向に移動自在に設けられ
ている。シャッタ３０は、吸着ノズル１０により電子部
品１２を吸着保持して取り出すときのみ、図１２に示す
ように、切欠き３３が部品供給口２０に合致して部品供
給口２０を開放し、それ以外のときに、図１２の位置か
ら右方に移動して蓋部３０ａで部品供給口２０を閉塞す
るように部品供給動作と連動して作動制御される。Further, as shown in FIGS. 11 and 12,
The pressing cover 19 has a component supply port 20 for the electronic component 12.
A shutter 30 is provided to prevent the electronic component 12 from accidentally jumping out of the component supply port 20 by opening and closing the component supply port 20 in association with the supply operation to the component supply port 20. In this shutter 30, two guide pins 31 fixed to the side surface of the pressing cover 19 are provided with guide long holes 32.
It is provided so as to be movable in the direction of the arrow in FIG. As shown in FIG. 12, the shutter 30 opens the component supply port 20 when the notch 33 is aligned with the component supply port 20, as shown in FIG. 12, only when the electronic component 12 is sucked and held by the suction nozzle 10 and taken out. At this time, the operation is controlled in conjunction with the component supply operation so as to move to the right from the position of FIG. 12 and close the component supply port 20 with the lid 30a.
【０００９】上述のように、部品供給カセット３の部品
収納部４の電子部品１２は、部品供給口２０に移送され
て吸着ノズル１０で吸着保持されたのち、回路基板１１
に実装されていくが、この実装動作に伴って上記部品収
納部４に収納されている電子部品１２に部品切れが生じ
た場合には、作業者が部品切れの生じた部品供給カセッ
ト３を部品供給部２から取り外して、その部品供給カセ
ット３に新たな補充用の部品収納部４を交換して取り付
けたのち、その部品供給カセット３を部品実装装置の部
品供給部２における元の位置に戻して取り付け、続い
て、部品実装装置における部品交換スイッチ（図示せ
ず）を押圧操作して、部品収納部４を交換した情報を部
品実装装置に入力する。これにより、部品実装装置で
は、新たな電子部品１２が補充されたことを認識して、
その情報に基づいてその後の実装動作を制御する。As described above, the electronic component 12 in the component storage section 4 of the component supply cassette 3 is transferred to the component supply port 20 and sucked and held by the suction nozzle 10, and then the circuit board 11 is held.
However, if the electronic component 12 stored in the component storage unit 4 runs out of parts due to this mounting operation, the operator inserts the part supply cassette 3 in which the parts have run out into parts. After removing from the supply unit 2 and replacing and installing a new component storage unit 4 for replenishment in the component supply cassette 3, the component supply cassette 3 is returned to the original position in the component supply unit 2 of the component mounting apparatus. After that, the component exchange switch (not shown) in the component mounting apparatus is pressed to input the information on the exchange of the component storage unit 4 into the component mounting apparatus. As a result, the component mounting apparatus recognizes that the new electronic component 12 has been replenished,
The subsequent mounting operation is controlled based on the information.
【００１０】[0010]
【発明が解決しようとする課題】ところで、近年では、
図１３に示すように、部品供給カセット３を部品実装装
置の部品供給部２から取り外すことなく部品収納部４を
交換することにより、部品実装装置の稼働率を高めるこ
とのできる部品供給方法が採用されている。すなわち、
同図（ａ）に示すように、部品供給動作を行っている部
品供給カセット３の部品収納部４に部品切れが生じてい
ない状態において、同図（ｂ）に示すように、部品供給
カセット３の本体部分を部品実装装置の部品供給部２か
ら取り外すことなく、部品収納部４のみを取り外して、
その取り外した部品収納部４に取り付けられていたテー
ピング部品１５の終端部１５ｂと、新たな補充用の部品
収納部４のテーピング部品１５の始端部１５ａとを接続
して、同図（ｃ）に示すように、補充用の部品収納部４
を部品供給カセット３に取り付ける部品供給方法が採用
されている。By the way, in recent years,
As shown in FIG. 13, a component supply method capable of increasing the operating rate of the component mounting apparatus by replacing the component storage unit 4 without removing the component supply cassette 3 from the component supply unit 2 of the component mounting apparatus is adopted. Has been done. That is,
As shown in FIG. 4A, in the state where the component storage section 4 of the component supply cassette 3 that is performing the component supply operation has not run out of components, as shown in FIG. Without removing the main body of the component from the component supply unit 2 of the component mounting apparatus, only the component storage unit 4 is removed,
The terminal end portion 15b of the taping component 15 attached to the removed component storage portion 4 and the starting end portion 15a of the taping component 15 of the new component storage portion 4 for connection are connected to each other, and as shown in FIG. As shown, the parts storage unit 4 for replenishment
The component supply method of attaching the component to the component supply cassette 3 is adopted.
【００１１】ところで、電子部品１２が実装済みの回路
基板１１の品質を非常に重要視する例えば自動車業界な
どでは、回路基板１１上に実装済みの電子部品１２のロ
ット管理、つまり部品収納部４に巻き回された１つのテ
ーピング部品１５を単位として電子部品１２を管理する
ことが望まれている。したがって、部品実装装置では、
実装動作に使用中の部品収納部４のテーピング部品１５
における電子部品１２から補充用のテーピング部品１５
の電子部品１２に切り替わった時点を確実、且つ正確に
把握して管理することが必要となる。By the way, in the automobile industry in which the quality of the circuit board 11 on which the electronic components 12 are mounted is very important, for example, lot management of the electronic components 12 mounted on the circuit board 11, that is, the component storage section 4 is performed. It is desired to manage the electronic component 12 with one wound taping component 15 as a unit. Therefore, in the component mounting device,
Taping component 15 of component storage unit 4 being used for mounting operation
From electronic component 12 to taping component 15 for replenishment
It is necessary to reliably and accurately grasp and manage the time when the electronic component 12 is switched to.
【００１２】しかしながら、従来の電子部品１２の供給
方法のうちの作業者が部品切れの部品供給カセット３を
部品実装装置から取り外して新たな補充用の部品供給カ
セット３を取り付ける方法では、作業者が部品供給カセ
ット３の交換後に部品交換スイッチを押圧操作して部品
交換の情報を入力するので、部品実装装置において補充
用のテーピング部品１５に切り替わった時点を正確に把
握して容易に管理することが可能であるが、部品実装装
置の稼働率が低下する欠点がある。However, in the conventional method of supplying the electronic components 12, the operator removes the component supply cassette 3 with the missing component from the component mounting apparatus and attaches a new component supply cassette 3 for replenishment. Since the information of the component replacement is input by pressing the component replacement switch after the component supply cassette 3 is replaced, it is possible to accurately grasp and easily manage the time when the component mounting apparatus switches to the supplementary taping component 15. Although possible, there is a drawback that the operating rate of the component mounting apparatus is reduced.
【００１３】一方、図１３に示した部品供給方法では、
部品実装装置の稼働率を高めることができる利点を有す
る反面、作業者が補充用の部品収納部４のテーピング部
品１５の始端部１５ａを使用中のテーピング部品１５の
終端部１５ｂに接続して部品補充するタイミングと、使
用中のテーピング部品１５の電子部品１２が補充用の部
品収納部４のテーピング部品１５の電子部品１２に実際
に切り替わるタイミングとが異なるため、回路基板１１
上に実装された電子部品１２を、一つの部品収納部４の
テーピング部品１５を単位としてロット管理することが
できない問題がある。On the other hand, in the component supplying method shown in FIG.
While having the advantage that the operating rate of the component mounting apparatus can be increased, the operator connects the starting end portion 15a of the taping component 15 of the component storage portion 4 for replenishment to the terminal end portion 15b of the taping component 15 in use. Since the timing of replenishment is different from the timing of actually switching the electronic component 12 of the taping component 15 in use to the electronic component 12 of the taping component 15 of the component storage portion 4 for replenishment, the circuit board 11
There is a problem that the electronic components 12 mounted on the upper part cannot be lot-managed in units of the taping components 15 of one component storage unit 4.
【００１４】そこで、本発明は、上記従来の課題に鑑み
てなされたもので、部品実装の稼働率の低下を招くこと
なく、回路基板上に実装された電子部品のロット管理を
正確に行うことができる部品供給方法およびその部品供
給方法を具現化して適用した部品実装装置を提供するこ
とを目的とするものである。Therefore, the present invention has been made in view of the above-mentioned problems of the related art, and accurately manages lots of electronic components mounted on a circuit board without lowering the operating rate of component mounting. It is an object of the present invention to provide a component supply method capable of achieving the above, and a component mounting apparatus embodying and applying the component supply method.
【００１５】[0015]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る部品供給方法は、複数個の電子部品が
収納された部品収納部を有する部品供給装置が、部品供
給部に複数配置され、前記各部品供給装置の各々の前記
部品収納部のうちから所要の電子部品を順次供給するに
際して、前記各部品供給装置のそれぞれにおいて、部品
供給に使用中の前記部品収納部が補充用の部品収納部に
交換されたときに、前記使用中の部品収納部の電子部品
から前記補充用の部品収納部の電子部品に切り替えて供
給される時点の部品切替タイミングを検出して記憶し、
前記各部品供給装置毎に前記部品切替タイミングを管理
することを特徴としている。In order to achieve the above object, in the component supply method according to the present invention, a component supply device having a component storage portion in which a plurality of electronic components are stored is provided in a plurality of component supply portions. When sequentially supplying the required electronic components from the component storage units of the respective component supply devices, the component storage units that are being used for component supply in each of the component supply devices are used for replenishment. When it is replaced with the component storage unit, the component switching timing at the time of switching and supplying from the electronic component of the component storage unit in use to the electronic component of the component storage unit for replenishment is detected and stored,
The component switching timing is managed for each component supply device.
【００１６】この部品供給方法では、複数の部品供給装
置の各々に装備される部品収納部が交換されたときに、
その交換された部品収納部の電子部品が実際に供給され
始める時点の部品切替タイミングを記憶して管理するの
で、回路基板に実装された電子部品を、各部品供給装置
毎に各々の部品収納部を単位として正確にロット管理す
ることができる。According to this component supply method, when the component storage unit provided in each of the plurality of component supply devices is replaced,
Since the electronic component mounted on the circuit board is stored and managed by storing and managing the component switching timing at the time when the electronic components in the replaced component storage unit are actually supplied, the electronic component mounted on the circuit board is stored in each component storage unit. Lots can be accurately managed in units of.
【００１７】上記発明の部品供給方法において、各部品
供給装置において部品収納部が交換されたことを検出し
て出力された検出信号と、前記検出信号が出力された時
点での使用中の前記部品収納部における電子部品の残り
個数と、前記部品収納部の電子部品の供給動作とに基づ
いて部品切替タイミングを検出することが好ましい。こ
れにより、部品収納部が交換された時点と、その交換さ
れた部品収納部の電子部品が実際に供給される時点が異
なる場合でも、交換された部品収納部の電子部品が供給
され始める部品の切替タイミングを正確に検出すること
ができる。In the component supply method of the above invention, a detection signal output by detecting the exchange of the component storage unit in each component supply device and the component in use at the time when the detection signal is output It is preferable to detect the component switching timing based on the remaining number of electronic components in the storage unit and the supply operation of the electronic components in the component storage unit. As a result, even when the time when the component storage unit is replaced and the time when the electronic component in the replaced component storage unit is actually supplied are different, the electronic component in the replaced component storage unit starts to be supplied. The switching timing can be accurately detected.
【００１８】上記発明の部品供給方法において、部品収
納部が、キャリアテープの長手方向に沿って一列に配設
された多数の部品収納凹所に電子部品がそれぞれ収納さ
れてなるテーピング部品がリールに巻回されてなり、部
品供給装置に装着された前記部品収納部の前記テーピン
グ部品の終端部と補充用の部品収納部のテーピング部品
の始端部とを接続することによって電子部品の補充を行
った際に、前記２つのテーピング部品間の接続部の認識
に基づき部品切替タイミングを検出することができる。
これにより、部品供給装置を部品実装装置の部品供給部
から取り外すことなく部品収納部のみを交換して、部品
実装の稼働率の向上を図りながら部品供給を継続しなが
らも、交換した部品収納部の電子部品が実際に供給され
始める部品切替タイミングを、接続部の認識に基づいて
正確に検出することができる。In the component supplying method of the above invention, the component storing section is a taping component in which electronic components are respectively stored in a large number of component storing recesses arranged in a line along the longitudinal direction of the carrier tape. The electronic parts are replenished by connecting the terminal end of the taping part of the part accommodating part that is wound and mounted on the part supplying device and the starting end of the taping part of the replenishing part accommodating part. At this time, the component switching timing can be detected based on the recognition of the connecting portion between the two taping components.
As a result, the component storage unit is replaced without removing the component supply unit from the component supply unit of the component mounting apparatus, and while the component supply is continued while improving the operation rate of component mounting, the replaced component storage unit It is possible to accurately detect the component switching timing at which the electronic component starts to be supplied based on the recognition of the connecting portion.
【００１９】同上の部品供給方法において、２つのテー
ピング部品間の接続部の検出信号と、前記検出信号が出
力された時点での使用中の部品収納部における電子部品
の残り個数と、前記部品収納部からの電子部品の供給動
作とに基づいて部品切替タイミングを検出することが好
ましい。これにより、部品実装の稼働率の向上を図りな
がら部品供給を継続したときにおいて、部品収納部が交
換された時点と、その交換された部品収納部の電子部品
が実際に供給される時点が異なる場合でも、交換された
部品収納部の電子部品が供給され始める部品切替タイミ
ングを正確に検出することができる。In the above component supplying method, the detection signal of the connecting portion between the two taping components, the remaining number of electronic components in the component storage unit in use at the time when the detection signal is output, and the component storage It is preferable to detect the component switching timing based on the operation of supplying the electronic component from the unit. As a result, when the component supply is continued while improving the operation rate of component mounting, the time when the component storage unit is replaced and the time when the electronic component of the replaced component storage unit is actually supplied are different. Even in such a case, it is possible to accurately detect the component switching timing at which the replaced electronic component in the component storage unit starts to be supplied.
【００２０】一方、本発明の部品実装装置は、部品供給
部に配置された複数の部品供給装置の各々に備えている
部品収納部のうちの所要の部品収納部から電子部品を吸
着ノズルで吸着保持して回路基板上まで搬送したのち、
前記吸着ノズルに吸着保持した前記電子部品を前記回路
基板の所要の実装位置に実装する部品実装装置におい
て、部品供給に使用中の前記部品収納部が補充用の部品
収納部に交換されたのを検出するセンサ部と、前記セン
サ部から出力する検出信号に基づいて使用中の前記部品
収納部から補充用の部品収納部に切り替えて電子部品が
供給される時点の部品切替タイミングを判別する部品切
替時点判別手段と、前記部品切替時点判別手段の判別信
号に基づいて前記各部品供給装置毎の前記部品切替タイ
ミングを記憶して管理する部品切替タイミング管理手段
とを備えていることを特徴としている。On the other hand, in the component mounting apparatus of the present invention, the electronic component is sucked by the suction nozzle from the required component storage unit of the component storage units provided in each of the plurality of component supply units arranged in the component supply unit. After holding and transporting to the circuit board,
In a component mounting apparatus that mounts the electronic component sucked and held by the suction nozzle at a required mounting position on the circuit board, the component storage unit that is being used for component supply is replaced with a component storage unit for replenishment. A sensor switch for detecting and a component switch for determining a component switch timing when an electronic component is supplied by switching from the component storage part in use to a supplemental component storage part based on a detection signal output from the sensor part The present invention is characterized by comprising a time point determination means and a component switching timing management means for storing and managing the component switching timing for each of the component supply devices based on the determination signal of the component switching time point determination means.
【００２１】この部品実装装置では、部品収納部の交換
をセンサ部で検出して、そのセンサ部の検出信号に基づ
いて部品切替時点判別手段が部品切替タイミングを判別
し、その判別した部品切替タイミングを部品切替タイミ
ング管理手段が記憶して管理するので、回路基板に実装
された電子部品を、各部品供給装置毎にその部品収納部
を単位として正確にロット管理しながら、電子部品の実
装を行うことができる。In this component mounting apparatus, the sensor unit detects the replacement of the component storage unit, the component switching time point determination means determines the component switching timing based on the detection signal of the sensor unit, and the determined component switching timing. Since the component switching timing management means stores and manages the electronic components, the electronic components mounted on the circuit board are mounted while the lots are accurately managed in units of the component storage units of each component supply device. be able to.
【００２２】上記発明の部品実装装置において、部品収
納部は、キャリアテープの長手方向に沿って一列に配設
された多数の部品収納凹所に電子部品がそれぞれ収納さ
れてなるテーピング部品がリールに巻回されてなり、セ
ンサ部は、部品供給装置に装着された前記部品収納部の
前記テーピング部品の終端部と補充用の部品収納部のテ
ーピング部品の始端部とを突き合わせ部分を接続部材で
接続された接続部を検出するものである構成とすること
ができる。この構成によれば、部品供給装置を部品供給
部から取り外すことなく部品収納部のみを交換して、部
品実装の稼働率の向上を図りながら部品供給の継続を行
いながらも、交換した部品収納部の電子部品が実際に供
給され始める部品切替タイミングを、接続部の検出に基
づいて正確に検出することができる。In the component mounting apparatus of the invention described above, in the component housing portion, a taping component, in which electronic components are respectively housed in a large number of component housing recesses arranged in a line along the longitudinal direction of the carrier tape, is mounted on the reel. The sensor unit is wound, and connects the end portion of the taping component of the component storage unit mounted on the component supply device and the start end of the taping component of the component storage unit for replenishment with a connecting member. It can be configured to detect the connected portion. According to this configuration, only the component storage unit is replaced without removing the component supply device from the component supply unit, and while the component supply is continued while improving the operation rate of component mounting, the replaced component storage unit It is possible to accurately detect the component switching timing at which the electronic component starts to be supplied based on the detection of the connection portion.
【００２３】同上の部品実装装置において、部品切替時
点判別手段は、センサ部からの検出信号とこの検出信号
が出力された時点での使用中の部品供給部における電子
部品の残り個数と部品収納部からの電子部品の供給動作
とに基づいて部品切替タイミングを検出するものである
ことが好ましい。この構成によれば、部品収納部が交換
された時点と、その交換された部品収納部の電子部品が
実際に供給される時点が異なる場合でも、交換された部
品収納部の電子部品が供給され始める部品切替タイミン
グを正確に検出することができる。In the component mounting apparatus of the above, the component switching point-of-time determining means includes the detection signal from the sensor section, the remaining number of electronic components in the component supply section in use at the time when the detection signal is output, and the component storage section. It is preferable to detect the component switching timing based on the operation of supplying the electronic component from the. According to this configuration, even when the time when the component storage unit is replaced and the time when the electronic component in the replaced component storage unit is actually supplied are different, the electronic component in the replaced component storage unit is supplied. It is possible to accurately detect the switching timing of the parts to start.
【００２４】上記発明の部品実装装置において、センサ
部から検出信号が出力された時点での使用中の部品収納
部における電子部品の残り個数を算出する部品残数算出
手段と、吸着ノズルが部品収納部の電子部品を吸着保持
するのを検出する部品吸着検出手段と、前記部品残数算
出手段が算出した残り個数と前記部品吸着検出手段の検
出信号とに基づいて使用中の部品収納部における電子部
品の現時点での残り個数を求める部品残数演算手段とを
備え、部品切替時点判別手段は、前記部品残数演算手段
が求めた残り個数がゼロになった時点の判別に基づいて
部品切替タイミングを検出するものである構成とするこ
とが好ましい。In the component mounting apparatus of the above invention, the component remaining number calculating means for calculating the remaining number of electronic components in the component storing part in use at the time when the detection signal is output from the sensor part, and the suction nozzle storing the component. Electronic component in the component storage unit in use based on the component suction detection means for detecting that the electronic component of the component is suction-held, and the remaining number calculated by the component remaining number calculation means and the detection signal of the component suction detection means. And a component switching time point determination means for determining the remaining number of components at the present time, wherein the component switching time point determination means is based on the determination at the time point when the remaining number determined by the component remaining number calculation means becomes zero. Is preferably detected.
【００２５】この構成によれば、部品収納部が交換され
た時点と、その交換された部品収納部の電子部品が実際
に供給される時点が異なる場合でも、交換された部品収
納部の電子部品が供給され始める部品切替タイミングを
一層正確に検出することが可能となる。According to this structure, even when the time when the component storage unit is replaced and the time when the electronic component in the replaced component storage unit is actually supplied are different, the electronic component in the replaced component storage unit is different. It is possible to more accurately detect the component switching timing at which the supply of hydrogen is started.
【００２６】[0026]
【発明の実施の形態】以下、本発明の好ましい実施の形
態について図面を参照しながら説明する。本発明の部品
供給方法は、図１３に示したように、部品供給カセット
３を部品実装装置の部品供給部２から取り外すことな
く、部品供給に使用中の部品供給カセット３における部
品収納部４のテーピング部品１５の終端部１５ｂに、補
充用の部品収納部４のテーピング部品１５の始端部１５
ａを接続して、部品実装の稼働率の低下を招くことなし
に電子部品１２の供給を行う。但し、図３に示すよう
に、本発明の部品供給方法では、終端部１５ｂと始端部
１５ａとの接続部２５を、部品実装装置の装置本体１の
適所に配設した接続部検出用センサ部３３によって検出
することを特徴の一つとする。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the component supply method of the present invention, as shown in FIG. 13, without removing the component supply cassette 3 from the component supply unit 2 of the component mounting apparatus, the component storage unit 4 in the component supply cassette 3 being used for component supply is At the end portion 15b of the taping component 15, the start end portion 15 of the taping component 15 of the supplementary component storage portion 4 is provided.
By connecting a, the electronic component 12 is supplied without lowering the operating rate of component mounting. However, as shown in FIG. 3, in the component supply method of the present invention, a connecting portion detecting sensor portion in which the connecting portion 25 between the terminal end portion 15b and the starting end portion 15a is arranged at an appropriate position of the device body 1 of the component mounting apparatus. One of the features is to detect by 33.
【００２７】図１は、本発明の一実施の形態に係る部品
供給方法を具現化した部品供給装置を示すブロック構成
図である。この部品供給装置は、テーピング部品１５の
終端部１５ｂと始端部１５ａとの接続部２５を検出する
ための上記接続部検出用センサ部３３と、このセンサ部
３３からの情報に基づき電子部品１２を１つのテーピン
グ部品１５を単位としてロット管理を行う制御部３４と
を備えている。FIG. 1 is a block diagram showing a component supply device embodying a component supply method according to an embodiment of the present invention. This component supply device detects the connection portion detection sensor portion 33 for detecting the connection portion 25 between the end portion 15b and the start end portion 15a of the taping component 15, and the electronic component 12 based on the information from the sensor portion 33. It is provided with a control unit 34 that performs lot management in units of one taping component 15.
【００２８】上記制御部３４は、接続部検出用センサ部
３３からの検出信号に基づきテーピング部品１５の接続
部２５の判別を行う接続部検出手段３７と、部品供給カ
セット３に装着されて部品供給に使用中の部品収納部４
のテーピング部品１５に残存する電子部品１２の個数を
算出する部品残数算出手段３８と、実装ヘッド９の吸着
ノズル１０が下降して部品供給口２０から電子部品１２
を吸着保持する毎にその動作を検出する部品吸着検出手
段３９と、部品残数算出手段３８で算出した部品残数と
部品吸着検出手段３９の検出情報とに基づき使用中の部
品収納部４における現時点の電子部品１２の残数を演算
する部品残数演算手段４０と、使用中の部品収納部４の
テーピング部品１５の電子部品１２が零になって補充用
のテーピング部品１５の電子部品１２に切り替わって供
給される時点を判別する部品切替時点判別手段４１と、
補充用のテーピング部品１５の電子部品１２に切り替わ
って供給された時点である部品切替タイミングの時刻を
部品供給カセット３毎に管理して、その時刻の情報を部
品実装装置の記憶部であるハードディスクに記憶させる
部品切替タイミング管理手段４２とを備えて構成されて
いる。The control unit 34 is connected to the connecting portion detecting means 37 for discriminating the connecting portion 25 of the taping component 15 based on the detection signal from the connecting portion detecting sensor portion 33, and is mounted on the component supplying cassette 3 to supply the component. Parts storage part 4 in use
The component remaining number calculating means 38 for calculating the number of the electronic components 12 remaining in the taping component 15 and the suction nozzle 10 of the mounting head 9 are lowered to move the electronic component 12 from the component supply port 20.
Of the component storage unit 4 in use based on the component suction detection unit 39 that detects the operation of the component suction detection unit 39 and the remaining component number calculated by the component remaining number calculation unit 38 and the detection information of the component suction detection unit 39. The remaining component calculation means 40 for calculating the remaining number of electronic components 12 at the present time, and the electronic component 12 of the taping component 15 in the component storage unit 4 in use become zero and become the electronic component 12 of the taping component 15 for replenishment. A component switching time point determination means 41 for determining a time point when the supply is switched and supplied,
The time of the component switching timing when the electronic component 12 of the supplementary taping component 15 is switched and supplied is managed for each component supply cassette 3, and the information of the time is stored in a hard disk which is a storage unit of the component mounting apparatus. And a component switching timing management means 42 to be stored.
【００２９】上記部品供給装置における制御処理の説明
に先立って、テーピング部品１５の終端部１５ｂと始端
部１５ａとの接続部２５の接続部検出用センサ部３３に
よる検出手段について説明する。図４（ａ）の平面図お
よび（ｂ）の側面図に示すように、使用中のテーピング
部品１５の終端部１５ｂと補充用のテーピング部品１５
の始端部１５ａとは、互いに突き合わせて、その突き合
わせ部分の両側面に接続部材２６を貼り付けることによ
り接続する。Prior to the description of the control process in the component supplying apparatus, the detecting means by the connecting portion detecting sensor portion 33 of the connecting portion 25 between the terminal end portion 15b and the starting end portion 15a of the taping component 15 will be described. As shown in the plan view of FIG. 4A and the side view of FIG. 4B, the terminal end portion 15b of the taping component 15 in use and the taping component 15 for replenishment are used.
The start end portions 15a are connected to each other by abutting each other and attaching the connecting members 26 to both side surfaces of the abutting portions.
【００３０】この接続方法では、上記接続部材２６とし
て、テーピング部品１５のカバーテープ１７と異なる着
色が施されたものを用いる。その場合、接続部検出用セ
ンサ部３３は、色識別センサを用いて構成し、接続部材
２６の色彩の識別に基づき接続部２５を検出する。ま
た、接続部材２６としては、テーピング部品１５のカバ
ーテープ１７とは異なる光反射率を有するものを用いて
もよく、その場合、接続部検出用センサ部３３は、投受
光素子を用いて構成し、反射光の受光量の相違を判別し
て接続部２５を検出する。さらに、接続部材２６として
は、アルミニウム箔またはその他の金属テープを用いて
もよく、その場合、接続部検出用センサ部３３は、磁気
検出センサを用いて構成し、検出した磁気量に基づく判
別により接続部２５を検出する。なお、接続部２５は、
使用中のテーピング部品１５の終端部１５ｂと補充用の
テーピング部品１５の始端部１５ａとの突き合わせ部分
の一側面にのみ接続部材２６を貼り付けて形成してもよ
く、その場合、接続部材２６は、接続部検出用センサ部
３３が配設される側に設ける必要がある。In this connecting method, as the connecting member 26, one which is colored differently from the cover tape 17 of the taping component 15 is used. In that case, the connection part detection sensor part 33 is configured by using a color identification sensor, and detects the connection part 25 based on the identification of the color of the connection member 26. Further, as the connecting member 26, one having a light reflectance different from that of the cover tape 17 of the taping component 15 may be used, and in that case, the connecting portion detecting sensor portion 33 is configured by using a light emitting / receiving element. , The connection portion 25 is detected by determining the difference in the amount of received reflected light. Further, aluminum foil or other metal tape may be used as the connecting member 26, and in that case, the connecting portion detecting sensor portion 33 is configured by using a magnetic detecting sensor, and is determined based on the detected magnetic amount. The connection 25 is detected. The connecting portion 25 is
The connecting member 26 may be attached and formed only on one side surface of the abutting portion between the terminal end portion 15b of the taping component 15 in use and the starting end portion 15a of the supplementing taping component 15. In that case, the connecting member 26 is formed. It is necessary to provide it on the side where the sensor portion 33 for detecting the connection portion is arranged.
【００３１】一方、他の接続手段としては、図５（ａ）
の平面図および（ｂ）の側面図に示すように、使用中の
テーピング部品１５の終端部１５ｂと補充用のテーピン
グ部品１５の始端部１５ａとの各々の少なくとも一辺側
にそれぞれ切欠き３５，３６を設けるとともに、接続部
材２６に、双方の切欠き３５，３６を包含する三角形状
の切欠き２６ａを設ける。この場合の接続部検出用セン
サ部３３としては、形状の相違を認識できるセンサを用
いて構成する。例えば、接続部検出用センサ部３３は、
投光素子と受光素子とを相対向する配置で設ける構成と
して、受光素子に光が入射することによって接続部２５
を検出する。或いは、接続部検出用センサ部３３は、投
受光素子によって構成して、光反射の有無によって接続
部２５を検出する。この場合、接続部材２６は如何なる
材質で形成してもよい。On the other hand, another connection means is shown in FIG.
As shown in the plan view and the side view of (b), the notches 35 and 36 are formed on at least one side of the terminal end portion 15b of the taping component 15 in use and the starting end portion 15a of the supplementing taping component 15, respectively. In addition, the connecting member 26 is provided with a triangular notch 26a including both notches 35 and 36. In this case, the connecting portion detecting sensor portion 33 is configured by using a sensor that can recognize the difference in shape. For example, the sensor unit 33 for detecting the connecting portion is
The light emitting element and the light receiving element are arranged so as to face each other.
To detect. Alternatively, the connecting portion detecting sensor portion 33 is configured by a light emitting / receiving element and detects the connecting portion 25 depending on the presence or absence of light reflection. In this case, the connecting member 26 may be made of any material.
【００３２】つぎに、上記部品供給装置における制御処
理について、図２のフローチャートに基づき説明する。
部品実装装置では、図９ないし図１２で説明したよう
に、部品供給カセット３における部品供給口２０に順次
移送された電子部品１２が、下降してくる吸着ノズル１
０で吸着保持されて、回路基板１１まで搬送して実装さ
れる（ステップＳ１）。このとき、部品実装装置では、
吸着ノズル１０が吸着保持した電子部品１２を回路基板
１１まで搬送する過程において、吸着中の電子部品１２
の吸着姿勢や種別を識別して（ステップＳ２）、電子部
品１２の位置補正を行う。また、部品供給装置の制御部
３４における接続部検出手段３７は、接続部検出用セン
サ部３３からの入力信号に基づき、補充用のテーピング
部品１５が使用中のテーピング部品１５に接続されて部
品補充されたか否かを監視し続ける（ステップＳ３）。Next, the control processing in the above-mentioned component supply apparatus will be described with reference to the flowchart of FIG.
In the component mounting apparatus, as described with reference to FIGS. 9 to 12, the electronic component 12 sequentially transferred to the component supply port 20 in the component supply cassette 3 descends the suction nozzle 1
It is adsorbed and held at 0, conveyed to the circuit board 11 and mounted (step S1). At this time, in the component mounting device,
In the process of transporting the electronic component 12 sucked and held by the suction nozzle 10 to the circuit board 11, the electronic component 12 being sucked
The position and the type of the electronic component 12 are corrected by identifying the suction posture and the type (step S2). Further, the connecting portion detecting means 37 in the control portion 34 of the component supplying device connects the replenishing taping component 15 to the taping component 15 in use and replenishes the component based on the input signal from the connecting portion detecting sensor portion 33. It continues to monitor whether or not it has been performed (step S3).
【００３３】そして、部品供給に使用中の部品供給カセ
ット３の何れかのテーピング部品１５の電子部品１２の
残数が少なくなった場合には、作業者が図１３で説明し
た手順により、使用中のテーピング部品１５の終端部１
５ｂと補充用のテーピング部品１５の始端部１５ａと
を、図４または図５で示した接続手段によって接続す
る。これにより、部品実装装置では、部品供給カセット
３を取り外すことなく電子部品１２の供給が継続され
る。その二つのテーピング部品１５の接続部２５が接続
部検出用センサ部３３により検出されたときには、制御
部３４の接続部検出手段３７が、接続部検出用センサ部
３３から入力される検出信号に基づき接続部２５が所定
位置に達したと判別して（ステップＳ３）、部品残数算
出手段３８に対し判別信号を出力する。When the remaining number of the electronic components 12 of the taping components 15 in any of the component supply cassettes 3 being used for component supply becomes small, the operator is in use according to the procedure described in FIG. Terminal part 1 of taping component 15 of
5b and the starting end portion 15a of the taping component 15 for replenishment are connected by the connecting means shown in FIG. 4 or 5. As a result, the component mounting apparatus continues to supply the electronic component 12 without removing the component supply cassette 3. When the connection part 25 of the two taping parts 15 is detected by the connection part detection sensor part 33, the connection part detection means 37 of the control part 34 is based on the detection signal input from the connection part detection sensor part 33. It is determined that the connecting portion 25 has reached the predetermined position (step S3), and a determination signal is output to the remaining component number calculating means 38.
【００３４】部品残数算出手段３８は、接続部検出手段
３７から判別信号を受けたときに、その判別した部品供
給カセット３の部品収納部４のテーピング部品１５に収
納されている電子部品１２の種別および接続部検出用セ
ンサ部３３と部品供給口２０との間隔とに基づいて、現
在使用中のテーピング部品１５における電子部品１２の
残り個数を算出する（ステップＳ４）。つぎに、この残
り個数の算出について、図６を参照しながら説明する。When receiving the discrimination signal from the connecting portion detecting means 37, the remaining component number calculating means 38 detects the electronic component 12 stored in the taping component 15 of the component storing portion 4 of the component supplying cassette 3. The number of remaining electronic components 12 in the taping component 15 currently in use is calculated based on the type and the distance between the sensor unit 33 for detecting the connecting portion and the component supply port 20 (step S4). Next, the calculation of the remaining number will be described with reference to FIG.
【００３５】図６において、吸着ノズル１０は、部品実
装装置の部品供給部２に装着されている部品供給カセッ
ト３における部品供給口２０の真上位置に位置決め停止
され、接続部検出用センサ部３３は、上記部品供給口２
０に対し所定の距離Ｌだけ離れた位置に設置されている
が、上記距離Ｌは部品残数算出手段３８に内蔵のメモリ
に予め記憶登録されている。また、部品残数算出手段３
８に内蔵のメモリには、部品供給部２の各装着箇所にそ
れぞれ装着される各部品供給カセット３の種別、つまり
この部品供給カセット３に収納されているテーピング部
品１５の種別も予め記憶登録されている。In FIG. 6, the suction nozzle 10 is positioned and stopped right above the component supply port 20 in the component supply cassette 3 mounted in the component supply unit 2 of the component mounting apparatus, and the connection unit detection sensor unit 33 is provided. Is the above-mentioned component supply port 2
Although it is installed at a position separated by a predetermined distance L from 0, the distance L is previously stored and registered in a memory built in the remaining component number calculation means 38. Also, the remaining part number calculation means 3
The type of each component supply cassette 3 mounted in each mounting location of the component supply unit 2, that is, the type of the taping component 15 accommodated in this component supply cassette 3 is also stored and registered in advance in the memory built in the unit 8. ing.
【００３６】そこで、部品残数算出手段３８は、先ず、
部品供給カセット３に装着のテーピング部品１５の種別
から一義的に決まるテーピング部品１５の各部品収納凹
所１４の配設ピッチＰを求めて、Ｌ／Ｐの演算を行うこ
とにより、使用中のテーピング部品１５における電子部
品１２の残り個数を算出する。ここで、電子部品１２の
残り個数は整数であるから、上記演算による算出結果の
少数点以下の数値は無視されて、整数を残り個数とされ
る。この算出した残り個数の情報は、制御部３４の部品
残数演算手段４０に対し出力される。Therefore, the remaining parts number calculating means 38 first
The taping in use is obtained by obtaining the arrangement pitch P of the component storage recesses 14 of the taping component 15 uniquely determined from the type of the taping component 15 mounted on the component supply cassette 3 and calculating L / P. The remaining number of electronic components 12 in the component 15 is calculated. Here, since the remaining number of electronic components 12 is an integer, the numerical value below the decimal point of the calculation result by the above calculation is ignored, and the integer is taken as the remaining number. The information on the calculated remaining number is output to the remaining component number calculating means 40 of the control unit 34.
【００３７】図２に戻って、上記部品残数演算手段４０
は、部品残数算出手段３８から入力された残り個数の情
報を自体に内蔵のメモリに一次記憶したのちに、吸着ノ
ズル１０が電子部品１２を吸着保持したのを部品吸着検
出手段３９が検出して検出信号を出力したか否かを監視
する（ステップＳ５）。部品残数演算手段４０は、部品
吸着検出手段３９からの信号に基づき吸着ノズル１０が
電子部品１２を吸着保持して取り出したと判別する毎
に、メモリに記憶している残り個数から「１」を減算し
て現時点での残り個数を新たに算出し（ステップＳ
６）、その算出した残り個数の情報を、メモリに更新記
憶するとともに部品切替時点判別手段４１に対し出力す
る。部品切替時点判別手段４１は、入力された残り個数
が「０」であるか否かを判別する（ステップＳ７）。
「０」でない場合には、ステップＳ５にリターンして、
部品切替時点判別手段４１が「０」であると判別するま
で、上述と同様の制御処理が繰り返される。Returning to FIG. 2, the remaining parts number calculating means 40 is provided.
After the information on the remaining number input from the remaining component number calculating means 38 is temporarily stored in a memory incorporated therein, the component suction detecting means 39 detects that the suction nozzle 10 suction-holds the electronic component 12. Then, it is monitored whether or not the detection signal is output (step S5). Whenever the suction nozzle 10 determines that the suction nozzle 10 has suction-held and picked up the electronic component 12 based on the signal from the component suction detection unit 39, the remaining component number calculation unit 40 outputs “1” from the remaining number stored in the memory. The remaining number at the present time is newly calculated by subtracting (step S
6) The information of the calculated remaining number is updated and stored in the memory and is output to the part switching time point determination means 41. The part switching time point determination means 41 determines whether or not the input remaining number is "0" (step S7).
If it is not "0", the process returns to step S5,
The same control process as described above is repeated until the component switching time point determination means 41 determines that the value is “0”.
【００３８】部品切替時点判別手段４１が部品残数演算
手段４０からの入力情報に基づいて残り個数が「０」で
あると判別したときには、部品供給口２０に供給される
電子部品１２が使用中のテーピング部品１５から補充用
のテーピング部品１５に切り替わったことを示す情報を
部品切替タイミング管理手段４２に対し出力する。これ
により、部品切替タイミング管理手段４２は、部品供給
口２０に供給される電子部品１２が使用中のテーピング
部品１５から補充用のテーピング部品１５に切り替わっ
た時点での時刻を自体に内蔵のタイマ回路から求めて、
その時刻情報と部品供給カセット３毎に予め設定されて
いる番号とを部品実装装置のハードディスクに記憶させ
（ステップＳ８）たのち、部品実装の稼働の終了である
と判別（ステップＳ９）するまで、ステップＳ１にリタ
ーンして、上述と同様の制御処理を繰り返す。When the component switching time point determination means 41 determines that the remaining number is "0" based on the input information from the remaining component number calculation means 40, the electronic component 12 supplied to the component supply port 20 is in use. The information indicating that the taping component 15 has been switched to the supplementary taping component 15 is output to the component switching timing management means 42. As a result, the component switching timing management means 42 has a timer circuit built in itself at the time when the electronic component 12 supplied to the component supply port 20 is switched from the taping component 15 in use to the supplementing taping component 15. Seeking from
After the time information and the number preset for each component supply cassette 3 are stored in the hard disk of the component mounting apparatus (step S8), it is determined that the operation of component mounting is completed (step S9). The process returns to step S1 and the same control process as described above is repeated.
【００３９】したがって、部品実装装置のハードディス
クには、図７に示すように、各部品供給カセット３毎
に、その部品供給カセット３において補充用のテーピン
グ部品１５の電子部品１２に切り替えて部品供給口２０
に電子部品１２の供給が開始される時点での日時と時刻
の情報が、部品切替タイミング管理手段４２の管理の下
に順次記憶されていく。また、部品切替タイミング管理
手段４２は、上記ハードディスクに記憶された情報を基
にして、生産済みの部品実装回路基板上にどの部品供給
カセット３の電子部品１２が実装されたかを、各部品供
給カセット３に装着される１つのテーピング部品１５を
単位としてロット管理する。これにより、上記部品供給
装置を搭載した部品実装装置では、回路部品１１への電
子部品１２の実装動作の稼働率の向上を図りながらも、
生産済みの部品実装回路基板上に実装された電子部品の
ロット管理を正確に行うことができる。Therefore, in the hard disk of the component mounting apparatus, as shown in FIG. 7, for each component supply cassette 3, the electronic component 12 of the taping component 15 for replenishment in the component supply cassette 3 is switched to the component supply port. 20
The information of the date and time at the time when the supply of the electronic component 12 is started is sequentially stored under the control of the component switching timing management means 42. Further, the component switching timing management means 42 determines, based on the information stored in the hard disk, which component supply cassette 3 the electronic component 12 has been mounted on the manufactured component mounting circuit board for each component supply cassette. Lot management is performed by using one taping component 15 mounted on the No. 3 unit. As a result, in the component mounting apparatus equipped with the component supply device, while improving the operation rate of the mounting operation of the electronic component 12 on the circuit component 11,
It is possible to accurately perform lot management of electronic components mounted on a component mounting circuit board that has already been manufactured.
【００４０】なお、上記実施の形態では、接続部検出用
センサ部３３を部品供給口２０から所定の距離Ｌだけ離
間した位置に配設した場合について説明しているが、部
品供給口２０において接続部２５を検出できる位置に接
続部検出用センサ部３３を配設できる場合には、接続部
検出用センサ部３３が接続部２５を検出した時点が補充
用のテーピング部品１５の電子部品１２に切り替えられ
る時点となるから、図１の部品残数算出手段３８や部品
残数演算手段４０などが不要となり、制御処理を簡略化
できる。In the above embodiment, the case where the connecting portion detecting sensor portion 33 is arranged at a position separated from the component supply port 20 by the predetermined distance L has been described. When the connecting portion detecting sensor portion 33 can be arranged at a position where the portion 25 can be detected, the time point when the connecting portion detecting sensor portion 33 detects the connecting portion 25 is switched to the electronic component 12 of the supplementary taping component 15. At this time, the remaining component number calculating means 38 and the remaining component number computing means 40 shown in FIG. 1 are unnecessary, and the control process can be simplified.
【００４１】[0041]
【発明の効果】以上のように本発明の部品供給方法によ
れば、複数の部品供給装置の各々に装備される部品収納
部が交換されたときに、その交換された部品収納部の電
子部品が実際に供給され始める時点の部品切替タイミン
グを記憶して管理するので、回路基板に実装された電子
部品を、各部品供給装置毎に各々の部品収納部を単位と
して正確にロット管理することができる。As described above, according to the component supply method of the present invention, when the component storage unit provided in each of the plurality of component supply devices is exchanged, the electronic component of the exchanged component storage unit is replaced. Since the component switching timing at the time when the components are actually supplied is stored and managed, the lots of electronic components mounted on the circuit board can be accurately managed in each component supply unit for each component supply device. it can.
【００４２】また、本発明の部品実装装置によれば、部
品収納部の交換をセンサ部で検出して、そのセンサ部の
検出信号に基づいて部品切替時点判別手段が部品切替タ
イミングを判別し、その判別した部品切替タイミングを
部品切替タイミング管理手段が記憶して管理する構成と
したので、回路基板に実装された電子部品を、各部品供
給装置毎にその部品収納部を単位として正確にロット管
理しながら、電子部品の実装を行うことができる。Further, according to the component mounting apparatus of the present invention, the sensor unit detects the replacement of the component housing unit, and the component switching time point determination means determines the component switching timing based on the detection signal of the sensor unit. Since the determined component switching timing is stored and managed by the component switching timing management means, the electronic components mounted on the circuit board can be accurately lot-managed by the component storage unit of each component supply device. Meanwhile, electronic components can be mounted.
【図１】本発明の一実施の形態に係る部品供給方法を具
現化した部品供給装置を示すブロック構成図。FIG. 1 is a block configuration diagram showing a component supply device that embodies a component supply method according to an embodiment of the present invention.
【図２】同上の部品供給装置の制御処理を示すフローチ
ャート。FIG. 2 is a flowchart showing a control process of the above component supply device.
【図３】同上の部品供給装置を搭載した部品実装装置の
概略側面図。FIG. 3 is a schematic side view of a component mounting apparatus equipped with the component supply apparatus of the above.
【図４】（ａ），（ｂ）は同上の実施の形態における二
つのテーピング部品の接続手段を示す平面図および側面
図。4 (a) and 4 (b) are a plan view and a side view showing a connecting means of two taping components in the above embodiment.
【図５】（ａ），（ｂ）は同上の実施の形態における二
つのテーピング部品の他の接続手段を示す平面図および
側面図。5 (a) and 5 (b) are a plan view and a side view showing another connecting means of the two taping components in the above embodiment.
【図６】同上の実施の形態における電子部品の残り個数
を演算する工程の説明図。FIG. 6 is an explanatory diagram of a process of calculating the remaining number of electronic components in the embodiment.
【図７】同上の実施の形態において得られた電子部品の
切り替えタイミング情報の説明図。FIG. 7 is an explanatory diagram of electronic component switching timing information obtained in the above embodiment.
【図８】同上の部品供給装置を適用して電子部品の実装
を行える部品実装装置の概略構成を示す斜視図。FIG. 8 is a perspective view showing a schematic configuration of a component mounting apparatus that is capable of mounting electronic components by applying the component supply apparatus of the above.
【図９】（ａ），（ｂ）は同上の実施の形態に用いられ
るテーピング部品の平面図および切断側面図。9A and 9B are a plan view and a cut side view of a taping component used in the above embodiment.
【図１０】同上の実施の形態に用いられる部品供給カセ
ットの斜視図。FIG. 10 is a perspective view of a component supply cassette used in the above embodiment.
【図１１】同上の部品供給カセットの一部を拡大して示
した斜視図。FIG. 11 is an enlarged perspective view showing a part of the above component supply cassette.
【図１２】同上の部品供給カセットの一部の斜視図。FIG. 12 is a perspective view of a part of the above component supply cassette.
【図１３】（ａ）〜（ｃ）は従来の部品供給方法におけ
る電子部品を切り替える過程を工程順に示した側面図。13A to 13C are side views showing the process of switching electronic components in the conventional component supply method in process order.
２ 部品供給部 ４ 部品収納部 ３ 部品供給カセット（部品供給装置） １０ 吸着ノズル １１ 回路基板 １２ 電子部品 １３ キャリアテープ １４ 部品収納凹所 １５ テーピング部品 １５ａ 始端部 １５ｂ 終端部 ２５ 接続部 ３３ 接続部検出用センサ部（センサ部） ３８ 部品残数算出手段 ３９ 部品吸着検出手段 ４０ 部品残数演算手段 ４１ 部品切替時点判別手段 ４２ 部品切替タイミング管理手段 2 parts supply department 4 parts storage 3 parts supply cassette (parts supply device) 10 Suction nozzle 11 circuit board 12 Electronic components 13 carrier tape 14 Parts storage recess 15 Taping parts 15a start end 15b Terminal part 25 connection 33 Sensor part for detecting connection part (sensor part) 38 Parts Remaining Number Calculation Means 39 Parts suction detection means 40 Parts remaining number calculation means 41 Part switching time point determination means 42 Parts switching timing management means
───────────────────────────────────────────────────── フロントページの続き (72)発明者 奥村 一正 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 藤原 宗良 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E313 AA03 AA11 AA18 CC04 CD03 DD02 DD03 DD32 DD50 EE02 EE24 FF32 FG01 FG10 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Kazumasa Okumura 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. (72) Inventor Muneyoshi Fujiwara 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. F-term (reference) 5E313 AA03 AA11 AA18 CC04 CD03 DD02 DD03 DD32 DD50 EE02 EE24 FF32 FG01 FG10
Claims (8)
部を有する部品供給装置が、部品供給部に複数配置さ
れ、前記各部品供給装置の各々の前記部品収納部のうち
から所要の電子部品を順次供給するに際して、 前記各部品供給装置のそれぞれにおいて、部品供給に使
用中の前記部品収納部が補充用の部品収納部に交換され
たときに、前記使用中の部品収納部の電子部品から前記
補充用の部品収納部の電子部品に切り替えて供給される
時点の部品切替タイミングを検出して記憶し、前記各部
品供給装置毎に前記部品切替タイミングを管理すること
を特徴とする部品供給方法。1. A plurality of component supply devices each having a component storage part in which a plurality of electronic components are stored are arranged in the component supply part, and a required electronic component is selected from among the component storage parts of each of the component supply devices. When sequentially supplying the components, in each of the component supply devices, when the component storage unit being used for component supply is replaced with a component storage unit for replenishment, an electronic component of the component storage unit being used From the above, the component switching timing at the time of switching and supplying to the electronic component of the supplemental component storage unit is detected and stored, and the component switching timing is managed for each of the component supply devices. Method.
換されたことを検出して出力された検出信号と、前記検
出信号が出力された時点での使用中の前記部品収納部に
おける電子部品の残り個数と、前記部品収納部の電子部
品の供給動作とに基づいて部品切替タイミングを検出す
るようにした請求項１に記載の部品供給方法。2. A detection signal that is output by detecting that the component storage unit has been replaced in each component supply device, and an electronic component in the component storage unit that is in use at the time when the detection signal is output. The component supply method according to claim 1, wherein the component switching timing is detected based on the remaining number and the electronic component supply operation of the component storage unit.
向に沿って一列に配設された多数の部品収納凹所に電子
部品がそれぞれ収納されてなるテーピング部品がリール
に巻回されてなり、 部品供給装置に装着された前記部品収納部の前記テーピ
ング部品の終端部と補充用の部品収納部のテーピング部
品の始端部とを接続することによって電子部品の補充を
行った際に、前記２つのテーピング部品間の接続部の認
識に基づき部品切替タイミングを検出するようにした請
求項１に記載の部品供給方法。3. A component storage section is formed by winding a taping component, in which electronic components are respectively stored in a large number of component storage recesses arranged in a row along the longitudinal direction of a carrier tape, on a reel. When electronic parts are replenished by connecting the terminal end of the taping component of the component accommodating unit mounted to the component supply device and the starting end of the taping component of the component accommodating unit for replenishment, The component supply method according to claim 1, wherein the component switching timing is detected based on the recognition of the connection between the taping components.
信号と、前記検出信号が出力された時点での使用中の部
品収納部における電子部品の残り個数と、前記部品収納
部からの電子部品の供給動作とに基づいて部品切替タイ
ミングを検出するようにした請求項３に記載の部品供給
方法。4. A detection signal of a connecting portion between two taping components, a remaining number of electronic components in a component storage unit in use at the time when the detection signal is output, and an electronic component from the component storage unit. 4. The component supply method according to claim 3, wherein the component switching timing is detected based on the supply operation of.
装置の各々に備えている部品収納部のうちの所要の部品
収納部から電子部品を吸着ノズルで吸着保持して回路基
板上まで搬送したのち、前記吸着ノズルに吸着保持した
前記電子部品を前記回路基板の所要の実装位置に実装す
る部品実装装置において、 部品供給に使用中の前記部品収納部が補充用の部品収納
部に交換されたのを検出するセンサ部と、 前記センサ部から出力する検出信号に基づいて使用中の
前記部品収納部から補充用の部品収納部に切り替えて電
子部品が供給される時点の部品切替タイミングを判別す
る部品切替時点判別手段と、 前記部品切替時点判別手段の判別信号に基づいて前記各
部品供給装置毎の前記部品切替タイミングを記憶して管
理する部品切替タイミング管理手段とを備えていること
を特徴とする部品実装装置。5. An electronic component is suction-held by a suction nozzle from a required component storage unit of the component storage units provided in each of a plurality of component supply units arranged in the component supply unit, and the electronic component is conveyed onto a circuit board. After that, in the component mounting apparatus that mounts the electronic component sucked and held by the suction nozzle at a required mounting position on the circuit board, the component storage unit that is being used for component supply is replaced with a supplemental component storage unit. A sensor unit that detects the noise, and based on the detection signal output from the sensor unit, determines the component switching timing when the electronic component is supplied by switching the component storage unit in use to the component storage unit for supplement And a component switching timing management unit that stores and manages the component switching timing of each of the component supply devices based on the determination signal of the component switching timing determination unit. And a component mounting apparatus.
向に沿って一列に配設された多数の部品収納凹所に電子
部品がそれぞれ収納されてなるテーピング部品がリール
に巻回されてなり、 センサ部は、部品供給装置に装着された前記部品収納部
の前記テーピング部品の終端部と補充用の部品収納部の
テーピング部品の始端部とを突き合わせ部分を接続部材
で接続された接続部を検出するものである請求項５に記
載の部品実装装置。6. The component storage portion is formed by winding a taping component, in which electronic components are respectively stored in a large number of component storage recesses arranged in a line along the longitudinal direction of the carrier tape, on a reel, The sensor unit detects a connecting portion in which a terminating end of the taping component of the component storage unit mounted on the component supply device and a starting end of the taping component of the component storage unit for replenishment are connected to each other with a connecting member. The component mounting apparatus according to claim 5, which is a component mounting apparatus.
の検出信号とこの検出信号が出力された時点での使用中
の部品供給部における電子部品の残り個数と部品収納部
からの電子部品の供給動作とに基づいて部品切替タイミ
ングを検出するものである請求項６に記載の部品実装装
置。7. The component switching time point determining means detects the detection signal from the sensor unit, the remaining number of electronic components in the component supply unit in use at the time when the detection signal is output, and the electronic component from the component storage unit. The component mounting apparatus according to claim 6, wherein the component switching timing is detected based on the supply operation.
での使用中の部品収納部における電子部品の残り個数を
算出する部品残数算出手段と、 吸着ノズルが部品収納部の電子部品を吸着保持するのを
検出する部品吸着検出手段と、 前記部品残数算出手段が算出した残り個数と前記部品吸
着検出手段の検出信号とに基づいて使用中の部品収納部
における電子部品の現時点での残り個数を求める部品残
数演算手段とを備え、 部品切替時点判別手段は、前記部品残数演算手段が求め
た残り個数がゼロになった時点の判別に基づいて部品切
替タイミングを検出するものである請求項５ないし７の
何れかに記載の部品実装装置。8. A remaining component number calculation means for calculating the remaining number of electronic components in the component storage unit in use at the time when the detection signal is output from the sensor unit, and a suction nozzle that suctions the electronic components in the component storage unit. A component suction detection means for detecting holding, a remaining number of electronic components in the component storage part in use based on the remaining number calculated by the remaining component number calculation means and the detection signal of the component suction detection means The remaining part number calculating means for calculating the number of parts is provided, and the part switching time point judging means detects the part switching timing based on the judgment at the time when the remaining number calculated by the remaining part number calculating means becomes zero. The component mounting apparatus according to claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002015111A JP4079643B2 (en) | 2002-01-24 | 2002-01-24 | Component supply method and component mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002015111A JP4079643B2 (en) | 2002-01-24 | 2002-01-24 | Component supply method and component mounting apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007302183A Division JP2008066752A (en) | 2007-11-21 | 2007-11-21 | Method of supplying component and component mounting system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003218586A true JP2003218586A (en) | 2003-07-31 |
| JP4079643B2 JP4079643B2 (en) | 2008-04-23 |
Family
ID=27651610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002015111A Expired - Lifetime JP4079643B2 (en) | 2002-01-24 | 2002-01-24 | Component supply method and component mounting apparatus |
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| Country | Link |
|---|---|
| JP (1) | JP4079643B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216703A (en) * | 2005-02-02 | 2006-08-17 | Juki Corp | Managing mounting component method of |
| JP2008066752A (en) * | 2007-11-21 | 2008-03-21 | Matsushita Electric Ind Co Ltd | Method of supplying component and component mounting system |
| JP7466103B2 (en) | 2020-03-23 | 2024-04-12 | パナソニックＩｐマネジメント株式会社 | Tape feeder and component mounting device |
-
2002
- 2002-01-24 JP JP2002015111A patent/JP4079643B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216703A (en) * | 2005-02-02 | 2006-08-17 | Juki Corp | Managing mounting component method of |
| JP4566768B2 (en) * | 2005-02-02 | 2010-10-20 | Ｊｕｋｉ株式会社 | On-board component management method |
| JP2008066752A (en) * | 2007-11-21 | 2008-03-21 | Matsushita Electric Ind Co Ltd | Method of supplying component and component mounting system |
| JP7466103B2 (en) | 2020-03-23 | 2024-04-12 | パナソニックＩｐマネジメント株式会社 | Tape feeder and component mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4079643B2 (en) | 2008-04-23 |
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