JP2003188565A - Heat dissipation structure of surface mount electronic component - Google Patents
Heat dissipation structure of surface mount electronic componentInfo
- Publication number
- JP2003188565A JP2003188565A JP2001384416A JP2001384416A JP2003188565A JP 2003188565 A JP2003188565 A JP 2003188565A JP 2001384416 A JP2001384416 A JP 2001384416A JP 2001384416 A JP2001384416 A JP 2001384416A JP 2003188565 A JP2003188565 A JP 2003188565A
- Authority
- JP
- Japan
- Prior art keywords
- smt
- radiator
- heat
- wiring pattern
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、部品リードまたは
部品取付けパッド等をプリント基板の所定配線パターン
にハンダ付けすることにより実装される電子部品に係
り、電子部品のリードまたは取付けパッドを介しパター
ンを通して熱を逃がし放熱を行う放熱構造の改良に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounted by soldering a component lead, a component mounting pad, or the like to a predetermined wiring pattern of a printed circuit board, and through a pattern of the electronic component lead or mounting pad. The present invention relates to improvement of a heat dissipation structure that releases heat and dissipates heat.
【０００２】[0002]
【従来の技術】従来から、プリント基板上に実装される
の発熱の多い電子部品（以下、発熱部品という）に対す
る放熱方法（冷却方法）の一つに発熱部品に放熱部材
（放熱フィン、ヒートシンク）を取り付ける方法があ
る。また、ＳＭＴ(surface mount technology)電子部品
その他の小型の発熱電子部品に対しては、より省スペー
スな冷却方法としてプリント基板上の配線パターン（以
下、単にパターンと記す）に熱を逃がす方法が知られて
いる。2. Description of the Related Art Conventionally, as one of heat dissipation methods (cooling methods) for electronic parts (hereinafter referred to as heat generating parts) mounted on a printed circuit board and generating a lot of heat, heat dissipating members (heat dissipation fins, heat sinks) are used as heat generating parts. There is a way to attach. For SMT (surface mount technology) electronic components and other small heat-generating electronic components, a method of releasing heat to a wiring pattern (hereinafter simply referred to as a pattern) on a printed circuit board is known as a more space-saving cooling method. Has been.
【０００３】このパターンを利用する放熱方法は、パタ
ーンの銅箔が薄いことや実装上パターン面積を大きくと
り難いことから、単にパターンに依存するのみでは所望
の冷却効果が得られない場合が往々にしてある。In the heat radiation method using this pattern, since the copper foil of the pattern is thin and it is difficult to take a large pattern area in mounting, it is often the case that the desired cooling effect cannot be obtained only by relying on the pattern. There is.
【０００４】この為、図５の部品実装基板の要部斜視図
に示す様に、パターン上のレジストを一部剥離し符号１
２で示す半田もりをすることによる冷却方法を実施する
場合がある。図５において、符号２は発熱部品、符号
３',４',５' は配線パターン、１１はプリント基板であ
る。しかし、この方法は盛る半田の量が管理できない事
や半田もり部の修正作業が必要となり、製造し難いとい
う欠点があった。また、図６に断面図で示すようにメタ
ルコア基板または、図７に断面図で示すセラミック基板
をベース素材に用いてパターンを形成しプリント基板を
構成する方法が提案されている。図６、図７において、
１３は実装された電子部品、１４は銅箔パターン層、１
５は絶縁層、１６はメタルコア、１７はセラミック基板
である。しかし、これらの方法は、プリント基板が高価
となってしまう欠点があった。Therefore, as shown in the perspective view of the main part of the component mounting board of FIG.
In some cases, the cooling method shown in 2 is performed by soldering. In FIG. 5, reference numeral 2 is a heat-generating component, reference numerals 3 ', 4', 5'are wiring patterns, and 11 is a printed circuit board. However, this method has a drawback in that it is difficult to manufacture because it is impossible to control the amount of solder that fills up and it is necessary to correct the solder stray portion. Further, there has been proposed a method of forming a pattern by forming a pattern using a metal core substrate as shown in the sectional view of FIG. 6 or a ceramic substrate as shown in the sectional view of FIG. 7 as a base material. 6 and 7,
13 is an electronic component mounted, 14 is a copper foil pattern layer, 1
Reference numeral 5 is an insulating layer, 16 is a metal core, and 17 is a ceramic substrate. However, these methods have a drawback that the printed circuit board becomes expensive.
【０００５】上述の難点に対処した幾つかの技術が提案
されている。例えば、(a) 特開平１１−５４８８３号公
報（電子部品の放熱構造）では、表面実装形電子部品搭
載用の導体パターン（部品搭載側）の裏面側で対応する
位置にスルーホールで接続される放熱用パターンを設け
るようにして、放熱用パターンを広げたことと等価な作
用を得ることで高い放熱を実現する技術が開示されてい
る。Several techniques have been proposed to address the above-mentioned difficulties. For example, in (a) Japanese Patent Application Laid-Open No. 11-54883 (heat dissipation structure of electronic component), a through hole is connected to a corresponding position on the back surface side of a conductor pattern (component mounting side) for mounting a surface mount type electronic component. There is disclosed a technique for realizing high heat dissipation by providing a heat dissipation pattern and obtaining an effect equivalent to widening the heat dissipation pattern.
【０００６】また、(b) 実開平５−７３９７８号公報
（放熱装置）には、プリント基板上に実装される発熱部
品の端子につながっている任意の面積を有するプリント
基板上の放熱用の銅箔パターンと、この放熱用の銅箔パ
ターン上に設けられた実装用の孔と、（裏面側から）こ
の実装用の孔に（半田付けにより）装着されるショート
ジャンパー線で構成された放熱装置が開示されている。Further, (b) Japanese Utility Model Publication No. 5-73978 (radiation device) discloses a copper for heat radiation on a printed circuit board having an arbitrary area connected to terminals of a heat-generating component mounted on the printed circuit board. A heat dissipation device composed of a foil pattern, a mounting hole provided on this heat dissipation copper foil pattern, and a short jumper wire that is mounted (by soldering) to this mounting hole (from the back side) Is disclosed.
【０００７】更には、(c) 特開昭５８−２０６１９９号
公報（プリント配線板の電子部品放熱装置）では、プリ
ント配線板上に発熱部品を実装する銅箔（すなわち、パ
ターン）とそれ以外の銅箔との間を、熱的には接続する
が電気的には接続しない（絶縁性の）電気絶縁伝熱素子
（一例にセラミックスを例示）を備えた電子部品放熱装
置を開示している。なお、この電気絶縁伝熱素子が両端
部に金属部を有し、この金属部分で銅箔にはんだ付けす
ることが記載されている。Further, in (c) Japanese Patent Application Laid-Open No. 58-206199 (electronic component heat dissipation device for a printed wiring board), a copper foil (that is, a pattern) for mounting heat generating components on the printed wiring board and other components are used. Disclosed is an electronic component heat dissipation device including an electrically insulating heat transfer element (ceramics is shown as an example) that is thermally connected but not electrically connected to a copper foil. It is described that this electrically insulating heat transfer element has metal parts at both ends and that the metal parts are soldered to a copper foil.
【０００８】その他にも、(d) 特開平７−１４７４６７
号公報（電子部品の放熱方法）は、発熱電子部品搭載用
の導体パターンと同一基板面上に、(1) 該導体パターン
と電気的に絶縁された他の導体パターンを併設し、(2)
該併設した両導体パターンを、良熱伝導性を有しかつ前
記良導体パターンを電気的に絶縁する材料を介して熱的
に接続し、(3) 各発熱電子部品からの発熱を、前記他の
導体パターンを介して放熱させる方法を開示している。
また、前記他の導体パターンを基板裏面に更に設けた更
に別な導体パターンとスルーホールを介して接続し裏面
側でも放熱する方法についても併せて開示している。Besides, (d) JP-A-7-147467
Japanese Patent Publication (Electronic Component Heat Dissipation Method) discloses that (1) another conductor pattern electrically insulated from the conductor pattern is provided on the same substrate surface as the conductor pattern for mounting the heat-generating electronic component, and (2)
The both conductor patterns provided side by side are thermally connected via a material having good thermal conductivity and electrically insulating the good conductor pattern, and (3) heat generated from each heat-generating electronic component is A method of dissipating heat via a conductor pattern is disclosed.
Further, a method of connecting the other conductor pattern to another conductor pattern further provided on the back surface of the substrate through a through hole and radiating heat on the back surface side is also disclosed.
【０００９】然しながら、上述した各冷却方法はプリン
ト基板にも多量の熱を伝え基板全体に温度上昇を招くこ
とから、基板に実装された他の熱に弱い部品に逆に熱の
影響を与えることになる欠点がある。However, each of the above-described cooling methods transfers a large amount of heat to the printed circuit board and causes a temperature rise in the entire circuit board. Therefore, the other heat-sensitive components mounted on the circuit board are adversely affected by the heat. There is a drawback that becomes.
【００１０】この点を考慮し空気中により効率的に放熱
するようにした技術も、提案されている。例えば、(e)
特開昭６２−１２５１号公報（放熱フィンの構造）で
は、誘電体基板上に形成されたパターンの部位のなか
で、発熱部品の発熱部近傍のパターン（部位）に、放熱
フィンを付設するようにしており、特に、この放熱フィ
ンを誘導性スタブと容量性スタブとで構成するようにし
てアドミタンスを零となるようにして回路のインピーダ
ンスに影響を与えないようにしたものを開示している。In consideration of this point, a technique for efficiently radiating heat to the air has also been proposed. For example, (e)
In JP-A-62-1251 (structure of heat radiation fin), a heat radiation fin is attached to a pattern (portion) in the vicinity of the heat generating portion of the heat generating component among the pattern portions formed on the dielectric substrate. In particular, it discloses that the radiation fin is composed of an inductive stub and a capacitive stub so that the admittance becomes zero so that the impedance of the circuit is not affected.
【００１１】しかし、この(e) 特開昭６２−１２５１号
公報に係る放熱用の構造においては、必要とする部品の
形状が複雑であり、製造工程中で取付け位置にも一定の
精度が要求される結果製造コストを低減することが難し
い。また、省スペース性の観点でも充分なものを得難い
場合も多い。However, in the structure for heat dissipation according to (e) Japanese Patent Laid-Open No. 62-1251, the shape of the required parts is complicated, and a certain accuracy is required for the mounting position during the manufacturing process. As a result, it is difficult to reduce the manufacturing cost. In many cases, it is difficult to obtain a sufficient product from the viewpoint of space saving.
【００１２】[0012]
【発明が解決しようとする課題】そこで、本発明は上述
した各問題を解決する基板実装用電子部品の放熱構造を
提案するものである。すなわち、本発明では発熱部品で
の発生熱を効率的に空気中に放熱するようにした低コス
トで実現できる放熱構造の一形態を新たに提案すること
をその目的としている。Therefore, the present invention proposes a heat dissipation structure for a board mounting electronic component which solves the above-mentioned problems. That is, it is an object of the present invention to newly propose one form of a heat dissipation structure that can efficiently dissipate heat generated in a heat generating component into the air at low cost.
【００１３】[0013]
【課題を解決するための手段】請求項１に記載の本発明
は、表面基板実装用電子部品の放熱構造であって、所定
の配線パターンを形成したプリント基板と、冷却対象と
なる表面実装用電子部品の少なくとも一つのはんだ付け
用端子部に対応する配線パターン部位の近傍の配線パタ
ーン上に表面実装されたＳＭＴラジエターとからなり、
前記ＳＭＴラジエター10は、金属製で直方体形状を有し
ている。According to a first aspect of the present invention, there is provided a heat dissipation structure for an electronic component for mounting a surface board, comprising: a printed board having a predetermined wiring pattern formed thereon; An SMT radiator surface-mounted on a wiring pattern near a wiring pattern portion corresponding to at least one soldering terminal portion of an electronic component,
The SMT radiator 10 is made of metal and has a rectangular parallelepiped shape.
【００１４】請求項２に記載の本発明は、表面実装用電
子部品の放熱構造であって、部品実装側の片面に所定の
配線パターンを形成したプリント基板と、冷却対象とな
る表面実装用電子部品の少なくとも一つのはんだ付け用
端子部に対応する前記部品実装側面の配線パターン部位
の近傍の配線パターン部位に設けられたスルーホール
と、当該スルーホールにより電気接続された当該プリン
ト基板の裏面側に設けられた裏面側配線パターンと、こ
の裏面側パターン上に表面実装されたＳＭＴラジエター
とからなり、前記ＳＭＴラジエターは、金属製で直方体
形状を有している。According to a second aspect of the present invention, there is provided a heat dissipating structure for a surface mounting electronic component, comprising: a printed circuit board having a predetermined wiring pattern formed on one surface on a component mounting side; and a surface mounting electronic object to be cooled. A through hole provided in a wiring pattern portion near the wiring pattern portion of the component mounting side surface corresponding to at least one soldering terminal portion of the component, and a back surface side of the printed circuit board electrically connected by the through hole. It comprises a rear surface side wiring pattern provided and an SMT radiator surface-mounted on the rear surface side pattern, and the SMT radiator is made of metal and has a rectangular parallelepiped shape.
【００１５】請求項３に記載の本発明は、表面実装用電
子部品の放熱構造であって、部品実装側の片面に形成さ
れた所定の配線パターンと、この配線パターンの冷却対
象となる表面実装用電子部品の少なくとも一つのはんだ
付け用端子部に対応する部位の近傍部位に設けられたス
ルーホールと、当該スルーホールにより電気接続された
当該プリント基板の裏面側に設けられた裏面側配線パタ
ーンと、前記部品実装側の前記近傍部位近くに表面実装
されたＳＭＴラジエターと、前記裏面側パターン上に表
面実装されたＳＭＴラジエターとからなり、前記ＳＭＴ
ラジエターは、金属製で直方体形状を有している。According to a third aspect of the present invention, there is provided a heat dissipation structure for a surface mounting electronic component, wherein a predetermined wiring pattern formed on one surface of a component mounting side and a surface mounting to be cooled by the wiring pattern. A through hole provided in the vicinity of a portion corresponding to at least one soldering terminal portion of the electronic component for electronic parts, and a back side wiring pattern provided on the back side of the printed circuit board electrically connected by the through hole , An SMT radiator surface-mounted near the component mounting side, and an SMT radiator surface-mounted on the back surface side pattern.
The radiator is made of metal and has a rectangular parallelepiped shape.
【００１６】また、請求項４の本発明では、請求項１〜
３のいずれか１項に記載の表面実装用電子部品の放熱構
造において、前記ＳＭＴラジエターには、少なくとも一
対の側面に溝を形成しておく。請求項５に記載の本発明
では、請求項１〜４のいずれか１項に記載の表面実装用
電子部品の放熱構造において、前記ＳＭＴラジエター
を、既存ＳＭＴ部品と実質的に略同一形状・同一寸法に
形成しておく。Further, in the present invention of claim 4,
In the heat dissipating structure for a surface-mount electronic component according to any one of 3 above, grooves are formed in at least a pair of side surfaces in the SMT radiator. According to a fifth aspect of the present invention, in the heat dissipation structure of the surface mounting electronic component according to any one of the first to fourth aspects, the SMT radiator has substantially the same shape and the same shape as an existing SMT component. It is formed to the dimensions.
【００１７】請求項６に記載の表面実装用電子部品の放
熱構造では、請求項５に記載のＳＭＴラジエターをＳＭ
Ｔ部品実装用の自動機により所定位置に実装する。請求
項７の電子機器は、請求項１〜６のいずれか１項に記載
の表面実装用電子部品の放熱構造を有し構成される。According to a sixth aspect of the present invention, there is provided a heat dissipation structure for surface-mounting electronic components, wherein the SMT radiator of the fifth aspect is SM.
It is mounted at a predetermined position by an automatic machine for mounting T components. According to a seventh aspect of the present invention, there is provided an electronic device having the heat dissipation structure for the surface-mounting electronic component according to any one of the first to sixth aspects.
【００１８】[0018]
【発明の実施の形態】本発明は、ＳＭＴ部品の冷却に関
し、部品リードまたは取付けパッドより熱が逃げる発熱
電子部品の放熱構造において、安価で入手しやすい熱伝
導率の良い金属をＳＭＴ部品と同等の形状に形成したＳ
ＭＴラジエターを、発熱部品の配置位置近傍の配線パタ
ーン上および／または対応する裏面部位に形成した配線
パターン上に実装し、パターンを介し更にＳＭＴラジエ
ターを通じて空気中に熱を逃がすようにしたことを特徴
とする。BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to cooling SMT components, and in a heat dissipation structure for heat-generating electronic components in which heat escapes from component leads or mounting pads, a metal that is inexpensive and easily available with good thermal conductivity is equivalent to an SMT component. Formed in the shape of
The MT radiator is mounted on the wiring pattern near the position where the heat-generating component is arranged and / or on the wiring pattern formed on the corresponding back surface part, and the heat is released to the air through the pattern and further through the SMT radiator. And
【００１９】なお、従来技術として先に例示した、(d)
特開平７−１４７４６７号公報（電子部品の放熱方法）
の開示技術は、二つの併設した導体パターン間を熱的に
接続するセラミックチップを開示しているが、このチッ
プは両端でのみパターンに接続され広いパターンに熱を
伝えるためのもので自身がラジエターとして機能するも
のではなく、本発明のラジエターはこれとは別異のもの
である。Incidentally, as an example of the prior art, (d)
Japanese Unexamined Patent Publication No. 7-147467 (Heat dissipation method for electronic components)
The disclosed technology discloses a ceramic chip that thermally connects two adjacent conductor patterns, but this chip is connected to the pattern only at both ends and conducts heat to a wide pattern. The radiator of the present invention is different from this.
【００２０】〔実施例〕以下、実施例を挙げ添付図面を
用いて本発明につき詳細に説明する。なお、本明細書に
係る各図面中で同等部分には同一符号を付してある。本
発明による放熱構造の第１の実施例に係る部品実装基板
の要部拡大斜視図を図１に示す。[Embodiments] The present invention will be described in detail below with reference to the accompanying drawings. In addition, in each of the drawings according to the present specification, the same parts are denoted by the same reference numerals. FIG. 1 shows an enlarged perspective view of a main part of a component mounting board according to a first embodiment of a heat dissipation structure according to the present invention.
【００２１】図１において、符号１は全体を省略して示
したプリント基板であり、符号２は表面実装された発熱
部品、符号３，４，５は配線パターンである。また、符
号２０はＳＭＴ部品の典型的な形状の一つでチップコン
デンサやチップ抵抗等に用いられている直方体形状を有
し、寸法的にもＳＭＴ部品に準じて形成されているラジ
エター（以後、ＳＭＴラジエターという）で後述所定位
置にその側面ではんだ付けされている。前記ＳＭＴラジ
エター２０の素材には、はんだ付け性が良好で安価な金
属、例えば銅や真鍮を用いる。ＳＭＴラジエター２０
は、金属製であるから熱伝導性も良い。構造も非常にシ
ンプルで安価である。In FIG. 1, reference numeral 1 is a printed circuit board which is omitted in its entirety, reference numeral 2 is a surface-mounted heat generating component, and reference numerals 3, 4 and 5 are wiring patterns. Further, reference numeral 20 is one of typical shapes of SMT components, and has a rectangular parallelepiped shape used for a chip capacitor, a chip resistor, etc., and a radiator (hereinafter, referred to as “dimension formed in accordance with SMT components”). It is soldered on its side surface to a predetermined position described later by SMT radiator). As a material of the SMT radiator 20, an inexpensive metal having good solderability, such as copper or brass, is used. SMT radiator 20
Since is made of metal, it has good thermal conductivity. The structure is also very simple and inexpensive.
【００２２】プリント基板１の実装側表面には所定の配
線パターン３，４，５が形成されている。実施例の発熱
部品は８ピンのＳＯＰタイプのパワーＦＥＴ；２であ
り、そのピン（金属製接続端子）(1),(2),(3),(4),(5),
(6),(7),(8) の配置（割当て）例を図２の説明図に示
す。このＦＥＴ；２では、１〜３番ピンは共通にソース
端子であり、４番ピンはゲート端子、５〜８番ピンは共
通にドレイン端子となっている。Predetermined wiring patterns 3, 4, and 5 are formed on the mounting side surface of the printed board 1. The heat-generating component of the embodiment is an 8-pin SOP type power FET; 2 and its pins (metal connection terminals) (1), (2), (3), (4), (5),
An example of arrangement (assignment) of (6), (7), and (8) is shown in the explanatory view of FIG. In this FET; 2, pins 1 to 3 are commonly source terminals, pin 4 is a gate terminal, and pins 5 to 8 are commonly drain terminals.
【００２３】前記ＳＭＴラジエター２０は、冷却対象と
なる表面実装用電子部品であるＦＥＴ；２のはんだ付け
用端子部（ドレイン端子(5) 〜(8) ）それぞれに対応す
る配線パターン部位近傍の僅かに離れた位置にそれぞれ
はんだ付けで表面実装されている。ＳＭＴラジエター２
０は、直方体状ではんだ付け可能な金属であるため、パ
ターンとの接触面が広くとれる。また、放熱効果も高
い。実施例では、分離して形成された全てのドレイン端
子それぞれに対応して４個のＳＭＴラジエター２０を実
装しているが、基板の実状に併せて適正に数を減ずるよ
うにしても良い。The SMT radiator 20 is a surface mounting electronic component to be cooled, which is an FET; 2; soldering terminal portions (drain terminals (5) to (8)) of 2; They are surface-mounted by soldering at separate positions. SMT radiator 2
Since 0 is a rectangular parallelepiped metal that can be soldered, the contact surface with the pattern can be wide. Also, the heat dissipation effect is high. In the embodiment, four SMT radiators 20 are mounted corresponding to all the separately formed drain terminals, but the number may be properly reduced according to the actual condition of the substrate.
【００２４】本実施例に係るＳＭＴラジエター２０は、
規定のＳＭＴ電子部品と形状等が実質的に同等であり、
従って上述した放熱構造を持つプリント基板を製造する
にあたり、ＳＭＴラジエター２０を図３の説明図に示す
様に自動実装ラインの既存実装装置に搭載できるリール
梱包形態で用意して、組立工程中での使用に供すること
が可能である。このようにすれば既成製造設備を活用し
て容易に自動化が可能となり従来の放熱構造に比して製
造作業性が飛躍的に向上し低コスト化もできる。The SMT radiator 20 according to this embodiment is
The shape and the like of the specified SMT electronic parts are substantially the same,
Therefore, in manufacturing the printed circuit board having the above-described heat dissipation structure, the SMT radiator 20 is prepared in a reel packing form that can be mounted in the existing mounting device of the automatic mounting line as shown in the explanatory view of FIG. It is possible to use it. By doing so, automation can be easily performed by utilizing the existing manufacturing equipment, and the manufacturing workability is dramatically improved and the cost can be reduced as compared with the conventional heat dissipation structure.
【００２５】上述のように構成された実施例の放熱構造
では、当該基板の実動作時にパワーＦＥＴ；２から発生
する熱は、ドレイン端子(5) 〜(8) から配線パターンを
速やかに伝わり各ＳＭＴラジエター２０に達し、金属製
のＳＭＴラジエター２０の側表面や上側表面から空気中
へと放熱される。ＳＭＴラジエター２０の放熱面積（表
面積）が充分確保されているため効率よくパワーＦＥ
Ｔ；２の冷却ができる。発熱部品の温度上昇が抑えられ
当該回路・装置の信頼性が向上する。なお、プリント基
板の加熱も抑えられ、他の部品に熱的に影響を与える度
合いも少ない。また、実施例の放熱構造は小形のＳＭＴ
ラジエター２０を表面実装するのみで良いため、省スペ
ース性も優れている。In the heat dissipation structure of the embodiment constructed as described above, the heat generated from the power FET; 2 during the actual operation of the substrate is quickly transmitted through the wiring pattern from the drain terminals (5) to (8) to each of them. It reaches the SMT radiator 20 and is radiated into the air from the side surface and the upper surface of the metal SMT radiator 20. Since the heat radiation area (surface area) of the SMT radiator 20 is sufficiently secured, the power FE can be efficiently used.
T: 2 can be cooled. The temperature rise of the heat generating parts is suppressed and the reliability of the circuit / device is improved. It should be noted that the heating of the printed circuit board is also suppressed, and the degree to which other parts are thermally affected is small. The heat dissipation structure of the embodiment is a small SMT.
Since the radiator 20 only needs to be surface-mounted, space saving is also excellent.
【００２６】以上説明したように、本実施例は、半田付
け可能な熱伝導率の良い金属をＳＭＴ状のラジエターと
し、ＳＭＴの発熱部品近傍の配線パターン上に実装して
いるため、非常に安価で冷却効果が高く、部品の小型化
が可能で省スペース性にも優れた放熱構造になってい
る。As described above, in the present embodiment, the metal having good thermal conductivity which can be soldered is used as the SMT-shaped radiator and mounted on the wiring pattern near the heat-generating component of the SMT, so that it is very inexpensive. It has a high cooling effect, allows downsizing of parts, and has a space-saving heat dissipation structure.
【００２７】なお、本実施例では発熱部品としてピンが
パッケージの外側に突き出た８ピンのＳＯＰ(Small Out
line Package) タイプのＦＥＴを使用した例を説明した
が、ピンがパッケージの内側に形成されたＳＯＪ(Small
Outline J-leaded package)タイプの部品であっても勿
論良く、ＦＥＴ以外でも部品リードまたは取付けパッド
より熱が逃げる部品であれば端子数等にかかわらずどの
ような発熱部品に対しても同様に本発明が適用できる。In this embodiment, an 8-pin SOP (Small Out) having a pin protruding outside the package is used as a heat-generating component.
An example using a line package type FET has been described, but an SOJ (Small) with pins formed inside the package
Of course, it may be an outline J-leaded package) type part, and if it is a part other than the FET that allows heat to escape from the part lead or mounting pad, the same applies to any heat generating part regardless of the number of terminals. The invention can be applied.
【００２８】続いて、本発明の他の実施例について説明
する。図４は、本発明による放熱構造の第２の実施例を
説明する、部品実装基板の要部拡大側断面図である。本
実施例の基本的概念は前実施例と同様であり、放熱性能
的に略同様の効果が得られる。Next, another embodiment of the present invention will be described. FIG. 4 is an enlarged side sectional view of an essential part of a component mounting board for explaining a second embodiment of the heat dissipation structure according to the present invention. The basic concept of this embodiment is similar to that of the previous embodiment, and substantially the same effect can be obtained in terms of heat dissipation performance.
【００２９】図４において、符号６は一般的なプリント
基板であり、符号２は発熱部品、符号７，８は部品実装
側面に形成された配線パターンであり、符号９は部品実
装側面の反対面で前記配線パターン８に対応する位置に
形成された補助パターンである。プリント基板６には、
配線パターン８と補助パターン９を結ぶスルーホール１
０が多数形成してある。補助パターン９上には適宜個数
のＳＭＴラジエター２０Ａが側面ではんだ付けにより実
装してある。In FIG. 4, reference numeral 6 is a general printed board, reference numeral 2 is a heat-generating component, reference numerals 7 and 8 are wiring patterns formed on the component mounting side surface, and reference numeral 9 is a surface opposite to the component mounting side surface. Is an auxiliary pattern formed at a position corresponding to the wiring pattern 8. On the printed circuit board 6,
Through hole 1 connecting the wiring pattern 8 and the auxiliary pattern 9
Many 0s are formed. An appropriate number of SMT radiators 20A are mounted on the side surfaces of the auxiliary patterns 9 by soldering on the side surfaces.
【００３０】このＳＭＴラジエター２０Ａも、例えば銅
製でＳＭＴ部品に準じた寸法の直方体形状を有してい
る。本実施例のＳＭＴラジエター２０Ａでは、全ての側
面に断面Ｖ字状の溝２０ｂが形成してあり、表面積を広
くとって、より放熱効果を高めている。なお、側面の溝
はＶ字状以外の形状でも良く、一対の対向側面にのみ形
成してあっても良い。また、一面につき複数本あっても
よい。This SMT radiator 20A is also made of copper, for example, and has a rectangular parallelepiped shape having dimensions according to SMT components. In the SMT radiator 20A of the present embodiment, the groove 20b having a V-shaped cross section is formed on all the side surfaces, and the surface area is widened to further enhance the heat radiation effect. The groove on the side surface may have a shape other than the V-shape, and may be formed only on the pair of opposed side surfaces. Also, there may be a plurality of sheets per surface.
【００３１】本実施例の配線パターン８と補助パターン
９は、スルーホール１０によって電気的に導通している
とともに熱的にも結合されている。従って、金属部であ
るスルーホール１０を介して基板の絶縁素材よりも熱が
伝導し易い。このため、発熱素子２で発生した熱は接続
端子から配線パターン８に伝わり、更にスルーホール１
０を伝わって裏面の補助パターン９へ、更にはＳＭＴラ
ジエター２０Ａに伝わり裏面側の空気中に放熱される。The wiring pattern 8 and the auxiliary pattern 9 of this embodiment are electrically connected by the through hole 10 and are also thermally coupled. Therefore, heat is more easily conducted through the through holes 10 which are metal parts than the insulating material of the substrate. Therefore, the heat generated in the heating element 2 is transferred from the connection terminal to the wiring pattern 8, and the through hole 1
0 is transmitted to the auxiliary pattern 9 on the back surface and further to the SMT radiator 20A to be radiated to the air on the back surface side.
【００３２】本実施例では、プリント基板のスルーホー
ルを多用し裏面にＳＭＴラジエターを実装することによ
り、熱を裏面に逃がすことができ前実施例同様に発熱素
子の発生熱を効率的に放熱させることができる。特に、
配線パターンを放熱特性に見合っただけ縮小できる等に
より、実装スペースが大幅に削減でき回路設計の自由度
が大いに増す利点がある。In this embodiment, the through holes are frequently used in the printed circuit board and the SMT radiator is mounted on the back surface, so that the heat can be radiated to the back surface and the heat generated by the heating element can be efficiently radiated as in the previous embodiment. be able to. In particular,
By reducing the wiring pattern in proportion to the heat dissipation characteristics, there is an advantage that the mounting space can be greatly reduced and the degree of freedom in circuit design is greatly increased.
【００３３】ここで説明した実施例では、裏面側にのみ
ＳＭＴラジエターを実装しているが、同時に部品実装側
の配線パターンにも同様にＳＭＴラジエターを実装する
ようにしても良い。以上説明したように本発明では、半
田付け可能な熱伝導率の良い金属をラジエターとし、Ｓ
ＭＴの発熱部品のパターン上に実装することにより、安
価で冷却効果の高い放熱構造が実現できる。また、基板
の小型化ひいては電子装置の小型化が可能となる。ま
た、本ラジエターが導電性の高い金属である場合、大電
流を流すことが可能でパターンの電流容量に対する補強
にもなり、パターン面積を小さくできる効果もある。In the embodiment described here, the SMT radiator is mounted only on the back surface side, but the SMT radiator may be mounted on the wiring pattern on the component mounting side at the same time. As described above, in the present invention, the metal having good thermal conductivity that can be soldered is used as the radiator, and S
By mounting on the pattern of the heat-generating component of MT, it is possible to realize a heat-dissipating structure that is inexpensive and has a high cooling effect. In addition, it is possible to reduce the size of the substrate and thus the electronic device. Further, when the radiator is made of a metal having high conductivity, a large amount of current can be passed, which also reinforces the current capacity of the pattern and has the effect of reducing the pattern area.
【００３４】[0034]
【発明の効果】本発明の第１の効果は、第１に低コスト
で発熱部品の放熱構造を実現できることである。これ
は、付加部品が安価なＳＭＴラジエター（放熱部品）の
みでよいためである。また、ＳＭＴラジエターの実装に
自動機を用いることで製造コストを抑えることができる
からである。ちなみに、発生熱を効率的に空気中に放熱
するようにしているため実装した回路基板の信頼性が向
上する効果もある。The first effect of the present invention is, firstly, to realize a heat dissipation structure for a heat-generating component at low cost. This is because the additional component is only an inexpensive SMT radiator (heat dissipation component). Further, the manufacturing cost can be suppressed by using an automatic machine for mounting the SMT radiator. Incidentally, since the generated heat is efficiently dissipated into the air, there is also an effect that the reliability of the mounted circuit board is improved.
【図１】本発明の第１実施例に係る部品実装基板の要部
拡大斜視図である。FIG. 1 is an enlarged perspective view of an essential part of a component mounting board according to a first embodiment of the present invention.
【図２】実施例に係る発熱電子部品の端子説明図であ
る。FIG. 2 is an explanatory diagram of terminals of the heat-generating electronic component according to the embodiment.
【図３】自動実装ラインの実装装置用リール梱包形態の
説明図である。FIG. 3 is an explanatory diagram of a reel packaging form for a mounting device of an automatic mounting line.
【図４】本発明の第２実施例を説明する部品実装基板の
要部拡大側断面図である。FIG. 4 is an enlarged side sectional view of an essential part of a component mounting board for explaining a second embodiment of the present invention.
【図５】従来の技術を示す部品実装基板の要部斜視図で
ある。FIG. 5 is a perspective view of a main part of a component mounting board showing a conventional technique.
【図６】従来の技術を示すメタルコア基板の断面図であ
る。FIG. 6 is a cross-sectional view of a metal core substrate showing a conventional technique.
【図７】従来の技術を示すセラミック基板の断面図であ
る。FIG. 7 is a sectional view of a ceramic substrate showing a conventional technique.
１…プリント基板 ２…発熱部品（パワーＦＥＴ） ３，４，５…配線パターン ６…プリント基板 ７，８…配線パターン ９…補助パターン １０…スルーホール ２０，２０Ａ…ラジエター（ＳＭＴラジエター） ２０ｂ…溝 1 ... Printed circuit board 2 ... Heat-generating component (power FET) 3, 4, 5 ... Wiring pattern 6 ... Printed circuit board 7, 8 ... Wiring pattern 9 ... Auxiliary pattern 10 ... Through hole 20, 20A ... Radiator (SMT radiator) 20b ... groove
───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 清彦 宮城県黒川郡大和町吉岡字雷神２番地 宮 城日本電気株式会社内 Ｆターム(参考） 5E322 AA11 AB02 FA04 5E336 AA04 CC50 EE03 GG03 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Kiyohiko Watanabe Miyagi Prefecture Kurokawa-gun Yamato-cho Yoshioka character Raijin 2 shrine Inside NEC Corporation F-term (reference) 5E322 AA11 AB02 FA04 5E336 AA04 CC50 EE03 GG03
Claims (7)
って、所定の配線パターンを形成したプリント基板と、
冷却対象となる表面実装用電子部品の少なくとも一つの
はんだ付け用端子部に対応する配線パターン部位の近傍
の配線パターン上に表面実装されたＳＭＴラジエターと
からなり、 前記ＳＭＴラジエター10は、金属製で直方体形状を有す
ることを特徴とする表面実装用電子部品の放熱構造。1. A heat dissipation structure for an electronic component for mounting on a surface board, comprising: a printed board having a predetermined wiring pattern formed thereon;
The SMT radiator 10 is surface-mounted on the wiring pattern near the wiring pattern portion corresponding to at least one soldering terminal portion of the surface-mounting electronic component to be cooled, and the SMT radiator 10 is made of metal. A heat dissipation structure for surface-mounting electronic parts, which has a rectangular parallelepiped shape.
て、部品実装側の片面に所定の配線パターンを形成した
プリント基板と、冷却対象となる表面実装用電子部品の
少なくとも一つのはんだ付け用端子部に対応する前記部
品実装側面の配線パターン部位の近傍の配線パターン部
位に設けられたスルーホールと、当該スルーホールによ
り電気接続された当該プリント基板の裏面側に設けられ
た裏面側配線パターンと、この裏面側パターン上に表面
実装されたＳＭＴラジエターとからなり、 前記ＳＭＴラジエター10は、金属製で直方体形状を有す
ることを特徴とする表面実装用電子部品の放熱構造。2. A heat dissipation structure for a surface mounting electronic component, comprising: a printed circuit board having a predetermined wiring pattern formed on one surface on the component mounting side; and at least one soldering of the surface mounting electronic component to be cooled. A through hole provided in a wiring pattern portion near the wiring pattern portion on the component mounting side surface corresponding to the terminal portion, and a back surface side wiring pattern provided on the back surface side of the printed circuit board electrically connected by the through hole The SMT radiator 10 is surface-mounted on the back surface side pattern, and the SMT radiator 10 is made of metal and has a rectangular parallelepiped shape.
て、部品実装側の片面に形成された所定の配線パターン
と、この配線パターンの冷却対象となる表面実装用電子
部品の少なくとも一つのはんだ付け用端子部に対応する
部位の近傍部位に設けられたスルーホールと、当該スル
ーホールにより電気接続された当該プリント基板の裏面
側に設けられた裏面側配線パターンと、前記部品実装側
の前記近傍部位近くに表面実装されたＳＭＴラジエター
10と、前記裏面側パターン上に表面実装されたＳＭＴラ
ジエターとからなり、 前記ＳＭＴラジエターは、金属製で直方体形状を有する
ことを特徴とする基板実装用電子部品の放熱構造。3. A heat dissipation structure for a surface mounting electronic component, comprising: a predetermined wiring pattern formed on one surface of a component mounting side; and at least one solder for the surface mounting electronic component to be cooled by this wiring pattern. Through holes provided in the vicinity of the portion corresponding to the attachment terminal portion, a back surface side wiring pattern provided on the back surface side of the printed circuit board electrically connected by the through holes, and the vicinity of the component mounting side Surface mounted SMT radiator near the site
10 and an SMT radiator surface-mounted on the back surface side pattern, wherein the SMT radiator is made of metal and has a rectangular parallelepiped shape.
とも一対の側面に溝を形成してあることを特徴とする請
求項１〜３のいずれか１項に記載の表面実装用電子部品
の放熱構造。4. The heat dissipating structure for a surface mounting electronic component according to claim 1, wherein the SMT radiator 10 has grooves formed on at least a pair of side surfaces.
品と実質的に略同一形状・同一寸法に形成されているこ
とを特徴とする請求項１〜４のいずれか１項に記載の表
面実装用電子部品の放熱構造。5. The surface mount electronic according to claim 1, wherein the SMT radiator is formed to have substantially the same shape and the same size as an existing SMT component. Heat dissipation structure for parts.
ＭＴ部品実装用の自動機により所定位置に実装したこと
を特徴とする表面実装用電子部品の放熱構造。6. The SMT radiator according to claim 5 is S.
A heat-dissipating structure for surface-mounting electronic components, which is mounted at a predetermined position by an automatic MT component mounting machine.
面実装用電子部品の放熱構造、を有する電子機器。7. An electronic device having the surface mounting electronic component heat dissipation structure according to claim 1. Description:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001384416A JP2003188565A (en) | 2001-12-18 | 2001-12-18 | Heat dissipation structure of surface mount electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001384416A JP2003188565A (en) | 2001-12-18 | 2001-12-18 | Heat dissipation structure of surface mount electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003188565A true JP2003188565A (en) | 2003-07-04 |
Family
ID=27594150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001384416A Pending JP2003188565A (en) | 2001-12-18 | 2001-12-18 | Heat dissipation structure of surface mount electronic component |
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| Country | Link |
|---|---|
| JP (1) | JP2003188565A (en) |
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| WO2014204982A2 (en) * | 2013-06-19 | 2014-12-24 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
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