JP2003170359A - Cutting wheel - Google Patents
Cutting wheelInfo
- Publication number
- JP2003170359A JP2003170359A JP2001373320A JP2001373320A JP2003170359A JP 2003170359 A JP2003170359 A JP 2003170359A JP 2001373320 A JP2001373320 A JP 2001373320A JP 2001373320 A JP2001373320 A JP 2001373320A JP 2003170359 A JP2003170359 A JP 2003170359A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- abrasive grains
- outer peripheral
- cutting
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、コンクリート、コ
ンクリート二次製品、セメント系建材、窯業系建材など
の切断に用いられる切断ホイールにかかり、詳しくは、
ろう付けにより基板に一層配列する砥粒の配列を改良し
て切断時のホイールの振動や切断面のチッピングを低減
させた切断ホイールに関する。TECHNICAL FIELD The present invention relates to a cutting wheel used for cutting concrete, concrete secondary products, cement-based building materials, ceramic-based building materials, and the like.
The present invention relates to a cutting wheel in which abrasive grains arranged on a substrate by brazing are improved to reduce vibration of the wheel during cutting and chipping of a cutting surface.
【０００２】[0002]
【従来の技術】コンクリート、コンクリート二次製品、
セメント系建材、窯業系建材などの切断用として、円盤
状基板の外周部に砥粒をろう付け法により一層配列した
切断ホイールが使用されている。このような切断ホイー
ルには、切れ味に優れ、しかもその切れ味が長期にわた
って安定的に持続することが要求される。ところが、切
断ホイールは切断作業の進行に伴い切れ味と寿命が低下
する。2. Description of the Related Art Concrete, secondary concrete products,
For cutting cement-based building materials, ceramic-based building materials and the like, a cutting wheel in which abrasive grains are further arranged by brazing on the outer peripheral portion of a disk-shaped substrate is used. Such a cutting wheel is required to have excellent sharpness and to maintain the sharpness stably for a long period of time. However, the cutting wheel deteriorates in sharpness and life as the cutting work progresses.
【０００３】その主な原因として、基板への砥粒の固着
状態が不安定で砥粒が脱落しやすいこと、チップポケッ
トが小さいこと、砥粒間隔のコントロールが不十分なた
めに切断作業中に切粉によって目詰まりが生じることが
挙げられる。とくに砥粒間隔に関しては、基板の表面に
砥粒を所定の配列状態に配設するのが難しく、砥粒どう
しが近接した状態にある部分においては、切粉が排出さ
れにくく、切れ味の低下につながる。The main causes thereof are that the adhered state of the abrasive grains on the substrate is unstable and the abrasive grains are likely to fall off, the chip pocket is small, and the control of the abrasive grain interval is insufficient, so that during cutting work. It is possible that the chips cause clogging. Especially regarding the abrasive grain interval, it is difficult to arrange the abrasive grains in a predetermined arrangement state on the surface of the substrate, and in the portion where the abrasive grains are in close proximity to each other, cutting chips are difficult to be discharged, resulting in a decrease in sharpness. Connect
【０００４】ろう付け法による切断ホイールの製造にお
いて、砥粒を均一に分散させるための方策として、特開
平９−１９８６７号公報には、金属被覆したダイヤモン
ド砥粒を基板外周面と金型の間隙に充填し、基板と金型
を加熱しながら銀ろうを間隙に溶浸させる切断ホイール
の製造方法が開示されている。また特開平１０−１１８
９３７号公報には、１個または集合した複数個の超砥粒
の一層によって作用砥粒を形成し、作用砥粒間の外周方
向の間隔を作用砥粒の粒径以上とした切断ホイールが記
載されている。As a measure for uniformly dispersing abrasive grains in the production of a cutting wheel by the brazing method, Japanese Patent Laid-Open No. 9-19867 discloses a method in which metal-coated diamond abrasive grains are used to form a gap between a substrate outer peripheral surface and a die. A method for manufacturing a cutting wheel is disclosed, in which the silver brazing material is infiltrated and the substrate and the mold are heated and the silver solder is infiltrated into the gap. In addition, JP-A-10-118
Japanese Patent No. 937 describes a cutting wheel in which working abrasive grains are formed by a single layer of one or a plurality of superabrasive grains, and the distance between the working abrasive grains in the outer circumferential direction is equal to or larger than the grain size of the working abrasive grains. Has been done.
【０００５】[0005]
【発明が解決しようとする課題】上記の公開公報に記載
の方法によれば、砥粒が所定の間隔をもって一様に分布
した切断ホイールが得られる。しかし、特開平９−１９
８６７号公報に記載の切断ホイールは、基板と金型の間
隙によって決まる一定厚さの砥粒層が形成され、砥粒と
砥粒の間に砥粒の金属被覆成分と銀ろうとが充填された
かたちであるので、いわゆるチップポケットが形成され
ず、充分な切れ味と切粉の排出が得られない、という問
題がある。According to the method disclosed in the above publication, a cutting wheel in which abrasive grains are uniformly distributed at a predetermined interval can be obtained. However, JP-A-9-19
In the cutting wheel described in Japanese Patent No. 867, an abrasive grain layer having a constant thickness determined by a gap between a substrate and a mold is formed, and a metal coating component of the abrasive grains and silver solder are filled between the abrasive grains. Since it is in the shape, so-called chip pockets are not formed, and there is a problem that sufficient sharpness and chip discharge cannot be obtained.
【０００６】また特開平１０−１１８９３７号公報に記
載の切断ホイールは、砥粒間隔が大きすぎて切断時のホ
イールの振動や切断面のチッピングが大きくなる、とい
う問題がある。Further, the cutting wheel described in Japanese Patent Laid-Open No. 10-118937 has a problem that the abrasive grain interval is too large and the vibration of the wheel at the time of cutting and the chipping of the cutting surface increase.
【０００７】本発明が解決すべき課題は、砥粒を基板に
一層配列してろう付けした切断ホイールにおいて、基板
外周部の形状と砥粒の配列を改良して、良好な切れ味を
維持したうえで、切断時のホイールの振動や切断面のチ
ッピングを低減させることにある。なお、本明細書でい
う砥粒とは、ダイヤモンド砥粒、ｃＢＮ砥粒、およびこ
れらの砥粒を金属被覆した砥粒、ダイヤモンド焼結体お
よびｃＢＮ焼結体を含むものとし、これらを総称して砥
粒という。The problem to be solved by the present invention is to improve the shape of the outer peripheral portion of the substrate and the arrangement of the abrasive grains in the cutting wheel in which the abrasive grains are further arranged and brazed on the substrate to maintain good sharpness. The purpose is to reduce the vibration of the wheel during cutting and the chipping of the cut surface. It should be noted that the abrasive grains referred to in the present specification include diamond abrasive grains, cBN abrasive grains, and abrasive grains in which these abrasive grains are metal-coated, a diamond sintered body and a cBN sintered body, and these are collectively referred to. It is called abrasive grain.
【０００８】[0008]
【課題を解決するための手段】本発明の切断ホイール
は、基板の外周面と外周部側面に砥粒を一層配列してろ
う付けした切断ホイールであって、基板の外周面と外周
部側面にそれぞれ基板周方向に複数列の砥粒を配設する
とともに、各列の各砥粒が他の列の砥粒のなかの少なく
とも１個の砥粒と基板周方向にみて一部が重なり合うよ
うに配設した切断ホイールである。A cutting wheel according to the present invention is a cutting wheel in which abrasive grains are arrayed and brazed on the outer peripheral surface and the outer peripheral side surface of a substrate, and the outer peripheral surface and the outer peripheral side surface of the substrate are brazed. Arranging a plurality of rows of abrasive grains in the substrate circumferential direction, respectively, so that each abrasive grain in each row partially overlaps at least one abrasive grain in the other rows in the substrate circumferential direction. It is a cutting wheel arranged.
【０００９】基板外周部に配設した各列の各砥粒が他の
列の砥粒のなかの少なくとも１個の砥粒と基板周方向に
みて一部が重なり合うように配設することで、切断加工
時に砥粒が絶え間なく連続的に被切断材に接触するの
で、ホイールの振動が少なくなり、切断面のチッピング
も小さくなる。By disposing each abrasive grain in each row disposed on the outer peripheral portion of the substrate so as to partially overlap with at least one abrasive grain in the other row in the circumferential direction of the substrate, Since the abrasive grains continuously contact the material to be cut during the cutting process, the vibration of the wheel is reduced and the chipping of the cut surface is also reduced.
【００１０】また本発明の切断ホイールとして、基板外
周の稜部を面取りした面取り部に基板側面より突出する
ように砥粒を配設し、基板の外周面に配設した砥粒と合
わせて基板周方向に３列以上の砥粒を配設し、基板の外
周部側面には基板周方向に複数列の砥粒を配設するとと
もに、各列の各砥粒が他の列の砥粒のなかの少なくとも
１個の砥粒と基板周方向にみて一部が重なり合うように
配設した切断ホイールとすることもできる。Further, as the cutting wheel of the present invention, abrasive grains are arranged on the chamfered portion of the outer periphery of the substrate so as to project from the side surface of the substrate, and the abrasive grains arranged on the outer peripheral surface of the substrate are combined with the abrasive grains. Abrasive grains of three or more rows are arranged in the circumferential direction, and a plurality of rows of abrasive grains are arranged in the circumferential direction of the substrate on the outer peripheral side surface of the substrate, and each abrasive grain of each row is different from the abrasive grains of the other row. It is also possible to use a cutting wheel in which at least one abrasive grain is arranged so as to partially overlap with the abrasive grain in the circumferential direction of the substrate.
【００１１】基板外周の稜部に面取りを施し、この面取
り部に砥粒を配設することにより、面取り部において砥
粒の保持力が増大されて脱落しにくくなる。ここで、面
取り部の幅は砥粒平均粒径以上とし、傾斜角度は基板側
面に対して３０度以上とするのが適当である。面取り部
の幅が砥粒平均粒径より小さいとろう材による砥粒保持
力が不充分となり、砥粒が脱落しやすくなる。また面取
り部の傾斜角度が３０度より小さいと切断時の接着面水
平分力が大きくなり、ろう材への負荷が大きくなって砥
粒の脱落につながる。また、各列の各砥粒が他の列の砥
粒のなかの少なくとも１個の砥粒と基板周方向にみて一
部が重なり合うように配設することで、前記と同様に切
断加工時にホイールの振動が少なくなり、切断面のチッ
ピングも小さくなる。By chamfering the ridges on the outer periphery of the substrate and disposing the abrasive grains on the chamfered portions, the holding force of the abrasive grains is increased at the chamfered portions, and the chamfered portions are less likely to fall off. Here, it is appropriate that the width of the chamfered portion is equal to or larger than the average grain diameter of the abrasive grains, and the inclination angle is equal to or larger than 30 degrees with respect to the side surface of the substrate. If the width of the chamfered portion is smaller than the average grain size of the abrasive grains, the abrasive grain holding force of the brazing material becomes insufficient and the abrasive grains are likely to fall off. If the angle of inclination of the chamfered portion is smaller than 30 degrees, the horizontal component of the adhesive surface at the time of cutting becomes large, and the load on the brazing material becomes large, leading to the dropping of abrasive grains. Further, by disposing each abrasive grain in each row so as to partially overlap with at least one abrasive grain in the other rows when viewed in the circumferential direction of the substrate, the wheel is used during the cutting process in the same manner as described above. Vibration is reduced and chipping of the cut surface is also reduced.
【００１２】ここで、前記各砥粒が他の砥粒と重なり合
う幅は、砥粒平均粒径の１／３以下とするのが望まし
い。砥粒どうしが重なり合う幅が砥粒平均粒径の１／３
より大きくなると、基板周方向の砥粒間隔が狭すぎて切
れ味が低下する。また、全部の砥粒のろう付けにおい
て、砥粒の埋め込み量は砥粒平均粒径の１／３以上とす
るのが適当である。埋め込み量が砥粒平均粒径の１／３
より少ないと砥粒の保持力が不充分となる。Here, it is desirable that the width at which each abrasive grain overlaps another abrasive grain be 1/3 or less of the average grain size of the abrasive grains. The width at which the abrasive grains overlap is 1/3 of the average grain size of the abrasive grains.
When it becomes larger, the interval between the abrasive grains in the circumferential direction of the substrate becomes too narrow and the sharpness decreases. Further, in brazing of all the abrasive grains, it is appropriate that the embedding amount of the abrasive grains is 1/3 or more of the average grain size of the abrasive grains. The embedding amount is 1/3 of the average grain size of abrasive grains
If it is less, the holding force of the abrasive grains becomes insufficient.
【００１３】さらに本発明の切断ホイールとして、基板
の外周部側面に配設した砥粒群の基板周方向にみた一定
間隔ごとに、複数列の砥粒を基板中心方向に向けて配設
したものとすることができる。被加工材の材質が硬い場
合、切断時に基板にかかる負荷が大きくなり、基板が微
小に変形して被加工材と接触する、いわゆる基板胴当た
りと称する現象が生じる。この基板胴当たりがひどくな
ると被加工材のチッピングが大きくなる。そこで、外周
部側面の砥粒群の一部を基板中心方向に向けて延長する
ことにより、基板胴当たりを防止するものである。Further, as the cutting wheel of the present invention, a plurality of rows of abrasive grains are arranged toward the substrate center direction at regular intervals of the abrasive grain group arranged on the side surface of the outer peripheral portion of the substrate when viewed in the peripheral direction of the substrate. Can be When the material of the material to be processed is hard, the load applied to the substrate at the time of cutting becomes large and the substrate is slightly deformed to come into contact with the material to be processed. When the contact of the substrate body becomes severe, the chipping of the work material increases. Therefore, a part of the group of abrasive grains on the side surface of the outer peripheral portion is extended toward the center of the substrate to prevent the substrate from hitting the cylinder.
【００１４】上記のように基板外周部の各面に特定の条
件で砥粒を配設した切断ホイールは以下のようにして製
造することができる。第１の方法は、所定の間隔で規則
的に孔を開けたスクリーンを用いて、基板外周部の各面
に有機接着剤を塗布し、この有機接着剤の上に砥粒を配
置した状態で乾燥炉中で乾燥させて砥粒を仮固定した
後、接着部にのみろう材とバインダーの混合物を塗布
し、加熱、ろう付けして本固定することにより、砥粒を
所定の間隔で配列させる方法である。第２の方法は、ス
クリーンを用いてろう材とバインダーの混合体を塗布
し、砥粒を配置した状態で加熱することにより、仮固定
なしで本固定する方法である。砥粒の確実な保持と所定
の配設条件で砥粒を配設するとともに、チップポケット
の形成のためにろう材とバインダーの混合物の塗布量を
コントロールするという点からは、砥粒の仮固定後に砥
粒一粒ずつに対して確実に塗布することのできる前記第
１の方法が適している。The cutting wheel in which the abrasive grains are arranged on each surface of the outer peripheral portion of the substrate under specific conditions as described above can be manufactured as follows. The first method is to use a screen in which holes are regularly formed at predetermined intervals, apply an organic adhesive on each surface of the substrate periphery, and place abrasive grains on the organic adhesive. After the abrasive particles are temporarily fixed by drying in a drying oven, the mixture of the brazing material and the binder is applied only to the adhesive portion, and the particles are arrayed at predetermined intervals by heating and brazing to fix them permanently. Is the way. The second method is a method in which a mixture of a brazing material and a binder is applied using a screen, and heating is performed in a state where abrasive grains are arranged, so that the fixing is performed without temporary fixing. Temporary fixing of the abrasive grains from the standpoints of securely holding the abrasive grains and arranging the abrasive grains under predetermined arrangement conditions and controlling the coating amount of the mixture of the brazing material and the binder for forming the chip pocket. The first method is suitable because it can be surely applied to each abrasive grain later.
【００１５】[0015]
【発明の実施の形態】図１および図２は本発明の第１の
実施形態の切断ホイールを説明する図であり、図１の
（ａ）は切断ホイールの正面図、（ｂ）は（ａ）のＡ−
Ａ線断面図であり、図２の（ａ）は基板外周部の拡大断
面図、（ｂ）は基板の外周面の基板周方向にみた一部の
展開図、（ｃ）は基板の外周部側面の基板周方向にみた
一部の展開図である。図中、砥粒および砥粒の配置は模
式的に示している。1 and 2 are views for explaining a cutting wheel according to a first embodiment of the present invention. (A) of FIG. 1 is a front view of the cutting wheel, (b) is (a) thereof. ) A-
2A is a sectional view taken along line A, FIG. 2A is an enlarged sectional view of a substrate outer peripheral portion, FIG. 2B is a partial development view of the outer peripheral surface of the substrate seen in the substrate circumferential direction, and FIG. FIG. 4 is a partial development view of the side surface in the circumferential direction of the substrate. In the figure, the abrasive grains and the arrangement of the abrasive grains are schematically shown.
【００１６】本実施形態の切断ホイール１０は、コンク
リートやセメント系建材などの切断用のホイールであ
る。基板１は外径１００ｍｍ、厚さ１．２ｍｍのスチー
ル製基板であり、砥粒２は平均粒径が０．３５ｍｍのダ
イヤモンド砥粒であり、ろう材３はＡｇ−Ｃｕ−Ｔｉ系
の活性金属入りろうである。The cutting wheel 10 of this embodiment is a wheel for cutting concrete or cement-based building materials. The substrate 1 is a steel substrate having an outer diameter of 100 mm and a thickness of 1.2 mm, the abrasive grains 2 are diamond abrasive grains having an average grain size of 0.35 mm, and the brazing filler metal 3 is an Ag-Cu-Ti based active metal. Let's enter.
【００１７】基板１の外周部には切粉排出のためのスリ
ット１１が形成され、各スリット１１の間に砥粒２が配
設されている。基板１の外周部は図２の拡大図に示すよ
うに、外周面１ａに３列、外周部側面１ｂに２列、砥粒
２が基板周方向に間隔をおいて配設され、ろう材３によ
り基板１に固着されている。ろう材３による砥粒２の埋
め込み量ｕは、砥粒粒径ｄの約１／２である。Slits 11 for discharging chips are formed on the outer periphery of the substrate 1, and abrasive grains 2 are arranged between the slits 11. As shown in the enlarged view of FIG. 2, the outer peripheral portion of the substrate 1 has three rows on the outer peripheral surface 1a, two rows on the outer peripheral portion side surface 1b, and the abrasive grains 2 are arranged at intervals in the substrate circumferential direction. It is fixed to the substrate 1 by. The embedding amount u of the abrasive grains 2 by the brazing material 3 is about 1/2 of the abrasive grain size d.
【００１８】つぎに砥粒２の配設状態について説明す
る。本実施形態の切断ホイール１０においては、砥粒２
を配設した外周面１ａと外周部側面１ｂを基板周方向に
展開した状態で、基板周方向に３列または２列に配設し
た砥粒２が基板厚さ方向または基板半径方向に揃うこと
のないように配設している。具体的には、図２の
（ｂ），（ｃ）に示すように各砥粒２を斜めに配置し
て、全部の列の砥粒２が同時に被切断材に接触すること
がないように配設している。これにより、被切断材への
食い込みが良くなり、切れ味が向上する。Next, the disposition state of the abrasive grains 2 will be described. In the cutting wheel 10 of this embodiment, the abrasive grains 2
In a state where the outer peripheral surface 1a and the outer peripheral portion side surface 1b are arranged in the substrate circumferential direction, the abrasive grains 2 arranged in three rows or two rows in the substrate circumferential direction are aligned in the substrate thickness direction or the substrate radial direction. It is arranged so that there is no. Specifically, as shown in (b) and (c) of FIG. 2, the abrasive grains 2 are obliquely arranged so that the abrasive grains 2 in all the rows do not simultaneously contact the material to be cut. It is arranged. This improves the bite into the material to be cut and improves the sharpness.
【００１９】さらに、各列の各砥粒２が他の列の砥粒２
と基板周方向にみて一部が重なり合うように配設してい
る。この重なり合う幅Ｌは０．１０ｍｍ（砥粒平均粒径
の約１／４）である。砥粒２どうしが基板周方向にみて
一部が重なり合うように配設することで、切断加工時に
砥粒２が絶え間なく連続的に被切断材に接触するので、
ホイール１０の振動が少なくなり、切断面のチッピング
も小さくなる。Furthermore, each abrasive grain 2 of each row is the abrasive grain 2 of another row.
And the substrate are arranged so as to partially overlap each other when viewed in the circumferential direction. The overlapping width L is 0.10 mm (about 1/4 of the average grain size of abrasive grains). By disposing the abrasive grains 2 so as to partially overlap each other when viewed in the circumferential direction of the substrate, the abrasive grains 2 continuously contact the material to be cut continuously during the cutting process.
Vibration of the wheel 10 is reduced and chipping of the cut surface is reduced.
【００２０】図３は本発明の第２の実施形態の切断ホイ
ールを説明する図であり、図３の（ａ）は基板外周部の
拡大断面図、（ｂ）は基板の外周面の基板周方向にみた
一部の展開図である。図中、砥粒および砥粒の配置は模
式的に示している。3A and 3B are views for explaining a cutting wheel according to a second embodiment of the present invention. FIG. 3A is an enlarged sectional view of the outer peripheral portion of the substrate, and FIG. 3B is a peripheral portion of the outer peripheral surface of the substrate. It is a partial development view seen in the direction. In the figure, the abrasive grains and the arrangement of the abrasive grains are schematically shown.
【００２１】本実施形態の切断ホイールも第１実施形態
の切断ホイールと同様なコンクリートやセメント系建材
などの切断用のホイールである。基板２１の外径、厚
さ、材質、砥粒およびろう材も第１実施形態の切断ホイ
ールと同じである。The cutting wheel of this embodiment is also the same as the cutting wheel of the first embodiment, for cutting concrete or cement-based building materials. The outer diameter, thickness, material, abrasive grains, and brazing material of the substrate 21 are also the same as those of the cutting wheel of the first embodiment.
【００２２】基板２１の外周部は図３の（ａ）に示すよ
うに、外周面１ａと外周部側面１ｂの境界である稜部に
面取りを施して平面とした面取り部１ｃを形成してい
る。面取り部１ｃの幅ｗは砥粒粒径ｄの約１．７倍と
し、傾斜角θは約３５度としている。このように、基板
１外周の稜部を面取りした面取り部１ｃに砥粒２を配設
したことにより、面取り部１ｃに配設した砥粒２はろう
材３による保持力が増大されて脱落しにくくなる。As shown in FIG. 3A, the outer peripheral portion of the substrate 21 has a chamfered portion 1c which is a flat surface by chamfering a ridge which is a boundary between the outer peripheral surface 1a and the outer peripheral side surface 1b. . The width w of the chamfered portion 1c is about 1.7 times the abrasive grain size d, and the inclination angle θ is about 35 degrees. By disposing the abrasive grains 2 in the chamfered portion 1c in which the ridge of the outer periphery of the substrate 1 is chamfered in this manner, the abrasive grains 2 disposed in the chamfered portion 1c increase in the holding force of the brazing material 3 and fall off. It gets harder.
【００２３】また、砥粒２を配設した外周面１ａと面取
り部１ｃを基板周方向に展開した状態で基板周方向に３
列となるように配設した砥粒２が基板厚さ方向に揃うこ
とのないように、図３の（ｂ）に示すように砥粒２を斜
めに配置している。さらに、第１実施形態の場合と同様
に、各列の各砥粒２が他の列の砥粒２と重なり幅Ｌをも
って重なり合うように配設している。なお、外周部側面
１ｂの砥粒の配設は第１実施形態の場合と同様である。Further, with the outer peripheral surface 1a having the abrasive grains 2 and the chamfered portion 1c unfolded in the peripheral direction of the substrate, the peripheral surface 3a is moved in the peripheral direction of the substrate.
The abrasive grains 2 are obliquely arranged as shown in FIG. 3B so that the abrasive grains 2 arranged in rows are not aligned in the substrate thickness direction. Further, as in the case of the first embodiment, the abrasive grains 2 in each row are arranged so as to overlap with the abrasive grains 2 in another row with an overlapping width L. The arrangement of abrasive grains on the outer peripheral surface 1b is the same as in the first embodiment.
【００２４】図４は本発明の第３の実施形態の切断ホイ
ールを説明する図であり、基板の外周部側面の基板周方
向にみた一部の展開図である。図中、砥粒および砥粒の
配置は模式的に示している。FIG. 4 is a view for explaining a cutting wheel according to a third embodiment of the present invention, and is a developed view of a part of the side surface of the outer peripheral portion of the substrate viewed in the substrate circumferential direction. In the figure, the abrasive grains and the arrangement of the abrasive grains are schematically shown.
【００２５】本実施形態の切断ホイールは、第１実施形
態の切断ホイールの基板外周部側面に配設した砥粒群の
配設形態をさらに改良したものである。基板１の外周部
側面１ｂに２列配設した砥粒群２ａの基板周方向にみた
一定間隔ごとに、３列の砥粒を基板中心方向に向けて配
設した砥粒群２ｂおよび２ｃを設けたものである。この
ように外周部側面１ｂの砥粒群２ａの一部を基板中心方
向に向けて延長することにより、加工時の基板胴当たり
が生じるのを防止することができる。The cutting wheel of this embodiment is obtained by further improving the arrangement of the abrasive grains arranged on the side surface of the outer peripheral portion of the substrate of the cutting wheel of the first embodiment. Abrasive grain groups 2b and 2c in which three rows of abrasive grains are arranged toward the center of the substrate are provided at regular intervals of the abrasive grain group 2a arranged in two rows on the outer peripheral side surface 1b of the substrate 1 as viewed in the substrate circumferential direction. It is provided. By extending a part of the abrasive grain group 2a on the outer peripheral surface 1b toward the center of the substrate in this way, it is possible to prevent the occurrence of a substrate cylinder contact during processing.
【００２６】第１の実施形態の切断ホイール１０の製造
手順はつぎの通りである。
・基板１として外径１００ｍｍ、厚さ１．２ｍｍのスチ
ール製基板を準備する。
・砥粒２として平均粒径約３５０μｍのダイヤモンド砥
粒を準備する。
・直径０．３５ｍｍの孔を図２の（ｂ）および（ｃ）に
示すかたちに配列したスクリーンを用いて、基板１の外
周部に有機接着剤を塗布する。
・この有機接着剤の上に砥粒２を配置する。この状態で
砥粒２は基板１の外周部に図２の（ｂ）および（ｃ）に
示すかたちに配列される。
・これを乾燥炉中で１２０℃、１時間乾燥させ、砥粒を
仮固定する。
・三次元移動が可能なアプリケータ（吐出機）を用い
て、接着部にろう材とバインダーの混合物を砥粒粒径の
約１／２の高さに塗布する。
・これを非酸化性雰囲気中で１０００℃、１時間加熱
し、砥粒を台金に本固定する。第２の実施形態の切断ホ
イールの製造手順も、基板の面取り部に関する点を除け
ば第１の実施形態の切断ホイールと同様である。The manufacturing procedure of the cutting wheel 10 of the first embodiment is as follows. As the substrate 1, a steel substrate having an outer diameter of 100 mm and a thickness of 1.2 mm is prepared. As the abrasive grain 2, a diamond abrasive grain having an average particle size of about 350 μm is prepared. -Using a screen in which holes having a diameter of 0.35 mm are arranged in the shapes shown in FIGS. 2B and 2C, the organic adhesive is applied to the outer peripheral portion of the substrate 1. -Place the abrasive grains 2 on this organic adhesive. In this state, the abrasive grains 2 are arranged on the outer peripheral portion of the substrate 1 in the shapes shown in FIGS. 2B and 2C. -This is dried in a drying furnace at 120 ° C for 1 hour to temporarily fix the abrasive grains. -Using a three-dimensionally movable applicator (discharging machine), a mixture of a brazing material and a binder is applied to the bonding portion at a height of about 1/2 of the abrasive grain size. -This is heated in a non-oxidizing atmosphere at 1000 ° C for 1 hour to permanently fix the abrasive grains to the base metal. The manufacturing procedure of the cutting wheel of the second embodiment is the same as that of the cutting wheel of the first embodiment, except for the chamfered portion of the substrate.
【００２７】〔試験例〕図２に示した第１実施形態の切
断ホイール（発明品１）と図３に示した第２実施形態の
切断ホイール（発明品２）、および、第１実施形態の基
板と同じ形状で複数列の砥粒どうしが基板周方向にみて
互いに重なり合っていない砥粒配置の切断ホイール（比
較品）を製造して切断加工試験を行った。[Test Example] The cutting wheel (invention 1) of the first embodiment shown in FIG. 2, the cutting wheel (invention 2) of the second embodiment shown in FIG. 3, and the cutting wheel of the first embodiment. A cutting wheel (comparative product) having the same shape as the substrate and having a plurality of rows of abrasive grains not overlapping each other when viewed in the circumferential direction of the substrate was manufactured and a cutting test was conducted.
【００２８】〔試験条件〕 切断機械 ：日立製丸のこ Ｃ４ＹＡ１ 機械回転数：１３０００ｍｉｎ−１ 被切断材 ：押し出し成形セメント板 切り込み量：１５ｍｍ／ｐａｓｓ 切断方式 ：乾式切断 送り速度 ：負荷電流８Ａになるよう調節[Test conditions] Cutting machine: Hitachi circular saw C4YA1 Machine rotation speed: 13000 min -1 Material to be cut: Extrusion molding cement board Depth of cut: 15 mm / pass Cutting method: Dry cutting Feed rate: 8 A of load current To adjust
【００２９】表１に試験結果を示す。Table 1 shows the test results.
【表１】 [Table 1]
【００３０】発明品１，２の切断速度、ホイール寿命お
よびホイール振動は、比較品の切断速度、ホイール寿命
およびホイール振動を１００としたときの指数で示す。
同表からわかるように、複数列に配設した砥粒が互いに
重なり合っていない比較品の切断ホイールに比べて、砥
粒の配列を改良した発明品１の切断ホイールは切断速度
は同程度、ホイール寿命は１．５倍程度向上し、さらに
基板外周の稜部に面取り部を形成した発明品２の切断ホ
イールは発明品１の切断ホイールよりもさらにホイール
寿命が向上している。また切断時の振動についても発明
品１，２の切断ホイールは比較品の切断ホイールに比べ
て半分程度となっている。The cutting speed, the wheel life and the wheel vibration of the invention products 1 and 2 are shown by indexes when the cutting speed, the wheel life and the wheel vibration of the comparative product are 100.
As can be seen from the table, the cutting wheel of the invention product 1 in which the arrangement of the abrasive grains is improved has the same cutting speed as the cutting wheel of the comparative product in which the abrasive grains arranged in a plurality of rows do not overlap each other. The life is improved by about 1.5 times, and the cutting wheel of the invention product 2 having the chamfered portion formed on the ridge of the outer periphery of the substrate has a further longer life than the cutting wheel of the invention product 1. Regarding the vibration at the time of cutting, the cutting wheels of the invention products 1 and 2 are about half of the cutting wheels of the comparative product.
【００３１】[0031]
【発明の効果】本発明によって以下の効果を奏する。The present invention has the following effects.
【００３２】（１）基板の外周面と外周部側面にそれぞ
れ基板周方向に複数列の砥粒を配設するとともに、各列
の各砥粒が他の列の砥粒のなかの少なくとも１個の砥粒
と基板周方向にみて一部が重なり合うように配設するこ
とで、切断加工時に砥粒が絶え間なく連続的に被切断材
に接触するので、ホイールの振動が少なくなり、切断面
のチッピングも小さくなる。また、基板外周の稜部を面
取りした面取り部に基板側面より突出するように砥粒を
配設し、外周面に配設した砥粒と合わせて基板周方向に
３列以上の砥粒を配設し、外周部側面には基板周方向に
複数列の砥粒を配設するとともに、各列の各砥粒が他の
列の砥粒のなかの少なくとも１個の砥粒と基板周方向に
みて一部が重なり合うように配設することで、面取り部
において砥粒の保持力が増大されて脱落しにくくなり、
前記と同様に切断加工時にホイールの振動が少なくな
り、切断面のチッピングも小さくなる。(1) A plurality of rows of abrasive grains are arranged on the outer peripheral surface and the side surface of the outer peripheral portion of the substrate in the circumferential direction of the substrate, and each abrasive grain in each row is at least one of the abrasive grains in the other row. By arranging so that a part of the abrasive grains and the substrate circumferential direction overlap with each other, the abrasive grains continuously contact the material to be cut continuously during the cutting process, so that the vibration of the wheel is reduced and the cutting surface Chipping is also small. In addition, abrasive grains are arranged on the chamfered portion of the outer circumference of the substrate so as to project from the side surface of the substrate, and three or more rows of abrasive grains are arranged in the circumferential direction of the substrate together with the abrasive grains arranged on the outer peripheral surface. A plurality of rows of abrasive grains are arranged on the outer peripheral side surface in the circumferential direction of the substrate, and each abrasive grain in each row is arranged in the circumferential direction of the substrate along with at least one abrasive grain in the other row. By arranging so that the parts overlap with each other, the holding force of the abrasive grains in the chamfered portion is increased and it becomes difficult for the abrasive particles to fall off.
Similar to the above, the vibration of the wheel during cutting is reduced and chipping of the cut surface is also reduced.
【００３３】（２）前記の各砥粒が他の砥粒と重なり合
う幅を、砥粒平均粒径の１／３以下とすることにより、
良好な切れ味を維持することができる。(2) By setting the width at which each of the above-mentioned abrasive grains overlaps with the other abrasive grains to 1/3 or less of the average grain size of the abrasive grains,
Good sharpness can be maintained.
【００３４】（３）基板の外周部側面に配設した砥粒群
の基板周方向にみた一定間隔ごとに、複数列の砥粒を基
板中心方向に向けて配設することにより、加工時の基板
胴当たりが生じるのを防止することができ、切断面のチ
ッピングも小さくなる。(3) By arranging a plurality of rows of abrasive grains toward the substrate center direction at regular intervals of the abrasive grain group arranged on the outer peripheral side surface of the substrate as viewed in the substrate circumferential direction, It is possible to prevent the substrate from hitting the cylinder, and reduce the chipping of the cut surface.
【図１】 本発明の第１の実施形態の切断ホイールを説
明する図であり、（ａ）は切断ホイールの正面図、
（ｂ）は（ａ）のＡ−Ａ線断面図である。FIG. 1 is a diagram illustrating a cutting wheel according to a first embodiment of the present invention, (a) is a front view of the cutting wheel,
(B) is the sectional view on the AA line of (a).
【図２】 図１の切断ホイールの部分拡大図であり、
（ａ）は基板外周部の拡大断面図、（ｂ）は基板の外周
面の基板周方向にみた一部の展開図、（ｃ）は基板の外
周部側面の基板周方向にみた一部の展開図である。2 is a partially enlarged view of the cutting wheel of FIG. 1,
(A) is an enlarged cross-sectional view of the outer peripheral portion of the substrate, (b) is a developed view of a part of the outer peripheral surface of the substrate seen in the substrate circumferential direction, and (c) is a partial developed view of the side face of the outer peripheral portion of the substrate seen in the substrate circumferential direction. FIG.
【図３】 本発明の第２の実施形態の切断ホイールを説
明する図であり、（ａ）は基板外周部の拡大断面図、
（ｂ）は基板の外周面の基板周方向にみた一部の展開図
である。FIG. 3 is a diagram illustrating a cutting wheel according to a second embodiment of the present invention, in which (a) is an enlarged cross-sectional view of a substrate outer peripheral portion,
(B) is a development view of a part of the outer peripheral surface of the substrate viewed in the substrate circumferential direction.
【図４】 本発明の第３の実施形態の切断ホイールを説
明する図であり、基板の外周部側面の基板周方向にみた
一部の展開図である。FIG. 4 is a diagram illustrating a cutting wheel according to a third embodiment of the present invention, and is a partially developed view of a side surface of an outer peripheral portion of the substrate viewed in a substrate circumferential direction.
１，２１ 基板 １ａ 外周面 １ｂ 外周部側面 １ｃ 面取り部 ２ 砥粒 ２ａ，２ｂ，２ｃ 砥粒群 ３ ろう材 １０ 切断ホイール １１ スリット ｄ 砥粒粒径 ｗ 面取り部の幅 ｕ 砥粒埋め込み量 θ 面取り部の傾斜角 Ｌ 重なり幅 1,21 substrate 1a outer peripheral surface 1b Outer side surface 1c Chamfer 2 abrasive grains 2a, 2b, 2c Abrasive grain group 3 brazing material 10 cutting wheels 11 slits d Abrasive grain size w Width of chamfer u Amount of abrasive grains embedded θ Angle of chamfer L overlap width
───────────────────────────────────────────────────── フロントページの続き (72)発明者 緒方 誠也 福岡県浮羽郡田主丸町大字竹野210番地 ノリタケダイヤ株式会社内 Ｆターム(参考） 3C063 AA02 AB03 BB02 BB15 BB23 BB24 BC02 BG01 BG07 CC09 EE16 EE31 FF22 FF30 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Seiya Ogata 210 Takeno, Odaiba, Ukiha-gun, Fukuoka Noritake Diamond Co., Ltd. F term (reference) 3C063 AA02 AB03 BB02 BB15 BB23 BB24 BC02 BG01 BG07 CC09 EE16 EE31 FF22 FF30
Claims (4)
配列してろう付けした切断ホイールであって、基板の外
周面と外周部側面にそれぞれ基板周方向に複数列の砥粒
を配設するとともに、各列の各砥粒が他の列の砥粒のな
かの少なくとも１個の砥粒と基板周方向にみて一部が重
なり合うように配設したことを特徴とする切断ホイー
ル。1. A cutting wheel in which a single layer of abrasive grains is arrayed and brazed on the outer peripheral surface and the outer peripheral surface of a substrate, wherein a plurality of rows of abrasive grains are provided on the outer peripheral surface and the outer peripheral surface of the substrate in the circumferential direction of the substrate. A cutting wheel, characterized in that each abrasive grain in each row is arranged so as to partially overlap with at least one abrasive grain in the other row in the circumferential direction of the substrate.
付けした切断ホイールであって、基板外周の稜部を面取
りした面取り部に基板側面より突出するように砥粒を配
設し、基板の外周面に配設した砥粒と合わせて基板周方
向に３列以上の砥粒を配設し、基板の外周部側面には基
板周方向に複数列の砥粒を配設するとともに、各列の各
砥粒が他の列の砥粒のなかの少なくとも１個の砥粒と基
板周方向にみて一部が重なり合うように配設したことを
特徴とする切断ホイール。2. A cutting wheel in which abrasive grains are arranged in a single layer on an outer peripheral portion of a substrate and brazed, wherein the chamfered portion where the ridge portion of the outer peripheral portion of the substrate is chamfered is provided with the abrasive grains protruding from the side surface of the substrate. , Three or more rows of abrasive grains are arranged in the circumferential direction of the substrate together with the abrasive grains arranged on the outer circumferential surface of the substrate, and a plurality of rows of abrasive grains are arranged in the circumferential direction of the substrate on the outer peripheral side surface of the substrate. The cutting wheel is characterized in that each abrasive grain in each row is arranged so as to partially overlap with at least one abrasive grain in the other rows in the circumferential direction of the substrate.
が、砥粒平均粒径の１／３以下である請求項１または２
記載の切断ホイール。3. The width in which each abrasive grain overlaps another abrasive grain is 1/3 or less of the average grain size of the abrasive grains.
Cutting wheel as described.
板周方向にみた一定間隔ごとに、複数列の砥粒を基板中
心方向に向けて配設した請求項１ないし３のいずれかに
記載の切断ホイール。4. A plurality of rows of abrasive grains are arranged toward the substrate center direction at regular intervals of the abrasive grain group arranged on the outer peripheral side surface of the substrate as viewed in the substrate circumferential direction. The cutting wheel described in Crab.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001373320A JP2003170359A (en) | 2001-12-06 | 2001-12-06 | Cutting wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001373320A JP2003170359A (en) | 2001-12-06 | 2001-12-06 | Cutting wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003170359A true JP2003170359A (en) | 2003-06-17 |
Family
ID=19182057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001373320A Pending JP2003170359A (en) | 2001-12-06 | 2001-12-06 | Cutting wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003170359A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009501637A (en) * | 2005-04-20 | 2009-01-22 | イーファ ダイアモンド インダストリアル カンパニー リミテッド | Diamond tool cutting insert and diamond tool |
-
2001
- 2001-12-06 JP JP2001373320A patent/JP2003170359A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009501637A (en) * | 2005-04-20 | 2009-01-22 | イーファ ダイアモンド インダストリアル カンパニー リミテッド | Diamond tool cutting insert and diamond tool |
| JP4860690B2 (en) * | 2005-04-20 | 2012-01-25 | イーファ ダイアモンド インダストリアル カンパニー リミテッド | Diamond tool cutting insert and diamond tool |
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|
| A02 | Decision of refusal |
Effective date: 20060725 Free format text: JAPANESE INTERMEDIATE CODE: A02 |