JP2003168824A - Led display and its manufacturing method - Google Patents

Led display and its manufacturing method

Info

Publication number
JP2003168824A
JP2003168824A JP2001366900A JP2001366900A JP2003168824A JP 2003168824 A JP2003168824 A JP 2003168824A JP 2001366900 A JP2001366900 A JP 2001366900A JP 2001366900 A JP2001366900 A JP 2001366900A JP 2003168824 A JP2003168824 A JP 2003168824A
Authority
JP
Japan
Prior art keywords
frame
light emitting
led display
emitting element
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001366900A
Other languages
Japanese (ja)
Inventor
正康 ▲よし▼浦
Masayasu Yoshiura
Takafumi Watanabe
孝文 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP2001366900A priority Critical patent/JP2003168824A/en
Publication of JP2003168824A publication Critical patent/JP2003168824A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED display in which an accurate position can be defined readily for an object being irradiated. <P>SOLUTION: An LED display comprising a light emitting element 4 emitting light in the direction Y parallel with the mounting face of the LED display is further provided with protruding spacers 8 and 8 for defining the distance between the light emitting element 4 and an object being irradiated in the light emitting direction. The protruding spacers 8 and 8 come into point contact with the object being irradiated thus defining the distance between the light emitting element and the object being irradiated. In an LED display employing an integrated molding of a frame and a resin molded package as a base, the electrode face of the frame projecting to the mounting face side of the resin molded package is bent reversely to the light emitting direction. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、実装面に対して平
行な方向に光を出射（実装方向に対して垂直な方向に光
を出射）する発光素子を備えたＬＥＤ表示器及びその製
造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display provided with a light emitting element that emits light in a direction parallel to a mounting surface (emits light in a direction perpendicular to the mounting direction) and a method for manufacturing the same. It is about.

【０００２】[0002]

【従来の技術】従来のＬＥＤ表示器１０１は、図１７お
よび図１８に示すように、インサートフレームと呼ばれ
るフレーム９８，９９と樹脂成形パッケージ１０３の一
体成形品を基台とし、そのフレーム９８上に発光素子１
０４を搭載している。2. Description of the Related Art A conventional LED display 101, as shown in FIGS. 17 and 18, has a frame 98, 99 called an insert frame and a resin molded package 103 integrally formed as a base, and is mounted on the frame 98. Light emitting element 1
It is equipped with 04.

【０００３】フレーム９８，９９のそれぞれ一部を埋設
した樹脂成形パッケージ１０３に凹所１００が設けられ
ており、この凹所１００内に露出したフレーム９８に発
光素子１０４（ＬＥＤ）の一端を固定接続し、他端をセ
カンドワイヤー１０５を介してフレーム９９に接続して
いる。凹所１００は、前方（Ｙ方向）に向けて拡大した
形状を成していて、発光素子１０４からの放射された光
をその壁面で反射して前方（Ｙ方向）へ出射する。ここ
で、凹所１００を形成する枠を反射枠１０６ということ
にする。また、ＬＥＤ表示器１０１としての出射面１０
３Ａは、反射枠１０６の前端面となっている。A recess 100 is provided in a resin molding package 103 in which a part of each of the frames 98 and 99 is embedded, and one end of a light emitting element 104 (LED) is fixedly connected to the frame 98 exposed in the recess 100. The other end is connected to the frame 99 via the second wire 105. The recess 100 has a shape enlarged toward the front (Y direction), and reflects the light emitted from the light emitting element 104 on its wall surface and emits the light toward the front (Y direction). Here, the frame forming the recess 100 will be referred to as a reflection frame 106. In addition, the emission surface 10 as the LED display 101
3A is the front end face of the reflection frame 106.

【０００４】前記フレーム９８，９９は凹所１００の底
部に存在するが、ＬＥＤ表示器１０１の全体から見る
と、出射面１０３Ａよりも遠い位置にある。それに伴
い、発光素子１０４も出射面１０３Ａよりも後方に位置
することになっている。したがって、発光素子１０４か
ら光の出射面１０３Ａまでの経路が長くなり、発光強度
のロスが多かった。Although the frames 98 and 99 are present at the bottom of the recess 100, they are farther from the emitting surface 103A when viewed from the LED display 101 as a whole. Accordingly, the light emitting element 104 is also positioned behind the emission surface 103A. Therefore, the path from the light emitting element 104 to the light emitting surface 103A becomes long, and the loss of light emission intensity is large.

【０００５】[0005]

【発明が解決しようとする課題】ＬＥＤ表示器１０１の
使用状態では、その出射面１０３Ａの前方には、照射対
象物としての導光板が配置されるのが一般的である。導
光板はＬＥＤ表示器１０１から出射された光を所望の位
置へ伝達する役目を果たす。その光伝達効率は、光源か
らの距離によって変わるので、発光素子１０４と導光板
との距離は、正確に規定されることが望ましい。ところ
で、従来のＬＥＤ表示器１０１は、導光板を出射面１０
３Ａに密着させ、面接触により、発光素子１０４と導光
板との距離を規定するようにしていた。そのため、ＬＥ
Ｄ表示器１０１の出射面１０３Ａの平面性が均一でない
と、精度よく距離を合わすことができないという問題が
あった。When the LED display 101 is in use, a light guide plate as an irradiation object is generally arranged in front of the emission surface 103A. The light guide plate serves to transmit the light emitted from the LED display 101 to a desired position. Since the light transmission efficiency changes depending on the distance from the light source, it is desirable that the distance between the light emitting element 104 and the light guide plate be accurately defined. By the way, in the conventional LED display 101, the light guide plate is provided on the emitting surface 10.
The distance between the light emitting element 104 and the light guide plate is regulated by the surface contact with 3A. Therefore, LE
If the flatness of the emission surface 103A of the D display 101 is not uniform, there is a problem that the distances cannot be adjusted accurately.

【０００６】図１７（ｃ）において、１０９は、樹脂成
形パッケージ１０３の実装面１０３Ｂと反対側の面（対
向する面）１０３Ｃに形成されたマウンターコレット用
の極性表示部である。この極性表示部１０９は、出射面
１０３Ａ側から見ると、図１７（ｂ）のように、出射面
１０３Ａのコーナーに位置する三角形の極性表示マーク
１１０となっている。したがって、面１０３Ｃ側からは
極性表示部１０９を見ることにより、出射面１０３Ａ側
からは極性表示マーク１１０を見ることにより、フレー
ム９８，９９の極性を確認できるようになっている。し
かし、ＬＥＤ表示器１０１の基板等への実装作業におい
ては、極性表示部１０９は面１０３Ｃのほぼ中央に配置
される方が見やすく、極性表示マーク１１０も面１０３
Ｃ側にある方が作業後の見栄えがよい。In FIG. 17 (c), reference numeral 109 denotes a mounter collet polarity display portion formed on a surface (opposing surface) 103C opposite to the mounting surface 103B of the resin molded package 103. The polarity display portion 109 has a triangular polarity display mark 110 located at a corner of the emission surface 103A as shown in FIG. 17B when viewed from the emission surface 103A side. Therefore, the polarities of the frames 98 and 99 can be confirmed by viewing the polarity display portion 109 from the surface 103C side and viewing the polarity display mark 110 from the emission surface 103A side. However, in the mounting work of the LED display 101 on the substrate or the like, it is easier to see the polarity display portion 109 in the approximate center of the surface 103C, and the polarity display mark 110 also has the surface 103.
The one on the C side looks better after work.

【０００７】フレーム９８，９９の下部を成す電極面９
８Ｂ，９９Ｂは、樹脂成形パッケージ１０３の実装面１
０３Ｂに露出しており、この実装面１０３Ｂに沿って折
り曲げられた形状をしている。その折り曲げの方向は、
図１７（ｄ）のように、光の出射方向Ｙと同じ向きであ
る。そのため、電極面９８Ｂ，９９Ｂと発光素子１０４
との距離が短くなる。したがって、半田付けによる実装
の際、熱源と発光素子１０４の位置が近くなり、発光素
子１０４が熱的な負荷を多く受けるという問題があっ
た。Electrode surface 9 forming the lower part of the frames 98, 99
8B and 99B are the mounting surface 1 of the resin molding package 103.
It is exposed at 03B and has a shape bent along the mounting surface 103B. The direction of the bend is
As shown in FIG. 17D, the direction is the same as the light emission direction Y. Therefore, the electrode surfaces 98B and 99B and the light emitting element 104
The distance between and becomes shorter. Therefore, when mounting by soldering, there is a problem that the heat source and the light emitting element 104 are close to each other, and the light emitting element 104 receives a large thermal load.

【０００８】また、従来、発光素子１０４から放射され
た青色光を白色光に変換して取り出す場合、色変換用の
蛍光体を発光素子１０４に直接塗布することが一般的で
あった。しかし、この方法では、蛍光体の濃度やムラが
白色化の精度に与える影響が大きく、特性維持のための
制御が困難であった。また、余分の蛍光体が発光素子１
０４近傍の反射枠１０６の壁面に付着し、反射枠１０６
の反射効率をロスさせていた。Further, conventionally, when the blue light emitted from the light emitting element 104 is converted into white light to be extracted, it is common to directly apply a phosphor for color conversion to the light emitting element 104. However, in this method, the density and unevenness of the phosphor have a great influence on the accuracy of whitening, and it is difficult to control for maintaining the characteristics. In addition, the extra phosphor is the light emitting element 1.
04 attached to the wall surface of the reflection frame 106,
Had a loss of reflection efficiency.

【０００９】本発明は、上記従来の課題を解決するため
になされたものであり、照射対象物に対する正確な位置
を容易に規定できるＬＥＤ表示器を提供することを目的
とする。また、本発明は、発光強度のロスの少ないＬＥ
Ｄ表示器を提供することを目的とする。また、本発明
は、ＬＥＤ表示器の実装時、フレームの極性を上方から
容易に確認できるＬＥＤ表示器を提供することを目的と
する。また、本発明は、ＬＥＤ表示器の実装時、発光素
子の受ける熱負荷の少ないＬＥＤ表示器を提供すること
を目的とする。さらに本発明は、発光素子の前方にムラ
なく色変換用の蛍光体層を形成できるＬＥＤ表示器の製
造方法を提供することを目的とする。The present invention has been made in order to solve the above-mentioned conventional problems, and an object thereof is to provide an LED display capable of easily defining an accurate position with respect to an irradiation object. In addition, the present invention is an LE with little loss of emission intensity.
It is intended to provide a D display. It is another object of the present invention to provide an LED display device that allows the polarity of the frame to be easily confirmed from above when the LED display device is mounted. Another object of the present invention is to provide an LED display device in which a light load on the light emitting element is small when the LED display device is mounted. A further object of the present invention is to provide a method for manufacturing an LED display in which a phosphor layer for color conversion can be uniformly formed in front of a light emitting element.

【００１０】[0010]

【課題を解決するための手段】上記の課題を解決するた
め本発明では、実装面に対し、平行な方向に光を出射す
る発光素子を備えたＬＥＤ表示器において、光の出射方
向に前記発光素子と照射対象物との距離を規定する突起
形状のスペーサを設けたことを特徴としている。これに
より、照射対象物をスペーサの先端に突き当て、複数の
点で両者を接触させることにより、発光素子と照射対象
物との距離を精度よく規定できる。In order to solve the above-mentioned problems, according to the present invention, in an LED display provided with a light emitting element that emits light in a direction parallel to a mounting surface, the light emission is performed in the light emission direction. It is characterized in that a protrusion-shaped spacer that defines the distance between the element and the irradiation object is provided. Thereby, the distance between the light emitting element and the irradiation target can be accurately defined by abutting the irradiation target on the tip of the spacer and bringing them into contact with each other at a plurality of points.

【００１１】また、フレームと樹脂成形パッケージの一
体成形品を基台とするＬＥＤ表示器において、前記樹脂
成形パッケージの実装面側に突出する前記フレームの電
極面は、前記光の出射方向とは逆方向に折り曲げられて
いることを特徴としている。したがって、電極面に半田
付けしてＬＥＤ表示器を実装するにあたり、熱源と発光
素子の距離が遠くなり、熱的な負荷を抑制することがで
きる。Further, in the LED display based on the integrally molded product of the frame and the resin molded package, the electrode surface of the frame projecting to the mounting surface side of the resin molded package is opposite to the light emitting direction. It is characterized by being bent in the direction. Therefore, when the LED display is mounted by soldering on the electrode surface, the distance between the heat source and the light emitting element becomes large, and the thermal load can be suppressed.

【００１２】また、実装方向に対し、垂直な方向に光を
出射する発光素子を備え、前記発光素子の搭載されるフ
レームと樹脂成形パッケージの一体成形品を基台とする
ＬＥＤ表示器において、前記樹脂成形パッケージの光の
出射面からの奥行き方向に関して、光の出射面に近い位
置に前記発光素子を搭載したことを特徴としている。こ
れにより、発光素子から光の出射面までの距離が短縮さ
れ、発光強度のロスを少なくすることができる。In addition, in the LED display, which is provided with a light emitting element which emits light in a direction perpendicular to the mounting direction, and which is based on an integrally molded product of a frame on which the light emitting element is mounted and a resin molded package, The light emitting element is characterized in that the light emitting element is mounted at a position close to the light emitting surface in the depth direction from the light emitting surface of the resin molded package. As a result, the distance from the light emitting element to the light emission surface is shortened, and the loss of light emission intensity can be reduced.

【００１３】また、フレームと樹脂成形パッケージの一
体成形品を基台とするＬＥＤ表示器において、前記樹脂
成形パッケージの実装面と対向する面に平坦部を設け、
該平坦部の形状の対称性を崩すことにより、該平坦部を
電極の極性の視認に利用できるようにしたことを特徴と
している。したがって、ＬＥＤ表示器の実装時に、実装
面の下に隠れた一対の電極面の極性を上方から容易に確
認できる。Further, in an LED display based on an integrally molded product of a frame and a resin molded package, a flat portion is provided on a surface facing the mounting surface of the resin molded package,
By breaking the symmetry of the shape of the flat portion, the flat portion can be used for visual recognition of the polarities of the electrodes. Therefore, when the LED display is mounted, the polarities of the pair of electrode surfaces hidden under the mounting surface can be easily confirmed from above.

【００１４】また、フレームと樹脂成形パッケージの一
体成形品を基台とし、前記フレーム上から前記樹脂成形
パッケージの光の出射面側にかけて所定の深さで形成さ
れた反射枠と、この反射枠内の前記フレーム上に搭載さ
れＬＥＤ表示器の実装方向に対し、垂直な方向に光を出
射する発光素子と、該発光素子の前面の前方に形成され
た色変換用の蛍光体層とを有するＬＥＤ表示器におい
て、前記反射枠と前記蛍光体層との間に蛍光体を含まな
い樹脂が介在していることを特徴としている。これによ
ると、発光素子の前面側にムラなく蛍光体層を形成でき
る。Further, a reflection frame formed with a predetermined depth from the frame to the light emitting surface side of the resin molded package on the basis of an integrally molded product of the frame and the resin molded package, and the inside of this reflection frame An LED having a light emitting element mounted on the frame, which emits light in a direction perpendicular to the mounting direction of the LED display, and a phosphor layer for color conversion formed in front of the front surface of the light emitting element. The display device is characterized in that a resin containing no phosphor is interposed between the reflection frame and the phosphor layer. According to this, the phosphor layer can be uniformly formed on the front surface side of the light emitting element.

【００１５】この場合、前記反射枠内に該反射枠の容量
よりも多い量の透明樹脂を注入し、表面張力によりレン
ズ形状に盛り上げ硬化させた後、この硬化透明樹脂の表
面に蛍光体を塗布することにより、前記反射枠の深さよ
りも高い位置で、かつ前記発光素子よりも前方にムラな
く蛍光体層を配置することができる。また、蛍光体が反
射枠の壁面に付着することがないため、反射枠の反射効
率が悪くなるのを防止できる。また、一定量、一定範
囲、一定厚みの蛍光体を配置できるので、安定した色変
換特性が得られる。In this case, a transparent resin in an amount larger than the capacity of the reflective frame is injected into the reflective frame, and the resin is lifted into a lens shape by surface tension and cured, and then a phosphor is applied to the surface of the cured transparent resin. By doing so, the phosphor layer can be arranged at a position higher than the depth of the reflection frame and in front of the light emitting element without any unevenness. Further, since the phosphor does not adhere to the wall surface of the reflection frame, it is possible to prevent the reflection efficiency of the reflection frame from being deteriorated. Further, since the phosphors having a constant amount, a constant range, and a constant thickness can be arranged, stable color conversion characteristics can be obtained.

【００１６】あるいは、前記反射枠内に該反射枠の容量
よりも多い量の沈降性蛍光体を含む透明樹脂を注入し、
表面張力によりレンズ形状に盛り上げた後、基台を上下
反転させ、前記沈降性蛍光体を前記透明樹脂中で沈降さ
せるとともに、この透明樹脂を硬化させてもよい。Alternatively, a transparent resin containing a precipitating phosphor in an amount larger than the capacity of the reflecting frame is injected into the reflecting frame,
After being raised into a lens shape by surface tension, the base may be turned upside down to settle the precipitating phosphor in the transparent resin and cure the transparent resin.

【００１７】あるいは、前記前記樹脂成形パッケージの
光の出射面の全面に沈降性蛍光体を含む透明樹脂を注入
し、該透明樹脂の硬化途上に基台を上下反転させ、前記
沈降性蛍光体を前記透明樹脂中で沈降させるとともに、
この透明樹脂を硬化させてもよい。Alternatively, a transparent resin containing a precipitating phosphor is injected onto the entire light emitting surface of the resin molded package, and the base is turned upside down while the transparent resin is being cured, so that the precipitating phosphor is removed. While settling in the transparent resin,
This transparent resin may be cured.

【００１８】あるいは、前記反射枠内に該反射枠の容量
よりも多い量の透明樹脂を注入し、表面張力によりレン
ズ形状に盛り上げ硬化させた後、さらにその上に沈降性
蛍光体を含む透明樹脂を注入し、前記沈降性蛍光体を前
記透明樹脂中で沈降させるとともに、この透明樹脂を硬
化させてもよい。Alternatively, after injecting a transparent resin in an amount larger than the capacity of the reflecting frame into the reflecting frame and raising it into a lens shape by surface tension and curing it, a transparent resin further containing a precipitating phosphor is formed thereon. May be injected to settle the sedimentary phosphor in the transparent resin, and the transparent resin may be cured.

【００１９】なお、前記反射枠の深さを前記発光素子の
高さとほぼ等しくすることにより、発光素子と蛍光体を
極力近づけることができる。By making the depth of the reflecting frame substantially equal to the height of the light emitting element, the light emitting element and the phosphor can be brought as close as possible.

【００２０】[0020]

【発明の実施の形態】本発明の第１の実施形態について
説明する。図１は、本発明の第１の実施形態に係るＬＥ
Ｄ表示器の外観を各方向から見た図であり、図２は、図
１（ａ）のＡ−Ａ線に沿った階段断面図であり、そし
て、図１３は、そのＬＥＤ表示器の斜視図である。BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described. FIG. 1 is an LE according to a first embodiment of the present invention.
It is the figure which looked at the external appearance of D display from each direction, Drawing 2 is a stairs sectional view along the AA line of Drawing 1 (a), and Drawing 13 is a perspective view of the LED display. It is a figure.

【００２１】ＬＥＤ表示器１は、アノードフレーム２
１、カソードフレーム２２と樹脂成形パッケージ３の一
体成形品を基台としている。樹脂成形パッケージ３は、
ほぼ直方体形状に成形されている。このＬＥＤ表示器１
は、矢印Ｘで示す実装方向に対し、垂直な方向（Ｙ方
向）に光を出射する。このＬＥＤ表示器１は、その底部
の実装面が、基板等の被実装面へ実装され、この実装面
に対して平行な方向（Ｙ方向）に光を出射する。The LED display 1 comprises an anode frame 2
1. The integrally formed product of the cathode frame 22 and the resin molded package 3 is used as a base. The resin molding package 3 is
It is formed into a substantially rectangular parallelepiped shape. This LED display 1
Emits light in a direction (Y direction) perpendicular to the mounting direction indicated by arrow X. The mounting surface of the bottom of the LED display 1 is mounted on a mounting surface such as a substrate and emits light in a direction (Y direction) parallel to the mounting surface.

【００２２】アノードフレーム２１およびカソードフレ
ーム２２のそれぞれ一部を埋設した樹脂成形パッケージ
３に凹所１００が設けられており、この凹所１００内に
露出したアノードフレーム２１に発光素子４（ＬＥＤ）
の一端（アノード）を固定接続し、他端（カソード）を
セカンドワイヤー５を介してカソードフレーム２２に接
続している。凹所１００は、前方（Ｙ方向）に向けて拡
大した形状を成していて、発光素子４からの放射された
光をその壁面で反射しながら前方（Ｙ方向）へ出射す
る。ここで、凹所１００を形成する枠を反射枠６という
ことにする。また、ＬＥＤ表示器１としての出射面３Ａ
は、反射枠６の前端面となっている。A recess 100 is provided in a resin molding package 3 in which a part of each of the anode frame 21 and the cathode frame 22 is buried. The anode frame 21 exposed in the recess 100 has a light emitting element 4 (LED).
One end (anode) is fixedly connected, and the other end (cathode) is connected to the cathode frame 22 via the second wire 5. The recess 100 has a shape enlarged toward the front (the Y direction), and emits the light emitted from the light emitting element 4 to the front (the Y direction) while reflecting the light emitted from the wall surface. Here, the frame forming the recess 100 will be referred to as the reflection frame 6. In addition, the emission surface 3A as the LED display 1
Is the front end face of the reflection frame 6.

【００２３】図１４は、アノードフレーム２１およびカ
ソードフレーム２２の斜視図である。アノードフレーム
２１は、発光素子４の搭載される発光素子搭載面２１Ａ
と、この発光素子搭載面２１Ａから樹脂成形パッケージ
３の実装面３Ｂに沿って直角に折り曲げられてできる電
極面２１Ｂと、この電極面２１Ｂからさらに直角に折り
返されてできる幅規定面２１Ｃ（図１（ｂ）参照）とを
有している。一方、カソードフレーム２２は、アノード
フレーム２１と左右対称（線対称）な形状をしており、
発光素子搭載面２１Ａに対応する面は、セカンドワイヤ
ー５がワイヤーボンドされるワイヤーボンド面２２Ａと
なっている。FIG. 14 is a perspective view of the anode frame 21 and the cathode frame 22. The anode frame 21 is a light emitting element mounting surface 21A on which the light emitting element 4 is mounted.
The electrode surface 21B formed by bending the light emitting element mounting surface 21A along the mounting surface 3B of the resin molded package 3 at a right angle, and the width defining surface 21C formed by bending the electrode surface 21B at a right angle (see FIG. 1). (See (b)). On the other hand, the cathode frame 22 has a symmetrical shape (axisymmetric) with the anode frame 21,
The surface corresponding to the light emitting element mounting surface 21A is a wire bonding surface 22A to which the second wire 5 is wire bonded.

【００２４】樹脂成形パッケージ３には、アノードフレ
ーム２１の発光素子搭載面２１Ａとカソードフレーム２
２のワイヤボンド面２２Ａの面上から光の出射面３Ａ側
にかけて所定の深さｄ（図２参照）で反射枠６が形成さ
れている。この反射枠６の深さ（したがって凹所１００
の深さ）ｄは、発光素子４の高さｈとほぼ等しい寸法に
選ばれている。The resin molded package 3 includes a light emitting element mounting surface 21 A of the anode frame 21 and the cathode frame 2.
The reflection frame 6 is formed at a predetermined depth d (see FIG. 2) from the surface of the second wire bond surface 22A to the light emission surface 3A side. The depth of this reflection frame 6 (hence the recess 100
Depth d) is selected to be approximately equal to the height h of the light emitting element 4.

【００２５】尚、厚さ制限が緩やかな場合は、この反射
枠６の深さｄは、発光素子４の高さｈよりも大きな寸法
に選ばれる。また、厚さ制限が厳しい場合は、この反射
枠６の深さｄは、発光素子４の高さｈよりも小さな寸法
に選ばれる。When the thickness limitation is loose, the depth d of the reflecting frame 6 is selected to be larger than the height h of the light emitting element 4. When the thickness limitation is severe, the depth d of the reflection frame 6 is selected to be smaller than the height h of the light emitting element 4.

【００２６】さらに反射枠６は、樹脂成形パッケージ３
と一体成形された仕切壁７により凹所１００を２つに仕
切るようになっている。ここで、仕切壁７は、発光素子
４の側面に平行ではなく、仕切られた２つの凹所１００
が前方に拡大するように、傾斜を有している。したがっ
て、発光素子４から放射された光は、仕切壁７によって
も反射されることになる。しかも、発光素子４から比較
的近い位置に仕切壁７による反射面が形成されることに
なるため、仕切壁７がない場合に比べて反射効率が向上
する。Further, the reflection frame 6 is formed by the resin molding package 3
The recess 100 is divided into two parts by a partition wall 7 integrally formed with. Here, the partition wall 7 is not parallel to the side surface of the light emitting element 4 and is divided into two recesses 100.
Has an inclination so that it expands forward. Therefore, the light emitted from the light emitting element 4 is also reflected by the partition wall 7. Moreover, since the reflecting surface by the partition wall 7 is formed at a position relatively close to the light emitting element 4, the reflection efficiency is improved as compared with the case where the partition wall 7 is not provided.

【００２７】ここで、アノードフレーム２１とカソード
フレーム２２の電極面２１Ｂ，２２Ｂの上記折り曲げ方
向は、いずれも光の出射方向Ｙとは逆である。したがっ
て、ＬＥＤ表示器１の実装にあたり、電極面２１Ｂ，２
２Ｂに半田付けをしても、熱源と発光素子４との距離が
遠いため、発光素子４に加わる熱的な負荷を抑制するこ
とができる。The bending directions of the electrode surfaces 21B and 22B of the anode frame 21 and the cathode frame 22 are opposite to the light emission direction Y. Therefore, when mounting the LED display 1, the electrode surfaces 21B, 2
Even when soldering to 2B, since the distance between the heat source and the light emitting element 4 is long, the thermal load applied to the light emitting element 4 can be suppressed.

【００２８】アノードフレーム２１，カソードフレーム
２２は凹所１００の底部に存在するが、ＬＥＤ表示器１
の全体から見ると、出射面３Ａに近い位置にある。それ
に伴い、発光素子１０４も出射面１０３Ａに近い前方に
位置することになる。これにより、発光素子４から光の
出射面３Ａまでの経路が短縮される。したがって、発光
強度のロスを少なくすることができる。Although the anode frame 21 and the cathode frame 22 are present at the bottom of the recess 100, the LED display 1
Seen from the whole, it is in a position close to the emission surface 3A. Along with this, the light emitting element 104 is also positioned in front of the emission surface 103A. As a result, the path from the light emitting element 4 to the light emission surface 3A is shortened. Therefore, the loss of light emission intensity can be reduced.

【００２９】樹脂成形パッケージ３の光の出射面３Ａの
両端には、発光素子４と導光板（図示せず）との距離を
規定する半円形状の一対のスペーサ８が凸設されてい
る。各スペーサ８は、その前方に設けられる導光板と点
接触することになり、導光板と出射面３Ａとの面接触を
利用する場合に比べ、樹脂成形時の寸法の誤差やばらつ
きの影響を少なくすることができる。したがって、発光
素子４から導光板までの距離が精度よく規定でき、導光
板の光伝達効率を高めることができる。また、出射面３
Ａ側にはレンズ形状の透明樹脂層が形成されることもあ
るが、スペーサ８は、この透明樹脂層を保護する役目も
果たす。A pair of semicircular spacers 8 that define the distance between the light emitting element 4 and the light guide plate (not shown) are provided at both ends of the light emitting surface 3A of the resin molded package 3. Each spacer 8 comes into point contact with the light guide plate provided in front of it, and is less affected by dimensional errors and variations during resin molding as compared with the case where surface contact between the light guide plate and the emission surface 3A is used. can do. Therefore, the distance from the light emitting element 4 to the light guide plate can be accurately defined, and the light transmission efficiency of the light guide plate can be increased. In addition, the exit surface 3
Although a lens-shaped transparent resin layer may be formed on the A side, the spacer 8 also serves to protect this transparent resin layer.

【００３０】また、樹脂成形パッケージ３の実装面３Ｂ
と対向する面３Ｃのほぼ中央には、コレット（組立装置
の素子吸着ノズル部分）用の矩形の平坦部９を設けてい
る。この平坦部９の形状は非対称であり、アノードフレ
ーム２１側の辺は斜辺１０となっている。したがって、
ＬＥＤ表示器１の実装時、実装面３Ｂの下に隠れたアノ
ードフレーム２１の電極面２１Ｂ又はカソードフレーム
２２の電極面２２Ｂの極性を上方から容易に目視あるい
は画像認識装置によって確認できる。The mounting surface 3B of the resin molding package 3
A rectangular flat portion 9 for a collet (element suction nozzle portion of the assembling device) is provided in the substantially center of the surface 3C facing the. The shape of the flat portion 9 is asymmetric, and the side on the anode frame 21 side is the oblique side 10. Therefore,
When the LED display 1 is mounted, the polarity of the electrode surface 21B of the anode frame 21 or the electrode surface 22B of the cathode frame 22 hidden under the mounting surface 3B can be easily visually confirmed from above or by an image recognition device.

【００３１】次に、本発明の第２の実施形態について説
明する。図３は、本発明の第２の実施形態に係るＬＥＤ
表示器の外観を正面（ｂ）と側面（ａ）から見た図であ
る。図４は、図３（ａ）のＢ−Ｂ線に沿った階段断面図
であり、そして、図１５は、本実施形態に係るＬＥＤ表
示器への色変換用の蛍光体層の形成方法を説明するため
の模式図である。これらの図において、上記第１の実施
形態と共通の部材には同一の符号を附し、その詳細な説
明を省略する。Next, a second embodiment of the present invention will be described. FIG. 3 shows an LED according to the second embodiment of the present invention.
It is the figure which looked at the external appearance of a display from the front (b) and the side (a). FIG. 4 is a stepwise sectional view taken along the line BB of FIG. 3A, and FIG. 15 shows a method of forming a phosphor layer for color conversion on the LED display according to the present embodiment. It is a schematic diagram for explaining. In these drawings, the same members as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

【００３２】図１５（ａ）のように、反射枠６内（した
がって凹所１００内）に該反射枠６の容量よりも多い量
の透明樹脂（蛍光体を含まない樹脂）１２を注入し、表
面張力によりレンズ形状に盛り上げ硬化させる。その
後、図１５（ｂ）のように、この硬化透明樹脂１２の表
面に蛍光体１１を塗布することにより、反射枠６の深さ
ｄよりも高い位置で、かつ発光素子４よりも前方にムラ
なく蛍光体１１の層を配置することができる。すなわ
ち、蛍光体１１の層と反射枠６の間に蛍光体を含まない
樹脂が介在することになる。As shown in FIG. 15 (a), a transparent resin (a resin not containing a phosphor) 12 which is larger than the capacity of the reflecting frame 6 is injected into the reflecting frame 6 (hence, in the recess 100), The surface tension builds up into a lens shape and cures. After that, as shown in FIG. 15B, by applying the phosphor 11 to the surface of the cured transparent resin 12, unevenness is provided at a position higher than the depth d of the reflection frame 6 and in front of the light emitting element 4. Instead, a layer of phosphor 11 can be arranged. That is, the resin containing no phosphor is interposed between the layer of the phosphor 11 and the reflection frame 6.

【００３３】したがって、蛍光体１１を直接発光素子４
に塗布する従来の手法に比べ、蛍光体１１の濃度やムラ
が色変換特性の精度に与える影響を小さくでき、特性維
持のための制御が容易になる。また、余分の蛍光体１１
が発光素子４近傍の反射枠６の壁面に付着することもな
いため、反射枠６の反射効率の向上が図られる。さら
に、反射枠の深さｄは、発光素子４の高さｈとほぼ等し
くしているので、発光素子４と蛍光体１１が近づき、色
変換効率がよいＬＥＤ表示器１を実現できる。Therefore, the phosphor 11 is directly connected to the light emitting element 4
As compared with the conventional method of applying the same to the above, the influence of the density and unevenness of the phosphor 11 on the accuracy of the color conversion characteristic can be reduced, and the control for maintaining the characteristic becomes easier. In addition, the extra phosphor 11
Does not adhere to the wall surface of the reflection frame 6 near the light emitting element 4, so that the reflection efficiency of the reflection frame 6 can be improved. Further, since the depth d of the reflection frame is set to be substantially equal to the height h of the light emitting element 4, the light emitting element 4 and the phosphor 11 are brought close to each other, and the LED display 1 having good color conversion efficiency can be realized.

【００３４】ここで、発光素子４は青色発光するもの
を、蛍光体１１は発光素子４の光を黄色系統の光に変換
するものを用いることにり、両方の光を混色させて白色
の光を取り出すことができるが、発光素子４の発光色や
蛍光体１１が発する光は、それ以外の組合わせのものと
することができる。これは、以下の実施形態でも同様で
ある。Here, the light-emitting element 4 uses a light source that emits blue light, and the phosphor 11 uses a light-emitting element 4 that converts the light of the light-emitting element 4 into a yellowish light. However, the emission color of the light emitting element 4 and the light emitted by the phosphor 11 may be other combinations. This also applies to the following embodiments.

【００３５】次に、本発明の第３の実施形態について説
明する。図５は、本発明の第３の実施形態に係るＬＥＤ
表示器の外観を正面（ｂ）と側面（ａ）から見た図であ
る。図６は、図５（ａ）のＤ−Ｄ線に沿った階段断面図
であり、そして、図１６は、本実施形態に係るＬＥＤ表
示器への色変換用の蛍光体層の形成方法を説明するため
の模式図である。これらの図において、上記第１の実施
形態と共通の部材には同一の符号を附し、その詳細な説
明を省略する。Next, a third embodiment of the present invention will be described. FIG. 5 shows an LED according to the third embodiment of the present invention.
It is the figure which looked at the external appearance of a display from the front (b) and the side (a). FIG. 6 is a staircase cross-sectional view taken along the line D-D of FIG. 5A, and FIG. 16 illustrates a method of forming a phosphor layer for color conversion on the LED display according to the present embodiment. It is a schematic diagram for explaining. In these drawings, the same members as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

【００３６】図１６（ａ）のように、反射枠６内に該反
射枠６の容量よりも多い量の沈降性蛍光体１１を含む透
明樹脂１２を注入し、表面張力によりレンズ形状に盛り
上げる。蛍光体１１は、その比重を硬化前の透明樹脂１
２の比重よりも大きく設定することにより、硬化前の樹
脂１２内でその自重で下に沈む沈降性のものを用いてい
る。As shown in FIG. 16A, the transparent resin 12 containing the precipitating phosphor 11 in an amount larger than the capacity of the reflecting frame 6 is injected into the reflecting frame 6 and is raised into a lens shape by surface tension. The phosphor 11 has a specific gravity of the transparent resin 1 before curing.
By setting the specific gravity to be larger than 2, a precipitating resin that sinks downward due to its own weight in the resin 12 before curing is used.

【００３７】その後、図１６（ｂ）のように、基台を上
下反転させ、沈降性蛍光体１１を透明樹脂１２中でその
自重によって沈降させるとともに、この透明樹脂１２を
硬化させると、透明樹脂１２の表面側に部分的に蛍光体
１１が形成される。このようにすると、反射枠６の深さ
ｄよりも高い位置で、かつ発光素子４よりも前方にムラ
なく蛍光体１１の層を位置させることができる。Thereafter, as shown in FIG. 16 (b), the base is turned upside down, and the settling phosphor 11 is settled in the transparent resin 12 by its own weight, and the transparent resin 12 is cured. The phosphor 11 is partially formed on the surface side of 12. By doing so, the layer of the phosphor 11 can be positioned at a position higher than the depth d of the reflection frame 6 and in front of the light emitting element 4 without unevenness.

【００３８】図７および図８は、本実施形態の変形例で
あり、発光素子４の前方に狭い範囲で蛍光体１１の層を
形成した例を示している。このように狭い範囲で蛍光体
１１の層を形成するには、仕切壁７で仕切られた２つ凹
所１００のうち、発光素子４の収納されている部分にの
み沈降性蛍光体１１を含む透明樹脂１２を注入すればよ
い。これによると、蛍光体１１や透明樹脂１２の使用量
が軽減されるため、コストダウンを図ることができる。FIG. 7 and FIG. 8 are modified examples of this embodiment and show an example in which a layer of the phosphor 11 is formed in a narrow area in front of the light emitting element 4. In order to form the layer of the phosphor 11 in such a narrow range, the settling phosphor 11 is included only in the portion where the light emitting element 4 is housed in the two recesses 100 partitioned by the partition wall 7. The transparent resin 12 may be injected. According to this, the usage amount of the phosphor 11 and the transparent resin 12 is reduced, so that the cost can be reduced.

【００３９】次に、本発明の第４の実施形態について説
明する。図９は、本発明の第４の実施形態に係るＬＥＤ
表示器の外観を正面（ｂ）と側面（ａ）から見た図であ
る。図１０は、図９（ａ）のＥ−Ｅ線に沿った階段断面
図である。これらの図において、上記第１の実施形態と
共通の部材には同一の符号を附し、その詳細な説明を省
略する。Next, a fourth embodiment of the present invention will be described. FIG. 9 shows an LED according to the fourth embodiment of the present invention.
It is the figure which looked at the external appearance of a display from the front (b) and the side (a). FIG. 10 is a step sectional view taken along the line EE of FIG. In these drawings, the same members as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

【００４０】反射枠６を含む光の出射面３Ａの全体に沈
降性蛍光体１１を含む透明樹脂１２を注入し、透明樹脂
１２の硬化途上に基台を上下反転させ、沈降性蛍光体１
１を透明樹脂１２中で沈降させるとともに、この透明樹
脂１２をさらに硬化させることにより、反射枠６の深さ
ｄよりも高い位置で、かつ発光素子４よりも前方にムラ
なく蛍光体１１の層を配置することができる。この場
合、透明樹脂１２の表面よりも内側に広い範囲の蛍光体
１１の層を形成できる。The transparent resin 12 containing the precipitating phosphor 11 is injected into the entire light emitting surface 3A including the reflecting frame 6, and the base is turned upside down while the transparent resin 12 is being cured, so that the precipitating phosphor 1 is formed.
1 is settled in the transparent resin 12 and the transparent resin 12 is further hardened, so that the layer of the phosphor 11 is evenly arranged at a position higher than the depth d of the reflection frame 6 and in front of the light emitting element 4. Can be placed. In this case, a wide range of layers of the phosphor 11 can be formed inside the surface of the transparent resin 12.

【００４１】上記第３の実施形態では、透明樹脂１２を
施した後、速やかに基台を上下反転させて硬化したが、
この第４の実施形態では、透明樹脂１２を施した後、し
ばらくして（ある程度、硬化して）から基台を上下反転
させることにより、図１０に示すように、広い範囲に蛍
光体１１の層が形成される。In the third embodiment, after the transparent resin 12 is applied, the base is immediately turned upside down and cured.
In the fourth embodiment, after the transparent resin 12 is applied, the base is turned upside down after a while (after being cured to some extent), so that as shown in FIG. A layer is formed.

【００４２】次に、本発明の第５の実施形態について説
明する。図１１は、本発明の第５の実施形態に係るＬＥ
Ｄ表示器の外観を正面（ｂ）と側面（ａ）から見た図で
ある。図１２は、図１１（ａ）のＦ−Ｆ線に沿った階段
断面図である。これらの図において、上記第１の実施形
態と共通の部材には同一の符号を附し、その詳細な説明
を省略する。Next, a fifth embodiment of the present invention will be described. FIG. 11 is an LE according to the fifth embodiment of the present invention.
It is the figure which looked at the external appearance of a D indicator from the front (b) and side (a). FIG. 12 is a staircase cross-sectional view taken along the line FF of FIG. In these drawings, the same members as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

【００４３】反射枠６内に該反射枠６の容量よりも多い
量の透明樹脂１２を注入し、表面張力によりレンズ形状
に盛り上げ硬化させた後、反射枠６を含む光の出射面３
Ａの全体に沈降性蛍光体１１を含む透明樹脂１２を注入
し、沈降性蛍光体１１を透明樹脂１２中で沈降させると
ともに、この透明樹脂１２を硬化させることにより、反
射枠６の深さｄよりも高い位置で、かつ発光素子４より
も前方にムラなく蛍光体１１の層を配置することができ
る。なお、この第５の実施形態では、基台を上下反転す
ることはしない。A transparent resin 12 in an amount larger than the capacity of the reflective frame 6 is injected into the reflective frame 6, and the surface is tension-set into a lens shape by surface tension to be cured. Then, the light emitting surface 3 including the reflective frame 6 is included.
By injecting the transparent resin 12 containing the sinking phosphor 11 into the entire A, allowing the sinking phosphor 11 to settle in the transparent resin 12, and hardening the transparent resin 12, the depth d of the reflection frame 6 is set. It is possible to arrange the layer of the phosphor 11 at a higher position and evenly in front of the light emitting element 4. In this fifth embodiment, the base is not turned upside down.

【００４４】上記実施形態において、樹脂１２は、その
前端をスペーサ８の前端よりも後方に位置させるのが望
ましいが、導光板などの対象物の形状によっては、その
前端をスペーサ８の前端と同等位置かスペーサ８の前端
より前方位置に配置することもできる。In the above-mentioned embodiment, it is desirable that the front end of the resin 12 is located behind the front end of the spacer 8. However, depending on the shape of the object such as the light guide plate, the front end of the resin 12 is equal to the front end of the spacer 8. It may be located at a position or in front of the front end of the spacer 8.

【００４５】上記のＬＥＤ表示器１は、樹脂成形パッケ
ージ３の実装面３Ｂが回路基板（被実装面）と対面する
ように配置され、電極面２１Ｂ、２２Ｂが半田などの導
電材を介して対応する回路基板の端子部に固定され、電
気的な接続が成される。そして、ＬＥＤ表示器は、スペ
ーサ８，８を、対象物、例えば導光板等の光入射面に接
触した状態とすることにより、バックライト装置の光源
として利用することができる。The above LED display 1 is arranged so that the mounting surface 3B of the resin molded package 3 faces the circuit board (mounting surface), and the electrode surfaces 21B and 22B correspond to each other via a conductive material such as solder. Is fixed to the terminal portion of the circuit board to be electrically connected. Then, the LED display can be used as a light source of a backlight device by bringing the spacers 8 into contact with an object, for example, a light incident surface such as a light guide plate.

【００４６】本発明は、上記の実施形態に限定されるも
のではなく、その要旨を変更しない範囲で種々の変更を
行なうことができる。The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the invention.

【００４７】[0047]

【発明の効果】以上説明したように本発明のＬＥＤ表示
器によると、照射対象物を突起形状のスペーサの先端に
突き当て、複数の点で両者を接触させることにより、発
光素子と照射対象物との距離を精度よく規定できる。As described above, according to the LED display of the present invention, the irradiation object is abutted against the tip of the protrusion-shaped spacer, and both are brought into contact with each other at a plurality of points, so that the light emitting element and the irradiation object are irradiated. The distance to and can be specified accurately.

【００４８】また、本発明のＬＥＤ表示器によると、フ
レームの電極面が光の出射方向とは逆方向に折り曲げら
れているため、電極面に半田付けしてＬＥＤ表示器を実
装するにあたり、熱源と発光素子の距離が遠くなり、熱
的な負荷を抑制することができる。According to the LED display of the present invention, since the electrode surface of the frame is bent in the direction opposite to the light emission direction, when mounting the LED display by soldering to the electrode surface, a heat source is used. The distance between the light emitting element and the light emitting element is increased, and the thermal load can be suppressed.

【００４９】また、本発明のＬＥＤ表示器によると、光
の出射面に比較的近い位置に発光素子を搭載したので、
発光素子から光の出射面までの距離が短縮され、発光強
度のロスを少なくすることができる。Further, according to the LED display of the present invention, since the light emitting element is mounted at a position relatively close to the light emitting surface,
The distance from the light emitting element to the light emission surface is shortened, and the loss of light emission intensity can be reduced.

【００５０】また、本発明のＬＥＤ表示器では、樹脂成
形パッケージの実装面と対向する面に平坦部を設け、該
平坦部の形状の対称性を崩すことにより、該平坦部を電
極の極性の視認に利用するようにしている。したがっ
て、ＬＥＤ表示器の実装時に、実装面の下に隠れた一対
の電極面の極性を上方から容易に確認できる。Further, in the LED display of the present invention, a flat portion is provided on the surface facing the mounting surface of the resin molded package, and the flat portion is broken to avoid the symmetry of the shape of the flat portion. I am trying to use it for visual recognition. Therefore, when the LED display is mounted, the polarities of the pair of electrode surfaces hidden under the mounting surface can be easily confirmed from above.

【００５１】また、本発明のＬＥＤ表示器では、反射枠
と色変換用の蛍光体層との間、あるいは発光素子の前面
と色変換用の蛍光体層との間に蛍光体を含まない透明樹
脂が介在する構造を採用しているため、発光素子の前面
側にムラなく蛍光体層を形成できる。Further, in the LED display of the present invention, a transparent material containing no phosphor is provided between the reflection frame and the phosphor layer for color conversion, or between the front surface of the light emitting element and the phosphor layer for color conversion. Since the structure in which the resin is interposed is adopted, the phosphor layer can be uniformly formed on the front surface side of the light emitting element.

【００５２】この場合、樹脂パッケージに凹所として設
けられた反射枠内に、該反射枠の容量よりも多い量の透
明樹脂を注入し、表面張力によりレンズ形状に盛り上げ
硬化させた後、この硬化透明樹脂の表面に蛍光体を塗布
することにより、前記反射枠の深さよりも高い位置で、
かつ前記発光素子よりも前方にムラなく蛍光体層を配置
することができる。また、蛍光体が反射枠の壁面に付着
することがないため、反射枠の反射効率が悪くなるのを
防止できる。また、一定量、一定範囲、一定厚みの蛍光
体を配置できるので、安定した色変換特性が得られる。In this case, a transparent resin in an amount larger than the capacity of the reflection frame is injected into the reflection frame provided as a recess in the resin package, and the resin is raised to a lens shape by surface tension and cured, and then the cured. By applying a phosphor on the surface of the transparent resin, at a position higher than the depth of the reflection frame,
In addition, the phosphor layer can be arranged evenly in front of the light emitting element. Further, since the phosphor does not adhere to the wall surface of the reflection frame, it is possible to prevent the reflection efficiency of the reflection frame from being deteriorated. Further, since the phosphors having a constant amount, a constant range, and a constant thickness can be arranged, stable color conversion characteristics can be obtained.

【００５３】あるいは、前記反射枠内に該反射枠の容量
よりも多い量の沈降性蛍光体を含む透明樹脂を注入し、
表面張力によりレンズ形状に盛り上げた後、基台を上下
反転させ、前記沈降性蛍光体を前記透明樹脂中で沈降さ
せるとともに、この透明樹脂を硬化させることにより、
前記反射枠の深さよりも高い位置で、かつ前記発光素子
よりも前方にムラなく蛍光体層を配置することができ
る。Alternatively, a transparent resin containing a precipitating phosphor in an amount larger than the capacity of the reflecting frame is injected into the reflecting frame,
After swelling into a lens shape by surface tension, the base is turned upside down, and the precipitating phosphor is allowed to settle in the transparent resin, and by curing the transparent resin,
The phosphor layer can be arranged at a position higher than the depth of the reflection frame and in front of the light emitting element without any unevenness.

【００５４】あるいは、前記樹脂成形パッケージの光の
出射面の全面に沈降性蛍光体を含む透明樹脂を注入し、
該透明樹脂の硬化途上に基台を上下反転させ、前記沈降
性蛍光体を前記透明樹脂中で沈降させるとともに、この
透明樹脂を硬化させることにより、前記反射枠の深さよ
りも高い位置で、かつ前記発光素子よりも前方にムラな
く蛍光体層を配置することができる。Alternatively, a transparent resin containing a settling phosphor is injected over the entire light emitting surface of the resin molded package,
The base is turned upside down while the transparent resin is being cured, and the precipitating phosphor is allowed to settle in the transparent resin, and by curing the transparent resin, at a position higher than the depth of the reflection frame, and The phosphor layer can be arranged evenly in front of the light emitting element.

【００５５】あるいは、前記反射枠内に該反射枠の容量
よりも多い量の透明樹脂を注入し、表面張力によりレン
ズ形状に盛り上げ硬化させた後、さらにその上に沈降性
蛍光体を含む透明樹脂を注入し、前記沈降性蛍光体を前
記透明樹脂中で沈降させるとともに、この透明樹脂を硬
化させることにより、前記反射枠の深さよりも高い位置
で、かつ前記発光素子よりも前方にムラなく蛍光体層を
配置することができる。Alternatively, a transparent resin in an amount larger than the capacity of the reflecting frame is injected into the reflecting frame, and the lens is formed into a lens shape by surface tension and cured, and then a transparent resin containing a precipitating phosphor is further formed thereon. Is injected, and the sedimentable phosphor is allowed to settle in the transparent resin, and by curing the transparent resin, fluorescence is evenly provided at a position higher than the depth of the reflection frame and ahead of the light emitting element. Body layers can be placed.

【００５６】なお、前記反射枠の深さを前記発光素子の
高さとほぼ等しくすることにより、発光素子と蛍光体が
極力近づくため、発光色の色変換効率がよくなる。By making the depth of the reflection frame substantially equal to the height of the light emitting element, the light emitting element and the phosphor are brought as close as possible, so that the color conversion efficiency of the emission color is improved.

【図面の簡単な説明】[Brief description of drawings]

【図１】 本発明の第１の実施形態に係るＬＥＤ表示
器の外観を正面（ｂ）、側面（ａ）、上面（ｃ）、下面
（ｄ）および背面（ｅ）から見た図である。FIG. 1 is a diagram showing an appearance of an LED display device according to a first embodiment of the present invention as seen from a front surface (b), a side surface (a), an upper surface (c), a lower surface (d) and a rear surface (e). .

【図２】 図１（ａ）のＡ−Ａ線に沿った階段断面図
であり。FIG. 2 is a step sectional view taken along the line AA of FIG.

【図３】 本発明の第２の実施形態に係るＬＥＤ表示
器の外観を正面（ｂ）と側面（ａ）から見た図である。FIG. 3 is a diagram showing an appearance of an LED display device according to a second embodiment of the present invention as viewed from the front (b) and side (a).

【図４】 図３（ａ）のＢ−Ｂ線に沿った階段断面図
である。FIG. 4 is a staircase cross-sectional view taken along the line BB of FIG.

【図５】 本発明の第３の実施形態に係るＬＥＤ表示
器の外観を正面（ｂ）と側面（ａ）から見た図である。FIG. 5 is a diagram showing the appearance of an LED display device according to a third embodiment of the present invention as seen from the front (b) and side (a).

【図６】 図５（ａ）のＤ−Ｄ線に沿った階段断面図
である。FIG. 6 is a step sectional view taken along the line D-D of FIG.

【図７】 本発明の第３の実施形態の他の例のＬＥＤ
表示器の外観を正面（ｂ）と側面（ａ）から見た図であ
る。FIG. 7 is an LED of another example of the third embodiment of the present invention.
It is the figure which looked at the external appearance of a display from the front (b) and the side (a).

【図８】 図７（ａ）のＣ−Ｃ線に沿った階段断面図
である。FIG. 8 is a step sectional view taken along the line CC of FIG. 7 (a).

【図９】 本発明の第４の実施形態に係るＬＥＤ表示
器の外観を正面（ｂ）と側面（ａ）から見た図である。FIG. 9 is a diagram showing the appearance of an LED display device according to a fourth embodiment of the present invention as seen from the front (b) and side (a).

【図１０】 図９（ａ）のＥ−Ｅ線に沿った階段断面
図である。FIG. 10 is a step sectional view taken along line EE of FIG. 9 (a).

【図１１】 本発明の第５の実施形態に係るＬＥＤ表
示器の外観を正面（ｂ）と側面（ａ）から見た図であ
る。FIG. 11 is a diagram showing the appearance of an LED display device according to a fifth embodiment of the present invention as seen from the front (b) and side (a).

【図１２】 図１１（ａ）のＦ−Ｆ線に沿った階段断
面図である。FIG. 12 is a staircase cross-sectional view taken along the line FF of FIG.

【図１３】 本発明に係るＬＥＤ表示器の斜視図であ
る。FIG. 13 is a perspective view of an LED display according to the present invention.

【図１４】 そのＬＥＤ表示器のフレームの斜視図で
ある。FIG. 14 is a perspective view of a frame of the LED display.

【図１５】 本発明に係るＬＥＤ表示器への白色変換
用の蛍光体層の形成方法の一例を説明するための模式図
である。FIG. 15 is a schematic diagram for explaining an example of a method of forming a phosphor layer for white conversion on the LED display according to the present invention.

【図１６】 本発明に係るＬＥＤ表示器への白色変換
用の蛍光体層の形成方法の他の例を説明するための模式
図である。FIG. 16 is a schematic view for explaining another example of the method of forming a phosphor layer for white conversion on the LED display according to the present invention.

【図１７】 従来の一般的なＬＥＤ表示器の外観を正
面（ｂ）、側面（ａ）、上面（ｃ）および下面（ｄ）か
ら見た図である。FIG. 17 is a diagram showing the appearance of a conventional general LED display from the front (b), side (a), top (c) and bottom (d).

【図１８】 図１７（ａ）のＺ−Ｚ線に沿った階段断
面図である。FIG. 18 is a staircase cross-sectional view taken along the line ZZ of FIG.

【符号の説明】[Explanation of symbols]

１ ＬＥＤ表示器 ３ 樹脂成形パッケージ ４ 発光素子 ５ セカンドワイヤー ６ 反射枠 ７ 仕切壁 ８ スペーサ ９ 平坦部 １０ 斜辺 １１ 蛍光体 １２ 透明樹脂 ２１ アノードフレーム ２２ カソードフレーム 1 LED display 3 resin molding package 4 light emitting elements 5 second wire 6 reflection frame 7 partition walls 8 spacers 9 Flat part 10 hypotenuse 11 phosphor 12 Transparent resin 21 Anode frame 22 Cathode frame

───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡邊 孝文 鳥取県鳥取市南吉方３丁目201番地 鳥取 三洋電機株式会社内 Ｆターム(参考） 5F041 DA12 DA17 DA26 DA46 DA57 DA58 DA81    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takafumi Watanabe             3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori             Sanyo Electric Co., Ltd. F-term (reference) 5F041 DA12 DA17 DA26 DA46 DA57                       DA58 DA81

Claims (11)

【特許請求の範囲】[Claims] 【請求項１】 ＬＥＤ表示器の実装面に対し、平行な方
向に光を出射する発光素子を備えたＬＥＤ表示器におい
て、光の出射方向に前記発光素子と照射対象物との距離
を規定する突起形状のスペーサを設けたことを特徴とす
るＬＥＤ表示器。1. An LED display equipped with a light emitting element that emits light in a direction parallel to a mounting surface of the LED display, wherein a distance between the light emitting element and an irradiation object is defined in a light emitting direction. An LED display comprising a protrusion-shaped spacer. 【請求項２】 前記突起形状のスペーサは、前記照射対
象物と点接触して、前記発光素子と前記照射対象物との
距離を規定するものであることを特徴とする請求項１に
記載のＬＥＤ表示器。2. The projection-shaped spacer makes point contact with the irradiation target object to define a distance between the light emitting element and the irradiation target object. LED display. 【請求項３】 フレームと樹脂成形パッケージの一体成
形品を基台とするＬＥＤ表示器において、前記樹脂成形
パッケージの実装面側に突出する前記フレームの電極面
は、前記光の出射方向とは逆方向に折り曲げられている
ことを特徴とするＬＥＤ表示器。3. In an LED display based on an integrally molded product of a frame and a resin molded package, an electrode surface of the frame protruding toward a mounting surface side of the resin molded package is opposite to a light emitting direction. An LED display characterized by being bent in any direction. 【請求項４】 ＬＥＤ表示器の実装面に対し、平行な方
向に光を出射する発光素子を備え、前記発光素子の搭載
されるフレームと樹脂成形パッケージの一体成形品を基
台とするＬＥＤ表示器において、前記樹脂成形パッケー
ジの光の出射面からの奥行き方向に関して、光の出射面
に近い位置に前記発光素子を搭載したことを特徴とする
ＬＥＤ表示器。4. An LED display comprising a light emitting element that emits light in a direction parallel to a mounting surface of an LED display, and a frame on which the light emitting element is mounted and an integrally molded product of a resin molded package as a base. In the container, the LED display is characterized in that the light emitting element is mounted at a position close to the light emitting surface in the depth direction from the light emitting surface of the resin molded package. 【請求項５】 フレームと樹脂成形パッケージの一体成
形品を基台とするＬＥＤ表示器において、前記樹脂成形
パッケージの実装面と対向する面に平坦部を設け、該平
坦部の形状の対称性を崩すことにより、該平坦部を電極
の極性の視認に利用できるようにしたことを特徴とする
ＬＥＤ表示器。5. An LED display using an integrally molded product of a frame and a resin molded package as a base, wherein a flat portion is provided on a surface facing the mounting surface of the resin molded package, and the shape of the flat portion is symmetrical. An LED display characterized in that the flat portion can be utilized for visual recognition of the polarities of the electrodes by breaking the flat portion. 【請求項６】 フレームと樹脂成形パッケージの一体成
形品を基台とし、前記フレーム上から前記樹脂成形パッ
ケージの光の出射面側にかけて所定の深さで形成された
反射枠と、この反射枠内の前記フレーム上に搭載されＬ
ＥＤ表示器の実装面に対し、平行な方向に光を出射する
発光素子と、該発光素子の前面の前方に形成された蛍光
体層とを有するＬＥＤ表示器において、前記反射枠と前
記蛍光体層との間に蛍光体を含まない樹脂が介在してい
ることを特徴とするＬＥＤ表示器。6. A reflection frame formed at a predetermined depth from above the frame to the light emission surface side of the resin molded package, which is based on an integrally molded product of the frame and the resin molded package, and inside the reflection frame. L mounted on the frame of
In the LED display having a light emitting element that emits light in a direction parallel to the mounting surface of the ED display and a phosphor layer formed in front of the front surface of the light emitting element, the reflection frame and the phosphor are provided. An LED display in which a resin not containing a phosphor is interposed between the layer and the layer. 【請求項７】 前記発光素子の前面と前記蛍光体層との
間に前記蛍光体を含まない樹脂が介在しているととも
に、前記反射枠の深さを前記発光素子の高さとほぼ等し
いか、前記発光素子の高さ以下にしたことを特徴とする
請求項６に記載のＬＥＤ表示器。7. A resin not containing the phosphor is interposed between the front surface of the light emitting element and the phosphor layer, and the depth of the reflection frame is substantially equal to the height of the light emitting element. The LED display device according to claim 6, wherein the light emitting device has a height equal to or less than the height of the light emitting device. 【請求項８】 フレームと樹脂成形パッケージの一体成
形品を基台とし、前記フレーム上から前記樹脂成形パッ
ケージの光の出射面側にかけて所定の深さで形成された
反射枠と、この反射枠内の前記フレーム上に搭載されＬ
ＥＤ表示器の実装面に対し、平行な方向に光を出射する
発光素子と、該発光素子の前面の前方に形成された蛍光
体層とを有するＬＥＤ表示器の製造方法において、前記
反射枠内に該反射枠の容量よりも多い量の透明樹脂を注
入し、表面張力によりレンズ形状に盛り上げ硬化させた
後、この硬化透明樹脂の表面に蛍光体を塗布することを
特徴とするＬＥＤ表示器の製造方法。8. A reflection frame formed at a predetermined depth from above the frame to the light emission surface side of the resin molding package, which is based on an integrally molded product of the frame and the resin molding package, and inside the reflection frame. L mounted on the frame of
In the method for manufacturing an LED display having a light emitting element that emits light in a direction parallel to the mounting surface of the ED display and a phosphor layer formed in front of the front surface of the light emitting element, A transparent resin in an amount larger than the capacity of the reflection frame is injected into the lens, and the resin is piled up and cured by a surface tension into a lens shape, and then a phosphor is applied to the surface of the cured transparent resin. Production method. 【請求項９】 フレームと樹脂成形パッケージの一体成
形品を基台とし、前記フレーム上から前記樹脂成形パッ
ケージの光の出射面側にかけて所定の深さで形成された
反射枠と、この反射枠内の前記フレーム上に搭載されＬ
ＥＤ表示器の実装面に対し、平行な方向に光を出射する
発光素子と、該発光素子の前面の前方に形成された蛍光
体層とを有するＬＥＤ表示器の製造方法において、前記
反射枠内に該反射枠の容量よりも多い量の沈降性蛍光体
を含む透明樹脂を注入し、表面張力によりレンズ形状に
盛り上げた後、基台を上下反転させ、前記沈降性蛍光体
を前記透明樹脂中で沈降させるとともに、この透明樹脂
を硬化させることを特徴とするＬＥＤ表示器の製造方
法。9. A reflecting frame formed at a predetermined depth from above the frame to the light emitting surface side of the resin molded package based on an integrally molded product of the frame and the resin molded package, and the inside of this reflecting frame. L mounted on the frame of
In the method for manufacturing an LED display having a light emitting element that emits light in a direction parallel to the mounting surface of the ED display and a phosphor layer formed in front of the front surface of the light emitting element, Injecting a transparent resin containing a settling phosphor in an amount larger than the capacity of the reflecting frame into the lens shape by surface tension and then inverting the base upside down to set the settling phosphor in the transparent resin. A method for manufacturing an LED display device, which comprises allowing the transparent resin to settle and curing the transparent resin. 【請求項１０】 フレームと樹脂成形パッケージの一体
成形品を基台とし、前記フレーム上から前記樹脂成形パ
ッケージの光の出射面側にかけて所定の深さで形成され
た反射枠と、この反射枠内の前記フレーム上に搭載され
ＬＥＤ表示器の実装面に対し、平行な方向に光を出射す
る発光素子と、該発光素子の前面の前方に形成された蛍
光体層とを有するＬＥＤ表示器の製造方法において、前
記前記樹脂成形パッケージの光の出射面の全面に沈降性
蛍光体を含む透明樹脂を注入し、該透明樹脂の硬化途上
に基台を上下反転させ、前記沈降性蛍光体を前記透明樹
脂中で沈降させるとともに、この透明樹脂を硬化させる
ことを特徴とするＬＥＤ表示器の製造方法。10. A reflection frame formed with a predetermined depth from the frame to the light emission surface side of the resin molded package, which is based on an integrally molded product of the frame and the resin molded package, and the inside of the reflection frame. Of an LED display mounted on the frame and emitting light in a direction parallel to a mounting surface of the LED display, and a phosphor layer formed in front of the front surface of the light emitting element. In the method, a transparent resin containing a precipitating phosphor is injected onto the entire light emitting surface of the resin molded package, the base is turned upside down while the transparent resin is being cured, and the precipitating phosphor is transparent. A method for manufacturing an LED display, which comprises setting the resin in a resin and curing the transparent resin. 【請求項１１】 フレームと樹脂成形パッケージの一体
成形品を基台とし、前記フレーム上から前記樹脂成形パ
ッケージの光の出射面側にかけて所定の深さで形成され
た反射枠と、この反射枠内の前記フレーム上に搭載され
ＬＥＤ表示器の実装面に対し、平行な方向に光を出射す
る発光素子と、該発光素子の前面の前方に形成された蛍
光体層とを有するＬＥＤ表示器の製造方法において、前
記反射枠内に該反射枠の容量よりも多い量の透明樹脂を
注入し、表面張力によりレンズ形状に盛り上げ硬化させ
た後、さらにその上に沈降性蛍光体を含む透明樹脂を注
入し、前記沈降性蛍光体を前記透明樹脂中で沈降させる
とともに、この透明樹脂を硬化させることを特徴とする
ＬＥＤ表示器の製造方法。11. A reflection frame formed at a predetermined depth from above the frame to the light emission surface side of the resin molded package, which is based on an integrally molded product of the frame and the resin molded package, and inside the reflection frame. Of an LED display mounted on the frame and emitting light in a direction parallel to a mounting surface of the LED display, and a phosphor layer formed in front of the front surface of the light emitting element. In the method, a transparent resin in an amount larger than the capacity of the reflective frame is injected into the reflective frame, and the resin is piled up into a lens shape by surface tension and cured, and then a transparent resin containing a precipitating phosphor is injected onto the transparent resin. Then, the method of manufacturing an LED display device, characterized in that the transparent phosphor is set in the transparent resin and the transparent resin is cured.
JP2001366900A 2001-11-30 2001-11-30 Led display and its manufacturing method Pending JP2003168824A (en)

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