JP2003155553A - Method and system for manufacturing thin film - Google Patents
Method and system for manufacturing thin filmInfo
- Publication number
- JP2003155553A JP2003155553A JP2001350571A JP2001350571A JP2003155553A JP 2003155553 A JP2003155553 A JP 2003155553A JP 2001350571 A JP2001350571 A JP 2001350571A JP 2001350571 A JP2001350571 A JP 2001350571A JP 2003155553 A JP2003155553 A JP 2003155553A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- resin material
- resin
- vacuum
- defoaming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Physical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、薄膜の製造方法及
びその製造装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film manufacturing method and a manufacturing apparatus thereof.
【０００２】[0002]
【従来の技術】現代社会において薄膜の果たす役割は非
常に広範囲であり、包装紙、磁気テープ、コンデンサ、
半導体など日常生活の様々な部分において薄膜が利用さ
れている。これらの薄膜無しには、近年における様々な
商品の高性能化や小型化と言った技術の基本トレンドを
語ることはできない。同時に、工業的需要を満足する形
で薄膜を形成する方法についても様々な開発がなされて
おり、例えば包装紙、磁気テープ、コンデンサなどの用
途においては、高速大量生産に有利な連続巻き取り真空
蒸着が行われている。その際、蒸発材料と基板材料を、
形成する薄膜の目的に合わせて選ぶと同時に、必要に応
じて真空槽内に反応ガスを導入することや、基板に電位
を与えた状態で薄膜を形成することによって、所望の特
性を持った薄膜を形成することが出来る。例えば、磁気
記録媒体の製造においては、Ｃｏ、Ｎｉ、Ｆｅ等の磁性
元素を含む蒸発材料を用い、真空槽中に酸素ガスを導入
しながら反応蒸着を行うことによって、長尺の磁気記録
媒体を得ることが出来る。また、半導体においては主に
スパッタ法によって薄膜が形成されている。スパッタ法
はセラミック系の材料を用いた薄膜形成にも特に有効で
あり、セラミック薄膜は膜厚数μｍ以上では塗布焼成法
で形成され、１μｍ以下ではスパッタ法で形成される場
合が多い。2. Description of the Related Art The role played by thin films in modern society is extremely widespread, and wrapping paper, magnetic tape, capacitors,
Thin films are used in various parts of daily life such as semiconductors. Without these thin films, it is impossible to talk about the basic trends of technology such as high performance and miniaturization of various products in recent years. At the same time, various developments have been made on methods for forming thin films that satisfy industrial demand.For applications such as wrapping paper, magnetic tape, and capacitors, continuous winding vacuum deposition is advantageous for high-speed mass production. Is being done. At that time, the evaporation material and the substrate material,
A thin film with desired characteristics can be selected by selecting a thin film to be formed and at the same time introducing a reaction gas into the vacuum chamber or forming a thin film while applying a potential to the substrate. Can be formed. For example, in the manufacture of a magnetic recording medium, a long magnetic recording medium can be obtained by using an evaporation material containing a magnetic element such as Co, Ni, and Fe and performing reactive vapor deposition while introducing oxygen gas into a vacuum chamber. You can get it. Further, in semiconductors, a thin film is mainly formed by a sputtering method. The sputtering method is also particularly effective for forming a thin film using a ceramic material, and a ceramic thin film is often formed by a coating and firing method when the film thickness is several μm or more, and is formed by a sputtering method when the film thickness is 1 μm or less.
【０００３】一方、樹脂材料を用いた薄膜の形成は塗装
による方法が用いられ、リバースコートやダイコートが
工業的に用いられており、溶剤で希釈した材料を塗工後
乾燥硬化させることが一般的である。また、これらの工
法で形成される樹脂薄膜の膜厚の下限は使用する材料に
よるが、１μｍ前後であることが多く、それ以下の膜厚
は得られにくい場合が多い。更に、溶剤希釈を行うと乾
燥後の塗膜に欠陥が生じやすい他、環境保護の観点から
も好ましくない。そこで、溶剤希釈を行わなくとも樹脂
薄膜が形成できる方法、及び極薄の樹脂薄膜が安定に得
られる方法が望まれている。これを解決する方法とし
て、真空中で樹脂薄膜を形成する方法が提案されてい
る。これは真空中で樹脂材料を気化又は霧化した後に支
持体に付着させる方法であり、この方法によれば空隙欠
陥のない樹脂薄膜を形成することが出来るとともに、溶
剤希釈の必要もない。On the other hand, a method of coating is used to form a thin film using a resin material, and a reverse coat or a die coat is industrially used. Generally, a material diluted with a solvent is dried and cured after coating. Is. The lower limit of the film thickness of the resin thin film formed by these methods depends on the material used, but is often around 1 μm, and it is often difficult to obtain a film thickness less than that. Further, if the solvent is diluted, defects are likely to occur in the coating film after drying, and it is not preferable from the viewpoint of environmental protection. Therefore, a method capable of forming a resin thin film without diluting with a solvent and a method capable of stably obtaining an extremely thin resin thin film are desired. As a method for solving this, a method of forming a resin thin film in vacuum has been proposed. This is a method in which a resin material is vaporized or atomized in a vacuum and then adhered to a support. According to this method, a resin thin film having no void defects can be formed and solvent dilution is not necessary.
【０００４】セラミック薄膜や樹脂薄膜の上に更に異種
の薄膜を積層することによって従来得られなかったよう
な複合薄膜が得られるようになり、その工業的利用分野
は非常に多岐にわたる。その中でもチップ形状の電子部
品は非常に有望であり、コンデンサ、コイル、抵抗、容
量性電池あるいはこれらの複合部品等が、薄膜積層によ
って極めて小型かつ高性能に形成できつつあり、既に商
品化・市場拡大が始まっている。By laminating different kinds of thin films on the ceramic thin film or the resin thin film, a composite thin film which has never been obtained can be obtained, and its industrial application fields are very diverse. Among them, chip-shaped electronic parts are very promising, and capacitors, coils, resistors, capacitive batteries, or composite parts of these are being formed into extremely small size and high performance by thin film lamination, and already commercialized and marketed. Expansion is starting.
【０００５】[0005]
【発明が解決しようとする課題】樹脂薄膜を用いて電子
部品等を形成する際に重要となるのが樹脂薄膜の表面性
や欠陥の有無である。表面あれや欠陥が存在すると薄膜
化の効果が半減してしまい、時には性能不良につなが
る。When forming an electronic component or the like using a resin thin film, the surface property of the resin thin film and the presence or absence of defects are important. The presence of surface irregularities and defects reduces the effect of thinning by half and sometimes leads to poor performance.
【０００６】一方、工業的には薄膜の生産性もまた重要
であることは言うまでもない。従って、生産性と膜質の
両立が重要であるが、これまでの方法では必ずしも十分
ではないという問題があった。すなわち、本発明の発明
者らによる特願平１０−５０９７０号によれば欠陥のな
い樹脂薄膜が得られるが、樹脂供給配管の途中で樹脂中
に気泡が発生し、これが真空槽内に入ると同時に膨張す
るため、樹脂蒸着ユニット内の内圧が大幅に変動し、安
定した膜厚が得られにくく、高速に均一な膜厚で成膜可
能な方法が望まれていた。On the other hand, it goes without saying that the productivity of thin films is also important industrially. Therefore, both productivity and film quality are important, but there is a problem that the conventional methods are not always sufficient. That is, according to Japanese Patent Application No. 10-50970 filed by the inventors of the present invention, a resin thin film without defects can be obtained. Since it expands at the same time, the internal pressure in the resin vapor deposition unit fluctuates greatly, and it is difficult to obtain a stable film thickness, and there has been a demand for a method capable of forming a uniform film thickness at high speed.
【０００７】そこで、本発明は前記従来の問題を解決す
るためになされたものであり、表面特性に優れ、かつ生
産性にも優れた薄膜の製造方法及びその製造装置を提供
することを目的とする。Therefore, the present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a thin film manufacturing method and a manufacturing apparatus therefor which are excellent in surface characteristics and productivity. To do.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するため
本発明の薄膜の製造方法は、真空中で樹脂材料を蒸発さ
せて支持体に付着させる薄膜の製造方法において、前記
樹脂材料を予め減圧雰囲気下で脱泡を行った上で真空中
に導入することを特徴とする。In order to achieve the above object, a method for producing a thin film according to the present invention is a method for producing a thin film in which a resin material is evaporated in a vacuum to adhere to a support. It is characterized in that it is degassed under an atmosphere and then introduced into a vacuum.
【０００９】また、本発明の薄膜の製造方法は、前記脱
泡が前記樹脂材料を加熱しながら減圧雰囲気下で行われ
ることが好ましい。Further, in the thin film manufacturing method of the present invention, it is preferable that the defoaming is performed in a reduced pressure atmosphere while heating the resin material.
【００１０】また、本発明の薄膜の製造方法は、前記脱
泡が前記樹脂材料を攪拌しながら減圧雰囲気下で行われ
ることが好ましい。Further, in the method for producing a thin film of the present invention, it is preferable that the defoaming is performed in a reduced pressure atmosphere while stirring the resin material.
【００１１】また、本発明の薄膜の製造方法は、前記脱
泡が真空度の調整を行いながら行われることが好まし
い。Further, in the thin film manufacturing method of the present invention, it is preferable that the defoaming is performed while adjusting the degree of vacuum.
【００１２】また、本発明の薄膜の製造方法は、前記脱
泡が前記樹脂材料の中にガスを導入しながら行われるこ
とが好ましい。Further, in the method for producing a thin film of the present invention, it is preferable that the defoaming is performed while introducing gas into the resin material.
【００１３】また、本発明の薄膜の製造方法は、前記ガ
スが酸素であることが好ましい。Further, in the method for producing a thin film of the present invention, it is preferable that the gas is oxygen.
【００１４】更に、本発明の薄膜の製造装置は、真空槽
と、前記真空槽中に樹脂材料を供給するための供給装置
と、前記樹脂材料を蒸発させるための蒸発装置と、蒸発
した前記樹脂材料を付着させて樹脂薄膜を形成するため
の支持体とを有する薄膜の製造装置において、前記樹脂
材料を予め脱泡する手段を備えたことを特徴とする。Further, the thin film manufacturing apparatus of the present invention comprises a vacuum tank, a supply apparatus for supplying a resin material into the vacuum tank, an evaporation apparatus for evaporating the resin material, and the evaporated resin. An apparatus for manufacturing a thin film having a support for adhering a material to form a resin thin film, characterized by comprising a means for defoaming the resin material in advance.
【００１５】[0015]
【発明の実施の形態】本発明は、真空中で樹脂材料を蒸
発させて支持体に付着させる薄膜の製造方法において、
前記樹脂材料を予め減圧雰囲気下で脱泡を行った上で真
空中に導入することを特徴とする薄膜の製造方法であ
り、このことにより高速でかつ均一な膜厚が得られる成
膜方法が実現できる。BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a method for producing a thin film in which a resin material is evaporated in a vacuum and adhered to a support,
A thin film manufacturing method characterized in that the resin material is degassed in advance under a reduced pressure atmosphere and then introduced into a vacuum, whereby a film forming method capable of obtaining a uniform film thickness at high speed is provided. realizable.
【００１６】以下、本発明の実施の形態について図面を
用いて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１７】（実施の形態１）図１は本発明の薄膜の製
造方法及びその製造装置の一例を示す図である。(Embodiment 1) FIG. 1 is a diagram showing an example of a thin film manufacturing method and a manufacturing apparatus thereof according to the present invention.
【００１８】図１で成膜に用いる樹脂１０は脱泡用真空
槽２内に設置された樹脂カップ１９に貯めらる。脱泡用
真空槽２内は脱泡用排気系６によって減圧されており、
樹脂１０を合成する際に使用した有機溶媒や合成過程で
吸着したガス、水蒸気が、減圧雰囲気下で脱気される。
樹脂１０は供給管３を経てバルブ８で供給量を調整しつ
つ成膜用真空槽５に導入される。支持体である長尺基板
１は、巻き出しロール１５から巻き出され、ガイドロー
ル１７を経て、円筒状のキャン７に沿って走行し、ガイ
ドロール１７を経て巻き取りロール１６に巻き取られ
る。長尺基板１上に樹脂薄膜を形成するための樹脂蒸気
は供給管３から供給された樹脂材料を気化することによ
って得られる。液状で供給された樹脂材料は加熱板１１
（温度：１１０℃、水平線に対する傾斜角２０#）に沿
って流動しつつ加熱板に沿って薄い液膜状に広がり蒸発
する。蒸発できない樹脂材料は加熱板１１の終端から冷
却された樹脂受け４内に滴下し蒸発を終える。The resin 10 used for film formation in FIG. 1 is stored in a resin cup 19 installed in the defoaming vacuum chamber 2. The inside of the defoaming vacuum tank 2 is decompressed by the defoaming exhaust system 6,
The organic solvent used when synthesizing the resin 10, the gas and water vapor adsorbed in the synthesis process are degassed under a reduced pressure atmosphere.
The resin 10 is introduced into the film forming vacuum chamber 5 through the supply pipe 3 while adjusting the supply amount by the valve 8. The long substrate 1 as a support is unwound from the unwinding roll 15, travels along the cylindrical can 7 via the guide roll 17, and is wound up by the winding roll 16 via the guide roll 17. The resin vapor for forming the resin thin film on the long substrate 1 is obtained by vaporizing the resin material supplied from the supply pipe 3. The resin material supplied in liquid form is the heating plate 11
While flowing along (temperature: 110 ° C., inclination angle 20 # with respect to the horizontal line), it spreads in a thin liquid film along the heating plate and evaporates. The resin material that cannot be evaporated is dropped from the end of the heating plate 11 into the cooled resin receiver 4 to complete the evaporation.
【００１９】上記方法では、成膜用真空槽５に樹脂材料
を導入する前に脱泡を行っているため、供給管３中や加
熱板１１に液滴する時に樹脂材料内から残留溶剤などが
気化し、樹脂材料が不連続に加熱板１１上に滴下するよ
うなことがない。このため、加熱板１１上に安定した樹
脂材料の滴下が可能となり、樹脂材料の安定した蒸発が
でき、長尺基板１上へ均一な膜厚で樹脂薄膜を成膜する
ことができる。In the above method, since defoaming is performed before introducing the resin material into the film forming vacuum tank 5, residual solvent or the like is removed from inside the resin material when the liquid drops in the supply pipe 3 or the heating plate 11. It does not vaporize and the resin material does not drop discontinuously on the heating plate 11. Therefore, the resin material can be stably dropped on the heating plate 11, the resin material can be stably evaporated, and the resin thin film can be formed on the long substrate 1 with a uniform film thickness.
【００２０】脱泡用真空槽２内の真空度を１〜３０００
Ｐａの範囲にして脱泡を行えば、ガスや吸着水分を十分
取り除くことが出来る。The degree of vacuum in the degassing vacuum tank 2 is set to 1 to 3000.
If degassing is performed within the range of Pa, gas and adsorbed water can be sufficiently removed.
【００２１】また、加熱板１１に接触したばかりの樹脂
材料は急激な温度上昇によって粗大粒子となって一部が
飛散する場合があるため、防壁１２でキャン７への直接
付着を防止する。また、壁面の汚れを防止するため周囲
壁１３も加熱した。樹脂薄膜の硬化を行う硬化装置１４
としては紫外線照射装置を用いた。Further, the resin material that has just come into contact with the heating plate 11 may become coarse particles and partly scatter due to a rapid temperature rise, so that the barrier 12 prevents direct adhesion to the can 7. The surrounding wall 13 was also heated to prevent the wall surface from being soiled. Curing device 14 for curing the resin thin film
An ultraviolet irradiation device was used as the.
【００２２】尚、図１において、９は成膜用排気系、１
８は各ロールの移動方向を示す。In FIG. 1, 9 is a film forming exhaust system and 1 is a film forming exhaust system.
8 shows the moving direction of each roll.
【００２３】（実施の形態２）次に、本発明の第２の実
施形態について図２を用いて説明する。(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG.
【００２４】図２は脱泡装置部分のみを記載したもので
ある。樹脂カップ１９の外壁の周囲に加熱ヒーター２０
が取り付けられており、樹脂１０は樹脂カップ１９を通
じて加熱ヒーター２０から加熱される。樹脂１０の液温
度を測温体２１によって計測し、樹脂１０の温度が所定
の温度になるよう加熱ヒーター２０に投入する電力を調
整する。FIG. 2 shows only the defoaming device part. A heater 20 is provided around the outer wall of the resin cup 19.
Is attached, and the resin 10 is heated from the heater 20 through the resin cup 19. The liquid temperature of the resin 10 is measured by the temperature measuring body 21, and the electric power supplied to the heater 20 is adjusted so that the temperature of the resin 10 reaches a predetermined temperature.
【００２５】樹脂材料の加熱温度は使用する材料によっ
て異なるが、通常３０〜１００℃とするのが好ましい。
加熱温度が高いほど、残留揮発成分を除去できる。しか
し、この範囲より高くなると、樹脂材料が熱硬化性のも
のであれば熱硬化し、樹脂カップ１９内で硬化してしま
い、成膜装置への導入が出来なくなる。The heating temperature of the resin material varies depending on the material used, but it is usually preferably 30 to 100 ° C.
The higher the heating temperature, the more the residual volatile components can be removed. However, if the temperature is higher than this range, if the resin material is a thermosetting material, it is thermoset and hardened in the resin cup 19, and it cannot be introduced into the film forming apparatus.
【００２６】通常、樹脂材料中には残留溶媒やガス、水
蒸気など様々な揮発成分が含まれており、これらは一定
の減圧雰囲気下においてそれぞれ蒸気圧が異なる。この
ため、加熱温度を段階的あるいは連続的に低温から高温
側へ変化させることで、このような様々な揮発成分を効
率良く脱泡させることが出来る。Usually, the resin material contains various volatile components such as residual solvent, gas and water vapor, and these have different vapor pressures under a constant reduced pressure atmosphere. Therefore, by varying the heating temperature stepwise or continuously from the low temperature to the high temperature side, it is possible to efficiently degas various volatile components.
【００２７】加熱ヒーター２０は電熱式やパイプ内に温
媒を流す方法等があり、その他の加熱方法でも本発明に
適用可能である。また、加熱方法は、樹脂カップ１９の
外側から加熱する方法のみならず、図３に示すように、
樹脂１０内に加熱ヒーター２０を入れて直接加熱しても
良い。The heater 20 may be an electric heating type or a method of flowing a heating medium in a pipe, and other heating methods can be applied to the present invention. Further, the heating method is not limited to the method of heating from the outside of the resin cup 19, but as shown in FIG.
You may put the heater 20 in the resin 10 and heat directly.
【００２８】尚、図２及び図３において、実施の形態１
と同じ構成要素に関しては同一の番号を付け説明を省略
する。2 and 3, the first embodiment will be described.
Constituent elements that are the same as those in FIG.
【００２９】（実施の形態３）次に、本発明の第３の実
施形態について図４を用いて説明する。(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG.
【００３０】図４において、モーター２３によって攪拌
子２２を回転させ、樹脂１０を攪拌しながら脱泡を行
う。攪拌速度は使用する樹脂材料の粘度や加熱温度に応
じて決定するが、毎分２０〜２００回転程度で行うこと
が好ましい。このように、樹脂１０を攪拌することによ
って、清置している場合に比べ、樹脂１０を均一に脱泡
することができ、特に樹脂材料が大量になった場合、攪
拌することが望ましい。攪拌方法は、図４に示した方法
以外に磁石を用いたマグネットスターラー方式などもあ
り、そのほかの方法でも本発明に適用可能である。In FIG. 4, the stirrer 22 is rotated by the motor 23 and the resin 10 is degassed while stirring. The stirring speed is determined according to the viscosity of the resin material used and the heating temperature, but it is preferable to perform the stirring at about 20 to 200 revolutions per minute. As described above, by stirring the resin 10, the resin 10 can be uniformly defoamed as compared with the case where the resin 10 is placed, and it is desirable to stir especially when the resin material becomes large in volume. As the stirring method, there is a magnetic stirrer method using a magnet in addition to the method shown in FIG. 4, and other methods can also be applied to the present invention.
【００３１】尚、図４では加熱ヒーター２０によって加
熱も可能な形態で記載しているが、攪拌だけで脱泡の効
果が得られる場合、装置簡略化のためこれを省略しても
良い。In FIG. 4, the heater 20 can be used for heating, but if the effect of defoaming can be obtained only by stirring, it may be omitted for simplification of the apparatus.
【００３２】（実施の形態４）次に、本発明の第４の実
施形態について図５を用いて説明する。(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG.
【００３３】図５において、ガス導入管２４を通じてバ
ルブ２５でガス流量を調整しながら脱泡用真空槽２内の
真空度を調整する。樹脂１０中の残留溶媒やガスなどの
揮発成分量が多い場合、脱泡用真空槽２内を高真空にす
ると、樹脂１０内から大量に揮発成分が蒸発し、樹脂１
０が樹脂カップ１９からあふれてしまう。本実施形態で
あれば、バルブ２５で脱泡用真空槽２内の真空度を調整
し、揮発成分の蒸発を一定に保つため、樹脂１０があふ
れず、樹脂を有効に使用することができる。In FIG. 5, the degree of vacuum in the defoaming vacuum chamber 2 is adjusted while adjusting the gas flow rate with the valve 25 through the gas introduction pipe 24. When the amount of volatile components such as residual solvent and gas in the resin 10 is large, a large amount of volatile components are evaporated from the resin 10 when the defoaming vacuum tank 2 is evacuated to a high vacuum.
0 overflows from the resin cup 19. In the present embodiment, the degree of vacuum in the defoaming vacuum tank 2 is adjusted by the valve 25 and the evaporation of the volatile components is kept constant, so that the resin 10 does not overflow and the resin can be effectively used.
【００３４】真空度調整のために導入するガスは、大
気、窒素、酸素や不活性ガスのＡｒ等が適しているが、
用いる樹脂の特性に応じて変えることによって、本発明
に適用可能である。また、真空度の調整は脱泡用真空槽
２と脱泡用排気系６の間に排気速度調整用のバルブを挿
入し、揮発成分の蒸発による泡の発生状態に応じて、排
気速度を調整することで、本発明を適用することが出来
る。The gas introduced for adjusting the degree of vacuum is preferably atmospheric air, nitrogen, oxygen or an inert gas such as Ar.
It can be applied to the present invention by changing it according to the characteristics of the resin used. In addition, the degree of vacuum is adjusted by inserting a valve for adjusting the exhaust speed between the defoaming vacuum tank 2 and the defoaming exhaust system 6 and adjusting the exhaust speed according to the state of foam generation due to evaporation of volatile components. By doing so, the present invention can be applied.
【００３５】（実施の形態５）次に、本発明の第５の実
施形態について図６を用いて説明する。(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIG.
【００３６】図６は、樹脂１０内にガスを導入するため
のガス導入管２６を入れ、樹脂液中にガスの泡を発生さ
せ、出てくる泡と共に樹脂１０内に含まれる揮発成分を
蒸発させるものである。ガスによって発生させた泡の中
に揮発成分を蒸発させることになるため、これまで記載
した実施の形態に比べ、短時間に脱泡を終えることが可
能となる。更に、これまでの実施の形態で述べてきたよ
うな樹脂の加熱や攪拌を同時に行うと、更に短時間化が
図れる。In FIG. 6, a gas introducing pipe 26 for introducing gas into the resin 10 is inserted to generate gas bubbles in the resin liquid, and the volatile components contained in the resin 10 are vaporized together with the bubbles coming out. It is what makes me. Since the volatile components are vaporized in the bubbles generated by the gas, it is possible to complete the defoaming in a shorter time than the above-described embodiments. Furthermore, when the heating and stirring of the resin as described in the above embodiments are simultaneously performed, the time can be further shortened.
【００３７】また、導入するガス流量によって、脱泡用
真空槽２内の真空度を調整すれば、実施の形態４と同様
な効果が得られる。導入するガスは、乾燥空気、酸素、
窒素、アルゴンなどが好ましい。特に、ラジカル反応に
よって重合する樹脂を用いる場合、酸素ガスを導入すれ
ば、脱泡中の樹脂の硬化が抑制できるため好ましい。If the degree of vacuum in the defoaming vacuum chamber 2 is adjusted by the flow rate of the gas to be introduced, the same effect as in the fourth embodiment can be obtained. The gas to be introduced is dry air, oxygen,
Nitrogen, argon and the like are preferable. In particular, when a resin that polymerizes by a radical reaction is used, it is preferable to introduce oxygen gas because the curing of the resin during defoaming can be suppressed.
【００３８】（実施の形態６）次に、本発明の第６の実
施形態について図７を用いて説明する。(Sixth Embodiment) Next, a sixth embodiment of the present invention will be described with reference to FIG.
【００３９】図７において、樹脂予備タンク３０に樹脂
を貯め、調整バルブ２７で樹脂の液適量を調整しながら
供給配管２８を通して傾斜板２９上に液滴する。液適さ
れた樹脂は、傾斜板２９上で液膜状に広がるため、これ
までの実施形態に比べ表面積が大きくなり、樹脂内部に
含まれる揮発成分をより短時間で蒸発させることが出来
る。揮発成分の蒸発を終えた樹脂は樹脂カップ１９内に
貯められ、供給管３から成膜用真空槽（図示せず)へ導
かれる。傾斜板２９は、樹脂の真空中沸点と熱硬化温度
より低い温度に加熱すると、より揮発成分を効果的に蒸
発させることが出来る。樹脂中の残留溶剤や吸着水分を
取り除くためには、通常３０〜１００℃に加熱するのが
好ましい。In FIG. 7, the resin is stored in the resin reserve tank 30, and the liquid is dropped onto the inclined plate 29 through the supply pipe 28 while the proper amount of the resin is adjusted by the adjusting valve 27. The liquid-adapted resin spreads in the form of a liquid film on the inclined plate 29, so that the surface area becomes larger than that in the previous embodiments, and the volatile components contained in the resin can be evaporated in a shorter time. The resin after the evaporation of the volatile components is stored in the resin cup 19 and guided from the supply pipe 3 to a film forming vacuum tank (not shown). When the inclined plate 29 is heated to a temperature lower than the boiling point of the resin in vacuum and the thermosetting temperature, the volatile components can be more effectively evaporated. In order to remove the residual solvent and adsorbed water in the resin, it is usually preferable to heat at 30 to 100 ° C.
【００４０】図７において、成膜用真空槽（図示せず）
への供給量をより安定させるため、樹脂カップ１９を加
熱ヒーター２０と測温体２１で一定温度に加熱している
が、粘度が低い樹脂を用いる場合などでは、必ずしも必
要でない。In FIG. 7, a film forming vacuum chamber (not shown)
The resin cup 19 is heated to a constant temperature by the heater 20 and the temperature measuring body 21 in order to further stabilize the amount supplied to the heater. However, this is not always necessary when a resin having low viscosity is used.
【００４１】[0041]
【発明の効果】以上のように本発明の薄膜の製造方法及
びその製造装置によれば、高速かつ均一な膜厚が得られ
る成膜方法が実現できる。As described above, according to the thin film manufacturing method and the manufacturing apparatus thereof of the present invention, it is possible to realize a film forming method capable of obtaining a uniform film thickness at high speed.
【図１】 本発明の薄膜の製造方法及びその製造装置の
一例を示す概略図である。FIG. 1 is a schematic view showing an example of a thin film manufacturing method and a manufacturing apparatus therefor according to the present invention.
【図２】 本発明の薄膜の製造装置の脱泡装置部分の一
例を示す概略図である。FIG. 2 is a schematic view showing an example of a defoaming device portion of the thin film manufacturing apparatus of the present invention.
【図３】 本発明の薄膜の製造装置の脱泡装置部分の更
に別の一例を示す概略図である。FIG. 3 is a schematic view showing still another example of the defoaming device portion of the thin film manufacturing apparatus of the present invention.
【図４】 本発明の薄膜の製造装置の脱泡装置部分の更
に別の一例を示す概略図である。FIG. 4 is a schematic view showing still another example of the defoaming device portion of the thin film manufacturing apparatus of the present invention.
【図５】 本発明の薄膜の製造装置の脱泡装置部分の更
に別の一例を示す概略図である。FIG. 5 is a schematic view showing still another example of the defoaming device portion of the thin film manufacturing apparatus of the present invention.
【図６】 本発明の薄膜の製造装置の脱泡装置部分の更
に別の一例を示す概略図である。FIG. 6 is a schematic view showing still another example of the defoaming device portion of the thin film manufacturing apparatus of the present invention.
【図７】 本発明の薄膜の製造装置の脱泡装置部分の更
に別の一例を示す概略図である。FIG. 7 is a schematic view showing still another example of the defoaming device portion of the thin film manufacturing apparatus of the present invention.
１ 長尺基板 ２ 脱泡用真空槽 ３ 供給管 ４ 樹脂受け ５ 成膜用真空槽 ６ 脱泡用排気系 ７ キャン ８ バルブ ９ 成膜用排気系 １０ 樹脂 １１ 加熱板 １２ 防壁 １３ 周囲壁 １４ 硬化装置 １５ 巻き出しロール １６ 巻き取りロール １７ ガイドロール １８ 移動方向 １９ 樹脂カップ 1 Long board 2 Vacuum tank for defoaming 3 supply pipes 4 resin receiving 5 Vacuum chamber for film formation 6 Degassing exhaust system 7 can 8 valves 9 Film forming exhaust system 10 resin 11 heating plate 12 Barrier 13 Surrounding wall 14 Curing device 15 Unrolling roll 16 winding roll 17 Guide roll 18 Moving direction 19 resin cups
───────────────────────────────────────────────────── フロントページの続き (72)発明者 砂流 伸樹 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4K029 AA25 BA62 DA02 DB06 DB15 JA10 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Nobutoki Sunagure 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. F-term (reference) 4K029 AA25 BA62 DA02 DB06 DB15 JA10
Claims (7)
付着させる薄膜の製造方法において、前記樹脂材料を予
め減圧雰囲気下で脱泡を行った上で真空中に導入するこ
とを特徴とする薄膜の製造方法。1. A method for producing a thin film in which a resin material is evaporated in a vacuum to adhere to a support, wherein the resin material is degassed in advance under a reduced pressure atmosphere and then introduced into a vacuum. Method of manufacturing thin film.
ら減圧雰囲気下で行われる請求項１に記載の薄膜の製造
方法。2. The method for producing a thin film according to claim 1, wherein the defoaming is performed in a reduced pressure atmosphere while heating the resin material.
ら減圧雰囲気下で行われる請求項１に記載の薄膜の製造
方法。3. The method for producing a thin film according to claim 1, wherein the defoaming is performed in a reduced pressure atmosphere while stirring the resin material.
行われる請求項１に記載の薄膜の製造方法。4. The method for producing a thin film according to claim 1, wherein the defoaming is performed while adjusting the degree of vacuum.
導入しながら行われる請求項１に記載の薄膜の製造方
法。5. The method for producing a thin film according to claim 1, wherein the defoaming is performed while introducing gas into the resin material.
の薄膜の製造方法。6. The method for producing a thin film according to claim 5, wherein the gas is oxygen.
給するための供給装置と、前記樹脂材料を蒸発させるた
めの蒸発装置と、蒸発した前記樹脂材料を付着させて樹
脂薄膜を形成するための支持体とを有する薄膜の製造装
置において、前記樹脂材料を予め脱泡する手段を備えた
ことを特徴とする薄膜の製造装置。7. A vacuum tank, a supply device for supplying a resin material into the vacuum tank, an evaporation device for evaporating the resin material, and a resin thin film formed by adhering the evaporated resin material. An apparatus for producing a thin film, comprising a means for defoaming the resin material in advance.
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