JP2003133032A - Disc-like heater - Google Patents
Disc-like heaterInfo
- Publication number
- JP2003133032A JP2003133032A JP2001329214A JP2001329214A JP2003133032A JP 2003133032 A JP2003133032 A JP 2003133032A JP 2001329214 A JP2001329214 A JP 2001329214A JP 2001329214 A JP2001329214 A JP 2001329214A JP 2003133032 A JP2003133032 A JP 2003133032A
- Authority
- JP
- Japan
- Prior art keywords
- heater
- disc
- heaters
- shaped
- shaped heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Resistance Heating (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体製造装置あ
るいは超伝導材製造装置において、半導体ウエハなどの
被加熱物を均一に加熱するための円盤状ヒータに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disc-shaped heater for uniformly heating an object to be heated such as a semiconductor wafer in a semiconductor manufacturing apparatus or a superconducting material manufacturing apparatus.
【０００２】[0002]
【従来の技術】従来、ＣＶＤ、エピタキシャル成長など
の気相成長装置において、例えば、半導体ウエハ支持部
材の下方に配置して、半導体ウエハを均一に加熱するた
めに、円盤状ヒータなどの面状ヒータとして、帯状ヒー
タを種々の形態に配設したものが提案され、使用されて
いる。2. Description of the Related Art Conventionally, in a vapor phase growth apparatus such as CVD and epitaxial growth, a planar heater such as a disk heater is disposed below a semiconductor wafer support member to uniformly heat the semiconductor wafer. Various types of band-shaped heaters have been proposed and used.
【０００３】例えば、カーボンヒータを渦巻き状に直列
に配設したもの（特開平５−１３５８５８号公報）が提
案されている。しかしながら、各種の加熱装置において
は、円盤状ヒータを水平に設置する場合が少なくなく、
このような場合には、円盤状ヒータを設置部に嵌め込む
ために、円盤状ヒータの中央部に円形の嵌め込み部を設
けることが必要となるが、上記提案のものでは、この嵌
め込み部の形成が困難となる。For example, there has been proposed one in which carbon heaters are spirally arranged in series (JP-A-5-135858). However, in various heating devices, the disk-shaped heater is often installed horizontally,
In such a case, in order to fit the disc-shaped heater into the installation portion, it is necessary to provide a circular fitting portion in the central portion of the disc-shaped heater. However, in the above-mentioned proposal, the formation of the fitting portion is required. Will be difficult.
【０００４】帯状ヒータを屈曲させ、その両端部に端子
をそなえてなる分割ヒータを組合わせて円盤状としたと
したものも提案されている（特開平１０−２０８８５５
号公報）が、円盤状とするために、複数の分割ヒータと
少なくとも４個所以上の端子部が必要となるため、製造
コストが高くなるという難点がある。It has also been proposed to bend a band-shaped heater and combine it with divided heaters having terminals at both ends thereof to form a disk shape (Japanese Patent Laid-Open No. 10-208855).
However, since it has a disk shape, a plurality of divided heaters and at least four or more terminal portions are required, which causes a problem that the manufacturing cost becomes high.
【０００５】ヒータを直列に且つ略同心円状に配設して
なる円盤状ヒータも提案されている（特開平１１−２８
３７３０号公報）が、この円盤状ヒータにおいては、円
盤状ヒータの中央部に円形の嵌め込み部を設けることは
可能であるが、端子部が内側に配置され、加熱時に端子
部は低温となるため、被加熱物の均一加熱が行い難いと
いう問題がある。A disk-shaped heater in which heaters are arranged in series and substantially concentrically is also proposed (Japanese Patent Laid-Open No. 11-28).
No. 3730 gazette), in this disc-shaped heater, it is possible to provide a circular fitting portion in the central portion of the disc-shaped heater, but since the terminal portion is arranged inside and the terminal portion has a low temperature during heating. However, there is a problem that it is difficult to uniformly heat the object to be heated.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、円盤状ヒー
タにおける上記従来の問題点を解消するためになされた
ものであり、その目的は、中央部に円形の嵌め込み部を
設け、端子部を外周側に配置し、帯状ヒータを略同心円
状に配設することにより、加熱装置内で円盤状ヒータを
水平に設置することができるようにし、且つ被加熱物の
均一加熱を可能とした円盤状ヒータを提供することにあ
る。SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned conventional problems in the disk-shaped heater, and an object thereof is to provide a circular fitting portion in the central portion and to provide a terminal portion. By arranging the band-shaped heaters on the outer peripheral side and arranging the band-shaped heaters in a substantially concentric shape, the disk-shaped heater can be installed horizontally in the heating device, and the disk-shaped heater enables uniform heating of the object to be heated. It is to provide a heater.
【０００７】[0007]
【課題を解決するための手段】上記の目的を達成するた
めの本発明の請求項１による円盤状ヒータは、帯状ヒー
タを中央部を除いて直列に、且つ略同心円状に配設して
なる円盤状ヒータであって、該円盤状ヒータは、帯状ヒ
ータを円盤状ヒータの直径部近傍に屈曲部を有するよう
屈曲させて半円内に直列に配設してなる半円状ヒータを
円状に合わせた形状を有し、前記中央部においては空間
部が形成され、帯状ヒータが該空間部を囲むよう環状に
配設されて並列回路を構成しており、円盤状ヒータ内で
の帯状ヒータの配置は前記中央部に対して点対称となっ
ており、各半円状ヒータの外周側には、それぞれ端子部
が互いに対向する位置関係に設けられていることを特徴
とする。In order to achieve the above object, a disk-shaped heater according to claim 1 of the present invention is formed by arranging band-shaped heaters in series except for a central portion and in a substantially concentric shape. A disc-shaped heater, wherein the disc-shaped heater is a semi-circular heater formed by bending a strip-shaped heater to have a bent portion near the diameter portion of the disc-shaped heater and arranging the heaters in series in a semi-circle. And a space part is formed in the central part, and the band-shaped heater is annularly arranged so as to surround the space part to form a parallel circuit. The band-shaped heater in the disc-shaped heater is formed. Is symmetrical with respect to the central portion, and terminal portions are provided on the outer peripheral side of each semi-circular heater so as to face each other.
【０００８】請求項２による円盤状ヒータは、請求項１
において、前記帯状ヒータの屈曲部のうち、加熱時に低
温域となる部分を除去したことを特徴とする。A disk-shaped heater according to a second aspect is the first aspect.
In the above, in the bent portion of the belt-shaped heater, a portion that becomes a low temperature region during heating is removed.
【０００９】[0009]
【発明の実施の形態】本発明の具体的な実施形態につい
て説明すると、図１に示すように、円盤状ヒータ１は、
帯状ヒータ２を円盤状ヒータ１の直径部Ｄ−Ｄ近傍に屈
曲部を有するよう屈曲させ、隙間３を空けて半円内に直
列に配設し、直列ヒータ部Ｂ１、Ｂ２、Ｂ３〜Ｂｎを形
成してなる半円状ヒータと、同じく帯状ヒータ２を屈曲
させ、隙間３を空けて半円内に直列に配設し、直列ヒー
タ部Ｃ１、Ｃ２、Ｃ３〜Ｃｎを形成してなる半円状ヒー
タを円状に合わせた形状をそなえており、円盤状ヒータ
１内での帯状ヒータ２により形成される直列ヒータ部Ｂ
１、Ｂ２、Ｂ３〜ＢｎおよびＣ１、Ｃ２、Ｃ３〜Ｃｎの
配置は、円盤状ヒータ１の中央部Ｃに対して点対称とな
っている。BEST MODE FOR CARRYING OUT THE INVENTION A specific embodiment of the present invention will be described. As shown in FIG.
The belt-shaped heater 2 is bent so that it has a bent portion near the diameter portion D-D of the disc-shaped heater 1 and is arranged in series in a semicircle with a gap 3 therebetween, and the series heater portions B1, B2, B3 to Bn are connected to each other. A semi-circular heater formed by bending the band-shaped heater 2 and the semi-circular heater formed in the same manner, and arranging them in series in the semi-circle with a gap 3 therebetween to form series heater parts C1, C2, C3 to Cn. Series heater B having a shape in which the heaters are combined in a circular shape and formed by the band-shaped heater 2 in the disk-shaped heater 1.
The arrangement of 1, B2, B3 to Bn and C1, C2, C3 to Cn is point-symmetric with respect to the central portion C of the disk-shaped heater 1.
【００１０】中央部Ｃは空間部となっており、半円状ヒ
ータを構成する帯状ヒータ２、２は、中央部Ｃにおい
て、空間部を囲むよう環状に配設されて並列ヒータ部
Ａ、Ａを形成している。各半円状ヒータの外周側には、
それぞれ端子部４、４が互いに対向する位置関係に設け
られている。The central portion C is a space portion, and the band-shaped heaters 2, 2 forming a semi-circular heater are annularly arranged in the central portion C so as to surround the space portion, and the parallel heater portions A, A are provided. Is formed. On the outer peripheral side of each semi-circular heater,
The terminal portions 4 and 4 are provided so as to face each other.
【００１１】すなわち、本発明による円盤状ヒータ１
は、帯状ヒータ２を中央部Ｃを除いて直列に、且つ略同
心円状に配設してなるものであって、中央部Ｃにおいて
は空間部が形成され、帯状ヒータ２、２が空間部を囲む
よう環状に配設されて並列回路を構成するという特徴を
有する。That is, the disc-shaped heater 1 according to the present invention.
Is a device in which the band-shaped heaters 2 are arranged in series except the central part C and in a substantially concentric shape, and a space part is formed in the central part C, and the band-shaped heaters 2 and 2 form the space part. It is characterized in that it is arranged in an annular shape so as to surround it to form a parallel circuit.
【００１２】本発明の円盤状ヒータ１においては、中央
部Ｃの空間部は、非加熱部となるから、空間部が大き過
ぎると被加熱物に対する温度分布が不均一となるため、
できるだけ小さくすることが好ましく、中央部Ｃに形成
される並列回路の並列ヒータ部Ａの幅ａは、直列ヒータ
部Ｂ１、Ｂ２、Ｂ３〜ＢｎおよびＣ１、Ｃ２、Ｃ３〜Ｃ
ｎの幅ｂの１／２（ａ＝ｂ／２）程度にするのが、被加
熱物に対する温度分布を均一にする上で好ましい。In the disk-shaped heater 1 of the present invention, the space portion of the central portion C is a non-heated portion. Therefore, if the space portion is too large, the temperature distribution with respect to the object to be heated becomes uneven.
The width a of the parallel heater portion A of the parallel circuit formed in the central portion C is preferably as small as possible, and the width a of the parallel heater portions B1, B2, B3 to Bn and C1, C2, C3 to C.
It is preferable that the width b of n is about 1/2 (a = b / 2) in order to make the temperature distribution of the object to be heated uniform.
【００１３】直列ヒータ部の個数（段数）については、
図１には８個（Ｂ１、Ｂ２、Ｂ３、Ｂｎ、Ｃ１、Ｃ２、
Ｃ３、Ｃｎの８段）の例を示し、図２には４個（Ｂ１、
Ｂ２、Ｃ１、Ｃ２の４段）の例を示すが、直列ヒータ部
の段数は少なくとも２段の構成が好ましく、抵抗値、発
熱部の幅ｂ、帯状ヒータの直径、帯状ヒータを構成する
材質の強度などを考慮して決定される。Regarding the number (number of stages) of the series heater parts,
In FIG. 1, eight (B1, B2, B3, Bn, C1, C2,
An example of 8 stages of C3 and Cn) is shown in FIG.
B2, C1, and C2), the number of stages of the series heater portion is preferably at least two, and the resistance value, the width b of the heating portion, the diameter of the strip heater, and the material of the strip heater It is determined in consideration of strength and the like.
【００１４】本発明による円盤状ヒータにおいては、中
央部Ｃに空間部が形成されているから、この空間部が各
種装置に水平に設置する場合の嵌め込み部となる。ま
た、端子部４、４が外周側の互いに対向する位置関係に
配設されているため、加熱時における端子部での低温化
の影響を少なくすることができ、被加熱物の均一加熱が
可能となる。In the disk-shaped heater according to the present invention, since the space portion is formed in the central portion C, this space portion serves as a fitting portion when horizontally installed in various devices. Further, since the terminals 4 and 4 are arranged in a positional relationship facing each other on the outer peripheral side, it is possible to reduce the influence of lowering the temperature of the terminals during heating, and it is possible to uniformly heat the object to be heated Becomes
【００１５】帯状ヒータ２を円盤状ヒータ１の直径部Ｄ
−Ｄ近傍に屈曲部を有するよう屈曲させて配設した構造
の本発明の円盤状ヒータにおいては、所定の電圧を印加
すると、電流が端子部４、４の間を最短の距離で流れる
ため、屈曲部の斜線部５は電流が流れ難く低温領域とな
る。このような低温領域が形成されると、被加熱物の温
度分布が不均一となるから、例えば、図２に示す円盤状
ヒータにおいて、帯状ヒータ２の屈曲部のうちの低温領
域５を除去し、図３に示すような形状の円盤状ヒータと
するのが好ましい。The belt-shaped heater 2 is replaced by the diameter portion D of the disk-shaped heater 1.
In the disk-shaped heater of the present invention having a structure in which it is bent so as to have a bent portion in the vicinity of −D, when a predetermined voltage is applied, a current flows between the terminal portions 4 and 4 at the shortest distance. The shaded portion 5 of the bent portion is a low temperature region where current hardly flows. When such a low temperature region is formed, the temperature distribution of the object to be heated becomes non-uniform. Therefore, for example, in the disc heater shown in FIG. 2, the low temperature region 5 of the bent portion of the belt heater 2 is removed. It is preferable to use a disc heater having a shape as shown in FIG.
【００１６】なお、直列ヒータ部および並列ヒータ部の
幅ｂ、ａが大きいほど、低温領域５の大きさが拡大し、
直列ヒータ部および並列ヒータ部の幅ｂ、ａが小さい場
合には、電流は略均一に流れ、屈曲部における温度差が
無視し得るものとなり、低温領域５は無くなるから、低
温領域５の除去は必要でなくなる。The larger the widths b and a of the series heater portion and the parallel heater portion, the larger the size of the low temperature region 5,
When the widths b and a of the series heater part and the parallel heater part are small, the current flows substantially uniformly, the temperature difference in the bent part becomes negligible, and the low temperature region 5 disappears. No longer needed.
【００１７】[0017]
【実施例】以下、本発明の実施例を比較例と対比して説
明する。これらの実施例は本発明の一実施態様を示すも
のであり、本発明はこれに限定されるものではない。EXAMPLES Examples of the present invention will be described below in comparison with comparative examples. These examples show one embodiment of the present invention, and the present invention is not limited thereto.
【００１８】実施例１
炭化珪素質発熱体（電気比抵抗値：０．０４５Ω・ｃ
ｍ）からなる帯状ヒータを屈曲させて図２に示す形状を
そなえた４種類の円盤状ヒータ１を作製し、この円盤状
ヒータを試験ヒータとして、以下の方法に従ってヒータ
の均熱性を評価した。各試験ヒータの直列ヒータ部の幅
ｂ、並列ヒータ部の幅ａ、隙間３の大きさ、ヒータの直
径ｄ、およびヒータの厚さを表１に、均熱性の評価結果
を表２に示す。なお、中央部（空間部）Ｃの直径は３０
ｍｍとする。Example 1 Silicon carbide heating element (electrical resistivity: 0.045 Ω · c
The band-shaped heater consisting of m) was bent to prepare four types of disc-shaped heaters 1 having the shape shown in FIG. 2, and the disc-shaped heater was used as a test heater to evaluate the soaking property of the heater according to the following method. The width b of the series heater portion, the width a of the parallel heater portion, the size of the gap 3, the diameter d of the heater, and the thickness of the heater of each test heater are shown in Table 1, and the evaluation results of the thermal uniformity are shown in Table 2. The diameter of the central portion (space portion) C is 30.
mm.
【００１９】均熱性の評価：試験ヒータを加熱炉内に水
平に設置し、ヒータ上面から３０ｃｍ上側に縦１２０ｍ
ｍ、横１２０ｍｍ、厚さ５ｍｍの被加熱板６（図５）を
水平に置き、炉内温度を１０００℃に保持した時の被加
熱板６の上面の各位置（〜）の温度を測定する。Evaluation of soaking property: A test heater was installed horizontally in a heating furnace, and 120 cm vertically 30 cm above the upper surface of the heater.
A heated plate 6 (FIG. 5) having a width of m, a width of 120 mm and a thickness of 5 mm is placed horizontally, and the temperature at each position (to) on the upper surface of the heated plate 6 is measured when the temperature inside the furnace is maintained at 1000 ° C. .
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【表２】 [Table 2]
【００２２】表２にみられるように、本発明に従う試験
ヒータはいずれも、被加熱板の各測定位置における最高
温度と最低温度の差が１５℃以内に抑えられており、均
一な加熱を行うことができることが確認された。As can be seen from Table 2, in all the test heaters according to the present invention, the difference between the maximum temperature and the minimum temperature at each measurement position of the heated plate is suppressed within 15 ° C., and uniform heating is performed. It was confirmed that it was possible.
【００２３】実施例２
実施例１の試験ヒータ４から屈曲部の低温領域を切断加
工により除去して、図３に示すような形状の円盤状ヒー
タを作製し、この円盤状ヒータを試験ヒータ５として、
実施例１と同一の方法に従ってヒータの均熱性を評価し
た。結果を表３に示す。Example 2 A low temperature region of a bent portion was removed by cutting from the test heater 4 of Example 1 to produce a disc heater having a shape as shown in FIG. 3, and the disc heater was used as a test heater 5. As
The soaking property of the heater was evaluated according to the same method as in Example 1. The results are shown in Table 3.
【００２４】[0024]
【表３】 [Table 3]
【００２５】表３にみられるように、屈曲部の低温領域
を除去した試験ヒータにおいては、被加熱板の各測定位
置における最高温度と最低温度の差が、実施例１のもの
よりさらに低く抑えられており、均熱性を大幅に向上し
得ることが確認された。As shown in Table 3, in the test heater from which the low temperature region of the bent portion is removed, the difference between the maximum temperature and the minimum temperature at each measurement position of the heated plate is suppressed to be lower than that of the first embodiment. It has been confirmed that the soaking property can be significantly improved.
【００２６】比較例１
炭化珪素質発熱体（電気比抵抗値：０．０４５Ω・ｃ
ｍ）からなる帯状ヒータを屈曲させて、図４に示すよう
に、直列ヒータ部のみで構成した直径ｄ：１７５ｍｍ、
中央部（空間部）Ｃの直径：３０ｍｍの円盤状ヒータ１
Ａを作製した。この円盤状ヒータ１Ａにおいては、端子
部４を中央部付近に形成した。また、屈曲部の低温領域
を切断加工により除去した。Comparative Example 1 Silicon Carbide Heating Element (Electrical Specific Resistance Value: 0.045 Ω · c
m) is bent to form a belt-shaped heater, and as shown in FIG.
Diameter of central part (space part) C: 30 mm disk-shaped heater 1
A was produced. In this disc-shaped heater 1A, the terminal portion 4 was formed near the central portion. The low temperature region of the bent portion was removed by cutting.
【００２７】得られた円盤状ヒータ１Ａを試験ヒータ
６、７として、実施例１と同一の方法に従ってヒータの
均熱性を評価した。各試験ヒータの直列ヒータ部（Ｂ
１、Ｂ２、Ｃ１、Ｃ２）の幅ｂ、直列ヒータ部（Ｂ０、
Ｃ０）の幅ａ、隙間３の大きさ、およびヒータの厚さを
表４に、均熱性の評価結果を表５に示す。The obtained disk-shaped heater 1A was used as test heaters 6 and 7, and the heat uniformity of the heater was evaluated in the same manner as in Example 1. Series heater part of each test heater (B
1, b2, C1, C2) width b, series heater section (B0,
Table 4 shows the width a of C0), the size of the gap 3, and the thickness of the heater, and Table 5 shows the evaluation results of the thermal uniformity.
【００２８】[0028]
【表４】 [Table 4]
【００２９】[0029]
【表５】 [Table 5]
【００３０】表５に示すように、試験ヒータ６、７は、
端子部が中央部に設けられているため、中央部は加熱時
に低温となり、均熱性に劣っている。As shown in Table 5, the test heaters 6 and 7 are
Since the terminal portion is provided in the central portion, the central portion has a low temperature during heating and is inferior in heat uniformity.
【００３１】[0031]
【発明の効果】本発明によれば、中央部に円形の嵌め込
み部を設け、端子部を外周側に配置し、帯状ヒータを略
同心円状に配設することにより、加熱装置内で円盤状ヒ
ータを水平に設置することができ、且つ被加熱物の均一
加熱を可能とした円盤状ヒータが提供される。According to the present invention, by providing a circular fitting portion in the central portion, arranging the terminal portion on the outer peripheral side, and arranging the band-shaped heaters in a substantially concentric shape, a disk-shaped heater is provided in the heating device. There is provided a disk-shaped heater that can be installed horizontally and that can uniformly heat an object to be heated.
【図１】本発明の円盤状ヒータの実施例を示す平面図で
ある。FIG. 1 is a plan view showing an embodiment of a disk-shaped heater of the present invention.
【図２】本発明の円盤状ヒータの他の実施例を示す平面
図である。FIG. 2 is a plan view showing another embodiment of the disc-shaped heater of the present invention.
【図３】本発明の円盤状ヒータのさらに他の実施例を示
す平面図である。FIG. 3 is a plan view showing still another embodiment of the disc heater of the present invention.
【図４】比較例で用いた円盤状ヒータの平面図である。FIG. 4 is a plan view of a disk-shaped heater used in a comparative example.
【図５】本発明の実施例で使用する被加熱板の温度測定
位置を示す平面図である。FIG. 5 is a plan view showing a temperature measurement position of a heated plate used in an example of the present invention.
１ 円盤状ヒータ １Ａ 円盤状ヒータ ２ 帯状ヒータ ３ 隙間 ４ 端子部 ５ 屈曲部の低温領域 ６ 被加熱板 Ｂｎ 直列ヒータ部 Ｃｎ 直列ヒータ部 Ａ 並列ヒータ部 ｂ 直列ヒータ部の幅 ａ 並列ヒータ部の幅 1 disk heater 1A disk heater 2 band heater 3 gap 4 terminals 5 Low temperature region of bend 6 Heated plate Bn series heater Cn series heater A parallel heater b Series heater width a Width of parallel heater part
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 3K092 PP20 QA05 QB30 QB45 RF03 RF17 VV22 4K030 CA04 CA12 KA23 ─────────────────────────────────────────────────── ─── Continued front page F term (reference) 3K092 PP20 QA05 QB30 QB45 RF03 RF17 VV22 4K030 CA04 CA12 KA23
Claims (2)
つ略同心円状に配設してなる円盤状ヒータであって、該
円盤状ヒータは、帯状ヒータを円盤状ヒータの直径部近
傍に屈曲部を有するよう屈曲させて半円内に直列に配設
してなる半円状ヒータを円状に合わせた形状を有し、前
記中央部においては空間部が形成され、帯状ヒータが該
空間部を囲むよう環状に配設されて並列回路を構成して
おり、円盤状ヒータ内での帯状ヒータの配置は前記中央
部に対して点対称となっており、各半円状ヒータの外周
側には、それぞれ端子部が互いに対向する位置関係に設
けられていることを特徴とする円盤状ヒータ。1. A disc-shaped heater in which strip-shaped heaters are arranged in series except for a central portion and in a substantially concentric circle shape. The disc-shaped heater has a strip-shaped heater in the vicinity of a diameter portion of the disc-shaped heater. It has a shape in which semi-circular heaters that are bent so as to have a bent portion and are arranged in series in a semi-circle are combined in a circular shape, and a space portion is formed in the central portion, and the band-shaped heater is the space. They are arranged in an annular shape so as to surround the parts and form a parallel circuit, and the arrangement of the band-shaped heaters in the disk-shaped heater is point-symmetric with respect to the central part, and the outer peripheral side of each semi-circular heater. The disk-shaped heater is characterized in that the terminals are provided in a positional relationship facing each other.
に低温域となる部分を除去したことを特徴とする請求項
１記載の円盤状ヒータ。2. The disc-shaped heater according to claim 1, wherein a portion of the bent portion of the belt-shaped heater which becomes a low temperature region during heating is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001329214A JP2003133032A (en) | 2001-10-26 | 2001-10-26 | Disc-like heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001329214A JP2003133032A (en) | 2001-10-26 | 2001-10-26 | Disc-like heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003133032A true JP2003133032A (en) | 2003-05-09 |
Family
ID=19145153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001329214A Pending JP2003133032A (en) | 2001-10-26 | 2001-10-26 | Disc-like heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003133032A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250816A (en) * | 2006-03-16 | 2007-09-27 | Nokodai Tlo Kk | Crystal growth apparatus |
| JP2008016796A (en) * | 2006-07-05 | 2008-01-24 | Momentive Performance Materials Inc | Electrode pattern for ohmic-resistance heating elements, and substrate treating device |
| US8106335B2 (en) | 2004-07-05 | 2012-01-31 | Tokyo Electron Limited | Processing apparatus and heater unit |
| CN104674195A (en) * | 2013-11-26 | 2015-06-03 | 艾克斯特朗欧洲公司 | Heating apparatus for CVD reactor base |
| JP2018006269A (en) * | 2016-07-07 | 2018-01-11 | 日本特殊陶業株式会社 | Ceramic heater |
| JP2019102135A (en) * | 2017-11-28 | 2019-06-24 | 京セラ株式会社 | heater |
| KR20200041073A (en) * | 2018-10-11 | 2020-04-21 | 엘지전자 주식회사 | Electric Heater |
| CN111560606A (en) * | 2020-05-21 | 2020-08-21 | 北京北方华创微电子装备有限公司 | Heating furnace body control method in semiconductor heat treatment equipment, heating furnace body and equipment |
-
2001
- 2001-10-26 JP JP2001329214A patent/JP2003133032A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8106335B2 (en) | 2004-07-05 | 2012-01-31 | Tokyo Electron Limited | Processing apparatus and heater unit |
| JP2007250816A (en) * | 2006-03-16 | 2007-09-27 | Nokodai Tlo Kk | Crystal growth apparatus |
| JP4631072B2 (en) * | 2006-03-16 | 2011-02-16 | 農工大ティー・エル・オー株式会社 | Crystal growth equipment |
| JP2008016796A (en) * | 2006-07-05 | 2008-01-24 | Momentive Performance Materials Inc | Electrode pattern for ohmic-resistance heating elements, and substrate treating device |
| US8168050B2 (en) | 2006-07-05 | 2012-05-01 | Momentive Performance Materials Inc. | Electrode pattern for resistance heating element and wafer processing apparatus |
| CN104674195A (en) * | 2013-11-26 | 2015-06-03 | 艾克斯特朗欧洲公司 | Heating apparatus for CVD reactor base |
| JP2018006269A (en) * | 2016-07-07 | 2018-01-11 | 日本特殊陶業株式会社 | Ceramic heater |
| JP2019102135A (en) * | 2017-11-28 | 2019-06-24 | 京セラ株式会社 | heater |
| KR20200041073A (en) * | 2018-10-11 | 2020-04-21 | 엘지전자 주식회사 | Electric Heater |
| KR102111332B1 (en) * | 2018-10-11 | 2020-05-15 | 엘지전자 주식회사 | Electric Heater |
| US11253100B2 (en) | 2018-10-11 | 2022-02-22 | Lg Electronics Inc. | Electric heater and electric heating apparatus having same |
| CN111560606A (en) * | 2020-05-21 | 2020-08-21 | 北京北方华创微电子装备有限公司 | Heating furnace body control method in semiconductor heat treatment equipment, heating furnace body and equipment |
| CN111560606B (en) * | 2020-05-21 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Heating furnace body control method in semiconductor heat treatment equipment, heating furnace body and equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4756695B2 (en) | Sheet heater | |
| JP2003017224A (en) | Resistive heating element circuit pattern and substrate processing equipment using the same | |
| JP2003133032A (en) | Disc-like heater | |
| KR102224630B1 (en) | Heating device | |
| TWM522949U (en) | Heating apparatus | |
| KR100847367B1 (en) | Apparatuses and methods for resistively heating a thermal processing system | |
| CN107112214A (en) | Semiconductor layer stack | |
| TWI713408B (en) | Ceramic heater | |
| JP2012028368A (en) | Semiconductor substrate heat treatment apparatus | |
| JPH10208855A (en) | Surface heater | |
| US5700992A (en) | Zigzag heating device with downward directed connecting portions | |
| US20120145701A1 (en) | Electrical resistance heater and heater assemblies | |
| JP3307924B2 (en) | Heat treatment equipment | |
| JP3067490B2 (en) | Heating equipment | |
| JP2873659B2 (en) | Uniform heating sheet for induction cooker | |
| JP7260589B2 (en) | Plate type heating device | |
| JP2018006269A (en) | Ceramic heater | |
| JP2012182221A (en) | Substrate supporting member | |
| JP3844408B2 (en) | Multilayer ceramic heater | |
| KR100363062B1 (en) | wafer heater | |
| JP2014017439A (en) | Semiconductor manufacturing apparatus and semiconductor manufacturing method | |
| KR20200078511A (en) | Heater and its manufacturing method | |
| JP2019096765A (en) | Sic epitaxial growth apparatus | |
| JP3220767B2 (en) | Induction heating cooker heating coil unit | |
| JPH04155822A (en) | Heat treatment device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041018 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060907 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070306 |