JP2003124585A - Universal printed circuit board - Google Patents
Universal printed circuit boardInfo
- Publication number
- JP2003124585A JP2003124585A JP2001318864A JP2001318864A JP2003124585A JP 2003124585 A JP2003124585 A JP 2003124585A JP 2001318864 A JP2001318864 A JP 2001318864A JP 2001318864 A JP2001318864 A JP 2001318864A JP 2003124585 A JP2003124585 A JP 2003124585A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- wiring
- conductive metal
- metal foil
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ユニバーサルプリ
ント配線基板、更に詳しくは配線層間を導電性バンプで
形成した導体配線部で接続する構成を備え、かつ高密度
な配線が可能で汎用性に優れたユニバーサルプリント配
線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a universal printed wiring board, and more particularly to a structure in which wiring layers are connected by a conductive wiring portion formed of conductive bumps, and high density wiring is possible and excellent in versatility. It relates to a universal printed wiring board.
【０００２】[0002]
【従来の技術】従来、両面プリント配線基板或いは多層
プリント配線基板においては、絶縁基材の両面に配設さ
れる配線層間の接続を次のような方法で行っている。例
えば、両面プリント配線基板の場合は、両面銅張基材の
所定の位置にドリルを用いて機械的に通孔を穿設し、当
該通孔の内壁面を含めて全面に化学メッキ処理及び電気
メッキ処理により銅メッキを施して配線層間の接続を行
っている。2. Description of the Related Art Conventionally, in a double-sided printed wiring board or a multi-layered printed wiring board, connection between wiring layers provided on both surfaces of an insulating base material is performed by the following method. For example, in the case of a double-sided printed wiring board, a through hole is mechanically drilled at a predetermined position on the double-sided copper clad substrate, and the entire surface including the inner wall surface of the through hole is subjected to chemical plating and electroplating. Copper plating is applied to connect the wiring layers.
【０００３】また、多層プリント配線基板の場合には、
基材両面に貼着された銅箔に所定の配線形状をパターン
ニングし、そのパターンニング面上にプリプレグに代表
される絶縁基材を介して更に銅箔を積層配設した後、こ
れを加熱状態で加圧して一体化させ、前記両面プリント
配線基板の場合と同様に、所定の位置にドリルを用いて
機械的に通孔を穿設し、当該通孔の内壁面を含めて全面
に化学メッキ処理及び電気メッキ処理により銅メッキを
施して配線層間の接続を行っている。In the case of a multilayer printed wiring board,
Pattern a predetermined wiring shape on the copper foil attached to both sides of the base material, and further stack copper foil on the patterned surface via an insulating base material typified by prepreg, then heat this In this state, pressurize and integrate them, and similarly to the case of the double-sided printed wiring board, mechanically form a through hole with a drill at a predetermined position, and chemically cover the entire surface including the inner wall surface of the through hole. Copper is plated by plating and electroplating to connect the wiring layers.
【０００４】更に、より配線層を重ねる高多層プリント
配線基板の場合は、基材両面に貼着された銅箔に所定の
配線形状をパターンニングしたものを、そのパターンニ
ング面上にプリプレグに代表される絶縁基材を介して積
層数を増加させることにより製造されている。Further, in the case of a high multi-layer printed wiring board having more wiring layers, a copper foil adhered on both sides of a base material is patterned into a predetermined wiring shape, and a prepreg is typically formed on the patterned surface. It is manufactured by increasing the number of layers through the insulating base material.
【０００５】また、これら従来のプリント配線基板の製
造方法においては、所定の位置にドリルを用いて機械的
に通孔を穿設する場合に加え、近年ではレーザーを利用
して通孔を形成する技術も実用化され、より微細な加工
が可能となり、配線層間の接続についても、化学メッキ
処理及び電気メッキ処理により銅メッキを施す方法のほ
かに、銅箔を張着していないプリプレグシートにドリル
やレーザーを用いて通孔を形成し、当該形成した通孔に
導電性ペーストを印刷法等により充填し、通孔内に充填
した導電性ペーストを硬化させた後、銅箔を積層配設し
て加熱状態で加圧することにより一体化させる方法も行
われている。Further, in these conventional methods for manufacturing a printed wiring board, in addition to the case where a through hole is mechanically formed at a predetermined position by using a drill, in recent years, the through hole is formed by using a laser. Technology has also been put into practical use, enabling finer processing, and for the connection between wiring layers, in addition to the method of plating copper by chemical plating and electroplating, drilling on prepreg sheets without copper foil attached A through hole is formed by using a laser or a laser, the conductive paste is filled in the formed through hole by a printing method, etc., and the conductive paste filled in the through hole is cured, and then a copper foil is laminated and arranged. There is also a method of integrating by heating and pressurizing.
【０００６】[0006]
【発明が解決しようとする課題】上記に説明した従来の
プリント配線基板は、いずれもこれを使用する機器類の
専用タイプとして製造されるもので、その製造にあたっ
ては、穿設する通孔の位置を示唆するためのデータを作
成し、当該データに基づいて所定の位置にドリルを用い
て機械的に通孔を穿設し、当該通孔の内壁面を含めて全
面に化学メッキ処理及び電気メッキ処理により銅メッキ
を施して配線層間の接続を行わなければならない。All of the conventional printed wiring boards described above are manufactured as a dedicated type of equipment using the printed wiring board. In manufacturing the printed wiring board, the positions of the through holes to be drilled are required. Data for suggesting that a through hole is mechanically drilled at a predetermined position based on the data, and the entire surface including the inner wall surface of the through hole is subjected to chemical plating and electroplating. Copper must be plated by processing to connect the wiring layers.
【０００７】従って、これら従来の工程には個別のデー
タの作成や専用の治具類が必要となり、それに要するコ
ストも製品に反映せざるを得ない状況となっている。Therefore, these conventional processes require the creation of individual data and dedicated jigs, and the cost required therefor must be reflected in the product.
【０００８】ところで、近年、電子機器類の高性能化、
小型化に伴い、プリント配線基板にも配線パターンの微
細化、通孔の小径化等の高密度化、或いは高多層化が求
められていると同時に、製造コストの低減や製造期間の
短縮といった生産性の向上がつよく望まれている。By the way, in recent years, electronic devices have been improved in performance,
Along with miniaturization, printed wiring boards are required to have finer wiring patterns, higher densities such as through holes with smaller diameters, or higher multilayers, and at the same time, to reduce manufacturing costs and shorten manufacturing time. There is a strong demand for improved sex.
【０００９】一方、こうした市場の要望に基づいて、各
種電子機器類の開発試作も盛んに行われているが、その
開発試作段階でも専用のプリント配線基板が必要とな
り、開発現場では専用のプリント配線基板を製造するた
めのコスト負担が多大なものとなっている。On the other hand, in response to the demands of the market, various electronic devices are being actively developed and prototyped. However, a dedicated printed wiring board is required even in the development and trial production stage, and a dedicated printed wiring is used at the development site. The cost burden for manufacturing the substrate is great.
【００１０】斯様な状況に対して、開発現場では開発す
る各種電子機器類の配線が比較的容易な場合は、図７〜
図１０に示すユニバーサルプリント配線基板を用いるこ
ともある。In such a situation, if it is relatively easy to wire various electronic devices to be developed at the development site, as shown in FIG.
The universal printed wiring board shown in FIG. 10 may be used.
【００１１】図７および図８は片面タイプのユニバーサ
ルプリント配線基板を示し、図７はその要部斜視図、図
８は図７のＢ−Ｂ線断面図であって、紙フェノール樹脂
やガラス織布にエポキシ樹脂を含浸させた材料を用いて
平板状に形成した絶縁板５１と、当該絶縁板５１に電子
部品の基本格子ピッチである２．５４ｍｍ間隔Ｐで穿設
された通孔５２と、絶縁板５１の一方の面に通孔５２に
沿って配設されたランド５３を備えており、当該片面タ
イプのユニバーサルプリント配線基板は、次のようにし
て製造されている。7 and 8 show a single-sided type universal printed wiring board, FIG. 7 is a perspective view of a main part thereof, and FIG. 8 is a sectional view taken along the line BB of FIG. An insulating plate 51 formed in a flat plate shape using a cloth impregnated with an epoxy resin, and through holes 52 formed in the insulating plate 51 at a pitch P of 2.54 mm which is a basic grid pitch of electronic components, The land 53 is provided on one surface of the insulating plate 51 along the through hole 52, and the single-sided universal printed wiring board is manufactured as follows.
【００１２】まず、紙フェノール樹脂やガラス織布にエ
ポキシ樹脂を含浸させた材料を用いて平板状に形成した
絶縁板５１の一方の面に、銅箔を加熱圧着した片面銅張
積層板にドリルを用いて電子部品の基本格子ピッチであ
る２．５４ｍｍ間隔Ｐで通孔５２を穿設し、ランド５３
形状を描画したフィルムやシルクスクリーン版により片
面銅張積層板の銅箔側にランド５３形状に沿ったエッチ
ングレジスト膜を形成した後、エッチングにより不要な
銅箔を除去している。First, one side of an insulating plate 51 formed in a flat plate shape using a material in which paper phenolic resin or glass woven cloth is impregnated with epoxy resin is heat-pressed with a copper foil to form a drill on a single-sided copper-clad laminate. Through holes 52 are formed at a pitch P of 2.54 mm, which is the basic grid pitch of electronic parts, by using
After forming an etching resist film along the shape of the land 53 on the copper foil side of the single-sided copper-clad laminate with a film having a drawn shape or a silk screen plate, unnecessary copper foil is removed by etching.
【００１３】また、図９、図１０は両面スルーホールタ
イプのユニバーサルプリント配線基板を示し、図９はそ
の要部斜視図、図１０は図９のＣ−Ｃ線断面図であっ
て、主にガラス織布にエポキシ樹脂を含浸させた材料を
用いて平板状に形成した絶縁板６１と、当該絶縁板６１
に電子部品の基本格子ピッチである２．５４ｍｍ間隔Ｐ
で穿設され、その内壁面に銅メッキを施したスルーホー
ル６２と、絶縁板６１の両面にスルーホール６２に沿っ
て配設されたランド６３を備えており、当該両面スルー
ホールタイプのユニバーサルプリント配線基板は、次の
ようにして製造されている。9 and 10 show a double-sided through-hole type universal printed wiring board, FIG. 9 is a perspective view of a main portion thereof, and FIG. 10 is a sectional view taken along line CC of FIG. An insulating plate 61 formed in a flat plate shape using a material obtained by impregnating a glass woven cloth with an epoxy resin, and the insulating plate 61.
2.54mm interval P which is the basic grid pitch of electronic parts
The double-sided through-hole type universal print is provided with through-holes 62 that are bored in the inner wall surface of the insulating plate 61 and lands 63 that are arranged along the through-holes 62 on both sides of the insulating plate 61. The wiring board is manufactured as follows.
【００１４】まず、ガラス織布にエポキシ樹脂を含浸さ
せた材料を用いて平板状に形成した絶縁板６１の両面
に、銅箔を加熱圧着した両面銅張積層板にドリルを用い
て電子部品の基本格子ピッチである２．５４ｍｍ間隔Ｐ
で通孔を穿設し、その後、当該通孔の内壁面を含めて全
面に化学メッキ処理及び電気メッキ処理により銅メッキ
を施し、ランド６３形状を描画したフィルムやシルクス
クリーン版によりランド６３形状に沿ったエッチングレ
ジスト膜を形成した後、エッチングにより不要な銅箔を
除去している。First, a double-sided copper-clad laminated sheet in which a copper foil is heat-pressed on both sides of an insulating plate 61 formed in a flat plate shape using a material obtained by impregnating glass woven cloth with an epoxy resin is used to form an electronic component. 2.54 mm interval P, which is the basic lattice pitch
Then, copper plating is performed on the entire surface including the inner wall surface of the through hole by chemical plating and electroplating, and the land 63 shape is formed by a film or silk screen plate on which the land 63 shape is drawn. After forming an etching resist film along with it, unnecessary copper foil is removed by etching.
【００１５】これら、図７〜図１０に示すユニバーサル
プリント配線基板は、開発現場において、リード挿入型
部品を配設しリード線により配線されるが、配線が比較
的容易な場合は利用できるものの複雑な配線には不向き
であると同時に近年多用されている表面実装型の電子部
品を使用することができない。従って、特定の機器類に
ついての専用プリント配線基板を製造しなくとも予め準
備しておくことが出来るが、小型高密度化している現在
の開発現場では殆ど使用することがない。These universal printed wiring boards shown in FIGS. 7 to 10 are provided with lead insertion type components at the development site and are wired by lead wires. However, if the wiring is relatively easy, they can be used but they are complicated. However, it is impossible to use surface mount type electronic parts which have been widely used in recent years. Therefore, it is possible to prepare in advance without manufacturing a dedicated printed wiring board for a specific device, but it is hardly used in the current development site where the size and density are increasing.
【００１６】本発明は、上記の如き問題点を解消するた
めになされたものであり、一方の配線層となる導電性金
属箔と他方の配線層となる導電性金属箔とを絶縁層を介
して狭着固定し、一方の配線層となる導電性金属箔と他
方の配線層となる導電性金属箔間を導電性バンプで接続
して導体配線部を形成し、当該導体配線部を所定のピッ
チ、又は、電子部品の基本格子ピッチ、或いは、電子部
品の基本格子ピッチを整数で分割したピッチで均等に配
列したことを特徴とするユニバーサルプリント配線基板
を提供することを目的とする。The present invention has been made in order to solve the above-mentioned problems, and a conductive metal foil to be one wiring layer and a conductive metal foil to be the other wiring layer are provided with an insulating layer interposed therebetween. Then, the conductive metal foil to be one wiring layer and the conductive metal foil to be the other wiring layer are connected by conductive bumps to form a conductor wiring portion, and the conductor wiring portion is fixed to a predetermined area. An object of the present invention is to provide a universal printed wiring board characterized in that pitches, basic grid pitches of electronic components, or basic grid pitches of electronic components are evenly arranged at a pitch divided by an integer.
【００１７】[0017]
【課題を解決するための手段】本発明に係るユニバーサ
ルプリント配線基板は、一方の配線層となる導電性金属
箔と他方の配線層となる導電性金属箔とを絶縁層を介し
て狭着固定し、一方の配線層となる導電性金属箔と他方
の配線層となる導電性金属箔間を導電性バンプで接続し
て導体配線部を形成し、当該導体配線部を所定のピッチ
で均等に配列したことを特徴とする。In a universal printed wiring board according to the present invention, a conductive metal foil serving as one wiring layer and a conductive metal foil serving as the other wiring layer are sandwiched and fixed via an insulating layer. Then, the conductive metal foil to be one wiring layer and the conductive metal foil to be the other wiring layer are connected by a conductive bump to form a conductor wiring portion, and the conductor wiring portion is evenly arranged at a predetermined pitch. It is characterized by being arranged.
【００１８】また、本発明に係るユニバーサルプリント
配線基板は、上記の発明において導体配線部を電子部品
の基本格子ピッチで均等に配列したことを特徴とする。Further, the universal printed wiring board according to the present invention is characterized in that, in the above invention, the conductor wiring portions are evenly arranged at the basic lattice pitch of the electronic component.
【００１９】また、本発明に係るユニバーサルプリント
配線基板は、上記の発明において導体配線部を電子部品
の基本格子ピッチを整数で分割したピッチで均等に配列
したことを特徴とする。Further, the universal printed wiring board according to the present invention is characterized in that, in the above invention, the conductor wiring portions are evenly arranged at a pitch obtained by dividing the basic lattice pitch of the electronic component by an integer.
【００２０】[0020]
【作用】本発明に係るユニバーサルプリント配線基板
は、一方の配線層となる導電性金属箔と他方の配線層と
なる導電性金属箔とを絶縁層を介して狭着固定し、一方
の配線層となる導電性金属箔と他方の配線層となる導電
性金属箔間を導電性バンプで接続して導体配線部を形成
し、当該導体配線部を所定のピッチで均等に配列したこ
とを特徴としており、ドリルやレーザを用いての通孔の
穿設、或いは銅メッキなどの煩雑で高コストな工程を経
ず配線密度および実装密度が高く汎用性に優れている。In the universal printed wiring board according to the present invention, the conductive metal foil serving as one wiring layer and the conductive metal foil serving as the other wiring layer are tightly fixed to each other via the insulating layer, and one wiring layer is fixed. Characterized in that a conductive wiring part is formed by connecting a conductive metal foil to be the conductive metal foil to be the other wiring layer with a conductive bump, and the conductive wiring part is evenly arranged at a predetermined pitch. In addition, the wiring density and the mounting density are high and the versatility is excellent without a complicated and expensive process such as drilling a through hole using a drill or a laser or copper plating.
【００２１】[0021]
【発明の実施の形態】以下、本発明の実施の形態を、図
面を参照して詳細に説明する。図１はユニバーサルプリ
ント配線基板の平面模式図、図２は図１のＡ−Ａ線断面
図、図３〜４は使用例の説明模式図、図５〜６は製造例
の説明模式図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. 1 is a schematic plan view of a universal printed wiring board, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, FIGS. 3 to 4 are schematic explanatory views of examples of use, and FIGS. .
【００２２】先ず、図１及び図２において、ユニバーサ
ルプリント配線基板本体１は、ガラス織布とエポキシ樹
脂からなる絶縁層５と、一方の配線層となる導電性金属
箔として選択した上面銅箔２と、他方の配線層となる導
電性金属箔として選択した下面銅箔３と、上面銅箔２と
下面銅箔３間を電気的に接続する導体配線部４とで構成
されている。First, referring to FIGS. 1 and 2, the universal printed wiring board body 1 includes an insulating layer 5 made of glass woven cloth and epoxy resin, and an upper surface copper foil 2 selected as a conductive metal foil for one wiring layer. And a lower surface copper foil 3 selected as a conductive metal foil to be the other wiring layer, and a conductor wiring portion 4 electrically connecting between the upper surface copper foil 2 and the lower surface copper foil 3.
【００２３】上面銅箔２と下面銅箔３には厚さ１８μｍ
の電解銅箔を用い、導体配線部４にはの銀系導電性材料
を用い、当該導体配線部４は電子部品の基本格子ピッチ
Ｐでユニバーサルプリント配線基板本体１の縦横に均等
に配設されている。The upper copper foil 2 and the lower copper foil 3 have a thickness of 18 μm.
Of electrolytic copper foil, the conductive wiring portion 4 is made of a silver-based conductive material, and the conductive wiring portion 4 is evenly arranged in the vertical and horizontal directions of the universal printed wiring board body 1 at the basic lattice pitch P of the electronic component. ing.
【００２４】次に製造例の一つについて図５〜６を参照
して説明する。初めに、厚さ１８μｍの電解銅箔からな
る下面銅箔３の上面に、電子部品の基本格子ピッチＰで
通孔を縦横に均等に配置したステンレス製のメタルマス
ク（図示せず）を当接し、銀系導電性ペーストを印刷し
て導体配線部４となる上端部が尖形の導電性バンプ１４
を形成する。Next, one of the manufacturing examples will be described with reference to FIGS. First, a metal mask (not shown) made of stainless steel in which through holes are evenly arranged vertically and horizontally at a basic grid pitch P of electronic components is brought into contact with the upper surface of the lower surface copper foil 3 made of an electrolytic copper foil having a thickness of 18 μm. , A conductive bump 14 having a pointed upper end which becomes a conductor wiring part 4 by printing a silver-based conductive paste
To form.
【００２５】次いで、下面銅箔３の導電性バンプ１４に
対向してガラス織布とエポキシ樹脂とからなるプリプレ
グ１５を位置決め配置し加熱圧着すると、導電性バンプ
１４はプリプレグ１５を貫通する。そして、その上に上
面銅箔２を配置し加熱圧着により積層化すると、上面銅
箔２と下面銅箔３とがプリプレクグ１５、すなわち絶縁
層５を介して狭着固定され、上面銅箔２と下面銅箔３間
を導電性バンプ１４で形成した導体配線部４で接続した
ユニバーサルプリント配線基板本体１が得られる。Then, a prepreg 15 made of a glass woven fabric and an epoxy resin is positioned and arranged so as to face the conductive bumps 14 of the lower surface copper foil 3 and is thermocompression bonded, so that the conductive bumps 14 penetrate the prepreg 15. Then, when the upper surface copper foil 2 is placed thereon and laminated by thermocompression bonding, the upper surface copper foil 2 and the lower surface copper foil 3 are tightly fixed to each other via the prepreg 15, that is, the insulating layer 5, and the upper surface copper foil 2 and The universal printed wiring board main body 1 in which the lower surface copper foils 3 are connected by the conductor wiring portions 4 formed by the conductive bumps 14 is obtained.
【００２６】尚、本実施態様では、一方及び他方の配線
層となる導電性金属箔として厚さ１８μｍの電解銅箔を
選択したが、銅以外の導電性金属材料及びその複合体で
あっても差し支え無く、厚さについても必要に応じて変
更すれば良い。In the present embodiment, an electrolytic copper foil having a thickness of 18 μm was selected as the conductive metal foil to be the one and the other wiring layers, but a conductive metal material other than copper and a composite thereof may be used. There is no problem, and the thickness may be changed as necessary.
【００２７】また、導体配線部４として銀系導電性ペー
ストを用いてメタルマスクを利用した印刷法により形成
した場合を説明したが、金、パラジウム、銅、半田など
の導電性粉末、或いはこれらのバインダー樹脂との複合
材を用いても良い。The case where the conductive wiring portion 4 is formed by a printing method using a metal mask using a silver-based conductive paste has been described. However, conductive powder such as gold, palladium, copper or solder, or a conductive powder of these is used. A composite material with a binder resin may be used.
【００２８】こうして得られたユニバーサルプリント配
線基板本体１の使用例の一つについて図３〜４を参照し
て説明する。上面銅箔２および下面銅箔３のそれぞれの
表面に、所望の配線形状でエッチングレジスト膜を形成
し、エッチング処理後エッチングレジスト膜を剥離する
と図３に示す所望の配線６形状を形成した両面プリント
配線基板が得られる。One example of use of the universal printed wiring board body 1 thus obtained will be described with reference to FIGS. A double-sided print in which an etching resist film having a desired wiring shape is formed on each surface of the upper surface copper foil 2 and the lower surface copper foil 3, and the desired wiring 6 shape shown in FIG. 3 is formed when the etching resist film is peeled off after the etching treatment. A wiring board is obtained.
【００２９】次に、この所望の配線６形状を形成した両
面プリント配線基板にソルダレジスト膜７を印刷法、或
いは写真法で形成すると、直ちに高密度な部品実装が可
能な両面プリント配線基板が得られる。Next, a solder resist film 7 is formed on the double-sided printed wiring board on which the desired wiring 6 is formed by a printing method or a photographic method to immediately obtain a double-sided printed wiring board on which high-density components can be mounted. To be
【００３０】また、上記により得られた両面プリント配
線基板を、プリプレグを介して複数積層してシールド板
を構成し、当該シールド板を従来の製造方法と組み合わ
せることにより、高多層プリント配線基板が得られる。Further, a plurality of double-sided printed wiring boards obtained as described above are laminated via a prepreg to form a shield plate, and the shield plate is combined with a conventional manufacturing method to obtain a high multilayer printed wiring board. To be
【００３１】[0031]
【発明の効果】本発明は、一方の配線層となる導電性金
属箔と他方の配線層となる導電性金属箔とを絶縁層を介
して狭着固定し、一方の配線層となる導電性金属箔と他
方の配線層となる導電性金属箔間を導電性バンプで接続
して導体配線部を形成し、当該導体配線部を所定のピッ
チで均等に配列したことを特徴とするので、電子機器類
の開発試作の段階で専用のプリント配線基板を製造する
ための通孔データ作成や、通孔穿設工程及び銅メッキ工
程を省くことができ開発コストの軽減を図ることが出来
る。According to the present invention, the conductive metal foil to be one wiring layer and the conductive metal foil to be the other wiring layer are sandwiched and fixed with an insulating layer interposed therebetween, and the conductivity of one wiring layer is obtained. The conductive foil is connected between the metal foil and the conductive metal foil to be the other wiring layer with a conductive bump to form a conductive wiring portion, and the conductive wiring portions are evenly arranged at a predetermined pitch. It is possible to reduce the development cost because it is possible to omit the creation of through-hole data for manufacturing a dedicated printed wiring board, the through-hole drilling process and the copper plating process at the stage of development and trial production of devices.
【００３２】即ち、従来、小型高密度化する電子機器類
の開発に必要な銅箔間の導体接続部にも配線や部品実装
が可能な貫通型の導体配線部を有するプリント配線基板
を得るためには高価な専用治具類やデータ作成が必須不
可欠なものであるが、本発明によれば、極めて汎用性が
高く、且つ、応用範囲の広いユニバーサルプリント配線
基板を提供でき、開発スピードの向上やコストの軽減に
多大な貢献をすることができる。That is, in order to obtain a printed wiring board having a through-type conductor wiring portion capable of mounting wiring and components also in the conductor connection portion between copper foils, which has been conventionally required for the development of electronic devices of small size and high density. However, according to the present invention, it is possible to provide a universal printed wiring board that is extremely versatile and has a wide range of applications, and expensive development of jigs and improvement of development speed are required. And can greatly contribute to cost reduction.
【図１】ユニバーサルプリント配線基板本体の平面模式
図である。FIG. 1 is a schematic plan view of a universal printed wiring board body.
【図２】図１のＡ−Ａ線断面模式図である。FIG. 2 is a schematic cross-sectional view taken along the line AA of FIG.
【図３】使用例の説明模式図である。FIG. 3 is a schematic diagram illustrating a usage example.
【図４】使用例の説明模式図である。FIG. 4 is a schematic diagram illustrating an example of use.
【図５】製造例の説明模式図である。FIG. 5 is a schematic diagram illustrating a manufacturing example.
【図６】製造例の説明模式図である。FIG. 6 is a schematic diagram illustrating a manufacturing example.
【図７】従来の片面タイプのユニバーサルプリント配線
基板要部斜視図である。FIG. 7 is a perspective view of a main part of a conventional single-sided universal printed wiring board.
【図８】図７のＢ−Ｂ線断面図である。FIG. 8 is a sectional view taken along line BB in FIG.
【図９】従来の両面タイプのユニバーサルプリント配線
基板要部斜視図である。FIG. 9 is a perspective view of a main part of a conventional double-sided type universal printed wiring board.
【図１０】図９のＣ−Ｃ線断面図である。10 is a cross-sectional view taken along the line CC of FIG.
１ ユニバーサルプリント配線基板本体 ２ 上面銅箔 ３ 下面銅箔 ４ 導体配線部 ５ 絶縁層 ６ 配線 ７ ソルダレジスト膜 １４ 導電性バンプ １５ プリプレグ Ｐ 電子部品の基本格子ピッチ 1 Universal printed wiring board body 2 Top copper foil 3 Bottom copper foil 4 conductor wiring part 5 insulating layers 6 wiring 7 Solder resist film 14 Conductive bump 15 prepreg P Basic grid pitch of electronic parts
Claims (3)
の配線層となる導電性金属箔とを絶縁層を介して狭着固
定し、一方の配線層となる導電性金属箔と他方の配線層
となる導電性金属箔間を導電性バンプで接続して導体配
線部を形成し、当該導体配線部を所定のピッチで均等に
配列したことを特徴とするユニバーサルプリント配線基
板。1. A conductive metal foil serving as one wiring layer and a conductive metal foil serving as the other wiring layer are sandwiched and fixed via an insulating layer, and the conductive metal foil serving as one wiring layer and the other. A conductive printed wiring board is formed by connecting conductive metal foils, which are wiring layers, by conductive bumps, and the conductive wiring portions are evenly arranged at a predetermined pitch.
の配線層となる導電性金属箔とを絶縁層を介して狭着固
定し、一方の配線層となる導電性金属箔と他方の配線層
となる導電性金属箔間を導電性バンプで接続して導体配
線部を形成し、当該導体配線部を電子部品の基本格子ピ
ッチで均等に配列したことを特徴とするユニバーサルプ
リント配線基板。2. A conductive metal foil serving as one wiring layer and a conductive metal foil serving as the other wiring layer are sandwiched and fixed with an insulating layer interposed between the conductive metal foil serving as one wiring layer and the other. A conductive printed wiring board is formed by connecting conductive metal foils, which are wiring layers, by conductive bumps, and the conductive wiring portions are evenly arranged at a basic grid pitch of an electronic component. .
の配線層となる導電性金属箔とを絶縁層を介して狭着固
定し、一方の配線層となる導電性金属箔と他方の配線層
となる導電性金属箔間を導電性バンプで接続して導体配
線部を形成し、当該導体配線部を電子部品の基本格子ピ
ッチを整数で分割したピッチで均等に配列したことを特
徴とするユニバーサルプリント配線基板。3. A conductive metal foil serving as one wiring layer and a conductive metal foil serving as the other wiring layer are sandwiched and fixed via an insulating layer, and a conductive metal foil serving as one wiring layer and the other. The conductive wiring is formed by connecting the conductive metal foils, which will be the wiring layers, by conductive bumps, and the conductive wiring is evenly arranged at a pitch obtained by dividing the basic grid pitch of the electronic component by an integer. And universal printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001318864A JP2003124585A (en) | 2001-10-17 | 2001-10-17 | Universal printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001318864A JP2003124585A (en) | 2001-10-17 | 2001-10-17 | Universal printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003124585A true JP2003124585A (en) | 2003-04-25 |
Family
ID=19136492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001318864A Pending JP2003124585A (en) | 2001-10-17 | 2001-10-17 | Universal printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003124585A (en) |
-
2001
- 2001-10-17 JP JP2001318864A patent/JP2003124585A/en active Pending
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