JP2003108953A - Non-contact ic card - Google Patents
Non-contact ic cardInfo
- Publication number
- JP2003108953A JP2003108953A JP2001295385A JP2001295385A JP2003108953A JP 2003108953 A JP2003108953 A JP 2003108953A JP 2001295385 A JP2001295385 A JP 2001295385A JP 2001295385 A JP2001295385 A JP 2001295385A JP 2003108953 A JP2003108953 A JP 2003108953A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- antenna coil
- wiring board
- electrodes
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 20
- 238000004049 embossing Methods 0.000 claims abstract description 3
- 238000002788 crimping Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- DMDPKUWXJUYFKO-UHFFFAOYSA-N 1,1'-biphenyl;hydrochloride Chemical compound Cl.C1=CC=CC=C1C1=CC=CC=C1 DMDPKUWXJUYFKO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
- G06K19/0726—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、無線送受信機か
らの送信周波数に同調させて信号の送受を実行する非接
触型ＩＣカードに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card for transmitting and receiving a signal in synchronization with a transmission frequency from a wireless transceiver.
【０００２】[0002]
【従来の技術】非接触型のＩＣカードを動作させるに
は、無線送受信機からの送信周波数と非接触型ＩＣカー
ド内の、非接触でデータ通信を行う無線カード用集積回
路とコンデンサとコイルからで構成される送受信回路に
同調させる必要がある。2. Description of the Related Art In order to operate a non-contact type IC card, a transmission frequency from a radio transmitter / receiver and a wireless card integrated circuit for non-contact data communication, a capacitor and a coil in the non-contact type IC card are used. It is necessary to tune to the transmission / reception circuit composed of.
【０００３】一般的な同調の取り方としては、コンデン
サの容量を変える方法がある。この方法は、パターンで
形成されたコンデンサの一部をカットして容量を変化
（減少）させて同調を行っている。As a general tuning method, there is a method of changing the capacitance of a capacitor. In this method, a part of the capacitor formed by the pattern is cut to change (decrease) the capacitance to perform tuning.
【０００４】この方法では、パターンの一部をカットす
るための装置が必要になり、またパターンをカットした
後の修正（再接続）が困難であった。また、複数のコン
デンサパターン部材を用意し、それを接続することで容
量を増やす手法もあるが、導電材を用いるためコスト
高、工程が複雑になる欠点がある。This method requires a device for cutting a part of the pattern, and it is difficult to correct (reconnect) after cutting the pattern. Further, there is a method of increasing the capacity by preparing a plurality of capacitor pattern members and connecting them, but there are drawbacks that the cost is high and the process is complicated because a conductive material is used.
【０００５】[0005]
【発明が解決しようとする課題】上記したように、従来
の非接触型ＩＣカードの同調回路の調整は、パターンで
形成されたコンデンサの一部をカットして容量を変化
（減少）させる方法の場合、パターンの一部をカットす
るための装置が必要になり、またパターンカットした後
の修正が困難になる。また、複数のコンデンサパターン
を部材を用意しそれを接続する手法（容量を増やす）の
場合、導電材を用いるためコスト高、工程が複雑になる
という問題があった。As described above, in the adjustment of the tuning circuit of the conventional non-contact type IC card, the capacitance is changed (decreased) by cutting a part of the capacitor formed by the pattern. In this case, a device for cutting a part of the pattern is required, and it becomes difficult to correct the pattern after cutting. Further, in the case of a method of preparing a plurality of capacitor patterns and connecting them (increasing the capacity), there is a problem that the cost is high and the process is complicated because a conductive material is used.
【０００６】この発明は、複数のコンデンサパターンを
互いに接続することで容量を増やし同調を行う手段を簡
単な構成により実現した非接触型ＩＣカードを提供する
ことにある。An object of the present invention is to provide a non-contact type IC card in which a means for increasing the capacity by connecting a plurality of capacitor patterns to each other and performing tuning is realized by a simple structure.
【０００７】[0007]
【課題を解決するための手段】上記した課題を解決する
ために、この発明の非接触型ＩＣカードによれば、絶縁
性の配線基板と、前記配線基板に固着したアンテナコイ
ルと、受信した信号電波に基づいて電力を生成するとと
もに受信信号の演算処理を行い、該演算結果を前記電力
の余剰分で外部に返信するための送受信部を有し、該送
受信部の一部を前記アンテナコイルの両端に接続した集
積回路と、前記配線基板に固着するとともに前記アンテ
ナコイルの一端に接続した第１の電極と、前記第１の電
極と前記配線基板を挟んで対向配置し、電気的に分離し
て前記配線基板に固着した複数の第２の電極と、前記第
２の電極の中の所望の電極と前記アンテナコイルの他端
に接続された配線バターンに導電性ビンで接続する接続
手段とを具備してなることを特徴とする。In order to solve the above problems, according to the non-contact type IC card of the present invention, an insulating wiring board, an antenna coil fixed to the wiring board, and a received signal are received. There is a transmitter / receiver for generating electric power based on radio waves and performing arithmetic processing of a received signal, and returning the arithmetic result to the outside with an excess of the electric power, and a part of the transmitter / receiver is provided in the antenna coil. The integrated circuit connected to both ends, the first electrode fixed to the wiring board and connected to one end of the antenna coil, and the first electrode and the wiring board are arranged to face each other so as to be electrically separated from each other. A plurality of second electrodes fixed to the wiring board, and a connecting means for connecting a desired electrode in the second electrode and a wiring pattern connected to the other end of the antenna coil with a conductive bin. Be prepared And wherein the Rukoto.
【０００８】上記した手段により、予め用意された複数
の電極を任意に接続して容量を増加させる、という簡単
な構成により受信周波数に対する同調を取ることが可能
となる。By the above means, it is possible to tune to the reception frequency with a simple structure in which a plurality of electrodes prepared in advance are arbitrarily connected to increase the capacitance.
【０００９】[0009]
【発明の実施の形態】以下、この発明の実施の形態につ
いて、図面を参照しながら詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.
【００１０】図１は、この発明の一実施の形態について
説明するための正面図であり、図２は図１のＡ−Ａ´断
面図である。FIG. 1 is a front view for explaining an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA 'in FIG.
【００１１】図１、図２において、１１は、厚さ０．０
２５ｍｍ程度のポリエチレンテレフタレートを用いた絶
縁性の配線基板である。この配線基板１１は、導体とし
て厚さ０．０２ｍｍ程度のアルミ箔を用い、このアルミ
箔をエッチングすることにより配線パターン１２を形成
する。In FIGS. 1 and 2, 11 is a thickness of 0.0
It is an insulating wiring board using polyethylene terephthalate of about 25 mm. The wiring board 11 uses an aluminum foil having a thickness of about 0.02 mm as a conductor, and the wiring pattern 12 is formed by etching the aluminum foil.
【００１２】配線基板１１の外周には配線パターン１２
を形成と同時にエッチングによりアンテナパターン１３
を形成する。アンテナパターン１３は１回以上巻回し、
その一端のアンテナ端子１３ａは集積回路１４内の送受
信回路部の一方のアンテナ入力端子に接続する。アンテ
ナパターン１３はアンテナコイルとなる。集積回路１４
は、アンテナパターン１３を介して外部からの信号電波
を送受信部で受信し、この受信電波に基づいた電力を生
成するとともに演算処理を行い、演算された結果を生成
された電力の余剰分で外部に返信する機能を備えてい
る。A wiring pattern 12 is provided on the outer periphery of the wiring board 11.
The antenna pattern 13 is formed by etching simultaneously with the formation of the
To form. The antenna pattern 13 is wound one or more times,
The antenna terminal 13a at one end is connected to one antenna input terminal of the transmission / reception circuit section in the integrated circuit 14. The antenna pattern 13 serves as an antenna coil. Integrated circuit 14
Receives a signal radio wave from the outside through the antenna pattern 13 at the transmission / reception unit, generates electric power based on the received radio wave, performs arithmetic processing, and outputs the calculated result to the outside with the generated electric power surplus. It has a function to reply to.
【００１３】アンテナパターン１３の他端のアンテナ端
子１３ｂは、スルーホール１５、配線基板１１の裏面側
の配線パターン１６、スルーホール１７を順次介して再
び配線基板１１の表面の配線パターン１２の幅広い配線
パターン１２１の一端に接続し、この配線パターン１２
１の他端を再度幅狭の配線パターンにして集積回路１４
内の送受信回路部の他方のアンテナ入力端子に接続す
る。集積回路１４は、例えばフリップチップの実装方式
により配線基板１１に電気的に接続する。The antenna terminal 13b at the other end of the antenna pattern 13 has a wide wiring of the wiring pattern 12 on the surface of the wiring board 11 again through the through hole 15, the wiring pattern 16 on the back surface side of the wiring board 11, and the through hole 17 in this order. This wiring pattern 12 is connected to one end of the pattern 121.
The other end of 1 is again made into a narrow wiring pattern and the integrated circuit 14
Connect to the other antenna input terminal of the transmitter / receiver circuit inside. The integrated circuit 14 is electrically connected to the wiring board 11 by, for example, a flip chip mounting method.
【００１４】また、集積回路１４の近傍の配線基板１１
の表面部には、コンデンサを構成する一方の共通電極１
８を、エッチングにより配線パターン１２と同時に形成
する。配線基板１１の裏面部の電極１８と対向する位置
には、コンデンサを構成する複数の他方の電極１９ａ〜
１９ｃをそれぞれ形成する。電極１９ａ〜１９ｃは配線
パターン１２１と対向する位置までそれぞれ形成する。
電極１９ａ，１９ｂと配線パターン１２１は、クリッピ
ング接続されたクリンピング接続部２０ａ，２０ｂでそ
れぞれ電気的に接続する。The wiring board 11 near the integrated circuit 14
One of the common electrodes 1 forming a capacitor is provided on the surface of the
8 is formed simultaneously with the wiring pattern 12 by etching. A plurality of other electrodes 19a to 19c constituting the capacitor are provided at positions facing the electrodes 18 on the back surface of the wiring board 11.
19c are formed respectively. The electrodes 19a to 19c are formed up to positions facing the wiring pattern 121, respectively.
The electrodes 19a and 19b and the wiring pattern 121 are electrically connected to each other by the crimping connection portions 20a and 20b which are clipped.
【００１５】このクリッピング接続は、図３に示すよう
に、矢印方向に図示しない尖頭の金型を用い配線基板１
１の幅広の配線パターン１２１から電極１９ａまで突き
刺すことにより、配線パターン１２１と電極１９ａを電
気的に接続を行うものである。配線基板１１には比較的
柔らかな材料であるポリエチレンテレフタレートを用い
ていることから、このような接続が実現できる。For this clipping connection, as shown in FIG. 3, a wiring board 1 is formed by using a pointed die not shown in the arrow direction.
The wiring pattern 121 and the electrode 19a are electrically connected by piercing from the wide wiring pattern 121 of No. 1 to the electrode 19a. Since the wiring board 11 uses polyethylene terephthalate, which is a relatively soft material, such a connection can be realized.
【００１６】集積回路１４を実装した後に、同調周波数
を測定し所定の同調周波数に合わせるために電極１９ａ
〜１９ｃのいくつかと配線バターン１２１を電気的に接
続して所望の値を値を得ている。After mounting the integrated circuit 14, the electrode 19a is used for measuring the tuning frequency and adjusting it to a predetermined tuning frequency.
A desired value is obtained by electrically connecting some of the wiring patterns 19c to the wiring pattern 121.
【００１７】なお、図１では、電極１９ａおよび１９ｂ
をクリンピング接続して共通電極１８との間にコンデン
サＣ１，Ｃ２を形成したものである。このとき、配線基
板１１はコンデンサＣ１，Ｃ２の誘電体となる。In FIG. 1, electrodes 19a and 19b are provided.
Are connected by crimping and capacitors C1 and C2 are formed between the capacitors and the common electrode 18. At this time, the wiring board 11 serves as a dielectric of the capacitors C1 and C2.
【００１８】電極１９ｃはクリンピング接続されていな
いが、共振回路の容量を増やす必要がある場合は、配線
パターン１２１側から型押しによりこれらを電気的に接
続してコンデンサを形成させて、同調回路の同調を調整
することが可能となる。Although the electrode 19c is not crimp-connected, if it is necessary to increase the capacitance of the resonance circuit, the wiring pattern 121 side is electrically connected to each other by embossing to form a capacitor, and the tuning circuit It is possible to adjust the tuning.
【００１９】ここで、厚さ０．０２５ｍｍのポリエチレ
ンテレフタレートを誘電体として用い、表裏のアルミ電
極で挟んだところ、電極１９ａ〜１９ｃの一つの電極の
面積１ｃｍ×１ｃｍとした場合、一つの電極と共通電極
１８との間の容量は約１００ｐＦとなった。Here, when polyethylene terephthalate having a thickness of 0.025 mm is used as a dielectric substance and sandwiched between aluminum electrodes on the front and back sides, when one electrode of electrodes 19a to 19c has an area of 1 cm × 1 cm, it is regarded as one electrode. The capacitance with the common electrode 18 was about 100 pF.
【００２０】図４は、電極１９ａ〜１９ｃのいくつかと
配線バターン１２１を接続するための他の例を示すもの
である。すなわち、尖頭の導電性ピン４１を配線基板１
１の幅広の配線パターン１２１から電極１９ａまで突き
刺すことにより、図３のクリンピング接続と同様に配線
パターン１２１と電極１９ａを電気的に接続を行うこと
ができる。FIG. 4 shows another example for connecting some of the electrodes 19a to 19c and the wiring pattern 121. That is, the conductive pin 41 at the tip is connected to the wiring board 1.
By piercing from the wide wiring pattern 121 of No. 1 to the electrode 19a, the wiring pattern 121 and the electrode 19a can be electrically connected similarly to the crimping connection of FIG.
【００２１】図５は、図１の等価回路であり、コンデン
サＣ１〜Ｃ３とアンテナコイル１３とにより構成される
同調回路５せ１において、コンデンサＣ１〜Ｃ３の並列
接続する数を任意に選択することにより所定の周波数に
同調させている。FIG. 5 is an equivalent circuit of FIG. 1, in which the number of capacitors C1 to C3 to be connected in parallel can be arbitrarily selected in the tuning circuit 5 to 1 composed of the capacitors C1 to C3 and the antenna coil 13. Is tuned to a predetermined frequency.
【００２２】図６は、図１を配線基板１１の両面に表面
シート６１と裏面シート６２で挟み込み、熱プレスにて
一体化してＩＣカード形状とした状態を示す正面図、図
７は図６のＢ−Ｂ´断面図である。表面シート６１と裏
面シート６２の材料は、たとえば塩化ビフェニールを用
いる。FIG. 6 is a front view showing a state in which FIG. 1 is sandwiched between both surfaces of the wiring board 11 by a top sheet 61 and a back sheet 62 and integrated by a heat press to form an IC card shape. FIG. It is a BB 'sectional view. As a material for the top sheet 61 and the back sheet 62, for example, biphenyl chloride is used.
【００２３】この発明は上記した実施の形態に限定され
るものではない。たとえば、電極１９ａ〜１９ｃは同一
の面積として同様の容量としたが、これらの面積の異な
る電極とし、所望の電極を任意に選択することにより微
調整が可能となる。また、表裏の導体を同じ種類（例え
ばアルミ）を用いたが、銅箔とアルミ箔の組み合わせで
もかまわない。また、集積回路実装方式はワイヤーボン
ディング方式でも構わない。The present invention is not limited to the above embodiment. For example, the electrodes 19a to 19c have the same area and have the same capacity, but electrodes having different areas can be used and fine adjustment can be performed by arbitrarily selecting a desired electrode. Further, the same type of conductor (for example, aluminum) is used for the front and back surfaces, but a combination of copper foil and aluminum foil may be used. Further, the integrated circuit mounting method may be a wire bonding method.
【００２４】上記したように、この発明では予め用意さ
れた複数の電極をクリッピング接続によって容量を増加
させる簡単な構成により受信周波数に対する同調を取る
ことが可能となる。As described above, according to the present invention, it is possible to tune to a reception frequency with a simple structure in which a plurality of electrodes prepared in advance are increased in capacity by clipping connection.
【００２５】[0025]
【発明の効果】以上説明したように、この発明の非接触
型ＩＣカードによれば、用意された複数の電極を任意に
クリッピング接続して容量を増加させるという簡単な構
成により受信周波数に対する同調を取ることが可能とな
る。As described above, according to the non-contact type IC card of the present invention, the tuning for the reception frequency is performed by a simple structure in which the prepared electrodes are arbitrarily connected by clipping to increase the capacitance. It is possible to take.
【図１】この発明の一実施の形態について説明するため
の正面図。FIG. 1 is a front view for explaining an embodiment of the present invention.
【図２】図１のＡ−Ａ´断面図。FIG. 2 is a sectional view taken along the line AA ′ of FIG.
【図３】図１のコンデンサの形成の一例について説明す
るための断面図。FIG. 3 is a sectional view for explaining an example of forming the capacitor of FIG.
【図４】図１のコンデンサの形成の他の例について説明
するための断面図。FIG. 4 is a cross-sectional view for explaining another example of forming the capacitor of FIG.
【図５】図１の等価回路。5 is an equivalent circuit of FIG.
【図６】図１の構成に外装を施しＩＣカード化した状態
を示す正面図。6 is a front view showing a state in which an IC card is formed by applying an exterior to the configuration of FIG.
【図７】図６のＢ−Ｂ´断面図。7 is a cross-sectional view taken along the line BB ′ of FIG.
１１…配線基板 １２，１２１…配線パターン １３…アンテナパターン １３ａ，１３ｂ…アンテナ入力端子 １４…集積回路 １５，１７…スルーホール １８…共通電極 １９ａ〜１９ｃ…電極 ２０ａ，２０ｂ…クリッピング接続部 ４１…導電性ピン 11 ... Wiring board 12, 121 ... Wiring pattern 13 ... Antenna pattern 13a, 13b ... Antenna input terminal 14 ... Integrated circuit 15, 17 ... Through hole 18 ... Common electrode 19a to 19c ... Electrodes 20a, 20b ... Clipping connection part 41 ... Conductive pin
Claims (6)
信信号の演算処理を行い、該演算結果を前記電力の余剰
分で外部に返信するための送受信部を有し、該送受信部
の一部を前記アンテナコイルの両端に接続した集積回路
と、 前記配線基板に固着するとともに前記アンテナコイルの
一端に接続した第１の電極と、 前記第１の電極と前記配線基板を挟んで対向配置し、電
気的に分離して前記配線基板に固着した複数の第２の電
極と、 前記第２の電極の中の所望の電極と前記アンテナコイル
の他端に接続された配線バターンに導電性ビンで接続す
る接続手段とを具備してなることを特徴とする非接触型
ＩＣカード。1. An insulating wiring board, an antenna coil fixed to the wiring board, electric power generated based on a received signal radio wave, arithmetic processing of a received signal is performed, and the arithmetic result is a surplus of the electric power. An integrated circuit having a transmitter / receiver for returning to the outside in minutes, and a part of the transmitter / receiver connected to both ends of the antenna coil; and a first fixed to the wiring board and connected to one end of the antenna coil. Electrode, a plurality of second electrodes that are arranged so as to face the first electrode with the wiring board sandwiched therebetween, and are electrically separated and fixed to the wiring board, and a desired one of the second electrodes. A non-contact type IC card comprising an electrode and a connecting means connected to a wiring pattern connected to the other end of the antenna coil with a conductive bottle.
ンで形成し、前記配線基板を誘電体とするコンデンサで
あることを特徴とする請求項１記載の非接触型ＩＣカー
ド。2. The non-contact type IC card according to claim 1, wherein the first and second electrodes are capacitors formed by wiring patterns and using the wiring substrate as a dielectric.
端に接続された配線バターン側から第２の電極まで型押
しし、前記配線パターンと前記第２の電極を電気的に接
続するクリンピング接続であることを特徴とする請求項
１記載の非接触型ＩＣカード。3. The crimping connection for embossing from the wiring pattern side connected to the other end of the antenna coil to the second electrode to electrically connect the wiring pattern to the second electrode. The non-contact type IC card according to claim 1, wherein
端に接続された配線バターン側から第２の電極まで導電
性ビンを差し込み電気的に接続したことを特徴とする請
求項１記載の非接触型ＩＣカード。4. The non-connecting device according to claim 1, wherein the connecting means is electrically connected by inserting a conductive bin from the wiring pattern side connected to the other end of the antenna coil to the second electrode. Contact type IC card.
電極および前記第１の電極と前記アンテナコイルは前記
集積回路の受信部の同調回路を構成してなることを特徴
する請求項１記載の非接触型ＩＣカード。5. The tuning circuit of the receiving section of the integrated circuit, wherein the second electrode, the first electrode and the antenna coil connected by the connecting means form a tuning circuit. Non-contact type IC card.
してなることを特徴とする請求項１記載の非接触型ＩＣ
カード。6. The non-contact type IC according to claim 1, wherein the second electrode is composed of electrodes having different areas.
card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001295385A JP2003108953A (en) | 2001-09-27 | 2001-09-27 | Non-contact ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001295385A JP2003108953A (en) | 2001-09-27 | 2001-09-27 | Non-contact ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003108953A true JP2003108953A (en) | 2003-04-11 |
Family
ID=19116830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001295385A Pending JP2003108953A (en) | 2001-09-27 | 2001-09-27 | Non-contact ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003108953A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006068985A (en) * | 2004-09-01 | 2006-03-16 | Dainippon Printing Co Ltd | Noncontact data carrier and manufacturing method thereof |
| JP2007041666A (en) * | 2005-08-01 | 2007-02-15 | Ricoh Co Ltd | Rfid tag and method for manufacturing the same |
| JP2008009882A (en) * | 2006-06-30 | 2008-01-17 | Fujitsu Ltd | Rfid tag, and manufacturing method thereof |
| JP2010103215A (en) * | 2008-10-22 | 2010-05-06 | Toppan Printing Co Ltd | Circuit board and method of manufacturing the same, and antenna sheet and non-contact ic card using the circuit board |
| JP2020072464A (en) * | 2018-10-29 | 2020-05-07 | 京セラ株式会社 | Substrate for rfid tag, rfid tag, and rfid system |
-
2001
- 2001-09-27 JP JP2001295385A patent/JP2003108953A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006068985A (en) * | 2004-09-01 | 2006-03-16 | Dainippon Printing Co Ltd | Noncontact data carrier and manufacturing method thereof |
| JP4566664B2 (en) * | 2004-09-01 | 2010-10-20 | 大日本印刷株式会社 | Non-contact data carrier and manufacturing method thereof |
| JP2007041666A (en) * | 2005-08-01 | 2007-02-15 | Ricoh Co Ltd | Rfid tag and method for manufacturing the same |
| JP2008009882A (en) * | 2006-06-30 | 2008-01-17 | Fujitsu Ltd | Rfid tag, and manufacturing method thereof |
| JP2010103215A (en) * | 2008-10-22 | 2010-05-06 | Toppan Printing Co Ltd | Circuit board and method of manufacturing the same, and antenna sheet and non-contact ic card using the circuit board |
| JP2020072464A (en) * | 2018-10-29 | 2020-05-07 | 京セラ株式会社 | Substrate for rfid tag, rfid tag, and rfid system |
| JP7120941B2 (en) | 2018-10-29 | 2022-08-17 | 京セラ株式会社 | Substrate for RFID tag, RFID tag and RFID system |
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