JP2003086667A - Cassette for thin wafer and suction band - Google Patents
Cassette for thin wafer and suction bandInfo
- Publication number
- JP2003086667A JP2003086667A JP2001276063A JP2001276063A JP2003086667A JP 2003086667 A JP2003086667 A JP 2003086667A JP 2001276063 A JP2001276063 A JP 2001276063A JP 2001276063 A JP2001276063 A JP 2001276063A JP 2003086667 A JP2003086667 A JP 2003086667A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- cassette
- wafer
- thin
- thin wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、半導体装置を製
造するためのウェーハ処理装置等で使用され、特に極薄
化された薄厚ウェーハ用のカセット及び、このカセット
に対して薄厚ウェーハを出し入れするために用いる吸着
ハンドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in a wafer processing apparatus or the like for manufacturing a semiconductor device, and particularly for an extremely thin wafer cassette for thin wafers, and for loading and unloading thin wafers into and from this cassette. The suction hand used for.
【０００２】[0002]
【従来の技術】図１３と図１４は、半導体装置を製造す
るためのウェーハ処理装置の一例を概略的に示し、ウェ
ーハ受渡しロボット１を中心にして、ウェーハＡの供給
部となるローダ部２と、ウェーハＡの位置合わせを行う
アライメント部３と、ウェーハＡに対する処理部４と、
ウェーハＡの収納部となるアンローダ部５が配置され、
ウェーハ受渡しロボット１は、ローダ部２から取り出し
たウェーハＡを、アライメント部３と処理部４に順次移
送し、処理後のウェーハＡを処理部４から取り出してア
ンローダ部５に収納することになる。13 and 14 schematically show an example of a wafer processing apparatus for manufacturing a semiconductor device, with a wafer transfer robot 1 as a center and a loader section 2 serving as a supply section for a wafer A. An alignment unit 3 for aligning the wafer A, a processing unit 4 for the wafer A,
An unloader unit 5 serving as a storage unit for the wafer A is arranged,
The wafer transfer robot 1 sequentially transfers the wafer A taken out from the loader unit 2 to the alignment unit 3 and the processing unit 4, and takes the processed wafer A out of the processing unit 4 and stores it in the unloader unit 5.
【０００３】上記処理部４は、ウェーハＡに対する検
査、表面保護テープの剥離、ダイポンドテープ張り付け
等の処理を行う部分である。The processing section 4 is a section for performing processing such as inspection of the wafer A, peeling of the surface protection tape, and attachment of the die pond tape.
【０００４】上記ウェーハ受渡しロボット１は、上下動
できる支柱６の上端に回転動する第１アーム７と、この
第１アーム７の先端に回転動する第２アーム８と、この
第２アーム８の先端に回転動する吸着ハンド９をそれぞ
れ取り付けて形成され、各々の回転を制御することによ
り、吸着ハンド９に所望の動きを与えることができるよ
うになっている。The wafer delivery robot 1 has a first arm 7 that rotates at the upper end of a column 6 that can move up and down, a second arm 8 that rotates at the tip of the first arm 7, and a second arm 8 of the second arm 8. The suction hands 9 that rotate and move are attached to the tip ends of the suction hands 9. By controlling the rotations of the suction hands 9, desired movements can be given to the suction hands 9.
【０００５】上記ローダ部２とアンローダ部５は、ウェ
ーハＡを上下多段に収納するカセット１０を用いて形成
され、ウェーハ受渡しロボット１の吸着ハンド９がカセ
ット１０の各段に対するウェーハＡの出し入れを行うこ
とになる。The loader section 2 and the unloader section 5 are formed by using a cassette 10 for accommodating the wafers A in a multistage structure, and the suction hand 9 of the wafer transfer robot 1 takes the wafer A in and out of each stage of the cassette 10. It will be.
【０００６】なお、ローダ部２とアンローダ部５を一つ
のカセット１０にまとめ、取り出したウェーハＡを処理
後に元のカセットに戻すようにすることもある。In some cases, the loader unit 2 and the unloader unit 5 may be integrated into one cassette 10 and the taken-out wafer A may be returned to the original cassette after processing.
【０００７】図１５乃至図１７は、従来のカセット１０
を示し、上壁１１と下壁１２及び両側の側壁１３で角筒
形に形成され、両側壁１３の対向する内面にウェーハＡ
を支持するための支持板１４がそれぞれ上下に一定の間
隔を設けて多段に突設され、吸着ハンド９は、取り出さ
んとするウェーハＡの下部に挿入され、吸引状態で上昇
することによりウェーハＡの下面を吸着保持して持ち上
げ、ウェーハＡをカセット１０内から取り出すようにな
っている。15 to 17 show a conventional cassette 10.
The upper wall 11 and the lower wall 12 and the side walls 13 on both sides are formed into a rectangular tube shape, and the wafer A is formed on the inner surfaces of the both side walls 13 facing each other.
Support plates 14 for supporting the wafer A are projected in a multi-tiered manner with a certain interval between the upper and lower sides, and the suction hand 9 is inserted into the lower portion of the wafer A to be taken out, and the suction hand 9 is raised in the suction state to raise the wafer A. The lower surface of the wafer 10 is suction-held and lifted, and the wafer A is taken out from the cassette 10.
【０００８】上記支持板１４は、図１５のように、ウェ
ーハＡの周囲両側を支持するように側壁１３の内面に水
平状態で前後に長く形成され、上下支持板１４の対向面
間にウェーハＡの周囲両側が納まる溝となるスロット１
５を形成している。As shown in FIG. 15, the support plate 14 is horizontally formed on the inner surface of the side wall 13 so as to support both sides of the wafer A, and the wafer A is provided between the opposing surfaces of the upper and lower support plates 14. Slot 1 that is a groove that fits on both sides of the
5 is formed.
【０００９】また、両側壁１３の後端部は垂直状態で互
いに内側へ傾斜状に屈曲し、その内面がウェーハＡの周
囲で後部両側が当接するストッパー部１６となり、カセ
ット１０内にウェーハＡを位置決め支持するようになっ
ている。Further, the rear ends of both side walls 13 are bent inward in a vertical state in a slanting manner with each other, and the inner surfaces thereof serve as stopper portions 16 with which the rear sides of the wafer A come into contact with each other. It is designed to support positioning.
【００１０】図１６は、スロット１５の間隔が狭く設定
されたカセット１０を示し、スロット１５の間隔は、例
えば８インチのウェーハ用で３／８インチ、６インチの
ウェーハ用で３／１６インチに設定されている。FIG. 16 shows the cassette 10 in which the intervals of the slots 15 are set to be narrow. The intervals of the slots 15 are, for example, 3/8 inch for 8 inch wafers and 3/16 inch for 6 inch wafers. It is set.
【００１１】図１７は、スロット１５の間隔が広く設定
されたカセット１０を示し、スロット１５の間隔は、上
記の２〜３倍に設定されている。FIG. 17 shows the cassette 10 in which the intervals between the slots 15 are set wide, and the intervals between the slots 15 are set to be 2 to 3 times the above.
【００１２】また、ウェーハＡを吸着して移送するため
に用いる従来の吸着ハンド９には特開平１１−５４５８
５号で示されているフオーク状の吸着ハンドと、特開平
７−１０６４００号のような丸形状の吸着ハンドがあ
る。A conventional suction hand 9 used for suctioning and transferring the wafer A is disclosed in Japanese Patent Laid-Open No. 11-5458.
There are a fork-shaped suction hand shown in No. 5 and a round-shaped suction hand as disclosed in JP-A-7-106400.
【００１３】前者のフオーク状の吸着ハンドは、ハンド
の先端を二又状にしてその両側先端の上面に吸着孔を設
け、ハンドに設けた１系統の吸気通路を両吸着孔と接続
し、この吸気通路に接続した吸引源の作動により、両側
の吸着孔でウェーハを吸着するようになっている。In the former fork-shaped suction hand, the tip of the hand is bifurcated and suction holes are provided on the upper surfaces of both ends of the hand, and one intake passage of the system provided in the hand is connected to both suction holes. The wafer is sucked by the suction holes on both sides by the operation of the suction source connected to the suction passage.
【００１４】後者の丸形状の吸着ハンドは、ハンドの先
端を円形にし、その先端部の上面に円弧状の吸着孔を設
け、ハンドに設けた１系統の吸気通路を吸着孔と接続
し、この吸気通路に接続した吸引源の作動により、吸着
孔でウェーハを吸着するようになっている。In the latter round-shaped suction hand, the tip of the hand is made circular, an arc-shaped suction hole is provided on the upper surface of the tip, and one system of intake passage provided in the hand is connected to the suction hole. The operation of the suction source connected to the suction passage sucks the wafer in the suction hole.
【００１５】ところで、近年、電子関連機器、情報機器
等の小型化及びＩＣカードの普及等に伴って、半導体ウ
ェーハのより一層の極薄化、大口径化が進み、従来の４
００〜３００μｍ程度から１００〜５０μｍ程度又はそ
れ以下の薄厚状のウェーハを取り扱うことが要求される
ようになってきた。By the way, in recent years, with the miniaturization of electronic-related equipment, information equipment, etc., and the widespread use of IC cards, semiconductor wafers have become much thinner and larger.
It has become necessary to handle thin wafers having a thickness of about 00 to 300 μm to about 100 to 50 μm or less.
【００１６】このような薄厚ウェーハは、外周縁部の断
面形状が弧状となる厚めのウェーハの下面側を研削、エ
ッチングにより除去して薄厚状に形成されているため、
外周縁部は断面がナイフエッジ状となり、また外周縁部
の平面形状は、波形状となっているので、僅かな外圧で
も割れや欠けが生じ易い状態になっている。Since such a thin wafer is formed by grinding and etching the lower surface side of a thicker wafer whose outer peripheral edge has an arcuate cross-sectional shape, it is formed into a thin shape.
Since the outer peripheral edge portion has a knife-edge-shaped cross section and the outer peripheral edge portion has a corrugated planar shape, even a slight external pressure is likely to cause cracking or chipping.
【００１７】また、薄厚のウェーハは、平面的な形状
が、反り、撓み、波打ち等の異形状になったり、異形状
になりやすい状態になっている。Further, the thin wafer has a planer shape such as a warp, a warp, or a wavy shape, or is likely to have a different shape.
【００１８】[0018]
【発明が解決しようとする課題】このため、上記した従
来のカセット１０において、両側壁１３の後端部にウェ
ーハＡの周囲で後部両側が当接する直線状のストッパー
部１６を設けた構造ではウェーハＡの取り出し時に吸着
ハンド９を上昇させると、ウェーハＡは外周部がストッ
パー部１６に接触して擦りつつ上昇するので、該ウェー
ハＡにストレスを与え、薄厚のウェーハでは割れや欠け
が生じる原因となる。For this reason, in the conventional cassette 10 described above, in the structure in which the linear stopper portions 16 with which the rear sides contact each other around the wafer A are provided at the rear ends of the side walls 13, When the suction hand 9 is lifted when taking out A, the outer peripheral portion of the wafer A comes in contact with the stopper portion 16 and rises while rubbing, which causes stress on the wafer A and causes cracks or chips in thin wafers. Become.
【００１９】また、スロット１４の間隔を狭く設定した
従来のカセット１０に、薄厚のウェーハを吸着ハンド９
で収納する場合、上記したように、該ウェーハが異形状
になっていると、ウェーハの両側部分が対向するスロッ
ト１５内に入らない場合や、上下段差状に入ったりする
という問題がある。Further, a thin cassette wafer is sucked into a conventional cassette 10 in which the intervals between the slots 14 are set narrow.
In the case of storing the wafer in the above-mentioned manner, as described above, if the wafer has a different shape, there is a problem that both side portions of the wafer may not enter the facing slots 15 or may enter into a stepped shape.
【００２０】仮に対向するスロット１５内に収納できて
も、図１６に二点鎖線で示すように、薄厚のウェーハａ
は自重で下方に垂れ下がってしまい、そのため、取り出
し時に吸着ハンドをウェーハａの下部に挿入できないと
いう問題がある。Even if it can be accommodated in the opposing slots 15, as shown by the chain double-dashed line in FIG.
Has a problem of being unable to insert the suction hand into the lower part of the wafer a at the time of taking it out because it hangs downward due to its own weight.
【００２１】このように、スロット１５の間隔を狭く設
定した従来のカセット１０では、薄厚のウェーハａの収
納、取り出しは実質的に不可能である。As described above, in the conventional cassette 10 in which the intervals between the slots 15 are set narrow, it is practically impossible to store and take out the thin wafer a.
【００２２】そこで、図１７に示したように、スロット
１５の間隔を広く設定したカセット１０を使用して薄厚
のウェーハａの収納、取り出しを行っているが、スロッ
ト１５の間隔を広くすると、上位支持板１４の下面でウ
ェーハａの外周端を支えることで、少しでも垂れ下がり
量を少なくしようとすることができないので、スロット
１５の間隔を狭く設定したカセット１０の場合よりも、
薄厚のウェーハａの垂れ下がり量が大きくなり、該ウェ
ーハａに余分なストレスを与えることになる。Therefore, as shown in FIG. 17, the cassette 10 in which the intervals between the slots 15 are set wide is used to store and take out the thin wafer a. By supporting the outer peripheral edge of the wafer a with the lower surface of the support plate 14, it is not possible to reduce the amount of sag even by a small amount. Therefore, as compared with the case of the cassette 10 in which the intervals of the slots 15 are set narrower,
The amount of sagging of the thin wafer a increases, and extra stress is applied to the wafer a.
【００２３】また、薄厚のウェーハａの取り出し時にお
いて、吸着ハンド９が上昇してウェーハａを吸着するも
のであるが、スロット１５の間隔が広いと、吸着ハンド
９の上昇でそのままウェーハａを持ち上げてしまい、吸
着ミスが生じるだけでなく、上位のウェーハａと接触し
て破損の原因となる。Further, when the thin wafer a is taken out, the suction hand 9 rises to suck the wafer a. However, if the gap between the slots 15 is wide, the suction hand 9 rises to lift the wafer a as it is. This not only causes a suction error, but also causes damage due to contact with the upper wafer a.
【００２４】更に、従来の吸着ハンド９は、フォーク状
の場合は先端の両側に吸着孔を設け、丸形状の場合は先
端に円弧状の吸着孔を設け、これらの吸着孔を１系統の
吸気通路で吸引する構造になっているため、平面的に異
形状になっている薄厚ウェーハａを吸引しようとする
と、吸着孔の一部が吸引してもウェーハａが吸着ハンド
９に馴染まないため、他の部分が吸引しない状態が生
じ、このため、吸着ミスが発生し、カセット１０に対し
て薄厚のウェーハａの収納、取り出しが行えないことに
なる。Further, the conventional suction hand 9 is provided with suction holes on both sides of the tip in the case of a fork shape, and is provided with an arc-shaped suction hole in the tip in the case of a round shape, and these suction holes are used as a single suction system. Since the structure is such that the wafer is sucked in the passage, when the thin wafer a having a different shape in a plane is to be sucked, the wafer a does not fit in the suction hand 9 even if a part of the suction holes is sucked. A state occurs in which the other portions are not sucked, which causes a suction error, making it impossible to store or take out the thin wafer a from the cassette 10.
【００２５】そこで、この発明の課題は、薄厚ウェーハ
の収納、取り出しが確実に行え、取り出し時に割れや欠
けを生じさせることのない薄厚ウェーハ用カセットと、
このカセットに対する薄厚ウェーハの収納、取り出しに
際しての吸着ミスの発生がない吸着ハンドを提供するこ
とにある。Therefore, an object of the present invention is to provide a cassette for a thin wafer, which can surely store and take out a thin wafer, and which does not cause cracks or chips at the time of taking out.
An object of the present invention is to provide a suction hand in which a suction error does not occur when a thin wafer is stored in or taken out from this cassette.
【００２６】[0026]
【課題を解決するための手段】上記のような課題を解決
するため、この発明は、薄厚ウェーハを収納するカセッ
トの両側壁の対向する内面間に、両側に平行部分を残し
て前縁から後方に吸着ハンドの通過用切り欠き部が形成
された支持板を上下に所定の間隔で多段に設け、各支持
板上の後端部側で両側の位置に上部が小径となるストッ
パーを設け、上記カセットの両側壁の内面で上下支持板
間の位置に、端部の下面が端部上がりに傾斜するスペー
サを下位支持板との対向面間に薄厚ウェーハの挿入間隔
を形成した状態で設けた構成を採用したものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is directed to the rear from the front edge, leaving parallel portions on both sides between opposed inner surfaces of both side walls of a cassette for accommodating thin wafers. The support plates on which the notches for passing the suction hand are formed are provided vertically in multiple stages at predetermined intervals, and stoppers having a small upper part are provided at both sides on the rear end side of each support plate. A structure in which a spacer whose lower end is inclined upward to the end is provided at a position between the upper and lower support plates on the inner surfaces of both side walls of the cassette in a state in which a thin wafer insertion interval is formed between the facing surfaces of the lower support plate. Is adopted.
【００２７】上記ストッパは、上部が小径の円錐台形状
となり、支持板上で支持した薄厚ウェーハの取り出し時
に吸着ハンドを上昇させると、ウェーハ外周部がストッ
パーに接触することなく上昇するので、該ウェーハにス
トレスを与えたり、該ウェーハの外周に割れや欠けが生
じさせることがない。The upper part of the stopper has a truncated cone shape with a small diameter, and when the suction hand is raised when taking out the thin wafer supported on the support plate, the outer peripheral portion of the wafer rises without coming into contact with the stopper. Does not cause stress or cracks or chips on the outer periphery of the wafer.
【００２８】また、下位支持板とスペーサの対向面間に
形成した薄厚ウェーハの挿入間隔は、スペーサの端部の
下面を端部上がりに傾斜させることによって、ウェーハ
を出し入れする部分が広幅となり、挿入間隔に対する薄
厚ウェーハの収納、取り出しが支障なく行え、スペーサ
により挿入間隔を狭く設定することで、支持板上で支持
した薄厚ウェーハの外周端部をスペーサで受け、薄厚ウ
ェーハの垂れ下がり発生を少なくすることができる。Further, as for the insertion interval of the thin wafer formed between the lower support plate and the facing surface of the spacer, by inclining the lower surface of the end portion of the spacer to the end rising, the portion for loading and unloading the wafer becomes wide and the insertion The thin wafers can be stored and taken out with respect to the space without any trouble.By setting the insertion interval to be narrow by the spacer, the outer peripheral edge of the thin wafer supported on the support plate can be received by the spacer, and the occurrence of sagging of the thin wafer can be reduced. You can
【００２９】上記スペーサは、カセットの側壁に対して
上下に位置調整が可能となるよう取り付けるようにして
薄厚ウェーハの厚みの変化に対応できるようにしたり、
支持板の切り欠き部の内端部に薄厚ウェーハの支持舌片
が前方に向けて突出するように設け、薄厚ウェーハを安
定よく支持できるようにすることもできる。The above spacers are attached to the side wall of the cassette so that the position of the spacers can be adjusted up and down, so that the spacers can respond to changes in the thickness of thin wafers.
It is also possible to provide the supporting tongue piece of the thin wafer at the inner end portion of the cutout portion of the supporting plate so as to project forward, so that the thin wafer can be stably supported.
【００３０】また、薄厚ウェーハ用吸着ハンドとして、
薄厚ウェーハを多段に収納するカセットに対応して配置
され、薄厚ウェーハを底面からエア吸着することによっ
て、この薄厚ウェーハをカセットに対して出し入れする
薄厚ウェーハ用吸着ハンドにおいて、吸着ハンドのカセ
ットに対して出し入れする部分の上面に独立した複数の
吸着部を設け、この吸着ハンドに少なくとも２系統以上
の吸気通路を設け、各吸気通路を異なる吸着部とそれぞ
れ接続した構成を採用したものである。As a suction hand for thin wafers,
It is arranged corresponding to a cassette that stores thin wafers in multiple stages, and by suctioning the thin wafers from the bottom by air, in a thin wafer suction hand that takes this thin wafer in and out of the cassette, A plurality of independent suction portions are provided on the upper surface of the portion to be taken in and out, at least two intake passages are provided in this suction hand, and each suction passage is connected to a different suction portion.
【００３１】上記複数の吸着部のそれぞれが複数の吸着
孔によって形成され、各系統の吸気通路は対応する吸着
部の各吸着孔と接続されているようにしたり、複数の吸
着部のそれぞれが多孔質の通気性部材によって形成さ
れ、各系統の吸気通路は対応する吸着部の通気性部材と
接続されているようにすることができる。Each of the plurality of suction portions is formed by a plurality of suction holes, the intake passage of each system is connected to each suction hole of the corresponding suction portion, or each of the plurality of suction portions is porous. The air intake passage of each system may be connected to the air permeable member of the corresponding adsorption portion.
【００３２】このように、独立した複数の吸着部を設
け、これを２系統以上の吸気通路で個々に吸引すると、
各吸着部はそれぞれ独立して吸引力が発生し、異形状に
なっている薄厚ウェーハでも吸着ハンドの上面になじむ
よう平坦な状態で吸着できることになる。As described above, when a plurality of independent suction portions are provided and the suction portions are individually sucked in two or more intake passages,
A suction force is independently generated in each suction portion, and even a thin wafer having a different shape can be sucked in a flat state so as to fit on the upper surface of the suction hand.
【００３３】[0033]
【発明の実施の形態】以下、この発明の実施の形態を図
示例と共に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【００３４】図１は、この発明に係る薄厚ウェーハ用カ
セットの第１の実施の形態を示す平面図、図２は同じく
第２の実施の形態を示す平面図、図３は両実施の形態の
正面図、図４は両実施の形態の縦断側面図である。FIG. 1 is a plan view showing a first embodiment of a thin wafer cassette according to the present invention, FIG. 2 is a plan view showing the same second embodiment, and FIG. 3 is a view of both embodiments. A front view and FIG. 4 are longitudinal side views of both embodiments.
【００３５】上記第１の実施の形態のカセット２１は、
フォーク状の吸着ハンド９に対応し、第２の実施の形態
のカセット２１は、丸形状の吸着ハンド９に対応する例
であり、両者は吸着ハンド９に対応する部分の構造以外
は共通するので、共通部分は同時に説明する。The cassette 21 of the first embodiment is
It corresponds to the fork-shaped suction hand 9, and the cassette 21 of the second embodiment is an example corresponding to the round suction hand 9, and both are common except for the structure of the portion corresponding to the suction hand 9. , Common parts will be explained at the same time.
【００３６】上記各図において、薄厚ウェーハａ用のカ
セット２１は、上壁２２と下壁２３及び両側の側壁２４
で角筒形に形成され、両側壁２４の対向する内面間に薄
厚ウェーハａを支持するための薄い板状の支持板２５が
それぞれ上下に広い一定の間隔で多段に設けられ、各支
持板２４上の後端部側で両側の位置に上部が小径となる
円錐台形状のストッパー２６が起立状に設けられ、上記
両側壁２４の内面で上下支持板２５間の位置に、スペー
サ２７が下位支持板２５との対向面間に薄厚ウェーハａ
の挿入間隔を形成した状態で設けられている。In each of the above drawings, the cassette 21 for the thin wafer a has an upper wall 22, a lower wall 23 and side walls 24 on both sides.
Are formed in a rectangular tube shape, and thin plate-shaped support plates 25 for supporting the thin wafer a are provided between the inner surfaces of the both side walls 24 facing each other in a multi-step manner at a wide constant interval in the vertical direction. A truncated cone-shaped stopper 26 having a small upper diameter is provided upright at both sides on the upper rear end side, and a spacer 27 is supported at a lower position between the upper and lower support plates 25 on the inner surface of the both side walls 24. A thin wafer a is provided between the surfaces facing the plate 25.
It is provided in a state where the insertion interval of is formed.
【００３７】上記支持板２５は、前縁から後方に吸着ハ
ンド９の通過用切り欠き部２８が後部接続部分２９を残
して形成され、この切り欠き部２９の両側が側壁２４の
内面に沿って前縁から後方に所定の幅で直線状に伸びる
平行部分３０となり、薄厚ウェーハａは、ストッパー２
６へ当接する状態で、この支持板２５の両側平行部分３
０と後部接続部分２９によって周囲が支持されることに
なる。The supporting plate 25 is formed with a cutout 28 for passage of the suction hand 9 rearward from the front edge, leaving a rear connecting portion 29, and both sides of the cutout 29 are along the inner surface of the side wall 24. The parallel portion 30 linearly extends rearward from the front edge with a predetermined width.
6 on both sides of the support plate 25 in a state of abutting against
0 and the rear connecting part 29 will provide peripheral support.
【００３８】フォーク状の吸着ハンド９に対応するカセ
ット２１の支持板２５は、図１のように、切り欠き部２
８の内端部に薄厚ウェーハａの支持舌片３１が、フォー
ク状の吸着ハンド９と干渉しないように前方に向けて突
設され、薄厚ウェーハａの支持面積を増大させ、薄厚ウ
ェーハａの垂れ下がりの発生を殆ど解消できるようにし
ている。The support plate 25 of the cassette 21 corresponding to the fork-shaped suction hand 9 has a cutout 2 as shown in FIG.
A support tongue piece 31 for the thin wafer a is provided at the inner end portion of 8 to project forward so as not to interfere with the fork-shaped suction hand 9, increasing the support area of the thin wafer a and allowing the thin wafer a to hang down. Is almost eliminated.
【００３９】また、図２のように、丸形状の吸着ハンド
９に対応するカセット２１の支持板２５は、丸形状の吸
着ハンド９の通過を許容する切り欠き部２８だけが設け
られている。Further, as shown in FIG. 2, the support plate 25 of the cassette 21 corresponding to the round suction hand 9 is provided with only the cutout portion 28 which allows the round suction hand 9 to pass therethrough.
【００４０】上記スペーサ２７は、支持板２５の両側平
行部分３０と略同程度の幅を有する前後に長い板状とな
り、上記両側壁２４の内面で上下支持板２５間の位置に
平行部分３０と対向するよう取り付けられ、スペーサ２
７の下面と下位支持板２５の上面との対向面間が薄厚ウ
ェーハａの挿入間隔となるスロット３２になり、このス
ペーサ２７の両端部の下面は端部上がりの傾斜面３３に
なっている。The spacer 27 has a plate shape having a width substantially equal to that of the parallel portions 30 on both sides of the support plate 25 and is long in the front-rear direction. Spacers 2 attached to face each other
The space between the lower surface of 7 and the upper surface of the lower support plate 25 is a slot 32 that serves as an insertion interval for the thin wafer a, and the lower surfaces of both ends of the spacer 27 are inclined surfaces 33 that rise upward.
【００４１】このように、支持板２５の上下間隔を広く
設定しても、スペーサ２７を設けることにより、スロッ
ト３２の間隔を狭く設定でき、支持板２５上で支持した
薄厚ウェーハａの外周端部をスペーサ２７の下面で受
け、薄厚ウェーハａの垂れ下がり発生を少なくすること
ができると共に、取り出し時に吸着ハンド９による上昇
でそのまま薄厚ウェーハａを持ち上げることのないよう
にすることができる。As described above, even if the vertical spacing of the support plate 25 is set wide, the spacing of the slots 32 can be set narrow by providing the spacer 27, and the outer peripheral end portion of the thin wafer a supported on the support plate 25 can be set. The lower surface of the spacer 27 can be used to reduce the occurrence of sagging of the thin wafer a, and it is possible to prevent the thin wafer a from being lifted as it is due to the rise by the suction hand 9 at the time of taking out.
【００４２】また、スペーサ２７の端部下面を傾斜面３
３とすることで、スロット３２の薄厚ウェーハａを出し
入れする部分の間隔が広幅となり、スロット３２に対す
る薄厚ウェーハａの収納、取り出しが支障なく行えるこ
とになる。Further, the lower surface of the end portion of the spacer 27 is provided with an inclined surface 3
By setting the number to 3, the interval of the portion of the slot 32 where the thin wafer a is taken in and out becomes wide, and the thin wafer a can be stored in and taken out from the slot 32 without any trouble.
【００４３】上記スペーサ２７は、図３と図４のよう
に、カセット２１の側壁２４にこの側壁２４に設けた上
下方向の長孔３４とボルト３５で、支持板２５の平行部
分３０に対して上下に位置調整が可能となるよう取り付
けられ、スロット３２の間隔を支持する薄厚ウェーハａ
の種類、大きさ、反り形状、厚み等の変化に応じて任意
に調整できるようになっている。As shown in FIGS. 3 and 4, the spacer 27 is provided on the side wall 24 of the cassette 21 by means of vertical holes 34 and bolts 35 provided on the side wall 24, with respect to the parallel portion 30 of the support plate 25. A thin wafer a which is mounted so as to be vertically adjustable and supports the space between the slots 32.
It can be arbitrarily adjusted according to changes in type, size, warp shape, thickness and the like.
【００４４】この発明のカセットは、上記のような構成
であり、図１３で例示したように、半導体装置を製造す
るためのウェーハ処理装置のローダ部２とアンローダ部
５に配置し、薄厚ウェーハａの取り出しと収納に使用す
るものであり、図１と図２のように、平面的には、カセ
ット２１内に収納した薄厚ウェーハａは、支持板２５の
両側平行部分３０と後部接続部２９で周縁部が支持され
た状態で後部周縁がストッパー２６に当接し、正面から
見ると図３のように、周縁の両側端部が支持板２５の平
行部分３０とスペーサ２７間のスロット３２に収まり、
自重で少し垂れ下がる状態になる。The cassette of the present invention has the above-described structure, and as shown in FIG. 13, it is arranged in the loader section 2 and the unloader section 5 of the wafer processing apparatus for manufacturing a semiconductor device, and the thin wafer a As shown in FIGS. 1 and 2, in plan view, the thin wafer a stored in the cassette 21 is formed by the parallel portions 30 on both sides of the support plate 25 and the rear connecting portion 29. With the peripheral edge supported, the rear peripheral edge abuts the stopper 26, and when viewed from the front, both side edges of the peripheral edge are accommodated in the slot 32 between the parallel portion 30 of the support plate 25 and the spacer 27, as shown in FIG.
It hangs a little under its own weight.
【００４５】この時、スロット３２の間隔はスペーサ２
７の配置により狭く設定されているので、薄厚ウェーハ
ａの周縁の両側端部がスペーサ２７の下面に当たって支
持され、薄厚ウェーハａの自重による垂れ下がり量の発
生を少なくしている。At this time, the space between the slots 32 is set to the spacer 2
Since the width is set to be narrow by the arrangement of the thin wafers a, both side edges of the peripheral edge of the thin wafer a are abutted against and supported by the lower surface of the spacer 27, and the amount of sagging of the thin wafer a due to its own weight is reduced.
【００４６】薄厚ウェーハａの取り出し時において、上
記のように、薄厚ウェーハａの上下に吸着ハンド９を抜
き差しできる空間を確保することができ、カセット２１
内に進入させた吸着ハンド９を上昇させて薄厚ウェーハ
ａを確実に吸着することができ、カセット２１内からの
薄厚ウェーハａの取り出しが支障なく行えることにな
る。At the time of taking out the thin wafer a, it is possible to secure a space in which the suction hand 9 can be inserted and removed above and below the thin wafer a, as described above.
The thin wafer a can be surely sucked by raising the suction hand 9 that has entered the inside, and the thin wafer a can be taken out from the cassette 21 without any trouble.
【００４７】また、吸着ハンド９の上昇時に薄厚ウェー
ハａも上昇するが、ストッパー２６は、上部が小径の円
錐台形状となっているので、薄厚ウェーハａの外周縁部
がストッパー２６に接触することなく上昇し、該ウェー
ハａにストレスを与えたり、該ウェーハａの外周に割れ
や欠けを生じさせることがない。Although the thin wafer a also rises when the suction hand 9 rises, since the stopper 26 has a truncated cone shape with a small diameter at the upper portion, the outer peripheral edge of the thin wafer a should contact the stopper 26. Without rising, the wafer a is not stressed, and the outer periphery of the wafer a is not cracked or chipped.
【００４８】更に、吸着ハンド９で吸着した薄厚ウェー
ハａの収納時において、下位支持板２５とスペーサ２７
の対向面間に形成したスロット３２の間隔は、スペーサ
２７の端部の下面を端部上がりに傾斜面３３とすること
によって、薄厚ウェーハａを出し入れする部分が広幅と
なり、薄厚ウェーハａの両側外周縁部を正確にスロット
３２へ挿入させることができ、このように、この発明の
カセット２１は１００〜５０μｍ程度又はそれ以下の薄
厚ウェーハａの収納や取り出しが支障なく行えることに
なる。Further, when the thin wafer a sucked by the suction hand 9 is stored, the lower support plate 25 and the spacer 27 are used.
The intervals of the slots 32 formed between the facing surfaces of the thin wafer a are widened by making the lower surface of the end of the spacer 27 an inclined surface 33 with the end rising so that the portion where the thin wafer a is put in and taken out becomes wide. The peripheral portion can be accurately inserted into the slot 32, and thus the cassette 21 of the present invention can store and take out thin wafers a of about 100 to 50 μm or less without any trouble.
【００４９】次に、図５乃至図１２は、この発明の吸着
ハンド４１の構造を示し、基本的には、吸着ハンド４１
のカセット２１に対して出し入れする部分の上面に独立
した複数の吸着部を設け、この吸着ハンド４１に少なく
とも２系統以上の吸気通路を設け、各吸気通路を異なる
吸着部とそれぞれ接続して形成されている。Next, FIGS. 5 to 12 show the structure of the suction hand 41 of the present invention, and basically, the suction hand 41.
A plurality of independent suction portions are provided on the upper surface of the portion to be taken in and out of the cassette 21, and the suction hand 41 is provided with at least two intake passages, and each suction passage is connected to a different suction portion. ing.
【００５０】先ず、図５と図６に示す第１の実施の形態
は、フォーク状吸着ハンドの例であり、この吸着ハンド
４１は、幅の狭い根元部分４２の先端に広幅部４３を連
成した、板厚が１．５ｍｍ程度の基板４４と、この基板
４４の広幅部４３の上面に重ねた板厚が０．５ｍｍ程度
の上板４５と、上記基板４４の下面で根元部分４２から
広幅部４３の途中の位置にわたって重ねた板厚が１．５
ｍｍ程度の底板４６との三層構造からなり、基板４４と
上板４５は、先端部から略中間にわたる深さの平面Ｕ字
状の切り欠き４７で二又のフォーク状に形成され、この
吸着ハンド４１は、基板４４と底板４６の根元部分４２
の下部に固定した支持体４８を介して、図１３で示した
ウェーハ受渡しロボットの第２アームの先端に水平状態
で回転可能に取り付けられる。First, the first embodiment shown in FIGS. 5 and 6 is an example of a fork-shaped suction hand, and this suction hand 41 has a wide portion 43 connected to the tip of a narrow base portion 42. In addition, a board 44 having a thickness of about 1.5 mm, an upper plate 45 having a thickness of about 0.5 mm stacked on the upper surface of the wide portion 43 of the board 44, and a wide portion from the root portion 42 on the lower surface of the board 44. The plate thickness over the middle of the portion 43 is 1.5
The base plate 44 and the upper plate 45 are formed in a bifurcated fork shape with a flat U-shaped notch 47 having a depth extending from the front end portion to approximately the middle thereof. The hand 41 includes a base 44 and a base portion 42 of the bottom plate 46.
13 is rotatably attached to the tip of the second arm of the wafer transfer robot shown in FIG.
【００５１】上記上板４５は、その上面で薄厚ウェーハ
ａを吸着するためのものであり、この上板４５には、切
り欠き４７の周囲を囲むように弧状に配置された複数の
第１吸気孔４９と、この第１吸気孔４９群の外側に配置
された複数の第２吸気孔５０とがそれぞれ上下に貫通す
るように設けられ、基板４４の上面に、第１吸気孔４９
群とそれぞれ連通する弧状の第１吸気溝５１と、吸着ハ
ンド４１の前後中心線を挟んで両側に対称状に配置さ
れ、両側の第２吸気孔５０群とそれぞれ連通する二本の
第２吸気溝５２とが凹設されている。The upper plate 45 is for adsorbing the thin wafer a on the upper surface thereof, and the upper plate 45 has a plurality of first suction holes arranged in an arc shape so as to surround the notch 47. A hole 49 and a plurality of second air intake holes 50 arranged outside the first air intake hole group 49 are provided so as to vertically penetrate each other, and the first air intake hole 49 is formed on the upper surface of the substrate 44.
An arc-shaped first intake groove 51 that communicates with each of the groups, and two second intake holes that are symmetrically arranged on both sides of the suction hand 41 with respect to the front-rear center line and that communicate with the second intake holes 50 on both sides. The groove 52 is provided as a recess.
【００５２】また、底板４６の上面には、第１吸気通路
５３と第２吸気通路５４が分離独立して形成され、第１
吸気通路５３は、先端が基板４４に設けた連通孔５５で
第１吸気溝５１と連通し、後端は支持体４８の下部に設
けた第１吸気口５６と連通孔５７を介して連通する直線
状に凹設され、第２吸気通路５４は、支持体４８の下部
に設けた第２吸気口５８と後端が連通孔５９を介して連
通し、この後端から二又状となって前方に伸び、その両
側先端が第２吸気溝５２とそれぞれ基板４４に設けた連
通孔６０を介して連通している。A first intake passage 53 and a second intake passage 54 are formed separately on the upper surface of the bottom plate 46, and
The intake passage 53 has a front end communicating with the first intake groove 51 through a communication hole 55 provided in the base plate 44, and a rear end communicating with a first intake port 56 provided at a lower portion of the support 48 through a communication hole 57. The second intake passage 54 is linearly recessed, and the second intake port 58 provided in the lower portion of the support 48 communicates with the rear end thereof through a communication hole 59, and the second intake passage 54 is bifurcated from the rear end. It extends forward and both ends thereof communicate with the second intake groove 52 through the communication holes 60 provided in the substrate 44, respectively.
【００５３】上記のように、支持体４８の下部に設けた
第１吸気口５６と第２吸気口５８を個々に吸気源と接続
することにより、第１吸気孔４９群と第２吸気孔５０群
は２系統の独立した吸気通路で個々に吸引されることに
なる。As described above, the first intake port 56 and the second intake port 58 provided in the lower portion of the support 48 are individually connected to the intake source, so that the first intake port group 49 and the second intake port 50 are connected. The group will be individually sucked by two independent intake passages.
【００５４】次に、図７と図８に示す第２の実施の形態
は、フォーク状吸着ハンド４１の他の例である。Next, a second embodiment shown in FIGS. 7 and 8 is another example of the fork-shaped suction hand 41.
【００５５】この第２の実施の形態は、吸着部分に例え
ば多孔質セラミックのような通気性部材である吸着ポー
ラスを使用したものであり、この吸着ハンド４１は、幅
の狭い根元部分６１の先端に広幅部６２を連成した、板
厚が２ｍｍ程度の基板６３と、この基板６３の下面で根
元部分６１から広幅部６２の途中の位置にわたって重ね
た板厚が１．５ｍｍ程度の底板６４との二層構造からな
り、基板６３は先端部から略中間にわたる深さの平面Ｕ
字状の切り欠き６５で二又のフオーク状に形成され、基
板６３と底板６４の根元部分６１の下部に支持体６６が
固定されている。In the second embodiment, a suction porous member, which is a breathable member such as porous ceramic, is used in the suction portion, and the suction hand 41 has a tip of a narrow base portion 61. A substrate 63 having a plate thickness of about 2 mm, which is connected to the wide part 62, and a bottom plate 64 having a plate thickness of about 1.5 mm, which is stacked on the lower surface of the substrate 63 from a root portion 61 to a position in the middle of the wide part 62. The substrate 63 has a flat surface U having a depth extending from the tip to substantially the middle.
It is formed in a forked shape by a notch 65 having a letter shape, and a support body 66 is fixed to the lower portion of the base portion 61 of the base plate 63 and the bottom plate 64.
【００５６】上記基板６３の上面で切り欠き６５の周囲
を囲むようにして、後部の位置に第１の凹部６７と、両
側の位置にそれぞれ第２の凹部６８を設け、第１の凹部
６７内に第１吸着ポーラス６９を、第２の凹部６８に第
２吸着ポーラス７０を、上面が基板６３と同一面になる
ようそれぞれ嵌め込んで取り付け、底板６４の上面に
は、第１吸気通路７１と第２吸気通路７２が分離独立し
て形成され、第１吸気通路７１は、先端が基板６３に設
けた連通孔７３で第１吸着ポーラス６９と連通し、後端
は支持体６６の下部に設けた第１吸気口７４と連通孔７
５を介して連通する直線状に凹設され、第２吸気通路７
２は、支持体６６の下部に設けた第２吸気口７６と連通
孔７７を介して後端が連通し、この後端から二又状とな
って前方に伸び、その両側先端が第２吸着ポーラス７０
とそれぞれ基板６３に設けた連通孔７８を介して連通し
ている。A first recess 67 is provided at a rear position and second recesses 68 are provided at both sides so as to surround the notch 65 on the upper surface of the substrate 63, and the first recess 67 is provided in the first recess 67. The first suction porous body 69 and the second suction porous body 70 are fitted into the second recess 68 so that the upper surfaces thereof are flush with the substrate 63, and are attached to the upper surface of the bottom plate 64. An intake passage 72 is formed separately, and the first intake passage 71 has a leading end that communicates with the first adsorption pore 69 through a communication hole 73 provided in the substrate 63, and a rear end that is provided below the support body 66. 1 Intake port 74 and communication hole 7
The second intake passage 7 is formed in a straight line and communicates with the second intake passage 7 through
The second end communicates with the second intake port 76 provided in the lower portion of the support body 66 through the communication hole 77 at the rear end, and extends forward from the rear end in a bifurcated shape. Porous 70
And communication with each other via communication holes 78 provided in the substrate 63.
【００５７】上記のように、支持体６６の下部に設けた
第１吸気口７４と第２吸気口７６を個々に吸気源と接続
することにより、第１吸着ポーラス６９と第２吸着ポー
ラス７０は２系統の独立した吸気通路で個々に吸引され
ることになる。As described above, by connecting the first intake port 74 and the second intake port 76 provided in the lower portion of the support 66 individually to the intake source, the first adsorption porous 69 and the second adsorption porous 70 are formed. It will be sucked individually by the two independent intake passages.
【００５８】図９と図１０に示す第３の実施の形態は、
丸形状吸着ハンドの例であり、上記した第１の実施の形
態と同一部分については、同一符号を付して説明する。The third embodiment shown in FIGS. 9 and 10 is
This is an example of a round suction hand, and the same parts as those in the above-described first embodiment will be described with the same reference numerals.
【００５９】この第３の実施の形態の吸着ハンド４１
は、幅の狭い根元部分４２の先端に広幅部４３を連成し
た基板４４と、この基板４４の広幅部４３の上面に重ね
た上板４５と、上記基板４４の下面で根元部分４２から
広幅部４３の途中の位置にわたって重ねた底板４６との
三層構造からなり、基板４４と上板４５、先端部が円弧
に形成され、基板４４と底板４６の根元部分４２の下部
に支持体４８が固定されている。The suction hand 41 of the third embodiment
Is a substrate 44 in which a wide portion 43 is connected to the tip of a narrow base portion 42, an upper plate 45 overlaid on the upper surface of the wide portion 43 of the substrate 44, and a wide portion from the root portion 42 on the lower surface of the substrate 44. It has a three-layer structure with a bottom plate 46 that is overlapped over the middle part of the portion 43. The substrate 44, the upper plate 45, and the tip end portion are formed into an arc, and the support body 48 is provided below the base portion 42 of the substrate 44 and the bottom plate 46. It is fixed.
【００６０】上記上板４５には、中央部の位置に十字状
に配置された複数の第１吸気孔８１と、この第１吸気孔
８１群の外側に円状に配置された複数の第２吸気孔８２
とがそれぞれ上下に貫通するように設けられ、基板４４
の上面に、第１吸気孔８１群とそれぞれ連通する円形の
第１吸気溝８３と、その外側に一部切り離しの環状に配
置され、第２吸気孔８２とそれぞれ連通する第２吸気溝
８４とが凹設されている。On the upper plate 45, a plurality of first intake holes 81 arranged in a cross shape at a central portion, and a plurality of second intake holes 81 arranged outside the first intake hole group 81 in a circular shape. Intake hole 82
Are provided so as to penetrate vertically, respectively, and the substrate 44
On the upper surface of the first intake holes 81, a circular first intake groove 83 that communicates with the first intake holes 81, and a second intake groove 84 that is arranged on the outer side of the first intake groove 83 in a partially cut-off annular shape and that communicates with the second intake holes 82. Is recessed.
【００６１】また、底板４６の上面には、第１吸気通路
５３と第２吸気通路５４が分離独立して形成され、第１
吸気通路５３は、先端が基板４４に設けた連通孔５５で
第１吸気溝８３と連通し、後端は支持体４８の下部に設
けた第１吸気口５６と連通孔５７を介して連通する直線
状に凹設され、第２吸気通路５４は、支持体４８の下部
に設けた第２吸気口５８と後端が連通孔５９を介して連
通し、先端が第２吸気溝８４と基板４４に設けた連通孔
６０を介して連通している。Further, a first intake passage 53 and a second intake passage 54 are separately formed on the upper surface of the bottom plate 46.
The intake passage 53 has a front end communicating with the first intake groove 83 through a communication hole 55 provided in the substrate 44, and a rear end communicating with a first intake port 56 provided at a lower portion of the support 48 through a communication hole 57. The second intake passage 54, which is linearly recessed, has a rear end that communicates with a second intake port 58 provided in the lower portion of the support body 48 through a communication hole 59, and a second end that has the second intake groove 84 and the substrate 44. Through the communication hole 60 provided in the.
【００６２】上記のように、支持体４８の下部に設けた
第１吸気口５６と第２吸気口５８を個々に吸気源と接続
することにより、第１吸気孔８１群と第２吸気孔８２群
は２系統の独立した吸気通路で個々に吸引されることに
なる。As described above, the first intake port 56 and the second intake port 58 provided in the lower portion of the support 48 are individually connected to the intake source, so that the first intake port group 81 and the second intake port 82 are connected. The group will be individually sucked by two independent intake passages.
【００６３】図１１と図１２に示す第４の実施の形態
は、丸形状の吸着ハンドの他の例であり、上記した第２
の実施の形態と同一部分については、同一符号を付して
説明する。The fourth embodiment shown in FIGS. 11 and 12 is another example of the round suction hand, which is the second embodiment described above.
The same parts as those of the embodiment will be described with the same reference numerals.
【００６４】この第４の実施の形態は、吸着部分に第２
の実施の形態と同様、吸着ポーラスを使用したものであ
り、この吸着ハンド４１は、幅の狭い根元部分６１の先
端に広幅部６２を連成した基板６３と、この基板６３の
下面で根元部分６１から広幅部６２の途中の位置にわた
って重ねた底板６４との二層構造からなり、基板６３は
先端部が円弧状に形成され、基板６３と底板６４の根元
部分の下部に支持体６６が固定されている。In the fourth embodiment, the second part is attached to the adsorption part.
Similar to the embodiment of the present invention, a suction porous body is used. This suction hand 41 has a substrate 63 in which a wide portion 62 is connected to the tip of a narrow base portion 61, and a base portion at the lower surface of the substrate 63. The base plate 63 has a two-layered structure including a bottom plate 64 stacked from 61 to a wide position in the middle of the wide part 62. The substrate 63 has an arc-shaped tip, and a support body 66 is fixed to the lower portions of the base parts of the substrate 63 and the bottom plate 64. Has been done.
【００６５】上記基板６３の上面には、中央に円形の第
１の凹部９１と、その外側に環状の第２の凹部９２と第
３の凹部９３を同軸心状の配置で独立して設け、第１の
凹部９１内に円形の第１吸着ポーラス９４を、第２の凹
部９２に環状の第２吸着ポーラス９５を、第３の凹部９
３に環状の第３吸着ポーラス９６を、上面が基板６３と
同一面になるようそれぞれ嵌め込んで取り付け、底板６
４の上面には、第１吸気通路７１と第２吸気通路７２及
び第３吸気通路９７が分離独立して形成され、第１吸気
通路７１は、先端が基板６３に設けた連通孔７３で第１
吸着ポーラス９４と連通し、後端は支持体６６の下部に
設けた第１吸気口７４と連通孔７５を介して連通する直
線状に凹設され、第２吸気通路７２は、支持体６６の下
部に設けた第２吸気口７６と後端が連通孔７７を介して
連通し、先端は第２吸着ポーラス９５と基板６３に設け
た連通孔７８を介して連通し、第３吸気通路９７は、支
持体６６の下部に設けた第３吸気口９８と後端が連通孔
１００を介して連通し、その先端が第３吸着ポーラス９
６と基板６３に設けた連通孔９９を介して連通してい
る。On the upper surface of the substrate 63, a circular first concave portion 91 is provided at the center, and an annular second concave portion 92 and a third concave portion 93 are independently provided on the outer side thereof in a coaxial arrangement. A circular first adsorption pore 94 is provided in the first recess 91, an annular second adsorption pore 95 is provided in the second recess 92, and a third recess 9 is provided.
The ring-shaped third suction porous member 96 is fitted and attached to the upper surface of the base plate 63 so that the upper surface thereof is flush with the substrate 63.
A first intake passage 71, a second intake passage 72, and a third intake passage 97 are formed separately on the upper surface of 4, and the first intake passage 71 has a communication hole 73 whose tip is provided in the substrate 63. 1
The rear end is communicated with the adsorption porous body 94, and the rear end thereof is linearly recessed so as to communicate with the first intake port 74 provided at the lower portion of the support body 66 through the communication hole 75, and the second intake passage 72 is provided with the second intake passage 72 of the support body 66. The second intake port 76 provided in the lower part communicates with the rear end through the communication hole 77, the front end communicates with the second adsorption pore 95 through the communication hole 78 provided in the substrate 63, and the third intake passage 97 forms , The third intake port 98 provided at the lower portion of the support 66 communicates with the rear end thereof through the communication hole 100, and the front end thereof has the third adsorption porous 9
6 and the substrate 63 through a communication hole 99 provided in the substrate 63.
【００６６】上記のように、支持体６６の下部に設けた
第１吸気口７４、第２吸気口７６、第３吸気口９８を個
々に吸気源と接続することにより、第１吸着ポーラス９
４、第２吸着ポーラス９５、第３吸着ポーラス９６は３
系統の独立した吸気通路で個々に吸引されることにな
る。As described above, by connecting the first intake port 74, the second intake port 76, and the third intake port 98 provided in the lower portion of the support 66 individually to the intake source, the first adsorption porous member 9 is obtained.
4, the second adsorption porous 95 and the third adsorption porous 96 are 3
It will be sucked individually in the independent intake passage of the system.
【００６７】この発明の吸着ハンド４１は、上記のよう
な構成であり、ウェーハ処理装置におけるウェーハ受渡
しロボットの第２アームの先端に回転動するよう取り付
け、薄厚ウェーハａを吸着することにより、ローダ部と
アンローダ部のカセットの各段に対する薄厚ウェーハａ
の出し入れや、薄厚ウェーハａのアライメント部と処理
部への順次移送を行うものである。The suction hand 41 of the present invention is configured as described above, is attached to the tip of the second arm of the wafer transfer robot in the wafer processing apparatus so as to rotate, and sucks the thin wafer a to loader unit. And thin wafer a for each stage of the cassette in the unloader section
The wafer is taken in and out, and the thin wafer a is sequentially transferred to the alignment section and the processing section.
【００６８】この発明の吸着ハンド４１は、カセットに
対して出し入れする部分の上面に独立した複数の吸着部
を設け、この吸着ハンド４１に少なくとも２系統以上の
吸気通路を設け、各吸気通路を異なる吸着部とそれぞれ
接続して形成したので、薄厚ウェーハａの吸着時に独立
した複数の吸着部で独自に吸引（例えばウェーハａの中
心部から外周部へと順次吸引）することにより、各吸着
部は他の吸着部の影響を受けることなく薄厚ウェーハａ
を吸引することができ、従って何れの実施の形態におい
ても、平面的な形状が反り、撓み、波打ち等の異形状に
なっている薄厚ウェーハａであっても、吸着ハンド４１
の上面になじむように全面吸着でき、吸着ミスの発生が
ないので、カセットの各段に対する薄厚ウェーハａの出
し入れが確実に行えることになる。In the suction hand 41 of the present invention, a plurality of independent suction portions are provided on the upper surface of the portion to be taken in and out of the cassette, and at least two or more intake passages are provided in this suction hand 41, and each suction passage is different. Since each of the suction portions is formed by being connected to the suction portion, each suction portion can be sucked independently by a plurality of independent suction portions when sucking the thin wafer a (for example, sequentially sucking from the central portion of the wafer a to the outer peripheral portion). Thin wafer a without being affected by other suction parts
Therefore, in any of the embodiments, even if the thin wafer a has a different planar shape such as a warp, a warp, or a wavy shape, the suction hand 41
Since the entire surface can be sucked so as to fit the upper surface of the cassette and no suction error occurs, the thin wafer a can be reliably taken in and out of each stage of the cassette.
【００６９】[0069]
【発明の効果】以上のように、この発明のカセットによ
ると、薄厚ウェーハを収納するカセットの両側壁の対向
する内面間に多段に設けた各支持板上の後端部側で両側
の位置に、上部が小径となるストッパーを設けたので、
支持板上で支持した薄厚ウェーハの取り出し時に吸着ハ
ンドを上昇させると、薄厚ウェーハ外周部がストッパー
に接触することなく上昇するので、該薄厚ウェーハにス
トレスを与えたり、該ウェーハの外周に割れや欠けが生
じさせることがない。As described above, according to the cassette of the present invention, the rear end portions of the supporting plates, which are provided in multiple stages between the opposing inner surfaces of the both side walls of the cassette for accommodating the thin wafers, are located at both sides of the rear end side. Since there is a stopper with a small diameter on the top,
If the suction hand is raised when taking out the thin wafer supported on the support plate, the thin wafer outer peripheral portion rises without coming into contact with the stopper, so that the thin wafer is stressed or the outer periphery of the wafer is cracked or chipped. Will not occur.
【００７０】また、カセットの両側壁の内面で上下支持
板間の位置に、端部の下面が端部上がりに傾斜するスペ
ーサを下位支柱板との対向面間に薄厚ウェーハの挿入間
隔を形成した状態で設けたので、薄厚ウェーハの挿入間
隔は、スペーサの端部の下面を端部上がりに傾斜させる
ことによって、ウェーハを出し入れする部分が広幅とな
り、挿入間隔に対する薄厚ウェーハの収納、取り出しが
支障なく行え、スペーサにより挿入間隔を狭く設定する
ことで、支持板上で支持した薄厚ウェーハの外周端部を
スペーサで受け、薄厚ウェーハの垂れ下がり発生を少な
くすることができ、カセットに対して吸着ハンドによる
薄厚ウェーハの収納と取り出しが支障なく行えることに
なる。In addition, a spacer, in which the lower surface of the end is inclined upward to the end, is formed between the upper and lower support plates on the inner surfaces of both side walls of the cassette, and a thin wafer insertion interval is formed between the surfaces facing the lower support plate. Since the thin wafers are inserted in this state, the space for inserting and removing the wafers becomes wider by inclining the lower surface of the end of the spacer upward so that the insertion and removal of the thin wafers against the insertion interval will not be a problem. This can be done by setting the insertion interval narrow by the spacer, and the spacer can receive the outer peripheral edge of the thin wafer supported on the support plate, and the occurrence of sagging of the thin wafer can be reduced. Wafers can be stored and taken out without any problems.
【００７１】更にスペーサは、カセットの側壁に対して
上下に位置調整が可能となるよう取り付けることによ
り、薄厚ウェーハの種類、大きさ、反り形状、厚み等の
変化に対応できるようになる。Further, the spacers are attached to the side wall of the cassette so that the spacers can be vertically adjusted, so that it is possible to cope with changes in the type, size, warp shape and thickness of the thin wafer.
【００７２】また、この発明の吸着ハンドによると、上
面に独立した複数の吸着部を設け、この吸着ハンドに少
なくとも２系統以上の吸気通路を設け、各吸気通路を異
なる吸着部とそれぞれ接続したので、各吸着部はそれぞ
れに独立して吸引力が発生し、異形状になっている薄厚
ウェーハでも、吸着ハンドの上面になじむよう平坦な状
態に全面吸着できることになり、吸着ミスの発生がなく
なり、カセットに対する薄厚ウェーハの出し入れが確実
に行える。Further, according to the suction hand of the present invention, a plurality of independent suction portions are provided on the upper surface, at least two or more intake passages are provided in the suction hand, and each suction passage is connected to a different suction portion. , The suction force is generated independently in each suction part, and even a thin wafer with a different shape can be sucked entirely in a flat state so as to fit on the upper surface of the suction hand, and the occurrence of suction mistakes is eliminated. The thin wafer can be reliably taken in and out of the cassette.
【００７３】[0073]
【図１】この発明に係る薄厚ウェーハ用カセットの第１
の実施の形態を示す横断平面図FIG. 1 is a first view of a thin wafer cassette according to the present invention.
Cross-sectional plan view showing an embodiment of
【図２】同じく第２の実施の形態の薄厚ウェーハ用カセ
ットを示す横断平面図FIG. 2 is a cross-sectional plan view showing the thin wafer cassette of the second embodiment.
【図３】第１と第２実施の形態の薄厚ウェーハ用カセッ
トを示す正面図FIG. 3 is a front view showing the thin wafer cassettes of the first and second embodiments.
【図４】第１と第２実施の形態の薄厚ウェーハ用カセッ
トを示す縦断側面図FIG. 4 is a vertical sectional side view showing the thin wafer cassettes according to the first and second embodiments.
【図５】この発明に係る薄厚ウェーハ用吸着ハンドの第
１の実施の形態を示す平面図FIG. 5 is a plan view showing a first embodiment of a suction hand for thin wafers according to the present invention.
【図６】同上の縦断正面図FIG. 6 is a vertical sectional front view of the same.
【図７】同じく第２の実施の形態の薄厚ウェーハ用吸着
ハンドを示す平面図FIG. 7 is a plan view showing a thin wafer suction hand according to the second embodiment.
【図８】同上の縦断正面図FIG. 8 is a vertical sectional front view of the above.
【図９】同じく第３の実施の形態の薄厚ウェーハ用吸着
ハンドを示す平面図FIG. 9 is a plan view showing a suction hand for thin wafers according to the third embodiment.
【図１０】同上の縦断正面図FIG. 10 is a vertical front view of the above.
【図１１】同じく第４の実施の形態の薄厚ウェーハ用吸
着ハンドを示す平面図FIG. 11 is a plan view showing a suction hand for thin wafers according to the fourth embodiment.
【図１２】同上の縦断正面図FIG. 12 is a vertical sectional front view of the same.
【図１３】半導体装置を製造するためのウェーハ処理装
置の一例を概略的に示す平面図FIG. 13 is a plan view schematically showing an example of a wafer processing apparatus for manufacturing a semiconductor device.
【図１４】図１３の矢印×から見た側面図FIG. 14 is a side view seen from the arrow X in FIG.
【図１５】従来のウェーハ用カセットを示す横断平面図FIG. 15 is a cross-sectional plan view showing a conventional wafer cassette.
【図１６】同上の支持壁の間隔を狭く設定したカセット
を示す正面図FIG. 16 is a front view showing a cassette in which the distance between the support walls is set narrow.
【図１７】同上の支持壁の間隔を広く設定したカセット
を示す正面図FIG. 17 is a front view showing a cassette in which the spacing between the support walls is set wide.
ａ 薄厚ウェーハ ９ 吸着ハンド ２１ カセット ２２ 上壁 ２３ 下壁 ２４ 側壁 ２５ 支持板 ２６ ストッパー ２７ スペーサ ２８ 切り欠き部 ２９ 後部接続部分 ３０ 平行部分 ３１ 支持舌片 ３２ スロット ３３ 傾斜面 ３４ 長孔 ３５ ボルト ４１ 吸着ハンド ４２ 根元部分 ４３ 広幅部 ４４ 基板 ４５ 上板 ４６ 底板 ４７ 切り欠き ４８ 支持体 ４９ 第１吸気孔 ５０ 第２吸気孔 ５１ 第１吸気溝 ５２ 第２吸気溝 ５３ 第１吸気通路 ５４ 第２吸気通路 ５５ 連通孔 ５６ 第１吸気口 ５７ 連通孔 ５８ 第２吸気口 ５９ 連通孔 ６０ 連通孔 ６１ 根元部分 ６２ 広幅部 ６３ 基板 ６４ 底板 ６５ 切り欠き ６６ 支持体 ６７ 第１の凹部 ６８ 第２の凹部 ６９ 第１吸着ポーラス ７０ 第２吸着ポーラス ７１ 第１吸気通路 ７２ 第２吸気通路 ７３ 連通孔 ７４ 第１吸気口 ７５ 連通孔 ７６ 第２吸気口 ７７ 連通孔 ７８ 連通孔 ８１ 第１吸気孔 ８２ 第２吸気孔 ８３ 第１吸気溝 ８４ 第２吸気溝 ９１ 第１の凹部 ９２ 第２の凹部 ９３ 第３の凹部 ９４ 第１吸着ポーラス ９５ 第２吸着ポーラス ９６ 第３吸着ポーラス ９７ 第３吸着通路 ９８ 第３吸気口 ９９ 連通孔 １００ 連通孔 a Thin wafer 9 Adsorption hand 21 cassettes 22 Upper wall 23 Lower wall 24 Side wall 25 Support plate 26 Stopper 27 spacer 28 Notch 29 Rear connection 30 parallel parts 31 Supporting tongue 32 slots 33 inclined surface 34 long hole 35 volts 41 Suction hand 42 Root 43 Wide part 44 substrate 45 Upper plate 46 Bottom plate 47 cutout 48 Support 49 First intake hole 50 Second intake hole 51 First intake groove 52 Second intake groove 53 First intake passage 54 Second intake passage 55 communication hole 56 First inlet 57 communication holes 58 Second intake port 59 communication hole 60 communication holes 61 Root 62 Wide part 63 substrate 64 bottom plate 65 cutout 66 Support 67 First recess 68 Second recess 69 First adsorption porous 70 Second adsorption porous 71 First intake passage 72 Second intake passage 73 communication hole 74 First intake port 75 communication hole 76 Second inlet 77 communication hole 78 Communication hole 81 First intake hole 82 Second intake hole 83 First intake groove 84 Second intake groove 91 First recess 92 Second recess 93 Third recess 94 First adsorption porous 95 Second adsorption porous 96 Third adsorption porous 97 Third adsorption passage 98 Third inlet 99 communication holes 100 communication holes
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 3C007 AS03 AS24 DS03 ES17 FS01 FT07 FT08 FT11 NS13 5F031 CA02 DA01 EA19 FA01 FA07 FA11 GA08 GA24 GA26 GA32 GA43 GA47 GA49 PA13 PA20 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 3C007 AS03 AS24 DS03 ES17 FS01 FT07 FT08 FT11 NS13 5F031 CA02 DA01 EA19 FA01 FA07 FA11 GA08 GA24 GA26 GA32 GA43 GA47 GA49 PA13 PA20
Claims (6)
壁の対向する内面間に、両側に平行部分を残して前縁か
ら後方に吸着ハンドの通過用切り欠き部が形成された支
持板を上下に所定の間隔で多段に設け、各支持板上の後
端部側で両側の位置に上部が小径となるストッパーを設
け、上記カセットの両側壁の内面で上下支持板間の位置
に、端部の下面が端部上がりに傾斜するスペーサを下位
支持板との対向面間に薄厚ウェーハの挿入間隔を形成し
た状態で設けた薄厚ウェーハ用カセット。1. A support plate having a notch for passage of a suction hand is formed up and down from the front edge to the rear, leaving parallel portions on both sides between opposed inner surfaces of both side walls of a cassette for accommodating thin wafers. Providing in multiple stages at predetermined intervals, stoppers with small upper diameters are provided at both positions on the rear end side of each support plate, and at the position between the upper and lower support plates on the inner surfaces of both side walls of the cassette, the end portions are A cassette for thin wafers, in which a spacer whose lower surface inclines toward the end is provided with a thin wafer insertion interval formed between the surfaces facing the lower support plate.
て上下に位置調整が可能となるよう取り付けられている
請求項１に記載の薄厚ウェーハ用カセット。2. The cassette for a thin wafer according to claim 1, wherein the spacer is attached to the side wall of the cassette so as to be vertically adjustable in position.
厚ウェーハの支持舌片が前方に向けて突出するように設
けられている請求項１又は２に記載の薄厚ウェーハ用カ
セット。3. The thin wafer cassette according to claim 1, wherein the supporting plate is provided at an inner end portion of the cutout portion such that a supporting tongue piece of the thin wafer projects forward.
に対応して配置され、薄厚ウェーハを底面からエア吸着
することによって、この薄厚ウェーハをカセットに対し
て出し入れする薄厚ウェーハ用吸着ハンドにおいて、吸
着ハンドのカセットに対して出し入れする部分の上面に
独立した複数の吸着部を設け、この吸着ハンドに少なく
とも２系統以上の吸気通路を設け、各吸気通路を異なる
吸着部とそれぞれ接続したことを特徴とする薄厚ウェー
ハ用吸着ハンド。4. A suction hand for a thin wafer, which is arranged corresponding to a cassette for accommodating thin wafers in multiple stages and which sucks the thin wafers into and out of the cassette by adsorbing the thin wafers from the bottom by air. A plurality of independent suction portions are provided on the upper surface of the portion to be taken in and out of the cassette, and at least two or more suction passages are provided in this suction hand, and each suction passage is connected to a different suction portion. Suction hand for thin wafers.
着孔によって形成され、各系統の吸気通路は対応する吸
着部の各吸着孔と接続されていることを特徴とする請求
項４に記載の薄厚ウェーハ用吸着ハンド。5. The suction unit according to claim 4, wherein each of the plurality of suction units is formed of a plurality of suction holes, and the intake passage of each system is connected to each suction hole of the corresponding suction unit. Adsorption hand for thin wafers.
通気性部材によって形成され、各系統の吸気通路は対応
する吸着部の通気性部材と接続されていることを特徴と
する請求項４に記載の薄厚ウェーハ用吸着ハンド。6. The suction member of each system is formed of a porous breathable member, and the intake passage of each system is connected to the breathable member of the corresponding suction unit. The suction hand for thin wafers as described in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001276063A JP2003086667A (en) | 2001-09-12 | 2001-09-12 | Cassette for thin wafer and suction band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001276063A JP2003086667A (en) | 2001-09-12 | 2001-09-12 | Cassette for thin wafer and suction band |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003086667A true JP2003086667A (en) | 2003-03-20 |
| JP2003086667A5 JP2003086667A5 (en) | 2005-06-30 |
Family
ID=19100827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001276063A Pending JP2003086667A (en) | 2001-09-12 | 2001-09-12 | Cassette for thin wafer and suction band |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003086667A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339574A (en) * | 2005-06-06 | 2006-12-14 | Nikon Corp | Substrate inspection device |
| JP2007022758A (en) * | 2005-07-15 | 2007-02-01 | Ckd Corp | Transfer device for plate-shaped workpiece |
| KR100767264B1 (en) * | 2006-09-18 | 2007-10-17 | 최일승 | Arm for moving wafer |
| WO2010035786A1 (en) * | 2008-09-29 | 2010-04-01 | 日東電工株式会社 | Suction sheet |
| JP2010089165A (en) * | 2008-10-03 | 2010-04-22 | Akim Kk | Suction nozzle of component, fixing head, and method of fixing component |
| JP2012104570A (en) * | 2010-11-08 | 2012-05-31 | Shin Etsu Polymer Co Ltd | Substrate housing container |
| JP2013038327A (en) * | 2011-08-10 | 2013-02-21 | Fujitsu Semiconductor Ltd | Substrate transfer system, semiconductor manufacturing system, and substrate transfer method |
| TWI735115B (en) * | 2019-12-24 | 2021-08-01 | 力成科技股份有限公司 | A wafer storage cassette and a wafer carrier plate |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332785U (en) * | 1986-08-20 | 1988-03-02 | ||
| JPS63278243A (en) * | 1987-05-08 | 1988-11-15 | Tokyo Electron Ltd | Wafer conveyer |
| JPH0435827A (en) * | 1990-05-31 | 1992-02-06 | Kyocera Corp | Vacuum suction device |
| JPH0430740U (en) * | 1990-07-06 | 1992-03-12 | ||
| JPH05293733A (en) * | 1992-04-23 | 1993-11-09 | Sony Corp | Vacuum chuck device |
| JPH0745692A (en) * | 1993-07-26 | 1995-02-14 | Nikon Corp | Sucking and holding apparatus for board |
| JPH0758181A (en) * | 1993-08-19 | 1995-03-03 | Fujitsu Ltd | Method and apparatus for conveying workpiece |
| JPH0742138U (en) * | 1993-12-27 | 1995-07-21 | オリンパス光学工業株式会社 | Object suction device |
| JPH08274148A (en) * | 1995-01-30 | 1996-10-18 | Sony Corp | Device and method for fixing substrate |
| JPH08323571A (en) * | 1995-05-30 | 1996-12-10 | Nitto Denko Corp | Suction locking device |
| JPH11238790A (en) * | 1998-02-23 | 1999-08-31 | Mitsubishi Electric Corp | Wafer carrier |
| JP2000091400A (en) * | 1998-09-08 | 2000-03-31 | Disco Abrasive Syst Ltd | Wafer storage cassette |
-
2001
- 2001-09-12 JP JP2001276063A patent/JP2003086667A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332785U (en) * | 1986-08-20 | 1988-03-02 | ||
| JPS63278243A (en) * | 1987-05-08 | 1988-11-15 | Tokyo Electron Ltd | Wafer conveyer |
| JPH0435827A (en) * | 1990-05-31 | 1992-02-06 | Kyocera Corp | Vacuum suction device |
| JPH0430740U (en) * | 1990-07-06 | 1992-03-12 | ||
| JPH05293733A (en) * | 1992-04-23 | 1993-11-09 | Sony Corp | Vacuum chuck device |
| JPH0745692A (en) * | 1993-07-26 | 1995-02-14 | Nikon Corp | Sucking and holding apparatus for board |
| JPH0758181A (en) * | 1993-08-19 | 1995-03-03 | Fujitsu Ltd | Method and apparatus for conveying workpiece |
| JPH0742138U (en) * | 1993-12-27 | 1995-07-21 | オリンパス光学工業株式会社 | Object suction device |
| JPH08274148A (en) * | 1995-01-30 | 1996-10-18 | Sony Corp | Device and method for fixing substrate |
| JPH08323571A (en) * | 1995-05-30 | 1996-12-10 | Nitto Denko Corp | Suction locking device |
| JPH11238790A (en) * | 1998-02-23 | 1999-08-31 | Mitsubishi Electric Corp | Wafer carrier |
| JP2000091400A (en) * | 1998-09-08 | 2000-03-31 | Disco Abrasive Syst Ltd | Wafer storage cassette |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339574A (en) * | 2005-06-06 | 2006-12-14 | Nikon Corp | Substrate inspection device |
| JP4737392B2 (en) * | 2005-06-06 | 2011-07-27 | 株式会社ニコン | Board inspection equipment |
| JP2007022758A (en) * | 2005-07-15 | 2007-02-01 | Ckd Corp | Transfer device for plate-shaped workpiece |
| KR100767264B1 (en) * | 2006-09-18 | 2007-10-17 | 최일승 | Arm for moving wafer |
| WO2010035786A1 (en) * | 2008-09-29 | 2010-04-01 | 日東電工株式会社 | Suction sheet |
| JP2010099826A (en) * | 2008-09-29 | 2010-05-06 | Nitto Denko Corp | Suction sheet |
| CN102164719A (en) * | 2008-09-29 | 2011-08-24 | 日东电工株式会社 | Suction sheet |
| US8414999B2 (en) | 2008-09-29 | 2013-04-09 | Nitto Denko Corporation | Suction sheet |
| JP2010089165A (en) * | 2008-10-03 | 2010-04-22 | Akim Kk | Suction nozzle of component, fixing head, and method of fixing component |
| JP2012104570A (en) * | 2010-11-08 | 2012-05-31 | Shin Etsu Polymer Co Ltd | Substrate housing container |
| JP2013038327A (en) * | 2011-08-10 | 2013-02-21 | Fujitsu Semiconductor Ltd | Substrate transfer system, semiconductor manufacturing system, and substrate transfer method |
| TWI735115B (en) * | 2019-12-24 | 2021-08-01 | 力成科技股份有限公司 | A wafer storage cassette and a wafer carrier plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9039867B2 (en) | Method for detaching a semiconductor chip from a foil | |
| US7659132B2 (en) | Semiconductor element holding apparatus and semiconductor device manufactured using the same | |
| JP2009147068A (en) | Semiconductor device manufacturing method and manufacturing apparatus | |
| JP2003086667A (en) | Cassette for thin wafer and suction band | |
| JP2004083180A (en) | Transporting method and device for sheet-form base board | |
| JP4797027B2 (en) | Substrate body sticking apparatus and substrate body handling method | |
| JP4256132B2 (en) | Plate-shaped material transfer device | |
| WO2004049430A1 (en) | Cassette for storing multiple sheets of semiconductor wafers | |
| JP5041504B2 (en) | Semiconductor substrate transfer apparatus and semiconductor substrate transfer method | |
| TWI504447B (en) | Absorption table | |
| JP4061261B2 (en) | Collet for die bonding | |
| JP3381692B2 (en) | Semiconductor adsorption collet and die bonding equipment | |
| JP4812660B2 (en) | Substrate handling equipment and substrate handling method | |
| US7293354B2 (en) | Apparatus for mounting columns for grid array electronic packages | |
| JP3655752B2 (en) | Transport suction pad device | |
| JP4447497B2 (en) | Board holder | |
| JP7250525B2 (en) | Wafer transfer tray | |
| KR20220158793A (en) | Manufacturing method of stamp tool holding device, stamp tool positioning device, multi-element transfer device and element array | |
| JP2005347315A (en) | Wafer transfer device and wafer transfer method | |
| KR100904888B1 (en) | Cassette for storing a plurality of semiconductor wafers | |
| CN214643745U (en) | Vacuum adsorption type annular tail end clamp holder | |
| JP2001077454A (en) | Apparatus and method for manufacturing semiconductor | |
| JP7456399B2 (en) | Sheet conveying device | |
| JPH11274110A (en) | Cutting method and apparatus for semiconductor wafer | |
| JP3915477B2 (en) | Substrate transport carrier, substrate underlay device, and bonding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041014 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041014 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20060715 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20060715 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061031 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061227 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20061227 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070213 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20070410 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070410 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070828 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20071225 |