JP2003059401A - Method of manufacturing plasma display panel - Google Patents
Method of manufacturing plasma display panelInfo
- Publication number
- JP2003059401A JP2003059401A JP2002227321A JP2002227321A JP2003059401A JP 2003059401 A JP2003059401 A JP 2003059401A JP 2002227321 A JP2002227321 A JP 2002227321A JP 2002227321 A JP2002227321 A JP 2002227321A JP 2003059401 A JP2003059401 A JP 2003059401A
- Authority
- JP
- Japan
- Prior art keywords
- tube
- glass
- substrate
- plasma display
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Gas-Filled Discharge Tubes (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、プラズマディスプレイ
パネル(PDP)の製造方法に関し、排気及び放電ガス
の充填に用いるガラス管の取り付け方法に特徴を有す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a plasma display panel (PDP), which is characterized by a method of mounting a glass tube used for filling exhaust gas and discharge gas.
【0002】PDPは、表示輝度の上で有利な自己発光
型の表示デバイスであり、画面の大型化及び高速表示が
可能であることから、CRTに代わるフラット型の表示
デバイスとして注目されている。特に蛍光体によるカラ
ー表示に適した面放電型PDPは、ハイビジョンを含む
テレビジョン映像の分野にその用途が拡大されつつあ
る。A PDP is a self-luminous display device which is advantageous in terms of display brightness, and because of its large screen and high-speed display, it has been attracting attention as a flat display device that replaces a CRT. In particular, the surface discharge PDP suitable for color display using a phosphor is expanding its application in the field of television images including high definition.
【0003】[0003]
【従来の技術】まず、本発明の実施例を示す図1を参照
してPDPの構造について説明する。PDPは、一対の
ガラス基板11,21を対向配置し、これらガラス基板
11,21の対向領域の周縁部を封止することによっ
て、内部に数十〜百μm程度の間隙寸法の放電空間30
を形成した表示デバイスである。2. Description of the Related Art First, the structure of a PDP will be described with reference to FIG. 1 showing an embodiment of the present invention. In the PDP, a pair of glass substrates 11 and 21 are arranged so as to face each other, and the peripheral portions of the facing regions of the glass substrates 11 and 21 are sealed, so that the discharge space 30 having a gap dimension of about several tens to 100 μm is provided inside.
Is a display device formed with.
【0004】例えばマトリクス表示方式のPDPでは、
各ガラス基板11,21の内面上に電極(図示せず)が
一定ピッチで配列され、これら電極によって放電セルの
画定される領域が表示領域EHとなる。For example, in a matrix display type PDP,
Electrodes (not shown) are arranged on the inner surface of each of the glass substrates 11 and 21 at a constant pitch, and a region where discharge cells are defined by these electrodes is a display region EH.
【0005】PDPの製造に際しては、表示面側及び背
面側の各ガラス基板11,21について別個に電極や誘
電体層などの構成部材を設けた後、両ガラス基板11,
21の周囲の封止(基板封止)に先立って、一方のガラ
ス基板21上に封止用部材として放電空間の間隙寸法の
1.5〜2倍程度の高さを有した枠状の低融点ガラス層
が設けられる。そして、両ガラス基板11,21を重ね
合わせ、挟持手段又は押圧手段などによって互いに押し
当てた状態で、500℃程度の熱処理が行われる。これ
により、低融点ガラス層が軟化して基板間隙を埋める封
止材40となり、この封止材40による融着の形で放電
空間30が密閉される。When manufacturing a PDP, after providing constituent members such as electrodes and dielectric layers separately on the glass substrates 11 and 21 on the display surface side and the back surface side, both glass substrates 11 and 21 are formed.
Prior to the sealing of the periphery of 21 (substrate sealing), a frame-shaped low glass having a height of about 1.5 to 2 times the gap size of the discharge space as a sealing member on one glass substrate 21. A melting point glass layer is provided. Then, the two glass substrates 11 and 21 are overlapped with each other, and a heat treatment at about 500 ° C. is performed in a state where they are pressed against each other by a sandwiching means or a pressing means. As a result, the low-melting-point glass layer softens to become the sealing material 40 that fills the substrate gap, and the discharge space 30 is hermetically sealed by the sealing material 40.
【0006】なお、低融点ガラス層は、枠状パターンを
有したスクリーンマスクを用いて低融点ガラスペースト
を塗布し、400℃程度の仮焼成を行うことによって形
成される。仮焼成は、基板封止時における放電空間30
の汚染の原因となるガラスペースト中の有機溶剤などの
不純物を予め発散させる、いわゆるガス抜き処理として
行われる。The low melting point glass layer is formed by applying a low melting point glass paste using a screen mask having a frame-shaped pattern and pre-baking at about 400 ° C. The calcination is performed in the discharge space 30 when the substrate is sealed.
This is a so-called degassing process in which impurities such as an organic solvent in the glass paste that cause the above-mentioned contamination are diffused in advance.
【0007】基板封止に続いて内部の排気が行なわれ、
清浄化された放電空間30に適当な放電ガスが充填され
る。このため、予め一方のガラス基板(通常は背面側)
21には直径5mm程度の通気孔25が設けられてお
り、排気処理以前の段階で、ガラス基板21の外面に数
cm程度の長さのガラス管(一般にチップ管と呼称され
る)60が融着される。つまり、放電空間30と真空ポ
ンプ(又はガスボンベ)とを接続するための配管の一部
としてチップ管60が取り付けられ、通気孔25とチッ
プ管60とを介して排気及びガス充填が行われる。なお
チップ管60は、放電ガスの充填の後に通気路を塞ぐよ
うに溶断され、その時点で放電空間30が完全に密閉さ
れる。After the substrate is sealed, the internal air is exhausted,
The cleaned discharge space 30 is filled with a suitable discharge gas. Therefore, one glass substrate (usually the back side) in advance
A vent hole 25 having a diameter of about 5 mm is provided in the glass plate 21, and a glass tube (generally called a chip tube) 60 having a length of several cm is melted on the outer surface of the glass substrate 21 before the exhaust treatment. Be worn. That is, the tip pipe 60 is attached as a part of the pipe for connecting the discharge space 30 and the vacuum pump (or the gas cylinder), and exhaust and gas filling are performed through the vent hole 25 and the tip pipe 60. Note that the tip tube 60 is melted and blown so as to close the ventilation path after the discharge gas is filled, and the discharge space 30 is completely sealed at that time.
【0008】さて、従来において、チップ管60は以下
の方法でガラス基板21に取り付けられていた。すなわ
ち、図7(a)に模式的に示すように、基板封止の直前
の段階で、融着用ガラスペースト70aを塗布したチッ
プ管60をガラス基板21の外面に押し当てる形で配置
していた。その時点で、ガラス基板21には、仮焼成を
経たガス抜き状態の低融点ガラス層40bが封止部材と
して設けられている。Conventionally, the chip tube 60 has been attached to the glass substrate 21 by the following method. That is, as schematically shown in FIG. 7A, the chip tube 60 coated with the glass paste 70a for fusing was arranged so as to be pressed against the outer surface of the glass substrate 21 immediately before the sealing of the substrate. . At that time, the glass substrate 21 is provided with the low melting point glass layer 40b in a degassed state that has undergone calcination as a sealing member.
【0009】なお、融着用ガラスペースト70aは、低
融点ガラスフリット、バインダ、及び有機溶剤などから
なる。また、チップ管60の融着側端部60Aは、取付
け強度を高めるために、ガラス基板21との対向面積が
増大するように肉厚化されている。The glass paste 70a for fusing is composed of a low melting point glass frit, a binder, an organic solvent and the like. In addition, the fusion-bonded end portion 60A of the tip tube 60 is thickened so that the area facing the glass substrate 21 increases in order to increase the attachment strength.
【0010】チップ管60を配置した状態で基板封止の
ための熱処理を行うと、図7(b)に示すように、融着
用ガラスペースト70aが焼成されて融着材70とな
り、チップ管60とガラス基板21とが固着(ガラス融
着)する。When the heat treatment for sealing the substrate is performed with the chip tube 60 arranged, as shown in FIG. 7B, the glass paste 70a for fusion is fired to become the fusion material 70, and the chip tube 60 is formed. And the glass substrate 21 are fixed (glass fusion).
【0011】[0011]
【発明が解決しようとする課題】従来では、融着用ガラ
スペースト70aから発散したガス(不純物)による放
電空間30の汚染が生じるおそれがあった。汚染は、放
電特性の悪化の原因となる。Conventionally, the discharge space 30 may be contaminated by gas (impurities) emitted from the glass paste 70a for fusing. Contamination causes deterioration of discharge characteristics.
【0012】融着用ガラスペースト70aは、基板封止
用のペーストと比べると少量であり、それから発散する
ガスも少量である。しかし、特に、大型のPDPでは、
部位による放電特性のバラツキが大きく動作マージンの
確保が困難であることから、動作マージンを拡げて駆動
の安定化を図る上で、放電空間30の汚染を可及的に抑
える必要がある。The amount of the glass paste 70a for fusing is smaller than that of the paste for sealing the substrate, and the amount of gas emitted therefrom is also small. However, especially for large PDPs,
Since there are large variations in the discharge characteristics depending on the parts and it is difficult to secure the operation margin, it is necessary to suppress the contamination of the discharge space 30 as much as possible in order to expand the operation margin and stabilize the driving.
【0013】本発明は、上述の問題に鑑み、配管接続用
のガラス管の取付けにともなう放電空間の汚染を防止す
ることを目的としている。The present invention has been made in view of the above problems, and an object of the present invention is to prevent the discharge space from being contaminated when the glass tube for pipe connection is attached.
【0014】[0014]
【課題を解決するための手段】請求項1の発明に係る方
法は、通気孔を有した基板に配管接続用のガラス管を取
り付け、前記通気孔及び前記ガラス管を介して内部の排
気及び放電ガスの充填を行うプラズマディスプレイパネ
ルの製造方法であって、他の基板と重ね合わせた前記基
板上に、予めガス抜きされた融着材を端部に固定した前
記ガラス管を配置し、その状態で前記各基板を一括に熱
することによって、基板封止と同時に前記融着材を溶融
させて前記ガラス管を取付けるものである。According to a first aspect of the present invention, a glass tube for connecting a pipe is attached to a substrate having a ventilation hole, and exhaust and discharge of the inside through the ventilation hole and the glass tube. A method of manufacturing a plasma display panel for filling a gas, wherein the glass tube having a pre-degassed fusion material fixed to an end thereof is arranged on the substrate superposed with another substrate, and the state is maintained. By heating each of the substrates together, the fusion material is melted at the same time when the substrates are sealed and the glass tube is attached.
【0015】請求項2の発明に係る製造方法において、
前記融着材は前記ガラス管の端部と係合するリング形状
を有し、仮焼成してガス抜きされた固体からなる。請求
項3の発明に係る製造方法は、チップ管の端部と係合す
るリング形状に成形され仮焼成によってガス抜きされた
低融点ガラスからなる融着材を予め当該チップ管に係合
して一体化しておき、当該融着材と一体化された当該チ
ップ管を前記背面側の基板上に配置し、当該融着材を熱
で溶かして当該チップ管を当該基板に取り付けるもので
ある。In the manufacturing method according to the invention of claim 2,
The fusing material has a ring shape that engages with the end of the glass tube, and is made of a solid that has been decalcified and degassed. In the manufacturing method according to the invention of claim 3, a fusion material made of a low melting point glass which is formed into a ring shape which engages with an end portion of the tip tube and which is degassed by calcination is previously engaged with the tip tube. The chip tube integrated with the fusion material is placed on the backside substrate, and the fusion material is melted by heat to attach the chip tube to the substrate.
【0016】請求項4の発明に係るチップ管は、端部が
拡張され、当該チップ管の端部と係合するリング形状に
成形され仮焼成によってガス抜きされた低融点ガラスか
らなる融着材とを両部材の係合状態で一体化してなるも
のである。A tip tube according to a fourth aspect of the present invention is a fusion material made of a low melting point glass, the end portion of which is expanded, formed into a ring shape that engages with the end portion of the tip tube, and degassed by pre-baking. And are integrated in the engaged state of both members.
【0017】[0017]
【作用】ガラス管60をガラス基板21に取り付けるた
めの融着用ガラスペースト70aのガス抜き、すなわち
融着用ガラスペースト70aの仮焼成が、基板封止の以
前の段階で行われる。The degassing of the glass paste for fusion 70a for attaching the glass tube 60 to the glass substrate 21, that is, the prebaking of the glass paste for fusion 70a is performed before the substrate is sealed.
【0018】[0018]
【実施例】図1は本発明の実施に係るPDP1の外観を
示す切欠き斜視図である。図1において、図7に対応す
る構成要素には同一の符号を付してある。以下の各図に
おいても同様である。1 is a cut-away perspective view showing the appearance of a PDP 1 according to the present invention. In FIG. 1, the components corresponding to those in FIG. 7 are designated by the same reference numerals. The same applies to the following figures.
【0019】PDP1は、一対のガラス基板11,2
1、放電空間30を囲む枠状の封止材40、及び図示し
ない電極群などから構成されている。背面側のガラス基
板21は、表示領域EHと封止材40との間に通気孔2
5を有している。The PDP 1 includes a pair of glass substrates 11 and 2.
1, a frame-shaped sealing material 40 surrounding the discharge space 30, an electrode group (not shown), and the like. The glass substrate 21 on the back side has the ventilation holes 2 between the display area EH and the sealing material 40.
Have five.
【0020】PDP1の製造に際しては、後述のよう
に、配管接続用のチップ管60が通気孔25と位置合わ
せして取り付けられ、このチップ管60を介して内部の
排気及び放電ガスの充填が行われる。なお、図1が示す
完成状態では、チップ管60の先端がガラス加工によっ
て塞がれ、放電空間30が完全に密閉されている。When manufacturing the PDP 1, as will be described later, a tip tube 60 for connecting a pipe is aligned with the vent hole 25 and attached, through which the exhaust gas and the discharge gas are filled. Be seen. In the completed state shown in FIG. 1, the tip end of the tip tube 60 is closed by glass processing, and the discharge space 30 is completely sealed.
【0021】図2はチップ管の取り付け方法の一例を示
す要部断面図である。図2の例では、チップ管60は、
基板封止の以前の段階でガラス基板21にガラス融着に
よって取り付けられる。FIG. 2 is a sectional view of an essential part showing an example of a method of attaching the tip tube. In the example of FIG. 2, the tip tube 60 is
The glass substrate 21 is attached to the glass substrate 21 by glass fusion before the substrate is sealed.
【0022】すなわち、放電セル構造を規定する所定の
構成要素を設けたガラス基板21の内面側に、基板封止
用ガラスペースト40aを塗布した後、融着用ガラスペ
ースト70aを塗布したチップ管60をガラス基板21
の外面に押しつけるように配置する。そして、その状態
でガラス基板21に対して400℃程度の熱処理を加え
る〔図2(a)〕。これにより、基板封止用ガラスペー
スト40aのガス抜きと同時に融着用ガラスペースト7
0aが焼成され、チップ管60とガラス基板21とが融
着する。That is, after the substrate sealing glass paste 40a is applied to the inner surface side of the glass substrate 21 provided with the predetermined constituent elements for defining the discharge cell structure, the chip tube 60 coated with the fusing glass paste 70a is applied. Glass substrate 21
Place it so that it presses against the outer surface of. Then, in that state, a heat treatment at about 400 ° C. is applied to the glass substrate 21 [FIG. 2 (a)]. As a result, the glass paste 7 for fusing is released at the same time when the glass paste 40a for sealing the substrate is degassed.
0a is baked, and the chip tube 60 and the glass substrate 21 are fused.
【0023】その後、別途に所定の構成要素を設けたガ
ラス基板11と、チップ管60を取り付けたガラス基板
21とを重ね合わせて基板封止を行う〔図2(b)〕。
この時点では、チップ管60とガラス基板21との間の
融着材70は、ガス抜き処理(焼成)を経ている。した
がって、チップ管60の融着材70による放電空間30
の汚染は起こらない。After that, the glass substrate 11 separately provided with predetermined components and the glass substrate 21 to which the chip tube 60 is attached are superposed on each other to seal the substrate [FIG. 2 (b)].
At this point, the fusing material 70 between the chip tube 60 and the glass substrate 21 has undergone degassing (firing). Therefore, the discharge space 30 by the fusion material 70 of the tip tube 60
Pollution does not occur.
【0024】図3は本発明の第1実施例に係る各製造段
階の状態を示す要部断面図である。チップ管60の一端
に融着用ガラスペースト70aを塗布して焼成する〔図
3(a)〕。そして、ガス抜き状態の融着材70bを有
したチップ管60を、ガラス基板11と重ね合わせたガ
ラス基板21上に載置し、その状態で各基板11,21
を一括に熱することによって、基板封止とガラス管60
の融着とを同時に行う〔図3(b)〕。FIG. 3 is a cross-sectional view of essential parts showing the state of each manufacturing step according to the first embodiment of the present invention. Glass paste 70a for fusing is applied to one end of the tip tube 60 and fired [FIG. 3 (a)]. Then, the chip tube 60 having the fusion material 70b in the degassed state is placed on the glass substrate 21 superposed on the glass substrate 11, and in that state, each of the substrates 11 and 21 is placed.
The substrate is sealed and the glass tube 60 is heated collectively.
And fusing are simultaneously performed [FIG. 3 (b)].
【0025】図4は本発明の第2実施例に係る各製造段
階の状態を示す要部断面図である。図3の例と同様に、
予めチップ管60にガス抜き状態の融着材70Bを設け
ておき、基板封止と同時にガラス管60の融着を行う。FIG. 4 is a cross-sectional view of essential parts showing the state of each manufacturing step according to the second embodiment of the present invention. Similar to the example of FIG.
The chip tube 60 is previously provided with a degassed fusion material 70B, and the glass tube 60 is fused at the same time when the substrate is sealed.
【0026】ただし、図3の例との相違点は、融着材7
0Bをチップ管60と別個に形成しておく点である。融
着材70Bは、図5に示すように、チップ管60の肉厚
部60Aと係合する分割リング状に形成されており、1
つのチップ管60に対して2つの融着材70Bを用い
る。However, the difference from the example of FIG. 3 is that the fusing material 7
The point is that 0B is formed separately from the tip tube 60. As shown in FIG. 5, the fusing material 70B is formed in a split ring shape that engages with the thick portion 60A of the tip tube 60.
Two fusing materials 70B are used for one tip tube 60.
【0027】図6はチップ管の取り付け方法の他の例を
示す要部断面図である。図6の例では、基板封止の以前
の段階で、通気孔25を塞ぎ且つ排気時の負圧により破
れる数μm程度の厚さのガラス膜26を設けておき、融
着用ガラスペースト70aを塗布したチップ管60をガ
ラス基板21上に配置して基板封止を行う。FIG. 6 is a cross-sectional view of essential parts showing another example of the method of attaching the tip tube. In the example of FIG. 6, a glass film 26 having a thickness of about several μm, which blocks the vent hole 25 and is broken by negative pressure during exhaust, is provided before the substrate is sealed, and the glass paste 70a for fusion is applied. The chip tube 60 is placed on the glass substrate 21 to seal the substrate.
【0028】つまり、ガラス膜26によって融着用ガラ
スペースト70aと放電空間30とを隔てた状態で、融
着用ガラスペースト70aを焼成してチップ管60を融
着する。That is, the glass paste 70a for fusion and the discharge space 30 are separated by the glass film 26, and the glass paste 70a for fusion is fired to fuse the chip tube 60.
【0029】ガラス膜26は、例えばガラス基板21の
作製時の成形によって設けることができる。その場合、
通気孔25の内面側の端部を塞ぐように設けておけば、
チップ管60の位置決めが容易となる。また、ガラス膜
26は、通気孔25より若干大径の薄いガラス板をガラ
ス基板21上に載置するとによって設けることもでき
る。The glass film 26 can be provided, for example, by molding when manufacturing the glass substrate 21. In that case,
If it is provided so as to block the inner end of the vent hole 25,
Positioning of the tip tube 60 becomes easy. Further, the glass film 26 can be provided by placing a thin glass plate having a diameter slightly larger than that of the ventilation hole 25 on the glass substrate 21.
【0030】図2の実施例によれば、製造工数を増大す
ることなく放電空間30の汚染を抑えることができる。
図3及び図4の実施例によれば、チップ管60の取り付
け準備、すなわち融着用ガラスペースト70aの塗布及
びそのガス抜きを、PDP本体の製造と並行して行うこ
とができ、工程の自由度を高めることができる。According to the embodiment of FIG. 2, the discharge space 30 can be prevented from being contaminated without increasing the number of manufacturing steps.
According to the embodiments of FIGS. 3 and 4, the mounting preparation of the tip tube 60, that is, the application of the glass paste 70a for fusing and the degassing thereof can be performed in parallel with the manufacture of the PDP main body, and the process flexibility is increased. Can be increased.
【0031】[0031]
【発明の効果】本発明によれば、配管接続用のガラス管
の取付けにともなう放電空間の汚染を防止することがで
き、大型で且つ動作の安定したプラズマディスプレイパ
ネルを容易に製造することができるとともに、予めガス
抜きした融着材の付いたチップ管を用意しておくので、
チップ管の取り付けを迅速に行うことができる。According to the present invention, it is possible to prevent the discharge space from being contaminated when the glass tube for pipe connection is attached, and it is possible to easily manufacture a large-sized and stable plasma display panel. At the same time, since the tip tube with the fusion material that has been degassed in advance is prepared,
The tip tube can be attached quickly.
【図1】本発明の実施に係るPDPの外観を示す切欠き
斜視図である。FIG. 1 is a cutaway perspective view showing an appearance of a PDP according to an embodiment of the present invention.
【図2】本発明のチップ管の取り付け方法の一例を示す
要部断面図である。FIG. 2 is a cross-sectional view of essential parts showing an example of a method of attaching the tip tube of the present invention.
【図3】本発明の第1実施例に係る各製造段階の状態を
示す要部断面図である。FIG. 3 is a sectional view of a key portion showing a state of each manufacturing stage according to the first embodiment of the present invention.
【図4】本発明の第2実施例に係る各製造段階の状態を
示す要部断面図である。FIG. 4 is a cross-sectional view of the essential parts showing the state of each manufacturing stage according to the second embodiment of the present invention.
【図5】図4の融着材の形状の一例を示す斜視図であ
る。5 is a perspective view showing an example of the shape of the fusion material of FIG.
【図6】チップ管の取り付け方法の他の例を示す要部断
面図である。FIG. 6 is a cross-sectional view of essential parts showing another example of the method of attaching the tip tube.
【図7】従来の各製造段階の状態を示す要部断面図であ
る。FIG. 7 is a cross-sectional view of a main part showing a state of each conventional manufacturing stage.
1 PDP(プラズマディスプレイパネル) 11,21 ガラス基板 25 通気孔 26 ガラス膜 60 チップ管(ガラス管60) 70 融着材 70a 融着用ガラスペースト70a 70B 融着材 1 PDP (plasma display panel) 11,21 glass substrate 25 vents 26 glass film 60 tip tube (glass tube 60) 70 Fusing material 70a Glass paste for fusion 70a 70B Fusing material
───────────────────────────────────────────────────── フロントページの続き (72)発明者 金江 達利 神奈川県川崎市中原区上小田中4丁目1番 1号 富士通株式会社内 (72)発明者 宮原 衛 神奈川県川崎市中原区上小田中4丁目1番 1号 富士通株式会社内 Fターム(参考) 5C012 AA09 BC03 5C040 HA05 KA08 MA22 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Tatsutoshi Kanae 4-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa No. 1 within Fujitsu Limited (72) Inventor Mamoru Miyahara 4-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa No. 1 within Fujitsu Limited F term (reference) 5C012 AA09 BC03 5C040 HA05 KA08 MA22
Claims (4)
管を取り付け、前記通気孔及び前記ガラス管を介して内
部の排気及び放電ガスの充填を行うプラズマディスプレ
イパネルの製造方法であって、 他の基板と重ね合わせた前記基板上に、予めガス抜きさ
れた融着材を端部に固定した前記ガラス管を配置し、そ
の状態で前記各基板を一括に熱することによって、基板
封止と同時に前記融着材を溶融させて前記ガラス管を取
付けることを特徴とするプラズマディスプレイパネルの
製造方法。1. A method of manufacturing a plasma display panel, wherein a glass tube for connecting a pipe is attached to a substrate having a ventilation hole, and exhaust gas and discharge gas inside are filled through the ventilation hole and the glass tube. By placing the glass tube, which has a pre-degassed fusing material fixed at its end, on the above-mentioned substrate laminated with another substrate, and heating the respective substrates together in that state, the substrate is sealed. A method for manufacturing a plasma display panel, characterized in that the fusion material is melted at the same time as the stopping, and the glass tube is attached.
するリング形状を有し、仮焼成してガス抜きされた固体
からなることを特徴とする請求項1記載のプラズマディ
スプレイパネルの製造方法。2. The plasma display according to claim 1, wherein the fusing material has a ring shape that engages with an end portion of the glass tube, and is made of a solid that has been decalcified and degassed. Panel manufacturing method.
取り付けるプラズマディスプレイパネルの製造に際し
て、 前記チップ管の端部と係合するリング形状に成形され仮
焼成によってガス抜きされた低融点ガラスからなる融着
材を予め当該チップ管に係合して一体化しておき、当該
融着材と一体化された当該チップ管を前記背面側の基板
上に配置し、当該融着材を熱で溶かして当該チップ管を
当該基板に取り付けることを特徴とするプラズマディス
プレイパネルの製造方法。3. When manufacturing a plasma display panel in which a chip tube is attached to a ventilation hole provided in a substrate on the back side, a low melting point formed into a ring shape engaging with an end of the chip tube and degassed by calcination. A fusion material made of glass is previously engaged with and integrated with the tip tube, and the tip tube integrated with the fusion material is placed on the substrate on the back side, and the fusion material is heated. A method for manufacturing a plasma display panel, which comprises melting the chip tube and attaching the chip tube to the substrate.
た通気孔に融着して取り付けられる融着材付きチップ管
であって、 端部が拡張されたチップ管と、当該チップ管の端部と係
合するリング形状に成形され仮焼成によってガス抜きさ
れた低融点ガラスからなる融着材とを両部材の係合状態
で一体化してなることを特徴とするプラズマディスプレ
イパネルの製造に用いる融着材付きチップ管。4. A chip tube with a fusion material, which is fused and attached to a vent hole provided in a substrate of a plasma display panel, wherein the tip tube has an expanded end portion, and the tip tube has an end portion. A fusion material for use in the production of a plasma display panel, characterized in that it is integrated with a fusion material made of a low-melting glass that has been formed into a mating ring shape and degassed by pre-firing in an engaged state of both members. With tip tube.
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JP2002227321A JP3675783B2 (en) | 2002-08-05 | 2002-08-05 | Method for manufacturing plasma display panel |
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JP25034693A Division JP3361161B2 (en) | 1993-10-06 | 1993-10-06 | Method for manufacturing plasma display panel |
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JP3675783B2 JP3675783B2 (en) | 2005-07-27 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011105596A (en) * | 2011-02-10 | 2011-06-02 | Nippon Electric Glass Co Ltd | Glass tablet, method for producing the same, and glass tablet-integrated exhaust pipe |
JP2011238538A (en) * | 2010-05-13 | 2011-11-24 | Panasonic Corp | Plasma display panel and method of manufacturing the same |
-
2002
- 2002-08-05 JP JP2002227321A patent/JP3675783B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011238538A (en) * | 2010-05-13 | 2011-11-24 | Panasonic Corp | Plasma display panel and method of manufacturing the same |
JP2011105596A (en) * | 2011-02-10 | 2011-06-02 | Nippon Electric Glass Co Ltd | Glass tablet, method for producing the same, and glass tablet-integrated exhaust pipe |
Also Published As
Publication number | Publication date |
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JP3675783B2 (en) | 2005-07-27 |
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