JP2003045747A - Stacked electronic component - Google Patents
Stacked electronic componentInfo
- Publication number
- JP2003045747A JP2003045747A JP2001234542A JP2001234542A JP2003045747A JP 2003045747 A JP2003045747 A JP 2003045747A JP 2001234542 A JP2001234542 A JP 2001234542A JP 2001234542 A JP2001234542 A JP 2001234542A JP 2003045747 A JP2003045747 A JP 2003045747A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- laminated body
- electronic component
- external
- external electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は各種電子機器等に使
用される積層電子部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component used in various electronic devices and the like.
【０００２】[0002]
【従来の技術】積層電子部品として積層セラミックコン
デンサを一例として以下に説明する。2. Description of the Related Art A laminated ceramic capacitor will be described below as an example of a laminated electronic component.
【０００３】図７は積層セラミックコンデンサ５１の一
部切欠斜視図である。図７において、５５はＢａＴｉＯ
3を主成分とするセラミック層５２とＮｉＯを主成分と
する内部電極層５３，５４とを交互に積層し、この最上
段と最下段にセラミック層５８，５９を重ねて焼結した
積層体であり、この積層体５５の表面に前記内部電極層
５３，５４とそれぞれ接続した外部電極５６，５７を形
成し、この外部電極５６，５７間にコンデンサ特性を有
する積層電子部品を構成している。FIG. 7 is a partially cutaway perspective view of the monolithic ceramic capacitor 51. In FIG. 7, 55 is BaTiO 3.
A laminated body in which ceramic layers 52 containing 3 as a main component and internal electrode layers 53 and 54 containing NiO as a main component are alternately laminated, and ceramic layers 58 and 59 are laminated on the uppermost and lowermost layers and sintered. Then, external electrodes 56 and 57 connected to the internal electrode layers 53 and 54, respectively, are formed on the surface of the laminated body 55, and a laminated electronic component having a capacitor characteristic is formed between the external electrodes 56 and 57.
【０００４】そして、前記積層電子部品が実装される電
子機器は小形化や多機能化が急速に進んでおり、高密度
実装ができ小形、高機能化を備えた積層電子部品が要求
されている。The electronic equipment on which the laminated electronic component is mounted is rapidly becoming smaller and more multifunctional, and there is a demand for a compact and highly functional laminated electronic component capable of high-density mounting. .
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
積層セラミックコンデンサ５１の構成によると、この積
層セラミックコンデンサ５１の底面を電子機器の回路基
板上に設置して前記外部電極５６，５７を前記回路基板
に接続する構成としているため、コンデンサ容量の高い
高積層タイプの積層セラミックコンデンサを用いると前
記回路基板上での実装高さが高くなり電子機器の小形化
が困難になるという問題点を有していた。However, according to the structure of the conventional monolithic ceramic capacitor 51, the bottom surface of the monolithic ceramic capacitor 51 is placed on the circuit board of an electronic device and the external electrodes 56 and 57 are provided on the circuit board. Therefore, if a high-multilayer type monolithic ceramic capacitor with a high capacitance is used, the mounting height on the circuit board becomes high, and it becomes difficult to miniaturize electronic equipment. It was
【０００６】本発明は前記問題点を解決するもので、電
子機器の回路基板上の実装高さが低く、かつ、コンデン
サの大容量化など高機能を付加できる積層電子部品を提
供することを目的とする。The present invention solves the above-mentioned problems, and an object of the present invention is to provide a laminated electronic component which has a low mounting height on a circuit board of an electronic device and can be added with a high function such as a large capacity of a capacitor. And
【０００７】[0007]
【課題を解決するための手段】前記目的を達成するため
に、以下の構成を有するものである。In order to achieve the above-mentioned object, it has the following constitution.
【０００８】本発明の請求項１に記載の発明は、特に、
機能材料層と内部電極層とを積層した第一の積層体と、
機能材料層と内部電極層とを積層し前記第一の積層体よ
り幅小の外形を有する第二の積層体とを積層して外形を
凸形状に形成し、この表面に外部電極を形成した積層電
子部品であり、これにより、前記凸形状の幅小の外形部
を電子機器の回路基板に形成した嵌合孔に嵌合させて実
装することで電子機器の実装高さが低くでき、第一の積
層体と第二の積層体とのそれぞれの特性を備えた高機能
を有する積層電子部品を得ることができるという作用効
果が得られる。The invention according to claim 1 of the present invention is
A first laminate in which a functional material layer and an internal electrode layer are laminated,
A functional material layer and an internal electrode layer were laminated and a second laminated body having an outer shape having a width smaller than that of the first laminated body was laminated to form a convex outer shape, and an external electrode was formed on this surface. It is a laminated electronic component, which allows the mounting height of the electronic device to be lowered by fitting and mounting the narrow outer shape portion of the convex shape into the fitting hole formed in the circuit board of the electronic device. It is possible to obtain a function and effect that it is possible to obtain a highly functional laminated electronic component having the respective characteristics of the first laminated body and the second laminated body.
【０００９】本発明の請求項２に記載の発明は特に、第
一の積層体と第二の積層体とにそれぞれ異なる電気特性
を持たせた請求項１に記載の積層電子部品であり、これ
により、電子機器の回路基板上の実装高さが低くできる
とともに、２つの電気特性を有する積層電子部品を得る
ことができるという作用効果が得られる。The invention according to claim 2 of the present invention is, in particular, the laminated electronic component according to claim 1, wherein the first laminated body and the second laminated body have different electric characteristics. As a result, the working height of the electronic device on the circuit board can be reduced, and the laminated electronic component having two electrical characteristics can be obtained.
【００１０】本発明の請求項３に記載の発明は、特に、
第一の積層体の側面に内部電極層と接続した一対の第一
の外部電極を形成し、第二の積層体の側面に内部電極層
と接続した一対の第二の外部電極を形成した請求項１に
記載の積層電子部品であり、これにより、第一の積層体
と第二の積層体とを電子機器の回路基板に接続して第一
の積層体、第二の積層体それぞれの電気特性を発現でき
るという作用効果が得られる。The invention according to claim 3 of the present invention is
A pair of first external electrodes connected to the internal electrode layers are formed on the side surfaces of the first laminate, and a pair of second external electrodes connected to the internal electrode layers are formed on the side surfaces of the second laminate. Item 1. The laminated electronic component according to Item 1, whereby the first laminated body and the second laminated body are connected to a circuit board of an electronic device, and electric power of each of the first laminated body and the second laminated body is increased. It is possible to obtain the effect of expressing the characteristics.
【００１１】本発明の請求項４に記載の発明は、特に、
内部電極層を機能材料層の同一面上に複数並設し、前記
内部電極層を並設した数の分だけ一対の外部電極を複数
並設した請求項１に記載の積層電子部品であり、これに
より一対の外部電極のそれぞれに電気特性を発現できる
ので電子機器の回路基板上に高密度に複数の電気素子を
実装できるという作用効果が得られる。The invention according to claim 4 of the present invention is
The laminated electronic component according to claim 1, wherein a plurality of internal electrode layers are arranged in parallel on the same surface of the functional material layer, and a plurality of pairs of external electrodes are arranged in parallel by the number of the internal electrode layers arranged in parallel. As a result, the electric characteristics can be developed in each of the pair of external electrodes, so that a plurality of electric elements can be mounted on the circuit board of the electronic device with high density.
【００１２】本発明の請求項５に記載の発明は、特に、
第一の外部電極と第二の外部電極とを接続した請求項２
に記載の積層電子部品であり、これにより第一の積層体
と第二の積層体とのそれぞれの電気特性を接続した電気
特性を発現できるので高機能を有し回路基板上の実装高
さが低い積層電子部品を得ることができるという作用効
果が得られる。The invention according to claim 5 of the present invention is
The first external electrode and the second external electrode are connected to each other.
The laminated electronic component according to claim 1, which has high functionality because it can express the electrical characteristics in which the respective electrical characteristics of the first laminated body and the second laminated body are connected and has a high mounting height on the circuit board. It is possible to obtain the operational effect that a low laminated electronic component can be obtained.
【００１３】本発明の請求項６に記載の発明は、特に、
第一の積層体の上面に第一の外部電極の延長部を形成
し、この第一の外部電極に重なるように第二の積層体の
下面に第二の外部電極の延長部を形成し、前記第一の積
層体の外部電極と前記第二の積層体の外部電極とを接続
した請求項５に記載の積層電子部品であり、これによ
り、第一の積層体と第二の積層体との外部電極を確実に
接続できるという作用効果が得られる。The invention according to claim 6 of the present invention is
The extension of the first external electrode is formed on the upper surface of the first laminated body, and the extension of the second external electrode is formed on the lower surface of the second laminated body so as to overlap with the first external electrode, The laminated electronic component according to claim 5, wherein an external electrode of the first laminated body and an external electrode of the second laminated body are connected to each other, whereby a first laminated body and a second laminated body are provided. It is possible to obtain the function and effect that the external electrodes can be reliably connected.
【００１４】本発明の請求項７に記載の発明は、特に、
第一の積層体の第一の外部電極を側面に代えて端面に形
成した請求項３に記載の積層電子部品であり、これによ
り、積層電子部品の外周に外部電極を形成できるので回
路基板と高密度に実装できるという作用効果が得られ
る。The invention according to claim 7 of the present invention is
The laminated electronic component according to claim 3, wherein the first external electrode of the first laminated body is formed on the end face instead of the side face, whereby the external electrode can be formed on the outer periphery of the laminated electronic component, and thus the circuit board and The effect of high-density mounting can be obtained.
【００１５】本発明の請求項８に記載の発明は、特に、
第一の積層体の側面に第二の積層体の外部電極の延長部
を形成した請求項７に記載の積層電子部品であり、これ
により、回路基板の嵌合孔に積層電子部品の凸部を嵌合
し回路基板の上面で第二の積層体の外部電極と第一の積
層体の外部電極とを接続できるのでこの接続に高信頼性
を確保できるという作用効果が得られる。The invention according to claim 8 of the present invention is
The laminated electronic component according to claim 7, wherein the extension of the external electrode of the second laminated body is formed on the side surface of the first laminated body, whereby the convex portion of the laminated electronic component is fitted into the fitting hole of the circuit board. Since the external electrodes of the second laminated body and the external electrodes of the first laminated body can be connected to each other on the upper surface of the circuit board by mating with each other, it is possible to obtain the operational effect of ensuring high reliability in this connection.
【００１６】[0016]
【発明の実施の形態】（実施の形態１）以下、実施の形
態１を用いて、本発明の特に請求項１〜６に記載の発明
について説明する。BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) In the following, the invention described in claims 1 to 6 of the present invention will be described with reference to Embodiment 1.
【００１７】図１は本発明の実施の形態１における積層
電子部品の分解斜視図、図２は同積層電子部品の外観斜
視図、図３は同積層電子部品の部品構成斜視図である。FIG. 1 is an exploded perspective view of a laminated electronic component according to Embodiment 1 of the present invention, FIG. 2 is an external perspective view of the laminated electronic component, and FIG. 3 is a component configuration perspective view of the laminated electronic component.
【００１８】図１〜図３において、１は積層電子部品で
あり、一対の第一の外部電極４，５を複数並設した第一
の積層体２と、一対の第二の外部電極６，７を複数並設
した第二の積層体３とを重ねて加熱、加圧して凸形状に
構成した。1 to 3, reference numeral 1 denotes a laminated electronic component, which includes a first laminated body 2 in which a plurality of a pair of first external electrodes 4, 5 are arranged in parallel, and a pair of second external electrodes 6, 6. The second laminated body 3 in which a plurality of 7 are arranged side by side is stacked and heated and pressed to form a convex shape.
【００１９】前記第一の積層体２の上面に前記第一の外
部電極４，５の延長部１２，１３を形成し、前記第二の
積層体３の底面に前記第二の外部電極６，７の延長部
（図示せず）を形成しており、前記第一の外部電極４，
５の延長部１２，１３と前記第二の外部電極６，７の延
長部とを重ねて積層し接続した。Extensions 12 and 13 of the first external electrodes 4 and 5 are formed on the upper surface of the first laminated body 2, and the second external electrodes 6 and 6 are formed on the bottom surface of the second laminated body 3. 7 has an extension (not shown), and the first external electrode 4,
The extension portions 12 and 13 of No. 5 and the extension portions of the second external electrodes 6 and 7 were laminated and connected.
【００２０】前記第一の積層体２は機能材料層として誘
電体を用いたセラミック層１８を介して複数並設した内
部電極１４と１５とを交互に複数積層し、前記内部電極
１４，１５を前記外部電極５，４に接続し、前記一対の
外部電極４，５間にこの一対の外部電極４，５を複数並
設した数の分だけコンデンサを構成した。The first laminated body 2 is formed by alternately laminating a plurality of internal electrodes 14 and 15 arranged in parallel with each other with a ceramic layer 18 using a dielectric as a functional material layer interposed therebetween. Capacitors were formed by connecting the external electrodes 5 and 4 and by arranging a plurality of the external electrodes 4 and 5 in parallel between the external electrodes 4 and 5.
【００２１】前記第二の積層体３は機能材料層として電
圧依存性抵抗体を用いたセラミック層１９を介して複数
並設した内部電極層２０と２１とを交互に複数積層し、
前記内部電極層２０，２１を前記外部電極７，６に接続
し、複数並設した前記一対の外部電極６，７間にこの１
対の外部電極６，７を複数並設した数の分だけバリスタ
を構成した。The second laminated body 3 is formed by alternately laminating a plurality of internal electrode layers 20 and 21 arranged in parallel through a ceramic layer 19 using a voltage dependent resistor as a functional material layer.
The internal electrode layers 20 and 21 are connected to the external electrodes 7 and 6, and the space between the pair of external electrodes 6 and 7 arranged in parallel is 1
The varistor was constituted by the number of the plurality of pairs of external electrodes 6 and 7 arranged in parallel.
【００２２】以上のように構成された積層電子部品１に
ついて、以下にこの製造方法を説明する。The method of manufacturing the laminated electronic component 1 having the above-described structure will be described below.
【００２３】先ず第一の積層体の製造方法を説明する。First, a method for manufacturing the first laminate will be described.
【００２４】誘電体材料としてＢａＴｉＯ3を主原料と
したバインダーとしてポリビニルブチラール樹脂、溶剤
として酢酸ｎブチル、可塑剤としてフタル酸ジブチルを
加え、イットリア部分安定化ジルコニアボールと共にボ
ールミルで７２時間混合しスラリーを作製し、このスラ
リーを用いてセラミックグリーンシート（以降、グリー
ンシートと称する）を成形した。Polyvinyl butyral resin as a binder mainly made of BaTiO 3 as a dielectric material, n-butyl acetate as a solvent, and dibutyl phthalate as a plasticizer were added and mixed with a yttria partially stabilized zirconia ball in a ball mill for 72 hours to form a slurry. A ceramic green sheet (hereinafter referred to as a green sheet) was formed using this slurry.
【００２５】その後、Ｎｉなどの卑金属材料あるいはＰ
ｄ，Ａｇ−Ｐｄ等の貴金属からなる内部電極ペーストを
セラミックシート上にスクリーンあるいはグラビア等に
より印刷し、交互に複数段重ね、この最上段と最下段に
セラミックシートを重ねて圧着し積層体ブロック（図示
せず）を得た。そして、この積層体ブロックを所定サイ
ズのチップ形状に切断し、個片にばらした後、所定の温
度で焼成を行った。このとき、Ｎｉ等の卑金属を内部電
極ペーストとして用いた場合は前記内部電極層１４，１
５の酸化劣化を防止するために窒素ガス雰囲気などの還
元性雰囲気中で焼成を行った。After that, a base metal material such as Ni or P
An internal electrode paste made of a noble metal such as d or Ag-Pd is printed on a ceramic sheet by a screen or gravure, and alternately stacked in a plurality of stages. The ceramic sheets are stacked in the uppermost and lowermost layers and pressure-bonded to form a laminated body block ( (Not shown) was obtained. Then, this laminate block was cut into a chip shape of a predetermined size, separated into individual pieces, and then fired at a predetermined temperature. At this time, when a base metal such as Ni is used as the internal electrode paste, the internal electrode layers 14, 1
In order to prevent oxidative deterioration of No. 5, firing was performed in a reducing atmosphere such as a nitrogen gas atmosphere.
【００２６】次いで、内部電極層１４，１５が露出した
第一の積層体２の両側面にＣｕからなる外部電極ペース
トを塗布し焼き付けを行いさらにこの表面にＮｉメッキ
及び半田メッキを施して前記外部電極４，５を形成し第
一の積層体２を得た。Then, an external electrode paste made of Cu is applied to both side surfaces of the first laminated body 2 where the internal electrode layers 14 and 15 are exposed and baked, and then Ni plating and solder plating are applied to the surfaces to form the external layer. The electrodes 4 and 5 were formed to obtain the first laminate 2.
【００２７】次に第二の積層体の製造方法を説明する。Next, a method for manufacturing the second laminated body will be described.
【００２８】まず、バリスタ材料としてＳｒＴｉＯ3を
主原料としたスラリーを用いてセラミックグリーンシー
ト（以降、グリーンシートと称する）成形した。First, a ceramic green sheet (hereinafter referred to as a green sheet) was formed using a slurry containing SrTiO 3 as a main material as a varistor material.
【００２９】その後、前記第一の積層体２の製造方法と
同様にＮｉなどの卑金属材料あるいはＰｄ，Ａｇ−Ｐｄ
等の貴金属からなる内部電極ペーストをセラミックシー
トと上に印刷し、交互に複数段重ね、この最上段と最下
段にセラミックシートを重ねて圧着し積層ブロック（図
示せず）を得た。そして、この積層体ブロックを前記第
一の積層体２の幅より小となる寸法でチップ形状に切断
し、所定の温度で焼成を行った。Thereafter, a base metal material such as Ni or Pd, Ag-Pd is used as in the method of manufacturing the first laminate 2.
An internal electrode paste made of a noble metal such as the above was printed on the ceramic sheet and alternately overlaid in a plurality of stages, and the ceramic sheets were overlaid on the uppermost stage and the lowermost stage and pressure-bonded to obtain a laminated block (not shown). Then, this laminated body block was cut into a chip shape with a dimension smaller than the width of the first laminated body 2 and fired at a predetermined temperature.
【００３０】次いで、前記内部電極２０，２１が露出し
た前記第二の積層体３の両側面１０，１１にＣｕペース
トを塗布して焼き付け、更にこの表面にＮｉメッキ、半
田メッキを施し前記第二の外部電極６，７を形成した第
二の積層体３を得た。Then, a Cu paste is applied to both side surfaces 10 and 11 of the second laminated body 3 where the internal electrodes 20 and 21 are exposed and baked, and then Ni plating and solder plating are applied to the surfaces to form the second paste. The second laminated body 3 having the external electrodes 6 and 7 was obtained.
【００３１】次に、前記第二の積層体３の下面にバイン
ダー成分や接着剤を塗布して前記第二の積層体３と前記
第一の積層体２とを重ね、約百℃で加熱しながら圧着し
て一体化し積層電子部品１を得た。Next, a binder component or an adhesive is applied to the lower surface of the second laminated body 3 so that the second laminated body 3 and the first laminated body 2 are stacked and heated at about 100 ° C. While pressing, they were integrated to obtain a laminated electronic component 1.
【００３２】（実施の形態２）以下、実施の形態２を用
いて、本発明の特に請求項７，８に記載の発明について
説明する。(Second Embodiment) The second embodiment of the present invention will be described below, particularly the inventions recited in claims 7 and 8.
【００３３】尚、前記実施の形態１と共通の構成は同一
符号で示し説明を省き、ここでは実施の形態２の特徴と
する構成について以下に説明する。The same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted. Here, the features of the second embodiment will be described below.
【００３４】図４は本発明の実施の形態２における積層
電子部品の分解斜視図、図５は同積層電子部品の外観斜
視図、図６は同積層電子部品の部品構成斜視図である。FIG. 4 is an exploded perspective view of the laminated electronic component according to the second embodiment of the present invention, FIG. 5 is an external perspective view of the laminated electronic component, and FIG. 6 is a component configuration perspective view of the laminated electronic component.
【００３５】図４〜図６において、３１は積層電子部品
であり、一対の第一の外部電極３５，３６を端面３３，
３４に複数並設した第一の積層体３２と、一対の第二の
外部電極６，７を複数並設した第二の積層体３とを重ね
て加熱、圧着して凸形状に構成した。In FIGS. 4 to 6, reference numeral 31 denotes a laminated electronic component, which includes a pair of first external electrodes 35, 36 and an end face 33,
A plurality of first laminated bodies 32 arranged in parallel with each other on 34 and a second laminated body 3 in which a plurality of pairs of second external electrodes 6 and 7 are arranged side by side are heated and pressure-bonded to form a convex shape.
【００３６】前記第一の積層体３２は誘電体からなるセ
ラミック層２７を介して内部電極２８と２９とを交互に
複数積層し、前記内部電極２８，２９をそれぞれ前記外
部電極３５，３６に接続し、前記一対の外部電極３５，
３６間にこの一対の外部電極３５，３６を複数並設した
数の分だけコンデンサを構成した。The first laminate 32 is formed by alternately laminating a plurality of internal electrodes 28 and 29 via ceramic layers 27 made of a dielectric material, and connecting the internal electrodes 28 and 29 to the external electrodes 35 and 36, respectively. The pair of external electrodes 35,
Capacitors are formed by the number of a plurality of the pair of external electrodes 35, 36 arranged in parallel between 36.
【００３７】このとき、前記内部電極層３５，３６の並
設方向は前記第二の積層体３の前記内部電極層２０，２
１の並設方向と直角方向に異なり、前記第一の積層体３
２の外部電極３５，３６を端面３３，３４に、前記第二
の積層体３の外部電極６，７を前記端面３３，３４と直
角方向の側面１０，１１に形成した。At this time, the inner electrode layers 35, 36 are arranged in parallel in the inner electrode layers 20, 2 of the second laminate 3.
The first laminated body 3 is different from the parallel installation direction of
The second external electrodes 35, 36 are formed on the end faces 33, 34, and the external electrodes 6, 7 of the second laminated body 3 are formed on the side faces 10, 11 perpendicular to the end faces 33, 34.
【００３８】また、前記第一の積層体３２の側面８，９
に導電性ペーストを前記第二の積層体３における第二の
外部電極６，７に接続するように塗布して焼き付け前記
第二の外部電極６，７の延長部３７，３８を形成した。Further, the side surfaces 8 and 9 of the first laminated body 32.
Then, a conductive paste was applied so as to be connected to the second external electrodes 6, 7 in the second laminated body 3 and baked to form the extension portions 37, 38 of the second external electrodes 6, 7.
【００３９】尚、本発明の実施の形態１，２において、
第一の積層体がコンデンサ、第２の積層体がバリスタを
構成しそれぞれ異なる電気特性を構成したが、前記第一
の積層体と第二の積層体とに同一の電気特性を構成して
もよい。In the first and second embodiments of the present invention,
Although the first laminated body constitutes a capacitor and the second laminated body constitutes a varistor and has different electric characteristics, respectively, even if the first laminated body and the second laminated body have the same electric characteristic. Good.
【００４０】また第一の積層体、第二の積層体それぞれ
の温度特性を異なるものに設定したり、誘電率の異なる
ものを選択することにより、更に付加価値の高い積層電
子部品を得ることができる。Further, by setting the temperature characteristics of the first laminated body and the second laminated body to be different from each other or selecting those having different dielectric constants, a laminated electronic component having a higher added value can be obtained. it can.
【００４１】[0041]
【発明の効果】以上本発明によれば、第一の積層体と、
この第一の積層体より幅小の外形を有する第二の積層体
とを積層して外形を凸形状に形成し、この表面に外部電
極を形成することにより、前記凸形状の幅小の外形部を
電子機器のプリント基板に形成した嵌合孔に嵌合させて
実装し電子機器の実装高さが低くでき、且つ高機能を付
加した積層電子部品を得ることができる。As described above, according to the present invention, the first laminated body,
By forming a convex outer shape by laminating a second laminated body having a smaller outer shape than the first laminated body, and forming an external electrode on this surface, the convex outer shape having a small width is formed. The mounting height of the electronic device can be reduced by fitting the parts into the fitting holes formed in the printed circuit board of the electronic device and mounting them, and it is possible to obtain a laminated electronic component having a high function.
【図１】本発明の実施の形態１における積層電子部品の
分解斜視図FIG. 1 is an exploded perspective view of a laminated electronic component according to a first embodiment of the present invention.
【図２】実施の形態１における同積層電子部品の外観斜
視図FIG. 2 is an external perspective view of the laminated electronic component according to the first embodiment.
【図３】実施の形態１における同積層電子部品の部品構
成斜視図FIG. 3 is a perspective view of the component structure of the multilayer electronic component according to the first embodiment.
【図４】本発明の実施の形態２における積層電子部品の
分解斜視図FIG. 4 is an exploded perspective view of a laminated electronic component according to a second embodiment of the present invention.
【図５】実施の形態２における同積層電子部品の外観斜
視図FIG. 5 is an external perspective view of the laminated electronic component according to the second embodiment.
【図６】実施の形態２における同積層電子部品の部品構
成斜視図FIG. 6 is a component perspective view of the laminated electronic component according to the second embodiment.
【図７】従来例における積層セラミックコンデンサの一
部切欠斜視図FIG. 7 is a partially cutaway perspective view of a conventional monolithic ceramic capacitor.
１，３１ 積層電子部品 ２，３２ 第一の積層体 ３ 第二の積層体 ４，５，３５，３６ 第一の外部電極 ６，７ 第二の外部電極 ８，９，１０，１１ 側面 １２，１３ 外部電極の延長部 １４，１５，２０，２１ 内部電極層 １６ 誘電体層 １８，１９ セラミック層 ３３，３４ 端面 ３７，３８ 第二の外部電極の延長部 1,31 Multilayer electronic components 2,32 First laminated body 3 Second stack 4, 5, 35, 36 First external electrode 6,7 Second external electrode 8, 9, 10, 11 Sides 12, 13 External electrode extension 14, 15, 20, 21 Internal electrode layers 16 Dielectric layer 18,19 Ceramic layer 33, 34 end face 37,38 Extension of the second external electrode
Claims (8)
一の積層体と、機能材料層と内部電極層とを積層し前記
第一の積層体より幅小の外形を有する第二の積層体とを
積層して外形を凸形状に形成し、この表面に外部電極を
形成した積層電子部品。1. A first laminated body in which a functional material layer and an internal electrode layer are laminated, and a second laminated body in which a functional material layer and an internal electrode layer are laminated and which has an outer shape smaller than the first laminated body. A laminated electronic component in which an external electrode is formed on the surface of a laminated body that is laminated to form a convex outer shape.
れ異なる電気特性を持たせた請求項１に記載の積層電子
部品。2. The laminated electronic component according to claim 1, wherein the first laminated body and the second laminated body have different electrical characteristics.
した一対の第一の外部電極を形成し、第二の積層体の側
面に内部電極層と接続した一対の第二の外部電極を形成
した請求項１に記載の積層電子部品。3. A pair of first external electrodes connected to the internal electrode layers are formed on the side surfaces of the first laminate, and a pair of second external electrodes connected to the internal electrode layers are formed on the side surfaces of the second laminate. The laminated electronic component according to claim 1, wherein an electrode is formed.
数並設し、前記内部電極層を並設した数の分だけ一対の
外部電極を複数並設した請求項１に記載の積層電子部
品。4. The laminate according to claim 1, wherein a plurality of internal electrode layers are provided in parallel on the same surface of the functional material layer, and a plurality of pairs of external electrodes are provided in parallel by the number of the internal electrode layers provided in parallel. Electronic components.
続した請求項２に記載の積層電子部品。5. The laminated electronic component according to claim 2, wherein the first external electrode and the second external electrode are connected to each other.
延長部を形成し、この第一の外部電極に重なるように第
二の積層体の下面に第二の外部電極の延長部を形成し、
前記第一の積層体の外部電極と前記第二の積層体の外部
電極とを接続した請求項５に記載の積層電子部品。6. The extension of the first external electrode is formed on the upper surface of the first laminate, and the extension of the second external electrode is formed on the lower surface of the second laminate so as to overlap the first external electrode. Forming a part,
The laminated electronic component according to claim 5, wherein the external electrode of the first laminated body and the external electrode of the second laminated body are connected to each other.
代えて端面に形成した請求項３に記載の積層電子部品。7. The laminated electronic component according to claim 3, wherein the first external electrode of the first laminated body is formed on the end face instead of the side face.
部電極の延長部を形成した請求項７に記載の積層電子部
品。8. The laminated electronic component according to claim 7, wherein an extension of the external electrode of the second laminated body is formed on a side surface of the first laminated body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001234542A JP2003045747A (en) | 2001-08-02 | 2001-08-02 | Stacked electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001234542A JP2003045747A (en) | 2001-08-02 | 2001-08-02 | Stacked electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003045747A true JP2003045747A (en) | 2003-02-14 |
Family
ID=19066137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001234542A Pending JP2003045747A (en) | 2001-08-02 | 2001-08-02 | Stacked electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003045747A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007500442A (en) * | 2003-07-30 | 2007-01-11 | イノチップス・テクノロジー・カンパニー・リミテッド | Composite multilayer chip element |
| JP2016171184A (en) * | 2015-03-12 | 2016-09-23 | 株式会社村田製作所 | Composite electronic component and resistive element |
-
2001
- 2001-08-02 JP JP2001234542A patent/JP2003045747A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007500442A (en) * | 2003-07-30 | 2007-01-11 | イノチップス・テクノロジー・カンパニー・リミテッド | Composite multilayer chip element |
| JP2010251771A (en) * | 2003-07-30 | 2010-11-04 | Innochips Technology Co Ltd | Composite laminated chip element |
| JP2016171184A (en) * | 2015-03-12 | 2016-09-23 | 株式会社村田製作所 | Composite electronic component and resistive element |
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