JP2003039305A - Polishing device - Google Patents
Polishing deviceInfo
- Publication number
- JP2003039305A JP2003039305A JP2001233066A JP2001233066A JP2003039305A JP 2003039305 A JP2003039305 A JP 2003039305A JP 2001233066 A JP2001233066 A JP 2001233066A JP 2001233066 A JP2001233066 A JP 2001233066A JP 2003039305 A JP2003039305 A JP 2003039305A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing pad
- cell
- polished
- connecting means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は三次元自由曲面を研
磨することのできる研磨装置に関する。TECHNICAL FIELD The present invention relates to a polishing apparatus capable of polishing a three-dimensional free curved surface.
【０００２】[0002]
【従来の技術】三次元自由曲面を研磨するため、従来か
ら様々な装置が提案されている。例えば特公平６−７５
８２２号公報には次のような装置が記載されている。す
なわち、被加工物である金型を金型載置テーブルに載置
し、この金型載置テーブルを通じ金型に回転と傾き、及
びＸＹ方向の動きを与える。他方研磨工具は研磨ヘッド
に支持してＺ方向の動きを与える。研磨工具は水平位置
と角度を変えず、金型の方を動かして曲面を研磨工具に
追随させる。そして、研磨工具を金型に接触させる接触
研磨と、研磨工具中心部の穴を通して砥粒液を供給しつ
つ行う非接触研磨とを使い分けて研磨を行う。2. Description of the Related Art Various devices have been conventionally proposed for polishing a three-dimensional free-form surface. For example, Japanese Patent Fair 6-75
The following device is described in Japanese Patent No. 822. That is, a die, which is a workpiece, is placed on the die placement table, and the die is rotated, tilted, and moved in the XY directions through the die placement table. On the other hand, the polishing tool supports the polishing head and gives movement in the Z direction. The polishing tool does not change its horizontal position and angle, but the mold is moved so that the curved surface follows the polishing tool. Then, the polishing is performed by selectively using the contact polishing in which the polishing tool is brought into contact with the mold and the non-contact polishing performed while supplying the abrasive grain liquid through the hole in the center of the polishing tool.
【０００３】上記特公平６−７５８２２号公報記載の装
置は、三次元自由曲面の精密研磨を可能にするものはあ
るが、大がかりな装置を必要とするという欠点がある。
特に、研磨工具の水平位置と角度を変えず、被加工物の
方を動かして曲面形状を研磨工具に追随させるようにし
ているため、支持メカニズムや制御が複雑であり、コス
ト高となる。また、被加工物をその載置テーブルぐるみ
移動させねばならないのでエネルギー消費も大きい。The apparatus described in Japanese Patent Publication No. 6-75822 mentioned above enables precise polishing of a three-dimensional free curved surface, but has a drawback that it requires a large-scale apparatus.
In particular, since the curved surface shape is made to follow the polishing tool by moving the workpiece without changing the horizontal position and angle of the polishing tool, the supporting mechanism and control are complicated and the cost is high. In addition, since the workpiece has to be moved around the mounting table, energy consumption is large.
【０００４】特開２０００−１１７６０９号公報には異
なる形式の研磨装置が記載されている。すなわち研磨工
具の砥石を角度可変として被研磨体の曲面に倣わせるも
のである。これは、研磨工具を工具固定部と工具支持部
とにより構成し、両者を球体形状部で接触させて、砥石
を有する工具固定部が角度を変えられるようにすること
により実現している。工具支持部から工具固定部への回
転伝達はコイルスプリング、ダイヤフラム、網目形状体
等のフレキシブルな連結具により行う。Japanese Unexamined Patent Publication No. 2000-117609 describes a polishing apparatus of a different type. That is, the grindstone of the polishing tool is made to have a variable angle so as to follow the curved surface of the object to be polished. This is realized by configuring the polishing tool with a tool fixing portion and a tool supporting portion, and bringing them into contact with each other in a spherical shape portion so that the tool fixing portion having a grindstone can change the angle. Rotational transmission from the tool supporting portion to the tool fixing portion is performed by a flexible connecting member such as a coil spring, a diaphragm, or a mesh-shaped body.
【０００５】上記特開２０００−１１７６０９号公報記
載の装置では砥石が自ら角度を変えるため、砥石を一定
荷重で被研磨体に接触させつつ砥石と被研磨体との相対
位置を変えさえすれば、相手が三次元自由曲面であって
も研磨を行うことができる。これにより、特公平６−７
５８２２号公報記載の装置に比べ、非常にコスト安の三
次元自由曲面研磨装置を得ることができる。しかしなが
らこの装置は球体形状部で接触する工具固定部と工具支
持部を用意する必要があり、十分に構成簡単とは言えな
い。また研磨には研磨液を使用するが、これが連結具を
濡らすことを防ぐことができない。連結具に研磨液が付
着した場合、連結具の材質が例えばバネ鋼であれば当然
錆が発生する。錆の発生しない材質の連結具であっても
その隙間部分に研磨液の構成成分である砥粒等が徐々に
堆積固化し、スムーズな伸縮が妨げられることになる。In the apparatus described in the above-mentioned Japanese Patent Laid-Open No. 2000-117609, since the grindstone changes its angle by itself, if the relative position between the grindstone and the object to be polished is changed while the wheel is brought into contact with the object to be polished under a constant load. Even if the partner is a three-dimensional free-form surface, polishing can be performed. As a result,
It is possible to obtain a three-dimensional free-form curved surface polishing apparatus which is very low in cost as compared with the apparatus described in Japanese Patent No. 5822. However, this device requires a tool fixing portion and a tool supporting portion that are in contact with each other in a spherical shape portion, and thus the structure cannot be said to be sufficiently simple. Further, a polishing liquid is used for polishing, but this cannot prevent the connector from getting wet. When the polishing liquid adheres to the connector, if the material of the connector is, for example, spring steel, rust naturally occurs. Even if the connector is made of a material that does not generate rust, the abrasive grains, which are the constituents of the polishing liquid, are gradually deposited and solidified in the gaps, and smooth expansion and contraction is hindered.
【０００６】[0006]
【発明が解決しようとする課題】本発明は上記従来装置
のかかえる問題を解決するためになされたもので、極め
て単純な構成で三次元自由曲面の研磨を可能にするとと
もに、研磨液が研磨工具に及ぼす悪影響を排除できる研
磨装置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the problems associated with the above-mentioned conventional apparatus, and enables polishing of a three-dimensional free-form surface with an extremely simple structure, and the polishing liquid is used as a polishing tool. It is an object of the present invention to provide a polishing apparatus that can eliminate the adverse effects on the polishing.
【０００７】[0007]
【課題を解決するための手段】本発明では、研磨装置に
次の構成要素を備えさせることとした。
（ａ）回転軸
（ｂ）研磨パッド
（ｃ）前記回転軸と研磨パッドとを連結し、研磨パッド
を首振り自在に支持するとともに回転軸の回転を研磨パ
ッドに伝達するものであって、可撓性膜からなるセル中
に流体を密封した構造の連結手段。In the present invention, the polishing apparatus is provided with the following components. (A) rotating shaft (b) polishing pad (c) connecting the rotating shaft and the polishing pad, supporting the polishing pad swingably and transmitting the rotation of the rotating shaft to the polishing pad, A connecting means having a structure in which a fluid is sealed in a cell made of a flexible film.
【０００８】このように回転軸と研磨パッドとを可撓性
膜からなるセル中に流体を密封した構造の連結手段によ
り連結したので、研磨パッドは被研磨物の曲面に合わせ
て自律的に角度を変え、三次元自由曲面の研磨が可能と
なる。そしてこの連結手段には研磨液が浸透するような
隙間がないので研磨液の構成成分が堆積固化することが
なく、長期にわたりスムーズな動きを得ることができ
る。As described above, since the rotating shaft and the polishing pad are connected by the connecting means having the structure in which the fluid is sealed in the cell made of the flexible film, the polishing pad is autonomously angled according to the curved surface of the object to be polished. Can be changed to polish a three-dimensional free curved surface. Further, since there is no gap for the polishing liquid to penetrate into the connecting means, the constituent components of the polishing liquid are not deposited and solidified, and smooth movement can be obtained for a long period of time.
【０００９】また本発明では、セル中に密封する流体を
気体とした。これにより、連結手段の製作を容易化でき
る。Further, in the present invention, the fluid sealed in the cell is gas. This can facilitate the production of the connecting means.
【００１０】また本発明では、セル中に密封する流体を
液体とした。これにより、温度差による剛性変化の少な
い連結手段を得ることができる。Further, in the present invention, the fluid sealed in the cell is a liquid. As a result, it is possible to obtain the connecting means in which the rigidity change due to the temperature difference is small.
【００１１】また本発明では、セルが単一セルで構成さ
れることとした。これにより、連結手段を簡便に調製す
ることができる。Further, in the present invention, the cell is constituted by a single cell. Thereby, the connecting means can be easily prepared.
【００１２】また本発明では、セルが複数セルの集合体
で構成されることとした。これにより、１個のセルが破
裂したとしても研磨パッドは他のセルにより定位置に保
持され続けることになり、研磨パッドがセルの残骸に付
着した状態で振り回されて被研磨面に傷をつけるという
危険を低減することができる。Further, in the present invention, the cell is made up of an aggregate of a plurality of cells. As a result, even if one cell bursts, the polishing pad will continue to be held in place by the other cells, and the polishing pad will be swung around in the state of being attached to the remnants of the cell and scratch the surface to be polished. It is possible to reduce the risk.
【００１３】[0013]
【発明の実施の形態】図１及び図２に本発明研磨装置の
第１実施形態を示す。図において１は被研磨面２を研磨
する研磨装置であり、軸線を垂直にした回転軸１０を備
える。回転軸１０にはモータ、ＸＹ移動装置、Ｚ移動装
置（いずれも図示せず）が付属する。モータは回転軸１
０に所定回転数の回転を与え、ＸＹ移動装置は回転軸１
０を水平面内で移動させ、Ｚ移動装置は回転軸１０に垂
直方向の変位を与えるものである。1 and 2 show a polishing apparatus according to a first embodiment of the present invention. In the figure, reference numeral 1 denotes a polishing apparatus for polishing a surface to be polished 2, which is provided with a rotary shaft 10 having an axis line vertical. A motor, an XY moving device, and a Z moving device (none of which are shown) are attached to the rotary shaft 10. Motor is rotating shaft 1
0 is rotated by a predetermined number of revolutions, and the XY movement device operates on the rotation axis 1
0 is moved in the horizontal plane, and the Z moving device gives a vertical displacement to the rotary shaft 10.
【００１４】回転軸１０の下端には研磨工具２０が固定
される。研磨工具２０は研磨パッド２１と、この研磨パ
ッド２１を回転軸１０に連結する連結手段２２により構
成される。A polishing tool 20 is fixed to the lower end of the rotary shaft 10. The polishing tool 20 includes a polishing pad 21 and a connecting means 22 that connects the polishing pad 21 to the rotary shaft 10.
【００１５】研磨パッド２１は円板形であり、スズ、フ
ェルト、ピッチ（アスファルト）、ウレタン等のシート
から成型される。連結手段２２は可撓性膜からなる独立
気泡状のセル２３の中に流体２４を密封した構造のもの
であり、セル２３の上面を回転軸１０の下面に、セル２
３の下面を研磨パッド２１の上面に、それぞれ接着剤で
固定して、回転軸１０と研磨パッド２１とを連結する。
この連結手段２２により研磨パッド２１は垂直面内で角
度可変、すなわち首振り自在に支持されるものである。The polishing pad 21 has a disc shape and is formed from a sheet of tin, felt, pitch (asphalt), urethane or the like. The connecting means 22 has a structure in which a fluid 24 is sealed in a closed-cell cell 23 made of a flexible film, and the upper surface of the cell 23 is placed on the lower surface of the rotating shaft 10 and the cell 2 is connected.
The lower surface of 3 is fixed to the upper surface of the polishing pad 21 with an adhesive, respectively, and the rotary shaft 10 and the polishing pad 21 are connected.
The polishing pad 21 is supported by the connecting means 22 so that its angle can be changed in a vertical plane, that is, it can swing freely.
【００１６】セル２３はポリエチレン等適度な強度を備
えた合成樹脂フィルムにより構成する。流体２４は空気
とする。The cell 23 is made of a synthetic resin film having a proper strength such as polyethylene. The fluid 24 is air.
【００１７】被研磨面２を研磨するにあたっては研磨液
を使用する。研磨液は微細な砥粒を溶剤に混合してスラ
リー状にしたものである。砥粒と溶剤の組み合わせとし
ては「ダイヤモンド微粒子＋水溶性の油」「酸化セリウ
ム＋水」等がある。A polishing liquid is used to polish the surface 2 to be polished. The polishing liquid is a slurry prepared by mixing fine abrasive grains with a solvent. Examples of combinations of abrasive grains and solvents include "diamond fine particles + water-soluble oil" and "cerium oxide + water".
【００１８】次に研磨装置１の作用を説明する。被研磨
面２に研磨液を供給しつつ、研磨パッド２１を所定圧力
で被研磨面２に押しつけると、研磨パッド２１が研磨液
中の砥粒を保持した形になり、研磨の準備が整う。研磨
液の供給を続けつつ回転軸１０を回転させると、連結手
段２２を介して研磨パッド２１に回転が伝達され、研磨
パッド２１はその保持する砥粒により被研磨面２を研磨
する。回転軸１０を水平面内で動かすことにより、被研
磨面２の全域を研磨することができる。なおパスカルの
原理により、研磨パッド２１が被研磨面２に及ぼす圧力
は研磨パッド２１の全面にわたってほぼ均一となる。Next, the operation of the polishing apparatus 1 will be described. When the polishing pad 21 is pressed against the surface to be polished 2 with a predetermined pressure while supplying the polishing liquid to the surface to be polished 2, the polishing pad 21 becomes a shape in which the abrasive grains in the polishing liquid are held, and the preparation for polishing is completed. When the rotary shaft 10 is rotated while continuously supplying the polishing liquid, the rotation is transmitted to the polishing pad 21 via the connecting means 22, and the polishing pad 21 polishes the surface 2 to be polished by the abrasive grains held by the polishing pad 21. By moving the rotary shaft 10 within a horizontal plane, the entire surface 2 to be polished can be polished. According to the Pascal principle, the pressure exerted by the polishing pad 21 on the surface to be polished 2 becomes substantially uniform over the entire surface of the polishing pad 21.
【００１９】図２に示すように被研磨面２が三次元自由
曲面であった場合、連結手段２２が変形して研磨パッド
２１に首を振らせる。これにより研磨パッド２１は被研
磨面２の傾斜にぴったりと沿う。従って、回転軸１０の
角度を変えずに三次元自由曲面の研磨を行うことができ
る。When the surface to be polished 2 is a three-dimensional free curved surface as shown in FIG. 2, the connecting means 22 is deformed and the polishing pad 21 is swung. As a result, the polishing pad 21 closely follows the inclination of the surface to be polished 2. Therefore, the three-dimensional free-form surface can be polished without changing the angle of the rotary shaft 10.
【００２０】研磨作業中、被研磨面２には研磨液が供給
されており、必然的にこの研磨液が連結手段２２に付着
する。コイルスプリング、ダイヤフラム、網目形状体等
や、スポンジのような有孔体を連結手段としているので
あれば、各部の隙間に研磨液の構成成分が侵入して堆積
固化し、伸縮を妨げるという問題が発生する。しかしな
がら連結手段２２の場合、セル２３に研磨液の構成成分
が堆積固化するような隙間がない。従って研磨液が連結
手段２２の動きを妨げるという事態は発生しない。また
連結手段２２には錆の問題もない。During the polishing operation, the polishing liquid is supplied to the surface 2 to be polished, and the polishing liquid inevitably adheres to the connecting means 22. If a coil spring, a diaphragm, a mesh-shaped body or the like or a perforated body such as a sponge is used as the connecting means, there is a problem that the constituent components of the polishing liquid enter the gaps between the portions to be deposited and solidified to prevent expansion and contraction. Occur. However, in the case of the connecting means 22, there is no gap in the cell 23 where the constituents of the polishing liquid are deposited and solidified. Therefore, the situation in which the polishing liquid hinders the movement of the connecting means 22 does not occur. Further, the connecting means 22 has no problem of rust.
【００２１】セル２３の材質は、流体を通過させず、ま
た適度な強度と可撓性を備えたものであれば何でも良
い。なお流体２４としては気体でなく液体を用いること
もできる。気体の場合温度変化による体積変動が大きい
のでセル２３内の温度が上昇するとセル２３の内圧も高
まり、連結手段２２が剛性を増す結果となるが、液体の
場合は温度変化による体積変動が小さいのでセル２３内
の温度が上昇したからといってセル２３の内圧はそれほ
ど上昇しない。つまり温度差による剛性変化の少ない連
結手段２２を得ることができる。The cell 23 may be made of any material as long as it does not allow passage of fluid and has appropriate strength and flexibility. The fluid 24 may be liquid instead of gas. In the case of gas, the volume change due to the temperature change is large, so that if the temperature inside the cell 23 rises, the internal pressure of the cell 23 also rises and the rigidity of the connecting means 22 increases, but in the case of a liquid, the volume change due to the temperature change is small. Even if the temperature inside the cell 23 rises, the internal pressure of the cell 23 does not rise so much. That is, it is possible to obtain the connecting means 22 in which the rigidity change due to the temperature difference is small.
【００２２】実験によれば、厚さ約０．１ｍｍのポリエ
チレンにより直径約１０ｍｍ、高さ約３ｍｍのセルを構
成し、その中に空気を封じ込め、研磨パッドとして直径
１０ｍｍのフェルト、研磨液としてダイヤモンドスラリ
ーを用い、回転軸の回転数を９００ｒｐｍ、回転軸の軸
荷重を１７０ｇ（回転軸の自重のみ）として平面状の被
加工物（材質は超硬合金）の研磨を行ったところ、次の
ような研磨結果を得ることができた。According to an experiment, a cell having a diameter of about 10 mm and a height of about 3 mm is made of polyethylene having a thickness of about 0.1 mm, air is enclosed in the cell, a felt having a diameter of 10 mm is used as a polishing pad, and a diamond is used as a polishing liquid. Using a slurry, the number of revolutions of the rotating shaft was 900 rpm, and the axial load of the rotating shaft was 170 g (only the own weight of the rotating shaft). It was possible to obtain excellent polishing results.
【００２３】まず被研磨物の表面粗さ（Ｒｙ）である
が、研磨前に４３０ｎｍであったものを研磨により７ｎ
ｍの鏡面に仕上げることができた。また形状うねり（Ｒ
ｖ）については、評価対象範囲を２０ｍｍとして測定し
たところ、Ｒｖ値は０．３μｍであった。研磨前と研磨
後の形状変化値も同程度であった。First, regarding the surface roughness (Ry) of the object to be polished, the surface roughness of 430 nm before polishing was changed to 7n by polishing.
I was able to finish the mirror surface of m. In addition, the shape swell (R
As for v), when the evaluation target range was 20 mm, the Rv value was 0.3 μm. The shape change values before and after polishing were about the same.
【００２４】また上記実験装置における研磨パッドの曲
面への追随性であるが、曲率半径５６ｍｍ、７５ｍｍ、
１２６ｍｍ、２３５ｍｍの４種類の凸レンズ（レンズ直
径はいずれも５０ｍｍ）を各１５ｍｍ四方ずつ研磨した
ところ、いずれの凸レンズにおいても表面粗さ（Ｒｙ）
６〜１４ｎｍの鏡面に仕上げることができた。Regarding the followability to the curved surface of the polishing pad in the above experimental apparatus, the radius of curvature is 56 mm, 75 mm,
When four types of convex lenses of 126 mm and 235 mm (lens diameters are 50 mm each) were polished by 15 mm squares, the surface roughness (Ry) of all convex lenses
It was possible to finish it to a mirror surface of 6 to 14 nm.
【００２５】上記実験装置のセルは６時間の使用に耐え
た。The cell of the above experimental apparatus survived 6 hours of use.
【００２６】図３に本発明研磨装置の第２実施形態を示
す。第１実施形態と共通の、ないしは同等の機能を有す
る構成要素には第１実施形態の説明で使用したのと同じ
符号を付し、説明は省略する。FIG. 3 shows a second embodiment of the polishing apparatus of the present invention. The same reference numerals as those used in the description of the first embodiment are given to the components having the same or equivalent functions as those of the first embodiment, and the description thereof will be omitted.
【００２７】第２実施形態では複数のセル２３ａを集合
させて連結手段２２ａを構成した。このように連結手段
２２ａを複数のセル２３ａの集合体としたことにより、
１個のセル２３ａが破裂したとしても研磨パッド２１は
他のセル２３ａにより定位置に保持され続けることにな
る。従って、研磨パッド２１がセルの残骸に付着した状
態で振り回され、被研磨面２に傷をつけるという危険が
低減される。In the second embodiment, a plurality of cells 23a are assembled to constitute the connecting means 22a. By thus forming the connecting means 22a into an assembly of a plurality of cells 23a,
Even if one cell 23a bursts, the polishing pad 21 will continue to be held in place by another cell 23a. Therefore, the risk that the polishing pad 21 is swung around while being attached to the remains of the cell and the surface to be polished 2 is scratched is reduced.
【００２８】また研磨パッド２１には金属等剛性の高い
材料からなる裏打ち板２５を装着した。これにより、研
磨パッド２１が平坦形状に維持され、精密な研磨が可能
になる。A backing plate 25 made of a highly rigid material such as metal is attached to the polishing pad 21. As a result, the polishing pad 21 is maintained in a flat shape, and precise polishing becomes possible.
【００２９】以上、本発明の各実施形態につき説明した
が、この他本発明の主旨を逸脱しない範囲で種々の変更
を加えて実施することができる。Although the respective embodiments of the present invention have been described above, various modifications can be made without departing from the scope of the present invention.
【００３０】[0030]
【発明の効果】本発明の研磨装置は次のような効果を奏
する。The polishing apparatus of the present invention has the following effects.
【００３１】本発明では、回転軸と研磨パッドとを可撓
性膜からなるセル中に流体を密封した構造の連結手段に
より連結したので、連結手段が変形することにより研磨
パッドは被研磨物の曲面に合わせて自律的に角度を変
え、三次元自由曲面の研磨が可能となる。また連結手段
には研磨液が浸透するような隙間がないので研磨液の構
成成分が堆積固化することがなく、長期にわたりスムー
ズな動きを得ることができる。しかもパスカルの原理に
より、研磨パッドの全面に均一な圧力が及ぼされること
になる。In the present invention, since the rotating shaft and the polishing pad are connected by the connecting means having a structure in which the fluid is sealed in the cell made of the flexible film, the polishing pad is deformed by the connecting means, so that the polishing pad is the object to be polished. The angle can be autonomously changed according to the curved surface to polish a three-dimensional free curved surface. In addition, since the connecting means has no gap through which the polishing liquid penetrates, the constituent components of the polishing liquid do not deposit and solidify, and smooth movement can be obtained for a long period of time. Moreover, the Pascal's principle applies a uniform pressure to the entire surface of the polishing pad.
【００３２】また本発明では、セル中に密封する流体を
気体としたから、連結手段の製作を容易化できる。Further, in the present invention, since the fluid to be sealed in the cell is gas, the production of the connecting means can be facilitated.
【００３３】また本発明では、セル中に密封する流体を
液体としたから、温度差による剛性変化の少ない連結手
段を得ることができる。Further, in the present invention, since the fluid to be sealed in the cell is a liquid, it is possible to obtain a connecting means with a small change in rigidity due to a temperature difference.
【００３４】また本発明では、セルが単一セルで構成さ
れることとしたから、連結手段を簡便に製作することが
できる。Further, in the present invention, since the cell is constituted by a single cell, the connecting means can be easily manufactured.
【００３５】また本発明では、セルが複数セルの集合体
で構成されることとしたから、１個のセルが破裂したと
しても研磨パッドは他のセルにより定位置に保持され続
けることになり、研磨パッドがセルの残骸に付着した状
態で振り回されて被研磨面に傷をつけるという危険を低
減することができる。Further, in the present invention, since the cells are composed of an aggregate of a plurality of cells, even if one cell ruptures, the polishing pad will continue to be held in place by another cell. It is possible to reduce the risk of the polishing pad being swung around while attached to the remains of the cell and scratching the surface to be polished.
【図１】 本発明研磨装置の第１実施形態を示す断面図FIG. 1 is a sectional view showing a first embodiment of a polishing apparatus of the present invention.
【図２】 図１と同様の断面図にして異なる状態を示す
もの2 is a sectional view similar to FIG. 1 showing a different state.
【図３】 本発明研磨装置の第２実施形態を示す断面図FIG. 3 is a sectional view showing a second embodiment of the polishing apparatus of the present invention.
１ 研磨装置 ２ 被研磨面 １０ 回転軸 ２０ 研磨工具 ２１ 研磨パッド ２２ 連結手段 ２３ セル ２４ 流体 ２２ａ 連結手段 ２３ａ セル ２５ 裏打ち板 1 Polishing device 2 Surface to be polished 10 rotation axis 20 polishing tools 21 polishing pad 22 Connection means 23 cells 24 fluid 22a connecting means 23a cell 25 backing plate
Claims (5)
を首振り自在に支持するとともに回転軸の回転を研磨パ
ッドに伝達するものであって、可撓性膜からなるセル中
に流体を密封した構造の連結手段。1. A polishing apparatus having the following structure: (a) rotating shaft (b) polishing pad (c) connecting the rotating shaft and the polishing pad, supporting the polishing pad swingably and rotating shaft Is a connection means for transmitting the rotation of the device to the polishing pad, and having a structure in which a fluid is sealed in a cell made of a flexible film.
請求項１記載の研磨装置。2. The polishing apparatus according to claim 1, wherein the fluid is gas.
請求項１記載の研磨装置。3. The polishing apparatus according to claim 1, wherein the fluid is a liquid.
する請求項１〜３のいずれかに記載の研磨装置。4. The polishing apparatus according to claim 1, wherein the cell is a single cell.
を特徴とする請求項１〜３のいずれかに記載の研磨装
置。5. The polishing apparatus according to claim 1, wherein the cells are an assembly of a plurality of cells.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001233066A JP2003039305A (en) | 2001-08-01 | 2001-08-01 | Polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001233066A JP2003039305A (en) | 2001-08-01 | 2001-08-01 | Polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003039305A true JP2003039305A (en) | 2003-02-13 |
Family
ID=19064886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001233066A Pending JP2003039305A (en) | 2001-08-01 | 2001-08-01 | Polishing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003039305A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009095923A (en) * | 2007-10-16 | 2009-05-07 | Sd Future Technology Co Ltd | Polishing device |
| JPWO2013001719A1 (en) * | 2011-06-29 | 2015-02-23 | 信越半導体株式会社 | Polishing head and polishing apparatus |
| JP2016043473A (en) * | 2014-08-26 | 2016-04-04 | 株式会社荏原製作所 | Buff processing module and processing apparatus |
| JP2017514307A (en) * | 2014-04-23 | 2017-06-01 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | System, method and apparatus for substrate cleaning after chemical mechanical planarization |
| WO2020158245A1 (en) * | 2019-02-01 | 2020-08-06 | 株式会社大気社 | Automated polishing system |
-
2001
- 2001-08-01 JP JP2001233066A patent/JP2003039305A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009095923A (en) * | 2007-10-16 | 2009-05-07 | Sd Future Technology Co Ltd | Polishing device |
| JPWO2013001719A1 (en) * | 2011-06-29 | 2015-02-23 | 信越半導体株式会社 | Polishing head and polishing apparatus |
| JP2017514307A (en) * | 2014-04-23 | 2017-06-01 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | System, method and apparatus for substrate cleaning after chemical mechanical planarization |
| JP2016043473A (en) * | 2014-08-26 | 2016-04-04 | 株式会社荏原製作所 | Buff processing module and processing apparatus |
| WO2020158245A1 (en) * | 2019-02-01 | 2020-08-06 | 株式会社大気社 | Automated polishing system |
| JP2020124755A (en) * | 2019-02-01 | 2020-08-20 | 株式会社大気社 | Automatic polishing system |
| CN111801195A (en) * | 2019-02-01 | 2020-10-20 | 株式会社大气社 | Automatic grinding system |
| US10926372B2 (en) | 2019-02-01 | 2021-02-23 | Taikisha Ltd. | Automatic polishing system |
| CN111801195B (en) * | 2019-02-01 | 2021-09-03 | 株式会社大气社 | Automatic grinding system |
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