JP2002507837A5 - - Google Patents
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- Publication number
- JP2002507837A5 JP2002507837A5 JP2000537255A JP2000537255A JP2002507837A5 JP 2002507837 A5 JP2002507837 A5 JP 2002507837A5 JP 2000537255 A JP2000537255 A JP 2000537255A JP 2000537255 A JP2000537255 A JP 2000537255A JP 2002507837 A5 JP2002507837 A5 JP 2002507837A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/040,651 | 1998-03-17 | ||
| US09/040,651 US5988485A (en) | 1998-03-17 | 1998-03-17 | Flux cleaning for flip chip technology using environmentally friendly solvents |
| PCT/US1999/005927 WO1999048142A1 (en) | 1998-03-17 | 1999-03-17 | Flux cleaning for flip chip technology using environmentally friendly solvents |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002507837A JP2002507837A (ja) | 2002-03-12 |
| JP2002507837A5 true JP2002507837A5 (ja) | 2006-03-30 |
Family
ID=21912175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000537255A Pending JP2002507837A (ja) | 1998-03-17 | 1999-03-17 | 環境にやさしい溶剤を用いた、フリップチップ技術のための融剤クリーニング |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5988485A (ja) |
| EP (1) | EP1064678A1 (ja) |
| JP (1) | JP2002507837A (ja) |
| KR (1) | KR100644420B1 (ja) |
| WO (1) | WO1999048142A1 (ja) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6475828B1 (en) * | 1999-11-10 | 2002-11-05 | Lsi Logic Corporation | Method of using both a non-filled flux underfill and a filled flux underfill to manufacture a flip-chip |
| US6234379B1 (en) * | 2000-02-28 | 2001-05-22 | Nordson Corporation | No-flow flux and underfill dispensing methods |
| JP2001332575A (ja) * | 2000-05-19 | 2001-11-30 | Sony Corp | フラックス洗浄方法及び半導体装置の製造方法 |
| US6333210B1 (en) | 2000-05-25 | 2001-12-25 | Advanced Micro Devices, Inc. | Process of ensuring detect free placement by solder coating on package pads |
| US6258612B1 (en) | 2000-06-28 | 2001-07-10 | Advanced Micro Devices, Inc. | Determination of flux prior to package assembly |
| US6597444B1 (en) | 2000-06-28 | 2003-07-22 | Advanced Micro Devices, Inc. | Determination of flux coverage |
| US6367679B1 (en) | 2000-06-28 | 2002-04-09 | Advanced Micro Devices, Inc. | Detection of flux residue |
| US6399902B1 (en) | 2000-08-01 | 2002-06-04 | Advanced Micro Devices, Inc. | Inline flux measurement system |
| US6433425B1 (en) * | 2000-09-12 | 2002-08-13 | International Business Machines Corporation | Electronic package interconnect structure comprising lead-free solders |
| US6578755B1 (en) * | 2000-09-22 | 2003-06-17 | Flip Chip Technologies, L.L.C. | Polymer collar for solder bumps |
| US6926190B2 (en) * | 2002-03-25 | 2005-08-09 | Micron Technology, Inc. | Integrated circuit assemblies and assembly methods |
| DE10303588B3 (de) * | 2003-01-29 | 2004-08-26 | Infineon Technologies Ag | Verfahren zur vertikalen Montage von Halbleiterbauelementen |
| US20050067468A1 (en) * | 2003-09-30 | 2005-03-31 | Daoqiang Lu | Fluxes for flip chip assembly using water soluble polymers |
| US7842948B2 (en) | 2004-02-27 | 2010-11-30 | Nvidia Corporation | Flip chip semiconductor die internal signal access system and method |
| US7666714B2 (en) * | 2006-12-29 | 2010-02-23 | Intel Corporation | Assembly of thin die coreless package |
| JP2021536131A (ja) | 2018-09-04 | 2021-12-23 | 中芯集成電路（寧波）有限公司 | ウェハレベルパッケージング方法およびパッケージング構造 |
| CN110875203B (zh) * | 2018-09-04 | 2021-11-09 | 中芯集成电路（宁波）有限公司 | 晶圆级封装方法以及封装结构 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3840098C1 (ja) * | 1988-11-28 | 1989-12-21 | Helmut Walter 8900 Augsburg De Leicht | |
| US5128057A (en) * | 1989-09-29 | 1992-07-07 | Kyzen Corporation | Furfuryl alcohol mixtures for use as cleaning agents |
| JPH0537136A (ja) * | 1991-08-02 | 1993-02-12 | Nec Corp | フラツクスの洗浄方法 |
| US5125560A (en) * | 1991-11-04 | 1992-06-30 | At&T Bell Laboratories | Method of soldering including removal of flux residue |
| US5288332A (en) * | 1993-02-05 | 1994-02-22 | Honeywell Inc. | A process for removing corrosive by-products from a circuit assembly |
| JP2795788B2 (ja) * | 1993-02-18 | 1998-09-10 | シャープ株式会社 | 半導体チップの実装方法 |
| US5668058A (en) * | 1995-12-28 | 1997-09-16 | Nec Corporation | Method of producing a flip chip |
-
1998
- 1998-03-17 US US09/040,651 patent/US5988485A/en not_active Expired - Lifetime
-
1999
- 1999-03-17 KR KR1020007010149A patent/KR100644420B1/ko not_active IP Right Cessation
- 1999-03-17 EP EP99912667A patent/EP1064678A1/en not_active Ceased
- 1999-03-17 WO PCT/US1999/005927 patent/WO1999048142A1/en active IP Right Grant
- 1999-03-17 JP JP2000537255A patent/JP2002507837A/ja active Pending