JP2002368373A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JP2002368373A JP2002368373A JP2001170382A JP2001170382A JP2002368373A JP 2002368373 A JP2002368373 A JP 2002368373A JP 2001170382 A JP2001170382 A JP 2001170382A JP 2001170382 A JP2001170382 A JP 2001170382A JP 2002368373 A JP2002368373 A JP 2002368373A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electrode pattern
- fixed
- flat
- spherical column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、積層型電子デバイ
スの構造に関し、特に球状の柱部材を介して、配線基板
上に表面実装型電子部品を固定した積層構造を有する電
子デバイスに関する。The present invention relates to a structure of a laminated electronic device, and more particularly to an electronic device having a laminated structure in which a surface-mounted electronic component is fixed on a wiring board via a spherical column member.
【０００２】[0002]
【従来の技術】近年、移動体通信機器、例えば携帯電話
機等に使用される電子デバイスは、小型、且つ、低背化
の要求が著しくなっている。このような要求に対して、
例えば、水晶発振器においては、水晶振動子の表面実装
化に加えて、回路の集積化、ＩＣ化等により部品点数を
削減することによって、小型、且つ、低背化を試みてい
る。2. Description of the Related Art In recent years, there has been a great demand for electronic devices used in mobile communication devices, for example, portable telephones, to be small in size and low in height. For such a request,
For example, in a crystal oscillator, an attempt is made to reduce the size and height of the crystal oscillator by reducing the number of components through circuit integration, IC integration, and the like in addition to the surface mounting of the crystal resonator.
【０００３】図５（ａ）は、従来の水晶発振器の一例を
示す断面図であり、（ｂ）は水晶発振器を分解した状態
を示す斜視構成図である。図５に示す水晶発振器１は、
プリント配線基板２上面の電極パターンに発振回路を構
成する複数の電子部品３を実装すると共に、プリント配
線基板２上面の四隅に設けた電極パターン４上に金属ボ
ール５を半田付けにより実装し、更に、前記プリント配
線基板２とほぼ等しい平面形状の水晶振動子６を前記電
子部品３の上面を覆い、且つ、前記金属ボール５を介し
て、水晶振動子６のパッケージ７の裏面に設けた表面実
装用端子電極８と前記四隅の電極パターン４とが導通す
るように半田付けにて固定したものである。FIG. 5A is a sectional view showing an example of a conventional crystal oscillator, and FIG. 5B is a perspective view showing a state where the crystal oscillator is disassembled. The crystal oscillator 1 shown in FIG.
A plurality of electronic components 3 constituting an oscillation circuit are mounted on the electrode patterns on the upper surface of the printed wiring board 2, and metal balls 5 are mounted on the electrode patterns 4 provided at the four corners of the upper surface of the printed wiring board 2 by soldering. A surface mounting device in which a crystal resonator 6 having a planar shape substantially equal to that of the printed wiring board 2 covers the upper surface of the electronic component 3 and is provided on the back surface of the package 7 of the crystal resonator 6 via the metal ball 5. Are fixed by soldering so that the terminal electrodes 8 for use and the electrode patterns 4 at the four corners are conducted.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、図５に
示すような水晶発振器１において、プリント配線基板２
上面四隅に設けた電極パターン４と水晶振動子６のパッ
ケージ７裏面の端子電極８とを、金属ボール５を介して
半田付けした場合、前記電極パターン４と前記金属ボー
ル５との間に半田が介在し、電極パターン４と金属ボー
ル５とが構造的に非接触となることにより、プリント配
線基板２上面から垂直方向に向かって金属ボール５の頂
点までの高さｈ１が各々四隅で相異なり、水晶振動子６
の端子電極８と金属ボール５との間が非接触となる箇所
が生じ、その結果、導通不良を引き起こす問題があっ
た。However, in the crystal oscillator 1 as shown in FIG.
When the electrode patterns 4 provided at the four corners of the upper surface and the terminal electrodes 8 on the back surface of the package 7 of the crystal unit 6 are soldered via the metal balls 5, the solder is formed between the electrode patterns 4 and the metal balls 5. Since the electrode pattern 4 and the metal ball 5 are not in structural contact with each other, the heights h1 from the upper surface of the printed wiring board 2 to the apex of the metal ball 5 in the vertical direction are different from each other at the four corners, Crystal oscillator 6
There is a place where the terminal electrode 8 and the metal ball 5 are not in contact with each other, and as a result, there is a problem that a conduction failure occurs.
【０００５】本発明は上述の如き従来の問題を解決する
ためになされたものであって、金属ボール等の球状の柱
部材をプリント配線基板上面の電極パターンに半田付け
により実装するにあたり、前記プリント配線基板上面か
ら垂直方向に向かって前記柱部材の頂点までの高さにお
いて、前記柱部材と前記電極パターンとの間に半田が介
在することによって生ずる各々の箇所で高さが異なると
いう不具合を解決し全て等しくすることよって、表面実
装型電子部品底面の各々の端子電極と対向する前記柱部
材との間を全て機械的に接触することを可能とすること
により導通不良を皆無にせしめる構造を有する電子デバ
イスを提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. In mounting a spherical column member such as a metal ball on an electrode pattern on the upper surface of a printed wiring board by soldering, Solves the problem that the height from the upper surface of the wiring board to the vertex of the pillar member in the vertical direction is different at each location caused by the interposition of solder between the pillar member and the electrode pattern. By making all of them equal, it is possible to make all the mechanical contact between each of the terminal electrodes on the bottom surface of the surface-mounted electronic component and the column member opposed thereto, thereby having a structure that eliminates poor conduction. An object is to provide an electronic device.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に本発明に係る電子デバイスの請求項１記載の発明は、
配線基板上面に配置した金属性の複数の球状の柱部材を
介して、前記配線基板上に所定のギャップを隔てて表面
実装型電子部品を固定した電子デバイスの構造におい
て、前記配線基板上面に設けた電極パターン、及び、表
面実装型電子部品の下面に設けた電極パターンの少なく
ともいずれか一方に前記球状の柱部材を位置決めせしめ
る凹部を形成し、前記電極パターンと前記球状の柱部材
を機械的、且つ、電気的に接触固定したことを特徴とし
ている。According to a first aspect of the present invention, an electronic device according to the present invention is provided.
In a structure of an electronic device in which surface-mounted electronic components are fixed on the wiring board with a predetermined gap therebetween through a plurality of metallic spherical column members disposed on the wiring board, A concave portion for positioning the spherical column member is formed in at least one of the electrode pattern and the electrode pattern provided on the lower surface of the surface mount electronic component, and the electrode pattern and the spherical column member are mechanically formed. In addition, it is characterized by being electrically fixed by contact.
【０００７】請求項２記載の発明は、平板状の配線基板
上面に配置した金属性の複数の球状の柱部材を介して、
前記平板状の配線基板上に所定のギャップを隔てて表面
実装型圧電共振子を固定した圧電発振器において、前記
平板上の配線基板上面に設けた電極パターン、及び、表
面実装型圧電共振子の下面に設けた電極パターンの少な
くともいずれか一方に前記球状の柱部材を位置決めせし
める平面形状が円形である凹部を形成し、前記平板状の
配線基板上面に発振回路を構成する複数の電子部品を搭
載すると共に底面に外部電極を備えた前記平板状の配線
基板と、該平板状の配線基板上面に固定した球状の柱部
材を介して所定のギャップを隔てて、機械的、且つ、電
気的に固定された圧電共振子とを備えた構造を有する圧
電発振器であることを特徴としている。According to a second aspect of the present invention, a plurality of metallic spherical column members disposed on the upper surface of a flat wiring board are provided.
An electrode pattern provided on an upper surface of a wiring board on the flat plate, and a lower surface of the piezoelectric resonator, the piezoelectric oscillator having a surface mounted piezoelectric resonator fixed on the flat wiring substrate with a predetermined gap therebetween. A concave portion having a circular planar shape for positioning the spherical column member is formed in at least one of the electrode patterns provided on the wiring board, and a plurality of electronic components constituting an oscillation circuit are mounted on the upper surface of the flat wiring board. Along with the flat wiring board having external electrodes on the bottom surface, and a predetermined gap via a spherical column member fixed to the top surface of the flat wiring board, mechanically and electrically fixed. And a piezoelectric oscillator having a structure including a piezoelectric resonator.
【０００８】請求項３記載の発明は、平板状の配線基板
上面に配置した金属性の複数の球状の柱部材を介して、
前記平板状の配線基板上に所定のギャップを隔てて表面
実装型圧電共振子を固定した圧電発振器において、前記
平板上の配線基板上面に設けた電極パターン、及び、表
面実装型圧電共振子の下面に設けた電極パターンの少な
くともいずれか一方に前記球状の柱部材を位置決めせし
める平面形状が多角形である凹部を形成し、前記平板状
の配線基板上面に発振回路を構成する複数の電子部品を
搭載すると共に底面に外部電極を備えた前記平板状の配
線基板と、該平板状の配線基板上面に固定した球状の柱
部材を介して所定のギャップを隔てて、機械的、且つ、
電気的に固定された圧電共振子とを備えた構造を有する
圧電発振器であることを特徴としている。[0010] According to a third aspect of the present invention, a plurality of metallic spherical column members arranged on the upper surface of a flat wiring board are provided.
An electrode pattern provided on an upper surface of a wiring board on the flat plate, and a lower surface of the piezoelectric resonator, the piezoelectric oscillator having a surface mounted piezoelectric resonator fixed on the flat wiring board with a predetermined gap therebetween. A concave portion having a polygonal planar shape for positioning the spherical column member is formed in at least one of the electrode patterns provided on the substrate, and a plurality of electronic components constituting an oscillation circuit are mounted on the upper surface of the flat wiring substrate. And the flat wiring board provided with external electrodes on the bottom surface, and a predetermined gap via a spherical column member fixed to the top surface of the flat wiring board, mechanically, and,
The piezoelectric oscillator has a structure including an electrically fixed piezoelectric resonator.
【０００９】請求項４記載の発明は、配線基板上面に配
置した金属性の複数の球状の柱部材を介して、前記配線
基板上に所定のギャップを隔てて表面実装型電子部品を
固定した電子デバイスの構造において、前記配線基板上
面に設けた電極パターン、及び、表面実装型電子部品の
下面に設けた電極パターンの少なくともいずれか一方に
前記球状の柱部材を位置決めせしめる凸部を形成し、前
記電極パターンと前記球状の柱部材を機械的、且つ、電
気的に接触固定したことを特徴としている。According to a fourth aspect of the present invention, there is provided an electronic device in which a surface-mounted electronic component is fixed on the wiring board with a predetermined gap therebetween via a plurality of metallic spherical column members disposed on the upper surface of the wiring board. In the structure of the device, an electrode pattern provided on the upper surface of the wiring board, and at least one of the electrode patterns provided on the lower surface of the surface-mounted electronic component, a convex portion for positioning the spherical column member is formed, An electrode pattern and the spherical column member are mechanically and electrically contacted and fixed.
【００１０】請求項５記載の発明は、平板状の配線基板
上面に配置した金属性の複数の球状の柱部材を介して、
前記平板状の配線基板上に所定のギャップを隔てて表面
実装型圧電共振子を固定した圧電発振器において、前記
平板状の配線基板上面に設けた電極パターン、及び、表
面実装型圧電共振子の下面に設けた電極パターンの少な
くともいずれか一方に前記球状の柱部材を位置決めせし
める凸部を形成し、前記平板状の配線基板上面に発振回
路を構成する複数の電子部品を搭載すると共に底面に外
部電極を備えた前記平板状の配線基板と、該平板状の配
線基板上面に固定した球状の柱部材を介して所定のギャ
ップを隔てて、機械的、且つ、電気的に固定された圧電
共振子とを備えた構造を有する圧電発振器であることを
特徴としている。According to a fifth aspect of the present invention, a plurality of metallic spherical column members arranged on the upper surface of a flat wiring board are provided.
In a piezoelectric oscillator in which a surface-mount type piezoelectric resonator is fixed on the flat-type wiring substrate with a predetermined gap therebetween, an electrode pattern provided on an upper surface of the flat-type wiring substrate, and a lower surface of the surface-mount type piezoelectric resonator A convex portion for positioning the spherical column member is formed on at least one of the electrode patterns provided on the substrate, and a plurality of electronic components constituting an oscillation circuit are mounted on the upper surface of the flat wiring board, and an external electrode is formed on the bottom surface. And a piezoelectric resonator mechanically and electrically fixed at a predetermined gap via a spherical column member fixed to the upper surface of the flat wiring substrate, and A piezoelectric oscillator having a structure provided with:
【００１１】[0011]
【発明の実施の形態】以下、図示した実施の形態例に基
づいて本発明を詳細に説明する。図１は、本発明に係る
水晶発振器の一実施形態であって、図１（ａ）はその断
面図、図１（ｂ）は発振器を分解した状態を示す斜視構
成図、図１（ｃ）は金属ボールを実装した電極パターン
の断面図を示す。プリント基板２上の四隅に配置した電
極パターン９には、円形の凹部１０が設けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on illustrated embodiments. FIG. 1 shows an embodiment of a crystal oscillator according to the present invention. FIG. 1 (a) is a cross-sectional view thereof, FIG. 1 (b) is a perspective view showing an exploded state of the oscillator, and FIG. 1 (c). Shows a cross-sectional view of an electrode pattern on which metal balls are mounted. The electrode patterns 9 arranged at the four corners on the printed circuit board 2 are provided with circular concave portions 10.
【００１２】リフロー方式によりクリーム半田を用い
て、プリント基板２上に発振回路を構成する複数の電子
部品３の実装、及び前記プリント基板２とほぼ等しい平
面形状の水晶振動子６を前記電子部品３の上面を覆い、
且つ、金属ボール５を介して実装し、水晶発振器１を組
み立てる一例を以下に説明する。A plurality of electronic components 3 constituting an oscillation circuit are mounted on a printed circuit board 2 by using cream solder by a reflow method, and a crystal resonator 6 having a plane shape substantially equal to that of the printed circuit board 2 is attached to the electronic component 3. Cover the top of
An example in which the crystal oscillator 1 is mounted via the metal balls 5 to assemble the crystal oscillator 1 will be described below.
【００１３】先ず、前記プリント基板２上の前記電子部
品３の実装部の電極パターンと前記四隅の電極パターン
９上にスクリーン印刷によって一括してクリーム半田を
塗布し、前記電子部品３及び金属ボール５を搭載する。
前記プリント基板２をリフロー炉内で所定温度にて加熱
した後、冷却することにより、前記電子部品３及び金属
ボール５はクリーム半田を介して固着し実装が完了す
る。First, cream solder is applied on the electrode pattern of the mounting portion of the electronic component 3 on the printed circuit board 2 and the electrode patterns 9 at the four corners at a time by screen printing, and the electronic component 3 and the metal balls 5 are applied. With.
After the printed circuit board 2 is heated at a predetermined temperature in a reflow furnace and then cooled, the electronic components 3 and the metal balls 5 are fixed via cream solder to complete the mounting.
【００１４】ここで、前記金属ボール５が前記電極パタ
ーン９上でクリーム半田を介して固着し実装が完了する
過程について以下説明する。凹部１０を含む電極パター
ン９上に塗布したクリーム半田は、リフロー炉内で溶融
し半田の界面張力の性質によって、凹部１０を除いた電
極パターン９のメタライズ部に集中するので、図１
（ｃ）の如く金属ボール５は、ある一定量ｇだけ凹部１
０に沈み、前記プリント基板２上面から垂直方向に向か
って金属ボール５の頂点Ｐまでの高さｈ２は各々同じ高
さとなり実装が完了する。Here, the process in which the metal balls 5 are fixed on the electrode patterns 9 via cream solder and the mounting is completed will be described below. The cream solder applied on the electrode pattern 9 including the concave portion 10 melts in the reflow furnace and concentrates on the metallized portion of the electrode pattern 9 excluding the concave portion 10 due to the interfacial tension property of the solder.
As shown in FIG. 3 (c), the metal ball 5 has a recess 1 by a certain amount g.
The height h2 from the upper surface of the printed circuit board 2 to the vertex P of the metal ball 5 in the vertical direction is the same, and the mounting is completed.
【００１５】次に、水晶振動子６のパッケージ７の底部
に配置した端子電極８を金属ボール５の頂点Ｐを介して
前記プリント基板２上にリフロー方式により実装する。
このとき、前記プリント基板２上面から水晶振動子６の
底面までの高さｈ３は、前記金属ボール５が配置されて
いる四隅共々等しくなり、導通不良を来たすことなく前
記水晶振動子６を前記プリント基板２上へ確実に実装す
ることができる。Next, the terminal electrodes 8 arranged on the bottom of the package 7 of the crystal unit 6 are mounted on the printed circuit board 2 via the vertexes P of the metal balls 5 by a reflow method.
At this time, the height h3 from the top surface of the printed circuit board 2 to the bottom surface of the crystal unit 6 is equal at all four corners where the metal balls 5 are arranged, and the crystal unit 6 is printed without causing conduction failure. It can be reliably mounted on the substrate 2.
【００１６】尚、上述においては、リフローを２回行っ
ているが生産効率を上げるために、プリント基板２上に
電子部品３、金属ボール５、及び、水晶振動子６を全て
搭載してからリフロー炉に通して一度に実装を完了させ
てもよい。In the above description, the reflow is performed twice, but in order to increase the production efficiency, the electronic components 3, the metal balls 5, and the quartz oscillator 6 are all mounted on the printed circuit board 2 and then reflowed. The mounting may be completed at once by passing through a furnace.
【００１７】更に、本発明の第２の実施形態として、図
２に示す如く水晶振動子１２のパッケージ１３の底面に
配置した端子電極１４にも円形の凹部１５を設けること
により実装性を高めて上述の如く水晶発振器１６を組み
立てることも可能となる。Further, as a second embodiment of the present invention, as shown in FIG. 2, a circular concave portion 15 is also provided on a terminal electrode 14 disposed on the bottom surface of a package 13 of a crystal unit 12 to improve mountability. The crystal oscillator 16 can be assembled as described above.
【００１８】更にまた、上述で用いたプリント基板の四
隅に設けた金属ボール固定用電極パターンにおいて、前
記電極パターンの膜厚が薄膜のために金属ボールが前記
電極パターンの凹部１５に沈む量には制限がある。Further, in the metal ball fixing electrode patterns provided at the four corners of the printed circuit board used above, the thickness of the electrode pattern is so thin that the amount of metal balls sinking into the concave portion 15 of the electrode pattern is as follows. There is a limit.
【００１９】そこで、本発明の第３の実施形態では、図
３（ａ）に示す如くプリント基板１７を積層型の多層プ
リント基板とすることによって、前記プリント基板１７
の最上層に図３（ｃ）に示す如く金属ボール５を固定す
る電極パターン１８の下部のプリント板にも凹部１９を
設けることで、前記金属ボール５をより深く沈め、且
つ、固定することができるので前記プリント基板１７の
上面から水晶振動子１２の底面までの高さｈ４につい
て、各々等しくすることをさらに容易に実現することを
可能としている。従って、プリント基板１７と水晶振動
子１２との構造的な接続性をより一層向上させることが
できる。Therefore, in a third embodiment of the present invention, as shown in FIG. 3A, the printed circuit board 17 is formed as a multilayer type printed circuit board.
As shown in FIG. 3 (c), the concave portion 19 is also provided on the printed board below the electrode pattern 18 for fixing the metal ball 5 on the uppermost layer, so that the metal ball 5 can be sunk deeper and fixed. Since the height h4 from the upper surface of the printed circuit board 17 to the bottom surface of the crystal unit 12 can be equalized, it is possible to more easily realize the same. Therefore, the structural connectivity between the printed board 17 and the crystal unit 12 can be further improved.
【００２０】尚、上述の金属ボールを固定する電極パタ
ーンに設けた凹部は、円形を用いて説明したが、凹部は
円形に限定されず多角形も適用できることは説明するま
でもない。Although the concave portion provided in the electrode pattern for fixing the above-mentioned metal ball has been described using a circular shape, it is needless to say that the concave portion is not limited to a circular shape but may be a polygon.
【００２１】次に、本発明の第４の実施形態について図
４を用いて以下に説明する。前述の第１乃至第３の実施
形態において、金属ボールを固定する電極パターンに凹
部を設けていたが、この実施形態では図４（ａ）の如く
電極パターン２０上に４個の突起上の凸部２１を形成し
ている。図４（ｂ）は、突起が形成された電極パターン
２０部の斜視概観図であり、図４（ｃ）は、前記電極パ
ターン２０上に金属ボール５を搭載したときの斜視概観
図を示している。Next, a fourth embodiment of the present invention will be described below with reference to FIG. In the above-described first to third embodiments, the concave portion is provided in the electrode pattern for fixing the metal ball. However, in this embodiment, as shown in FIG. The part 21 is formed. FIG. 4B is a schematic perspective view of a portion of the electrode pattern 20 on which the protrusions are formed, and FIG. 4C is a schematic perspective view of the metal pattern 5 mounted on the electrode pattern 20. I have.
【００２２】ここで、図４（ｄ）の断面図に示す如く凸
部２１は、金属ボール５を搭載したときに、前記電極パ
ターン２０と前記金属ボール５との間隙の最短高さｈ５
ができるように該電極パターン２０上に形成している。
従って、図４（ｅ）の断面図に示す如く半田付け実装に
より、金属ボール５と電極パターン２０との間に半田２
１が介在しても、これを考慮に入れた前述の間隙ｈ５が
あるため、前述の第１乃至第３の実施形態で説明したよ
うなリフローにより水晶発振器を組み立てを行ってもプ
リント基板３２上面から水晶振動子の底面までの高さ
が、該プリント基板３２の四隅共に等しくできるため該
水晶振動子のパッケージ底面の端子電極と金属ボール間
での接触不良による導通不良は生じることはない。Here, as shown in the sectional view of FIG. 4D, when the metal ball 5 is mounted, the convex portion 21 has the shortest height h5 of the gap between the electrode pattern 20 and the metal ball 5.
It is formed on the electrode pattern 20 so as to be formed.
Therefore, as shown in the sectional view of FIG.
Even when the crystal oscillator 1 is interposed, there is the above-mentioned gap h5 taking this into account, so that even if the crystal oscillator is assembled by reflow as described in the above-described first to third embodiments, Since the height from the top to the bottom of the crystal unit can be made equal at all four corners of the printed circuit board 32, there is no occurrence of poor conduction due to poor contact between the terminal electrodes on the package bottom surface of the crystal unit and the metal balls.
【００２３】尚、上述の説明において、凸部の突起の数
は、電極パターン１個に対して４個を用いたが、これに
限定されるものではなく金属ボールを支持できる数を適
宜設定すればよい。In the above description, the number of protrusions of the projections is four for each electrode pattern. However, the number of protrusions is not limited to this. I just need.
【００２４】更に、前述した本発明の第２の実施形態と
同様に、水晶振動子のパッケージの底面に配置した端子
電極にも凸部を設けることにより実装性を高めて上述の
如く水晶発振器を組み立てることも可能であることは説
明するまでもない。Further, similarly to the above-described second embodiment of the present invention, the terminal is arranged on the bottom surface of the package of the crystal unit, and the protruding portion is also provided to improve the mountability so that the crystal oscillator can be manufactured as described above. Needless to say, it is possible to assemble.
【００２５】[0025]
【発明の効果】本発明は以上説明した如く構成するの
で、請求項１記載の発明によれば、球状の柱部材を、間
に半田の介在を排除して、プリント配線基板上に設けた
電極パターンに形成した凹部に固定することができるの
で、前記電極パターンと前記柱部材を機械的、且つ、電
気的に接触固定できるという優れた効果を奏する。Since the present invention is constructed as described above, according to the first aspect of the present invention, an electrode in which a spherical column member is provided on a printed wiring board without the intervention of solder therebetween. Since it can be fixed to the concave portion formed in the pattern, there is an excellent effect that the electrode pattern and the column member can be mechanically and electrically contacted and fixed.
【００２６】請求項２記載の発明によれば、球状の柱部
材を、間に半田の介在を排除して、プリント配線基板上
に設けた電極パターンに形成した平面形状が円形である
凹部に固定することができるので、前記電極パターンと
前記柱部材を機械的、且つ、電気的に接触固定すること
ができ、前記配線基板上面から垂直方向に柱部材の頂点
の高さが各々等しくなるので、圧電共振子を該配線基板
上面に固定した前記柱部材を介して所定のギャップを隔
てて、機械的、且つ、電気的に固定することができるこ
とによって、導通不良のない圧電発振器を提供できると
いう優れた効果を奏する。According to the second aspect of the present invention, the spherical column member is fixed to the concave portion having a circular planar shape formed on the electrode pattern provided on the printed wiring board without interposing solder therebetween. Since the electrode pattern and the pillar member can be mechanically and electrically contacted and fixed, and the heights of the vertices of the pillar members in the vertical direction from the upper surface of the wiring board become equal, Since the piezoelectric resonator can be mechanically and electrically fixed at a predetermined gap via the column member fixed to the upper surface of the wiring substrate, a piezoelectric oscillator free from poor conduction can be provided. It has the effect.
【００２７】請求項３記載の発明によれば、球状の柱部
材を、間に半田の介在を排除して、プリント配線基板上
に設けた電極パターンに形成した平面形状が多角形であ
る凹部に固定することができるので、前記電極パターン
と前記柱部材を機械的、且つ、電気的に接触固定するこ
とができ、前記配線基板上面から垂直方向に柱部材の頂
点の高さが各々等しくなるので、圧電共振子を該配線基
板上面に固定した前記柱部材を介して所定のギャップを
隔てて、機械的、且つ、電気的に固定することができる
ことによって、導通不良のない圧電発振器を提供できる
という優れた効果を奏する。According to the third aspect of the present invention, a spherical column member is formed in a concave portion having a polygonal planar shape formed on an electrode pattern provided on a printed wiring board by eliminating solder intervening therebetween. Since the fixing can be performed, the electrode pattern and the column member can be mechanically and electrically fixed in contact with each other, and the heights of the vertices of the column members in the vertical direction from the upper surface of the wiring board become equal to each other. The piezoelectric resonator can be mechanically and electrically fixed with a predetermined gap therebetween via the column member that fixes the piezoelectric resonator to the upper surface of the wiring board, thereby providing a piezoelectric oscillator having no conduction failure. It has excellent effects.
【００２８】更に、上述の請求項１乃至３記載の本発明
において、圧電共振子のパッケージの底面に配置した端
子電極にも凹部を設けることにより、極めて実装性が高
く、且つ、導通不良のない水晶発振器を提供できるとい
う優れた効果を奏する。Further, according to the present invention, the terminal electrodes arranged on the bottom surface of the package of the piezoelectric resonator are also provided with a concave portion, so that the mountability is extremely high and there is no conduction failure. It has an excellent effect that a crystal oscillator can be provided.
【００２９】更に、上述の請求項１乃至３記載の本発明
において、プリント基板を積層型の多層プリント基板と
することにより、球状の柱部材を固定する電極パターン
の凹部下のプリント基板の最上層にも凹部を設けること
によって、前記柱部材を前記凹部により深く沈め、且
つ、固定することができるので前記プリント基板の上面
から圧電共振子の底面までの高さについて、各々等しく
することをさらに容易に実現することを可能とすること
ができるので、前記プリント基板と圧電共振子との構造
的な接続性は、より一層向上するという優れた効果を奏
する。Further, according to the present invention as set forth in claims 1 to 3, the printed circuit board is a laminated multilayer printed circuit board, so that the uppermost layer of the printed circuit board below the concave portion of the electrode pattern for fixing the spherical column member. By providing the concave portion also, the column member can be sunk deeper into the concave portion and fixed, so that the heights from the upper surface of the printed circuit board to the lower surface of the piezoelectric resonator can be more easily equalized. Therefore, there is an excellent effect that the structural connectivity between the printed circuit board and the piezoelectric resonator is further improved.
【００３０】請求項４記載の発明によれば、球状の柱部
材を、間に半田を介在することを排除して、プリント配
線基板上に設けた電極パターンに形成した凸部に固定す
ることができるので、前記電極パターンの凸部と前記柱
部材を機械的、且つ、電気的に接触固定するができると
いう優れた効果を奏する。According to the fourth aspect of the present invention, the spherical column member can be fixed to the convex portion formed on the electrode pattern provided on the printed wiring board by eliminating the interposition of solder therebetween. Therefore, there is an excellent effect that the convex portion of the electrode pattern and the column member can be mechanically and electrically contacted and fixed.
【００３１】請求項５記載の発明によれば、球状の柱部
材を、間に半田の介在を排除して、プリント配線基板上
に設けた電極パターンに形成した凸部に固定することが
できるので、前記電極パターンの凸部と前記柱部材を機
械的、且つ、電気的に接触固定することができ、前記配
線基板上面から垂直方向に柱部材の頂点の高さが各々等
しくなるので、圧電共振子を該配線基板上面に固定した
前記柱部材を介して所定のギャップを隔てて、機械的、
且つ、電気的に固定することができることによって、導
通不良のない圧電発振器を提供できるという優れた効果
を奏する。According to the fifth aspect of the present invention, the spherical column member can be fixed to the projection formed on the electrode pattern provided on the printed wiring board without the intervention of solder therebetween. The protrusions of the electrode pattern and the column member can be mechanically and electrically contacted and fixed, and the heights of the vertices of the column members in the vertical direction from the upper surface of the wiring board are equal to each other. A predetermined gap via the column member fixed to the upper surface of the wiring board,
In addition, since the piezoelectric oscillator can be electrically fixed, there is an excellent effect that a piezoelectric oscillator having no conduction failure can be provided.
【００３２】更に、上述の請求項４乃至５記載の本発明
において、圧電共振子のパッケージの底面に配置した端
子電極にも凸部を設けることにより、極めて実装性が高
く、且つ、導通不良のない水晶発振器を提供できるとい
う優れた効果を奏する。Further, according to the present invention as set forth in claims 4 and 5, by providing the terminal electrodes disposed on the bottom surface of the package of the piezoelectric resonator with projections, the mountability is extremely high and the connection failure is improved. It has an excellent effect that it can provide a crystal oscillator without any.
【図１】（ａ）は本発明に係る電子デバイスの第１実施
形態を説明するための断面図であって、（ｂ）はその電
子デバイスを分解した斜視概観図、（ｃ）は金属ボール
を搭載した電極パターンを示す断面図である。1A is a cross-sectional view for explaining a first embodiment of an electronic device according to the present invention, FIG. 1B is an exploded perspective view of the electronic device, and FIG. FIG. 4 is a cross-sectional view showing an electrode pattern on which is mounted.
【図２】（ａ）は本発明に係る電子デバイスの第２実施
形態を説明するための断面図であって、（ｂ）はその電
子デバイスを分解した斜視概観図である。FIG. 2A is a cross-sectional view for explaining a second embodiment of the electronic device according to the present invention, and FIG. 2B is an exploded perspective view of the electronic device.
【図３】（ａ）は本発明に係る電子デバイスの第３実施
形態を説明するための断面図であって、（ｂ）はその電
子デバイスを分解した斜視概観図、（ｃ）は電極パター
ンの凹部を示す断面図である。3A is a cross-sectional view for explaining a third embodiment of the electronic device according to the present invention, FIG. 3B is an exploded perspective view of the electronic device, and FIG. 3C is an electrode pattern. It is sectional drawing which shows the recessed part.
【図４】本発明に係る電子デバイスの第４実施形態を説
明するための図であって、（ａ）はプリント基板を示す
平面図、（ｂ）は電極パターン上の突起を説明するため
の斜視概観図、（ｃ）は電極パターン上に金属ボールを
搭載した状態を示す斜視概観図、（ｄ）は電極パターン
上に金属ボールを搭載した状態を示す断面図、（ｅ）は
電極パターン上に金属ボールを半田付け実装した状態を
示す断面図である。4A and 4B are views for explaining a fourth embodiment of the electronic device according to the present invention, wherein FIG. 4A is a plan view showing a printed circuit board, and FIG. 4B is a view for explaining protrusions on an electrode pattern. (C) is a perspective view showing a state where a metal ball is mounted on the electrode pattern, (d) is a sectional view showing a state where a metal ball is mounted on the electrode pattern, and (e) is a view showing the state where the metal ball is mounted on the electrode pattern. FIG. 4 is a cross-sectional view showing a state where metal balls are mounted by soldering.
【図５】従来の電子デバイスを説明するための図であっ
て、（ａ）は従来の電子デバイスを示す断面図、（ｂ）
はその電子デバイスを分解した斜視概観図である。5A and 5B are views for explaining a conventional electronic device, wherein FIG. 5A is a cross-sectional view showing the conventional electronic device, and FIG.
FIG. 2 is an exploded perspective view of the electronic device.
１ 電子デバイス（水晶発振器） ２ プリント基板 ３ 電子部品 ４ 電極パターン ５ 柱部材（金属ボール） ６ 水晶振動子 ７ パッケージ ８ 電極パターン ９ 電極パターン １０ 凹部 １１ 電子デバイス（水晶発振器） １２ 水晶振動子 １３ パッケージ １４ 電極パターン １５ 凹部 １６ 電子デバイス（水晶発振器） １７ 多層プリント基板 １８ 電極パターン １９ 凹部 ２０ 電極パターン ２１ 凸部 DESCRIPTION OF SYMBOLS 1 Electronic device (crystal oscillator) 2 Printed circuit board 3 Electronic component 4 Electrode pattern 5 Column member (metal ball) 6 Crystal oscillator 7 Package 8 Electrode pattern 9 Electrode pattern 10 Depression 11 Electronic device (crystal oscillator) 12 Crystal oscillator 13 Package 14 Electrode Pattern 15 Depression 16 Electronic Device (Crystal Oscillator) 17 Multilayer Printed Circuit Board 18 Electrode Pattern 19 Depression 20 Electrode Pattern 21 Convex
Claims (5)
球状の柱部材を介して、前記配線基板上に所定のギャッ
プを隔てて表面実装型電子部品を固定した電子デバイス
の構造において、前記配線基板上面に設けた電極パター
ン、及び、表面実装型電子部品の下面に設けた電極パタ
ーンの少なくともいずれか一方に前記球状の柱部材を位
置決めせしめる凹部を形成し、前記電極パターンと前記
球状の柱部材を機械的、且つ、電気的に接触固定したこ
とを特徴とする電子デバイス。1. A structure of an electronic device in which a surface-mounted electronic component is fixed on a wiring board with a predetermined gap therebetween via a plurality of metallic spherical column members disposed on an upper surface of the wiring board. A concave portion for positioning the spherical column member is formed in at least one of the electrode pattern provided on the upper surface of the wiring board and the electrode pattern provided on the lower surface of the surface mount electronic component, and the electrode pattern and the spherical column are formed. An electronic device, wherein a member is mechanically and electrically fixed by contact.
の複数の球状の柱部材を介して、前記平板状の配線基板
上に所定のギャップを隔てて表面実装型圧電共振子を固
定した圧電発振器において、前記平板状の配線基板上面
に設けた電極パターン、及び、表面実装型圧電共振子の
下面に設けた電極パターンの少なくともいずれか一方に
前記球状の柱部材を位置決めせしめる平面形状が円形で
ある凹部を形成し、前記平板状の配線基板上面に発振回
路を構成する複数の電子部品を搭載すると共に底面に外
部電極を備えた前記平板状の配線基板と、該平板状の配
線基板上面に固定した球状の柱部材を介して所定のギャ
ップを隔てて、機械的、且つ、電気的に固定された圧電
共振子とを備えた構造を有していることを特徴とする圧
電発振器。2. A surface-mounted piezoelectric resonator is fixed on the flat wiring board with a predetermined gap therebetween via a plurality of metallic spherical column members arranged on the upper surface of the flat wiring board. In the piezoelectric oscillator, a plane shape for positioning the spherical column member on at least one of the electrode pattern provided on the upper surface of the flat wiring substrate and the electrode pattern provided on the lower surface of the surface mount type piezoelectric resonator is circular. Forming a concave portion, mounting a plurality of electronic components constituting an oscillation circuit on the upper surface of the flat wiring board, and providing external electrodes on the bottom surface, and the upper surface of the flat wiring substrate. And a piezoelectric resonator mechanically and electrically fixed at a predetermined gap via a spherical column member fixed to the piezoelectric resonator.
の複数の球状の柱部材を介して、前記平板状の配線基板
上に所定のギャップを隔てて表面実装型圧電共振子を固
定した圧電発振器において、前記平板状の配線基板上面
に設けた電極パターン、及び、表面実装型圧電共振子の
下面に設けた電極パターンの少なくともいずれか一方に
前記球状の柱部材を位置決めせしめる平面形状が多角形
である凹部を形成し、前記平板状の配線基板上面に発振
回路を構成する複数の電子部品を搭載すると共に底面に
外部電極を備えた前記平板状の配線基板と、該平板状の
配線基板上面に固定した球状の柱部材を介して所定のギ
ャップを隔てて、機械的、且つ、電気的に固定された圧
電共振子とを備えた構造を有していることを特徴とする
圧電発振器。3. A surface-mount type piezoelectric resonator is fixed on the flat wiring substrate with a predetermined gap therebetween via a plurality of metallic spherical column members arranged on the upper surface of the flat wiring substrate. In a piezoelectric oscillator, the planar shape in which the spherical column member is positioned on at least one of the electrode pattern provided on the upper surface of the flat wiring substrate and the electrode pattern provided on the lower surface of the surface mount type piezoelectric resonator is often used. A flat-shaped wiring board having a rectangular recess formed thereon, mounting a plurality of electronic components constituting an oscillation circuit on an upper surface of the flat-shaped wiring board, and having external electrodes on a bottom surface; and the flat-shaped wiring board A piezoelectric oscillator having a structure including a mechanically and electrically fixed piezoelectric resonator separated by a predetermined gap via a spherical column member fixed to an upper surface.
球状の柱部材を介して、前記配線基板上に所定のギャッ
プを隔てて表面実装型電子部品を固定した電子デバイス
の構造において、前記配線基板上面に設けた電極パター
ン、及び、表面実装型電子部品下面に設けた電極パター
ンの少なくともいずれか一方に前記球状の柱部材を位置
決めせしめる凸部を形成し、前記電極パターンと前記球
状の柱部材を機械的、且つ、電気的に接触固定したこと
を特徴とする電子デバイス。4. A structure of an electronic device in which a surface-mounted electronic component is fixed on a wiring board at a predetermined gap via a plurality of metallic spherical column members disposed on an upper surface of the wiring board. An electrode pattern provided on the upper surface of the wiring board, and at least one of the electrode patterns provided on the lower surface of the surface mount type electronic component, a convex portion for positioning the spherical column member is formed, and the electrode pattern and the spherical column are formed. An electronic device, wherein a member is mechanically and electrically fixed by contact.
の複数の球状の柱部材を介して、前記平板状の配線基板
上に所定のギャップを隔てて表面実装型圧電共振子を固
定した圧電発振器において、前記平板状の配線基板上面
に設けた電極パターン、及び、表面実装型圧電共振子の
下面に設けた電極パターンの少なくともいずれか一方に
前記球状の柱部材を位置決めせしめる凸部を形成し、前
記平板状の配線基板上面に発振回路を構成する複数の電
子部品を搭載すると共に底面に外部電極を備えた前記平
板状の配線基板と、該平板状の配線基板上面に固定した
球状の柱部材を介して所定のギャップを隔てて、機械
的、且つ、電気的に固定された圧電共振子とを備えた構
造を有していることを特徴とする圧電発振器。5. A surface-mount type piezoelectric resonator is fixed on the flat wiring board with a predetermined gap therebetween via a plurality of metallic spherical column members arranged on the upper surface of the flat wiring board. In the piezoelectric oscillator, a projection for positioning the spherical column member is formed on at least one of the electrode pattern provided on the upper surface of the flat wiring board and the electrode pattern provided on the lower surface of the surface-mount type piezoelectric resonator. A flat wiring board having a plurality of electronic components constituting an oscillation circuit mounted on the upper surface of the flat wiring substrate and having external electrodes on the bottom surface, and a spherical shape fixed to the upper surface of the flat wiring substrate. A piezoelectric oscillator having a structure including a mechanically and electrically fixed piezoelectric resonator separated by a predetermined gap via a column member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001170382A JP2002368373A (en) | 2001-06-06 | 2001-06-06 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001170382A JP2002368373A (en) | 2001-06-06 | 2001-06-06 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002368373A true JP2002368373A (en) | 2002-12-20 |
Family
ID=19012311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001170382A Pending JP2002368373A (en) | 2001-06-06 | 2001-06-06 | Electronic device |
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| Country | Link |
|---|---|
| JP (1) | JP2002368373A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007013365A1 (en) * | 2005-07-28 | 2007-02-01 | Sharp Kabushiki Kaisha | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| WO2007013344A1 (en) * | 2005-07-28 | 2007-02-01 | Sharp Kabushiki Kaisha | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| JP2011054649A (en) * | 2009-08-31 | 2011-03-17 | Ihi Corp | Method of manufacturing electronic device, and the electronic device |
| WO2013153717A1 (en) * | 2012-04-12 | 2013-10-17 | 日本電気株式会社 | Electronic apparatus and method for manufacturing same |
| CN107567657A (en) * | 2015-05-08 | 2018-01-09 | 敏捷电源开关三维集成Apsi3D | Semiconductor power device and the method for assembling semiconductor power device |
| JP2020113782A (en) * | 2015-05-08 | 2020-07-27 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | Method of assembling semiconductor power device |
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| WO2007013365A1 (en) * | 2005-07-28 | 2007-02-01 | Sharp Kabushiki Kaisha | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| WO2007013344A1 (en) * | 2005-07-28 | 2007-02-01 | Sharp Kabushiki Kaisha | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| KR100982183B1 (en) * | 2005-07-28 | 2010-09-14 | 샤프 가부시키가이샤 | Method for manufacturing solder mounting structure |
| US7968801B2 (en) | 2005-07-28 | 2011-06-28 | Sharp Kabushiki Kaisha | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| JP2011054649A (en) * | 2009-08-31 | 2011-03-17 | Ihi Corp | Method of manufacturing electronic device, and the electronic device |
| WO2013153717A1 (en) * | 2012-04-12 | 2013-10-17 | 日本電気株式会社 | Electronic apparatus and method for manufacturing same |
| JPWO2013153717A1 (en) * | 2012-04-12 | 2015-12-17 | 日本電気株式会社 | Electronic device and manufacturing method thereof |
| CN107567657A (en) * | 2015-05-08 | 2018-01-09 | 敏捷电源开关三维集成Apsi3D | Semiconductor power device and the method for assembling semiconductor power device |
| JP2018515941A (en) * | 2015-05-08 | 2018-06-14 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | Semiconductor power device and method for assembling semiconductor power device |
| US20180286814A1 (en) * | 2015-05-08 | 2018-10-04 | Agile Power Switch 3D - Integration Apsi3D | Semiconductor power device and a method of assembling a semiconductor power device |
| US10714428B2 (en) | 2015-05-08 | 2020-07-14 | Agile Power Switch 3D—Integration Apsi3D | Semiconductor power device and a method of assembling a semiconductor power device |
| JP2020113782A (en) * | 2015-05-08 | 2020-07-27 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | Method of assembling semiconductor power device |
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