JP2002366917A - Ic card incorporating antenna - Google Patents

Ic card incorporating antenna

Info

Publication number
JP2002366917A
JP2002366917A JP2001172049A JP2001172049A JP2002366917A JP 2002366917 A JP2002366917 A JP 2002366917A JP 2001172049 A JP2001172049 A JP 2001172049A JP 2001172049 A JP2001172049 A JP 2001172049A JP 2002366917 A JP2002366917 A JP 2002366917A
Authority
JP
Japan
Prior art keywords
chip
antenna
input
card
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001172049A
Other languages
Japanese (ja)
Inventor
Akira Sato
朗 佐藤
Kenji Samejima
賢二 鮫島
Takashi Tase
隆 田勢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2001172049A priority Critical patent/JP2002366917A/en
Publication of JP2002366917A publication Critical patent/JP2002366917A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To realize an antenna built-in IC card which is inexpensive in the mounting of an IC chip on an antenna circuit board, is highly reliable, is not influenced by the type of an antenna structure and the size of an IC chip and is applicable in a wide range. SOLUTION: An IC chip 70 in which two input-output terminals of the IC chip 70 are respectively taken out of a front face and a rear face is used. A non-contact IC card or tag where the IC chip is mounted on the antenna circuit board 10 is obtained by folding one end connection part 60 over the other end connection part 50 to be connected to upper and lower input-output terminal electrodes of the IC chip as a method for connecting a conductor pattern 20 for an antenna to the two input-output terminals.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、アンテナを内蔵す
るＩＣカード、更に詳しく言えば、ＩＣチップとそのＩ
Ｃの信号を外部の装置と無線で結合するためのアンテナ
を平面状基板に実装したＩＣカード（非接触ＩＣタグを
含む）及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having a built-in antenna, and more specifically, an IC chip and its IC.
The present invention relates to an IC card (including a non-contact IC tag) in which an antenna for wirelessly coupling a C signal to an external device is mounted on a planar substrate, and a method of manufacturing the same.

【０００２】[0002]

【従来の技術】従来知られているアンテナを内蔵するＩ
Ｃカードは、図１（ａ）及び（ｃ）に示すように、ＩＣ
チップ７０を実装したフィルム状アンテナ回路基板１０
の一面に、アンテナ用導体パターン２０が形成されてい
る。アンテナ用導体パターン２０はコイル状であり、ア
ンテナ用導体パターン２０の両端は、ＩＣチップ７０の
２つの電極５０及び６０にそれぞれ接続されている。こ
の場合に、導体パターン２０がコイル（スパイラル）状
であるために、図示のように、コイル２０の内側端部を
貫通孔３０でアンテナ回路基板１０の裏面に引き出し、
裏面コイルパターン４０に接続し、貫通孔３５でフィル
ム１０の表面に引き出し、接続部６０に接続する。これ
によって、同一平面状での交差を回避している。 また、上記貫通孔３０、３５を用いない方法は、図１
（ｃ）のように、コイルの形状を巻き数を単一にして、
ＩＣチップ７０の接続部５０と接続部６０とをアンテナ
用導体パターン２０の両端部に接続している（特開平１
１−１６７６０号公報に記載されている。）。2. Description of the Related Art A conventional antenna having a built-in antenna is used.
As shown in FIGS. 1A and 1C, the C card is an IC card.
Film antenna circuit board 10 on which chip 70 is mounted
On one surface, a conductor pattern 20 for an antenna is formed. The antenna conductor pattern 20 has a coil shape, and both ends of the antenna conductor pattern 20 are connected to two electrodes 50 and 60 of an IC chip 70, respectively. In this case, since the conductor pattern 20 has a coil (spiral) shape, the inside end of the coil 20 is pulled out to the back surface of the antenna circuit board 10 through the through hole 30 as shown in the drawing.
It is connected to the back side coil pattern 40, pulled out to the surface of the film 10 through the through hole 35, and connected to the connection part 60. This avoids crossing on the same plane. Also, a method not using the through holes 30 and 35 is shown in FIG.
As shown in (c), the shape of the coil is set to a single number of turns,
The connecting portion 50 and the connecting portion 60 of the IC chip 70 are connected to both ends of the conductor pattern 20 for the antenna (Japanese Patent Laid-Open No.
It is described in JP-A-1-176060. ).

【０００３】[0003]

【発明が解決しようとする課題】前記図１（ａ）、
（ｂ）に示すＩＣカードは、その製造において、貫通孔
を設けることが必須であり、それに付随するメッキ行程
及び裏面の接続配線行程が付加される。そのために、ア
ンテナ回路基板の製造コストが高くなる。また、図１
（ｃ）に示すＩＣカードは、ＩＣチップの２つの出入力
端子接続は、チップの内側でコイル状導体パターン２０
の両端の接続を閉じることが必要なために、アンテナ用
導体パターン２０の巻き数及びチップサイズ等の制限を
受け、そのＩＣカードの応用範囲が制限される。SUMMARY OF THE INVENTION FIG.
In the manufacture of the IC card shown in (b), it is essential to provide a through-hole in its manufacture, and a plating step and a connection wiring step on the back surface are added thereto. Therefore, the manufacturing cost of the antenna circuit board increases. FIG.
In the IC card shown in (c), the connection between the two input / output terminals of the IC chip is made by the coil-shaped conductor pattern 20 inside the chip.
It is necessary to close the connection at both ends of the IC card, so that the number of turns and the chip size of the antenna conductor pattern 20 are limited, and the application range of the IC card is limited.

【０００４】従って、本発明の目的は、上記課題を解決
し、低コスト、高信頼性で、アンテナ構造の種類、ＩＣ
チップのサイズにも影響されない、応用範囲が広いアン
テナ内臓ＩＣカード提供することである。すなわち、貫
通孔を設けることなく、また、コイルの巻数、チップサ
イズ、信頼性の劣化等に制限されないアンテナ内臓ＩＣ
カード及びその製造方法を提供することである。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, to provide a low-cost, high-reliability,
An object of the present invention is to provide an IC card with a built-in antenna that is not affected by the size of a chip and has a wide application range. That is, an antenna built-in IC that does not have a through hole and is not limited by the number of turns of a coil, chip size, deterioration of reliability, and the like.
An object of the present invention is to provide a card and a method for manufacturing the card.

【０００５】[0005]

【課題を解決するための手段】上記目的を達成するた
め、本発明のアンテナを内臓するＩＣカードは、少なく
とも２つの外部入出力電極をもつＩＣチップと、上記２
つの外部入出力電極に接続されたアンテナ用導体パター
ンとをもち、上記アンテナ用導体パターンが形成されア
ンテナ回路基板が上記ＩＣチップの上下側に面接するよ
うにした屈曲部をもつように構成される。ここで、ＩＣ
カードは、ＩＣチップが２つの端子のみで、識別用に使
用される非接触ＩＣタグを含む。 また、上記本発明のＩＣカードを製造するため、本発明
のＩＣカードの製造方法は、フィルム状基板面上に上記
アンテナ用導体パターンを形成し、上記ＩＣチップの入
出力電極の１つが上記アンテナ用導体パターンの一端と
接続されるように実装し、上記アンテナ用導体パターン
の他端を上記チップの入出力電極の他の１つの電極に接
するように上記フィルム状基板の少なくとも一部を屈曲
する工程をもつ。すなわち、上記アンテナ用導体パター
ンの一部はフィルム状基板面と一緒に屈曲部を形成して
ＩＣチップの電極に接続される。 本発明によれば、上述の構成及び製造方法により、貫通
孔を設けることなく、また、コイルの巻数、チップサイ
ズ、信頼性の劣化等に制限されることなく課題は解決で
きる。すなわち、ＩＣ回路の一方の端子が接地端子とな
るＩＣを用い、その取り出し電極をシリコン基板の裏面
に設け、ＩＣチップの２つの入出力端子を、表面と裏面
からそれぞれ取り出すことをできる。また、通常使用す
る２つの入出力端子がＩＣチップ表面に形成されている
ＩＣチップを用いても、折りたたみを２重に行うことに
より解決できる。また、低抵抗のアンテナ用導体パター
ンの材料を用いても、酸化防止金属と銀ペーストを組み
合わせることにより解決できるIn order to achieve the above object, an IC card having an antenna of the present invention includes an IC chip having at least two external input / output electrodes,
A conductor pattern for the antenna connected to the three external input / output electrodes, wherein the conductor pattern for the antenna is formed, and the antenna circuit board is configured to have a bent portion so as to contact the upper and lower sides of the IC chip. . Where IC
The card includes a non-contact IC tag that has only two IC chips and is used for identification. Further, in order to manufacture the IC card of the present invention, the method of manufacturing an IC card of the present invention includes forming the conductor pattern for an antenna on a film-like substrate surface, wherein one of the input / output electrodes of the IC chip has the antenna And mounting at least a part of the film-shaped substrate so that the other end of the antenna conductor pattern is in contact with another one of the input / output electrodes of the chip. Has a process. That is, a part of the conductor pattern for the antenna forms a bent portion together with the surface of the film-shaped substrate and is connected to the electrode of the IC chip. According to the present invention, the above-described configuration and manufacturing method can solve the problem without providing a through-hole and without being limited by the number of turns of the coil, the chip size, the deterioration of reliability, and the like. That is, an IC in which one terminal of an IC circuit is a ground terminal is used, and its extraction electrode is provided on the back surface of the silicon substrate, and the two input / output terminals of the IC chip can be extracted from the front surface and the back surface, respectively. Further, even if an IC chip having two normally used input / output terminals formed on the surface of the IC chip is used, the problem can be solved by performing double folding. In addition, even if a material for a low-resistance antenna conductor pattern is used, it can be solved by combining an antioxidant metal and a silver paste.

【０００６】[0006]

【発明の実施の形態】＜実施の形態１＞図２は本発明に
よるＩＣカードの第1の実施形態の構造及び製造方法を
説明する平面図及び断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS <First Embodiment> FIG. 2 is a plan view and a sectional view for explaining a structure and a manufacturing method of an IC card according to a first embodiment of the present invention.

【０００７】図２（a）及び(b)は、本発明によるＩＣカ
ードの製造方法の一工程を説明する平面図である。連続
する所定形状（長方形）のフィルム２０及び１００の一
面に、銀ペーストのスクリーン印刷又は銅、アルミニウ
ム等のエッチングによるアンテナ用導体パターン２０を
コイル状に形成する。フィルム２０及び１００は0.05〜
0.2mm程度の容易に折り曲げることができる材料が使用
される。導体パターン２０は0.05〜1mm程度の幅で、銀ペ
ースト、銅、アルミ薄膜が使用される。 アンテナ用導体パターン２０の両端には、入出力接続部
５０及び入出力接続部６０が存在する。次に、入出力接
続部５０上に、電気的接続するための異方導電フィルム
８０を仮圧着する。異方導電フィルム８０上にＩＣチッ
プ７０をその下側端子を入出力接続部５０に、位置合わ
せをして、ＩＣチップ７０を仮圧着し固定する。ここで
用いるＩＣチップ７０は、ＩＣ回路の接地端子を、シリ
コン基板から取り出す構造とすることにより、ＩＣチッ
プの２つの入出力端子を、表面と裏面からそれぞれ取り
出したＩＣチップを用いる。FIGS. 2A and 2B are plan views for explaining one step of the method for manufacturing an IC card according to the present invention. On one surface of continuous films (100) and 100 having a predetermined shape (rectangle), antenna conductor pattern 20 is formed in a coil shape by screen printing of silver paste or etching of copper, aluminum or the like. Films 20 and 100 are 0.05-
A material of about 0.2 mm that can be easily bent is used. The conductor pattern 20 has a width of about 0.05 to 1 mm, and is made of silver paste, copper, or aluminum thin film. At both ends of the conductor pattern 20 for the antenna, an input / output connection portion 50 and an input / output connection portion 60 are present. Next, an anisotropic conductive film 80 for electrical connection is temporarily pressure-bonded on the input / output connection portion 50. The IC chip 70 is positioned on the anisotropic conductive film 80 with the lower terminal thereof aligned with the input / output connection portion 50, and the IC chip 70 is temporarily compressed and fixed. The IC chip 70 used here has a structure in which the ground terminal of the IC circuit is taken out from the silicon substrate, so that the two input / output terminals of the IC chip are taken out from the front surface and the back surface, respectively.

【０００８】図２（ｂ）の絶縁用フィルム１１０を位置
合わせして第１フィルム接着剤１４０が下になるように
合わせる。絶縁用フィルム１１０は、絶縁用フィルム開
口部１６０が設けられており、上部入出力電極９０が絶
縁用フィルム開口部１６０を介して、入出力接続部６０
と接続できる構造としている。絶縁用フィルム１１０は
入出力接続部６０を折り返した時にコイルアンテナ２０
のショートを防止する。[0008] The insulating film 110 of FIG. 2B is aligned and the first film adhesive 140 is positioned downward. The insulating film 110 is provided with an insulating film opening 160, and the upper input / output electrode 90 is connected to the input / output connection portion 60 through the insulating film opening 160.
It can be connected to When the input / output connection part 60 is folded, the insulating film 110 is
To prevent short circuit.

【０００９】その後、異方導電フィルム８０を仮圧着し
固定する、フィルム１００（以下折り込み用フィルムと
呼ぶ）を、フィルム１０の表面に向かって折り込み部１
０５の部分で折りたたむ。折り込み用フィルム１００と
フィルム１０は同サイズなので、折りたたむことにより
自動的に位置合わせが完了する。入出力接続部６０は0.
1〜数mm平方であるため、位置合わせは容易にできる。 その後に、図２（ｃ）の断面図の状態にして、ＩＣチッ
プの上下に熱をかけながら荷重をかけ、ＩＣチップ７０
を電気的に導通させる。なお、図面は見易くするため、厚
さ方法を誇張して示しているため、左側はコの字型に曲
げられているが、実際には湾曲した形となる。 絶縁用フィルム１１０には、第１フィルム接着剤１４
０、第２フィルム接着剤１５０を形成しているため、基
板全体を加熱圧着して第１フィルム接着剤１４０、第１
フィルム接着剤１５０により接着し、カード形態として
完成させる。[0009] Thereafter, a film 100 (hereinafter referred to as a folding film) for temporarily compressing and fixing the anisotropic conductive film 80 is placed in the folded portion 1 toward the surface of the film 10.
Fold it at the part of 05. Since the folding film 100 and the film 10 are the same size, the folding automatically completes the alignment. Input / output connection unit 60 is 0.
Since it is 1 to several mm square, alignment can be easily performed. Thereafter, a load is applied while applying heat to the top and bottom of the IC chip in the state of the cross-sectional view of FIG.
Are electrically conducted. Although the thickness method is exaggerated for the sake of clarity, the left side is bent in a U-shape, but actually has a curved shape. The insulating film 110 has a first film adhesive 14
0, since the second film adhesive 150 is formed, the entire substrate is heated and pressed to form the first film adhesive 140 and the first film adhesive 140.
The film is adhered with a film adhesive 150 to complete a card form.

【００１０】上記の構造及び製造方法により、貫通孔を
用いること無く、外側の入出力接続部６０を折り返して
アンテナ及びＩＣチップを実装したＩＣカードが得られ
る。また、アンテナ用導体パターン２０は折り込み用フ
ィルム１００とフィルム１０に同一印刷工程で実現さ
れ、折り込み用フィルム１００を折り込むだけの工程
で、簡単な製造方法により低コスト化ができる。 ＜実施の形態２＞図３は本発明によるＩＣカードの第２
の実施形態の構造及び製造方法を説明する平面図及び断
面図である。本実施形態は、アンテナ用導体パターン２
０の入出力端子５０を含む部分のみを折り返して構成し
たものである。第1の実施形態の構成と実質的に同じ機
能、構成部には図２と同じ番号を付した。入出力接続部
６０上に、電気的接続するための異方導電フィルム８０
を仮圧着する。異方導電フィルム８０上にＩＣチップ７
０を入出力接続部６０に、位置合わせをして、ＩＣチッ
プ７０を仮圧着し固定する。その後、入出力接続部５０
にも、異方導電フィルム８０を仮圧着し固定する。According to the above-described structure and manufacturing method, an IC card in which an antenna and an IC chip are mounted by folding the outer input / output connection portion 60 without using a through hole can be obtained. In addition, the antenna conductor pattern 20 is realized on the folding film 100 and the film 10 in the same printing process, and the cost can be reduced by a simple manufacturing method by simply folding the folding film 100. <Embodiment 2> FIG. 3 shows a second embodiment of an IC card according to the present invention.
It is a top view and a sectional view explaining a structure and a manufacturing method of an embodiment. In the present embodiment, the antenna conductor pattern 2
Only the portion including the input / output terminal 50 of 0 is folded back. Functions and components substantially the same as those in the configuration of the first embodiment are denoted by the same reference numerals as in FIG. An anisotropic conductive film 80 for electrical connection on the input / output connection portion 60
Is temporarily crimped. IC chip 7 on anisotropic conductive film 80
0 is aligned with the input / output connection portion 60, and the IC chip 70 is temporarily compressed and fixed. Then, the input / output connection unit 50
Also, the anisotropic conductive film 80 is temporarily compressed and fixed.

【００１１】次に、切り込み部１３０で分離された、折
り込み用フィルム１００を図３（ｂ）の様に、折り込み
部１０５、１０６の部分で折りたたむ。このとき、絶縁
用フィルム１１０を配置することにより、コイル間の短
絡は防止されている。次に、ＩＣチップ７０の上下に熱
をかけながら荷重をかけ、ＩＣチップ７０を電気的に導
通させる。最後に接着剤付フィルムで上下をはさみ、基
板全体を加熱圧着してカード形態として完成させる。上
述の構造及び方法により、貫通孔を用いること無く、内
側の入出力端子を折り返してＩＣチップを実装した非接
触ＩＣカードが得られる。Next, as shown in FIG. 3 (b), the folding film 100 separated by the cut portion 130 is folded at the folding portions 105 and 106. At this time, by arranging the insulating film 110, a short circuit between the coils is prevented. Next, a load is applied while applying heat to the upper and lower sides of the IC chip 70 to electrically conduct the IC chip 70. Finally, the upper and lower sides are sandwiched by a film with an adhesive, and the entire substrate is heated and pressed to complete a card form. According to the above-described structure and method, a non-contact IC card in which an IC chip is mounted by folding an inner input / output terminal without using a through-hole can be obtained.

【００１２】本発明のＩＣカードにおけるアンテナパタ
ーンは、コイル状に限定されない。図４は、コイル状以
外の形状のアンテナについて示し、上記同様にＩＣチッ
プの２つの入出力端子を、表面と裏面からそれぞれ取り
出すＩＣチップを用いて実装するが、フィルム１０上の
アンテナ用導体パターン２０がコイル状でない形状を示
す。なお、簡明のため、ＩＣチップ部の表示は省略され
ている。The antenna pattern in the IC card of the present invention is not limited to a coil. FIG. 4 shows an antenna having a shape other than the coil shape, and the two input / output terminals of the IC chip are mounted using the IC chips respectively taken out from the front surface and the back surface in the same manner as described above. Reference numeral 20 denotes a non-coiled shape. Note that, for simplicity, the display of the IC chip unit is omitted.

【００１３】図４（ａ）は、１ターンのアンテナ構造を
示した。ＩＣチップを上記同様に実装した後、フィルム
１０の中心線から、入出力接続部５０と入出力接続部６
０が破線１０５を折り込み部として重なり合う様に折り
たたむ。ＩＣチップの入出力電極と入出力接続部５０と
入出力接続部６０は電気的な接続行い、ＩＣチップを実
装した非接触ＩＣカード及びタグが得られる。FIG. 4A shows a one-turn antenna structure. After the IC chip is mounted in the same manner as described above, the input / output connection 50 and the input / output connection 6
0 folds such that the dashed line 105 overlaps with the folded portion. The input / output electrodes of the IC chip, the input / output connection unit 50 and the input / output connection unit 60 are electrically connected to each other to obtain a non-contact IC card and a tag on which the IC chip is mounted.

【００１４】図４（ｂ）は、アンテナ用導体パターン２
０にアンテナスリット４５を入れて形成したものを示し
た。これも、フィルム１０の中心線１０５から、入出力
接続部５０と入出力接続部６０が重なり合う様に折りた
たむ。ＩＣチップの入出力電極と入出力接続部５０と入
出力接続部６０は電気的な接続行い、ＩＣチップを実装
した非接触ＩＣカード及びタグが得られる。FIG. 4B shows a conductor pattern 2 for an antenna.
FIG. 1 shows an example in which the antenna slit 45 is formed in the hole No. 0. This is also folded so that the input / output connection part 50 and the input / output connection part 60 overlap from the center line 105 of the film 10. The input / output electrodes of the IC chip, the input / output connection unit 50 and the input / output connection unit 60 are electrically connected to each other to obtain a non-contact IC card and a tag on which the IC chip is mounted.

【００１５】図４（ｃ）は、ダイポールアンテナを示し
たものである。フィルム１０の中心線１０５から、入出
力接続部５０と入出力接続部６０が重なり合う様に折り
たたむ。ＩＣチップの入出力電極と入出力接続部５０と
入出力接続部６０は電気的な接続行い、ＩＣチップを実
装した非接触ＩＣカードが得られる。FIG. 4C shows a dipole antenna. From the center line 105 of the film 10, the input / output connection part 50 and the input / output connection part 60 are folded so as to overlap. The input / output electrodes of the IC chip, the input / output connection unit 50 and the input / output connection unit 60 are electrically connected to each other, and a non-contact IC card on which the IC chip is mounted is obtained.

【００１６】上記の方法により、貫通孔を設けることな
く、また、コイルの巻数、チップサイズに制限されるこ
となく、ＩＣチップを実装した非接触ＩＣカード及びタ
グが得られる。 ＜実施の形態３＞図５は本発明によるＩＣカードの第３
の実施形態を説明する図である。According to the above method, a contactless IC card and a tag on which an IC chip is mounted can be obtained without providing a through-hole and without being limited by the number of turns of the coil and the chip size. <Embodiment 3> FIG. 5 shows a third embodiment of an IC card according to the present invention.
It is a figure explaining embodiment of.

【００１７】同図（ａ）及び（ｂ）は、製造方法を説明
する平面図で、（ｃ）はＩＣカードの断面図（（ａ）の
D−D‘断面図）を示す。本実施形態はアンテナ用導体パ
ターン２０を２重巻きしたものである。FIGS. 2A and 2B are plan views for explaining a manufacturing method, and FIG. 1C is a cross-sectional view of the IC card shown in FIG.
DD ′ cross-sectional view). In this embodiment, the conductor pattern 20 for the antenna is double-wound.

【００１８】図５（ａ）のフィルム１０上に、アンテナ
用導体パターン２０は、アンテナ用導体パターン２０を
向かい合わせた時に、コイルの巻き数が２倍に成るよう
に、中心で点対称に配置して形成する。入出力接続部６
０上に、異方導電フィルム８０を仮圧着し固定する。異
方導電フィルム８０上に、ＩＣチップ７０を入出力接続
部６０に位置合わせをして、ＩＣチップ７０を仮圧着し
固定する。入出力接続部５０にも、異方導電フィルム８
０を仮圧着し固定する。上下のアンテナ用導体パターン
２０同士が接触しない為に、図５（ｂ）に示す絶縁用フ
ィルム１１０を、位置合わせして第１フィルム接着剤１
４０が下になるように合わせる。この絶縁用フィルム１
１０には絶縁用フィルム開口部１６０が設けられてお
り、上部入出力電極９０が絶縁用フィルム開口部１６０
を介して、入出力接続部６０と接続できる構造としてい
る。フィルム１０を矢印の方向のアンテナ用導体パター
ン２０が向かい合う方向に、折り込み部１０５の部分で
折りたたみ、ＩＣチップ７０を加熱圧着して電気的に接
続する。最後に基板全体を加熱圧着して第１フィルム接
着剤１４０、第１フィルム接着剤１５０により接着し、
カード形態として完成させる。 ＜実施の形態５＞図６は本発明によるＩＣカードの第５
の実施形態を説明する図である。同図（ａ）及び（ｂ）
は、製造方法を説明する平面図を示す。本実施形態はア
ンテナ用導体パターン２０を２重巻きしたものである。
第４の実施形態と比べ、アンテナ用導体パターンの重な
る形態において異なる。実質的に同じ構成、機能部には
図５の同一部分と同じ番号を示す。なお、ＩＣチップ部
分については省略している。On the film 10 shown in FIG. 5A, the antenna conductor patterns 20 are arranged point-symmetrically at the center so that the number of turns of the coil is doubled when the antenna conductor patterns 20 face each other. Formed. Input / output connection 6
An anisotropic conductive film 80 is temporarily press-bonded and fixed on the upper side of the film. On the anisotropic conductive film 80, the IC chip 70 is aligned with the input / output connection part 60, and the IC chip 70 is temporarily compressed and fixed. The input / output connection part 50 also has an anisotropic conductive film 8.
0 is temporarily pressed and fixed. In order to prevent the upper and lower antenna conductor patterns 20 from contacting each other, the insulating film 110 shown in FIG.
Adjust so that 40 is down. This insulating film 1
10 is provided with an insulating film opening 160, and the upper input / output electrode 90 is connected to the insulating film opening 160.
Via the input / output connection unit 60. The film 10 is folded at the folded portion 105 in the direction in which the antenna conductor pattern 20 faces in the direction of the arrow, and the IC chip 70 is electrically connected by heat compression. Finally, the entire substrate is heat-pressed and bonded with the first film adhesive 140 and the first film adhesive 150,
Complete in card form. <Fifth Embodiment> FIG. 6 shows a fifth embodiment of the IC card according to the present invention.
It is a figure explaining embodiment of. Figures (a) and (b)
Shows a plan view for explaining the manufacturing method. In the present embodiment, the antenna conductor pattern 20 is double-wound.
The fourth embodiment differs from the fourth embodiment in the form of overlapping antenna conductor patterns. Substantially the same configuration and functional units are denoted by the same reference numerals as the same parts in FIG. Note that the IC chip portion is omitted.

【００１９】フィルム１０上にアンテナ用導体パターン
２０、第２アンテナ用導体パターン２５、入出力接続部
５０、入出力接続部６０を形成する。破線部１０５を折
り込む。折り込んだ後は、同図（ｂ）のように、アンテ
ナ用導体パターン２０、第２アンテナ用導体パターン２
５、入出力接続部５０、入出力接続部６０が重なりあっ
た状態になる。入出力接続部とコイルの交差部分以外は
重なり合わないようにする。ここでは、アンテナ用導体
パターンを説明したが、ＩＣチップの接続及び絶縁、接
着等は前記同様に行い、カード形態として完成させる。On the film 10, an antenna conductor pattern 20, a second antenna conductor pattern 25, an input / output connection part 50, and an input / output connection part 60 are formed. The broken line portion 105 is folded. After being folded, the conductor pattern 20 for the antenna, the conductor pattern 2 for the second antenna, as shown in FIG.
5, the input / output connection unit 50 and the input / output connection unit 60 are in a state of being overlapped. Except for the intersection between the input / output connection and the coil, do not overlap. Here, the conductor pattern for the antenna has been described, but connection, insulation, bonding, and the like of the IC chip are performed in the same manner as described above to complete the card form.

【００２０】上述の方法により、貫通孔を設けることな
く、また、行程を増やすこともなく、コイルを２重する
ことによって、巻数を２倍にしたアンテナ回路基板を実
現し、さらに、アンテナ用導体パターンの形状を工夫す
ることにより、寄生容量を増加させることなく、ＩＣチ
ップを実装した非接触ＩＣカード及びタグが得られる。 ＜実施の形態６＞図７は本発明によるＩＣカードの第６
の実施形態を説明する図である。同図（ａ）、（ｂ）及
び（ｃ）は、製造方法を説明する平面図を示し、（ｄ）
は（ｃ）のＥ−Ｅ断面を示す断面図である。本実施形態
は、ＩＣチップの２つの電極がＩＣチップの同じ平面側
にある場合に適したものである。According to the above-mentioned method, an antenna circuit board having twice the number of turns is realized by doubling the coil without providing a through-hole and without increasing the number of strokes. By devising the shape of the pattern, a contactless IC card and a tag on which an IC chip is mounted can be obtained without increasing the parasitic capacitance. <Embodiment 6> FIG. 7 shows a sixth embodiment of the IC card according to the present invention.
It is a figure explaining embodiment of. FIGS. 3A, 3B and 3C are plan views for explaining a manufacturing method, and FIGS.
FIG. 3C is a cross-sectional view showing the EE cross section of FIG. This embodiment is suitable when the two electrodes of the IC chip are on the same plane side of the IC chip.

【００２１】図７（ａ）のフィルム１０の表面に、アン
テナ用導体パターン２０を形成し、内側の入出力接続部
５０の近傍に、入出力接続部６０を配置するために、絶
縁用フィルム開口部１８０を設ける。第２折り込み用フ
ィルム１７０を、入出力接続部ｂが裏側を向くように、
第２折り込み部１８０の部分で折りたたむ。次に、折り
込み用フィルム１００をアンテナ用導体パターン２０が
裏側を向くように、折り込み部１０５の部分で折りたた
む。すなわち、（ａ）の第２折り込み用フィル図７
（ｃ）ム１７０の面は（ａ）平面に対し３６０度回転さ
れる。図７（ｂ）に、折り込んだ状態を示した。ＩＣチ
ップ７０の電極部を接続する為の、入出力接続部５０、
入出力接続部６０が近接して設置できている。An antenna conductor pattern 20 is formed on the surface of the film 10 shown in FIG. 7A, and an insulating film opening is formed in order to dispose the input / output connection 60 near the inner input / output connection 50. A part 180 is provided. The second folding film 170 is set so that the input / output connection part b faces the back side.
It is folded at the second folding section 180. Next, the folding film 100 is folded at the folded portion 105 such that the conductor pattern 20 for the antenna faces the back side. That is, FIG. 7A shows the second folding file.
(C) The surface of the rubber 170 is rotated 360 degrees with respect to the (a) plane. FIG. 7B shows the folded state. An input / output connection unit 50 for connecting the electrode unit of the IC chip 70,
The input / output connection unit 60 can be installed in close proximity.

【００２２】図７（ｄ）に示すように、ＩＣチップ７０
の、入出力電極２００及び入出力電極２１０は、入出力
接続部５０、入出力接続部６０にそれぞれ、異方導電フ
ィルム８０を用い加熱圧着して電気的に接続される。最
後に接着剤付フィルムで上下をはさみ、基板全体を加熱
圧着してカード形態として完成させる。上記の方法によ
り、貫通孔を設けることなく、現在通常用いられてい
る、ＩＣチップ表面に入出力電極を形成しているＩＣチ
ップを用いたアンテナ回路基板を実現し、ＩＣチップを
実装した非接触ＩＣカード及びタグが得られる。 ＜実施の形態７＞図８は、ＩＣチップを実装するアンテ
ナ回路基板において、低抵抗を実現できる、銅、アルミ
ニウム等を用いた時の、表面の酸化等による、接続信頼
性低減を防止する接続構造を平面図及び一部断面図を示
す。銅、アルミニウム等でアンテナ導体パターン２０を
形成した場合、低抵抗のアンテナ回路基板を実現できる
が、金属表面の酸化は避けられない、特に高温高湿等の
厳しい環境条件においては、接続信頼性の劣化が懸念さ
れる。As shown in FIG. 7D, the IC chip 70
The input / output electrode 200 and the input / output electrode 210 are electrically connected to the input / output connection unit 50 and the input / output connection unit 60 by heating and pressing using an anisotropic conductive film 80, respectively. Finally, the upper and lower sides are sandwiched by a film with an adhesive, and the entire substrate is heated and pressed to complete a card form. According to the above method, an antenna circuit board using an IC chip having an input / output electrode formed on the surface of the IC chip, which is generally used at present, is realized without providing a through-hole, and a non-contact mounting the IC chip is realized. An IC card and a tag are obtained. <Embodiment 7> FIG. 8 shows a connection which can realize a low resistance in an antenna circuit board on which an IC chip is mounted and which prevents a reduction in connection reliability due to oxidation of the surface when copper, aluminum or the like is used. The structure is shown by a plan view and a partial sectional view. When the antenna conductor pattern 20 is formed of copper, aluminum, or the like, a low-resistance antenna circuit board can be realized, but oxidation of the metal surface is inevitable. Particularly, in severe environmental conditions such as high temperature and high humidity, the connection reliability is poor. Deterioration is a concern.

【００２３】図８（ａ）、（ｂ）のアンテナ導体パター
ン２０の終端である入出力接続部５０、入出力接続部６
０のそれぞれの上層に、酸化防止用金属２２０を形成
し、さらにその上に銀ペーストを積層する、その後、異
方導電フィルムを用いてＩＣチップをアンテナ回路基板
に実装して、酸化を防止し、さらに、接続信頼性の高い
銀ペーストで接続することにより、低抵抗で接続信頼性
の高いＩＣチップを実装した非接触ＩＣカード及びタグ
が得られる。8 (a) and 8 (b), the input / output connection portion 50 and the input / output connection portion 6 which are the ends of the antenna conductor pattern 20.
In each of the upper layers of O, an antioxidant metal 220 is formed, and a silver paste is further laminated thereon. Thereafter, an IC chip is mounted on the antenna circuit board using an anisotropic conductive film to prevent oxidation. Furthermore, by connecting with a silver paste having high connection reliability, a non-contact IC card and a tag on which an IC chip having low resistance and high connection reliability are mounted can be obtained.

【００２４】上記実施例では、低周波から高周波まで用
いることのできる、入出力接続部の部分のみを積層する
構造を示した。これは、高周波においては、アンテナ金
属の１〜２μmの表皮のみ信号電波が流れるため、コイ
ル表面部分は低抵抗材料である必要がある。しかし、低
周波で用いる場合は、コイル表面部分が低抵抗で有る必
要が無いため、アンテナ用導体パターン及び入出力接続
部のすべてを積層構造としてもかまわない。In the above embodiment, the structure in which only the input / output connection portion, which can be used from low frequency to high frequency, is laminated is shown. This is because, at high frequencies, signal radio waves only flow through the skin of the antenna metal of 1 to 2 μm, so that the coil surface needs to be made of a low-resistance material. However, when used at a low frequency, the coil surface does not need to have low resistance, so that all of the antenna conductor pattern and the input / output connection portion may have a laminated structure.

【００２５】また上記の酸化防止用金属は、Ｔｉ、Ｐ
ｔ、Ａｕ、Ｎｉ、Ｔａ、Ａｇ等の金属を用いることがで
きる、また、前記の金属の重ね膜、合金を用いても良
い。The above-mentioned oxidation preventing metals are Ti, P
Metals such as t, Au, Ni, Ta, Ag and the like can be used, and a stacked film or alloy of the above metals may be used.

【００２６】上記発明の実施の形態１〜４では、ＩＣチ
ップの電気的接続条件において、異方導電フィルムを用
いる方法を述べてきたが、電気的接続は半田、導電性接
着剤、接着剤、金属−金属間の直接接合、合金接合のい
ずれの接合方式を用いても良い。In the first to fourth embodiments of the present invention, the method of using an anisotropic conductive film under the electric connection condition of the IC chip has been described. However, the electric connection is performed by using a solder, a conductive adhesive, an adhesive, Either direct bonding between metal and metal or alloy bonding may be used.

【００２７】[0027]

【発明の効果】ＩＣチップの２つの入出力端子を、表面
と裏面からそれぞれ取り出すことを可能としたＩＣチッ
プを用い、一方の終端接続部を、もう一方の終端接続部
の上に折りたたみ、ＩＣチップの上下の入出力端子電極
と終端接続部をそれぞれ接続して、アンテナ回路基板に
ＩＣチップを実装した非接触ＩＣカード及びタグを得る
ことできる。アンテナ用導体パターンを同一平面上に、
アンテナ用導体パターンの中心で、向かい合わせて折り
たたんだ時に、コイルの巻き数が２倍に成るように、中
心で点対称に配置して形成することにより、２重巻きに
したアンテナ回路基板にＩＣチップを実装した非接触Ｉ
Ｃカード及びタグを得ることできる。また、通常使用す
る２つの入出力端子がＩＣチップ表面に形成されている
ＩＣチップにおいても、折りたたみを２重に行うことに
より、ＩＣチップを実装した非接触ＩＣカード及びタグ
を得ることできる。また、低抵抗のアンテナ用導体パタ
ーンの材料を用いても、酸化防止金属と銀ペーストを組
み合わせることにより、ＩＣチップを実装した非接触Ｉ
Ｃカード及びタグを得ることできる。According to the present invention, an IC chip capable of taking out two input / output terminals of an IC chip from a front surface and a back surface is used, and one terminal connection portion is folded over the other terminal connection portion. By connecting the upper and lower input / output terminal electrodes of the chip and the terminating connector, respectively, a non-contact IC card and a tag having an IC chip mounted on an antenna circuit board can be obtained. Place the conductor pattern for the antenna on the same plane,
At the center of the conductor pattern for the antenna, when it is folded face-to-face, the number of turns of the coil is doubled so that it is arranged point-symmetrically at the center so that the IC is mounted on the double-wound antenna circuit board. Non-contact I with chip mounted
C card and tag can be obtained. Further, even in the case of an IC chip in which two normally used input / output terminals are formed on the surface of the IC chip, a non-contact IC card and a tag on which the IC chip is mounted can be obtained by performing double folding. In addition, even when using a low-resistance antenna conductor pattern material, a non-contact IC chip mounted IC chip can be obtained by combining an antioxidant metal and a silver paste.
C card and tag can be obtained.

【００２８】上記の方法により、貫通孔を設けることな
く、また、コイルの巻数、チップサイズ、信頼性の劣化
等に制限されることなくチップを実装した非接触ＩＣカ
ード及びタグを得ることできる。According to the above method, a non-contact IC card and a tag on which a chip is mounted can be obtained without providing a through-hole and without being limited by the number of turns of the coil, the chip size, the reliability, and the like.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 従来のＩＣカードの構成を示す図である。FIG. 1 is a diagram showing a configuration of a conventional IC card.

【図２】 発明によるＩＣカードの第１の実施形態を説
明する平面図及び断面図である。FIGS. 2A and 2B are a plan view and a cross-sectional view illustrating a first embodiment of an IC card according to the present invention.

【図３】 発明によるＩＣカードの第２の実施形態を説
明する平面図及び断面図である。FIG. 3 is a plan view and a cross-sectional view illustrating a second embodiment of an IC card according to the present invention.

【図４】 発明によるＩＣカードの第３の実施形態を説
明する平面図及び断面図である。FIG. 4 is a plan view and a sectional view illustrating a third embodiment of an IC card according to the present invention.

【図５】 発明によるＩＣカードの第４の実施形態を説
明する平面図及び断面図である。FIG. 5 is a plan view and a cross-sectional view illustrating a fourth embodiment of the IC card according to the present invention.

【図６】 発明によるＩＣカードの第５の実施形態を説
明する平面図及び断面図である。FIG. 6 is a plan view and a cross-sectional view illustrating a fifth embodiment of the IC card according to the present invention.

【図７】 発明によるＩＣカードの第６の実施形態を説
明する平面図及び断面図である。FIG. 7 is a plan view and a cross-sectional view illustrating a sixth embodiment of an IC card according to the present invention.

【図８】 発明によるＩＣカードの第７の実施形態を説
明する平面図及び断面図である。8A and 8B are a plan view and a cross-sectional view illustrating a seventh embodiment of the IC card according to the present invention.

【符号の説明】[Explanation of symbols]

１０ ：フィルム ２０ ：アンテナ用導体パターン ２５ ：第２アンテナ用導体パターン ３０ ：貫通孔ａ ３５ ：貫通孔ｂ ４０ ：裏面アンテナ用導体パターン ４５ ：アンテナスリット ５０ ：入出力接続部ａ ６０ ：入出力接続部ｂ ７０ ：ＩＣチップ ８０ ：異方導電フィルム ９０ ：上部入出力電極 １００：折り込み用フィルム １０５：折り込み部 １１０：絶縁用フィルム １２０：下部入出力電極 １３０：折り込み用切り込み部 １４０：第１接着剤 １５０：第２接着剤 １６０：絶縁用フィルム開口部 １７０：第２折り込み用フィルム １８０：第２折り込み部 １９０：フィルム開口部 ２００：入出力電極ａ ２１０：入出力電極ｂ ２２０：酸化防止金属 ２３０：銀ペースト Reference Signs List 10: Film 20: Conductor pattern for antenna 25: Conductor pattern for second antenna 30: Through hole a 35: Through hole b 40: Conductor pattern for backside antenna 45: Antenna slit 50: Input / output connection part a 60: Input / output connection Part b 70: IC chip 80: Anisotropic conductive film 90: Upper input / output electrode 100: Folding film 105: Folding part 110: Insulating film 120: Lower input / output electrode 130: Folding cut part 140: First adhesive 150: second adhesive 160: insulating film opening 170: second folding film 180: second folding part 190: film opening 200: input / output electrode a 210: input / output electrode b 220: antioxidant metal 230: Silver paste

フロントページの続き (72)発明者 田勢 隆 東京都国分寺市東恋ヶ窪一丁目280番地 株式会社日立製作所中央研究所内 Ｆターム(参考） 2C005 MA18 NA08 NA36 5B035 BA03 BB09 CA01 CA23 Continued on the front page (72) Inventor Takashi Tase 1-280 Higashi-Koigabo, Kokubunji-shi, Tokyo F-term in Central Research Laboratory, Hitachi, Ltd. (Reference) 2C005 MA18 NA08 NA36 5B035 BA03 BB09 CA01 CA23

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】少なくとも２つの外部入出力電極をもつＩ
Ｃチップと、上記２つの外部入出力電極に接続されたア
ンテナ用導体パターンとをもち、上記アンテナ用導体パ
ターンが形成されアンテナ回路基板の少なくとも一部が
上記ＩＣチップの２つの外部入出力電極に上記アンテナ
用導体パターンの端部に接続されるようにした屈曲部を
もって構成されたことを特徴とするアンテナを内蔵する
ＩＣカード。An I / O having at least two external input / output electrodes
A C chip and an antenna conductor pattern connected to the two external input / output electrodes, wherein the antenna conductor pattern is formed and at least a part of the antenna circuit board is connected to the two external input / output electrodes of the IC chip; An IC card having a built-in antenna, comprising a bent portion connected to an end of the conductor pattern for an antenna. 【請求項２】上記ＩＣチップが扁平状で、上記２つの外
部入出力電極が上記ＩＣチップ上及び下側にあり、上記
アンテナ用導体パターンが連続するコイル状で、その両
端が上記２つの外部入出力電極に接続されていることを
特徴とする請求項1記載のアンテナを内蔵するＩＣカー
ド。2. The IC chip has a flat shape, the two external input / output electrodes are on and under the IC chip, and the antenna conductor pattern is a continuous coil, and both ends of the two external input / output electrodes are the two external electrodes. 2. The IC card according to claim 1, wherein the IC card is connected to an input / output electrode. 【請求項３】上記ＩＣチップが扁平状で、上記２つの外
部入出力電極が上記ＩＣチップの同一面側にあり、上記
アンテナ用導体パターンが連続するコイル状態で、その
両端は両端が上記２つの外部入出力電極に接続され、そ
の一端はカードの外周部を上記アンテナ用導体パターン
が屈曲して上記外部入出力電極に接続されていることを
特徴とする請求項1記載のアンテナを内蔵するＩＣカー
ド。3. The IC chip is flat, the two external input / output electrodes are on the same side of the IC chip, and the antenna conductor pattern is in a continuous coil state. The antenna according to claim 1, wherein one end of the antenna is connected to the external input / output electrode by connecting the antenna conductor pattern at one end to the outer peripheral portion of the card. IC card. 【請求項４】請求項１ないし3の何れか1つに記載のＩＣ
カードの製造方法であって、フィルム状アンテナ回路基
板面上に上記アンテナ用導体パターンを形成し、上記Ｉ
Ｃチップの入出力電極の１つが上記アンテナ用導体パタ
ーンの一端と接続されるように実装し、上記アンテナ回
路基板面の少なくとも上記アンテナ用導体パターンの他
端を含む部分を折り曲げ、当該他端が上記ＩＣチップの
入出力電極の他の１つの電極に接するように屈曲する工
程をもつことを特徴とするＩＣカードの製造方法。4. The IC according to claim 1, wherein
A method of manufacturing a card, comprising: forming the antenna conductor pattern on a film-like antenna circuit board surface;
One of the input / output electrodes of the C chip is mounted so as to be connected to one end of the antenna conductor pattern, and a portion of the antenna circuit board surface including at least the other end of the antenna conductor pattern is bent. A method of manufacturing an IC card, comprising a step of bending so as to be in contact with another one of the input / output electrodes of the IC chip. 【請求項５】請求項４記載のＩＣカードの製造方法にお
いて、上記フィルム状アンテナ回路基板の少なくとも一
部を屈曲する工程の際に、上記フィルム状アンテナ回路
基板のアンテナ用導体パターンと上記フィルム状アンテ
ナ回路基板の少なくとも一部以外のアンテナ用導体パタ
ーンの接触を回避するための絶縁層を形成する工程をも
つことを特徴とするＩＣカードの製造方法。5. The method for manufacturing an IC card according to claim 4, wherein the step of bending at least a part of the film-like antenna circuit board includes the step of bending the antenna conductor pattern of the film-like antenna circuit board and the film-like antenna circuit board. A method for manufacturing an IC card, comprising a step of forming an insulating layer for avoiding contact with an antenna conductor pattern other than at least a part of an antenna circuit board.
JP2001172049A 2001-06-07 2001-06-07 Ic card incorporating antenna Pending JP2002366917A (en)

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