JP2002353668A - Electronic component cooling unit and cooling system - Google Patents
Electronic component cooling unit and cooling systemInfo
- Publication number
- JP2002353668A JP2002353668A JP2001162036A JP2001162036A JP2002353668A JP 2002353668 A JP2002353668 A JP 2002353668A JP 2001162036 A JP2001162036 A JP 2001162036A JP 2001162036 A JP2001162036 A JP 2001162036A JP 2002353668 A JP2002353668 A JP 2002353668A
- Authority
- JP
- Japan
- Prior art keywords
- cooling water
- cooling
- heat
- forming member
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、水冷および空冷の
双方の放熱ユニットを有する電子部品冷却装置および電
子部品冷却システムに関するものである。The present invention relates to an electronic component cooling device and an electronic component cooling system having both water-cooled and air-cooled heat radiation units.
【０００２】[0002]
【従来の技術】近年、サイリスタやパワートランジスタ
等の電子部品の性能の向上は著しく、それに対応して電
子部品（発熱素子）からの発熱量が大きくなっている。
一方、例えば工作機械の制御機器・通信機器等は、ます
ます小型かつ薄型が要求されており、その中で動作の安
定を保つために、発生する大きな熱量を外部へ速やかに
放出するための冷却装置が非常に重要になってきてい
る。2. Description of the Related Art In recent years, the performance of electronic components such as thyristors and power transistors has been significantly improved, and the amount of heat generated from electronic components (heating elements) has been correspondingly increased.
On the other hand, for example, control equipment and communication equipment for machine tools are increasingly required to be small and thin, and in order to maintain stable operation, cooling to quickly release a large amount of generated heat to the outside is required. Equipment is becoming very important.
【０００３】制御機器用電子部品の冷却には、ヒートシ
ンク、空冷ファン、ヒートパイプ、水冷ユニット等が単
独又は組み合わせて使用されている。特に発熱が大きい
場合には、水冷ユニットが用いられている。A heat sink, an air-cooling fan, a heat pipe, a water-cooling unit and the like are used alone or in combination for cooling electronic components for control equipment. In particular, when heat generation is large, a water cooling unit is used.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
水冷式の電子部品冷却装置では、その構造上、電子部品
より生じた熱を受ける受熱部と放熱フィンとの間に冷却
水路が設けられ、冷却水を介した熱伝達となっており、
放熱フィンによる放熱が充分でなく、また冷却水への熱
伝達を良好にするために冷却水路内にフィンを設ける
と、冷却水の通路抵抗が増加し、冷却水が流れ難くな
り、放熱性能が低下するという問題があった。However, in a conventional water-cooled electronic component cooling device, a cooling water passage is provided between a heat receiving portion that receives heat generated by the electronic component and a radiation fin. Heat transfer through water,
If the fins are not enough to dissipate heat, and if fins are provided in the cooling water passage to improve the heat transfer to the cooling water, the resistance of the cooling water passage will increase, making it difficult for the cooling water to flow, and improving the heat radiation performance. There was a problem of lowering.
【０００５】本発明の目的は、上記の従来技術の問題を
解決し、水冷および空冷の双方の放熱ユニットを有する
電子部品冷却装置について、サイリスタやパワートラン
ジスタ等の電子部品から生じた熱を、熱伝導により放熱
フィンに直に伝えるとともに、放熱フィンの熱飽和分を
冷却水に伝えることにより、放熱効率が向上し、工作機
械の制御機器・通信機器等に適用した場合にも、電子部
品から発生する大きな熱量を外部へ速やかに放出するこ
とができる、電子部品冷却装置および電子部品冷却シス
テムを提供しようとすることにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide an electronic component cooling apparatus having both a water-cooled and an air-cooled heat radiating unit with a heat generated from electronic components such as a thyristor and a power transistor. By transmitting heat directly to the radiating fins by conduction, and by transmitting the heat saturation of the radiating fins to the cooling water, the heat radiation efficiency is improved, and it is generated from electronic components even when applied to control equipment and communication equipment of machine tools. It is an object of the present invention to provide an electronic component cooling device and an electronic component cooling system capable of rapidly releasing a large amount of heat to the outside.
【０００６】[0006]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明の請求項１による電子部品冷却装置は、片
面に放熱フィンを有する熱伝導プレートと、熱伝導プレ
ートの他面に密着状に取り付けられかつ冷却水路用凹部
を有する冷却水路形成部材とを備えており、冷却水路形
成部材に、冷却水路用凹部の底面から熱伝導プレートに
接触する高さを有する熱伝導架橋部が、熱伝導プレート
と冷却水路形成部材との間に形成された冷却水路に囲ま
れるように設けられ、熱伝導プレートと反対側において
熱伝導架橋部に対応する冷却水路形成部材の壁面部分に
取り付けられた電子部品より生じた熱が、冷却水路形成
部材の熱伝導架橋部および熱伝導プレートを介して放熱
フィンに伝達されるようになされていることを特徴とし
ている。According to a first aspect of the present invention, there is provided an electronic component cooling apparatus comprising: a heat conductive plate having a heat dissipating fin on one surface; And a cooling water passage forming member having a cooling water passage concave portion, and a heat conducting bridge portion having a height contacting the heat conduction plate from the bottom surface of the cooling water passage concave portion to the cooling water passage forming member. The cooling water passage formed between the heat conduction plate and the cooling water passage forming member was provided so as to be surrounded by the cooling water passage, and attached to the wall surface portion of the cooling water passage forming member corresponding to the heat conduction bridge on the opposite side to the heat conduction plate. It is characterized in that heat generated from the electronic component is transmitted to the radiating fins through the heat conduction bridge portion of the cooling water channel forming member and the heat conduction plate.
【０００７】従って、電子部品より生じた熱は、放熱フ
ィンから外部に放出されるとともに、放熱フィンの熱飽
和分が、熱伝導架橋部を囲む水路の冷却水に吸収されて
外部に搬出されるようになされている。Therefore, the heat generated by the electronic components is radiated to the outside from the radiating fins, and the heat saturation of the radiating fins is absorbed by the cooling water in the water channel surrounding the heat conduction bridge, and is carried out to the outside. It has been made like that.
【０００８】また、請求項２の発明は、請求項１記載の
電子部品冷却装置において、熱伝導架橋部が、冷却水路
形成部材の素材と一体に形成されて、冷却水路形成部材
の冷却水路用凹部の底面から立上がり状に設けられてい
る。According to a second aspect of the present invention, in the electronic component cooling device according to the first aspect, the heat conduction bridging portion is formed integrally with the material of the cooling water channel forming member, and is used for the cooling water channel of the cooling water channel forming member. It is provided in a rising shape from the bottom surface of the concave portion.
【０００９】なお、熱伝導架橋部は、冷却水路形成部材
の素材とは別体に形成され、冷却水路形成部材の冷却水
路用凹部の底面の所定箇所に固定されていても良い。こ
の場合、熱伝導架橋部の固定手段としては、例えばろう
付けによる方法、あるいはまた冷却水路形成部材の冷却
水路用凹部の底面所定箇所に、熱伝導架橋部の嵌合凹所
を設けておき、該嵌合凹所に熱伝導架橋部の一部を嵌め
込んで固定する機械的方法などがある。The heat conduction bridge may be formed separately from the material of the cooling water channel forming member, and may be fixed to a predetermined location on the bottom surface of the cooling water channel forming recess of the cooling water channel forming member. In this case, as the fixing means of the heat conduction bridge portion, for example, a method by brazing, or alternatively, a fitting recess of the heat conduction bridge portion is provided at a predetermined position on the bottom surface of the cooling water passage concave portion of the cooling water passage forming member, There is a mechanical method of fitting a part of the heat conduction bridge portion into the fitting recess and fixing it.
【００１０】熱伝導架橋部は、熱伝導架橋部を囲む水路
の冷却水が流れやすいように、円柱状もしくは楕円柱状
の形状を有するものであるのが、好ましい。It is preferable that the heat conduction bridge has a columnar or elliptical column shape so that cooling water in a water channel surrounding the heat conduction bridge flows easily.
【００１１】冷却水路形成部材の熱伝導架橋部は、工作
機械の制御機器等の回路基板に取り付けられた電子部品
に対応する箇所に設けられているのが、好ましい。The heat conduction bridge of the cooling water channel forming member is preferably provided at a position corresponding to an electronic component mounted on a circuit board such as a control device of a machine tool.
【００１２】請求項６の発明は、請求項１記載の電子部
品冷却装置において、冷却水路形成部材の壁面に、熱伝
導性を有する熱拡散板（いわゆるスプレッダプレート）
を介して電子部品が取り付けられている。According to a sixth aspect of the present invention, in the electronic component cooling device of the first aspect, a heat diffusion plate having heat conductivity (so-called spreader plate) is provided on a wall surface of the cooling water passage forming member.
Electronic components are attached via the.
【００１３】また、請求項７の発明は、請求項１記載の
電子部品冷却装置において、放熱フィンが、波形フィン
よりなるとともに、横断面略コ形のフィンカバーによっ
て覆われて、フィンカバーと熱伝導プレートとによって
ダクトが形成され、ダクトの下端寄り部分に空冷ファン
が配置されて、空冷ファンからの風がダクト内の放熱フ
ィンに向かって吹き付けられるようになされている。According to a seventh aspect of the present invention, in the electronic component cooling device according to the first aspect, the radiating fin is formed of a corrugated fin and is covered by a fin cover having a substantially U-shaped cross section. A duct is formed by the conductive plate, and an air-cooling fan is arranged near the lower end of the duct so that wind from the air-cooling fan is blown toward radiation fins in the duct.
【００１４】さらに、請求項８による電子部品冷却シス
テムの発明は、密閉筺体の右側壁部に第１熱伝導プレー
トが取り付けられ、第１熱伝導プレートの外面に第１放
熱フィンが取り付けられ、同第１熱伝導プレートの内面
に冷却水路用凹部を有する第１冷却水路形成部材が密着
状に取り付けられて、熱伝導プレートと冷却水路形成部
材との間に第１冷却水路が形成され、第１冷却水路形成
部材に、冷却水路用凹部の底面から第１熱伝導プレート
に接触する高さを有する熱伝導架橋部が、熱伝導プレー
トと冷却水路形成部材との間に形成された冷却水路に囲
まれるように設けられ、第１熱伝導プレートと反対側に
おいて熱伝導架橋部に対応する冷却水路形成部材の壁面
部分に取り付けられた電子部品より生じた熱が、第１冷
却水路形成部材の熱伝導架橋部および第１熱伝導プレー
トを介して第１放熱フィンに伝達されるようになされ、
密閉筺体の左側壁部に第２熱伝導プレートが取り付けら
れ、第２熱伝導プレートの外面に第２放熱フィンが取り
付けられ、同第２熱伝導プレートの内面に冷却水路用凹
部を有する第２冷却水路形成部材が密着状に取り付けら
れて、熱伝導プレートと冷却水路形成部材との間に第２
冷却水路が形成され、第１冷却水路および第２冷却水路
の下端部同士が下部パイプを介して互いに連通せしめら
れるとともに、第１冷却水路および第２冷却水路の上端
部同士が上部パイプを介して互いに連通せしめられ、下
部パイプの長さの中間部分に水冷ポンプが介在させられ
ており、電子部品より生じた熱が、第１放熱フィンから
外部に放出されるとともに、その非除去分の熱が、熱伝
導架橋部を囲む第１冷却水路の冷却水に吸収され、水冷
ポンプの作動により、第１冷却水路内の冷却水が上部パ
イプを通って第２冷却水路へと流送され、そこで冷却水
の保有する熱が、第２放熱フィンから外部に放出され、
冷却された第２冷却水路内の冷却水が、水冷ポンプの作
動により、下部パイプを通って第１冷却水路へと循環す
るようになされていることを特徴としている。Further, in the electronic component cooling system according to the present invention, a first heat conduction plate is mounted on a right side wall portion of the closed casing, and a first radiating fin is mounted on an outer surface of the first heat conduction plate. A first cooling water passage forming member having a cooling water passage concave portion is closely attached to an inner surface of the first heat conduction plate, and a first cooling water passage is formed between the heat conduction plate and the cooling water passage forming member. The cooling water passage forming member has a heat conduction bridging portion having a height from the bottom surface of the cooling water passage recess to contact the first heat conduction plate surrounded by the cooling water passage formed between the heat conduction plate and the cooling water passage forming member. The heat generated from the electronic component attached to the wall portion of the cooling water passage forming member corresponding to the heat conduction bridge on the side opposite to the first heat conduction plate is provided by the first heat conduction plate. Is adapted to be transmitted to the first heat radiation fin via the conductive bridge portion and the first heat conduction plate,
A second cooling plate having a second heat conduction plate attached to a left side wall of the closed casing, a second radiating fin attached to an outer surface of the second heat conduction plate, and a cooling water channel recess on an inner surface of the second heat conduction plate. A water channel forming member is attached in close contact with the heat conductive plate and the cooling water channel forming member.
A cooling channel is formed, and lower ends of the first and second cooling channels are communicated with each other via a lower pipe, and upper ends of the first and second cooling channels are connected via an upper pipe. A water cooling pump is interposed in the middle part of the length of the lower pipe, and the heat generated from the electronic components is released from the first radiating fins to the outside, and the heat removed therefrom is removed. Is absorbed by the cooling water in the first cooling channel surrounding the heat conduction bridge, and the cooling water in the first cooling channel is sent to the second cooling channel through the upper pipe by the operation of the water cooling pump, where it is cooled. The heat of the water is released to the outside from the second radiating fin,
The cooling water in the cooled second cooling water passage is circulated to the first cooling water passage through the lower pipe by the operation of the water cooling pump.
【００１５】また、請求項９の発明は、請求項８記載の
電子部品冷却システムにおいて、第１放熱フィンが、波
形フィンよりなるとともに、横断面略コ形の第１フィン
カバーによって覆われて、第１フィンカバーと第１熱伝
導プレートと筺体右側壁部とによって第１ダクトが形成
され、第１ダクトの下端部に第１空冷ファンが配置され
て、第１空冷ファンからの風が第１ダクト内の放熱フィ
ンに向かって吹き付けられるようになされ、第２放熱フ
ィンが、波形フィンよりなるとともに、横断面略コ形の
第２フィンカバーによって覆われて、第２フィンカバー
と第２熱伝導プレートと筺体左側壁部とによって第２ダ
クトが形成され、第２ダクトの下端部に第２空冷ファン
が配置されて、第２空冷ファンからの風が第２ダクト内
の放熱フィンに向かって吹き付けられるようになされて
いる。According to a ninth aspect of the present invention, in the electronic component cooling system according to the eighth aspect, the first radiating fin is formed of a corrugated fin and is covered by a first fin cover having a substantially U-shaped cross section. A first duct is formed by the first fin cover, the first heat conduction plate, and the right side wall of the housing, and a first air-cooling fan is disposed at a lower end of the first duct. The second radiating fin is formed of a corrugated fin, and is covered by a second fin cover having a substantially U-shaped cross section. A second duct is formed by the plate and the left side wall of the housing, and a second air-cooling fan is arranged at a lower end of the second duct, and wind from the second air-cooling fan is directed to a radiation fin in the second duct. It has been made to be sprayed me.
【００１６】[0016]
【発明の実施の形態】つぎに、本発明の実施の形態を、
図面を参照して説明する。Next, an embodiment of the present invention will be described.
This will be described with reference to the drawings.
【００１７】この明細書において、左右および上下は、
図１を基準とし、左とは図１の左側、右とは同右側をい
ゝ、また前とは同図図面紙葉の表側、後とは同裏側をい
ゝ、また上とは同図の上側、下とは同下側をいうものと
する。In this specification, left and right and up and down
With reference to FIG. 1, the left means the left side of FIG. 1, the right means the same right side, the front means the front side of the drawing sheet, the rear means the same back side, and the upper means the same figure. Above and below mean the lower side.
【００１８】図１と図２は、本発明の電子部品冷却装置
および電子部品冷却システムの実施形態を示している。FIGS. 1 and 2 show an embodiment of an electronic component cooling apparatus and an electronic component cooling system according to the present invention.
【００１９】同図を参照すると、例えば工作機械の制御
機器の回路基板(9) に取り付けられたサイリスタやパワ
ートランジスタ等の電子部品（発熱素子）(8) は、工場
内の空気等により汚染されないようにするために、工場
の床(F) 上に設置された制御機器の縦型の密閉筺体(1)
内に収められている。本発明による電子部品冷却装置(1
0)は、これらの電子部品(8) を冷却するためのものであ
って、密閉筺体(1) の右側壁部(1a)および左側壁部(1b)
に備えられている。電子部品冷却装置(10)は、例えばア
ルミニウム（アルミニウム合金を含む）または銅（銅合
金を含む）などの熱伝導性の優れた材料によりつくられ
ている。Referring to FIG. 1, an electronic component (heating element) (8) such as a thyristor or a power transistor attached to a circuit board (9) of a control device of a machine tool is not contaminated by air or the like in a factory. The vertical sealed enclosure of the control equipment installed on the factory floor (F) (1)
Is housed inside. Electronic component cooling device (1
(0) is for cooling these electronic components (8), and the right side wall (1a) and the left side wall (1b) of the closed casing (1) are provided.
It is provided in. The electronic component cooling device (10) is made of a material having excellent thermal conductivity such as aluminum (including an aluminum alloy) or copper (including a copper alloy).
【００２０】本発明による電子部品冷却装置および電子
部品冷却システムにおいて、密閉筺体(1) の右側壁部(1
a)に第１熱伝導プレート(2) が取り付けられ、この第１
熱伝導プレート(2) の外面には、波形フィンよりなる第
１放熱フィン(11)が取り付けられ、同第１熱伝導プレー
ト(2) の内面には、冷却水路用凹部(4) を有する第１冷
却水路形成部材(3) が密着状に取り付けられて、熱伝導
プレート(2) と冷却水路形成部材(3) との間に第１冷却
水路(5) が形成されている。In the electronic component cooling device and the electronic component cooling system according to the present invention, the right side wall (1) of the closed casing (1) is provided.
a) a first heat conducting plate (2) is attached,
A first radiating fin (11) made of corrugated fins is attached to the outer surface of the heat conducting plate (2), and a first cooling fin (4) having a cooling water channel recess (4) is provided on the inner surface of the first heat conducting plate (2). The first cooling water channel forming member (3) is attached in a tight contact state, and a first cooling water channel (5) is formed between the heat conducting plate (2) and the cooling water channel forming member (3).
【００２１】第１冷却水路形成部材(3) に、冷却水路用
凹部(4) の底面から第１熱伝導プレート(2) に接触する
高さを有する熱伝導架橋部(6) が、熱伝導プレート(2)
と冷却水路形成部材(3) との間に形成された冷却水路
(5) に囲まれるように設けられている。そして、第１熱
伝導プレート(2) と反対側において熱伝導架橋部(6) に
対応する冷却水路形成部材(3) の壁面部分に取り付けら
れた電子部品（発熱素子）(8) より生じた熱が、第１冷
却水路形成部材(3) の熱伝導架橋部(6) および第１熱伝
導プレート(2) を介して第１放熱フィン(11)に伝達され
るようになされている。なお、この実施形態では、熱伝
導架橋部(6) を囲む水路(5) の冷却水が流れやすいよう
に、熱伝導架橋部(6) は略円柱状の形状を有していると
ともに、熱伝導架橋部(6) が、冷却水路形成部材(3) の
素材と一体に形成されて、冷却水路形成部材(3) の冷却
水路用凹部(4) の底面から立上がり状に設けられてい
る。The first cooling water channel forming member (3) is provided with a heat conductive bridge (6) having a height from the bottom of the cooling water channel recess (4) to contact the first heat conductive plate (2). Plate (2)
Cooling water passage formed between the cooling water passage forming member and the cooling water passage forming member (3)
It is provided so as to be surrounded by (5). The electronic component (heating element) (8) attached to the wall of the cooling water channel forming member (3) corresponding to the heat conduction bridge (6) on the side opposite to the first heat conduction plate (2). Heat is transmitted to the first radiating fins (11) via the heat conductive bridge (6) of the first cooling water channel forming member (3) and the first heat conductive plate (2). In this embodiment, the heat conducting bridge (6) has a substantially columnar shape so that the cooling water in the water channel (5) surrounding the heat conducting bridge (6) flows easily. The conductive bridging portion (6) is formed integrally with the material of the cooling water channel forming member (3) and is provided so as to rise from the bottom surface of the cooling water channel concave portion (4) of the cooling water channel forming member (3).
【００２２】このような冷却水路形成部材(3) の熱伝導
架橋部(6) は、工作機械の制御機器等の回路基板(9) に
取り付けられた電子部品(8) に対応する箇所に設けられ
ているものである。The heat conduction bridge portion (6) of the cooling water channel forming member (3) is provided at a position corresponding to an electronic component (8) mounted on a circuit board (9) such as a control device of a machine tool. It is what is being done.
【００２３】さらに、この実施形態では、制御機器の回
路基板(9) に取り付けられた電子部品(8) が、冷却水路
形成部材(3) の所定の壁面部分に熱伝導性の高い正面よ
りみて方形の金属製熱拡散板（スプレッダプレート）(1
6)を介して取り付けられている。Further, in this embodiment, the electronic component (8) mounted on the circuit board (9) of the control device is provided on a predetermined wall portion of the cooling water channel forming member (3) when viewed from the front having high thermal conductivity. Square metal heat spreader (spreader plate) (1
6) is mounted via.
【００２４】また、図２に詳しく示すように、第１冷却
水路(5) 内は、冷却水路用凹部(4)の底面から第１熱伝
導プレート(2) に接触する高さを有する垂直状および水
平状の水流規制兼熱伝導架橋用凸条(7) によって流路が
分かれており、かつ熱伝導架橋部(6) を囲むように環状
流路部が形成されている。また、第１冷却水路形成部材
(3) の下端部の一側縁部に冷却水導入用開口部(15)が設
けられている。As shown in detail in FIG. 2, the inside of the first cooling water passage (5) has a vertical shape having a height from the bottom surface of the cooling water passage recess (4) to contact the first heat conduction plate (2). In addition, the flow path is divided by a ridge (7) for horizontal water flow regulation and heat conduction cross-linking, and an annular flow path is formed so as to surround the heat conduction cross-linking section (6). Also, a first cooling channel forming member
An opening (15) for introducing cooling water is provided at one side edge of the lower end of (3).
【００２５】上記第１熱伝導プレート(2) の外面に取り
付けられた波形フィンよりなる第１放熱フィン(11)は、
横断面略コ形のフィンカバー(12)によって覆われてお
り、第１放熱フィン(11)の曲面状の右側縁部は、フィン
カバー(12)の右側壁(12a) の内面に接合され、フィンカ
バー(12)の前後両側壁部(12b)(12b)の側縁部は、密閉筺
体(1) の右側壁部(1a)に接合されていて、フィンカバー
(12)と、熱伝導プレート(2) と、筺体右側壁部(1a)との
間に第１ダクト(13)が形成されている。この第１ダクト
(13)の下端部には、第１空冷ファン(14)が配置され、第
１空冷ファン(14)からの上向きの風が第１放熱フィン(1
1)に向かって吹き付けられるようになされている。The first radiating fins (11) formed of corrugated fins attached to the outer surface of the first heat conducting plate (2) are:
The right side edge of the curved surface of the first radiating fin (11) is joined to the inner surface of the right side wall (12a) of the fin cover (12), and is covered by a fin cover (12) having a substantially U-shaped cross section. The side edges of the front and rear side walls (12b) and (12b) of the fin cover (12) are joined to the right side wall (1a) of the sealed housing (1),
A first duct (13) is formed between (12), the heat conduction plate (2), and the right side wall (1a) of the housing. This first duct
At the lower end of (13), a first air-cooling fan (14) is disposed, and upward wind from the first air-cooling fan (14) is supplied to the first radiation fin (1).
It is made to be sprayed toward 1).
【００２６】一方、密閉筺体(1) の左側壁部(1b)に第２
熱伝導プレート(22)が取り付けられ、この第２熱伝導プ
レート(22)の外面には、波形フィンよりなる第２放熱フ
ィン(31)が取り付けられ、同第２熱伝導プレート(22)の
内面には、冷却水路用凹部(24)を有する第２冷却水路形
成部材(23) が密着状に取り付けられて、熱伝導プレー
ト(22)と冷却水路形成部材(23)との間に第２冷却水路(2
5)が形成されている。On the other hand, the second wall is provided on the left side wall (1b) of the closed casing (1).
A heat conducting plate (22) is attached, and a second heat radiating fin (31) made of corrugated fins is attached to an outer surface of the second heat conducting plate (22). A second cooling water channel forming member (23) having a cooling water channel concave portion (24) is attached in close contact with the second cooling water channel forming member (23), and a second cooling water channel forming member (23) is provided between the heat conduction plate (22) and the cooling water channel forming member (23). Waterway (2
5) is formed.
【００２７】上記第２熱伝導プレート(22)の外面に取り
付けられた波形フィンよりなる第２放熱フィン(31)は横
断面略コ形のフィンカバー(32)によって覆われており、
第２放熱フィン(31)の曲面状の左側縁部は、フィンカバ
ー(32)の左側壁(32a) の内面に接合され、フィンカバー
(32)の前後両側壁部(32b)(32b)の側縁部は、密閉筺体
(1) の左側壁部(1b)に接合されていて、フィンカバー(3
2)と、熱伝導プレート(22)と、筺体左側壁部(1b)との間
に第２ダクト(33)が形成されている。この第２ダクト(3
3)の下端部には、第２空冷ファン(34)が配置され、第２
空冷ファン(34)からの上向きの風が第２放熱フィン(31)
に向かって吹き付けられるようになされている。A second radiating fin (31) composed of a corrugated fin attached to the outer surface of the second heat conductive plate (22) is covered by a fin cover (32) having a substantially U-shaped cross section.
The curved left edge of the second radiating fin (31) is joined to the inner surface of the left wall (32a) of the fin cover (32).
The side edges of the front and rear side walls (32b) and (32b) of (32) are sealed enclosures.
(1) is joined to the left side wall (1b), and the fin cover (3
A second duct (33) is formed between 2), the heat conduction plate (22), and the left wall portion (1b) of the housing. This second duct (3
At the lower end of (3), a second air-cooling fan (34) is arranged.
The upward wind from the air-cooling fan (34) generates the second radiating fin (31).
It is made to be sprayed toward.
【００２８】また、密閉筺体(1) 内の下端部において、
第１冷却水路形成部材(3) の下端部と第２冷却水路形成
部材(23)の下端部とが下部パイプ(26)によって連結され
て、第１冷却水路(5) および第２冷却水路(25)の下端部
同士がこの下部パイプ(26)を介して互いに連通せしめら
れるとともに、下部パイプ(26)の長さの中間部分に水冷
ポンプ(20)が介在させられている。これに対し、密閉筺
体(1) 内の上端部において、第１冷却水路形成部材(3)
の上端部と第２冷却水路形成部材(23)の上端部とが上部
パイプ(27)によって連結されて、第１冷却水路(5) およ
び第２冷却水路(25)の上端部同士がこの上部パイプ(27)
を介して互いに連通せしめられている。Further, at the lower end in the closed casing (1),
The lower end of the first cooling channel forming member (3) and the lower end of the second cooling channel forming member (23) are connected by a lower pipe (26), and the first cooling channel (5) and the second cooling channel ( The lower ends of 25) are communicated with each other via the lower pipe (26), and a water cooling pump (20) is interposed at an intermediate portion of the length of the lower pipe (26). On the other hand, at the upper end of the closed casing (1), the first cooling water channel forming member (3)
The upper end of the first cooling water passage (5) and the upper end of the second cooling water passage (25) are connected to each other by an upper pipe (27). Pipe (27)
Are communicated with each other via the.
【００２９】上記電子部品冷却装置および電子部品冷却
システムにおいて、工作機械の密閉筺体(1) 内に収めら
れた制御機器に取り付けられたサイリスタやパワートラ
ンジスタ等の電子部品（発熱素子）(8) から生じた熱
は、第１冷却水路形成部材(3)の熱伝導架橋部(6) およ
び第１熱伝導プレート(2) を介して第１放熱フィン(11)
に直に伝達されて、第１放熱フィン(11)から外部に放出
され、第１放熱フィン(11)に予定している冷却能力を発
揮させることができるようになされている。そして、第
１空冷ファン(14)の作動によって空冷ファン周辺の大気
が第１ダクト(13)を通って、これの内部の第１放熱フィ
ン(11)に向けて吹き付けられ、空気は一方向に流速の大
きい状態で流れることができるために、高い効率で冷却
することができる。In the above electronic component cooling apparatus and electronic component cooling system, the electronic components (heat generating elements) (8) such as thyristors and power transistors attached to the control device housed in the closed casing (1) of the machine tool. The generated heat is transferred to the first radiating fin (11) through the heat conduction bridge (6) of the first cooling water channel forming member (3) and the first heat conduction plate (2).
The heat is directly transmitted to the radiating fins (11) and is emitted to the outside, so that the first radiating fins (11) can exhibit a predetermined cooling capacity. Then, by the operation of the first air-cooling fan (14), the air around the air-cooling fan passes through the first duct (13) and is blown toward the first radiating fins (11) inside the first duct, and the air flows in one direction. Since it can flow at a high flow rate, it can be cooled with high efficiency.
【００３０】従って、電子部品(8) より生じた熱は、第
１放熱フィン(11)から外部に放出されるとともに、非除
去分の熱、換言すれば放熱フィン(11)の熱飽和分を冷却
水に伝えるために、熱伝導架橋部(6) が第１冷却水路
(5) 内の環状水路の水流により囲まれているとともに、
冷却水流方向が規制されることにより、上記熱飽和分
が、熱伝導架橋部(6) を囲む水路(5) の冷却水に吸収さ
れて外部に搬出されるようになされており、従って、空
冷および水冷の双方により冷却されるため、放熱効率を
向上することができるものである。Therefore, the heat generated from the electronic component (8) is radiated to the outside from the first radiating fin (11), and the heat not removed, in other words, the heat saturation of the radiating fin (11) is reduced. The heat conduction bridge (6) is connected to the first cooling channel to transmit to the cooling water.
(5) While being surrounded by the water current of the annular canal inside,
By restricting the flow direction of the cooling water, the above-mentioned heat saturation is absorbed by the cooling water in the water channel (5) surrounding the heat conduction bridge (6) and is carried out to the outside. Since the cooling is performed by both the water cooling and the water cooling, the heat radiation efficiency can be improved.
【００３１】また、この実施形態では、電子部品（発熱
素子）(8) が、比較的表面積の広い熱伝導性の高い熱拡
散板（スプレッダプレート）(16)を介して冷却水路形成
部材(3) に取り付けられている。このように、電子部品
(8) から発生する熱を、高い熱伝導性を有しかつ広い面
積のアルミニウム製または銅製熱拡散板（スプレッダプ
レート）(16)により拡散させられるため、さらに高い冷
却効率を得ることができる。In this embodiment, the electronic component (heating element) (8) is connected to the cooling water channel forming member (3) via a heat diffusion plate (spreader plate) (16) having a relatively large surface area and high thermal conductivity. ). Thus, electronic components
The heat generated from (8) is diffused by the aluminum or copper heat spreader (spreader plate) (16) having high thermal conductivity and a large area, so that higher cooling efficiency can be obtained.
【００３２】さらに、この実施形態においては、第１冷
却水路(5) 内の冷却水は、下部パイプ(26)の長さの中間
部分に介在させられた水冷ポンプ(20)の作動により、第
１冷却水路(5) の上端部および第２冷却水路(25)の上端
部同士を連通する上部パイプ(27)を通って、密閉筺体
(1) の左側壁部(1b)に設けられた第２冷却水路(25)へと
流送され、そこで、冷却水の保有する熱は、第２熱伝導
プレート(22)およびこれの外面に取り付けられた波形フ
ィンよりなる第２放熱フィン(31)に伝達されて、第２放
熱フィン(31)から外部に放出されるとともに、第２空冷
ファン(34)の作動によって空冷ファン周辺の大気が第２
ダクト(33)を通って、これの内部の第２放熱フィン(31)
に向けて吹き付けられ、空気は一方向に流速の大きい状
態で流れることができるために、高い効率で冷却するこ
とができる。Further, in this embodiment, the cooling water in the first cooling water passage (5) is supplied to the second cooling water passage (5) by the operation of the water cooling pump (20) interposed in the middle portion of the length of the lower pipe (26). A closed casing is passed through an upper pipe (27) which communicates the upper end of the cooling water channel (5) and the upper end of the second cooling water channel (25).
(1) is sent to a second cooling water passage (25) provided on the left side wall (1b), where the heat of the cooling water is transferred to the second heat conduction plate (22) and the outer surface thereof. It is transmitted to the second radiating fin (31) composed of the attached wave-shaped fins and is released from the second radiating fin (31) to the outside, and the air around the air-cooling fan is released by the operation of the second air-cooling fan (34). Second
Through the duct (33), the second radiating fin (31) inside it
, And the air can flow at a high flow rate in one direction, so that it can be cooled with high efficiency.
【００３３】こうして、第２冷却水路(25)内において冷
却された冷却水は、水冷ポンプ(20)の作動により、第２
冷却水路(25)の下端部および第１冷却水路(5) の下端部
同士を連通する下部パイプ(26)を通って、密閉筺体(1)
の右側壁部(1a)の第１冷却水路(5) へと循環するもので
ある。このように、本発明の電子部品冷却装置および電
子部品冷却システムによれば、水冷ポンプ(20)および空
冷ファン(14)(34)の組み合わせによる作用により、熱の
放散効率が極めて高く、狭い部所での部品の冷却にすぐ
れた効果を発揮することができる。The cooling water cooled in the second cooling water passage (25) is supplied to the second cooling water passage (25) by the operation of the water cooling pump (20).
The closed casing (1) passes through a lower pipe (26) communicating the lower end of the cooling water channel (25) and the lower end of the first cooling water channel (5).
And circulates to the first cooling water channel (5) of the right side wall (1a). As described above, according to the electronic component cooling device and the electronic component cooling system of the present invention, the action of the combination of the water-cooling pump (20) and the air-cooling fans (14) and (34) has extremely high heat dissipation efficiency and narrow portions. It is possible to exert an excellent effect for cooling parts at a place.
【００３４】なお、上記実施形態において、電子部品冷
却装置および電子部品冷却システムの第１および第２冷
却水路(5)(25) 内に空気が入ると、水冷ポンプ(20)が破
損するおそれがあるので、冷却水路(5)(25) 内は水が満
液状態となされている。In the above embodiment, if air enters the first and second cooling water passages (5) and (25) of the electronic component cooling device and the electronic component cooling system, the water cooling pump (20) may be damaged. Therefore, the cooling water channels (5) and (25) are filled with water.
【００３５】また、上記実施形態においては、制御機器
の電子部品(8) が収められている密閉筺体(1) が縦型で
あるが、これは横型であっても、勿論良い。In the above embodiment, the closed casing (1) in which the electronic components (8) of the control device are accommodated is of a vertical type. However, it may be of course a horizontal type.
【００３６】上記の本発明の電子部品冷却装置および電
子部品冷却システムによれば、水冷および空冷の双方の
放熱ユニットを有しており、放熱フィン(11)に予定して
いる冷却能力を発揮させるために、電子部品（発熱素
子）(8) が当接するべき冷却水路形成部材(3) の所定の
壁部分に熱伝導架橋部(6) が設けられ、さらにその外部
に放熱フィン(11)が配置されて、電子部品（発熱素子）
(8) から生じた熱が、熱伝導架橋部(6) および熱伝導プ
レート(2) を介して放熱フィン(11)に直に伝えられると
ともに、非除去分の熱、換言すれば放熱フィン(11)の熱
飽和分を冷却水に伝えるために、熱伝導架橋部(6) 周辺
に水路(5) が設けられ、さらに冷却水流方向を規制する
ことにより、熱伝導架橋部(6) が水流で囲まれており、
従って、電子部品(8) より生じた熱は、放熱フィン(11)
から外部に放出されるとともに、放熱フィン(11)の熱飽
和分が、熱伝導架橋部(6) を囲む水路の冷却水に吸収さ
れて外部に搬出され、放熱効率を大幅に向上させること
ができて、例えば工作機械の制御機器、通信機器等の電
子部品の冷却装置として最適に使用することができるも
のである。According to the electronic component cooling device and the electronic component cooling system of the present invention described above, both the water-cooled and air-cooled heat radiating units are provided, and the radiating fins (11) exhibit the predetermined cooling capacity. For this purpose, a heat conducting bridge (6) is provided at a predetermined wall portion of the cooling water channel forming member (3) with which the electronic component (heating element) (8) is to come into contact, and a radiating fin (11) is provided outside the heat conducting bridge. Electronic components (heating elements) arranged
The heat generated from (8) is directly transmitted to the radiating fins (11) through the heat conducting bridge (6) and the heat conducting plate (2), and the heat not removed, in other words, the radiating fins (11) A water channel (5) is provided around the heat conduction bridge (6) to transmit the heat saturation of (11) to the cooling water, and by regulating the flow direction of the cooling water, the heat conduction bridge (6) Surrounded by
Therefore, the heat generated by the electronic component (8) is
From the fins (11), and the thermal saturation of the radiating fins (11) is absorbed by the cooling water in the water channel surrounding the heat conduction bridge (6) and is carried out to the outside, greatly improving the heat radiation efficiency. It can be optimally used as a cooling device for electronic components such as control devices of machine tools and communication devices.
【００３７】なお、上記実施形態においては、熱伝導架
橋部(6) が、冷却水路形成部材(3)の素材と一体に形成
されているが、熱伝導架橋部(6) は、冷却水路形成部材
(3)の素材とは別体に形成されて、冷却水路形成部材(3)
の冷却水路用凹部(4) の底面の所定箇所に固定されて
いても良い。この場合、熱伝導架橋部(6) の固定手段と
しては、例えばろう付けによる方法、あるいはまた冷却
水路形成部材(3) の冷却水路用凹部(4) の底面所定箇所
に、熱伝導架橋部(6) の嵌合凹所（図示略）を設けてお
き、該嵌合凹所に熱伝導架橋部(6) の一部を嵌め込んで
固定する機械的方法などがある。In the above embodiment, the heat conducting bridge (6) is formed integrally with the material of the cooling water channel forming member (3). Element
Formed separately from the material of (3), the cooling water channel forming member (3)
May be fixed to a predetermined location on the bottom surface of the cooling water channel recess (4). In this case, the means for fixing the heat conduction bridge (6) may be, for example, a brazing method, or may be provided at a predetermined position on the bottom surface of the cooling water passage recess (4) of the cooling water passage forming member (3). There is a mechanical method in which a fitting recess (not shown) of 6) is provided, and a part of the heat conduction bridging portion (6) is fitted and fixed in the fitting recess.
【００３８】また、上記実施形態では、熱伝導架橋部
(6) は、これを囲む水路(5) の冷却水が流れやすいよう
に、熱伝導架橋部(6) は円柱状の形状を有しているが、
熱伝導架橋部(6) は楕円柱状の形状を有するものであっ
ても良い。Further, in the above embodiment, the heat conductive cross-linking portion
In (6), the heat conducting bridge (6) has a columnar shape so that the cooling water in the water channel (5) surrounding it can flow easily.
The heat conductive bridge (6) may have an elliptical column shape.
【００３９】さらに、上記実施形態では、第１冷却水路
(5) 内が、垂直状および水平状に配置された水流規制兼
熱伝導架橋用凸条(7) によって流路が分けられている
が、水流規制兼熱伝導架橋用凸条(7) は、斜めに配置さ
れたものであっても、勿論良い。Further, in the above embodiment, the first cooling water passage
(5) The flow path is divided by water flow regulation and heat conduction cross-linking ridges (7) arranged vertically and horizontally, but the water flow regulation and heat conduction cross-linking ridges (7) are Of course, even if they are arranged diagonally, they are good.
【００４０】なお、本発明による電子部品冷却装置は、
工作機械の制御機器、通信機器等の電子部品(8) の冷却
装置として最適に使用することができる他、パソコンの
電子部品の冷却装置にも、同様に適用可能である。The electronic component cooling device according to the present invention is
It can be optimally used as a cooling device for electronic components (8) such as control devices of machine tools and communication devices, and is similarly applicable to a cooling device for electronic components of personal computers.
【００４１】[0041]
【発明の効果】本発明の請求項１記載の電子部品冷却装
置は、上述のように、片面に放熱フィンを有する熱伝導
プレートと、熱伝導プレートの他面に密着状に取り付け
られかつ冷却水路用凹部を有する冷却水路形成部材とを
備えており、冷却水路形成部材に、冷却水路用凹部の底
面から熱伝導プレートに接触する高さを有する熱伝導架
橋部が、熱伝導プレートと冷却水路形成部材との間に形
成された冷却水路に囲まれるように設けられ、熱伝導プ
レートと反対側において熱伝導架橋部に対応する冷却水
路形成部材の壁面部分に取り付けられた電子部品より生
じた熱が、冷却水路形成部材の熱伝導架橋部および熱伝
導プレートを介して放熱フィンに伝達されるようになさ
れているもので、本発明によれば、水冷および空冷の双
方の放熱ユニットを有する電子部品冷却装置について、
サイリスタやパワートランジスタ等の電子部品から生じ
た熱を、熱伝導により放熱フィンに直に伝えるととも
に、放熱フィンの熱飽和分を冷却水に伝えることによ
り、空冷および水冷の双方により冷却されるため、放熱
効率が向上し、工作機械の制御機器・通信機器等に適用
した場合にも、電子部品から発生する大きな熱量を外部
へ速やかに放出することができ、ひいては工作機械の制
御機器・通信機器等の小型化および薄型化、さらにはそ
の中で機器動作の安定性の保持の要望に応えることがで
きるという効果を奏する。As described above, the electronic component cooling device according to the first aspect of the present invention has a heat conduction plate having heat radiation fins on one surface, and a cooling water passage which is attached in close contact with the other surface of the heat conduction plate. A cooling water passage forming member having a recess for the cooling water passage, wherein the cooling water passage forming member has a heat conductive bridge portion having a height from the bottom of the cooling water passage concave portion to contact the heat conduction plate. The heat generated from the electronic components attached to the wall portion of the cooling water passage forming member corresponding to the heat conduction bridge portion on the opposite side to the heat conduction plate is provided so as to be surrounded by the cooling water passage formed between the member and the heat conduction plate. According to the present invention, both the water-cooled and the air-cooled heat-dissipating units are transmitted to the heat-dissipating fins through the heat-conducting bridge portion and the heat-conducting plate of the cooling water passage forming member. For electronic component cooling apparatus having,
Heat generated from electronic components such as thyristors and power transistors is directly transmitted to the radiating fins by heat conduction, and the heat saturation of the radiating fins is transmitted to the cooling water to be cooled by both air cooling and water cooling. Improved heat dissipation efficiency, even when applied to machine tool control equipment and communication equipment, etc., can quickly release a large amount of heat generated from electronic components to the outside, and consequently control equipment and communication equipment for machine tools This has the effect of being able to meet the demand for miniaturization and thinning of the device, as well as for maintaining the stability of device operation.
【００４２】また、本発明の請求項６記載の電子部品冷
却装置は、上述のように、冷却水路形成部材の壁面に、
熱伝導性を有する熱拡散板（いわゆるスプレッダプレー
ト）を介して電子部品が取り付けられているものである
から、電子部品（発熱素子）から生じた熱を、高い熱伝
導性を有しかつ広い面積の熱拡散板（スプレッダプレー
ト）により拡散させられるため、さらに高い冷却効率を
得ることができるという効果を奏する。Further, according to the electronic component cooling device of the present invention, as described above, the wall of the cooling water channel forming member
Since the electronic component is mounted via a heat diffusion plate having thermal conductivity (a so-called spreader plate), heat generated from the electronic component (heating element) can be transferred to a wide area having high thermal conductivity. Is diffused by the heat spreader plate (spreader plate), so that higher cooling efficiency can be obtained.
【００４３】本発明の請求項８記載の電子部品冷却シス
テムは、上述のように、密閉筺体の右側壁部に第１熱伝
導プレートが取り付けられ、第１熱伝導プレートの外面
に第１放熱フィンが取り付けられ、同第１熱伝導プレー
トの内面に冷却水路用凹部を有する第１冷却水路形成部
材が密着状に取り付けられて、熱伝導プレートと冷却水
路形成部材との間に第１冷却水路が形成され、第１冷却
水路形成部材に、冷却水路用凹部の底面から第１熱伝導
プレートに接触する高さを有する熱伝導架橋部が、熱伝
導プレートと冷却水路形成部材との間に形成された冷却
水路に囲まれるように設けられ、第１熱伝導プレートと
反対側において熱伝導架橋部に対応する冷却水路形成部
材の壁面部分に取り付けられた電子部品より生じた熱
が、第１冷却水路形成部材の熱伝導架橋部および第１熱
伝導プレートを介して第１放熱フィンに伝達されるよう
になされ、密閉筺体の左側壁部に第２熱伝導プレートが
取り付けられ、第２熱伝導プレートの外面に第２放熱フ
ィンが取り付けられ、同第２熱伝導プレートの内面に冷
却水路用凹部を有する第２冷却水路形成部材が密着状に
取り付けられて、熱伝導プレートと冷却水路形成部材と
の間に第２冷却水路が形成され、第１冷却水路および第
２冷却水路の下端部同士が下部パイプを介して互いに連
通せしめられるとともに、第１冷却水路および第２冷却
水路の上端部同士が上部パイプを介して互いに連通せし
められ、下部パイプの長さの中間部分に水冷ポンプが介
在させられており、電子部品より生じた熱が、第１放熱
フィンから外部に放出されるとともに、その非除去分の
熱が、熱伝導架橋部を囲む第１冷却水路の冷却水に吸収
され、水冷ポンプの作動により、第１冷却水路内の冷却
水が上部パイプを通って第２冷却水路へと流送され、そ
こで冷却水の保有する熱が、第２放熱フィンから外部に
放出され、冷却された第２冷却水路内の冷却水が、水冷
ポンプの作動により、下部パイプを通って第１冷却水路
へと循環するようになされているもので、本発明によれ
ば、水冷および空冷の双方の放熱ユニットを有する電子
部品冷却システムについて、サイリスタやパワートラン
ジスタ等の電子部品から生じた熱を、熱伝導により第１
放熱フィンに直に伝えるとともに、第１放熱フィンの熱
飽和分を第１冷却水路の冷却水に伝え、水冷ポンプの作
動により、第１冷却水路内の冷却水を、さらに第２冷却
水路へと流送して、そこで冷却水の保有する熱を第２放
熱フィンに伝えて、外部に放出し、冷却後の第２冷却水
路内の冷却水を第１冷却水路へと循環させるものである
から、放熱効率がより一層向上し、工作機械の制御機器
・通信機器等に適用した場合にも、電子部品から発生す
る大きな熱量を外部へきわめて速やかに放出することが
でき、ひいては工作機械の制御機器・通信機器等の小型
化および薄型化、さらにはその中で機器動作の安定性の
保持の要望に応えることができるという顕著な効果を奏
する。As described above, in the electronic component cooling system according to the present invention, the first heat conduction plate is attached to the right side wall of the closed casing, and the first heat radiation fin is provided on the outer surface of the first heat conduction plate. Is attached, and a first cooling water channel forming member having a cooling water channel concave portion is closely attached to an inner surface of the first heat conductive plate, and a first cooling water channel is provided between the heat conductive plate and the cooling water channel forming member. The first cooling water channel forming member is formed with a heat conductive bridging portion having a height from the bottom surface of the cooling water channel concave portion and in contact with the first heat conductive plate, between the heat conductive plate and the cooling water channel forming member. Generated from the electronic component attached to the wall portion of the cooling water channel forming member corresponding to the heat conduction bridge on the side opposite to the first heat conduction plate, the heat being generated by the first cooling water channel. form The first heat dissipation fin is transmitted to the first heat dissipation fin through the heat conduction bridge portion of the member and the first heat conduction plate, the second heat conduction plate is attached to the left side wall of the closed casing, and the outer surface of the second heat conduction plate A second cooling water passage forming member having a cooling water passage recess on the inner surface of the second heat conduction plate, and a second cooling water passage forming member attached in close contact with the second heat conduction plate; A second cooling channel is formed, and lower ends of the first cooling channel and the second cooling channel are connected to each other via a lower pipe, and upper ends of the first cooling channel and the second cooling channel are connected to an upper pipe. And a water-cooled pump is interposed in the middle part of the length of the lower pipe, so that the heat generated from the electronic components is released from the first radiating fins to the outside. The heat of the non-removed portion is absorbed by the cooling water in the first cooling channel surrounding the heat conduction bridge, and the cooling water in the first cooling channel is passed through the upper pipe to the second cooling channel by the operation of the water cooling pump. The heat held by the cooling water is released from the second radiating fins to the outside, and the cooled cooling water in the second cooling water passage is passed through the first pipe through the lower pipe by the operation of the water cooling pump. According to the present invention, for an electronic component cooling system having both water-cooled and air-cooled heat radiating units, heat generated from electronic components such as a thyristor and a power transistor is provided. First by heat conduction
The cooling water in the first cooling channel is further transferred to the second cooling channel by operating the water-cooling pump, while transmitting the heat saturation of the first radiating fin directly to the cooling water in the first cooling channel. Since the heat is transferred to the second cooling fin, the heat of the cooling water is transmitted to the second radiating fins and released to the outside, and the cooling water in the second cooling water passage after cooling is circulated to the first cooling water passage. The heat dissipation efficiency is further improved, and even when applied to machine tool control equipment and communication equipment, the large amount of heat generated from electronic components can be released to the outside very quickly, and as a result, machine tool control equipment -It has a remarkable effect that it is possible to meet the demand for miniaturization and thinning of communication devices and the like, and to maintain the stability of device operation among them.
【図１】本発明の実施形態を示す電子部品冷却装置およ
び電子部品冷却システムの概略縦断面である。FIG. 1 is a schematic longitudinal sectional view of an electronic component cooling device and an electronic component cooling system according to an embodiment of the present invention.
【図２】同電子部品冷却装置の要部分解斜視図である。FIG. 2 is an exploded perspective view of a main part of the electronic component cooling device.
【符号の説明】 １ 密閉筺体 １ａ 右側壁部 １ｂ 左側壁部 ２ 第１熱伝導プレート（熱伝導プレート） ３ 第１冷却水路形成部材（冷却水路形成部材） ４ 冷却水路用凹部 ５ 第１冷却水路（冷却水路） ６ 熱伝導架橋部 ７ 水流規制兼熱伝導架橋用凸条 ８ 電子部品 ９ 回路基板 １０ 電子部品冷却装置 １１ 第１放熱フィン（放熱フィン） １２ 横断面略コ形のフィンカバー １３ 第１ダクト １４ 第１空冷ファン（空冷ファン） １６ 熱拡散板（スプレッダプレート） ２０ 水冷ポンプ ２２ 第２熱伝導プレート ２３ 第２冷却水路形成部材 ２４ 冷却水路用凹部 ２５ 第２冷却水路 ２６ 下部パイプ ２７ 上部パイプ ３１ 第１放熱フィン（放熱フィン） ３２ 横断面略コ形のフィンカバー ３３ 第２ダクト ３４ 第２空冷ファン（空冷ファン）[Description of Signs] 1 Closed enclosure 1a Right side wall 1b Left side wall 2 First heat conduction plate (heat conduction plate) 3 First cooling water channel forming member (Cooling water channel forming member) 4 Cooling water channel concave portion 5 First cooling water channel (Cooling water channel) 6 Heat conduction bridge section 7 Convex ridge for water flow regulation and heat conduction crosslinking 8 Electronic component 9 Circuit board 10 Electronic component cooling device 11 First radiating fin (radiating fin) 12 Fin cover with approximately U-shaped cross section 13 1 duct 14 first air cooling fan (air cooling fan) 16 heat diffusion plate (spreader plate) 20 water cooling pump 22 second heat conduction plate 23 second cooling water channel forming member 24 concave portion for cooling water channel 25 second cooling water channel 26 lower pipe 27 upper portion Pipe 31 First radiating fin (radiating fin) 32 Fin cover with approximately U-shaped cross section 33 Second duct 34 Second air cooling fan (air cooling fan)
Claims (9)
トと、熱伝導プレートの他面に密着状に取り付けられか
つ冷却水路用凹部を有する冷却水路形成部材とを備えて
おり、冷却水路形成部材に、冷却水路用凹部の底面から
熱伝導プレートに接触する高さを有する熱伝導架橋部
が、熱伝導プレートと冷却水路形成部材との間に形成さ
れた冷却水路に囲まれるように設けられ、熱伝導プレー
トと反対側において熱伝導架橋部に対応する冷却水路形
成部材の壁面部分に取り付けられた電子部品より生じた
熱が、冷却水路形成部材の熱伝導架橋部および熱伝導プ
レートを介して放熱フィンに伝達されるようになされて
いる、電子部品冷却装置。1. A cooling water passage forming member, comprising: a heat conducting plate having a radiation fin on one surface; and a cooling water passage forming member attached to the other surface of the heat conducting plate in close contact with the cooling water passage concave portion. A heat conducting bridge having a height from the bottom surface of the cooling water passage recess to be in contact with the heat conducting plate is provided so as to be surrounded by a cooling water passage formed between the heat conducting plate and the cooling water passage forming member; The heat generated by the electronic components attached to the wall portion of the cooling water channel forming member corresponding to the heat conductive bridging portion on the side opposite to the conductive plate generates heat radiation fins through the heat conductive bridging portion of the cooling water channel forming member and the heat conductive plate. Electronic component cooling device that is adapted to be transmitted to
材と一体に形成されて、冷却水路形成部材の冷却水路用
凹部の底面から立上がり状に設けられている、請求項１
記載の電子部品冷却装置。2. The cooling water passage forming member is formed integrally with the material of the cooling water passage forming member and is provided so as to rise from the bottom surface of the cooling water passage concave portion of the cooling water passage forming member.
An electronic component cooling device according to claim 1.
材とは別体に形成され、冷却水路形成部材の冷却水路用
凹部の底面の所定箇所に固定されている、請求項１記載
の電子部品冷却装置。3. The cooling water passage forming member according to claim 1, wherein the heat conduction bridge portion is formed separately from the material of the cooling water passage forming member, and is fixed at a predetermined position on the bottom surface of the cooling water passage forming recess of the cooling water passage forming member. Electronic component cooling device.
状の形状を有するものである、請求項１〜３のうちのい
ずれか一項記載の電子部品冷却装置。4. The electronic component cooling device according to claim 1, wherein the heat conductive bridge has a cylindrical or elliptical column shape.
作機械の制御機器等の基板に取り付けられた電子部品に
対応する箇所に設けられている、請求項１〜４のうちの
いずれか一項記載の電子部品冷却装置。5. The cooling water passage forming member according to claim 1, wherein the heat conduction bridge portion is provided at a position corresponding to an electronic component mounted on a substrate such as a control device of a machine tool. An electronic component cooling device according to claim 1.
有する熱拡散板を介して電子部品が取り付けられてい
る、請求項１〜５のうちのいずれか一項記載の電子部品
冷却装置。6. The electronic component cooling device according to claim 1, wherein an electronic component is attached to a wall surface of the cooling water channel forming member via a heat diffusion plate having thermal conductivity. .
もに、横断面略コ形のフィンカバーによって覆われて、
フィンカバーと熱伝導プレートとによってダクトが形成
され、ダクトの下端寄り部分に空冷ファンが配置され
て、空冷ファンからの風がダクト内の放熱フィンに向か
って吹き付けられるようになされている、請求項１記載
の電子部品冷却装置。7. The radiating fin is formed of a corrugated fin and is covered by a fin cover having a substantially U-shaped cross section.
A duct is formed by the fin cover and the heat conduction plate, and an air-cooling fan is arranged at a portion near a lower end of the duct, so that wind from the air-cooling fan is blown toward radiation fins in the duct. An electronic component cooling device according to claim 1.
トが取り付けられ、第１熱伝導プレートの外面に第１放
熱フィンが取り付けられ、同第１熱伝導プレートの内面
に冷却水路用凹部を有する第１冷却水路形成部材が密着
状に取り付けられて、熱伝導プレートと冷却水路形成部
材との間に第１冷却水路が形成され、第１冷却水路形成
部材に、冷却水路用凹部の底面から第１熱伝導プレート
に接触する高さを有する熱伝導架橋部が、熱伝導プレー
トと冷却水路形成部材との間に形成された冷却水路に囲
まれるように設けられ、第１熱伝導プレートと反対側に
おいて熱伝導架橋部に対応する冷却水路形成部材の壁面
部分に取り付けられた電子部品より生じた熱が、第１冷
却水路形成部材の熱伝導架橋部および第１熱伝導プレー
トを介して第１放熱フィンに伝達されるようになされ、
密閉筺体の左側壁部に第２熱伝導プレートが取り付けら
れ、第２熱伝導プレートの外面に第２放熱フィンが取り
付けられ、同第２熱伝導プレートの内面に冷却水路用凹
部を有する第２冷却水路形成部材が密着状に取り付けら
れて、熱伝導プレートと冷却水路形成部材との間に第２
冷却水路が形成され、第１冷却水路および第２冷却水路
の下端部同士が下部パイプを介して互いに連通せしめら
れるとともに、第１冷却水路および第２冷却水路の上端
部同士が上部パイプを介して互いに連通せしめられ、下
部パイプの長さの中間部分に水冷ポンプが介在させられ
ており、電子部品より生じた熱が、第１放熱フィンから
外部に放出されるとともに、その非除去分の熱が、熱伝
導架橋部を囲む第１冷却水路の冷却水に吸収され、水冷
ポンプの作動により、第１冷却水路内の冷却水が上部パ
イプを通って第２冷却水路へと流送され、そこで冷却水
の保有する熱が、第２放熱フィンから外部に放出され、
冷却された第２冷却水路内の冷却水が、水冷ポンプの作
動により、下部パイプを通って第１冷却水路へと循環す
るようになされていることを特徴とする、電子部品冷却
システム。8. A first heat conduction plate is attached to a right side wall portion of the closed casing, a first radiating fin is attached to an outer surface of the first heat conduction plate, and a cooling water channel recess is provided on an inner surface of the first heat conduction plate. The first cooling water channel forming member having the following structure is attached in close contact with the first cooling water channel forming member, and the first cooling water channel forming member is formed between the heat conduction plate and the cooling water channel forming member. And a heat conductive bridge portion having a height contacting the first heat conductive plate is provided so as to be surrounded by a cooling water channel formed between the heat conductive plate and the cooling water channel forming member. The heat generated by the electronic component attached to the wall portion of the cooling water passage forming member corresponding to the heat conduction bridging portion on the opposite side is transmitted through the heat conducting bridging portion of the first cooling water passage forming member and the first heat conduction plate. 1 heat dissipation To be transmitted to the fins,
A second cooling plate having a second heat conduction plate attached to a left side wall of the closed casing, a second radiating fin attached to an outer surface of the second heat conduction plate, and a cooling water channel recess on an inner surface of the second heat conduction plate. A water channel forming member is attached in close contact with the heat conductive plate and the cooling water channel forming member.
A cooling channel is formed, and lower ends of the first and second cooling channels are communicated with each other via a lower pipe, and upper ends of the first and second cooling channels are connected via an upper pipe. A water cooling pump is interposed in the middle part of the length of the lower pipe, and the heat generated from the electronic components is released from the first radiating fins to the outside, and the heat removed therefrom is removed. Is absorbed by the cooling water in the first cooling channel surrounding the heat conduction bridge, and the cooling water in the first cooling channel is sent to the second cooling channel through the upper pipe by the operation of the water cooling pump, where it is cooled. The heat of the water is released to the outside from the second radiating fin,
An electronic component cooling system, wherein the cooled cooling water in the second cooling water passage is circulated to the first cooling water passage through a lower pipe by operation of a water cooling pump.
とともに、横断面略コ形の第１フィンカバーによって覆
われて、第１フィンカバーと第１熱伝導プレートと筺体
右側壁部とによって第１ダクトが形成され、第１ダクト
の下端部に第１空冷ファンが配置されて、第１空冷ファ
ンからの風が第１ダクト内の放熱フィンに向かって吹き
付けられるようになされ、第２放熱フィンが、波形フィ
ンよりなるとともに、横断面略コ形の第２フィンカバー
によって覆われて、第２フィンカバーと第２熱伝導プレ
ートと筺体左側壁部とによって第２ダクトが形成され、
第２ダクトの下端部に第２空冷ファンが配置されて、第
２空冷ファンからの風が第２ダクト内の放熱フィンに向
かって吹き付けられるようになされている、請求項８記
載の電子部品冷却システム。9. The first radiating fin is formed of a corrugated fin, is covered by a first fin cover having a substantially U-shaped cross section, and is formed by the first fin cover, the first heat conduction plate, and the right side wall of the housing. One duct is formed, a first air-cooling fan is disposed at a lower end of the first duct, and wind from the first air-cooling fan is blown toward a radiating fin in the first duct. Are formed by corrugated fins, are covered by a second fin cover having a substantially U-shaped cross section, and a second duct is formed by the second fin cover, the second heat conduction plate, and the housing left side wall,
9. The electronic component cooling according to claim 8, wherein a second air cooling fan is arranged at a lower end of the second duct, and wind from the second air cooling fan is blown toward radiation fins in the second duct. system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001162036A JP2002353668A (en) | 2001-05-30 | 2001-05-30 | Electronic component cooling unit and cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001162036A JP2002353668A (en) | 2001-05-30 | 2001-05-30 | Electronic component cooling unit and cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002353668A true JP2002353668A (en) | 2002-12-06 |
Family
ID=19005222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001162036A Withdrawn JP2002353668A (en) | 2001-05-30 | 2001-05-30 | Electronic component cooling unit and cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002353668A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100349286C (en) * | 2005-09-13 | 2007-11-14 | 中国电力科学研究院 | Thyratron transistor valve water-cooling radiator |
| CN100362734C (en) * | 2005-04-29 | 2008-01-16 | 中国电力科学研究院 | Spring hanging mechanism for thyristor valve |
| JP2008161005A (en) * | 2006-12-26 | 2008-07-10 | Toshiba Mitsubishi-Electric Industrial System Corp | Power conversion apparatus |
| US7455103B2 (en) | 2003-08-11 | 2008-11-25 | Hitachi, Ltd. | Electronic equipment provided with cooling system |
| US8272428B2 (en) | 2007-07-04 | 2012-09-25 | Denso Corporation | Cooling apparatus using brine |
| CN102711413A (en) * | 2011-03-28 | 2012-10-03 | 株式会社安川电机 | Motor control apparatus |
| CN108807313A (en) * | 2018-07-05 | 2018-11-13 | 安康学院 | A kind of heat dissipation from microelectronic devices device |
| CN110440522A (en) * | 2019-06-28 | 2019-11-12 | 安徽国际商务职业学院 | A kind of electronic component cooling device for processing |
| CN111627664A (en) * | 2020-06-01 | 2020-09-04 | 江苏兆开电气有限公司 | Transformer equipment with multistage heat dissipation mechanism |
-
2001
- 2001-05-30 JP JP2001162036A patent/JP2002353668A/en not_active Withdrawn
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7455103B2 (en) | 2003-08-11 | 2008-11-25 | Hitachi, Ltd. | Electronic equipment provided with cooling system |
| CN100362734C (en) * | 2005-04-29 | 2008-01-16 | 中国电力科学研究院 | Spring hanging mechanism for thyristor valve |
| CN100349286C (en) * | 2005-09-13 | 2007-11-14 | 中国电力科学研究院 | Thyratron transistor valve water-cooling radiator |
| JP2008161005A (en) * | 2006-12-26 | 2008-07-10 | Toshiba Mitsubishi-Electric Industrial System Corp | Power conversion apparatus |
| US8272428B2 (en) | 2007-07-04 | 2012-09-25 | Denso Corporation | Cooling apparatus using brine |
| CN102711413A (en) * | 2011-03-28 | 2012-10-03 | 株式会社安川电机 | Motor control apparatus |
| JP2012204715A (en) * | 2011-03-28 | 2012-10-22 | Yaskawa Electric Corp | Motor controller |
| CN108807313A (en) * | 2018-07-05 | 2018-11-13 | 安康学院 | A kind of heat dissipation from microelectronic devices device |
| CN108807313B (en) * | 2018-07-05 | 2020-06-23 | 安康学院 | Microelectronic device heat dissipation device |
| CN110440522A (en) * | 2019-06-28 | 2019-11-12 | 安徽国际商务职业学院 | A kind of electronic component cooling device for processing |
| CN110440522B (en) * | 2019-06-28 | 2021-01-05 | 安徽国际商务职业学院 | Cooling device for electronic component processing |
| CN111627664A (en) * | 2020-06-01 | 2020-09-04 | 江苏兆开电气有限公司 | Transformer equipment with multistage heat dissipation mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20080805 |