JP2002344123A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JP2002344123A JP2002344123A JP2001141086A JP2001141086A JP2002344123A JP 2002344123 A JP2002344123 A JP 2002344123A JP 2001141086 A JP2001141086 A JP 2001141086A JP 2001141086 A JP2001141086 A JP 2001141086A JP 2002344123 A JP2002344123 A JP 2002344123A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- printed wiring
- wiring board
- conductive adhesive
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は導電性接着剤を用い
て電子部品を印刷配線板に実装する時に最適な印刷配線
板に関する、詳しくは電極部に表面処理を施した印刷配
線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board which is most suitable for mounting an electronic component on the printed wiring board using a conductive adhesive, and more particularly to a printed wiring board having an electrode portion subjected to a surface treatment. is there.
【０００２】[0002]
【従来技術】近年印刷配線板はパソコンを始めとして、
電子部品が搭載された製品には欠くことのできない部品
となっている。この印刷配線板に電子部品を実装する方
法として一般的に行われている方法は半田を使って電子
部品を半田付けする方法である。この方法は半田に含ま
れる鉛が環境に有害であるため、鉛を含まない半田が検
討されている。また、半田を使わない電子部品の実装方
法も各種検討されていて、本発明では導電性接着剤を使
った電子部品の実装方法について検討している。2. Description of the Related Art In recent years, printed wiring boards, including personal computers,
This is an indispensable part for products on which electronic components are mounted. A common method for mounting electronic components on the printed wiring board is to solder the electronic components using solder. In this method, since lead contained in the solder is harmful to the environment, lead-free solder is being studied. In addition, various methods for mounting electronic components without using solder have been studied. In the present invention, a method for mounting electronic components using a conductive adhesive has been studied.
【０００３】図６は導電性接着剤を用いて印刷配線板に
電子部品を実装した時の断面図を示し、１は印刷配線
板、２は印刷配線板に形成した電極、３は導電性接着
剤、４は面実装タイプの電子部品、そして、５はその電
子部品の電極である。FIG. 6 is a cross-sectional view when electronic components are mounted on a printed wiring board using a conductive adhesive, 1 is a printed wiring board, 2 is an electrode formed on the printed wiring board, and 3 is a conductive adhesive. The agent 4 is a surface mount type electronic component, and 5 is an electrode of the electronic component.
【０００４】この実装方法の組立手順は最初印刷配線板
の電極２の表面に導電性接着剤３をシルク印刷等により
印刷する。その結果電極２の表面に導電性接着剤３が配
置される。その導電性接着剤３の上に電子部品をのせ、
乾燥させることにより導電性接着剤が固化し、電子部品
の電極と印刷配線板の電極が電気的に接続される。この
ようにして電子部品が印刷配線板に実装される。In the assembly procedure of this mounting method, first, a conductive adhesive 3 is printed on the surface of the electrode 2 of the printed wiring board by silk printing or the like. As a result, the conductive adhesive 3 is disposed on the surface of the electrode 2. Electronic components are placed on the conductive adhesive 3,
By drying, the conductive adhesive is solidified, and the electrodes of the electronic component and the electrodes of the printed wiring board are electrically connected. Thus, the electronic component is mounted on the printed wiring board.
【０００５】図７は図６のＡ部を拡大した拡大図で、印
刷配線板に形成された電極２と導電性接着剤３との接合
面を説明するための図である。導電性接着剤はエポキシ
樹脂材料をベースとし、そのベース材料に導電粒子を混
合させたものである。図７では６がエポキシ樹脂で７が
導電粒子である。FIG. 7 is an enlarged view of a portion A in FIG. 6 and is a view for explaining a bonding surface between an electrode 2 and a conductive adhesive 3 formed on a printed wiring board. The conductive adhesive is based on an epoxy resin material, and is obtained by mixing conductive particles with the base material. In FIG. 7, 6 is an epoxy resin and 7 is conductive particles.
【０００６】[0006]
【発明が解決しようとする課題】この導電性接着剤を用
いて電子部品を印刷配線板に実装する場合、要求される
特性としては第一には電子部品を印刷配線板に所定の強
度をもって接合することであり、第二には接合部の電気
抵抗をできる限り小さくすることである。When an electronic component is mounted on a printed wiring board using this conductive adhesive, the first required characteristic is that the electronic component is bonded to the printed wiring board with a predetermined strength. The second is to reduce the electrical resistance of the junction as much as possible.
【０００７】導電性接着剤と印刷配線板の電極との接合
は導電性接着剤に含まれるエポキシ樹脂と印刷配線板の
電極表面とで行われ、接合強度は両部材の接触面の大き
さにより決まる。そして大きい面積で接触させる程接合
強度は大となり望ましい。一方、接合部の電気抵抗は導
電性接着剤に含まれる導電粒子と印刷配線板の電極との
接触面の大きさで決まり、接触面積が大きければ大きい
程接合部の電気抵抗は小さくなり望ましい。The bonding between the conductive adhesive and the electrode of the printed wiring board is performed by the epoxy resin contained in the conductive adhesive and the electrode surface of the printed wiring board. The bonding strength depends on the size of the contact surface between the two members. Decided. The larger the contact area, the higher the bonding strength, which is desirable. On the other hand, the electrical resistance of the joint is determined by the size of the contact surface between the conductive particles contained in the conductive adhesive and the electrode of the printed wiring board.
【０００８】このことは印刷配線板の電極面積を一定と
すれば、導電性接着剤に含まれるエポキシ樹脂と導電粒
子との配合割合に関係することになる。接合強度をアッ
プさせようとすると、導電性接着剤に含まれるエポキシ
樹脂の配合割合を多くして、印刷配線板の電極と接触す
る面積を大きくする。この場合接合部の電気抵抗が大き
くなる。反対に接合部の電気抵抗を小さくしようとする
と、導電性接着剤に含まれる導電粒子の割合を多くす
る。この場合接合強度は低下する。This is related to the mixing ratio of the epoxy resin and the conductive particles contained in the conductive adhesive, provided that the electrode area of the printed wiring board is constant. In order to increase the bonding strength, the mixing ratio of the epoxy resin contained in the conductive adhesive is increased to increase the area of the printed wiring board in contact with the electrode. In this case, the electrical resistance of the joint increases. Conversely, if the electrical resistance of the joint is to be reduced, the proportion of the conductive particles contained in the conductive adhesive is increased. In this case, the joining strength decreases.
【０００９】従って、導電性接着剤に含まれるエポキシ
樹脂と導電粒子の割合を調整しても接合強度を大きく、
電気抵抗を小さくすることはできない。接合強度を大き
くし、接合部の電気抵抗を小さくしようとするとどうし
ても印刷配線板の電極面積を大きくする必要があり、電
極面積を大きくすると電子部品の高密度実装ができない
という問題点が発生する。Therefore, even if the ratio of the epoxy resin and the conductive particles contained in the conductive adhesive is adjusted, the bonding strength is large,
Electric resistance cannot be reduced. In order to increase the bonding strength and reduce the electrical resistance of the bonding portion, it is absolutely necessary to increase the electrode area of the printed wiring board. If the electrode area is increased, there is a problem that high-density mounting of electronic components cannot be performed.
【００１０】[0010]
【課題を解決するための手段】本発明は前記課題を解決
するために下記のように構成したものである。Means for Solving the Problems The present invention is configured as follows to solve the above-mentioned problems.
【００１１】（１） 導電性接着剤を印刷配線板の電極
部に配置して、電子部品を実装する印刷配線板であっ
て、前記電子部品の接合部の接合強度を増すとともに電
気抵抗を小とするために、前記電極部表面を粗面化し
た。(1) A printed wiring board on which an electronic component is mounted by disposing a conductive adhesive on an electrode portion of the printed wiring board, wherein the bonding strength of the junction of the electronic component is increased and the electric resistance is reduced. The surface of the electrode portion was roughened.
【００１２】（２） １項記載の印刷配線板で電極部表
面の表面粗さを２〜９μｍとした。(2) The surface roughness of the surface of the electrode portion of the printed wiring board described in the item 1 was set to 2 to 9 μm.
【００１３】[0013]
【発明の実施の形態】本発明を図１から図５を用いて詳
細に説明する。図１は従来例の図６に対応するものであ
り、１は印刷配線板、８は印刷配線板の表面に形成され
た電極で、表面は９で示すように粗面化されている。３
は導電性接着剤である。本図では導電性接着剤の上に実
装される面実装電子部品が省略されている。本図と従来
例の図６との違いは電極８の表面が粗面化されているこ
とである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to FIGS. FIG. 1 corresponds to FIG. 6 of the conventional example, in which 1 is a printed wiring board, 8 is an electrode formed on the surface of the printed wiring board, and the surface is roughened as indicated by 9. 3
Is a conductive adhesive. In this drawing, the surface mount electronic components mounted on the conductive adhesive are omitted. The difference between this figure and FIG. 6 of the conventional example is that the surface of the electrode 8 is roughened.
【００１４】図２は導電性接着剤と電極の接合部の断面
図を示し、図１のＢ部拡大図である。図示のように電極
８の表面は９で示すように粗面化されているので、電極
表面の面積が従来より大となる。そのため導電性接着剤
に含まれる導電粒子と電極との接触面積が従来より増す
ことになり、接合部の電気抵抗が下がる。更に、導電性
接着剤に含まれるエポキシ樹脂と電極との接触面積も増
えることになり、接合強度がアップする。FIG. 2 is a sectional view of a joint between the conductive adhesive and the electrode, and is an enlarged view of a portion B in FIG. As shown in the figure, the surface of the electrode 8 is roughened as indicated by 9, and the area of the electrode surface becomes larger than before. Therefore, the contact area between the conductive particles contained in the conductive adhesive and the electrode is increased as compared with the conventional case, and the electric resistance of the joint is reduced. Further, the contact area between the epoxy resin contained in the conductive adhesive and the electrode also increases, and the bonding strength increases.
【００１５】次に効果を確認するために確認実験を実施
した。図３は面実装電子部品として２１０１サイズの０
オームのチップ抵抗とし、そのチップ抵抗を印刷配線板
に実装した時の断面図を示す。１が印刷配線板、８が電
極、３が導電性接着剤、そして、１０が前記チップ抵
抗、１１はチップ抵抗の電極である。Next, a confirmation experiment was performed to confirm the effect. FIG. 3 shows 0 of 2101 size as a surface mount electronic component.
FIG. 3 is a cross-sectional view when an ohmic chip resistor is used and the chip resistor is mounted on a printed wiring board. 1 is a printed wiring board, 8 is an electrode, 3 is a conductive adhesive, 10 is the chip resistor, and 11 is a chip resistor electrode.
【００１６】ここまでの説明で電極表面を粗面化すると
述べてきたが、ここで粗面について説明する。図４は印
刷配線板および表面が粗面化されている電極の断面図を
示し、粗面の度合い（以後表面粗さとする）は実際より
オーバーに表現している。表面粗さを数値化する方法と
して電極表面を複数の計測エリアに分割し、その各エリ
アに対して一番高い山と一番低い谷を計測し、その差
（図示のＲ）を求め、それらの値の平均値を求めて表面
粗さと定義した。In the above description, the roughening of the electrode surface has been described. Here, the rough surface will be described. FIG. 4 is a cross-sectional view of the printed wiring board and the electrode whose surface is roughened, and the degree of the rough surface (hereinafter referred to as surface roughness) is expressed more than actual. As a method of quantifying the surface roughness, the electrode surface is divided into a plurality of measurement areas, the highest peak and the lowest valley are measured for each area, and the difference (R in the figure) is obtained. Was determined as the surface roughness.
【００１７】発明者は表面粗さが異なる確認用試料（サ
ンプル）を製作する前に、試料の電極に対して表面粗さ
を計測した。その結果表面粗さは略１μｍ（ミクロン）
であった。この試料の表面を粗面化する方法としてサン
ドペーパーで擦る方法とした。そして、表面粗さの異な
る試料は粗さの異なるサンドペーパーを用いて製作し
た。The inventor measured the surface roughness of an electrode of the sample before producing a confirmation sample (sample) having a different surface roughness. As a result, the surface roughness is approximately 1 μm (micron)
Met. As a method of roughening the surface of the sample, a method of rubbing with a sandpaper was used. And samples with different surface roughness were manufactured using sandpaper with different roughness.
【００１８】このようにして製作された数種類の試料に
対して表面粗さを求めた。そして、これらの試料に対し
て接合強度（単位Ｎ）および電気抵抗（単位ｍΩ）を測
定した。図５にその結果を示す。この結果から表面粗さ
が２〜９μｍの範囲が粗面化することにより接合強度が
増加し、電気抵抗が低下していることが分かる。The surface roughness was determined for several types of samples manufactured as described above. Then, the bonding strength (unit N) and electric resistance (unit mΩ) of these samples were measured. FIG. 5 shows the result. From this result, it can be seen that when the surface roughness in the range of 2 to 9 μm is roughened, the bonding strength is increased and the electric resistance is reduced.
【００１９】尚、表面粗さを増せば増すほど電極表面の
表面積が大きくなり、接合強度は増加するように考えら
れるが、電気抵抗は９μｍを越えると大きくなり、接合
強度が低下していることがわかる。これは表面粗さが大
きくなると表面にできる谷が深くなり、その深い谷の底
まで導電性接着剤が入り込まないためと考えられる。It is considered that as the surface roughness increases, the surface area of the electrode surface increases and the bonding strength increases. However, the electrical resistance increases above 9 μm, and the bonding strength decreases. I understand. It is considered that this is because when the surface roughness increases, the valley formed on the surface becomes deep, and the conductive adhesive does not penetrate to the bottom of the deep valley.
【００２０】[0020]
【発明の効果】以上説明したように本発明の方法によれ
ば印刷配線板に形成した電極表面を粗面化することによ
り電極の表面積が大きくなり、導電性接着剤に含まれる
エポキシ樹脂と電極表面の接触面積が増大し接合強度が
増加する。また、導電粒子と電極表面の接触面積が増大
し電気抵抗が低下するので電子部品の高密度実装が可能
となる。As described above, according to the method of the present invention, the surface of the electrode formed on the printed wiring board is roughened to increase the surface area of the electrode. The contact area of the surface increases, and the bonding strength increases. Further, since the contact area between the conductive particles and the electrode surface increases and the electric resistance decreases, high-density mounting of electronic components becomes possible.
【図１】本発明の印刷配線板に形成された電極と導電性
接着剤の接合部の断面図。FIG. 1 is a cross-sectional view of a joint between an electrode and a conductive adhesive formed on a printed wiring board of the present invention.
【図２】図１説明の接合部断面（Ｂ部）の拡大図。FIG. 2 is an enlarged view of a cross section (a portion B) of a bonding portion described in FIG. 1;
【図３】印刷配線板にチップ抵抗を実装した時の断面
図。FIG. 3 is a sectional view when a chip resistor is mounted on a printed wiring board.
【図４】粗面の度合いの定義を説明するための図。FIG. 4 is a diagram for explaining the definition of the degree of rough surface.
【図５】表面粗さに対する接合強度および電気抵抗の関
係を示す特性図。FIG. 5 is a characteristic diagram showing a relationship between bonding strength and electric resistance with respect to surface roughness.
【図６】従来の印刷配線板にチップ部品を実装した時の
接合部の断面図。FIG. 6 is a cross-sectional view of a joint when a chip component is mounted on a conventional printed wiring board.
【図７】図６説明の接合部断面（Ａ部）の拡大図。FIG. 7 is an enlarged view of a cross section (A section) of a joining portion described in FIG. 6;
１ 印刷配線板 ２ 印刷配線板に形成された電極（ランド） ３ 導電性接着剤 ４ チップ部品 ５ チップ部品の電極 ６ 導電性接着剤に含まれるエポキシ樹脂 ７ 導電性接着剤に含まれる導電粒子 ８ 印刷配線板に形成された表面が粗面化さ
れた電極 ９ 電極表面の粗面 １０ チップ抵抗 １１ チップ抵抗の電極REFERENCE SIGNS LIST 1 printed wiring board 2 electrode (land) formed on printed wiring board 3 conductive adhesive 4 chip component 5 electrode of chip component 6 epoxy resin contained in conductive adhesive 7 conductive particle contained in conductive adhesive 8 Electrode with rough surface formed on printed wiring board 9 Rough surface of electrode surface 10 Chip resistor 11 Electrode of chip resistor
Claims (2)
置して、電子部品を実装する印刷配線板であって、前記
電子部品の接合部の接合強度を増すとともに電気抵抗を
小とするために、前記電極部表面を粗面化したことを特
徴とする印刷配線板。1. A printed wiring board on which an electronic component is mounted by disposing a conductive adhesive on an electrode portion of the printed wiring board, wherein the bonding strength of the bonding portion of the electronic component is increased and the electric resistance is reduced. A printed wiring board, wherein the surface of the electrode portion is roughened in order to do so.
たことを特徴とする１項記載の印刷配線板。2. The printed wiring board according to claim 1, wherein the surface roughness of the electrode portion is 2 to 9 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001141086A JP2002344123A (en) | 2001-05-11 | 2001-05-11 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001141086A JP2002344123A (en) | 2001-05-11 | 2001-05-11 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002344123A true JP2002344123A (en) | 2002-11-29 |
Family
ID=18987590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001141086A Pending JP2002344123A (en) | 2001-05-11 | 2001-05-11 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002344123A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8455769B2 (en) | 2008-01-30 | 2013-06-04 | Murata Manufacturing Co., Ltd. | Electronic component and method of mounting the same |
-
2001
- 2001-05-11 JP JP2001141086A patent/JP2002344123A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8455769B2 (en) | 2008-01-30 | 2013-06-04 | Murata Manufacturing Co., Ltd. | Electronic component and method of mounting the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3612922A (en) | Method of mounting a piezoelectric device | |
| KR20060040727A (en) | Heatsinking electronic devices | |
| EP1577942A3 (en) | Device with through-hole interconnection and method for manufacturing the same | |
| US5100695A (en) | Method of manufacturing a printed circuit board | |
| JPH11163501A (en) | Method for mounting electronic part, and electronic circuit device manufactured there by | |
| US6833512B2 (en) | Substrate board structure | |
| JP2002344123A (en) | Printed wiring board | |
| JP2642922B2 (en) | Printed wiring board | |
| JP2504486B2 (en) | Hybrid integrated circuit structure | |
| JP2001223452A (en) | Circuit board | |
| JPH065769A (en) | Laminated film base material and lead frame for mounting electronic circuit element employing the film base material | |
| JP2002134639A (en) | Package for high freaquency electronic component and high freaquency electronic component using it | |
| JP2809316B2 (en) | Substrate for mounting electronic components | |
| JPH08191128A (en) | Electronic device | |
| US20040119155A1 (en) | Metal wiring board and method for manufacturing the same | |
| JP2002141647A (en) | Bonding structure of printed-wiring board to electronic component | |
| JPS6347157B2 (en) | ||
| JPH056714Y2 (en) | ||
| TWI220993B (en) | Resistor device package and its manufacturing process | |
| JPH0528917B2 (en) | ||
| JPH05297398A (en) | Electrode connecting structure | |
| JPH09129784A (en) | Semiconductor device and manufacture thereof | |
| JPH05259221A (en) | Electronic part mounting device | |
| JPH02121360A (en) | Electronic component mounting substrate | |
| JPH03255691A (en) | Printed wiring board |