JP2002344115A - Method of forming film and method of manufacturing printed board - Google Patents
Method of forming film and method of manufacturing printed boardInfo
- Publication number
- JP2002344115A JP2002344115A JP2001146191A JP2001146191A JP2002344115A JP 2002344115 A JP2002344115 A JP 2002344115A JP 2001146191 A JP2001146191 A JP 2001146191A JP 2001146191 A JP2001146191 A JP 2001146191A JP 2002344115 A JP2002344115 A JP 2002344115A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- flexible printed
- film
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント基板上に金属薄膜を形成する方法及びフレキシブル
プリント基板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a metal thin film on a flexible printed board and a method for manufacturing the flexible printed board.
【０００２】[0002]
【従来の技術】従来の成膜方法、特にフレキシブルプリ
ント基板上に、アルミなどの金属膜、セラミック薄膜な
どを所定のパターンに成膜する方法は、まず、成膜用の
開口部を設けたコンタクト型のマスクを、基板上の所定
の位置に配置していた。そして、その後、スパッタリン
グや蒸着等によって、フレキシブル基板上に成膜を行っ
ていた。2. Description of the Related Art A conventional film forming method, in particular, a method of forming a metal film such as aluminum, a ceramic thin film or the like in a predetermined pattern on a flexible printed circuit board, first comprises a contact having an opening for film formation. The mold mask was placed at a predetermined position on the substrate. Thereafter, a film is formed on the flexible substrate by sputtering, vapor deposition, or the like.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上記のよ
うな従来の方法で、たとえば接着剤などで貼り合わせた
フレキシブルプリント基板に、スパッタリングや蒸着に
より金属成膜を行なうと、接着剤や基板からの水分、未
反応モノマー、溶剤、添加剤などの蒸発、飛散などによ
って、成膜されたアルミの膜質が変化することがある。
場合によっては、導通抵抗の低下や表面抵抗の変化、黒
ずみなどの不具合が発生することがある。However, when a metal film is formed by sputtering or vapor deposition on a flexible printed circuit board bonded with an adhesive or the like in the above-mentioned conventional method, however, the moisture from the adhesive or the substrate is lost. The film quality of the formed aluminum may change due to evaporation and scattering of unreacted monomers, solvents, additives, and the like.
In some cases, problems such as a decrease in conduction resistance, a change in surface resistance, and darkening may occur.
【０００４】本発明は、上記従来の問題点を解決するも
ので、接着剤などで貼り合わせたフレキシブルプリント
基板に、スパッタリングや蒸着により金属成膜を行なう
ときに、接着剤や基板からの水分、未反応モノマー、添
加剤などの蒸発、飛散などを防止し、高品質な薄膜パタ
ーン形成を提供するものである。The present invention solves the above-mentioned conventional problems. When a metal film is formed by sputtering or vapor deposition on a flexible printed circuit board bonded with an adhesive or the like, moisture or water from the adhesive or the board is reduced. An object of the present invention is to prevent the unreacted monomer and additives from evaporating and scattering, and to provide a high-quality thin film pattern.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するため
に本発明は、接着剤により貼り合わせを行ったフレキシ
ブルプリント基板の上に、成膜用の開口部の周囲に通気
を阻害する部材を形成したマスクを設置し、前記基板上
に金属を成膜するもので、成膜時の水分、未反応モノマ
ー、溶剤などの飛散を防止することを特徴とする。According to the present invention, there is provided a flexible printed circuit board bonded with an adhesive, comprising a member for inhibiting air flow around a film forming opening. A metal film is formed on the substrate by installing the formed mask, and is characterized in that scattering of moisture, unreacted monomers, and solvents during film formation is prevented.
【０００６】また、凸形の曲面を有するベース上に設置
され、接着剤により貼り合わせを行ったフレキシブルプ
リント基板の上に、マスクを設置し、バネ性を有する部
材により、前記基板面と前記マスクを押圧し、前記基板
上に金属を成膜することで、成膜品質を高めることが可
能となる。Further, a mask is provided on a flexible printed circuit board mounted on a base having a convex curved surface and bonded with an adhesive, and the substrate surface and the mask are fixed by a member having a spring property. Is pressed to form a metal film on the substrate, thereby improving the film formation quality.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施の形態に係る
成膜方法について、図面を参照しながら具体的に説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a film forming method according to an embodiment of the present invention will be specifically described with reference to the drawings.
【０００８】図１は、本発明の第１の実施の形態に係る
成膜方法のプロセスを示す断面図およびその拡大図であ
る。図１において、１はフレキシブルプリント基板、２
は接着剤、３はカバーレイポリイミド、４は成膜用メタ
ルマスク、５は成膜されたアルミ、６はスパッタされて
いるアルミ、１０は穴部、７は穴部１０から飛散、蒸発
した水分、未反応モノマー、８はマスク上に形成された
通気を阻害する部材、９は開口部、１１は基板保持用ベ
ース、１２はマスク開口部である。FIG. 1 is a sectional view showing a process of a film forming method according to a first embodiment of the present invention and an enlarged view thereof. In FIG. 1, 1 is a flexible printed circuit board, 2
Is an adhesive, 3 is a coverlay polyimide, 4 is a metal mask for film formation, 5 is a film-formed aluminum, 6 is aluminum which is sputtered, 10 is a hole, 7 is water scattered and evaporated from the hole 10 and evaporated water. , Unreacted monomer, 8 is a member formed on the mask that inhibits ventilation, 9 is an opening, 11 is a substrate holding base, and 12 is a mask opening.
【０００９】以上のように構成されたアルミ成膜方法に
ついて、そのプロセスを図１に基づき、以下に説明す
る。The aluminum film forming method configured as described above will be described below with reference to FIG.
【００１０】回路パターンが形成されているフレキシブ
ルプリント基板１に、絶縁、保護などのためにカバーレ
イポリイミド３が、接着剤２により貼り付けられてい
る。そのフレキシブルプリント基板１をベース１１上に
置き、フレキシブルプリント基板１の上に成膜パターン
が形成されているマスク４を置き、スパッタ装置（図示
せず）内に投入する。A coverlay polyimide 3 is adhered to a flexible printed circuit board 1 on which a circuit pattern is formed with an adhesive 2 for insulation and protection. The flexible printed board 1 is placed on a base 11, a mask 4 on which a film forming pattern is formed is placed on the flexible printed board 1, and the flexible printed board 1 is put into a sputtering apparatus (not shown).
【００１１】次に減圧の後にアルミ６をスパッタする
が、その時、カバーレイ用接着剤２の硬化が不十分であ
ったり、吸水量が多かったりすると、開口部９や穴部１
０から水分や未反応モノマ７（溶媒含む）が飛散する。
しかし、マスク４に通気を阻害する部材８が形成されて
いることにより、水分や未反応モノマ７は、マスク開口
部１２から飛散量が低減されるため、成膜されたアルミ
に不具合（導通抵抗の増加、変色など）が発生すること
はない。Next, aluminum 6 is sputtered after the pressure is reduced. At this time, if the curing of the cover lay adhesive 2 is insufficient or the amount of water absorption is large, the opening 9 or the hole 1
From 0, water and unreacted monomer 7 (including solvent) are scattered.
However, since the mask 4 is formed with the member 8 that inhibits airflow, the amount of moisture and unreacted monomer 7 scattered from the mask opening 12 is reduced. Increase, discoloration, etc.) do not occur.
【００１２】以上のように本実施の形態によれば、接着
剤により貼り合わせを行ったプリント基板上にスパッタ
リング、蒸着などで成膜する際のマスクに通気を阻害す
る部材を形成し、金属（アルミ）を成膜することによ
り、カバーレイ用接着剤２の硬化が不十分であったり、
吸水量が多かった場合でも良好な品質の成膜を行うこと
ができる。As described above, according to the present embodiment, a member that inhibits airflow is formed on a mask for forming a film by sputtering, vapor deposition, or the like on a printed circuit board that has been bonded with an adhesive. Aluminum), the curing of the coverlay adhesive 2 is insufficient,
Even when the amount of water absorption is large, a film with good quality can be formed.
【００１３】図２は、本発明の第２の実施の形態に係る
成膜方法のプロセスを示す断面図である。実施の形態１
と同様の作用を有する部分には同じ符号を付している。
１３はマスク４を押圧する板材、１４は押圧の方向を示
すベクトルを示したものである。FIG. 2 is a sectional view showing a process of a film forming method according to a second embodiment of the present invention. Embodiment 1
Portions having the same operation as those described above are denoted by the same reference numerals.
Reference numeral 13 denotes a plate material for pressing the mask 4, and reference numeral 14 denotes a vector indicating a pressing direction.
【００１４】以上のように構成されたアルミ成膜方法に
ついて、そのプロセスを図２に基づき、以下に説明す
る。The process of the aluminum film forming method configured as described above will be described below with reference to FIG.
【００１５】回路パターンが形成されているフレキシブ
ルプリント基板１に絶縁、保護などのためにポリイミド
製カバーレイ３が接着剤２により貼り付けられている。
そのフレキシブルプリント基板１をベース１１上に置
き、そのフレキシブルプリント基板のうえに成膜パター
ンが形成されているマスクを置き、スパッタ装置（図示
せず）内に投入する。A polyimide coverlay 3 is adhered to a flexible printed circuit board 1 on which a circuit pattern is formed by an adhesive 2 for insulation and protection.
The flexible printed board 1 is placed on the base 11, a mask on which a film forming pattern is formed is placed on the flexible printed board, and the flexible printed board 1 is put into a sputtering apparatus (not shown).
【００１６】次に減圧の後にアルミ６をスパッタする
が、その時、マスク４に通気を阻害する部材８が形成さ
れていることにより、水分や未反応モノマはマスク開口
部１２から飛散量は低減されるが、フレキシブルプリン
ト基板の変形などがあるとフレキシブルプリント基板３
と部材８との間に空隙ができ、微小な飛散が発生する場
合がある。そこで押圧用板材１４でマスク４上から下方
向１４へ押圧することにより飛散量を極めて少なくする
ことができ、成膜されたアルミに不具合（導通抵抗の増
加、変色など）が発生することはない。Next, the aluminum 6 is sputtered after the pressure is reduced. At this time, the amount of moisture and unreacted monomer scattered from the mask opening 12 is reduced due to the formation of the member 8 which inhibits the ventilation in the mask 4. However, if the flexible printed circuit board is deformed, the flexible printed circuit board 3
There is a case where a gap is formed between the member and the member 8 and minute scattering occurs. Therefore, the amount of scattering can be extremely reduced by pressing the mask 4 downward from above the mask 4 with the pressing plate member 14, and no trouble (increase in conduction resistance, discoloration, etc.) occurs in the deposited aluminum. .
【００１７】図３は、本発明の第３の実施の形態に係る
成膜方法を示す斜視図である。図３において、２０はフ
レキシブルプリント基板保持用ベース、２１は基板面と
の通気を阻害する部材が形成された成膜用メタルマス
ク、２２はフレキシブルプリント基板、２３はばね性を
有する固定治具、２４はメタルマスクの開口部である。FIG. 3 is a perspective view showing a film forming method according to a third embodiment of the present invention. In FIG. 3, reference numeral 20 denotes a base for holding a flexible printed board, reference numeral 21 denotes a metal mask for film formation on which a member that inhibits airflow with the board surface is formed, reference numeral 22 denotes a flexible printed board, reference numeral 23 denotes a fixing jig having spring properties, Reference numeral 24 denotes an opening of the metal mask.
【００１８】フレキシブルプリント基板保持ベース２０
上にアルミを成膜するフレキシブルプリント基板２２を
配置し、その上に通気を阻害する部材が形成されたメタ
ルマスク２１を置く。そして、ばね性を有する部材２３
でマスク、フレキシブルプリント基板、ベースの密着を
行なう。その後、スパッタ装置でアルミの成膜を行な
う。メタルマスク２１に形成された通気を阻害する部材
と基板との密着性が、ばねの押圧により高まり、基板よ
り飛散する水分や未反応モノマの量が低減される。その
ため、成膜されたアルミに不具合（導通抵抗の増加、変
色など）が発生することはない。Flexible printed circuit board holding base 20
A flexible printed circuit board 22 on which an aluminum film is formed is disposed thereon, and a metal mask 21 on which a member that inhibits ventilation is formed is placed thereon. And the member 23 having a spring property
The mask, the flexible printed circuit board and the base are brought into close contact with each other. Thereafter, aluminum is formed by a sputtering apparatus. The adhesion between the substrate that inhibits airflow formed on the metal mask 21 and the substrate is increased by the pressing of the spring, and the amount of moisture and unreacted monomer scattered from the substrate is reduced. Therefore, no trouble (increase in conduction resistance, discoloration, etc.) does not occur in the deposited aluminum.
【００１９】図４は本発明の第４の実施の形態に係る成
膜方法を示す斜視図である。図４において、３０は保持
面が曲面であるフレキシブルプリント基板保持用ベー
ス、３１は成膜用メタルマスク、３２はフレキシブルプ
リント基板、３３はばね性を有する固定治具、３４はメ
タルマスクの開口部である。FIG. 4 is a perspective view showing a film forming method according to a fourth embodiment of the present invention. In FIG. 4, reference numeral 30 denotes a flexible printed circuit board holding base having a curved holding surface, 31 denotes a metal mask for film formation, 32 denotes a flexible printed circuit board, 33 denotes a fixing jig having spring properties, and 34 denotes an opening of the metal mask. It is.
【００２０】保持ベース３０が曲面であるため、固定治
具３３による押圧により、フレキシブルプリント基板３
２とマスク３１の全体的な密着性が高まる。したがっ
て、うねりを有するフレキシブルプリント基板に対して
もマスクとの密着性を高め、通気を阻害することがで
き、水分、未反応モノマなどの飛散が低減されるため、
導通抵抗の低下や変色などの不具合が発生せず成膜品質
を高めることが可能となる。Since the holding base 30 has a curved surface, the flexible printed circuit board 3 is pressed by the fixing jig 33.
The overall adhesion between the mask 2 and the mask 31 is improved. Therefore, even for a flexible printed circuit board having undulations, the adhesiveness with the mask can be enhanced, ventilation can be inhibited, and the scattering of moisture, unreacted monomers, etc. is reduced,
Defects such as a decrease in conduction resistance and discoloration do not occur, and the film formation quality can be improved.
【００２１】図５は、本発明の第５の実施の形態に係る
成膜方法を示す図である。図５において、４０は保持面
が曲面であるフレキシブルプリント基板保持用ベース、
４１は成膜用メタルマスク、４２はフレキシブルプリン
ト基板、４３はばね性を有する固定治具、４４はメタル
マスクの開口部、４５は通気を阻害する部材、４６はフ
レキシブルプリント基板に形成された穴部である。FIG. 5 is a view showing a film forming method according to a fifth embodiment of the present invention. In FIG. 5, reference numeral 40 denotes a flexible printed circuit board holding base having a curved holding surface;
41 is a metal mask for film formation, 42 is a flexible printed board, 43 is a fixing jig having a spring property, 44 is an opening of the metal mask, 45 is a member that inhibits airflow, 46 is a hole formed in the flexible printed board. Department.
【００２２】保持ベース４０が曲面であるため、固定治
具４３による押圧により、フレキシブルプリント基板４
２とマスク４１の全体的な密着性が高まり（均一に密
着）、おもにフレキシブルプリント基板４２の穴部４６
より飛散する水分や未反応モノマの量が低減される。さ
らに通気を阻害する部材４５がマスク４１の開口部周辺
に形成されているため、水分や未反応モノマの封止効果
が高まる。そのため、マスク４１の開口部４４のパター
ンに成膜されたアルミに不具合（導通抵抗の増加、変色
など）が発生することはなく、パターンのエッジ形状も
良好になる。Since the holding base 40 has a curved surface, the flexible printed circuit board 4 is pressed by the fixing jig 43.
2 and the mask 41 are improved in overall adhesion (uniform adhesion), and mainly the holes 46 in the flexible printed circuit board 42.
The amount of scattered moisture and unreacted monomer is reduced. Further, since the member 45 that inhibits ventilation is formed around the opening of the mask 41, the effect of sealing moisture and unreacted monomers is enhanced. Therefore, no problem (such as an increase in conduction resistance or discoloration) occurs in the aluminum film formed in the pattern of the opening portion 44 of the mask 41, and the edge shape of the pattern becomes good.
【００２３】図６は、本発明の実施の形態に係るアルミ
成膜用マスクを示す図である。図７において、６０は通
気を阻害する部材６２を形成したマスク、６１はマスク
開口部である。FIG. 6 is a view showing an aluminum film forming mask according to the embodiment of the present invention. In FIG. 7, reference numeral 60 denotes a mask on which a member 62 that inhibits ventilation is formed, and 61 denotes a mask opening.
【００２４】マスク開口部６１の周辺に基板面との通気
を阻害する部材６２を形成しているため、フレキシブル
プリント基板から飛散する水分や未反応モノマの影響を
うけず、導通抵抗が低く、外観も良好なアルミパターン
を成膜することができる。Since the member 62 for preventing airflow from the substrate surface is formed around the mask opening 61, the conductive resistance is low, the external resistance is not affected by the moisture and unreacted monomer scattered from the flexible printed circuit board. Also, a good aluminum pattern can be formed.
【００２５】[0025]
【発明の効果】以上のように本発明によれば、接着剤に
より貼り合わせを行ったフレキシブルプリント基板上に
スパッタリング、蒸着などで成膜する際のマスクに、基
板面との通気を阻害する部材を形成し、金属（アルミ）
を成膜することにより、カバーレイ用接着剤の硬化が不
十分であったり、吸水量が多かった場合でも良好な品質
の成膜を行うことができる。As described above, according to the present invention, a mask for forming a film by sputtering, vapor deposition or the like on a flexible printed circuit board bonded with an adhesive is used to prevent airflow from the substrate surface. Forming a metal (aluminum)
By forming a film, it is possible to form a film of good quality even when the adhesive for the coverlay is insufficiently cured or the amount of water absorption is large.
【図１】本発明の第１の実施の形態に係る成膜方法のプ
ロセスを示す断面図及びその拡大図FIG. 1 is a cross-sectional view showing a process of a film forming method according to a first embodiment of the present invention and an enlarged view thereof.
【図２】本発明の第２の実施の形態に係る成膜方法のプ
ロセスを示す断面図FIG. 2 is a sectional view showing a process of a film forming method according to a second embodiment of the present invention.
【図３】本発明の第３の実施の形態に係る成膜方法のプ
ロセスを示す斜視図FIG. 3 is a perspective view showing a process of a film forming method according to a third embodiment of the present invention.
【図４】本発明の第４の実施の形態に係る成膜方法のプ
ロセスを示す斜視図FIG. 4 is a perspective view showing a process of a film forming method according to a fourth embodiment of the present invention.
【図５】本発明の第５の実施の形態に係る成膜方法のプ
ロセスを示す図FIG. 5 is a diagram showing a process of a film forming method according to a fifth embodiment of the present invention.
【図６】本発明の実施の形態に係るアルミ成膜用マスク
を示す図FIG. 6 is a view showing an aluminum film forming mask according to the embodiment of the present invention.
１ フレキシブルプリント基板 ４ 成膜用メタルマスク ８ 通気を阻害する部材 １３ マスクを押圧する板材 ２１ 成膜用メタルマスク ２２ フレキシブルプリント基板 ２３ 固定治具 ３０ フレキシブルプリント基板保持用ベース ３１ 成膜用メタルマスク ３２ フレキシブルプリント基板 ３３ 固定治具 ４０ フレキシブルプリント基板保持用ベース ４１ 成膜用メタルマスク ４２ フレキシブルプリント基板 ４３ 固定治具 ６０ マスク ６２ 通気を阻害する部材 DESCRIPTION OF SYMBOLS 1 Flexible printed board 4 Metal mask for film formation 8 Member which obstructs ventilation 13 Plate material which presses mask 21 Metal mask for film formation 22 Flexible printed circuit board 23 Fixing jig 30 Base for holding flexible printed circuit board 31 Metal mask for film formation 32 Flexible printed circuit board 33 Fixing jig 40 Flexible printed circuit board holding base 41 Metal mask for film formation 42 Flexible printed circuit board 43 Fixing jig 60 Mask 62 Member that inhibits ventilation
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中上 裕一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 清家 智和 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4K029 BA03 BD00 HA04 5E343 AA33 BB28 DD23 DD25 FF30 GG06 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Yuichi Nakagami 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. F term (reference) 4K029 BA03 BD00 HA04 5E343 AA33 BB28 DD23 DD25 FF30 GG06
Claims (5)
シブルプリント基板の上に、成膜用の開口部の周囲に通
気を阻害する部材を形成したマスクを設置する工程と、
前記基板上に金属を成膜する工程とを有することを特徴
とする成膜方法。1. A step of installing a mask having a member that inhibits airflow around a film-forming opening on a flexible printed circuit board bonded with an adhesive;
Forming a metal film on the substrate.
スクを押圧することを特徴とする請求項１、２のいずれ
かに記載の成膜方法。2. The film forming method according to claim 1, wherein the substrate surface and the mask are pressed by a member having a spring property.
れ、接着剤により貼り合わせを行ったフレキシブルプリ
ント基板の上に、マスクを設置する工程と、バネ性を有
する部材により、前記基板面と前記マスクを押圧する工
程と、前記基板上に金属を成膜する工程とを有すること
を特徴とする成膜方法。3. A step of installing a mask on a flexible printed circuit board mounted on a base having a convex curved surface and bonded with an adhesive; A film forming method, comprising: pressing the mask; and forming a metal film on the substrate.
阻害する部材を形成したことを特徴とする請求項４に記
載の成膜方法。4. The film forming method according to claim 4, wherein a member that inhibits ventilation is formed around the film forming opening of the mask.
工程を有したことを特徴とするプリント基板の製造方
法。5. A method for manufacturing a printed circuit board, comprising a step of forming a film by the method according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001146191A JP2002344115A (en) | 2001-05-16 | 2001-05-16 | Method of forming film and method of manufacturing printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001146191A JP2002344115A (en) | 2001-05-16 | 2001-05-16 | Method of forming film and method of manufacturing printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002344115A true JP2002344115A (en) | 2002-11-29 |
Family
ID=18991880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001146191A Pending JP2002344115A (en) | 2001-05-16 | 2001-05-16 | Method of forming film and method of manufacturing printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002344115A (en) |
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-
2001
- 2001-05-16 JP JP2001146191A patent/JP2002344115A/en active Pending
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