JP2002329892A - Luminous display device and manufacturing method therefor - Google Patents

Luminous display device and manufacturing method therefor

Info

Publication number
JP2002329892A
JP2002329892A JP2001131457A JP2001131457A JP2002329892A JP 2002329892 A JP2002329892 A JP 2002329892A JP 2001131457 A JP2001131457 A JP 2001131457A JP 2001131457 A JP2001131457 A JP 2001131457A JP 2002329892 A JP2002329892 A JP 2002329892A
Authority
JP
Japan
Prior art keywords
resin
display device
light
opening
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001131457A
Other languages
Japanese (ja)
Other versions
JP4899252B2 (en
Inventor
Yasuko Hashiguchi
安子 橋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001131457A priority Critical patent/JP4899252B2/en
Publication of JP2002329892A publication Critical patent/JP2002329892A/en
Application granted granted Critical
Publication of JP4899252B2 publication Critical patent/JP4899252B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a luminous display device wherein a resin is mounted from the end surface of a reflecting case with no leakage of resin to efficiently take out light. SOLUTION: An annular recessed part 8 is formed by providing a V-like cut on an end surface 1a on an opening side of a resin filling part 7 of a reflecting case 1, so that an epoxy resin R so injected as to be mounded on the resin filling part 7 is prevented from flowing out of the reflecting case 1 due to falling of viscosity at curing, thus mounding the epoxy resin R to form a convex lens.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、発光素子を反射ケ
ース内に設け樹脂封止してレンズを形成した発光表示装
置およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting display device in which a light emitting element is provided in a reflection case and sealed with a resin to form a lens, and a method of manufacturing the same.

【０００２】[0002]

【従来の技術】発光素子である発光ダイオード（ＬＥ
Ｄ）は、動作電圧が低く、かつ応答速度が速く、しかも
動作寿命が長いなどの利点があるため、各種表示装置の
光源として使用されている。特に、近年では、電気機器
の小型化の要求に応じるため表面実装用のチップ型発光
表示装置が使用されている。ＬＥＤを用い、かつ反射ケ
ースを有する従来の表面実装型のチップ型発光表示装置
（以下、チップＬＥＤという）の構成について図面を参
照して説明する。2. Description of the Related Art A light emitting diode (LE) as a light emitting element
D) is used as a light source for various display devices because it has advantages such as low operating voltage, high response speed, and long operating life. In particular, in recent years, chip-type light emitting display devices for surface mounting have been used in order to meet the demand for miniaturization of electric equipment. The configuration of a conventional surface-mounted chip-type light-emitting display device (hereinafter, referred to as a chip LED) using an LED and having a reflective case will be described with reference to the drawings.

【０００３】図４に反射ケースを有するチップＬＥＤの
従来例を示す。同図（ａ）はチップＬＥＤの平面図、同
図（ｂ）は（ａ）のチップＬＥＤの断面図であり、箱状
の反射ケース１１に対してリードフレームからなる一対
の電極１２，１３がインサート成形によって設けられて
いる。一方の電極１３の上部は複合発光素子１５を実装
するパット部１３ａであり、このパット部１３ａに塗布
された導電性樹脂である銀ペースト１４を熱硬化させる
ことによって複合発光素子１５が電極１３と電気的およ
び機械的に接続されている。他方の電極１２の上部は、
複合発光素子１５と金属ワイヤ１６にて電気的に接続さ
れるボンディングパット部１２ａとなっている。FIG. 4 shows a conventional example of a chip LED having a reflection case. 2A is a plan view of the chip LED, and FIG. 2B is a cross-sectional view of the chip LED of FIG. 2A. It is provided by insert molding. An upper portion of one electrode 13 is a pad portion 13a on which the composite light emitting element 15 is mounted. The composite light emitting element 15 is connected to the electrode 13 by thermosetting a silver paste 14 which is a conductive resin applied to the pad portion 13a. Electrically and mechanically connected. The upper part of the other electrode 12
The bonding pad portion 12a is electrically connected to the composite light emitting element 15 and the metal wire 16.

【０００４】反射ケース１１は、複合発光素子１５から
の光の取り出し効率を向上させるために白色の高耐熱樹
脂によって成形されている。さらに複合発光素子１５と
金属ワイヤ１６の保護と、光の取り出し効率向上のため
に、透光性のエポキシ樹脂を反射ケース１１の樹脂充填
部１７に注入した後、加熱・硬化させてレンズを形成す
ることによってチップＬＥＤが構成される。このとき、
エポキシ樹脂を反射ケース１１の端面１１ａと平坦に注
入し、加熱・効果させると、エポキシ樹脂は硬化・収縮
により体積が減少し、硬化後に反射ケース１１の端面１
１ａよりも凹んだ状態（図４（ｂ）参照）になる。そこ
で、予め図４（ｂ）に破線にて示すエポキシ樹脂の硬化
・収縮量を見込んだり、あるいは凸状レンズを形成した
りする場合には、エポキシ樹脂を反射ケース１１の樹脂
充填部１７に多めに注入し、同図（ｃ）に示すようにエ
ポキシ樹脂の表面が反射ケース１１の端面１１ａから凸
状に盛り上がった状態にする。The reflection case 11 is made of a white heat-resistant resin in order to improve the efficiency of extracting light from the composite light emitting element 15. Further, in order to protect the composite light emitting element 15 and the metal wire 16 and to improve the light extraction efficiency, a translucent epoxy resin is injected into the resin filling portion 17 of the reflection case 11 and then heated and cured to form a lens. By doing so, a chip LED is configured. At this time,
When the epoxy resin is injected flat with the end face 11a of the reflection case 11 and heated and effected, the epoxy resin decreases in volume due to curing and shrinkage.
It is in a state recessed from 1a (see FIG. 4B). Therefore, when the hardening / shrinkage amount of the epoxy resin indicated by the broken line in FIG. 4B is anticipated, or when a convex lens is formed, a larger amount of the epoxy resin is used in the resin filling portion 17 of the reflection case 11. To form a state in which the surface of the epoxy resin protrudes from the end face 11a of the reflection case 11 in a convex shape as shown in FIG.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、その状
態のまま加熱・硬化させると、硬化時にエポキシ樹脂は
その粘度低下により反射ケース１１の端面１１ａ上に流
れてしまい、周囲への樹脂漏れが生じ、輝度の不足、外
形寸法異常、端子樹脂付着による半田濡れ性悪化等を引
き起こす。However, if the resin is heated and cured in that state, the epoxy resin flows on the end face 11a of the reflection case 11 due to a decrease in the viscosity during curing, causing resin leakage to the surroundings. Insufficient brightness, abnormal external dimensions, deterioration of solder wettability due to terminal resin adhesion, etc. are caused.

【０００６】そこで、本発明においては、樹脂漏れを発
生させることなく樹脂を反射ケースの端面から盛り上げ
て注入し、加熱、硬化させることにより、効率良く光を
取り出し可能とした発光表示装置およびその製造方法を
提供する。Accordingly, in the present invention, a light-emitting display device capable of extracting light efficiently by raising and injecting resin from the end face of the reflection case without causing resin leakage, and then heating and curing the resin, and manufacturing the same. Provide a way.

【０００７】[0007]

【課題を解決するための手段】上記課題を解決するため
本発明の発光表示装置は、反射ケースの樹脂充填部の開
口側の端面に樹脂の流れを堰き止めるための凹部または
凸部を設け、樹脂充填部に注入した樹脂の硬化時の粘度
低下による流れを凹部または凸部によって堰き止めるよ
うにしたものである。In order to solve the above-mentioned problems, a light emitting display device according to the present invention is provided with a concave portion or a convex portion for blocking a resin flow on an opening-side end surface of a resin filling portion of a reflection case, The flow caused by the decrease in the viscosity of the resin injected into the resin filling portion during the curing is blocked by the concave or convex portions.

【０００８】本発明によれば、樹脂充填部に注入した樹
脂の漏れが発生することなく、樹脂を盛り上げてレンズ
を形成することで効率良く光を取り出し可能とした発光
表示装置が得られる。According to the present invention, it is possible to obtain a light-emitting display device in which light can be efficiently extracted by forming a lens by raising the resin without causing leakage of the resin injected into the resin-filled portion.

【０００９】[0009]

【発明の実施の形態】請求項１に記載の発明は、発光素
子を設けた反射ケースの樹脂充填部に樹脂を注入し、加
熱、硬化させることによりレンズを形成したことを特徴
とする発光表示装置において、前記反射ケースの樹脂充
填部の開口側の端面に前記樹脂の流れを堰き止めるため
の凹部または凸部を設けた発光表示装置であり、樹脂充
填部に注入した樹脂の硬化時の粘度低下による流れを凹
部または凸部によって堰き止めることができる。The invention according to claim 1 is characterized in that a lens is formed by injecting a resin into a resin-filled portion of a reflection case provided with a light-emitting element, and heating and curing the resin. The device is a light emitting display device provided with a concave portion or a convex portion for blocking a flow of the resin on an end surface on an opening side of a resin filling portion of the reflection case, wherein a viscosity of the resin injected into the resin filling portion at the time of curing is provided. The flow due to the drop can be blocked by the concave portion or the convex portion.

【００１０】請求項２に記載の発明は、前記樹脂充填部
の開口は滑らかな形状とし、前記凹部または凸部は前記
開口に沿って形成したことを特徴とする請求項１記載の
発光表示装置であり、樹脂充填部に注入した樹脂は滑ら
かな形状とした開口から周囲に一様に拡がるため、この
開口に沿って形成した凹部または凸部によって堰き止
め、レンズの外形を滑らかに仕上げることができる。According to a second aspect of the present invention, the opening of the resin filling portion has a smooth shape, and the concave portion or the convex portion is formed along the opening. Since the resin injected into the resin-filled portion uniformly spreads from the smooth opening to the periphery, it can be blocked by concave portions or convex portions formed along the opening to smoothly finish the outer shape of the lens. it can.

【００１１】請求項３に記載の発明は、発光素子を設け
た反射ケースの樹脂充填部に樹脂を注入し、加熱、硬化
させることによりレンズを形成する発光表示装置の製造
方法であって、前記反射ケースの樹脂充填部の開口側の
側面に前記樹脂の流れを堰き止めるための凹部または凸
部を設け、前記樹脂充填部に樹脂を注入し、前記樹脂充
填部の開口を重力方向に向けて放置した後、硬化炉内で
加熱、硬化させることを特徴とする発光表示装置の製造
方法であり、樹脂充填部に注入した樹脂の硬化時の粘度
低下による流れは凹部または凸部によって堰き止められ
るうえ、樹脂充填部の開口から注入樹脂が重力方向に盛
り上がるようになるため形成するレンズの外形を容易に
凸状とすることができる。According to a third aspect of the present invention, there is provided a method for manufacturing a light-emitting display device, wherein a resin is injected into a resin-filled portion of a reflection case provided with a light-emitting element, and the lens is formed by heating and curing the resin. A concave portion or a convex portion for blocking the flow of the resin is provided on the side surface on the opening side of the resin filling portion of the reflection case, the resin is injected into the resin filling portion, and the opening of the resin filling portion is directed in the direction of gravity. A method for manufacturing a light-emitting display device, characterized by heating and curing in a curing furnace after standing, wherein a flow due to a decrease in viscosity of the resin injected into the resin filling portion during curing is blocked by the concave portion or the convex portion. In addition, since the injected resin rises in the direction of gravity from the opening of the resin filling portion, the outer shape of the formed lens can be easily made convex.

【００１２】以下、本発明の実施の形態について、図面
を参照して説明する。Hereinafter, embodiments of the present invention will be described with reference to the drawings.

【００１３】図１は本発明の実施の形態におけるチップ
ＬＥＤを示し、（ａ）は平面図、（ｂ）は断面図、図２
は図１のＡ部詳細図である。FIGS. 1A and 1B show a chip LED according to an embodiment of the present invention, wherein FIG. 1A is a plan view, FIG.
FIG. 2 is a detailed view of a portion A in FIG.

【００１４】図１において、本発明の実施の形態におけ
る発光表示装置としてのチップＬＥＤは、上方を開口し
て周囲に側壁１ｂが形成された箱状をなす白色の光耐熱
樹脂製の反射ケース１に、リードフレームで形成された
一対の電極２，３がインサート成形によって設けられて
いる。一方の電極３の上部のパット部３ａには複合発光
素子５が銀ペースト４によって電気的および機械的に接
続され、複合発光素子５は他方の電極２の上部のボンデ
ィングパット部２ａに金属ワイヤ６にて電気的に接続さ
れている。ここで、複合発光素子５は、ツェナーダイオ
ードの上に青色ＬＥＤチップをフリップチップ実装し、
さらに青色ＬＥＤチップの周りに蛍光体を塗布した白色
の複合発光素子である。In FIG. 1, a chip LED as a light-emitting display device according to an embodiment of the present invention is a box-shaped reflective case 1 made of a light-resistant resin having a white shape and having an upper opening and a side wall 1b formed therearound. In addition, a pair of electrodes 2 and 3 formed of a lead frame are provided by insert molding. A composite light emitting element 5 is electrically and mechanically connected to a pad portion 3a above one electrode 3 by a silver paste 4 and a metal wire 6 is connected to a bonding pad portion 2a above the other electrode 2. Are electrically connected. Here, the composite light emitting element 5 is formed by flip-chip mounting a blue LED chip on a zener diode,
Further, it is a white composite light emitting device in which a phosphor is applied around a blue LED chip.

【００１５】反射ケース１の側壁１ｂによって囲まれた
パラボラ状の空間は、エポキシ樹脂Ｒを充填してレンズ
を形成するための樹脂充填部７である。樹脂充填部７に
エポキシ樹脂Ｒを注入する反射ケース１の開口は、図１
（ａ）に示すように滑らかな楕円形状とし、また側壁１
ｂの上面すなわち反射ケース１の開口側の端面１ａに
は、この開口の周縁に沿うように環状の凹部８が設けら
れている。The parabolic space surrounded by the side wall 1b of the reflection case 1 is a resin filling portion 7 for filling the epoxy resin R to form a lens. The opening of the reflection case 1 for injecting the epoxy resin R into the resin filling portion 7 is shown in FIG.
(A) As shown in FIG.
An annular concave portion 8 is provided on the upper surface of b, that is, on the end surface 1a on the opening side of the reflective case 1 along the periphery of the opening.

【００１６】凹部８は、図２に示すように側壁１ｂの端
面１ａにＶ字状の切り欠きを形成して、樹脂充填部７に
盛り上げるように注入したエポキシ樹脂Ｒが、その硬化
時の粘度低下により反射ケース１の外側に流れようとす
るのを堰き止めるようにしたものである。このような凹
部８の内側に流れ込んだエポキシ樹脂Ｒは、図２に示す
ように凹部８の内面によって堰き止められる。As shown in FIG. 2, the concave portion 8 has a V-shaped notch formed in the end surface 1a of the side wall 1b, and the epoxy resin R injected so as to swell the resin filling portion 7 has a viscosity at the time of curing. In this case, the flow to the outside of the reflection case 1 due to the drop is blocked. The epoxy resin R flowing into the inside of the recess 8 is blocked by the inner surface of the recess 8 as shown in FIG.

【００１７】すなわち、樹脂充填部７に注入したエポキ
シ樹脂Ｒの硬化時の粘度低下による流れは凹部８によっ
て堰き止められるため、エポキシ樹脂Ｒが側壁１ｂの端
面１ａから漏れることがなく、エポキシ樹脂Ｒを盛り上
げてレンズを形成することが可能となる。したがって、
本実施形態におけるチップＬＥＤは、図１（ｂ）に示す
ように上方（光の取り出し方向）に向かって凸状のレン
ズを形成したものとなり、効率良く光を取り出し可能と
した高輝度のチップＬＥＤとなる。That is, since the flow of the epoxy resin R injected into the resin filling portion 7 due to the decrease in the viscosity at the time of curing is blocked by the concave portion 8, the epoxy resin R does not leak from the end surface 1a of the side wall 1b. Can be raised to form a lens. Therefore,
As shown in FIG. 1B, the chip LED according to the present embodiment is formed by forming a convex lens upward (in the light extraction direction), and is a high-brightness chip LED capable of efficiently extracting light. Becomes

【００１８】また、本実施形態のチップＬＥＤにおいて
は、樹脂充填部７の開口を滑らかな楕円形状とし、凹部
８をこの開口に沿って形成したものとすることで、開口
から周囲に向かってエポキシ樹脂Ｒが一様に拡がるよう
になる。また、このとき、エポキシ樹脂Ｒが凹部８によ
って堰き止められることで、レンズの外形が滑らかな楕
円形状として仕上げられるため、さらに高輝度のチップ
ＬＥＤとなる。In the chip LED of the present embodiment, the opening of the resin-filled portion 7 has a smooth elliptical shape, and the concave portion 8 is formed along the opening. The resin R spreads uniformly. At this time, since the epoxy resin R is blocked by the concave portions 8, the outer shape of the lens is finished as a smooth elliptical shape, so that the chip LED has a higher luminance.

【００１９】ところで、前述の凹部８に代えて、図３に
示すような凸部９を設けることも可能である。凸部９
は、側壁１ｂの端面１ａに逆Ｖ字状の突起として形成す
ることができる。これにより、樹脂充填部７に盛り上げ
るように注入したエポキシ樹脂Ｒが凸部９の側面によっ
て堰き止められ、前述の凹部８と同様にエポキシ樹脂Ｒ
が側壁１ｂの端面１ａから漏れるのを防止して、高輝度
のチップＬＥＤを得ることができる。なお、凹部８およ
び凸部９は図２および図３に示すような形状に限定され
るものではなく、エポキシ樹脂Ｒの流れを堰き止めるこ
とが可能なように適宜その形状を変えることが可能であ
る。By the way, it is also possible to provide a projection 9 as shown in FIG. Convex part 9
Can be formed as an inverted V-shaped projection on the end surface 1a of the side wall 1b. As a result, the epoxy resin R injected so as to swell into the resin filling portion 7 is blocked by the side surface of the convex portion 9, and the epoxy resin R
Is prevented from leaking from the end surface 1a of the side wall 1b, and a high-intensity chip LED can be obtained. The shapes of the concave portion 8 and the convex portion 9 are not limited to those shown in FIGS. 2 and 3, but can be changed as appropriate so that the flow of the epoxy resin R can be blocked. is there.

【００２０】次に、図１に示すチップＬＥＤの製造方法
について説明する。Next, a method of manufacturing the chip LED shown in FIG. 1 will be described.

【００２１】まず、図１に示す反射ケース１の樹脂充填
部７の開口より、エポキシ樹脂Ｒを注入する。このと
き、エポキシ樹脂Ｒは粘度が高いため樹脂充填部７から
盛り上げた状態まで注入することができ、また硬化が始
まって粘度低下が起きても反射ケース１には環状の凹部
８または凸部９が設けられているため漏れることがな
い。First, an epoxy resin R is injected from the opening of the resin filling portion 7 of the reflection case 1 shown in FIG. At this time, since the epoxy resin R has a high viscosity, the epoxy resin R can be injected from the resin filling portion 7 to a raised state, and even if the curing starts and the viscosity decreases, the reflecting case 1 has an annular concave portion 8 or a convex portion 9. There is no leakage due to being provided.

【００２２】そして、このエポキシ樹脂Ｒの注入後、樹
脂充填部７の開口を重力方向に向けた状態（図１（ｂ）
の上下を逆とした状態）で４０分以上放置する。この硬
化時のエポキシ樹脂Ｒの粘度低下によって、エポキシ樹
脂Ｒは樹脂充填部７の開口から重力方向（図１（ｂ）の
上方向）に盛り上がるようになる。その後、硬化炉で加
熱し（１１５℃，１２時間）、樹脂を硬化させることに
より凸状のレンズを形成する。After the epoxy resin R is injected, the opening of the resin filling portion 7 is oriented in the direction of gravity (FIG. 1B).
(Upside down) for 40 minutes or more. Due to the decrease in the viscosity of the epoxy resin R during the curing, the epoxy resin R rises from the opening of the resin filling portion 7 in the direction of gravity (upward in FIG. 1B). Thereafter, the resin is heated in a curing furnace (115 ° C., 12 hours), and the resin is cured to form a convex lens.

【００２３】このように、本実施形態における反射ケー
ス１では、樹脂充填部７に注入したエポキシ樹脂Ｒの硬
化時の粘度低下による流れは凹部８または凸部９によっ
て堰き止められるうえ、樹脂充填部７の開口から注入樹
脂が重力方向に盛り上がるようになるため形成するレン
ズの外形を容易に凸状とすることができる。すなわち、
樹脂充填部７に注入したエポキシ樹脂Ｒの漏れを発生さ
せることなく、エポキシ樹脂Ｒを盛り上げて凸状のレン
ズを形成し、効率良く光を取り出した高輝度の発光表示
装置を得ることができる。As described above, in the reflection case 1 of the present embodiment, the flow due to the decrease in the viscosity of the epoxy resin R injected into the resin filling portion 7 at the time of curing is blocked by the concave portion 8 or the convex portion 9 and the resin filling portion Since the injected resin rises in the direction of gravity from the opening 7, the outer shape of the lens to be formed can be easily made convex. That is,
Without causing leakage of the epoxy resin R injected into the resin filling portion 7, the epoxy resin R is raised to form a convex lens, and a high-luminance light-emitting display device that efficiently extracts light can be obtained.

【００２４】[0024]

【発明の効果】本発明によれば、樹脂充填部に注入した
樹脂の硬化時の粘度低下による流れを凹部または凸部に
よって堰き止め、樹脂充填部に注入した樹脂の漏れを発
生させることなく、樹脂を盛り上げてレンズを形成し、
効率良く光を取り出した高輝度の発光表示装置が得られ
る。According to the present invention, the flow caused by the decrease in the viscosity of the resin injected into the resin-filled portion at the time of curing is blocked by the concave portion or the convex portion, and the resin injected into the resin-filled portion does not leak. Raise the resin to form a lens,
A high-luminance light-emitting display device from which light is efficiently extracted can be obtained.

【００２５】また、樹脂充填部の開口を滑らかな形状と
し、この開口に沿って形成した凹部または凸部によって
開口から周囲に一様に拡がる樹脂を堰き止め、レンズの
外形を滑らかに仕上げてさらに高輝度の発光表示装置が
得られる。Further, the opening of the resin-filled portion is formed in a smooth shape, and the resin which spreads uniformly from the opening to the periphery is blocked by the concave portion or the convex portion formed along the opening, so that the outer shape of the lens is finished smoothly. A high-luminance light-emitting display device can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施の形態におけるチップＬＥＤを示
し、（ａ）は平面図 （ｂ）は断面図FIG. 1 shows a chip LED according to an embodiment of the present invention, wherein (a) is a plan view and (b) is a cross-sectional view.

【図２】図１のＡ部詳細図FIG. 2 is a detailed view of part A of FIG.

【図３】図１のＡ部の別の実施形態を示す詳細図FIG. 3 is a detailed view showing another embodiment of the part A in FIG. 1;

【図４】従来の反射ケースを有するチップＬＥＤの例を
示し、（ａ）は平面図 （ｂ）は断面図 （ｃ）は別の例を示す断面図4A and 4B show examples of a conventional chip LED having a reflective case, wherein FIG. 4A is a plan view, FIG. 4B is a sectional view, and FIG. 4C is a sectional view showing another example.

【符号の説明】[Explanation of symbols]

１ 反射ケース １ａ 端面 １ｂ 側壁 ２，３ 電極 ２ａ ボンディングパット部 ３ａ パット部 ４ 銀ペースト ５ 複合発光素子 ６ 金属ワイヤ ７ 樹脂充填部 ８ 凹部 ９ 凸部 DESCRIPTION OF SYMBOLS 1 Reflective case 1a End surface 1b Side wall 2, 3 Electrode 2a Bonding pad part 3a Pad part 4 Silver paste 5 Composite light emitting element 6 Metal wire 7 Resin filling part 8 Concave part 9 Convex part

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 発光素子を設けた反射ケースの樹脂充填
部に樹脂を注入し、加熱、硬化させることによりレンズ
を形成した発光表示装置において、前記反射ケースの樹
脂充填部の開口側の端面に前記樹脂の流れを堰き止める
ための凹部または凸部を設けたことを特徴とする発光表
示装置。1. A light-emitting display device in which a lens is formed by injecting a resin into a resin-filled portion of a reflective case provided with a light-emitting element, and heating and curing the resin to form a lens. A light emitting display device comprising a concave portion or a convex portion for blocking the flow of the resin. 【請求項２】 前記樹脂充填部の開口は滑らかな形状と
し、前記凹部または凸部は前記開口に沿って形成したこ
とを特徴とする請求項１記載の発光表示装置。2. The light emitting display device according to claim 1, wherein the opening of the resin filling portion has a smooth shape, and the concave portion or the convex portion is formed along the opening. 【請求項３】 発光素子を設けた反射ケースの樹脂充填
部に樹脂を注入し、加熱、硬化させることによりレンズ
を形成する発光表示装置の製造方法であって、前記反射
ケースの樹脂充填部の開口側の側面に前記樹脂の流れを
堰き止めるための凹部または凸部を設け、前記樹脂充填
部に樹脂を注入し、前記樹脂充填部の開口を重力方向に
向けて放置した後、硬化炉内で加熱、硬化させることを
特徴とする発光表示装置の製造方法。3. A method for manufacturing a light-emitting display device in which a resin is injected into a resin-filled portion of a reflective case provided with a light-emitting element, and heated and cured to form a lens, wherein the resin-filled portion of the reflective case is provided. After providing a concave portion or a convex portion for blocking the flow of the resin on the side surface on the opening side, injecting the resin into the resin filling portion, and leaving the opening of the resin filling portion facing the direction of gravity, the inside of the curing furnace A method for manufacturing a light-emitting display device, wherein the method comprises heating and curing the device.
JP2001131457A 2001-04-27 2001-04-27 Method for manufacturing light-emitting display device Expired - Fee Related JP4899252B2 (en)

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