JP2002317810A - Suction structure for printed circuit board material - Google Patents
Suction structure for printed circuit board materialInfo
- Publication number
- JP2002317810A JP2002317810A JP2001122113A JP2001122113A JP2002317810A JP 2002317810 A JP2002317810 A JP 2002317810A JP 2001122113 A JP2001122113 A JP 2001122113A JP 2001122113 A JP2001122113 A JP 2001122113A JP 2002317810 A JP2002317810 A JP 2002317810A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- board material
- lip
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manipulator (AREA)
- Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
- Laser Beam Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、プリント基板材
を真空吸着するときに使用される吸着構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction structure used when vacuuming a printed circuit board material.
【０００２】[0002]
【従来の技術】プリント基板材を基板材保持装置に真空
吸着保持して露光マスクと密着させ、プリント基板材に
露光マスクの回路パターンを焼き付ける基板露光装置が
公知である。例えば特開平１０−３３３３３７号の図１
４〜１６に開示の基板露光装置を図７で説明すれば、図
７の左側の搬送装置上を水平搬送されてきたプリント基
板材Ｗを搬入側（左側）の回動スライド機枠Ａで吸着保
持して９０度揺動させて垂直状態とし、そのプリント基
板材Ｗを授受位置Ｐ１にある可動保持ベースＢｅの一方
のプリント基板材保持装置Ｂ１に吸着保持させて露光マ
スクＣ１と対向する露光位置Ｐ２まで上昇移動させ、露
光位置Ｐ２で露光マスクＣ１とプリント基板材Ｗとを密
着させてプリント基板材Ｗの一面を露光処理し、次い
で、一対ある一方の基板受け渡し装置Ｄ１を前記プリン
ト基板材保持装置Ｂ１に対向させて前記プリント基板材
Ｗを吸着し、プリント基板材保持装置Ｂ１が次のプリン
ト基板材Ｗを装着するために可動保持ベースＢｅが授受
位置Ｐ１に移動する一方、一方の基板受け渡し装置Ｄ１
に吸着されているプリント基板材Ｗを他方の基板受け渡
し装置Ｄ２に吸着受け渡し、次のプリント基板材Ｗをプ
リント基板材保持装置Ｂ１に受け取って露光位置Ｐ２に
戻ってきた可動保持ベースＢｅの反対側のプリント基板
材保持装置Ｂ２に、前記他方の基板受け渡し装置Ｄ２か
らプリント基板材Ｗを受け渡して吸着保持させ、今度
は、プリント基板材Ｗの反対側面を他方の露光マスクＣ
２を介して露光処理し、こうして両面を露光処理された
基板材Ｗは、プリント基板材保持装置Ｂ２に吸着保持さ
れたまま、可動保持ベースＢｅが授受位置Ｐ１にもどっ
て、排出側（図で右側）の回動スライド機枠Ａに垂直状
態で吸着保持され、排出側の回動スライド機枠Ａが水平
に揺動して、排出側の搬送装置で機台外側に排出するよ
うになっている。2. Description of the Related Art There is known a substrate exposing apparatus which vacuum-holds a printed circuit board material to a substrate material holding device, makes it adhere to an exposure mask, and prints a circuit pattern of the exposure mask on the printed board material. For example, FIG. 1 of JP-A-10-333337
The substrate exposure apparatus disclosed in 4 to 16 will be described with reference to FIG. 7. The printed board material W horizontally transported on the transport device on the left side of FIG. 7 is sucked by the rotating slide machine frame A on the loading side (left side). The printed board material W is held vertically by swinging 90 degrees, and the printed board material W is sucked and held by the one printed board material holding device B1 of the movable holding base Be at the transfer position P1 to expose the exposure mask C1. P2, the exposure mask C1 and the printed circuit board material W are brought into close contact with each other at the exposure position P2 to expose one surface of the printed circuit board material W, and then one of the pair of substrate transfer devices D1 is used to hold the printed circuit board material. The movable board base Be moves to the transfer position P1 so that the printed circuit board material W is sucked while facing the apparatus B1, and the printed circuit board material holding apparatus B1 mounts the next printed circuit board material W. Person, one of the substrate transfer apparatus D1
The other side of the movable holding base Be returned to the exposure position P2 by receiving the next printed board material W by the printed board material holding device B1 and transferring the next printed board material W to the other board transferring device D2 by suction. The printed circuit board material holding device B2 transfers the printed circuit board material W from the other substrate transfer device D2 to be sucked and held, and then the other side of the printed circuit board material W is exposed to the other exposure mask C
The substrate material W subjected to the exposure processing through the substrate 2 and thus exposed on both sides is returned to the transfer position P1 by the movable holding base Be while being sucked and held by the printed board material holding device B2, and is discharged (see FIG. (Right side) is vertically held by the rotary slide machine frame A, and the discharge-side rotary slide machine frame A swings horizontally and is discharged to the outside of the machine by the discharge-side transfer device. I have.
【０００３】[0003]
【発明が解決しようとする課題】前記の露光装置におい
て、回動スライド機枠Ａに備えた吸着装置、基板受け渡
し装置Ｄ１、Ｄ２に備えた吸着装置は、バキューム圧が
作用する吸引孔Ｅを中心に備えた弾性材料から成る複数
の真空吸着パッド（吸盤）Ｆによる場合（図８）と、樹
脂やアルミなどの変形しにくい材料の平面から成る吸着
面Ｇに、バキューム圧の作用する多数の吸引孔Ｈを形成
した面吸着構造による場合（図９）とがあった。ここで
は、基板受け渡し装置Ｄ１（Ｄ２）を例示している。真
空吸着パッド方式は、一般的に吸着力が大きいので、重
量の大きな板厚の厚いプリント基板材Ｗを保持するのに
適しているが、板厚の薄い（１ｍｍ以下）あるいは剛性
の小さなプリント基板材Ｗに対しては吸着力が大き過ぎ
て基板材自体が変形する問題があった。他方、面吸着方
式では、プリント基板材Ｗを硬く広い平面に密着させる
ように吸着するため、薄い板厚のプリント基板材であっ
ても変形なく吸着できる。しかし、図１０に示すよう
に、板厚の厚いプリント基板材Ｗのように発生した反り
が残りやすい基板材Ｗでは、そのような反りがあること
により吸引孔Ｈとの間に隙間ができて外気が流入してバ
キューム源１７のバキューム圧が有効に作用せず吸着で
きないという問題がある。そのため、これまでは、プリ
ント基板材の厚みにより、これらの吸着方式が夫々使い
分けられており、管理する部品種類が増える問題があっ
た。In the above-mentioned exposure apparatus, the suction device provided in the rotary slide frame A and the suction devices provided in the substrate transfer devices D1 and D2 are mainly provided with suction holes E on which vacuum pressure acts. A plurality of vacuum suction pads (suckers) F made of an elastic material provided in FIG. 8 (FIG. 8), and a large number of suctions on which a suction pressure G acts on a suction surface G made of a flat surface of a hardly deformable material such as resin or aluminum. In some cases, the surface was attracted by a surface suction structure having holes H (FIG. 9). Here, the substrate transfer device D1 (D2) is illustrated. The vacuum suction pad method is generally suitable for holding a heavy printed board material W having a large board thickness because of its large suction force. However, the vacuum suction pad system has a small board thickness (1 mm or less) or a printed board having a small rigidity. There is a problem that the substrate material itself is deformed due to too large an attraction force to the plate material W. On the other hand, in the surface suction method, since the printed circuit board material W is suctioned so as to be in close contact with a hard and wide plane, even a thin printed board material can be suctioned without deformation. However, as shown in FIG. 10, in a substrate material W in which the generated warpage tends to remain, such as a thick printed circuit board material W, a gap is formed between the substrate material W and the suction hole H due to such warpage. There is a problem that the outside air flows in and the vacuum pressure of the vacuum source 17 does not work effectively, so that the suction cannot be performed. Therefore, hitherto, these suction methods have been properly used depending on the thickness of the printed circuit board material, and there has been a problem that the types of components to be managed increase.
【０００４】また、プリント基板材保持装置Ｂ１（Ｂ
２）では、露光マスクＣ１（Ｃ２）とプリント基板材Ｗ
を面一に密着させる必要性から、板厚に関係なく上記面
吸着方式が採用されていたが、上記のような問題がある
ことから、板厚が大きくて反りがあるようなプリント基
板材も吸着保持できるように、吸着圧力を大きくするな
どして対処しており、真空圧発生源の能力を高くしなけ
ればならないなどの問題がある。この発明は、上記問題
を解消して反り（ひずみ）があるような厚いプリント基
板材も、変形しやすい薄いプリント基板材も、確実に吸
着保持できる吸着構造を提供することを目的とする。Further, a printed board material holding device B1 (B
In 2), the exposure mask C1 (C2) and the printed circuit board material W
Due to the necessity of making the surfaces in close contact, the above-mentioned surface suction method was adopted regardless of the board thickness.However, due to the above-mentioned problems, printed board materials with large board thickness and warpage may be used. In order to be able to hold by suction, measures are taken by increasing the suction pressure and the like, and there is a problem that the capability of the vacuum pressure source must be increased. SUMMARY OF THE INVENTION It is an object of the present invention to provide a suction structure capable of reliably sucking and holding a thick printed circuit board material having warpage (distortion) and a thin printed circuit board material which is easily deformed by solving the above problem.
【０００５】[0005]
【課題を解決するための手段】上記課題解決のため、本
願吸着構造では、吸着部材を金属、樹脂材料など、変形
容易でない材料から構成し、その吸着部材の前面を平面
から成る吸着面とし、その吸着面には、バキューム源に
連通される多数の吸引孔を設け、前記吸着面の周囲を取
り囲んで弾性材料から成る真空漏れ防止リップを設け、
該リップの外周縁を含む平面は、前記吸着面とほぼ同一
平面に形成されていることを特徴とする。詳しくは、リ
ップ外周縁を含む平面が吸着面に対してほぼ同一平面と
みなされる程度に僅かに前方に位置している。一層具体
的には、吸着面の外周に嵌め込み部を形成し、その嵌め
込み部に真空漏れ防止リップを有するリップ部材を嵌合
して成る。これらの構成によれば、薄い基板材を吸着し
た場合であっても、吸着面が容易に変形しない平面であ
り、しかも、リップの外周面を含む平面がほぼ吸着面と
ほぼ同一平面に形成されていることから、リップを変形
させる抵抗が小さく、薄い基板材をその平面から成る吸
着面に面一に吸着できて、変形をもたらすことがない。
また、歪みがあるようなプリント基板材であって、吸着
面との間に隙間が生じるような場合でも、吸着面外周を
囲む真空漏れ防止リップがプリント基板材表面に接触し
てリップ内側空間が閉じられて吸引圧力が有効に作用し
て吸引作用を行うため、プリント基板材を強力に吸着で
きる。さらに、プリント基板材を吸着面から引き離す方
向の外力が作用して、基板材が吸着面から引き離される
ように引っ張られたときには、リップ部が自体の弾性に
より基板材に吸着された状態で変形するため、基板材と
吸着面が密着状態では孔の総面積と吸引圧の積であった
吸引力が、吸引圧の作用面積が広がることにより大きく
なり、より吸着力が大きくなる。そのため、吸着面から
プリント基板材を引き離そうとする外力が作用しても、
容易には引き離されず、基板材を吸着状態に維持でき
る。吸着パッドは、シリコンゴムから構成されると好適
である。これによれば、例えば、吸着状態で基板材を垂
直に保持する場合に、吸着力に加えて摩擦係数が大きい
ために、保持力が大きく、安定して垂直保持できる。In order to solve the above problems, in the suction structure of the present invention, the suction member is made of a material that is not easily deformable, such as a metal or a resin material, and the front surface of the suction member is a flat suction surface. The suction surface is provided with a number of suction holes communicating with a vacuum source, and a vacuum leakage prevention lip made of an elastic material is provided around the suction surface,
A plane including the outer peripheral edge of the lip is formed substantially flush with the suction surface. Specifically, the plane including the outer peripheral edge of the lip is located slightly forward so as to be regarded as substantially the same plane as the suction surface. More specifically, a fitting portion is formed on the outer periphery of the suction surface, and a lip member having a vacuum leakage prevention lip is fitted into the fitting portion. According to these configurations, even when a thin substrate material is sucked, the suction surface is a plane that is not easily deformed, and the plane including the outer peripheral surface of the lip is formed substantially in the same plane as the suction surface. As a result, the resistance to deform the lip is small, and the thin substrate material can be sucked to the suction surface consisting of the flat surface, so that no deformation occurs.
Also, even in the case of a printed circuit board material that has distortion and a gap is formed between the suction surface and the suction surface, the vacuum leakage prevention lip surrounding the outer periphery of the suction surface comes into contact with the surface of the printed circuit board material and the space inside the lip is reduced. The printed circuit board material can be strongly adsorbed because it is closed and the suction pressure effectively acts to perform the suction action. Further, when an external force acts in a direction to separate the printed circuit board material from the suction surface and the substrate material is pulled to be separated from the suction surface, the lip portion is deformed in a state where the lip portion is sucked to the substrate material by its own elasticity. Therefore, when the substrate material and the suction surface are in close contact with each other, the suction force, which is the product of the total area of the holes and the suction pressure, increases due to an increase in the suction pressure action area, and the suction force further increases. Therefore, even if an external force acts to separate the printed circuit board material from the suction surface,
The substrate material is not easily separated, and the substrate material can be maintained in an adsorbed state. The suction pad is preferably made of silicone rubber. According to this, for example, when the substrate material is vertically held in the suction state, the holding force is large and the vertical holding can be performed stably because the friction coefficient is large in addition to the suction force.
【０００６】[0006]
【発明の実施の形態】前述の図７における基板受け渡し
装置Ｄ２に本願を実施した例を説明する。図１に示すよ
うに、受け渡し装置Ｄ２の本体１は、後方ボックス２の
前面に、シール部材３を介して前プレート４が固着さ
れ、全体が箱形状となっている。前プレート４には、千
鳥配列として５個所の貫通孔５が設けてある。各貫通孔
５に対応して、前プレート４の前面にはＯリング６を介
在して吸着部材７が固着されている。吸着部材７は、ア
ルミ、あるいは、アクリルなどの硬質樹脂材など、容易
には変形しない材質から形成されている。吸着部材７
は、前プレート４への取り付け部から更に前方（基板材
方向）に突出する突出部８を有しており、その突出部８
の前面は、平面から成る吸着面９に形成されている。突
出部８の周囲は、嵌め込み部としての軸部１０となって
いる。この嵌め込み部１０には、リング状のリップ部材
１１の中心孔１２が嵌合されている。リップ部材１１
は、弾性材料（シリコンゴム）から構成され、外方に広
がる真空漏れ防止リップ１３を一体に備えている。リッ
プ部材１１を嵌め込み部１０に嵌め込んだ状態におい
て、前記リップ１３の外周縁１３ａを含む平面が前記吸
着面９に対してほぼ同一平面とみなされる程度に僅かに
前方に位置している。前記吸着面９には、複数の吸引孔
１４が本体内側に形成された吸引空間１５に連通するよ
うに形成されている。その吸引空間１５は、接続管１６
を介してバキューム源１７に連通されている。複数の吸
着部材７は、各吸着面９が、同一面内に位置するように
取り付けられる。DESCRIPTION OF THE PREFERRED EMBODIMENTS An example in which the present invention is applied to the above-described substrate transfer device D2 in FIG. 7 will be described. As shown in FIG. 1, the main body 1 of the transfer device D2 has a front plate 4 fixed to the front surface of a rear box 2 via a seal member 3, and has a box shape as a whole. The front plate 4 is provided with five through holes 5 in a staggered arrangement. A suction member 7 is fixed to the front surface of the front plate 4 via an O-ring 6 corresponding to each through hole 5. The suction member 7 is made of a material that is not easily deformed, such as aluminum or a hard resin material such as acrylic. Suction member 7
Has a protruding portion 8 that protrudes further forward (in the direction of the substrate material) from a portion attached to the front plate 4.
Is formed on a suction surface 9 formed of a flat surface. The periphery of the protruding portion 8 is a shaft portion 10 as a fitting portion. The center hole 12 of the ring-shaped lip member 11 is fitted into the fitting portion 10. Lip member 11
Is made of an elastic material (silicone rubber), and integrally has a vacuum leakage prevention lip 13 extending outward. When the lip member 11 is fitted in the fitting portion 10, the plane including the outer peripheral edge 13 a of the lip 13 is located slightly forward so as to be regarded as substantially the same plane as the suction surface 9. A plurality of suction holes 14 are formed in the suction surface 9 so as to communicate with a suction space 15 formed inside the main body. The suction space 15 is connected to a connection pipe 16.
Through a vacuum source 17. The plurality of suction members 7 are attached such that the suction surfaces 9 are located in the same plane.
【０００７】このような基板受け渡し装置Ｄ２では、基
板材Ｗに当接して吸引孔１４に真空吸引作用を働かせた
とき、薄い基板材では、吸着面９が平面であって、これ
が複数あること、及び、リップ１３が吸着面９とほぼ同
一平面であることから、吸着されるときにリップ１３を
変形させる抵抗が極めて小さく、そのため、薄い基板材
Ｗであっても、吸着状態では、垂直、かつ面一に吸着さ
れてひずみなく吸着される。また、厚い基板材Ｗにおい
て、反りがあるような場合には、吸引孔１４周囲が真空
漏れ防止リップ１３で囲まれていることから、図３に示
すように、吸着面１４と基板材Ｗとの間に隙間があって
も、その外側でリップ１３が基板材Ｗの表面に密着する
ため、リップ１３内側空間が閉ざされて吸引孔１４によ
る真空吸着作用が基板材Ｗに作用する。そのため、従来
であれば、図１０で説明したように、基板材Ｗと吸着面
９との間に隙間ができることで、吸着機能を発揮できな
い吸引孔１４が発生して吸着作用が低下していた不具合
が解消される。In such a substrate transfer device D2, when a vacuum suction action is applied to the suction holes 14 in contact with the substrate material W, the suction surface 9 is flat for a thin substrate material, and a plurality of suction surfaces 9 are provided. Further, since the lip 13 is substantially flush with the suction surface 9, the resistance to deform the lip 13 when suction is performed is extremely small. Therefore, even if the substrate material W is thin, it is vertical in the suction state. Adsorbed evenly and adsorbed without distortion. In the case where the thick substrate material W is warped, since the suction hole 14 is surrounded by the vacuum leakage prevention lip 13, as shown in FIG. Even if there is a gap between them, the lip 13 is in close contact with the surface of the substrate material W outside thereof, so that the space inside the lip 13 is closed and the vacuum suction action by the suction hole 14 acts on the substrate material W. Therefore, in the related art, as described with reference to FIG. 10, as described with reference to FIG. 10, a gap is formed between the substrate material W and the suction surface 9, so that the suction hole 14 that cannot perform the suction function is generated and the suction function is reduced. The defect is eliminated.
【０００８】また、吸着状態では、基板材Ｗ表面とリッ
プ１３とが密着しており、リップ１３はシリコンゴムで
構成されているために、摩擦係数が大きく、その結果、
基板材Ｗを一層安定して垂直に吸着でき、吸着が外れて
基板材Ｗが落下するなどの事故が防止できる。また、基
板受け渡し装置Ｄ２は、基板受け渡し装置Ｄ１から基板
材Ｗを受け取って、基板材保持装置Ｂ２へその基板材Ｗ
を受け渡すために、垂直保持したまま前後に移動する
が、そのような移動による振動などで吸着保持していた
基板材Ｗが吸着面９から離れるようなことが起きた場合
（要するに、基板材Ｗを吸着面９から引き離そうとする
外力が作用した場合）、リップ１３は、引き続き吸引作
用で弾性変形して基板材Ｗとの接触状態を保ち得るた
め、吸着面９から基板材Ｗが離れることで、吸引圧が作
用する作用面積が広がり（図４）、吸着力が、吸引孔１
４が基板材Ｗに密着していたときより大きくなり、基板
材Ｗは吸着面９に引き戻されるという作用が発生し、基
板材Ｗは確実に基板受け渡し装置Ｄ２に保持される。In the suction state, the surface of the substrate material W and the lip 13 are in close contact with each other, and since the lip 13 is made of silicone rubber, the coefficient of friction is large.
The substrate material W can be more stably and vertically sucked, and an accident such as the removal of the suction and the falling of the substrate material W can be prevented. The substrate transfer device D2 receives the substrate material W from the substrate transfer device D1, and transfers the substrate material W to the substrate material holding device B2.
In order to transfer the substrate material, the substrate material W is moved back and forth while being held vertically, but when the substrate material W that has been suction-held is separated from the suction surface 9 due to vibration or the like due to such movement (in short, the substrate material W When an external force is applied to separate W from suction surface 9), lip 13 can be continuously elastically deformed by suction to maintain the state of contact with substrate material W, so that substrate material W separates from suction surface 9. The working area on which the suction pressure acts is widened (FIG. 4), and the suction force is reduced by the suction hole 1.
4 becomes larger than when the substrate material W is in close contact with the substrate material W, the substrate material W is pulled back to the suction surface 9, and the substrate material W is securely held by the substrate transfer device D2.
【０００９】次に、この吸着構造を、基板材保持装置Ｂ
１に適用したものを説明する。基板材保持装置Ｂ１は、
可動保持ベースＢｅに一体に取り付けられるものであ
り、可動保持ベースＢｅは前述のように、基板材Ｗの搬
送装置との間で基板材Ｗをやり取りする授受位置Ｐ１
と、露光マスクＣ１（Ｃ２）と対峙する露光位置Ｐ２と
の間で垂直に移動する。図５には、基板材保持装置Ｂ１
の正面図のおよそ１／４を示しており、その他の部分
は、この１／４部分を、中心点Ｃ１を中心として９０度
毎に点対称とした形状である。可動保持ベースＢｅと一
体のベース板２０の前面には、図においてＬ字形状にＯ
リング溝２１が形成されている。そのＯリング溝２１の
内側には、横方向に伸びる複数の直線突条２２が設けて
ある。直線突条２２相互間、直線突条２２と前記Ｏリン
グ溝２１との間は、空気流通空間２３に形成されてい
る。このベース板２０の前面には、前記Ｏリング溝２１
に嵌め込んだＯリング２４を介して、透明なアクリル板
から成る基板吸着板（吸着部材）２５が一体に取り付け
られ、Ｏリング２４で囲まれた内側空間は完全に閉鎖空
間となる。バキューム源１７からのバキューム圧は、ベ
ース板２０の背面に接続した配管２６と連通孔２７を通
じてこの閉鎖空間に作用する。図５では、基板吸着板２
５が透明であることから、その背部にあるベース板２０
に設けられた直線突条２２、Ｏリング溝２１などが見え
ている。Next, this suction structure is connected to a substrate material holding device B.
The one applied to 1 will be described. The substrate material holding device B1 includes:
The movable holding base Be is integrally attached to the movable holding base Be. As described above, the movable holding base Be exchanges the substrate material W with the transfer device of the substrate material W.
, And vertically moves between an exposure position P2 facing the exposure mask C1 (C2). FIG. 5 shows a substrate material holding device B1.
The other part has a shape in which this quarter part is point-symmetrical at every 90 degrees with respect to the center point C1. On the front surface of the base plate 20 integral with the movable holding base Be, an L-shaped O
A ring groove 21 is formed. Inside the O-ring groove 21, a plurality of linear ridges 22 extending in the lateral direction are provided. An air circulation space 23 is formed between the linear protrusions 22 and between the linear protrusion 22 and the O-ring groove 21. The front surface of the base plate 20 is provided with the O-ring groove 21.
A substrate suction plate (suction member) 25 made of a transparent acrylic plate is integrally attached via an O-ring 24 fitted into the O-ring 24, and the inner space surrounded by the O-ring 24 becomes a completely closed space. The vacuum pressure from the vacuum source 17 acts on this closed space through a pipe 26 and a communication hole 27 connected to the back of the base plate 20. In FIG. 5, the substrate suction plate 2
5 is transparent, the base plate 20
Are visible.
【００１０】基板吸着板２５の前面は、平面から成る吸
着面９に形成され、その吸着面９には、前記閉鎖空間と
連通する複数の吸引孔１４が形成されている。また、基
板吸着板２５の中心Ｃ１近傍には、本願発明の吸着構造
が設けてある。この実施形態において、基板吸着板２５
の所定位置には、嵌め込み部としての所定の円形溝３０
が形成されている。その円形溝３０の内側も、吸着面９
となっており、ここにも、多数の吸引孔１４が形成され
ている。そして、前記実施形態と同様に、前記円形溝３
０には、前記同様のリップ部材１１の中心孔１２が嵌め
込まれている。The front surface of the substrate suction plate 25 is formed on a suction surface 9 having a flat surface, and the suction surface 9 is formed with a plurality of suction holes 14 communicating with the closed space. The suction structure of the present invention is provided near the center C1 of the substrate suction plate 25. In this embodiment, the substrate suction plate 25
Is provided with a predetermined circular groove 30 as a fitting portion.
Are formed. The inside of the circular groove 30 is also the suction surface 9.
Here, a large number of suction holes 14 are also formed. Then, similarly to the embodiment, the circular groove 3
The center hole 12 of the lip member 11 similar to that described above is fitted in 0.
【００１１】[0011]
【発明の効果】以上のように本願のプリント基板材の吸
着構造によれば、薄い基板材を吸着した場合であって
も、吸着面が平面であることおよび、真空漏れ防止リッ
プが、その吸着面とほぼ同一平面となる変形量の極めて
小さいものとしてあることから、薄い基板材をその平面
から成る吸着面に面一に吸着できて、変形をもたらすこ
とがない。また、歪みがあるようなプリント基板材であ
って、吸着面との間に隙間が生じるような場合でも、吸
着面外周を囲む真空漏れ防止リップがプリント基板材表
面に接触してリップ内側空間が閉じられて吸引圧力が有
効に作用して吸引作用を行うため、プリント基板材を強
力に吸着できる。As described above, according to the structure for adsorbing a printed circuit board material of the present invention, even when a thin substrate material is adsorbed, the suction surface is flat and the vacuum leakage prevention lip has the suction surface. Since the amount of deformation is substantially the same as the plane and the amount of deformation is extremely small, the thin substrate material can be sucked flush with the suction surface formed of the flat surface, and no deformation occurs. Also, even in the case of a printed circuit board material that has distortion and a gap is formed between the suction surface and the suction surface, the vacuum leakage prevention lip surrounding the outer periphery of the suction surface comes into contact with the surface of the printed circuit board material and the space inside the lip is reduced. The printed circuit board material can be strongly adsorbed because it is closed and the suction pressure effectively acts to perform the suction action.
【００１２】又、本願では、プリント基板材を吸着面か
ら引き離す方向の外力が作用して、基板材が吸着面から
引き離されるように引っ張られたときには、リップ部が
自体の弾性により基板材に吸着された状態で変形するた
め、基板材と吸着面が密着状態では孔の総面積と吸引圧
の積であった吸引力が、吸引圧の作用面積が広がること
により大きくなり、より吸着力が大きくなる。そのた
め、吸着面からプリント基板材Ｗを引き離そうとする外
力が作用しても、容易には引き離されず、基板材を吸着
状態に維持できる。In the present invention, when an external force acts in the direction of separating the printed circuit board material from the suction surface and the substrate material is pulled away from the suction surface, the lip portion is attracted to the substrate material by its own elasticity. When the substrate material and the suction surface are in close contact with each other, the suction force, which was the product of the total area of the holes and the suction pressure, increases due to the increase in the suction pressure action area, and the suction force increases. Become. Therefore, even if an external force is applied to separate the printed circuit board material W from the suction surface, the printed circuit board material W is not easily separated, and the board material can be maintained in the suction state.
【図１】基板受け渡し装置の正面図であり、図７のＩ視
図である。FIG. 1 is a front view of a substrate transfer device, and is a view as viewed from I in FIG. 7;
【図２】図１のＩＩ−ＩＩ線断面図である。FIG. 2 is a sectional view taken along line II-II of FIG.
【図３】作用説明図である。FIG. 3 is an operation explanatory view.
【図４】作用説明図である。FIG. 4 is an operation explanatory view.
【図５】図７のＶ視図であり、基板材保持装置の正面図
の略１／４を示す図である。FIG. 5 is a view as viewed in the direction V in FIG. 7, and is a view showing substantially a quarter of a front view of the substrate material holding device.
【図６】図５のＶＩ−ＶＩ線断面図である。FIG. 6 is a sectional view taken along line VI-VI of FIG. 5;
【図７】本願発明が適用される基板露光装置の概略図で
ある。FIG. 7 is a schematic view of a substrate exposure apparatus to which the present invention is applied.
【図８】従来の基板受け渡し装置の斜視図である。FIG. 8 is a perspective view of a conventional substrate transfer device.
【図９】従来の別の基板受け渡し装置の斜視図である。FIG. 9 is a perspective view of another conventional substrate delivery device.
【図１０】従来技術の問題点を説明する図である。FIG. 10 is a diagram for explaining a problem of the related art.
７ 吸着部材 ９ 吸着面 １０ 軸部（嵌め込み部） １１ リップ部材 １３ 真空漏れ防止リップ １４ 吸引孔 １７ バキューム源 7 suction member 9 suction surface 10 shaft portion (fitting portion) 11 lip member 13 vacuum leakage prevention lip 14 suction hole 17 vacuum source
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｂ２３Ｋ 101:42 Ｂ２３Ｋ 101:42 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // B23K 101: 42 B23K 101: 42
Claims (4)
易でない材料から構成し、その吸着部材の前面を平面か
ら成る吸着面とし、その吸着面には、バキューム源に連
通される多数の吸引孔を設け、前記吸着面の周囲を取り
囲んで弾性材料から成る真空漏れ防止リップを設け、該
リップの外周縁を含む平面は、前記吸着面とほぼ同一平
面に形成されていることを特徴とするプリント基板材の
吸着構造。The suction member is made of a material that is not easily deformed, such as a metal or a resin material, and the front surface of the suction member is a flat suction surface, and the suction surface has a large number of suction holes connected to a vacuum source. A hole is provided, and a vacuum leakage prevention lip made of an elastic material is provided around the suction surface, and a plane including an outer peripheral edge of the lip is formed substantially flush with the suction surface. Suction structure for printed circuit board materials.
てほぼ同一平面とみなされる程度に僅かに前方に位置し
ていることを特徴とする請求項１記載のプリント基板材
の吸着構造。2. The suction structure for a printed circuit board material according to claim 1, wherein the plane including the outer peripheral edge of the lip is located slightly forward so as to be regarded as substantially the same plane as the suction surface.
ら構成される請求項１又は２に記載のプリント基板材の
吸着構造。3. The structure according to claim 1, wherein the vacuum leakage prevention lip is made of silicone rubber.
の嵌め込み部に真空漏れ防止リップを有するリップ部材
を嵌合して成ることを特徴とする請求項１〜３の何れか
に記載のプリント基板材の吸着構造。4. The suction device according to claim 1, wherein a fitting portion is formed on the outer periphery of the suction surface, and a lip member having a vacuum leakage prevention lip is fitted into the fitting portion. Suction structure for printed circuit board materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001122113A JP2002317810A (en) | 2001-04-20 | 2001-04-20 | Suction structure for printed circuit board material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001122113A JP2002317810A (en) | 2001-04-20 | 2001-04-20 | Suction structure for printed circuit board material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002317810A true JP2002317810A (en) | 2002-10-31 |
Family
ID=18971876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001122113A Pending JP2002317810A (en) | 2001-04-20 | 2001-04-20 | Suction structure for printed circuit board material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002317810A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006276084A (en) * | 2005-03-28 | 2006-10-12 | Orc Mfg Co Ltd | Exposure table and exposure device |
| JP2018003149A (en) * | 2016-07-01 | 2018-01-11 | 廣州明毅電子機械有限公司 | Electroplating equipment automatic unloader |
| CN109132534A (en) * | 2011-11-18 | 2019-01-04 | 耐克创新有限合伙公司 | Manufacture vacuum tool |
| CN116193733A (en) * | 2023-04-25 | 2023-05-30 | 四川托璞勒科技有限公司 | Absorbing part, feeding device for stacking plates and brown treatment device for PCB |
-
2001
- 2001-04-20 JP JP2001122113A patent/JP2002317810A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006276084A (en) * | 2005-03-28 | 2006-10-12 | Orc Mfg Co Ltd | Exposure table and exposure device |
| CN109132534A (en) * | 2011-11-18 | 2019-01-04 | 耐克创新有限合伙公司 | Manufacture vacuum tool |
| JP2018003149A (en) * | 2016-07-01 | 2018-01-11 | 廣州明毅電子機械有限公司 | Electroplating equipment automatic unloader |
| CN116193733A (en) * | 2023-04-25 | 2023-05-30 | 四川托璞勒科技有限公司 | Absorbing part, feeding device for stacking plates and brown treatment device for PCB |
| CN116193733B (en) * | 2023-04-25 | 2023-07-04 | 四川托璞勒科技有限公司 | Absorbing part, feeding device for stacking plates and brown treatment device for PCB |
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