JP2002317064A - Thermoconductive material - Google Patents

Thermoconductive material

Info

Publication number
JP2002317064A
JP2002317064A JP2001122546A JP2001122546A JP2002317064A JP 2002317064 A JP2002317064 A JP 2002317064A JP 2001122546 A JP2001122546 A JP 2001122546A JP 2001122546 A JP2001122546 A JP 2001122546A JP 2002317064 A JP2002317064 A JP 2002317064A
Authority
JP
Japan
Prior art keywords
heat conductive
conductive material
heat
foaming agent
high heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001122546A
Other languages
Japanese (ja)
Inventor
Shunji Hyozu
俊司 俵頭
Hitoshi Shirato
斉 白土
Kenichi Azuma
賢一 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2001122546A priority Critical patent/JP2002317064A/en
Publication of JP2002317064A publication Critical patent/JP2002317064A/en
Pending legal-status Critical Current

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  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a thermoconductive material affording such a condition as to be in compliance with the uneven design or warpage of the respective boundary surfaces of two members disposed so as to sandwich itself, and securing high thermal conductivity. SOLUTION: In this thermoconductive material functioning to transfer the heat of one member to another member through interposition between the two members in a sandwiched condition, at least expandable highly thermoconductive layers each formed of a resin composition containing a forming agent foamable at >=40 deg.C and a highly thermoconductive filler are borne on both sides.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、熱伝導材に関す
る。[0001] The present invention relates to a heat conductive material.

【０００２】[0002]

【従来の技術】例えば、電気・電子部品などの発熱部材
に添設して発熱体から伝わった発熱体の熱を放熱させる
ヒートシンク等の放熱部材との間には、従来、熱が発熱
部材から放熱部材に効率よく伝わるようにシリコーンオ
イルコンパウンドや、窒化ホウ素、アルミナ、窒化ケイ
素または窒化アルミニウムなどの熱伝導性の高い充填材
を樹脂に高充填した高熱伝導材（例えば、特開平１０−
１３９８９３号公報）が提案され、樹脂としてシリコー
ンゴムを用いた熱伝導シートが上市されている。2. Description of the Related Art For example, conventionally, heat is transferred from a heat-generating member to a heat-dissipating member such as a heat sink which radiates heat of the heat-generating member which is attached to a heat-generating member such as an electric / electronic component. A high heat conductive material in which a resin is highly filled with a resin having a high heat conductivity such as silicone oil compound, boron nitride, alumina, silicon nitride, or aluminum nitride so that the heat is efficiently transmitted to the heat radiating member (for example,
No. 139893), and a heat conductive sheet using silicone rubber as a resin has been put on the market.

【０００３】すなわち、電気・電子部品に限らず、発熱
部材及び放熱部材の表面は平滑でないことが多い。従っ
て、両者を直接接触させても接触面積が小さく熱伝導が
悪い場合がある。そこで、柔軟で凹凸に添いやすく高熱
伝導性を有する上記のようなシリコーンオイルコンパウ
ンドや上記熱伝導シート等の熱伝導材を発熱部材と放熱
部材との間に介在させるようになっている。That is, the surfaces of the heat generating member and the heat radiating member are not limited to the electric and electronic parts in many cases. Therefore, even if both are brought into direct contact, the contact area may be small and the heat conduction may be poor. Therefore, a heat conductive material such as the above-described silicone oil compound or the heat conductive sheet, which is flexible and easily adheres to irregularities and has high heat conductivity, is interposed between the heat generating member and the heat radiating member.

【０００４】しかし、上記シリコーンオイルコンパウン
ドの場合、柔軟性があり、密着性が高く、熱抵抗性もよ
いのであるが、粘稠体であるので、取り扱い性が悪いと
ともに塗りムラが発生する恐れもある。[0004] However, the silicone oil compound has flexibility, high adhesiveness and good heat resistance, but since it is a viscous body, it has poor handling properties and may cause uneven coating. is there.

【０００５】一方、樹脂に高熱伝導性を有する高熱伝導
性フィラーを混合分散した上記の熱伝導シートの場合、
高い熱伝導性を得るために、高熱伝導性フィラーの充填
量を大きくすると、柔軟性が乏しくて挟着面への形状追
従性、すなわち、密着性が悪くなる。したがって、上記
の熱伝導シートの場合、柔軟性はあるが、高熱伝導性物
質の充填量が不十分で熱伝導率が低いものか、あるい
は、熱伝導率は良好であるが柔軟性に乏しいものとな
り、結果として熱抵抗の大きいものにならざるを得な
い。On the other hand, in the case of the above-mentioned heat conductive sheet in which a high heat conductive filler having high heat conductivity is mixed and dispersed in a resin,
When the filling amount of the high heat conductive filler is increased in order to obtain high heat conductivity, the flexibility is poor and the shape following property to the sandwiching surface, that is, the adhesion is deteriorated. Therefore, in the case of the above-mentioned heat conductive sheet, although it is flexible, the filling amount of the high heat conductive material is insufficient and the thermal conductivity is low, or the thermal conductivity is good but the flexibility is poor. As a result, the thermal resistance must be large.

【０００６】他方、アルミニウム箔のように熱伝導性に
優れ可撓性のある平滑な金属シートを熱伝導シートとし
て使用することも考えられるが，このような平滑な金属
シートでは、やはりＣＰＵや基板等の電子部品やヒート
シンクなどの放熱部材は、反り、うねり、凹凸等に追従
せず電子部品で発生した熱を十分に放熱部品に伝えるこ
とができなくなる恐れがある。On the other hand, it is conceivable to use a flexible and smooth metal sheet having excellent thermal conductivity such as an aluminum foil as the heat conductive sheet. There is a fear that the heat generated by the electronic component may not be sufficiently transmitted to the heat radiating component without following the warp, undulation, unevenness, etc.

【０００７】[0007]

【発明が解決しようとする課題】本発明は、このような
事情に鑑みて、熱伝導材を挟むように配置される２つの
部材の添設面の凹凸形状や反りうねりに追従した添設状
態になり、高い熱伝導性を確保し得る熱伝導材を提供す
ることを目的としている。SUMMARY OF THE INVENTION In view of such circumstances, the present invention provides an attached state that follows the uneven shape and warpage of an attached surface of two members arranged so as to sandwich a heat conductive material. It is an object of the present invention to provide a heat conductive material which can ensure high heat conductivity.

【０００８】[0008]

【課題を解決するための手段】このような目的を達成す
るために、本発明の請求項１に記載の発明にかかる熱伝
導材（以下、「請求項１の熱伝導材」と記す）は、挟着
された状態で２つの部材間に介在し、一方の部材の熱を
他方の部材に伝える熱伝導材において、４０℃以上で発
泡する発泡剤および高熱伝導フィラーを含む樹脂組成物
から形成された発泡性高熱伝導層を少なくとも備えてい
る構成とした。In order to achieve such an object, a heat conductive material according to the first aspect of the present invention (hereinafter referred to as "a heat conductive material of the first aspect") is provided. A heat conductive material interposed between two members in a sandwiched state and transmitting heat of one member to the other member, formed from a resin composition containing a foaming agent foaming at 40 ° C. or more and a high heat conductive filler; It is configured to have at least the expanded foamable high heat conductive layer.

【０００９】本発明の請求項２に記載の発明にかかる熱
伝導材（以下、「請求項２の熱伝導材」と記す）は、請
求項１の熱伝導材において、発泡性高熱伝導層と発泡剤
非含有の非発泡性高熱伝導層とを備え、これらの層が部
材間の挟着方向に積層されている構成とした。The heat conductive material according to the second aspect of the present invention (hereinafter referred to as “the heat conductive material of the second aspect”) is the same as the heat conductive material of the first aspect, except that A non-foamable non-foamable high thermal conductive layer containing no foaming agent was provided, and these layers were laminated in the direction of sandwiching between the members.

【００１０】本発明の熱伝導材は、柱状、シート状、波
板状等その形状は、用途に応じて適宜決定することがで
きるが、取り扱い性を考慮すると、請求項３のようにシ
ート状とすることが好ましい。また、本発明の熱伝導材
の熱伝導率は、特に限定されないが、１Ｗ／ｍ・Ｋ以上
とすることが好ましく、３Ｗ／ｍ・Ｋ以上とすることが
より好ましい。The shape of the heat conductive material of the present invention, such as a column, a sheet, a corrugated sheet, etc., can be appropriately determined according to the intended use. It is preferable that The thermal conductivity of the heat conductive material of the present invention is not particularly limited, but is preferably 1 W / m · K or more, more preferably 3 W / m · K or more.

【００１１】本発明の熱伝導材において、発泡性高熱伝
導層に用いられる樹脂としては、特に限定されないが、
たとえば、オレフィン系樹脂、スチレン系樹脂、塩化ビ
ニル系樹脂、エステル系樹脂、アミド系樹脂等が挙げら
れ、（メタ）アクリル酸ブチル、（メタ）アクリル酸２
−エチルヘキシル等のアクリル酸エステルを重合したア
クリル酸エステル重合体、（メタ）アクリル酸ブチル、
（メタ）アクリル酸２−エチルヘキシル等のモノマーの
共重合体、エチレン酢酸ビニル共重合体、エチレン−α
オレフィン共重合体等の軟質オレフィン系樹脂、スチレ
ン−イソプレン−スチレン共重合体（ＳＩＳ）、スチレ
ン−ブチレン−スチレン共重合体（ＳＢＳ）、スチレン
−エチレン−ブチレン−スチレン共重合体（ＳＥＢ
Ｓ）、スチレン−エチレン−プロピレン−スチレン共重
合体（ＳＥＰＳ）等の軟質スチレン系樹脂、ウレタンＴ
ＰＥ、エステルＴＰＥ、アミドＴＰＥ等の熱可塑性エラ
ストマー、これらの樹脂の架橋されたもの、あるいは、
ウレタン樹脂、エポキシ樹脂、シリコーン樹脂等の熱硬
化性樹脂などが挙げられ、部材への密着性を考慮すると
ショアＡ硬度で３０以下のものがより好ましい。In the heat conductive material of the present invention, the resin used for the foamable high heat conductive layer is not particularly limited.
For example, olefin-based resins, styrene-based resins, vinyl chloride-based resins, ester-based resins, amide-based resins, and the like, include butyl (meth) acrylate, and (meth) acrylic acid 2
-An acrylate polymer obtained by polymerizing an acrylate such as ethylhexyl, butyl (meth) acrylate,
Copolymer of monomers such as 2-ethylhexyl (meth) acrylate, ethylene-vinyl acetate copolymer, ethylene-α
Soft olefin resins such as olefin copolymer, styrene-isoprene-styrene copolymer (SIS), styrene-butylene-styrene copolymer (SBS), styrene-ethylene-butylene-styrene copolymer (SEB)
S), soft styrene resin such as styrene-ethylene-propylene-styrene copolymer (SEPS), urethane T
PE, ester TPE, thermoplastic elastomer such as amide TPE, cross-linked one of these resins, or
Examples thereof include thermosetting resins such as urethane resins, epoxy resins, and silicone resins, and those having a Shore A hardness of 30 or less are more preferable in consideration of adhesion to members.

【００１２】高熱伝導フィラーとしては、特に限定され
ないが、たとえば、たとえば、金、銅、銀、鉄、アルミ
ニウム、コバルト、すず、ニッケル、チタン、インジウ
ムなどの金属および各種合金などの粒子；酸化アルミニ
ウム（アルミナ）、酸化亜鉛、酸化マグネシウム、酸化
ベリリウム、酸化チタン、酸化インジウムすず（ＩＴ
Ｏ）などの酸化物類粒子；窒化ホウ素、窒化ケイ素、窒
化アルミニウムなどの窒化物類粒子；炭化ケイ素、ダイ
ヤモンド、非晶カーボン、カーボンブラック、炭素繊維
などの炭化物類粒子；石英、石英ガラスなどのシリカ粉
類粒子などが挙げられる。The high heat conductive filler is not particularly limited. For example, for example, particles of metals such as gold, copper, silver, iron, aluminum, cobalt, tin, nickel, titanium, indium and various alloys; aluminum oxide ( Alumina), zinc oxide, magnesium oxide, beryllium oxide, titanium oxide, indium tin oxide (IT
Oxide particles such as O); nitride particles such as boron nitride, silicon nitride, and aluminum nitride; carbide particles such as silicon carbide, diamond, amorphous carbon, carbon black, and carbon fiber; quartz, quartz glass, and the like. Silica powder particles and the like.

【００１３】上記高熱伝導フィラーの熱伝導率は、樹脂
より高ければよいが、１０Ｗ／ｍ・Ｋ以上とすることが
好ましく、２０Ｗ／ｍ・Ｋ以上とすることがより好まし
い。ただし、熱伝導材を、絶縁性を必要とする用途に用
いる場合、上記金属および各種合金などの金属系フィラ
ーは、絶縁性に劣るため、他の無機フィラーを用いるこ
とが好ましい。The thermal conductivity of the high thermal conductive filler may be higher than that of the resin, but is preferably 10 W / m · K or more, more preferably 20 W / m · K or more. However, in the case where the heat conductive material is used for applications requiring insulating properties, it is preferable to use other inorganic fillers because the metal-based fillers such as the above metals and various alloys have poor insulating properties.

【００１４】また、高熱伝導性フィラーとして、たとえ
ば、窒化ホウ素などの鱗片状粒子と、炭化ケイ素、窒化
アルミなどの球状粒子とを、その比率を１／９〜９／１
程度の割合で組み合わせて用いるようにすると、より高
い熱伝導率を得ることができる。さらに、熱伝導性物質
の添加量は、所定の柔軟性を確保できれば、多い程好ま
しい。Further, as the high thermal conductive filler, for example, scaly particles such as boron nitride and spherical particles such as silicon carbide and aluminum nitride may be used in a ratio of 1/9 to 9/1.
Higher thermal conductivity can be obtained when used in combination at about the same ratio. Further, it is preferable that the amount of the heat conductive substance added is large as long as a predetermined flexibility can be secured.

【００１５】発泡剤としては、４０℃以上で発泡するも
のであれば特に限定されず、たとえば、熱分解型発泡
剤、蒸発型発泡剤を用いることができるが、発熱部材の
発熱限界温度（発熱部材の発熱による温度上昇により機
能不全になる温度）以下の温度で発泡するものが選択さ
れる。The foaming agent is not particularly limited as long as it foams at 40 ° C. or higher. For example, a pyrolytic foaming agent or an evaporative foaming agent can be used. A material that foams at a temperature equal to or lower than the temperature at which the member malfunctions due to a rise in temperature due to heat generated by the member is selected.

【００１６】上記熱分解型発泡剤としては、特に限定さ
れないが、たとえば、重炭酸ナトリウム、炭酸アンモニ
ウム、重炭酸アンモニウム、アジド化合物なとの無機系
発泡剤、アゾジカルボンアミド、アゾビスホルムアミ
ド、アゾビスイソブチロニトリル、ジアゾアミノベンゼ
ンなどのアゾ化合物、ニトロソ化合物、スルホニルヒド
ラジド化合物等が挙げられるが、発熱部材がＩＣチップ
などの電子部品の場合、体重炭酸ナトリウム、炭酸アン
モニウム、重炭酸アンモニウム等を用いることが好まし
い。The thermal decomposition type foaming agent is not particularly limited. Examples thereof include sodium bicarbonate, ammonium carbonate, ammonium bicarbonate, inorganic foaming agents such as azide compounds, azodicarbonamide, azobisformamide, and azobis. Examples include azo compounds such as isobutyronitrile and diazoaminobenzene, nitroso compounds, and sulfonyl hydrazide compounds.When the heat generating member is an electronic component such as an IC chip, sodium carbonate, ammonium carbonate, ammonium bicarbonate, or the like is used. Is preferred.

【００１７】なお、本発明において、熱分解型発泡剤の
分解温度は、ＴＧ（熱重量測定）／ＤＴＡ（示差熱分
析）で減量開始温度とする。In the present invention, the decomposition temperature of the thermal decomposition type foaming agent is defined as TG (thermogravimetry) / DTA (differential thermal analysis) as the weight loss start temperature.

【００１８】上記蒸発型発泡剤としては、特に限定され
ないが、たとえば、常圧で樹脂組成物中に含浸させる場
合には、沸点４０℃以下の液体で、熱可塑性樹脂との親
和性が必要で、たとえば、エタノールや水が挙げられ
る。一方、高圧で樹脂組成物中に含浸させる場合には、
特に限定がなく、窒素、二酸化炭素、水、エタノール等
が挙げられる。The evaporating foaming agent is not particularly limited. For example, when impregnating a resin composition at normal pressure, it is a liquid having a boiling point of 40 ° C. or less and needs to have an affinity for a thermoplastic resin. For example, ethanol and water can be mentioned. On the other hand, when impregnating the resin composition at high pressure,
There is no particular limitation, and examples include nitrogen, carbon dioxide, water, and ethanol.

【００１９】なお、含浸は、樹脂の溶融状態、固化状態
のいずれにおいても行なうことができるが、溶融状態の
樹脂に高圧で含浸させる場合には、含浸後高圧状態で樹
脂を冷却固化させたのち、低圧に雰囲気に戻すことによ
り発泡剤を内包した状態に保つことができる。また、蒸
発型発泡剤の場合、樹脂内に内包させた膨張粒子の状態
で樹脂組成物中に含ませるようにしても構わない。The impregnation can be performed in either the molten state or the solidified state of the resin. When impregnating the resin in the molten state at a high pressure, the resin is cooled and solidified in the high pressure state after the impregnation. By returning the atmosphere to a low pressure, the state in which the foaming agent is included can be maintained. In the case of an evaporative foaming agent, the resin composition may be contained in the state of expanded particles contained in the resin.

【００２０】発泡剤の配合量は、特に限定されないが、
大気中で熱伝導材を発泡させた時の発泡倍率が１．１倍
〜１０倍程度となるような配合量が好ましい。すなわ
ち、発泡倍率が１．１倍未満であると、発泡しても部材
への密着性を十分確保できなくなる恐れがあり、１０倍
を超すと、気泡が多くなりすぎて、シート自体の熱伝導
率が下がり、うまく放熱できなくなる恐れがある。The amount of the foaming agent is not particularly limited.
The compounding amount is preferably such that the expansion ratio when the heat conductive material is expanded in the atmosphere is about 1.1 to 10 times. That is, if the expansion ratio is less than 1.1 times, there is a possibility that the adhesiveness to the member may not be sufficiently ensured even when the foaming is performed. There is a risk that the rate will decrease and the heat will not be radiated well.

【００２１】また、樹脂組成物中には、発泡時にその形
体を維持させるために、添設される発熱部材の発熱温度
で架橋を開始したり、電子線や紫外線の照射により架橋
を開始する架橋剤を添加したり、難燃剤、酸化防止剤、
紫外線防止剤等の他の添加剤を添加することができる。In the resin composition, in order to maintain its shape during foaming, crosslinking is started at the heat generation temperature of an attached heating member, or crosslinking is started by irradiation with electron beams or ultraviolet rays. Additives, flame retardants, antioxidants,
Other additives such as UV inhibitors can be added.

【００２２】請求項２の熱伝導材において、発泡剤非含
有の非発泡性高熱伝導層を形成する材料としては発泡性
高熱伝導層の発泡による熱伝導材表面の部材表面への変
形密着性を阻害せず、熱伝導性に優れたものであれば特
に限定されないが、たとえば、発泡性高熱伝導層を形成
する樹脂組成物に用いた熱可塑性樹脂と高熱伝導フィラ
ーとを含む熱可塑性樹脂（発泡剤非含有）や、ニッケ
ル、すず、アルミニウム、金、銀、銅、鉄、コバルト、
インジウムやこれらの合金などの金属が挙げられる。In the heat conductive material according to the second aspect, the material for forming the non-foamable high heat conductive layer containing no foaming agent may be a deformable adhesion of the heat conductive material surface to the member surface due to foaming of the foamable high heat conductive layer. There is no particular limitation as long as it does not hinder and is excellent in thermal conductivity. For example, a thermoplastic resin containing a thermoplastic resin and a high thermal conductive filler used in a resin composition forming a foamable high thermal conductive layer (foaming Agent, nickel, tin, aluminum, gold, silver, copper, iron, cobalt,
Examples include metals such as indium and alloys thereof.

【００２３】発泡性高熱伝導層の製造方法としては特に
限定されないが、たとえば、高熱伝導フィラーと熱可塑
性樹脂とを溶融混練した配合物に熱分解型発泡剤を溶媒
とを加え混合紙、塗工溶液を作製したのち、離型性の高
い材料で形成された型の型面に塗工し、この塗工物を乾
燥（溶媒を除去）させたのち型から剥離することによっ
て形成する方法、予め形成された非発泡性高熱伝導層の
表面に上記塗工溶液を塗工し乾燥させて形成させる方法
が挙げられる。The method for producing the foamable high heat conductive layer is not particularly limited. For example, a mixture obtained by melting and kneading a high heat conductive filler and a thermoplastic resin, a pyrolytic foaming agent and a solvent are added, and mixed paper, A method of forming a solution by preparing a solution, applying the solution onto a mold surface of a mold formed of a material having a high release property, drying the coated material (removing the solvent), and then peeling the coated material from the mold. A method of applying the above-mentioned coating solution to the surface of the formed non-foamable high heat conductive layer and drying the applied solution to form the layer is used.

【００２４】また、得られた発泡性高熱伝導層の表面に
非発泡性高熱伝導層を形成する方法としては、特に限定
されないが、たとえば、発泡剤を除いた以外は同様の塗
工溶液を発泡性高熱伝導層の表面に塗工し乾燥させる方
法、非発泡性高熱伝導層が金属で形成される場合、金属
箔を熱伝導性接着剤を介して発泡性高熱伝導層に接着す
る方法、発泡性高熱伝導層の表面に無電解メッキ、物理
蒸着、化学蒸着などを用いて金属膜を形成する方法など
が挙げられる。The method for forming the non-foamable high heat conductive layer on the surface of the obtained foamable high heat conductive layer is not particularly limited. For example, a similar coating solution is foamed except that the foaming agent is removed. Coating and drying on the surface of the conductive high thermal conductive layer, when the non-foamable high thermal conductive layer is formed of metal, bonding the metal foil to the foamable high thermal conductive layer via the thermal conductive adhesive, foaming A method of forming a metal film on the surface of the conductive high thermal conductive layer by using electroless plating, physical vapor deposition, chemical vapor deposition, or the like.

【００２５】[0025]

【発明の実施の形態】以下に、本発明の実施の形態を、
図面を参照しつつ詳しく説明する。図１は本発明にかか
る熱伝導材の第１の実施の形態をあらわしている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below.
This will be described in detail with reference to the drawings. FIG. 1 shows a first embodiment of the heat conductive material according to the present invention.

【００２６】図１に示すように、この熱伝導材１は、シ
ート状をしていて、４０℃以上で発泡する熱分解型の発
泡剤１１と高熱伝導フィラー（図示せず）と樹脂とを含
む樹脂組成物１２からなる発泡性高熱伝導層のみからな
るシート状をしている。また、発泡剤１１は、大気圧中
で発泡させた時発泡倍率が１．１倍〜１０倍となる量が
配合されている。As shown in FIG. 1, this heat conductive material 1 is in the form of a sheet, and comprises a thermally decomposable foaming agent 11 which foams at 40 ° C. or higher, a high heat conductive filler (not shown), and a resin. It is in the form of a sheet made of only the foamable high heat conductive layer made of the resin composition 12 containing the resin. Further, the foaming agent 11 is blended in an amount such that the foaming ratio becomes 1.1 to 10 times when foaming is performed at atmospheric pressure.

【００２７】この熱伝導材１は、上記のようになってお
り、図２に示すように、発熱部材Ｈと放熱部材Ｃとの間
に挟み込むように介在させて使用するが、発熱部材Ｈお
よび放熱部材Ｃは、反ったり凹凸があり、挟み込んだだ
けでは図２（ａ）に示すように、熱伝導材１の表面との
間に隙間Ｓが生じる。しかし、発熱部材Ｈが使用時に発
熱すると発泡剤１１が発泡し、熱伝導材１'の表面が発
熱部材Ｈおよび放熱部材Ｃの反りや凹凸に沿うようにな
る。したがって、発熱部材Ｈおよび放熱部材Ｃと、熱伝
導材１の接触面積が増大し、ロス無く発熱部材Ｈの熱を
放熱部材Ｃに伝達することができる。また、シート状を
しているので取り扱い性がよく、ＩＣチップ等のヒート
シンク等の放熱部材への取付の際に有効である。The heat conductive material 1 is configured as described above, and is used by being interposed between the heat generating member H and the heat radiating member C as shown in FIG. The heat dissipating member C has warpage or irregularities, and a gap S is generated between the heat dissipating member C and the surface of the heat conductive material 1 as shown in FIG. However, when the heat generating member H generates heat during use, the foaming agent 11 foams, and the surface of the heat conductive material 1 ′ follows the warpage and unevenness of the heat generating member H and the heat radiating member C. Therefore, the contact area between the heat generating member H and the heat radiating member C and the heat conductive material 1 increases, and the heat of the heat generating member H can be transmitted to the heat radiating member C without loss. Further, since it is in the form of a sheet, the handleability is good, and it is effective in attaching to a heat radiating member such as a heat sink such as an IC chip.

【００２８】図３は、本発明にかかる熱伝導材の第２の
実施の形態をあらわしている。図３に示すように、この
熱伝導材２は、シート状をしていて、４０℃以上で発泡
する熱分解型の発泡剤２１と高熱伝導フィラー（図示せ
ず）と樹脂とを含む樹脂組成物２２からなるシート状を
した発泡性高熱伝導層２３と、この発泡性高熱伝導層２
３の厚み方向の両面を覆うように積層され、高熱伝導フ
ィラー（図示せず）と樹脂とを含み、発泡剤を含まない
樹脂組成物２４からなる非発泡性高熱伝導層２５とを備
えた３層構造になっている以外は第１の実施の形態と同
様になっている。FIG. 3 shows a second embodiment of the heat conductive material according to the present invention. As shown in FIG. 3, the heat conductive material 2 is in the form of a sheet, and has a resin composition containing a pyrolytic foaming agent 21 which foams at 40 ° C. or more, a high heat conductive filler (not shown), and a resin. A sheet-like foamable high thermal conductive layer 23 made of the material 22;
3 comprising a non-foamable high heat conductive layer 25 made of a resin composition 24 containing a high heat conductive filler (not shown) and a resin and containing no foaming agent. The configuration is the same as that of the first embodiment except that it has a layer structure.

【００２９】図４は、本発明にかかる熱伝導材の第３の
実施の形態をあらわしている。図４に示すように、この
熱伝導材３は、シート状をしていて、シート状をした金
属からなる非発泡性高熱伝導層３１と、この非発泡性高
熱伝導層３１の厚み方向の両面を覆うように積層され、
４０℃以上で発泡する熱分解型の発泡剤３２と高熱伝導
フィラー（図示せず）と樹脂とを含む樹脂組成物３３か
らなる発泡性高熱伝導層３４とを備えた３層構造になっ
ている以外は第１の実施の形態と同様になっている。FIG. 4 shows a third embodiment of the heat conductive material according to the present invention. As shown in FIG. 4, the heat conductive material 3 has a sheet shape, and a non-foamable high heat conductive layer 31 made of a sheet-shaped metal, and both surfaces of the non-foamable high heat conductive layer 31 in the thickness direction. Laminated so as to cover
It has a three-layer structure including a thermally decomposable foaming agent 32 that foams at 40 ° C. or higher, a highly heat conductive filler (not shown), and a foamable high heat conductive layer 34 made of a resin composition 33 containing a resin. Other than that, the configuration is the same as that of the first embodiment.

【００３０】図５は、本発明にかかる熱伝導材の第４の
実施の形態をあらわしている。図５に示すように、この
熱伝導材４は、シート状をしていて、４０℃以上で発泡
する熱分解型の発泡剤４１と高熱伝導フィラー（図示せ
ず）と樹脂とを含む樹脂組成物４２からなる柱状をした
発泡性高熱伝導層４３が間隔を開けて並列に並んでい
て、発泡性高熱伝導層４３と発泡性高熱伝導層４３との
間および各発泡性高熱伝導層４３の周囲を囲むように、
高熱伝導フィラー（図示せず）と樹脂とを含み、発泡剤
を含まない樹脂組成物４５からなる非発泡性高熱伝導層
４６が設けられている以外は第１の実施の形態と同様に
なっている。FIG. 5 shows a fourth embodiment of the heat conductive material according to the present invention. As shown in FIG. 5, the heat conductive material 4 is in the form of a sheet, and has a resin composition containing a pyrolytic foaming agent 41 which foams at 40 ° C. or higher, a high heat conductive filler (not shown), and a resin. The column-shaped foamable high heat conductive layers 43 made of the object 42 are arranged in parallel with a space therebetween, and between the foamable high heat conductive layers 43 and around each foamable high heat conductive layer 43. So that
It is the same as the first embodiment except that a non-foamable high heat conductive layer 46 made of a resin composition 45 containing a high heat conductive filler (not shown) and a resin and not containing a foaming agent is provided. I have.

【００３１】図６は、本発明にかかる熱伝導材の第５の
実施の形態をあらわしている。図６に示すように、この
熱伝導材５は、シート状をしていて、高熱伝導フィラー
（図示せず）と樹脂とを含み、発泡剤を含まない樹脂組
成物５１からなる柱状をした非発泡性高熱伝導層５２が
間隔を開けて並列に並んでいて、非発泡性高熱伝導層５
２と非発泡性高熱伝導層５２との間および各非発泡性高
熱伝導層５２の周囲を囲むように、４０℃以上で発泡す
る熱分解型の発泡剤５３と高熱伝導フィラー（図示せ
ず）と樹脂とを含む樹脂組成物５４からなる柱状をした
発泡性高熱伝導層５５が設けられている以外は第１の実
施の形態と同様になっている。FIG. 6 shows a fifth embodiment of the heat conductive material according to the present invention. As shown in FIG. 6, the heat conductive material 5 is in the form of a sheet, contains a high heat conductive filler (not shown) and a resin, and has a columnar shape made of a resin composition 51 containing no foaming agent. The foamable high heat conductive layers 52 are arranged in parallel with a space therebetween, and the non-foamable high heat conductive layers 5
A thermal decomposition type foaming agent 53 and a high heat conductive filler (not shown) which foam at 40 ° C. or more so as to surround between the second and non-foamable high heat conductive layers 52 and around each non-foamable high heat conductive layer 52. It is the same as the first embodiment, except that a columnar foamable high heat conductive layer 55 made of a resin composition 54 containing a resin and a resin is provided.

【００３２】図７は、本発明にかかる熱伝導材の第６の
実施の形態をあらわしている。図７に示すように、この
熱伝導材６は、シート状をしていて、４０℃以上で発泡
する蒸発型の発泡剤６１と高熱伝導フィラー（図示せ
ず）と樹脂とを含む樹脂組成物６２からなるシート状を
した発泡性高熱伝導層６３内に発泡性高熱伝導層６３の
厚み方向に収縮した状態の多数のバネ６４が埋設されて
いる。FIG. 7 shows a sixth embodiment of the heat conductive material according to the present invention. As shown in FIG. 7, the heat conductive material 6 is in the form of a sheet, and is a resin composition containing an evaporative foaming agent 61 that foams at 40 ° C. or more, a high heat conductive filler (not shown), and a resin. A large number of springs 64, which are contracted in the thickness direction of the foamable high heat conductive layer 63, are embedded in a sheet-shaped foamable high heat conductive layer 63 made of 62.

【００３３】すなわち、この熱伝導材６は、上記のよう
になっているので、熱伝導材６が発熱部材Ｈの発熱によ
って加熱されると発泡剤６１が発泡するとともに熱可塑
性樹脂が軟化するので熱可塑性樹脂による規制がゆるみ
バネ６４の復元力によって、熱伝導材の表面をより発熱
部材Ｈおよび放熱部材Ｃに密着させやすくなる。That is, since the heat conductive material 6 is as described above, when the heat conductive material 6 is heated by the heat generated by the heat generating member H, the foaming agent 61 foams and the thermoplastic resin is softened. Due to the restoring force of the loose spring 64 regulated by the thermoplastic resin, the surface of the heat conductive material is more easily brought into close contact with the heat generating member H and the heat radiating member C.

【００３４】なお、この熱伝導材６は、特に限定されな
いが、たとえば、ばね６４を収縮させた状態で型内にセ
ットするとともに、この型内に高熱伝導フィラー（図示
せず）と樹脂とを含み、発泡剤を非含有の溶融状態の樹
脂組成物を充填し、樹脂を冷却固化させたのち、この冷
却固化物に高圧状態で蒸発型の発泡剤６１を含浸させる
ことによって製造することができる。The heat conductive material 6 is not particularly limited. For example, the heat conductive material 6 is set in a mold with the spring 64 contracted, and a high heat conductive filler (not shown) and a resin are placed in the mold. It can be produced by filling a molten resin composition containing no foaming agent and cooling and solidifying the resin, and then impregnating the cooled solidified material with an evaporating foaming agent 61 under high pressure. .

【００３５】本発明は、上記の実施の形態に限定されな
い。たとえば、上記の第２、３の実施の形態では、３層
構造になっていたが、２層構造にしても構わないし、４
層構造以上の多層構造としても構わない。また、上記バ
ネ６４に代えて発熱部材による加熱時の形状回復するよ
うな形状記憶材料を用いるようにしても構わない。The present invention is not limited to the above embodiment. For example, in the above-described second and third embodiments, a three-layer structure is used, but a two-layer structure may be used.
A multi-layer structure having a layer structure or more may be used. Further, instead of the spring 64, a shape memory material that recovers the shape when heated by the heat generating member may be used.

【００３６】[0036]

【実施例】以下に、本発明の実施例をより詳しく説明す
る。Embodiments of the present invention will be described below in more detail.

【００３７】（実施例１）アクリル酸２−エチルヘキシ
ル重合体（以下、「ＥＨＡ」と記す）、熱伝導性充填材
としての窒化ホウ素（電気化学工業社製 デンカボロン
ナイトＳＧＰ）、熱伝導性充填材としての炭化珪素（屋
久島電工社製 グレードＧＣ−８００Ｓ）を、ＥＨＡ：
窒化ホウ素：炭化珪素＝４０体積％：４０体積％：２０
体積％となるように配合し、この配合物１００重量部に
対し、発泡剤としての重炭酸ナトリウム（分解温度６０
℃）２重量部と、溶媒としての酢酸エチル４００重量部
を加えて混合して塗工溶液を作製した。(Example 1) 2-ethylhexyl acrylate polymer (hereinafter referred to as "EHA"), boron nitride (Dencaboronite SGP manufactured by Denki Kagaku Kogyo Co., Ltd.) as a thermally conductive filler, and thermally conductive filler Silicon carbide (grade GC-800S manufactured by Yakushima Electric Works) as a material was used for EHA:
Boron nitride: silicon carbide = 40% by volume: 40% by volume: 20
% By volume, and 100 parts by weight of this mixture were added to sodium bicarbonate as a foaming agent (decomposition temperature: 60%).
C) 2 parts by weight and 400 parts by weight of ethyl acetate as a solvent were added and mixed to prepare a coating solution.

【００３８】この塗工溶液をマルチコーターでポリエチ
レンテレフタレートフィルム上に塗工し乾燥させて、厚
み１００μｍの熱伝導材サンプルを得た。This coating solution was coated on a polyethylene terephthalate film with a multi-coater and dried to obtain a heat conductive material sample having a thickness of 100 μm.

【００３９】（実施例２）ＥＨＡ：窒化ホウ素：炭化珪
素＝４０体積％：４０体積％：２０体積％の配合物に代
えて、ＥＨＡ：窒化ホウ素：炭化珪素＝４０体積％：６
０体積％：０体積％の配合物を用いた以外は、実施例１
と同様にして厚み１００μｍの熱伝導材サンプルを得
た。(Example 2) EHA: boron nitride: silicon carbide = 40 volume%: 6 instead of the composition of EHA: boron nitride: silicon carbide = 40 volume%: 40 volume%: 20 volume%
Example 1 except that a 0 vol%: 0 vol% formulation was used.
In the same manner as in the above, a heat conductive material sample having a thickness of 100 μm was obtained.

【００４０】（実施例３）発泡剤として重炭酸ナトリウ
ムに代えて炭酸アンモニウム（分解温度４０℃）を用い
るようにした以外は、実施例１と同様にして厚み１００
μｍの熱伝導材サンプルを得た。Example 3 A thickness of 100 was obtained in the same manner as in Example 1 except that ammonium bicarbonate (decomposition temperature: 40 ° C.) was used instead of sodium bicarbonate as a foaming agent.
A μm heat conductive material sample was obtained.

【００４１】（比較例１）発泡剤を添加しなかった以外
は、実施例１と同様にして厚み１００μｍの熱伝導材サ
ンプルを得た。Comparative Example 1 A heat conductive material sample having a thickness of 100 μm was obtained in the same manner as in Example 1 except that no foaming agent was added.

【００４２】（比較例２）発泡剤を添加しなかった以外
は、実施例１と同様にして厚み１００μｍの熱伝導材サ
ンプルを得た。そして、上記実施例１〜３および比較例
１，２で得た熱伝導材サンプルのそれぞれについて熱抵
抗値を以下のようにして測定し、その結果を表１に示し
た。Comparative Example 2 A heat conductive material sample having a thickness of 100 μm was obtained in the same manner as in Example 1 except that no foaming agent was added. Then, the thermal resistance value of each of the heat conductive material samples obtained in Examples 1 to 3 and Comparative Examples 1 and 2 was measured as follows, and the results are shown in Table 1.

【００４３】〔熱抵抗の測定〕アルミニウム製の冷却器
の上に熱伝導材サンプルを載せ、さらに、熱伝導材サン
プルの上に３０ｍｍ×３０ｍｍ×高さ１０ｍｍのヒータ
ーを載せ、締めつけ板と冷却器との間で締めつけトルク
１Ｎ・ｍで熱伝導材サンプルをおよびヒーターを挟着し
た状態で冷却器の内部に恒温水槽から２３℃の水を循環
供給しておき、ヒーターに４０Ｗの電力を印加し、５分
後のヒーターの温度（Ｔ１）と、冷却器のシート接触面
近傍温度（Ｔ２）を、周辺温度（室温）２３℃で測定
し，その測定結果から熱抵抗値を以下の式で求めた。 ・熱抵抗値（℃／Ｗ）＝（Ｔ１−Ｔ２）／（ヒーターへ
の供給電力）[Measurement of Thermal Resistance] A heat conductive material sample was placed on an aluminum cooler, and a heater having a size of 30 mm × 30 mm × 10 mm was placed on the heat conductive material sample. A heat conductive material sample and a heater are sandwiched between them at a tightening torque of 1 N · m, and water at 23 ° C. is circulated and supplied from a constant temperature water tank to the inside of the cooler in a state in which the heater is sandwiched, and a power of 40 W is applied to the heater. After 5 minutes, the temperature of the heater (T1) and the temperature near the sheet contact surface of the cooler (T2) were measured at an ambient temperature (room temperature) of 23 ° C. From the measurement results, the thermal resistance value was obtained by the following equation. Was.・ Thermal resistance (° C / W) = (T1−T2) / (power supplied to heater)

【００４４】[0044]

【表１】 [Table 1]

【００４５】表1によれば、本発明の熱伝導材が、接触
面への変形追従性に優れ、接触面に凹凸、反り、うねり
等があっても、良好な熱伝導状態を得られることがよく
わかる。According to Table 1, the heat conductive material of the present invention is excellent in the ability to follow the deformation on the contact surface and can obtain a good heat conduction state even if the contact surface has irregularities, warpage, undulations, etc. You can see well.

【００４６】[0046]

【発明の効果】本発明にかかる熱伝導材シートは、以上
のように構成されているので、熱伝導材を挟むように配
置される２つの部材の添設面の凹凸形状や反りうねりに
追従した添設状態を常に確保でき、結果として優れた熱
伝導性を示す。また、請求項３のようにすれば、取り扱
い性に優れたものとすることができる。Since the heat conductive material sheet according to the present invention is constructed as described above, it follows the uneven shape and warp of the attached surface of the two members arranged so as to sandwich the heat conductive material. The attached state can be always secured, and as a result, excellent thermal conductivity is exhibited. Further, according to the third aspect, it is possible to make the handleability excellent.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明にかかる熱伝導材の第１の実施の形態を
模式的にあらわす断面図である。FIG. 1 is a sectional view schematically showing a first embodiment of a heat conductive material according to the present invention.

【図２】図１の熱伝導材の使用状態を模式的にあらわ
し、同図（ａ）はその発泡剤が発泡する前の状態の断面
図、同図（ａ）はその発泡剤が発泡した後の状態の断面
図である。FIG. 2 schematically shows a use state of the heat conductive material of FIG. 1, wherein FIG. 2 (a) is a cross-sectional view of a state before the foaming agent foams, and FIG. 2 (a) shows a state where the foaming agent foams. It is sectional drawing of a state after.

【図３】本発明にかかる熱伝導材の第２の実施の形態を
模式的にあらわす断面図である。FIG. 3 is a cross-sectional view schematically showing a second embodiment of the heat conductive material according to the present invention.

【図４】本発明にかかる熱伝導材の第３の実施の形態を
模式的にあらわす断面図である。FIG. 4 is a cross-sectional view schematically showing a third embodiment of the heat conductive material according to the present invention.

【図５】本発明にかかる熱伝導材の第４の実施の形態を
模式的にあらわす断面図である。FIG. 5 is a cross-sectional view schematically showing a fourth embodiment of the heat conductive material according to the present invention.

【図６】本発明にかかる熱伝導材の第５の実施の形態を
模式的にあらわす断面図である。FIG. 6 is a sectional view schematically showing a fifth embodiment of the heat conductive material according to the present invention.

【図７】本発明にかかる熱伝導材の第６の実施の形態を
模式的にあらわす断面図である。FIG. 7 is a sectional view schematically showing a sixth embodiment of the heat conductive material according to the present invention.

【符号の説明】[Explanation of symbols]

Ｃ 放熱部材 Ｈ 発熱部材 １，２，３，４，５，６ 熱伝導材 １１，２１，３２，４１，５３，６１ 発泡剤 １２，２２，２４，３３，４２，４５，５１，５４ 樹
脂組成物 ２３，３４，４３，５５，６３ 発泡性高熱伝導層 ２５，３１，４６，５２ 非発泡性高熱伝導層C Heat radiating member H Heat generating member 1,2,3,4,5,6 Thermal conductive material 11,21,32,41,53,61 Blowing agent 12,22,24,33,42,45,51,54 Resin composition Materials 23, 34, 43, 55, 63 Foamable high heat conductive layer 25, 31, 46, 52 Non-foamable high heat conductive layer

フロントページの続き Ｆターム(参考） 4F074 AA48 AC32 AC33 AG01 AG20 BA03 BA04 CA29 CC04Y CC22X CC24X CC32Y CC42 CE02 CE24 CE43 CE98 DA07 DA59 4F100 AD06H AD08H AK25A AR00A AR00B BA02 BA10A BA10B CA01 CA23 DJ04A GB41 JJ01A JJ01B JL05 5F036 AA01 BA23 BB21 BC23 BD21Continued on the front page F-term (reference) 4F074 AA48 AC32 AC33 AG01 AG20 BA03 BA04 CA29 CC04Y CC22X CC24X CC32Y CC42 CE02 CE24 CE43 CE98 DA07 DA59 4F100 AD06H AD08H AK25A AR00A AR00B BA02 BA10A BA10B CA01 CA23 DJ04AJ01B01 JJ01A01 BC05 BD21

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】挟着された状態で２つの部材間に介在し、
一方の部材の熱を他方の部材に伝える熱伝導材におい
て、４０℃以上で発泡する発泡剤および高熱伝導フィラ
ーを含む樹脂組成物から形成された発泡性高熱伝導層を
少なくとも備えていることを特徴とする熱伝導材。Claims: 1. An interposed member between two members in a sandwiched state,
A heat conductive material that transmits heat of one member to the other member, characterized in that the heat conductive material includes at least a foamable high heat conductive layer formed from a resin composition including a foaming agent that foams at 40 ° C. or higher and a high heat conductive filler. Thermal conductive material. 【請求項２】発泡性高熱伝導層と発泡剤非含有の非発泡
性高熱伝導層とを備え、これらの層が部材間の挟着方向
に積層されている請求項１に記載の熱伝導材。2. The heat conductive material according to claim 1, further comprising a foamable high heat conductive layer and a non-foamable high heat conductive layer containing no foaming agent, wherein these layers are laminated in a direction of sandwiching the members. . 【請求項３】シート状に形成されている請求項１または
請求項２に記載の熱伝導材。3. The heat conductive material according to claim 1, which is formed in a sheet shape.
JP2001122546A 2001-04-20 2001-04-20 Thermoconductive material Pending JP2002317064A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

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JP2001122546A JP2002317064A (en) 2001-04-20 2001-04-20 Thermoconductive material

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JP2002317064A true JP2002317064A (en) 2002-10-31

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Country Link
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JP2006526687A (en) * 2003-05-30 2006-11-24 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive foam interface material
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JP2009503241A (en) * 2005-08-05 2009-01-29 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive adhesive tape with improved function
JP2010021230A (en) * 2008-07-09 2010-01-28 Denso Corp Manufacturing method of electronic apparatus
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JP2006526687A (en) * 2003-05-30 2006-11-24 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive foam interface material
JP4773339B2 (en) * 2003-05-30 2011-09-14 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive foam interface material
JP2005107487A (en) * 2003-09-26 2005-04-21 Samsung Sdi Co Ltd Display apparatus and plasma display apparatus
JP2009503241A (en) * 2005-08-05 2009-01-29 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive adhesive tape with improved function
WO2007052860A1 (en) * 2005-11-02 2007-05-10 Korea Institute Of Science And Technology Hollow diamond shells filled compostte materials
US8369764B2 (en) 2008-03-21 2013-02-05 Ricoh Company, Ltd. Fixing member, fixing device, and image forming apparatus
JP2010021230A (en) * 2008-07-09 2010-01-28 Denso Corp Manufacturing method of electronic apparatus
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