JP2002314232A - Fully molded electronic component and its manufacturing method - Google Patents
Fully molded electronic component and its manufacturing methodInfo
- Publication number
- JP2002314232A JP2002314232A JP2001116283A JP2001116283A JP2002314232A JP 2002314232 A JP2002314232 A JP 2002314232A JP 2001116283 A JP2001116283 A JP 2001116283A JP 2001116283 A JP2001116283 A JP 2001116283A JP 2002314232 A JP2002314232 A JP 2002314232A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mold
- manufacturing
- molding
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は基板に電気回路を構成
し、その後電気回路をモールドする電子回路装置に関す
るもので、特にトランスファーモールドの小型の電子回
路装置のパッケージに特に有効なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device in which an electric circuit is formed on a substrate and then the electric circuit is molded, and is particularly effective for a package of a transfer-molded small electronic circuit device.
【０００２】[0002]
【従来の技術】従来の電子回路装置は、図４に示すよう
に、基板の所定個所に電子部品を搭載し、はんだ付け後
に、基板全体をモールドしていた。その際に、電子部品
とその下と部分との距離が０から0.15mmとばらつき、場
合によってはモールド樹脂がまんべんなく充填されない
ものが存在していた。2. Description of the Related Art In a conventional electronic circuit device, as shown in FIG. 4, electronic components are mounted on predetermined portions of a substrate, and after soldering, the entire substrate is molded. At that time, the distance between the electronic component and the portion below the electronic component fluctuated from 0 to 0.15 mm, and in some cases, the mold resin was not evenly filled.
【０００３】モールド樹脂がまんべんなく充填されない
と、電子部品下に空気が残り、そのままの状態でモール
ドされることがあった。この場合に、モールド時の圧力
で場合によっては電子部品内部の部品たとえばシリコン
チップ等が割れてしまうという不具合が発生していた。
また、空気が残されたまま製品化すると、電子回路装置
使用時に、温度が上昇した場合など、電子部品の温度上
昇が設計通りでなくなり、電子部品が破損したりして信
頼性に問題が合った。[0003] If the mold resin is not evenly filled, air remains under the electronic component, and the electronic component may be molded as it is. In this case, there has been a problem that a component inside the electronic component, for example, a silicon chip or the like may be broken by the pressure at the time of molding.
In addition, if a product is manufactured with air remaining, the temperature of electronic components will not rise as designed, such as when the temperature rises during use of the electronic circuit device, and the electronic components will be damaged. Was.
【０００４】そこで、従来は図３のように電子部品直下
にあらかじめ液状樹脂を塗っておき、キュアーした後に
モールドしていた。そうすることで、電子部品下に樹脂
がまんべんなく充填されて空気が下に入るのを防止する
ことができた。しかし、あらかじめ、液状樹脂を塗るこ
とは材料が高価でありかつ、作業が面倒であることか
ら、作業工数が増大していた。また、液状樹脂の塗り方
により特性のばらつきがあった。Therefore, conventionally, as shown in FIG. 3, a liquid resin was previously applied immediately below the electronic component, cured, and then molded. By doing so, it was possible to prevent the resin from being evenly filled beneath the electronic component and to prevent air from entering underneath. However, applying a liquid resin in advance is expensive because of the material and the work is troublesome. In addition, the characteristics varied depending on how the liquid resin was applied.
【０００５】[0005]
【発明が解決する課題】本発明は、基板に実装された電
子部品のモールドを行うに際し、電子部品と基板との隙
間を大きく出来、モールド時に概ハ゜ッケーシ゛直下にモール
ド樹脂がまんべんなく充填される隙間が確保できること
を特徴とする。SUMMARY OF THE INVENTION According to the present invention, when molding an electronic component mounted on a substrate, a gap between the electronic component and the substrate can be increased, and a gap in which the molding resin is uniformly filled almost immediately below the package at the time of molding. It can be secured.
【０００６】[0006]
【課題を解決するための手段】請求項１の発明は、基板
に電気回路を構成し、所定個所に電子部品を実装し、前
記電子部品および前記電気回路をモールドして製造する
電子回路装置において、前記電子部品直下に凹部を形成
した事を特徴する。According to a first aspect of the present invention, there is provided an electronic circuit device comprising: an electric circuit formed on a substrate; an electronic component mounted on a predetermined portion; and the electronic component and the electric circuit are molded. A recess is formed directly below the electronic component.
【０００７】請求項２の発明は前記モールドがトランス
ファーモールドであることを特徴とした請求項１のフル
モールド電子部品であり、トランスファーモルドは1平
方センチメートルあたり、１１０ｋｇ〜１２０ｋｇの応
力がかかるので特にこの発明が有効である。A second aspect of the present invention is the full-mold electronic component according to the first aspect, wherein the mold is a transfer mold. In the transfer mold, a stress of 110 kg to 120 kg per square centimeter is applied. Is valid.
【０００８】[0008]
【発明の実施の形態】本発明の一実施例をセラミックの
印刷多層基板で製作する場合について述べる。図1は本
願一実施例である。印刷多層基板はセラミック基板上に
下部導体５、結晶質ガラス４、上部導体３、非結晶質ガ
ラス２の順に各ペーストを印刷・焼成を行ない電気回路
を構成する。その際、下部導体５、結晶質ガラス４、上
部導体３、非結晶質ガラス２を既パッケージ下から避け
る様に構成し避けた層の総厚がそのまま既パッケージ下
の隙間（スタンドオフ）となりモールド樹脂が充分に充
填される構造となる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A case in which an embodiment of the present invention is manufactured on a ceramic printed multilayer substrate will be described. FIG. 1 shows an embodiment of the present invention. The printed multi-layer substrate forms an electric circuit by printing and firing each paste on the ceramic substrate in the order of the lower conductor 5, the crystalline glass 4, the upper conductor 3, and the amorphous glass 2. At this time, the lower conductor 5, the crystalline glass 4, the upper conductor 3, and the amorphous glass 2 are configured to be avoided from under the package, and the total thickness of the avoided layers becomes a gap (stand-off) under the package as it is. The structure is such that the resin is sufficiently filled.
【０００９】また各層が厚い場合には、下部導体５、結
晶質ガラス４、上部導体３、非結晶質ガラス２の全層を
避けずに１、２層でも同様の効果を得ることも可能であ
る。When each layer is thick, the same effect can be obtained with one or two layers without avoiding all layers of the lower conductor 5, the crystalline glass 4, the upper conductor 3, and the amorphous glass 2. is there.
【００１０】[0010]
【発明の効果】従来のフルモールド電子部品と比べて、
信頼性の高い部品を提供することができるものであり産
業上利用価値大なものである。As compared with the conventional full-mold electronic parts,
It can provide highly reliable components and is of great industrial value.
【図１】 本発明一実施例側面図モールド前FIG. 1 is a side view of an embodiment of the present invention before a mold;
【図２】 本発明一実施例斜視図モールド前FIG. 2 is a perspective view of an embodiment of the present invention before a mold;
【図３】従来の改良例斜視図モールド前FIG. 3 is a perspective view of a conventional improved example before molding.
【図４】従来の側面図モールド後FIG. 4 shows a conventional side view after molding.
【図５】従来の改良例側面図モールド後FIG. 5 is a side view of a conventional improved example after molding.
【図６】本発明一実施例モールド後FIG. 6 after molding according to one embodiment of the present invention.
１ 電子部品装置 ２ 非結晶質ガラス ３ 上部導体 ４ 結晶質ガラス ５ 下部導体 ６ 凹部 ７ 液状樹脂 ８ 空気 ９ モールド樹脂 DESCRIPTION OF SYMBOLS 1 Electronic component device 2 Amorphous glass 3 Upper conductor 4 Crystalline glass 5 Lower conductor 6 Depression 7 Liquid resin 8 Air 9 Mold resin
Claims (3)
子部品を実装し、前記電子部品および前記電気回路をモ
ールドして製造するフルモールド電子部品において、前
記電子部品直下に凹部を形成したことを特徴としたフル
モールド電子部品。An electric circuit is formed on a substrate, an electronic component is mounted at a predetermined position, and a concave portion is formed immediately below the electronic component in a full-mold electronic component manufactured by molding the electronic component and the electric circuit. Full-mold electronic components characterized by the following.
あることを特徴とした請求項１のフルモールド電子部品2. The full-mold electronic component according to claim 1, wherein said mold is a transfer mold.
望の個所に、凹部を形成し、電子部品搭載後、はんだつ
けし、その後モールドしたことを特徴としたフルモール
ド電子部品の製造方法。3. A method of manufacturing a fully-molded electronic component, comprising forming an electric circuit on a substrate, forming a recess at a desired portion of the circuit, mounting the electronic component, soldering, and then molding. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001116283A JP2002314232A (en) | 2001-04-16 | 2001-04-16 | Fully molded electronic component and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001116283A JP2002314232A (en) | 2001-04-16 | 2001-04-16 | Fully molded electronic component and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002314232A true JP2002314232A (en) | 2002-10-25 |
Family
ID=18967040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001116283A Pending JP2002314232A (en) | 2001-04-16 | 2001-04-16 | Fully molded electronic component and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002314232A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016025229A (en) * | 2014-07-22 | 2016-02-08 | 株式会社オートネットワーク技術研究所 | Circuit structure |
-
2001
- 2001-04-16 JP JP2001116283A patent/JP2002314232A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016025229A (en) * | 2014-07-22 | 2016-02-08 | 株式会社オートネットワーク技術研究所 | Circuit structure |
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