JP2002275693A - Separating membrane body for electrolytic plating equipment and method for manufacturing the same as well as electroplating equipment - Google Patents
Separating membrane body for electrolytic plating equipment and method for manufacturing the same as well as electroplating equipmentInfo
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- JP2002275693A JP2002275693A JP2001082646A JP2001082646A JP2002275693A JP 2002275693 A JP2002275693 A JP 2002275693A JP 2001082646 A JP2001082646 A JP 2001082646A JP 2001082646 A JP2001082646 A JP 2001082646A JP 2002275693 A JP2002275693 A JP 2002275693A
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- Prior art keywords
- electrolytic
- diaphragm
- separate film
- support frame
- welded
- Prior art date
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- Electrodes Of Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体ウエハーや
液晶ガラス板等の電導体の表面に金属の薄い被膜を形成
する電解メッキ装置に用いて好適なセパレート膜体およ
びその製造方法と電解メッキ装置の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a separate film body suitable for use in an electrolytic plating apparatus for forming a thin metal film on the surface of a conductor such as a semiconductor wafer or a liquid crystal glass plate, a method of manufacturing the same, and an electrolytic plating apparatus. Regarding improvement.
【０００２】[0002]
【従来の技術】近年、半導体の製造工程中において、銅
配線を生成させるために、半導体基板上に銅膜を電解メ
ッキ装置にて生成させる方法が採られている。この装置
では銅メッキの電解液として、硫酸銅水溶液が使用され
るが、この電解液には不純物が極めて少ないものが要求
されることから、それが製造コストを引き上げる原因の
一つとなっている。2. Description of the Related Art In recent years, a method of forming a copper film on a semiconductor substrate by an electrolytic plating apparatus has been adopted in order to generate copper wiring during a semiconductor manufacturing process. In this apparatus, an aqueous solution of copper sulfate is used as an electrolytic solution for copper plating, and since this electrolytic solution is required to have an extremely small amount of impurities, this is one of the causes for increasing the production cost.
【０００３】そこで、これを解決するために、電解メッ
キ槽内にフィルターとして機能する電解隔膜（以後セパ
レート膜体と称する）を設置する方法が行われている。
このセパレート膜体を使用した方法では、槽内の電解液
はセパレート膜を介して２つの室に区画されており、電
解アノード側で発生した金属イオンはセパレート膜体を
通してカソード側に供給され、電解メッキに阻害となる
不純物はセパレート膜体に遮られカソード側に供給され
ず、メッキが行われる。[0003] In order to solve this problem, a method of installing an electrolytic diaphragm (hereinafter, referred to as a separate film) functioning as a filter in an electrolytic plating tank has been performed.
In the method using the separate membrane, the electrolytic solution in the tank is divided into two chambers through the separate membrane, and metal ions generated on the electrolytic anode side are supplied to the cathode side through the separate membrane, Impurities that hinder plating are blocked by the separate film body and are not supplied to the cathode side, and plating is performed.
【０００４】ここで、セパレート膜体は、主にプラスチ
ック材料が使用されているが、耐薬品性等の理由により
特にふっ素樹脂が使用されており、その構造は隔膜とそ
の骨組みとなる補強用支持枠とから構成されている。上
記補強用支持枠と隔膜は、２枚の補強支持枠の間に隔膜
を挟み同材質のピンにより数カ所をピン止め固定した
り、補強支持枠に隔膜を接着剤にて固定するなどの手段
が適用されている。Here, the separate film body is mainly made of a plastic material, but is particularly made of a fluororesin for reasons of chemical resistance and the like, and its structure is composed of a diaphragm and a reinforcing support which forms a skeleton thereof. And a frame. The reinforcing support frame and the diaphragm are formed by sandwiching the diaphragm between the two reinforcing support frames and fixing a few places with pins of the same material, or fixing the diaphragm to the reinforcing support frame with an adhesive. Have been applied.
【０００５】[0005]
【発明が解決しようとする課題】しかし、２枚の補強支
持枠の間に隔膜を挟みピン固定する構造では、どうして
もピンとピンとの間で補強支持枠と隔膜との間に隙間が
生じてしまい、不純物が純度の高い液側に漏れてしまう
不具合がある。また、補強支持枠に隔膜を接着剤にて固
定する構造では、ＰＥやふっ素樹脂等のように極性が低
く結晶性の高い樹脂は接着が難しく、専用の接着剤や特
殊な表面処理が必要とされる。しかし、この構造でも接
着強度が弱いため使用中に隔膜が剥がれたり、接着剤の
成分が電解液中に溶出したりすることがある。However, in the structure in which the diaphragm is sandwiched between the two reinforcing support frames and the pins are fixed, a gap is inevitably formed between the reinforcing support frame and the diaphragm between the pins. There is a problem that impurities leak to the high-purity liquid side. In the structure where the diaphragm is fixed to the reinforcing support frame with an adhesive, it is difficult to bond a resin with low polarity and high crystallinity, such as PE or fluororesin, which requires a special adhesive or special surface treatment. Is done. However, even in this structure, since the adhesive strength is weak, the diaphragm may be peeled off during use, or the components of the adhesive may be eluted into the electrolytic solution.
【０００６】更に、補強支持枠と隔膜とを加熱溶着する
手段も考えられるが、表層のみを溶融させてお互いを溶
着させるため、溶着強度が弱かったり不均一になってし
まう。一方、加熱量を増すと、隔膜等が変色、炭化して
しまう。Further, a method of heating and welding the reinforcing support frame and the diaphragm is conceivable. However, since only the surface layer is melted and welded to each other, the welding strength is weak or non-uniform. On the other hand, when the heating amount is increased, the diaphragm and the like are discolored and carbonized.
【０００７】本発明は上記事情に鑑みてなされたもの
で、長期に使用しても液の漏れや電解隔膜の破損が無
く、耐久性に優れた電解メッキ装置用セパレート膜体お
よびその製造方法と電解メッキ装置を提供することを目
的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has no danger of liquid leakage or breakage of an electrolytic membrane even when used for a long period of time, and has excellent durability and a method of manufacturing the same. An object of the present invention is to provide an electrolytic plating apparatus.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、本発明による電解メッキ装置用セパレート膜体は、
電解隔膜と、これを補強する支持枠とが超音波振動によ
り溶着されていることを要旨とする。また、本発明によ
る電解メッキ装置用セパレート膜体の製造方法は、プラ
スチック材料製の電解隔膜と、これを補強するプラスチ
ック材料製の支持枠とを超音波発生装置を用いて溶着す
ることを要旨としている。さらにまた、本発明による電
解メッキ装置は、メッキ処理液を収容するメッキ処理槽
と、前記メッキ処理槽内を２つの室に区画するための請
求項１〜５のいずれかのセパレート膜体とで構成するこ
とを要旨としている。In order to achieve the above object, a separate film for an electrolytic plating apparatus according to the present invention is provided.
The gist is that the electrolytic diaphragm and the supporting frame for reinforcing the electrolytic diaphragm are welded by ultrasonic vibration. Further, a method of manufacturing a separate film body for an electroplating apparatus according to the present invention is characterized in that an electrolytic diaphragm made of a plastic material and a support frame made of a plastic material for reinforcing the same are welded using an ultrasonic generator. I have. Furthermore, the electrolytic plating apparatus according to the present invention comprises a plating tank containing a plating solution and a separate film body according to any one of claims 1 to 5 for dividing the inside of the plating tank into two chambers. The gist is to configure.
【０００９】[0009]
【発明の実施の形態】本発明の好ましい実施の形態とし
ては、図１〜図２に示すように、ポリエチレン製不織布
をＰＶＤＦ（ポリビニリデンフルオライド樹脂）多孔質
体で挟んで形成した隔膜１と、その一方の面に重ね合わ
せたＰＶＤＦ樹脂からなる補強用支持枠２とを超音波振
動により溶着してセパレート膜体Ａを構成する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As a preferred embodiment of the present invention, as shown in FIGS. 1 and 2, a non-woven fabric made of polyethylene is sandwiched between PVDF (polyvinylidene fluoride resin) porous bodies. And a reinforcing support frame 2 made of PVDF resin superimposed on one surface thereof is welded by ultrasonic vibration to form a separate film body A.
【００１０】前記補強用支持枠２は、図示の例ではリン
グ状の外枠部とその外枠部から中心部に延びる内枠部と
で形成されており、外枠部と内枠部とで囲まれた開口部
が電解後のイオンの通過部分となっている。この開口部
形状は、例えばシリコンウエハのようなメッキ成膜させ
る対象物に対して有効に作用するためのもので、可能な
限り面積を大きく取り、かつ対象物形状に近づけること
が重要である。In the illustrated example, the reinforcing support frame 2 is formed of a ring-shaped outer frame and an inner frame extending from the outer frame to the center. The enclosed opening is a portion through which ions after electrolysis pass. The shape of the opening is to effectively act on an object on which a plating film is formed, such as a silicon wafer, and it is important that the area be as large as possible and close to the shape of the object.
【００１１】前記隔膜と補強用支持枠とからなるセパレ
ート膜体の形状は、図１〜図２に示した構造に限定され
るものではなく、円盤状のものに任意の位置に円形、四
角、三角等の形をした空間部を形成したものでもよく、
また平板状に限らずＶ字型・アーチ型・コーン型等任意
の形としても良い。図３〜図５に、セパレート膜体の他
の例を示す。これらのセパレート膜体のうち、図４の膜
体は処理槽内にある気体が支持枠の凹部にたまってしま
う傾向があるので、アノード側に隔膜がある方が好まし
い。また、図３に示す構造とすることで、端部が上向き
になっているため気体が抜けていくことができる。また
ウエハー交換時やメッキ処理装置のメンテナンス時には
電解液を抜くが、図３の構造によれば、セパレート膜体
に残る液だまりを少なくすることができる。The shape of the separate membrane composed of the diaphragm and the reinforcing support frame is not limited to the structure shown in FIGS. 1 and 2, but may be a disc, a circle, a square, It may be one that forms a space such as a triangle,
Further, the shape is not limited to a flat shape, and may be an arbitrary shape such as a V shape, an arch shape, and a cone shape. 3 to 5 show other examples of the separate film body. Among these separate membranes, the membrane in FIG. 4 preferably has a diaphragm on the anode side because the gas in the processing tank tends to accumulate in the concave portion of the support frame. In addition, the structure shown in FIG. 3 allows the gas to escape because the end is upward. Further, the electrolyte is drained at the time of wafer exchange or maintenance of the plating apparatus, but according to the structure of FIG. 3, the liquid pool remaining on the separate film body can be reduced.
【００１２】また、補強支持枠としては、ＰＶＤＦ，Ｐ
ＣＴＦＥ，ＥＴＦＥ，ＰＥＴ，ＰＶＣ、等のふっ素樹脂
や、ポリエチレン，ポリプロピレン等の汎用プラスチッ
クが使用できるが、耐薬品性に優れるふっ素樹脂、特に
機械的強度が大きく、かつ融点が比較的低くて溶融粘度
が小さいため加工しやすいＰＶＤＦが好ましい。また、
超音波溶着はプラスチックの融点が低く溶融粘度の小さ
いものほど容易であるため、この点からポリエチレン樹
脂、ポリエチレンテレクタレート樹脂、等の樹脂が好ま
しい。Further, as the reinforcing support frame, PVDF, P
Fluororesins such as CTFE, ETFE, PET, PVC, and general-purpose plastics such as polyethylene and polypropylene can be used. Fluororesins with excellent chemical resistance, especially high mechanical strength, relatively low melting point and melt viscosity Since PVDF is small, PVDF which is easy to process is preferable. Also,
Ultrasonic welding is easier when the melting point of plastic is lower and the melt viscosity is lower. Therefore, resins such as polyethylene resin and polyethylene terephthalate resin are preferable from this point.
【００１３】一方、電解隔膜１としては、無機結晶物、
ごみ等の不純物を通さず銅イオン等の金属イオンを透過
させるものであり、一例としてポリエチレン等の汎用プ
ラスチックやＰＶＤＦ等のふっ素樹脂からなる不織布ま
たはメッシュ状のプラスチック，プラスチック多孔質
体、プラスチックメッシュにプラスチック多孔質体を挟
んだもの等が挙げられるが、高強度および加工の容易さ
の理由によりプラスチックメッシュをＰＶＤＦ多孔質体
で挟んだものが特に好ましい。On the other hand, as the electrolytic diaphragm 1, an inorganic crystal,
It allows metal ions such as copper ions to pass through without allowing impurities such as dust to pass through. For example, non-woven fabrics or mesh-like plastics made of general-purpose plastics such as polyethylene or fluororesin such as PVDF, plastic porous bodies, and plastic meshes Examples thereof include a member sandwiching a plastic porous body, and a member sandwiching a plastic mesh between PVDF porous members is particularly preferable because of high strength and ease of processing.
【００１４】前記電解隔膜１に補強用支持枠２とを溶着
する超音波溶着とは、約１５ｋＨｚ以上の超音波の機械
的振動エネルギーを利用し、被溶着物を加圧しつつその
振動エネルギーを被溶着物に与えることにより、被溶着
物の接合面に強力な摩擦熱を発生させて軟化・溶融さ
せ、両者を接着するもので、このような性能を有する市
販の超音波溶着装置を任意に選択使用できる。Ultrasonic welding for welding the reinforcing support frame 2 to the electrolytic diaphragm 1 utilizes mechanical vibration energy of ultrasonic waves of about 15 kHz or more and applies the vibration energy while pressurizing an object to be welded. By applying it to the welded material, it generates strong frictional heat on the joint surface of the welded material, softens and melts it, and bonds them together.Any commercial ultrasonic welding device with such performance can be selected arbitrarily Can be used.
【００１５】図６に、超音波溶着装置の概略構成を示
す。同図において、３は発振器から電気信号を機械的振
動エネルギーに変換するコンバータ、４はその振動エネ
ルギーを増幅あるいは減衰させるブースター、５はブー
スターを通ってきた振動エネルギーを被溶着物に伝達す
るホーン、６は治具、Ａ１はパーツ（被溶着物）であ
り、ホーンは治具の上方に位置して上下に移動可能とな
っている。即ち、この超音波エネルギーを機械的振動エ
ネルギーに変換し、加圧を同時に供給することによって
溶着される２つのパーツの接合面に強力な摩擦熱を発生
し、プラスチックを溶融して溶着を行う。FIG. 6 shows a schematic configuration of the ultrasonic welding apparatus. In the figure, 3 is a converter for converting an electric signal from an oscillator into mechanical vibration energy, 4 is a booster for amplifying or attenuating the vibration energy, 5 is a horn for transmitting the vibration energy passing through the booster to a welded object, 6 jig, a 1 is a part (the weld deposit), the horn is movable vertically positioned above the jig. That is, the ultrasonic energy is converted into mechanical vibration energy, and by applying pressure simultaneously, strong frictional heat is generated at the joint surface of the two parts to be welded, and the plastic is melted and welded.
【００１６】図７に、前記セパレート膜体を適用した電
解メッキ装置の概略構成例を示す。同図において、７は
電解メッキ処理槽、Ａはコーン型セパレート膜体、８は
銅ブロックのアノード、９は半導体ウエハー、１０はウ
エハーに設けたカソードである。即ち、電解メッキ装置
は、メッキ処理液を収容する電解メッキ処理槽７をコー
ン型セパレート膜体Ａでアノード室とカソード室との区
画した構成とされている。FIG. 7 shows a schematic configuration example of an electrolytic plating apparatus to which the separate film body is applied. In the figure, 7 is an electrolytic plating tank, A is a cone-shaped separate film, 8 is an anode of a copper block, 9 is a semiconductor wafer, and 10 is a cathode provided on the wafer. That is, the electrolytic plating apparatus has a configuration in which an electrolytic plating tank 7 containing a plating solution is divided into an anode chamber and a cathode chamber by a cone-type separate film body A.
【００１７】[0017]
【実施例】セパレート膜体を構成する隔膜としては、ポ
リエチレン製不織布にＰＶＤＦ多孔質材を両側から挟み
一体化したもの（ユアサコーポレーション製Ｙ−９２０
５Ｔ）を使用した。また、補強用支持枠はＰＶＤＦ製と
し、リング状の外枠部とその外枠部から中心部へと延び
る内枠部とからなる形状（図１参照）としたものを用い
た。上記隔膜と補強用支持枠とを、図６の超音波溶着装
置（日本エマソン株式会社製「ＢＲＡＮＳＯＮ超音波ウ
エルダー モデル２０００ａｅｄ」）により溶着を行っ
た。EXAMPLES As a diaphragm constituting a separate membrane, a non-woven fabric made of polyethylene and a PVDF porous material sandwiched from both sides is integrated (Y-920 manufactured by Yuasa Corporation).
5T) was used. Further, the reinforcing support frame was made of PVDF, and had a shape including a ring-shaped outer frame portion and an inner frame portion extending from the outer frame portion to the center (see FIG. 1). The diaphragm and the supporting frame for reinforcement were welded by an ultrasonic welding apparatus ("BRANSON ultrasonic welder model 2000aed" manufactured by Emerson Japan, Ltd.) in FIG.
【００１８】隔膜と補強支持枠とを溶着する場合、治具
のローレット加工部上に、支持枠、隔膜、支持枠の順で
載置し、その後、ホーンを支持枠にあたるまで下げ、２
kgf/cm２の圧力を加えながら、周波数２０ｋＨｚの超音
波振動を０．２秒加えた。これにより隔膜がローレット
部の形状（鋸歯形状）に応じて軟化溶融した後、硬化す
ることにより、隔膜と補強用支持枠とは隙間なく溶着固
定されたセパレート膜体を得た。When welding the diaphragm and the reinforcing support frame, the support frame, the diaphragm, and the support frame are placed in this order on the knurled portion of the jig, and then the horn is lowered until it hits the support frame.
While applying a pressure of kgf / cm 2 , ultrasonic vibration having a frequency of 20 kHz was applied for 0.2 seconds. As a result, the diaphragm was softened and melted in accordance with the shape of the knurled portion (sawtooth shape), and then cured to obtain a separate film body in which the diaphragm and the reinforcing support frame were welded and fixed without gaps.
【００１９】比較例１ 実施例１と同一の補強支持枠、電解隔膜を使用し、上記
補強支持枠と隔膜とを、ＰＶＤＦ製のピンにより固定す
ることによりセパレート膜体を得た。Comparative Example 1 The same reinforcing support frame and electrolytic membrane as in Example 1 were used, and the reinforcing support frame and the diaphragm were fixed with PVDF pins to obtain a separate membrane.
【００２０】比較例２ 補強支持枠と電解隔膜は実施例１と同一のものを使用
し、その補強支持枠と隔膜をゴム系接着剤を５０〜１０
０g/m２塗布して接着固定することによりセパレート膜
体を得た。Comparative Example 2 The same reinforcing support frame and electrolytic diaphragm as in Example 1 were used.
0 g / m 2 was applied and fixed by adhesion to obtain a separate film.
【００２１】比較例３ 補強支持枠と電解隔膜は実施例１と同一のものを使用
し、２００〜２５０℃で１０〜２０秒加熱し、補強支持
枠と電解隔膜とを熱融着にて接着固定することによりセ
パレータ膜を得た。その結果、熱溶着時に、電解隔膜が
褐色に変色する場合が発生した。Comparative Example 3 The same reinforcing support frame and electrolytic membrane as in Example 1 were used, heated at 200 to 250 ° C. for 10 to 20 seconds, and the reinforcing support frame and the electrolytic diaphragm were bonded by heat fusion. By fixing, a separator membrane was obtained. As a result, during thermal welding, the electrolytic diaphragm sometimes turned brown.
【００２２】実施例１、比較例１〜３のセパレート膜体
を電解メッキ装置（銅メッキ）にセットし、０.１〜０.
３（kgf/cm２）の圧力でメッキ薬液を流し、その薬液の
漏れおよび補強支持枠と電解隔膜との接着強さを調べた
試験結果を下記表１に示す。The separate film bodies of Example 1 and Comparative Examples 1 to 3 were set in an electrolytic plating apparatus (copper plating), and 0.1 to 0.1.
Table 1 shows the test results obtained by flowing a plating solution at a pressure of 3 (kgf / cm 2 ) and examining the leakage of the solution and the adhesive strength between the reinforcing support frame and the electrolytic diaphragm.
【００２３】[0023]
【表１】 [Table 1]
【００２４】[0024]
【発明の効果】以上詳述したように、本発明によれば、
電解隔膜と補強支持枠とを超音波振動により溶着するも
のであるから、接着強度が強く、長時間使用しても電解
液の漏れや隔膜の破損がなく、耐久性に優れた電解メッ
キ装置用セパレート膜体が得られる。したがって、本発
明のセパレート膜体の使用によれば、清浄な電解液を用
意せずに済むとともに、半導体基板に対し、不純物の極
めて少ない電解液を供給することが可能となる。As described in detail above, according to the present invention,
Electrolytic diaphragm is welded to the reinforcing support frame by ultrasonic vibration, so it has strong adhesive strength, and it does not leak electrolyte or break the diaphragm even if used for a long time. A separate membrane is obtained. Therefore, according to the use of the separate film body of the present invention, it is not necessary to prepare a clean electrolytic solution, and it is possible to supply the semiconductor substrate with an electrolytic solution having extremely few impurities.
【図１】本発明の一実施例を示す電解メッキ装置用セパ
レート膜体の平面図である。FIG. 1 is a plan view of a separate film body for an electrolytic plating apparatus according to an embodiment of the present invention.
【図２】セパレート膜体の断面図である。FIG. 2 is a sectional view of a separate film body.
【図３】他の実施例を示すセパレート膜体の断面図であ
る。FIG. 3 is a cross-sectional view of a separate film body showing another embodiment.
【図４】他の実施例を示すセパレート膜体の断面図であ
る。FIG. 4 is a cross-sectional view of a separate film body showing another embodiment.
【図５】他の実施例を示すセパレート膜体の断面図であ
る。FIG. 5 is a sectional view of a separate film body showing another embodiment.
【図６】超音波溶着装置の概略構成図である。FIG. 6 is a schematic configuration diagram of an ultrasonic welding device.
【図７】本発明による電解メッキ装置の概略構成図であ
る。FIG. 7 is a schematic configuration diagram of an electrolytic plating apparatus according to the present invention.
Ａ セパレート膜体 １ 電解隔膜 ２ 補強用支持枠 ３ コンバータ ４ ブースター ５ ホーン ６ 治具 Ａ１ 被溶着物 ７ 電解メッキ処理槽 ８ 銅ブロックのアノード ９ 半導体ウエハー １０ カソードReference Signs List A Separate film 1 Electrolytic diaphragm 2 Reinforcing support frame 3 Converter 4 Booster 5 Horn 6 Jig A 1 Deposit to be welded 7 Electroplating bath 8 Anode of copper block 9 Semiconductor wafer 10 Cathode
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大加瀬 亘 東京都港区赤坂５−３−６ ＴＢＳ放送セ ンター 東京エレクトロン株式会社内 (72)発明者 平尾 光一 東京都港区芝大門１−１−26 ニチアス株 式会社内 (72)発明者 上野 洋司 神奈川県横浜市鶴見区大黒町１−70 ニチ アス株式会社鶴見工場内 Ｆターム(参考） 4K024 AA09 AB01 BA11 BB12 CB01 CB26 4M104 BB04 DD52 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Wataru Okase 5-3-6 Akasaka, Minato-ku, Tokyo TBS Broadcasting Center Tokyo Electron Limited (72) Inventor Koichi Hirao 1-1-26 Shiba-Daimon, Minato-ku, Tokyo Inside Nichias Co., Ltd. (72) Inventor Yoji Ueno 1-70, Ogurocho, Tsurumi-ku, Yokohama-shi, Kanagawa F-term in Nichiasu Co., Ltd. Tsurumi Factory 4K024 AA09 AB01 BA11 BB12 CB01 CB26 4M104 BB04 DD52
Claims (8)
超音波振動により溶着されていることを特徴とする電解
メッキ装置用セパレート膜体。1. A separate film body for an electrolytic plating apparatus, wherein an electrolytic diaphragm and a support frame for reinforcing the diaphragm are welded by ultrasonic vibration.
振動により溶着されている請求項１に記載の電解メッキ
装置用セパレート膜体。2. The separate film body for an electrolytic plating apparatus according to claim 1, wherein the electrolytic diaphragm and the support frame are welded on one surface by ultrasonic vibration.
が超音波振動により溶着されている請求項１に記載の電
解メッキ装置用セパレート膜体。3. The separate film for an electroplating apparatus according to claim 1, wherein the support frame and the electrolytic diaphragm sandwiching both sides thereof are welded by ultrasonic vibration.
が超音波振動により溶着されている請求項１に記載の電
解メッキ装置用セパレート膜体。4. The separate film body for an electroplating apparatus according to claim 1, wherein the electrolytic diaphragm and a support frame sandwiching both sides thereof are welded by ultrasonic vibration.
に電解隔膜が超音波振動により溶着されている請求項１
〜４のいずれかに記載の電解メッキ装置用セパレート膜
体。5. An electrolytic diaphragm is welded to a substantially V-shaped or arch-shaped support frame by ultrasonic vibration.
5. The separate film for an electroplating apparatus according to any one of items 4 to 4.
ＤＦの多孔質体で挟んだものからなり、補強用支持枠が
ＰＶＤＦで形成されている請求項１〜５に記載の電解メ
ッキ装置用セパレート膜体。6. The non-woven fabric made of polyethylene is used as the electrolytic diaphragm.
The separate film body for an electroplating apparatus according to claim 1, wherein the reinforcing frame is made of PVDF and is sandwiched between DF porous bodies.
挟み込むように重ね合わせたプラスチック材料製の補強
用支持枠とを超音波発生装置を用いて溶着することを特
徴とする電解メッキ装置用セパレート膜体の製造方法。7. A separate film for an electrolytic plating apparatus, wherein an electrolytic diaphragm made of a plastic material and a reinforcing frame made of a plastic material which are overlapped so as to sandwich the same are welded by using an ultrasonic generator. How to make the body.
と、前記メッキ処理槽内を２つの室に区画するための請
求項１〜６記載のセパレート膜体とを有する電解メッキ
装置。8. An electrolytic plating apparatus comprising: a plating tank containing a plating solution; and a separate film according to claim 1 for dividing the plating tank into two chambers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001082646A JP2002275693A (en) | 2001-03-22 | 2001-03-22 | Separating membrane body for electrolytic plating equipment and method for manufacturing the same as well as electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001082646A JP2002275693A (en) | 2001-03-22 | 2001-03-22 | Separating membrane body for electrolytic plating equipment and method for manufacturing the same as well as electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002275693A true JP2002275693A (en) | 2002-09-25 |
Family
ID=18938565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001082646A Pending JP2002275693A (en) | 2001-03-22 | 2001-03-22 | Separating membrane body for electrolytic plating equipment and method for manufacturing the same as well as electroplating equipment |
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| JP (1) | JP2002275693A (en) |
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