JP2002270033A - Conductive paste composition and printed wiring board - Google Patents
Conductive paste composition and printed wiring boardInfo
- Publication number
- JP2002270033A JP2002270033A JP2001063668A JP2001063668A JP2002270033A JP 2002270033 A JP2002270033 A JP 2002270033A JP 2001063668 A JP2001063668 A JP 2001063668A JP 2001063668 A JP2001063668 A JP 2001063668A JP 2002270033 A JP2002270033 A JP 2002270033A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- resin
- epoxy resin
- conductive
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は新規な導電性ペース
ト組成物に関し、特に基材との接着力、硬度、靭性が要
求される電子回路成形用に使用すする導電性ペースト組
成物及びそれを用いたプリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel conductive paste composition, and more particularly, to a conductive paste composition used for forming an electronic circuit which requires adhesion, hardness and toughness to a substrate, and the same. The present invention relates to a printed wiring board used.
【０００２】[0002]
【従来の技術】導電性ペースト組成物は、エレクトロニ
クス分野において、ＩＣ回路用、導電性接着剤、電磁波
シールド等多くの用途に使用されている。特に最近で
は、少なくとも一方の面の所定位置に導電性ペーストで
作った円錐状導電バンプが設けられた第一の基板と、少
なくとも一方の面に配線パターンが設けられた第二の基
板とを、前記導電バンプが設けられた面および前記配線
パターンが設けられた面を内側にして対向させ、前記第
一の基板と前記第二の基板との間に絶縁体層を配置して
積層体を構成し、該積層体を積層プレスすることにより
絶縁体層の厚さ方向に前期バンプを貫通させて導電配線
部を形成するプリント配線板の製造方法が提案されてい
る。（特開平６−３５０２５８号公報）2. Description of the Related Art In the field of electronics, conductive paste compositions are used for many purposes such as IC circuits, conductive adhesives, electromagnetic wave shields, and the like. Particularly recently, a first substrate provided with a conical conductive bump made of a conductive paste at a predetermined position on at least one surface, and a second substrate provided with a wiring pattern on at least one surface, The surface on which the conductive bumps are provided and the surface on which the wiring pattern is provided are opposed to each other with an insulator layer disposed between the first substrate and the second substrate to form a laminate. Then, there has been proposed a method of manufacturing a printed wiring board in which a conductive wiring portion is formed by causing the bumps to penetrate in the thickness direction of the insulator layer by stacking and pressing the stacked body. (JP-A-6-350258)
【０００３】上記の導電バンプの形成には例えばメラミ
ン樹脂、フェノール樹脂、ポリイミド#樹脂等のバイン
ダー成分と例えば銀、金、 銅、半田粉等の導電性粉末
又はこれらの合金粉末を混合して調整した導電性ペース
ト組成物が使用されている。The conductive bumps are formed by mixing a binder component such as melamine resin, phenol resin and polyimide #resin with a conductive powder such as silver, gold, copper and solder powder or an alloy powder thereof. The used conductive paste composition is used.
【０００４】[0004]
【発明が解決しようする課題】上記プリント配線基板の
製造において上記導電性ペースト組成物を使用した場合
以下の問題があった。When the above-mentioned conductive paste composition is used in the production of the above-mentioned printed wiring board, there are the following problems.
【０００５】第一の問題は、導電性ペースト組成物から
形成した円錐状バンプの絶縁体層の貫通不良により接続
不良が生じることである。導電バンプの貫通温度は、各
種絶縁体層により最適な範囲に設定されねばならない
が、例えば比較的軟化点の低いＦＲ−４（米国ＮＥＭ
Ａ：ｎａｔｉｏｎａｌ ｅｌｅｃｔｒｉｃａｌ ｍａｎ
ｕｆａｃｔｕｒｅｒｓ ａｓｓｏｃｉａｔｉｏｎ規格）
のガラスクロス入りプリプレグでは、8０乃至１2０℃の
温度範囲で貫通する。このため、この温度範囲で変形し
ないレベルのバンプ軟化点、硬度が必要である。もし変
形した場合はバンプが絶縁体層を貫通できないため、層
間に接続不良が生じる。[0005] The first problem is that poor connection occurs due to poor penetration of the insulating layer of the conical bump formed from the conductive paste composition. The penetration temperature of the conductive bumps must be set in an optimum range depending on the type of the insulating layers. For example, FR-4 having a relatively low softening point (NEM, USA)
A: National electrical man
ufacturers association standard)
In the case of the prepreg containing glass cloth, the material penetrates in a temperature range of 80 to 120 ° C. For this reason, a bump softening point and hardness that do not deform in this temperature range are required. If deformed, the bumps cannot penetrate the insulator layer, resulting in poor connection between the layers.
【０００６】第二の問題は貫通時及び積層プレス時にバ
ンプが割れることによる接続不良、バンプ先端部の飛び
による回路のショートが起きることである。これは、バ
インダー樹脂が脆い場合、導電粉、チクソ付与剤等の充
填剤が適切に配合されていない場合に起きる傾向があっ
た。[0006] The second problem is that the connection failure due to the cracking of the bump at the time of penetration or lamination pressing, and the short circuit of the circuit due to the jump of the tip of the bump occur. This tended to occur when the binder resin was brittle or when fillers such as conductive powder and thixotropy agent were not properly blended.
【０００７】第三の問題は積層プレス後にバンプ突き当
て部と配線パターン間の接着不良である。バインダー自
体の接着力が弱い場合の他、バンプの硬化度が進み過ぎ
た場合に起きる傾向があった。[0007] The third problem is poor adhesion between the bump contact portion and the wiring pattern after the lamination press. In addition to the case where the adhesive force of the binder itself is weak, the tendency tends to occur when the degree of curing of the bump is excessively advanced.
【０００８】[0008]
【課題を解決するための手段】本発明者らは、上記課題
を解決すべく鋭意研究を重ねた。その結果、導電性ペー
スト組成物のバインダー成分としてメラミン樹脂、フェ
ノール樹脂に接着力及び靭性が高いエポキシ樹脂を使用
し、絶縁層貫通前の導電バンプの硬化度を制御すること
で、上記問題を解決できることを見出し、本発明を完成
するに至った。Means for Solving the Problems The present inventors have intensively studied to solve the above problems. As a result, the above problem is solved by using a melamine resin, a phenol resin, and an epoxy resin having high adhesiveness and toughness as a binder component of the conductive paste composition and controlling the degree of curing of the conductive bump before penetrating the insulating layer. They have found that they can do this and have completed the present invention.
【０００９】即ち、本発明は、メラミン樹脂、フェノー
ル樹脂、エポキシ樹脂及び導電粉末を必須成分とするこ
とを特徴とする導電性ペースト組成物であり、上記エポ
キシ樹脂が軟化点８０℃以上１３０℃以下のエポキシ樹
脂であることを特徴とする導電性ペースト組成物であ
る。以下具体的に記載する。That is, the present invention is a conductive paste composition comprising a melamine resin, a phenol resin, an epoxy resin and a conductive powder as essential components, wherein the epoxy resin has a softening point of 80 ° C. or more and 130 ° C. or less. A conductive paste composition characterized by being an epoxy resin. The details are described below.
【００１０】本発明に用いられるエポキシ樹脂はＭＥＴ
ＴＬＥＲ ＦＰ−９０（メトラー（株）製）自動軟化点
測定装置で測定した軟化点が８０℃以上、１３０℃以下
のエポキシ樹脂であり、好ましくは９５℃以上、１２５
℃以下のエポキシ樹脂である。エポキシ樹脂の軟化点が
このような範囲であると、バンプの絶縁体貫通性が良好
でバンプの割れがなく、且つバンプと銅箔の接着力が大
きい点から好ましい。The epoxy resin used in the present invention is MET
TLER FP-90 (manufactured by METTLER CORPORATION) is an epoxy resin having a softening point measured by an automatic softening point measuring device of 80 ° C to 130 ° C, preferably 95 ° C to 125 ° C.
It is an epoxy resin of below ° C. It is preferable that the softening point of the epoxy resin is in such a range, since the insulator has good penetration of the bumps, there is no breakage of the bumps, and the adhesive strength between the bumps and the copper foil is large.
【００１１】これらのエポキシ樹脂としてはビスフェノ
ール型エポキシ樹脂、トリスグリシジル型エポキシ樹
脂、テトラグリシジル型エポキシ樹脂、ノボラック型エ
ポキシ樹脂を使用できるが、好ましくは、固形ビスフェ
ノール型エポキシ樹脂単独、又は固形ビスフェノール型
エポキシ樹脂とノボラック型エポキシ樹脂の混合が好ま
しい。固形ビスフェノール型エポキシ樹脂とノボラック
型エポキシ樹脂の混合の場合も軟化点が８０℃以上、１
３０℃以下の範囲であることが好ましい。ノボラック樹
脂と固形ビスフェノール型エポキシ樹脂との併用は接着
力が高く、融点と硬度が適当な値に制御できるので好ま
しい。As these epoxy resins, bisphenol-type epoxy resins, trisglycidyl-type epoxy resins, tetraglycidyl-type epoxy resins, and novolak-type epoxy resins can be used. Preferably, solid bisphenol-type epoxy resins alone or solid bisphenol-type epoxy resins are used. Mixing of a resin and a novolak type epoxy resin is preferred. In the case of mixing a solid bisphenol type epoxy resin and a novolak type epoxy resin, the softening point is 80 ° C. or more,
It is preferably in the range of 30 ° C. or lower. The use of a novolak resin and a solid bisphenol-type epoxy resin in combination is preferred because the adhesive strength is high and the melting point and hardness can be controlled to appropriate values.
【００１２】本発明に用いられるメラミン樹脂とフェノ
ール樹脂に対するエポキシ樹脂の割合はメラミン樹脂及
びフェノール樹脂の合計１００質量部に対しエポキシ樹
脂３００質量部以下、５質量部以上が好ましく、特に好
ましくは１００質量部以下、１０質量部以上が好まし
い。エポキシ樹脂が多くなるとバンプの硬度が不足し、
また少なすぎると接着力が不足し、且つ脆くなる傾向に
ある。The ratio of the epoxy resin to the melamine resin and the phenol resin used in the present invention is preferably 300 parts by mass or less, more preferably 5 parts by mass or more, based on 100 parts by mass of the total of the melamine resin and the phenol resin. Or less, preferably 10 parts by weight or more. When the epoxy resin increases, the bump hardness becomes insufficient,
On the other hand, if the amount is too small, the adhesive strength tends to be insufficient and brittle.
【００１３】本発明において、バンプ性能が低下しない
範囲内でエポキシ樹脂の潜在性硬化剤となる硬化剤（以
下硬化剤という）を使用しても良い。これら硬化剤とし
てはジシアンジアミド類、ジアミノジフェニルスルホン
類、フェノールノボラック樹脂、イミダゾール等が挙げ
られる。硬化剤量は特に規定はないが、バンプの硬度と
接着力をバランスできる範囲の使用量が好ましい。硬化
剤は単独使用あるいは２種以上併用できる。硬化剤の選
定に当たってはポットライフが長いこと、バンプ硬化度
の制御が容易であること、プリント配線板成形温度と同
等の硬化温度であること、ボイドの原因となるような副
生成物の発生が極めて少ないが考慮される。In the present invention, a curing agent (hereinafter referred to as a curing agent) serving as a latent curing agent for the epoxy resin may be used as long as the bump performance is not reduced. These curing agents include dicyandiamides, diaminodiphenylsulfone
S, phenol novolak resin, and imidazole. Although there is no particular limitation on the amount of the curing agent, it is preferable to use the curing agent in an amount capable of balancing the hardness and the adhesive force of the bump. The curing agents can be used alone or in combination of two or more. In selecting a curing agent, the pot life is long, the degree of bump curing is easy to control, the curing temperature is equivalent to the molding temperature of the printed wiring board, and the generation of by-products that may cause voids Very few are considered.
【００１４】本発明においては、導電粉末としては例え
ば銀、金、銅、半田粉等の金属粉末、これらの合金粉末
もしくは混合金属粉末を使用できるが、硬度の点で銀、
銅が好ましい。使用される導電金属粉量はメラミン樹
脂、フェノール樹脂及びエポキシ樹脂の合計量１００質
量部に対して、３００質量部以下、２０００質量部以
上、好ましくは４５０質量部以上、１０００質量部以下
の割合で用いられる。In the present invention, as the conductive powder, for example, metal powder such as silver, gold, copper and solder powder, alloy powder or mixed metal powder thereof can be used.
Copper is preferred. The amount of the conductive metal powder used is 300 parts by mass or less, 2,000 parts by mass or more, preferably 450 parts by mass or more, with respect to 100 parts by mass of the total amount of the melamine resin, phenolic resin and epoxy resin, in a ratio of 1000 parts by mass or less. Used.
【００１５】上記の導電金属粉の割合がメラミン樹脂、
フェノール樹脂及びエポキシ樹脂の合計量１００質量部
に対して、３００質量部より多い場合は、良好な導電性
が得られる。また該金属粉の割合が２０００質量部を超
える場合は、ペーストの流動性が低下し、印刷性が悪く
なるだけでなく、得られる硬化体の金属粉の結合力が弱
まり、バンプの割れ、バンプ先端部の飛びが生じ易くな
り接続不良、短絡が発生し好ましくない。The ratio of the conductive metal powder is melamine resin,
If the total amount of the phenol resin and the epoxy resin is more than 300 parts by mass with respect to 100 parts by mass, good conductivity is obtained. When the ratio of the metal powder exceeds 2,000 parts by mass, not only the fluidity of the paste is reduced and the printability is deteriorated, but also the bonding strength of the metal powder of the obtained cured product is weakened, and the cracks and bumps of the bump are reduced. It is not preferable because the tip is apt to fly, resulting in poor connection and short circuit.
【００１６】本発明においては、溶剤としては導電ペー
スト用として使用される公知の溶剤が特に制限なく使用
できる。例えば、酢酸エチル、酢酸ブチル等のエステエ
ル類、エチルセロソルブ、ブチルセロソルブ等のセロソ
ルブ類、エチルカルビトール、ブチルカルビトール等の
カルビトール類、イソプロパノール、ブタノール等のア
ルコール類が挙げられる。上記溶剤は単独あるいは2種
類以上を混合して使用しても良いが、スクリーン印刷で
バンプを形成する場合は版かわきを考慮してカルビトー
ル類及びセロソルブ類が好ましい。溶剤はメラミン樹
脂、フェノール樹脂およびエポキシ樹脂の合計１００質
量部に対し、５０〜１５０質量部を使用するのが好まし
い。In the present invention, known solvents used for conductive pastes can be used without any particular limitation. For example, esters such as ethyl acetate and butyl acetate, cellosolves such as ethyl cellosolve and butyl cellosolve, carbitols such as ethyl carbitol and butyl carbitol, and alcohols such as isopropanol and butanol. The above-mentioned solvents may be used alone or as a mixture of two or more kinds. However, in the case of forming a bump by screen printing, carbitols and cellosolves are preferable in consideration of plate separation. The solvent is preferably used in an amount of 50 to 150 parts by mass with respect to a total of 100 parts by mass of the melamine resin, the phenol resin and the epoxy resin.
【００１７】本発明において、その特性を著しく低下さ
せない範囲で公知の添加剤を配合しても良い。かかる添
加剤としては、例えば、チクソトロピー付与剤、消泡
剤、分散剤、防錆剤、還元剤等が挙げられる。In the present invention, known additives may be blended as long as their properties are not significantly reduced. Such additives include, for example, thixotropy-imparting agents, defoamers, dispersants, rust inhibitors, reducing agents, and the like.
【００１８】本発明の導電性ペーストの製造方法は特に
制限されないが、上記メラミン樹脂、フェノール樹脂、
エポキシ樹脂、硬化剤、導電性金属粉及び溶剤を予備混
合し、例えば三本ロールミル等を用いて混練し、ペース
トを得て、 真空下脱泡する方法などが挙げられる。Although the method for producing the conductive paste of the present invention is not particularly limited, the above-mentioned melamine resin, phenol resin,
A method in which an epoxy resin, a curing agent, a conductive metal powder and a solvent are preliminarily mixed, kneaded using, for example, a three-roll mill, etc. to obtain a paste, and deaerated under vacuum is used.
【００１９】本発明において、マルコム社製スパイラル
粘度計で１０回転／ｍｉｎ、25℃で測定した粘度は１０
００Ｐａ・ｓ以上、４０００Ｐａ・ｓ以下が好ましく、
さらに好ましくは２０００Ｐａ・ｓ以上、３０００Ｐａ
・ｓ以下が適当である。またｌｏｇ（１０ｍｉｎ-1粘度
／５ｍｉｎ-1粘度）／ｌｏｇ（５／１０）で計算するチ
クソ比が好ましくは０．３以上、１．０以下であり、よ
り好ましくは０．４以上、０．９以下が適当である。上
記範囲内であればスクリーン版への濡れが適当で、版の
穴を通り易く、更に印刷で十分なバンプ高さが得られ
る。In the present invention, the viscosity measured at 10 rpm / 25 ° C. with a spiral viscometer manufactured by Malcolm Co. is 10
It is preferably from 00 Pa · s to 4000 Pa · s,
More preferably 2000 Pa · s or more and 3000 Pa
-S or less is appropriate. The thixo ratio calculated by log (10 min -1 viscosity / 5 min -1 viscosity) / log (5/10) is preferably 0.3 or more and 1.0 or less, more preferably 0.4 or more and 0.1 or less. 9 or less is appropriate. Within the above range, wetting to the screen plate is appropriate, easy to pass through holes in the plate, and sufficient bump height can be obtained by printing.
【００２０】本発明において、微小硬度計で測定したバ
ンプの硬度は３０以上、５０以下が好ましい。硬度が３
０以上であれば絶縁体の貫通が容易である。In the present invention, the bump hardness measured by a microhardness tester is preferably 30 or more and 50 or less. Hardness is 3
If it is 0 or more, it is easy to penetrate the insulator.
【００２１】本発明の導電性ペーストはスクリーン印
刷、ディスペンサー等公知の方法で印刷することができ
る。The conductive paste of the present invention can be printed by a known method such as screen printing and dispenser.
【発明の実施形態】以下実施例を用いて本発明を具体的
に説明するが、本発明はこれらの実施例により限定され
るものではない。なお、配合割合は質量部であり、評価
や測定は次の方法に従った。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In addition, the compounding ratio is a mass part, and evaluation and measurement followed the following method.
【００２２】（１）軟化点 エポキシ樹脂を熔融し、ＭＥＴＴＬＥＲ ＦＰ−９０自
動軟化点測定装置で、１℃／分の昇温速度で測定した。(1) Softening Point The epoxy resin was melted and measured at a heating rate of 1 ° C./min with a METTLER FP-90 automatic softening point measuring apparatus.
【００２３】（２）硬度 ペーストを銅箔のＭ面（電解法銅箔で電解液側光沢のな
い面）に２００μm厚みに塗布した後、１６０℃で２０
分乾燥し、サンプルとした。硬度は微少硬度計ＭＸ−Ｔ
５０（松沢精機（株））で、試験温度２３℃、試験荷重
２５ｋｇｆ、荷重保持時間１５秒で測定した。(2) Hardness After applying the paste to the M surface of the copper foil (the surface of the electrolytic copper foil with no gloss on the electrolyte side) to a thickness of 200 μm, the paste was heated at 160 ° C. for 20 minutes.
After drying for a minute, a sample was obtained. Hardness is micro hardness meter MX-T
50 (Matsuzawa Seiki Co., Ltd.) at a test temperature of 23 ° C., a test load of 25 kgf, and a load holding time of 15 seconds.
【００２４】（３）銅箔引き剥がし強さ ペーストを銅箔のＭ面に２００μm厚みに塗布した後、
１６０℃で２０分乾燥した。塗布面にＭ面を下にして銅
箔を載せ、プレスで１７０℃、６０分間硬化しサンプル
とした。ＪＩＳ Ｃ６４８１に準じて銅箔引き剥がし強
さ（Ｎ／cm）を測定した。(3) Copper foil peeling strength After applying the paste to the M surface of the copper foil to a thickness of 200 μm,
Dried at 160 ° C. for 20 minutes. A copper foil was placed on the application side with the M side facing down, and cured with a press at 170 ° C. for 60 minutes to obtain a sample. The copper foil peeling strength (N / cm) was measured according to JIS C6481.
【００２５】（４）プリプレグ貫通性、バンプの割れ・
欠け 厚さ１８μmの電解銅箔に、直径０．３mmの孔を所定の
位置に穿設してなる厚さ０．５mmのメタルスクリーン板
を通して、導電性ペーストを印刷した。印刷した導電性
ペーストを、１６０℃で１０分間乾燥処理した後、同一
メタルスクリーン板を用いて、同一位置に印刷、乾燥処
理を３回繰り返した。３回目印刷後は１６０℃２０分乾
燥し、円錐状の導電性バンプを形成した。その後、導電
性バンプを設けた電解銅箔にエポキシ樹脂をガラスクロ
スに含浸したＦＲ４タイププリプレグを載せ、専用の貫
通機を通してバンプをプリプレグに貫通させた。貫通後
の状態を２０倍光学顕微鏡で観察し、プリプレグ貫通
性、バンプの割れ、欠けを判定した。 ａ）貫通性 良好：全てがプリプレグを通過ししている。 不良：プリプレグを貫通していないバンプがある。 ｂ）バンプの割れ、欠け 良好：プリプレグを貫通し、突き出たバンプ部分が円錐
状になっている。 不良：突き出たバンプの先端が欠け落ちていたり、割
れ、ひびが入っている。(4) Pre-preg penetration, bump cracking
Notch A conductive paste was printed on a 18-μm-thick electrolytic copper foil through a 0.5-mm-thick metal screen plate in which holes having a diameter of 0.3 mm were formed at predetermined positions. After the printed conductive paste was dried at 160 ° C. for 10 minutes, printing and drying were repeated three times at the same position using the same metal screen plate. After the third printing, drying was performed at 160 ° C. for 20 minutes to form conical conductive bumps. Thereafter, an FR4 type prepreg impregnated with an epoxy resin in a glass cloth was placed on an electrolytic copper foil provided with conductive bumps, and the bumps were penetrated through the prepreg through a dedicated penetrating machine. The state after penetration was observed with a 20-fold optical microscope, and prepreg penetration, bump cracking and chipping were determined. a) Good penetration: All have passed through the prepreg. Bad: Some bumps do not penetrate the prepreg. b) Cracking and chipping of the bumps: good: The bumps that penetrate the prepreg and protrude are conical. Bad: The tip of the protruding bump is chipped, cracked, or cracked.
【００２６】実施例１ メラミン樹脂（メラミン・ホルムアルデヒド・メタノー
ル共重合物）５０部、フェノール樹脂（ポリビニルフェ
ノール樹脂、重量平均分子量５，０００）を５０部、ビ
スフェノールＡ型エポキシ樹脂（ 軟化点；１２５℃）
２５部、ナフタレンノボラック型エポキシ樹脂（軟化点
９６℃）１０部を酢酸ジエチレングリコールモノブチル
エーテル８８部に溶解した。硬化剤であるジアミノジフ
ェニルスルフォン３．９部および２−フェニルー４，５
ジヒドロキシメチルイミダゾール０．１、 銀粉８００
部、及びチクソトロピー賦与剤であるアエロジル１７部
を加え、万能混合器で３０分予備混合し、その後三本ロ
ールで混練して導電性ペーストを得た。Example 1 50 parts of a melamine resin (melamine / formaldehyde / methanol copolymer), 50 parts of a phenol resin (polyvinyl phenol resin, weight average molecular weight 5,000), bisphenol A type epoxy resin (softening point: 125 ° C.) )
25 parts and 10 parts of a naphthalene novolak type epoxy resin (softening point: 96 ° C.) were dissolved in 88 parts of diethylene glycol monobutyl ether acetate. 3.9 parts of diaminodiphenylsulfone as a curing agent and 2-phenyl-4,5
Dihydroxymethyl imidazole 0.1, silver powder 800
And Aerosil, a thixotropic agent, were added, and the mixture was premixed with a universal mixer for 30 minutes, and then kneaded with a three-roll mill to obtain a conductive paste.
【００２７】ビスフェノールＡ型エポキシ樹脂とナフタ
レンノボラック型エポキシ樹脂混合物の軟化点は１１５
℃であった。得られた導電性ペーストについて前期記載
の方法で測定した結果、粘度が２６００Ｐａ・ｓ／２５
℃、チクソ比が０．５、硬度が４３、銅箔引き剥がし強
度が６Ｎ／ｃｍであり、プリプレグの貫通性は良好でか
つ、バンプの割れ・欠けは発生しなかった。The softening point of the mixture of bisphenol A type epoxy resin and naphthalene novolak type epoxy resin is 115
° C. As a result of measuring the obtained conductive paste by the method described above, the viscosity was 2600 Pa · s / 25.
° C, the thixotropy ratio was 0.5, the hardness was 43, the copper foil peeling strength was 6 N / cm, the penetration of the prepreg was good, and no cracking or chipping of the bumps occurred.
【００２８】比較例１ ビスフェノールＡ型エポキシ樹脂（ 軟化点７５℃）５
部、メラミン樹脂を５０部、フェノール樹脂を５０部、
酢酸ジエチレングリコールモノブチルエーテル５８部、
ジアミノジフェニルスルフォンを１部、2−フェニル−
４，５−ジヒドロキシイミダゾール０．１部、銀粉６０
０部、アエロジル１６部とした以外は実施例１と同様に
混合し、導電性ペーストを得た。得られた導電性ペース
トについて前記記載の方法で測定した結果、粘度が２５
００Ｐａ・ｓ／２５℃、チクソ比が０．５、硬度が４
３、銅箔引き剥がし強度が２Ｎ／ｃｍ、プリプレグの貫
通性は良好であったが、バンプの割れ・欠けが発生し
た。Comparative Example 1 Bisphenol A type epoxy resin (softening point 75 ° C.) 5
Parts, 50 parts of melamine resin, 50 parts of phenol resin,
58 parts of diethylene glycol monobutyl ether acetate,
1 part of diaminodiphenylsulfone, 2-phenyl-
0.1 part of 4,5-dihydroxyimidazole, silver powder 60
A conductive paste was obtained by mixing in the same manner as in Example 1 except that 0 parts and 16 parts of Aerosil were used. As a result of measuring the obtained conductive paste by the method described above, the viscosity was 25.
00Pa · s / 25 ° C, thixotropic ratio 0.5, hardness 4
3. The copper foil peeling strength was 2 N / cm, and the prepreg had good penetration, but the bumps were cracked or chipped.
【００２９】[0029]
【発明の効果】本発明の導電性ペーストを使用すると、
プリプレグ貫通性が良好、且つ貫通時及びプレス時に割
れ欠けを発生せず、更に貫通後のバンプと配線パターン
との接着力が大きいバンプを作成することができる。こ
の結果、貫通型の導電配線部を有するプリント配線板製
造において、歩留まりが向上するとともに接続信頼性が
向上する。When the conductive paste of the present invention is used,
A bump having good prepreg penetrability, no breakage at the time of penetrating and pressing, and a large adhesive force between the penetrated bump and the wiring pattern can be produced. As a result, in manufacturing a printed wiring board having a penetrating conductive wiring portion, the yield is improved and the connection reliability is improved.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 志摩 健二 神奈川県厚木市戸室５−32−１ 三井化学 株式会社内 (72)発明者 牧野 繁男 東京都千代田区霞が関三丁目２番５号 三 井化学株式会社内 (72)発明者 藤枝 信彦 千葉県袖ヶ浦市長浦580−32 三井化学株 式会社内 (72)発明者 津田 武 千葉県袖ヶ浦市長浦580−32 三井化学株 式会社内 (72)発明者 福岡 義孝 東京都府中市東芝町２番地１ ディーティ ーサーキットテクノロジー株式会社内 (72)発明者 佐藤 由純 東京都府中市東芝町２番地１ ディーティ ーサーキットテクノロジー株式会社内 Ｆターム(参考） 4E351 AA01 BB01 BB26 BB31 CC11 DD04 DD52 EE11 EE15 EE16 GG01 5G301 DA03 DA42 DA55 DA57 DD01 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Kenji Shima 5-32-1 Tomuro, Atsugi-shi, Kanagawa Mitsui Chemicals, Inc. (72) Inventor Shigeo Makino 3-5 Kasumigaseki, Chiyoda-ku, Tokyo Mitsui Chemicals (72) Inventor Nobuhiko Fujieda 580-32 Nagaura, Sodegaura-shi, Chiba Mitsui Chemicals Co., Ltd. (72) Inventor Takeshi Takeda 580-32 Nagaura, Sodegaura-shi, Chiba Mitsui Chemicals Co., Ltd. Yoshitaka Fukuoka 2-1, Toshiba-cho, Fuchu-shi, Tokyo (72) Inventor Yuzumi Sato 2-1, 1-Toshiba-cho, Fuchu-shi, Tokyo F-term (D-circuit technology) 4E351 AA01 BB01 BB26 BB31 CC11 DD04 DD52 EE11 EE15 EE16 GG01 5G301 DA03 DA42 DA55 DA57 DD01
Claims (3)
シ樹脂、導電粉末及び溶剤を含有してなる導電性ペース
トであって、該エポキシ樹脂の軟化点が８０℃以上、１
３０℃以下であるプリント配線板層間接続用導電性ペー
スト組成物1. A conductive paste containing a melamine resin, a phenol resin, an epoxy resin, a conductive powder and a solvent, wherein the epoxy resin has a softening point of 80 ° C. or higher,
Conductive paste composition for interconnection between printed wiring boards having a temperature of 30 ° C. or less
エポキシ樹脂の割合がメラミン樹脂とフェノール樹脂の
合計量１００質量部に対しエポキシ樹脂が３００質量部
以下、５質量部以上であることを特徴とする、請求項１
に記載のプリント配線板層間接続用導電性ペースト組成
物。2. The method according to claim 1, wherein the ratio of the epoxy resin to the melamine resin and the phenol resin is 300 parts by mass or less and 5 parts by mass or more based on 100 parts by mass of the total amount of the melamine resin and the phenol resin. Item 1
5. The conductive paste composition for interlayer connection of a printed wiring board according to the above.
導電性ペースト組成物を用いたプリント配線板。3. A printed wiring board using the conductive paste composition for interlayer connection according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001063668A JP2002270033A (en) | 2001-03-07 | 2001-03-07 | Conductive paste composition and printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001063668A JP2002270033A (en) | 2001-03-07 | 2001-03-07 | Conductive paste composition and printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002270033A true JP2002270033A (en) | 2002-09-20 |
Family
ID=18922617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001063668A Pending JP2002270033A (en) | 2001-03-07 | 2001-03-07 | Conductive paste composition and printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002270033A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7416687B2 (en) | 2006-03-31 | 2008-08-26 | Dai Nippon Printing Co., Ltd. | Electroconductive paste composition and printed wiring board |
| JP2012164696A (en) * | 2011-02-03 | 2012-08-30 | Sumitomo Bakelite Co Ltd | Conductive paste for bump formation |
| TWI392424B (en) * | 2008-05-23 | 2013-04-01 | Denso Corp | And a method for manufacturing a conductor for interlayer connection |
-
2001
- 2001-03-07 JP JP2001063668A patent/JP2002270033A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7416687B2 (en) | 2006-03-31 | 2008-08-26 | Dai Nippon Printing Co., Ltd. | Electroconductive paste composition and printed wiring board |
| TWI392424B (en) * | 2008-05-23 | 2013-04-01 | Denso Corp | And a method for manufacturing a conductor for interlayer connection |
| JP2012164696A (en) * | 2011-02-03 | 2012-08-30 | Sumitomo Bakelite Co Ltd | Conductive paste for bump formation |
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