JP2002261421A - Method of manufacturing component mounted with electronic component, method of manufacturing finished product mounted with electronic component and finished product mounted with semiconductor component - Google Patents

Method of manufacturing component mounted with electronic component, method of manufacturing finished product mounted with electronic component and finished product mounted with semiconductor component

Info

Publication number
JP2002261421A
JP2002261421A JP2001061797A JP2001061797A JP2002261421A JP 2002261421 A JP2002261421 A JP 2002261421A JP 2001061797 A JP2001061797 A JP 2001061797A JP 2001061797 A JP2001061797 A JP 2001061797A JP 2002261421 A JP2002261421 A JP 2002261421A
Authority
JP
Japan
Prior art keywords
electronic component
component
manufacturing
base material
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001061797A
Other languages
Japanese (ja)
Other versions
JP3916405B2 (en
JP2002261421A5 (en
Inventor
Norito Tsukahara
法人 塚原
Naoshi Akiguchi
尚士 秋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001061797A priority Critical patent/JP3916405B2/en
Publication of JP2002261421A publication Critical patent/JP2002261421A/en
Publication of JP2002261421A5 publication Critical patent/JP2002261421A5/ja
Application granted granted Critical
Publication of JP3916405B2 publication Critical patent/JP3916405B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a high-quality, high-productivity and low-cost component mounted with an electronic component, to provide a method of manufacturing a finished product mounted with an electronic component and to provide the finished product mounted with the electronic component. SOLUTION: An electronic component 104 is embedded in a first thermoplastic resin substrate 122, and a circuit pattern 118 is formed on the electronic component 104. Thereby, a core module component 101 with the built-in electronic component is manufactured. After that, it is laminated with a second thermoplastic resin substrate 124 and a third thermoplastic resin substrate 125. Thereby, a core-module finished product with the built-in electronic component is manufactured. Thereby, a step does not exist on the surface of the electronic component 104 and the first substrate 122, and a defect such as a swell, a dent or the like is not generated in terms of appearance. Since an anisotropic conductive member is not used, a sheet substrate of low heat resistance can be used, and it is possible to provide the high-productivity and low-cost component mounted with electronic component and the finished product mounted with electronic component.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、ＩＣチップ等の電
子部品を基材に実装して半導体部品実装済部品を製造す
る電子部品実装済部品の製造方法、該製造方法にて製造
される電子部品実装済部品を有する電子部品実装済完成
品の製造方法、及び該電子部品実装済完成品製造方法に
て製造される半導体部品実装済完成品に関する。上記電
子部品実装済部品の製造方法は、例えば非接触ＩＣカー
ドを製造する場合のように、アルミニウム、Ｃｕ、Ｎｉ
等にて形成された回路パターンにＡｇやＣｕ等の導電性
ペーストやメッキ法により設けた接続パッドにＩＣチッ
プを電気的に接続する場合にて使用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component-mounted component, in which an electronic component such as an IC chip is mounted on a substrate to manufacture a semiconductor component-mounted component, and an electronic device manufactured by the manufacturing method. The present invention relates to a method of manufacturing a completed electronic component mounted product having component mounted components, and a completed semiconductor component mounted product manufactured by the electronic component mounted finished product manufacturing method. The method of manufacturing the electronic component-mounted component includes, for example, aluminum, Cu, Ni, as in the case of manufacturing a non-contact IC card.
It is used when an IC chip is electrically connected to a connection pad provided by a conductive paste such as Ag or Cu or a plating method on a circuit pattern formed by the above method.

【０００２】[0002]

【従来の技術】非接触ＩＣカードを例に取り、従来の電
子部品実装済完成品の製造方法について、図１６〜図２
５を参照しながら以下に説明する。従来、コイルとＩＣ
チップとを内蔵し、該コイルを介して外部とのデータの
授与を行なう非接触ＩＣカードを製造する際において、
上記コイルの形成方法としては、銅にてなる巻線コイル
を用いる方法や、銀ペースト等の導体ペーストを印刷し
て形成する方法や、銅箔等の金属箔をエッチングしてコ
イルを形成する方法等が用いられており、なかでも上記
導体ペーストを印刷して回路パターン及びコイルを形成
する方法が盛んになっている。2. Description of the Related Art Taking a non-contact IC card as an example, FIGS.
5 will be described below. Conventionally, coil and IC
When manufacturing a non-contact IC card incorporating a chip and transmitting data to the outside through the coil,
Examples of the method of forming the coil include a method using a coil coil made of copper, a method of forming a coil by printing a conductive paste such as a silver paste, and a method of forming a coil by etching a metal foil such as a copper foil. Among them, a method for forming a circuit pattern and a coil by printing the above-mentioned conductor paste has become popular.

【０００３】図１６〜図２５は従来の非接触ＩＣカード
及びその製造方法を示す。図１６に示すように、従来の
非接触ＩＣカードは、第１基材１ａに導電性ペーストに
てコイルパターン２が形成され、このコイルパターン２
の外周端３ａに設けた接続パッド６、及びコイルパター
ン２の内周端３ｂに設けた接続パッド６のそれぞれがＩ
Ｃチップ４の電極部と電気的に接続される構成となって
いる。その製造工程は、図１７に示すように、まずステ
ップ（図内では「Ｓ」にて示す）１では、第１基材１ａ
の表面に導電性ペーストにてコイルパターン２を含む回
路パターンを印刷する。上記導電性ペーストとしては、
銀ペーストが好適に使用される。上記導電性ペーストの
印刷は、スクリーン印刷やオフセット印刷やグラビア印
刷等によって行われ、例えばスクリーン印刷の場合、１
６５メッシュ／インチ、乳剤厚み１０μｍのマスクを介
して導電性ペーストを第１基材１ａに印刷し、導体厚み
約３０μｍの回路パターンを形成する。上記第１基材１
ａ及び後述の第２基材２ｂには、ポリエチレンテレフタ
レート、塩化ビニル、ポリカーボネイト、アクリロニト
リルブタジエンスチレン等からなる厚さ０．１〜０．５
ｍｍ程度の熱可塑性樹脂が用いられる。FIGS. 16 to 25 show a conventional non-contact IC card and a method of manufacturing the same. As shown in FIG. 16, in the conventional non-contact IC card, a coil pattern 2 is formed of a conductive paste on a first base material 1a.
The connection pad 6 provided on the outer peripheral end 3a of the coil pattern 2 and the connection pad 6 provided on the inner peripheral end 3b of the coil pattern 2
It is configured to be electrically connected to the electrode part of the C chip 4. As shown in FIG. 17, in the manufacturing process, first, in step (indicated by “S” in the figure) 1, the first base material 1a
A circuit pattern including the coil pattern 2 is printed on the surface of the substrate with a conductive paste. As the conductive paste,
Silver paste is preferably used. The printing of the conductive paste is performed by screen printing, offset printing, gravure printing, or the like.
A conductive paste is printed on the first base material 1a through a mask of 65 mesh / inch and an emulsion thickness of 10 μm to form a circuit pattern with a conductor thickness of about 30 μm. The first base material 1
a and a second base material 2b described later have a thickness of 0.1 to 0.5 made of polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene, or the like.
A thermoplastic resin of about mm is used.

【０００４】ステップ２では、上記印刷方法により第１
基材１ａ上に形成した上記導電性ペーストにてなる上記
回路パターンを１２０℃の温度で１０分間加熱して上記
導電性ペーストを硬化させる。ステップ３では、図１８
に示すように、上記回路パターンにおける上記外周端３
ａや内周端３ｂに設けられた接続パッド６に異方導電性
シート９を貼り付ける。該異方導電性シートとは、金属
粒子を含有する樹脂シートであり、加熱、加圧されるこ
とで上記金属粒子と上記接続パッド６とを電気的に接続
する。ステップ４では、異方導電性シート９を１００℃
で５秒加熱して、接続パッド６に仮圧着する。ステップ
５では、仮圧着した異方導電性シート９に半導体素子４
やコンデンサ等の部品をマウントする。半導体素子の実
装面には、図１９に示すように半導体素子４上の電極パ
ッド７にバンプ１０が形成されており、図２０に示すよ
うにバンブ１０と接続パッド６とが異方導電性シート９
を介して電気的に接続される。尚、バンブ１０は、ワイ
ヤボンディング法やメッキ法、具体的には半田、金、
銀、銅等を用いたメッキ法により、半導体素子４の電極
パッド７上に形成される。[0004] In step 2, the first printing method is used.
The circuit pattern made of the conductive paste formed on the base material 1a is heated at a temperature of 120 ° C. for 10 minutes to cure the conductive paste. In step 3, FIG.
As shown in FIG.
Then, an anisotropic conductive sheet 9 is attached to the connection pad 6 provided on the inner peripheral end 3b. The anisotropic conductive sheet is a resin sheet containing metal particles, and electrically connects the metal particles and the connection pads 6 when heated and pressed. In Step 4, the anisotropic conductive sheet 9 is heated to 100 ° C.
For 5 seconds, and temporarily bonded to the connection pad 6. In step 5, the semiconductor element 4 is placed on the temporarily compressed anisotropic conductive sheet 9.
And components such as capacitors. On the mounting surface of the semiconductor element, bumps 10 are formed on the electrode pads 7 on the semiconductor element 4 as shown in FIG. 19, and the bumps 10 and the connection pads 6 are formed on the anisotropic conductive sheet as shown in FIG. 9
Are electrically connected via The bump 10 is formed by a wire bonding method or a plating method, specifically, solder, gold,
It is formed on the electrode pad 7 of the semiconductor element 4 by a plating method using silver, copper, or the like.

【０００５】ステップ６では、２００℃の温度で３０秒
間加熱して、図２１に示すように異方導電性シートを硬
化して、半導体素子４を本圧着する。尚、第１基材１ａ
にガラスエポキシ基板やセラミック基板を用いた一般的
な半導体実装においては、このステップ６までで半導体
素子の実装は完了する。そして、ステップ７では、第１
機材１ａに第２基材１ｂを貼り合わせてラミネート処理
することにより、図２２に示すように、接続パッド６と
バンプ１０とが異方導電性ペースト９を介して電気的に
接続されたＩＣカードが得られる。図２２にて、５はコ
イルパターン２に並列接続されるコンデンサを示す。In step 6, the semiconductor element 4 is heated at a temperature of 200 ° C. for 30 seconds to cure the anisotropic conductive sheet as shown in FIG. In addition, the first substrate 1a
In a general semiconductor mounting using a glass epoxy substrate or a ceramic substrate, the mounting of the semiconductor element is completed by this step 6. Then, in step 7, the first
An IC card in which the connection pads 6 and the bumps 10 are electrically connected through the anisotropic conductive paste 9 as shown in FIG. Is obtained. In FIG. 22, reference numeral 5 denotes a capacitor connected in parallel to the coil pattern 2.

【０００６】[0006]

【発明が解決しようとする課題】しかし、上述した従来
の半導体部品実装済完成品製造方法、及び該製造方法に
て製造される、半導体部品実装済完成品としての非接触
ＩＣカードの構成では、以下の問題があった。上記第１
基材１ａや第２基材１ｂには、一般的にポリエチレンテ
レフタレートや塩化ビニル等の安価な熱可塑性樹脂が使
用されている。一方、従来の製造工程では、上記ステッ
プ６において異方導電性シート９を介して半導体素子４
を本圧着する際の温度が２００℃以上と高温である為、
耐熱性に劣る第１基材１ａや第２基材１ｂが劣化し易い
という問題がある。又、異方導電性シート９を用いて半
導体素子４等の部品を第１基材１ａに固定する為、異方
導電性シート９の第１基材１ａへの仮圧着及び本加圧工
程が必要となる。よって、工程数が多くなり生産性が悪
くコスト高になるという問題がある。さらに又、異方導
電性シート９の代わりに異方導電性粒子を用いた場合も
同様である。However, in the above-described conventional method for manufacturing a completed product with semiconductor components mounted thereon and the configuration of a non-contact IC card as a completed product with semiconductor components mounted manufactured by the manufacturing method, There were the following problems: The first
In general, inexpensive thermoplastic resins such as polyethylene terephthalate and vinyl chloride are used for the substrate 1a and the second substrate 1b. On the other hand, in the conventional manufacturing process, in step 6 described above, the semiconductor element 4
Because the temperature at the time of final pressure bonding is as high as 200 ° C or more,
There is a problem that the first base material 1a and the second base material 1b having poor heat resistance are easily deteriorated. In addition, since the components such as the semiconductor element 4 are fixed to the first base material 1a using the anisotropic conductive sheet 9, the provisional pressure bonding and the main pressing process of the anisotropic conductive sheet 9 to the first base material 1a are performed. Required. Therefore, there is a problem that the number of processes is increased, productivity is reduced, and costs are increased. Further, the same applies to the case where anisotropic conductive particles are used instead of the anisotropic conductive sheet 9.

【０００７】さらに又、上記ステップ７においてラミネ
ート処理する際に、半導体素子４が加熱、加圧される
為、図２３に示すように、半導体素子４が第１基材１ａ
に沈み込み、導体ペーストによる回路パターン６が湾曲
した形に変形してしまう。その結果、回路パターン断線
の可能性が高く、動作不良の不具合が発生する。又、図
２４に示すように上記ステップ７においてラミネート処
理する際に、実装されている半導体素子４及び電子部品
５と第１基材１ａの表面に段差ｈが生じている為に、第
２基材１ｂがその段差ｈになじまず、図２５に示すよう
に、半導体素子４及び電子部品５周辺に気体例えば空気
１７０が残り、外観上膨れや凹み等不良が生じる。本発
明はこのような問題点を解決するためになされたもの
で、高品質、高生産性で安価な、半導体部品実装済部品
を製造する電子部品実装済部品の製造方法、該製造方法
にて製造される電子部品実装済部品を有する電子部品実
装済完成品の製造方法、及び該電子部品実装済完成品製
造方法にて製造される半導体部品実装済完成品を提供す
ることを目的とする。Further, since the semiconductor element 4 is heated and pressurized during the laminating process in the above step 7, the semiconductor element 4 is placed on the first substrate 1a as shown in FIG.
And the circuit pattern 6 of the conductive paste is deformed into a curved shape. As a result, the possibility of disconnection of the circuit pattern is high, and a malfunction such as a malfunction occurs. Further, as shown in FIG. 24, when the laminating process is performed in the above step 7, a step h is generated between the mounted semiconductor element 4 and the electronic component 5 and the surface of the first base material 1a. The material 1b does not adapt to the step h, and as shown in FIG. 25, a gas such as air 170 remains around the semiconductor element 4 and the electronic component 5, and defects such as swelling and dents appear in appearance. The present invention has been made in order to solve such problems, and is a high-quality, high-productivity, inexpensive, electronic component-mounted component manufacturing method for manufacturing a semiconductor component-mounted component. An object of the present invention is to provide a method of manufacturing a completed electronic component mounted product having an electronic component mounted component to be manufactured, and a completed semiconductor component mounted product manufactured by the electronic component mounted finished product manufacturing method.

【０００８】[0008]

【課題を解決するための手段】上記目的を達成するため
に本発明は以下のように構成する。本発明の第1態様に
おける、電子部品実装済部品の製造方法は、第１基材内
へ電子部品を埋設し、埋設された上記電子部品の電極と
電気的に接続する回路パターンを上記第１基材の回路形
成面に形成して上記電極と上記回路パターンとの電気的
接続を図る、ことを特徴とする。To achieve the above object, the present invention is configured as follows. In the first aspect of the present invention, the method of manufacturing an electronic component-mounted component includes the step of embedding the electronic component in a first base material and forming a circuit pattern that is electrically connected to an electrode of the embedded electronic component. It is formed on the circuit forming surface of the base material to electrically connect the electrode and the circuit pattern.

【０００９】又、上記第１基材内への上記電子部品の埋
設後、上記回路パターン形成前に、埋設された上記電子
部品の上記電極を上記回路形成面に露出させ、該露出後
に上記回路パターンを形成することもできる。Further, after embedding the electronic component in the first base material and before forming the circuit pattern, the electrodes of the embedded electronic component are exposed on the circuit forming surface. Patterns can also be formed.

【００１０】又、上記回路パターン形成後、該回路パタ
ーンを上記第１基材内へ押し込んで上記電気的接続を図
るとともに上記回路形成面を平坦化することもできる。After the circuit pattern is formed, the circuit pattern may be pushed into the first base material to make the electrical connection and flatten the circuit formation surface.

【００１１】又、熱可塑性樹脂材にてなる上記第１基材
と、加熱された上記電子部品とを相対的に押圧すること
で上記第１基材内への上記電子部品の埋設を行ない、導
電性ペースト又は金属メッキにて上記回路パターンを形
成することもできる。The electronic component is embedded in the first base by relatively pressing the first base made of a thermoplastic resin material and the heated electronic component, The above circuit pattern can be formed by conductive paste or metal plating.

【００１２】本発明の第２態様における、電子部品実装
済完成品の製造方法は、上記第１態様における電子部品
実装済部品の製造方法を用いて電子部品実装済部品を製
造した後、上記電極と上記回路パターンとの上記電気的
接続後、上記第１基材の厚み方向から第２基材及び第３
基材にて上記第１基材のラミネート処理を行なうことを
特徴とする。[0012] In a second aspect of the present invention, a method of manufacturing a completed electronic component-mounted product comprises: using the method of manufacturing an electronic component-mounted component of the first aspect, manufacturing an electronic component-mounted component; After the electrical connection between the first base member and the second base member and the third base member in the thickness direction of the first base member.
It is characterized in that the first substrate is laminated on the substrate.

【００１３】又、本発明の第３態様における電子部品実
装済完成品は、上記第２態様の、電子部品実装済完成品
の製造方法にて製造されたことを特徴とする。Further, a completed electronic component mounted product according to a third aspect of the present invention is characterized by being manufactured by the method for manufacturing a completed electronic component mounted product according to the second aspect.

【００１４】又、上記第３態様の電子部品実装済完成品
において、非接触ＩＣカードを構成するため、上記回路
パターンは、無線にて情報の送受信を行なうアンテナコ
イル形状にて形成することもできる。In the electronic component-mounted finished product of the third aspect, the circuit pattern may be formed in an antenna coil shape for wirelessly transmitting and receiving information in order to constitute a non-contact IC card. .

【００１５】[0015]

【発明の実施の形態】本発明の実施形態である、電子部
品実装済部品の製造方法、電子部品実装済完成品の製造
方法、及び電子部品実装済完成品について、図を参照し
ながら以下に説明する。ここで、上記電子部品実装済完
成品の製造方法は、上記電子部品実装済部品の製造方法
にて製造された電子部品実装済部品を有する電子部品実
装済完成品を製造する方法であり、及び上記電子部品実
装済完成品は上記電子部品実装済完成品の製造方法にて
製造されたものである。尚、各図において同じ構成部分
については同じ符号を付している。上記「電子部品実装
済完成品」の機能を果たす一例として本実施形態では非
接触ＩＣカードを例にとるが、勿論これに限定されるも
のではない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS With reference to the drawings, a method of manufacturing an electronic component mounted component, a method of manufacturing an electronic component mounted finished product, and an electronic component mounted finished product according to embodiments of the present invention will be described below. explain. Here, the manufacturing method of the electronic component mounted finished product is a method of manufacturing an electronic component mounted completed product having the electronic component mounted component manufactured by the electronic component mounted component manufacturing method, and The completed electronic component mounted product is manufactured by the method of manufacturing the electronic component mounted finished product. In the drawings, the same components are denoted by the same reference numerals. In the present embodiment, a non-contact IC card is taken as an example that fulfills the function of the “finished product with electronic components mounted thereon”, but is not limited to this.

【００１６】第１実施形態；図１は、本実施形態の電子
部品実装済部品製造方法を用いて製造された電子部品実
装済部品を示している。尚、上記電子部品実装済部品を
電子部品内蔵コアモジュール部品と記す場合もある。
又、図１では、該電子部品内蔵コアモジュール部品の一
例として、非接触ＩＣカードを構成する電子部品内蔵コ
アモジュール部品１０１を示している。上記非接触ＩＣ
カードにおける電子部品内蔵コアモジュール部品１０１
において、半導体素子１０４及びコンデンサ部品１０５
は予め第１熱可塑性樹脂基材１２２に埋め込まれ、該第
１熱可塑性樹脂基材１２２の、回路形成面に相当する回
路パターン形成面１２３に露出したバンプ１１３及びコ
ンデンサ部品１０５の電極露出面１１５にコイルパター
ン１０２を含む回路パターン１１８を形成する。回路パ
ターン１１８及び電極露出面１１５は異方導電性ペース
ト等を介さずに直接に回路パターン１１８と導通を得る
点、並びに半導体素子１０４及びコンデンサ部品１０５
と、パターン形成面１２３との間には第１熱可塑性樹脂
基材１２２が介在している点で従来例とは異なる。First Embodiment FIG. 1 shows an electronic component mounted component manufactured using the electronic component mounted component manufacturing method of the present embodiment. Note that the electronic component mounted component may be referred to as an electronic component built-in core module component in some cases.
FIG. 1 shows an electronic component built-in core module component 101 constituting a non-contact IC card as an example of the electronic component built-in core module component. The above non-contact IC
Electronic component built-in core module component 101 in card
, The semiconductor element 104 and the capacitor component 105
Are embedded in the first thermoplastic resin base material 122 in advance, and the bumps 113 of the first thermoplastic resin base material 122 exposed on the circuit pattern forming surface 123 corresponding to the circuit forming surface and the electrode exposed surface 115 of the capacitor component 105 Then, a circuit pattern 118 including the coil pattern 102 is formed. The circuit pattern 118 and the electrode exposed surface 115 are directly connected to the circuit pattern 118 without the use of an anisotropic conductive paste or the like.
Is different from the conventional example in that a first thermoplastic resin base material 122 is interposed between the first thermoplastic resin base material 122 and the pattern forming surface 123.

【００１７】図２は、本実施形態の電子部品実装済部品
の製造方法を用いて作製された電子部品実装済部品を備
えた電子部品実装済完成品の一例としての非接触ＩＣカ
ード１００を示している。ここで、１２４、１２５は、
半導体素子１０４、コンデンサ部品１０５、及び回路パ
ターン１１８を有する上記電子部品内蔵コアモジュール
部品１０１を保護する為にラミネート処理を行なうため
のシート状の部材であり、第２基材及び第３基材の機能
を果たす一例である第２熱可塑性樹脂基材及び第３熱可
塑性樹脂基材である。以下に、上記電子部品実装済部品
１０１の製造方法を含めて上記非接触ＩＣカード１００
の製造方法について、図を参照して説明する。FIG. 2 shows a non-contact IC card 100 as an example of a completed electronic component-mounted product including an electronic component-mounted component manufactured using the method of manufacturing an electronic component-mounted component of the present embodiment. ing. Here, 124 and 125 are
It is a sheet-shaped member for performing a laminating process for protecting the electronic component built-in core module component 101 having the semiconductor element 104, the capacitor component 105, and the circuit pattern 118, and includes a second base material and a third base material. A second thermoplastic resin substrate and a third thermoplastic resin substrate, which are examples of performing the function. Hereinafter, the non-contact IC card 100 including the method of manufacturing the electronic component mounted component 101 will be described.
Will be described with reference to the drawings.

【００１８】図１０に示すステップ（図内では「Ｓ」に
て示す）１０１において、図３に示すように、電子部品
の一例に相当する半導体素子１０４の電極１１７上に、
ＡｕやＣｕ、半田等にてなる金属ワイヤを用いたワイヤ
ボンディング法により、バンプ１１３を形成する。尚、
バンプ１１３の形成方法は、ワイヤボンディング法によ
る形成に限定されるものではなく、めっき法による形成
でも良い。又、図３に示す１１２は、半導体素子１０４
のアクティブ面を保護するためのパッシベーション膜で
ある。次のステップ１０２において、バンブ１１３を形
成した半導体素子１０４、及び図４に示すように、外部
電極５０を有し電子部品の他の例としてのコンデンサ部
品１０５を、ポリエチレンテレフタレート、塩化ビニ
ル、ポリカーボネイト、アクリロニトリルブタジエンス
チレン等の電気的絶縁性を有する熱可塑性樹脂で形成さ
れたシート状の、第１基材の機能を果たす一例である第
１熱可塑性樹脂基材１２２上にマウントする。半導体素
子１０４及びコンデンサ部品１０５は、それぞれ複数個
マウントする場合もあり、又、コンデンサ部品１０５は
搭載せずに一つ若しくは複数の半導体素子１０４のみを
マウントする場合もある。In a step 101 (indicated by “S” in the figure) 101 shown in FIG. 10, as shown in FIG. 3, an electrode 117 of a semiconductor element 104 corresponding to an example of an electronic component is placed on the electrode 117.
The bump 113 is formed by a wire bonding method using a metal wire made of Au, Cu, solder, or the like. still,
The method of forming the bumps 113 is not limited to the formation by the wire bonding method, but may be the formation by a plating method. Further, 112 shown in FIG.
Is a passivation film for protecting the active surface. In the next step 102, the semiconductor element 104 having the bump 113 formed thereon and, as shown in FIG. 4, a capacitor component 105 having another external electrode 50 and having another external component are made of polyethylene terephthalate, vinyl chloride, polycarbonate, It is mounted on a first thermoplastic resin substrate 122 which is an example of a sheet-like material formed of an electrically insulating thermoplastic resin such as acrylonitrile butadiene styrene, which functions as a first substrate. A plurality of semiconductor elements 104 and capacitor parts 105 may be mounted respectively, or only one or a plurality of semiconductor elements 104 may be mounted without mounting the capacitor parts 105.

【００１９】ここで、第１熱可塑性樹脂基材１２２の厚
みｔ１は、本実施形態の場合、後述するようにバンプ１
１３を第１熱可塑性樹脂基材１２２の回路パターン形成
面１２３から露出させる必要から、基本的に半導体素子
１０４の厚み以上で、半導体素子１０４の厚みとバンプ
１１３の高さとを合わせた厚み以下にすることが望まし
い。例えば、半導体素子１０４の厚みが０．１８ｍｍ、
バンプ１１３の高さが０．０４ｍｍの場合、第１熱可塑
性樹脂基材１２２の厚みは０．２０ｍｍが好ましい。
又、回路パターン形成面１２３から上記外部電極５０を
露出させる必要から、コンデンサ部品１０５は、第１熱
可塑性樹脂基材１２２の厚みに対して５０μｍ程度厚い
厚みのものを用いることが好適である。少なくとも、厚
みが第１熱可塑性樹脂基材１２２の厚みｔ１以下になる
こと避ける必要がある。Here, the thickness t1 of the first thermoplastic resin base material 122 in the present embodiment is, as described later,
13 is required to be exposed from the circuit pattern forming surface 123 of the first thermoplastic resin base material 122, so that it is basically equal to or more than the thickness of the semiconductor element 104 and equal to or less than the total thickness of the semiconductor element 104 and the height of the bump 113. It is desirable to do. For example, the thickness of the semiconductor element 104 is 0.18 mm,
When the height of the bump 113 is 0.04 mm, the thickness of the first thermoplastic resin base 122 is preferably 0.20 mm.
Further, since it is necessary to expose the external electrode 50 from the circuit pattern forming surface 123, it is preferable to use the capacitor component 105 having a thickness about 50 μm larger than the thickness of the first thermoplastic resin base material 122. At least, it is necessary to avoid that the thickness becomes equal to or less than the thickness t1 of the first thermoplastic resin base material 122.

【００２０】次のステップ１０３では、図６に示すよう
に、バンプ１１３付の半導体素子１０４及びコンデンサ
部品１０５を載置した第１熱可塑性樹脂基材１２２を熱
プレス板１７１、１７２間に狭み、熱プレス板１７１、
１７２にて、バンプ１１３付の半導体素子１０４及びコ
ンデンサ部品１０５、並びに第１熱可塑性樹脂基材１２
２を加熱しながらこれらを相対的に押圧して、図７に示
すように半導体素子１０４及びコンデンサ部品１０５を
第１熱可塑性樹脂基材１２２内に埋設する。尚、図６に
おいて、１７３、１７４は、上記押圧動作のために熱プ
レス板１７１、１７２を移動させる各移動装置であり、
１７５、１７６は、熱プレス板１７１、１７２をそれぞ
れ加熱するための加熱装置である。該熱プレス動作の条
件は、例えばポリエチレンテレフタレート製の第１熱可
塑性樹脂基材を用いた場合、一例として、圧力３０×１
０５Ｐａ、温度１６０℃、プレス時間１分である。尚、
上記温度、圧力値は、第１熱可塑性樹脂基材１２２の材
質により異ならせる。又、半導体素子１０４及びコンデ
ンサ部品１０５に対する押圧動作は、それぞれ別々の熱
プレス板を用いて個別に実施しても良い。In the next step 103, as shown in FIG. 6, the first thermoplastic resin base 122 on which the semiconductor element 104 with the bump 113 and the capacitor component 105 are mounted is narrowed between the hot press plates 171 and 172. , Hot press plate 171,
At 172, the semiconductor element 104 and the capacitor component 105 with the bump 113, and the first thermoplastic resin base material 12
These are relatively pressed while heating 2 to bury the semiconductor element 104 and the capacitor component 105 in the first thermoplastic resin base 122 as shown in FIG. In FIG. 6, reference numerals 173 and 174 denote moving devices for moving the hot press plates 171 and 172 for the pressing operation.
175 and 176 are heating devices for heating the hot press plates 171 and 172, respectively. The condition of the hot pressing operation is, for example, when a first thermoplastic resin substrate made of polyethylene terephthalate is used, as an example, a pressure of 30 × 1
0 5 Pa, temperature 160 ° C., press time 1 minute. still,
The above temperature and pressure values are made different depending on the material of the first thermoplastic resin base material 122. Further, the pressing operation on the semiconductor element 104 and the capacitor component 105 may be individually performed using different hot press plates.

【００２１】本実施形態では、バンプ１１３及び電極５
０がそれぞれ熱プレス板１７１に接触した面である、バ
ンブ１１３の端面１１５、及びコンデンサ部品１０５の
電極５０の端面５１が熱プレス板１７１に達するまで押
圧することから、図７に示すように上記プレス動作によ
り、上記端面１１５及び端面５１は、それぞれ第１熱可
塑性樹脂基材１２２における上記熱プレス板１７１との
接触面である上記回路パターン形成面１２３に露出する
ことになる。In the present embodiment, the bump 113 and the electrode 5
0 presses until the end face 115 of the bump 113 and the end face 51 of the electrode 50 of the capacitor component 105, which are the surfaces in contact with the hot press plate 171 respectively, reach the hot press plate 171. As shown in FIG. By the pressing operation, the end surface 115 and the end surface 51 are respectively exposed on the circuit pattern forming surface 123 which is the contact surface of the first thermoplastic resin base material 122 with the hot press plate 171.

【００２２】このとき、本実施形態では薄型化を図るた
め、半導体素子１０４の上記アクティブ面に対向する裏
面１０４ａ及びコンデンサ部品１０５の片面側１０５ａ
と、上記パターン形成面１２３に対向する第１熱可塑性
樹脂基材１２２の裏面１２２ａとは、図示するように同
一面となるようにしているが、これに限定されるもので
はない。つまり、製造する半導体部品実装済部品によっ
ては、上述した第１熱可塑性樹脂基材１２２の厚みｔ１
や、熱プレス板１７１、１７２の押圧力等の調整によ
り、例えば、第１熱可塑性樹脂基材１２２の裏面１２２
ａより半導体素子１０４の裏面１０４ａ及びコンデンサ
部品１０５の端面１０５ａを突出させても良い。At this time, in this embodiment, in order to reduce the thickness, the back surface 104a of the semiconductor element 104 facing the active surface and the one side 105a of the capacitor component 105 are formed.
The rear surface 122a of the first thermoplastic resin substrate 122 facing the pattern forming surface 123 is made to be the same surface as shown in the figure, but is not limited to this. That is, the thickness t1 of the first thermoplastic resin base 122 described above depends on the semiconductor component-mounted component to be manufactured.
By adjusting the pressing force or the like of the hot press plates 171 and 172, for example, the back surface 122 of the first thermoplastic resin base material 122 is adjusted.
The back surface 104a of the semiconductor element 104 and the end surface 105a of the capacitor component 105 may project from a.

【００２３】次のステップ１０５では、第１熱可塑性樹
脂基材１２２における回路パターン形成面１２３に露出
している、バンブ１１３の端面１１５、及びコンデンサ
部品１０５の電極５０の端面５１と電気的接続を図るた
め、端面１１５、５１に接触するようにして、Ａｇ、Ｃ
ｕ等の導電性ペーストを用いて回路パターン１１８をパ
ターン形成面１２３上に形成する。尚、回路パターン１
１８には、半導体素子１０４及びコンデンサ部品１０５
と電気的に接続されるコイルパターン１０２を含む。該
導電性ペーストによる回路パターン１１８の形成は、一
般的にスクリーン印刷やオフセット印刷やグラビア印刷
等によって行う。例えばスクリーン印刷の場合、１６５
メッシュ／インチ、乳剤厚み１０μｍのマスクを介して
導電性ペーストを印刷し、導体厚み約３０μｍの回路パ
ターン１１８を形成する。In the next step 105, electrical connection is made with the end face 115 of the bump 113 and the end face 51 of the electrode 50 of the capacitor component 105, which are exposed on the circuit pattern forming surface 123 of the first thermoplastic resin base material 122. In order to measure, Ag, C
A circuit pattern 118 is formed on the pattern forming surface 123 using a conductive paste such as u. The circuit pattern 1
18 includes a semiconductor element 104 and a capacitor component 105
And a coil pattern 102 electrically connected to the coil pattern 102. The formation of the circuit pattern 118 using the conductive paste is generally performed by screen printing, offset printing, gravure printing, or the like. For example, in the case of screen printing, 165
A conductive paste is printed through a mask having a mesh / inch and an emulsion thickness of 10 μm to form a circuit pattern 118 having a conductor thickness of about 30 μm.

【００２４】尚、回路パターン１１８の形成は、導電性
ペーストの印刷による形成に限定されるものではなく、
Ｃｕ、Ｎｉ、アルミニウム等の金属メッキにより形成し
ても良い。又、形成される回路パターン１１８は、本実
施形態では、半導体素子１０４と無線にて情報の送受信
を行なう為のアンテナコイルの形状である。勿論、上記
回路パターン１１８は、上記アンテナコイル形状に限定
されるものではなく、製造物としての電子部品実装済部
品の機能に応じた形態に形成される。このようにして、
回路パターン１１８への半導体素子１０４及びコンデン
サ部品１０５の実装を行ない図１に示す電子部品内蔵コ
アモジュール部品１０１が形成される。さらに以下の工
程を実行することで、即ち電子部品実装済完成品の製造
方法を実行することで、電子部品実装済完成品、本実施
形態では非接触ＩＣカード１００が作製される。The formation of the circuit pattern 118 is not limited to the formation of the conductive paste by printing.
It may be formed by metal plating such as Cu, Ni, and aluminum. In this embodiment, the formed circuit pattern 118 has the shape of an antenna coil for wirelessly transmitting and receiving information to and from the semiconductor element 104. Of course, the circuit pattern 118 is not limited to the antenna coil shape, but is formed in a form according to the function of the electronic component-mounted component as a product. In this way,
By mounting the semiconductor element 104 and the capacitor component 105 on the circuit pattern 118, the electronic component built-in core module component 101 shown in FIG. 1 is formed. Further, by executing the following steps, that is, by executing the method of manufacturing the completed electronic component mounted product, the electronic component mounted completed product, in this embodiment, the non-contact IC card 100 is manufactured.

【００２５】次のステップ１０６では、図８に示すよう
に、上記電子部品内蔵コアモジュール部品１０１をその
厚み方向からポリエチレンテレフタレート、塩化ビニ
ル、ポリカーボネイト、アクリロニトリルブタジエンス
チレン等電気的絶縁性を有するシート状の第２熱可塑性
樹脂基材１２４及び第３熱可塑性樹脂基材１２５にてサ
ンドイッチして、ラミネート処理し、電子部品内蔵コア
モジュール部品１０１の封止を行なう。該ラミネート処
理は、加熱された平面プレス板２０１、２０２により加
熱、加圧して実施する。処理条件は、例えばポリエチレ
ンテレフタレート製の熱可塑性樹脂基材を用いた場合、
圧力３０×１０５Ｐａ、温度１６０℃、昇圧時間１分、
圧力保持時間１分である。尚、図８において、２０５、
２０６は、上記押圧動作のために平面プレス板２０１、
２０２を移動させる各移動装置であり、２０７、２０８
は、平面プレス板２０１、２０２をそれぞれ加熱するた
めの加熱装置である。In the next step 106, as shown in FIG. 8, the electronic component built-in core module component 101 is placed in a sheet shape having electrical insulation properties such as polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene in the thickness direction. The second thermoplastic resin substrate 124 and the third thermoplastic resin substrate 125 are sandwiched and laminated, and the electronic component built-in core module component 101 is sealed. The laminating process is performed by applying heat and pressure by the heated flat press plates 201 and 202. Processing conditions, for example, when using a thermoplastic resin substrate made of polyethylene terephthalate,
Pressure 30 × 10 5 Pa, temperature 160 ° C., pressure rise time 1 minute,
The pressure holding time is 1 minute. In addition, in FIG.
206 is a flat press plate 201 for the pressing operation,
Each of the moving devices for moving 202, 207 and 208
Is a heating device for heating the flat press plates 201 and 202, respectively.

【００２６】又、上記ラミネート処理は、図９に示すロ
ールプレス方式により実施しても良い。図９において２
０３、２０４は加熱されたローラーである。電子部品内
蔵コアモジュール１０１をその厚み方向からサンドイッ
チする形でポリエチレンテレフタレート、塩化ビニル、
ポリカーボネイト、アクリロニトリルブタジエンスチレ
ン等電気的絶縁性を有するシート状の第２熱可塑性樹脂
基材１２４及び第３熱可塑性樹脂基材１２５をローラー
２０３、２０４間に供給し、ラミネート処理していく。
処理条件は、例えばポリエチレンテレフタレート製の熱
可塑性樹脂基材１２４、１２５を用いた場合、圧力３０
×１０５Ｐａ、温度１４０℃、ラミネート速度０．１ｍ
／分である。尚、図９において、２０９、２１０は、上
記押圧動作のためにローラ２０３、２０４を回転させる
各駆動装置であり、２１１、２１２は、ローラ２０３、
２０４をそれぞれ加熱するための加熱装置である。以上
の工程を経て、図２に示すような、半導体素子１０４及
びコンデンサ部品１０５が実装されたモジュールとして
の電子部品実装済部品や、本実施形態の場合のように電
子部品実装済完成品としての機能を果たす一例に相当す
る非接触ＩＣカード１００が完成する。The laminating process may be performed by a roll press method shown in FIG. In FIG. 9, 2
03 and 204 are heated rollers. In the form of sandwiching the electronic component built-in core module 101 from its thickness direction, polyethylene terephthalate, vinyl chloride,
A sheet-like second thermoplastic resin substrate 124 and a third thermoplastic resin substrate 125 having electrical insulation properties, such as polycarbonate and acrylonitrile butadiene styrene, are supplied between the rollers 203 and 204 and laminated.
The processing conditions are, for example, when the thermoplastic resin substrates 124 and 125 made of polyethylene terephthalate are used, the pressure is 30
× 10 5 Pa, temperature 140 ° C, lamination speed 0.1m
/ Min. In FIG. 9, 209 and 210 are driving devices for rotating the rollers 203 and 204 for the pressing operation, and 211 and 212 are the rollers 203 and
This is a heating device for heating each of the heaters 204. Through the above steps, as shown in FIG. 2, an electronic component mounted component as a module on which the semiconductor element 104 and the capacitor component 105 are mounted, or a completed electronic component mounted product as in the present embodiment. A non-contact IC card 100 corresponding to an example that fulfills a function is completed.

【００２７】このように本実施形態によれば、第１熱可
塑性樹脂基材１２２に半導体素子１０４及びコンデンサ
部品１０５を予め埋め込んだ後に、カード化を実施する
為、実装されている半導体素子１０４及びコンデンサ部
品１０５と第１基材１２２の表面との間に段差が無い。
その為、従来例における図２４及び図２５に示すように
第２基材１ｂがその段差ｈになじまず、半導体素子４及
び電子部品５周辺に気体１７０が残り、外観上膨れや凹
み等不良が生じることは無い。又、第１熱可塑性樹脂基
材１２２に半導体素子１０４及びコンデンサ部品１０５
を予め埋め込んだ後、半導体素子１０４及びコンデンサ
部品１０５と電気的接続を図って回路パターン１１８を
形成することから、従来例における図２３に示すような
カード化後における半導体素子４の基材１ａへの沈み込
みは発生せず、回路パターン６が断線することは無く、
高品質の電子部品実装済部品及び電子部品実装済宛成品
を製造することが可能になる。As described above, according to the present embodiment, after the semiconductor element 104 and the capacitor component 105 are embedded in the first thermoplastic resin base material 122 in advance, the semiconductor element 104 and the mounted There is no step between capacitor component 105 and the surface of first substrate 122.
Therefore, as shown in FIGS. 24 and 25 in the conventional example, the second base material 1b does not conform to the step h, the gas 170 remains around the semiconductor element 4 and the electronic component 5, and defects such as swelling and dents appear in appearance. Will not occur. Also, the semiconductor element 104 and the capacitor component 105 are provided on the first thermoplastic resin base 122.
Is embedded in advance, and the circuit pattern 118 is formed by electrically connecting the semiconductor element 104 and the capacitor component 105 to the substrate 1a of the semiconductor element 4 after carding as shown in FIG. 23 in the conventional example. Does not occur, the circuit pattern 6 does not break,
It is possible to manufacture high-quality electronic component-mounted components and electronic component-mounted products.

【００２８】さらに、高価な異方導電性シートまたは異
方導電性粒子等の接合材料を用いる必要が無い為、加熱
押圧動作を要する異方導電性シート等の処理に要する工
程は必要ない。よって耐熱性の低いシート基材を使用す
ることができ、かつ第１基材１２２の劣化を招くことも
ない。よって、高品質、高生産性旦つ安価な電子部品実
装済部品及び電子部品実装済完成品を提供することが可
能になる。尚、上述した図１〜図９は半導体素子１０
４、コンデンサ部品１０５と回路パターン１１８の接続
箇所のみを示したものであり、電子部品実装済完成品の
全体を示すものではない。Further, since it is not necessary to use an expensive anisotropic conductive sheet or an anisotropic conductive particle or other bonding material, there is no need for a step required for processing an anisotropic conductive sheet or the like which requires a heating and pressing operation. Therefore, a sheet substrate having low heat resistance can be used, and the first substrate 122 does not deteriorate. Therefore, it is possible to provide high-quality, high-productivity, inexpensive electronic component-mounted components and electronic component-mounted finished products. The above-described FIGS.
4. Only the connection portions between the capacitor component 105 and the circuit pattern 118 are shown, and do not show the entire electronic component mounted finished product.

【００２９】第２実施形態；上述の第１実施形態では、
半導体素子１０４のバンプ１１３等が第１熱可塑性樹脂
基材１２２のパターン形成面１２３に露出可能な場合を
例に採ったが、例えば第１熱可塑性樹脂基材１２２の厚
みｔ１よりかなり厚みの薄い半導体素子１０４やコンデ
ンサ部品１０５を第１熱可塑性樹脂基材１２２に埋設す
る場合には、図１１に示すように、埋設工程のみでは半
導体素子１０４のバンプ１１３上やコンデンサ部品１０
５の電極５０上には未だ樹脂の残余部分３０１が存在
し、上記パターン形成面１２３にバンプ１１３や電極５
０を露出できないときもある。当該第２実施形態は、こ
のような場合に対応するものである。即ち、図１１に示
すように、上記ステップ１０４の後でステップ１０５の
前に、第１熱可塑性樹脂基材１２２のパターン形成面１
２３側より、半導体素子１０４のバンプ１１３及びコン
デンサ部品１０５の電極５０上を、加熱された露出用部
材３００で押圧することで、図１２に示すようにバンブ
１１３及び電極５０上の樹脂３０１を押しのけ、バンプ
１１３及び電極５０をパターン形成面１２３に露出させ
る。Second Embodiment: In the above-described first embodiment,
Although the case where the bumps 113 and the like of the semiconductor element 104 can be exposed on the pattern forming surface 123 of the first thermoplastic resin base material 122 is taken as an example, for example, the thickness is much thinner than the thickness t1 of the first thermoplastic resin base material 122. In the case where the semiconductor element 104 and the capacitor component 105 are embedded in the first thermoplastic resin base material 122, as shown in FIG.
The resin remaining portion 301 still exists on the electrode 50 of No. 5 and the bump 113 and the electrode 5 are formed on the pattern forming surface 123.
In some cases, 0 cannot be exposed. The second embodiment corresponds to such a case. That is, as shown in FIG. 11, after step 104 and before step 105, the pattern forming surface 1 of the first thermoplastic resin base material 122 is formed.
By pressing the bump 113 of the semiconductor element 104 and the electrode 50 of the capacitor component 105 with the heated exposing member 300 from the 23 side, the resin 301 on the bump 113 and the electrode 50 is pushed away as shown in FIG. Then, the bumps 113 and the electrodes 50 are exposed on the pattern forming surface 123.

【００３０】このように第２実施形態によれば、上記埋
設工程のみではバンブ１１３及び電極５０をパターン形
成面１２３に露出できない場合でも、上記露出用部材３
００を用いた露出工程によりバンブ１１３及び電極５０
をパターン形成面１２３に露出させることができる。よ
ってその後、上記ステップ１０５、さらには上記ステッ
プ１０６を実行することが可能となる。さらに又、第２
実施形態によれば図１３に示すように、電極１１７にバ
ンブ１１３を形成していない半導体素子１０４１や、電
極が突出していないフィルム状のコンデンサ部品であっ
ても使用が可能となる。よって、種々の形態の電子部品
が使用可能となり電子部品の選択範囲を拡大することが
できる。上記露出用部材３００の押圧条件は、例えば、
２００℃に加熱され、荷重９８０ｍＮである。As described above, according to the second embodiment, even when the bumps 113 and the electrodes 50 cannot be exposed on the pattern forming surface 123 only by the embedding process, the exposing member 3
The bump 113 and the electrode 50
Can be exposed on the pattern forming surface 123. Therefore, after that, the above step 105 and further the above step 106 can be executed. Furthermore, the second
According to the embodiment, as shown in FIG. 13, it is possible to use even a semiconductor element 1041 in which the bump 113 is not formed in the electrode 117 or a film-shaped capacitor component in which the electrode does not protrude. Therefore, various forms of electronic components can be used, and the selection range of electronic components can be expanded. The pressing condition of the exposure member 300 is, for example,
Heated to 200 ° C with a load of 980 mN.

【００３１】又、露出用部材３００による上記露出工程
は、バンプ１１３や電極５０の上記パターン形成面１２
３における露出面積をより拡大するために実行すること
もできる。即ち、図７に示すように、半導体素子１０４
及びコンデンサ部品１０５を第１熱可塑性樹脂基材１２
２に埋設したとき、既にバンプ１１３や電極５０がパタ
ーン形成面１２３に露出している場合であっても上記露
出工程を実行してもよい。該動作により、バンプ１１３
や電極５０のパターン形成面１２３における露出面積を
より拡大することができ、導電性ペーストとの接合強度
が増し、接合信頼性を向上させることができる。The exposing step using the exposing member 300 is performed in the same manner as the step of forming the bump 113 and the electrode 50 on the pattern forming surface 12.
3 can be performed to further increase the exposed area. That is, as shown in FIG.
And the capacitor component 105 with the first thermoplastic resin base material 12.
2, the above-described exposure step may be performed even when the bumps 113 and the electrodes 50 are already exposed on the pattern formation surface 123. By this operation, the bump 113
The exposed area of the electrode 50 on the pattern forming surface 123 can be further increased, the bonding strength with the conductive paste can be increased, and the bonding reliability can be improved.

【００３２】第３実施形態；該第３実施形態では、上記
ステップ１０５の終了後、ステップ１０６の実行前に、
図１４に示すように、図１に示す電子部品内蔵コアモジ
ュール部品１０１をその厚み方向から押圧用部材３０
２、３０３にて加熱、加圧する。該加熱、加圧条件は、
例えば、圧力３０×１０５Ｐａ、温度１６０℃、昇圧時
間１分、圧力保持時間１分である。該押圧動作により、
第１熱可塑性樹脂基材１２２のパターン形成面１２３に
形成されている上記回路パターン１１８は、第１熱可塑
性樹脂基材１２２内に埋め込まれる。よって、図１４に
示す、第１熱可塑性樹脂基材１２２の回路パターン形成
面１２３と回路パターン１１８との、数μｍ〜数十μｍ
にてなる段差ｈ２が無くなり、図１５に示すようにパタ
ーン形成面１２３が平坦な電子部品内蔵コアモジュール
部品１０６が作製される。Third Embodiment In the third embodiment, after the above-described step 105 is completed, and before the execution of step 106,
As shown in FIG. 14, the pressing member 30 is attached to the electronic component built-in core module component 101 shown in FIG.
Heating and pressurizing are performed in steps 2 and 303. The heating and pressurizing conditions are as follows:
For example, the pressure is 30 × 10 5 Pa, the temperature is 160 ° C., the pressure raising time is 1 minute, and the pressure holding time is 1 minute. By the pressing operation,
The circuit pattern 118 formed on the pattern forming surface 123 of the first thermoplastic resin base 122 is embedded in the first thermoplastic resin base 122. Therefore, as shown in FIG. 14, the distance between the circuit pattern forming surface 123 of the first thermoplastic resin base 122 and the circuit pattern 118 is several μm to several tens μm.
Thus, the step h2 is eliminated, and the electronic component built-in core module component 106 having the flat pattern formation surface 123 as shown in FIG.

【００３３】上記電子部品内蔵コアモジュール部品１０
６によれば、該電子部品内蔵コアモジュール部品１０６
を上記第２、第３の熱可塑性樹脂基材１２４、１２５で
封止する際に、気体溜まり発生の原因となる段差がμｍ
レベルのオーダーで無くなるため、上記膨れ等の外観上
の不良発生が無い。よって、高品質の電子部品実装済完
成品を安定して供給することができる。The above-mentioned electronic component built-in core module component 10
6, the electronic component built-in core module component 106
Is sealed by the second and third thermoplastic resin bases 124 and 125, and the step that causes the generation of gas pool is μm.
Since they are eliminated in the order of the level, there is no appearance defect such as swelling. Therefore, a high-quality completed electronic component-mounted product can be supplied stably.

【００３４】[0034]

【発明の効果】以上詳述したように本発明の第１態様に
おける電子部品実装済部品の製造方法によれば、第１基
材に電子部品を埋め込み、該第１基材上に上記電子部品
と電気的に接続する回路パターンを形成したことから、
従来のように異方導電性部材を用いる必要がない。よっ
て、上記異方導電性部材を本圧着するために必要であっ
た、例えば２００℃以上の加熱動作が不要となる。した
がって、上記異方導電性部材用の加熱動作は不要とな
り、かつ耐熱性に劣る上記第１基材について加熱が原因
で劣化することはなく、かつ高価な異方導電性部材の使
用を排除できるので、高品質、高生産で安価な半導体部
品実装済部品の製造方法を提供することができる。As described above in detail, according to the method of manufacturing an electronic component-mounted component according to the first aspect of the present invention, an electronic component is embedded in a first base material, and the electronic component is mounted on the first base material. Because a circuit pattern that is electrically connected to
It is not necessary to use an anisotropic conductive member as in the related art. Therefore, a heating operation at, for example, 200 ° C. or higher, which is necessary for the final pressure bonding of the anisotropic conductive member, becomes unnecessary. Therefore, the heating operation for the anisotropic conductive member becomes unnecessary, and the first base material having poor heat resistance does not deteriorate due to heating, and the use of the expensive anisotropic conductive member can be eliminated. Therefore, it is possible to provide a method of manufacturing a high-quality, high-production and inexpensive semiconductor component-mounted component.

【００３５】又、上記電子部品の埋設後、該電子部品の
電極を露出させた後、上記回路パターンの形成を行なう
ことで、例えば第１基材の厚みよりかなり厚みの薄い電
子部品を第１基材に埋設した場合であっても、埋設した
電子部品と上記回路パターンとを電気的に接続すること
ができる。よって、種々の形態の電子部品が使用可能と
なり電子部品の選択範囲を拡大することができる。After burying the electronic component, exposing the electrodes of the electronic component and then forming the circuit pattern, the electronic component having a thickness considerably smaller than the thickness of the first base material can be removed. Even when buried in the base material, the buried electronic component can be electrically connected to the circuit pattern. Therefore, various forms of electronic components can be used, and the selection range of electronic components can be expanded.

【００３６】上記第１基材の回路形成面上に形成した上
記回路パターンを当該第１基材内へ押し込み上記回路形
成面を平坦化することができる。The circuit pattern formed on the circuit forming surface of the first base can be pushed into the first base to flatten the circuit forming surface.

【００３７】本発明の第２態様における電子部品実装済
完成品の製造方法、及び第３態様における半導体部品実
装済完成品によれば、上記第１態様の製造方法にて製造
された電子部品実装済部品を使用することから、高品
質、高生産で安価な電子部品実装済完成品の製造方法、
及び半導体部品実装済完成品を提供することができる。According to the method for manufacturing a completed electronic component-mounted product according to the second aspect of the present invention, and the completed semiconductor component-mounted product according to the third aspect, the electronic component mounted by the manufacturing method according to the first aspect described above. The use of pre-installed components makes it possible to produce high-quality, high-production, inexpensive electronic component-mounted finished products,
In addition, it is possible to provide a finished product on which semiconductor parts are mounted.

【００３８】又、電子部品を埋設することから、従来の
ような、第１基材と電子部品との段差は無くなる。よっ
て、上記電子部品実装済部品を第２基材及び第３基材に
てラミネート処理したとき、電子部品の周辺に気体が残
り、半導体部品実装済完成品の外観上、膨れや凹み等の
不良が生じることは無い。さらに、上述のように電子部
品は第１基材内に埋設され、かつ上記第１基材上に回路
パターンを形成したことから、ラミネート処理したと
き、従来発生したような電子部品の基材への沈み込みは
発生せず、回路パターンが断線することは無い。よっ
て、高品質の電子部品実装済完成品を安定して供給する
ことができる。Since the electronic component is buried, there is no step between the first base member and the electronic component as in the related art. Therefore, when the electronic component-mounted component is laminated on the second base material and the third base material, gas remains around the electronic component, and defects such as swelling and dents appear on the appearance of the completed semiconductor component-mounted product. Does not occur. Furthermore, as described above, since the electronic component is embedded in the first base material and the circuit pattern is formed on the first base material, when the electronic component is subjected to lamination processing, the electronic component base material that has conventionally occurred can be obtained. Does not occur, and the circuit pattern does not break. Therefore, a high-quality completed electronic component-mounted product can be supplied stably.

【００３９】又、上記回路形成面の平坦化により、当該
電子部品実装済部品をラミネート処理して電子部品実装
済完成品を作製するとき、膨れ等の外観上の不良発生を
無くすことができる。よって、高品質の電子部品実装済
完成品を安定して供給することができる。Further, by flattening the circuit forming surface, it is possible to eliminate appearance defects such as blisters when laminating the electronic component mounted component to produce a completed electronic component mounted product. Therefore, a high-quality completed electronic component-mounted product can be supplied stably.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 本発明の実施形態における電子部品内蔵コア
モジュール部品の断面図である。FIG. 1 is a cross-sectional view of an electronic component built-in core module component according to an embodiment of the present invention.

【図２】 本発明の実施形態における電子部品実装済完
成品の断面図である。FIG. 2 is a cross-sectional view of a completed electronic component-mounted product according to an embodiment of the present invention.

【図３】 図１、図２に示す電子部品内蔵コアモジュー
ル部品、及び電子部品実装済完成品の製造過程を説明す
るための図であり、半導体素子を示す図である。FIG. 3 is a diagram for explaining a manufacturing process of the core module component with a built-in electronic component and the completed electronic component mounted product shown in FIGS. 1 and 2, and is a diagram showing a semiconductor element.

【図４】 図１、図２に示す電子部品内蔵コアモジュー
ル部品、及び電子部品実装済完成品に含まれるコンデン
サ部品を示す図である。FIG. 4 is a view showing a core module component with a built-in electronic component shown in FIGS. 1 and 2 and a capacitor component included in a completed product with an electronic component mounted thereon.

【図５】 図１、図２に示す電子部品内蔵コアモジュー
ル部品、及び電子部品実装済完成品の製造過程を説明す
るための図であり、第１熱可塑性樹脂基材上に半導体素
子及びコンデンサ部品を載置した状態を示す図である。FIG. 5 is a diagram for explaining a manufacturing process of the core module component with a built-in electronic component and the completed electronic component mounted product shown in FIGS. 1 and 2, wherein a semiconductor element and a capacitor are provided on a first thermoplastic resin base material. It is a figure showing the state where parts were mounted.

【図６】 図１、図２に示す電子部品内蔵コアモジュー
ル部品、及び電子部品実装済完成品の製造過程を説明す
るための図であり、半導体素子等を第１熱可塑性樹脂基
材へ押し込む状態を示す図である。FIG. 6 is a view for explaining a manufacturing process of the electronic component built-in core module component and the electronic component mounted finished product shown in FIGS. 1 and 2, wherein a semiconductor element or the like is pushed into a first thermoplastic resin base material. It is a figure showing a state.

【図７】 図１、図２に示す電子部品内蔵コアモジュー
ル部品、及び電子部品実装済完成品の製造過程を説明す
るための図であり、半導体素子等を第１熱可塑性樹脂基
材内に埋設した状態を示す図である。FIG. 7 is a view for explaining a manufacturing process of the core module component with a built-in electronic component and the completed electronic component mounted product shown in FIGS. 1 and 2, wherein a semiconductor element and the like are placed in a first thermoplastic resin base material. It is a figure showing the state where it was buried.

【図８】 図１に示す電子部品内蔵コアモジュール部品
を備えた電子部品実装済完成品の製造過程を説明するた
めの図であり、電子部品内蔵コアモジュール部品を平面
プレス板にてラミネート処理する状態を示す図である。FIG. 8 is a view for explaining a manufacturing process of a completed electronic component-mounted product having the electronic component-embedded core module component shown in FIG. 1, in which the electronic component-embedded core module component is laminated with a flat press plate. It is a figure showing a state.

【図９】 図１に示す電子部品内蔵コアモジュール部品
を備えた電子部品実装済完成品の製造過程を説明するた
めの図であり、電子部品内蔵コアモジュール部品をロー
ラにてラミネート処理する状態を示す図である。9 is a view for explaining a manufacturing process of a completed electronic component-mounted product including the electronic component-embedded core module component shown in FIG. 1 and illustrates a state in which the electronic component-embedded core module component is laminated by a roller. FIG.

【図１０】 電子部品実装済完成品の製造過程を示すフ
ローチャートである。FIG. 10 is a flowchart illustrating a manufacturing process of a completed electronic component mounted product.

【図１１】 本発明の第２実施形態における電子部品内
蔵コアモジュール部品の製造方法における露出工程を説
明するための図である。FIG. 11 is a view for explaining an exposing step in the method for manufacturing a core module component with a built-in electronic component according to the second embodiment of the present invention.

【図１２】 上記露出工程にてバンプ等が露出した状態
における電子部品内蔵コアモジュール部品の断面図であ
る。FIG. 12 is a sectional view of the electronic component built-in core module component in a state where bumps and the like are exposed in the exposing step.

【図１３】 上記露出工程が適用可能な電子部品の一例
を説明するための図である。FIG. 13 is a diagram illustrating an example of an electronic component to which the above-described exposure step can be applied.

【図１４】 本発明の第３実施形態における電子部品内
蔵コアモジュール部品の製造方法を説明するための図で
ある。FIG. 14 is a view illustrating a method of manufacturing a core module component with a built-in electronic component according to the third embodiment of the present invention.

【図１５】 図１４に示す製造方法にて作製された電子
部品内蔵コアモジュール部品の断面図である。15 is a cross-sectional view of a core module component with a built-in electronic component manufactured by the manufacturing method shown in FIG.

【図１６】 従来の非接触ＩＣカードの構造を示す斜視
図である。FIG. 16 is a perspective view showing the structure of a conventional non-contact IC card.

【図１７】 従来の非接触ＩＣカードの製造工程を示す
フローチャートである。FIG. 17 is a flowchart showing a conventional non-contact IC card manufacturing process.

【図１８】 従来の非接触ＩＣカードの製造工程を示す
断面図である。FIG. 18 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

【図１９】 従来の非接触ＩＣカードの製造工程を示す
断面図である。FIG. 19 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

【図２０】 従来の非接触ＩＣカードの製造工程を示す
断面図である。FIG. 20 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

【図２１】 従来の非接触ＩＣカードの製造工程を示す
断面図である。FIG. 21 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

【図２２】 従来の非接触IＣカードの構造を示す断面
図である。FIG. 22 is a sectional view showing the structure of a conventional non-contact IC card.

【図２３】 従来の非接触IＣカードの不具合状態を示
す断面図である。FIG. 23 is a cross-sectional view showing a failure state of a conventional non-contact IC card.

【図２４】 従来の非接触IＣカードの構造において基
材と電子部品との段差を説明するための図である。FIG. 24 is a view for explaining a step between a base material and an electronic component in the structure of a conventional non-contact IC card.

【図２５】 従来の非接触ＩＣカードの不具合状態を示
す断面図である。FIG. 25 is a cross-sectional view showing a defective state of a conventional non-contact IC card.

【符号の説明】[Explanation of symbols]

１００…非接触ＩＣカード、１０１…電子部品内蔵コア
モジュール部品、１２２…第１熱可塑性樹脂基材、１０
４…半導体素子、１０５…電子部品、１１７…電極、１
１８…回路パターン、１２３…パターン形成面、１２４
…第２熱可塑性樹脂基材、１２５…第３熱可塑性樹脂基
材。100: Non-contact IC card, 101: Core module component with built-in electronic component, 122: First thermoplastic resin base material, 10
4 ... Semiconductor element, 105 ... Electronic component, 117 ... Electrode, 1
18 ... circuit pattern, 123 ... pattern formation surface, 124
... Second thermoplastic resin substrate, 125 ... Third thermoplastic resin substrate.

───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2C005 MA19 NA08 NA09 RA22 5B035 AA04 AA07 AA08 BA05 BB09 CA02 CA03 CA08 CA23 5E336 AA08 AA11 BB02 BB12 BC01 BC25 CC32 CC51 CC55 EE15 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA19 NA08 NA09 RA22 5B035 AA04 AA07 AA08 BA05 BB09 CA02 CA03 CA08 CA23 5E336 AA08 AA11 BB02 BB12 BC01 BC25 CC32 CC51 CC55 EE15

Claims (7)

【特許請求の範囲】[Claims] 【請求項１】 第１基材（１２２）内へ電子部品（１０
４、１０５）を埋設し、 埋設された上記電子部品の電極（１１７、５０）と電気
的に接続する回路パターン（１１８）を上記第１基材の
回路形成面（１２３）に形成して上記電極と上記回路パ
ターンとの電気的接続を図る、 ことを特徴とする電子部品実装済部品の製造方法。An electronic component (10) is inserted into a first substrate (122).
4, 105) is buried, and a circuit pattern (118) for electrically connecting to the buried electrodes (117, 50) of the electronic component is formed on the circuit forming surface (123) of the first base material. A method for manufacturing an electronic component-mounted component, comprising: electrically connecting an electrode to the circuit pattern. 【請求項２】 上記第１基材内への上記電子部品の埋設
後、上記回路パターン形成前に、埋設された上記電子部
品の上記電極を上記回路形成面に露出させ、該露出後に
上記回路パターンを形成する、請求項１記載の電子部品
実装済部品の製造方法。2. After burying the electronic component in the first base material and before forming the circuit pattern, the electrodes of the buried electronic component are exposed on the circuit formation surface, and after the exposure, the circuit is formed. The method for manufacturing an electronic component-mounted component according to claim 1, wherein the pattern is formed. 【請求項３】 上記回路パターン形成後、該回路パター
ンを上記第１基材内へ押し込んで上記電気的接続を図る
とともに上記回路形成面を平坦化する、請求項１記載の
電子部品実装済部品の製造方法。3. The electronic component-mounted component according to claim 1, wherein after the circuit pattern is formed, the circuit pattern is pushed into the first base material to make the electrical connection and flatten the circuit forming surface. Manufacturing method. 【請求項４】 熱可塑性樹脂材にてなる上記第１基材
と、加熱された上記電子部品とを相対的に押圧すること
で上記第１基材内への上記電子部品の埋設を行ない、導
電性ペースト又は金属メッキにて上記回路パターンを形
成する、請求項１から３のいずれかに記載の電子部品実
装済部品の製造方法。4. Embedding the electronic component in the first base material by relatively pressing the first base material made of a thermoplastic resin material and the heated electronic component, The method for manufacturing an electronic component-mounted component according to claim 1, wherein the circuit pattern is formed by conductive paste or metal plating. 【請求項５】 請求項１から４のいずれかに記載の電子
部品実装済部品の製造方法を用いて電子部品実装済部品
を製造した後、 上記電極と上記回路パターンとの上記電気的接続後、上
記第１基材の厚み方向から第２基材（１２４）及び第３
基材（１２５）にて上記第１基材のラミネート処理を行
なうことを特徴とする電子部品実装済完成品の製造方
法。5. After manufacturing an electronic component mounted component using the method of manufacturing an electronic component mounted component according to claim 1, after the electrical connection between the electrode and the circuit pattern. The second base material (124) and the third base material in the thickness direction of the first base material.
A method of manufacturing a completed electronic component-mounted product, comprising laminating the first substrate on a substrate (125). 【請求項６】 請求項５記載の、電子部品実装済完成品
の製造方法にて製造されたことを特徴とする電子部品実
装済完成品。6. A completed electronic component mounted product manufactured by the method for manufacturing a completed electronic component mounted product according to claim 5. 【請求項７】 非接触ＩＣカードを構成するため、上記
回路パターンは、無線にて情報の送受信を行なうアンテ
ナコイル形状にてなる、請求項６記載の電子部品実装済
完成品。7. The completed electronic component mounted product according to claim 6, wherein the circuit pattern has an antenna coil shape for wirelessly transmitting and receiving information to constitute a non-contact IC card.
JP2001061797A 2001-03-06 2001-03-06 Electronic component mounted component manufacturing method, electronic component mounted finished product manufacturing method, and semiconductor component mounted finished product Expired - Fee Related JP3916405B2 (en)

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