JP2002217645A - Surface mounting piezoelectric oscillator - Google Patents
Surface mounting piezoelectric oscillatorInfo
- Publication number
- JP2002217645A JP2002217645A JP2001012716A JP2001012716A JP2002217645A JP 2002217645 A JP2002217645 A JP 2002217645A JP 2001012716 A JP2001012716 A JP 2001012716A JP 2001012716 A JP2001012716 A JP 2001012716A JP 2002217645 A JP2002217645 A JP 2002217645A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- base
- electrode
- electrodes
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はベースの表面に圧電振動
板を搭載するとともに、同裏面に回路部品を形成し、こ
れらを適宜内部配線で電気的接続した圧電発振器に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric oscillator in which a piezoelectric vibrating plate is mounted on a front surface of a base, and circuit components are formed on the rear surface, and these are electrically connected by appropriate internal wiring.
【0002】[0002]
【従来の技術】ベースの表面に圧電振動板を搭載し、同
裏面に回路部品を形成し、各々収納領域を区別すること
により、相互の特性劣化を防止した構成の出願は多数有
り、例えば特開平8−78955号、特開平10−28
024号、特開2000−138532号がある。2. Description of the Related Art There are a number of applications in which a piezoelectric vibrating plate is mounted on the front surface of a base, circuit components are formed on the rear surface, and storage areas are distinguished from each other to prevent mutual characteristic deterioration. JP-A-8-78955, JP-A-10-28
024 and JP-A-2000-138532.
【0003】特開平8−78955号はセラミックから
なる基台(ベース)に必要な電極配線および電極パッド
が形成されており、基台の裏面には凹部が設けられた構
成である。基台上部には水晶振動板を搭載し、キャップ
をガラス材にて接合するとともに、ICチップを凹部に
収納し必要な配線により圧電発振器を構成している。こ
の構成では圧電振動板と回路素子とを各々離隔して収納
するので、特に放出ガス等による圧電振動板への悪影響
を防ぐ利点を有している。またキャップの接合をガラス
材を溶融させることにより行うのでバッチ処理が可能で
あり量産性に優れていた。しかしながらキャップが絶縁
性材料であり、外部からの有害な電磁波の影響を受けや
すく、電気的特性が低下することがあった。Japanese Patent Application Laid-Open No. 8-78955 has a structure in which necessary electrode wirings and electrode pads are formed on a ceramic base, and a concave portion is provided on the back surface of the base. A quartz oscillator is mounted on the upper part of the base, the cap is joined with a glass material, and the IC chip is housed in a concave portion to constitute a piezoelectric oscillator by necessary wiring. In this configuration, since the piezoelectric vibrating plate and the circuit element are housed separately from each other, there is an advantage that the adverse effect on the piezoelectric vibrating plate due to the released gas or the like is particularly prevented. In addition, since the cap is joined by melting the glass material, batch processing was possible and the mass productivity was excellent. However, since the cap is made of an insulating material, the cap is easily affected by harmful electromagnetic waves from the outside, and the electric characteristics may be deteriorated.
【0004】また特開平10−28024号は、特開平
8−78955号とベース構造は類似しているがキャッ
プ(カバー)が金属製で、これを金属の封着体により接
合することにより電磁的なシールドが行われており、こ
の点で特性の低下の少ない構成であった。ところで圧電
振動板は導電接着剤により保持電極に接続されている
が、近年の電子部品の超小型化により圧電振動板の接合
領域も狭小化し、導電接合材の量が過多であったり、塗
布位置が適切でない場合に金属製キャップあるいは金属
の封着体のところにまで流出することがあり、短絡事故
の生じることがあった。Japanese Patent Application Laid-Open No. 10-28024 has a base structure similar to that of Japanese Patent Application Laid-Open No. 8-78955, but the cap (cover) is made of metal, and the cap (cover) is joined by a metal sealing member to obtain an electromagnetic effect. In this regard, the configuration was such that the characteristics were not significantly reduced in this respect. By the way, the piezoelectric vibration plate is connected to the holding electrode by a conductive adhesive. However, due to the recent miniaturization of electronic components, the bonding area of the piezoelectric vibration plate has been narrowed, and the amount of the conductive bonding material has been excessive, If it is not appropriate, it may flow out to a metal cap or a metal sealing body, and a short circuit accident may occur.
【0005】特開2000−138532号はこのよう
な短絡事故を防ぐためになされたものであり、シール用
導体膜と振動子用電極パッド(保持電極)間に溝を設け
ることにより導電接合材による短絡を防止している。し
かしながらさらなる小型化を目指した場合、このような
溝の形成は困難になり、パッケージのコスト高につなが
っていた。Japanese Patent Application Laid-Open No. 2000-138532 has been made in order to prevent such a short circuit accident, and a short circuit is caused by a conductive bonding material by providing a groove between a sealing conductor film and a vibrator electrode pad (holding electrode). Has been prevented. However, in the case of further miniaturization, it is difficult to form such a groove, which has led to an increase in package cost.
【0006】[0006]
【発明が解決しようとする課題】本発明は上記問題点を
解決するためになされたもので、パッケージ内での短絡
事故を防ぎ、また電磁シールド機能を有する特性劣化の
少ない圧電発振器を安価に提供することを目的とするも
のである。SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and provides a low-cost piezoelectric oscillator having an electromagnetic shielding function with less characteristic deterioration, which prevents a short circuit accident in a package. It is intended to do so.
【0007】[0007]
【課題を解決するための手段】本発明による表面実装型
圧電発振器は、ほぼ平坦な表面を有し、当該表面に複数
の保持電極を有するとともに、裏面に凹形収納部を有
し、かつ内部配線により適宜電極が引き出されたベース
と、前記保持電極に搭載される励振電極が形成された圧
電振動板と、前記凹形収納部に収納され必要な接続が行
われる回路部品と、ベースの表面の外周近傍に接合材に
より接合され、前記圧電振動板を気密封止するキャップ
とからなる圧電発振器であって、前記キャップとこれを
ベースに接合する接合材は絶縁性であり、かつ前記キャ
ップの外表面のほぼ全面に導電膜が形成され、当該導電
膜がベースに形成されたアース接続電極に接続されてい
ることを特徴としている。A surface mount type piezoelectric oscillator according to the present invention has a substantially flat surface, a plurality of holding electrodes on the surface, a concave storage portion on the back surface, and an inner surface. A base from which electrodes are appropriately pulled out by wiring, a piezoelectric vibrating plate on which an excitation electrode to be mounted on the holding electrode is formed, a circuit component housed in the concave housing portion and required connection is performed, and a surface of the base A piezoelectric oscillator that is joined by a joining material in the vicinity of an outer periphery of the cap and hermetically seals the piezoelectric vibrating plate, wherein the cap and a joining material joining the base to the cap are insulative, and A conductive film is formed on almost the entire outer surface, and the conductive film is connected to an earth connection electrode formed on the base.
【0008】上記構成により、パッケージの内部におい
ては保持電極に圧電振動板を搭載する際に、ここで用い
る導電接合材が流出し、キャップ側に到達したとしても
キャップ並びに接合材が絶縁性であるために、短絡事故
が生じない。またキャップ外側においては導電膜が形成
され、これがアース接続電極に接続されているので、電
磁シールド機能を十分に発揮させることができる。According to the above configuration, when the piezoelectric vibrating plate is mounted on the holding electrode inside the package, the conductive bonding material used here flows out, and even if the conductive bonding material reaches the cap side, the cap and the bonding material are insulative. Therefore, a short circuit accident does not occur. Further, since a conductive film is formed outside the cap and is connected to the ground connection electrode, the electromagnetic shielding function can be sufficiently exhibited.
【0009】[0009]
【実施の形態】次に、本発明における実施の形態につい
て表面実装型の水晶発振器を例にとり、図面を参照して
説明する。図1は本発明による第1の実施の形態を示す
分解斜視図であり、図2は図1においてキャップにて気
密封止した場合の裏面斜視図であり、図3は図1におい
てキャップにて気密封止し、樹脂材を充填した状態のA
−A断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings, taking a surface mount type crystal oscillator as an example. FIG. 1 is an exploded perspective view showing a first embodiment of the present invention, FIG. 2 is a rear perspective view in a case where the cap is hermetically sealed with a cap in FIG. 1, and FIG. A hermetically sealed and filled with resin material
It is -A sectional drawing.
【0010】表面実装型の水晶発振器は、ベース2とベ
ース表面に搭載された圧電振動板1とベース裏面の凹部
に収納された回路素子(ICチップ)4と圧電振動板を
気密封止するキャップ3とからなる。The surface mount type crystal oscillator comprises a base 2, a piezoelectric vibrating plate 1 mounted on the surface of the base, a circuit element (IC chip) 4 housed in a concave portion on the back surface of the base, and a cap for hermetically sealing the piezoelectric vibrating plate. 3
【0011】圧電振動板である水晶振動板1はATカッ
ト水晶板を矩形状に形成してなり、厚みすべり振動を行
わしめるようその表裏面の中央部分に励振電極11,1
2(裏面の12については図示せず)が形成されてい
る。これら励振電極11,12からは、水晶振動板の長
手方向一方端に引出電極11a,12a(裏面の12a
については図示せず)が導出されている。A quartz vibrating plate 1 which is a piezoelectric vibrating plate is formed by forming an AT-cut quartz plate into a rectangular shape, and excitation electrodes 11, 1 are provided at central portions on the front and rear surfaces thereof so as to perform thickness-shear vibration.
2 (the back surface 12 is not shown) is formed. From these excitation electrodes 11 and 12, extraction electrodes 11a and 12a (12a on the back surface)
Is not shown).
【0012】ベース2はセラミックスを積層形成してな
り、その内部に必要な電極配線が施され、その一部が後
述する保持電極として露出するとともに、側面並びに裏
面にも引き出されている。このベースの上部には水晶振
動板を搭載する保持電極21,22,23が形成され、
保持電極21,22を通じて、水晶振動板に駆動信号が
入力される。なお、保持電極23は水晶振動板の他端を
補助的に支持する電極であり、電気的接合を行わなくて
もよい。また、このベースの側面には切り欠き(キャス
タレーション)2a,2b,2c,2dが設けられ、こ
れら各切り欠き内に外部導出電極24,25,26,2
7が引き出されている。これら外部導出電極は前記保持
電極や後述のICチップと接続される電極パッドと適宜
内部配線により接続されている。The base 2 is formed by laminating ceramics, and necessary electrode wirings are provided therein. A part of the base 2 is exposed as a holding electrode to be described later, and the base 2 is also extended to the side surface and the back surface. On the upper part of the base, holding electrodes 21, 22, 23 on which a quartz vibrating plate is mounted are formed.
A drive signal is input to the quartz plate via the holding electrodes 21 and 22. Note that the holding electrode 23 is an electrode that supports the other end of the quartz vibrating plate in an auxiliary manner, and does not need to be electrically connected. Cutouts (castellations) 2a, 2b, 2c, 2d are provided on the side surfaces of the base, and external lead-out electrodes 24, 25, 26, 2 are provided in these cutouts.
7 has been pulled out. These external lead-out electrodes are connected to electrode pads connected to the holding electrodes and an IC chip described later by appropriate internal wiring.
【0013】切り欠き2b、2dはベースの上下に貫通
して形成されており、ここに形成される外部導出電極は
アース電極25、27となる。当該アース電極25,2
7はベースの上面にも引き出され、アース接続電極25
a,27aを形成している。また切り欠き2a,2cは
ベースの下方側のみに形成され、当該切り欠きに形成さ
れる外部導出電極は駆動電極24,26となる。なお、
当該切り欠きおよびアース電極はベースの角側面に形成
してもよいし、切り欠きを形成せずにアース電極のみを
ベース側面に延出する構成であってもよい。The cutouts 2b and 2d are formed to penetrate the base up and down, and the external lead-out electrodes formed here become the ground electrodes 25 and 27. The ground electrode 25, 2
7 is also pulled out to the upper surface of the base, and the ground connection electrode 25
a, 27a. The cutouts 2a and 2c are formed only on the lower side of the base, and the external lead electrodes formed in the cutouts are the drive electrodes 24 and 26. In addition,
The notch and the ground electrode may be formed on the corner side surface of the base, or a configuration in which only the ground electrode extends to the base side surface without forming the notch.
【0014】ベースの裏面には板厚方向に開口した凹形
収納部Cが設けられ、この凹形収納部Cは上部収納部C
1と下部収納部C2とからなる。上部収納部C1には電
極パッドC11,C12,C13,C14が形成され、
この上部収納部C1の中央部分にさらに深いICチップ
搭載用の下部収納部C2が設けられている。回路素子で
あるICチップ4は発振回路並びに必要に応じて組み込
んだ温度補償回路を有しており、前記下部収納部25に
収納されている。ICチップ4はその電極パッド(明示
せず)と前記電極パッドC11,C12,C13,C1
4とをボンディングワイヤーWで接続される。なお、I
Cチップの接合は下部収納部に複数の微小電極パッドを
形成し、これら微小電極パッドにフリップチップ接合し
てもよい。On the back surface of the base, there is provided a concave storage section C which is opened in the plate thickness direction.
1 and a lower storage section C2. Electrode pads C11, C12, C13, C14 are formed in the upper storage section C1,
A lower storage section C2 for mounting a deeper IC chip is provided at a central portion of the upper storage section C1. The IC chip 4 as a circuit element has an oscillation circuit and a temperature compensation circuit incorporated as required, and is housed in the lower housing part 25. The IC chip 4 has its electrode pads (not shown) and the electrode pads C11, C12, C13, C1.
4 are connected by a bonding wire W. Note that I
For bonding of the C chip, a plurality of microelectrode pads may be formed in the lower housing portion, and flip chip bonding may be performed to these microelectrode pads.
【0015】なお、回路素子はICチップ1つのみでは
なく、コンデンサ等の他の回路素子を当該凹形収納部に
収納してもよい。Note that the circuit element is not limited to one IC chip, and other circuit elements such as a capacitor may be stored in the concave storage section.
【0016】キャップ3はセラミックスからなり、振動
空間を確保する逆凹部31を有する構成である。キャッ
プ3の表面には真空蒸着法あるいはメッキ法により、
金、銀、銅、ニッケル等の導電膜3aが被覆形成され、
当該導電膜3aは前記ベース上部に形成されたアース接
続電極25a,27aに導電接合されている。当該導電
接合はアース接続電極領域を含んで導電膜形成時を行っ
てもよいし、導電膜形成後当該導電膜とアース接続電極
とを導電接合材により接合してもよい。The cap 3 is made of ceramics and has an inverted concave portion 31 for securing a vibration space. The surface of the cap 3 is formed by a vacuum evaporation method or a plating method.
A conductive film 3a of gold, silver, copper, nickel or the like is coated and formed,
The conductive film 3a is conductively connected to the ground connection electrodes 25a and 27a formed on the base. The conductive bonding may be performed during formation of the conductive film including the ground connection electrode region, or the conductive film and the ground connection electrode may be bonded by a conductive bonding material after the conductive film is formed.
【0017】この表面実装型水晶発振器を製造するに
は、励振電極が形成された水晶振動板1をベースに設け
られた前記保持電極21,22,23に搭載し、導電接
合(導電性接合材の図示は省略している)を行う。その
後ベース表面の外周近傍に低融点ガラスGを配置し、こ
の低融点ガラスG上にキャップ3をその開口端部が位置
するように設置し、窒素ガス雰囲気中で400゜Cで約
2時間加熱し溶融接合を行う。これにより水晶振動板は
ベース上部にキャップ3にて気密的に封止される。な
お、ベースとキャップの接合は低融点ガラス等の封着用
ガラスに限定されるものではなく、気密性低下を許容で
きる場合はエポキシ樹脂等の絶縁性樹脂接合材を用いる
こともできる。In order to manufacture this surface-mount type crystal oscillator, the crystal vibrating plate 1 on which the excitation electrode is formed is mounted on the holding electrodes 21, 22, 23 provided on the base, and the conductive bonding (conductive bonding material) is performed. Are not shown). Thereafter, a low-melting glass G is placed near the outer periphery of the base surface, and the cap 3 is placed on the low-melting glass G so that the opening end thereof is located, and heated at 400 ° C. for about 2 hours in a nitrogen gas atmosphere. And perform fusion joining. As a result, the quartz vibrating plate is hermetically sealed with the cap 3 above the base. Note that the joining of the base and the cap is not limited to sealing glass such as low-melting glass, and an insulating resin joining material such as an epoxy resin can also be used if a decrease in airtightness can be tolerated.
【0018】そして、気密封止された状態の水晶振動板
の特性を評価確認し、当該特性に対応したICチップを
選択するか、あるいは当該特性に対応したデータをIC
チップに書き込むことにより、必要な特性を有する水晶
発振器を得る。そして樹脂材5を凹形収納部に充填する
ことにより、ICチップ等が埋設処理される。その後、
キャップ3とベースに形成されたアース接続電極に対し
て、真空蒸着法により導電膜Cを形成し、キャップ3表
面の導電膜を最終的にアース電極に接続する。以上によ
り、表面実装型圧電振動子の完成となる。Then, the characteristics of the quartz plate in a hermetically sealed state are evaluated and confirmed, and an IC chip corresponding to the characteristics is selected, or data corresponding to the characteristics is stored in an IC.
By writing to the chip, a crystal oscillator having the required characteristics is obtained. Then, by filling the resin material 5 into the concave storage portion, the IC chip or the like is embedded. afterwards,
A conductive film C is formed on the cap 3 and the ground connection electrode formed on the base by a vacuum evaporation method, and the conductive film on the surface of the cap 3 is finally connected to the ground electrode. Thus, the surface-mount type piezoelectric vibrator is completed.
【0019】本発明は、上記実施例に限定されるもので
はなく、他の回路構成による発振器(例えば温度補償型
電圧制御水晶発振器)の場合等にも適用することができ
る。The present invention is not limited to the above embodiment, but can be applied to an oscillator having another circuit configuration (for example, a temperature-compensated voltage-controlled crystal oscillator).
【0020】[0020]
【発明の効果】本発明によれば、パッケージの内部にお
いては保持電極に圧電振動板を搭載し、ここで用いる導
電接合材が流出し、キャップ側に到達したとしてもキャ
ップ並びに接合材が絶縁性であるために、短絡事故が生
じない。またキャップ外側においては導電膜が形成さ
れ、これがアース接続電極に接続されているので、電磁
シールド機能を発揮させることができる。よって、パッ
ケージ内での短絡事故を防ぎ、また特性劣化が少なく電
気的特性の安定した圧電発振器を安価に得ることができ
る。According to the present invention, the piezoelectric vibrating plate is mounted on the holding electrode inside the package, and the conductive bonding material used here flows out and even if it reaches the cap side, the cap and the bonding material are insulative. Therefore, a short circuit accident does not occur. In addition, since a conductive film is formed outside the cap and is connected to the ground connection electrode, an electromagnetic shielding function can be exhibited. Therefore, it is possible to prevent a short circuit accident in the package, and to obtain a piezoelectric oscillator with less characteristic deterioration and stable electric characteristics at low cost.
【図1】本発明による表面実装型圧電発振器の第1の実
施例を示す分解斜視図。FIG. 1 is an exploded perspective view showing a first embodiment of a surface-mount type piezoelectric oscillator according to the present invention.
【図2】図1においてキャップにて気密封止した場合の
裏面斜視図FIG. 2 is a rear perspective view of FIG. 1 when hermetically sealed with a cap.
【図3】図1においてキャップにて気密封止し、樹脂材
を充填した状態のA−A断面図FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1 in a state of being hermetically sealed with a cap and filled with a resin material.
1 圧電振動板(水晶振動板) 2 ベース 24,25,26,27 外部導出電極(アース電極、
駆動電極) 3 キャップ 4 ICチップ 5 樹脂材 C 凹部収納部1 piezoelectric vibrating plate (quartz vibrating plate) 2 base 24, 25, 26, 27 external lead-out electrodes (earth electrode,
Drive electrode) 3 Cap 4 IC chip 5 Resin material C Concave section
Claims (1)
の保持電極を有するとともに、裏面に凹形収納部を有
し、かつ内部配線により適宜電極が引き出されたベース
と、前記保持電極に搭載される励振電極が形成された圧
電振動板と、前記凹形収納部に収納され必要な接続が行
われる回路部品と、ベースの表面の外周近傍に接合材に
より接合され、前記圧電振動板を気密封止するキャップ
とからなる圧電発振器であって、 前記キャップとこれをベースに接合する接合材は絶縁性
であり、かつ前記キャップの外表面のほぼ全面に導電膜
が形成され、当該導電膜がベースに形成されたアース接
続電極に接続されていることを特徴とする表面実装型圧
電発振器。1. A base having a substantially flat surface, a plurality of holding electrodes on the front surface, a concave storage portion on the back surface, and electrodes from which electrodes are appropriately drawn out by internal wiring, and the holding electrode. A piezoelectric vibrating plate on which an excitation electrode is formed, a circuit component housed in the concave housing portion and connected to the piezoelectric vibrating plate, and a bonding material which is joined to a vicinity of an outer periphery of a surface of the base by a joining material; A cap that hermetically seals the cap, wherein the cap and a bonding material for bonding the cap to the base are insulative, and a conductive film is formed on substantially the entire outer surface of the cap. A surface-mounted piezoelectric oscillator, wherein the film is connected to a ground connection electrode formed on a base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001012716A JP2002217645A (en) | 2001-01-22 | 2001-01-22 | Surface mounting piezoelectric oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001012716A JP2002217645A (en) | 2001-01-22 | 2001-01-22 | Surface mounting piezoelectric oscillator |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002217645A true JP2002217645A (en) | 2002-08-02 |
Family
ID=18879685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001012716A Pending JP2002217645A (en) | 2001-01-22 | 2001-01-22 | Surface mounting piezoelectric oscillator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002217645A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006086664A (en) * | 2004-09-15 | 2006-03-30 | Nec Corp | Crystal vibrator, crystal oscillator, and assembling method for them, and mobile communication terminal |
JP2011160115A (en) * | 2010-01-29 | 2011-08-18 | Daishinku Corp | Piezoelectric vibration device |
JP2012142683A (en) * | 2010-12-28 | 2012-07-26 | Kyocera Crystal Device Corp | Piezoelectric device |
JP2013026919A (en) * | 2011-07-22 | 2013-02-04 | Seiko Instruments Inc | Method of manufacturing electronic device package, electronic device package, and oscillator |
US8749123B2 (en) | 2010-03-29 | 2014-06-10 | Kyocera Kinseki Corporation | Piezoelectric device |
-
2001
- 2001-01-22 JP JP2001012716A patent/JP2002217645A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006086664A (en) * | 2004-09-15 | 2006-03-30 | Nec Corp | Crystal vibrator, crystal oscillator, and assembling method for them, and mobile communication terminal |
JP2011160115A (en) * | 2010-01-29 | 2011-08-18 | Daishinku Corp | Piezoelectric vibration device |
US8749123B2 (en) | 2010-03-29 | 2014-06-10 | Kyocera Kinseki Corporation | Piezoelectric device |
JP2012142683A (en) * | 2010-12-28 | 2012-07-26 | Kyocera Crystal Device Corp | Piezoelectric device |
JP2013026919A (en) * | 2011-07-22 | 2013-02-04 | Seiko Instruments Inc | Method of manufacturing electronic device package, electronic device package, and oscillator |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4545004B2 (en) | Piezoelectric oscillator | |
US11342899B2 (en) | Crystal resonator device | |
JP2006279872A (en) | Piezoelectric vibrator, manufacturing method therefor, and manufacturing method of piezoelectric oscillator using the piezoelectric vibrator | |
US11362641B2 (en) | Piezoelectric resonator device | |
JP4204873B2 (en) | Method for manufacturing piezoelectric oscillator | |
JP2007060593A (en) | Piezoelectric device and manufacturing method thereof | |
JP2005244639A (en) | Temperature compensated crystal oscillator | |
JP4724518B2 (en) | Piezoelectric oscillator | |
JP2002217645A (en) | Surface mounting piezoelectric oscillator | |
JP2002026679A (en) | Package for piezoelectric vibration device | |
JP3501516B2 (en) | Surface mount type piezoelectric oscillator and method of manufacturing the same | |
JP3101996B2 (en) | Surface mount type piezoelectric oscillator | |
JP2007142947A (en) | Surface-mounting piezoelectric oscillator | |
JP2003273690A (en) | Piezoelectric vibration device | |
JP2005253007A (en) | Temperature compensated crystal oscillator | |
JP2007067832A (en) | Piezoelectric oscillator and manufacturing method thereof | |
JP2006101241A (en) | Piezoelectric oscillator and manufacturing method thereof | |
JP4336213B2 (en) | Piezoelectric oscillator | |
JP4833716B2 (en) | Piezoelectric oscillator | |
JP2004056269A (en) | Piezoelectric oscillator | |
JP2002261548A (en) | Piezoelectric device | |
JP2001094380A (en) | Package for piezoelectric oscillation device | |
JP2004297208A (en) | Surface mount type piezoelectric vibrator | |
JP2004356911A (en) | Surface mount type piezoelectric oscillator | |
JP2003110363A (en) | Crystal oscillator and manufacturing method of crystal oscillator |