JP2002217354A5 - - Google Patents
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- Publication number
- JP2002217354A5 JP2002217354A5 JP2001006917A JP2001006917A JP2002217354A5 JP 2002217354 A5 JP2002217354 A5 JP 2002217354A5 JP 2001006917 A JP2001006917 A JP 2001006917A JP 2001006917 A JP2001006917 A JP 2001006917A JP 2002217354 A5 JP2002217354 A5 JP 2002217354A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001006917A JP2002217354A (en) | 2001-01-15 | 2001-01-15 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001006917A JP2002217354A (en) | 2001-01-15 | 2001-01-15 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002217354A JP2002217354A (en) | 2002-08-02 |
| JP2002217354A5 true JP2002217354A5 (en) | 2007-03-08 |
Family
ID=18874741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001006917A Pending JP2002217354A (en) | 2001-01-15 | 2001-01-15 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002217354A (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101166575B1 (en) | 2002-09-17 | 2012-07-18 | 스태츠 칩팩, 엘티디. | Semiconductor multi-package module having wire bond interconnection between stacked packages |
| US7064426B2 (en) | 2002-09-17 | 2006-06-20 | Chippac, Inc. | Semiconductor multi-package module having wire bond interconnect between stacked packages |
| JP4615189B2 (en) * | 2003-01-29 | 2011-01-19 | シャープ株式会社 | Semiconductor device and interposer chip |
| JP2006186053A (en) * | 2004-12-27 | 2006-07-13 | Shinko Electric Ind Co Ltd | Laminated semiconductor device |
| JP5092284B2 (en) * | 2006-05-31 | 2012-12-05 | 凸版印刷株式会社 | TOC structure for bonding IC chips |
| KR100800149B1 (en) * | 2006-06-30 | 2008-02-01 | 주식회사 하이닉스반도체 | Stack package |
| JP2008091396A (en) * | 2006-09-29 | 2008-04-17 | Sanyo Electric Co Ltd | Semiconductor module and semiconductor device |
| JP2007214582A (en) * | 2007-03-29 | 2007-08-23 | Sharp Corp | Semiconductor device and interposer chip |
| JP2007180587A (en) * | 2007-03-29 | 2007-07-12 | Sharp Corp | Semiconductor device |
| JP5166903B2 (en) * | 2008-02-08 | 2013-03-21 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| JP4536808B2 (en) * | 2008-09-08 | 2010-09-01 | シャープ株式会社 | Semiconductor device and interposer chip |
| JP5099714B2 (en) * | 2009-04-27 | 2012-12-19 | ルネサスエレクトロニクス株式会社 | Multi-chip module |
| KR20110137926A (en) * | 2010-06-18 | 2011-12-26 | (주)에프씨아이 | Stacked multi chip package structure |
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2001
- 2001-01-15 JP JP2001006917A patent/JP2002217354A/en active Pending