JP2002190457A - Method for manufacturing and handling element having directivity - Google Patents
Method for manufacturing and handling element having directivityInfo
- Publication number
- JP2002190457A JP2002190457A JP2000386800A JP2000386800A JP2002190457A JP 2002190457 A JP2002190457 A JP 2002190457A JP 2000386800 A JP2000386800 A JP 2000386800A JP 2000386800 A JP2000386800 A JP 2000386800A JP 2002190457 A JP2002190457 A JP 2002190457A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- elements
- attached
- substrate
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 46
- 230000001070 adhesive effect Effects 0.000 claims abstract description 46
- 238000005520 cutting process Methods 0.000 claims abstract description 22
- 238000010008 shearing Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 45
- 230000010287 polarization Effects 0.000 claims description 18
- 206010040844 Skin exfoliation Diseases 0.000 claims description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000013067 intermediate product Substances 0.000 description 8
- 238000005336 cracking Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 206010061876 Obstruction Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、粘着シートに貼り
付けた複数枚の基板から多数の素子を切り出し、各素子
を粘着シートに貼り付けた状態のまま、方向性を保持し
た状態で取り扱えるようにする方向性を有する素子の作
製・取扱方法に関するものである。この技術は、例えば
数mm角以下の微小な剪断型圧電素子の製造などに有用で
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting out a large number of elements from a plurality of substrates attached to an adhesive sheet and handling each element in a state where the elements are attached to the adhesive sheet while maintaining the directivity. The present invention relates to a method of manufacturing and handling an element having a direction of: This technique is useful, for example, for manufacturing a micro-shear type piezoelectric element of several mm square or less.
【０００２】[0002]
【従来の技術】圧電セラミックスを用いた素子には様々
な構造のものがあるが、その一つとして面に沿って滑り
振動する剪断型圧電素子がある。これは、素子の分極方
向と両方の駆動電極又は検知電極を結ぶ方向（電界を印
加する方向又は電界を検出する方向）が直交する構造で
ある。この種の剪断型圧電素子を模式的に図５に示す。
圧電体１０は矢印方向の分極処理が施されており、その
上下面全体に電極１２が形成されている。電極間に電圧
Ｅを印加すると、圧電体１０は点線で示すように剪断歪
みが生じる。逆に分極方向に外力が加わって点線に示す
ような剪断歪みが生じると、上下両面の電極間に電圧が
発生する。2. Description of the Related Art There are various types of devices using piezoelectric ceramics. One of them is a shearing type piezoelectric device which slides and vibrates along a surface. This is a structure in which the polarization direction of the element is orthogonal to the direction connecting the two drive electrodes or the detection electrodes (the direction in which an electric field is applied or the direction in which the electric field is detected). FIG. 5 schematically shows this type of shear type piezoelectric element.
The piezoelectric body 10 is polarized in the direction of the arrow, and electrodes 12 are formed on the entire upper and lower surfaces. When a voltage E is applied between the electrodes, a shear strain is generated in the piezoelectric body 10 as shown by a dotted line. Conversely, when an external force is applied in the polarization direction to generate a shear strain as shown by a dotted line, a voltage is generated between the upper and lower electrodes.
【０００３】このような構造の剪断型圧電素子は、近
年、微動機構のアクチュエータや衝撃検出用のセンサ等
のデバイスに利用されている。例えば微動機構のアクチ
ュエータでは、変位拡大機構に一対の剪断型圧電素子を
分極の向きが逆向きとなるように貼り付ける構成があ
り、衝撃検出用のセンサでは、２個の剪断型圧電素子を
それらの分極方向が検出方向に応じて直交方向に（Ｘ方
向とＹ方向を向くように）設けられている。つまり、こ
のような剪断型圧電素子では、分極処理による方向性が
あり、その分極方向が予め決められている適正な向きと
なるようにデバイスに組み込む必要があり、そうしなけ
れば所望の特性は得られない。[0003] In recent years, the shear-type piezoelectric element having such a structure is used for devices such as an actuator of a fine movement mechanism and a sensor for detecting an impact. For example, in an actuator of a fine movement mechanism, there is a configuration in which a pair of shear-type piezoelectric elements are attached to a displacement enlarging mechanism so that the directions of polarization are opposite to each other. Are provided in a direction orthogonal to the detection direction (to face the X direction and the Y direction). In other words, such a shear-type piezoelectric element has directionality due to polarization processing, and it is necessary to incorporate the shearing type piezoelectric element into a device so that the polarization direction is a predetermined appropriate direction. I can't get it.
【０００４】[0004]
【発明が解決しようとする課題】このような剪断型圧電
素子では、素子形状を長方形板状にしておけば、長辺と
短辺とによって分極方向は判別できる。しかし、分極の
向き（どちらの側を正極に、どちらの側を負極に分極処
理したか）までは外観からでは判別できない。そこで、
従来技術としては、分極の向きを示すために、筆記具あ
るいは先端が鋭利な治具などでマークを付すことが行わ
れている。しかし、小さな素子１個１個について、その
分極の向きを示す微小なマークを付ける作業は、極めて
煩瑣であり効率が悪い。上下面を全面電極とするのでは
なく、方向性が判別できるような電極パターンとするこ
とも提案されているが、電極面積が小さくなったり電極
面積にばらつきが生じる恐れがあるので、あまり好まし
くない。In such a shearing type piezoelectric element, if the element shape is rectangular, the direction of polarization can be determined from the long side and the short side. However, it is not possible to determine the direction of polarization (which side is the positive electrode and which side is the negative electrode) from the appearance. Therefore,
In the prior art, a mark is provided with a writing instrument or a jig having a sharp tip to indicate the direction of polarization. However, it is extremely complicated and inefficient to attach a minute mark indicating the direction of polarization for each small element. Instead of using the upper and lower surfaces as full-surface electrodes, it has been proposed to use an electrode pattern that allows discrimination of directionality. However, it is not preferable because the electrode area may be reduced or the electrode area may be varied. .
【０００５】通常、剪断型圧電素子は、分極処理を施し
た矩形板状の基板を縦横に切断することで１個１個の素
子に切り出し切断治具から分離するようにして作製す
る。このようにして１個１個に分離した素子を、実装用
のトレイに並べたり、テープリールに装着して、実装工
程へと搬送する。切断する前の基板の状態では、分極の
向きは一定である。しかし、切断してばらばらになり１
個１個の素子になると、分極の向きはランダムになり、
それを分極の向きを揃えてトレイに並べたり、テープリ
ールに装着する作業は、素子が微小であることも相俟っ
て、極めて作業性が悪い。Normally, a shearing type piezoelectric element is manufactured by cutting a rectangular plate-shaped substrate subjected to a polarization process vertically and horizontally so that the element is cut into individual elements and separated from a cutting jig. The elements thus separated one by one are arranged on a mounting tray or mounted on a tape reel and transported to a mounting step. In the state of the substrate before cutting, the direction of polarization is constant. However, it cuts apart and becomes 1
In the case of individual elements, the direction of polarization becomes random,
The work of arranging them on a tray with their polarization directions aligned or mounting them on a tape reel is extremely poor in workability due to the small size of the elements.
【０００６】本発明の目的は、方向性が揃ったままの状
態で切断し取り出すことができるように工夫した方向性
を有する素子の作製・取扱方法を提供することである。
本発明の他の目的は、１個１個に分離した後でも、方向
性が容易に判別できるような方向性を有する素子の作製
・取扱方法を提供することである。本発明の更に他の目
的は、輸送中に割れや欠け等が生じる恐れが無く、直接
実装可能な方向性を有する素子の作製・取扱方法を提供
することである。本発明の他の目的は、方向性を揃えて
実装用のトレイやテープリールなどに容易に詰めること
ができる方向性を有する素子の作製・取扱方法を提供す
ることである。SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing and handling an element having a directional characteristic so that the element can be cut and taken out while keeping the directional characteristic.
It is another object of the present invention to provide a method of manufacturing and handling an element having a direction so that the direction can be easily determined even after the elements are separated one by one. Still another object of the present invention is to provide a method of manufacturing and handling an element having directivity that can be directly mounted without the possibility of cracking or chipping during transportation. It is another object of the present invention to provide a method of manufacturing and handling a device having a direction that can be easily packed in a mounting tray or a tape reel with the same direction.
【０００７】[0007]
【課題を解決するための手段】本発明は、方向性を有す
る素子が実質的に多数縦横に配列されている基板を、複
数枚、縦横に整列配置した状態で粘着シートに貼り付け
ると共に切断用のフレーム状治具に取り付け、粘着シー
トの厚みの少なくとも一部分を残すように前記基板を縦
横に切断することにより個々の素子に切り分けると共
に、全ての素子が粘着シートによりフレーム状治具と一
体的に保持されるようにした方向性を有する素子の作製
方法である。SUMMARY OF THE INVENTION The present invention is directed to a method for attaching a plurality of substrates having a large number of directional elements arranged vertically and horizontally to an adhesive sheet in a state of being arranged vertically and horizontally, and for cutting the substrates. Attached to a frame-shaped jig, and cut into individual elements by cutting the substrate vertically and horizontally so as to leave at least a part of the thickness of the adhesive sheet, and all the elements are integrally formed with the frame-shaped jig by the adhesive sheet. This is a method for manufacturing an element having directionality to be held.
【０００８】また本発明は、方向性を有する素子が実質
的に多数縦横に配列されている基板を、複数枚、縦横に
整列配置した状態で粘着シートに貼り付けると共に切断
用のフレーム状治具に取り付け、各基板の各素子毎に方
向性を表示するマーキングを施し、粘着シートの厚みの
少なくとも一部分を残すように前記基板を縦横に切断す
ることにより個々の素子に切り分けると共に、全ての素
子が粘着シートによりフレーム状治具と一体的に保持さ
れるようにした方向性を有する素子の作製方法である。Further, the present invention provides a frame-shaped jig for attaching and cutting a plurality of substrates, each of which has a large number of directional elements arranged vertically and horizontally, to an adhesive sheet in a state of being arranged vertically and horizontally. Attached to, to give a marking indicating the direction of each element of each substrate, and cut the substrate vertically and horizontally to leave at least a part of the thickness of the adhesive sheet, and cut into individual elements, all the elements are This is a method for manufacturing an element having directionality so as to be held integrally with a frame-shaped jig by an adhesive sheet.
【０００９】基板の切断は、ダイシング装置により、複
数枚の基板にわたって共通に縦横に切断することで行う
のが望ましい。方向性を有する素子の代表的な例として
は、圧電体基板を面内の一方向に分極処理し、上下全面
に電極を形成した剪断型圧電素子がある。その他、イン
ダクタやフィルタなど方向性のある素子の作製・取り扱
いなどにも本発明は適用できる。It is desirable that the substrate is cut by using a dicing apparatus to cut the substrate in a vertical and horizontal manner across a plurality of substrates. A typical example of a directional element is a shear-type piezoelectric element in which a piezoelectric substrate is polarized in one direction in a plane and electrodes are formed on the entire upper and lower surfaces. In addition, the present invention can be applied to the manufacture and handling of directional elements such as inductors and filters.
【００１０】マーキング方法としてはインクジェットプ
リンタを用いる方法が最適である。インクジェットノズ
ルから各素子の表面の一方の端部寄りの位置にインクを
噴射して付着乾燥させることでマーキングを施し、その
マークの位置によって方向性を判別可能とする。このマ
ークは目視可能であれば小さなドットなどでよい。その
他、スクリーン印刷法なども使用可能である。The most suitable marking method is a method using an ink jet printer. Marking is performed by ejecting ink from an ink jet nozzle to a position near one end of the surface of each element and adhering and drying the ink. This mark may be a small dot if it is visible. In addition, a screen printing method or the like can be used.
【００１１】このような方法によって作製した中間製品
（多数の素子が切断されたまま粘着シートに貼り付けら
れている状態でフレーム状治具に取り付けられているも
の）は、フレーム状治具ごとケースに収容して輸送す
る。これによって輸送中に割れや欠けが生じるのを防ぐ
ことができる。素子実装工程においては、粘着シートに
易剥離化処理を施した後、個々の素子を剥離・吸着して
粘着シートから分離することで、予め決められている向
きで、デバイスの所定の位置に直接実装することができ
る。[0011] The intermediate product produced by such a method (the one in which a large number of elements are cut and attached to a frame-shaped jig in a state of being attached to an adhesive sheet) is a case together with the frame-shaped jig. Housed and transported. This can prevent cracking and chipping during transportation. In the element mounting process, after the adhesive sheet is subjected to an easy-peeling treatment, the individual elements are peeled and adsorbed and separated from the adhesive sheet, so that the individual elements are directly placed at predetermined positions on the device in a predetermined direction. Can be implemented.
【００１２】また、上記のような方法によって作製した
中間製品は、粘着シートに易剥離化処理を施した後、個
々の素子を剥離・吸着して粘着シートから分離すること
で、容易に予め決められている向きで、トレイもしくは
テープリールなどの梱包材に充填することができる。従
って、トレイもしくはテープリールなどの梱包材から素
子を取り出し実装する装置を装備している工程への適用
も容易となる。The intermediate product produced by the above-mentioned method can be easily determined in advance by subjecting the adhesive sheet to an easy-peeling treatment and then separating and adsorbing the individual elements from the adhesive sheet. In a predetermined orientation in a packing material such as a tray or a tape reel. Therefore, the present invention can be easily applied to a process in which a device for taking out and mounting elements from a packing material such as a tray or a tape reel is provided.
【００１３】[0013]
【実施例】図１は本発明に係る方向性を有する素子の作
製方法の一実施例を示す説明図である。この例は、方向
性を有する素子が剪断型圧電素子の場合である。即ち、
基板２０は、矩形板状の圧電体２２の面内の一方向に高
電圧を印加することにより分極処理し、その上下全面に
電極２４を形成したものである。電極２４は、例えば金
などの導電材料を蒸着法やスパッタ法などで成膜したも
のである。従って、基板２０は、分極の方向に起因する
方向性をもつ。この基板２０を縦横に切断することで剪
断型圧電素子が得られる。言い換えれば、明確な区画が
形成されているわけではないが、このような基板２０中
には、実質的に多数の剪断型圧電素子（方向性を有する
素子）が縦横に規則的に配列されているということにな
る。FIG. 1 is an explanatory view showing one embodiment of a method for manufacturing a directional element according to the present invention. In this example, the directional element is a shear-type piezoelectric element. That is,
The substrate 20 is formed by applying a high voltage in one direction in the plane of a rectangular plate-shaped piezoelectric body 22 to perform a polarization process, and forming electrodes 24 on the entire upper and lower surfaces thereof. The electrode 24 is formed by depositing a conductive material such as gold by a vapor deposition method or a sputtering method. Therefore, the substrate 20 has directionality caused by the direction of polarization. By cutting the substrate 20 vertically and horizontally, a shear-type piezoelectric element is obtained. In other words, although a clear section is not formed, a large number of shear-type piezoelectric elements (directional elements) are regularly and vertically arranged in such a substrate 20. It means that there is.
【００１４】基板２０は、例えば２０mm×１０mmという
ような矩形状であり、ここでは短辺方向に平行な向きに
分極処理されている（分極方向を矢印で示す）。負極の
側を明示するために基板の一角を切除している。このよ
うにな薄板状の基板２０を、複数枚、縦横に整列配置し
た状態で粘着シート２６に貼り付けると共に、切断用の
フレーム状治具２８に取り付ける。The substrate 20 has a rectangular shape of, for example, 20 mm × 10 mm, and is polarized in a direction parallel to the short side direction (the polarization direction is indicated by an arrow). One corner of the substrate is cut away to clearly show the side of the negative electrode. A plurality of such thin plate-shaped substrates 20 are attached to the adhesive sheet 26 in a state of being arranged in a matrix, and are attached to a frame-shaped jig 28 for cutting.
【００１５】この作業には、図示するのを省略するが、
配列用の治具を使用すればよい。配列用の治具は、各基
板が収まるような浅い凹部を縦横に規則的に配列形成し
たものであり、外側に位置決め用の２本のピンが立てら
れているものである。この各凹部内に基板を同じ向き
（切り欠いた角部が同じ方向）となるように嵌め込む。
そして、切断用のフレーム状治具２８を、両方のピンに
合わせて装着する。切断用のフレーム状治具２８には２
箇所の切欠き３０があり、それぞれの切欠き３０に前記
ピン３２を嵌め込むことで位置合わせが可能となる。Although illustration is omitted in this work,
An arrangement jig may be used. The arrangement jig is one in which shallow recesses for accommodating each substrate are regularly arranged vertically and horizontally, and two positioning pins are set up on the outside. The substrate is fitted into each of the recesses so as to be in the same direction (the notched corners are in the same direction).
Then, a frame jig 28 for cutting is mounted in accordance with both pins. 2 is used for the frame-shaped jig 28 for cutting.
There is a notch 30 at a location, and the positioning can be performed by fitting the pin 32 into each notch 30.
【００１６】その状態で、配列用の治具上に粘着シート
を被せて、該粘着シートに各基板を写し取るような方式
で全ての基板２０を貼り付ける。また、同時に、フレー
ム状治具２８も一緒に粘着シート２６に貼り付けること
で、フレーム状治具２８と多数枚の基板２０を一体化す
る。そして、配列用の治具から取り外す。その状態が図
１のＡである。位置決め用のピンも参考のために同時に
描いている。In this state, an adhesive sheet is put on a jig for arrangement, and all the substrates 20 are attached to the adhesive sheet in such a manner that each substrate is copied. At the same time, the frame-shaped jig 28 and the large number of substrates 20 are integrated by pasting the frame-shaped jig 28 onto the adhesive sheet 26 together. Then, it is removed from the arrangement jig. That state is A in FIG. Pins for positioning are also drawn for reference.
【００１７】次に、各基板２０の各素子毎に、方向性を
表示するマーキングを施す（図１のＢ参照）。ここで
は、インクジェットプリンタを用いて、各素子の形成領
域の一方の端部寄りの位置に、インクジェットノズルか
らインクを噴射して付着乾燥することでマーキングして
いる。インクジェットプリンタへの設定も、位置決め用
のピンを基準として行う。マークは極く簡単なドット
（点状）マーク３４で十分である。このドットマーク３
４の位置によって、切断後でも方向性が判別可能とな
る。Next, a marking for indicating the direction is provided for each element of each substrate 20 (see FIG. 1B). Here, marking is performed by ejecting ink from an inkjet nozzle and adhering and drying the ink at a position near one end of the formation region of each element using an inkjet printer. The setting for the ink jet printer is also performed based on the positioning pins. A very simple dot (dot) mark 34 is sufficient as the mark. This dot mark 3
The position 4 allows the directionality to be determined even after cutting.
【００１８】この実施例では分極の負極側にマーキング
を施している。インクジェットプリンタによるマーキン
グは、細かい制御が可能なことと基板から離れた位置か
らインクを噴射できる点で、正確に且つ基板に応力など
を与えることなく実施できる利点があるために特に有効
である。しかも、インクによるマーキングは、ペイント
などと異なり、極めて薄い膜になるので、実装時に障害
となる恐れもない。In this embodiment, a marking is provided on the negative electrode side of the polarization. Marking by an ink jet printer is particularly effective because it has an advantage that it can be performed accurately and without applying stress to the substrate, since fine control is possible and ink can be ejected from a position away from the substrate. In addition, since marking with ink is an extremely thin film, unlike paint and the like, there is no risk of obstruction during mounting.
【００１９】そして、位置決め用ピンを基準として切断
用のフレーム状治具を設置し、ダイシング装置により、
粘着シートの厚みの少なくとも一部分を残すように前記
基板２０を切断し、個々の剪断型圧電素子３６に切り分
ける（図１のＣ参照：細線は切断線を表示している）。
ここでは、複数枚の基板にわたって共通に縦横に切断
し、各基板を４行１２列の合計４８個の素子に切り分け
ている。個々の素子は、粘着シートによって一体的に保
持されたままの状態を維持する。これは、ダイヤモンド
カッタによる切り込み量を基板の厚み＋α（αは粘着シ
ート厚よりもはるかに小さな値）に調整することによっ
て達成できる。Then, a frame-like jig for cutting is set with reference to the positioning pins, and
The substrate 20 is cut so as to leave at least a part of the thickness of the adhesive sheet, and cut into individual shear-type piezoelectric elements 36 (see FIG. 1C: thin lines indicate cutting lines).
Here, a plurality of substrates are cut vertically and horizontally in common, and each substrate is divided into a total of 48 elements in 4 rows and 12 columns. The individual elements maintain a state of being integrally held by the adhesive sheet. This can be achieved by adjusting the cut amount by the diamond cutter to the thickness of the substrate + α (α is a value much smaller than the thickness of the adhesive sheet).
【００２０】従って、各剪断型圧電素子３６は、基板配
列時の方向性がそのままの状態で保たれていることにな
る。その状態を図２に示す。この状態では、１個１個の
剪断型圧電素子３６が粘着シート２６に貼り付けられ固
定されているために、フレーム状治具２８で掴んで取り
扱うことができ、また全体を洗浄液に浸漬して一度に洗
浄することができる。例えば超音波洗浄を行うことによ
り、切断面に詰まっていたり、粘着シートに付着してい
る切り屑、あるいは粘着剤の繊維状あるいはかたまり状
のもの等を除去することができる。Therefore, each shearing type piezoelectric element 36 maintains its directivity when arranging the substrates. The state is shown in FIG. In this state, since each of the shearing type piezoelectric elements 36 is attached and fixed to the adhesive sheet 26, it can be gripped and handled by the frame-shaped jig 28, and the whole is immersed in the cleaning liquid. Can be washed at once. For example, by performing ultrasonic cleaning, chips clogging the cut surface, chips attached to the adhesive sheet, or fibrous or lump-like adhesives can be removed.
【００２１】粘着シートとしては、例えばポリエステル
系の樹脂シートにＵＶ（紫外線）系の粘着剤を塗布した
ものなどが好適である。これは、シート面に紫外線を照
射することで、各素子は粘着シートから剥がれやすくな
る（易剥離化する）ため、その後の素子の取り扱いは容
易となる。As the pressure-sensitive adhesive sheet, for example, a sheet obtained by applying a UV (ultraviolet) pressure-sensitive adhesive to a polyester resin sheet is suitable. This is because, by irradiating the sheet surface with ultraviolet rays, each element is easily peeled off (adhesion is easily performed), so that the subsequent handling of the element becomes easy.
【００２２】上記のような方法によって作製した図２に
示すような中間製品４０（多数の素子が切断されたまま
粘着シートに貼り付けられている状態でフレーム状治具
に取り付けられているもの）は、通常、図３のＡに示す
ように、素子群の上面を保護シート４２で覆うのが好ま
しい。これによってゴミや埃などの異物が付着するのを
防止することができる。中間製品４０の製造工程と個々
の素子の実装工程が遠く離れているような場合には、図
３のＢに示すように、フレーム状治具２８ごとケース４
４に収容して輸送すると、各剪断型圧電素子３６は粘着
シート２６に貼り付けられ固定されているている状態で
運ばれるために、輸送途中で多少の衝撃などが加わって
も割れや欠けなどが発生する恐れはない。Intermediate product 40 as shown in FIG. 2 manufactured by the above-described method (a large number of elements are cut and attached to a frame-shaped jig in a state of being attached to an adhesive sheet). In general, it is preferable to cover the upper surface of the element group with a protective sheet 42 as shown in FIG. Thus, it is possible to prevent foreign substances such as dust and dirt from adhering. If the manufacturing process of the intermediate product 40 and the mounting process of the individual elements are far apart, as shown in FIG.
4 and transported, each shear-type piezoelectric element 36 is transported in a state of being stuck and fixed to the adhesive sheet 26, so that even if a slight impact or the like is applied during transportation, cracking or chipping occurs. There is no danger of occurrence.
【００２３】素子実装工程においては、中間製品４０を
ケース４４から取り出し、粘着シート２６に易剥離化処
理（例えば、下面から紫外線を照射する処理）を施した
後、図４に示すように、個々の剪断型圧電素子３６を剥
離・吸着して粘着シートから分離し、デバイスの所定の
位置に直接実装する。即ち、チップマウンタ等の吸着部
４６を剪断型圧電素子３６の上に位置させ、下からピン
４８で対応する剪断型圧電素子３６を突き上げて粘着シ
ート２６から剥がし、吸着部４６で掴んで１個ずつ移送
し、デバイスに自動組み込みすることができる。In the element mounting step, the intermediate product 40 is taken out of the case 44 and subjected to an easy peeling process (for example, a process of irradiating ultraviolet rays from the lower surface) to the adhesive sheet 26, and then, as shown in FIG. Of the shear-type piezoelectric element 36 is separated from the adhesive sheet by peeling and adsorbing, and directly mounted at a predetermined position of the device. That is, the suction portion 46 such as a chip mounter is positioned on the shearing type piezoelectric element 36, the corresponding shearing type piezoelectric element 36 is pushed up from below with a pin 48, peeled off from the adhesive sheet 26, and grasped by the suction portion 46 to form one piece. Can be transported one by one and automatically integrated into the device.
【００２４】このような実装設備を備えておらず、トレ
イやテープリールなどから素子を取り出して実装するよ
うな場合でも、図２に示すような中間製品（多数の素子
が切断されたまま粘着シートに貼り付けられている状態
でフレーム状治具に取り付けられているもの）につい
て、粘着シートに易剥離化処理を施した後、個々の素子
を剥離・吸着して粘着シートから分離し、実装用のトレ
イもしくはテープリールなどの梱包材に充填することも
可能である。中間製品では素子の方向性が一定であるの
で、一定の向きで自動的にトレイもしくはテープリール
などに容易に配列することができるからである。Even when the device is not provided with such mounting equipment and the device is taken out from a tray or a tape reel and mounted, an intermediate product as shown in FIG. After attaching to the frame jig in a state where it is attached to the adhesive sheet, the adhesive sheet is subjected to an easy-peeling treatment, and then the individual elements are separated and separated from the adhesive sheet by peeling and adsorbing. It is also possible to fill a packing material such as a tray or a tape reel. This is because, in an intermediate product, since the directionality of the elements is constant, the elements can be automatically arranged in a fixed direction on a tray or a tape reel easily.
【００２５】上記の実施例では、方向性を有する素子と
して剪断型圧電素子の例について説明したが、本発明は
フィルタやインダクタなど内部パターン等の関係で方向
性が生じる素子の作製・取扱などにも適用できる。In the above embodiment, the example of the shear type piezoelectric element has been described as the element having the directivity. However, the present invention is applicable to the production and handling of the element having the directivity due to the internal pattern such as a filter and an inductor. Can also be applied.
【００２６】各素子は粘着シートに貼り付けられている
状態では一定の方向に並んでいるために、そのまま直接
デバイスに組み込む場合には、方向性を表示するための
マーキングは必ずしも必要ないが、デバイス実装時にロ
ボットで方向を認識しながら作業できるし、デバイス実
装後の検査工程などを考慮すると、マーキングを施して
おいた方が好ましい。Since the elements are arranged in a certain direction when they are attached to the adhesive sheet, when they are directly incorporated into a device, markings for indicating the direction are not necessarily required. Work can be performed while recognizing the direction with a robot at the time of mounting, and it is preferable to perform marking in consideration of an inspection process after device mounting.
【００２７】[0027]
【発明の効果】本発明は上記のように、基板を縦横に整
列配置した状態で粘着シートに貼り付けて切断用のフレ
ーム状治具に取り付け、個々の素子に切り分けると共に
個々の素子が粘着シートで一体的に保持されるようにし
た素子作製方法であるから、方向性が容易に判別でき、
方向性が揃ったままの状態で切り分け取り出すことがで
きる。As described above, according to the present invention, the substrates are attached to an adhesive sheet in a state where they are arranged vertically and horizontally, attached to a frame-shaped jig for cutting, and cut into individual elements. Because it is an element manufacturing method that is held integrally, the directionality can be easily determined,
It can be cut out and taken out while the directionality remains the same.
【００２８】また本発明は、多数の素子が切断されたま
ま粘着シートに貼り付けられている状態でフレーム状治
具に取り付けられているものを、フレーム状治具ごとケ
ースに収容して輸送する取扱方法であるから、輸送中に
割れや欠け等が生じる恐れは無い。また、素子実装工程
において、粘着シートに易剥離化処理を施した後、個々
の素子を剥離・吸着して粘着シートから分離する取扱方
法であるから、直接デバイスなどに実装できるし、方向
性を揃えてトレイやテープリールなどに容易に詰めるこ
ともできる。Further, according to the present invention, a large number of elements attached to a frame-shaped jig while being cut and attached to an adhesive sheet are transported together with the frame-shaped jig in a case. Since it is a handling method, there is no possibility of cracking or chipping during transportation. Also, in the element mounting process, after the adhesive sheet is subjected to an easy-peeling treatment, the individual elements are peeled and adsorbed and separated from the adhesive sheet, so that they can be directly mounted on a device, etc. They can also be easily packed in trays or tape reels.
【図１】本発明に係る素子作製工程の一例を示す説明
図。FIG. 1 is an explanatory view showing an example of a device manufacturing process according to the present invention.
【図２】得られた中間製品の説明図。FIG. 2 is an explanatory view of the obtained intermediate product.
【図３】保護・梱包状態を示す説明図。FIG. 3 is an explanatory view showing a state of protection and packing.
【図４】素子の実装工程の説明図。FIG. 4 is an explanatory diagram of an element mounting process.
【図５】剪断型圧電素子の説明図。FIG. 5 is an explanatory diagram of a shear-type piezoelectric element.
２０ 基板 ２６ 粘着シート ２８ フレーム状治具 ３０ 切欠き ３２ ピン ３４ ドットマーク ３６ 剪断型圧電素子 Reference Signs List 20 substrate 26 adhesive sheet 28 frame-shaped jig 30 notch 32 pin 34 dot mark 36 shear-type piezoelectric element
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 21/78 Ｐ 41/08 Ｃ 41/22 Ｚ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 21/78 P 41/08 C 41/22 Z
Claims (8)
に配列されている基板を、複数枚、縦横に整列配置した
状態で粘着シートに貼り付けると共に切断用のフレーム
状治具に取り付け、粘着シートの厚みの少なくとも一部
分を残すように前記基板を縦横に切断することにより個
々の素子に切り分けると共に、全ての素子が粘着シート
によりフレーム状治具と一体的に保持されるようにした
ことを特徴とする方向性を有する素子の作製方法。1. A plurality of substrates having a large number of directional elements arranged vertically and horizontally are attached to an adhesive sheet in a state where they are arranged vertically and horizontally, and attached to a frame-shaped jig for cutting. The substrate is cut into individual elements by cutting the substrate vertically and horizontally so as to leave at least a part of the thickness of the adhesive sheet, and all the elements are integrally held with the frame-shaped jig by the adhesive sheet. A method for manufacturing an element having a characteristic directionality.
に配列されている基板を、複数枚、縦横に整列配置した
状態で粘着シートに貼り付けると共に切断用のフレーム
状治具に取り付け、各基板の各素子毎に方向性を表示す
るマーキングを施し、粘着シートの厚みの少なくとも一
部分を残すように前記基板を縦横に切断することにより
個々の素子に切り分けると共に、全ての素子が粘着シー
トによりフレーム状治具と一体的に保持されるようにし
たことを特徴とする方向性を有する素子の作製方法。2. A plurality of substrates each having a plurality of elements having directionality arranged vertically and horizontally are attached to an adhesive sheet in a state where they are arranged vertically and horizontally, and attached to a frame-shaped jig for cutting. A marking indicating the direction is given to each element of each substrate, and the substrate is cut into individual elements by cutting the substrate vertically and horizontally so as to leave at least a part of the thickness of the adhesive sheet, and all the elements are formed by the adhesive sheet. A method for manufacturing a directional element, wherein the element is held integrally with a frame-shaped jig.
わたって共通に縦横に切断する請求項１又は２記載の方
向性を有する素子の作製方法。3. The method for manufacturing a directional element according to claim 1, wherein the substrate is cut vertically and horizontally across a plurality of substrates by a dicing apparatus.
内の一方向に分極処理し、上下全面に電極を形成した剪
断型圧電素子である請求項１乃至３のいずれかに記載の
方向性を有する素子の作製方法。4. The shearing type piezoelectric element according to claim 1, wherein the directional element is a shearing type piezoelectric element in which a piezoelectric substrate is subjected to a polarization treatment in one direction in a plane and electrodes are formed on the entire upper and lower surfaces. Method for manufacturing element having directionality.
の一方の端部寄りの位置にインクを噴射して付着乾燥さ
せることでマーキングを施し、そのマークの位置によっ
て方向性を判別可能とした請求項１乃至４のいずれかに
記載の方向性を有する素子の作製方法。5. A marking is made by ejecting ink from an ink jet nozzle to a position near one end of the surface of each element and adhering and drying the ink, whereby the direction can be determined based on the position of the mark. 5. A method for manufacturing a device having directionality according to any one of items 4 to 4.
によって作製した、多数の素子が切断されたまま粘着シ
ートに貼り付けられている状態でフレーム状治具に取り
付けられているものを、フレーム状治具ごとケースに収
容して素子実装工程へ輸送することを特徴とする方向性
を有する素子の取扱方法。6. A method in which a large number of elements, which are produced by the method according to claim 1 and are attached to an adhesive sheet while being cut, are attached to a frame-shaped jig. A method for handling a directional element, wherein the element is housed in a case together with the frame-shaped jig and transported to an element mounting step.
剥離化処理を施した後、個々の素子を剥離・吸着して粘
着シートから分離し、デバイスの所定の位置に直接実装
する請求項６記載の方向性を有する素子の取扱方法。7. The device mounting step, wherein after the pressure-sensitive adhesive sheet is subjected to an easy-peeling treatment, the individual devices are separated and separated from the pressure-sensitive adhesive sheet by being peeled and adsorbed, and are directly mounted at predetermined positions of the device. How to handle elements with different directions.
によって作製した、多数の素子が切断されたまま粘着シ
ートに貼り付けられている状態でフレーム状治具に取り
付けられているものを、粘着シートに易剥離化処理を施
した後、個々の素子を剥離・吸着して粘着シートから分
離し、トレイもしくはテープリールなどの梱包材に充填
することを特徴とする方向性を有する素子の取扱方法。8. A method in which a large number of elements produced by the method according to claim 1 and attached to a frame-shaped jig while being cut and attached to an adhesive sheet. After subjecting the pressure-sensitive adhesive sheet to an easy-peeling treatment, the individual elements are peeled / adsorbed and separated from the pressure-sensitive adhesive sheet, and are filled in a packing material such as a tray or a tape reel. Handling method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000386800A JP2002190457A (en) | 2000-12-20 | 2000-12-20 | Method for manufacturing and handling element having directivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000386800A JP2002190457A (en) | 2000-12-20 | 2000-12-20 | Method for manufacturing and handling element having directivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002190457A true JP2002190457A (en) | 2002-07-05 |
Family
ID=18853846
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000386800A Pending JP2002190457A (en) | 2000-12-20 | 2000-12-20 | Method for manufacturing and handling element having directivity |
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| Country | Link |
|---|---|
| JP (1) | JP2002190457A (en) |
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| WO2007018040A1 (en) * | 2005-08-08 | 2007-02-15 | Lintec Corporation | Sheet cutting device and cutting method |
| WO2007018041A1 (en) * | 2005-08-11 | 2007-02-15 | Lintec Corporation | Sheet application device and application method |
| JP2008135455A (en) * | 2006-11-27 | 2008-06-12 | Ngk Insulators Ltd | Chip transfer apparatus |
| JP2009141025A (en) * | 2007-12-04 | 2009-06-25 | Ueno Seiki Kk | Semiconductor processing device |
| WO2012073623A1 (en) * | 2010-12-01 | 2012-06-07 | 株式会社村田製作所 | Piezoelectric element manufacturing method and mother piezoelectric substrate with electrode attached |
| JP2013161970A (en) * | 2012-02-06 | 2013-08-19 | Ngk Insulators Ltd | Manufacturing method of piezoelectric element |
| WO2015159573A1 (en) * | 2014-04-17 | 2015-10-22 | オリンパス株式会社 | Scanner unit, optical fiber scanner, illumination device and observation device |
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| WO2012073623A1 (en) * | 2010-12-01 | 2012-06-07 | 株式会社村田製作所 | Piezoelectric element manufacturing method and mother piezoelectric substrate with electrode attached |
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| US8816571B2 (en) | 2010-12-01 | 2014-08-26 | Murata Manufacturing Co., Ltd. | Manufacturing method for piezoelectric element and mother piezoelectric substrate with electrode |
| JP2013161970A (en) * | 2012-02-06 | 2013-08-19 | Ngk Insulators Ltd | Manufacturing method of piezoelectric element |
| US9755134B2 (en) | 2013-04-25 | 2017-09-05 | Tdk Corporation | Piezoelectric device |
| WO2015159573A1 (en) * | 2014-04-17 | 2015-10-22 | オリンパス株式会社 | Scanner unit, optical fiber scanner, illumination device and observation device |
| JP2015206824A (en) * | 2014-04-17 | 2015-11-19 | オリンパス株式会社 | Scanner unit, optical fiber scanner, lighting device, and observation device |
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| WO2019054336A1 (en) * | 2017-09-12 | 2019-03-21 | 日本碍子株式会社 | Method for producing piezoelectric element |
| JPWO2019054336A1 (en) * | 2017-09-12 | 2020-08-27 | 日本碍子株式会社 | Piezoelectric element manufacturing method |
| US11262394B2 (en) | 2017-09-12 | 2022-03-01 | Ngk Insulators, Ltd. | Method for inspecting piezoelectric element |
| US11515470B2 (en) | 2017-09-12 | 2022-11-29 | Ngk Insulators, Ltd. | Method for producing piezoelectric element |
| JP7201603B2 (en) | 2017-09-12 | 2023-01-10 | 日本碍子株式会社 | Piezoelectric element manufacturing method |
| JP2020165887A (en) * | 2019-03-29 | 2020-10-08 | 凸版印刷株式会社 | Piezoelectric laminated sheet, manufacturing method therefor, piezoelectric sensor, and manufacturing method therefor |
| JP7238546B2 (en) | 2019-03-29 | 2023-03-14 | 凸版印刷株式会社 | Piezoelectric laminated sheet, method for producing piezoelectric laminated sheet, piezoelectric sensor, and method for producing piezoelectric sensor |
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