JP2002187727A - Method of manufacturing glass substrate and die for molding glass substrate - Google Patents
Method of manufacturing glass substrate and die for molding glass substrateInfo
- Publication number
- JP2002187727A JP2002187727A JP2000383427A JP2000383427A JP2002187727A JP 2002187727 A JP2002187727 A JP 2002187727A JP 2000383427 A JP2000383427 A JP 2000383427A JP 2000383427 A JP2000383427 A JP 2000383427A JP 2002187727 A JP2002187727 A JP 2002187727A
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- mold
- molding
- hole
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/088—Flat discs
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B40/00—Preventing adhesion between glass and glass or between glass and the means used to shape it, hold it or support it
- C03B40/02—Preventing adhesion between glass and glass or between glass and the means used to shape it, hold it or support it by lubrication; Use of materials as release or lubricating compositions
- C03B40/027—Apparatus for applying lubricants to glass shaping moulds or tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/40—Product characteristics
- C03B2215/44—Flat, parallel-faced disc or plate products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/50—Structural details of the press-mould assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、磁気ディスクなど
の記録媒体に最適な磁気ディスク用のガラス基板の製造
方法およびガラス基板成形用金型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a glass substrate for a magnetic disk, which is optimal for a recording medium such as a magnetic disk, and a mold for forming a glass substrate.
【０００２】[0002]
【従来の技術】近年、磁気記録の分野、特に磁気ディス
クにおいては、小型化、薄型化、高容量化などの高性能
化が進んでいる。それに伴って、高密度磁気記録媒体へ
の要求が高まり、ガラス基板は、高剛性、高硬度で平坦
化が容易で、高密度化、高信頼性化に極めて有利なこと
から盛んに検討されている。2. Description of the Related Art In recent years, in the field of magnetic recording, particularly in magnetic disks, high performance such as miniaturization, thinning, and high capacity has been promoted. Along with this, the demand for high-density magnetic recording media has increased, and glass substrates have been actively studied because they have high rigidity, high hardness, are easy to flatten, and are extremely advantageous for high density and high reliability. I have.
【０００３】従来、磁気ディスク用ガラス基板は、所定
のサイズに切り抜かれた後、平滑な表面を得るために基
板を研磨する研磨法により製造されてきた。しかしなが
ら、近年、基板表面には超平滑性が要求され、研磨行程
には技術的にも非常に難しい高い精度が求められるよう
になり、こうした基板を１枚１枚研磨する製造方法は、
多くの行程を要し、製品が高価になるという欠点があっ
た。Conventionally, a glass substrate for a magnetic disk has been manufactured by a polishing method of cutting a predetermined size and then polishing the substrate to obtain a smooth surface. However, in recent years, ultra-smoothness has been required for the substrate surface, and high precision has been required for the polishing process, which is very difficult from a technical point of view.
There is a disadvantage that it requires many steps and the product becomes expensive.
【０００４】一方、ガラス素材を加熱、成形、冷却し、
金型成形面を高精度で転写するプレス成形法は、後加工
を必要としないため、安価で生産性が高く、かつ高品質
である。したがって、光学素子製造の分野では、すでに
数多くの検討がなされ実用化が図られている。On the other hand, a glass material is heated, formed and cooled,
The press molding method for transferring a mold molding surface with high precision does not require post-processing, and therefore is inexpensive, has high productivity, and has high quality. Therefore, in the field of optical element manufacturing, many studies have already been made and commercialization has been attempted.
【０００５】しかしながら、磁気ディスク用ガラス基板
のように外径が大きく、基板厚が薄く、外径と基板厚と
の比が大きなもの（例えば、２．５インチサイズの磁気
ディスク用ガラス基板では、外径６５ｍｍ、基板厚み
０．６３５ｍｍであり、外径と基板厚との比は約１０
０：１）を形成することは、光学素子のようにレンズ厚
と外径との比が比較的小さく、かつ曲率を持ったものを
成形する場合とは違った課題を有している。However, a magnetic disk glass substrate such as a magnetic disk glass substrate having a large outer diameter, a thin substrate thickness, and a large ratio of the outer diameter to the substrate thickness (for example, a 2.5-inch magnetic disk glass substrate The outer diameter is 65 mm and the substrate thickness is 0.635 mm, and the ratio of the outer diameter to the substrate thickness is about 10
Forming 0: 1) has a different problem from molding an optical element having a relatively small ratio between the lens thickness and the outer diameter and having a curvature.
【０００６】成形の冷却工程にて上下型に温度差が生じ
ると、ガラス基板は温度の高い方へ反り返ってしまう特
性がある。上型の方へ反りが生じると、型開きする際に
ガラス基板が上型に密着してしまう。そして、上型の上
昇時にガラス基板が自重で剥離し、下型に落下して破損
する恐れがある。また、上型に密着したままだと、取出
しができないという問題もある。If a temperature difference occurs between the upper and lower molds in the cooling step of molding, the glass substrate has a characteristic of warping to a higher temperature. If the upper mold warps, the glass substrate comes into close contact with the upper mold when the mold is opened. Then, when the upper mold is lifted, the glass substrate is peeled off by its own weight, and may fall to the lower mold and be damaged. Further, there is also a problem that it cannot be taken out if it is kept in close contact with the upper mold.
【０００７】このような上型への密着の防止に関して
は、特開平05-043259号公報に開示されているように、
離型に際して上型を所定量上昇させ、上型に成形品が付
着して追従した場合、センサー等でこれを検出し、成形
品が自重や熱応力で上型から剥離、落下するのを待って
成形品を取出そうとする方法が提案されている。As for the prevention of such close contact with the upper mold, as disclosed in Japanese Patent Application Laid-Open No. 05-043259,
When releasing the mold, the upper mold is raised by a predetermined amount, and if a molded product adheres to and follows the upper mold, this is detected by a sensor or the like, and the molded product is separated from the upper mold by its own weight or thermal stress, and waits for it to fall. There has been proposed a method of removing a molded product by using the method.
【０００８】また、特開平06-009229号公報に開示され
ているように、冷却時に上下型に温度差を与えて、成形
品を下側に収縮させて、上型に対する成形品の離型性を
良好にしようとする方法が提案されている。そもそも、
ガラス基板が上型に密着するのは、冷却工程において、
上下型の温度差の影響でガラス基板の上面が凹状に変形
し、超平滑平面のためガラス基板と上型との間に空気が
入り込めない状態になるからである。したがって、上型
密着を防止するには、ガラス基板の形状を下側凹状にし
なければならない。Further, as disclosed in Japanese Patent Application Laid-Open No. 06-009229, a temperature difference is given to the upper and lower molds during cooling to cause the molded article to contract downward, thereby releasing the molded article from the upper mold. Have been proposed. In the first place,
The glass substrate adheres to the upper mold in the cooling process.
This is because the upper surface of the glass substrate is deformed into a concave shape due to the temperature difference between the upper and lower molds, and air cannot enter between the glass substrate and the upper mold due to the super-smooth plane. Therefore, in order to prevent the upper mold from sticking, the shape of the glass substrate must be lower concave.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、上記の
従来の構成では、上型に付着しているか否かを検知する
だけであり、付着した成型品が落下しなければ、次の工
程へ進むことができないという問題がある。また、落下
時に成型品が割れると生産を停止し、破損した成型品の
除去、金型のメンテナンス等を実施しなければならず生
産性の観点で大きな欠点がある。However, in the above-mentioned conventional configuration, it is only necessary to detect whether or not the product adheres to the upper mold. If the adhered molded product does not drop, the process proceeds to the next step. There is a problem that can not be. Further, if the molded product is broken at the time of dropping, the production must be stopped, and the damaged molded product must be removed, the mold must be maintained, and the like, which is a major disadvantage in terms of productivity.
【００１０】また、ガラス基板には上下面ともに非常に
厳しい平坦度が求められるため、上型への密着を防止す
るために、例えば上面凸状、下面凹状の形状差を設ける
ことはできない。[0010] Further, since very strict flatness is required for both the upper and lower surfaces of the glass substrate, for example, in order to prevent the glass substrate from sticking to the upper mold, it is not possible to provide a difference in shape between the upper surface convex shape and the lower surface concave shape.
【００１１】本発明は、上記の課題を解決するものであ
り、高い平坦度を有しながらも上型への密着を防止で
き、生産性が向上し、大量かつ安価に、外径と基板厚と
の比が大きな磁気ディスクなどの記録媒体に最適なガラ
ス基板を製造することができるガラス基板の製造方法お
よびガラス基板成形用金型を提供することを目的とす
る。The present invention has been made to solve the above-mentioned problems, and has a high flatness and can prevent the close contact with the upper die, thereby improving the productivity, and reducing the outer diameter and the substrate thickness in a large amount and at low cost. It is an object of the present invention to provide a method of manufacturing a glass substrate and a mold for forming a glass substrate, which can manufacture a glass substrate optimal for a recording medium such as a magnetic disk having a large ratio.
【００１２】[0012]
【課題を解決するための手段】本発明のガラス基板の製
造方法は、上下型間にガラス素材を配置した後、加熱工
程・加圧工程・冷却工程を経てガラス基板をプレス成形
する製造方法において、プレス成形後の型開き工程に
て、前記上型に設けた貫通孔から前記ガラス基板を離型
させる離型部材を供給することを特徴とするものであ
る。The method of manufacturing a glass substrate according to the present invention is directed to a manufacturing method of press-forming a glass substrate through a heating step, a pressing step, and a cooling step after placing a glass material between upper and lower molds. In a mold opening process after press molding, a release member for releasing the glass substrate from a through hole provided in the upper die is supplied.
【００１３】本発明のガラス基板成形用金型は、互いの
間にガラス素材を配置し加熱工程・加圧工程・冷却工程
を経てガラス基板をプレス成形する上下型からなり、前
記上型に前記ガラス基板を離型させる離型部材を供給す
る貫通孔を設けたことを特徴とするものである。The glass substrate molding die of the present invention comprises upper and lower dies which press a glass substrate through a heating step, a pressurizing step and a cooling step by arranging a glass material between the upper and lower dies. It is characterized in that a through-hole for supplying a release member for releasing the glass substrate is provided.
【００１４】本発明のガラス基板の製造方法およびガラ
ス基板成形用金型によれば、型開きの際に、上型に設け
た貫通孔から離型部材を供給することにより、高い平坦
度を有したガラス基板であっても確実に上型から離型さ
せることができ、かつ、プレス成形にて大量かつ安価に
ガラス基板を製造することができる。According to the glass substrate manufacturing method and the glass substrate molding die of the present invention, when the mold is opened, a high degree of flatness is obtained by supplying the release member from the through hole provided in the upper die. It is possible to reliably release the molded glass substrate from the upper mold, and to manufacture the glass substrate in large quantities and at low cost by press molding.
【００１５】[0015]
【発明の実施の形態】本発明の請求項１に記載のガラス
基板の製造方法は、上下型間にガラス素材を配置した
後、加熱工程・加圧工程・冷却工程を経てガラス基板を
プレス成形する製造方法において、プレス成形後の型開
き工程にて、前記上型に設けた貫通孔から前記ガラス基
板を離型させる離型部材を供給することを特徴とするも
のである。なお、離型部材は不活性気体あるいは金属体
からなり、また貫通孔は上型の中心部等に設ける。この
構成によると、型開きの際に、上型に設けた貫通孔から
離型部材を供給することにより、高い平坦度を有したガ
ラス基板であっても確実に上型から離型させることがで
き、かつ、プレス成形にて大量かつ安価にガラス基板を
製造することができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method for manufacturing a glass substrate according to the first aspect of the present invention, after a glass material is placed between upper and lower dies, the glass substrate is press-formed through a heating step, a pressing step, and a cooling step. In the manufacturing method, a releasing member for releasing the glass substrate from a through hole provided in the upper die is supplied in a mold opening step after press molding. The release member is made of an inert gas or a metal body, and the through-hole is provided at the center of the upper mold. According to this configuration, at the time of opening the mold, by supplying the release member from the through hole provided in the upper mold, it is possible to reliably release the mold from the upper mold even if the glass substrate has a high flatness. In addition, a large amount of glass substrates can be manufactured inexpensively by press molding.
【００１６】本発明の請求項２に記載のガラス基板の製
造方法は、上下型間にガラス素材を配置した後、加熱工
程・加圧工程・冷却工程を経てガラス基板をプレス成形
する製造方法において、プレス成形後の型開き工程に
て、前記下型に設けた貫通孔を介して前記ガラス基板を
真空吸着するものである。なお、貫通孔は下型の中心部
等に設ける。この構成によると、下型に設けた貫通孔を
介してガラス基板を下型に真空吸着することにより、高
い平坦度を有したガラス基板であっても確実に上型から
離型させることができ、かつ、プレス成形にて大量かつ
安価にガラス基板を製造することができる。According to a second aspect of the present invention, there is provided a method of manufacturing a glass substrate, comprising: placing a glass material between upper and lower dies; In a mold opening step after press molding, the glass substrate is vacuum-sucked through a through hole provided in the lower mold. The through-hole is provided at the center of the lower mold or the like. According to this configuration, the glass substrate is vacuum-sucked to the lower mold through the through-hole provided in the lower mold, so that even a glass substrate having a high flatness can be reliably released from the upper mold. In addition, a glass substrate can be manufactured in large quantities and at low cost by press molding.
【００１７】本発明の請求項３に記載のガラス基板の製
造方法は、互いの間にてガラス素材を挟持する上下型
と、プレス成形時に前記上下型の成形面間の距離を規制
する規制部材と、前記上下型をガイドおよび保温する胴
型とからなり、かつ、前記上型に貫通孔を設けた金型ブ
ロックを成形機に投入する工程と、成形完成後に前記成
形機より前記金型ブロックを取出す搬送工程と、前記金
型ブロックを分解してガラス基板を取出すと共に、前記
下型にガラス素材を載置して前記金型ブロックを組立て
る分解組立て工程とからなるガラス基板の製造方法であ
って、前記成形ブロックの上型を開く際に、前記上型の
貫通孔から前記ガラス基板を離型させる離型部材を供給
することを特徴とするものである。なお、離型部材は不
活性気体あるいは金属体からなり、また貫通孔は上型の
中心部等に設ける。この構成によると、型開きの際に、
上型に設けた貫通孔から離型部材を供給することによ
り、高い平坦度を有したガラス基板であっても確実に上
型から離型させることができ、かつ、プレス成形にて大
量かつ安価にガラス基板を製造することができる。According to a third aspect of the present invention, there is provided the glass substrate manufacturing method, wherein the upper and lower molds sandwich a glass material therebetween, and a regulating member for regulating a distance between molding surfaces of the upper and lower molds during press molding. And a step of feeding a mold block comprising a body mold for guiding and warming the upper and lower molds and having a through hole in the upper mold into a molding machine, and after the molding is completed, the mold block from the molding machine. And a disassembling and assembling step of disassembling the mold block to take out the glass substrate, placing a glass material on the lower mold, and assembling the mold block. When opening the upper die of the molding block, a release member for releasing the glass substrate from the through hole of the upper die is supplied. The release member is made of an inert gas or a metal body, and the through-hole is provided at the center of the upper mold. According to this configuration, when opening the mold,
By supplying the release member from the through hole provided in the upper mold, even a glass substrate having a high flatness can be reliably released from the upper mold, and a large amount and low cost can be obtained by press molding. A glass substrate can be manufactured.
【００１８】本発明の請求項４に記載のガラス基板の製
造方法は、互いの間にてガラス素材を挟持する上下型
と、プレス成形時に前記上下型の成形面間の距離を規制
する規制部材と、前記上下型をガイドおよび保温する胴
型とからなり、かつ、前記下型に貫通孔を設けた金型ブ
ロックを成形機に投入する工程と、成形完成後に前記成
形機より前記金型ブロックを取出す搬送工程と、前記金
型ブロックを分解してガラス基板を取出すと共に、前記
下型にガラス素材を載置して前記金型ブロックを組立て
る分解組立て工程とからなるガラス基板の製造方法であ
って、前記成形ブロックの上型を開く際に、前記下型の
貫通孔を介して前記ガラス基板を真空吸着することを特
徴とするものである。なお、貫通孔は下型の中心部等に
設ける。この構成によると、下型に設けた貫通孔を介し
てガラス基板を下型に真空吸着することにより、高い平
坦度を有したガラス基板であっても確実に上型から離型
させることができ、かつ、プレス成形にて大量かつ安価
にガラス基板を製造することができる。According to a fourth aspect of the present invention, there is provided a method of manufacturing a glass substrate, comprising: an upper and lower mold for holding a glass material therebetween; and a regulating member for regulating a distance between molding surfaces of the upper and lower molds during press molding. And a step of feeding a mold block comprising a body mold that guides and heats the upper and lower molds and has a through hole in the lower mold into a molding machine, and after the molding is completed, the mold block is formed by the molding machine. And a disassembling and assembling step of disassembling the mold block to take out the glass substrate, placing a glass material on the lower mold, and assembling the mold block. When the upper mold of the molding block is opened, the glass substrate is vacuum-sucked through the through hole of the lower mold. The through-hole is provided at the center of the lower mold or the like. According to this configuration, the glass substrate is vacuum-sucked to the lower mold through the through-hole provided in the lower mold, so that even a glass substrate having a high flatness can be reliably released from the upper mold. In addition, a glass substrate can be manufactured in large quantities and at low cost by press molding.
【００１９】本発明の請求項７に記載のガラス基板成形
用金型は、互いの間にガラス素材を配置し加熱工程・加
圧工程・冷却工程を経てガラス基板をプレス成形する上
下型からなり、前記上型に前記ガラス基板を離型させる
離型部材を供給する貫通孔を設けたことを特徴とするも
のである。なお、離型部材は不活性気体あるいは金属体
からなり、また貫通孔は上型の中心部等に設ける。この
構成によると、型開きの際に、上型に設けた貫通孔から
離型部材を供給することにより、高い平坦度を有したガ
ラス基板であっても確実に上型から離型させることがで
き、かつ、プレス成形にて大量かつ安価にガラス基板を
製造することができる。A glass substrate molding die according to a seventh aspect of the present invention comprises upper and lower dies which place a glass material between each other and press-mold the glass substrate through a heating step, a pressing step, and a cooling step. And a through-hole for supplying a release member for releasing the glass substrate from the upper mold. The release member is made of an inert gas or a metal body, and the through-hole is provided at the center of the upper mold. According to this configuration, at the time of opening the mold, by supplying the release member from the through hole provided in the upper mold, it is possible to reliably release the mold from the upper mold even if the glass substrate has a high flatness. In addition, a large amount of glass substrates can be manufactured inexpensively by press molding.
【００２０】本発明の請求項８に記載のガラス基板成形
用金型は、互いの間にガラス素材を配置し加熱工程・加
圧工程・冷却工程を経てガラス基板をプレス成形する上
下型からなり、前記下型に前記ガラス基板を前記ガラス
基板を真空吸着する貫通孔を設けたことを特徴とするも
のである。なお、貫通孔は下型の中心部等に設ける。こ
の構成によると、下型に設けた貫通孔を介してガラス基
板を下型に真空吸着することにより、高い平坦度を有し
たガラス基板であっても確実に上型から離型させること
ができ、かつ、プレス成形にて大量かつ安価にガラス基
板を製造することができる。The glass substrate forming die according to the present invention comprises an upper and lower die for pressing a glass substrate through a heating step, a pressing step, and a cooling step by arranging a glass material therebetween. The lower mold is provided with a through-hole for vacuum-sucking the glass substrate to the glass substrate. The through-hole is provided at the center of the lower mold or the like. According to this configuration, the glass substrate is vacuum-sucked to the lower mold through the through-hole provided in the lower mold, so that even a glass substrate having a high flatness can be reliably released from the upper mold. In addition, a glass substrate can be manufactured in large quantities and at low cost by press molding.
【００２１】本発明の請求項１１に記載のガラス基板成
形用金型は、請求項７または請求項８の金型において、
貫通孔を設けた上型または下型の成形面と前記貫通孔と
のエッジ部分に面取り部を形成したことを特徴とするも
のである。この構成によると、ガラス素材が貫通孔内に
埋没しても簡単に剥離し、ガラス基板の離型性が向上す
る。[0021] The glass substrate molding die according to claim 11 of the present invention is the die according to claim 7 or claim 8,
A chamfer is formed at an edge portion between a molding surface of an upper die or a lower die having a through hole and the through hole. According to this configuration, even if the glass material is buried in the through hole, the glass material is easily peeled off, and the releasability of the glass substrate is improved.
【００２２】以下、本発明の実施の形態について、図１
ないし図７を用いて説明する。 （実施の形態１）図１は、本発明の実施の形態１におけ
るガラス基板成形用金型の断面図である。Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. (Embodiment 1) FIG. 1 is a sectional view of a glass substrate molding die according to Embodiment 1 of the present invention.
【００２３】ガラス基板成形用金型１は、上型または下
型に使用され、プレス成形面２上にガラス素材を配置し
て成形を行う。金型１の中心部には直径１ｍｍの貫通孔
３が形成されている。ガラス素材の粘度は１×１０6〜8
Ｐａ・ｓにて成形され、この程度の粘度であればガラス
素材が貫通孔３に流れ出すことはないため、問題なくガ
ラス基板を成形できる。なお、ガラス基板成形用金型１
の成形面２と貫通孔３とのエッジ部分に面取り部１９が
形成されている。The glass substrate molding die 1 is used for an upper die or a lower die, and a glass material is placed on a press molding surface 2 to perform molding. A through hole 3 having a diameter of 1 mm is formed in the center of the mold 1. The viscosity of the glass material is 1 × 10 6-8
Since the glass material does not flow into the through-hole 3 at such a viscosity, the glass substrate can be formed without any problem. In addition, the glass substrate molding die 1
A chamfer 19 is formed at the edge between the molding surface 2 and the through hole 3.
【００２４】図２ないし図４は、図１に示すガラス基板
成形用金型を用いてガラス基板１８を成形する工程の概
略断面図を示している。FIGS. 2 to 4 are schematic sectional views showing steps of forming a glass substrate 18 using the glass substrate forming die shown in FIG.
【００２５】図２は、ガラス素材７を下型４に載置して
なる加熱工程を示す概略断面図である。ガラス基板成形
用金型は上型１、下型４、プレス成形時に上下型１，４
の成形面２，５間の距離を規制する規制リング６、上下
型１，４をガイドおよび保温する保温胴型１６，１７と
から構成されている。上下型１，４は、母材としてタン
グステンカーバイト（ＷＣ）を主成分とする超硬合金や
石英ガラス等、高温時の機械強度の優れたものがよく、
熱膨張係数が小さいものが望ましい。このプレス成形面
２，５には白金（Ｐｔ）、ルテニウム（Ｒｕ）、イリジ
ウム（Ｉｒ）等の貴金属系金属または合金の材料からな
るターゲットをスパッタして薄膜状の保護膜（図示せ
ず）が形成されており、高温、高圧下でのガラス基板１
８のプレス成形の繰返しによるプレス成形面２，５への
ガラスの付着、および母材のプレス成形面２，５の面荒
れによる表面平滑性の低下を防止している。さらに、保
護膜の平滑性（非常に狭い範囲（１０μｍ×１０μｍ）
の形状精度（表面粗さＲａ））は、磁気ディスク用とし
ては０．５ｎｍ以下が適当で、このような平滑面は酸化
セリウムの微粒子を用いた研磨によって得ることができ
る。なお、合金保護膜により被膜が施されている。FIG. 2 is a schematic sectional view showing a heating step in which the glass material 7 is placed on the lower mold 4. The mold for forming a glass substrate is an upper mold 1, a lower mold 4, and upper and lower molds 1, 4 during press molding.
A regulating ring 6 for regulating the distance between the molding surfaces 2 and 5, and upper and lower dies 1 and 4 as guides and heat retaining drum dies 16 and 17 for retaining heat. The upper and lower dies 1 and 4 preferably have excellent mechanical strength at high temperature, such as a cemented carbide or quartz glass having tungsten carbide (WC) as a main component as a base material.
Those having a small coefficient of thermal expansion are desirable. A target made of a noble metal or alloy such as platinum (Pt), ruthenium (Ru), or iridium (Ir) is sputtered on the press-formed surfaces 2 and 5 to form a thin protective film (not shown). Glass substrate 1 formed at high temperature and high pressure
This prevents the adhesion of glass to the press-formed surfaces 2 and 5 due to the repetition of the press-forming of No. 8 and the decrease in surface smoothness due to the roughening of the press-formed surfaces 2 and 5 of the base material. Furthermore, the smoothness of the protective film (a very narrow range (10 μm × 10 μm)
The shape accuracy (surface roughness Ra) is preferably 0.5 nm or less for a magnetic disk, and such a smooth surface can be obtained by polishing using fine particles of cerium oxide. Note that the coating is applied by an alloy protective film.
【００２６】また、上型１および下型４は、固定リング
８，９を介してそれぞれヒータブロック１０，１４に固
定されている。上ヒータブロック１０はシリンダヘッド
１２に固定されており、このシリンダヘッド１２の上下
動により上型１が上下動する。また、上ヒータブロック
１０の中央部には上型１の貫通孔３と対応する位置に貫
通孔１１が形成され、シリンダヘッド１２に形成された
窒素供給孔１３より供給される窒素が、上ヒータブロッ
ク１０の貫通孔１１を介して上型１の貫通孔３より排出
される。The upper mold 1 and the lower mold 4 are fixed to heater blocks 10 and 14 via fixing rings 8 and 9, respectively. The upper heater block 10 is fixed to a cylinder head 12, and the vertical movement of the cylinder head 12 causes the upper die 1 to move up and down. A through-hole 11 is formed at a position corresponding to the through-hole 3 of the upper die 1 in a central portion of the upper heater block 10, and nitrogen supplied from a nitrogen supply hole 13 formed in the cylinder head 12 is supplied to the upper heater block 10. It is discharged from the through-hole 3 of the upper die 1 through the through-hole 11 of the block 10.
【００２７】規制リング６は下型４の成形面５に載置さ
れ、下保温胴型１７により位置決めされており、上型１
の成形面２と当接して成形品であるガラス基板１８の厚
みを決定する。The regulating ring 6 is mounted on the molding surface 5 of the lower die 4 and is positioned by the lower heat retaining drum 17 so that the upper die 1
To determine the thickness of the glass substrate 18 as a molded product.
【００２８】さらに、上下型１，４は、ヒータブロック
１０，１４に埋め込まれた直管式カートリッジヒータ１
５により、ガラス軟化点Ｔｓ近傍（±５０℃程度）とガ
ラス転移点Ｔｇ近傍（±５０℃程度）との間の所定温度
に加熱される。Further, the upper and lower dies 1, 4 are straight tube type cartridge heaters 1 embedded in the heater blocks 10, 14.
5 heats to a predetermined temperature between the vicinity of the glass softening point Ts (about ± 50 ° C.) and the vicinity of the glass transition point Tg (about ± 50 ° C.).
【００２９】図３は、加圧成形完了直後から冷却までの
工程を示す概略断面図である。加熱されたガラス素材７
はシリンダヘッド１２により加圧され、上型１のプレス
成形面２が規制リング６に当接するまで変形され、プレ
スが完了することになる。このときのガラス素材７の粘
度は１×１０6〜8Ｐａ・ｓ程度であり、上型１の貫通孔
３に流れ出ることはない。なお、ガラス素材７は、数百
μｍ程度、貫通孔３に埋没するが、この部分は内径加工
により切り落とされるので性能には何ら問題はない。FIG. 3 is a schematic sectional view showing steps from immediately after the completion of the pressure molding to cooling. Heated glass material 7
Is pressed by the cylinder head 12 and deformed until the press forming surface 2 of the upper die 1 comes into contact with the regulating ring 6, and the pressing is completed. At this time, the viscosity of the glass material 7 is about 1 × 10 6 to 8 Pa · s, and does not flow out into the through-hole 3 of the upper mold 1. The glass material 7 is buried in the through hole 3 by about several hundred μm, but since this portion is cut off by the inner diameter processing, there is no problem in performance.
【００３０】ガラス基板１８がガラス歪点Ｐｓ以下に冷
却されると、上型１を上昇させ型開きを行う。このとき
上型１の貫通孔３より窒素ガスを供給し、ガラス基板１
８を強制的に上型１より離型させ、上型１への密着を防
止する。この後、シリンダヘッド１２を上昇させ型開き
を行う。なお、上型１の成形面２と貫通孔３とのエッジ
部分に面取り部１９が形成されているので、ガラス素材
７が貫通孔３に埋没しても、当該埋没したガラス素材７
が貫通孔３から簡単に剥離し、ガラス基板１８の離型が
容易に行える。When the glass substrate 18 is cooled below the glass strain point Ps, the upper mold 1 is raised to open the mold. At this time, a nitrogen gas is supplied from the through-hole 3 of the upper mold 1 and the glass substrate 1
8 is forcibly released from the upper mold 1 to prevent close contact with the upper mold 1. Thereafter, the cylinder head 12 is raised to open the mold. Since the chamfered portion 19 is formed at the edge portion between the molding surface 2 of the upper mold 1 and the through hole 3, even if the glass material 7 is buried in the through hole 3,
Is easily peeled off from the through-hole 3, and the mold release of the glass substrate 18 can be easily performed.
【００３１】図４は、型開きした状態を示す概略断面図
である。型開きの状態でガラス基板１８が上型１に密着
していると、搬送部材（図示せず）にて型内よりガラス
基板１８を搬出できなくなる。また、型開き後、ガラス
基板１８が上型１より落下すれば割れる可能性や、規制
リング６に乗り上げて搬送部材で拾えない状況にもな
り、生産性が極端に低くなり実用に耐えなくなる。しか
し、本実施の形態１のように、上型１の貫通孔３より窒
素ガスを供給してガラス基板１８を強制的に上型１より
離型させることにより、上型１への密着を防止できるよ
うになる。 （実施の形態２）図５は、本発明の実施の形態２におけ
るガラス基板成形用金型内に、ガラス素材７を載置した
状態を示す断面図である。FIG. 4 is a schematic sectional view showing a state where the mold is opened. If the glass substrate 18 is in close contact with the upper mold 1 while the mold is open, the glass member 18 cannot be carried out of the mold by a transport member (not shown). Further, after the mold is opened, if the glass substrate 18 falls from the upper mold 1, the glass substrate 18 may be broken, or it may not be able to be picked up by the conveyance member after riding on the regulating ring 6, so that the productivity is extremely lowered and the product cannot be put to practical use. However, as in the first embodiment, the glass substrate 18 is forcibly released from the upper mold 1 by supplying nitrogen gas from the through-hole 3 of the upper mold 1, thereby preventing the glass substrate 18 from adhering to the upper mold 1. become able to. (Embodiment 2) FIG. 5 is a sectional view showing a state in which a glass material 7 is placed in a glass substrate molding die according to Embodiment 2 of the present invention.
【００３２】ガラス基板成形用金型は、上型１、下型
４、プレス成形時に上下型１，４の成形面２，５間の距
離を規制する規制リング６、上下型１，４をガイドおよ
び保温する保温胴型２０とから構成されている。また、
上型１の中心部には貫通孔３が形成されている。この金
型ブロックを加熱工程、加圧成形工程、冷却工程を有す
る成形機に投入しガラス基板１８の成形を行う。成形完
成後、搬送工程にて成形機より金型ブロックを取出す。The glass substrate molding die includes an upper die 1, a lower die 4, a regulating ring 6 for regulating the distance between the molding surfaces 2, 5 of the upper and lower dies 1, 4 during press molding, and a guide for the upper and lower dies 1, 4. And a heat retaining drum mold 20 for retaining heat. Also,
A through hole 3 is formed in the center of the upper die 1. The mold block is put into a molding machine having a heating step, a pressure molding step, and a cooling step, and the glass substrate 18 is molded. After molding is completed, the mold block is removed from the molding machine in the transport process.
【００３３】図６，図７は、成形完了後の金型ブロック
を分解する工程を示す概略断面図である。上型搬送アー
ム２１には、上型１の貫通孔３と対応する位置に窒素供
給孔２２が形成されている。上型１を保持し型開きする
前に、この窒素供給孔２２より窒素ガスを供給し、上型
１の貫通孔３を通じてガラス基板１８を上型１より強制
的に離型させる。この後、型開きを行ってガラス基板１
８を取出す。FIGS. 6 and 7 are schematic sectional views showing steps of disassembling the mold block after completion of molding. A nitrogen supply hole 22 is formed in the upper die transfer arm 21 at a position corresponding to the through hole 3 of the upper die 1. Before holding and opening the upper mold 1, nitrogen gas is supplied from the nitrogen supply hole 22 to forcibly release the glass substrate 18 from the upper mold 1 through the through-hole 3 of the upper mold 1. Thereafter, the mold is opened and the glass substrate 1 is opened.
Take out 8.
【００３４】金型ブロックを組立てる工程では、下型４
にガラス素材７を載置し、上型搬送アーム２１にて上型
１を保持して下型４上に下降させ保温胴型２０にて保持
させる。その後、金型ブロックを成形機に投入しガラス
基板１８の成形を行う。In the step of assembling the mold block, the lower mold 4
The glass material 7 is placed on the lower die 4, and the upper die 1 is held by the upper die transfer arm 21, lowered onto the lower die 4, and held by the heat retaining die 20. Thereafter, the mold block is put into a molding machine, and the glass substrate 18 is molded.
【００３５】なお、前記各実施の形態１，２では、上型
１に貫通孔３を設け窒素ガスを供給する例を示したが、
下型４の中心部に貫通孔を設けガラス基板１８を真空吸
着させることにより上型１より離型させてもよい。In each of the first and second embodiments, an example has been described in which the through-hole 3 is provided in the upper die 1 and nitrogen gas is supplied.
A through-hole may be provided in the center of the lower mold 4 and the glass substrate 18 may be released from the upper mold 1 by vacuum suction.
【００３６】また、離型部材として窒素ガスを用いる例
を示したが、水素等のその他の不活性ガスを用いてもよ
い。Although an example has been described in which nitrogen gas is used as the release member, other inert gases such as hydrogen may be used.
【００３７】また、離型部材として不活性ガスを用いる
例を示したが、上型１の貫通孔３より棒状の金属体等を
突出させ、成形品を押すことにより離型させてもよい。Although an example in which an inert gas is used as the release member has been described, a rod-shaped metal body or the like may be projected from the through hole 3 of the upper die 1 and the molded product may be released by pressing the molded product.
【００３８】さらに、前記各実施の形態１，２では、貫
通孔３を上型１または下型４の中心部に設けたが、形成
部位は中心部に限るものではなく、例えば、上型１また
は下型４の成形面２，５に複数の貫通孔を形成し、離型
部材を供給または真空吸着によりガラス基板１８を離型
させてもよい。 （実施例１）つぎに、本発明の磁気ディスク用基板の製
造方法の具体例について説明する。Further, in each of the first and second embodiments, the through-hole 3 is provided at the center of the upper mold 1 or the lower mold 4. However, the forming portion is not limited to the center. Alternatively, a plurality of through holes may be formed in the molding surfaces 2 and 5 of the lower mold 4 and the glass substrate 18 may be released by supplying a release member or by vacuum suction. (Example 1) Next, a specific example of a method for manufacturing a magnetic disk substrate of the present invention will be described.
【００３９】ガラス素材７は、転移点温度Ｔｇ＝５０１
℃、軟化点温度Ｔｓ＝６７０℃、ガラス歪点温度Ｐｓ＝
４５０℃、線膨張係数α＝９５×１０-7/℃のアルミノ
シリケートガラスであり、重量６．５ｇ±０．５ｇ、外
径２２．３ｍｍ±０．３ｍｍ、厚み８ｍｍ±０．５ｍｍ
の滴下硝材を用いた。The glass material 7 has a transition point temperature Tg = 501.
° C, softening point temperature Ts = 670 ° C, glass strain point temperature Ps =
Aluminosilicate glass having a temperature of 450 ° C. and a coefficient of linear expansion α = 95 × 10 −7 / ° C., a weight of 6.5 g ± 0.5 g, an outer diameter of 22.3 mm ± 0.3 mm, and a thickness of 8 mm ± 0.5 mm
Was used.
【００４０】上型１の貫通孔３の直径は１ｍｍである。The diameter of the through hole 3 of the upper die 1 is 1 mm.
【００４１】成形条件として、上下型１，４は７００
℃、成形圧力を４００Ｋｇ/ｃｍ2とし、成形時間は１分
とした。その後加熱を停止し、プレス圧力を１００Ｋｇ
/ｃｍ2とし冷却を行い、ヒータの温度モニターが４００
℃で上型１の貫通孔３より窒素ガスを供給し、上型１を
上昇させて型開きした。As the molding conditions, the upper and lower dies 1, 4 are 700
C., the molding pressure was 400 kg / cm 2 , and the molding time was 1 minute. Thereafter, the heating was stopped and the press pressure was reduced to 100 kg.
/ cm 2 and cooling, and the heater temperature monitor is 400
Nitrogen gas was supplied from the through hole 3 of the upper mold 1 at a temperature of 0 ° C., and the upper mold 1 was raised to open the mold.
【００４２】このようにして得られた磁気ディスク用ガ
ラス基板１８は、外径７０ｍｍ、厚み０．６３５ｍｍ、
表面の平滑性はＲａ＝０．５ｎｍ±０．２ｎｍとなり、
上下型１，４のプレス成形面２，５の平滑性がほぼその
まま転写されることを確認した。The magnetic disk glass substrate 18 thus obtained has an outer diameter of 70 mm, a thickness of 0.635 mm,
The surface smoothness is Ra = 0.5 nm ± 0.2 nm,
It was confirmed that the smoothness of the press-formed surfaces 2 and 5 of the upper and lower dies 1 and 4 was transferred almost as it was.
【００４３】[0043]
【発明の効果】本発明のガラス基板の製造方法およびガ
ラス基板成形用金型によれば、高い平坦度を有しながら
も上型への密着を防止でき、生産性が向上し、大量かつ
安価に、外径と基板厚との比が大きな磁気ディスクなど
の記録媒体に最適なガラス基板を製造することができる
という有利な効果が得られる。According to the method for manufacturing a glass substrate and the mold for molding a glass substrate of the present invention, it is possible to prevent the close contact with the upper mold while having a high flatness, to improve the productivity, to increase the mass and to reduce the cost. Furthermore, an advantageous effect is obtained that a glass substrate optimal for a recording medium such as a magnetic disk having a large ratio between the outer diameter and the substrate thickness can be manufactured.
【図１】 本発明の実施の形態１におけるガラス基板成
形用金型の断面図FIG. 1 is a cross-sectional view of a glass substrate molding die according to a first embodiment of the present invention.
【図２】 本発明の実施の形態１におけるガラス素材を
加熱する工程の概略断面図FIG. 2 is a schematic sectional view of a step of heating the glass material according to the first embodiment of the present invention.
【図３】 本発明の実施の形態１における加圧成形完了
直後から冷却までの工程を示す概略断面図FIG. 3 is a schematic cross-sectional view showing steps from immediately after the completion of pressure molding to cooling in Embodiment 1 of the present invention.
【図４】 本発明の実施の形態１における型開きした状
態を示す概略断面図FIG. 4 is a schematic sectional view showing a state where the mold is opened according to the first embodiment of the present invention;
【図５】 本発明の実施の形態２におけるガラス基板成
形用金型内にガラス素材を載置した状態を示す断面図FIG. 5 is a cross-sectional view showing a state where a glass material is placed in a glass substrate molding die according to a second embodiment of the present invention.
【図６】 本発明の実施の形態２における成形完了後の
金型ブロックを分解する工程を示す概略断面図FIG. 6 is a schematic sectional view showing a step of disassembling a mold block after completion of molding in Embodiment 2 of the present invention.
【図７】 本発明の実施の形態２における成形完了後の
金型ブロックを分解する工程を示す概略断面図FIG. 7 is a schematic sectional view showing a step of disassembling a mold block after completion of molding according to the second embodiment of the present invention.
１ 上型 ２，５ 成形面 ３ 貫通孔 ４ 下型 ６ 規制リング ７ ガラス素材 １０，１４ ヒータブロック １２ シリンダヘッド １８ ガラス基板（成形品） ２１ 上型搬送アーム DESCRIPTION OF SYMBOLS 1 Upper die 2, 5 Molding surface 3 Through hole 4 Lower die 6 Restriction ring 7 Glass material 10, 14 Heater block 12 Cylinder head 18 Glass substrate (molded product) 21 Upper die transfer arm
Claims (11)
熱工程・加圧工程・冷却工程を経てガラス基板をプレス
成形する製造方法において、 プレス成形後の型開き工程にて、前記上型に設けた貫通
孔から前記ガラス基板を離型させる離型部材を供給する
ことを特徴とするガラス基板の製造方法。1. A manufacturing method for press-forming a glass substrate through a heating step, a pressing step, and a cooling step after disposing a glass material between upper and lower molds, wherein the upper mold is formed in a mold opening step after press molding. Supplying a release member for releasing the glass substrate from the through hole provided in the glass substrate.
熱工程・加圧工程・冷却工程を経てガラス基板をプレス
成形する製造方法において、 プレス成形後の型開き工程にて、前記下型に設けた貫通
孔を介して前記ガラス基板を真空吸着することを特徴と
するガラス基板の製造方法。2. A manufacturing method for press-forming a glass substrate through a heating step, a pressing step, and a cooling step after disposing a glass material between upper and lower molds, wherein the lower mold is formed in a mold opening step after press molding. A method for manufacturing a glass substrate, wherein the glass substrate is vacuum-sucked through a through hole provided in the glass substrate.
型と、プレス成形時に前記上下型の成形面間の距離を規
制する規制部材と、前記上下型をガイドおよび保温する
胴型とからなり、かつ、前記上型に貫通孔を設けた金型
ブロックを成形機に投入する工程と、 成形完成後に前記成形機より前記金型ブロックを取出す
搬送工程と、 前記金型ブロックを分解してガラス基板を取出すと共
に、前記下型にガラス素材を載置して前記金型ブロック
を組立てる分解組立て工程とからなるガラス基板の製造
方法であって、 前記成形ブロックの上型を開く際に、前記上型の貫通孔
から前記ガラス基板を離型させる離型部材を供給するこ
とを特徴とするガラス基板の製造方法。3. An upper and lower mold for holding a glass material between each other, a regulating member for regulating a distance between molding surfaces of the upper and lower molds during press molding, and a body mold for guiding and heating the upper and lower molds. And a step of feeding a mold block having a through hole in the upper mold into a molding machine; a conveying step of taking out the mold block from the molding machine after completion of molding; and disassembling the mold block. A method for manufacturing a glass substrate, comprising taking out a glass substrate and disassembling and assembling a mold block by placing a glass material on the lower mold, wherein when opening an upper mold of the molding block, A method for manufacturing a glass substrate, comprising supplying a release member for releasing the glass substrate from a through hole of an upper die.
型と、プレス成形時に前記上下型の成形面間の距離を規
制する規制部材と、前記上下型をガイドおよび保温する
胴型とからなり、かつ、前記下型に貫通孔を設けた金型
ブロックを成形機に投入する工程と、 成形完成後に前記成形機より前記金型ブロックを取出す
搬送工程と、 前記金型ブロックを分解してガラス基板を取出すと共
に、前記下型にガラス素材を載置して前記金型ブロック
を組立てる分解組立て工程とからなるガラス基板の製造
方法であって、 前記成形ブロックの上型を開く際に、前記下型の貫通孔
を介して前記ガラス基板を真空吸着することを特徴とす
るガラス基板の製造方法。4. An upper and lower mold for holding a glass material between each other, a regulating member for regulating a distance between molding surfaces of the upper and lower molds during press molding, and a body mold for guiding and heating the upper and lower molds. And feeding a mold block having a through hole in the lower mold to a molding machine; a conveying step of taking out the mold block from the molding machine after completion of molding; and disassembling the mold block. A method for manufacturing a glass substrate, comprising taking out a glass substrate and disassembling and assembling a mold block by placing a glass material on the lower mold, wherein when opening an upper mold of the molding block, A method for manufacturing a glass substrate, wherein the glass substrate is vacuum-sucked through a through hole of a lower die.
らなることを特徴とする請求項１または請求項３に記載
のガラス基板の製造方法。5. The method for manufacturing a glass substrate according to claim 1, wherein the release member is made of an inert gas or a metal body.
たことを特徴とする請求項１から請求項４のいずれかに
記載のガラス基板の製造方法。6. The method for manufacturing a glass substrate according to claim 1, wherein the through-hole is provided in a center portion of the upper die or the lower die.
・加圧工程・冷却工程を経てガラス基板をプレス成形す
る上下型からなるガラス基板成形用金型において、 前記上型に前記ガラス基板を離型させる離型部材を供給
する貫通孔を設けたことを特徴とするガラス基板成形用
金型。7. A glass substrate forming mold comprising upper and lower dies for press-forming a glass substrate through a heating step, a pressing step, and a cooling step by arranging a glass material therebetween, wherein the upper substrate is provided with the glass substrate. A through hole for supplying a release member for releasing the mold from the mold.
・加圧工程・冷却工程を経てガラス基板をプレス成形す
る上下型からなるガラス基板成形用金型において、 前記下型に前記ガラス基板を前記ガラス基板を真空吸着
する貫通孔を設けたことを特徴とするガラス基板成形用
金型。8. A glass substrate forming mold comprising upper and lower dies for press-forming a glass substrate through a heating step, a pressurizing step, and a cooling step by arranging a glass material therebetween, wherein the lower substrate is provided with the glass substrate. Characterized in that a through hole for vacuum-sucking the glass substrate is provided.
らなることを特徴とする請求項７に記載のガラス基板成
形用金型。9. The glass substrate molding die according to claim 7, wherein the release member is made of an inert gas or a metal body.
けたことを特徴とする請求項７または請求項８に記載の
ガラス基板成形用金型。10. The glass substrate molding die according to claim 7, wherein the through-hole is provided in the center of the upper die or the lower die.
面と前記貫通孔とのエッジ部分に面取り部を形成したこ
とを特徴とする請求項７または請求項８に記載のガラス
基板成形用金型。11. The glass substrate molding according to claim 7, wherein a chamfered portion is formed at an edge portion between the molding surface of the upper die or the lower die having the through hole and the through hole. Mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000383427A JP2002187727A (en) | 2000-12-18 | 2000-12-18 | Method of manufacturing glass substrate and die for molding glass substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000383427A JP2002187727A (en) | 2000-12-18 | 2000-12-18 | Method of manufacturing glass substrate and die for molding glass substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002187727A true JP2002187727A (en) | 2002-07-05 |
| JP2002187727A5 JP2002187727A5 (en) | 2007-12-13 |
Family
ID=18851084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000383427A Withdrawn JP2002187727A (en) | 2000-12-18 | 2000-12-18 | Method of manufacturing glass substrate and die for molding glass substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002187727A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004092083A1 (en) * | 2003-04-15 | 2004-10-28 | Raytheon Company | System and method for forming infrared glass optical components |
| SG108848A1 (en) * | 2001-05-09 | 2005-02-28 | Fuji Electric Co Ltd | Press die and molding precess of disk with shaft shaped portion |
| SG126739A1 (en) * | 2002-12-04 | 2006-11-29 | Fuji Elec Device Tech Co Ltd | Method and apparatus for manufacturing glass substrate for storage medium, glass substrate for storage medium, and storage medium |
| US7159419B2 (en) | 2003-04-15 | 2007-01-09 | Umicore Sa | System and method for vapor pressure controlled growth of infrared chalcogenide glasses |
| US7171827B2 (en) | 2003-04-15 | 2007-02-06 | Umicore Sa | System and method for automated casting of infrared glass optical components |
| JP2010195649A (en) * | 2009-02-26 | 2010-09-09 | Hoya Corp | Glass blank, method for producing the same, method for producing substrate for information recording medium, and method for producing information recording medium |
| CN113354268A (en) * | 2021-06-30 | 2021-09-07 | Oppo广东移动通信有限公司 | Hot bending equipment, cover plate and forming method thereof and electronic device |
| CN113620573A (en) * | 2021-08-27 | 2021-11-09 | Oppo广东移动通信有限公司 | Hot bending equipment, cover plate and forming method thereof |
-
2000
- 2000-12-18 JP JP2000383427A patent/JP2002187727A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG108848A1 (en) * | 2001-05-09 | 2005-02-28 | Fuji Electric Co Ltd | Press die and molding precess of disk with shaft shaped portion |
| SG126739A1 (en) * | 2002-12-04 | 2006-11-29 | Fuji Elec Device Tech Co Ltd | Method and apparatus for manufacturing glass substrate for storage medium, glass substrate for storage medium, and storage medium |
| US7313930B2 (en) | 2002-12-04 | 2008-01-01 | Fuji Electric Device Technology Co., Ltd | Method and apparatus for manufacturing glass substrate for storage medium |
| WO2004092083A1 (en) * | 2003-04-15 | 2004-10-28 | Raytheon Company | System and method for forming infrared glass optical components |
| US7159419B2 (en) | 2003-04-15 | 2007-01-09 | Umicore Sa | System and method for vapor pressure controlled growth of infrared chalcogenide glasses |
| US7159420B2 (en) | 2003-04-15 | 2007-01-09 | Umicore Sa | System and method for forming infrared glass optical components |
| US7171827B2 (en) | 2003-04-15 | 2007-02-06 | Umicore Sa | System and method for automated casting of infrared glass optical components |
| JP2010195649A (en) * | 2009-02-26 | 2010-09-09 | Hoya Corp | Glass blank, method for producing the same, method for producing substrate for information recording medium, and method for producing information recording medium |
| CN113354268A (en) * | 2021-06-30 | 2021-09-07 | Oppo广东移动通信有限公司 | Hot bending equipment, cover plate and forming method thereof and electronic device |
| CN113620573A (en) * | 2021-08-27 | 2021-11-09 | Oppo广东移动通信有限公司 | Hot bending equipment, cover plate and forming method thereof |
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