JP2002158245A - Apparatus and method for heat treating plate-like material - Google Patents
Apparatus and method for heat treating plate-like materialInfo
- Publication number
- JP2002158245A JP2002158245A JP2000354119A JP2000354119A JP2002158245A JP 2002158245 A JP2002158245 A JP 2002158245A JP 2000354119 A JP2000354119 A JP 2000354119A JP 2000354119 A JP2000354119 A JP 2000354119A JP 2002158245 A JP2002158245 A JP 2002158245A
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- heat
- plate
- heat medium
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
- Muffle Furnaces And Rotary Kilns (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ガラス基板、半導
体基板、プリント基板等の板状被処理物およびその上に
形成される絶縁性、導電性あるいはマスク形成用等の膜
を加熱、降温する熱処理装置および方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for heating and lowering the temperature of a plate-like object to be processed such as a glass substrate, a semiconductor substrate, or a printed circuit board and a film formed thereon, such as an insulating, conductive or mask-forming film. The present invention relates to a heat treatment apparatus and method.
【０００２】[0002]
【従来の技術】従来の熱処理装置として、例えば連続炉
のように、複数の熱処理ゾーンを備え、被処理物が、第
１熱処理ゾーンから最終熱処理ゾーンを経て搬出される
までの間に被処理物に対して段階的な温度変化（以下、
単に熱処理という）をさせるものがある。段階的な温度
変化とは、予熱、本加熱のような複数段階加熱の他、加
熱、冷却の組み合わせも含むものとする。2. Description of the Related Art As a conventional heat treatment apparatus, for example, a continuous furnace is provided with a plurality of heat treatment zones, and the object to be processed is carried out from a first heat treatment zone to a final heat treatment zone before being carried out. Stepwise temperature change (hereinafter,
Heat treatment). The stepwise temperature change includes a combination of heating and cooling in addition to a plurality of steps of heating such as preheating and main heating.
【０００３】[0003]
【発明が解決しようとする課題】上記、従来の熱処理装
置は、被処理物搬送中の振動が避けられない。このた
め、例えば、上記熱処理装置によって被処理物である基
板に膜を焼成するさい、焼成される膜厚さが均一でなく
なる、あるいははんだバンプを形成するさいにバンプの
形状が歪んだり不揃いになることがあるという問題が生
じる。SUMMARY OF THE INVENTION In the above-described conventional heat treatment apparatus, vibration during the transfer of the workpiece is inevitable. Therefore, for example, when the film is baked on the substrate to be processed by the heat treatment apparatus, the thickness of the baked film becomes non-uniform, or when the solder bump is formed, the shape of the bump becomes distorted or irregular. A problem arises.
【０００４】その他、熱処理装置内に設けられる搬送装
置や両端開口からの熱ロスの問題、熱処理装置の大型化
という問題などもある。また、被処理物によっては搬送
に適していない形状のものもある。[0004] In addition, there is a problem of heat loss from a transfer device provided in the heat treatment apparatus and openings at both ends, and a problem of an increase in the size of the heat treatment apparatus. Further, some objects to be processed are not suitable for conveyance.
【０００５】本発明は、上記問題を解決することを課題
とし、熱処理中に被処理物が搬出されることなく、従っ
て被処理物が振動することのない熱処理装置を提供する
ことを目的とする。さらに、熱ロスが小さく小型であ
り、被処理物の形状によらず熱処理を高い精度で行える
熱処理装置を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a heat treatment apparatus in which the object to be processed is not carried out during the heat treatment and therefore the object to be processed does not vibrate. . Further, it is another object of the present invention to provide a heat treatment apparatus which has a small heat loss and is small in size and capable of performing heat treatment with high accuracy irrespective of the shape of an object to be processed.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、本発明の熱処理装置は、板状被処理物が載置される
被処理物熱処理板と、熱処理板上の被処理物を輻射加熱
する輻射加熱装置とを備え、熱処理板の内部に少なくと
も一つの流路が設けられ、流路に熱媒体を流すことおよ
び輻射装置により、熱処理板上に載置された被処理物を
段階的に温度変化させて熱処理を施すことを特徴とする
ものである。In order to solve the above-mentioned problems, a heat treatment apparatus according to the present invention includes a heat treatment plate on which a plate-like work is placed, and a heat treatment plate on the heat treatment plate. A radiant heating device for heating, and at least one flow path is provided inside the heat treatment plate, and by flowing a heat medium through the flow path and the radiating device, an object to be processed placed on the heat treatment plate is stepped. And performing a heat treatment by changing the temperature.
【０００７】この熱処理装置によれば、被処理物を搬送
することなく、熱処理できるので、熱処理中に被処理物
が振動することがない。そして、被処理物を搬送してい
る間に熱処理を行うものではないので、被処理物の搬送
スペースが必要でなく装置が小型になり、熱ロスが小さ
くなる。しかも搬送するのに適さない形状の被処理物を
も高い精度で熱処理を行える。According to this heat treatment apparatus, since the heat treatment can be performed without transporting the work, the work does not vibrate during the heat treatment. Since the heat treatment is not performed while the object is being conveyed, no space is required for conveying the object, and the apparatus is reduced in size and heat loss is reduced. In addition, heat treatment can be performed with high accuracy even on an object to be processed that is not suitable for conveyance.
【０００８】また、上記の装置を用いて行われる本発明
の熱処理方法は、少なくとも一つの流路が内部に形成さ
れた被処理物熱処理板に載置された被処理物に対し、流
路に流れる第１熱媒体により被処理物を温度変化させる
行程と、輻射加熱装置によって被処理物を温度変化させ
る行程と、さらに、流路へ第２熱媒体を流して被処理物
を温度変化させる行程を備えているものである。Further, the heat treatment method of the present invention performed using the above-mentioned apparatus is characterized in that the object to be processed placed on the heat-treating plate having at least one channel formed therein has a channel A step of changing the temperature of the object by the flowing first heat medium, a step of changing the temperature of the object by the radiant heating device, and a step of changing the temperature of the object by flowing the second heat medium through the flow path It is provided with.
【０００９】この熱処理方法によれば、被処理物を搬送
することなく多段階の温度変化を伴う熱処理を行うこと
ができる。なお、行程の順序は上記のようには限られな
い。例えば、輻射加熱装置による加熱が最初あるいは最
後に行われてもよい。According to this heat treatment method, a heat treatment involving a multi-step temperature change can be performed without transporting an object to be processed. The order of the steps is not limited to the above. For example, heating by a radiant heating device may be performed first or last.
【００１０】熱媒体によりなされる温度変化のうちの少
なくとも一つが冷却であることがある。[0010] At least one of the temperature changes made by the heating medium may be cooling.
【００１１】この場合、被処理物を下方から冷却して降
温させることができるのでバンプに冷風を吹き付ける必
要がなく、バンプの形状が歪んだり不揃いになることが
なく、また、被処理物側から上側に向かってはんだが固
まるので、ボイド等の欠陥の生成をなくすことができ
る。In this case, the object can be cooled from below to lower the temperature, so that it is not necessary to blow cold air onto the bumps, and the shapes of the bumps are not distorted or irregular. Since the solder hardens toward the upper side, generation of defects such as voids can be eliminated.
【００１２】[0012]
【発明の実施の形態】以下、図面を参照して本発明の実
施形態について説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１３】図１に示された第１の実施形態の熱処理装
置は、断熱材製壁によって形成された処理室(1)と、処
理室(1)内に上下に間隔をおいて配された複数の断熱材
製水平部材(2)と、処理室(1)の上壁を除く水平部材(2)
上に配された被処理物熱処理板(4)と、各熱処理板(4)の
上側に配された輻射加熱装置(3)を備えたものであり、
被処理物熱処理板(4)上に被処理物である基板（被処理
物）(P)が配されている。The heat treatment apparatus according to the first embodiment shown in FIG. 1 has a processing chamber (1) formed by a wall made of a heat insulating material, and is vertically spaced within the processing chamber (1). Multiple horizontal members made of thermal insulation (2) and horizontal members (2) excluding the upper wall of the processing chamber (1)
A heat treatment plate (4) disposed on the upper side, and a radiant heating device (3) disposed above each heat treatment plate (4),
A substrate (object to be processed) (P), which is an object to be processed, is disposed on the heat-treated plate (4) to be processed.
【００１４】なお、処理室(1)の前壁には被処理物搬入
出口(1a)が上下に間隔をおいて複数形成され、かつ各搬
入出口(1a)を開閉する扉(5)が設けられている。さら
に、処理室(1)の後壁をそれぞれ貫通した雰囲気ガス供
給管(6)と、雰囲気ガス排出管(7)とが設けられており、
必要に応じて熱処理室内に雰囲気ガスを導入したり、ま
た処理室から雰囲気ガスを排出できるようになってい
る。なお、図示は省略したが熱処理装置の前方には公知
の被処理物搬入出装置が配されており、この搬入出装置
によって被処理物(P)が搬入出される。On the front wall of the processing chamber (1), a plurality of workpiece loading / unloading ports (1a) are formed at intervals vertically, and a door (5) for opening and closing each loading / unloading port (1a) is provided. Have been. Further, an atmosphere gas supply pipe (6) penetrating the rear wall of the processing chamber (1) and an atmosphere gas discharge pipe (7) are provided,
Atmosphere gas can be introduced into the heat treatment chamber as needed, and the atmosphere gas can be exhausted from the treatment chamber. Although not shown, a known object loading / unloading device is disposed in front of the heat treatment device, and the object (P) is loaded / unloaded by the loading / unloading device.
【００１５】図２には、熱処理板(4)の詳細が示されて
いる。熱処理板(4)は中空であり、熱媒体導入管(8)と熱
媒体導出管(9)とがそれぞれ接続されて中空部分(4a)が
第１熱媒体流路となされている。なお、熱媒体導入管
(8)および熱媒体導出管(9)はそれぞれバルブ(B1)(B2)を
介して図示しない、第１熱媒体貯留槽に接続され、後に
述べる様に中空部分(4a)を流れた熱媒体を回収して再利
用するようになっている。FIG. 2 shows the details of the heat treatment plate (4). The heat treatment plate (4) is hollow, and the heat medium introduction pipe (8) and the heat medium discharge pipe (9) are connected to each other, so that the hollow part (4a) forms a first heat medium flow path. In addition, heat medium introduction pipe
(8) and the heat medium outlet pipe (9) are connected to a first heat medium storage tank (not shown) via valves (B1) and (B2), respectively, and the heat medium flowing through the hollow portion (4a) as described later. Are collected and reused.
【００１６】さらに、中空部分(4a)内には、平面から見
て蛇行状に伸びる配管(10)が配されており、この配管(1
0)が第２の流路となされている。配管(10)の端部はそれ
ぞれ熱処理板(4)の後壁を貫通して外部へ突出してい
る。配管(10)もバルブ(B3)(B4)を介して図示しない、第
２熱媒体貯留槽に接続され、後に述べる様に配管(10)を
流れた熱媒体を回収して再利用するようになっている。Further, in the hollow portion (4a), a pipe (10) extending in a meandering shape when viewed from a plane is disposed.
0) is a second flow path. The ends of the pipes (10) respectively penetrate the rear wall of the heat treatment plate (4) and protrude to the outside. The pipe (10) is also connected to a second heat medium storage tank (not shown) via valves (B3) and (B4) so that the heat medium flowing through the pipe (10) is recovered and reused as described later. Has become.
【００１７】なお、図示は省略したが、各熱媒体貯留槽
と熱処理板(4)とを結ぶ配管部分は、断熱材により覆わ
れている。Although not shown, the piping connecting each heat medium storage tank and the heat treatment plate (4) is covered with a heat insulating material.
【００１８】輻射加熱装置(3)の詳細な図示は省略した
が、輻射加熱装置(3)は、赤外線や遠赤外線を放射する
ランプやヒータなどの本体と、本体のハウジングを貫通
する冷却媒体流路(3a)とを備えている。流路(3a)はバル
ブ(B9)(B10)を介して図示しない冷却媒体貯留槽に接続
されている。Although the detailed illustration of the radiant heating device (3) is omitted, the radiant heating device (3) includes a main body such as a lamp or a heater that emits infrared rays or far-infrared rays and a cooling medium flowing through a housing of the main body. Road (3a). The channel (3a) is connected to a cooling medium storage tank (not shown) via valves (B9) and (B10).
【００１９】この熱処理装置を例えば、はんだリフロー
装置として用いる場合について以下に述べるが、この熱
処理装置によって他の熱処理を行うことも可能である。The case where this heat treatment apparatus is used as, for example, a solder reflow apparatus will be described below. However, other heat treatments can be performed by this heat treatment apparatus.
【００２０】なお、熱処理板(4)上にボール状のはんだ
(B)が載せられた被処理物(P)を載置し、熱処理後に取り
出す手順は公知のものであるので、以下、熱処理板(4)
上に載置された被処理物(P)に熱処理を施す手順につい
て説明する。The ball-shaped solder is placed on the heat-treated plate (4).
Since the procedure for mounting the object (P) on which the (B) is mounted and removing it after the heat treatment is known, the heat treatment plate (4)
A procedure for performing a heat treatment on the object to be processed (P) mounted thereon will be described.
【００２１】まず、バルブ(B1)(B2)(B3)(B4)が閉じた状
態からバルブ(B1)(B2)を開いて中空部分(4a)内を所定温
度の第１熱媒体が流れるようにする。中空部分(4a)内を
流れた熱媒体は、前記第１熱媒体貯蔵槽に戻る。このよ
うに熱媒体は、第１熱媒体貯蔵槽と熱処理板(4)との間
を循環し、温度が下がった熱媒体は貯蔵槽において再び
所定温度まで戻されるので、熱媒体の持っている熱が無
駄になることがない。こうして熱処理板(4)上の被処理
物(P)が所定温度になされて予熱される。なお、被処理
物(P)を熱処理板(4)上に載置した後に第１の熱媒体を流
すこともあれば、第１の熱媒体が流れている熱処理板
(4)の上に被処理物(P)を載置することもある。First, when the valves (B1), (B2), (B3), and (B4) are closed, the valves (B1) and (B2) are opened to allow the first heat medium of a predetermined temperature to flow through the hollow portion (4a). To The heat medium flowing in the hollow portion (4a) returns to the first heat medium storage tank. Thus, the heat medium circulates between the first heat medium storage tank and the heat treatment plate (4), and the heat medium whose temperature has decreased is returned to the predetermined temperature again in the storage tank, so that the heat medium has No heat is wasted. Thus, the object (P) on the heat-treated plate (4) is heated to a predetermined temperature. The first heat medium may flow after the object to be processed (P) is placed on the heat treatment plate (4), or the heat treatment plate through which the first heat medium flows may be used.
The object to be processed (P) may be placed on (4).
【００２２】この後、バルブ(B1)を閉じ、輻射加熱装置
(3)により基板(P)の上表面側から輻射加熱してさらに温
度変化させて本加熱し、ボール状のはんだ(B)をリフロ
ーする。Thereafter, the valve (B1) is closed and the radiant heating device is closed.
According to (3), radiant heating is performed from the upper surface side of the substrate (P), the temperature is further changed, the main heating is performed, and the ball-shaped solder (B) is reflowed.
【００２３】つぎに、輻射加熱装置(3)による加熱をや
め、バルブ(B3)(B4)を開いて配管(10)内を所定温度（第
１熱媒体とは異なる温度かつ輻射加熱装置(3)により加
熱された基板(P)の温度より低い温度）の第２熱媒体が
流れるようにして被処理物(P)を冷却する。第２熱媒体
は上記の場合と同様に、第２貯蔵槽と熱処理板(4)との
間を循環する。こうして中空部分(4a)に満たされた第１
熱媒体を介しての伝熱により被処理物(P)が所定温度ま
で降温させられる。なお、同時にバルブ(B9)(B10)が開
かれて冷却媒体流路(3a)内を冷却媒体が流れて輻射加熱
装置(3)が冷却される。Next, the heating by the radiant heating device (3) is stopped, the valves (B3) and (B4) are opened, and the inside of the pipe (10) is heated to a predetermined temperature (a temperature different from the first heat medium and the radiant heating device (3)). The object to be processed (P) is cooled by flowing the second heat medium of a temperature lower than the temperature of the substrate (P) heated by ()). The second heat medium circulates between the second storage tank and the heat treatment plate (4) as in the above case. Thus, the first portion filled in the hollow portion (4a)
The object to be processed (P) is cooled to a predetermined temperature by heat transfer via the heat medium. At the same time, the valves (B9) and (B10) are opened, the cooling medium flows in the cooling medium flow path (3a), and the radiant heating device (3) is cooled.
【００２４】輻射加熱装置(3)を冷却することにより被
処理物(P)の冷却をいっそう早めることができる。さら
に、次の処理の初期条件を一定にできるので処理の再現
性を高めることができ、均一な処理を高いスループット
で行うことができる。The cooling of the object (P) can be further accelerated by cooling the radiant heating device (3). Further, since the initial conditions for the next process can be kept constant, the reproducibility of the process can be improved, and uniform processing can be performed with high throughput.
【００２５】中空部分(4a)および配管(10)に流す熱媒体
は使用温度によって適宜選択すればよい。例えば、使用
温度が１０〜８０℃であれば水、１３０℃までであれば
メタノール、５０〜２３０℃であればシリコンオイルや
フロロカーボン、２００〜３５０℃であればナフタレン
などが好ましい。The heating medium flowing through the hollow portion (4a) and the pipe (10) may be appropriately selected depending on the operating temperature. For example, water is preferably used at a temperature of 10 to 80 ° C., methanol at 130 ° C., silicon oil or fluorocarbon at 50 to 230 ° C., and naphthalene at 200 to 350 ° C.
【００２６】加熱時間および降温時間も適宜選択すれば
よい。The heating time and the cooling time may be appropriately selected.
【００２７】また、熱処理板(4)および配管(10)は熱伝
導性のよいものが好ましい。具体的には、アルミニウム
製や銅製などがよい。The heat treatment plate (4) and the pipe (10) preferably have good heat conductivity. Specifically, it is preferably made of aluminum or copper.
【００２８】つぎに図３を参照して本発明の他の実施形
態の熱処理装置について説明する。なお、以下に述べる
熱処理装置は、図示した部分以外は先に述べた熱処理装
置と同様の構成を有するものであり、説明は省略する。Next, a heat treatment apparatus according to another embodiment of the present invention will be described with reference to FIG. Note that the heat treatment apparatus described below has the same configuration as the heat treatment apparatus described above except for the illustrated portions, and a description thereof will be omitted.
【００２９】図３には熱処理板部分の拡大断面図が示さ
れている。この中空熱処理板(11)内には水平板状仕切部
材(12)がこれと垂直な方向、すなわち上下方向に移動自
在に配され、この水平板状仕切部材(12)により熱処理板
(11)内部が上下に分割されている。図３には、熱処理板
(11)内に等量の第１、第２熱媒体が入っている状態が示
されているが、水平板状仕切部材(12)の位置は熱処理板
(11)内の第１、第２熱媒体の量により変化する。そし
て、熱処理板(11)の最下部に第１熱媒体導入管(16)と第
１熱媒体導出管(15)とがそれぞれ接続されている。ま
た、最上部に第２熱媒体導入管(13)と第２熱媒体導出管
(14)とがそれぞれ接続されている。なお、各管(13)(14)
(15)(16)にはバルブ(B5)(B6)(B7)(B8)が設けられてい
る。FIG. 3 is an enlarged sectional view of the heat-treated plate portion. In the hollow heat-treated plate (11), a horizontal plate-shaped partition member (12) is arranged movably in a direction perpendicular to the horizontal heat-treating plate, that is, in a vertical direction.
(11) The inside is divided vertically. FIG. 3 shows a heat-treated plate
(11) shows a state in which equal amounts of the first and second heat carriers are contained, but the position of the horizontal plate-like partition member (12) is
It varies depending on the amounts of the first and second heat carriers in (11). Further, a first heat medium introduction pipe (16) and a first heat medium discharge pipe (15) are connected to the lowermost part of the heat treatment plate (11). At the top, a second heat medium inlet pipe (13) and a second heat medium outlet pipe
(14) are connected to each other. In addition, each pipe (13) (14)
(15) and (16) are provided with valves (B5), (B6), (B7), and (B8).
【００３０】この熱処理板(11)においては、バルブ(B5)
(B8)が閉じられ、バルブ(B6)(B7)が開いた状態からバル
ブ(B8)が開かれて第１熱媒体導入管(16)から所定温度の
第１熱媒体が熱処理板(11)内に流れ込む。そして第１熱
媒体は、第１熱媒体導出管(15)から熱処理板(11)の外部
へと流れ出る。このさい、水平板状仕切部材(12)は上下
に移動自在であるから熱処理板(11)内に流れ込む第１熱
媒体の圧力により最も上方にまで押し上げられ、熱処理
板(11)内が第１熱媒体によって満たされる。このように
して熱処理板(11)上の被処理物(P)が所定温度になされ
て予熱される。In the heat-treated plate (11), the valve (B5)
(B8) is closed, the valve (B8) is opened from the state where the valves (B6) and (B7) are open, and the first heat medium of a predetermined temperature is supplied from the first heat medium introduction pipe (16) to the heat treatment plate (11). Flows into. Then, the first heat medium flows out of the first heat medium outlet pipe (15) to the outside of the heat treatment plate (11). At this time, since the horizontal plate-shaped partition member (12) is movable up and down, it is pushed up to the uppermost position by the pressure of the first heat medium flowing into the heat treatment plate (11), and the inside of the heat treatment plate (11) becomes the first heat medium. Filled with heat medium. In this way, the object (P) on the heat-treated plate (11) is heated to a predetermined temperature and preheated.
【００３１】この後、バルブ(B8)を閉じ、輻射加熱装置
(3)により基板(P)の上表面側から輻射加熱してさらに温
度変化させて本加熱する。Thereafter, the valve (B8) is closed, and the radiant heating device is closed.
According to (3), the substrate (P) is radiantly heated from the upper surface side to further change the temperature to perform main heating.
【００３２】そして、熱処理板(11)上の被処理物(P)が
所定温度にされた後は、輻射加熱をやめ、同時にバルブ
(B5)を開く。そして、所定温度（第１熱媒体の温度とは
異なる）の第２熱媒体が熱処理板(11)内に流れ込む。こ
のさい、既にバルブ(B8)は閉じられ、熱処理板(11)内の
第１熱媒体には圧力がかかっていないので、第２熱媒体
が熱処理板(11)内に流れ込むにつれて水平板状仕切部材
(12)は下方に移動し、熱処理板(11)内の第１熱媒体は熱
処理板(11)外へと押し出される。そして、水平板状仕切
部材(12)は熱処理板(11)内において最も下方に位置し、
熱処理板(11)内は第２熱媒体によって満たされる。この
ようにして被処理物(P)が所定温度に降温される。な
お、同時にバルブ(B9)(B10)が開かれて冷却媒体流路(3
a)内を冷却媒体が流れて輻射加熱装置(3)が冷却される
のは上記実施形態の場合と同様である。After the object (P) on the heat-treated plate (11) is heated to a predetermined temperature, the radiation heating is stopped, and at the same time, the valve is heated.
Open (B5). Then, the second heat medium at a predetermined temperature (different from the temperature of the first heat medium) flows into the heat treatment plate (11). At this time, since the valve (B8) is already closed and the first heat medium in the heat treatment plate (11) is not under pressure, the horizontal plate-like partition is formed as the second heat medium flows into the heat treatment plate (11). Element
(12) moves downward, and the first heat medium in the heat treatment plate (11) is pushed out of the heat treatment plate (11). And the horizontal plate-shaped partition member (12) is located at the lowest position in the heat-treated plate (11),
The inside of the heat treatment plate (11) is filled with the second heat medium. Thus, the object to be processed (P) is cooled to a predetermined temperature. At the same time, the valves (B9) and (B10) are opened and the cooling medium flow path (3
The cooling medium flows in a) to cool the radiant heating device (3) as in the above embodiment.
【００３３】つぎに図４を参照して本発明のさらに他の
実施形態の熱処理装置について説明する。この熱処理板
(20)内には、水平板状仕切部材(12)に変えて、膜状仕切
部材(21)が設けられている。膜状仕切部材(21)は、伸縮
性を有し、図４に実線で示したように周端が熱処理板(2
0)の周壁内面の高さの中央に固定されて熱処理板(20)を
上下に分割している。膜状仕切部材(21)の状態は熱処理
板(20)内の第１、第２熱媒体の量により変化する。Next, a heat treatment apparatus according to still another embodiment of the present invention will be described with reference to FIG. This heat-treated plate
In (20), a film-like partition member (21) is provided instead of the horizontal plate-like partition member (12). The membrane-like partition member (21) has elasticity, and its peripheral end is a heat-treated plate (2) as shown by a solid line in FIG.
The heat treatment plate (20) is fixed to the center of the height of the inner surface of the peripheral wall of (0) and is vertically divided. The state of the film-like partition member (21) changes depending on the amounts of the first and second heat carriers in the heat treatment plate (20).
【００３４】この熱処理板(20)において、バルブ(B5)(B
8)が閉じられ、バルブ(B6)(B7)が開いた状態からバルブ
(B8)を開くと第１熱媒体導入管(16)から第１熱媒体が熱
処理板(20)内に流れ込んで図４に二点鎖線で示したよう
に、膜状仕切部材(21)が上方へと膨らむ。そして、膜状
仕切部材(21)は、周壁内面の上半分、上壁内面に沿う形
状となり、熱処理板(20)内が第１熱媒体によって満たさ
れる。この後、バルブ(B8)を閉じ、輻射加熱装置(3)に
より基板(P)を輻射加熱する。In the heat-treated plate (20), the valves (B5) (B
8) is closed and valves (B6) and (B7) are open.
When (B8) is opened, the first heat medium flows into the heat treatment plate (20) from the first heat medium introduction pipe (16), and as shown by the two-dot chain line in FIG. Inflates upward. Then, the film-like partition member (21) has a shape along the upper half of the inner surface of the peripheral wall and along the inner surface of the upper wall, and the inside of the heat treatment plate (20) is filled with the first heat medium. Thereafter, the valve (B8) is closed, and the substrate (P) is radiatively heated by the radiant heating device (3).
【００３５】つぎに、輻射加熱をやめ、同時にバルブ(B
5)を開く。そして、第２熱媒体が熱処理板(20)内に流れ
込む。このさい、既にバルブ(B8)は閉じられ、熱処理板
(20)内の第１熱媒体には圧力がかかっていないので、第
２熱媒体が熱処理板(20)内に流れ込むにつれて第１熱媒
体が熱処理板(20)の外部へと押しやられて膜状仕切部材
(21)は下方へと膨らむ。そして、膜状仕切部材(21)は、
周壁内面の下半分、下壁内面に沿う形状となり、熱処理
板(20)内が第２熱媒体によって満たされる。なお、同時
にバルブ(B9)(B10)が開かれて冷却媒体流路(3a)内を冷
却媒体が流れて輻射加熱装置(3)が冷却されるのは上記
実施形態の場合と同様である。Next, the radiation heating was stopped, and at the same time, the valve (B
5) Open. Then, the second heat medium flows into the heat treatment plate (20). At this time, the valve (B8) is already closed and the heat-treated plate
Since no pressure is applied to the first heat medium in (20), as the second heat medium flows into the heat treatment plate (20), the first heat medium is pushed out of the heat treatment plate (20), and Partitioning member
(21) expands downward. And the membrane-like partition member (21)
The lower half of the inner surface of the peripheral wall is shaped along the inner surface of the lower wall, and the inside of the heat treatment plate (20) is filled with the second heat medium. It is to be noted that the valves (B9) and (B10) are simultaneously opened and the cooling medium flows in the cooling medium flow path (3a) to cool the radiant heating device (3) as in the case of the above embodiment.
【００３６】なお、本発明の加熱装置は上記実施形態の
構成に限定されるものではなく、適宜変更自在である。
例えば、各バルブの開閉のタイミングと輻射加熱装置の
オン、オフのタイミングとは、必ずしも上記のようには
限定されず、目的により逐次最適なタイミングの組み合
わせを選択すればよい。また、配管(10)は平面から見て
渦巻き状をなしていてもよい。The heating device of the present invention is not limited to the configuration of the above embodiment, but can be changed as appropriate.
For example, the timing for opening and closing each valve and the timing for turning on and off the radiant heating device are not necessarily limited to the above, and an optimal combination of timings may be selected according to purpose. Further, the pipe (10) may have a spiral shape when viewed from a plane.
【００３７】なお、第１と第２の熱媒体の流路を入れ替
えてもよい。またにより加熱した後に、２段階に降温す
ることもできる。従って本発明の装、本発明の装置は、
第１熱媒体および第２熱媒体の温度を適宜選択すること
によって被処理物を段階的に加熱することや加熱および
冷却を組み合わせた熱処理を行うことができる。すなわ
ち、上記の様に２段階加熱の後に降温するだけでなく、
例えば３段階に加熱することもできる。さらには、輻射
加熱装置置は、はんだリフローのみならず、各種基板お
よび基板表面に形成された各種の膜の熱処理にも利用で
きる。The flow paths of the first and second heat carriers may be interchanged. After the heating, the temperature can be lowered in two stages. Therefore, the device of the present invention and the device of the present invention
By appropriately selecting the temperatures of the first heat medium and the second heat medium, the object to be processed can be heated stepwise or a heat treatment combining heating and cooling can be performed. That is, not only does the temperature drop after the two-stage heating as described above,
For example, heating can be performed in three stages. Further, the radiation heating device can be used not only for solder reflow but also for heat treatment of various substrates and various films formed on the substrate surface.
【００３８】また、熱処理板内の流路は一つ以上であれ
ばよく、上記実施形態のように流路が二つあるものには
限定されない。そして例えば一つの流路内に複数の異な
る温度の熱媒体を切り換えて流すことにより熱処理板に
よって２段階以上の温度変化を伴う熱処理を行うことが
できる。なお、熱処理板によって行われる熱処理は熱媒
体の温度によって定められるものであり、加熱、降温の
いずれをも行うことができる。The number of channels in the heat treatment plate may be one or more, and is not limited to the one having two channels as in the above embodiment. Then, for example, by switching and flowing a plurality of heat mediums having different temperatures in one flow path, heat treatment involving two or more stages of temperature change can be performed by the heat treatment plate. Note that the heat treatment performed by the heat treatment plate is determined by the temperature of the heat medium, and can be either heating or cooling.
【図１】本発明の１実施形態における熱処理装置の断面
図である。FIG. 1 is a sectional view of a heat treatment apparatus according to an embodiment of the present invention.
【図２】同熱処理装置の熱処理板部分の拡大断面図であ
る。FIG. 2 is an enlarged sectional view of a heat-treated plate portion of the heat-treating apparatus.
【図３】他の実施形態の熱処理装置における熱処理板部
分の拡大断面図である。FIG. 3 is an enlarged cross-sectional view of a heat-treated plate in a heat-treating apparatus according to another embodiment.
【図４】さらに、他の実施形態の熱処理装置における熱
処理板部分の拡大断面図である。FIG. 4 is an enlarged cross-sectional view of a heat-treated plate in a heat-treating apparatus according to another embodiment.
(3) 輻射加熱装置 (4) 熱処理板 (4a) 第１の流路（中空部分） (10) 第２の流路（配管） (11) 熱処理板 (12) 板状仕切部材 (20) 熱処理板 (21) 膜状仕切部材 (P) 被処理物（基板） (3) Radiant heating device (4) Heat treatment plate (4a) First flow path (hollow part) (10) Second flow path (piping) (11) Heat treatment plate (12) Plate-shaped partition member (20) Heat treatment Plate (21) Membrane partition (P) Workpiece (substrate)
Claims (3)
理板と、熱処理板上の被処理物を輻射加熱する輻射加熱
装置とを備え、 熱処理板の内部に少なくとも一つの流路が設けられ、 流路に熱媒体を流すことおよび輻射装置により、熱処理
板上に載置された被処理物を段階的に温度変化させて熱
処理を施すことを特徴とする熱処理装置。1. An object heat treatment plate on which a plate-like object is placed, and a radiant heating device for radiantly heating the object on the heat treatment plate, wherein at least one flow path is provided inside the heat treatment plate. A heat treatment apparatus characterized in that a heat medium is caused to flow through a flow path and a heat treatment is performed by changing a temperature of an object to be processed placed on a heat treatment plate in a stepwise manner by a radiation device.
た被処理物熱処理板に載置された被処理物に対し、 流路に流れる第１熱媒体により被処理物を温度変化させ
る行程と、 輻射加熱装置によって被処理物を温度変化させる行程
と、 さらに、流路へ第２熱媒体を流して被処理物を温度変化
させる行程を備えていることを特徴とする熱処理方法。And a step of changing the temperature of the object to be processed mounted on the object heat treatment plate having at least one flow path formed therein by a first heat medium flowing through the flow path. A heat treatment method comprising: a step of changing the temperature of an object to be processed by a radiation heating device; and a step of changing the temperature of the object to be processed by flowing a second heat medium through a flow path.
少なくとも一つが冷却であることを特徴とする請求項２
記載の方法。3. The method according to claim 2, wherein at least one of the temperature changes made by the heat medium is cooling.
The described method.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000354119A JP4003204B2 (en) | 2000-11-21 | 2000-11-21 | Heat treatment apparatus and heat treatment method for heat treating a plate-like object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000354119A JP4003204B2 (en) | 2000-11-21 | 2000-11-21 | Heat treatment apparatus and heat treatment method for heat treating a plate-like object |
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| Publication Number | Publication Date |
|---|---|
| JP2002158245A true JP2002158245A (en) | 2002-05-31 |
| JP4003204B2 JP4003204B2 (en) | 2007-11-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005297334A (en) * | 2004-04-09 | 2005-10-27 | Yokohama Rubber Co Ltd:The | Method for manufacturing honeycomb sandwich structure, heating device used for this method and base plate for heating/cooling-type lamination |
-
2000
- 2000-11-21 JP JP2000354119A patent/JP4003204B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005297334A (en) * | 2004-04-09 | 2005-10-27 | Yokohama Rubber Co Ltd:The | Method for manufacturing honeycomb sandwich structure, heating device used for this method and base plate for heating/cooling-type lamination |
| JP4501150B2 (en) * | 2004-04-09 | 2010-07-14 | 横浜ゴム株式会社 | Manufacturing method of honeycomb sandwich structure, heating apparatus used therefor, and heating / cooling type base plate for lamination |
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