JP2002151825A - Mounting method of connector - Google Patents

Mounting method of connector

Info

Publication number
JP2002151825A
JP2002151825A JP2000341227A JP2000341227A JP2002151825A JP 2002151825 A JP2002151825 A JP 2002151825A JP 2000341227 A JP2000341227 A JP 2000341227A JP 2000341227 A JP2000341227 A JP 2000341227A JP 2002151825 A JP2002151825 A JP 2002151825A
Authority
JP
Japan
Prior art keywords
connector
circuit
mounting
discarded
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000341227A
Other languages
Japanese (ja)
Inventor
Takeo Nakajima
建夫 中島
Osamu Kumazawa
治 熊澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000341227A priority Critical patent/JP2002151825A/en
Publication of JP2002151825A publication Critical patent/JP2002151825A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce manufacturing costs by mounting a connector to the circuit section of a circuit board, without using lifters. SOLUTION: A cavity section 11 surrounded by a disposal substrate 3 is formed at the end section of a circuit section 2 of a circuit substrate 1, a support board 12 is bridged to the cavity section 11 for positioning and retaining the connector 5, a terminal section 2a and a circuit conductor 2a are jointed through soldering for mounting, and the disposal substrate is separated along a split line for removing the support board 12.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は電子部品であるコネ
クタを回路基板に実装する実装方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method for mounting a connector as an electronic component on a circuit board.

【0002】[0002]

【従来の技術】近年、情報関連の分野に於ける機器の小
型、軽量、高密度化は著しく進んでいる。それに伴い製
造方法においても精密正確さを求められる一方、合理化
と製造方法の簡略化も要求されている。従来の技術とし
て図12に示すように機械実装の出来ない部品は実装治
具を用いて部品実装を行っている。
2. Description of the Related Art In recent years, the size, weight, and density of equipment in the information-related field have been remarkably increased. Accordingly, precision and accuracy are required in the manufacturing method, while rationalization and simplification of the manufacturing method are also required. As a conventional technique, as shown in FIG. 12, components that cannot be machine-mounted are mounted using a mounting jig.

【0003】以下図11を参照しながら、上述した従来
の方法の一例について説明する。図11(b)〜(c)は、
回路基板1の回路部2とコネクタ5との実装前を示す分
解斜視図および組立状態の側面断面図、また図11(a)
は単品取り基板1を示す平面図である。回路基板1は、
回路部2と捨て基板部3と回路基板分割線(たとえば分
割用溝)4で構成され、製造方法により回路部2がたと
えば単品の場合は、図12(a)に示すように、周囲また
は両側部に捨て基板部3を形成し、また多数個取りの場
合は、回路部2を複数個まとめて周囲に捨て基板部3を
形成していることが多い。
An example of the above-described conventional method will be described below with reference to FIG. FIGS. 11 (b) to 11 (c)
FIG. 11 (a) is an exploded perspective view showing the circuit portion 2 of the circuit board 1 and the connector 5 before mounting, and a side sectional view showing an assembled state.
FIG. 2 is a plan view showing the single product pick-up board 1. The circuit board 1
When the circuit portion 2 is composed of, for example, a single product depending on the manufacturing method, the circuit portion 2, the discarded substrate portion 3, and the circuit board dividing line (for example, a dividing groove) 4, as shown in FIG. In many cases, a plurality of circuit portions 2 are collectively formed to form a discard substrate portion 3 around the periphery.

【0004】実装時には、捨て基板部3を分離して回路
部2だけを用い、コネクタ5を回路部2に実装するとき
に位置ばらつきの防止と作業性をよくするために受け台
6を用いる。
At the time of mounting, the discard substrate portion 3 is separated and only the circuit portion 2 is used. When mounting the connector 5 on the circuit portion 2, a cradle 6 is used to prevent positional variation and improve workability.

【0005】受け台6は、回路部2とコネクタ5を配置
したときに、所定の位置、高さになるように回路部受け
部6a,コネクタ受け部6bはそれぞれの寸法にあわせ
着脱自在で、かつ位置が大きく狂わないように位置決め
可能に形成されている。
When the circuit portion 2 and the connector 5 are arranged, the receiving portion 6 has a circuit portion receiving portion 6a and a connector receiving portion 6b which can be freely attached and detached so as to have predetermined positions and heights in accordance with respective dimensions. Further, it is formed so as to be positionable so that the position is not largely deviated.

【0006】実装手順は、受け台6の回路部受け部6
a,コネクタ受け部6bに回路部2、コネクタ5の順に
それぞれ配置して位置決めし、次いで端子部5aと回路
部2の回路導体2aとをはんだ7を用いて接合して実装
を完了する。
[0006] The mounting procedure is as follows.
a, the circuit portion 2 and the connector 5 are arranged and positioned in the connector receiving portion 6b in this order, and then the terminal portion 5a and the circuit conductor 2a of the circuit portion 2 are joined by using the solder 7 to complete the mounting.

【0007】[0007]

【発明が解決しようとする課題】しかしながら上記構成
では、生産量が多い場合には受け台6を多量に作成しな
ければならず、また使用後は、受け台6の保管管理によ
る場所と手間、補修の費用が必要となりコスト増になる
という問題点があった。
However, in the above configuration, when the production amount is large, a large number of cradles 6 must be prepared, and after use, the space and time required for storage and management of the cradle 6 are reduced. There was a problem that the cost of repair was required and the cost increased.

【0008】[0008]

【課題を解決するための手段】上記問題点を解決するた
めに本発明は、回路基板にコネクタを実装するに際し
て、回路基板で回路部の端部に設けられた捨て基板部
に、コネクタが嵌合可能な切欠き部を形成し、前記捨て
基板部の切欠き部の2つの辺部にわたって支え部材を配
置し、前記切欠き部内にコネクタを挿入して支え部材に
より支持させ、前記コネクタの端子部と回路部の回路導
体とをはんだ付けした後、捨て基板部を除去して支え部
材を外し、コネクタを回路基板に実装することにより上
記課題を解決するものである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, when a connector is mounted on a circuit board, the connector is fitted to a discarded board portion provided at an end of the circuit portion on the circuit board. Forming a notch portion that can be fitted, a support member disposed over two sides of the notch portion of the discarded substrate portion, a connector inserted into the notch portion and supported by the support member, and a terminal of the connector This object is achieved by soldering the part and the circuit conductor of the circuit part, removing the discarded substrate part, removing the supporting member, and mounting the connector on the circuit board.

【0009】[0009]

【発明の実施の形態】本発明の請求項1記載の発明は、
回路部と捨て基板部とを有する回路基板にコネクタを実
装するに際して、回路部の端部にコネクタが嵌合可能で
かつ少なくとも両側に捨て基板部を有する切欠き部を形
成し、前記捨て基板部の切欠き部の2つの辺部にわたっ
て支え部材を配置し、前記切欠き部内にコネクタを挿入
して支え部材により支持させ、前記コネクタの端子部と
回路部の回路導体とをはんだ付けした後、捨て基板を除
去して支え部材を外し、コネクタを回路基板に実装する
ものである。上記方法によれば、回路基板に形成した切
欠き部と簡単な支え部材とで、コネクタを位置決めして
回路基板に実装することができ、製造コストを低く出来
るという作用を奏する。
BEST MODE FOR CARRYING OUT THE INVENTION
When mounting the connector on a circuit board having a circuit portion and a discarded board portion, a cutout portion is formed at an end of the circuit portion so that the connector can be fitted and has discarded board portions on at least both sides, and the discarded board portion is formed. After arranging a support member over two sides of the notch portion, inserting a connector into the notch portion and supporting the support member, and soldering a terminal portion of the connector and a circuit conductor of a circuit portion, The discarded substrate is removed, the supporting member is removed, and the connector is mounted on the circuit board. According to the above method, the connector can be positioned and mounted on the circuit board by the notch formed in the circuit board and the simple support member, and the operation of reducing the manufacturing cost can be achieved.

【0010】請求項2記載の発明は、上記方法におい
て、支え部材が対向する辺部にわたって掛け渡され、切
欠き部と支え部材とにより、コネクタの端子部が回路導
体に対応する位置に幅方向および深さ方向に位置決めさ
れるものである。上記方法によれば、コネクタを精度良
く位置決めして容易に実装することができる。
According to a second aspect of the present invention, in the above method, the supporting member is stretched over the opposing sides, and the notch portion and the supporting member move the terminal portion of the connector to a position corresponding to the circuit conductor in the width direction. And in the depth direction. According to the above method, the connector can be accurately positioned and easily mounted.

【0011】請求項3記載の発明は、回路部と捨て基板
部とを有する回路基板にコネクタを実装するに際して、
回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成するとともに、
この切欠き部の辺部の捨て基板部または/および回路部
に位置決め用凸部を形成し、前記切欠き部にコネクタを
配置して、前記位置決め用凸部によりコネクタの端子部
が回路部の回路導体に対応する略水平姿勢に位置決めさ
せ、コネクタの端子部と回路導体とをはんだ付けした
後、捨て基板部を除去してコネクタを回路基板に実装す
るものである。上記方法によれば、切欠き部に設けた相
対する2辺の凸部、または4辺の凸部、あるいは凸部と
切欠き部の辺部とでコネクタを挟み保持して位置決めす
るので、回路基板の形成と同時に凸部を有する切欠き部
を形成でき、余分な部材を必要とせず、製造コストを削
減できるという作用効果を有する。
According to a third aspect of the present invention, when a connector is mounted on a circuit board having a circuit portion and a waste board portion,
Forming a notch having a discardable substrate portion on which a connector can be fitted at an end of the circuit portion and at least on both sides,
A positioning convex portion is formed on the discarded substrate portion and / or the circuit portion on the side of the notch portion, and a connector is disposed in the notch portion, and the terminal portion of the connector is connected to the circuit portion by the positioning convex portion. After positioning the connector in a substantially horizontal position corresponding to the circuit conductor and soldering the terminal portion of the connector and the circuit conductor, the discarded board portion is removed and the connector is mounted on the circuit board. According to the above-described method, the connector is sandwiched and held between the opposed two-sided protrusions or the four-sided protrusions provided in the notch portion, or the protrusion and the notch side portion. A notch having a convex portion can be formed at the same time as the formation of the substrate, which has the effect of eliminating the need for an extra member and reducing the manufacturing cost.

【0012】請求項4記載の発明は、請求項3の方法に
おいて、位置決め用凸部に対応する捨て基板部または回
路部に、応力吸収穴を形成して位置決め用凸部に弾性を
持たせるものである。上記方法によれば、凸部の後に応
力吸収穴を形成して凸部の支える捨て基板部の幅を小さ
くすることにより、凸部にたわみ性を持たせてコネクタ
を挟み込む力が生じるので、コネクタを安定して保持し
精度良く位置決めすることができる。
According to a fourth aspect of the present invention, in the method according to the third aspect, a stress absorbing hole is formed in a discarded substrate portion or a circuit portion corresponding to the positioning convex portion so that the positioning convex portion has elasticity. It is. According to the above method, by forming a stress absorbing hole after the convex portion to reduce the width of the discarded substrate portion supported by the convex portion, a force is generated that causes the convex portion to have flexibility and pinch the connector. Can be held stably and positioned with high accuracy.

【0013】請求項5記載の発明は、回路部と捨て基板
部とを有する回路基板にコネクタを実装するに際して、
回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成し、前記切欠き
部にコネクタを配置して、コネクタから突出する複数の
位置決めピン、または位置決めピンと端子部によりコネ
クタを位置決めし、コネクタの端子部と回路部の回路導
体とをはんだ付けした後、捨て基板部を除去してコネク
タを回路導体に実装するものである。上記方法によれ
ば、コネクタを切欠き部に設置したときに、コネクタが
切欠き部から脱落しないようにコネクタ側面に回路基板
の表面と接する位置決めピンにより端子部と共にコネク
タを支え位置決めすることができるので、製造コストを
削減できるという作用効果を奏する。
According to a fifth aspect of the present invention, when the connector is mounted on a circuit board having a circuit portion and a waste board portion,
A notch portion is formed at the end of the circuit portion, into which the connector can be fitted and at least on both sides has a discarded substrate portion, and the connector is arranged in the notch portion, and a plurality of positioning pins projecting from the connector, or positioning. A connector is positioned by pins and terminals, and after soldering a terminal portion of the connector and a circuit conductor of a circuit portion, a discarded substrate portion is removed and the connector is mounted on the circuit conductor. According to the above method, when the connector is installed in the notch, the connector can be supported and positioned together with the terminal by the positioning pin in contact with the surface of the circuit board on the side of the connector so that the connector does not fall out of the notch. Therefore, there is an effect that the manufacturing cost can be reduced.

【0014】請求項6記載の発明は、請求項7の方法に
おいて、位置決めピンは着脱式または一体成形としたも
のである。上記方法によれば、コネクタを回路基板に実
装後、邪魔にならないように一体型の位置決めピンを形
成すれば、製造コストもほとんど変わらずコネクタを位
置決めすることができる。またコネクタに位置決めピン
の装着用の穴を設けるか、またはコネクタに形成された
接続用の挿入穴を利用して位置決めピンを装着すること
により、着脱式として実装後、実装後に位置決めピンを
削除して用いることができるという作用効果を奏する。
According to a sixth aspect of the present invention, in the method of the seventh aspect, the positioning pins are detachable or integrally formed. According to the above method, after the connector is mounted on the circuit board, if the integrated positioning pin is formed so as not to be in the way, the connector can be positioned with almost no change in manufacturing cost. Also, by providing a hole for mounting the positioning pin on the connector, or by mounting the positioning pin using the insertion hole for connection formed on the connector, after mounting as a detachable type, remove the positioning pin after mounting. This has the effect of being able to be used.

【0015】請求項7記載の発明は、回路部と捨て基板
部とを有する回路基板にコネクタを実装するに際して、
回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成し、コネクタの
前面または左右側面に端子部の高さに対応する段部を形
成しておき、このコネクタを切欠き部に嵌合して前記段
部により位置決めし、コネクタの端子部と回路部の回路
導体とをはんだ付けした後、捨て基板部を除去してコネ
クタを回路部に実装するものである。上記方法によれ
ば、コネクタを空洞部に挿入したときに回路基板に支え
られるように、コネクタの側面に段部を設け、段部はコ
ネクタの一部を小さくして設けることにより、実装後に
何ら手を加える必要がなく、コネクタを切欠き部に精度
良く位置決めして実装することができ、実装のための部
品も不要で製造コストを削減することができる。
According to a seventh aspect of the present invention, when the connector is mounted on a circuit board having a circuit portion and a waste board portion,
A notch is formed at the end of the circuit portion, into which the connector can be fitted and at least on both sides, and a discarded substrate portion is formed. The connector is fitted into the notch and positioned by the step, and after soldering the terminal of the connector and the circuit conductor of the circuit, the discarded substrate is removed and the connector is mounted on the circuit. Things. According to the above method, a step is provided on the side surface of the connector so that the connector is supported by the circuit board when the connector is inserted into the hollow portion, and the step is provided by reducing a part of the connector, so that the connector is not mounted after mounting. The connector can be positioned and mounted with high precision in the cutout portion without any need for modification, and components for mounting are not required, and the manufacturing cost can be reduced.

【0016】請求項8記載の発明は、回路部と捨て基板
部とを有する回路基板にコネクタを実装するに際して、
回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成するとともに、
切欠き部の左右両側の捨て基板部に位置決め穴を形成
し、コネクタの両側面に、前記位置決め穴に嵌合可能な
固定爪を切り離し部を介して形成しておき、コネクタを
切欠き部に配置して固定爪を前記固定穴に嵌入して位置
決めした後、端子部と回路部の回路導体とをはんだ付け
し、回路部と捨て基板部を分離するときに前記切り離し
部を介して固定爪を同時に分離するものである。上記方
法によれば、コネクタを切欠き部の上方から嵌め込み固
定爪を位置決め穴に挿し込むだけで、コネクタを切欠き
部に精度良く位置決めができ、製造コストを削減するこ
とができる。
According to the present invention, when the connector is mounted on a circuit board having a circuit portion and a waste board portion,
Forming a notch having a discardable substrate portion on which a connector can be fitted at an end of the circuit portion and at least on both sides,
Positioning holes are formed in the discarded substrate portions on the left and right sides of the cutout portion, and fixed claws that can be fitted into the positioning holes are formed on both side surfaces of the connector through cutout portions, and the connector is inserted into the cutout portion. After arranging and fixing the fixing claws into the fixing holes and positioning them, the terminal portion and the circuit conductor of the circuit portion are soldered, and when the circuit portion and the discarded board portion are separated, the fixing claws are inserted through the separating portion. At the same time. According to the above method, the connector can be accurately positioned in the notch by simply inserting the connector from above the notch and inserting the fixing claw into the positioning hole, thereby reducing the manufacturing cost.

【0017】請求項9記載の発明は、請求項8の方法に
おいて、固定爪の切り離し部を、回路基板の回路部と捨
て回路部との分割線を含む垂直面内に配置したものであ
る。上記方法によれば、回路部と捨て基板部の分割と同
時に、固定爪をコネクタに無理な力を加えることなく切
り離し部を介して分離できるという作用効果を奏する。
According to a ninth aspect of the present invention, in the method of the eighth aspect, the separation portion of the fixing claw is disposed in a vertical plane including a dividing line between the circuit portion and the discarded circuit portion of the circuit board. According to the above method, there is an operational effect that the fixing claw can be separated via the separating portion without applying an excessive force to the connector at the same time as the division of the circuit portion and the discarded substrate portion.

【0018】請求項10記載の発明は、回路部と捨て基
板部とを有する回路基板にコネクタを実装するに際し
て、プレスにより、回路部の端部にコネクタが嵌合可能
でかつ少なくとも両側に捨て基板部を有する保持用凹部
を半抜き状態で形成し、前記保持用凹部内にコネクタを
配置して、コネクタの端子部と回路部の回路導体とをは
んだ付けした後、捨て基板部および保持凹部の底材を除
去してコネクタを回路基板に実装するものである。上記
構成によれば、切欠き部を半抜き状とすることにより、
回路基板の形成と同時に保持凹部を形成でき、余分な部
材や工程が不要で製造コストを削減できるという作用を
有する。
According to a tenth aspect of the present invention, when the connector is mounted on a circuit board having a circuit portion and a discarded board portion, the connector can be fitted to the end of the circuit portion by pressing and the discarded board is disposed on at least both sides. A holding recess having a portion is formed in a half-blanked state, a connector is arranged in the holding recess, and a terminal portion of the connector and a circuit conductor of a circuit portion are soldered. The bottom material is removed and the connector is mounted on the circuit board. According to the above configuration, by forming the cutout portion into a semi-cut shape,
The holding concave portion can be formed at the same time as the formation of the circuit board, which has the effect of eliminating the need for extra members and steps and reducing the manufacturing cost.

【0019】請求項11記載の発明は、請求項10の方
法において、半抜き状態の保持用凹部により、コネクタ
が端子部を回路導体に対応する位置に幅方向および深さ
方向に位置決めされるものである。上記方法によれば、
コネクタを精度良く位置決めして実装を容易に行うこと
ができる。
According to an eleventh aspect of the present invention, in the method according to the tenth aspect, the connector is positioned in the width direction and the depth direction at the position corresponding to the circuit conductor by the half-retained holding recess. It is. According to the above method,
The connector can be positioned accurately and mounting can be easily performed.

【0020】請求項12記載の発明は、請求項1〜11
の方法において、複数の回路部が設けられた回路基板
で、回路部の端部にコネクタを実装するに際して、回路
部のコネクタ取付端部を、回路部が隣接しない左右側端
部に配置するとともに、これらコネクタ取付端部にコネ
クタが嵌合可能な切欠き部を回路部ごとに左右交互に形
成し、隣接する回路部のコネクタが左右逆向きに取り付
けられるものである。上記方法によれば、コネクタが回
路部より幅が大きい時や支え部材を用いるとき、または
コネクタの位置決めピンが隣り合う回路部に出っ張る場
合には、隣り合う回路部の捨て基板部を利用してコネク
タを位置決め保持することができ、無駄のない回路基板
を形成できるという作用効果を奏する。
The invention according to claim 12 is the invention according to claims 1 to 11
In the method of (1), when mounting a connector on an end of the circuit part on a circuit board provided with a plurality of circuit parts, the connector mounting ends of the circuit part are arranged on the left and right ends where the circuit parts are not adjacent to each other. Notch portions into which the connectors can be fitted are formed alternately on the left and right sides of each of the circuit portions at the connector mounting end portions, and the connectors of the adjacent circuit portions are mounted in opposite directions. According to the above method, when the connector is wider than the circuit portion or when using the supporting member, or when the positioning pin of the connector protrudes to the adjacent circuit portion, the disposal substrate portion of the adjacent circuit portion is used. The operation and effect that the connector can be positioned and held and a lean circuit board can be formed can be obtained.

【0021】請求項13記載の発明は、回路基板の回路
部の端部にコネクタを実装するに際して、前記回路部の
回路導体に挿入穴を形成し、コネクタの端面に、先端側
がL形に折り曲げられるとともに先端部に挿入穴に嵌入
可能なV形の係止部を有する端子部を設けておき、コネ
クタを回路部の端部に配置して、前記端子部の係止部を
係止穴に嵌入してコネクタの端面と端子部の係止部とで
回路部を挟み込むことによりコネクタを位置決め保持
し、コネクタの端子部を回路導体にはんだ付けして実装
するものである。上記方法によれば、L形状に曲げられ
た端子部の先端係止部を挿入穴に挿入することにより、
コネクタ背面と端子部の係止部とで回路部を挟みつけて
コネクタを位置決めして水平姿勢に保持することがで
き、回路部に直接コネクタを設置できるという作用効果
を奏する。
According to a thirteenth aspect of the present invention, when the connector is mounted at the end of the circuit portion of the circuit board, an insertion hole is formed in the circuit conductor of the circuit portion, and the distal end is bent into an L shape at the end surface of the connector. A terminal portion having a V-shaped locking portion that can be fitted into the insertion hole at the front end portion is provided, a connector is arranged at an end of the circuit portion, and the locking portion of the terminal portion is inserted into the locking hole. The connector is positioned and held by inserting the circuit portion between the end face of the connector and the locking portion of the terminal portion, and the terminal portion of the connector is soldered to the circuit conductor for mounting. According to the above method, by inserting the distal end locking portion of the terminal portion bent into an L shape into the insertion hole,
The circuit portion is sandwiched between the rear surface of the connector and the locking portion of the terminal portion, and the connector is positioned so that the connector can be held in a horizontal position, so that the connector can be directly installed on the circuit portion.

【0022】以下本発明の実施の形態を図面に基づいて
説明する。なお、以下の実施の形態では、従来例と同一
部材には同一符号を付して説明する。 (実施の形態1)図1(a)〜(c)は本発明に係る実施の
形態1を示す分解斜視図、正面断面図および側面断面図
で、一枚取りの回路基板に関するものである。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same members as those of the conventional example are denoted by the same reference numerals and described. (Embodiment 1) FIGS. 1A to 1C are an exploded perspective view, a front sectional view and a side sectional view showing a first embodiment of the present invention, and relate to a single circuit board.

【0023】回路基板1は、回路部2と、回路部2のコ
ネクタ5の取付け端部に貫通成形されてコネクタ5が嵌
合可能な切欠き部である空洞部11と、回路部2および
空洞部11の周囲に形成された捨て基板部3とで構成さ
れている。回路部2には、表面で空洞部11に近い部分
にコネクタ5の端子部5aと接続される回路導体2aが
形成されている。回路部2と捨て基板部3の境には、部
品実装後に捨て基板部3を除去しやすくするための回路
基板分割線4(たとえば折り曲げて分離する場合には分
割用溝)が形成されている。また空洞部11には、支え
部材である支え板12が着脱自在に配置され、空洞部1
1は支え板12を介してコネクタ5が抵抗なく挿入設置
できる最小の大きさに形成されている。また支え板12
は、空洞部11に嵌合可能な凹形溝形状の受け部12a
と、受け部12aの両側で捨て基板部3の表面に掛止さ
れる鍵形状の掛止部12bとで構成されている。そして
支え板12の受け部12aは、コネクタ5を設置したと
きにその端子部5aの先端部が回路部2の回路導体2a
と水平に接する深さに形成され、また空洞部11内で幅
方向に位置ずれしない幅で、かつ挿入されたコネクタ5
が幅方向に位置ずれしない幅に形成されている。またこ
の支え板12の材質は、反復使用と製作コストに有利な
金属板が使用されるが、金属板に限るものではない。
The circuit board 1 includes a circuit portion 2, a hollow portion 11 which is formed through the mounting end of the connector 5 of the circuit portion 2 and is a notch portion into which the connector 5 can be fitted, a circuit portion 2 and a hollow portion. And the discard substrate portion 3 formed around the portion 11. The circuit portion 2 has a circuit conductor 2a connected to the terminal portion 5a of the connector 5 at a portion close to the cavity portion 11 on the surface. A circuit board dividing line 4 (for example, a dividing groove when bending and separating) is formed at a boundary between the circuit section 2 and the discarded board section 3 so that the discarded board section 3 can be easily removed after the components are mounted. . A support plate 12 serving as a support member is detachably disposed in the hollow portion 11.
Reference numeral 1 denotes a minimum size that allows the connector 5 to be inserted and installed via the support plate 12 without resistance. Support plate 12
Is a concave groove-shaped receiving portion 12a that can be fitted into the hollow portion 11.
And a key-shaped hooking portion 12b hooked on the surface of the discarded substrate portion 3 on both sides of the receiving portion 12a. When the connector 5 is installed, the receiving portion 12a of the support plate 12 is connected to the circuit conductor 2a of the circuit portion 2 by the tip of the terminal portion 5a.
The connector 5 is formed to a depth that is in horizontal contact with the connector 5 and has a width that does not shift in the width direction in the hollow portion 11 and that is inserted.
Are formed so as not to be displaced in the width direction. The material of the support plate 12 is a metal plate which is advantageous for repeated use and production cost, but is not limited to the metal plate.

【0024】上記構成において、この回路基板1にコネ
クタ5を実装する場合には、まず、回路基板1が回路部
2の回路導体2aを有する面を上面となるように配置
し、空洞部11に上方から支え板12を挿入し、掛止部
12bを捨て基板部3に引っかけて設置する。次にコネ
クタ5を上部から空洞部11に挿入して支え板12の受
け部12aに嵌合させるとともに、端子部5a側の背面
を回路部2の前面に接近させてコネクタ5を前後方向、
幅方向および高さ方向にそれぞれ位置決めするととも
に、各端子部5を回路部2の回路導体2aにそれぞれ当
接させる。さらにはんだ7を用いて端子部5aと回路導
体2aをはんだ付けする。次いで、回路部2と捨て基板
部3を所定の方法で分離するとともに、支え板12を外
して取り除き、回路部2へのコネクタ5の実装を完了す
る。
In the above configuration, when the connector 5 is mounted on the circuit board 1, first, the circuit board 1 is arranged so that the surface having the circuit conductor 2 a of the circuit section 2 faces upward, and The support plate 12 is inserted from above, and the hook portion 12b is disposed on the substrate portion 3 by being hooked. Next, the connector 5 is inserted into the hollow portion 11 from above and fitted into the receiving portion 12a of the support plate 12, and the back surface of the terminal portion 5a is brought close to the front surface of the circuit portion 2 so that the connector 5 is moved in the front-rear direction.
The terminals 5 are positioned in the width direction and the height direction, respectively, and the respective terminal portions 5 are brought into contact with the circuit conductors 2a of the circuit portion 2, respectively. Further, the terminal portion 5a and the circuit conductor 2a are soldered using the solder 7. Next, the circuit section 2 and the discarded board section 3 are separated by a predetermined method, and the support plate 12 is removed and removed, thereby completing the mounting of the connector 5 on the circuit section 2.

【0025】上記実施の形態によれば、回路基板1に予
め空洞部11を形成しておき、実装時に、コネクタ5を
空洞部11に挿入して支え板12を介して抜け止めする
とともに位置決めし、端子部5aを回路導体2aに対応
する適性位置に位置決めできるので、基板成形時に予め
空洞部11を形成し、小部品である支え板12を用意し
ておくだけでよく、従来のような大きな受け台も不要と
なり、その保守管理の手間も無く、低い製造コストでコ
ネクタ5を回路基板1に実装することができる。
According to the above embodiment, the cavity 11 is formed in the circuit board 1 in advance, and during mounting, the connector 5 is inserted into the cavity 11 to prevent the connector 5 from coming off via the support plate 12 and to position the connector. Since the terminal portion 5a can be positioned at an appropriate position corresponding to the circuit conductor 2a, it is only necessary to form the hollow portion 11 in advance at the time of molding the substrate and prepare the supporting plate 12 as a small component. A cradle is not required, the maintenance work is not required, and the connector 5 can be mounted on the circuit board 1 at low manufacturing cost.

【0026】なお、上記実施の形態1では切欠き部を空
洞部11としたが、回路基板1の前部の捨て基板部3が
無く前辺部が開放された切欠き状であってもよい。また
支え板12を隣接する切欠き部11の辺部にかけわたし
てもよい。 (実施の形態2)図2(a)は、実施の形態2を示す平面
図、(b)はその変形例を示す平面図である。
In the first embodiment, the cut-out portion is the hollow portion 11. However, the cut-out portion may be a cut-out shape in which the front side portion of the circuit board 1 is not provided and the front side portion is open. . Alternatively, the support plate 12 may be placed on the side of the adjacent notch 11. (Embodiment 2) FIG. 2 (a) is a plan view showing a second embodiment, and FIG. 2 (b) is a plan view showing a modification thereof.

【0027】図2(a)に示すように、回路基板1は、回
路部2と、回路部2のコネクタ5の取付け端部に貫通成
形されてコネクタ5が嵌合可能な空洞部11と、回路部
2および空洞部11の周囲に形成された捨て基板部3と
で構成されている。回路部2には、表面で空洞部11に
近い部分にコネクタ5の端子部5aと接続される回路導
体7が形成されている。回路部2と捨て基板部3の境に
は、部品実装後に捨て基板部3を除去しやすくするため
の回路基板分割線4(たとえば分割用溝)が形成されてい
る。また空洞部11には、左右の側辺部に捨て基板部3
から突出するたとえば半円形の位置決め用凸部21が形
成されている。この凸部21は、コネクタ5を両側から
挟み込んで幅方向に位置決めするもので、左右側辺部の
一方にのみ凸部21を形成して他方の側辺との間にコネ
クタ5を挟み込んでもよい。このため、凸部21間の寸
法または側辺部と凸部21の寸法は、コネクタ5の幅よ
り微少に小さく、コネクタ5を挿入でき且つ保持できる
寸法とする。さらに、寸法誤差の吸収と挟み込みによる
保持力の安定のために、凸部21の外側の捨て基板部3
には、応力吸収穴22が設けられている。応力吸収穴2
2の形成位置および大きさなどは、凸部21がコネクタ
5により押されたときに弾力性を生じる位置とするが、
回路基板1の材質、厚みにより異なるため個々に寸法設
定する必要がある。
As shown in FIG. 2A, the circuit board 1 includes a circuit portion 2, a hollow portion 11 formed through the mounting end of the connector 5 of the circuit portion 2 so that the connector 5 can be fitted therein, It comprises a circuit section 2 and a discard substrate section 3 formed around the hollow section 11. A circuit conductor 7 connected to the terminal portion 5 a of the connector 5 is formed in a portion of the circuit portion 2 near the cavity 11 on the surface. A circuit board dividing line 4 (for example, a dividing groove) is formed at the boundary between the circuit section 2 and the discarded board section 3 to facilitate removal of the discarded board section 3 after component mounting. Further, the hollow portion 11 has discarded substrate portions 3 on left and right side portions.
For example, a semicircular positioning projection 21 projecting from the projection is formed. The convex portion 21 is for positioning the connector 5 in the width direction by sandwiching the connector 5 from both sides. The convex portion 21 may be formed only on one of the left and right side portions, and the connector 5 may be sandwiched between the other side. . For this reason, the size between the protrusions 21 or the size of the side portions and the protrusions 21 is slightly smaller than the width of the connector 5, and is set to a size in which the connector 5 can be inserted and held. Further, in order to absorb the dimensional error and stabilize the holding force due to pinching, the discarded substrate portion 3 outside the convex portion 21 is formed.
Is provided with a stress absorbing hole 22. Stress absorption hole 2
The formation position and size of 2, etc. are positions where the elasticity is generated when the convex portion 21 is pressed by the connector 5,
Since it differs depending on the material and thickness of the circuit board 1, it is necessary to set the dimensions individually.

【0028】上記構成において、この回路基板1にコネ
クタ5を実装する場合には、まず、回路基板1が回路部
2の回路導体2aを有する面を上面となるように配置
し、コネクタ5を空洞部11に嵌入して左右の側面を位
置決め用凸部21間に挟み込み、端子部5aを回路導体
2a表面に接触させて略水平姿勢に保持する。なお、コ
ネクタ5の姿勢は水平が最良であるが、接合後に修正で
きる範囲の傾きが生じる程度であれば許容される。これ
により、コネクタ5は凸部21により幅方向に位置決め
されるともに、端子部5aにより高さ方向に位置決めさ
れる。さらにはんだ7により端子部5aと回路導体2a
とをはんだ付けし接合する。次に所定の方法で回路部2
と捨て基板部3を分割線4で分離除去して実装を完了す
る。
In the above configuration, when the connector 5 is mounted on the circuit board 1, first, the circuit board 1 is arranged so that the surface of the circuit portion 2 having the circuit conductor 2a is the upper surface, and the connector 5 is hollowed. The left and right side faces are inserted into the portion 11 and sandwiched between the positioning projections 21, and the terminal portion 5a is brought into contact with the surface of the circuit conductor 2a to be held in a substantially horizontal posture. Note that the posture of the connector 5 is best horizontal, but is acceptable as long as the inclination of the connector 5 can be corrected after joining. As a result, the connector 5 is positioned in the width direction by the convex portion 21 and is positioned in the height direction by the terminal portion 5a. Further, the terminal portion 5a and the circuit conductor 2a are
And soldering. Next, the circuit unit 2 is provided in a predetermined manner.
Then, the substrate 3 is separated and removed by the dividing line 4 to complete the mounting.

【0029】上記実施の形態2によれば、回路基板1に
予め空洞部11と凸部21を形成しておくだけで、捨て
基板3の凸部21により、コネクタ5を空洞部11の所
定位置に位置決めして保持させ、端子部5aと回路導体
2aとをはんだ付けすることによりコネクタ5を容易か
つ精度良く実装することができる。また、各凸部21の
外側の捨て基板部3に応力吸収穴22を設けたので、凸
部21の弾性により、空洞部11や凸部21、コネクタ
5の寸法誤差を吸収することができるとともに、コネク
タを安定して挟み込んで保持することができ、実装作業
を安定して行うことができる。したがって、従来のよう
な大きな受け台も不要で、その保守管理の必要も無く、
低い製造コストでコネクタ5を回路基板1に実装するこ
とができる。なお、図2(a)に示す実施の形態2では、
回路基板1の前部の捨て基板部3が無くてもよく、空洞
部11の前辺部が開放されていてもよい。
According to the second embodiment, simply forming the cavity 11 and the protrusion 21 on the circuit board 1 in advance, the connector 5 is moved to the predetermined position of the cavity 11 by the protrusion 21 of the discard substrate 3. The connector 5 can be easily and accurately mounted by soldering the terminal portion 5a and the circuit conductor 2a. Further, since the stress absorbing holes 22 are provided in the discarded substrate portion 3 outside each convex portion 21, the elasticity of the convex portion 21 can absorb the dimensional error of the hollow portion 11, the convex portion 21, and the connector 5, and Therefore, the connector can be stably held and held, and the mounting operation can be stably performed. Therefore, there is no need for a conventional large cradle, and no need for maintenance and management.
The connector 5 can be mounted on the circuit board 1 at low manufacturing cost. In the second embodiment shown in FIG.
The discard substrate portion 3 at the front of the circuit board 1 may not be provided, and the front side of the cavity 11 may be open.

【0030】図2(b)は、実施の形態2の変形例を示
し、凸部21と応力吸収用孔22を空洞部11の前辺部
の捨て基板部3に設けたものである。上記構成によれ
ば、凸部21と基板部2の端部との間に、コネクタ5を
挟み込んで保持することができ、実施の形態2と同様の
作用効果を奏することができる。
FIG. 2B shows a modification of the second embodiment, in which a projection 21 and a stress absorbing hole 22 are provided in the throwaway substrate 3 on the front side of the cavity 11. According to the above configuration, the connector 5 can be sandwiched and held between the convex portion 21 and the end of the substrate portion 2, and the same operation and effect as in the second embodiment can be obtained.

【0031】なお、空洞部11に設ける凸部21は、コ
ネクタ5を挟み保持して位置決めできればよく、相対す
る2辺の凸部、または4辺の凸部、あるいは凸部と空洞
部11の辺部とで挟んで位置決めすることができる。も
ちろん、回路部2であっても、支障の無い範囲で凸部2
1および応力吸収穴22を形成することができる。
The convex portion 21 provided in the hollow portion 11 may be any position as long as it can be positioned while holding the connector 5 therebetween. Two opposing convex portions or four opposing convex portions, or a convex portion and a side of the hollow portion 11 are provided. It can be positioned by being sandwiched between the parts. Of course, even in the case of the circuit portion 2, the protrusion 2
1 and the stress absorption hole 22 can be formed.

【0032】(実施の形態3)図3(a)〜(c)は、実施の
形態3を示す分解斜視図、正面断面図および側面断面図
である。
Third Embodiment FIGS. 3A to 3C are an exploded perspective view, a front sectional view, and a side sectional view showing a third embodiment.

【0033】回路基板1は、回路部2と、回路部2のコ
ネクタ5の取付け端部に貫通成形されてコネクタ5が嵌
合可能な空洞部11と、回路部2および空洞部11の周
囲に形成された捨て基板部3とで構成されている。回路
部2には、表面で空洞部11に近い部分にコネクタ5の
端子部5aと接続される回路導体7が形成されている。
回路部2と捨て基板部3の境には、部品実装後に捨て基
板部3を除去しやすくするための回路基板分割線4(た
とえば分割用溝)が形成されている。
The circuit board 1 includes a circuit section 2, a hollow section 11 formed through the mounting end of the connector 5 of the circuit section 2 so that the connector 5 can be fitted therein, and a circuit section 2 around the circuit section 2 and the hollow section 11. And the formed discard substrate portion 3. A circuit conductor 7 connected to the terminal portion 5a of the connector 5 is formed on the surface of the circuit portion 2 near the cavity 11 on the surface.
A circuit board dividing line 4 (for example, a dividing groove) is formed at a boundary between the circuit section 2 and the discarded board section 3 to facilitate removal of the discarded board section 3 after component mounting.

【0034】コネクタ5の左右側面には、位置決めピン
31が一体で突設形成されるか、または装着穴を介して
着脱式に位置決めピン31が装着されている。一体成形
された位置決めピン31は後の工程ので障害となるよう
なことの無いように設計されてる。この位置決めピン3
1は、コネクタ5を空洞部11に設置したときに、端子
部5aが回路導体2aと接した三方支持の状態で水平姿
勢になる位置に設けるのが最良であるが、接合後修正で
きる範囲の傾きが生じる程度であれば許容される。もち
ろん、コネクタ5の左右側面にそれぞれ2本の位置決め
ピンを設けることにより、端子部5aに頼ることなく、
空洞部11に嵌合したコネクタ5を水平姿勢に安定して
保持することができる。
On the left and right side surfaces of the connector 5, positioning pins 31 are integrally formed so as to protrude, or the positioning pins 31 are detachably mounted through mounting holes. The integrally formed positioning pin 31 is designed so as not to be an obstacle in a later process. This positioning pin 3
1 is best provided at a position where the terminal portion 5a is in a horizontal posture in a state of three-way support in contact with the circuit conductor 2a when the connector 5 is installed in the hollow portion 11, but within a range that can be corrected after joining. It is permissible as long as the inclination occurs. Of course, by providing two positioning pins on each of the left and right side surfaces of the connector 5, without depending on the terminal portion 5a,
The connector 5 fitted in the cavity 11 can be stably held in a horizontal posture.

【0035】上記構成において、この回路基板1にコネ
クタ5を実装する場合、まず回路基板1が回路部2の回
路導体7を有する面を上面となるように配置し、コネク
タ5を空洞部11に挿入して、端子部5aが回路部2の
回路導体7に接するとともに、位置決めピン31を捨て
基板部3の上面に当接して、コネクタ5が水平、又は略
水平姿勢で配置されるとともに、空洞部11により前後
方向および幅方向に位置決めされる。そして端子部5a
と回路導体2aの位置があっていることを確認の後、は
んだ7を用いて端子部5aと回路導体2aとを接合す
る。次いで回路部2と捨て基板部3とを分割線4に沿っ
て所定の寸法で分離除去する。さらに着脱式の位置決め
ピン31は取り外し、一体成形した位置決めピン31は
そのまま放置する。これにより回路部2へのコネクタ5
の実装が完了する。
In the above configuration, when the connector 5 is mounted on the circuit board 1, first, the circuit board 1 is arranged so that the surface of the circuit portion 2 having the circuit conductor 7 faces upward, and the connector 5 is placed in the hollow portion 11. When the connector 5 is inserted, the terminal portion 5a contacts the circuit conductor 7 of the circuit portion 2, the positioning pin 31 contacts the upper surface of the substrate portion 3, and the connector 5 is disposed in a horizontal or substantially horizontal position. The positioning is performed by the part 11 in the front-rear direction and the width direction. And the terminal portion 5a
After confirming that the position of the circuit conductor 2a matches the position of the circuit conductor 2a, the terminal portion 5a and the circuit conductor 2a are joined by using the solder 7. Next, the circuit section 2 and the discarded substrate section 3 are separated and removed at a predetermined size along the dividing line 4. Further, the detachable positioning pin 31 is removed, and the integrally formed positioning pin 31 is left as it is. This allows the connector 5 to be connected to the circuit section 2.
Is completed.

【0036】上記実施の形態3によれば、回路基板1に
予め空洞部11を形成しておくとともに、コネクタ5に
位置決めピン31を突設しておくことにより、空洞部1
1でコネクタ5の前後方向および幅方向の位置決めでき
るとともに、コネクタ5の端子部5aと位置決めピン3
1とにより、コネクタ5を高さ方向に位置決めをしてコ
ネクタ5を略水平姿勢とし、端子部5aと回路導体2a
とをはんだ付けすることにより、コネクタ5を容易かつ
精度良く実装することができる。したがって、従来のよ
うな大きな受け台も不要で、その保守管理の必要も無
く、低い製造コストでコネクタ5を回路基板1に実装す
ることができる。なお、図3に示す実施の形態3では、
回路基板1の前部の捨て基板部3が無くして空洞部11
の前辺部が開放されていてもよい。
According to the third embodiment, the cavity 11 is formed in the circuit board 1 in advance, and the positioning pin 31 is projected from the connector 5 so that the cavity 1 is formed.
1 allows positioning of the connector 5 in the front-rear direction and the width direction, and the terminal 5a of the connector 5 and the positioning pin 3
1, the connector 5 is positioned in the height direction, the connector 5 is set to a substantially horizontal posture, and the terminal portion 5a and the circuit conductor 2a are positioned.
By soldering the connector 5, the connector 5 can be easily and accurately mounted. Therefore, the connector 5 can be mounted on the circuit board 1 at a low manufacturing cost without the need for a large receiving stand as in the related art, and without the need for maintenance and management. In the third embodiment shown in FIG.
The hollow portion 11 is removed by eliminating the waste substrate portion 3 at the front of the circuit board 1.
May be open at the front side.

【0037】また図4(a)〜(c)は、実施の形態3の第
1変形例を示す分解斜視図、正面断面よび側面断面図で
ある。この第1変形例では、コネクタ5の前面に形成さ
れる複数の接続穴5bのうちの単数個または複数個に、
位置決めピン32が着脱自在に装着され、これら位置決
めピン32と、端子部5aの複数の端子により、コネク
タ5を略水平姿勢に調整して、高さ方向に位置決めする
とともに、空洞部11により幅方向および前後方向の位
置決めがされるものである。端子部5aと回路導体2a
とのはんだ付けの後に、位置決めピン32は取り外され
る。
FIGS. 4A to 4C are an exploded perspective view, a front sectional view and a side sectional view showing a first modification of the third embodiment. In the first modified example, one or more of the plurality of connection holes 5b formed on the front surface of
The positioning pins 32 are removably mounted. The positioning pins 32 and a plurality of terminals of the terminal portion 5a adjust the connector 5 to a substantially horizontal posture, and position the connector 5 in the height direction. And positioning in the front-back direction. Terminal part 5a and circuit conductor 2a
After the soldering, the positioning pins 32 are removed.

【0038】この第1変形例によれば、実施の形態3と
同様の作用効果を奏することができる。さらに図5(a)
〜(c)は、実施の形態3の第2変形例を示す分解斜視
図、正面断面図および側面断面図である。
According to the first modification, the same operation and effect as those of the third embodiment can be obtained. Further, FIG.
(C) is an exploded perspective view, a front sectional view, and a side sectional view showing a second modification of the third embodiment.

【0039】この第2変形例では、コネクタ5の左右側
面に、空洞部11の左右側辺の捨て基板部2の表面に掛
止される段部33がそれぞれ前後方向に全長にわたって
形成され、これら段部33は、コネクタ5の端子部5a
が回路部2の回路導体2aに接したときに水平姿勢とな
って保持される高さ位置に形成される。そして、これら
段部33の突出量は、端子部5aと回路導体2aのはん
だ付けまでの間コネクタ5を保持できるだけでよいの
で、空洞部11の大きさとコネクタ5の大きさとを調節
すれば、微少の段差34でよく、実装後に段部33を除
去する必要はない。
In the second modified example, on the left and right side surfaces of the connector 5, step portions 33 to be hooked on the surface of the discarded substrate portion 2 on the left and right sides of the cavity portion 11 are respectively formed over the entire length in the front-rear direction. The step part 33 is a terminal part 5a of the connector 5.
Is formed at a height position that is held in a horizontal posture when in contact with the circuit conductor 2a of the circuit portion 2. The amount of protrusion of the stepped portion 33 is only required to hold the connector 5 until the terminal portion 5a and the circuit conductor 2a are soldered. Therefore, if the size of the hollow portion 11 and the size of the connector 5 are adjusted, the amount of protrusion is very small. And the step 33 does not need to be removed after mounting.

【0040】この第2変形例によれば、実施の形態3と
同様の効果を奏するとともに、空洞部11内でより安定
してコネクタ5を水平姿勢で保持することができる。 (実施の形態4)図6(a)〜(c)は、実施の形態4を示す
分解斜視図、平面図および正面断面図である。
According to the second modification, the same effect as that of the third embodiment can be obtained, and the connector 5 can be more stably held in the horizontal position in the hollow portion 11. Fourth Embodiment FIGS. 6A to 6C are an exploded perspective view, a plan view, and a front sectional view showing a fourth embodiment.

【0041】回路基板1は、回路部2と、回路部2のコ
ネクタ5の取付け端部に貫通成形されてコネクタ5が嵌
合可能な空洞部11と、回路部2および空洞部11の周
囲に形成された捨て基板部3とで構成されている。回路
部2には、表面で空洞部11に近い部分にコネクタ5の
端子部5aと接続される回路導体7が形成されている。
回路部2と捨て基板部3の境には、部品実装後に捨て基
板部3を除去しやすくするための回路基板分割線4(た
とえば分割用溝)が形成されている。
The circuit board 1 includes a circuit portion 2, a hollow portion 11 formed through the mounting end of the connector 5 of the circuit portion 2 so that the connector 5 can be fitted therein, and a circuit portion 2 around the circuit portion 2 and the hollow portion 11. And the formed discard substrate portion 3. A circuit conductor 7 connected to the terminal portion 5a of the connector 5 is formed on the surface of the circuit portion 2 near the cavity 11 on the surface.
A circuit board dividing line 4 (for example, a dividing groove) is formed at a boundary between the circuit section 2 and the discarded board section 3 to facilitate removal of the discarded board section 3 after component mounting.

【0042】コネクタ5には、端子部5aと直角方向の
左右両側面に切り離し部41を介してL字状に形成され
た固定爪42が設けられている。一方、空洞部11の両
側の酸い基板部3には、それぞれ固定爪42が嵌入可能
な固定穴43が形成されている。前記切り離し部41の
形状、寸法は種々考えられるが、その一部を図7(a),
(b)に示すように、コネクタ5を支持できる強度を持
ち、かつ切り離しが容易な段部や溝部、絞り形状がよ
い。いずれもコネクタ5の両側で、且つ回路基板分割線
4を含む垂直面内に極めて近くなる位置に形成する。ま
た切り離し部41は固定爪42より小さい横断面で細
く、弱くすることにより切り離しやすくなる形成され
る。これは固定爪42全体を細く、弱くすると、切り離
し時に切り離し部41以外の部分で破断するおそれがあ
るからである。
The connector 5 is provided with fixing claws 42 formed in an L-shape via separation portions 41 on both right and left sides in a direction perpendicular to the terminal portion 5a. On the other hand, fixing holes 43 into which the fixing claws 42 can be respectively formed are formed in the acidic substrate portions 3 on both sides of the hollow portion 11. Although various shapes and dimensions of the separating portion 41 are conceivable, a part thereof is shown in FIG.
As shown in (b), a step, a groove, and an aperture shape which have strength enough to support the connector 5 and are easily detachable are preferable. Both are formed on both sides of the connector 5 and at positions very close to a vertical plane including the circuit board dividing line 4. Further, the separating portion 41 is formed to have a smaller cross section than the fixing claw 42 and to be easily separated by making it weaker. This is because if the entire fixing claw 42 is made thin and weak, there is a possibility that the fixing claw 42 may be broken at a portion other than the separation portion 41 at the time of separation.

【0043】コネクタ5には、予め固定爪42を一体成
形しておき、実装は、コネクタ5を空洞部11に嵌合し
つつ固定爪42を捨て基板部3の固定穴43に上方から
挿入する。そして固定爪42が固定穴43に挿入されて
端子部5aが回路導体2a上に接する位置で固定爪42
によりコネクタ5が位置決め保持される。さらに端子部
5aと回路導体2aがはんだ11で接合された後、回路
部2と捨て基板部3を分割線4に沿って、たとえば折り
曲げることにより、分割線4に沿って破断するが、同時
に固定穴43に差し込まれている固定爪42も切り離し
部41で折り曲げられて切り離され、これにより実装を
完了する。
A fixing claw 42 is integrally formed on the connector 5 in advance, and the mounting is performed by inserting the fixing claw 42 into the fixing hole 43 of the substrate 3 from above while fitting the connector 5 into the cavity 11. . Then, the fixing claw 42 is inserted into the fixing hole 43 so that the terminal 5a comes into contact with the circuit conductor 2a.
As a result, the connector 5 is positioned and held. Further, after the terminal portion 5a and the circuit conductor 2a are joined by the solder 11, the circuit portion 2 and the discarded substrate portion 3 are broken along the dividing line 4, for example, by bending, but are fixed at the same time. The fixing claw 42 inserted in the hole 43 is also bent and separated by the separating portion 41, thereby completing the mounting.

【0044】上記実施の形態5によれば、回路基板1に
予め空洞部11と固定穴43とを形成しておくととも
に、コネクタ5に固定爪42を一体成形しておくことに
より、実装時に空洞部11内でコネクタ5を、端子部5
aが回路導体2aに対応する水平姿勢に保持することが
でき、端子部5aと回路導体2aとを正確にはんだ付け
することができる。さらに、捨て基板部3の切り離し時
に、同時に固定爪42を切り離し部41を介して切り離
して分離することができ、実装作業を効率よく行うこと
ができる。したがって、従来のような大きな受け台も不
要で、その保守管理の必要も無く、低い製造コストでコ
ネクタ5を回路基板1に実装することができる。なお、
回路基板1の前部の捨て基板部3が無くてもよく、空洞
部11の前辺部が開放された切欠き部であってもよい。 (実施の形態5)図8(a),(b)は、実施の形態5を示
す分解状態および組立状態の側面断面図である。
According to the fifth embodiment, the cavity 11 and the fixing hole 43 are formed in the circuit board 1 in advance, and the fixing claw 42 is formed integrally with the connector 5 so that the cavity can be formed at the time of mounting. The connector 5 is connected to the terminal portion 5 in the portion 11.
a can be held in a horizontal position corresponding to the circuit conductor 2a, and the terminal portion 5a and the circuit conductor 2a can be accurately soldered. Further, when the discarded substrate portion 3 is separated, the fixing claws 42 can be separated and separated at the same time via the separating portion 41, so that the mounting operation can be performed efficiently. Therefore, the connector 5 can be mounted on the circuit board 1 at a low manufacturing cost without the need for a large receiving stand as in the related art, and without the need for maintenance and management. In addition,
The discard substrate portion 3 at the front of the circuit board 1 may not be provided, and the front portion of the cavity 11 may be a cutout portion that is open. (Fifth Embodiment) FIGS. 8A and 8B are side sectional views of a disassembled state and an assembled state showing a fifth embodiment.

【0045】回路基板1は、回路部2と、回路部2のコ
ネクタ5の取付け端部にコネクタ5が嵌合可能な大きさ
に打ち抜きを完全に行わない半抜き状に形成された保持
凹部51と、回路部2および保持凹部51の周囲に形成
された捨て基板部3とで構成されている。回路部2に
は、表面で保持凹部51に近い部分にコネクタ5の端子
部5aに接合される回路導体2aが形成されている。
The circuit board 1 includes a circuit portion 2 and a holding recessed portion 51 formed in a semi-blanked shape that is not completely punched into a size that allows the connector 5 to be fitted to a mounting end of the connector 5 of the circuit portion 2. And a discard substrate portion 3 formed around the circuit portion 2 and the holding concave portion 51. The circuit portion 2 is provided with a circuit conductor 2a which is joined to the terminal portion 5a of the connector 5 at a portion close to the holding recess 51 on the surface.

【0046】また回路部2と捨て基板部3の境には、部
品実装後に捨て基板部3を除去しやすくするための回路
基板分割線(たとえば分割用溝)(図示せず)が形成されて
いる。そして半抜き状の保持凹部51の深さは、コネク
タ4を嵌合したときに端子部5aが回路導体2aと接し
て水平姿勢となる深さとなるよう形成され、この時の保
持凹部51の底材51aは、その周囲には破断線が形成
されて、周囲の捨て基板部3および回路部2と摩擦によ
り保持されている。
A circuit board dividing line (for example, a dividing groove) (not shown) is formed at the boundary between the circuit section 2 and the discarded board section 3 to facilitate removal of the discarded board section 3 after mounting components. I have. The depth of the semi-hollow holding recess 51 is formed such that the terminal portion 5a comes into contact with the circuit conductor 2a and assumes a horizontal posture when the connector 4 is fitted. A break line is formed around the material 51a, and the material 51a is held by friction with the surrounding discarded substrate portion 3 and the circuit portion 2.

【0047】回路基板1は、予め回路部2の回路導体7
側より打ち抜かれて半抜き状の保持凹部51が形成され
ている。そして実装に際しては、コネクタ4が保持凹部
51に嵌合されて、その端子部5aが回路部2の回路導
体2aと合致するように保持され、端子部5aと回路導
体2aとの位置あわせを確認後、はんだ11を用いて端
子部5aと回路導体2aとを接合する。次いで、回路部
2と捨て基板部3を所定の方法で分離すると、保持凹部
51の底材51aは摩擦力がなくなって同時に除去さ
れ、実装が完了する。
The circuit board 1 is provided with the circuit conductors 7 of the circuit section 2 in advance.
A half-hole-shaped holding concave portion 51 is formed by punching from the side. At the time of mounting, the connector 4 is fitted into the holding concave portion 51, the terminal portion 5a is held so as to match the circuit conductor 2a of the circuit portion 2, and the alignment between the terminal portion 5a and the circuit conductor 2a is confirmed. Thereafter, the terminal portion 5a and the circuit conductor 2a are joined using the solder 11. Next, when the circuit portion 2 and the discard substrate portion 3 are separated by a predetermined method, the bottom material 51a of the holding concave portion 51 is removed at the same time because the frictional force disappears, and the mounting is completed.

【0048】上記実施の形態によれば、回路基板1の形
成時に予め半抜き状の保持凹部51を形成しておくだけ
で、コネクタ5を適正位置に位置決め保持して、端子部
5aと回路導体2aのはんだ付けを行い、コネクタ5を
回路部2に容易かつ正確に実装することができる。した
がって、従来のような大きな受け台も不要で、その保守
管理の必要も無く、低い製造コストでコネクタ5を回路
基板1に実装することができる。
According to the above embodiment, when the circuit board 1 is formed, the connector 5 is positioned and held at an appropriate position only by forming the half-hollow holding recess 51 in advance. By soldering 2a, the connector 5 can be easily and accurately mounted on the circuit section 2. Therefore, the connector 5 can be mounted on the circuit board 1 at a low manufacturing cost without the need for a large receiving stand as in the related art, and without the need for maintenance and management.

【0049】(実施の形態6)図9は、実施の形態6を示
す平面図である。上記の実施の形態1〜5では一枚取り
の回路基板について説明したがこの実施の形態6では、
複数の回路部62A〜62Cを形成した多数個取りの回
路基板61ついて、実施の形態1〜6を実施する場合の
形態を説明をする。
(Sixth Embodiment) FIG. 9 is a plan view showing a sixth embodiment. In the first to fifth embodiments, a single-circuit board has been described. In the sixth embodiment,
An embodiment in which the first to sixth embodiments are implemented for a multi-cavity circuit board 61 on which a plurality of circuit portions 62A to 62C are formed will be described.

【0050】すなわち、この多数個取り回路基板61を
形成する場合は、隣り合う回路部62〜62Cと切欠き
部である空洞部(保持凹部)11A〜11Cを、180度
逆向きにした逆向き回路基板61を形成する。図9では
3個取りを表示しているが、数が増えても、隣り合う回
路部62と空洞部11を逆になるように形成する。また
隣り合う境には、実装完了後に分割のための回路基板分
割線4を形成しておくことは言うまでもない。支え板1
2,位置決めピン31,32,段部33を用いて、空洞
部(保持凹部)11A〜11Cにコネクタ5を保持する場
合は、両隣の回路部2を用いる。片側が捨て基板部3の
場合も、隣の回路部2を利用して保持することができ
る。
That is, when the multi-piece circuit board 61 is formed, the adjacent circuit portions 62 to 62C and the cavities (holding concave portions) 11A to 11C, which are notches, are turned upside down by 180 degrees. The circuit board 61 is formed. In FIG. 9, three-cavity display is shown, but even if the number increases, the adjacent circuit part 62 and the cavity part 11 are formed to be reversed. It is needless to say that a circuit board dividing line 4 for division is formed at an adjacent boundary after the mounting is completed. Support plate 1
2. When the connector 5 is held in the hollow portions (holding concave portions) 11A to 11C using the positioning pins 31, 32 and the step portion 33, the circuit portions 2 on both sides are used. Even when one side is the discarded substrate part 3, it can be held using the adjacent circuit part 2.

【0051】実施の形態6によれば、多数個取り回路基
板61であっても、実施の形態1〜6を実施することが
でき、各回路部62〜62C毎に切欠き部である空洞部
(保持凹部)11A〜11Cを形成してコネクタ5をそれ
ぞれ位置決め保持し、端子部5aと回路導体2aとをは
んだ付けし、容易かつ正確にコネクタ5を実装すること
ができる。したがって、多数個取り回路基板61であっ
ても、従来のような大きな受け台も不要で、その保守管
理の必要も無く、低い製造コストでコネクタ5を各回路
部62〜62Cにそれぞれ実装することができる。
According to the sixth embodiment, the first to sixth embodiments can be carried out even with the multi-cavity circuit board 61, and the cavity portion which is a cutout portion for each of the circuit portions 62 to 62C.
(Holding recesses) 11A to 11C are formed to position and hold the connectors 5, respectively, and the terminal portions 5a and the circuit conductors 2a are soldered, so that the connectors 5 can be mounted easily and accurately. Therefore, even in the case of the multi-cavity circuit board 61, a large receiving base as in the related art is not required, no maintenance is required, and the connector 5 is mounted on each of the circuit portions 62 to 62C at low manufacturing cost. Can be.

【0052】(実施の形態7)図10(a)〜(d)は、実
施の形態7を示す分解斜視図、分解側面断面図、組立状
態の側面断面図および他の組立状態の側面断面図であ
る。
(Seventh Embodiment) FIGS. 10A to 10D are exploded perspective views, exploded side sectional views, side sectional views in an assembled state, and side sectional views in other assembled states showing a seventh embodiment. It is.

【0053】この実施の形態7は、回路部2に直接コネ
クタ5を配置して実装するものである。捨て基板部3を
有しても、回路部2のみで形成してもどちらでも良い
が、コネクタ装着部分には、捨て基板部3が削除されて
いる。回路部2でコネクタ5の取付部に対応して回路部
2の端部2bから寸法Xをあけて、端子部72に対応す
る複数の挿入穴71を回路導体2a位置に形成する。そ
してこれら挿入穴71の大きさは、コネクタ5の端子部
72により決定する。
In the seventh embodiment, the connector 5 is directly arranged on the circuit section 2 and mounted. The discard substrate portion 3 may be provided or the circuit portion 2 alone may be used. However, the discard substrate portion 3 is omitted from the connector mounting portion. In the circuit section 2, a plurality of insertion holes 71 corresponding to the terminal sections 72 are formed at the positions of the circuit conductors 2a with a distance X from the end 2b of the circuit section 2 corresponding to the mounting section of the connector 5. The size of these insertion holes 71 is determined by the terminal 72 of the connector 5.

【0054】コネクタ5の端子部72は、コネクタ5の
背面5cから後方に伸びる複数本の端子本体72aが、
先端側でL字状に下方に折り曲げられて折り曲げ部72
bが形成され、これら折り曲げ部72bには、V形に折
り曲げられて挿入穴71に挿入可能な係止部72bが形
成される。そしてコネクタ背面5cから折り曲げ部51
bまでの端子本体72aの長さYが、挿入穴71までの
と同じか、または寸法Xから微少寸法Δxだけ小さい寸
法になるように、Y=X〜X−ΔxでL字状に折り曲げ
られ、このΔxは微少で端子折り曲げ部72bを挿入穴
71に挿入するときに端子部72の有するバネ性を利用
して挿入可能な範囲の寸法とする。これにより、取付部
に配置したコネクタ5の端子部72を挿入穴71に挿入
することで、コネクタ背面5cと折曲部72bとの間に
回路部2を挟み込んで、コネクタ5が水平姿勢で位置決
めされ保持される。そして、図10(c),(d)に示すよ
うに、はんだ7により挿入穴71周囲の回路導体2aと
端子部72と接合して実装を完了する。この回路部2で
回路導体2aは上面、下面のいずれでも、また両面にあ
ってもよい。したがって、従来のような大きな受け台も
不要で、その保守管理の必要も無く、低い製造コストで
コネクタ5を回路基板1に実装することができる。
The terminal portion 72 of the connector 5 includes a plurality of terminal bodies 72a extending rearward from the back surface 5c of the connector 5,
The bent portion 72 is bent downward in an L-shape on the distal end side.
b are formed, and a locking portion 72b which is bent into a V shape and can be inserted into the insertion hole 71 is formed in each of the bent portions 72b. Then, the bent portion 51 from the connector back surface 5c
The terminal body 72a is bent in an L-shape at Y = X to X-Δx such that the length Y of the terminal body 72a up to b is the same as the length up to the insertion hole 71 or smaller than the dimension X by a minute dimension Δx. .DELTA.x is very small, and has a size within a range in which the terminal bent portion 72b can be inserted by utilizing the spring property of the terminal portion 72 when the terminal bent portion 72b is inserted into the insertion hole 71. As a result, by inserting the terminal portion 72 of the connector 5 disposed in the mounting portion into the insertion hole 71, the circuit portion 2 is sandwiched between the connector back surface 5c and the bent portion 72b, and the connector 5 is positioned in a horizontal posture. Is retained. Then, as shown in FIGS. 10C and 10D, the circuit conductor 2a around the insertion hole 71 and the terminal portion 72 are joined by the solder 7 to complete the mounting. In this circuit section 2, the circuit conductor 2a may be on either the upper surface or the lower surface or on both surfaces. Therefore, the connector 5 can be mounted on the circuit board 1 at a low manufacturing cost without the need for a large receiving stand as in the related art, and without the need for maintenance and management.

【0055】[0055]

【発明の効果】以上のように請求項1記載の発明によれ
ば、回路基板に形成した切欠き部と簡単な支え部材と
で、コネクタを位置決めして回路基板に実装することが
でき、製造コストを低く出来、従来のような大型の位置
決め用受け台を製作する必要がなく、受け台の製作費
用、製作時間、管理費用などを削減でき、大きくコスト
ダウンを図ることができる。
As described above, according to the first aspect of the present invention, the connector can be positioned and mounted on the circuit board by the notch formed in the circuit board and the simple supporting member. The cost can be reduced, and there is no need to manufacture a large-sized positioning pedestal as in the related art, so that the production cost, the production time, the management cost, and the like of the pedestal can be reduced, and the cost can be greatly reduced.

【0056】請求項3記載の発明によれば、切欠き部に
設けた相対する2辺の凸部、または4辺の凸部、あるい
は凸部と切欠き部の辺部とでコネクタを挟み保持して位
置決めするので、回路基板の形成と同時に凸部を有する
切欠き部を形成でき、余分な部材を必要とせず、製造コ
ストを削減できるという作用効果を有する。
According to the third aspect of the present invention, the connector is sandwiched and held between the opposed two-sided protrusions or four-sided protrusions provided in the notch, or the protrusion and the notch side. Since the positioning is performed, the cutout portion having the convex portion can be formed at the same time as the formation of the circuit board, which has an operational effect that no extra member is required and the manufacturing cost can be reduced.

【0057】請求項5記載の発明によれば、コネクタを
切欠き部に設置したときに、コネクタが切欠き部から脱
落しないようにコネクタ側面に回路基板の表面と接する
位置決めピンにより端子部と共にコネクタを支え位置決
めすることができるので、製造コストを削減できるとい
う作用効果を奏する。
According to the fifth aspect of the present invention, when the connector is installed in the notch, the connector is provided together with the terminal by the positioning pin on the side surface of the connector so that the connector does not fall out of the notch. Therefore, there is an effect that the manufacturing cost can be reduced.

【0058】請求項7記載の発明によれば、コネクタを
空洞部に挿入したときに回路基板に支えられるように、
コネクタの側面に段部を設け、段部はコネクタの一部を
小さくして設けることにより、実装後に何ら手を加える
必要がなく、コネクタを切欠き部に精度良く位置決めし
て実装することができ、実装のための部品も不要で製造
コストを削減することができる。
According to the present invention, the connector is supported by the circuit board when the connector is inserted into the hollow portion.
By providing a step on the side of the connector and making the step a small part of the connector, there is no need to take any action after mounting, and the connector can be accurately positioned in the notch and mounted. In addition, there is no need for components for mounting, and manufacturing costs can be reduced.

【0059】請求項8記載の発明によれば、コネクタを
切欠き部の上方から嵌め込み固定爪を位置決め穴に挿し
込むだけで、コネクタを切欠き部に精度良く位置決めが
でき、製造コストを削減することができる。
According to the eighth aspect of the present invention, the connector can be accurately positioned in the notch simply by inserting the connector from above the notch and inserting the fixing claw into the positioning hole, thereby reducing the manufacturing cost. be able to.

【0060】請求項10記載の発明によれば、切欠き部
を半抜き状とすることにより、回路基板の形成と同時に
保持凹部を形成でき、余分な部材や工程が不要で製造コ
ストを削減できるという作用を有する。
According to the tenth aspect of the present invention, by forming the cutout portion in a semi-blanked shape, the holding concave portion can be formed simultaneously with the formation of the circuit board, and no extra member or process is required, thereby reducing the manufacturing cost. It has the action of:

【0061】請求項12記載の発明によれば、コネクタ
が回路部より幅が大きい時や支え部材を用いるとき、ま
たはコネクタの位置決めピンが隣り合う回路部に出っ張
る場合には、隣り合う回路部の捨て基板部を利用してコ
ネクタを位置決め保持することができ、無駄のない回路
基板を形成できるという作用効果を奏する。
According to the twelfth aspect of the present invention, when the connector is wider than the circuit part, when using a support member, or when the positioning pin of the connector protrudes to the adjacent circuit part, the adjacent circuit part is not connected. The connector can be positioned and held by using the discarded board portion, and the operation and effect can be achieved that a lean circuit board can be formed.

【0062】請求項13記載の発明によれば、L形状に
曲げられた端子部の先端係止部を挿入穴に挿入すること
により、コネクタ背面と端子部の係止部とで回路部を挟
みつけてコネクタを位置決めして水平姿勢に保持するこ
とができ、回路部に直接コネクタを設置できるという作
用効果を奏する。
According to the thirteenth aspect of the present invention, the circuit portion is sandwiched between the rear surface of the connector and the terminal portion locking portion by inserting the tip locking portion of the terminal portion bent into an L shape into the insertion hole. In addition, the connector can be positioned and held in a horizontal position, and the connector can be directly installed in the circuit section.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係るコネクタの実装方法の実施の形態
1を示し、(a)は同分解斜視図、(b)は同正面断面図、
(c)は同側面断面図である。
FIGS. 1A and 1B show a connector mounting method according to a first embodiment of the present invention, wherein FIG. 1A is an exploded perspective view, FIG.
(c) is a side sectional view of the same.

【図2】本発明に係るコネクタの実装方法の実施の形態
2を示し、(a)は同平面図、(b)は実施の形態2の変形
例を示す平面図である。
FIGS. 2A and 2B show a connector mounting method according to a second embodiment of the present invention, wherein FIG. 2A is a plan view and FIG. 2B is a plan view showing a modification of the second embodiment.

【図3】本発明に係るコネクタの実装方法の実施の形態
3を示し、(a)は同分解斜視図、(b)は同正面断面図、
(c)は同側面断面図である。
3A and 3B show a connector mounting method according to a third embodiment of the present invention, wherein FIG. 3A is an exploded perspective view, FIG.
(c) is a side sectional view of the same.

【図4】同実施の形態3の第1変形例を示し、(a)は同
分解斜視図、(b)は同側面断面図である。
FIGS. 4A and 4B show a first modification of the third embodiment, in which FIG. 4A is an exploded perspective view, and FIG.

【図5】同実施の形態3の第2変形例を示し、(a)は同
分解斜視図、(b)は同正面断面図、(c)は同側面断面図
である。
5A and 5B show a second modification of the third embodiment, in which FIG. 5A is an exploded perspective view, FIG. 5B is a front sectional view, and FIG. 5C is a side sectional view.

【図6】本発明に係るコネクタの実装方法の実施の形態
4を示し、(a)は同分解斜視図、(b)は同平面図、(c)
は同正面断面図である。
FIG. 6 shows a fourth embodiment of the connector mounting method according to the present invention, wherein (a) is an exploded perspective view, (b) is a plan view, and (c).
FIG.

【図7】(a)は実施の形態4の変形例を示す部分正面
図、(b)は実施の形態4の他の変形例を示す部分正面図
である。
FIG. 7A is a partial front view showing a modification of the fourth embodiment, and FIG. 7B is a partial front view showing another modification of the fourth embodiment.

【図8】本発明に係る実施の形態5を示し、(a)は同分
解状態の側面断面図、(b)は同組立状態の側面断面図で
ある。
8A and 8B show a fifth embodiment according to the present invention, wherein FIG. 8A is a side sectional view of the same disassembled state, and FIG. 8B is a side sectional view of the same assembled state.

【図9】本発明に係る実施の形態6を示す分解斜視図で
ある。
FIG. 9 is an exploded perspective view showing a sixth embodiment according to the present invention.

【図10】本発明に係る実施の形態7を示し、(a)は同
分解斜視図、(b)は同分解状態の側面断面図、(c)は同
組立状態の側面断面図、(d)は他の組立状態の側面断面
図である。
10A and 10B show a seventh embodiment according to the present invention, wherein FIG. 10A is an exploded perspective view, FIG. 10B is a side sectional view of the same disassembled state, FIG. 10C is a side sectional view of the same assembled state, and FIG. () Is a side sectional view of another assembled state.

【図11】従来のコネクタの実装方法を示し、(a)は回
路基板の平面図、(b)は分解状態の側面断面図、(c)は
同組立状態の側面断面図である。
11A and 11B show a conventional connector mounting method, in which FIG. 11A is a plan view of a circuit board, FIG. 11B is a side sectional view in an exploded state, and FIG. 11C is a side sectional view in the assembled state.

【符号の説明】[Explanation of symbols]

1 回路基板 2 回路部 2a 回路導体 3 捨て基板部 4 回路基板分割線 5 コネクタ 5a 端子部 11 空洞部(切欠き部) 12 支え板(支え部材) 21 位置決め用凸部 22 応力吸収穴 31,32 位置決めピン 33 段部 41 切り離し部 42 固定爪 43 固定穴 51 保持凹部 51a 底材 61 多数個取り回路基板 62A〜62C 回路部 71 挿入穴 72 端子部 72a 端子本体 72b 折り曲げ部 72c 係止部 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Circuit part 2a Circuit conductor 3 Discard substrate part 4 Circuit board dividing line 5 Connector 5a Terminal part 11 Cavity part (notch part) 12 Support plate (Support member) 21 Positioning convex part 22 Stress absorption hole 31, 32 Positioning pin 33 Step part 41 Separation part 42 Fixing claw 43 Fixing hole 51 Holding concave part 51a Bottom material 61 Multi-piece circuit board 62A to 62C Circuit part 71 Insertion hole 72 Terminal part 72a Terminal body 72b Bend part 72c Lock part

フロントページの続き Fターム(参考) 5E023 AA04 AA16 BB01 BB22 CC23 CC26 EE04 FF01 HH01 HH16 HH18 5E051 KA01 KA09 KB05 5E077 BB23 BB31 CC22 CC24 CC26 DD01 GG03 JJ05 JJ11 JJ20 5E336 AA07 BB01 BC23 CC51 DD12 DD38 EE01 GG09 GG30 Continued on the front page F term (reference) 5E023 AA04 AA16 BB01 BB22 CC23 CC26 EE04 FF01 HH01 HH16 HH18 5E051 KA01 KA09 KB05 5E077 BB23 BB31 CC22 CC24 CC26 DD01 GG03 JJ05 JJ11 JJ20 5E336 GG01 BB01

Claims (13)

【特許請求の範囲】[Claims] 【請求項1】回路部と捨て基板部とを有する回路基板に
コネクタを実装するに際して、 回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成し、 前記捨て基板部の切欠き部の2つの辺部にわたって支え
部材を配置し、 前記切欠き部内にコネクタを挿入して支え部材により支
持させ、 前記コネクタの端子部と回路部の回路導体とをはんだ付
けした後、 捨て基板部を除去して支え部材を外し、 コネクタを回路基板に実装することを特徴とするコネク
タの実装方法。
When mounting a connector on a circuit board having a circuit portion and a discarded board portion, a notch portion is formed at an end of the circuit portion so that the connector can be fitted therein and has discarded board portions on at least both sides. A support member is arranged over two sides of the cutout portion of the discarded substrate portion, a connector is inserted into the cutout portion and supported by the support member, and a terminal portion of the connector and a circuit conductor of a circuit portion are connected to each other. A method for mounting a connector, comprising: after soldering, removing a discarded substrate portion, removing a supporting member, and mounting the connector on a circuit board.
【請求項2】支え部材が対向する辺部にわたって掛け渡
され、 切欠き部と支え部材とにより、コネクタの端子部が回路
導体に対応する位置に幅方向および深さ方向に位置決め
されることを特徴とする請求項1記載のコネクタの実装
方法。
2. A notch and a support member for positioning a terminal portion of a connector in a width direction and a depth direction at a position corresponding to a circuit conductor. The method for mounting a connector according to claim 1, wherein:
【請求項3】回路部と捨て基板部とを有する回路基板に
コネクタを実装するに際して、 回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成するとともに、
この切欠き部の辺部の捨て基板部または/および回路部
に位置決め用凸部を形成し、 前記切欠き部にコネクタを配置して、前記位置決め用凸
部によりコネクタの端子部が回路部の回路導体に対応す
る略水平姿勢に位置決めさせ、 コネクタの端子部と回路導体とをはんだ付けした後、捨
て基板部を除去してコネクタを回路基板に実装すること
を特徴とするコネクタの実装方法。
3. When mounting a connector on a circuit board having a circuit portion and a discarded board portion, a cutout portion is formed at an end of the circuit portion so that the connector can be fitted therein and has discarded board portions on at least both sides. With
A positioning projection is formed on the discarded substrate portion and / or the circuit portion on the side of the notch, and a connector is arranged in the notch, and the terminal portion of the connector is formed by the positioning projection. A method of mounting a connector, comprising positioning a connector in a substantially horizontal position corresponding to a circuit conductor, soldering a terminal portion of the connector to the circuit conductor, removing a discarded board portion, and mounting the connector on a circuit board.
【請求項4】位置決め用凸部に対応する捨て基板部また
は回路部に、応力吸収穴を形成して位置決め用凸部に弾
性を持たせることを特徴とする請求項3記載のコネクタ
の実装方法。
4. The method of mounting a connector according to claim 3, wherein a stress absorbing hole is formed in the discarded substrate portion or the circuit portion corresponding to the positioning projection, so that the positioning projection has elasticity. .
【請求項5】回路部と捨て基板部とを有する回路基板に
コネクタを実装するに際して、 回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成し、 前記切欠き部にコネクタを配置して、コネクタから突出
する複数の位置決めピン、または位置決めピンと端子部
によりコネクタを位置決めし、 コネクタの端子部と回路部の回路導体とをはんだ付けし
た後、捨て基板部を除去してコネクタを回路導体に実装
することを特徴とするコネクタの実装方法。
5. When mounting a connector on a circuit board having a circuit portion and a discarded board portion, a notch portion is formed at an end of the circuit portion so that the connector can be fitted and has discarded board portions on at least both sides. After arranging the connector in the notch, positioning the connector with a plurality of positioning pins projecting from the connector, or positioning pins and the terminal, soldering the terminal of the connector and the circuit conductor of the circuit, and then discarding the connector A method for mounting a connector, comprising removing a substrate portion and mounting the connector on a circuit conductor.
【請求項6】位置決めピンは着脱式または一体成形であ
ることを特徴とする請求項5記載のコネクタの実装方
法。
6. The method according to claim 5, wherein the positioning pins are detachable or integrally molded.
【請求項7】回路部と捨て基板部とを有する回路基板に
コネクタを実装するに際して、 回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成し、 コネクタの前面または左右側面に端子部の高さに対応す
る段部を形成しておき、 このコネクタを切欠き部に嵌合して前記段部により位置
決めし、 コネクタの端子部と回路部の回路導体とをはんだ付けし
た後、捨て基板部を除去してコネクタを回路部に実装す
ることを特徴とするコネクタの実装方法。
7. When mounting a connector on a circuit board having a circuit portion and a discarded board portion, a notch portion is formed at an end of the circuit portion so that the connector can be fitted and has discarded board portions on at least both sides. A step portion corresponding to the height of the terminal portion is formed on the front surface or the left and right side surfaces of the connector, and the connector is fitted into the notch portion and positioned by the step portion. A method for mounting a connector, comprising: after soldering a circuit conductor; removing a discarded substrate portion; and mounting the connector on the circuit portion.
【請求項8】回路部と捨て基板部とを有する回路基板に
コネクタを実装するに際して、 回路部の端部にコネクタが嵌合可能でかつ少なくとも両
側に捨て基板部を有する切欠き部を形成するとともに、
切欠き部の左右両側の捨て基板部に位置決め穴を形成
し、 コネクタの両側面に、前記位置決め穴に嵌合可能な固定
爪を切り離し部を介して形成しておき、 コネクタを切欠き部に配置して固定爪を前記固定穴に嵌
入して位置決めした後、 端子部と回路部の回路導体とをはんだ付けし、 回路部と捨て基板部を分離するときに前記切り離し部を
介して固定爪を同時に分離することを特徴とするコネク
タの実装方法。
8. When mounting a connector on a circuit board having a circuit portion and a discarded board portion, a cutout portion is formed at an end of the circuit portion so that the connector can be fitted therein and has discarded board portions on at least both sides. With
Positioning holes are formed in the discarded substrates on the left and right sides of the notch, and fixed claws that can be fitted into the positioning holes are formed on both sides of the connector through the cut-off section, and the connector is inserted into the notch. After arranging and fixing the fixing claws into the fixing holes and positioning them, the terminal portion and the circuit conductor of the circuit portion are soldered, and when the circuit portion and the discarded substrate portion are separated from each other, the fixing claws are inserted through the separating portion. A connector mounting method, wherein the connectors are separated simultaneously.
【請求項9】固定爪の切り離し部を、回路基板の回路部
と捨て回路部との分割線を含む垂直面内に配置したこと
を特徴とする請求項8記載のコネクタの実装方法。
9. The connector mounting method according to claim 8, wherein the separation portion of the fixing claw is disposed in a vertical plane including a dividing line between the circuit portion and the discarded circuit portion of the circuit board.
【請求項10】回路部と捨て基板部とを有する回路基板
にコネクタを実装するに際して、 プレスにより、回路部の端部にコネクタが嵌合可能でか
つ少なくとも両側に捨て基板部を有する保持用凹部を半
抜き状態で形成し、 前記保持用凹部内にコネクタを配置して、コネクタの端
子部と回路部の回路導体とをはんだ付けした後、 捨て基板部および保持凹部の底材を除去してコネクタを
回路基板に実装することを特徴とするコネクタの実装方
法。
10. A mounting recess for mounting a connector on a circuit board having a circuit portion and a discarded board portion, wherein the connector can be fitted to an end of the circuit portion by pressing and the discarded board portion is provided on at least both sides. After the connector is arranged in the holding recess and the terminal of the connector and the circuit conductor of the circuit are soldered, the bottom material of the discarded substrate and the holding recess is removed. A method for mounting a connector, comprising mounting the connector on a circuit board.
【請求項11】半抜き状態の保持用凹部により、コネク
タが端子部を回路導体に対応する位置に幅方向および深
さ方向に位置決めされることを特徴とする請求項10記
載のコネクタの実装方法。
11. The connector mounting method according to claim 10, wherein the connector is positioned in a width direction and a depth direction at a position corresponding to the circuit conductor by the holding recess in the half-empty state. .
【請求項12】複数の回路部が設けられた回路基板で、
回路部の端部にコネクタを実装するに際して、 回路部のコネクタ取付端部を、回路部が隣接しない左右
側端部に配置するとともに、これらコネクタ取付端部に
コネクタが嵌合可能な切欠き部を回路部ごとに左右交互
に形成し、 隣接する回路部のコネクタが左右逆向きに取り付けられ
ることを特徴とする請求項1乃至11のいずれかに記載
のコネクタの実装方法。
12. A circuit board provided with a plurality of circuit parts,
When mounting the connector at the end of the circuit section, the connector mounting ends of the circuit section are arranged at the left and right ends where the circuit section is not adjacent, and the notch section where the connector can be fitted to these connector mounting ends. 12. The connector mounting method according to claim 1, wherein left and right sides are alternately formed for each circuit portion, and connectors of adjacent circuit portions are mounted in left and right opposite directions.
【請求項13】回路基板の回路部の端部にコネクタを実
装するに際して、 前記回路部の回路導体に挿入穴を形成し、 コネクタの端面に、先端側がL形に折り曲げられるとと
もに先端部に前記挿入穴に嵌入可能なV形の係止部を有
する端子部を設けておき、 コネクタを回路部の端部に配置するとともに前記端子部
の係止部を係止穴に嵌入して、コネクタの端面と端子部
の係止部とで回路部を挟み込むことにより、コネクタを
位置決めして保持させ、 コネクタの端子部を回路導体にはんだ付けして実装する
ことを特徴とするコネクタの実装方法。
13. When mounting a connector at an end of a circuit portion of a circuit board, an insertion hole is formed in a circuit conductor of the circuit portion, and a distal end side is bent into an L-shape at an end surface of the connector, and the distal end is bent at the distal end. A terminal portion having a V-shaped locking portion that can be fitted into the insertion hole is provided, and the connector is disposed at an end of the circuit portion, and the locking portion of the terminal portion is fitted into the locking hole, and A connector mounting method comprising: positioning and holding a connector by sandwiching a circuit portion between an end face and a locking portion of a terminal portion; and soldering and mounting the terminal portion of the connector to a circuit conductor.
JP2000341227A 2000-11-09 2000-11-09 Mounting method of connector Pending JP2002151825A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
JP2000341227A JP2002151825A (en) 2000-11-09 2000-11-09 Mounting method of connector

Publications (1)

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Family

ID=18816002

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Country Link
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Cited By (5)

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Publication number Priority date Publication date Assignee Title
JP2007173153A (en) * 2005-12-26 2007-07-05 Nintendo Co Ltd Electronic circuit module, and surface-mounted connector used for same
JP2008186929A (en) * 2007-01-29 2008-08-14 Matsushita Electric Ind Co Ltd Circuit board and electronic device
WO2011122396A1 (en) * 2010-03-31 2011-10-06 イリソ電子工業株式会社 Connector
JP2015011994A (en) * 2013-06-28 2015-01-19 エルジー イノテック カンパニー リミテッド Circuit board and lighting device having circuit board
JP2015216043A (en) * 2014-05-12 2015-12-03 三菱電機株式会社 Substrate and regulation method of positional deviation of connector

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JPS5933276U (en) * 1982-08-25 1984-03-01 ティーディーケイ株式会社 Electronic component mounting structure
JPS6329994A (en) * 1986-07-23 1988-02-08 松下電器産業株式会社 Apparatus for fitting parts
JPH04158603A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Method of fixing semi-coaxial dielectric resonator
JPH06164117A (en) * 1992-11-19 1994-06-10 Sony Corp Manufacture of wiring board with connector attached
JPH07211408A (en) * 1994-01-18 1995-08-11 Matsushita Electric Ind Co Ltd Mounting structure of connector
JPH10117062A (en) * 1996-08-19 1998-05-06 Sony Corp Fitting method/device of lead part and shielding case preventing the leakage of high-frequency signal to printed board, fitting method/device of chip part, lead part and shielding case preventing leakage of high-frequency signal to printed board
JPH10308468A (en) * 1997-04-30 1998-11-17 Ibiden Co Ltd Substrate mounted with electronic part

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JPS5247249U (en) * 1975-09-30 1977-04-04
JPS5933276U (en) * 1982-08-25 1984-03-01 ティーディーケイ株式会社 Electronic component mounting structure
JPS6329994A (en) * 1986-07-23 1988-02-08 松下電器産業株式会社 Apparatus for fitting parts
JPH04158603A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Method of fixing semi-coaxial dielectric resonator
JPH06164117A (en) * 1992-11-19 1994-06-10 Sony Corp Manufacture of wiring board with connector attached
JPH07211408A (en) * 1994-01-18 1995-08-11 Matsushita Electric Ind Co Ltd Mounting structure of connector
JPH10117062A (en) * 1996-08-19 1998-05-06 Sony Corp Fitting method/device of lead part and shielding case preventing the leakage of high-frequency signal to printed board, fitting method/device of chip part, lead part and shielding case preventing leakage of high-frequency signal to printed board
JPH10308468A (en) * 1997-04-30 1998-11-17 Ibiden Co Ltd Substrate mounted with electronic part

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173153A (en) * 2005-12-26 2007-07-05 Nintendo Co Ltd Electronic circuit module, and surface-mounted connector used for same
JP2008186929A (en) * 2007-01-29 2008-08-14 Matsushita Electric Ind Co Ltd Circuit board and electronic device
WO2011122396A1 (en) * 2010-03-31 2011-10-06 イリソ電子工業株式会社 Connector
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EP2555333A4 (en) * 2010-03-31 2015-03-25 Iriso Electronics Co Ltd Connector
JP2015011994A (en) * 2013-06-28 2015-01-19 エルジー イノテック カンパニー リミテッド Circuit board and lighting device having circuit board
US9482810B2 (en) 2013-06-28 2016-11-01 Lg Innotek Co., Ltd. Circuit board and lighting device having the circuit board
JP2015216043A (en) * 2014-05-12 2015-12-03 三菱電機株式会社 Substrate and regulation method of positional deviation of connector

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