JP2002137428A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JP2002137428A JP2002137428A JP2000332423A JP2000332423A JP2002137428A JP 2002137428 A JP2002137428 A JP 2002137428A JP 2000332423 A JP2000332423 A JP 2000332423A JP 2000332423 A JP2000332423 A JP 2000332423A JP 2002137428 A JP2002137428 A JP 2002137428A
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- heat
- grooves
- radiating plate
- head substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ワードプロセッサ
やファクシミリ等のプリンタ機構として組み込まれるサ
ーマルヘッドに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head incorporated as a printer mechanism for a word processor, a facsimile, or the like.
【０００２】[0002]
【従来の技術】従来、ワードプロセッサ等のプリンタ機
構として組み込まれるサーマルヘッドは、例えば図４に
示す如く、上面に発熱素子列１２を有したアルミナセラ
ミックス製のヘッド基板１１を、アルミニウム等の金属
から成る放熱板１３上に接着剤１５等を用いて取着・固
定した構造を有しており、発熱素子列を構成する多数の
発熱素子を外部からの画像データに基づいて個々に選択
的にジュール発熱させるとともに、該発熱した熱を感熱
紙等の記録媒体に伝導させ、記録媒体に所定の印字画像
を形成することによってサーマルヘッドとして機能す
る。2. Description of the Related Art Conventionally, a thermal head incorporated as a printer mechanism such as a word processor or the like, as shown in FIG. 4, for example, comprises a head substrate 11 made of alumina ceramic having a heating element array 12 on the upper surface and made of a metal such as aluminum. It has a structure in which it is attached and fixed on the heat radiating plate 13 using an adhesive 15 or the like, and a plurality of heating elements constituting the heating element row are selectively and individually generated based on image data from the outside. At the same time, the generated heat is conducted to a recording medium such as thermal paper to form a predetermined print image on the recording medium, thereby functioning as a thermal head.
【０００３】尚、前記ヘッド基板１１と放熱板１３との
間で、発熱素子列１２の直下領域には、シリコングリー
ス中にアルミナ等の無機物粒子を添加・混合して成る放
熱コンパウンド１４が介在されており、この放熱コンパ
ウンド１４によりヘッド基板１１中の熱の一部を放熱板
１３側に伝導させてヘッド基板１１の温度状態を良好に
保つようにしている。[0003] Between the head substrate 11 and the heat radiating plate 13, a heat radiating compound 14 made by adding and mixing inorganic particles such as alumina into silicon grease is interposed in a region directly below the heating element array 12. A part of the heat in the head substrate 11 is conducted to the heat radiating plate 13 side by the heat radiating compound 14 so that the temperature state of the head substrate 11 is kept good.
【０００４】また前記放熱板１３の上面で発熱素子列１
２の両側には、一対の溝１３ａ，１３ｂが設けられてお
り、これらの溝１３ａ，１３ｂ内で放熱コンパウンド１
４の余剰分を収容するようにしていた。[0004] The heating element array 1
2 are provided on both sides with a pair of grooves 13a and 13b, and the heat radiation compound 1 is provided in these grooves 13a and 13b.
4 was to be accommodated.
【０００５】上述したサーマルヘッドの組み立ては、ま
ず一対の溝１３ａ，１３ｂ間に位置する放熱板１３の上
面に放熱コンパウンド１４を、その他の領域に接着剤１
５をそれぞれ塗布し、その後、放熱板１３上にヘッド基
板１１を載置して、これを放熱板１３側に押し付けなが
ら接着剤１５を硬化させることによって行われていた。In assembling the above-mentioned thermal head, first, a heat radiation compound 14 is provided on the upper surface of a heat radiation plate 13 located between a pair of grooves 13a and 13b, and an adhesive 1
5 is applied, and then the head substrate 11 is placed on the heat radiating plate 13, and the adhesive 15 is cured while pressing the head substrate 11 against the heat radiating plate 13.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上述し
た従来のサーマルヘッドにおいては、放熱板１３の上面
と溝１３ａ，１３ｂとの間に形成される角部が直角に角
張っており、サーマルヘッドの組み立てに際してヘッド
基板１１を放熱板１３側に押し付けると、放熱コンパウ
ンド１４が上述した鋭利な角部によって分断されてしま
うことがある。このような場合、サーマルヘッドの組み
立て終了後にヘッド基板１１への押圧力が開放される
と、ヘッド基板１１が押し戻されて、溝１３ａ，１３ｂ
内に充填されている空気の一部がヘッド基板１１−放熱
板１３間に入り込むことから、放熱コンパウンド１４中
には気泡が混入してしまい、かかるサーマルヘッドを用
いて印画を行うと、ヘッド基板１１から放熱板１３への
熱の伝導にバラツキを生じて、印画の濃度むらが形成さ
れる欠点を有していた。However, in the above-described conventional thermal head, the corner formed between the upper surface of the heat radiating plate 13 and the grooves 13a and 13b is square at right angles, so that the thermal head is assembled. At this time, if the head substrate 11 is pressed against the heat radiating plate 13, the heat radiating compound 14 may be divided by the sharp corners described above. In such a case, when the pressing force on the head substrate 11 is released after the completion of the assembly of the thermal head, the head substrate 11 is pushed back and the grooves 13a, 13b
Since a part of the air filled therein enters between the head substrate 11 and the heat radiating plate 13, air bubbles are mixed in the heat radiating compound 14. This has a drawback in that the conduction of heat from the substrate 11 to the heat radiating plate 13 varies, and the density unevenness of the print is formed.
【０００７】本発明は上記欠点に鑑みて案出されたもの
で、その目的は、濃度むらの少ない良好な印画を形成す
ることが可能なサーマルヘッドを提供することにある。The present invention has been made in view of the above-mentioned drawbacks, and an object of the present invention is to provide a thermal head capable of forming a good print with less density unevenness.
【０００８】[0008]
【課題を解決するための手段】本発明のサーマルヘッド
は、上面に一対の溝を有する放熱板上に、発熱素子列を
有するヘッド基板を、発熱素子列の直下領域が前記一対
の溝間に位置するように載置させるとともに、前記一対
の溝間の放熱板とヘッド基板との間に放熱コンパウンド
を介在させたサーマルヘッドにおいて、前記発熱素子列
の直下に位置する放熱板上面と、その両側に位置する溝
の内壁面との間の角度が１１０°〜１５０°をなすよう
に、前記内壁面を発熱素子列側に傾斜させたことを特徴
とするものである。According to a thermal head of the present invention, a head substrate having a row of heating elements is provided on a heat sink having a pair of grooves on the upper surface, and a region immediately below the row of heating elements is provided between the pair of grooves. In a thermal head in which a heat radiating compound is interposed between a heat radiating plate between the pair of grooves and a head substrate, and a heat radiating plate located immediately below the heating element row, and both sides thereof The inner wall surface is inclined toward the heating element row so that the angle between the groove and the inner wall surface is 110 ° to 150 °.
【０００９】また本発明のサーマルヘッドは、上面に一
対の溝を有する放熱板上に、発熱素子列を有するヘッド
基板を、発熱素子列の直下領域が前記一対の溝間に位置
するように載置させるとともに、前記一対の溝間の放熱
板とヘッド基板との間に放熱コンパウンドを介在させた
サーマルヘッドにおいて、前記発熱素子列の直下に位置
する放熱板上面と、その両側に位置する溝の内壁面との
間に形成される角部を曲率半径０．５ｍｍ〜２．０ｍｍ
の曲面状になしたことを特徴とするものである。In the thermal head of the present invention, a head substrate having a row of heating elements is mounted on a heat radiating plate having a pair of grooves on an upper surface such that a region immediately below the row of heating elements is located between the pair of grooves. In the thermal head in which a heat radiating compound is interposed between the heat radiating plate between the pair of grooves and the head substrate, the upper surface of the heat radiating plate located immediately below the heating element row and the grooves located on both sides thereof The corner formed between the inner wall surface and the radius of curvature is 0.5 mm to 2.0 mm.
Characterized by having a curved surface.
【００１０】本発明のサーマルヘッドによれば、発熱素
子列の直下に位置する放熱板の上面と、その両側に位置
する溝の内壁面との間に形成される角部は角張っておら
ず、放熱コンパウンドの介在領域には鋭利な角部が存在
しないため、サーマルヘッドの組み立てに際してヘッド
基板を放熱板側に押し付けても、ヘッド基板−放熱板間
に介在される放熱コンパウンドが上記角部によって分断
されることはなく、従って、ヘッド基板中の熱は略一定
幅、略一定厚みの放熱コンパウンドを介して放熱板側に
良好かつ均一に伝導されるようになり、濃度むらの少な
い良好な印画を形成することができる。According to the thermal head of the present invention, the corner formed between the upper surface of the heat radiating plate located immediately below the row of heating elements and the inner wall surface of the groove located on both sides thereof is not sharp. Since there is no sharp corner in the intervening area of the heat radiation compound, the heat radiation compound interposed between the head substrate and the heat radiation plate is divided by the above-mentioned corner even if the head substrate is pressed against the heat radiation plate when assembling the thermal head. Therefore, the heat in the head substrate is transmitted to the heat radiating plate side through the heat radiating compound having a substantially constant width and a substantially constant thickness in a good and uniform manner, so that a good print with less density unevenness can be obtained. Can be formed.
【００１１】[0011]
【発明の実施の形態】以下、本発明を添付図面に基づい
て詳細に説明する。図１は本発明の一実施形態に係るサ
ーマルヘッドの分解斜視図、図２は図１のサーマルヘッ
ドの断面図であり、１はヘッド基板、３は発熱素子列、
５は放熱板、５ａ，５ｂは一対の溝、６は放熱コンパウ
ンドである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an exploded perspective view of a thermal head according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the thermal head of FIG. 1, 1 is a head substrate, 3 is a row of heating elements,
Reference numeral 5 denotes a radiator plate, 5a and 5b denote a pair of grooves, and 6 denotes a radiator compound.
【００１２】前記ヘッド基板１は、アルミナセラミック
ス等の電気絶縁性材料をベースとし、その上面には発熱
素子列３等が設けられ、発熱素子列３等を支持するため
の支持母材として機能する。The head substrate 1 is based on an electrically insulating material such as alumina ceramics, and has a heating element array 3 or the like provided on its upper surface, and functions as a supporting base material for supporting the heating element array 3 or the like. .
【００１３】前記ヘッド基板１は、アルミナセラミック
スから成る場合、アルミナ、シリカ、マグネシア等のセ
ラミックス原料粉末に適当な有機溶剤、有機溶媒等を添
加・混合して泥漿状になすとともに、これを従来周知の
ドクターブレード法等によって所定のセラミックグリー
ンシートとなし、しかる後、前記セラミックグリーンシ
ートを矩形状に打ち抜いた上、高温で焼成することによ
って製作される。When the head substrate 1 is made of alumina ceramics, an appropriate organic solvent, an organic solvent or the like is added to and mixed with a ceramic raw material powder of alumina, silica, magnesia or the like to form a slurry. The ceramic green sheet is formed into a predetermined ceramic green sheet by a doctor blade method or the like, and thereafter, the ceramic green sheet is punched into a rectangular shape and fired at a high temperature.
【００１４】また前記ヘッド基板１の上面には、断面円
弧状のグレーズ層２がヘッド基板１の長手方向に沿って
帯状に形成され、その頂部には発熱素子列３が配され
る。On the upper surface of the head substrate 1, a glaze layer 2 having an arc-shaped cross section is formed in a band along the longitudinal direction of the head substrate 1, and a heating element array 3 is arranged on the top.
【００１５】前記グレーズ層２は、ガラス等の低熱伝導
性材料により形成されており、その内部で発熱素子３ａ
の発する熱の一部を蓄積及び放散することによりサーマ
ルヘッドの熱応答特性を良好に維持する作用を為す。The glaze layer 2 is formed of a material having a low thermal conductivity such as glass, and has a heating element 3a therein.
By accumulating and dissipating a part of the heat generated by the thermal head, the thermal head has an excellent thermal response characteristic.
【００１６】前記グレーズ層２は、ガラスから成る場
合、ガラス粉末に適当な有機溶剤を添加・混合して得た
所定のガラスペーストを従来周知のスクリーン印刷等に
よってヘッド基板１の上面に帯状に印刷・塗布し、これ
を高温で焼き付けることによって被着・形成される。When the glaze layer 2 is made of glass, a predetermined glass paste obtained by adding and mixing an appropriate organic solvent to glass powder is printed in a belt shape on the upper surface of the head substrate 1 by a conventionally known screen printing or the like. -It is applied and formed by applying and baking it at a high temperature.
【００１７】また前記グレーズ層２上に配されている発
熱素子列３は、例えば６００ｄｐｉ（dot per inch）の
密度で主走査方向に直線状に配列された多数の発熱素子
３ａから成り、これらの発熱素子３ａはＴａＳｉＯやＴ
ｉＳｉＯ，ＴａＮ等の電気抵抗材料により形成されてい
ることから、給電配線４等を介して電源電力が印加され
るとジュール発熱を起こし、感熱紙等の記録媒体に印画
を形成するのに必要な所定の温度となる。The heating element array 3 disposed on the glaze layer 2 is composed of a large number of heating elements 3a linearly arranged in the main scanning direction at a density of, for example, 600 dpi (dot per inch). The heating element 3a is made of TaSiO or T
Since it is made of an electric resistance material such as iSiO, TaN, etc., when power supply power is applied through the power supply wiring 4 or the like, Joule heat is generated, which is necessary for forming a print on a recording medium such as thermal paper. The temperature reaches a predetermined value.
【００１８】尚、前記多数の発熱素子３ａ及び給電配線
４は、従来周知の薄膜形成技術、具体的にはスパッタリ
ングやフォトリソグラフィー技術，エッチング技術等を
採用することによって所定厚み、所定パターンに被着・
形成される。The plurality of heating elements 3a and the power supply wirings 4 are adhered to a predetermined thickness and a predetermined pattern by employing a conventionally known thin film forming technique, specifically, sputtering, photolithography, etching, or the like.・
It is formed.
【００１９】そして上述したヘッド基板１は、アルミニ
ウム等の金属から成る放熱板５上に載置・固定される。The above-mentioned head substrate 1 is mounted and fixed on a heat radiating plate 5 made of metal such as aluminum.
【００２０】前記放熱板５の上面には、間に略一定の間
隔をあけて長手方向に配された一対の溝５ａ，５ｂを有
しており、この一対の溝間５ａ−５ｂに発熱素子列３の
直下領域が位置するようにしてヘッド基板１が放熱板５
上に載置される。The upper surface of the radiator plate 5 has a pair of grooves 5a, 5b arranged in the longitudinal direction with a substantially constant interval therebetween, and a heating element is provided between the pair of grooves 5a-5b. The head substrate 1 is positioned such that the area immediately below the row 3 is located.
Placed on top.
【００２１】また前記放熱板５とヘッド基板１との間に
は、一対の溝５ａ，５ｂ間の領域に放熱コンパウンド６
が、その他の領域に接着剤７が介在されており、前記放
熱コンパウンド６によってヘッド基板１の熱を放熱板５
に伝導させ、前記接着剤７によってヘッド基板１を放熱
板５に対して固定している。A radiating compound 6 is provided between the radiating plate 5 and the head substrate 1 in a region between the pair of grooves 5a and 5b.
However, the adhesive 7 is interposed in other areas, and the heat radiation compound 6 transfers the heat of the head substrate 1 to the heat radiation plate 5.
The head substrate 1 is fixed to the heat sink 5 by the adhesive 7.
【００２２】前記放熱板５は、その上面でヘッド基板１
を支持するとともに、該ヘッド基板１の熱の一部を放熱
コンパウンド６を介して吸収し、これを大気中に放散さ
せることによってヘッド基板１の温度が過度に高温とな
るのを有効に防止するためのものであり、例えばアルミ
ニウムのインゴット（塊）を従来周知の金属加工法を採
用し、所定形状に加工することによって製作される。The radiator plate 5 has a head substrate 1 on its upper surface.
And a part of the heat of the head substrate 1 is absorbed through the heat radiation compound 6 and dissipated into the atmosphere, thereby effectively preventing the temperature of the head substrate 1 from becoming excessively high. For example, it is manufactured by processing an aluminum ingot (lump) into a predetermined shape by using a conventionally known metal processing method.
【００２３】また前記放熱板５に対するヘッド基板１の
固定は、まず放熱板５の上面のうち、一対の溝５ａ，５
ｂ間の領域に放熱コンパウンド６を、他の領域に接着剤
７をそれぞれ塗布し、しかる後、放熱板５上にヘッド基
板１を載置して、これを放熱板５側に押し付けながら接
着剤７を硬化させることによって行われる。The fixing of the head substrate 1 to the radiating plate 5 is performed by first forming a pair of grooves 5a, 5a on the upper surface of the radiating plate 5.
b, a heat dissipating compound 6 is applied to the other area, and an adhesive 7 is applied to the other areas. Thereafter, the head substrate 1 is placed on the heat dissipating plate 5 and the adhesive is 7 by curing.
【００２４】尚、前記放熱コンパウンド６としては、例
えばシリコングリース中にアルミナ等の良熱伝導性材料
（アルミナの熱伝導率：約７．２×１０-3ｃａｌ／ｍｍ
・ｓｅｃ・℃）から成る粒径３μｍ〜３０μｍの無機物
微粒子を２０重量％〜８０重量％の割合で添加させたも
のが使用され、所定の流動性（粘度：３００ｋｇ／ｍ・
ｓ〜７００ｋｇ／ｍ・ｓ）を有しているため、サーマル
ヘッドの組み立てに際して、放熱板５上に載置したヘッ
ド基板１を上から押さえ付けると、ヘッド基板１−放熱
板５間に介在させた放熱コンパウンド６はヘッド基板１
の下面と放熱板５の上面の双方に対して良好に密着され
る。このとき、放熱コンパウンド６の余剰分は溝５ａ，
５ｂの内部に収容されることとなる。The heat dissipating compound 6 may be made of, for example, a material having good thermal conductivity such as alumina in silicon grease (thermal conductivity of alumina: about 7.2 × 10 −3 cal / mm).
.Sec..degree. C.) to which inorganic fine particles having a particle size of 3 .mu.m to 30 .mu.m are added at a ratio of 20% by weight to 80% by weight.
s to 700 kg / m · s), the head substrate 1 placed on the heat radiating plate 5 is pressed down from above when assembling the thermal head. The heat radiation compound 6 is the head substrate 1
And the upper surface of the radiator plate 5 is satisfactorily adhered to both. At this time, the excess amount of the heat radiation compound 6 is
5b.
【００２５】そして更に前記溝５ａ，５ｂの内壁面は、
発熱素子列３の直下に位置する放熱板５の上面と、その
両側に位置する溝５ａ，５ｂの内壁面との間の角度θが
１１０°〜１５０°をなすように、発熱素子列３側に傾
斜させてある。Further, the inner wall surfaces of the grooves 5a and 5b are
The heating element array 3 side so that the angle θ between the upper surface of the heat radiating plate 5 located immediately below the heating element array 3 and the inner wall surfaces of the grooves 5a and 5b located on both sides thereof is 110 ° to 150 °. It is inclined.
【００２６】この場合、発熱素子列３の直下に位置する
放熱板５の上面と溝５ａ，５ｂの内壁面との間に形成さ
れる角部は角張っておらず、放熱コンパウンド６の介在
領域には鋭利な角部が存在していないため、サーマルヘ
ッドの組み立てに際してヘッド基板１を放熱板５側に押
し付けても、放熱コンパウンド６が上記角部によって分
断されることはなく、ヘッド基板１への押圧力を開放し
た後でヘッド基板１が上に押し戻されても、ヘッド基板
１−放熱板５間には溝５ａ，５ｂ内に流出した放熱コン
パウンド６が逆流して再充填されるだけで、空気が流れ
込むことはない。従って、ヘッド基板１中の熱は略一定
幅、略一定厚みの放熱コンパウンド６を介して放熱板５
側に良好かつ均一に伝導されるようになり、濃度むらの
少ない良好な印画を形成することができる。In this case, the corner formed between the upper surface of the heat radiating plate 5 located immediately below the heating element row 3 and the inner wall surfaces of the grooves 5a and 5b is not sharp, and is located in the intervening area of the heat radiating compound 6. Since there is no sharp corner, even when the head substrate 1 is pressed against the heat radiating plate 5 at the time of assembling the thermal head, the heat radiating compound 6 is not divided by the corner, and Even if the head substrate 1 is pushed back up after releasing the pressing force, the radiating compound 6 flowing into the grooves 5a and 5b flows back and refills between the head substrate 1 and the radiating plate 5, No air flows in. Therefore, the heat in the head substrate 1 is transmitted through the heat radiating compound 6 having a substantially constant width and a substantially constant thickness.
As a result, it is possible to form a good print with less density unevenness.
【００２７】尚、発熱素子列３の直下に位置する放熱板
５の上面と溝５ａ，５ｂの内壁面との間に形成される角
部の角度が１１０°よりも小さくなると、角部が鋭利に
なるので放熱コンパウンド６が角部によって分断されて
しまう恐れがあり、また角部の角度が１５０°よりも大
きくなると、溝５ａ，５ｂの深さが浅くなってしまうの
で放熱コンパウンド６の余剰分を溝５ａ，５ｂの内部で
確実に収容することが不可となる場合がある。従って、
発熱素子列３の直下に位置する放熱板５の上面と溝５
ａ，５ｂの内壁面との間に形成される角部の角度は１１
０°〜１５０°の範囲内に設定することが重要である。When the angle of the corner formed between the upper surface of the heat radiating plate 5 located immediately below the heating element row 3 and the inner wall surfaces of the grooves 5a and 5b becomes smaller than 110 °, the corner becomes sharp. When the angle of the corner is larger than 150 °, the depth of the grooves 5a and 5b becomes shallow, so that the excess amount of the heat dissipation compound 6 is reduced. May not be reliably accommodated in the grooves 5a and 5b. Therefore,
Upper surface of heat radiating plate 5 and groove 5 located immediately below heating element array 3
The angle of the corner formed between the inner wall surfaces of the a and 5b is 11
It is important to set within the range of 0 ° to 150 °.
【００２８】かくして上述した本実施形態のサーマルヘ
ッドは、発熱素子列３を構成する多数の発熱素子３ａを
外部からの画像データに基づいて個々に選択的にジュー
ル発熱させるとともに、該発熱した熱を感熱紙等の記録
媒体に伝導させ、記録媒体に所定の印画を形成すること
によってサーマルヘッドとして機能する。As described above, the thermal head according to the present embodiment selectively causes the plurality of heating elements 3a constituting the heating element array 3 to generate Joule heat individually based on image data from the outside, and also generates the generated heat. Conduction is made to a recording medium such as thermal paper, and a predetermined print is formed on the recording medium to function as a thermal head.
【００２９】尚、本発明は上述の形態に限定されるもの
ではなく、本発明の要旨を逸脱しない範囲において種々
の変更、改良等が可能である。The present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.
【００３０】例えば上述の実施形態においては、発熱素
子列３の直下に位置する放熱板５の上面と、その両側に
位置する溝５ａ，５ｂの内壁面との間の角度が１１０°
〜１５０°をなすように、前記内壁面を発熱素子列３側
に傾斜させるようにしたが、これに代えて、図３に示す
如く、発熱素子列３の直下に位置する放熱板５の上面
と、その両側に位置する溝５ａ，５ｂの内壁面との間に
形成される角部を曲率半径０．５ｍｍ〜２．０ｍｍの曲
面状となすようにしても良く、このような場合も上述の
実施形態と全く同様の効果を得ることができる。For example, in the above-described embodiment, the angle between the upper surface of the radiator plate 5 located immediately below the heating element row 3 and the inner wall surfaces of the grooves 5a and 5b located on both sides thereof is 110 °.
The inner wall surface is inclined to the side of the heating element row 3 so as to form an angle of about 150 °. Alternatively, as shown in FIG. And the corners formed between the inner wall surfaces of the grooves 5a and 5b located on both sides thereof may be formed into a curved surface having a radius of curvature of 0.5 mm to 2.0 mm. The same effects as in the embodiment can be obtained.
【００３１】また上述の形態においてはシリコングリー
スを主成分とする流動性材料を放熱コンパウンド６とし
て用いるようにしたが、これに代えて、シリコーン系接
着剤等にアルミナ等の無機物微粒子を添加・混合したも
のを放熱コンパウンド６として用いても構わない。In the above embodiment, a fluid material containing silicon grease as a main component is used as the heat radiating compound 6. Instead of this, inorganic fine particles such as alumina are added and mixed into a silicone adhesive or the like. The heat dissipating compound 6 may be used.
【００３２】更に上述の形態において接着剤７として両
面テープを使用したり、或いは、発熱素子３ａや給電配
線４等を窒化珪素やサイアロン等から成る保護膜で被覆
しても良いことは言うまでもない。Further, in the above embodiment, it is needless to say that a double-sided tape may be used as the adhesive 7, or the heating element 3a and the power supply wiring 4 may be covered with a protective film made of silicon nitride, sialon, or the like.
【００３３】[0033]
【発明の効果】本発明のサーマルヘッドによれば、発熱
素子列の直下に位置する放熱板の上面と、その両側に位
置する溝の内壁面との間に形成される角部は角張ってお
らず、放熱コンパウンドの介在領域には鋭利な角部が存
在しないため、サーマルヘッドの組み立てに際してヘッ
ド基板を放熱板側に押し付けても、ヘッド基板−放熱板
間に介在される放熱コンパウンドが上記角部によって分
断されることはなく、従って、ヘッド基板中の熱は略一
定幅、略一定厚みの放熱コンパウンドを介して放熱板側
に良好かつ均一に伝導されるようになり、濃度むらの少
ない良好な印画を形成することができる。According to the thermal head of the present invention, the corner formed between the upper surface of the heat radiating plate located immediately below the row of heating elements and the inner wall surface of the groove located on both sides of the radiating plate is square. However, since there is no sharp corner in the intervening area of the heat radiation compound, even if the head substrate is pressed against the heat radiation plate at the time of assembling the thermal head, the heat radiation compound interposed between the head substrate and the heat radiation plate has the above-mentioned corner. Therefore, the heat in the head substrate is transmitted to the heat radiating plate side through the heat radiating compound having a substantially constant width and a substantially constant thickness in a good and uniform manner. Prints can be formed.
【図１】本発明の一実施形態に係るサーマルヘッドの分
解斜視図である。FIG. 1 is an exploded perspective view of a thermal head according to an embodiment of the present invention.
【図２】図１のサーマルヘッドのＸ−Ｘ線断面図であ
る。FIG. 2 is a sectional view taken along line XX of the thermal head of FIG.
【図３】本発明の他の実施形態に係るサーマルヘッドの
断面図である。FIG. 3 is a sectional view of a thermal head according to another embodiment of the present invention.
【図４】従来のサーマルヘッドの断面図である。FIG. 4 is a sectional view of a conventional thermal head.
１・・・ヘッド基板、３・・・発熱素子列、５・・・放
熱板、５ａ，５ｂ・・・溝、６・・・放熱コンパウンドDESCRIPTION OF SYMBOLS 1 ... Head board, 3 ... Heating element row, 5 ... Heat sink, 5a, 5b ... Groove, 6 ... Heat dissipation compound
Claims (2)
素子列を有するヘッド基板を、発熱素子列の直下領域が
前記一対の溝間に位置するように載置させるとともに、
前記一対の溝間の放熱板とヘッド基板との間に放熱コン
パウンドを介在させたサーマルヘッドにおいて、 前記発熱素子列の直下に位置する放熱板上面と、その両
側に位置する溝の内壁面との間の角度が１１０°〜１５
０°をなすように、前記内壁面を発熱素子列側に傾斜さ
せたことを特徴とするサーマルヘッド。1. A head substrate having a row of heating elements is placed on a heat radiating plate having a pair of grooves on an upper surface such that a region immediately below the row of heating elements is positioned between the pair of grooves.
In a thermal head in which a heat radiating compound is interposed between a heat radiating plate between the pair of grooves and a head substrate, an upper surface of a heat radiating plate located immediately below the heating element row and inner wall surfaces of grooves located on both sides thereof Angle between 110 ° and 15
A thermal head, wherein the inner wall surface is inclined toward the row of heating elements so as to form 0 °.
素子列を有するヘッド基板を、発熱素子列の直下領域が
前記一対の溝間に位置するように載置させるとともに、
前記一対の溝間の放熱板とヘッド基板との間に放熱コン
パウンドを介在させたサーマルヘッドにおいて、 前記発熱素子列の直下に位置する放熱板上面と、その両
側に位置する溝の内壁面との間に形成される角部を曲率
半径０．５ｍｍ〜２．０ｍｍの曲面状になしたことを特
徴とするサーマルヘッド。2. A head substrate having a row of heating elements is mounted on a heat radiating plate having a pair of grooves on an upper surface such that a region immediately below the row of heating elements is located between the pair of grooves.
In a thermal head in which a heat radiating compound is interposed between a heat radiating plate between the pair of grooves and a head substrate, an upper surface of a heat radiating plate located immediately below the heating element row and inner wall surfaces of grooves located on both sides thereof A thermal head characterized in that the corners formed between them are curved with a radius of curvature of 0.5 mm to 2.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000332423A JP2002137428A (en) | 2000-10-31 | 2000-10-31 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000332423A JP2002137428A (en) | 2000-10-31 | 2000-10-31 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002137428A true JP2002137428A (en) | 2002-05-14 |
Family
ID=18808632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000332423A Pending JP2002137428A (en) | 2000-10-31 | 2000-10-31 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002137428A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011025629A (en) * | 2009-07-29 | 2011-02-10 | Kyocera Corp | Recording head and recorder |
| JP2012066400A (en) * | 2010-09-21 | 2012-04-05 | Toshiba Hokuto Electronics Corp | Thermal print head |
| CN102470677A (en) * | 2009-08-27 | 2012-05-23 | 京瓷株式会社 | Recording head and recording device comprising same |
-
2000
- 2000-10-31 JP JP2000332423A patent/JP2002137428A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011025629A (en) * | 2009-07-29 | 2011-02-10 | Kyocera Corp | Recording head and recorder |
| CN102470677A (en) * | 2009-08-27 | 2012-05-23 | 京瓷株式会社 | Recording head and recording device comprising same |
| EP2471661A1 (en) * | 2009-08-27 | 2012-07-04 | Kyocera Corporation | Recording head and recording device comprising same |
| EP2471661A4 (en) * | 2009-08-27 | 2013-02-27 | Kyocera Corp | Recording head and recording device comprising same |
| US8587624B2 (en) | 2009-08-27 | 2013-11-19 | Kyocera Corporation | Recording head and recording device comprising same |
| JP2012066400A (en) * | 2010-09-21 | 2012-04-05 | Toshiba Hokuto Electronics Corp | Thermal print head |
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