JP2002094222A - Sheet for bonding electronic component, method for mounting electronic component, and equipment for mounting the same - Google Patents
Sheet for bonding electronic component, method for mounting electronic component, and equipment for mounting the sameInfo
- Publication number
- JP2002094222A JP2002094222A JP2000283624A JP2000283624A JP2002094222A JP 2002094222 A JP2002094222 A JP 2002094222A JP 2000283624 A JP2000283624 A JP 2000283624A JP 2000283624 A JP2000283624 A JP 2000283624A JP 2002094222 A JP2002094222 A JP 2002094222A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- forming body
- circuit forming
- circuit
- bonding sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば半導体素子
のような電子部品を回路形成体に電気的に接合するとき
に使用される電子部品接合用シートに関し、さらに該電
子部品接合用シートを用いて上記電子部品の実装を行な
う電子部品実装方法、及び該電子部品実装方法を実行す
る電子部品実装装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet for joining electronic parts, which is used for electrically joining an electronic part such as a semiconductor element to a circuit-forming body. The present invention also relates to an electronic component mounting method for mounting the electronic component and an electronic component mounting apparatus for executing the electronic component mounting method.
【０００２】[0002]
【従来の技術】従来の半導体素子の実装方法について、
図１１〜図１５を参照しながら説明する。半導体素子を
回路基板に接合する方法としては、従来、熱可塑性若し
くは熱硬化性の樹脂と導電粉末とを有する異方導電性の
接合シート、又は導電粉末を含まない熱可塑性若しくは
熱硬化性の樹脂を有する接合シートを用いる方法が高密
度で、薄型で、高信頼性かつ高生産性にて実装可能な接
合方法として盛んに実施されている。2. Description of the Related Art A conventional method for mounting a semiconductor device is described below.
This will be described with reference to FIGS. Conventionally, as a method of joining a semiconductor element to a circuit board, an anisotropic conductive bonding sheet having a thermoplastic or thermosetting resin and a conductive powder, or a thermoplastic or thermosetting resin containing no conductive powder The method using a bonding sheet having a high density, a low thickness, a high reliability, and a high productivity can be implemented as a bonding method.
【０００３】図１１〜図１３は、半導体素子の従来の実
装方法の一例を示している。ここで、１は、回路基板で
あり、半導体素子５の電極６と対向する、回路基板１上
の位置に電極３が形成されている。２は、熱可塑性若し
くは熱硬化性の樹脂シート、又は熱可塑性若しくは熱硬
化性の樹脂とＡｕ、Ｃｕ、Ｎｉ等の導電粉末とを有する
異方導電性の接着シートであり、回路基板１の電極３を
覆って接着されている。熱可塑性若しくは熱硬化性の樹
脂シート又は熱可塑性若しくは熱硬化性の樹脂とＡｕ、
Ｃｕ、Ｎｉ等の導電粉末とを有する異方導電性のシート
２の回路基板１への接着は、一般的に温度１００℃、圧
力約１０×１０5Ｐａ、時間５秒にて、シート２を回路
基板１へ加熱及び加圧して行われる。FIGS. 11 to 13 show an example of a conventional mounting method of a semiconductor device. Here, reference numeral 1 denotes a circuit board, and the electrode 3 is formed at a position on the circuit board 1 facing the electrode 6 of the semiconductor element 5. Reference numeral 2 denotes a thermoplastic or thermosetting resin sheet, or an anisotropic conductive adhesive sheet having a thermoplastic or thermosetting resin and a conductive powder such as Au, Cu, or Ni. 3 is adhered. A thermoplastic or thermosetting resin sheet or a thermoplastic or thermosetting resin and Au,
Adhesion of the anisotropic conductive sheet 2 having a conductive powder of Cu, Ni, etc. to the circuit board 1 is generally performed at a temperature of 100 ° C., a pressure of about 10 × 10 5 Pa, and a time of 5 seconds. This is performed by applying heat and pressure to the circuit board 1.
【０００４】４は認識マークであり、上記半導体素子５
の電極６と回路基板１の電極３を位置合わせし半導体素
子５を回路基板１に実装する工程において、実装設備に
て半導体素子５と回路基板１の相対位置を算出し位置補
正する為に、画像として取り込み利用される。図１３に
示すように、上記実装設備にて回路基板１上の認識マー
ク４を画像として取り込み、半導体素子５と回路基板１
の相対位置を算出し位置補正した後、半導体素子５は、
シート２が接着された回路基板１上に実装される。[0004] Reference numeral 4 denotes a recognition mark.
In the process of aligning the electrode 6 of the circuit board 1 with the electrode 3 of the circuit board 1 and mounting the semiconductor element 5 on the circuit board 1, in order to calculate and correct the relative position of the semiconductor element 5 and the circuit board 1 by mounting equipment, Captured and used as an image. As shown in FIG. 13, the recognition mark 4 on the circuit board 1 is captured as an image by the above-mentioned mounting equipment, and the semiconductor element 5 and the circuit board 1
After calculating the relative position and correcting the position, the semiconductor element 5
The sheet 2 is mounted on the circuit board 1 to which the sheet 2 is adhered.
【０００５】その後、実装された半導体素子５に対し
て、上記実装設備に備わりヒータ８を有する加熱加圧ツ
ール７により、温度及び圧力が加えられシート２が硬化
される。よって半導体素子５の電極６と回路基板１の電
極３は電気的に接合されるとともに、シート２の硬化収
縮力を利用して半導体素子５と回路基板１との接合の機
械的信頼性を確保している。尚、上記接合時の一般的な
加熱及び加圧条件は、温度２００℃、圧力約３０×１０
5Ｐａ、時間３０秒である。[0005] Thereafter, a temperature and a pressure are applied to the mounted semiconductor element 5 by a heating and pressurizing tool 7 having a heater 8 provided in the mounting facility, and the sheet 2 is cured. Therefore, the electrode 6 of the semiconductor element 5 and the electrode 3 of the circuit board 1 are electrically joined, and the mechanical reliability of the joining between the semiconductor element 5 and the circuit board 1 is secured by utilizing the curing shrinkage force of the sheet 2. are doing. The general heating and pressurizing conditions at the time of the above-mentioned joining are as follows: temperature 200 ° C., pressure about 30 × 10
5 Pa, time 30 seconds.
【０００６】尚、図１１において回路基板１上の回路パ
ターンは、半導体素子５の電極６に対向する電極３のみ
を示しており、その他の引き回し配線の図示は省略して
いる。又、上述の説明では、画像として取り込む対象物
として認識マーク４を利用したが、例えば、回路基板１
に認識マーク４が設けられていない場合等、半導体素子
５の電極６に対向する電極３の周辺に、特徴のある回路
パターンが存在すればそのパターンを上記画像対象物と
して利用しても良い。但し、一般的には実装精度を向上
させる為に、図１１に示すような十字、丸、四角等の形
状をした認識マーク４を半導体素子５の電極６に対向す
る電極３周辺に設けられており、そのマークを利用す
る。In FIG. 11, only the electrode 3 facing the electrode 6 of the semiconductor element 5 is shown in the circuit pattern on the circuit board 1, and other wirings are not shown. In the above description, the recognition mark 4 is used as an object to be captured as an image.
For example, when the recognition mark 4 is not provided, if a characteristic circuit pattern exists around the electrode 3 facing the electrode 6 of the semiconductor element 5, the pattern may be used as the image object. However, in general, in order to improve the mounting accuracy, a recognition mark 4 having a cross, a circle, a square or the like as shown in FIG. 11 is provided around the electrode 3 facing the electrode 6 of the semiconductor element 5. And use that mark.
【０００７】又、他の従来例として、図１４及び図１５
に示す方法がある。図１４において、９は回路基板であ
り、半導体素子が複数個、本例の場合４個が搭載出来る
ように、回路基板９上における１０〜１２の４領域に各
半導体素子の電極と対向する電極３が形成されている。
熱可塑性若しくは熱硬化性の樹脂シート、又は熱可塑性
若しくは熱硬化性の樹脂とＡｕ、Ｃｕ、Ｎｉ等の導電粉
末とを有する異方導電性の接着シート２は、各上記半導
体素子が実装される回路基板９上における１０〜１３の
各４領域に、各半導体素子の電極と対向する回路基板９
上の電極３を覆うように接着されている。上記シート２
の回路基板９への接着は、一般的に温度１００℃、圧力
約１０×１０5Ｐａ、時間５秒で行われる。実装設備で
各半導体素子の電極と対向する形で回路基板９上の１０
〜１３の各４領域における電極３周辺に形成された認識
マーク４を画像として取り込み、半導体素子と回路基板
９の相対位置を算出し各半導体素子の位置補正した後、
各上記半導体素子は、シート２が接着された回路基板９
上に実装される。FIGS. 14 and 15 show another conventional example.
There is a method shown in In FIG. 14, reference numeral 9 denotes a circuit board, and a plurality of semiconductor elements, in this case, four electrodes, which are opposed to the electrodes of the respective semiconductor elements, are arranged in four regions 10 to 12 on the circuit board 9 so that four semiconductor elements can be mounted. 3 are formed.
Each of the above semiconductor elements is mounted on a thermoplastic or thermosetting resin sheet, or an anisotropic conductive adhesive sheet 2 having a thermoplastic or thermosetting resin and a conductive powder such as Au, Cu, or Ni. In each of four regions 10 to 13 on the circuit board 9, the circuit board 9 facing the electrode of each semiconductor element is provided.
It is adhered so as to cover the upper electrode 3. Sheet 2 above
Is generally performed at a temperature of 100 ° C., a pressure of about 10 × 10 5 Pa, and a time of 5 seconds. In the mounting equipment, the 10 on the circuit board 9 is opposed to the electrode of each semiconductor element.
After the recognition mark 4 formed around the electrode 3 in each of the four regions 13 to 13 is captured as an image, the relative position between the semiconductor element and the circuit board 9 is calculated and the position of each semiconductor element is corrected,
Each of the above semiconductor elements has a circuit board 9 to which the sheet 2 is adhered.
Implemented above.
【０００８】各上記半導体素子の実装動作は、各半導体
素子が実装される各領域１０〜１３における電極３周辺
の認識マーク４を各半導体素子を実装する度に個別に画
像として取り込み行うか、又は回路基板９の任意の位置
のマークを２点以上取り込んだ後、各半導体素子を連続
して実装していく。各上記半導体素子の実装後、上記実
装設備に備わる加熱加圧ツールにより、各半導体素子を
個別に若しくは一括して、温度及び圧力を上記半導体素
子に加え、シート２を硬化する。よって、各半導体素子
の電極と回路基板９の電極３は電気的に接合されるとと
もに、シート２の硬化収縮力を利用して半導体素子５と
回路基板１との接合の機械的信頼性を確保している。
尚、接合時の一般的な加熱及び加圧条件は、温度２００
℃、圧力約３０×１０5Ｐａ、時間３０秒である。The mounting operation of each of the above-mentioned semiconductor elements is performed by taking the recognition mark 4 around the electrode 3 in each of the regions 10 to 13 where each of the semiconductor elements is mounted as an image each time the respective semiconductor element is mounted, or After capturing two or more marks at arbitrary positions on the circuit board 9, each semiconductor element is mounted successively. After mounting each of the semiconductor elements, the temperature and pressure are applied to the semiconductor elements individually or collectively by a heating and pressing tool provided in the mounting equipment, and the sheet 2 is cured. Therefore, the electrodes of the respective semiconductor elements and the electrodes 3 of the circuit board 9 are electrically joined, and the mechanical reliability of the joining between the semiconductor elements 5 and the circuit board 1 is secured by utilizing the curing shrinkage force of the sheet 2. are doing.
Note that general heating and pressing conditions at the time of bonding are as follows:
C., pressure about 30 × 10 5 Pa, time 30 seconds.
【０００９】[0009]
【発明が解決しようとする課題】しかし、上述した従来
の半導体素子の実装方法においては、以下に示す課題が
あった。図１１〜図１３に示す従来の半導体素子の実装
方法では、図１６に示すように、例えば、回路基板１上
の回路パターン１４と、半導体素子５の電極６に対向す
る回路基板１上の電極３とが、図示する距離１６のよう
に、近接している場合、認識マーク４を形成するスペー
スが必然的に狭くなる。よって、電極３と認識マーク４
の距離１５が短くなる為、シート２を回路基板１に貼り
付けたとき、シート２が認識マーク４を覆ってしまう。
その結果、実装設備は、認識マーク４を認識画像として
取り込むことができず、半導体素子５を回路基板１上に
実装できないという問題が生じる。尚、図１６におい
て、回路基板１上の回路パターン１４は、一部のみを示
しており、その他の引き回し配線の図示は省略してい
る。However, the above-mentioned conventional method for mounting a semiconductor device has the following problems. In the conventional method for mounting a semiconductor element shown in FIGS. 11 to 13, for example, as shown in FIG. 16, for example, a circuit pattern 14 on the circuit board 1 and an electrode on the circuit board 1 facing the electrode 6 of the semiconductor element 5. 3 are close to each other, such as a distance 16 shown in the figure, the space for forming the recognition mark 4 is necessarily narrowed. Therefore, the electrode 3 and the recognition mark 4
Since the distance 15 is short, the sheet 2 covers the recognition mark 4 when the sheet 2 is attached to the circuit board 1.
As a result, the mounting facility cannot take in the recognition mark 4 as a recognition image, and there is a problem that the semiconductor element 5 cannot be mounted on the circuit board 1. Note that, in FIG. 16, only a part of the circuit pattern 14 on the circuit board 1 is shown, and other wirings are not shown.
【００１０】又、図１４及び図１５に示すような、各半
導体素子が実装される回路基板９上の各４領域１０〜１
３に、各半導体素子の電極と対向する回路基板９上の電
極３を覆うようにして上記シート２を個別に接着する従
来の半導体素子の実装方法に対して、生産性を向上させ
る為に、図１７に示すように、上記４領域１０〜１３の
全てを一枚のシート２で覆う場合がある。この場合、符
号１８にて示すように、認識マーク４がシート２に覆わ
れてしまう。その結果、認識マーク４を実装設備で認識
画像として取り込むことができず、各半導体素子を実装
できないという問題が生じる。又、上述のように一枚の
シート２で上記４領域１０〜１３を覆う場合、生産性は
二倍以上向上する。よって、上記問題点のために該方法
を採れないことは、生産性のみならず、製品のコストア
ップにもつながる。本発明は、上述したような問題点を
解決するためになされたもので、電子部品を高密度にて
実装可能とし、さらに、高生産性及び低コストにて実装
可能とする、電子部品接合用シート、該電子部品接合用
シートを用いた電子部品実装方法、及び該電子部品実装
方法を実行する電子部品実装装置を提供することを目的
とする。Also, as shown in FIGS. 14 and 15, each of four regions 10 to 1 on a circuit board 9 on which each semiconductor element is mounted.
In order to improve the productivity, in order to improve the productivity in comparison with the conventional semiconductor element mounting method in which the sheets 2 are individually bonded so as to cover the electrodes 3 on the circuit board 9 facing the electrodes of the respective semiconductor elements, As shown in FIG. 17, there is a case where all of the four regions 10 to 13 are covered with one sheet 2. In this case, as indicated by reference numeral 18, the recognition mark 4 is covered by the sheet 2. As a result, there arises a problem that the recognition mark 4 cannot be captured as a recognition image by the mounting equipment, and each semiconductor element cannot be mounted. Further, when the four regions 10 to 13 are covered with one sheet 2 as described above, the productivity is more than doubled. Therefore, not being able to adopt this method due to the above-mentioned problems leads not only to productivity but also to an increase in product cost. SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has been made to enable electronic components to be mounted at a high density, and to be mountable at a high productivity and at a low cost. It is an object to provide a sheet, an electronic component mounting method using the electronic component bonding sheet, and an electronic component mounting apparatus that executes the electronic component mounting method.
【００１１】[0011]
【課題を解決するための手段】本発明の第１態様の電子
部品接合用シートは、電子部品と該電子部品を装着する
回路形成体との間にて少なくとも上記電子部品に対応し
て配置され、かつ上記電子部品を上記回路形成体に装着
するとき上記電子部品と上記回路形成体とを接合する電
子部品接合用シートであって、上記回路形成体又は上記
電子部品に形成され上記電子部品と上記回路形成体との
上記装着のときの位置合わせに使用される認識用パター
ンに対応して形成され、かつ上記回路形成体又は上記電
子部品上に当該電子部品接合用シートを載置したとき上
記認識用パターンを露出させ該認識用パターンの検出を
可能とする検出用窓を備えたことを特徴とする。The electronic component bonding sheet according to the first aspect of the present invention is disposed between an electronic component and a circuit forming body on which the electronic component is mounted, at least corresponding to the electronic component. An electronic component bonding sheet for bonding the electronic component and the circuit forming body when mounting the electronic component on the circuit forming body, wherein the electronic component is formed on the circuit forming body or the electronic component. The electronic component bonding sheet is formed corresponding to the recognition pattern used for the alignment at the time of the mounting with the circuit formed body, and the electronic component bonding sheet is placed on the circuit formed body or the electronic component. A detection window for exposing the recognition pattern and enabling detection of the recognition pattern is provided.
【００１２】上記認識用パターンは、上記回路形成体上
に形成されている位置合わせ用マークであってもよい。The recognition pattern may be a positioning mark formed on the circuit forming body.
【００１３】上記認識用パターンは、上記電子部品の電
極に対応して上記回路形成体上に形成されている電極部
であってもよい。[0013] The recognition pattern may be an electrode portion formed on the circuit forming body corresponding to an electrode of the electronic component.
【００１４】上記認識用パターンは、上記回路形成体上
に形成されている配線であってもよい。The recognition pattern may be a wiring formed on the circuit forming body.
【００１５】本発明の第２態様の電子部品実装方法は、
請求項１記載の電子部品接合用シートに備わる上記検出
用窓を上記回路形成体又は上記電子部品上に形成されて
いる上記認識用パターンに対応させた状態で上記回路形
成体又は上記電子部品上に載置された上記電子部品接合
用シートの上記検出用窓を通して、露出している上記認
識用パターンを検出し、該検出にて得た検出情報に基い
て上記回路形成体と上記電子部品との位置合わせを行っ
た後、上記回路形成体と上記電子部品との接合を行な
う、ことを特徴とする。An electronic component mounting method according to a second aspect of the present invention comprises:
2. The circuit forming body or the electronic component in a state where the detection window provided in the electronic component bonding sheet according to claim 1 corresponds to the recognition pattern formed on the circuit forming body or the electronic component. Through the detection window of the electronic component bonding sheet placed on, to detect the exposed recognition pattern, based on the detection information obtained by the detection, the circuit forming body and the electronic component After the above-mentioned alignment, the circuit forming body and the electronic component are joined.
【００１６】本発明の第３態様の電子部品実装装置は、
請求項１記載の電子部品接合用シートに備わる上記検出
用窓を上記回路形成体又は上記電子部品上に形成されて
いる上記認識用パターンに対応させた状態で上記回路形
成体又は上記電子部品上に載置された上記電子部品接合
用シートの上記検出用窓を通して、露出している上記認
識用パターンを検出する検出装置と、上記検出装置から
得た検出情報に基いて上記回路形成体と上記電子部品と
の位置合わせを行い上記回路形成体と上記電子部品との
接合を行なう接合装置と、を備えたことを特徴とする。An electronic component mounting apparatus according to a third aspect of the present invention comprises:
2. The circuit forming body or the electronic component in a state where the detection window provided in the electronic component bonding sheet according to claim 1 corresponds to the recognition pattern formed on the circuit forming body or the electronic component. A detection device for detecting the exposed recognition pattern through the detection window of the electronic component bonding sheet placed on the circuit forming body and the detection device based on detection information obtained from the detection device; And a joining device for aligning with the electronic component and joining the circuit forming body and the electronic component.
【００１７】[0017]
【発明の実施の形態】本発明の実施形態である、電子部
品接合用シート、該電子部品接合用シートを用いた電子
部品実装方法、及び該電子部品実装方法を実行する電子
部品実装装置について、図を参照しながら以下に説明す
る。尚、各図において同じ構成部分については同じ符号
を付している。又、図１、３、５〜９では、回路形成体
上の回路パターンは一部のみを示しており、その他の引
き回し配線については図示を省略している。又、図１、
３、５〜９において、電子部品接合用シートを表すため
にハッチングを施しているが、該ハッチングは断面を示
すものではない。DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component bonding sheet, an electronic component mounting method using the electronic component bonding sheet, and an electronic component mounting apparatus for executing the electronic component mounting method according to embodiments of the present invention are described below. This will be described below with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals. In FIGS. 1, 3, 5 to 9, only a part of the circuit pattern on the circuit forming body is shown, and other wirings are not shown. Also, FIG.
In 3, 5 to 9, hatching is applied to represent the electronic component bonding sheet, but the hatching does not show a cross section.
【００１８】又、この明細書で回路形成体とは、樹脂基
板、紙−フェノール基板、セラミック基板、ガラス・エ
ポキシ（ガラエポ）基板、フィルム基板等の回路基板、
単層基板若しくは多層基板などの回路基板、部品、筐
体、又は、フレーム等、回路が形成されている対象物を
意味する。例えば図２に示すように、回路形成体１２０
の一例は、いわゆるプリント基板である。該回路形成体
１２０には、当該回路形成体１２０に実装される電子部
品１２５の電極１２６と対向する位置に、電極部１２３
及び回路パターン１３４が形成されている。又、上記電
子部品１２５の一例は、図示するＩＣチップのような半
導体素子である。In this specification, the term "circuit-forming body" means a circuit board such as a resin board, a paper-phenol board, a ceramic board, a glass epoxy (glass epoxy) board, a film board, or the like.
It refers to an object on which a circuit is formed, such as a circuit board such as a single-layer board or a multilayer board, a component, a housing, or a frame. For example, as shown in FIG.
Is a so-called printed circuit board. The circuit part 120 has an electrode part 123 at a position facing the electrode 126 of the electronic component 125 mounted on the circuit part 120.
And a circuit pattern 134 are formed. An example of the electronic component 125 is a semiconductor device such as an IC chip shown in the drawing.
【００１９】まず、本実施形態の電子部品接合シートに
ついて説明する。図１及び図２に示すように、上記電子
部品接合用シート１０１は、熱可塑性若しくは熱硬化性
のシート状の樹脂材、又は熱可塑性若しくは熱硬化性の
樹脂材とＡｕ、Ｃｕ、Ｎｉ等の導電粉末とを有するシー
ト状の異方導電性樹脂材であり、検出用窓１１０を備え
ている。このような電子部品接合用シート１０１は、電
子部品１２５を回路形成体１２０に装着するとき、電子
部品１２５と回路形成体１２０との間にて少なくとも上
記電子部品１２５に対応して配置され、かつ電子部品１
２５と回路形成体１２０との接合を行なう部材である。
又、図２に示すように、電子部品接合用シート１０１
は、平面的に電子部品１２５以上の大きさを有する。
尚、電子部品接合用シート１０１の大きさは、必ずし
も、平面的に電子部品１２５以上の大きさを有する必要
はなく、電子部品１２５より小さくても良い。但し、電
子部品接合用シート１０１が上記異方導電性樹脂材であ
るときには、電子部品１２５の電極１２６を覆う程度の
大きさである必要がある。First, the electronic component bonding sheet of the present embodiment will be described. As shown in FIGS. 1 and 2, the electronic component bonding sheet 101 is made of a thermoplastic or thermosetting sheet-like resin material, or a thermoplastic or thermosetting resin material and Au, Cu, Ni, or the like. It is a sheet-shaped anisotropic conductive resin material having conductive powder and has a detection window 110. When the electronic component 125 is mounted on the circuit forming body 120, the electronic component bonding sheet 101 is arranged between the electronic component 125 and the circuit forming body 120 at least corresponding to the electronic component 125, and Electronic component 1
25 is a member that joins the circuit forming body 120 and 25.
Also, as shown in FIG.
Has a size larger than the electronic component 125 in plan view.
Note that the size of the electronic component bonding sheet 101 does not necessarily need to be larger than the electronic component 125 in plan view, and may be smaller than the electronic component 125. However, when the electronic component bonding sheet 101 is the anisotropic conductive resin material, the electronic component bonding sheet 101 needs to be large enough to cover the electrodes 126 of the electronic component 125.
【００２０】上記検出用窓１１０は、回路形成体１２０
又は電子部品１２５に形成されている認識用パターンに
対応して形成され、上記電子部品接合用シート１０１の
厚み方向に該電子部品接合用シート１０１を貫通する穴
である。The detection window 110 is provided with a circuit forming body 120.
Alternatively, the holes are formed corresponding to the recognition patterns formed on the electronic component 125 and penetrate the electronic component bonding sheet 101 in the thickness direction of the electronic component bonding sheet 101.
【００２１】ここで上記認識用パターンは、電子部品実
装装置にて上記電子部品１２５を回路形成体１２０に実
装するとき、電子部品１２５と、該電子部品１２５が実
装される回路形成体１２０上の実装位置との相対位置を
求めて両者の位置ずれを補正するために、上記電子部品
実装装置に備わり検出装置とのしての機能を果たす一例
である撮像装置にて撮像されるパターンであり、例えば
図１に示すように、回路形成体１２０上に予め形成され
た位置合わせ用マーク１２４が相当する。又、上記認識
用パターンは、上記位置合わせ用マーク１２４に限定さ
れるものではなく、図３に示すように、回路形成体１２
０上に形成されている上記電極部１２３であってもよい
し、図６に示すように、回路形成体１２０上に形成され
ている上記回路パターン１３４であってもよい。又、上
記認識用パターンは、一種類に限定されるものではな
く、上述の位置合わせ用マーク１２４、上記電極部１２
３、及び上記回路パターン１３４の複数種を組み合わせ
てもよく、例えば図６に示すように、電極部１２３及び
回路パターン１３４の両方を用いても良い。又、上記認
識用パターンは、回路形成体１２０上に形成されるもの
に限定するものではなく、上記電子部品１２５上に形成
することもでき、例えば上記電子部品１２５の電極１２
６を相当させてもよい。Here, when the electronic component 125 is mounted on the circuit forming body 120 by the electronic component mounting apparatus, the recognition pattern is formed on the electronic component 125 and on the circuit forming body 120 on which the electronic component 125 is mounted. In order to determine the relative position with respect to the mounting position and to correct the displacement between the two, it is a pattern that is taken by an imaging device that is an example that is provided in the electronic component mounting device and performs a function as a detection device, For example, as shown in FIG. 1, the alignment mark 124 formed in advance on the circuit forming body 120 corresponds to this. Further, the recognition pattern is not limited to the alignment mark 124, and as shown in FIG.
The electrode portion 123 may be formed on the circuit board 120, or may be the circuit pattern 134 formed on the circuit forming body 120 as shown in FIG. Further, the recognition pattern is not limited to one type, and the above-described alignment mark 124 and the electrode portion 12 may be used.
3, and a plurality of types of the circuit patterns 134 may be combined. For example, as shown in FIG. 6, both the electrode portions 123 and the circuit patterns 134 may be used. Further, the recognition pattern is not limited to the pattern formed on the circuit forming body 120, and may be formed on the electronic component 125. For example, the electrode 12 of the electronic component 125
6 may be used.
【００２２】上記検出用窓１１０は、例えばＮＣパンチ
ャーや、金型を用いて、ピンで打ち抜く方法等により形
成する。又、検出用窓１１０の大きさは、上記認識用パ
ターンである上記位置合わせ用マーク１２４等の全体を
露出させる大きさが好ましい。しかしながら、上記認識
用パターンの形状によっては、その一部が隠れる状態で
あっても、当該認識用パターンの特徴的な形状部分が見
え、認識上問題が生じない大きさであっても良い。The detection window 110 is formed by, for example, punching out with a pin using an NC puncher or a mold. The size of the detection window 110 is preferably such that the entirety of the alignment mark 124 or the like, which is the recognition pattern, is exposed. However, depending on the shape of the recognition pattern, even if a part of the recognition pattern is hidden, the size may be such that a characteristic shape portion of the recognition pattern is visible and no problem occurs in recognition.
【００２３】又、図１等では、検出用窓１１０の形状は
円形であるが、これに限定されるものではなく、四角
形、三角形、楕円形等でもよく、形状は問わない。又、
図１等では、上記認識用パターンである上記位置合わせ
用マーク１２４等は、電子部品１２５の実装領域の対角
位置の２箇所に設けられ、これに対応して検出用窓１１
０も電子部品接合用シート１０１の２箇所に形成してい
るが、これに限定されるものではない。例えば図５で
は、回路形成体１２０上に形成されている４角に位置す
る４つの電極部１２３に対応して４つの検出用窓１１０
を設けている。要するに、検出用窓１１０は、上記認識
用パターンに対応させて任意の数にて形成すればよい。
但し、検出用窓１１０を上述の２個を超えて設けること
で、認識ポイントが増える為、より高精度に電子部品１
２５を回路形成体１２０に実装することができる。In FIG. 1 and the like, the shape of the detection window 110 is circular, but the shape is not limited to this, and may be a square, a triangle, an ellipse, or the like, and the shape is not limited. or,
In FIG. 1 and the like, the alignment marks 124 and the like, which are the recognition patterns, are provided at two diagonal positions in the mounting area of the electronic component 125.
Although 0 is also formed at two places on the electronic component bonding sheet 101, it is not limited to this. For example, in FIG. 5, four detection windows 110 corresponding to the four electrode portions 123 located at the four corners formed on the circuit formation body 120 are shown.
Is provided. In short, the detection windows 110 may be formed in an arbitrary number corresponding to the recognition patterns.
However, since the number of recognition points increases by providing more than the two detection windows 110 described above, the electronic component 1 can be more accurately provided.
25 can be mounted on the circuit forming body 120.
【００２４】上述のように、認識用パターンに対応して
上記検出用窓１１０が電子部品接合用シート１０１に形
成される。よって、電子部品接合用シート１０１が電子
部品１２５と回路形成体１２０との間にて少なくとも上
記電子部品１２５に対応して配置されても、上述のよう
に検出用窓１１０は貫通穴であるので、上記認識用パタ
ーンは、電子部品接合用シート１０１にて覆われること
はなく、露出した状態である。したがって、電子部品接
合用シート１０１を載置した状態であっても、検出用窓
１１０を通して上記認識用パターンを上記撮像装置にて
撮像することができる。As described above, the detection window 110 is formed in the electronic component bonding sheet 101 corresponding to the recognition pattern. Therefore, even if the electronic component bonding sheet 101 is disposed between the electronic component 125 and the circuit forming body 120 at least corresponding to the electronic component 125, the detection window 110 is a through hole as described above. The recognition pattern is not covered with the electronic component bonding sheet 101 but is exposed. Therefore, even when the electronic component bonding sheet 101 is placed, the recognition pattern can be imaged by the imaging device through the detection window 110.
【００２５】又、図７〜図９には、回路形成体１２１上
に複数個の電子部品１２５を搭載可能な場合を示してい
る。図７〜図９では、電子部品１２５を４個、搭載可能
なように回路形成体１２１上には、各電子部品１２５の
電極１２６に対応するように、電極部形成部分１２２−
１〜１２２−４が形成されている。少なくともこれらの
電極部形成部分１２２−１〜１２２−４を覆い、一枚の
電子部品接合用シート１０２が設けられる。図７に示す
電子部品接合用シート１０２−１では、図１に相当する
ように、回路形成体１２１の対角位置に存在する２箇所
の上記認識用パターンを撮像可能なように、２つの検出
用窓１１０を設けている。FIGS. 7 to 9 show a case where a plurality of electronic components 125 can be mounted on the circuit forming body 121. In FIGS. 7 to 9, four electronic components 125 are mounted on the circuit forming body 121 so as to be able to be mounted thereon so as to correspond to the electrodes 126 of the electronic components 125.
1 to 122-4 are formed. One electronic component bonding sheet 102 is provided so as to cover at least these electrode portion forming portions 122-1 to 122-4. In the electronic component bonding sheet 102-1 shown in FIG. 7, as shown in FIG. 1, two detection patterns are provided so that two recognition patterns existing at diagonal positions of the circuit forming body 121 can be imaged. Window 110 is provided.
【００２６】図８に示す電子部品接合用シート１０２−
２では、上記電極部形成部分１２２−１〜１２２−４の
それぞれについて設けられている上記認識用パターンの
全てに対応するように、検出用窓１１０を８つ設けてい
る。図９に示す電子部品接合用シート１０２−３では、
図６に示す場合と同様に、上記電極部１２３及び回路パ
ターン１３４に対応して検出用窓１１０を８つ設けてい
る。図８及び図９に示すタイプでは、図７の場合に比べ
て、検出用窓１１０の数を増やしているので、撮像可能
な上記認識用パターンが増え、より高精度に電子部品１
２５を回路形成体１２１に実装することが可能となる。The electronic component bonding sheet 102- shown in FIG.
In No. 2, eight detection windows 110 are provided so as to correspond to all of the recognition patterns provided for each of the electrode portion forming portions 122-1 to 122-4. In the electronic component bonding sheet 102-3 shown in FIG.
As in the case shown in FIG. 6, eight detection windows 110 are provided corresponding to the electrode portions 123 and the circuit patterns 134. In the type shown in FIGS. 8 and 9, the number of detection windows 110 is increased as compared with the case of FIG.
25 can be mounted on the circuit forming body 121.
【００２７】図７〜図９に示す電子部品接合用シート１
０２を使用した場合、各電極部形成部分１２２−１〜１
２２−４の全てを一枚の電子部品接合用シート１０２に
て覆った後、検出用窓１１０を通して上記認識用パター
ンを撮像する。その後、各電極部形成部分１２２−１〜
１２２−４のそれぞれに対応して各電子部品１２５を連
続的に実装していく。よって、各電極部形成部分１２２
−１〜１２２−４のそれぞれを個別に電子部品接合用シ
ートにて覆うのではないので、シート接着の時間を大幅
に短縮でき、生産性を向上させることができる。よっ
て、コストダウンを図ることもできる。Electronic component bonding sheet 1 shown in FIGS.
02 is used, each of the electrode portion forming portions 122-1 to 122-1
After covering all of 22-4 with one electronic component bonding sheet 102, the above-mentioned recognition pattern is imaged through the detection window 110. Thereafter, each of the electrode portion forming portions 122-1 to 122-1
Each electronic component 125 is successively mounted corresponding to each of the components 122-4. Therefore, each electrode portion forming portion 122
Since each of -1 to 122-4 is not individually covered with the electronic component bonding sheet, the time for sheet bonding can be greatly reduced, and the productivity can be improved. Therefore, cost can be reduced.
【００２８】次に、上述した電子部品接合用シート１０
１、１０２の内、図１、３、５、６に示す電子部品接合
用シート１０１を例に採り、回路形成体１２０上に上記
電子部品１２５を接合させる電子部品実装装置について
説明する。図１０に示すように上記電子部品実装装置２
０１は、搬入搬出装置２１０と、回路形成体移載装置２
２０と、回路形成体搬送装置２３０と、接合用シート貼
付装置２４０と、電子部品供給載置装置２５０と、接合
装置２６０と、制御装置２８０とを備える。上記搬入搬
出装置２１０は、搬入装置２１１と搬出装置２１２とを
有し、上記搬入装置２１１にて当該電子部品実装装置２
０１に回路形成体１２０を搬入し、回路形成体１２０に
電子部品１２５を実装した電子部品実装済回路形成体を
上記搬出装置２１２にて当該電子部品実装装置２０１か
ら次工程へ搬出する装置である。上記回路形成体移載装
置２２０は、上記搬入装置２１１にて搬入された回路形
成体１２０を、搬入装置２１１から上記回路形成体搬送
装置２３０の支持テーブル２３０１に移載するととも
に、上記支持テーブル２３０１から上記電子部品実装済
回路形成体を上記搬出装置２１２へ移載する装置であ
る。Next, the electronic component bonding sheet 10 described above is used.
The electronic component mounting apparatus for bonding the electronic component 125 on the circuit forming body 120 will be described by taking the electronic component bonding sheet 101 shown in FIGS. As shown in FIG.
01 is a carry-in / carry-out device 210 and a circuit-formed-body transfer device 2
20, a circuit-forming-body conveying device 230, a joining sheet sticking device 240, an electronic component supply / placement device 250, a joining device 260, and a control device 280. The carry-in / carry-out device 210 includes a carry-in device 211 and a carry-out device 212.
01 is a device in which the circuit-formed body 120 is carried in, and the electronic-part-mounted circuit formed body in which the electronic component 125 is mounted on the circuit-formed body 120 is carried out from the electronic component mounting device 201 to the next process by the carrying-out device 212. . The circuit forming body transfer device 220 transfers the circuit forming body 120 carried in by the carrying-in device 211 from the carrying-in device 211 to the support table 2301 of the circuit-forming body transporting device 230, and also includes the support table 2301. Is a device for transferring the electronic component-mounted circuit formed body to the unloading device 212.
【００２９】上記回路形成体搬送装置２３０は、本実施
形態ではロータリー式の搬送装置であり、上記回路形成
体移載装置２２０、上記接合用シート貼付装置２４０、
上記電子部品供給載置装置２５０、上記接合装置２６
０、そして再び上記回路形成体移載装置２２０の順に周
回しながら各装置に回路形成体１２０を搬送する装置で
ある。上記接合用シート貼付装置２４０は、上記電子部
品接合用シート１０１を備え、回路形成体搬送装置２３
０の上記支持テーブル２３０１に載置されている回路形
成体１２０上に、上記電子部品接合用シート１０１を加
熱、加圧して貼付する装置である。上記電子部品供給載
置装置２５０は、部品供給装置２５１と、部品載置装置
２５２と、検出装置とのしての機能を果たす一例である
撮像装置２５３とを備える。上記部品載置装置２５２に
は上記撮像装置２５３が備わり、部品載置装置２５２
は、上記部品供給部２５１から供給された電子部品１２
５を保持して、上記電子部品接合用シート１０１が貼付
された上記支持テーブル２３０１上の回路形成体１２０
上に載置する。このとき、回路形成体１２０に形成され
ている上記認識用パターンである上記位置合わせ用マー
ク１２４等が撮像装置２５３にて上記検出用窓１１０を
通して撮像される。そして当該撮像装置２５３から上記
制御装置２８０へ送出される撮像情報に基いて、電子部
品１２５の位置補正がなされる。In the present embodiment, the circuit-formed-body transfer device 230 is a rotary transfer device, and the circuit-formed-body transfer device 220, the bonding sheet sticking device 240,
The electronic component supply / placement device 250, the joining device 26
0, and a device for transporting the circuit forming body 120 to each device while circulating in the order of the circuit forming body transfer device 220 again. The bonding sheet sticking device 240 includes the electronic component bonding sheet 101, and is provided with the circuit forming body transport device 23.
This is an apparatus for attaching the electronic component bonding sheet 101 to the circuit forming body 120 placed on the support table 2301 by heating and pressing. The electronic component supply and placement device 250 includes a component supply device 251, a component placement device 252, and an imaging device 253 that is an example that functions as a detection device. The component mounting device 252 includes the imaging device 253 and the component mounting device 252.
Is the electronic component 12 supplied from the component supply unit 251.
5 and the circuit forming body 120 on the support table 2301 to which the electronic component bonding sheet 101 is attached.
Place on top. At this time, the alignment mark 124 and the like, which are the recognition patterns formed on the circuit forming body 120, are imaged by the imaging device 253 through the detection window 110. Then, the position of the electronic component 125 is corrected based on the imaging information sent from the imaging device 253 to the control device 280.
【００３０】上記接合装置２６０は、加熱加圧装置２６
１を備え、図２に示すように、上記電子部品接合用シー
ト１０１を間に挟んで回路形成体１２０上に載置された
上記電子部品１２５に対して、上記加熱加圧装置２６１
にて加熱しながら電子部品１２５を回路形成体１２０へ
押圧し、電子部品１２５と回路形成体１２０とを接合さ
せる装置である。上記制御装置２８０は、上述した各装
置の動作制御を行なう。The joining device 260 includes a heating / pressing device 26
As shown in FIG. 2, the electronic component 125 mounted on the circuit forming body 120 with the electronic component bonding sheet 101 interposed therebetween is used as the heating and pressing device 261.
This is a device that presses the electronic component 125 against the circuit forming body 120 while heating the electronic component 125 to join the electronic component 125 and the circuit forming body 120. The control device 280 controls the operation of each device described above.
【００３１】上述のように構成される電子部品実装装置
２０１の動作、つまり該電子部品実装装置２０１にて実
行される電子部品実装方法について、以下に説明する。
上記回路形成体１２０が上記搬入装置２１１にて当該電
子部品実装装置２０１に搬入され、回路形成体移載装置
２２０にて搬入装置２１１から回路形成体搬送装置２３
０の支持テーブル２３０１上に載置される。尚、図１に
は、支持テーブル２３０１上に２個の回路形成体１２０
を載置した場合を示しているが、載置される回路形成体
１２０の個数はこれに限定されるものではない。載置
後、回路形成体搬送装置２３０の支持テーブル２３０１
が矢印にて示す時計回り方向へ４５度回転し、回路形成
体１２０は接合用シート貼付装置２４０へ移動される。
接合用シート貼付装置２４０では、上記電子部品接合用
シート１０１の検出用窓１１０と、例えば上記位置合わ
せ用マーク１２４とをそれぞれ画像認識することで、図
１に示すように、上記電子部品接合用シート１０１の検
出用窓１１０と、例えば上記位置合わせ用マーク１２４
とを位置合わせした後、電子部品接合用シート１０１が
回路形成体１２０上の電極部１２３をカバーして接着さ
れる。上記接着は、一般的に、温度１００℃、圧力約１
０×１０5Ｐａ、時間５秒で行われる。The operation of the electronic component mounting apparatus 201 configured as described above, that is, an electronic component mounting method executed by the electronic component mounting apparatus 201 will be described below.
The circuit forming body 120 is carried into the electronic component mounting apparatus 201 by the carrying-in device 211, and the circuit forming body transporting device 23 is moved from the carrying-in device 211 by the circuit forming body transfer device 220.
0 on the support table 2301. FIG. 1 shows two circuit forming bodies 120 on a support table 2301.
Is shown, but the number of circuit forming bodies 120 to be placed is not limited to this. After the placement, the support table 2301 of the circuit-formed-body transport device 230
Rotates 45 degrees in the clockwise direction indicated by the arrow, and the circuit forming body 120 is moved to the bonding sheet sticking device 240.
In the bonding sheet sticking device 240, the detection window 110 of the electronic component bonding sheet 101 and the alignment mark 124 are image-recognized, respectively, as shown in FIG. The detection window 110 of the sheet 101 and, for example, the alignment mark 124
After the positions are aligned, the electronic component bonding sheet 101 covers and adheres the electrode portion 123 on the circuit forming body 120. The bonding is generally performed at a temperature of 100 ° C. and a pressure of about 1
It is performed at 0 × 10 5 Pa for 5 seconds.
【００３２】電子部品接合用シート１０１の接着後、支
持テーブル２３０１が時計回り方向へさらに４５度回転
し、回路形成体１２０は、部品載置装置２５２へ移動さ
れる。部品載置装置２５２では、まず、撮像装置２５３
にて、電子部品接合用シート１０１の上方から上記検出
用窓１１０を通して上記回路形成体１２０上の例えば上
記位置合わせ用マーク１２４を撮像する。このように、
回路形成体１２０上の電極部１２３を覆って電子部品接
合用シート１０１が配置されても、上述のように検出用
窓１１０は貫通穴であるので、上記認識用パターンであ
る例えば位置合わせ用マーク１２４は、電子部品接合用
シート１０１にて覆われることはなく、露出した状態で
ある。したがって、電子部品接合用シート１０１を載置
した状態であっても、検出用窓１１０を通して上記認識
用パターンを上記撮像装置にて撮像することができる。
そして上記撮像情報は、撮像装置２５３から制御装置２
８０へ送出され、制御装置２８０にて回路形成体１２０
と電子部品１２５との相対位置が求められ、制御装置２
８０は電子部品１２５を保持している部品載置装置２５
２の動作制御を行ない位置補正を行なう。これにより、
図２に示すように、回路形成体１２０の電極部１２３
と、電子部品１２５の電極１２６との位置が合う。そし
て電子部品接合用シート１０１が接着されている回路形
成体１２０へ部品載置装置２５２にて電子部品１２５が
実装される。After bonding the electronic component bonding sheet 101, the support table 2301 is further rotated clockwise by 45 degrees, and the circuit forming body 120 is moved to the component mounting device 252. In the component placement device 252, first, the imaging device 253
Then, for example, the alignment mark 124 on the circuit forming body 120 is imaged from above the electronic component bonding sheet 101 through the detection window 110. in this way,
Even if the electronic component bonding sheet 101 is disposed so as to cover the electrode portion 123 on the circuit forming body 120, since the detection window 110 is a through hole as described above, the recognition pattern, for example, the alignment mark Reference numeral 124 denotes an exposed state without being covered with the electronic component bonding sheet 101. Therefore, even when the electronic component bonding sheet 101 is placed, the recognition pattern can be imaged by the imaging device through the detection window 110.
Then, the imaging information is transmitted from the imaging device 253 to the control device 2
80, and is sent to the circuit forming body 120 by the control device 280.
Relative position between the electronic component 125 and the
80 is a component placement device 25 holding an electronic component 125.
The position control is performed by performing the operation control of step 2. This allows
As shown in FIG. 2, the electrode portion 123 of the circuit forming body 120
And the position of the electrode 126 of the electronic component 125 match. Then, the electronic component 125 is mounted on the circuit forming body 120 to which the electronic component bonding sheet 101 is adhered by the component mounting device 252.
【００３３】電子部品１２５の実装後、支持テーブル２
３０１が時計回り方向へさらに４５度回転し、回路形成
体１２０は、接合装置２６０へ移動される。接合装置２
６０では、図２に示すように、加熱加圧装置２６１によ
り、電子部品１２５及び回路形成体１２０が加熱される
とともに、電子部品１２５が回路形成体１２０側へ押圧
される。尚、図２に示す符号２６２は、加熱用のヒータ
を示す。これにより回路形成体１２０の電極部１２３と
電子部品１２５の電極１２６とが電気的に接続されると
ともに、電子部品接合用シート１０１が硬化し、その硬
化収縮力を利用して回路形成体１２０と電子部品１２５
とが接合され、機械的接合強度が得られる。上記接合の
ための加熱加圧条件としては、一般的に、温度２００
℃、圧力約３０×１０5Ｐａ、時間３０秒である。After mounting the electronic component 125, the support table 2
301 is further rotated clockwise by 45 degrees, and the circuit forming body 120 is moved to the joining device 260. Joining device 2
At 60, as shown in FIG. 2, the electronic component 125 and the circuit forming body 120 are heated by the heating and pressing device 261, and the electronic component 125 is pressed toward the circuit forming body 120. Note that reference numeral 262 shown in FIG. 2 indicates a heater for heating. As a result, the electrode portion 123 of the circuit forming body 120 and the electrode 126 of the electronic component 125 are electrically connected, and the electronic component bonding sheet 101 is hardened. Electronic components 125
Are joined, and mechanical joining strength is obtained. The heating and pressurizing conditions for the bonding are generally as follows:
C., pressure about 30 × 10 5 Pa, time 30 seconds.
【００３４】電子部品１２５の接合後、支持テーブル２
３０１が時計回り方向へさらに４５度回転し、電子部品
１２５を接合した電子部品実装済回路形成体は、再び搬
入搬出装置２１０へ移動される。そして、回路形成体移
載装置２２０により支持テーブル２３０１から搬出装置
２１２へ上記電子部品実装済回路形成体が移載され、搬
出装置２１２は、上記電子部品実装済回路形成体を次工
程へ搬送する。After joining the electronic components 125, the support table 2
301 is further rotated clockwise by 45 degrees, and the electronic component mounted circuit formed body to which the electronic component 125 has been joined is moved to the carry-in / carry-out device 210 again. Then, the circuit-formed body with electronic components mounted thereon is transferred from the support table 2301 to the unloading device 212 by the circuit-formed body transfer device 220, and the unloading device 212 conveys the circuit formed body with electronic components mounted to the next step. .
【００３５】このように本実施形態の電子部品実装装置
２０１では、回路形成体１２０上の電極部１２３を覆っ
て電子部品接合用シート１０１を配置しても、上述のよ
うに検出用窓１１０を通して位置合わせ用マーク１２４
を上記撮像装置２５３にて撮像することができる。よっ
て、回路形成体１２０と電子部品１２５との位置合わせ
の精度が従来に比べて向上することから、電子部品１２
５を高密度で回路形成体１２０へ実装することができ
る。さらに又、図７〜図９に示すように、複数の回路部
分に対して一枚の電子部品接合用シート１０２を配置し
た場合でも、上述の場合と同様に、回路形成体１２０と
電子部品１２５との位置合わせの精度を従来に比べて向
上させることができる。、よって、複数の電子部品１２
５を高精度にて回路形成体１２０へ実装することがで
き、高生産性、低コストを達成することができる。As described above, in the electronic component mounting apparatus 201 of the present embodiment, even if the electronic component bonding sheet 101 is arranged so as to cover the electrode portion 123 on the circuit forming body 120, as described above, it passes through the detection window 110. Alignment mark 124
Can be imaged by the imaging device 253. Therefore, since the accuracy of the alignment between the circuit forming body 120 and the electronic component 125 is improved as compared with the related art, the electronic component 12
5 can be mounted on the circuit forming body 120 at high density. Further, as shown in FIGS. 7 to 9, even when one electronic component bonding sheet 102 is arranged for a plurality of circuit portions, the circuit forming body 120 and the electronic component 125 are disposed in the same manner as described above. Can be improved in comparison with the prior art. Therefore, the plurality of electronic components 12
5 can be mounted on the circuit forming body 120 with high accuracy, and high productivity and low cost can be achieved.
【００３６】尚、上述した実施形態では、認識用パター
ン１２３、１２４、１３４を撮像して、回路形成体１２
０と電子部品１２５との位置合わせ精度の向上を図った
が、検出用窓１１０を通して検出される認識用パターン
は、電極部１２３、位置合わせ用マーク１２４、回路パ
ターン１３４に限定されるものではなく、例えばバーコ
ードのような情報用記号でもよい。該情報用記号の検出
動作は、撮像動作の場合もあれば、その他、例えば読取
動作等が実行される。よって、上記情報用記号の検出に
基いて、回路形成体１２０と電子部品１２５とに対して
行なわれる動作は、両者の上記位置合わせに限定されな
い。In the above-described embodiment, the recognition patterns 123, 124, and 134 are imaged, and the circuit
Although the accuracy of the alignment between the electronic component 125 and the electronic component 125 is improved, the recognition pattern detected through the detection window 110 is not limited to the electrode part 123, the alignment mark 124, and the circuit pattern 134. For example, an information symbol such as a bar code may be used. The operation of detecting the information symbol may be an imaging operation, or may be, for example, a reading operation. Therefore, the operation performed on the circuit forming body 120 and the electronic component 125 based on the detection of the information symbol is not limited to the alignment of the two.
【００３７】[0037]
【発明の効果】以上詳述したように本発明の第１態様の
電子部品接合用シート、第２態様の電子部品実装装置、
及び第３態様の電子部品実装方法によれば、電子部品接
合用シートに検出用窓を設け、検出用窓付の電子部品接
合用シートを用いて電子部品の実装を行なう。よって、
当該電子部品接合用シートを例えば回路形成体上に設け
たときであっても、回路形成体上の認識用パターンが上
記電子部品接合用シートで隠れることはなく、上記検出
用窓を通して露出させることができ、上記認識用パター
ンを検出することができる。したがって、検出情報に基
いて、例えば、上記回路形成体と電子部品との位置合わ
せを行なうことができるので、上記回路形成体と上記電
子部品との位置合わせ精度が上がり電子部品の高密度実
装が可能となる。又、上記電子部品接合用シートを貼付
した後であっても、上記認識用パターンの検出が可能で
あるので、従来に比べて生産性が向上し、それによりコ
ストダウンを図ることもできる。As described in detail above, the electronic component bonding sheet according to the first aspect of the present invention, the electronic component mounting apparatus according to the second aspect,
According to the electronic component mounting method of the third aspect, the detection window is provided in the electronic component bonding sheet, and the electronic component is mounted using the electronic component bonding sheet with the detection window. Therefore,
Even when the electronic component bonding sheet is provided on, for example, a circuit forming body, the recognition pattern on the circuit forming body is not hidden by the electronic component bonding sheet and is exposed through the detection window. And the recognition pattern can be detected. Therefore, for example, the alignment between the circuit forming body and the electronic component can be performed based on the detection information, so that the alignment accuracy between the circuit forming body and the electronic component increases, and high-density mounting of the electronic component can be performed. It becomes possible. Further, since the recognition pattern can be detected even after the electronic component bonding sheet is pasted, the productivity is improved as compared with the related art, and the cost can be reduced.
【００３８】上記認識用パターンとして位置合わせ用マ
ークを使用したり、上記回路形成体上の電極部や配線を
使用することができる。上記電極部や配線を利用する場
合、別途、認識用パターンを形成する必要がないことか
ら、より簡易に、かつ生産性の向上及びコストダウンを
図ることができる。As the recognition pattern, an alignment mark can be used, or an electrode portion or a wiring on the circuit forming body can be used. In the case of using the above-mentioned electrode portion and wiring, since it is not necessary to separately form a recognition pattern, it is possible to more easily improve the productivity and reduce the cost.
【図１】 本発明の一実施形態の電子部品接合用シート
の平面図である。FIG. 1 is a plan view of an electronic component bonding sheet according to an embodiment of the present invention.
【図２】 図１に示す電子部品接合用シートを使用し
て、回路形成体と電子部品とを接合させている状態を示
し、図１のＣ−Ｃにおける回路形成体及び電子部品接合
用シートの断面図である。FIG. 2 shows a state in which the circuit forming body and the electronic component are joined together using the electronic component joining sheet shown in FIG. 1, and the circuit forming body and the electronic component joining sheet in CC in FIG. 1 are shown. FIG.
【図３】 図１に示す電子部品接合用シートの変形例に
おける平面図である。FIG. 3 is a plan view of a modification of the electronic component bonding sheet shown in FIG. 1;
【図４】 図３に示す電子部品接合用シートを使用し
て、回路形成体と電子部品とを接合させている状態を示
し、図３のＤ−Ｄにおける回路形成体及び電子部品接合
用シートの断面図である。4 shows a state in which the circuit-forming body and the electronic component are joined together using the electronic-component joining sheet shown in FIG. 3, and the circuit-forming body and the electronic-component joining sheet in DD in FIG. 3 are shown. FIG.
【図５】 図１に示す電子部品接合用シートの他の変形
例における平面図である。FIG. 5 is a plan view of another modification of the electronic component bonding sheet shown in FIG.
【図６】 図１に示す電子部品接合用シートの別の変形
例における平面図である。FIG. 6 is a plan view of another modified example of the electronic component bonding sheet shown in FIG. 1;
【図７】 図１に示す電子部品接合用シートのさらに別
の変形例における平面図であって、４つの電極部形成部
分に対して設けられる一枚の電子部品接合用シートの平
面図である。FIG. 7 is a plan view of still another modification of the electronic component bonding sheet shown in FIG. 1, and is a plan view of one electronic component bonding sheet provided for four electrode portion forming portions. .
【図８】 図７に示す電子部品接合用シートの他の変形
例における平面図である。8 is a plan view of another modification of the electronic component bonding sheet shown in FIG.
【図９】 図７に示す電子部品接合用シートの別の変形
例における平面図である。FIG. 9 is a plan view of another modification of the electronic component bonding sheet shown in FIG. 7;
【図１０】 図１〜図９に示す電子部品接合用シートの
いずれかを用いて電子部品と回路形成体との接合を行な
う電子部品実装装置の斜視図である。FIG. 10 is a perspective view of an electronic component mounting apparatus for joining an electronic component and a circuit-formed body using any one of the electronic component bonding sheets shown in FIGS. 1 to 9;
【図１１】 回路基板と半導体素子とを接合させる従来
の接着シートの平面図である。FIG. 11 is a plan view of a conventional adhesive sheet for joining a circuit board and a semiconductor element.
【図１２】 従来の接着シートを使用して、回路基板と
半導体素子とを接合させている状態を示し、図１１のＡ
−Ａにおける回路基板及び接着シートの断面図である。12 shows a state in which a circuit board and a semiconductor element are joined using a conventional adhesive sheet, and FIG.
It is sectional drawing of the circuit board and adhesive sheet in -A.
【図１３】 図１２に示す状態にて、半導体素子を回路
基板側へ押圧している図である。13 is a diagram in which the semiconductor element is pressed toward the circuit board in the state shown in FIG.
【図１４】 回路基板と半導体素子とを接合させる従来
の他の接着シートの平面図である。FIG. 14 is a plan view of another conventional adhesive sheet for joining a circuit board and a semiconductor element.
【図１５】 図１４のＢ−Ｂにおける回路基板及び接着
シートの断面図である。15 is a cross-sectional view of the circuit board and the adhesive sheet taken along line BB of FIG.
【図１６】 回路基板と半導体素子とを接合させる従来
の別の接着シートの平面図である。FIG. 16 is a plan view of another conventional adhesive sheet for joining a circuit board and a semiconductor element.
【図１７】 回路基板と半導体素子とを接合させる従来
のさらに別の接着シートの平面図である。FIG. 17 is a plan view of still another conventional adhesive sheet for joining a circuit board and a semiconductor element.
１０１、１０２…電子部品接合用シート、１１０…検出
用窓、１２０、１２１…回路形成体、１２３…電極部、
１２４…位置合わせ用マーク、１２５…電子部品、１２
６…電極。101, 102: Electronic component bonding sheet, 110: Detection window, 120, 121: Circuit formed body, 123: Electrode part
124: alignment mark, 125: electronic component, 12
6 ... electrodes.
Claims (6)
する回路形成体（１２０、１２１）との間にて少なくと
も上記電子部品に対応して配置され、かつ上記電子部品
を上記回路形成体に装着するとき上記電子部品と上記回
路形成体とを接合する電子部品接合用シートであって、 上記回路形成体又は上記電子部品に形成され上記電子部
品と上記回路形成体との上記装着のときの位置合わせに
使用される認識用パターン（１２３、１２４、１３４）
に対応して形成され、かつ上記回路形成体又は上記電子
部品上に当該電子部品接合用シートを載置したとき上記
認識用パターンを露出させ該認識用パターンの検出を可
能とする検出用窓（１１０）を備えたことを特徴とする
電子部品接合用シート。An electronic component (125) and a circuit forming body (120, 121) on which the electronic component is mounted are arranged at least corresponding to the electronic component, and the electronic component is mounted on the circuit forming body. An electronic component joining sheet for joining the electronic component and the circuit forming body when mounted on the circuit forming body or the electronic component and the electronic component formed on the electronic component at the time of mounting the electronic component and the circuit forming body. Pattern (123, 124, 134) used for positioning
And a detection window formed when the electronic component bonding sheet is mounted on the circuit forming body or the electronic component, so as to expose the recognition pattern and enable detection of the recognition pattern. 110) A sheet for bonding electronic components, comprising:
上に形成されている位置合わせ用マーク（１２４）であ
る、請求項１記載の電子部品接合用シート。2. The electronic component bonding sheet according to claim 1, wherein the recognition pattern is an alignment mark formed on the circuit forming body.
電極（１２６）に対応して上記回路形成体上に形成され
ている電極部（１２３）である、請求項１又は２記載の
電子部品接合用シート。3. The electronic component according to claim 1, wherein the recognition pattern is an electrode portion (123) formed on the circuit forming body corresponding to the electrode (126) of the electronic component. Sheet for joining.
上に形成されている配線である、請求項１から３のいず
れかに記載の電子部品接合用シート。4. The electronic component bonding sheet according to claim 1, wherein the recognition pattern is a wiring formed on the circuit forming body.
備わる上記検出用窓を上記回路形成体又は上記電子部品
上に形成されている上記認識用パターン（１２３、１２
４、１３４）に対応させた状態で上記回路形成体又は上
記電子部品上に載置された上記電子部品接合用シートの
上記検出用窓を通して、露出している上記認識用パター
ンを検出し、 該検出にて得た検出情報に基いて上記回路形成体と上記
電子部品との位置合わせを行った後、上記回路形成体と
上記電子部品との接合を行なう、ことを特徴とする電子
部品実装方法。5. The recognition pattern (123, 12) formed on the circuit forming body or the electronic component by using the detection window provided in the electronic component bonding sheet according to claim 1.
4, 134), the exposed recognition pattern is detected through the detection window of the electronic component bonding sheet placed on the circuit forming body or the electronic component. An electronic component mounting method, comprising: performing positioning between the circuit forming body and the electronic component based on detection information obtained by detection, and then joining the circuit forming body and the electronic component. .
備わる上記検出用窓を上記回路形成体又は上記電子部品
上に形成されている上記認識用パターン（１２３、１２
４、１３４）に対応させた状態で上記回路形成体又は上
記電子部品上に載置された上記電子部品接合用シートの
上記検出用窓を通して、露出している上記認識用パター
ンを検出する検出装置（２５３）と、 上記検出装置から得た検出情報に基いて上記回路形成体
と上記電子部品との位置合わせを行い上記回路形成体と
上記電子部品との接合を行なう接合装置（２６０）と、
を備えたことを特徴とする電子部品実装装置。6. The recognition pattern (123, 12) formed on the circuit forming body or the electronic component by using the detection window provided in the electronic component bonding sheet according to claim 1.
4, 134) a detection device for detecting the exposed recognition pattern through the detection window of the circuit forming body or the electronic component bonding sheet placed on the electronic component. (253) a joining device (260) for performing alignment between the circuit forming body and the electronic component based on the detection information obtained from the detecting device and joining the circuit forming body and the electronic component;
An electronic component mounting apparatus comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000283624A JP2002094222A (en) | 2000-09-19 | 2000-09-19 | Sheet for bonding electronic component, method for mounting electronic component, and equipment for mounting the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000283624A JP2002094222A (en) | 2000-09-19 | 2000-09-19 | Sheet for bonding electronic component, method for mounting electronic component, and equipment for mounting the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002094222A true JP2002094222A (en) | 2002-03-29 |
| JP2002094222A5 JP2002094222A5 (en) | 2005-06-02 |
Family
ID=18767962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000283624A Withdrawn JP2002094222A (en) | 2000-09-19 | 2000-09-19 | Sheet for bonding electronic component, method for mounting electronic component, and equipment for mounting the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002094222A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010199546A (en) * | 2009-11-25 | 2010-09-09 | Sony Chemical & Information Device Corp | Electronic component mounting structure and method of manufacturing same |
| JP2011187554A (en) * | 2010-03-05 | 2011-09-22 | Murata Mfg Co Ltd | Composite module and manufacturing method for the same |
| JP2014075317A (en) * | 2012-10-05 | 2014-04-24 | Sumitomo Bakelite Co Ltd | Conductive connection sheet, semiconductor device and electronic apparatus |
| WO2017203884A1 (en) * | 2016-05-27 | 2017-11-30 | 富士フイルム株式会社 | Anisotropic electroconductive material, electronic element, structure including semiconductor element, and method for manufacturing electronic element |
| JP2020177916A (en) * | 2014-12-22 | 2020-10-29 | デクセリアルズ株式会社 | Anisotropic conductive film and connecting structure |
-
2000
- 2000-09-19 JP JP2000283624A patent/JP2002094222A/en not_active Withdrawn
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010199546A (en) * | 2009-11-25 | 2010-09-09 | Sony Chemical & Information Device Corp | Electronic component mounting structure and method of manufacturing same |
| WO2011065093A1 (en) * | 2009-11-25 | 2011-06-03 | ソニーケミカル＆インフォメーションデバイス株式会社 | Electronic component mounting structure and method for producing same |
| JP2011187554A (en) * | 2010-03-05 | 2011-09-22 | Murata Mfg Co Ltd | Composite module and manufacturing method for the same |
| JP2014075317A (en) * | 2012-10-05 | 2014-04-24 | Sumitomo Bakelite Co Ltd | Conductive connection sheet, semiconductor device and electronic apparatus |
| JP2020177916A (en) * | 2014-12-22 | 2020-10-29 | デクセリアルズ株式会社 | Anisotropic conductive film and connecting structure |
| JP7176550B2 (en) | 2014-12-22 | 2022-11-22 | デクセリアルズ株式会社 | Anisotropic conductive film and connection structure |
| WO2017203884A1 (en) * | 2016-05-27 | 2017-11-30 | 富士フイルム株式会社 | Anisotropic electroconductive material, electronic element, structure including semiconductor element, and method for manufacturing electronic element |
| KR20180134970A (en) * | 2016-05-27 | 2018-12-19 | 후지필름 가부시키가이샤 | An anisotropic conductive material, an electronic element, a structure including a semiconductor element, and a method of manufacturing an electronic element |
| CN109155259A (en) * | 2016-05-27 | 2019-01-04 | 富士胶片株式会社 | The manufacturing method of anisotropic conductive material, electronic component, the structural body comprising semiconductor element and electronic component |
| JPWO2017203884A1 (en) * | 2016-05-27 | 2019-02-21 | 富士フイルム株式会社 | Anisotropic conductive material, electronic element, structure including semiconductor element, and method for manufacturing electronic element |
| KR102134135B1 (en) * | 2016-05-27 | 2020-07-15 | 후지필름 가부시키가이샤 | Structure including electronic device and semiconductor device |
| CN109155259B (en) * | 2016-05-27 | 2023-02-28 | 富士胶片株式会社 | Electronic element, structure including semiconductor element, and method for manufacturing electronic element |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3536728B2 (en) | Semiconductor device, tape carrier, manufacturing method thereof, circuit board, electronic device, and tape carrier manufacturing apparatus | |
| US9030223B2 (en) | Test carrier | |
| KR100276193B1 (en) | Printed circuit board, ic card and fabricating method thereof | |
| KR100950523B1 (en) | Printed circuit board assembly and electronic device | |
| JP2002094222A (en) | Sheet for bonding electronic component, method for mounting electronic component, and equipment for mounting the same | |
| US20040115864A1 (en) | Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product | |
| JP2003142797A (en) | Finished product with electronic component mounted and manufacturing method thereof | |
| KR101602725B1 (en) | Method for manufacturing the Embedded FPCB | |
| JP2003110240A (en) | Composite wiring board and manufacturing method thereof | |
| JP2001007460A (en) | Recognition mark structure for flexible substrate | |
| JP2002009451A (en) | Manufacturing method and apparatus for printed circuit board | |
| JP2008258332A (en) | Printed circuit board, electronic device, manufacturing method of printed circuit board | |
| JP3765570B2 (en) | Component mounting equipment | |
| JPH0435000A (en) | Mounting of chip parts on circuit board | |
| JP3435157B1 (en) | Holding and conveying jig and holding and conveying method | |
| JP2000106385A (en) | Semiconductor device and manufacture thereof, manufacturing device of semiconductor, circuit board and electronic equipment | |
| JP4209574B2 (en) | Manufacturing method of semiconductor component mounted parts | |
| JP2004193213A (en) | Tape carrier for tab and method of manufacturing same | |
| US20080196827A1 (en) | Fabrication of Electronic Components In Plastic | |
| JPWO2005073902A1 (en) | Electronic circuit board intermediate member, manufacturing method thereof, manufacturing apparatus thereof, manufacturing method of non-contact ID cards, and apparatus thereof | |
| KR100222754B1 (en) | Fabrication method of rigid-flexible laminate elevation of surface confidence | |
| JP2013007913A (en) | Fpd module assembling device and method for conveying display substrate | |
| JP2007276319A (en) | Auxiliary plate for substrate press, manufacturing equipment for wiring substrate unit and manufacturing method for wiring substrate unit | |
| JP3816434B2 (en) | Component mounting method | |
| JPS639127A (en) | Ic module substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040813 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040813 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061003 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061127 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070116 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070316 |