JP2002078089A - Ultrasonic wave sensor - Google Patents
Ultrasonic wave sensorInfo
- Publication number
- JP2002078089A JP2002078089A JP2000256503A JP2000256503A JP2002078089A JP 2002078089 A JP2002078089 A JP 2002078089A JP 2000256503 A JP2000256503 A JP 2000256503A JP 2000256503 A JP2000256503 A JP 2000256503A JP 2002078089 A JP2002078089 A JP 2002078089A
- Authority
- JP
- Japan
- Prior art keywords
- elastic body
- cylindrical case
- bottomed cylindrical
- ultrasonic sensor
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Transducers For Ultrasonic Waves (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、超音波を送信、受
信することにより障害物等の検出を行う超音波センサに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic sensor for detecting an obstacle by transmitting and receiving ultrasonic waves.
【０００２】[0002]
【従来の技術】従来の防滴型超音波センサの断面図を図
３に示す。アルミニウム材等から成る有底筒状ケース７
の底面内部に圧電振動素子２を接着剤１で接着し、圧電
振動素子２の有底筒状ケース７との接着面側とは反対面
と、有底筒状ケース７より入出力リード５を半田付けし
取り出す。圧電振動素子２と有底筒状ケース７とは電気
的に接続されており、更に、圧電振動素子２と入出力リ
ード５ａ及び、有底筒状ケース７と入出力リード５ｂと
は、電気的に接続されている。圧電振動素子の上面に発
泡弾性体４等の吸音材を載置し、更に、その上からシリ
コン弾性体６を有底筒状ケース７内に充填し構成する。2. Description of the Related Art A sectional view of a conventional drip-proof ultrasonic sensor is shown in FIG. Bottom cylindrical case 7 made of aluminum or the like
The piezoelectric vibrating element 2 is bonded to the inside of the bottom surface of the piezoelectric vibrating element 2 with an adhesive 1. Remove by soldering. The piezoelectric vibrating element 2 and the bottomed cylindrical case 7 are electrically connected, and the piezoelectric vibrating element 2 and the input / output lead 5a and the bottomed cylindrical case 7 and the input / output lead 5b are electrically connected. It is connected to the. A sound absorbing material such as a foamed elastic body 4 is placed on the upper surface of the piezoelectric vibrating element, and a silicon elastic body 6 is filled in the bottomed cylindrical case 7 from above.
【０００３】[0003]
【発明が解決しようとする課題】図３に示すように、従
来の防滴型超音波センサにおいて、有底筒状ケース７内
壁に発泡弾性体４、シリコン弾性体６が接触し、有底筒
状ケース７の内壁は異質の材料で境界層ができることに
なる。超音波センサに電気信号を入力し、駆動するにあ
たり、パルスバースト信号を入力すると、有底筒状ケー
ス７のケース内壁が異質の材料で境界層を作る為、有底
筒状ケース７が一体となり振動せず振動歪を発生しやす
くなる。このことにより、図４に示す如く、電気的入力
信号が終了後の残響信号に於いて、歪んだ状態で減衰が
発生する。よって、電気的入力信号が終了後の残響に於
いて、終了後の時間と残響との関係が不安定となる。こ
のことは、有底筒状ケース７内に充填及び挿入する発泡
弾性体４、シリコン弾性体６の構造バラツキにより残響
が不安定となることを意味する。これは、超音波センサ
を送信、受信して障害物を検出するにあたり、残響が不
安定であると障害物を検出できる距離が不安定と問題が
発生する。更に、圧電振動素子２と有底筒状ケース７の
２ヶ所より取り出される入出力リード５に於いては、シ
リコン弾性体を充填し、ホールドされているので、引っ
ぱり強度が弱く断線の恐れが有り信頼性に欠ける。As shown in FIG. 3, in the conventional drip-proof ultrasonic sensor, the foamed elastic body 4 and the silicon elastic body 6 come into contact with the inner wall of the bottomed cylindrical case 7, and The inner wall of the case 7 has a boundary layer made of a different material. When inputting an electric signal to the ultrasonic sensor and driving it, when a pulse burst signal is input, since the inner wall of the bottomed cylindrical case 7 forms a boundary layer with a different material, the bottomed cylindrical case 7 is integrated. Vibration distortion easily occurs without vibration. As a result, as shown in FIG. 4, attenuation occurs in a distorted state in the reverberation signal after the termination of the electrical input signal. Therefore, in the reverberation after the end of the electrical input signal, the relationship between the time after the end and the reverberation becomes unstable. This means that reverberation becomes unstable due to structural variations of the foamed elastic body 4 and the silicon elastic body 6 filled and inserted into the bottomed cylindrical case 7. This is a problem that, when transmitting and receiving the ultrasonic sensor to detect an obstacle, if the reverberation is unstable, the distance at which the obstacle can be detected is unstable. Further, since the input / output leads 5 taken out from the two locations of the piezoelectric vibrating element 2 and the bottomed cylindrical case 7 are filled with a silicon elastic body and held, the pulling strength is weak and there is a possibility of disconnection. Lack of reliability.
【０００４】[0004]
【課題を解決するための手段】有底筒状ケースの底面内
部に圧電振動素子を接着し、圧電振動子上面を発泡弾性
体で覆いその他のケース内底面、側面を含む有底筒状ケ
ース内をシリコン弾性体で充填する。更に、有底筒状ケ
ース内から取り出せれる入出力リードに於いて、有底筒
状ケース内にリード線と一体となるストッパーを設け、
このストッパーを含め有底筒状ケース内をシリコン弾性
体で充填する。Means for Solving the Problems A piezoelectric vibrating element is adhered to the inside of the bottom surface of a bottomed cylindrical case, and the upper surface of the piezoelectric vibrator is covered with a foamed elastic body. Is filled with a silicon elastic body. Furthermore, in the input / output lead which can be taken out from the bottomed cylindrical case, a stopper integrated with the lead wire is provided in the bottomed cylindrical case,
The inside of the bottomed cylindrical case including this stopper is filled with a silicon elastic body.
【０００５】[0005]
【発明の実施の形態】図１、図２は本発明に関わる超音
波センサを説明する断面図である。図１に示す様に有底
筒状ケース７の底面内部に接着剤１を用いて圧電振動素
子２を接着する。圧電振動素子２の接着裏面より、入出
力リード５の一端５ａを半田付けし取り出し、且つ、こ
の面に有底筒状ケース７の内に充填するシリコン弾性体
６が入り込まないように、予めリング状シリコン弾性体
３を圧電振動素子２の周囲に形成し、その上に発泡弾性
体４を装着する。この発泡弾性体４と有底筒状ケース７
の内壁には、シリコン弾性体６の充填が可能な隙間をも
たせる。入出力リード５のもう一端５ｂはケース７より
半田付けし、取り出す。この様にして形成された有底筒
状ケース７の内部を入出力リード線５を含め、シリコン
弾性体６で充填する。更に、入出力リード５の引っ張り
強度をＵＰする為、図２に示す様にリードスットパー８
を設け、これも含め、シリコン弾性体６で充填する。リ
ードスットパー８は、有底筒状ケース７内壁及び発泡弾
性体４に触れないように設定する。リードスットパーは
円板状とした。リードストッパー７の形状は円板状、角
板状、球状、多面体等、シリコン弾性体６で充填され負
荷となる形状であればよい。1 and 2 are sectional views illustrating an ultrasonic sensor according to the present invention. As shown in FIG. 1, the piezoelectric vibration element 2 is bonded to the inside of the bottom surface of the bottomed cylindrical case 7 using the adhesive 1. One end 5a of the input / output lead 5 is soldered and removed from the back surface of the piezoelectric vibrating element 2 and a ring is formed in advance so that the silicon elastic body 6 to be filled into the bottomed cylindrical case 7 does not enter this surface. A silicon elastic body 3 is formed around the piezoelectric vibrating element 2, and a foamed elastic body 4 is mounted thereon. The foamed elastic body 4 and the bottomed cylindrical case 7
The inner wall has a gap capable of being filled with the silicon elastic body 6. The other end 5b of the input / output lead 5 is soldered out of the case 7 and taken out. The interior of the bottomed cylindrical case 7 thus formed, including the input / output lead wires 5, is filled with the silicon elastic body 6. Further, in order to increase the tensile strength of the input / output lead 5, as shown in FIG.
Is filled, and the silicon elastic body 6 is filled. The lead stopper 8 is set so as not to touch the inner wall of the bottomed cylindrical case 7 and the foamed elastic body 4. The lead stopper was disk-shaped. The shape of the lead stopper 7 may be any shape such as a disk shape, a square plate shape, a spherical shape, or a polyhedron, as long as it is filled with the silicon elastic body 6 and becomes a load.
【０００６】[0006]
【発明の効果】図５に示す様に、駆動入力信号終了後の
残響がケースの内部にシリコン弾性体を充填することで
一体の振動となり減衰振動をする。よって、減衰振動が
安定化し残響の時間が一定化する為、障害物を検出する
距離が安定化する。As shown in FIG. 5, the reverberation after the end of the drive input signal becomes an integrated vibration by filling the inside of the case with the silicon elastic body, and the vibration is attenuated. Accordingly, the damped vibration is stabilized and the reverberation time is fixed, so that the distance for detecting an obstacle is stabilized.
【図１】本発明の実施例に関わる超音波センサの断面図FIG. 1 is a sectional view of an ultrasonic sensor according to an embodiment of the present invention.
【図２】本発明の実施例に関わる超音波センサの断面図FIG. 2 is a sectional view of an ultrasonic sensor according to an embodiment of the present invention.
【図３】従来の超音波センサの断面図FIG. 3 is a cross-sectional view of a conventional ultrasonic sensor.
【図４】従来の超音波センサの残響FIG. 4 shows the reverberation of a conventional ultrasonic sensor.
【図５】本発明の超音波センサの残響FIG. 5 shows the reverberation of the ultrasonic sensor of the present invention.
１ 接着剤 ２ 圧電振動素子 ３ リング状シリコン弾性体 ４ 発泡弾性体 ５ 入出力リード ６ シリコン弾性体 ７ 有底筒状ケース ８ リードストッパー DESCRIPTION OF SYMBOLS 1 Adhesive 2 Piezoelectric vibration element 3 Ring-shaped silicon elastic body 4 Foam elastic body 5 Input / output lead 6 Silicon elastic body 7 Bottom cylindrical case 8 Lead stopper
Claims (2)
子を接着してなる超音波センサに於いて、圧電振動素子
上面を発泡弾性体で覆いその他の有底筒状ケースの内底
面、側面を含む有底筒状ケース内をシリコン弾性体で充
填することを特徴とする超音波センサ。1. An ultrasonic sensor in which a piezoelectric vibrating element inside a bottom surface of a bottomed cylindrical case is adhered, wherein an upper surface of the piezoelectric vibrating element is covered with a foamed elastic body, and an inner bottom surface of another bottomed cylindrical case. An ultrasonic sensor characterized by filling the inside of a bottomed cylindrical case including a side surface with a silicon elastic body.
線に於いて、有底筒状ケース内にリード線と一体となる
リードストッパーを設け、このストッパーを含め有底筒
状ケース内をシリコン弾性体で充填する請求項１の超音
波センサ。2. An input / output lead wire taken out of a case, a lead stopper integrated with the lead wire is provided in the bottomed cylindrical case, and the inside of the bottomed cylindrical case including the stopper is formed of a silicon elastic body. The ultrasonic sensor according to claim 1, wherein the ultrasonic sensor is filled with:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000256503A JP2002078089A (en) | 2000-08-25 | 2000-08-25 | Ultrasonic wave sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000256503A JP2002078089A (en) | 2000-08-25 | 2000-08-25 | Ultrasonic wave sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002078089A true JP2002078089A (en) | 2002-03-15 |
Family
ID=18745105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000256503A Pending JP2002078089A (en) | 2000-08-25 | 2000-08-25 | Ultrasonic wave sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002078089A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006189364A (en) * | 2005-01-07 | 2006-07-20 | Olympus Corp | Eddy current flaw detection multi-coil type probe, and manufacturing method therefor |
| US7392705B2 (en) | 2005-03-29 | 2008-07-01 | Denso Corporation | Ultrasonic sensor |
| US7461555B2 (en) * | 2004-04-26 | 2008-12-09 | Murata Manufacturing Co., Ltd | Ultrasonic sensor |
| CN102353951A (en) * | 2010-05-28 | 2012-02-15 | 株式会社村田制作所 | Ultrasonic Sensor |
| EP1988742B1 (en) * | 2006-02-14 | 2021-03-24 | Murata Manufacturing Co., Ltd. | Ultrasonic sensor and fabrication method thereof |
-
2000
- 2000-08-25 JP JP2000256503A patent/JP2002078089A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7461555B2 (en) * | 2004-04-26 | 2008-12-09 | Murata Manufacturing Co., Ltd | Ultrasonic sensor |
| JP2006189364A (en) * | 2005-01-07 | 2006-07-20 | Olympus Corp | Eddy current flaw detection multi-coil type probe, and manufacturing method therefor |
| JP4608322B2 (en) * | 2005-01-07 | 2011-01-12 | オリンパス株式会社 | Eddy current flaw detection multi-coil probe manufacturing method |
| US7392705B2 (en) | 2005-03-29 | 2008-07-01 | Denso Corporation | Ultrasonic sensor |
| EP1988742B1 (en) * | 2006-02-14 | 2021-03-24 | Murata Manufacturing Co., Ltd. | Ultrasonic sensor and fabrication method thereof |
| CN102353951A (en) * | 2010-05-28 | 2012-02-15 | 株式会社村田制作所 | Ultrasonic Sensor |
| US9003887B2 (en) | 2010-05-28 | 2015-04-14 | Murata Manufacturing Co., Ltd. | Ultrasonic sensor |
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