JP2002066429A - Rotary coating apparatus and method - Google Patents
Rotary coating apparatus and methodInfo
- Publication number
- JP2002066429A JP2002066429A JP2000266614A JP2000266614A JP2002066429A JP 2002066429 A JP2002066429 A JP 2002066429A JP 2000266614 A JP2000266614 A JP 2000266614A JP 2000266614 A JP2000266614 A JP 2000266614A JP 2002066429 A JP2002066429 A JP 2002066429A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processed
- chuck
- plate
- cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は回転塗布装置とこの
装置を用いた回転塗布方法に関する。The present invention relates to a spin coating apparatus and a spin coating method using the spin coating apparatus.
【０００２】[0002]
【従来の技術】半導体ウェーハやガラス基板の表面に塗
膜を形成する塗布装置として、カップ内にスピンナーに
て回転せしめられるチャックを配置したオープンカップ
タイプと、固定されたアウターカップ内に回転可能なイ
ンナーカップを配置し、このインナーカップ内にスピン
ナーにて回転せしめられるチャックを配置した回転カッ
プタイプが知られている。2. Description of the Related Art As a coating apparatus for forming a coating film on a surface of a semiconductor wafer or a glass substrate, an open cup type in which a chuck which is rotated by a spinner is arranged in a cup, and a rotatable apparatus in a fixed outer cup. A rotary cup type in which an inner cup is arranged and a chuck that is rotated by a spinner in the inner cup is known.
【０００３】回転カップタイプの塗布装置は特開平９−
１２２５６１号公報に開示されるように、インナーカッ
プ上面を蓋体で閉塞した状態で回転せしめることで、オ
ープンタイプの回転塗布装置の欠点を改善している。即
ち、インナーカップ内を密閉空間（排気孔の部分は除
く）とすることで、雰囲気を溶媒雰囲気として塗布液の
乾燥を抑え、またインナーカップ内での乱流の発生をな
くすことで、均一な塗膜を得ることができるようにして
いる。A rotating cup type coating apparatus is disclosed in
As disclosed in JP-A-122561, the drawback of the open-type spin coating device is improved by rotating the inner cup with the upper surface closed with a lid. That is, the inner space of the inner cup is made a closed space (excluding the exhaust hole portion) to suppress the drying of the coating liquid by using the atmosphere as a solvent atmosphere, and to eliminate the occurrence of turbulence in the inner cup, thereby providing a uniform atmosphere. A coating film can be obtained.
【０００４】特に、特開平９−１２２５６１号公報に
は、インナーカップ内に更にトレーを設け、このトレー
内に被処理基板をセットするとともに、トレー上面を被
処理基板よりも若干大きめの開口を形成したカバー部材
で覆うことが開示されてる。[0004] In particular, JP-A-9-122561 discloses that a tray is further provided in an inner cup, a substrate to be processed is set in the tray, and an opening slightly larger than the substrate to be processed is formed on the upper surface of the tray. It is disclosed to cover with a cover member.
【０００５】[0005]
【発明が解決しようとする課題】オープンカップタイプ
の塗布装置にあっては、カップ内で乱流が生じやすく、
均一な塗膜を得にくい。一方、回転カップタイプにあっ
ては、インナーカップ内で乱流は発生しにくいが、矩形
状の基板を回転させた場合、基板のコーナ部における風
切りでフリンジが生じたり、基板周縁部に幅広なエッジ
ビードが発生しやすい。In an open cup type coating apparatus, turbulence tends to occur in the cup,
It is difficult to obtain a uniform coating. On the other hand, in the case of the rotating cup type, turbulence is unlikely to occur in the inner cup, but when a rectangular substrate is rotated, fringe occurs due to wind breaking at the corner of the substrate, and a wide area is formed at the peripheral edge of the substrate. Edge beads are likely to occur.
【０００６】[0006]
【課題を解決するための手段】従来の回転塗布装置にあ
っては、被処理基板周縁部の周辺で生じる気流を如何に
小さくするかについて多くの改善を行っているが、本発
明者らは１８０°発想を転換し、乱流が生じるのは好ま
しくないが、一定方向に流れる気流であれば、それを利
用してフリンジやエッジビードの発生を抑制できるとの
知見に基づいて本発明をなしたものである。Means for Solving the Problems In the conventional spin coating apparatus, many improvements have been made on how to reduce the air flow generated around the periphery of the substrate to be processed. It is not preferable that turbulence is generated by changing the idea of 180 °, but the present invention has been made based on the finding that fringes and edge beads can be suppressed by using an airflow flowing in a certain direction. Things.
【０００７】即ち、本発明に係る回転塗布装置は、上方
が開放されたカップ内に、スピンナーにて回転せしめら
れるチャックと、このチャックと一体的に回転するとと
もにチャックに保持された被処理基板よりも若干大きい
相似形の開口を形成したプレートを配置した。That is, in the spin coating apparatus according to the present invention, a chuck rotated by a spinner in a cup whose upper part is opened, and a substrate to be processed held by the chuck while rotating integrally with the chuck. A plate having a slightly larger similar-shaped opening was also arranged.
【０００８】気流を発生させるには、カップの上方が開
放されていることが必要である。したがって、従来の蓋
体を設けた回転カップタイプの塗布装置から本発明に係
る塗布装置を推考することはできない。またカップの上
方が開放されている点からすれば、本発明の塗布装置は
オープンカップタイプの塗布装置になるが、オープンカ
ップタイプの塗布装置にも気流を積極的にコントロール
する考えは全くなく、オープンカップタイプの塗布装置
から本発明に係る塗布装置を推考することはできない。In order to generate an air flow, the upper part of the cup needs to be open. Therefore, the coating device according to the present invention cannot be inferred from a rotating cup type coating device provided with a conventional lid. Also, in view of the fact that the upper part of the cup is open, the coating device of the present invention is an open cup type coating device, but there is no idea to actively control the airflow also in the open cup type coating device, The coating apparatus according to the present invention cannot be inferred from the open cup type coating apparatus.
【０００９】また、上記の回転塗布装置を用いた塗布方
法は、チャックにて被処理基板を保持するとともに、被
処理基板外周部とプレートの開口内周部とに間に周方向
に沿って均一な隙間を形成し、この状態で被処理基板に
塗布液を供給し、次いでスピンナーにてチャック、被処
理基板およびプレートを一体的に回転せしめ、被処理基
板外周部とプレートの開口内周部との間の隙間において
上から下に向かう気流を積極的に生じさせつつ被処理基
板に供給した塗布液を遠心力で均一に拡散せしめる。Further, in the coating method using the above-mentioned rotary coating apparatus, the substrate to be processed is held by a chuck, and is uniformly formed along the circumferential direction between an outer peripheral portion of the substrate to be processed and an inner peripheral portion of the opening of the plate. A gap is formed, and in this state, the coating liquid is supplied to the substrate to be processed, and then the chuck, the substrate to be processed and the plate are integrally rotated by a spinner, and the outer peripheral portion of the substrate to be processed and the inner peripheral portion of the opening of the plate are rotated. The coating liquid supplied to the substrate to be processed is uniformly diffused by the centrifugal force while positively generating an airflow from top to bottom in the gap between the substrates.
【００１０】[0010]
【発明の実施の形態】以下に本発明の実施の形態を説明
する。図１は本発明に係る回転塗布装置の全体図、図２
は同回転塗布装置の平面図であり、回転塗布装置はベー
スなどにカップ１を固定している。このカップ１は上面
に開口２を有し、底面の隅部に排気口３を形成してい
る。Embodiments of the present invention will be described below. FIG. 1 is an overall view of a spin coating apparatus according to the present invention, and FIG.
FIG. 3 is a plan view of the spin coating apparatus, in which the cup 1 is fixed to a base or the like. The cup 1 has an opening 2 on the upper surface and an exhaust port 3 at a corner of the bottom surface.
【００１１】また、カップ１内には、図示しないスピン
ナーにて回転せしめられる保持台４を設けている。この
保持台４の中央にはガラス基板などの被処理基板Ｗを吸
着保持する真空チャック５を設けている。この真空チャ
ック５は昇降動可能とされている。Further, a holding table 4 which is rotated by a spinner (not shown) is provided in the cup 1. At the center of the holding table 4, a vacuum chuck 5 for sucking and holding a substrate W to be processed such as a glass substrate is provided. The vacuum chuck 5 can move up and down.
【００１２】また、保持台４の上面には支柱６を介して
プレート７を取り付けている。このプレート7の中央部
には前記真空チャック５にて吸着保持される被処理基板
Ｗと相似形で若干大きめの開口８が形成される。而して
被処理基板Ｗの外周部と開口８の内周部との間には、一
定幅の隙間９が形成される。A plate 7 is attached to the upper surface of the holding base 4 via a support 6. At the center of the plate 7, an opening 8 slightly similar to the substrate W to be processed and held by the vacuum chuck 5 is formed. Thus, a gap 9 having a constant width is formed between the outer peripheral portion of the substrate W to be processed and the inner peripheral portion of the opening 8.
【００１３】更に、プレート7の外周部は上方に折り返
されるとともに前記開口２の裏側に位置するフランジ部
１０となっている。このように、フランジ部１０を開口
２の裏側に近接せしめることでラビリンスパッキンに近
いシール性が得られ、一旦カップ１内に落下した塗布液
が再びミスト状になって開口２内に戻って、被処理基板
表面に付着する不利が防止できる。Further, the outer peripheral portion of the plate 7 is turned upward to form a flange portion 10 located behind the opening 2. In this way, by bringing the flange portion 10 close to the back side of the opening 2, a sealing property close to labyrinth packing is obtained, and the coating liquid once dropped into the cup 1 returns to the inside of the opening 2 as a mist again, The disadvantage of adhering to the surface of the substrate to be processed can be prevented.
【００１４】また、プレート７の高さは、最も下方位置
まで降下したチャック５に吸着されている被処理基板Ｗ
よりも若干高くなる位置に設定されている。このよう
に、被処理基板Ｗを開口８よりも若干低くすると、後述
するように気流が下方に流れやすくなる。The height of the plate 7 is adjusted so that the processing target substrate W
It is set at a position slightly higher than that. As described above, when the processing target substrate W is slightly lower than the opening 8, the air current easily flows downward as described later.
【００１５】以上において、被処理基板Ｗに塗膜を形成
するには、先ず図３（ａ）に示すように、チャック５を
カップ１の開口２よりも上昇せしめ、その位置で被処理
基板Ｗを受け取る。この後、図１に示した位置までチャ
ック５は降下する。In the above, in order to form a coating film on the substrate W to be processed, first, as shown in FIG. 3A, the chuck 5 is raised above the opening 2 of the cup 1, and the substrate W Receive. Thereafter, the chuck 5 descends to the position shown in FIG.
【００１６】次いで、被処理基板Ｗの表面に塗布液を滴
下した後、スピンナーにて、保持台４、チャック５被処
理基板Ｗ及びプレート７を一体的に回転せしめる。この
回転により保持台４とプレート７との間の空気は遠心力
でカップ１内の外側部分に押しやられ、排気口３を介し
てカップ1外に排気される。Next, after the application liquid is dropped on the surface of the substrate W to be processed, the holding table 4, the chuck 5, the substrate W to be processed and the plate 7 are integrally rotated by a spinner. Due to this rotation, the air between the holding table 4 and the plate 7 is pushed by centrifugal force to the outer portion inside the cup 1, and is exhausted out of the cup 1 through the exhaust port 3.
【００１７】一方、保持台４とプレート７との間の空気
が排気されるにつれ、それに見合う空気が図３（ｂ）に
示すように、被処理基板Ｗの外周部と開口８の内周部と
の間の隙間９から入り込む。即ち隙間９の部分では下方
への気流が生じ、回転によって生じる乱流は打ち消され
る。On the other hand, as the air between the holding table 4 and the plate 7 is exhausted, the air corresponding to the air is exhausted, as shown in FIG. From the gap 9 between the two. That is, a downward airflow is generated in the gap 9, and the turbulence generated by the rotation is canceled.
【００１８】[0018]
【発明の効果】以上に説明したように本発明によれば、
下方への強制的な気流を基板周縁部において発生せしめ
るため、角基板に塗膜を形成する際に、基板のコーナ部
においてフリンジが生じることなく、また基板形状に関
わらず周縁部にエッジビードが生じないようにすること
ができるか、或いは生じたとしてもその幅を極めて狭く
することができ、基板上の有効エリアを拡大できる。According to the present invention as described above,
Because a forced airflow downward is generated at the periphery of the substrate, when forming a coating film on a square substrate, no fringe occurs at the corner of the substrate, and edge beads are generated at the periphery regardless of the substrate shape. Or the width, if any, can be made very small, thus increasing the effective area on the substrate.
【００１９】また、被処理基板の周縁部における一定方
向の気流によって、周縁部乾燥が促進され、乾きにくい
塗布液を用いた場合には有効である。In addition, the drying of the peripheral portion is promoted by the airflow in a certain direction at the peripheral portion of the substrate to be processed, and this is effective when a coating liquid that does not easily dry is used.
【図１】本発明に係る回転塗布装置の全体図FIG. 1 is an overall view of a spin coating apparatus according to the present invention.
【図２】同回転塗布装置の平面図FIG. 2 is a plan view of the spin coating apparatus.
【図３】（ａ）および（ｂ）は本発明に係る回転塗布方
法を説明した図FIGS. 3A and 3B are diagrams illustrating a spin coating method according to the present invention.
1…カップ、２…開口、３…排気口、４…保持台、５…
チャック、６…支柱、７…プレート、８…開口、９…隙
間、１０…フランジ部、Ｗ…被処理基板。1 ... cup, 2 ... opening, 3 ... exhaust port, 4 ... holding stand, 5 ...
Chuck, 6 support, 7 plate, 8 opening, 9 gap, 10 flange part, W substrate to be processed.
Claims (2)
ーにて回転せしめられるチャックと、このチャックと一
体的に回転するとともにチャックに保持された被処理基
板よりも若干大きい相似形の開口を形成したプレートを
配置したことを特徴とする回転塗布装置。1. A chuck which is rotated by a spinner and a similar opening which is integrally rotated with the chuck and is slightly larger than a substrate to be processed held by the chuck, in a cup whose upper part is opened. A spin coating device, wherein a set plate is arranged.
塗布方法であって、チャックにて被処理基板を保持する
とともに、被処理基板外周部とプレートの開口内周部と
の間に周方向に沿って均一な隙間を形成し、この状態で
被処理基板に塗布液を供給し、次いでスピンナーにてチ
ャック、被処理基板およびプレートを一体的に回転せし
め、被処理基板外周部とプレートの開口内周部との間の
隙間において上から下に向かう気流を積極的に生じさせ
つつ被処理基板に供給した塗布液を遠心力で均一に拡散
せしめるようにしたことを特徴とする回転塗布方法。2. A coating method using the spin coating apparatus according to claim 1, wherein the substrate to be processed is held by a chuck and between an outer peripheral portion of the substrate and an inner peripheral portion of the opening of the plate. A uniform gap is formed along the circumferential direction, the coating liquid is supplied to the substrate to be processed in this state, and then the chuck, the substrate and the plate are integrally rotated by a spinner, and the outer peripheral portion of the substrate to be processed and the plate are rotated. Rotational coating characterized in that a coating liquid supplied to a substrate to be processed is uniformly diffused by centrifugal force while positively generating an airflow going downward from above in a gap between the inner peripheral portion of the opening and the opening. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000266614A JP3888840B2 (en) | 2000-09-04 | 2000-09-04 | Spin coating apparatus and spin coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000266614A JP3888840B2 (en) | 2000-09-04 | 2000-09-04 | Spin coating apparatus and spin coating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002066429A true JP2002066429A (en) | 2002-03-05 |
| JP3888840B2 JP3888840B2 (en) | 2007-03-07 |
Family
ID=18753667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000266614A Expired - Fee Related JP3888840B2 (en) | 2000-09-04 | 2000-09-04 | Spin coating apparatus and spin coating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3888840B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010262997A (en) * | 2009-04-30 | 2010-11-18 | Mtc:Kk | Resist film forming device |
| KR101064566B1 (en) | 2006-12-29 | 2011-09-14 | 삼성코닝정밀소재 주식회사 | Semiconductor wafer polishing apparatus and method for polishing the semiconductor wafer |
-
2000
- 2000-09-04 JP JP2000266614A patent/JP3888840B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101064566B1 (en) | 2006-12-29 | 2011-09-14 | 삼성코닝정밀소재 주식회사 | Semiconductor wafer polishing apparatus and method for polishing the semiconductor wafer |
| JP2010262997A (en) * | 2009-04-30 | 2010-11-18 | Mtc:Kk | Resist film forming device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3888840B2 (en) | 2007-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002066429A (en) | Rotary coating apparatus and method | |
| JPH08141476A (en) | Rotary cup type liquid supply device | |
| JPH0512990B2 (en) | ||
| KR100446808B1 (en) | Method and device for treating substrates | |
| JP3461068B2 (en) | Rotating cup type liquid supply device | |
| TWI388377B (en) | Spin-cup coating apparatus | |
| JPS584926A (en) | Spin coater | |
| JP3002368B2 (en) | Rotating cup type liquid supply device | |
| JPH05109612A (en) | Resist coating apparatus | |
| JP2533401B2 (en) | Rotary coating device | |
| JP4447673B2 (en) | Spin processing equipment | |
| JP2658710B2 (en) | Resist coating equipment | |
| JPH0754997Y2 (en) | Photoresist coating device | |
| JPH06224173A (en) | Rotary type substrate processing apparatus | |
| JPH05283327A (en) | Resist coating device | |
| JPH01228575A (en) | Spin coater | |
| JPS645882Y2 (en) | ||
| JPH0684776A (en) | Rotating mechanism | |
| JP4861082B2 (en) | Coating device | |
| JPS607959A (en) | Rotary coater | |
| JP2005000726A (en) | Rotary applicator and rotary applying method | |
| JPH04130430U (en) | Rotary coating device | |
| JPS6333660Y2 (en) | ||
| JP2004160335A (en) | Substrate treating apparatus | |
| JP2527682Y2 (en) | Rotary coating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040622 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060712 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060718 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060914 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20061128 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20061128 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 3888840 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091208 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101208 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101208 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111208 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111208 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121208 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121208 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131208 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |