JP2002042922A - Electric connector and its manufacturing method - Google Patents
Electric connector and its manufacturing methodInfo
- Publication number
- JP2002042922A JP2002042922A JP2000220907A JP2000220907A JP2002042922A JP 2002042922 A JP2002042922 A JP 2002042922A JP 2000220907 A JP2000220907 A JP 2000220907A JP 2000220907 A JP2000220907 A JP 2000220907A JP 2002042922 A JP2002042922 A JP 2002042922A
- Authority
- JP
- Japan
- Prior art keywords
- elastic
- connector
- circuit board
- electronic circuit
- holding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、表面実装型等の各
種ＩＣパッケージと検査回路基板との接続検査、あるい
は各種ＩＣパッケージと電子電気回路基板、電子回路基
板と電子回路基板、電子回路基板と液晶モジュール、電
子回路基板と携帯電話用のマイクやスピーカ等との電気
的な接続に用いられる電気コネクタ及びその製造方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection test between various IC packages such as a surface mount type and an inspection circuit board, or various IC packages and an electronic circuit board, an electronic circuit board and an electronic circuit board, and an electronic circuit board. The present invention relates to a liquid crystal module, an electrical connector used for electrical connection between an electronic circuit board and a microphone or speaker for a mobile phone, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来の電気コネクタは、図１４に示すよ
うに、電子回路基板と電気接合物との間に介在する絶縁
性の弾性層５０と、この弾性層５０の厚さ方向に所定の
間隔で埋設される複数本の導電性の金属細線４６とを備
えている。各金属細線４６の両端部は、弾性層５０の表
裏両面やその付近にそれぞれ位置し、図示しない電子回
路基板の電極と電気接合物の電極とに接触する。このよ
うな構成の電気コネクタは、電子回路基板と電気接合物
とに挟持され、これらが加圧圧縮されることにより、電
子回路基板と電気接合物とを電気的に導通する。2. Description of the Related Art As shown in FIG. 14, a conventional electrical connector has an insulating elastic layer 50 interposed between an electronic circuit board and an electric joint, and a predetermined thickness in the thickness direction of the elastic layer 50. And a plurality of conductive metal wires 46 buried at intervals. Both ends of each thin metal wire 46 are located on the front and back surfaces of the elastic layer 50 and in the vicinity thereof, respectively, and are in contact with electrodes of an electronic circuit board (not shown) and electrodes of an electric joint. An electric connector having such a configuration is sandwiched between an electronic circuit board and an electric joint, and is electrically compressed between the electronic circuit board and the electric joint by being compressed.
【０００３】[0003]
【発明が解決しようとする課題】従来の電気コネクタ
は、以上のように構成されているので、表面実装型等の
ＩＣパッケージを導通しようとすると、ＩＣパッケージ
が歪んだり、電極が屈曲・損傷する等の問題がある。以
下、この問題を具体的に説明すると、従来の電気コネク
タは、弾性層５０の表裏両面に各金属細線４６の端部が
それぞれ位置するので、電子回路基板と電気接合物とを
安定した状態で導通させるには、十分な加圧が必要不可
欠となり、加圧力が非常に大きくなる。一方、表面実装
型のＩＣパッケージは、近年ますます薄型化、小型化、
多ピン化、及び小ピッチ化されてきている。このような
特徴を有するＩＣパッケージを従来の電気コネクタで導
通しようとすると、強く加圧しなければならないので、
結果としてＩＣパッケージが歪んだり、電極の屈曲や損
傷を招くこととなる。Since the conventional electrical connector is configured as described above, when conducting an IC package such as a surface mount type, the IC package is distorted or the electrodes are bent or damaged. There are problems such as. Hereinafter, this problem will be specifically described. In the conventional electric connector, since the ends of the thin metal wires 46 are respectively located on the front and back surfaces of the elastic layer 50, the electronic circuit board and the electric joint are stably connected. Sufficient pressurization is indispensable for conduction, and the pressing force becomes extremely large. On the other hand, in recent years, surface mount IC packages have become increasingly thinner and smaller,
The number of pins has been increased and the pitch has been reduced. When trying to conduct an IC package having such features with a conventional electrical connector, a strong pressure must be applied.
As a result, the IC package may be distorted, and the electrodes may be bent or damaged.
【０００４】また、ＬＧＡ等からなる表面実装型のＩＣ
パッケージや電子回路基板の電極は、同一平面状に形成
されたり、あるいは薄く小さく(例えば、十数μｍ程
度、φ０．５ｍｍ程度)形成されているが、このような
電気接合物を従来の電気コネクタで導通しようとする
と、例え強く加圧しても不十分な導通になったり、導通
に支障を来すことが少なくない。また、近年の電子回路
基板もますます多積層化されたり、薄く形成(厚さ０．
５ｍｍ以下の場合もある)されてきているが、このよう
な電子回路基板も従来の電気コネクタで接続しようとす
ると、上記同様、強く加圧しなければならないので、回
路の切断や歪み、電子部品の剥離という大きな問題を生
じる。さらに、これらに伴い接続不良、品質の低下、又
はコスト高が生じる。[0004] Also, a surface mount type IC composed of an LGA or the like.
The electrodes of the package and the electronic circuit board are formed on the same plane or are formed thin and small (for example, about several tens of μm, about φ0.5 mm). In many cases, even if pressure is applied strongly, insufficient conduction or impediment to conduction may occur. In recent years, electronic circuit boards have also become increasingly multi-layered or thinner (thickness of 0.1 mm).
However, if such an electronic circuit board is to be connected with a conventional electrical connector, it must be strongly pressurized as described above. A major problem is peeling. In addition, connection failures, quality deterioration, or cost increases occur.
【０００５】本発明は、上記に鑑みなされたもので、表
面実装型等のＩＣパッケージや電子回路基板等からなる
電気接合物が歪んだり、電極が屈曲・損傷するのを抑制
防止し、接続不良、品質の低下、又はコスト高を防ぐこ
とのできる電気コネクタ及びその製造方法を提供するこ
とを目的としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is intended to prevent an electric joint formed of an IC package or an electronic circuit board of a surface mount type or the like from being distorted or to prevent bending or damage of an electrode, and to prevent poor connection. It is an object of the present invention to provide an electrical connector and a method for manufacturing the same, which can prevent a decrease in quality or an increase in cost.
【０００６】[0006]
【課題を解決するための手段】請求項１記載の発明にお
いては、上記課題を達成するため、電子回路基板と電気
接合物とを導通するものであって、上記電子回路基板と
上記電気接合物との間に介在する絶縁性の保持プレート
の複数の貫通孔に、絶縁性の弾性筒を嵌め入れ、各弾性
筒に略コイルスプリング状を呈した導電性の弾性接続子
を保持させ、各弾性接続子の両端部を上記保持プレート
の表裏両面からそれぞれ僅かに露出させて上記電子回路
基板の電極と上記電気接合物の電極とに面接触させるよ
うにしたことを特徴としている。According to the first aspect of the present invention, in order to achieve the above object, the electronic circuit board is electrically connected to the electrical joint, and the electronic circuit board is electrically connected to the electrical joint. An insulating elastic cylinder is fitted into a plurality of through-holes of an insulating holding plate interposed between the elastic cylinders, and each elastic cylinder holds a conductive elastic connector having a substantially coil spring shape. Both ends of the connector are slightly exposed from the front and back surfaces of the holding plate so as to be in surface contact with the electrodes of the electronic circuit board and the electrodes of the electric joint.
【０００７】請求項２記載の発明においては、上記課題
を達成するため、電子回路基板と電気接合物とを導通す
るものの製造方法であって、絶縁性の弾性エラストマー
をレーザ加工して複数の弾性筒を形成し、各弾性筒内に
略コイルスプリング状で導電性を有する弾性接続子を嵌
め入れ、絶縁性の保持プレートの複数の貫通孔に該弾性
筒を嵌めて該弾性接続子の両端部を上記保持プレートの
表裏両面からそれぞれ僅かに露出させることを特徴とし
ている。According to a second aspect of the present invention, there is provided a method for producing an electronic circuit board and an electrical joint, the method comprising the steps of: A cylinder is formed, an elastic connector having substantially coil spring shape and conductivity is fitted into each elastic cylinder, and the elastic cylinder is fitted into a plurality of through holes of an insulating holding plate, and both ends of the elastic connector are fitted. Are slightly exposed from both the front and back surfaces of the holding plate.
【０００８】ここで、特許請求の範囲における電子回路
基板には、検査回路基板、プリント配線板、高密度フレ
キシブル基板等の各種回路基板が含まれる。電気接合物
には、表面実装型(ＱＦＰ、ＢＧＡ、ＬＧＡ等)等の各種
ＩＣパッケージ、各種回路基板、液晶モジュール、携帯
電話用のマイクやスピーカ等の各種電子部品が含まれ
る。また、保持プレートは、正方形、長方形、円形、多
角形、楕円形等に形成することができる。複数の貫通孔
に弾性筒を嵌め入れる際、全ての貫通孔に弾性筒を嵌め
入れても良いし、任意の複数の貫通孔だけに弾性筒を嵌
め入れることも可能である。Here, the electronic circuit board in the claims includes various circuit boards such as an inspection circuit board, a printed wiring board, and a high-density flexible board. The electrical joint includes various electronic components such as various IC packages such as surface mount type (QFP, BGA, LGA, etc.), various circuit boards, liquid crystal modules, microphones and speakers for mobile phones. Further, the holding plate can be formed in a square, a rectangle, a circle, a polygon, an ellipse, or the like. When fitting the elastic cylinder into the plurality of through holes, the elastic cylinder may be fitted into all the through holes, or the elastic cylinder may be fitted only into any of the plurality of through holes.
【０００９】[0009]
【発明の実施の形態】以下、図面を参照して本発明の好
ましい実施形態を説明すると、本実施形態における電気
コネクタは、図１ないし図４に示すように、平坦な電子
回路基板１０と電気接合物２０との間に介在する絶縁性
の保持プレート４０の複数の貫通孔４２に弾性筒４３を
それぞれ密嵌し、各弾性筒４３に導電性の弾性接続子４
４を嵌入保持させ、各弾性接続子４４の上下両端部を保
持プレート４０の表裏上下両面からそれぞれ僅かに露出
させて電子回路基板１０の電極１１と電気接合物２０の
電極２２とに面接触させるようにしている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIGS. The elastic cylinders 43 are closely fitted to the plurality of through holes 42 of the insulating holding plate 40 interposed between the joints 20, respectively, and the conductive elastic connectors 4 are fitted to the respective elastic cylinders 43.
4 is fitted and held, and the upper and lower ends of each elastic connector 44 are slightly exposed from the front, back, upper and lower surfaces of the holding plate 40 to make surface contact with the electrode 11 of the electronic circuit board 10 and the electrode 22 of the electric joint 20. Like that.
【００１０】電子回路基板１０は、図１に示すように、
例えばプリント配線板からなり、表面に複数の電極１１
が平坦に配列されており、保持プレート４０の取付孔４
１を貫通する複数本の位置決めピン(図示せず)が立設さ
れている。電気接合物２０は、同図に示すように、例え
ば表面実装型のＩＣパッケージ(ＢＧＡ)２１からなり、
電子回路基板１０の表面に近接対向する。この電気接合
物２０は、ボール状を呈した複数の電極２２を並べ備え
ている。The electronic circuit board 10 is, as shown in FIG.
For example, it is made of a printed wiring board and has a plurality of electrodes 11 on its surface.
Are arranged flat, and the mounting holes 4 of the holding plate 40 are
A plurality of positioning pins (not shown) penetrating through 1 are provided upright. As shown in the figure, the electric joint 20 is composed of, for example, a surface mount type IC package (BGA) 21.
It is closely opposed to the surface of the electronic circuit board 10. The electrical joint 20 includes a plurality of electrodes 22 having a ball shape.
【００１１】保持プレート４０は、図１や図２に示すよ
うに、所定の材料を使用して単層の平面矩形に成形さ
れ、対角線上の２隅部に位置決めや固定用の取付孔４１
がそれぞれ貫通して成形されており、円筒状を呈した小
径の貫通孔４２がマトリクスに複数並べて上下厚さ方向
に穿孔成形されている。この保持プレート４０は、耐熱
性や寸法安定性等に優れる汎用のエンジニアリングプラ
スチック(例えば、ＡＢＳ樹脂、ポリエーテルエーテル
ケトン、ポリアミドイミド、ポリエーテルイミド、ポリ
エーテルサルトン等)やセラミック材料を用いて成形さ
れる。As shown in FIGS. 1 and 2, the holding plate 40 is formed into a single-layer flat rectangular shape using a predetermined material, and is provided with mounting holes 41 for positioning and fixing at two diagonal corners.
Are formed through each of them, and a plurality of small-diameter through-holes 42 each having a cylindrical shape are arranged in a matrix and formed in a vertical thickness direction. The holding plate 40 is molded using a general-purpose engineering plastic (for example, ABS resin, polyetheretherketone, polyamideimide, polyetherimide, polyethersultone, etc.) or a ceramic material having excellent heat resistance and dimensional stability. Is done.
【００１２】各弾性筒４３は、図１や図３に示すよう
に、２０°〜５０°Ｈの硬度を有するエラストマー材料
を使用して円筒状に成形され、貫通孔４２の径よりも少
々(０．０５〜０．２ｍｍ程度)拡径に成形されている。
この弾性筒４３は、電子回路基板１０や電気接合物２０
の電極１１・２２形状あるいはその小ピッチを考慮し、
絶縁性とされる。弾性筒４３の材質を２０°〜５０°Ｈ
の硬度を有するエラストマーとするのは、係るエラスト
マーを選択すれば、各貫通孔４２に弾性筒４３を嵌入す
る際、弾性筒４３が柔軟に弾性変形するので、組み立て
が簡易化するからである。また、嵌入後には元の形に弾
性復帰するので、貫通孔４２と弾性筒４３とが密嵌して
抜けにくくなり、接着剤やカシメ等の方法を採用する必
要性がないからである。As shown in FIGS. 1 and 3, each elastic cylinder 43 is formed into a cylindrical shape using an elastomer material having a hardness of 20 ° to 50 ° H, and is slightly smaller than the diameter of the through hole 42 ( (About 0.05 to 0.2 mm).
The elastic tube 43 is used to hold the electronic circuit board 10 and the electric joint 20.
Considering the shape of electrodes 11 and 22 or their small pitch,
It is insulative. 20 ° to 50 ° H for the material of the elastic cylinder 43
The reason why the elastomer having the above hardness is used is that if such an elastomer is selected, when the elastic cylinder 43 is fitted into each through-hole 42, the elastic cylinder 43 is elastically deformed flexibly, thereby simplifying the assembly. In addition, after the fitting, the elastic shape returns to the original shape, so that the through-hole 42 and the elastic cylinder 43 are tightly fitted to each other and hard to come off, and there is no need to employ a method such as an adhesive or caulking.
【００１３】弾性筒４３の具体的な材質としては、硬化
後に架橋構造を形成する材料が好ましい。より具体的に
は、シリコーンゴム、ポリブタジエンゴム、天然ゴム、
ポリイソプレンゴム、ウレタンゴム、クロロプレンゴ
ム、ポリエステル系ゴム、スチレン・ブタジエン共重合
ゴム、エピクロルヒドリンゴム、又はこれらの発泡材料
等があげられるが、硬化物の電気絶縁性、耐熱性、圧縮
永久歪みに優れるシリコーンゴムが好適であり、接続荷
重を極力小さくするために硬化後のゴム硬度が２０°〜
５０°Ｈのシリコーンゴムが最適である。また、携帯電
話のマイク、スピーカの接続に使用される場合には、ハ
ウリングやエコーを防止するため、ゴム硬度の低いシリ
コーンゴムが良い。As a specific material of the elastic cylinder 43, a material which forms a crosslinked structure after curing is preferable. More specifically, silicone rubber, polybutadiene rubber, natural rubber,
Examples include polyisoprene rubber, urethane rubber, chloroprene rubber, polyester rubber, styrene-butadiene copolymer rubber, epichlorohydrin rubber, and foamed materials thereof, and the cured product is excellent in electrical insulation, heat resistance, and compression set. Silicone rubber is preferred, and the rubber hardness after curing is 20 ° to minimize the connection load.
50 ° H silicone rubber is optimal. When used for connection of a microphone and a speaker of a mobile phone, silicone rubber having a low rubber hardness is preferable in order to prevent howling and echo.
【００１４】複数の弾性接続子４４は、図１に示すよう
に、電子回路基板１０、検査回路基板、表面実装型のＩ
Ｃパッケージ２１、液晶モジュール(ＩＴＯ、ＴＡＢ、
ＣＯＦ電極)２２の接続の場合には、これらの電極数と
同本数とされる。これに対し、電気接合物２０が携帯電
話のマイクやスピーカの接続の場合、電極がプレート状
で２個のときには２本であれば良く、電極が中心電極２
９とドーナツ状の電極３０とからなるときには、中心電
極２９に１本、ドーナツ状の電極３０に３〜４本等間隔
に設けられる(図１０参照)。As shown in FIG. 1, the plurality of elastic connectors 44 include an electronic circuit board 10, an inspection circuit board, and a surface-mount type I-connector.
C package 21, liquid crystal module (ITO, TAB,
In the case of connection of the (COF electrodes) 22, the number of these electrodes is the same. On the other hand, when the electric joint 20 is connected to a microphone or a speaker of a mobile phone, when the number of electrodes is two in a plate shape, it is sufficient to use two electrodes.
9 and a donut-shaped electrode 30, one is provided at the center electrode 29 and three to four are provided at equal intervals at the donut-shaped electrode 30 (see FIG. 10).
【００１５】また、携帯電話に用いられる場合には、絶
縁性のマイクホルダ２８内にコンデンサマイクロホン２
７が嵌合され、このコンデンサマイクロホン２７の電極
２２側に電気コネクタとして組み込まれる(図１０参
照)。これらマイクホルダ２８と電気コネクタとは、別
ピースとして組み込まれても良く、一体成形も可能であ
る。When used in a mobile phone, the condenser microphone 2 is placed in an insulating microphone holder 28.
7 is fitted and incorporated as an electrical connector on the electrode 22 side of the condenser microphone 27 (see FIG. 10). The microphone holder 28 and the electrical connector may be incorporated as separate pieces, and may be integrally formed.
【００１６】各弾性接続子４４は、図１、図３、図４に
示すように、直径３０〜１００μｍ、好ましくは３０〜
７０μｍの金属細線４６が等ピッチ(例えば、５０μｍ)
で巻回されることにより、円筒状を呈した弾性のコイル
スプリング状に形成されている。この弾性接続子４４を
形成する金属細線４６としては、リン青銅、銅、ステン
レス、ベリリウム銅等の金属線、あるいはこれらの金属
線に金メッキした金属細線４６があげられる。金属細線
４６の直径を３０〜７０μｍとするのは、この値の範囲
を選択すれば、低コストや低荷重接続の実現が容易とな
るからである。Each of the elastic connectors 44 has a diameter of 30 to 100 μm, preferably 30 to 100 μm, as shown in FIGS.
70 μm thin metal wires 46 are equally spaced (for example, 50 μm)
Is formed into a cylindrical elastic coil spring shape. Examples of the thin metal wire 46 forming the elastic connector 44 include a metal wire such as phosphor bronze, copper, stainless steel, and beryllium copper, or a thin metal wire 46 obtained by plating these metal wires with gold. The reason for setting the diameter of the thin metal wire 46 to 30 to 70 μm is that if this value range is selected, low cost and low load connection can be easily realized.
【００１７】弾性接続子４４の長さとしては、１．０〜
３．０ｍｍ、好ましくは１．０〜１．５ｍｍが良い。こ
の範囲とすれば、外部からのノイズによる悪影響を回避
し、弾性特性を維持することも可能になる。また、弾性
接続子４４、換言すれば、金属細線４６のコイル径は、
最近の電極２２の低ピッチ化を考慮し、０．２〜１．０
ｍｍ、好ましくは０．３〜０．８ｍｍが望ましい。The length of the elastic connector 44 is 1.0 to 1.0.
3.0 mm, preferably 1.0 to 1.5 mm. Within this range, adverse effects due to external noise can be avoided, and elastic characteristics can be maintained. Further, the coil diameter of the elastic connector 44, in other words, the metal wire 46 is
Considering the recent pitch reduction of the electrode 22, 0.2 to 1.0
mm, preferably 0.3 to 0.8 mm.
【００１８】次に、上記電気コネクタの製造方法を説明
すると、先ず、複数の貫通孔４２を備えた絶縁性の保持
プレート４０を高精度と低コストを確保する観点から射
出成形する。この際、各貫通孔４２は、弾性筒４３の径
よりも少々(０．０５〜０．２ｍｍ程度)縮径に成形す
る。こうして保持プレート４０を成形したら、導電性を
有する金属細線４６を等ピッチで巻回して円筒状の弾性
接続子４４を弾性のコイルスプリング状に形成する。こ
の弾性接続子４４の形成は、保持プレート４０成形の先
でも良いし、同時でも良い。また、弾性接続子４４の形
成方法は、公知・周知の方法を適宜採用すれば良い。さ
らに、市販の弾性接続子４４を用いても良い。Next, a method of manufacturing the electrical connector will be described. First, an insulating holding plate 40 having a plurality of through holes 42 is injection-molded from the viewpoint of ensuring high accuracy and low cost. At this time, each through hole 42 is formed to have a diameter slightly smaller (about 0.05 to 0.2 mm) than the diameter of the elastic cylinder 43. After the holding plate 40 is formed in this manner, the conductive metal thin wires 46 are wound at an equal pitch to form the cylindrical elastic connector 44 into an elastic coil spring shape. The formation of the elastic connector 44 may be performed before the holding plate 40 is formed, or may be performed simultaneously. In addition, as a method for forming the elastic connector 44, a known method may be appropriately adopted. Further, a commercially available elastic connector 44 may be used.
【００１９】次いで、保持プレート４０と略同じ厚さの
シリコーンゴム等からなる絶縁性の弾性エラストマー４
７を用意し、この弾性エラストマー４７を公知の方法で
レーザ加工して複数の弾性筒４３を形成する。具体的に
は、弾性エラストマー４７の厚さ方向にレーザ光(矢印
参照)を照射して円筒で小径の貫通口を複数形成(図５参
照)し、各貫通口の外周縁側にレーザ光を同心円で照射
して円筒の弾性筒４３を複数くりぬき形成する(図６参
照)。貫通口形成の際、貫通口の径は、弾性接続子４４
のコイル径と同一か、あるいは０．０５ｍｍ程度小さく
する。Next, an insulating elastic elastomer 4 made of silicone rubber or the like having substantially the same thickness as the holding plate 40 is used.
7 is prepared, and the elastic elastomer 47 is laser-processed by a known method to form a plurality of elastic cylinders 43. Specifically, a plurality of small-diameter through holes are formed by irradiating laser light (see arrows) in the thickness direction of the elastic elastomer 47 (see FIG. 5), and the laser light is concentrically formed on the outer peripheral side of each through hole. To form a plurality of hollow elastic cylinders 43 (see FIG. 6). When forming the through-hole, the diameter of the through-hole is adjusted by the elastic connector 44.
Is the same as or smaller by about 0.05 mm.
【００２０】次いで、各弾性筒４３内に弾性接続子４４
を嵌入保持させ、各弾性接続子４４の略リング状を呈し
た両端部を弾性筒４３の両開口面からそれぞれ僅かに露
出させる(図７、図８参照)。この際、弾性筒４３に弾性
接続子４４を挿入すると、弾性筒４３が僅かに膨らんだ
状態で弾性接続子４４が密嵌保持され、挿入後は弾性体
の元に戻ろうとする特性により、弾性接続子４４が抜け
ることなく強固に保持される。そしてその後、保持プレ
ート４０の各貫通孔４２に弾性筒４３を嵌入(図８参照)
してその上下両開口面と保持プレート４０の上下表裏両
面とを同じ高さとし、各弾性接続子４４の両端部を保持
プレート４０の上下表裏両面からそれぞれ少々露出(図
３参照)させれば、図２に示す電気コネクタを作製する
ことができる。Next, an elastic connector 44 is provided in each elastic cylinder 43.
Are fitted and held, and the generally ring-shaped ends of each elastic connector 44 are slightly exposed from both opening surfaces of the elastic cylinder 43 (see FIGS. 7 and 8). At this time, when the elastic connector 44 is inserted into the elastic tube 43, the elastic connector 43 is closely fitted and held in a state where the elastic tube 43 is slightly expanded, and after the insertion, the elastic connector 44 tends to return to the elastic body. The connector 44 is firmly held without falling off. Then, the elastic cylinder 43 is fitted into each through hole 42 of the holding plate 40 (see FIG. 8).
Then, the upper and lower opening surfaces and the upper and lower front and back surfaces of the holding plate 40 are made the same height, and both ends of each elastic connector 44 are slightly exposed from the upper and lower front and back surfaces of the holding plate 40 (see FIG. 3). The electrical connector shown in FIG. 2 can be manufactured.
【００２１】上記構成において、電子回路基板１０と電
気接合物２０とに電気コネクタを複数本の位置決めピン
を介して位置決め挟持させ、電子回路基板１０の各電極
１１と弾性接続子４４の下端部を面接触させるととも
に、電気接合物２０の各電極２２と弾性接続子４４の上
端部を面接触させ、電子回路基板１０に対して電気接合
物２０を加圧圧縮する。こうすれば、各弾性接続子４４
が圧縮変形し、電子回路基板１０と電気接合物２０を弾
性接続子４４を介して電気的に導通することができる
(図１参照)。In the above configuration, the electric connector is positioned and sandwiched between the electronic circuit board 10 and the electric joint 20 through a plurality of positioning pins, and each electrode 11 of the electronic circuit board 10 and the lower end of the elastic connector 44 are connected. At the same time, the electrodes 22 of the electric joint 20 are brought into surface contact with the upper ends of the elastic connectors 44, and the electric joint 20 is pressed and compressed against the electronic circuit board 10. In this way, each elastic connector 44
Is compressed and deformed, so that the electronic circuit board 10 and the electric joint 20 can be electrically connected via the elastic connector 44.
(See FIG. 1).
【００２２】上記構成によれば、各弾性接続子４４をコ
イルスプリング状に巻装形成するので、例え低荷重で弾
性接続子４４を圧縮しても、十分な弾性作用が期待で
き、しかも、電子回路基板１０や電気接合物２０の電極
１１・２２と弾性接続子４４とが点接触ではなく、面接
触するので、接続時の安定性を著しく向上させることが
できる。したがって、薄型化、小型化、多ピン化、及び
小ピッチ化された表面実装型等のＩＣパッケージ２１を
導通する場合にも、ＩＣパッケージ２１が歪んだり、電
極２２の屈曲や損傷を招くことがない。また、ＬＧＡ等
からなる表面実装型のＩＣパッケージ２１や電子回路基
板１０を導通する場合にも、十分な導通が期待でき、導
通に支障を来すこともない。According to the above configuration, since each elastic connector 44 is wound and formed in a coil spring shape, even if the elastic connector 44 is compressed with a low load, a sufficient elastic action can be expected. Since the electrodes 11 and 22 of the circuit board 10 and the electric joint 20 and the elastic connector 44 make surface contact, not point contact, the stability at the time of connection can be remarkably improved. Therefore, even when conducting the IC package 21 such as a surface mount type having a reduced thickness, a smaller size, a larger number of pins, and a smaller pitch, the IC package 21 may be distorted or the electrode 22 may be bent or damaged. Absent. Also, in the case where the surface mount type IC package 21 made of LGA or the like and the electronic circuit board 10 are electrically connected, sufficient conduction can be expected and there is no hindrance to the conduction.
【００２３】また、近年の薄い電子回路基板１０を電気
コネクタで接続する場合にも、強く加圧する必要性が全
くなく、これを通じて回路の切断や歪み、電子部品の剥
離という問題を解消することができ、かつ接続不良、品
質の低下、又はコスト高という問題をも除去することが
可能になる。また、各弾性筒４３内に弾性接続子４４を
保護保持させているので、検査時や導通時に弾性接続子
４４が損傷したり、損傷に伴い腐食することがない。さ
らに、弾性エラストマー４７をレーザ加工して複数の弾
性筒４３を形成するので、金型成形とは異なり、小径の
弾性筒４３を簡単に形成することができ、作業の便宜も
大いに期待できる。さらにまた、上記製造方法によれ
ば、電子回路基板１０や電気接合物２０の電極１１・２
２形状、ピッチに影響されることなく、接続したい部分
のみに弾性接続子４４を高精度に設けることができると
ともに、多品種小ロット生産にも十分対応でき、製造コ
スト的にも非常に優位となる。Further, even when a recent thin electronic circuit board 10 is connected by an electric connector, there is no need to apply strong pressure at all, and through this, it is possible to solve the problems of cutting, distortion, and peeling of electronic components. It is also possible to eliminate the problems of poor connection, poor quality, and high cost. Further, since the elastic connector 44 is protected and held in each elastic tube 43, the elastic connector 44 is not damaged at the time of inspection or conduction, and does not corrode due to the damage. Further, since the plurality of elastic cylinders 43 are formed by laser processing the elastic elastomer 47, unlike the die molding, the small-diameter elastic cylinders 43 can be easily formed, and the convenience of work can be greatly expected. Furthermore, according to the above manufacturing method, the electrodes 11 and 2 of the electronic circuit board 10 and the electric joint 20
(2) The elastic connector 44 can be provided with high accuracy only at the portion to be connected without being affected by the shape and pitch, and it can sufficiently cope with multi-product small-lot production, and has a very superior manufacturing cost. Become.
【００２４】次に、図９は、本発明の第２の実施形態を
示すもので、この場合には、電子回路基板１０と液晶モ
ジュール２３からなる電気接合物２０との間に液晶導光
板２４を介在させ、この液晶導光板２４のコネクタガイ
ド口に長板状の保持プレート４０を嵌合し、この保持プ
レート４０長手方向(図の奥方向)の一列に並んだ複数の
貫通孔４２に弾性筒４３をそれぞれ密嵌するとともに、
各弾性筒４３に導電性の弾性接続子４４を嵌入保持さ
せ、各弾性接続子４４の両端部を保持プレート４０の表
裏両面からそれぞれ僅かに露出させて電子回路基板１０
の電極１１と電気接合物２０の電極(ＩＴＯ電極)２５と
に面接触させるようにしている。その他の部分について
は、上記実施形態と同様であるので説明を省略する。本
実施形態においても、上記実施形態と同様の作用効果が
期待できる。FIG. 9 shows a second embodiment of the present invention. In this case, a liquid crystal light guide plate 24 is provided between an electronic circuit board 10 and an electric joint 20 comprising a liquid crystal module 23. , A long plate-shaped holding plate 40 is fitted into the connector guide opening of the liquid crystal light guide plate 24, and a plurality of through holes 42 arranged in a line in the longitudinal direction (the depth direction in the drawing) of the holding plate 40 are elastically inserted. Each of the tubes 43 is closely fitted,
A conductive elastic connector 44 is fitted and held in each elastic cylinder 43, and both ends of each elastic connector 44 are slightly exposed from the front and back surfaces of the holding plate 40, respectively.
And the electrode (ITO electrode) 25 of the electric joint 20 is brought into surface contact. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. In this embodiment, the same operation and effect as those of the above embodiment can be expected.
【００２５】次に、図１０は、本発明の第３の実施形態
を示すもので、この場合には、電子回路基板１０とケー
ス２６内のコンデンサマイクロホン２７からなる電気接
合物２０との間に、円形を呈した保持プレート４０を介
在させ、この保持プレート４０の複数の貫通孔４２に弾
性筒４３をそれぞれ密嵌するとともに、各弾性筒４３に
導電性の弾性接続子４４を嵌入保持させ、各弾性接続子
４４の両端部を保持プレート４０の表裏両面からそれぞ
れ僅かに露出させて電子回路基板１０の電極１１と電気
接合物２０の電極２２とに面接触させるようにしてい
る。Next, FIG. 10 shows a third embodiment of the present invention. In this case, between the electronic circuit board 10 and the electric joint 20 including the condenser microphone 27 in the case 26, FIG. A circular elastic holding plate 40 is interposed, the elastic tubes 43 are closely fitted to the plurality of through holes 42 of the holding plate 40, and the conductive elastic connectors 44 are fitted and held in the elastic tubes 43, respectively. Both ends of each elastic connector 44 are slightly exposed from the front and back surfaces of the holding plate 40 so as to make surface contact with the electrode 11 of the electronic circuit board 10 and the electrode 22 of the electric joint 20.
【００２６】コンデンサマイクロホン２７は、断面略凸
字形で中空筒形のマイクホルダ２８の拡径部に内蔵保持
されている。このコンデンサマイクロホン２７の電極２
２は、中心電極２９と、これ２９を囲むドーナツ状の電
極３０とから形成されている。複数の貫通孔４２は、保
持プレート４０の中心部や同心円上の任意の箇所に適宜
穿孔される。その他の部分については、上記実施形態と
同様であるので説明を省略する。本実施形態において
も、上記実施形態と同様の作用効果が期待できる。The condenser microphone 27 is held in a large-diameter section of a hollow cylindrical microphone holder 28 having a substantially convex cross section. Electrode 2 of this condenser microphone 27
2 is formed of a center electrode 29 and a donut-shaped electrode 30 surrounding the center electrode 29. The plurality of through-holes 42 are appropriately drilled at an arbitrary position on the center of the holding plate 40 or on a concentric circle. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. In this embodiment, the same operation and effect as those of the above embodiment can be expected.
【００２７】なお、上記実施形態では金属細線４６を等
ピッチで巻回することにより、通常の円筒状を呈したコ
イルスプリング状の弾性接続子４４を形成したが、なん
らこの形状に限定されるものではない。例えば、弾性接
続子４４を形成する金属細線４６の上下両端部のピッチ
をそれぞれ小さくして密接させ、中央の残部を等ピッチ
で巻回して円筒状としたり(図１１参照)、金属細線４６
の上下両端部のピッチをそれぞれ大きくして等ピッチで
巻回し、中央の残部のピッチを小さくして密接させても
良い(図１２参照)。In the above-described embodiment, the coil spring-like elastic connector 44 having a normal cylindrical shape is formed by winding the thin metal wires 46 at an equal pitch. However, the present invention is not limited to this shape. is not. For example, the pitches of the upper and lower ends of the thin metal wires 46 forming the elastic connector 44 may be reduced and closely contacted, and the remaining portion at the center may be wound at an equal pitch to form a cylindrical shape (see FIG. 11).
May be wound at equal pitches by increasing the pitch of both upper and lower ends, and may be closely contacted by reducing the pitch of the remaining portion at the center (see FIG. 12).
【００２８】また、弾性接続子４４を形成する金属細線
４６の上下両端部の径をそれぞれ小さくし、中央の残部
の径を大きくして太鼓状、タル状の円筒状等にすること
も可能である(図１３参照)。これら弾性接続子４４の形
状の変更は、電極１１・２２の形状、圧縮荷重、圧縮量
等により適宜変更可能である。さらに、電子回路基板１
０に向けて電気接合物２０を加圧圧縮したが、加圧圧縮
を省いても電子回路基板１０と電気接合物２０とを電気
的に十分導通させることができる。It is also possible to reduce the diameter of the upper and lower ends of the thin metal wire 46 forming the elastic connector 44, and to increase the diameter of the remaining portion at the center so as to form a drum-shaped or tall cylindrical shape. (See FIG. 13). The shape of the elastic connector 44 can be changed as appropriate depending on the shapes of the electrodes 11 and 22, the compression load, the amount of compression, and the like. Further, the electronic circuit board 1
Although the electric joint 20 is pressurized and compressed toward zero, the electronic circuit board 10 and the electric joint 20 can be electrically conducted sufficiently even if the pressurization and compression are omitted.
【００２９】[0029]
【実施例】以下、本発明に係る電気コネクタ及びその製
造方法の実施例を説明する。 実施例１ 先ず、ポリフェニレンサルファイドを使用して４００個
の複数の貫通孔４２を備えた絶縁性の保持プレート４０
を射出成形した。この保持プレート４０は、縦横２０ｍ
ｍ、厚さ１．０ｍｍの寸法とし、対角線上の２隅部に直
径１．５ｍｍの取付孔４１をそれぞれ貫通成形した。複
数の貫通孔４２は２０×２０列に配列し、各貫通孔４２
の直径は０．７５ｍｍとした。こうして保持プレート４
０を成形したら、導電性を有する金属細線４６を５０μ
ｍの等ピッチで巻回して円筒状の弾性接続子４４を弾性
のコイルスプリング状に形成した。金属細線４６として
は、リン青銅に金メッキした直径３０μｍの金属線を使
用した。また、弾性接続子４４は、直径０．５ｍｍ、高
さ１．４ｍｍの大きさに形成した。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the electrical connector according to the present invention and a method for manufacturing the same will be described. Example 1 First, an insulating holding plate 40 having a plurality of through holes 42 using polyphenylene sulfide was used.
Was injection molded. This holding plate 40 is 20 m in length and width.
m, a thickness of 1.0 mm, and a mounting hole 41 having a diameter of 1.5 mm was formed at two corners on a diagonal line. The plurality of through holes 42 are arranged in 20 × 20 rows,
Was 0.75 mm in diameter. Thus, the holding plate 4
After molding 0, the conductive thin metal wire 46 is
By winding at a constant pitch of m, the cylindrical elastic connector 44 was formed into an elastic coil spring shape. As the fine metal wire 46, a metal wire having a diameter of 30 μm and gold-plated on phosphor bronze was used. The elastic connector 44 was formed to have a diameter of 0.5 mm and a height of 1.4 mm.
【００３０】次いで、保持プレート４０と同じ厚さのシ
リコーンゴムシートからなる絶縁性の弾性エラストマー
４７を用意し、この弾性エラストマー４７を炭酸ガスレ
ーザでレーザ加工して４００個の複数の弾性筒４３を１
０ｍｍピッチで２０×２０列に配列形成した。シリコー
ンゴムシートは、成形後の厚さが１．０ｍｍとなるよ
う、シリコーンゴムコンパウンドＫＥ‐９５１Ｕ(信越
化学工業株式会社製 商品名)を圧縮成形することによ
り、３００ｍｍ×３００ｍｍの大きさに成形した。各弾
性筒４３は、弾性エラストマー４７の厚さ方向にレーザ
光を照射して直径０．５ｍｍの貫通口を複数形成し、各
貫通口の外周側にレーザ光を同心円で直径０．８ｍｍに
照射することによりくりぬき形成した。Next, an insulating elastic elastomer 47 made of a silicone rubber sheet having the same thickness as the holding plate 40 is prepared, and the elastic elastomer 47 is laser-processed with a carbon dioxide gas laser to form 400 elastic cylinders 43 in one.
They were arranged in 20 × 20 rows at a pitch of 0 mm. The silicone rubber sheet was formed into a size of 300 mm x 300 mm by compression-molding a silicone rubber compound KE-951U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) so that the thickness after molding became 1.0 mm. . Each elastic cylinder 43 irradiates a laser beam in the thickness direction of the elastic elastomer 47 to form a plurality of through-holes having a diameter of 0.5 mm, and irradiates the outer peripheral side of each through-hole with a laser beam concentrically to a diameter of 0.8 mm. A hollow was formed.
【００３１】次いで、各弾性筒４３内に弾性接続子４４
を嵌入保持させ、各弾性接続子４４の両端部を弾性筒４
３の両開口面からそれぞれ０．２ｍｍ露出させた。そし
て、保持プレート４０の各貫通孔４２に弾性筒４３を嵌
入して各弾性接続子４４の両端部を保持プレート４０の
上下表裏両面からそれぞれ０．２ｍｍ露出させ、電気コ
ネクタを作製した。Next, an elastic connector 44 is provided in each elastic cylinder 43.
Are fitted and held, and both ends of each elastic connector 44 are
3 was exposed by 0.2 mm from both opening surfaces. Then, the elastic tube 43 was fitted into each through hole 42 of the holding plate 40 to expose both ends of each elastic connector 44 by 0.2 mm from both the upper, lower, front and back surfaces of the holding plate 40, thereby producing an electrical connector.
【００３２】電気コネクタを作製したら、電子回路基板
１０に電気コネクタを複数本の位置決めピンを介して固
定し、電子回路基板１０の各電極１１と弾性接続子４４
の下端部を面接触させ、電気コネクタ上にＢＧＡからな
る電気接合物２０を配置して各弾性接続子４４の上端部
と電気接合物２０の電極２２(総数４００個)とを面接触
させ、電子回路基板１０に電気接合物２０を接近方向に
０．３ｍｍ加圧圧縮(荷重にして約５０ｇ)した。これに
より、各弾性接続子４４が撓み、電子回路基板１０と電
気接合物２０を導通抵抗の安定した状態で電気的に導通
させることができた。また、これらに振動を加えたが、
安定した電気的な導通を継続することができた。After the electrical connector is manufactured, the electrical connector is fixed to the electronic circuit board 10 via a plurality of positioning pins, and each electrode 11 of the electronic circuit board 10 and the elastic connector 44 are fixed.
The lower end of the elastic connector 44 is placed on the electric connector, and the upper end of each elastic connector 44 is brought into surface contact with the electrode 22 (total 400) of the electric joint 20, The electric joint 20 was pressed and compressed (approximately 50 g as a load) to the electronic circuit board 10 in the approaching direction by 0.3 mm. As a result, each of the elastic connectors 44 was bent, and the electronic circuit board 10 and the electric joint 20 could be electrically conducted with a stable conduction resistance. Also, vibration was applied to these,
Stable electrical continuity could be maintained.
【００３３】実施例２ 先ず、ＡＢＳ樹脂を使用して２０個の複数の貫通孔４２
を備えた絶縁性の保持プレート４０を射出成形した。こ
の保持プレート４０は、縦３０ｍｍ、横５ｍｍ、厚さ
１．０ｍｍの寸法とし、両端の隅部に直径１．５ｍｍの
取付孔４１をそれぞれ貫通成形した。複数の貫通孔４２
は縦方向に一列に配列し、各貫通孔４２の直径は０．７
ｍｍとした。保持プレート４０を成形したら、導電性の
金属細線４６を５０μｍの等ピッチで巻回して円筒状の
弾性接続子４４を弾性のコイルスプリング状に形成し
た。金属細線４６としては、リン青銅に金メッキした直
径３０μｍの金属線を使用した。また、弾性接続子４４
は、直径０．４ｍｍ、高さ１．４ｍｍの大きさに形成し
た。Example 2 First, a plurality of 20 through-holes 42 were formed using ABS resin.
The insulating holding plate 40 provided with was molded by injection molding. The holding plate 40 had dimensions of 30 mm in length, 5 mm in width, and 1.0 mm in thickness, and formed through-holes 1.5 mm in diameter at the corners at both ends. Multiple through holes 42
Are arranged in a line in the vertical direction, and the diameter of each through hole 42 is 0.7
mm. After the holding plate 40 was formed, the conductive thin metal wires 46 were wound at an equal pitch of 50 μm to form the cylindrical elastic connector 44 into an elastic coil spring shape. As the fine metal wire 46, a metal wire having a diameter of 30 μm and gold-plated on phosphor bronze was used. Also, the elastic connector 44
Was formed to have a diameter of 0.4 mm and a height of 1.4 mm.
【００３４】次いで、保持プレート４０と同じ厚さのシ
リコーンゴムシートからなる絶縁性の弾性エラストマー
４７を用意し、この弾性エラストマー４７を炭酸ガスレ
ーザでレーザ加工して２９０個の複数の弾性筒４３を１
ｍｍピッチで配列形成した。シリコーンゴムシートは、
成形後の厚さが１．０ｍｍとなるよう、シリコーンゴム
コンパウンドＫＥ‐９５１Ｕ(信越化学工業株式会社製
商品名)を圧縮成形することにより、３００ｍｍ×１
０ｍｍの大きさに成形した。各弾性筒４３は、弾性エラ
ストマー４７の厚さ方向にレーザ光を照射して直径０．
４ｍｍの貫通口を複数形成し、各貫通口の外周側にレー
ザ光を同心円で直径０．７５ｍｍに照射することにより
くりぬき形成した。Next, an insulating elastic elastomer 47 made of a silicone rubber sheet having the same thickness as the holding plate 40 is prepared, and this elastic elastomer 47 is laser-processed with a carbon dioxide gas laser to form 290 plural elastic cylinders 43.
An array was formed at a pitch of mm. Silicone rubber sheet
By compressing and molding silicone rubber compound KE-951U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) so that the thickness after molding becomes 1.0 mm, 300 mm × 1
It was molded to a size of 0 mm. Each elastic cylinder 43 irradiates a laser beam in the thickness direction of the elastic elastomer 47 and has a diameter of 0.1 mm.
A plurality of 4 mm through holes were formed, and laser light was concentrically applied to the outer peripheral side of each through hole to a diameter of 0.75 mm to form a hollow.
【００３５】次いで、各弾性筒４３内に弾性接続子４４
を嵌入保持させ、各弾性接続子４４の両端部を弾性筒４
３の両開口面からそれぞれ０．２ｍｍ突出させた。そし
て、保持プレート４０の各貫通孔４２に弾性筒４３を嵌
入して各弾性接続子４４の両端部を保持プレート４０の
上下表裏両面からそれぞれ０．２ｍｍ露出させ、電気コ
ネクタを作製した。Next, an elastic connector 44 is provided in each elastic cylinder 43.
Are fitted and held, and both ends of each elastic connector 44 are
No. 3 protruded 0.2 mm from both opening surfaces. Then, the elastic tube 43 was fitted into each through hole 42 of the holding plate 40 to expose both ends of each elastic connector 44 by 0.2 mm from both the upper, lower, front and back surfaces of the holding plate 40, thereby producing an electrical connector.
【００３６】電気コネクタを作製したら、電子回路基板
１０に液晶導光板２４と共に電気コネクタを複数本の位
置決めピンを介して固定し、電子回路基板１０の各電極
１１と弾性接続子４４の下端部を面接触させ、電気コネ
クタ上に液晶モジュール２３からなる電気接合物２０を
配置して各弾性接続子４４の上端部と電気接合物２０の
電極２５とを面接触させ、電子回路基板１０に電気接合
物２０を接近方向に０．３ｍｍ加圧圧縮(荷重にして約
５０ｇ)した。これにより、各弾性接続子４４が撓み、
電子回路基板１０と電気接合物２０を導通抵抗の安定し
た状態で電気的に導通させることができた。また、これ
らに振動を加えたが、安定した電気的な導通を継続する
ことができた。After the electric connector is manufactured, the electric connector is fixed to the electronic circuit board 10 together with the liquid crystal light guide plate 24 via a plurality of positioning pins, and each electrode 11 of the electronic circuit board 10 and the lower end of the elastic connector 44 are connected. The electric connector 20 including the liquid crystal module 23 is placed on the electric connector, and the upper end of each elastic connector 44 and the electrode 25 of the electric connector 20 are brought into surface contact. The object 20 was pressed and compressed (approximately 50 g as a load) by 0.3 mm in the approaching direction. Thereby, each elastic connector 44 bends,
The electronic circuit board 10 and the electrical joint 20 could be electrically conducted with a stable conduction resistance. Although vibration was applied to these, stable electrical continuity could be maintained.
【００３７】実施例３ 先ず、ＡＢＳ樹脂を使用して５個の貫通孔４２を備えた
絶縁性の保持プレート４０を射出成形した。この保持プ
レート４０は、直径６ｍｍ、厚さ１．０ｍｍの寸法とし
た。複数の貫通孔４２は、保持プレート４０の中心部に
１個、中心部を中心として直径３．５ｍｍの円周上に９
０°おきに４個配列し、各貫通孔４２の直径を１．０ｍ
ｍとした。保持プレート４０を成形したら、導電性を有
する金属細線４６を５０μｍの等ピッチで巻回して円筒
状の弾性接続子４４を弾性のコイルスプリング状に形成
した。金属細線４６としては、リン青銅に金メッキした
直径５０μｍの金属線を使用した。また、弾性接続子４
４は、直径０．６ｍｍ、高さ１．４ｍｍの大きさに形成
した。Example 3 First, an insulating holding plate 40 having five through holes 42 was injection-molded using ABS resin. The holding plate 40 had a diameter of 6 mm and a thickness of 1.0 mm. The plurality of through-holes 42 are one at the center of the holding plate 40 and 9 on the circumference of 3.5 mm in diameter around the center.
Four are arranged at 0 ° intervals, and the diameter of each through-hole 42 is 1.0 m.
m. After the holding plate 40 was formed, the conductive thin metal wires 46 were wound at an equal pitch of 50 μm to form the cylindrical elastic connector 44 into an elastic coil spring shape. As the thin metal wire 46, a metal wire having a diameter of 50 μm and gold-plated on phosphor bronze was used. Also, the elastic connector 4
No. 4 was formed to have a diameter of 0.6 mm and a height of 1.4 mm.
【００３８】次いで、保持プレート４０と同じ厚さのシ
リコーンゴムシートからなる弾性エラストマー４７を用
意し、この弾性エラストマー４７を炭酸ガスレーザでレ
ーザ加工して２９０個の複数の弾性筒４３を１ｍｍピッ
チで配列形成した。シリコーンゴムシートは、成形後の
厚さが１．０ｍｍとなるよう、シリコーンゴムコンパウ
ンドＫＥ‐９５１Ｕ(同上)を圧縮成形することにより、
３００ｍｍ×１０ｍｍの大きさに成形した。各弾性筒４
３は、弾性エラストマー４７の厚さ方向にレーザ光を照
射して直径０．６ｍｍの貫通口を複数形成し、各貫通口
の外周側にレーザ光を同心円で直径１．０５ｍｍに照射
することによりくりぬき形成した。Next, an elastic elastomer 47 made of a silicone rubber sheet having the same thickness as that of the holding plate 40 is prepared, and the elastic elastomer 47 is laser-processed with a carbon dioxide gas laser to arrange 290 plural elastic cylinders 43 at a pitch of 1 mm. Formed. The silicone rubber sheet is compression-molded with a silicone rubber compound KE-951U (same as above) so that the thickness after molding becomes 1.0 mm.
It was formed into a size of 300 mm × 10 mm. Each elastic cylinder 4
3 is to irradiate a laser beam in the thickness direction of the elastic elastomer 47 to form a plurality of through-holes having a diameter of 0.6 mm, and to irradiate the outer periphery of each through-hole with a laser beam concentrically to a diameter of 1.05 mm. A hollow was formed.
【００３９】次いで、各弾性筒４３内に弾性接続子４４
を嵌入保持させ、各弾性接続子４４の両端部を弾性筒４
３の両開口面からそれぞれ０．２ｍｍ突出させた。そし
て、保持プレート４０の各貫通孔４２に弾性筒４３を嵌
入して各弾性接続子４４の両端部を保持プレート４０の
上下表裏両面からそれぞれ０．２ｍｍ突出させ、電気コ
ネクタを作製した。Next, an elastic connector 44 is provided in each elastic cylinder 43.
Are fitted and held, and both ends of each elastic connector 44 are
No. 3 protruded 0.2 mm from both opening surfaces. Then, the elastic cylinder 43 was fitted into each through hole 42 of the holding plate 40, and both ends of each elastic connector 44 were protruded by 0.2 mm from the upper, lower, front and back surfaces of the holding plate 40, respectively, to produce an electrical connector.
【００４０】電気コネクタを作製したら、この電気コネ
クタを携帯電話用のコンデンサマイクロホン２７からな
る電気接合物２０を被覆保護するマイクホルダ２８に内
蔵保持させ、電気接合物２０の電極２２と各弾性接続子
４４の上端部とを面接触させ、電子回路基板１０にマイ
クホルダ２８を固定して電子回路基板１０の各電極１１
と弾性接続子４４の下端部を面接触させ、これらを携帯
電話のマイク挿入部分に組み込んだ。電気接合物２０の
電極２２は、中心部に位置するφ１ｍｍの中心電極２９
と、中心部を中心として直径３．５ｍｍの円周上に位置
する幅１ｍｍのドーナツ状の電極３０とから構成されて
いる。マイクホルダ２８は所定のゴムを使用して成形し
た。After the electric connector has been manufactured, the electric connector is built and held in a microphone holder 28 for covering and protecting the electric joint 20 comprising a condenser microphone 27 for a mobile phone, and the electrode 22 of the electric joint 20 and each elastic connector The microphone holder 28 is fixed to the electronic circuit board 10 by bringing the upper end portion of the electrode 44 into surface contact with each electrode 11 of the electronic circuit board 10.
And the lower ends of the elastic connectors 44 were brought into surface contact, and these were assembled into the microphone insertion portion of the mobile phone. The electrode 22 of the electric conjugate 20 has a center electrode 29 of φ1 mm located at the center.
And a donut-shaped electrode 30 having a width of 1 mm and located on a circumference having a diameter of 3.5 mm with the center as a center. The microphone holder 28 was formed using a predetermined rubber.
【００４１】そして、電子回路基板１０で電気接合物２
０を０．３ｍｍ加圧圧縮(荷重にして約５００ｇ)したと
ころ、各弾性接続子４４が撓み、電子回路基板１０と電
気接合物２０を導通抵抗の安定した状態で電気的に導通
させることができた。また、これらに振動を加えたが、
安定した電気的な導通を継続することができ、かつハウ
リングやエコーも確認されなかった。Then, the electric conjugate 2 is connected to the electronic circuit board 10.
When 0 is pressed and compressed by 0.3 mm (approximately 500 g as a load), each elastic connector 44 bends, and the electronic circuit board 10 and the electric joint 20 can be electrically conducted with a stable conduction resistance. did it. Also, vibration was applied to these,
Stable electrical continuity could be maintained, and no howling or echo was observed.
【００４２】[0042]
【発明の効果】以上のように本発明によれば、表面実装
型等のＩＣパッケージや回路基板等からなる電気接合物
が歪んだり、電極が屈曲・損傷するのを抑制防止し、接
続不良、品質の低下、又はコスト高を防ぐことができる
という効果がある。As described above, according to the present invention, it is possible to prevent the electrical joint formed of a surface mount type IC package, a circuit board, or the like from being distorted or to prevent the electrodes from being bent or damaged. There is an effect that deterioration in quality or high cost can be prevented.
【図１】本発明に係る電気コネクタの実施形態を示す部
分断面説明図である。FIG. 1 is a partial cross-sectional explanatory view showing an embodiment of an electric connector according to the present invention.
【図２】本発明に係る電気コネクタの実施形態を示す斜
視図説明図である。FIG. 2 is a perspective view explanatory view showing an embodiment of the electric connector according to the present invention.
【図３】本発明に係る電気コネクタの実施形態を示す部
分断面説明図である。FIG. 3 is an explanatory partial cross-sectional view showing an embodiment of the electrical connector according to the present invention.
【図４】本発明に係る電気コネクタの製造方法の実施形
態における弾性接続子を示す説明図である。FIG. 4 is an explanatory view showing an elastic connector in the embodiment of the method for manufacturing an electrical connector according to the present invention.
【図５】本発明に係る電気コネクタの製造方法の実施形
態における弾性エラストマーにレーザ光を照射して小径
の貫通口を複数形成した状態を示す部分断面説明図であ
る。FIG. 5 is a partial cross-sectional explanatory view showing a state in which a plurality of small-diameter through holes are formed by irradiating a laser beam to the elastic elastomer in the embodiment of the method for manufacturing an electrical connector according to the present invention.
【図６】図５の貫通口の外周側にレーザ光を同心円で照
射して弾性筒を複数形成する状態を示す部分断面説明図
である。6 is a partial cross-sectional explanatory view showing a state in which a plurality of elastic cylinders are formed by irradiating a laser beam concentrically on the outer peripheral side of the through hole in FIG.
【図７】図６の弾性筒内に弾性接続子を嵌入保持させる
状態を示す断面説明図である。FIG. 7 is an explanatory sectional view showing a state in which an elastic connector is fitted and held in the elastic cylinder of FIG. 6;
【図８】図７の弾性接続子の両端部をそれぞれ僅かに露
出させ、保持プレートの各貫通孔に弾性筒を嵌入する状
態を示す断面説明図である。8 is a cross-sectional explanatory view showing a state in which both ends of the elastic connector of FIG. 7 are slightly exposed, and an elastic cylinder is fitted into each through hole of the holding plate.
【図９】本発明に係る電気コネクタの第２の実施形態を
示す部分断面説明図である。FIG. 9 is an explanatory partial sectional view showing a second embodiment of the electrical connector according to the present invention.
【図１０】本発明に係る電気コネクタの第３の実施形態
を示す部分断面説明図である。FIG. 10 is a partial cross-sectional explanatory view showing a third embodiment of the electrical connector according to the present invention.
【図１１】本発明に係る電気コネクタの第４の実施形態
における弾性接続子を示す説明図である。FIG. 11 is an explanatory view showing an elastic connector in a fourth embodiment of the electrical connector according to the present invention.
【図１２】本発明に係る電気コネクタの第５の実施形態
における弾性接続子を示す説明図である。FIG. 12 is an explanatory view showing an elastic connector in a fifth embodiment of the electric connector according to the present invention.
【図１３】本発明に係る電気コネクタの第６の実施形態
における弾性接続子を示す説明図である。FIG. 13 is an explanatory view showing an elastic connector in a sixth embodiment of the electrical connector according to the present invention.
【図１４】従来の電気コネクタを示す部分断面説明図で
ある。FIG. 14 is a partially sectional explanatory view showing a conventional electric connector.
【符号の説明】 １０ 電子電子回路基板 １１ 電極 ２０ 電気接合物 ２１ ＩＣパッケージ ２２ 電極 ２３ 液晶モジュール ２４ 液晶導光板 ２５ 電極 ２７ コンデンサマイクロホン ２８ マイクホルダ ２９ 中心電極 ３０ ドーナツ状の電極 ４０ 保持プレート ４２ 貫通孔 ４３ 弾性筒 ４４ 弾性接続子 ４６ 金属細線 ４７ 弾性エラストマーDESCRIPTION OF THE SYMBOLS 10 Electronic / Electronic Circuit Board 11 Electrode 20 Electrical Joint 21 IC Package 22 Electrode 23 Liquid Crystal Module 24 Liquid Crystal Light Guide Plate 25 Electrode 27 Capacitor Microphone 28 Microphone Holder 29 Center Electrode 30 Donut-shaped Electrode 40 Holding Plate 42 Through Hole 43 Elastic cylinder 44 Elastic connector 46 Fine metal wire 47 Elastic elastomer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｒ 33/76 ５０５ Ｈ０１Ｒ 43/00 Ｈ 43/00 23/68 ３０３Ｅ Ｆターム(参考） 2G003 AA07 AG01 AG12 2G011 AA01 AA16 AB01 AB08 AC14 AE01 AE03 AF04 AF07 5E023 AA04 AA16 AA22 BB16 BB18 BB22 CC02 CC22 CC26 DD26 EE14 EE19 FF07 HH05 HH06 HH08 HH17 HH18 HH28 5E024 CA18 CA30 CB05 5E051 BA08 BB02 BB05 CA04 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01R 33/76 505 H01R 43/00 H 43/00 23/68 303E F-term (Reference) 2G003 AA07 AG01 AG12 2G011 AA01 AA16 AB01 AB08 AC14 AE01 AE03 AF04 AF07 5E023 AA04 AA16 AA22 BB16 BB18 BB22 CC02 CC22 CC26 DD26 EE14 EE19 FF07 HH05 HH06 HH08 HH17 HH18 HH28 5E024 CA18 CA30 CB05 5E051 BA05 BB04
Claims (2)
電気コネクタであって、 上記電子回路基板と上記電気接合物との間に介在する絶
縁性の保持プレートの複数の貫通孔に、絶縁性の弾性筒
を嵌め入れ、各弾性筒に略コイルスプリング状を呈した
導電性の弾性接続子を保持させ、各弾性接続子の両端部
を上記保持プレートの表裏両面からそれぞれ僅かに露出
させて上記電子回路基板の電極と上記電気接合物の電極
とに面接触させるようにしたことを特徴とする電気コネ
クタ。1. An electrical connector for electrically connecting an electronic circuit board and an electric joint, comprising: a plurality of through holes in an insulating holding plate interposed between the electronic circuit board and the electric joint; The elastic elastic cylinders are fitted, and each elastic cylinder holds a conductive elastic connector having a substantially coil spring shape. Both ends of each elastic connector are slightly exposed from the front and back surfaces of the holding plate. An electric connector characterized by being brought into surface contact with the electrode of the electronic circuit board and the electrode of the electrical joint.
電気コネクタの製造方法であって、 絶縁性の弾性エラストマーをレーザ加工して複数の弾性
筒を形成し、各弾性筒内に略コイルスプリング状で導電
性を有する弾性接続子を嵌め入れ、絶縁性の保持プレー
トの複数の貫通孔に該弾性筒を嵌めて該弾性接続子の両
端部を上記保持プレートの表裏両面からそれぞれ僅かに
露出させることを特徴とする電気コネクタの製造方法。2. A method of manufacturing an electrical connector for electrically connecting an electronic circuit board and an electrical joint, comprising: forming a plurality of elastic cylinders by laser processing an insulating elastic elastomer; A resilient connector having a spring-like conductivity is fitted, and the resilient cylinder is fitted into a plurality of through holes of an insulating holding plate, and both ends of the resilient connector are slightly exposed from both the front and back surfaces of the holding plate. A method of manufacturing an electrical connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000220907A JP2002042922A (en) | 2000-07-21 | 2000-07-21 | Electric connector and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000220907A JP2002042922A (en) | 2000-07-21 | 2000-07-21 | Electric connector and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002042922A true JP2002042922A (en) | 2002-02-08 |
Family
ID=18715426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000220907A Pending JP2002042922A (en) | 2000-07-21 | 2000-07-21 | Electric connector and its manufacturing method |
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| Country | Link |
|---|---|
| JP (1) | JP2002042922A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1566642A1 (en) * | 2004-02-23 | 2005-08-24 | Nihon Denshizairyo Kabushiki Kaisha | Probe card |
| JP2006088629A (en) * | 2004-09-27 | 2006-04-06 | Brother Ind Ltd | Inkjet head |
| JP2012204285A (en) * | 2011-03-28 | 2012-10-22 | Shin Etsu Polymer Co Ltd | Anisotropic conductive sheet and method of manufacturing anisotropic conductive sheet |
| CN102854343A (en) * | 2011-06-29 | 2013-01-02 | 台湾积体电路制造股份有限公司 | Test structures and testing methods for semiconductor devices |
| JP2015092503A (en) * | 2007-06-22 | 2015-05-14 | クウォリタウ・インコーポレーテッドＱｕａｌｉｔａｕ Ｉｎｃｏｒｐｏｒａｔｅｄ | High temperature ceramic socket configured to test packaged semiconductor device |
| CN104767057A (en) * | 2015-04-10 | 2015-07-08 | 张立 | Data connection head of two-sided labelling machine |
| KR101961281B1 (en) * | 2018-01-29 | 2019-07-18 | 주식회사 이노글로벌 | By-directional electrically conductive module |
| CN113168935A (en) * | 2018-11-21 | 2021-07-23 | 三井化学株式会社 | Anisotropic conductive sheet, anisotropic conductive composite sheet, anisotropic conductive sheet set, electrical inspection device, and electrical inspection method |
-
2000
- 2000-07-21 JP JP2000220907A patent/JP2002042922A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1566642A1 (en) * | 2004-02-23 | 2005-08-24 | Nihon Denshizairyo Kabushiki Kaisha | Probe card |
| JP2006088629A (en) * | 2004-09-27 | 2006-04-06 | Brother Ind Ltd | Inkjet head |
| JP2015092503A (en) * | 2007-06-22 | 2015-05-14 | クウォリタウ・インコーポレーテッドＱｕａｌｉｔａｕ Ｉｎｃｏｒｐｏｒａｔｅｄ | High temperature ceramic socket configured to test packaged semiconductor device |
| JP2012204285A (en) * | 2011-03-28 | 2012-10-22 | Shin Etsu Polymer Co Ltd | Anisotropic conductive sheet and method of manufacturing anisotropic conductive sheet |
| CN102854343A (en) * | 2011-06-29 | 2013-01-02 | 台湾积体电路制造股份有限公司 | Test structures and testing methods for semiconductor devices |
| US9891273B2 (en) | 2011-06-29 | 2018-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Test structures and testing methods for semiconductor devices |
| CN104767057A (en) * | 2015-04-10 | 2015-07-08 | 张立 | Data connection head of two-sided labelling machine |
| KR101961281B1 (en) * | 2018-01-29 | 2019-07-18 | 주식회사 이노글로벌 | By-directional electrically conductive module |
| WO2019146831A1 (en) * | 2018-01-29 | 2019-08-01 | 주식회사 이노글로벌 | Bidirectional conductive module |
| CN113168935A (en) * | 2018-11-21 | 2021-07-23 | 三井化学株式会社 | Anisotropic conductive sheet, anisotropic conductive composite sheet, anisotropic conductive sheet set, electrical inspection device, and electrical inspection method |
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