JP2002013979A - Assembling method for light shielding plate in on-vehicle light detector - Google Patents

Assembling method for light shielding plate in on-vehicle light detector

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Publication number
JP2002013979A
JP2002013979A JP2000198627A JP2000198627A JP2002013979A JP 2002013979 A JP2002013979 A JP 2002013979A JP 2000198627 A JP2000198627 A JP 2000198627A JP 2000198627 A JP2000198627 A JP 2000198627A JP 2002013979 A JP2002013979 A JP 2002013979A
Authority
JP
Japan
Prior art keywords
light
shielding plate
receiving element
light receiving
light shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000198627A
Other languages
Japanese (ja)
Inventor
Norihiro Katayama
片山　　典浩
Michitaka Hayashi
道孝 林
Kazuyoshi Sumiya
和好 角谷
Takeshi Tsukamoto
武 塚本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2000198627A priority Critical patent/JP2002013979A/en
Publication of JP2002013979A publication Critical patent/JP2002013979A/en
Pending legal-status Critical Current

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Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Photovoltaic Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Air-Conditioning For Vehicles (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an assembling method for a light shielding plate in an on-vehicle light detector capable of assembling the light shielding plate while securing a relative position accuracy of the light shielding plate and a light receiving element. SOLUTION: The light receiving element 3 is arranged on an upper face of a housing 2. The light shielding plate 5 having a through-hole 22 is arranged above the light receiving element 3. In a state of the light receiving element 3 fixed to the housing 2, the light shielding plate 5 is adhered and assembled in a desired position of the housing 2 while performing image recognition of a position of the light receiving element 3 on the basis of a position of a light receiving area 11 inside the element 3 by using a CCD camera and performing image recognition of a position of the through hole 22 of the light shielding plate 5 or an outline shape of the light shielding plate 5 for maintaining a relative position between the light shielding plate 5 and the light receiving element 3.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は車載用光検出器に
おける遮光板の組付け方法に関するものであり、車載用
光検出器は、例えば、車両空調システム等に使用される
日射センサとして用いることができるものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for assembling a light-shielding plate in an on-vehicle photodetector. The on-vehicle photodetector can be used, for example, as a solar radiation sensor used in a vehicle air conditioning system or the like. You can do it.

【０００２】[0002]

【従来の技術】車両空調システムにおいて、近年、左右
独立空調のニーズが高まっている。このシステムにおい
ては、左右各々の日射量を検出するセンサは重要な構成
部品の一つである。2. Description of the Related Art In recent years, there has been a growing need for left and right independent air conditioning in vehicle air conditioning systems. In this system, a sensor that detects the amount of solar radiation on each of the right and left is one of the important components.

【０００３】従来技術として、特開平７−４３１４５号
公報には、受光素子上に配置された透明基板の上に遮光
膜を形成することにより、受光素子と遮光膜の位置関係
を利用して左右の日射量を検出する日射センサ構造が提
案されている。詳しくは、図１６に示すように、受光素
子１０１，１０２の上に透明基板１０３が配置され、そ
の透明基板１０３の上面に黒色エポキシ樹脂製の遮光膜
１０４が形成され、遮光膜１０４の中央部に光導入孔１
０５が形成されている。そして、中心線にて左右対称に
分割された受光素子１０１，１０２にて方位（右・左）
毎の日射量（強度）を検出する。しかし、この構造では
透明基板などの介在物が必要であり、センサ構造が複雑
になり、コストが高くなりやすい。[0003] As a prior art, Japanese Patent Application Laid-Open No. 7-43145 discloses that a light-shielding film is formed on a transparent substrate disposed on a light-receiving element, so that the right-and-left direction is obtained by utilizing the positional relationship between the light-receiving element and the light-shielding film. There has been proposed a solar radiation sensor structure for detecting the amount of solar radiation. Specifically, as shown in FIG. 16, a transparent substrate 103 is disposed on the light receiving elements 101 and 102, and a light shielding film 104 made of black epoxy resin is formed on the upper surface of the transparent substrate 103. Light introduction hole 1
05 is formed. Then, the azimuths (right and left) of the light receiving elements 101 and 102 which are symmetrically divided at the center line.
The amount of solar radiation (intensity) is detected for each. However, this structure requires inclusions such as a transparent substrate, and the sensor structure is complicated, and the cost is likely to be high.

【０００４】これに対し、特開平１１−３３７４０５号
公報においては、透明基板などの介在物を廃止し、遮光
膜を遮光板に代えた簡素な構造が提案されている。しか
し、その組付方法までは提示されていない。On the other hand, Japanese Patent Application Laid-Open No. 11-337405 proposes a simple structure in which inclusions such as a transparent substrate are eliminated and a light shielding film is replaced with a light shielding plate. However, the method of assembling is not presented.

【０００５】[0005]

【発明が解決しようとする課題】本発明はこのような背
景の下になされたものであり、その目的は、遮光板と受
光素子の相対位置精度を確保しつつ遮光板を取付けるこ
とができる車載用光検出器における遮光板の組付け方法
を提供することにある。SUMMARY OF THE INVENTION The present invention has been made under such a background, and an object of the present invention is to provide a light-shielding plate which can be mounted on a light-shielding plate while ensuring relative positional accuracy between the light-shielding plate and the light receiving element. An object of the present invention is to provide a method for assembling a light-shielding plate in a photodetector for use.

【０００６】[0006]

【課題を解決するための手段】請求項１に記載の発明に
よれば、ハウジングに受光素子を固定した状態から、撮
像装置を用いて受光素子の位置が画像認識されるととも
に遮光板の透孔の位置または遮光板の外形形状が画像認
識されつつ、遮光板と受光素子の相対位置を保ちながら
遮光板がハウジングの所望の位置に組付けられる。よっ
て、遮光板と受光素子の相対位置精度を確保しつつ遮光
板を取付けることができる。According to the first aspect of the present invention, the position of the light receiving element is image-recognized using the image pickup device from the state where the light receiving element is fixed to the housing, and the through hole of the light shielding plate is provided. The light-shielding plate is attached to a desired position of the housing while maintaining the relative position between the light-shielding plate and the light receiving element while the position of the light-shielding plate or the outer shape of the light-shielding plate is image-recognized. Therefore, the light-shielding plate can be attached while ensuring the relative positional accuracy between the light-shielding plate and the light receiving element.

【０００７】また、請求項２に記載のように、受光素子
の位置の画像認識は、素子内の受光領域の位置を画像認
識することにより行うようにすると、実用上好ましいも
のになる。It is practically preferable that the image recognition of the position of the light receiving element is performed by image recognition of the position of the light receiving region in the element.

【０００８】また、請求項３に記載の発明によれば、遮
光板はハウジングの上面に接着することによりハウジン
グに固定される。請求項４に記載のように、遮光板の透
孔の位置の画像認識に加えて、遮光板に設けたマークを
画像認識して平面内の位置を決定するようにすると、実
用上好ましいものとなる。According to the third aspect of the present invention, the light shielding plate is fixed to the housing by bonding to the upper surface of the housing. As described in claim 4, in addition to the image recognition of the position of the through hole of the light shielding plate, it is practically preferable to determine the position in the plane by image recognition of the mark provided on the light shielding plate. Become.

【０００９】[0009]

【発明の実施の形態】以下、この発明を具体化した実施
の形態を図面に従って説明する。本実施の形態における
車載用光検出器（光量検出センサ）は、カーエアコンに
おけるオートエアコンシステムに用いられる。このオー
トエアコンシステムは、乗用車の前席での左右の乗員に
独立に温度制御でき、乗員が車室内の温度を希望の温度
に設定すると、左右独立温度制御を行い空調システムの
吹出し温度や風量などを自動調節することにより日射の
当たる側の温度を下げて日射の強さによる影響を自動補
正し、車室内温度を常に一定に保つようになっている。Embodiments of the present invention will be described below with reference to the drawings. The on-vehicle photodetector (light amount detection sensor) in the present embodiment is used for an auto air conditioner system in a car air conditioner. This auto air-conditioning system can control the temperature independently for the left and right occupants in the front seat of the passenger car, and when the occupant sets the temperature in the cabin to the desired temperature, the left and right independent temperature control is performed and the air-conditioning system's blowing temperature and air volume etc. By automatically adjusting the temperature, the temperature on the side of the solar radiation is lowered to automatically correct the influence of the intensity of the solar radiation, so that the vehicle interior temperature is always kept constant.

【００１０】図１には、本実施の形態における車載用光
検出器の平面図を示す。図２には、図１のＡ−Ａ断面図
を示す。また、図３には、図１のＢ−Ｂ断面図を示す。
ただし、図１は、図２，３に示す光学レンズ（フィル
タ）４と遮光板５を取外した状態での平面図である。図
１において遮光板５の配置位置を二点鎖線にて示す。FIG. 1 is a plan view of an on-vehicle photodetector according to the present embodiment. FIG. 2 is a sectional view taken along line AA of FIG. FIG. 3 is a sectional view taken along line BB of FIG.
1. However, FIG. 1 is a plan view with the optical lens (filter) 4 and the light shielding plate 5 shown in FIGS. In FIG. 1, the position of the light shielding plate 5 is indicated by a two-dot chain line.

【００１１】図２において、車載用光検出器１は、コネ
クタを兼ねるハウジング２と、受光素子（センサチッ
プ）３と、光学レンズ４と、遮光板（スリット板）５
と、ターミナル６とを備えている。ハウジング２は、ケ
ース７とホルダ８から構成され、両部材７，８は共に合
成樹脂よりなる。ケース７は、円筒状をなし、立設した
状態で使用される。また、ホルダ８は、ケース７内の上
部に嵌入されている。ここで、ハウジング２がケース７
とホルダ８にて構成されていることから、ケース７を共
通部材とし、ホルダ８（受光素子実装部とコネクタ部）
を光検出器の仕様毎に変えて用いることができる。In FIG. 2, an on-vehicle photodetector 1 includes a housing 2 also serving as a connector, a light receiving element (sensor chip) 3, an optical lens 4, and a light shielding plate (slit plate) 5.
And a terminal 6. The housing 2 is composed of a case 7 and a holder 8, and both members 7, 8 are made of synthetic resin. The case 7 has a cylindrical shape and is used in an upright state. The holder 8 is fitted into the upper part of the case 7. Here, the housing 2 is the case 7
And the holder 8, the case 7 is used as a common member, and the holder 8 (light receiving element mounting portion and connector portion) is used.
Can be changed for each specification of the photodetector.

【００１２】図２に示すように、ケース７の外周面には
取付け爪９が設けられており、車載用光検出器１が自動
車のダッシュパネル１０の取付け孔１０ａに対し図２
中、Ｘ方向に挿入され、取付け爪９の外方への付勢力に
より本光検出器１がダッシュパネル１０に取付けられ
る。As shown in FIG. 2, a mounting claw 9 is provided on the outer peripheral surface of the case 7, and the on-vehicle photodetector 1 is attached to a mounting hole 10a of a dash panel 10 of the vehicle as shown in FIG.
The photodetector 1 is attached to the dash panel 10 by being inserted in the middle and X directions, and the urging force of the attachment claws 9 outward.

【００１３】ホルダ８の上面中央部には受光素子（セン
サチップ）３が配置されている。また、ホルダ８には検
出信号を外部に出力するための外部出力端子としてのタ
ーミナル６がインサート成形され、ホルダ８の中にター
ミナル６を埋設した構造となっている。ターミナル６の
一端がホルダ８の上面に露出し、ターミナル６の他端が
ホルダ８の下面から突出している。A light receiving element (sensor chip) 3 is arranged at the center of the upper surface of the holder 8. A terminal 6 as an external output terminal for outputting a detection signal to the outside is insert-molded in the holder 8, and the terminal 6 is embedded in the holder 8. One end of the terminal 6 is exposed on the upper surface of the holder 8, and the other end of the terminal 6 projects from the lower surface of the holder 8.

【００１４】図１（図４参照）において、四角形状の受
光素子（センサチップ）３には、方位角が「０」の基準
となる軸Ｌcentの左側に右検出用フォトダイオードＤR
が、右側に左検出用フォトダイオードＤL が配置される
とともに、基準となる軸Ｌcentの上に、中央検出用フォ
トダイオードＤC1及びＤC2が配置されている。フォトダ
イオードＤR ，ＤL ，ＤC1, ＤC2は入射する光の量（日
射強度）に応じた信号をそれぞれ出力する。In FIG. 1 (see FIG. 4), a square-shaped light receiving element (sensor chip) 3 has a right detecting photodiode DR on the left side of an axis Lcent with an azimuth of "0".
However, a left detecting photodiode DL is disposed on the right side, and center detecting photodiodes DC1 and DC2 are disposed on a reference axis Lcent. The photodiodes DR, DL, DC1, and DC2 output signals corresponding to the amount of incident light (insolation intensity).

【００１５】受光素子（センサチップ）３の詳細を図
４，５を用いて説明する。受光素子３はフォトダイオー
ドＤR ，ＤL ，ＤC1, ＤC2に加えて信号処理回路を具備
した光ＩＣである。受光素子３は、素子３の中心に位置
する円形の受光領域１１と、該領域１１の周りの円弧状
の受光領域１２，１３，１４を有している。各領域１１
〜１４は電気的に絶縁されている。より詳しくは、図５
に示すように、ｎ型シリコン基板１５の表層部におい
て、ｐ型領域１１，１２，１３，１４が形成されてい
る。また、ｎ型シリコン基板１５の裏面にはカソード電
極１６が形成されるとともに、基板１５の表面側におい
てｐ型領域１１，１２，１３，１４にはアノード電極１
７，１８，１９，２０が設けられている。このように、
ｐ型領域１２にてフォトダイオードＤR が、ｐ型領域１
３にてフォトダイオードＤL が、ｐ型領域１４，１１に
てフォトダイオードＤC1, ＤC2が形成され、図４の各領
域１１〜１４に光が当たるとそれぞれ受光量（日射強
度）に応じた電気信号（光電流）が取出される。The details of the light receiving element (sensor chip) 3 will be described with reference to FIGS. The light receiving element 3 is an optical IC having a signal processing circuit in addition to the photodiodes DR, DL, DC1, and DC2. The light receiving element 3 has a circular light receiving area 11 located at the center of the element 3, and circular light receiving areas 12, 13, 14 around the area 11. Each area 11
To 14 are electrically insulated. More specifically, FIG.
As shown in the figure, p-type regions 11, 12, 13, and 14 are formed in the surface layer of the n-type silicon substrate 15. A cathode electrode 16 is formed on the back surface of the n-type silicon substrate 15, and the anode electrode 1 is formed on the p-type regions 11, 12, 13, 14 on the front surface side of the substrate 15.
7, 18, 19, and 20 are provided. in this way,
In the p-type region 12, the photodiode DR becomes the p-type region 1
The photodiodes DL are formed at 3 and the photodiodes DC1 and DC2 are formed at the p-type regions 14 and 11. When light strikes each of the regions 11 to 14 in FIG. 4, an electric signal corresponding to the amount of received light (intensity of solar radiation) is obtained. (Photocurrent) is taken out.

【００１６】ここで、受光領域１１〜１４は受光効率を
向上させるためにその表面は黒色となっており、受光領
域１１は受光素子３の中心を認識するためのマークとし
ても機能する。Here, the light receiving regions 11 to 14 have a black surface in order to improve the light receiving efficiency, and the light receiving region 11 also functions as a mark for recognizing the center of the light receiving element 3.

【００１７】なお、図４において、素子３内での受光領
域１１〜１４でない場所（例えば、受光領域１２，１
３，１４の外周側）に信号処理回路が形成されている。
図１に示すように、受光素子（センサチップ）３はター
ミナル６とボンディングワイヤー２１にて電気的に接続
されている。In FIG. 4, a place other than the light receiving areas 11 to 14 in the element 3 (for example, the light receiving areas 12, 1)
Signal processing circuits are formed on the outer peripheral sides of 3, 14).
As shown in FIG. 1, the light receiving element (sensor chip) 3 is electrically connected to the terminal 6 by a bonding wire 21.

【００１８】図２において、受光素子（センサチップ）
３の上方において、ホルダ８の上面には遮光板５が受光
素子３を覆うように支持されている。図６にはホルダ８
の正面図を示すとともに、このホルダ８の上面に配置さ
れる遮光板５の詳細を図７に示す。In FIG. 2, a light receiving element (sensor chip)
Above 3, a light blocking plate 5 is supported on the upper surface of the holder 8 so as to cover the light receiving element 3. FIG. 6 shows the holder 8
7 is shown in FIG. 7, and details of the light shielding plate 5 arranged on the upper surface of the holder 8 are shown in FIG.

【００１９】図７において、遮光板５は遮光材料よりな
る。本例では遮光板５は樹脂製であるが、他の材料、例
えば金属製であってもよい。遮光板５はその中央部に上
下に貫通する透孔（スリット）２２が形成され、透孔２
２は円形をなしている。また、遮光板５には透孔２２を
挟んだ両側に穴２３ａ，２３ｂが形成されている。この
穴２３ａ，２３ｂは遮光板５の位置（向き）を認識する
ためのマークとして機能する。図１，２に示すように、
遮光板５は、透孔２２の中心が受光素子（センサチッ
プ）３の中心と一致する状態で取付けられている。In FIG. 7, the light shielding plate 5 is made of a light shielding material. In this example, the light shielding plate 5 is made of resin, but may be made of another material, for example, metal. The light-shielding plate 5 has a through-hole (slit) 22 formed vertically in the center thereof.
2 is circular. Holes 23a and 23b are formed in the light shielding plate 5 on both sides of the through hole 22. The holes 23a and 23b function as marks for recognizing the position (direction) of the light shielding plate 5. As shown in FIGS.
The light shielding plate 5 is mounted such that the center of the through hole 22 matches the center of the light receiving element (sensor chip) 3.

【００２０】ここで、ホルダ８について詳しく説明す
る。図２，６に示すように、ホルダ８は水平方向に広が
るプレート部２４を有し、プレート部２４の上面中央に
受光素子（センサチップ）３が接着されている。また、
プレート部２４の上面での外周部には側壁部２５が立設
されている。この側壁部２５は受光素子３の配置領域の
周りに環状に形成されている。この側壁部２５の内方に
おいて防湿剤（ポッテング剤）２６が充填され、防湿剤
２６にて受光素子３およびワイヤー２１が覆われてい
る。さらに、側壁部２５の上面において図１に示すよう
に遮光板搭載部２７ａ，２７ｂが形成されている。各遮
光板搭載部２７ａ，２７ｂは平面形状として長方形をな
し、両遮光板搭載部２７ａ，２７ｂは受光素子３を挟ん
だ両側に位置している。さらに、図６に示すように、遮
光板搭載部２７ａ，２７ｂの高さは側壁部２５の上面よ
りも高くなっている。そして、遮光板搭載部２７ａ，２
７ｂの上面において接着剤２８（図３参照）により遮光
板５が接着されている。Here, the holder 8 will be described in detail. As shown in FIGS. 2 and 6, the holder 8 has a plate portion 24 extending in the horizontal direction, and the light receiving element (sensor chip) 3 is bonded to the center of the upper surface of the plate portion 24. Also,
A side wall portion 25 is provided upright on an outer peripheral portion of the upper surface of the plate portion 24. The side wall 25 is formed in an annular shape around the area where the light receiving element 3 is arranged. A moisture-proofing agent (potting agent) 26 is filled inside the side wall 25, and the light-receiving element 3 and the wire 21 are covered with the moisture-proofing agent 26. Further, as shown in FIG. 1, light shielding plate mounting portions 27a and 27b are formed on the upper surface of the side wall portion 25. Each of the light-shielding plate mounting portions 27a and 27b has a rectangular shape in plan view, and both light-shielding plate mounting portions 27a and 27b are located on both sides of the light receiving element 3. Further, as shown in FIG. 6, the height of the light shielding plate mounting portions 27a and 27b is higher than the upper surface of the side wall portion 25. Then, the light shielding plate mounting portions 27a, 2
The light shielding plate 5 is adhered to the upper surface of 7b with an adhesive 28 (see FIG. 3).

【００２１】ここで、図１６の透明基板１０３による高
さＨ２に代わるものとして、本実施形態においては、図
２の高さＨ１の遮光板搭載部２７ａ，２７ｂが設けら
れ、その上に遮光板５が組付けられている。このよう
に、ハウジング２の中で最も高い遮光板搭載部２７ａ，
２７ｂにおいて遮光板５が接着されるので、遮光板５が
ハウジング２と干渉することが防止される。Here, as an alternative to the height H2 of the transparent substrate 103 of FIG. 16, in the present embodiment, the light shielding plate mounting portions 27a and 27b of the height H1 of FIG. 5 is assembled. As described above, the highest light-shielding plate mounting portion 27a,
Since the light shielding plate 5 is bonded at 27b, the light shielding plate 5 is prevented from interfering with the housing 2.

【００２２】また、図１に示すように、ホルダ８の上面
には３つの穴８ａ，８ｂ，８ｃが形成され、この穴８
ａ，８ｂ，８ｃはホルダ８（ハウジング２）の中心を認
識するためのマークとして機能する。As shown in FIG. 1, three holes 8a, 8b and 8c are formed on the upper surface of the holder 8, and these holes 8a, 8b and 8c are formed.
a, 8b and 8c function as marks for recognizing the center of the holder 8 (housing 2).

【００２３】図２において、光学レンズ４は着色ガラス
や樹脂（半透明材）よりなり、お碗型をなしている。こ
の光学レンズ４がホルダ８の外周面に嵌入され、受光素
子（センサチップ）３の上方においてハウジング２に支
持されている。さらに、光学レンズ４の内周面（下面）
の中央部には凹部２９が形成され、この凹部２９により
光学レンズ４がレンズ機能を持つことになる。なお、光
学レンズ４にレンズ機能を持たせるために凹レンズの他
にもプリズムの集合体レンズ（フレネルレンズ）等を用
いてもよい。In FIG. 2, the optical lens 4 is made of colored glass or resin (translucent material) and has a bowl shape. The optical lens 4 is fitted on the outer peripheral surface of the holder 8, and is supported by the housing 2 above the light receiving element (sensor chip) 3. Further, the inner peripheral surface (lower surface) of the optical lens 4
A concave portion 29 is formed in the central portion of the optical lens 4, and the concave portion 29 allows the optical lens 4 to have a lens function. In addition, in order to give the optical lens 4 a lens function, an aggregate lens of prisms (Fresnel lens) or the like may be used in addition to the concave lens.

【００２４】そして、図２の光学レンズ４の表面側に照
射された光は光学レンズ４を通過し、遮光板５に照射さ
れる。さらに、遮光板５の透孔２２を通過した光は受光
素子（センサチップ）３のフォトダイオードＤR ，ＤL
，ＤC1, ＤC2（図４参照）に照射される。つまり、光
検出器の表面（光学レンズ４）に照射された光は、レン
ズ材の屈折率と形状により光路変更されレンズ４内を進
み、受光素子３に向かって出射され、遮光板５の透孔２
２を通して受光素子３に至る。この光照射によりフォト
ダイオードＤR ，ＤL ，ＤC1, ＤC2から信号が出力され
る。ここで、真上からの光による受光素子３上での光照
射領域に対し、左側からの光は受光素子３上での光照射
領域が右側となり、また、右側からの光は受光素子３上
での光照射領域が左側となる。The light irradiated on the surface of the optical lens 4 in FIG. 2 passes through the optical lens 4 and is irradiated on the light shielding plate 5. Further, the light passing through the through hole 22 of the light shielding plate 5 receives the photodiodes DR and DL of the light receiving element (sensor chip) 3.
, DC1, DC2 (see FIG. 4). That is, the light applied to the surface of the photodetector (the optical lens 4) changes its optical path according to the refractive index and shape of the lens material, travels through the lens 4, is emitted toward the light receiving element 3, and is transmitted through the light shielding plate 5. Hole 2
2 to the light receiving element 3. By this light irradiation, signals are output from the photodiodes DR, DL, DC1, and DC2. Here, with respect to the light irradiation area on the light receiving element 3 by the light from right above, the light from the left is the light irradiation area on the light receiving element 3 on the right side, and the light from the right is on the light receiving element 3 Is the light irradiation area on the left side.

【００２５】なお、図１に示すように、各ターミナル６
の間には保護素子（コンデンサ）３０が配置され、ター
ミナル６から高電圧が印加されると、同保護素子３０を
通してグランド側に逃がすようになっている。Note that, as shown in FIG.
Between them, a protection element (capacitor) 30 is disposed, and when a high voltage is applied from the terminal 6, the protection element (capacitor) 30 is released to the ground side through the protection element 30.

【００２６】図８には、オートエアコンシステムの電気
的構成図を示す。４つのフォトダイオードＤR ，ＤL ，
ＤC1, ＤC2に対し信号処理回路３１が接続されている。
信号処理回路３１において、左検出用フォトダイオード
ＤL の出力電流と中央検出用フォトダイオードＤC1, Ｄ
C2の出力電流の１／２値とが加算されて左受光信号の出
力電流（＝ＩL ＋１／２・ＩC1＋１／２・ＩC2）として
抵抗３２（抵抗値；Ｒ）により電流−電圧変換されてマ
イコン３３に送られる。また、右検出用フォトダイオー
ドＤR の出力電流と中央検出用フォトダイオードＤC1,
ＤC2の出力電流の１／２値とが加算されて右受光信号の
出力電流（＝ＩR ＋１／２・ＩC1＋１／２・ＩC2）とし
て抵抗３２（抵抗値；Ｒ）により電流−電圧変換されて
マイコン３３に送られる。つまり、左検出用フォトダイ
オードＤL の出力と感度を下げた中央検出用フォトダイ
オードＤC1, ＤC2の出力により左受光信号Ｖ１が得ら
れ、右検出用フォトダイオードＤR の出力と感度を下げ
た中央検出用フォトダイオードＤC1, ＤC2の出力により
右受光信号Ｖ２が得られる。この両信号Ｖ１，Ｖ２によ
り、日射の強さと日射が当たっている側（運転席あるい
は助手席）が分かる。具体的には、日射量が出力の総和
（＝Ｖ１＋Ｖ２）にて、方位が出力比（＝Ｖ１／（Ｖ１
＋Ｖ２）またはＶ２／（Ｖ１＋Ｖ２））にて検出でき
る。FIG. 8 shows an electrical configuration diagram of the automatic air conditioner system. Four photodiodes DR, DL,
A signal processing circuit 31 is connected to DC1 and DC2.
In the signal processing circuit 31, the output current of the left detection photodiode DL and the center detection photodiodes DC1, D
The half value of the output current of C2 is added, and the output current of the left light receiving signal (= IL + 1 / 2.IC1 + 1 / 2.IC2) is converted from current to voltage by the resistor 32 (resistance value; R) to the microcomputer. 33. The output current of the right detection photodiode DR and the center detection photodiode DC1,
A half value of the output current of DC2 is added, and the output current of the right light receiving signal (= IR + 1 / 2.IC1 + 1 / 2.IC2) is subjected to current-voltage conversion by the resistor 32 (resistance value; R). 33. In other words, the output of the left detection photodiode DL and the output of the center detection photodiodes DC1 and DC2 with reduced sensitivity provide the left light receiving signal V1, and the output of the right detection photodiode DR and the center detection with reduced sensitivity. The right light receiving signal V2 is obtained from the outputs of the photodiodes DC1 and DC2. From these two signals V1 and V2, the intensity of solar radiation and the side on which the solar radiation is applied (driver's seat or passenger seat) can be known. Specifically, the insolation is the sum of the outputs (= V1 + V2), and the azimuth is the output ratio (= V1 / (V1
+ V2) or V2 / (V1 + V2)).

【００２７】マイコン３３にはエアコンユニット３４が
接続され、エアコンユニット３４はブロワ、クーラ、ヒ
ータ等を含むものであり、車両のインパネ内に搭載され
ている。マイコン３３は前述の２つの信号Ｖ１，Ｖ２に
基づいて日射量と方位（左右）を検出して、左右の光強
度からエアコンユニット３４を制御して日射の当たる側
（運転席あるいは助手席）の吹出し風量を増やし、温度
を下げる。このようにして、カーエアコンの左右独立空
調が行われる。An air conditioner unit 34 is connected to the microcomputer 33. The air conditioner unit 34 includes a blower, a cooler, a heater, and the like, and is mounted in an instrument panel of the vehicle. The microcomputer 33 detects the amount of solar radiation and the azimuth (left and right) based on the two signals V1 and V2 described above, controls the air conditioner unit 34 from the left and right light intensities, and controls the air conditioner unit 34 on the side that receives the solar radiation (driver's seat or passenger seat). Increase the blowing air volume and lower the temperature. In this way, left and right independent air conditioning of the car air conditioner is performed.

【００２８】次に、車載用光検出器１の組付け工程、特
に、遮光板５の組付け工程を主に説明する。今、車載用
光検出器１を構成する部品である、ケース７とホルダ８
と受光素子（センサチップ）３と光学レンズ４と遮光板
５とが別々に用意されている。つまり、光検出器の組立
てラインにおいて、トレイに各部品がセットされてい
る。ただし、ホルダ８においてターミナル６はインサー
ト成形にて埋設済みである。また、この組立てラインに
おいて、ロボットアーム等の把持・搬送手段が備えられ
ており、これを使って受光素子３や遮光板５等を把持お
よび搬送することができるようになっている。ロボット
アーム等の把持・搬送手段はコンピュータの指示にて作
動する。このコンピュータはＣＣＤカメラからの撮像信
号を入力して画像処理を行い、把持・搬送手段に作業指
示を与えるようになっている。Next, the process of assembling the on-vehicle photodetector 1, particularly the process of assembling the light shielding plate 5, will be mainly described. Now, a case 7 and a holder 8, which are components constituting the on-vehicle photodetector 1, are described.
, A light receiving element (sensor chip) 3, an optical lens 4, and a light shielding plate 5 are separately prepared. That is, each component is set on the tray in the assembly line of the photodetector. However, the terminal 6 in the holder 8 has been embedded by insert molding. Further, in this assembly line, a gripping / transporting means such as a robot arm is provided, and the light receiving element 3, the light shielding plate 5, and the like can be gripped and transported using the gripping / transporting means. A gripping / transporting means such as a robot arm operates according to instructions from a computer. The computer receives image signals from a CCD camera, performs image processing, and gives work instructions to the gripping / transporting means.

【００２９】このような設備を用いて、以下の組立て作
業が行われる。まず、受光素子３のマウントを行う。こ
の際、図９に示すように、ホルダ８の受光素子搭載部に
接着剤（図示略）を適量塗布しておき、このホルダ８を
ＣＣＤカメラ４０により撮像して、その中心位置を画像
認識する。具体的にはホルダ８の上面の穴８ａ，８ｂ，
８ｃ（図１参照）から中心を認識する。The following assembling work is performed using such equipment. First, the light receiving element 3 is mounted. At this time, as shown in FIG. 9, an appropriate amount of adhesive (not shown) is applied to the light receiving element mounting portion of the holder 8, and the holder 8 is imaged by the CCD camera 40 to recognize the center position thereof. . Specifically, holes 8a, 8b,
8c (see FIG. 1) to recognize the center.

【００３０】一方、図１０に示すように、受光素子３を
裏面（表層部にｐｎ接合を形成した面とは反対の面）か
らＣＣＤカメラ４１により撮像して、受光素子３の外形
形状から受光素子３の中心位置を画像認識する。そし
て、図１１に示すように、受光素子３を把持・搬送して
ホルダ８の中心と受光素子３の中心を合わせた状態で、
ホルダ８の上面の所定の位置に受光素子３を載置する。
そして、接着剤を硬化することにより受光素子３を固定
する。On the other hand, as shown in FIG. 10, the light receiving element 3 is imaged by the CCD camera 41 from the back surface (opposite to the surface where the pn junction is formed on the surface layer), and the light is received from the outer shape of the light receiving element 3. The center position of the element 3 is image-recognized. Then, as shown in FIG. 11, in a state where the center of the holder 8 and the center of the light receiving element 3 are aligned by gripping and transporting the light receiving element 3,
The light receiving element 3 is placed at a predetermined position on the upper surface of the holder 8.
Then, the light receiving element 3 is fixed by curing the adhesive.

【００３１】引き続き、図１の保護素子３０を接着剤に
て接着する。その後、ターミナル６と、受光素子３の電
気信号取出し用パッドとの間を、ボンディングワイヤー
２１で電気接続する。さらに、受光素子３およびワイヤ
ー２１を覆うように、防湿剤２６を適量塗布して硬化す
る。Subsequently, the protection element 30 shown in FIG. 1 is bonded with an adhesive. After that, the terminal 6 and the electric signal extracting pad of the light receiving element 3 are electrically connected by the bonding wire 21. Further, an appropriate amount of a moisture proofing agent 26 is applied and cured so as to cover the light receiving element 3 and the wire 21.

【００３２】続いて、遮光板５の組付けを行う。この
際、図１２に示すように、ホルダ８の遮光板搭載部２７
ａ，２７ｂに接着剤２８を適量塗布する。図１２におい
てハッチングを付した領域が接着剤２８の塗布領域であ
る。そして、図１３に示すように、このホルダ８に固定
された受光素子３をＣＣＤカメラ４２により撮像して、
その中心位置を画像認識する。詳しくは、受光素子３の
適当な位置合せマークとして、受光素子３の円形の受光
領域１１（図１参照）を用いる。この円形の受光領域１
１（円形パターン）の外周を認識して中心位置を割り出
す。Subsequently, the light shielding plate 5 is assembled. At this time, as shown in FIG.
An appropriate amount of adhesive 28 is applied to a and 27b. In FIG. 12, the hatched area is the area where the adhesive 28 is applied. Then, as shown in FIG. 13, the light receiving element 3 fixed to the holder 8 is imaged by the CCD camera 42,
The center position is image-recognized. Specifically, a circular light receiving area 11 (see FIG. 1) of the light receiving element 3 is used as an appropriate alignment mark of the light receiving element 3. This circular light receiving area 1
The center position is determined by recognizing the outer periphery of 1 (circular pattern).

【００３３】一方、図１４に示すように、遮光板５をＣ
ＣＤカメラ４３により撮像して、遮光板５の透孔２２の
中心位置を画像認識するとともに、マーク用穴２３ａ，
２３ｂ（図７参照）を画像認識する。そして、図１５に
示すように、遮光板５を把持・搬送して受光素子３の円
形の受光領域１１（円形パターン）の中心と遮光板５の
透孔２２の中心を合わせた状態で、ホルダ８の遮光板搭
載部２７ａ，２７ｂの上に遮光板５を載置する。この
際、高さ方向の位置合わせに関して、ハウジング２の遮
光板搭載部２７ａ，２７ｂの高さＨ１（図２参照）で一
義的に決まる。そして、接着剤２８を硬化することによ
り遮光板５がホルダ８の遮光板搭載部２７ａ，２７ｂの
上に接着され（固定され）、ホルダ８（ハウジング２）
に組付けられる。On the other hand, as shown in FIG.
An image is taken by the CD camera 43 to recognize the image of the center position of the through hole 22 of the light shielding plate 5 and to form the mark holes 23a,
23b (see FIG. 7) is image-recognized. Then, as shown in FIG. 15, the light-shielding plate 5 is gripped and conveyed so that the center of the circular light-receiving region 11 (circular pattern) of the light-receiving element 3 and the center of the through hole 22 of the light-shielding plate 5 are aligned. The light-shielding plate 5 is placed on the light-shielding plate mounting portions 27a and 27b of No. 8. At this time, the positioning in the height direction is uniquely determined by the height H1 (see FIG. 2) of the light-shielding plate mounting portions 27a and 27b of the housing 2. Then, by hardening the adhesive 28, the light shielding plate 5 is bonded (fixed) onto the light shielding plate mounting portions 27a and 27b of the holder 8, and the holder 8 (housing 2).
Assembled in

【００３４】このように、遮光板５の取付けの際の平面
内の位置の決定に関して、遮光板５の透孔２２と二つの
マーク用穴２３ａ，２３ｂを認識することにより、遮光
板５の位置決めが容易となり、受光素子３の中心に対し
前後左右のズレが少なく受光素子３と遮光板５の透孔２
２の位置合わせ精度が高い。As described above, the position of the light shielding plate 5 is determined by recognizing the through hole 22 and the two mark holes 23a and 23b in determining the position in the plane when the light shielding plate 5 is mounted. And the deviation of the front, rear, left and right with respect to the center of the light receiving element 3 is small,
2. Positioning accuracy is high.

【００３５】これを詳しく説明する。本例では、遮光板
５と受光素子３の相対位置を保ちながら遮光板５をハウ
ジング２の所望の位置に組付けており、ハウジング２に
受光素子３を固定した状態で遮光板５とハウジング２の
相対位置を保ちながら遮光板５をハウジング２の所望の
位置に組付ける場合（比較例）に比べ取付け精度がよ
い。つまり、比較例の場合にはハウジング２に受光素子
３を取付けるときの取付け誤差Δ１とハウジング２に遮
光板５を取付けるときの取付け誤差Δ２との和（＝Δ１
＋Δ２）が遮光板５と受光素子３とのトータルの取付け
誤差となるのに対し、本実施形態では、遮光板５と受光
素子３との取付け誤差Δ３のみであり、高い取付け精度
を確保することができる。This will be described in detail. In this example, the light-shielding plate 5 is assembled at a desired position of the housing 2 while maintaining the relative position of the light-shielding plate 5 and the light-receiving element 3. The mounting accuracy is better than the case where the light shielding plate 5 is assembled at a desired position of the housing 2 while maintaining the relative position (comparative example). That is, in the case of the comparative example, the sum (= Δ1) of the mounting error Δ1 when mounting the light receiving element 3 on the housing 2 and the mounting error Δ2 when mounting the light shielding plate 5 on the housing 2.
+ Δ2) is the total mounting error between the light-shielding plate 5 and the light-receiving element 3, whereas in the present embodiment, only the mounting error Δ3 between the light-shielding plate 5 and the light-receiving element 3 ensures high mounting accuracy. Can be.

【００３６】なお、遮光板５の透孔２２の位置を画像認
識する代わりに、遮光板５の外形形状を画像認識しても
よい。その後、ホルダ８をケース７に嵌合にて組付け、
このハウジング２に光学レンズ４を嵌合にて組付ける。
このとき、上述したように遮光板５をズレることなく所
望の位置に組付けることができ、平面内の位置に大きな
ズレがある場合には遮光板５が光学レンズ４と干渉（接
触）してしまうが、本例ではこれを回避することができ
る。また、遮光板５において平面内の位置にズレがある
と、遮光板５とハウジング２の隙間から光（外乱光）が
入ってしまうが、本例ではこれを回避することができ
る。Instead of recognizing the position of the through hole 22 of the light shielding plate 5 by image recognition, the outer shape of the light shielding plate 5 may be image recognized. Then, the holder 8 is attached to the case 7 by fitting.
The optical lens 4 is attached to the housing 2 by fitting.
At this time, as described above, the light-shielding plate 5 can be assembled at a desired position without deviation, and when there is a large deviation at a position in the plane, the light-shielding plate 5 interferes (contacts) with the optical lens 4 and contacts. However, in this example, this can be avoided. Further, if there is a deviation in the position of the light shielding plate 5 in the plane, light (disturbance light) enters through a gap between the light shielding plate 5 and the housing 2, but this can be avoided in this example.

【００３７】このように、本実施の形態は下記の特徴を
有する。 （イ）遮光板５の組付け方法として、図１３，１４，１
５に示すように、ホルダ８（ハウジング２）に受光素子
３を固定した状態から、ＣＣＤカメラ（撮像装置）４
２，４３を用いて受光素子３の位置を画像認識するとと
もに遮光板５の透孔２２の位置または遮光板５の外形形
状を画像認識しつつ、遮光板５と受光素子３の相対位置
を保ちながら遮光板５をホルダ８の所望の位置に組付け
るようにした。よって、遮光板５と受光素子３の相対位
置精度を確保しつつ遮光板５を取付けることができる。
このように遮光板５をハウジング２へ精度よく組付ける
ことができるので、簡素で安価な光検出器とすることが
できる。As described above, this embodiment has the following features. (A) As a method for assembling the light shielding plate 5, FIGS.
As shown in FIG. 5, the state in which the light receiving element 3 is fixed to the holder 8 (housing 2) is changed to a CCD camera (imaging device) 4.
The relative position between the light-shielding plate 5 and the light-receiving element 3 is maintained while the position of the light-receiving element 3 is image-recognized using the reference numerals 2 and 43 and the position of the through hole 22 of the light-shielding plate 5 or the outer shape of the light-shielding plate 5 is image-recognized. The light-shielding plate 5 was attached to a desired position of the holder 8 while doing so. Therefore, the light shielding plate 5 can be attached while ensuring the relative positional accuracy between the light shielding plate 5 and the light receiving element 3.
Since the light shielding plate 5 can be accurately assembled to the housing 2 as described above, a simple and inexpensive photodetector can be provided.

【００３８】詳しくは、遮光板５の位置ズレは、通常の
管理によりできる程度の組付け精度でよいため、組付け
工数増加や歩留り低下がない。また、受光素子３や遮光
板５等の移送はロボットアーム等の把持・搬送手段を用
いて行われ、遮光板５の組付け工程は自動化される。よ
って、量産性に優れている。さらに、図１６の従来構造
の場合、印刷された遮光膜１０４の受光素子１０１，１
０２に対する位置ズレ許容が極めて小さく（例えば±２
０μｍ程度）、製造上歩留りを悪化させ、コストアップ
の要因となっている。また、受光素子１０１，１０２と
遮光膜１０４の間に透明基板１０３を介在させているた
め、部品点数が増え、小型化の妨げにもなる。これに対
し、本実施形態では、透明基板１０３を介在せずに、遮
光膜印刷の代わりに透孔２２を有する遮光板５を受光素
子３に対し左右前後の組付けズレを小さくして精度よく
組付けることができる。また、受光素子３のハウジング
２への組付けズレは考慮しなくてもよいため、歩留りも
向上し、コスト的にも大幅な低減を図ることができる。 （ロ）受光素子３の位置の画像認識は、図１のごとく、
素子３内の受光領域１１の位置を画像認識することによ
り行うようにしたので、専用のマークを不要にでき、実
用上好ましいものになる。 （ハ）図７のごとく、遮光板５の透孔２２の位置の画像
認識に加えて、遮光板５に設けたマークとしての穴２３
ａ，２３ｂを画像認識して平面内の位置を決定するよう
にしたので、正確に遮光板５の位置を認識でき、実用上
好ましいものとなる。More specifically, the positional deviation of the light-shielding plate 5 can be as high as the accuracy of assembly that can be achieved by ordinary management, so that there is no increase in the number of assembling steps and no reduction in yield. The transfer of the light receiving element 3 and the light shielding plate 5 is performed using a gripping / transporting means such as a robot arm, and the assembling process of the light shielding plate 5 is automated. Therefore, it is excellent in mass productivity. Further, in the case of the conventional structure shown in FIG. 16, the light receiving elements 101 and 1 of the printed light shielding film 104 are used.
02 is extremely small (for example, ± 2
(Approximately 0 μm), which lowers the production yield and increases the cost. In addition, since the transparent substrate 103 is interposed between the light receiving elements 101 and 102 and the light shielding film 104, the number of components increases, which hinders miniaturization. On the other hand, in the present embodiment, the light-shielding plate 5 having the through-holes 22 is replaced with the light-receiving element 3 with the right-left and front-rear assembly deviations reduced with high accuracy without interposing the transparent substrate 103 in place of the light-shielding film printing. Can be assembled. In addition, since there is no need to consider the displacement of the light receiving element 3 to the housing 2, the yield can be improved and the cost can be significantly reduced. (B) Image recognition of the position of the light receiving element 3 is as shown in FIG.
Since this is performed by recognizing the position of the light receiving region 11 in the element 3 by image recognition, a special mark can be eliminated, which is practically preferable. (C) As shown in FIG. 7, in addition to the image recognition of the position of the through hole 22 of the light shielding plate 5, a hole 23 as a mark provided on the light shielding plate 5 is provided.
Since the positions in the plane are determined by recognizing the images a and 23b, the position of the light shielding plate 5 can be accurately recognized, which is practically preferable.

【００３９】これまでの説明においてはフォトダイオー
ドを用いてきたが、他にも例えばフォトトランジスタを
用いてもよい。Although a photodiode has been used in the above description, a phototransistor may be used instead.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 実施の形態における車載用光検出器の平面
図。FIG. 1 is a plan view of an on-vehicle photodetector according to an embodiment.

【図２】 図１のＡ−Ａ断面図。FIG. 2 is a sectional view taken along line AA of FIG.

【図３】 図１のＢ−Ｂ断面図。FIG. 3 is a sectional view taken along line BB of FIG. 1;

【図４】 受光素子の平面図。FIG. 4 is a plan view of a light receiving element.

【図５】 受光素子の説明図。FIG. 5 is an explanatory diagram of a light receiving element.

【図６】 ホルダの正面図。FIG. 6 is a front view of the holder.

【図７】 遮光板を示す図。FIG. 7 is a view showing a light shielding plate.

【図８】 オートエアコンシステムの電気的構成図。FIG. 8 is an electrical configuration diagram of an auto air conditioner system.

【図９】 車載用光検出器の組み立てを説明するための
図。FIG. 9 is a diagram for explaining the assembly of the on-vehicle photodetector.

【図１０】 車載用光検出器の組み立てを説明するため
の図。FIG. 10 is a diagram for explaining the assembly of the on-vehicle photodetector.

【図１１】 車載用光検出器の組み立てを説明するため
の図。FIG. 11 is a diagram for explaining the assembly of the on-vehicle photodetector.

【図１２】 車載用光検出器の組み立てを説明するため
の平面図。FIG. 12 is a plan view for explaining assembly of the on-vehicle photodetector.

【図１３】 車載用光検出器の組み立てを説明するため
の図。FIG. 13 is a view for explaining assembly of the on-vehicle photodetector.

【図１４】 車載用光検出器の組み立てを説明するため
の図。FIG. 14 is a diagram for explaining the assembly of the on-vehicle photodetector.

【図１５】 車載用光検出器の組み立てを説明するため
の図。FIG. 15 is a diagram for explaining the assembly of the on-vehicle photodetector.

【図１６】 従来技術を説明するための図。FIG. 16 is a diagram for explaining a conventional technique.

【符号の説明】[Explanation of symbols]

１…車載用光検出器、２…ハウジング、３…受光素子、
５…遮光板、８…ホルダ、１１…受光領域、２２…透
孔、２３ａ，２３ｂ…穴、４２，４３…ＣＣＤカメラ。1. Photodetector for vehicle use 2. Housing 3. Photodetector
5: light shielding plate, 8: holder, 11: light receiving area, 22: through hole, 23a, 23b: hole, 42, 43: CCD camera.

フロントページの続き (72)発明者 角谷 和好 愛知県刈谷市昭和町１丁目１番地 株式会 社デンソー内 (72)発明者 塚本 武 愛知県刈谷市昭和町１丁目１番地 株式会 社デンソー内 Ｆターム(参考） 2F065 AA03 AA07 AA16 BB05 CC28 FF01 FF04 JJ03 JJ09 JJ26 TT02 UU04 UU05 2G065 AA15 AA17 BA04 BA09 BA34 BA36 BB08 BB21 BB24 BB48 BC07 BC11 BC16 BC35 CA01 DA20 5F051 BA05 JA02 JA09 Continued on the front page (72) Inventor Kazuyoshi Kazuya 1-1-1, Showa-cho, Kariya-shi, Aichi Prefecture Inside Denso, Inc. (72) Inventor Takeshi Tsukamoto 1-1-1, Showa-cho, Kariya-shi, Aichi Prefecture F inside Denso, Inc. Term (reference) 2F065 AA03 AA07 AA16 BB05 CC28 FF01 FF04 JJ03 JJ09 JJ26 TT02 UU04 UU05 2G065 AA15 AA17 BA04 BA09 BA34 BA36 BB08 BB21 BB24 BB48 BC07 BC11 BC16 BC35 CA01 DA20 5F051 BA05 JA02

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 ハウジング（２）と、 前記ハウジング（２）の上面に配置された受光素子
（３）と、 前記受光素子（３）の上方において、入射した光を透孔
（２２）を通して前記受光素子（３）に送る遮光板
（５）と、を備えた車載用光検出器における遮光板の組
付け方法であって、 前記ハウジング（２）に受光素子（３）を固定した状態
から、撮像装置（４２，４３）を用いて前記受光素子
（３）の位置を画像認識するとともに遮光板（５）の透
孔（２２）の位置または遮光板（５）の外形形状を画像
認識しつつ、遮光板（５）と受光素子（３）の相対位置
を保ちながら遮光板（５）をハウジング（２）の所望の
位置に組付けるようにしたことを特徴とする車載用光検
出器における遮光板の組付け方法。1. A housing (2), a light receiving element (3) disposed on an upper surface of the housing (2), and an incident light passing through the through hole (22) above the light receiving element (3). A method of assembling a light-shielding plate in an on-vehicle photodetector comprising a light-shielding plate (5) to be sent to a light-receiving element (3), wherein the light-receiving element (3) is fixed to the housing (2). Using an imaging device (42, 43), the position of the light receiving element (3) is image-recognized and the position of the through hole (22) of the light-shielding plate (5) or the outer shape of the light-shielding plate (5) is image-recognized. Wherein the light shielding plate (5) is mounted at a desired position of the housing (2) while maintaining a relative position between the light shielding plate (5) and the light receiving element (3). How to assemble the board. 【請求項２】 請求項１に記載の車載用光検出器におけ
る遮光板の組付け方法において、 前記受光素子（３）の位置の画像認識は、素子（３）内
の受光領域（１１）の位置を画像認識することにより行
うようにしたことを特徴とする車載用光検出器における
遮光板の組付け方法。2. The method of assembling a light-shielding plate in an on-vehicle photodetector according to claim 1, wherein the image recognition of the position of the light-receiving element (3) is performed on a light-receiving area (11) in the element (3). A method for assembling a light-shielding plate in an on-vehicle photodetector, wherein the method is performed by recognizing a position of an image. 【請求項３】 請求項１に記載の車載用光検出器におけ
る遮光板の組付け方法において、 前記遮光板（５）をハウジング（２）の上面に接着する
ことによりハウジング（２）に固定するようにしたこと
を特徴とする車載用光検出器における遮光板の組付け方
法。3. The method of assembling a light-shielding plate in an on-vehicle photodetector according to claim 1, wherein the light-shielding plate (5) is fixed to the housing (2) by bonding the light-shielding plate (5) to an upper surface of the housing (2). A method for assembling a light-shielding plate in an on-vehicle photodetector, characterized in that: 【請求項４】 請求項１〜３のいずれか１項に記載の車
載用光検出器における遮光板の組付け方法において、 遮光板（５）の透孔（２２）の位置の画像認識に加え
て、遮光板（５）に設けたマーク（２３ａ，２３ｂ）を
画像認識して平面内の位置を決定するようにしたことを
特徴とする車載用光検出器における遮光板の組付け方
法。4. The method for assembling a light-shielding plate in an on-vehicle photodetector according to claim 1, further comprising the step of recognizing an image of a position of a through-hole (22) of the light-shielding plate (5). A mark (23a, 23b) provided on the light-shielding plate (5) is image-recognized to determine a position in a plane.
JP2000198627A 2000-06-30 2000-06-30 Assembling method for light shielding plate in on-vehicle light detector Pending JP2002013979A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000198627A JP2002013979A (en) 2000-06-30 2000-06-30 Assembling method for light shielding plate in on-vehicle light detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000198627A JP2002013979A (en) 2000-06-30 2000-06-30 Assembling method for light shielding plate in on-vehicle light detector

Publications (1)

Publication Number Publication Date
JP2002013979A true JP2002013979A (en) 2002-01-18

Family

ID=18696764

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2002013979A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089311A (en) * 2006-09-29 2008-04-17 Noba Denko Kk Solar radiation sensor
WO2008044490A1 (en) * 2006-10-06 2008-04-17 Sharp Kabushiki Kaisha Method for manufacturing photovoltaic power generation unit and system for manufacturing photovoltaic power generation unit
KR100830720B1 (en) 2006-08-28 2008-06-13 태진정밀 주식회사 Optical Measuring Equipment Using Lightguide Ass'y And Optical Measuring Method
US8178777B2 (en) 2003-10-08 2012-05-15 Sharp Kabushiki Kaisha Method of manufacturing solar cell and solar cell manufactured thereby
JP2022148745A (en) * 2021-03-24 2022-10-06 本田技研工業株式会社 Light detection device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178777B2 (en) 2003-10-08 2012-05-15 Sharp Kabushiki Kaisha Method of manufacturing solar cell and solar cell manufactured thereby
KR100830720B1 (en) 2006-08-28 2008-06-13 태진정밀 주식회사 Optical Measuring Equipment Using Lightguide Ass'y And Optical Measuring Method
JP2008089311A (en) * 2006-09-29 2008-04-17 Noba Denko Kk Solar radiation sensor
WO2008044490A1 (en) * 2006-10-06 2008-04-17 Sharp Kabushiki Kaisha Method for manufacturing photovoltaic power generation unit and system for manufacturing photovoltaic power generation unit
JP2022148745A (en) * 2021-03-24 2022-10-06 本田技研工業株式会社 Light detection device

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