JP2001353662A - Polishing material, and method of polishing surface of multilayer wiring board using this polishing material - Google Patents
Polishing material, and method of polishing surface of multilayer wiring board using this polishing materialInfo
- Publication number
- JP2001353662A JP2001353662A JP2000174507A JP2000174507A JP2001353662A JP 2001353662 A JP2001353662 A JP 2001353662A JP 2000174507 A JP2000174507 A JP 2000174507A JP 2000174507 A JP2000174507 A JP 2000174507A JP 2001353662 A JP2001353662 A JP 2001353662A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- abrasive
- rubber
- wiring board
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【発明の属する技術分野】本発明は、配線基板同士の導
電を目的としたスルーホールを有する配線基板の製造過
程において、表面粗化、ドリル等で開けられたスルーホ
ールのバリ取り除去、銅メッキ処理不良による突起物の
除去、配線基板を貼り合わす際にブラインドスルーホー
ルから流出し、突出して硬化した熱硬化性樹脂の除去等
を、配線基板の寸法変化が少なく、また、配線基板に損
傷を与えずに行うことができる研磨材及びこの研磨材を
用いた多層配線基板表面の研磨方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for manufacturing a wiring board having through holes for the purpose of conducting between the wiring boards, such as surface roughening, deburring and removal of through holes formed with a drill, and copper plating. Removal of protrusions due to processing defects, removal of thermosetting resin that has flowed out of the blind through hole when projecting and bonding the wiring board, and has hardened protruding, etc., have little dimensional change of the wiring board and damage to the wiring board The present invention relates to an abrasive which can be performed without applying the abrasive and a method for polishing the surface of a multilayer wiring board using the abrasive.
【０００２】[0002]
【従来の技術】一般的に配線基板の製造は図９に示すよ
うに内層回路１１とスルーホール１２から形成される配
線基板１３，１４でプリプレグ１５を両側から挟み込
み、加熱プレスしてプリプレグ１５に含浸している樹脂
を溶融させ、この溶融樹脂を配線基板１３，１４とスル
ーホール１２に充填する。次ぎに、図１０に示すように
溶融樹脂を熱硬化させることにより、配線基板１３，１
４とプリプレグ１５は接着され、スルーホール１２はブ
ラインドスルーホール１６に形成され、多層配線基板が
得られる。しかし、表面粗化、スルーホール加工時のバ
リ取り除去、銅メッキ処理不良による突起物除去、ブラ
インドスルーホールから溶け出し硬化した樹脂の除去
は、ロール状研磨材を回転して研磨するロールバフ方式
や、特開平４−８４４９５号に開示されるように、砥粒
を使用したサンドペーパーをベルト状にして２つのロー
ルで回転させるロールベルトサンダー方式等で研磨除去
する方法が一般的に行われているが、多層配線基板の研
磨部にかかる力が大きいため、配線基板に損傷を与えた
り、回路不良を生じさせたり、或いは、配線基板の伸張
率が大きくなり、部品を多層配線基板の回路上にロボッ
トで装着する際の位置ずれ等が生じて部品が正しく装着
できない等の不具合が生じていた。そこで、ロールバフ
方式やロールベルトサンダー方式に代わり、図７に示す
ように、基材２１上に固着されたナイロンバフ２２に砥
粒２３を分散接着した板状の研磨材や、図８に示すよう
に、砥粒を樹脂でペレット状に成型した研磨基材２４を
布２５に張り付けてシート状にした研磨材を多層配線基
板に圧着し、オシレーションして研磨する方法によっ
て、配線基板の研磨部にかかる力を分散し、配線基板の
回路の損傷が少なく、配線基板の伸張率も小さくするこ
とを目的とした研磨方法が開発された。2. Description of the Related Art Generally, as shown in FIG. 9, a prepreg 15 is sandwiched between wiring boards 13 and 14 formed of an inner layer circuit 11 and a through hole 12 from both sides, and heated and pressed into a prepreg 15 as shown in FIG. The impregnated resin is melted, and the molten resin is filled into the wiring boards 13 and 14 and the through holes 12. Next, as shown in FIG. 10, the molten resin is cured by heat so that the wiring boards 13 and 1 are hardened.
4 and the prepreg 15 are adhered, and the through-hole 12 is formed in the blind through-hole 16 to obtain a multilayer wiring board. However, surface buffing, removal of burrs during through-hole processing, removal of protrusions due to poor copper plating, and removal of resin that has melted out of the blind through-hole and hardened are performed using a roll buff method in which a roll-shaped abrasive is rotated and polished. As disclosed in Japanese Patent Application Laid-Open No. 4-84495, a method of polishing and removing a sandpaper using abrasive grains by a roll belt sander method in which a belt-shaped sandpaper is rotated by two rolls or the like is generally performed. However, since the force applied to the polishing portion of the multilayer wiring board is large, the wiring board may be damaged, a circuit failure may occur, or the extension rate of the wiring board may increase, and the components may be placed on the circuit of the multilayer wiring board. There has been a problem such as a position shift when mounting with a robot, and a component cannot be mounted correctly. Therefore, instead of a roll buff method or a roll belt sander method, as shown in FIG. 7, a plate-like abrasive material in which abrasive grains 23 are dispersed and adhered to a nylon buff 22 fixed on a base material 21, or as shown in FIG. Then, a polishing material formed into a pellet shape with a resin is adhered to a cloth 25, and a sheet-like polishing material is pressed onto a multilayer wiring substrate, and oscillated and polished. A polishing method has been developed for the purpose of dispersing the force applied to the wiring board, reducing the damage to the circuit of the wiring board, and reducing the elongation rate of the wiring board.
【０００３】[0003]
【発明が解決しようとする課題】しかし、ナイロンバフ
に砥粒を分散接着した板状の研磨材の場合、研磨時の配
線基板への当たりが比較的柔らかく、ワーク形状へのな
じみも比較的良好なため、配線基板の銅メッキ層の表面
粗化には向いているが、研磨力が弱いため、配線基板上
の樹脂が充填されていないスルーホールの加工バリの除
去、銅メッキ処理不良による突起物の除去、配線基板上
の樹脂の除去はできない。また、比較的ワークの凹凸形
状になじみが良好な上記ナイロンバフに砥粒を分散接着
した板状の研磨材を使用しても、フレキシブル基板の様
な凹凸の大きな基板にはその凹凸に研磨材がなじまず、
凹部が研磨できないといった欠点があった。また、砥粒
を樹脂でペレット状に成型した研磨基材を布に張り付け
てシート状にした研磨材の場合、研磨力は比較的良好だ
が、配線基板回路に損傷を与えたり、型なじみ性が悪
く、配線基板に凹凸があると凹部の樹脂の除去ができな
い。更に、近年、多層配線基板回路の高密度化、配線基
板の薄化に伴い、多層配線基板の研磨精度の向上が不可
欠となり、配線基板が裂けたり、伸びたりせずに、配線
基板の表面粗化、スルーホールのバリ取り除去、突起物
の除去、樹脂の除去を確実に行える研磨材及び研磨方法
の改良が要求されていた。そこで、本発明は、多層配線
基板を研磨する工程において、配線基板回路に損傷を与
えず、配線基板の伸張率が低く、高い研磨力を持ち、か
つ、配線基板に凹凸があっても研磨ムラを生じない性能
を有する研磨材と研磨方法を提供しようとするものであ
る。However, in the case of a plate-like abrasive material in which abrasive grains are dispersed and adhered to a nylon buff, the contact with the wiring substrate during polishing is relatively soft, and the adaptation to the work shape is relatively good. Therefore, it is suitable for roughening the surface of the copper plating layer of the wiring board, but because of its weak polishing power, removal of processing burrs of through holes that are not filled with resin on the wiring board, protrusion due to defective copper plating processing. It is not possible to remove objects or remove resin on the wiring board. Even if a plate-like abrasive with abrasive particles dispersed and adhered to the above nylon buff, which is relatively well adapted to the uneven shape of the work, is used for a substrate with large unevenness such as a flexible substrate, I don't know
There was a disadvantage that the recess could not be polished. Also, in the case of a polishing material made by laminating a polishing base material in which the abrasive grains are formed into a pellet shape with a resin and pasting it on a cloth to form a sheet, the polishing power is relatively good, but it may damage the wiring board circuit, Poorly, if the wiring substrate has irregularities, the resin in the concave portions cannot be removed. Furthermore, in recent years, with the increase in the density of multilayer wiring board circuits and the thinning of wiring boards, it has become essential to improve the polishing accuracy of the multilayer wiring board, and the wiring board is not torn or stretched, and the surface roughness of the wiring board is not increased. There has been a demand for an improved abrasive and a polishing method capable of reliably performing deburring, removing through holes, removing protrusions, and removing resin. Therefore, the present invention provides a method of polishing a multilayer wiring board, which does not damage the wiring board circuit, has a low extension rate of the wiring board, has a high polishing force, and has uneven polishing even if the wiring board has irregularities. It is an object of the present invention to provide a polishing material and a polishing method having a performance that does not cause polishing.
【０００４】[0004]
【課題を解決するための手段】本発明者等は、前記目的
を達成するべく、鋭意検討の結果、無機質長繊維を樹脂
マトリックスで結着して薄肉状乃至は細径状に形成した
複数個の研磨基材を、前記無機質長繊維の繊維端が研磨
部となるように支持部材に植設することにより、多層配
線基板が裂けたり、伸びたりせずに、配線基板に凹凸が
あっても、配線基板の表面粗化、スルーホールのバリの
除去、突起物の除去、樹脂の除去を確実に行える研磨材
が得られることを知見した。本発明の研磨材は、かかる
知見に基づきなされたもので、請求項１記載の通り、無
機質長繊維を樹脂マトリックスで結着して薄肉状乃至は
細径状に形成した複数個の研磨基材を、前記無機質長繊
維の繊維端が研磨部となるように支持部材に植設したこ
とを特徴とする。また、請求項２記載の研磨材は、請求
項１記載の研磨材において、前記研磨基材を厚み０．５
ｍｍ以下のシート状としたことを特徴とする。また、請
求項３記載の研磨材は、請求項１記載の研磨材におい
て、前記研磨基材を断面積１．０ｍｍ２以下の細線状と
したことを特徴とする。また、請求項４記載の研磨材
は、請求項１記載の研磨材において、前記研磨基材を直
径３ｍｍ以下の棒状としたことを特徴とする。また、請
求項５記載の研磨材は、請求項１乃至４の何れかに記載
の研磨材において、前記樹脂マトリックスがゴム弾性を
有するものであることを特徴とする。また、請求項６記
載の研磨材は、請求項５記載の研磨材において、前記樹
脂マトリックスはクロロプレンゴム、ニトリルゴム、ブ
タジエンゴム、スチレンーブタジエンゴム、ブチルゴ
ム、エチレンープロピレンゴム、フッ素ゴム、シリコー
ンゴム、或いは、ウレタンゴムであることを特徴とす
る。また、請求項７記載の研磨材は、請求項１乃至６の
何れかに記載の研磨材において、前記研磨基材に無機質
中実球状ビーズを含ませたことを特徴とする。また、請
求項８記載の研磨材は、請求項１乃至７の何れかに記載
の研磨材において、前記支持部材がゴム弾性を有するも
のであることを特徴とする。また、請求項９記載の研磨
材は、請求項８記載の研磨材において、前記支持部材は
クロロプレンゴム、ニトリルゴム、ブタジエンゴム、ス
チレンーブタジエンゴム、ブチルゴム、エチレンープロ
ピレンゴム、フッ素ゴム、シリコーンゴム、或いは、ウ
レタンゴムであることを特徴とする。また、請求項１０
記載の研磨材は、請求項１乃至９の何れかに記載の研磨
材において、前記支持部材に砥粒を含ませたことを特徴
とする。また、請求項１１記載の研磨材は、請求項１乃
至１０の何れかに記載の研磨材において、前記支持部材
に中空球状ビーズを含ませたことを特徴とする。また、
請求項１２記載の研磨材は、請求項１乃至１１の何れか
に記載の研磨材において、前記研磨基材はその無機質長
繊維方向に沿って少なくとも２５％以上の長さを前記支
持部材内に埋設するようにしたことを特徴とする。ま
た、請求項１３記載の研磨材は、請求項１２記載の研磨
材において、前記研磨基材を前記支持部材内に全て埋設
したことを特徴とする。また、請求項１４記載の研磨材
は、請求項１３記載の研磨材において、前記支持部材の
植設面に外側端面まで通り抜けた溝を設けたことを特徴
とする。また、本発明の多層配線基板の研磨方法は、請
求項１５記載の通り、前記請求項１乃至１４の何れかに
記載の研磨材を用いて、その研磨基材を多層配線基板に
圧着してオシレーションすることを特徴とする。Means for Solving the Problems In order to achieve the above-mentioned object, the present inventors have conducted intensive studies and as a result, have found that a plurality of inorganic long fibers formed into a thin or small diameter shape by binding them with a resin matrix. By polishing the polishing base material on the support member so that the fiber end of the inorganic long fiber becomes a polishing portion, the multilayer wiring board is not torn or stretched, even if the wiring board has irregularities. It has been found that an abrasive can be obtained that can reliably roughen the surface of the wiring board, remove burrs from through holes, remove protrusions, and remove resin. The polishing material of the present invention is based on such knowledge, and as described in claim 1, a plurality of polishing base materials formed into thin or small diameters by binding inorganic long fibers with a resin matrix. Is planted on a support member such that the fiber end of the inorganic long fiber becomes a polishing portion. The abrasive according to claim 2 is the abrasive according to claim 1, wherein the abrasive substrate has a thickness of 0.5.
mm or less. The abrasive according to a third aspect of the present invention is the abrasive according to the first aspect, characterized in that the polishing substrate has a fine line shape having a cross-sectional area of 1.0 mm 2 or less. The abrasive according to a fourth aspect is the abrasive according to the first aspect, characterized in that the abrasive substrate has a rod shape having a diameter of 3 mm or less. The abrasive according to claim 5 is characterized in that, in the abrasive according to any one of claims 1 to 4, the resin matrix has rubber elasticity. The abrasive according to claim 6 is the abrasive according to claim 5, wherein the resin matrix is chloroprene rubber, nitrile rubber, butadiene rubber, styrene butadiene rubber, butyl rubber, ethylene-propylene rubber, fluorine rubber, silicone rubber. Alternatively, it is a urethane rubber. An abrasive according to a seventh aspect is characterized in that, in the abrasive according to any one of the first to sixth aspects, the polishing base material contains inorganic solid spherical beads. An abrasive according to claim 8 is the abrasive according to any one of claims 1 to 7, wherein the support member has rubber elasticity. The abrasive according to claim 9 is the abrasive according to claim 8, wherein the supporting member is chloroprene rubber, nitrile rubber, butadiene rubber, styrene butadiene rubber, butyl rubber, ethylene-propylene rubber, fluorine rubber, silicone rubber. Alternatively, it is a urethane rubber. Claim 10
An abrasive according to the present invention is characterized in that, in the abrasive according to any one of claims 1 to 9, abrasive grains are included in the support member. An abrasive according to an eleventh aspect is characterized in that, in the abrasive according to any one of the first to tenth aspects, the support member includes hollow spherical beads. Also,
The abrasive according to claim 12 is the abrasive according to any one of claims 1 to 11, wherein the abrasive substrate has a length of at least 25% or more along the direction of the inorganic long fibers in the support member. It is characterized by being buried. A polishing material according to a thirteenth aspect is characterized in that, in the polishing material according to the twelfth aspect, the polishing substrate is entirely embedded in the support member. A polishing material according to a fourteenth aspect is characterized in that, in the polishing material according to the thirteenth aspect, a groove is provided on the planting surface of the support member so as to extend to an outer end surface. According to a fifteenth aspect of the present invention, there is provided a method for polishing a multilayer wiring board, comprising using the abrasive according to any one of the first to fourteenth aspects and pressing the polishing base material onto the multilayer wiring board. It is characterized by oscillation.
【０００５】本発明の研磨材は、無機質長繊維を樹脂マ
トリックスで結着して薄肉状乃至は細径状に形成した複
数個の研磨基材を、前記無機質長繊維の繊維端が研磨部
となるように支持部材に植設するようにしたため、多層
配線基板が裂けたり、伸びたりせずに、配線基板の表面
粗化、スルーホールのバリ取り除去、樹脂の除去を確実
に行える。この理由としては、無機質長繊維に樹脂マト
リックスを含浸結着した研磨基材は、無機質長繊維によ
る高い研磨性が生じ、同時に高い曲げ強度を持つため、
シート状、細線状、棒状等の薄肉状乃至は細径状に成型
しても、折れたり破損することがなく、また、支持部材
にこのような研磨基材を無機質長繊維の先端が配線基板
の表面に接するように任意の配列で複数個植設されてい
るため、研磨基材を配線基板に押し当て、研磨すること
により、配線基板の研磨部にかかる荷重を分散すること
ができ、また、配線基板の細かな凹凸にも研磨基材の刃
先が届くためである。[0005] The abrasive of the present invention comprises a plurality of abrasive base materials formed into thin or small diameters by binding inorganic long fibers with a resin matrix, wherein the fiber ends of the inorganic long fibers form a polishing portion. Since the multi-layered wiring board is implanted in the supporting member, the surface of the wiring board can be roughened, deburred and removed from the through-hole, and the resin can be reliably removed without breaking or extending the multilayer wiring board. The reason for this is that the polishing base material obtained by impregnating and binding the inorganic long fiber with the resin matrix has a high abrasiveness due to the inorganic long fiber and at the same time has a high bending strength,
Even if it is formed into a thin or thin shape such as a sheet, a thin line, or a rod, it does not break or break. Since a plurality of pieces are planted in an arbitrary arrangement so as to be in contact with the surface of the wiring board, by pressing the polishing base material against the wiring board and polishing, the load applied to the polishing portion of the wiring board can be dispersed, and This is because the edge of the polishing base material can reach even fine irregularities on the wiring board.
【０００６】[0006]
【発明の実施の形態】本発明の研磨材の特徴は、前記の
通り、無機質長繊維を樹脂マトリックスで結着して薄肉
状乃至は細径状に形成した複数個の研磨基材を、前記無
機質長繊維の繊維端が研磨部となるように支持部材に植
設し、この支持部材に植設された状態の研磨基材を多層
配線基板に押し当て、研磨することにより、ワーク研磨
面の凹凸に影響を受けず、ワークへの損傷が少ない効率
的な研磨を実現できるようにしたものである。具体的に
は、例えば、支持部材を板状とした研磨材として構成
し、オシレーションタイプの研磨機に装着して使用する
ことにより、多層配線基板が裂けたり、伸びたりせず
に、配線基板の表面粗化、スルーホールのバリ取り除
去、突起物の除去、樹脂の除去を確実に行える。但し、
多層配線基板は種類により様々であるので表面粗化、ス
ルーホールのバリ取り除去、突起物の除去、樹脂の除去
といった目的により、研磨基材を次ぎのように選択して
使用する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The abrasive of the present invention is characterized in that, as described above, a plurality of abrasive base materials formed into a thin or small diameter by binding inorganic long fibers with a resin matrix are used. The fiber end of the inorganic long fiber is planted on the support member so as to be a polishing portion, and the polishing base material planted on the support member is pressed against the multilayer wiring board and polished, thereby polishing the work polishing surface. It is possible to realize efficient polishing with little damage to the work without being affected by unevenness. Specifically, for example, the support member is configured as a plate-shaped abrasive, and is used by being mounted on an oscillation-type polishing machine. Surface roughness, through-hole deburring removal, protrusion removal, and resin removal can be performed reliably. However,
Since there are various types of multilayer wiring boards, polishing substrates are selected and used as follows for the purpose of surface roughening, deburring removal of through holes, removal of protrusions, and removal of resin.
【０００７】配線基板の表面粗化、スルーホールのバリ
を除去する場合は、無機質長繊維を一方向に引き揃え、
熱硬化性樹脂等の樹脂マトリックスを含浸させて厚み
０．１〜０．５ｍｍ程度の薄いＵＤシート等のシート状
に硬化させ、そのシート状とした無機質長繊維の先端を
研磨部分とした研磨基材を、板状支持部材に無機質長繊
維の先端が配線基板の表面に接するように複数列に並列
させて植設すればよく、刃先がしなやかであるので、配
線基板の細かな凹凸にも柔軟に研磨基材の刃先が届き、
基板表面を均一に粗化し、スルーホールの有するバリも
配線基板に損傷を与えることなく均一に研磨除去するこ
とができる。また、シート状研磨基材の刃先部分におい
て、無機質長繊維の長手方向に一定の間隔で切れ目を入
れて短冊状にすれば、よりしなやかになり、性能、効率
が上がる。When the surface of a wiring board is roughened and burrs on through holes are removed, inorganic long fibers are aligned in one direction,
A polishing base in which a resin matrix such as a thermosetting resin is impregnated and cured into a thin UD sheet or the like having a thickness of about 0.1 to 0.5 mm, and the tip of the inorganic long fiber formed into the sheet is polished. The material can be planted in parallel in a plurality of rows on the plate-shaped support member so that the tips of the inorganic long fibers are in contact with the surface of the wiring board, and the cutting edge is flexible, so it is flexible to fine irregularities on the wiring board The edge of the abrasive substrate reaches
The surface of the substrate is uniformly roughened, and burrs of the through holes can be uniformly removed by polishing without damaging the wiring substrate. In addition, by forming cuts at predetermined intervals in the longitudinal direction of the inorganic long fibers in the blade edge portion of the sheet-like polishing substrate to form a strip, the flexibility becomes higher, and the performance and efficiency are improved.
【０００８】また、配線基板上の突起物を除去する場合
は、無機質長繊維の集合糸に、熱硬化性樹脂等の樹脂マ
トリックスを含浸硬化させた断面積０．１〜１．０ｍｍ
２程度の細線状体の複数本を少なくともそれらの一端が
自由な状態にして結束し、その自由端を研磨部分とした
研磨基材を無機質長繊維の先端が配線基板の表面に接す
るように板状支持部材にブラシ状に植設すればよく、刃
先が細かく多いために研磨性も高く、配線基板の細かな
凹凸にも柔軟に研磨基材の刃先が届き配線基板に損傷を
与えることなく、配線基板上の突起物を除去することが
できる。In order to remove the protrusions on the wiring board, the aggregate yarn of the inorganic long fibers is impregnated and cured with a resin matrix such as a thermosetting resin and has a cross-sectional area of 0.1 to 1.0 mm.
At least one end of each of the two or more thin linear bodies is bound in a free state, and the polishing base having the free end as a polished portion is polished so that the tips of the inorganic long fibers contact the surface of the wiring board. It is only necessary to implant in a brush-like shape on the support member, the sharpness is high because the number of blade edges is fine, the edge of the polishing base material reaches the fine unevenness of the wiring board flexibly and without damaging the wiring board, The protrusion on the wiring board can be removed.
【０００９】更に、研磨力が必要とされる配線基板上の
樹脂を除去する場合は、無機質長繊維を一方向きに引き
揃え、熱硬化性樹脂等の樹脂マトリックスを含浸させて
直径１〜３ｍｍ程度の棒状に硬化させ、その棒状体先端
を研磨部分とした研磨基材を、無機質長繊維の先端が配
線基板の表面に接するように板状支持部材にブラシ状に
植設すればよい。Further, when removing the resin on the wiring board which requires a polishing force, the inorganic long fibers are aligned in one direction and impregnated with a resin matrix such as a thermosetting resin to have a diameter of about 1 to 3 mm. It is only necessary that the polishing material is cured into a rod shape, and a polishing base material having the rod-shaped body tip as a polished portion is implanted in a brush-like shape on a plate-shaped support member such that the tip of the inorganic long fiber is in contact with the surface of the wiring board.
【００１０】刃先となる研磨基材に使用する樹脂マトリ
ックスとしては、エポキシ樹脂のような比較的硬いもの
から、ナイロン樹脂のような比較的柔らかいもの、或い
は、クロロプレンゴム、ニトリルゴム、ブタジエンゴ
ム、スチレンーブタジエンゴム、ブチルゴム、エチレン
ープロピレンゴム、フッ素ゴム、シリコーンゴム、ウレ
タンゴムのようなゴム弾性を有するものまで、熱硬化性
樹脂、熱可塑性樹脂、ゴム等任意に使用でき、研磨基材
の刃先の配線基板へのクッション性の調整が可能で、エ
ポキシ樹脂のような比較的硬いものを使えば研磨性は上
がり、シリコーンゴムのような弾性のあるものを使え
ば、凹凸の大きな配線基板でも刃先が常に凹凸に接する
ため、研磨ムラが生じなくなり、柔らかく接するので、
配線基板への損傷を抑えることができる。[0010] The resin matrix used for the abrasive substrate serving as the cutting edge may be a relatively hard material such as an epoxy resin, a relatively soft material such as a nylon resin, or chloroprene rubber, nitrile rubber, butadiene rubber, or styrene. Thermosetting resin, thermoplastic resin, rubber, etc. can be used arbitrarily, such as rubbers having rubber elasticity such as rubber, butyl rubber, butyl rubber, ethylene-propylene rubber, fluorine rubber, silicone rubber, and urethane rubber. It is possible to adjust the cushioning property of the wiring board by using a relatively hard material such as epoxy resin, and the polishing property is improved. Is always in contact with irregularities, so polishing unevenness does not occur and it comes in soft contact,
Damage to the wiring board can be suppressed.
【００１１】また、配線基板の研磨は、目詰まりを起こ
しやすい銅箔層や銅メッキ層を研磨するため、研磨基材
が目詰まりを起こし研磨性が低下する場合があるが、研
磨基材に直径０．１〜１５０μｍ程度の無機質中実球状
ビーズを含ませると、目詰まりが防止でき、研磨材の研
磨性を保つことができることが判明した。このような無
機質中実球状ビーズとしては、アルミナビーズ、ガラス
ビーズ、シリカビーズ、ジルコニアビーズ等が挙げられ
る。In addition, in the polishing of a wiring board, a copper foil layer or a copper plating layer, which is apt to be clogged, is polished. Therefore, the polishing base material may be clogged and the polishing property may be reduced. It was found that when inorganic solid spherical beads having a diameter of about 0.1 to 150 μm were included, clogging could be prevented and the abrasiveness of the abrasive could be maintained. Examples of such inorganic solid spherical beads include alumina beads, glass beads, silica beads, zirconia beads and the like.
【００１２】また、支持部材に使用する樹脂マトリック
スとしては、研磨基材と同様にエポキシ樹脂のような比
較的硬いものから、ナイロン樹脂のような比較的柔らか
いもの、或いは、クロロプレンゴム、ニトリルゴム、ブ
タジエンゴム、スチレンーブタジエンゴム、ブチルゴ
ム、エチレンープロピレンゴム、フッ素ゴム、シリコー
ンゴム、ウレタンゴムのようなゴム弾性を有するものま
で、熱硬化性樹脂、熱可塑性樹脂、ゴム等任意に使用で
き、研磨基材の刃先の配線基板へのクッション性の調整
が可能となる。また、研磨基材は支持部材に植設する際
に、板状支持部材に研磨基材がしっかりと保持されるよ
うに、無機質長繊維方向に沿って少なくとも２５％以上
の長さを前記支持部材内に埋設することが好ましく、例
えば３０ｍｍの研磨基材の場合、下端側を１０ｍｍ程度
埋め込み、２０ｍｍ程度突出させると、研磨性、配線基
板の凹凸へのなじみ性に対して効果的であるが、ゴム弾
性を有する支持部材に植設する場合には、研磨基材の刃
先が支持部材表面と同一になるまで埋め込んだ方が、研
磨基材を支える強度が上がり、研磨性が高くなる。但
し、支持部材には研削液が研磨基材の研磨部に供給され
る溝が必要であり、その溝は支持部材の外側端面まで通
り抜けている直線または曲線状の溝に形成することが好
ましく、研削液が研磨基材に行き届くことにより、被研
磨物の切り粉の排出がスムーズに行なわれ、目詰まりが
防止される。更に、充填材としてダイヤモンド、炭化ケ
イ素、アルミナ、ＣＢＮ等の砥粒を使用することによ
り、支持部材にも研磨性が生じ、研磨効率が上がる。ま
た、マイクロバルーン（有機球状体）、シラスバルーン
（無機球状体）、ガラス中空ビーズ（無機球状体）等の
中空球状ビーズを充填材として使用することにより、支
持部材が消しゴムのように磨耗するので、研磨基材を適
度に支持しながら、研磨性を阻害することなく、常に研
磨基材の研磨性が維持される。これらの充填材は併用し
て使用すれば更に効果的である。The resin matrix used for the support member may be a relatively hard material such as an epoxy resin, a relatively soft material such as a nylon resin, or a chloroprene rubber, a nitrile rubber, or the like. Can be used arbitrarily, such as thermosetting resin, thermoplastic resin, rubber, etc., with rubber elasticity such as butadiene rubber, styrene butadiene rubber, butyl rubber, ethylene-propylene rubber, fluorine rubber, silicone rubber, urethane rubber, etc. It is possible to adjust the cushioning property of the cutting edge of the base material to the wiring board. When the polishing substrate is implanted in the supporting member, the supporting member has a length of at least 25% or more along the inorganic long fiber direction so that the polishing substrate is firmly held by the plate-like supporting member. It is preferable that the lower end side is embedded by about 10 mm and the lower end side is protruded by about 20 mm. In the case of planting on a support member having rubber elasticity, embedding until the cutting edge of the polishing base material becomes the same as the surface of the support member increases the strength for supporting the polishing base material and enhances the polishing property. However, the support member needs a groove in which the grinding liquid is supplied to the polishing portion of the polishing base material, and the groove is preferably formed as a straight or curved groove passing through to the outer end surface of the support member, When the grinding fluid reaches the polishing substrate, the chips of the object to be polished are smoothly discharged, and clogging is prevented. Further, by using abrasive grains such as diamond, silicon carbide, alumina, and CBN as a filler, the support member is also polished and the polishing efficiency is increased. Also, by using hollow spherical beads such as microballoons (organic spheres), shirasu balloons (inorganic spheres), and glass hollow beads (inorganic spheres) as fillers, the support member wears out like an eraser. In addition, while appropriately supporting the polishing base, the polishing performance of the polishing base is always maintained without inhibiting the polishing performance. These fillers are more effective if used in combination.
【００１３】尚、無機質長繊維としては、アルミナ質長
繊維、ガラス繊維、炭化ケイ素質繊維、ボロン繊維、窒
化ケイ素質繊維等が挙げられるが、本発明者等の実験に
よれば、アルミナ質長繊維が研磨性、強度、耐久性にお
いて研磨基材として最も優れていた。The inorganic long fibers include alumina long fibers, glass fibers, silicon carbide fibers, boron fibers, silicon nitride fibers, and the like. The fiber was the most excellent as an abrasive substrate in terms of abrasiveness, strength and durability.
【００１４】[0014]
【実施例】（実施例１）繊維径１０μｍのモノフィラメ
ント１０００本からなるアルミナ質長繊維（Ａｌ２Ｏ３
８５重量％、ＳｉＯ２１５重量％）のロービングを直径
３３０ｍｍの回転ドラムにロービングが重なり合わない
ように、かつ、隣同士のロービングが離れ過ぎないよう
にトラバースし、巻き幅１００ｍｍに巻き上げた後、シ
リコーンゴム主剤（ＫＥ１２０２ 信越化学工業）に対
して硬化剤（Ｃａｔ−ＲＧ 信越化学工業）を７重量％
添加し、十分に攪拌、脱泡したシリコーンゴム組成物１
５ｇをローラーにより繊維に含浸させ、十分に馴染ませ
てから注意深く切り開き、厚さ０．１ｍｍ、幅１００ｍ
ｍ、長さ約１０００ｍｍで繊維が１方向に配列したシー
ト状成形物を得た。これを、繊維の長さ方向が３０ｍ
ｍ、幅方向が１００ｍｍとなるように成形したアルミナ
質長繊維ＵＤシートを、１５０℃で３０ｍｉｎ加熱硬化
させて研磨基材とした。更に、研磨基材の刃先部分にお
いて無機質長繊維の長手方向に一定の間隔で切れ目を入
れて短冊状にした。(Example 1) Alumina long fiber (Al 2 O 3 ) consisting of 1,000 monofilaments having a fiber diameter of 10 μm
85% by weight, 15% by weight of SiO 2 ) were traversed so that the rovings did not overlap on a rotating drum having a diameter of 330 mm and the adjacent rovings were not too far apart, and were wound up to a winding width of 100 mm. 7% by weight of curing agent (Cat-RG Shin-Etsu Chemical) based on silicone rubber base (KE1202 Shin-Etsu Chemical)
Silicone rubber composition 1 which was added, sufficiently stirred and defoamed
5 g of fiber is impregnated into the fiber with a roller.
m, a sheet-like molded product having a length of about 1000 mm and fibers arranged in one direction. When the length direction of the fiber is 30m
m, an alumina long fiber UD sheet molded so as to have a width of 100 mm was heated and cured at 150 ° C. for 30 minutes to obtain a polishing substrate. Further, cuts were made at regular intervals in the longitudinal direction of the inorganic long fibers at the cutting edge portion of the polishing base material to form strips.
【００１５】また、シリコーンゴム主剤（ＫＥ１２１６
信越化学工業）に対して硬化剤（Ｃａｔ−ＲＧ 信越
化学工業）を１０重量部加え、十分に攪拌、脱泡したシ
リコーンゴム組成物を１００℃で６０ｍｉｎ熱硬化させ
て、厚さ２０ｍｍ、幅１００ｍｍ、長さ６００ｍｍの板
状支持部材とし、刃厚１ｍｍのダイヤモンドカッターを
用いて、板状支持部材の幅方向に深さ１０ｍｍ、幅１ｍ
ｍの溝を板状支持部材の長さ方向に１ｍｍの間隔で加工
形成し、上記ＵＤシート状研磨基材を繊維長さ方向に１
０ｍｍ植設し、２０ｍｍを突出させた状態として研磨材
を得た。図１は得られた研磨材の斜視図を示すもので、
図中１は支持部材、２は研磨基材を示すものである。Further, a silicone rubber base (KE1216)
10 parts by weight of a curing agent (Cat-RG Shin-Etsu Chemical Co., Ltd.) was added to Shin-Etsu Chemical Co., Ltd., and the silicone rubber composition that had been sufficiently stirred and defoamed was heat-cured at 100 ° C. for 60 minutes to have a thickness of 20 mm and a width of 100 mm. A plate-like support member having a length of 600 mm, and using a diamond cutter having a blade thickness of 1 mm, a depth of 10 mm and a width of 1 m in the width direction of the plate-like support member.
m is formed in the length direction of the plate-shaped support member at an interval of 1 mm, and the UD sheet-shaped polishing base material is processed by 1 mm in the fiber length direction.
An abrasive was obtained by implanting 0 mm and projecting 20 mm. FIG. 1 shows a perspective view of the obtained abrasive,
In the drawing, reference numeral 1 denotes a support member, and 2 denotes a polishing substrate.
【００１６】（実施例２）繊維径１０μｍのモノフィラ
メント１０００本からなるアルミナ質長繊維（Ａｌ２Ｏ
３８５重量％、ＳｉＯ２１５重量％）のロービングに、
エポキシ樹脂（エピコート８２８ 油化シェルエポキ
シ）１００重量部と、これに三フッ化ホウ素モノエチル
アミン（ステラケミファ）３重量部を加え、よく攪拌混
合したものをローラーにより連続的に含浸処理しながら
ワインダー装置でボビンに巻き取った。Example 2 Alumina long fibers (Al 2 O) comprising 1,000 monofilaments having a fiber diameter of 10 μm
3 85% by weight, SiO 2 15% by weight)
100 parts by weight of an epoxy resin (Epicoat 828 oiled shell epoxy) and 3 parts by weight of boron trifluoride monoethylamine (Stella Chemifa) were added thereto, and the mixture was thoroughly stirred and mixed. And wound it on a bobbin.
【００１７】この巻き取った含浸ストランドのボビンを
クリールに取り付け、引き出した樹脂含浸ストランド
を、約３００℃に加熱された雰囲気の長さ２ｍの硬化炉
を毎分１．６ｍの速度で連続的に通過させて断面積０．
５ｍｍ２の細線状に硬化した後、巻き取り装置に巻き取
り、それを長さ３０ｍｍに切り揃え、３０本を１束とし
て、束の片方をエポキシ接着剤で固定して研磨基材とし
た。The bobbin of the wound impregnated strand is attached to a creel, and the drawn resin impregnated strand is continuously placed in a curing furnace having a length of 2 m in an atmosphere heated to about 300 ° C. at a speed of 1.6 m / min. Cross-section of 0.
After hardening into a fine wire of 5 mm 2 , it was wound on a winding device, cut into a length of 30 mm, 30 pieces were bundled, and one of the bundles was fixed with an epoxy adhesive to obtain a polishing substrate.
【００１８】また、エポキシ樹脂（エピコート８２８
油化シェルエポキシ）１００重量部、硬化促進剤として
イミダゾール化合物（２Ｅ４ＭＺ−ＣＮ 四国化成工
業）２重量部を添加した樹脂組成物を１２０℃で２時
間、加熱硬化させ、厚さ２０ｍｍ、幅１００ｍｍ、長さ
６００ｍｍの板状支持部材とし、直径５ｍｍ、深さ１０
ｍｍの穴を格子状に５ｍｍ間隔で加工形成し、上記細線
状研磨基材を繊維の長さ方向に１０ｍｍ植設し、２０ｍ
ｍを突出させた状態として研磨材を得た。図２は得られ
た研磨材の斜視図を示すもので、図中１は支持部材、２
は研磨基材を示すものである。Further, an epoxy resin (Epicoat 828)
A resin composition containing 100 parts by weight of an oily shell epoxy) and 2 parts by weight of an imidazole compound (2E4MZ-CN Shikoku Chemicals) as a curing accelerator is heated and cured at 120 ° C. for 2 hours, and has a thickness of 20 mm and a width of 100 mm. 600mm long plate-shaped support member, diameter 5mm, depth 10
mm holes are formed at intervals of 5 mm in a grid pattern, and the fine wire-shaped abrasive substrate is implanted in a length direction of the fiber by 10 mm, and is formed by 20 m.
An abrasive was obtained with m protruding. FIG. 2 shows a perspective view of the obtained abrasive, in which 1 is a supporting member, 2
Indicates a polishing substrate.
【００１９】（実施例３）繊維径２０μｍのモノフィラ
メント１０００本からなるアルミナ質長繊維（Ａｌ２Ｏ
３８５重量％、ＳｉＯ２１５重量％）のロービングを１
６本のボビンに巻き取って組み紐機に掛け、更に、中心
にも上記ロービングを芯材として配設しながら棒状の組
み紐体を作成した。エポキシ樹脂（エピコート８２８
油化シェルエポキシ）１００重量部と、これに硬化剤と
して酸無水物（ＨＮ２２００ 日立化成工業）８０重量
部と、硬化促進剤としてイミダゾール化合物（１Ｂ２Ｍ
Ｚ 四国化成工業）２重量部を加えてよく攪拌混合した
樹脂組成物と、上記組み紐体を、レジンバスに入れて、
組み紐体に樹脂を含浸させた。このようにして得られた
樹脂を含浸した組み紐体を内径２．５ｍｍ、長さ１５０
ｍｍのパイプの中に引き込み、その状態のまま１２０℃
の硬化炉で硬化させ、硬化後にパイプの中の組み紐体を
引き抜き、直径２．５ｍｍの棒状体を得、長さ３０ｍｍ
に５等分して研磨基材とした。Example 3 Alumina long fibers (Al 2 O) consisting of 1000 monofilaments having a fiber diameter of 20 μm
3 85% by weight, SiO 2 15% by weight)
It was wound around six bobbins and hung on a braiding machine. Further, a rod-shaped braided body was prepared while the above roving was also provided as a core material at the center. Epoxy resin (Epicoat 828
Oiled shell epoxy), 100 parts by weight of an acid anhydride (HN2200 Hitachi Chemical Co., Ltd.) as a curing agent, and an imidazole compound (1B2M) as a curing accelerator
Z Shikoku Chemical Industry) Add 2 parts by weight, stir and mix well and put the above braided body in a resin bath,
The braid was impregnated with resin. The braided body impregnated with the resin obtained in this manner is 2.5 mm in inner diameter and 150 mm in length.
mm into the pipe, 120 ° C as it is
After curing, the braided body inside the pipe was pulled out to obtain a 2.5 mm diameter rod-shaped body, and the length was 30 mm.
And divided into 5 parts to obtain a polishing substrate.
【００２０】また、シリコーンゴム主剤（ＫＥ１２１６
信越化学工業）に対して硬化剤（Ｃａｔ−ＲＧ 信越
化学工業）を１０重量部加え、十分に攪拌、脱泡したシ
リコーンゴム組成物を１００℃で６０ｍｉｎ熱硬化させ
て、厚さ２０ｍｍ、幅１００ｍｍ、長さ６００ｍｍの板
状支持部材とし、直径２．５ｍｍ、深さ１０ｍｍの穴
を、格子状に５ｍｍ間隔で加工形成して、上記棒状研磨
基材を繊維の長さ方向に１０ｍｍ植設し、２０ｍｍを突
出させた状態として研磨材を得た。図３は得られた研磨
材の斜視図を示すもので、図中１は支持部材、２は研磨
基材を示すものである。The silicone rubber base (KE1216)
10 parts by weight of a curing agent (Cat-RG Shin-Etsu Chemical Co., Ltd.) was added to Shin-Etsu Chemical Co., Ltd., and the silicone rubber composition that had been sufficiently stirred and defoamed was heat-cured at 100 ° C. for 60 minutes to have a thickness of 20 mm and a width of 100 mm. A plate-shaped support member having a length of 600 mm, holes having a diameter of 2.5 mm and a depth of 10 mm are formed in a grid at intervals of 5 mm, and the bar-shaped polishing substrate is implanted in a length direction of the fiber by 10 mm. , 20 mm protruded to obtain an abrasive. FIG. 3 is a perspective view of the obtained abrasive, in which 1 is a support member, and 2 is an abrasive substrate.
【００２１】（実施例４）研磨基材は実施例３と同様に
して作成し、シリコーンゴム主材（ＫＥ１２１６信越化
学工業）に対して硬化剤（Ｃａｔ−ＲＧ 信越化学工
業）を１０重量部加え、更に、シラスバルーン（サンキ
ライトＹ０２ 三機化工建設）２０重量部を加えて十分
に攪拌、脱泡したシリコーンゴム組成物を１００℃で６
０ｍｉｎ熱硬化させて、厚さ４０ｍｍ、幅１００ｍｍ、
長さ６００ｍｍの板状支持部材とし、直径２．５ｍｍ、
深さ３０ｍｍの穴を格子状に５ｍｍ間隔で加工形成し、
また、各穴からの距離が等しくなるように幅１．５ｍ
ｍ、深さ１０ｍｍの外側端面まで通り抜けた溝を格子状
に形成し、上記棒状研磨基材の刃先先端が板状支持部材
の表面と同一面となるように各穴に植設して研磨材とし
た。図４は得られた研磨材の斜視図を示すもので、図中
１は支持部材、２は研磨基材、３は溝を示すものであ
る。Example 4 A polishing substrate was prepared in the same manner as in Example 3, and 10 parts by weight of a curing agent (Cat-RG Shin-Etsu Chemical) was added to the silicone rubber main material (KE1216 Shin-Etsu Chemical). Further, 20 parts by weight of Shirasu balloon (Sankilite Y02 Sanki Kako Construction) was added, and the mixture was sufficiently stirred and defoamed.
0min heat cured, thickness 40mm, width 100mm,
A plate-shaped support member with a length of 600 mm, a diameter of 2.5 mm,
Holes with a depth of 30 mm are formed in a grid at 5 mm intervals,
In addition, width 1.5m so that the distance from each hole is equal
m, a groove penetrating to the outer end surface having a depth of 10 mm is formed in a lattice shape, and the cutting edge of the rod-shaped polishing substrate is planted in each hole so as to be flush with the surface of the plate-like supporting member. And FIG. 4 is a perspective view of the obtained abrasive, in which 1 is a support member, 2 is an abrasive substrate, and 3 is a groove.
【００２２】（比較例１）ナイロンバフにＷＡ砥粒＃４
００を分散接着した板状の研磨材（スコッチブライト
住友スリーエム）を作成した。(Comparative Example 1) WA abrasive grains # 4 on nylon buff
Abrasive (Scotch Bright)
Sumitomo 3M) was created.
【００２３】（比較例２）ダイヤモンド砥粒＃４００を
樹脂でペレット状に成型した研磨基材を布に張り付けシ
ート状にした研磨材（日本研紙）を作成した。(Comparative Example 2) A polishing material (Nippon Kenshi) was prepared in which a polishing base material obtained by molding diamond abrasive grains # 400 into a pellet shape with a resin was adhered to a cloth and made into a sheet shape.
【００２４】上記実施例１乃至４並びに比較例１乃至２
で得られた各研磨材につき、オシレーションタイプの多
層配線基板研磨装置（オーバリーサンダー アミテッ
ク）に装着し、厚み２ｍｍの多層配線基板を１．０ｍ／
ｍｉｎのスピードで送り、研削回転数１０００ｒｐｍ、
ヘッド揺動回数５５回／ｍｉｎ（３０ｍｍ／ｓｔ）の条
件にて研磨して、研磨後の多層配線回路基板の損傷状態
について観察し、その結果を表１に示した。Examples 1 to 4 and Comparative Examples 1 and 2
Each of the abrasives obtained in (1) was mounted on an oscillation type multilayer wiring board polishing apparatus (Overly Thunder Amitec), and a multilayer wiring board having a thickness of 2 mm was placed at 1.0 m /
min speed, grinding rotation speed 1000rpm,
Polishing was performed under the conditions of a head swing frequency of 55 times / min (30 mm / st), and the damaged state of the multilayer wiring circuit board after polishing was observed. The results are shown in Table 1.
【００２５】[0025]
【表１】 [Table 1]
【００２６】表１から明かなように、実施例１乃至４及
び比較例１で得られた研磨材については、多層配線基板
の回路への損傷はないことが確認できた。As apparent from Table 1, it was confirmed that the abrasives obtained in Examples 1 to 4 and Comparative Example 1 did not damage the circuit of the multilayer wiring board.
【００２７】次ぎに、多層配線基板の伸張率について測
定し、その測定結果を表２に示した。Next, the extension ratio of the multilayer wiring board was measured, and the measurement results are shown in Table 2.
【００２８】[0028]
【表２】 [Table 2]
【００２９】表２から明かなように、実施例１乃至４及
び比較例１で得られた研磨材については、多層配線基板
の伸張がほとんどないことが確認できた。As is clear from Table 2, it was confirmed that the abrasives obtained in Examples 1 to 4 and Comparative Example 1 hardly expanded the multilayer wiring board.
【００３０】次ぎに、多層配線基板の表面粗化状態につ
いて観察し、その結果を表３に示した。Next, the surface roughness of the multilayer wiring board was observed, and the results are shown in Table 3.
【００３１】[0031]
【表３】 [Table 3]
【００３２】表３から明かなように、実施例１、２で得
られた研磨材については、比較的細かい表面仕上がりと
なり、次工程の回路レジストが良好であった。As is clear from Table 3, the abrasives obtained in Examples 1 and 2 had a relatively fine surface finish, and the circuit resist in the next step was good.
【００３３】次ぎに、多層配線基板のスルーホールのバ
リ取り除去状態について観察し、その結果を表４に示し
た。Next, the state of deburring and removal of through holes in the multilayer wiring board was observed, and the results are shown in Table 4.
【００３４】[0034]
【表４】 [Table 4]
【００３５】表４から明かなように、実施例１乃至４で
得られた研磨材については、多層配線基板上のスルーホ
ールのバリが完全に除去されていることが確認できた。As is clear from Table 4, it was confirmed that the burrs of the through holes on the multilayer wiring board were completely removed from the abrasives obtained in Examples 1 to 4.
【００３６】次ぎに、多層配線基板上の突起物の除去状
態について観察し、その結果を表５示した。Next, the state of removal of the protrusions on the multilayer wiring board was observed, and the results are shown in Table 5.
【００３７】[0037]
【表５】 [Table 5]
【００３８】表５から明かなように、実施例２乃至４で
得られた研磨材については、多層配線基板上の突起物が
完全に除去されていることが確認できた。As is clear from Table 5, it was confirmed that the protrusions on the multilayer wiring board were completely removed from the abrasives obtained in Examples 2 to 4.
【００３９】次ぎに、多層配線基板上の樹脂の除去状態
について観察し、その結果を表６示した。Next, the state of removal of the resin from the multilayer wiring board was observed, and the results are shown in Table 6.
【００４０】[0040]
【表６】 [Table 6]
【００４１】表６から明かなように、実施例４で得られ
た研磨材については、多層配線基板上の樹脂が完全に除
去されていることが確認できた。As is clear from Table 6, it was confirmed that the resin on the multilayer wiring board was completely removed from the abrasive obtained in Example 4.
【００４２】次ぎに、前記実施例１乃至４並びに比較例
１乃至２の各研磨材につき、オシレーションタイプの多
層配線基板研磨装置（オーバリーサンダー アミテッ
ク）に装着し、厚み２ｍｍのフレキシブル配線基板を
１．０ｍ／ｍｉｎのスピードで送り、研削回転数１００
０ｒｐｍ、ヘッド揺動回数５５回／ｍｉｎ（３０ｍｍ／
ｓｔ）の条件にて研磨して、フレキシブル配線基板の表
面研磨状態について観察し、その結果を表７に示した。Next, each of the abrasives of Examples 1 to 4 and Comparative Examples 1 and 2 was mounted on an oscillation type multilayer wiring board polishing apparatus (Overly Thunder Amitec) to obtain a flexible wiring board having a thickness of 2 mm. Feed at a speed of 1.0 m / min, grinding speed 100
0 rpm, head swing frequency 55 times / min (30 mm /
Polishing was performed under the conditions of st), and the surface polishing state of the flexible wiring board was observed. The results are shown in Table 7.
【００４３】[0043]
【表７】 [Table 7]
【００４４】表７から明らかなように、実施例１、２で
得られた研磨材については表面が均一に研磨されてお
り、実施例３、４の研磨材についても、凹凸部以外は均
一に研磨されていることが確認できた。As is apparent from Table 7, the surfaces of the abrasives obtained in Examples 1 and 2 were uniformly polished, and the abrasives of Examples 3 and 4 were also uniformly polished except for the uneven portions. It was confirmed that it was polished.
【００４５】本発明の研磨材は、前記実施例の材質、形
態に限定されるものではなく、例えば、図５に示すよう
に、実施例１のシート状の研磨基材２の配列方向をブロ
ックごとに変えたものに構成してもよい。The abrasive material of the present invention is not limited to the material and form of the above embodiment. For example, as shown in FIG. 5, the arrangement direction of the sheet-like abrasive substrate 2 of the first embodiment is blocked. It may be configured to be changed every time.
【００４６】また、図６に示すように、支持部材１をロ
ール状に形成し、その周囲に研磨基材２を配置させるよ
うにして、ロールバフ方式の研磨機に装着して使用する
こともできる。ロールバフ方式はオシレーションタイプ
の研磨機より相対的に研磨力が高いので、研磨基材、支
持部材に弾性のあるタイプを使用すると効果的である。As shown in FIG. 6, the support member 1 is formed in a roll shape, and the polishing base material 2 is disposed around the support member 1. The support member 1 can be mounted on a roll buff type polishing machine for use. . Since the roll buff method has a relatively higher polishing force than the oscillation type polishing machine, it is effective to use elastic types for the polishing substrate and the support member.
【００４７】本発明の研磨材は、各種形状、材質の支持
部材と研磨基材の組み合わせとして構成できるものであ
る。このように構成される研磨材の使用用途は多層配線
基板の研磨に限定されるものではないが、特に、アルミ
ニウム、マグネシウム、銅、黄銅等の成形、加工時に発
生するバリの除去に適しており、研磨材をオシレーショ
ン、回転、または、振動させて、ワークに押し当てるこ
とにより、ワークに凹凸があっても研磨材の刃先が柔軟
に動いてバリを除去し、バリの取り残しが無い。The abrasive of the present invention can be constituted as a combination of a support member of various shapes and materials and an abrasive substrate. The use of the abrasive material configured in this way is not limited to the polishing of a multilayer wiring board, but is particularly suitable for removing burrs generated during molding and processing of aluminum, magnesium, copper, brass and the like. When the abrasive is oscillated, rotated, or vibrated and pressed against the work, even if the work has irregularities, the cutting edge of the abrasive moves flexibly and removes burrs, leaving no burrs.
【００４８】[0048]
【発明の効果】以上説明したように、本発明によれば、
多層配線基板が裂けたり、伸びたりせずに、多層配線基
板回路に損傷を与えず、多層配線基板の伸張率が低く、
配線基板の表面粗化、スルーホールのバリ取り除去、突
起物の除去、樹脂の除去を可能とした研磨材及び多層配
線基板表面の研磨方法を提供できるものである。As described above, according to the present invention,
The multilayer wiring board does not break or stretch, does not damage the multilayer wiring board circuit, the extension rate of the multilayer wiring board is low,
An object of the present invention is to provide an abrasive material capable of roughening the surface of a wiring board, removing deburring of through holes, removing protrusions, and removing resin, and a method of polishing the surface of a multilayer wiring board.
【図１】 本発明研磨材の一実施例の斜視図FIG. 1 is a perspective view of one embodiment of an abrasive of the present invention.
【図２】 本発明研磨材の他実施例の斜視図FIG. 2 is a perspective view of another embodiment of the abrasive of the present invention.
【図３】 本発明研磨材の更なる他実施例の斜視図FIG. 3 is a perspective view of still another embodiment of the abrasive of the present invention.
【図４】 本発明研磨材の別の更なる他実施例の斜視図FIG. 4 is a perspective view of another further embodiment of the abrasive material of the present invention.
【図５】 本発明研磨材の変形例を示す斜視図FIG. 5 is a perspective view showing a modified example of the abrasive material of the present invention.
【図６】 本発明研磨材の他変形例を示す斜視図FIG. 6 is a perspective view showing another modified example of the abrasive of the present invention.
【図７】 従来の研磨材の斜視図FIG. 7 is a perspective view of a conventional abrasive.
【図８】 別の従来の研磨材の斜視図FIG. 8 is a perspective view of another conventional abrasive.
【図９】 多層配線基板の断面図FIG. 9 is a cross-sectional view of a multilayer wiring board.
【図１０】多層配線基板の要部拡大断面図FIG. 10 is an enlarged sectional view of a main part of the multilayer wiring board;
１ 支持部材 ２ 研磨基材 ３ 溝 １１ 内層回路 １２ スルーホール １３ 配線基板 １４ 配線基板 １５ プリプレグ １６ ブラインドスルーホール １７ 銅箔層 １８ 銅メッキ層 DESCRIPTION OF SYMBOLS 1 Support member 2 Polishing base material 3 Groove 11 Inner layer circuit 12 Through hole 13 Wiring board 14 Wiring board 15 Prepreg 16 Blind through hole 17 Copper foil layer 18 Copper plating layer
フロントページの続き (72)発明者 明石 充央 長野県上伊那郡南箕輪村3685番地の２ 大 明化学工業株式会社内 (72)発明者 松下 俊 長野県上伊那郡南箕輪村3685番地の２ 大 明化学工業株式会社内 Ｆターム(参考） 3C058 AA07 AA09 CA01 CB01 CB03 3C063 BA15 BA17 BA22 BB11 BC03 BC04 BC09 BG06 BG22 BH03 EE10 FF22 5E343 AA02 AA07 AA11 EE33 EE43 GG04 GG20 5E346 EE19 GG16 GG27 HH11 HH21 HH33 Continuing from the front page (72) Inventor Mitsuo Akashi 2682, Minamiminowa-mura, Minamiminowa-gun, Kamiina-gun, Nagano Pref. Incorporated F-term (reference) 3C058 AA07 AA09 CA01 CB01 CB03 3C063 BA15 BA17 BA22 BB11 BC03 BC04 BC09 BG06 BG22 BH03 EE10 FF22 5E343 AA02 AA07 AA11 EE33 EE43 GG04 GG20 5E346 EE19 H11H33H21
Claims (15)
して薄肉状乃至は細径状に形成した複数個の研磨基材
を、前記無機質長繊維の繊維端が研磨部となるように支
持部材に植設したことを特徴とする研磨材。1. A support member comprising a plurality of polishing bases formed by binding inorganic filaments in a resin matrix to have a thin or small diameter so that fiber ends of said inorganic filaments become polishing portions. An abrasive material characterized by being planted on a surface.
ート状としたことを特徴とする請求項１記載の研磨材。2. The abrasive according to claim 1, wherein said abrasive substrate is formed into a sheet having a thickness of 0.5 mm or less.
の細線状としたことを特徴とする請求項１記載の研磨
材。3. The polishing material according to claim 1, wherein the polishing base material has a fine line shape having a sectional area of 1.0 mm 2 or less.
したことを特徴とする請求項１記載の研磨材。4. The polishing material according to claim 1, wherein said polishing substrate is formed in a rod shape having a diameter of 3 mm or less.
るものであることを特徴とする請求項１乃至４の何れか
に記載の研磨材。5. The abrasive according to claim 1, wherein said resin matrix has rubber elasticity.
ム、ニトリルゴム、ブタジエンゴム、スチレンーブタジ
エンゴム、ブチルゴム、エチレンープロピレンゴム、フ
ッ素ゴム、シリコーンゴム、或いは、ウレタンゴムであ
ることを特徴とする請求項５記載の研磨材。6. The resin matrix according to claim 5, wherein the resin matrix is chloroprene rubber, nitrile rubber, butadiene rubber, styrene butadiene rubber, butyl rubber, ethylene-propylene rubber, fluorine rubber, silicone rubber, or urethane rubber. An abrasive as described.
含ませたことを特徴とする請求項１乃至６の何れかに記
載の研磨材。7. The polishing material according to claim 1, wherein said polishing base material contains inorganic solid spherical beads.
あることを特徴とする請求項１乃至７の何れかに記載の
研磨材。8. The abrasive according to claim 1, wherein said support member has rubber elasticity.
リルゴム、ブタジエンゴム、スチレンーブタジエンゴ
ム、ブチルゴム、エチレンープロピレンゴム、フッ素ゴ
ム、シリコーンゴム、或いは、ウレタンゴムであること
を特徴とする請求項８記載の研磨材。9. The method according to claim 8, wherein said support member is chloroprene rubber, nitrile rubber, butadiene rubber, styrene butadiene rubber, butyl rubber, ethylene-propylene rubber, fluorine rubber, silicone rubber, or urethane rubber. An abrasive as described.
特徴とする請求項１乃至９の何れかに記載の研磨材。10. The abrasive according to claim 1, wherein said support member contains abrasive grains.
せたことを特徴とする請求項１乃至１０の何れかに記載
の研磨材。11. The abrasive according to claim 1, wherein said support member includes hollow spherical beads.
に沿って少なくとも２５％以上の長さを前記支持部材内
に埋設するようにしたことを特徴とする請求項１乃至１
１の何れかに記載の研磨材。12. The polishing base material according to claim 1, wherein at least 25% or more of the length of the polishing base material is buried in the support member along the direction of the inorganic long fibers.
An abrasive according to any one of the preceding claims.
埋設したことを特徴とする請求項１２記載の研磨材。13. The abrasive according to claim 12, wherein the polishing base material is entirely embedded in the support member.
通り抜けた溝を設けたことを特徴とする請求項１３記載
の研磨材。14. The abrasive according to claim 13, wherein a groove is formed in the planting surface of the support member so as to extend to an outer end surface.
の研磨材を用いて、その研磨基材を多層配線基板に圧着
してオシレーションすることを特徴とする多層配線基板
表面の研磨方法。15. A method for polishing a surface of a multilayer wiring board, comprising using the abrasive according to claim 1 to press-bond the polishing base material to a multilayer wiring board for oscillation. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000174507A JP2001353662A (en) | 2000-06-09 | 2000-06-09 | Polishing material, and method of polishing surface of multilayer wiring board using this polishing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000174507A JP2001353662A (en) | 2000-06-09 | 2000-06-09 | Polishing material, and method of polishing surface of multilayer wiring board using this polishing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001353662A true JP2001353662A (en) | 2001-12-25 |
Family
ID=18676535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000174507A Pending JP2001353662A (en) | 2000-06-09 | 2000-06-09 | Polishing material, and method of polishing surface of multilayer wiring board using this polishing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001353662A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153376A (en) * | 2006-12-15 | 2008-07-03 | Fujitsu Ltd | Paste printing device and paste printing method |
| JP2011067904A (en) * | 2009-09-25 | 2011-04-07 | Fujibo Holdings Inc | Abrasive cloth |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279695A (en) * | 1985-10-03 | 1987-04-13 | 有限会社 白金工業所 | Printed substrate polishing device |
| JPH0179560U (en) * | 1987-11-13 | 1989-05-29 | ||
| JPH0277192A (en) * | 1989-06-23 | 1990-03-16 | Cmk Corp | Surface abrasive apparatus for printed wiring board |
| JPH02180562A (en) * | 1988-12-29 | 1990-07-13 | Genichi Sato | Polishing grindstone and manufacture thereof |
| JPH03178775A (en) * | 1989-09-13 | 1991-08-02 | Norton Co | Polished article and its manufacture |
| JPH04176136A (en) * | 1990-11-07 | 1992-06-23 | Ibiden Co Ltd | Printed-wiring board |
| JPH0593336A (en) * | 1991-09-27 | 1993-04-16 | Mazda Motor Corp | Monofilament and polishing tool using monofilament |
| JPH05301172A (en) * | 1992-04-27 | 1993-11-16 | Nippon Unit Kk | Grinder |
| JPH06278039A (en) * | 1993-03-31 | 1994-10-04 | Tokyo Jiki Insatsu Kk | Abrasive film |
| JPH06312378A (en) * | 1993-04-28 | 1994-11-08 | Hiroshi Akita | Polishing grinding wheel and manufacture thereof |
| JPH10128669A (en) * | 1996-10-28 | 1998-05-19 | Sumitomo Chem Co Ltd | Abrasive material comprising rubber containing inorganic fiber |
-
2000
- 2000-06-09 JP JP2000174507A patent/JP2001353662A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279695A (en) * | 1985-10-03 | 1987-04-13 | 有限会社 白金工業所 | Printed substrate polishing device |
| JPH0179560U (en) * | 1987-11-13 | 1989-05-29 | ||
| JPH02180562A (en) * | 1988-12-29 | 1990-07-13 | Genichi Sato | Polishing grindstone and manufacture thereof |
| JPH0277192A (en) * | 1989-06-23 | 1990-03-16 | Cmk Corp | Surface abrasive apparatus for printed wiring board |
| JPH03178775A (en) * | 1989-09-13 | 1991-08-02 | Norton Co | Polished article and its manufacture |
| JPH04176136A (en) * | 1990-11-07 | 1992-06-23 | Ibiden Co Ltd | Printed-wiring board |
| JPH0593336A (en) * | 1991-09-27 | 1993-04-16 | Mazda Motor Corp | Monofilament and polishing tool using monofilament |
| JPH05301172A (en) * | 1992-04-27 | 1993-11-16 | Nippon Unit Kk | Grinder |
| JPH06278039A (en) * | 1993-03-31 | 1994-10-04 | Tokyo Jiki Insatsu Kk | Abrasive film |
| JPH06312378A (en) * | 1993-04-28 | 1994-11-08 | Hiroshi Akita | Polishing grinding wheel and manufacture thereof |
| JPH10128669A (en) * | 1996-10-28 | 1998-05-19 | Sumitomo Chem Co Ltd | Abrasive material comprising rubber containing inorganic fiber |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153376A (en) * | 2006-12-15 | 2008-07-03 | Fujitsu Ltd | Paste printing device and paste printing method |
| JP2011067904A (en) * | 2009-09-25 | 2011-04-07 | Fujibo Holdings Inc | Abrasive cloth |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0999918B1 (en) | Polishing semiconductor wafers | |
| JP4411062B2 (en) | Super abrasive wire saw winding structure, super abrasive wire saw cutting device, and super abrasive wire saw winding method | |
| EP1009588B1 (en) | Polishing pad and method for making polishing pad with elongated microcolumns | |
| KR20010076351A (en) | Substrate polishing article | |
| KR20090021187A (en) | Polishing roll and method for manufacturing the polishing roll | |
| KR101204468B1 (en) | Abrasive brush | |
| JP2002036091A (en) | Super-abrasive grain wire saw and manufacturing method | |
| JP4024934B2 (en) | Wire saw and manufacturing method thereof | |
| JP2006007387A (en) | Super-abrasive grain wire saw | |
| JP4072512B2 (en) | Calculation method of superabrasive ratio of superabrasive wire saw | |
| JP2006326795A (en) | Grinding wheel for polishing | |
| CN101048259A (en) | Grinding material and its preparation method | |
| JP2001353662A (en) | Polishing material, and method of polishing surface of multilayer wiring board using this polishing material | |
| JP2002273663A (en) | Resin bond wire saw | |
| JP2000288903A (en) | Surface grinding method and surface grinding device using multiwire saw | |
| JP2002361564A (en) | Polishing sheet and method of manufacturing the polishing sheet | |
| KR20030091641A (en) | Polishing grindstone | |
| JP2006231451A (en) | Method and device for manufacturing resin continuous plate containing glass fiber | |
| JP4221463B2 (en) | Grinding wheel | |
| KR101092203B1 (en) | Method manufacturing diamond wire for processing semiconductor materials and diamond wire manufactured by the method | |
| JP2003291071A (en) | Polishing tool made from non-woven cloth | |
| JP4579382B2 (en) | Tube brush-like abrasive, deburring and polishing method | |
| CN219359123U (en) | Polishing pad | |
| JP2003136397A (en) | Polishing pad | |
| JP2000094344A (en) | Brush-shaped grinding tool and deburring and polishing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070510 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20091215 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A977 | Report on retrieval |
Effective date: 20091217 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20100406 |