JP2001339126A - Flexible printed board - Google Patents

Flexible printed board

Info

Publication number
JP2001339126A
JP2001339126A JP2000160093A JP2000160093A JP2001339126A JP 2001339126 A JP2001339126 A JP 2001339126A JP 2000160093 A JP2000160093 A JP 2000160093A JP 2000160093 A JP2000160093 A JP 2000160093A JP 2001339126 A JP2001339126 A JP 2001339126A
Authority
JP
Japan
Prior art keywords
fpc
width
circuit pattern
flexible printed
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000160093A
Other languages
Japanese (ja)
Inventor
Ichiro Terunuma
一郎 照沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2000160093A priority Critical patent/JP2001339126A/en
Publication of JP2001339126A publication Critical patent/JP2001339126A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent disconnection in a site that is bent for usage, and to improve reliability. SOLUTION: In an FPC 10, a conductive layer 2 having a specific pattern is formed on the upper surface of a base material 1 and further the conductive layer 2 is covered with a coverlay 3. Also, the FPC 10 is folded back by a bending line L by approximately 180 deg.. Width W1 of a circuit pattern at a part where the bending line L crosses is wider than width W2 of the circuit pattern at other parts.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、フレキシブルプ
リント基板(以下、「FPC」と略記)に関し、特に一
部が折り曲げられて使用されるFPCに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board (hereinafter abbreviated as "FPC"), and more particularly, to an FPC which is partially bent and used.

【0002】[0002]

【従来の技術】近年、FPCを自動車のワイヤーハーネ
スの代用として使用することがなされている。即ち、図
3に示すように、例えば自動車のドア20には、これに
沿ってFPC30が配設されている。ドア20に対して
各補機の位置は決められているので、補機レイアウトの
関係から、FPC30は、その一部を図中A,Bで示す
ように、折り曲げて使用されることがある。このような
自動車に配設されるFPC30の場合、コスト上の問題
等から、ベースフィルムはポリエステルフィルム(PE
T)が使用される。
2. Description of the Related Art In recent years, FPCs have been used as substitutes for wire harnesses in automobiles. That is, as shown in FIG. 3, for example, the FPC 30 is arranged along the door 20 of the automobile. Since the position of each accessory is determined with respect to the door 20, the FPC 30 may be used by bending a part of the FPC 30 as shown by A and B in the figure due to the layout of the accessory. In the case of the FPC 30 provided in such an automobile, the base film is made of a polyester film (PE
T) is used.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、FPC
のベースフィルムにPETを使用した場合に最も問題と
なるのは、回路を折り曲げたときの回路の断線である。
実際にハーネスと同様にFPCの自動車への配設を考え
た場合、180°折り返さなくてはならない部分も出て
くる。高い屈曲性能を有するポリイミドと異なり、PE
Tの場合、180°の曲げを行うと、FPCの導体への
影響が大きくなり、亀裂が発生する。振動や他の部位と
の干渉等があった場合、亀裂が進展して断線を起こすお
それがある。FPCに断線等の不具合が起きた場合、F
PCに付属しているコネクタ、外装品等全ての部品を交
換しなければならないため、莫大なコストがかかってし
まう。
However, the FPC
When PET is used as the base film, the most problem is disconnection of the circuit when the circuit is bent.
When actually arranging an FPC in a car in the same manner as a harness, there are some parts that need to be turned back by 180 degrees. Unlike polyimide, which has high bending performance, PE
In the case of T, when the bending is performed at 180 °, the influence of the FPC on the conductor increases, and a crack occurs. If there is vibration, interference with other parts, or the like, there is a possibility that cracks may develop and cause disconnection. If the FPC has a problem such as disconnection,
Since all parts such as connectors and exterior parts attached to the PC must be replaced, enormous costs are required.

【0004】本発明は、このような問題点を解決するた
めになされたもので、折り曲げて使用される部位の断線
を防止して、信頼性を向上させることができるフレキシ
ブルプリント基板を提供する事を目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and it is an object of the present invention to provide a flexible printed circuit board that can be bent to prevent disconnection of a part to be used and improve reliability. With the goal.

【0005】[0005]

【課題を解決するための手段】本発明に係るフレキシブ
ルプリント基板は、ベース材と、このベース材の上に回
路パターンを形成する導体層とを備え、前記ベース材と
導体層の一部が折り曲げられて使用されるフレキシブル
プリント基板において、折り曲げ線の交差する部分の前
記回路パターンの幅を他の部分の前記回路パターンの幅
よりも広く形成してなることを特徴とする。
A flexible printed circuit board according to the present invention includes a base material and a conductor layer for forming a circuit pattern on the base material, and the base material and a part of the conductor layer are bent. In the flexible printed circuit board to be used, the width of the circuit pattern at a portion where the bending line intersects is formed wider than the width of the circuit pattern at another portion.

【0006】本発明によれば、折り曲げ線と交差する部
分の回路パターンの幅が他の部分の回路パターンの幅よ
りも広く形成されているので、FPCの折り返しによっ
て万一導体に導体層に亀裂が発生した場合でも、断線に
至る事態を抑えることができる。
According to the present invention, since the width of the circuit pattern at the portion that intersects with the bending line is formed wider than the width of the circuit pattern at the other portion, the conductor layer is cracked by the return of the FPC. Even when the error occurs, the situation leading to disconnection can be suppressed.

【0007】なお、本発明によれば、FPCの耐折性を
向上させることができるので、ベース材としてPETを
使用することができ、これによりコスト低減が図れる。
[0007] According to the present invention, since the folding resistance of the FPC can be improved, PET can be used as the base material, thereby reducing the cost.

【0008】[0008]

【発明の実施の形態】以下、添付の図面に基づき、本発
明の好ましい実施の形態について説明する。図1は、本
発明の一実施例に係るFPC10の折り曲げ部を示す斜
視図、図2は、同折り曲げ部を展開した平面図である。
このFPC10は、ベース材1の上面に所定のパターン
の導体層2を形成し、更にその上をカバーレイ3で被覆
してなる。ベース材1はPETからなり、導体層2は電
解銅箔、圧延銅箔等からなる。また、カバーレイ3とし
ては、UV硬化樹脂、カバーレイフィルム等を使用する
ことができる。
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view showing a bent portion of an FPC 10 according to an embodiment of the present invention, and FIG. 2 is a developed plan view of the bent portion.
The FPC 10 is formed by forming a conductor layer 2 having a predetermined pattern on the upper surface of a base material 1 and covering the conductor layer 2 with a coverlay 3 thereon. The base material 1 is made of PET, and the conductor layer 2 is made of an electrolytic copper foil, a rolled copper foil, or the like. Further, as the cover lay 3, a UV curable resin, a cover lay film, or the like can be used.

【0009】このFPC10は、図2に示す折り曲げ線
Lでほぼ180°折り返される。折り曲げ線Lが交差す
る部分の回路パターンの幅W1は、他の部分の回路パタ
ーンの幅W2よりも広くなっている。このため、この実
施例によれば、折り曲げ線Lの部分が構造的に他の部分
よりも頑丈に形成されていることに加え、導体層2に万
が一亀裂が発生した場合でも、回路の幅が広いことか
ら、断線に至る事態を抑えることができる。これによ
り、作業者が折り曲げる方向を誤って、何度も折り直し
をするような不測の事態が起きた場合の断線防止にも効
果がある。
This FPC 10 is folded by approximately 180 ° at a bending line L shown in FIG. The width W1 of the circuit pattern at the portion where the bending line L intersects is wider than the width W2 of the circuit pattern at the other portion. For this reason, according to this embodiment, in addition to the fact that the bent line L portion is structurally formed more robustly than other portions, even if a crack occurs in the conductor layer 2, the circuit width is reduced. Since it is large, it is possible to suppress a situation that leads to disconnection. This is also effective in preventing disconnection in the event that an unexpected situation occurs, such as when the operator erroneously bends in the wrong direction and turns over many times.

【0010】なお、回路パターンの幅W1は、広ければ
広いほど断線に対する信頼性が高くなるが、折り曲げ作
業の効率を考慮した場合、広すぎるのも問題である。そ
こで、幅W1は、好ましくは幅W2の1.5〜2倍程度
の範囲とする。これにより、折り曲げ作業性をあまり低
下させずに、信頼性を向上させることができる。
[0010] The greater the width W1 of the circuit pattern, the higher the reliability against disconnection. However, considering the efficiency of the bending operation, there is also a problem that the width W1 is too large. Therefore, the width W1 is preferably set in a range of about 1.5 to 2 times the width W2. Thereby, the reliability can be improved without significantly lowering the bending workability.

【0011】[0011]

【発明の効果】以上述べたように本発明によれば、折り
曲げ線と交差する部分の回路パターンの幅が他の部分の
回路パターンの幅よりも広く形成されているので、FP
Cの折り曲げによって万一導体に導体層に亀裂が発生し
た場合でも、断線に至る事態を抑えることができるとい
う効果を奏する。
As described above, according to the present invention, the width of the circuit pattern at the portion intersecting the bending line is formed wider than the width of the circuit pattern at the other portions.
Even if a crack occurs in the conductor layer in the conductor due to the bending of C, an effect that disconnection can be suppressed can be suppressed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の実施例に係るFPCの折り曲げ部を
示す斜視図である。
FIG. 1 is a perspective view showing a bent portion of an FPC according to an embodiment of the present invention.

【図2】 同折り曲げ部を展開して示す平面図である。FIG. 2 is an expanded plan view showing the bent portion.

【図3】 FPCがハーネスの代わりに自動車に配設さ
れた状態を示す平面図である。
FIG. 3 is a plan view showing a state in which an FPC is provided in an automobile instead of a harness.

【符号の説明】 1…ベース材、2…導電層、3…カバーレイ、10,3
0…FPC。
[Explanation of Signs] 1. Base material, 2. Conductive layer, 3. Coverlay, 10, 3
0 ... FPC.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ベース材と、このベース材の上に回路パ
ターンを形成する導体層とを備え、前記ベース材と導体
層の一部が折り曲げられて使用されるフレキシブルプリ
ント基板において、 折り曲げ線の交差する部分の前記回路パターンの幅を他
の部分の前記回路パターンの幅よりも広く形成してなる
ことを特徴とするフレキシブルプリント基板。
1. A flexible printed circuit board comprising a base material and a conductor layer for forming a circuit pattern on the base material, wherein a part of the base material and the conductor layer is bent and used. A flexible printed circuit board, wherein a width of the circuit pattern at an intersecting portion is formed wider than a width of the circuit pattern at another portion.
【請求項2】 前記ベース材は、ポリエステルフィルム
(PET)であることを特徴とする請求項1記載のフレ
キシブルプリント基板。
2. The flexible printed circuit board according to claim 1, wherein the base material is a polyester film (PET).
JP2000160093A 2000-05-30 2000-05-30 Flexible printed board Pending JP2001339126A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000160093A JP2001339126A (en) 2000-05-30 2000-05-30 Flexible printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000160093A JP2001339126A (en) 2000-05-30 2000-05-30 Flexible printed board

Publications (1)

Publication Number Publication Date
JP2001339126A true JP2001339126A (en) 2001-12-07

Family

ID=18664339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000160093A Pending JP2001339126A (en) 2000-05-30 2000-05-30 Flexible printed board

Country Status (1)

Country Link
JP (1) JP2001339126A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005122656A1 (en) * 2004-06-10 2005-12-22 Ibiden Co., Ltd. Flex-rigid wiring board and manufacturing method thereof
US7378596B2 (en) 2003-04-18 2008-05-27 Ibiden Co., Ltd. Rigid-flex wiring board
US7423219B2 (en) 2004-06-11 2008-09-09 Ibiden Co., Ltd. Flex-rigid wiring board
JP2010010376A (en) * 2008-06-26 2010-01-14 Sumitomo Metal Mining Co Ltd Cof substrate
JP2015116380A (en) * 2013-12-19 2015-06-25 京楽産業.株式会社 Game machine
WO2018128082A1 (en) * 2017-01-05 2018-07-12 住友電工プリントサーキット株式会社 Flexible printed wiring board
WO2020218267A1 (en) * 2019-04-22 2020-10-29 株式会社村田製作所 Transmission line substrate and electronic apparatus
KR20210119792A (en) * 2020-03-25 2021-10-06 한화솔루션 주식회사 Flexible printed circuit boards with increased fixing force when folded

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7378596B2 (en) 2003-04-18 2008-05-27 Ibiden Co., Ltd. Rigid-flex wiring board
US7655869B2 (en) 2003-04-18 2010-02-02 Ibiden Co., Ltd. Flex-rigid wiring board
US8093502B2 (en) 2004-06-10 2012-01-10 Ibiden Co., Ltd. Flex-rigid wiring board and manufacturing method thereof
JP2005353827A (en) * 2004-06-10 2005-12-22 Ibiden Co Ltd Flexible rigid wiring board
WO2005122656A1 (en) * 2004-06-10 2005-12-22 Ibiden Co., Ltd. Flex-rigid wiring board and manufacturing method thereof
JP4536430B2 (en) * 2004-06-10 2010-09-01 イビデン株式会社 Flex rigid wiring board
US7423219B2 (en) 2004-06-11 2008-09-09 Ibiden Co., Ltd. Flex-rigid wiring board
JP2010010376A (en) * 2008-06-26 2010-01-14 Sumitomo Metal Mining Co Ltd Cof substrate
JP4760866B2 (en) * 2008-06-26 2011-08-31 住友金属鉱山株式会社 COF substrate
JP2015116380A (en) * 2013-12-19 2015-06-25 京楽産業.株式会社 Game machine
WO2018128082A1 (en) * 2017-01-05 2018-07-12 住友電工プリントサーキット株式会社 Flexible printed wiring board
CN110169209A (en) * 2017-01-05 2019-08-23 住友电工印刷电路株式会社 Flexible printed circuit board
JPWO2018128082A1 (en) * 2017-01-05 2019-11-07 住友電工プリントサーキット株式会社 Flexible printed wiring board
CN110169209B (en) * 2017-01-05 2022-11-29 住友电工印刷电路株式会社 Flexible printed circuit board
JP7439366B2 (en) 2017-01-05 2024-02-28 住友電工プリントサーキット株式会社 flexible printed wiring board
WO2020218267A1 (en) * 2019-04-22 2020-10-29 株式会社村田製作所 Transmission line substrate and electronic apparatus
KR20210119792A (en) * 2020-03-25 2021-10-06 한화솔루션 주식회사 Flexible printed circuit boards with increased fixing force when folded
KR102394224B1 (en) 2020-03-25 2022-05-03 한화솔루션 주식회사 Flexible printed circuit boards with increased fixing force when folded

Similar Documents

Publication Publication Date Title
JP3794556B2 (en) Laminated wiring material with laminated flat wiring material
JPH069165U (en) Flexible printed circuit board
JP2006324406A (en) Flexible/rigid multilayer printed circuit board
US20060116005A1 (en) Reinforced flexible printed circuit board
JP2001339126A (en) Flexible printed board
EP1164661B1 (en) Connecting structure of flat circuit member
JP2001339125A (en) Flexible printed board
JPH0888448A (en) Flexible printed circuit board
JP2007103631A (en) Flexible printed wiring board
KR101012699B1 (en) Flexible printed circuit board having bulgy and hollow shape and camera-phone therewith
JPS61271707A (en) Wire harness
JPH0582917A (en) Flexible wiring board
KR102392290B1 (en) Flexible printed circuit device and manufacturing method of the flexible printed circuit device
JP5119852B2 (en) Flexible wiring board
JP2008166496A (en) Flexible wiring board
JPH11195850A (en) Flexible printed board
JP2009099837A5 (en)
JP4115257B2 (en) Flexible circuit board
CN218851047U (en) Flexible circuit board and electronic device
JPH09162505A (en) Flexible printed board
JPS6180712A (en) Wire harness for automobile
JP3839968B2 (en) Flexible printed circuit board
JP2998339B2 (en) Method of forming flat wire harness
JP2005109132A (en) Flexible board
JP2849888B2 (en) Wiring junction box