JP2001326391A - Electronic device comprising molten electrode - Google Patents
Electronic device comprising molten electrodeInfo
- Publication number
- JP2001326391A JP2001326391A JP2000145055A JP2000145055A JP2001326391A JP 2001326391 A JP2001326391 A JP 2001326391A JP 2000145055 A JP2000145055 A JP 2000145055A JP 2000145055 A JP2000145055 A JP 2000145055A JP 2001326391 A JP2001326391 A JP 2001326391A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electronic device
- molten
- state
- molten electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、信頼性が高く、耐久性
に優れた電子デバイスに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having high reliability and excellent durability.
【０００２】[0002]
【従来の技術】市販の熱電デバイスや、セラミックコン
デンサおよびセラミックPTCサーミスタ等の電子デバイ
スには、固体状態の電極が備えられていることはよく知
られている。ところが、これらの固体状態の電極は、環
境変化、ジュール発熱、また外部からの熱流によって、
温度変化が生じた場合、電子デバイス内で発生する熱応
力や、電極とその周囲の材料との線膨張率の違いから生
じるせん断力によって、電極の破損や電極とその周囲の
材料との電気的接触状態の悪化が生じ、電子デバイスと
しての効率低下や故障の原因となっていた。2. Description of the Related Art It is well known that commercially available thermoelectric devices and electronic devices such as ceramic capacitors and ceramic PTC thermistors are provided with solid-state electrodes. However, these solid-state electrodes are subject to environmental changes, Joule heat, and external heat flow.
When a temperature change occurs, damage to the electrode or electrical contact between the electrode and the surrounding material is caused by thermal stress generated in the electronic device and shearing force caused by the difference in the coefficient of linear expansion between the electrode and the surrounding material. Deterioration of the contact state has occurred, causing a reduction in efficiency and failure of the electronic device.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、かかる従来
技術の有する問題を解消し、信頼性が高く、耐久性に優
れた電子デバイスを提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art and to provide an electronic device having high reliability and excellent durability.
【０００４】[0004]
【課題を解決するための手段】本発明者は、上記目的を
達成するために鋭意研究を行った結果、電子デバイスの
電極として、従来の固体状電極にかえ、溶融状態の電極
を備えることで電子デバイスの信頼性および耐久性が向
上するという知見を得て、本発明に達した。すなわち、
本発明は、溶融状態の電極を少なくとも１箇所以上備え
たことを特徴とする電子デバイスである。Means for Solving the Problems The present inventor has conducted intensive studies in order to achieve the above-mentioned object, and as a result, as a device for an electronic device, an electrode in a molten state is provided instead of a conventional solid-state electrode. The inventors have found that the reliability and durability of an electronic device are improved, and have reached the present invention. That is,
The present invention is an electronic device including at least one or more electrodes in a molten state.
【０００５】[0005]
【発明の実施の形態】以下、本発明について詳細に説明
する。本発明における溶融状態の電極とは、電子デバイ
スの使用時または非使用時の少なくともいずれかにおい
て溶融状態にある電極のことである。溶融状態とは、融
点以上の温度で液体状態であることを示しており、Hgな
どのように常温で液体のものも含む。この溶融状態の電
極は固体状態でないため、熱応力やせん断力による電極
の破損や電極とその周囲との材料との電気的接触状態の
悪化による電子デバイスの効率低下や故障を防ぎ、電極
の信頼性を向上させることができる。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. The electrode in the molten state in the present invention is an electrode in a molten state at least when the electronic device is used or not used. The molten state indicates a liquid state at a temperature equal to or higher than the melting point, and includes a liquid state at room temperature such as Hg. Since the electrode in the molten state is not in a solid state, it prevents the electrode from being damaged due to thermal stress or shear force and the efficiency and failure of the electronic device from being deteriorated due to the deterioration of the electrical contact between the electrode and the surrounding material. Performance can be improved.
【０００６】本発明において電極材料としては、Au、A
g、Cu、Pb、Pt、Sn、Ni、W、Mo、Na、K、Li、Zn、Cr、F
e、Mn、Pd、In、Sb、Te、Ti、Hgなどの金属、または、
これらの複合金属あるいは、金属化合物、複合金属化合
物、あるいはその他の導電性材料が使用される。電極材
料の選択は、電子デバイスの使用時または非使用時の温
度と、電極材料の融点、沸点、揮発性及び電極の周囲の
材料との濡れ性や反応性との関係において決定される。
例えば、1000℃の熱源を利用する熱電変換デバイスの場
合には、熱伝導性、電気伝導性に優れたAgなどが好まし
い。[0006] In the present invention, Au, A
g, Cu, Pb, Pt, Sn, Ni, W, Mo, Na, K, Li, Zn, Cr, F
metals such as e, Mn, Pd, In, Sb, Te, Ti, Hg, or
These composite metals, metal compounds, composite metal compounds, or other conductive materials are used. The choice of the electrode material is determined by the relationship between the temperature when the electronic device is used or not used, the melting point, the boiling point, the volatility of the electrode material, and the wettability and reactivity with the material around the electrode.
For example, in the case of a thermoelectric conversion device using a heat source of 1000 ° C., Ag or the like having excellent heat conductivity and electric conductivity is preferable.
【０００７】溶融状態の電極は、溶融時の流動性により
移動しないように、電極周囲を封止したり、溶融状態に
おいて発生する付着力を利用して周囲の物質に固定され
るが、電子デバイスの取り扱いが容易になることから、
電極周囲を封止する方法が好ましく採用される。溶融状
態の電極を封止する材料としては、珪酸ガラス、アルミ
ナ、炭化珪素、ステンレスなどの耐熱性材料があげら
れ、接合能力を付与する場合には、珪酸ガラス、各種セ
ラミックス又は金属系もしくは樹脂系バインダーなどと
混合してもよい。電極周囲を封止する場合、封止された
空間内には電極の溶融状態と固体状態における体積変化
を考慮して、空気や不活性ガスなどを加えておいてもよ
い。An electrode in a molten state is sealed around the electrode or is fixed to a surrounding substance by using an adhesive force generated in the molten state so as not to move due to fluidity at the time of melting. Is easier to handle,
A method of sealing around the electrodes is preferably employed. Examples of the material for sealing the electrode in the molten state include heat-resistant materials such as silicate glass, alumina, silicon carbide, and stainless steel. You may mix with a binder etc. When the periphery of the electrode is sealed, air, an inert gas, or the like may be added to the sealed space in consideration of the volume change between the molten state and the solid state of the electrode.
【０００８】本発明の電子デバイスとは、少なくとも１
組の電極を有し、電極間に電圧を印加することで機能を
発揮したり、あるいは電極間から電圧を発生させること
で機能を発揮するような、電極部において電気又は電子
の移動が発生するデバイスのことである。[0008] The electronic device of the present invention comprises at least one
A set of electrodes has a function by applying a voltage between the electrodes, or a function is achieved by generating a voltage between the electrodes. A device.
【０００９】本発明の電子デバイスについて、図１に例
を示しながら説明する。本発明の電子デバイスは、電子
デバイスの基本特性を決定する電子デバイス材料１があ
り、この電子デバイス材料１の端部に、溶融状態の電極
（以下、溶融電極）２が電気的に接合されていて、この
溶融電極２は溶融電極封止材３、４で封止されている。
さらに溶融電極２と電気的に接合されたリード線５を備
えている。ここで、溶融電極封止材３が導電材料であ
り、溶融電極２とリード線５は溶融電極封止材３をはさ
んで電気的に接合されていてもよい。The electronic device of the present invention will be described with reference to FIG. The electronic device of the present invention includes an electronic device material 1 that determines basic characteristics of the electronic device, and an electrode 2 in a molten state (hereinafter, a molten electrode) 2 is electrically connected to an end of the electronic device material 1. The molten electrode 2 is sealed with the molten electrode sealing materials 3 and 4.
Further, a lead wire 5 electrically connected to the molten electrode 2 is provided. Here, the molten electrode sealing material 3 may be a conductive material, and the molten electrode 2 and the lead wire 5 may be electrically joined with the molten electrode sealing material 3 interposed therebetween.
【００１０】上記電子デバイスの具体例としては、熱電
変換デバイスが挙げられる。熱電変換デバイスとは、デ
バイスの両側に温度差が発生した場合に、電極間に起電
力が発生する電子デバイスのことであり、一般にはゼー
ベック素子、ペルチェ素子、熱電対などとして身近に利
用されている。これらの中で、特にゼーベック効果を利
用したゼーベック素子は、大きな温度差を利用するた
め、溶融状態の電極の利用が有効である。As a specific example of the above electronic device, there is a thermoelectric conversion device. A thermoelectric conversion device is an electronic device that generates an electromotive force between electrodes when a temperature difference occurs on both sides of the device. I have. Among these, in particular, the Seebeck element utilizing the Seebeck effect utilizes a large temperature difference, and thus it is effective to use a molten electrode.
【００１１】[0011]
【実施例】以下、本発明を実施例によって具体的に説明
する。The present invention will be specifically described below with reference to examples.
【００１２】実施例１ 図２に示したように、溶融電極を有する熱電変換デバイ
ス６は、N型素子７、P型素子８、基材（吸熱側）９、基
材（放熱側）10、固体状電極11、溶融電極（Ag）12、溶
融電極封止材13、リード線14より構成され、基材９には
セラミックヒーター15、基材10には水冷管16が熱的に接
触している。セラミックヒーター温度を1000℃に設定
し、水冷管には15℃の水を流した。このとき、溶融電極
12は溶融状態となっている。この熱電変換デバイスを、
３ヶ月間連続運転させた。リード線間の出力電圧は、運
転開始より１日後で0.20V、３ヶ月後で0.20Vであり、安
定した状態であった。またリード線間に外部電圧を５V
印加し、内部抵抗を測定したところ、運転開始より１日
後は0.37Ω、３ヶ月後で0.38Ωであった。このような大
きな温度差のもとでの連続運転において全く熱電変換デ
バイスの性能劣化は見られなかった。Embodiment 1 As shown in FIG. 2, a thermoelectric conversion device 6 having a molten electrode includes an N-type element 7, a P-type element 8, a substrate (heat absorbing side) 9, a substrate (radiating side) 10, It is composed of a solid electrode 11, a molten electrode (Ag) 12, a molten electrode sealing material 13, and a lead wire 14. A ceramic heater 15 is in contact with the substrate 9, and a water cooling tube 16 is in thermal contact with the substrate 10. I have. The temperature of the ceramic heater was set at 1000 ° C., and water at 15 ° C. was passed through the water cooling tube. At this time, the molten electrode
12 is in a molten state. This thermoelectric conversion device,
It was operated continuously for three months. The output voltage between the lead wires was 0.20 V one day after the start of operation, and 0.20 V three months later, and was in a stable state. 5V external voltage between lead wires
When the voltage was applied and the internal resistance was measured, it was 0.37Ω one day after the start of operation and 0.38Ω three months later. No performance degradation of the thermoelectric conversion device was observed in continuous operation under such a large temperature difference.
【００１３】比較例１ 図３に示したように、溶融電極（Ag）を固体状電極（P
t）18にかえた熱電変換デバイス17を用いて、実施例１
と同様に３ヶ月間連続運転した。このとき、固体状電極
18は固体状態である。リード線間の出力電圧は、運転開
始より１日後で0.20V、３ヶ月後で0.20Vであり、安定し
た状態であったが、リード線間に外部電圧を５V印加
し、内部抵抗を測定したところ、運転開始より１日後は
0.37Ω、３ヶ月後で5.8Ωであった。固体状電極を使用
した場合には熱電変換デバイスの内部抵抗の増加による
性能劣化が確認された。Comparative Example 1 As shown in FIG. 3, a molten electrode (Ag) was replaced with a solid electrode (P
t) Example 1 using the thermoelectric conversion device 17 changed to 18
The operation was continued for 3 months in the same manner as described above. At this time, the solid electrode
18 is in the solid state. The output voltage between the lead wires was 0.20 V one day after the start of operation, and 0.20 V three months later, and was in a stable state. However, an external voltage of 5 V was applied between the lead wires, and the internal resistance was measured. However, one day after the start of operation
It was 0.37Ω and 5.8Ω after 3 months. When a solid electrode was used, performance degradation due to an increase in the internal resistance of the thermoelectric conversion device was confirmed.
【００１４】[0014]
【発明の効果】本発明の電子デバイスは、溶融状態の電
極を少なくとも１箇所以上備えているため、従来の電極
接合部での破損等による電子デバイスの内部抵抗の増加
を防ぐことが容易となる。したがって、熱電発電デバイ
スのように長時間使用するデバイスにおいても、性能劣
化が少なく、信頼性が高いものとなる。Since the electronic device of the present invention has at least one or more electrodes in a molten state, it is easy to prevent an increase in the internal resistance of the electronic device due to breakage at a conventional electrode junction. . Therefore, even for a device that is used for a long time, such as a thermoelectric power generation device, performance degradation is small and reliability is high.
【図１】溶融電極を備えた電子デバイスの一例を示す図
である。FIG. 1 is a diagram illustrating an example of an electronic device including a molten electrode.
【図２】溶融電極を備えた熱電変換デバイスの一例を示
す図である。FIG. 2 is a diagram illustrating an example of a thermoelectric conversion device including a molten electrode.
【図３】溶融電極を備えない従来の固体状電極を備えた
熱電変換デバイスの一例を示す図である。FIG. 3 is a diagram showing an example of a thermoelectric conversion device provided with a conventional solid electrode without a molten electrode.
１ 電子デバイス材料 ２ 溶融電極 ３ 溶融電極封止材 ４ 溶融電極封止材 ５ リード線 ６ 熱電変換デバイス ７ N型素子 ８ P型素子 ９ 基材（吸熱側） 10 基材（放熱側） 11 固体状電極 12 溶融電極（Ag） 13 溶融電極封止材 14 リード線 15 セラミックヒーター 16 水冷管 17 熱電変換デバイス 18 固体状電極（Pt） DESCRIPTION OF SYMBOLS 1 Electronic device material 2 Fused electrode 3 Fused electrode sealing material 4 Fused electrode sealing material 5 Lead wire 6 Thermoelectric conversion device 7 N-type element 8 P-type element 9 Base material (heat absorbing side) 10 Base material (radiation side) 11 Solid Shaped electrode 12 Fused electrode (Ag) 13 Fused electrode sealing material 14 Lead wire 15 Ceramic heater 16 Water cooling tube 17 Thermoelectric conversion device 18 Solid-state electrode (Pt)
Claims (2)
備えたことを特徴とする電子デバイス。1. An electronic device comprising at least one electrode in a molten state.
ことを特徴とする請求項１記載の電子デバイス。2. The electronic device according to claim 1, wherein the electronic device is a thermoelectric conversion device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000145055A JP2001326391A (en) | 2000-05-17 | 2000-05-17 | Electronic device comprising molten electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000145055A JP2001326391A (en) | 2000-05-17 | 2000-05-17 | Electronic device comprising molten electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001326391A true JP2001326391A (en) | 2001-11-22 |
Family
ID=18651619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000145055A Pending JP2001326391A (en) | 2000-05-17 | 2000-05-17 | Electronic device comprising molten electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001326391A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010278035A (en) * | 2009-05-26 | 2010-12-09 | Swcc Showa Cable Systems Co Ltd | Thermoelectric conversion module |
| US8846439B2 (en) | 2012-05-28 | 2014-09-30 | Hitachi High-Technologies Corporation | Method and apparatus for forming pattern |
| US9601679B2 (en) | 2013-04-10 | 2017-03-21 | Hitachi Chemical Co., Ltd. | Thermoelectric module and method of manufacturing the same |
-
2000
- 2000-05-17 JP JP2000145055A patent/JP2001326391A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010278035A (en) * | 2009-05-26 | 2010-12-09 | Swcc Showa Cable Systems Co Ltd | Thermoelectric conversion module |
| US8846439B2 (en) | 2012-05-28 | 2014-09-30 | Hitachi High-Technologies Corporation | Method and apparatus for forming pattern |
| US9223228B2 (en) | 2012-05-28 | 2015-12-29 | Hitachi High-Technologies Corporation | Method and apparatus for forming pattern |
| US9601679B2 (en) | 2013-04-10 | 2017-03-21 | Hitachi Chemical Co., Ltd. | Thermoelectric module and method of manufacturing the same |
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