JP2001271149A - Stainless steel/aluminum clad plate having improved delamination resistance - Google Patents

Stainless steel/aluminum clad plate having improved delamination resistance

Info

Publication number
JP2001271149A
JP2001271149A JP2000085711A JP2000085711A JP2001271149A JP 2001271149 A JP2001271149 A JP 2001271149A JP 2000085711 A JP2000085711 A JP 2000085711A JP 2000085711 A JP2000085711 A JP 2000085711A JP 2001271149 A JP2001271149 A JP 2001271149A
Authority
JP
Japan
Prior art keywords
stainless steel
aluminum
clad plate
intermetallic compound
aluminum clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000085711A
Other languages
Japanese (ja)
Inventor
Tatsuhiro Den
達博 傳
Akihiro Nakamura
明博 中村
Kenji Hara
健治 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Nisshin Co Ltd
Original Assignee
Nisshin Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nisshin Steel Co Ltd filed Critical Nisshin Steel Co Ltd
Priority to JP2000085711A priority Critical patent/JP2001271149A/en
Publication of JP2001271149A publication Critical patent/JP2001271149A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cookers (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a stainless steel/aluminum clad plate causing neither formation nor growth of intermetallic compounds such as FeAl3 and Fe2Al5, at the interface even if heated for a long time, and consequently keeping excellent heat resistance and delamination resistance. SOLUTION: The stainless steel/aluminum clad plate is constituted by cladding a stainless steel plate containing, by mass, <=0.03% C and >=0.2% Nb with aluminum or aluminum alloy plate. By controlling C content in the stainless steel and adding Nb, interdiffusion reaction between Fe and Al is prevented, and consequently delamination can be suppressed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、200〜500℃程度
の温度域に長時間加熱されても金属間化合物の生成・成
長がなく、耐層間剥離性が改善されたステンレス鋼/ア
ルミニウムクラッド板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stainless steel / aluminum clad plate which has no intermetallic compound formation and growth and has improved delamination resistance even when heated to a temperature range of about 200 to 500 DEG C. for a long time. About.

【0002】[0002]

【従来の技術】特性の異なる異種金属を複合したクラッ
ド板は、異種金属それぞれの長所を兼ね備えた材料とし
て厨房用品,建材,電子部品,配管等の広範な分野で使
用されている。なかでも、耐食性及び強度に優れたステ
ンレス鋼と熱伝導性の良好なアルミニウムとを組み合わ
せたステンレス鋼/アルミニウムクラッド板は、電磁調
理器用途に広く使用されている。ところが、200〜5
00℃の比較的低温域に長時間曝される部材としてステ
ンレス鋼/アルミニウムクラッド板を使用すると、ステ
ンレス鋼/アルミニウムの接合界面に相互拡散による硬
くて脆い金属間化合物層が生成する。たとえば、ステン
レス鋼(SUS430)/アルミニウム(A1100)
クラッド板を500℃に加熱すると、ステンレス鋼/ア
ルミニウムの接合界面でステンレス鋼側からアルミニウ
ム側にFeが拡散すると共に、アルミニウム側からステ
ンレス鋼側にAlが拡散する。
2. Description of the Related Art A clad plate in which dissimilar metals having different properties are combined has been used in a wide range of fields such as kitchenware, building materials, electronic components, and piping as materials having the advantages of the dissimilar metals. Above all, a stainless steel / aluminum clad plate obtained by combining stainless steel having excellent corrosion resistance and strength with aluminum having good thermal conductivity is widely used for electromagnetic cookers. However, 200-5
When a stainless steel / aluminum clad plate is used as a member that is exposed to a relatively low temperature range of 00 ° C. for a long time, a hard and brittle intermetallic compound layer is generated at the joint interface between the stainless steel and aluminum by mutual diffusion. For example, stainless steel (SUS430) / aluminum (A1100)
When the clad plate is heated to 500 ° C., Fe diffuses from the stainless steel side to the aluminum side at the joint interface of stainless steel / aluminum, and Al diffuses from the aluminum side to the stainless steel side.

【0003】加熱時間の経過に従って、ステンレス鋼1
とアルミニウム2との間の接合界面(図1a)でFeと
Alとの相互拡散が進行し、硬質で脆いFeAl3,F
2Al5等の金属間化合物3が生成する。初期段階で
は、ステンレス鋼1中のAlの拡散速度よりもアルミニ
ウム2中のFeの拡散速度が速いため、金属間化合物3
は、アルミニウム2側に向かって成長し、ステンレス鋼
/アルミニウムの接合界面で部分的にアルミニウム2側
の突出した舌状に成長する(図1b)。接合界面の各部
に生成した金属間化合物3は、更に加熱が継続すると、
接合界面全域に層状に成長する(図1c)。
[0003] As the heating time elapses, stainless steel 1
Interdiffusion of Fe and Al progresses at the joint interface between Al and aluminum 2 (FIG. 1a), and the hard and brittle FeAl 3 , F
An intermetallic compound 3 such as e 2 Al 5 is generated. In the initial stage, the diffusion rate of Fe in aluminum 2 is higher than the diffusion rate of Al in stainless steel 1,
Grows toward the aluminum 2 side and partially grows in a protruding tongue shape on the aluminum 2 side at the stainless steel / aluminum joint interface (FIG. 1b). When the intermetallic compound 3 generated at each part of the bonding interface is further heated,
It grows in layers over the entire bonding interface (FIG. 1c).

【0004】金属間化合物3は温度が高いほど成長速度
が速くなり、加熱時間に応じて成長し、金属間化合物3
が厚くなる。ステンレス鋼/アルミニウムの接合界面に
金属間化合物3が部分的に生成している状態(図1b)
では、金属間化合物3のない接合界面部分で接合強度が
保たれている。ところが、金属間化合物3が接合界面全
域に層状に厚く成長すると(図1c)、金属間化合物3
自体が硬くて脆いため、ステンレス鋼/アルミニウムク
ラッド板の接合強度がほとんどなくなる。その結果、僅
かな衝撃でもステンレス鋼1とアルミニウム2との間に
剥離が生じる。
The growth rate of the intermetallic compound 3 increases as the temperature increases, and grows in accordance with the heating time.
Becomes thicker. A state in which intermetallic compound 3 is partially formed at the stainless steel / aluminum joint interface (FIG. 1b)
In the example, the bonding strength is maintained at the bonding interface portion where there is no intermetallic compound 3. However, when the intermetallic compound 3 grows in a layered manner over the entire bonding interface (FIG. 1c), the intermetallic compound 3
Since it is hard and brittle, the bonding strength of the stainless steel / aluminum clad plate is almost lost. As a result, even a slight impact causes separation between the stainless steel 1 and the aluminum 2.

【0005】[0005]

【発明が解決しようとする課題】アルミニウムとクラッ
ドされる鋼板に適正量のNを添加すると、接合界面にA
lN化合物が生成し、Fe及びAlの相互拡散反応が抑
えられる(特公昭46−42296号公報,特公昭63
−11981号公報,特公昭57−36346号公
報)。しかし、Nの添加効果は、ステンレス鋼/アルミ
ニウムクラッド板では有効でない。ステンレス鋼板で
は、比較的多量に含まれるCrのためにNの添加効果が
打ち消され、Fe及びAlの相互拡散が抑えられない。
その結果、ステンレス鋼/アルミニウムの接合界面に金
属間化合物が生じやすく、接合界面でアルミニウムがス
テンレス鋼から剥離しやすくなる。
When an appropriate amount of N is added to a steel sheet clad with aluminum, A
An 1N compound is formed and the interdiffusion reaction between Fe and Al is suppressed (JP-B-46-42296, JP-B-63).
-11981, JP-B-57-36346). However, the effect of adding N is not effective in the stainless steel / aluminum clad plate. In a stainless steel sheet, the effect of adding N is negated due to Cr contained in a relatively large amount, and the interdiffusion of Fe and Al cannot be suppressed.
As a result, an intermetallic compound is easily generated at the stainless steel / aluminum joint interface, and aluminum is easily separated from the stainless steel at the joint interface.

【0006】[0006]

【課題を解決するための手段】本発明は、このような問
題を解消すべく案出されたものであり、Fe及びAlの
相互拡散がNbによって抑制されるとの知見を基に、所
定量のNbを添加したステンレス鋼を基材に使用するこ
とにより、耐熱性及び耐層間剥離性に優れたステンレス
鋼/アルミニウムクラッド板を提供することを目的とす
る。本発明のステンレス鋼/アルミニウムクラッド板
は、その目的を達成するため、C:0.03質量%以下
及びNb:0.2質量%以上を含むステンレス鋼を基材
とし、該ステンレス鋼にアルミニウム又はアルミニウム
合金をクラッドしていることを特徴とする。
SUMMARY OF THE INVENTION The present invention has been devised to solve such a problem, and based on the finding that the interdiffusion of Fe and Al is suppressed by Nb, a predetermined amount is determined. An object of the present invention is to provide a stainless steel / aluminum clad plate excellent in heat resistance and delamination resistance by using a stainless steel to which Nb is added as a base material. In order to achieve the object, the stainless steel / aluminum clad plate of the present invention is based on a stainless steel containing C: 0.03% by mass or less and Nb: 0.2% by mass or more, and the stainless steel contains aluminum or aluminum. It is characterized by being clad with an aluminum alloy.

【0007】ステンレス鋼としては、鋼種に別段の制約
が加わるものではなく、フェライト系,オーステナイト
系,マルテンサイト系,二相系等各種ステンレス鋼が使
用される。ステンレス鋼にクラッドされるアルミニウム
又はアルミニウム合金としても、純アルミニウムや種々
のアルミニウム合金が使用される。
As the stainless steel, there is no particular restriction on the type of steel, and various stainless steels such as ferritic, austenitic, martensitic, and duplex stainless steels are used. Pure aluminum and various aluminum alloys are also used as aluminum or aluminum alloy clad on stainless steel.

【0008】[0008]

【作用】本発明者等は、ステンレス鋼/アルミニウムク
ラッド板が加熱されたときに生じる金属間化合物の生成
・成長過程を詳細に調査検討した。その結果、金属間化
合物の生成・成長は、ステンレス鋼の成分,特にC含有
量及びNb含有量に大きく影響されることを見出した。
C含有量及びNb含有量が金属間化合物の生成・成長に
及ぼす影響は次のように推察される。金属間化合物は、
ステンレス鋼/アルミニウムの接合界面でFeとAlと
の相互拡散が加熱により促進され、Fe及びAlが金属
間化合物を生成する濃度割合に達し、金属間化合物の生
成に必要なエネルギー(加熱温度)が加えられていると
きに生成する。このとき、ステンレス鋼にNbが添加さ
れていると、Fe/Alの相互拡散反応を助長するCが
炭化物NbCとして固定され、FeAl3,Fe2Al5
等の金属間化合物の生成温度も高くなる。その結果,金
属間化合物の生成・成長が抑制され、耐層間剥離性が改
善される。しかし、Nbと同様にCを炭化物として固定
する作用のあるTiでは、金属間化合物の生成を抑制す
る効果がみられない。
The present inventors have studied in detail the process of forming and growing intermetallic compounds generated when a stainless steel / aluminum clad plate is heated. As a result, it has been found that the formation and growth of the intermetallic compound is greatly affected by the components of stainless steel, particularly the C content and the Nb content.
The effects of the C content and the Nb content on the formation and growth of the intermetallic compound are presumed as follows. The intermetallic compound is
Interdiffusion between Fe and Al is promoted by heating at the stainless steel / aluminum joint interface, the concentration ratio of Fe and Al reaches the concentration at which an intermetallic compound is formed, and the energy (heating temperature) required for the formation of the intermetallic compound is reduced. Generate when added. At this time, if Nb is added to the stainless steel, C that promotes the interdiffusion reaction of Fe / Al is fixed as carbide NbC, and FeAl 3 , Fe 2 Al 5
, Etc., also increases. As a result, generation and growth of intermetallic compounds are suppressed, and the delamination resistance is improved. However, Ti, which acts to fix C as a carbide like Nb, has no effect of suppressing the formation of intermetallic compounds.

【0009】実際、ステンレス鋼(SUS430)/ア
ルミニウムクラッド板(A1100)を400℃で40
00時間加熱したところ、接合界面全域に層厚20μm
の金属間化合物が接合界面全域に生成していた。他方、
Nb:0.4質量%を含むステンレス鋼にアルミニウム
(A1100)を被覆したステンレス鋼/アルミニウム
クラッド板を同じ条件下で加熱したものでは、金属間化
合物の生成が検出されなかった。Nbにより金属間化合
物の生成・成長が抑制される作用は、Nb含有量:0.
2質量%以上みられ、Nb含有量の増加に応じて抑制作
用が強くなる。しかし、必要以上に高価なNbを添加す
ることは、鋼材コストを上昇させる原因となるので、
1.0質量%に上限を定めることが好ましい。Fe/A
lの相互拡散反応を助長するCの影響は、C含有量を
0.03質量%以下に低減することにより抑えられる。
In practice, a stainless steel (SUS430) / aluminum clad plate (A1100) was treated at 400 ° C. for 40 minutes.
After heating for 00 hours, a layer thickness of 20 μm
Was formed over the entire bonding interface. On the other hand,
When a stainless steel / aluminum clad plate in which stainless steel containing 0.4% by mass of Nb was coated with aluminum (A1100) was heated under the same conditions, generation of an intermetallic compound was not detected. The effect of suppressing the formation and growth of the intermetallic compound by Nb is as follows.
2% by mass or more, and the inhibitory effect becomes stronger as the Nb content increases. However, the addition of unnecessarily expensive Nb increases the cost of steel,
It is preferable to set the upper limit to 1.0% by mass. Fe / A
The effect of C that promotes the interdiffusion reaction of 1 can be suppressed by reducing the C content to 0.03% by mass or less.

【0010】このようにして耐層間剥離性が改善された
ステンレス鋼/アルミニウムクラッド板は、ステンレス
鋼及びアルミニウム又はアルミニウム合金双方の特性が
活用され、耐熱性,耐食性,熱伝導性,電気伝導性等が
要求される各種部材として使用される。
[0010] The stainless steel / aluminum clad plate having improved delamination resistance as described above utilizes the properties of both stainless steel and aluminum or aluminum alloy, and has heat resistance, corrosion resistance, thermal conductivity, electric conductivity, etc. Are used as various members that require the following.

【0011】[0011]

【実施例】表1の組成をもつ各種ステンレス鋼とアルミ
ニウム(A1100)を重ね合わせ、圧下率40%で圧
延接合することにより、板厚1.2mmのステンレス鋼
/アルミニウムクラッド板を製造した。得られた各ステ
ンレス鋼/アルミニウムクラッド板から試験片を切り出
し、400℃で4000時間加熱保持した。次いで、各
試験片の接合界面を顕微鏡観察及びEPMA観察し、金
属間化合物の生成有無を調査した。
EXAMPLES A stainless steel / aluminum clad plate having a thickness of 1.2 mm was manufactured by laminating various stainless steels having the compositions shown in Table 1 and aluminum (A1100) and rolling and joining them at a rolling reduction of 40%. A test piece was cut out from each of the obtained stainless steel / aluminum clad plates and heated and maintained at 400 ° C. for 4000 hours. Next, the bonding interface of each test piece was observed under a microscope and EPMA, and the presence or absence of the formation of an intermetallic compound was examined.

【0012】表1の調査結果にみられるように、本発明
で規定した量のNb及びCを含むステンレス鋼を基材と
した試験番号4〜7では、ステンレス鋼/アルミニウム
の接合界面に金属間化合物が検出されず、加熱保持後に
も30N/mm2以上と良好な接合強度が保たれてい
た。これに対し、Nb無添加のステンレス鋼を基材とし
た試験番号1,10〜12や、Nb含有量が少ない試験
番号2では、ステンレス鋼/アルミニウムの接合界面に
最大層厚30μmの金属化合物層が層状に成長した。ま
た、0.2質量%以上のNbが含まれていてもC含有量
が過剰の試験番号8,9では、厚い金属間化合物層が接
合界面に成長していた。更に、Nbと同様にCを固定す
る作用のあるTiを添加した試験番号10〜12でも、
金属間化合物層が検出された。この対比から明らかなよ
うに、基材として使用するステンレス鋼のC含有量を
0.03質量%以下に規制すると共に0.02質量%以
上のNbを添加することにより、Fe/Alの相互拡散
反応が抑制され、200〜500℃の温度域に長時間加
熱されても層間剥離のないクラッド材が得られることが
確認された。
As can be seen from the survey results in Table 1, in Test Nos. 4 to 7 using a stainless steel containing Nb and C in the amounts specified in the present invention, the interfacial surface of the stainless steel / aluminum was No compound was detected, and good bonding strength of 30 N / mm 2 or more was maintained even after heating and holding. On the other hand, in Test Nos. 1 and 10 to 12 using Nb-free stainless steel as a base material and Test No. 2 having a small Nb content, a metal compound layer having a maximum layer thickness of 30 μm was formed at the stainless steel / aluminum bonding interface. Grew in layers. Further, in Test Nos. 8 and 9 in which the C content was excessive even when Nb was contained in an amount of 0.2% by mass or more, a thick intermetallic compound layer was grown at the bonding interface. Further, even in Test Nos. 10 to 12 in which Ti having an action of fixing C like Nb was added,
An intermetallic compound layer was detected. As is clear from this comparison, the C / C content of the stainless steel used as the base material is regulated to not more than 0.03% by mass, and by adding 0.02% by mass or more of Nb, the mutual diffusion of Fe / Al is performed. It was confirmed that the reaction was suppressed, and a clad material free of delamination was obtained even when heated to a temperature range of 200 to 500 ° C. for a long time.

【0013】 [0013]

【0014】[0014]

【発明の効果】以上に説明したように、本発明のステン
レス鋼/アルミニウムクラッド板は、基材に使用される
ステンレス鋼のC含有量を0.03質量%以下に規制し
且つNbを0.2質量%以上添加することにより、Fe
/Alの相互拡散反応が抑制され、長時間加熱されても
ステンレス鋼/アルミニウムの接合界面に金属間化合物
が生成・成長することなく、優れた耐層間剥離性を呈す
る。そのため、ステンレス鋼及びアルミニウムそれぞれ
の長所を活用し、各種厨房機器,建材,電子部品等、広
範な分野で使用される。
As described above, in the stainless steel / aluminum clad plate of the present invention, the C content of the stainless steel used for the base material is regulated to 0.03 mass% or less, and Nb is set to 0.1% by mass. By adding 2% by mass or more, Fe
/ Al inter-diffusion reaction is suppressed, and even when heated for a long time, an intermetallic compound is not generated and grown at the joint interface between stainless steel / aluminum, and exhibits excellent delamination resistance. Therefore, it is used in a wide range of fields, such as various kitchen appliances, building materials, and electronic components, utilizing the advantages of each of stainless steel and aluminum.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 ステンレス鋼/アルミニウムの接合界面に生
成・成長する金属間化合物の説明図
FIG. 1 is an explanatory view of an intermetallic compound generated and grown at a stainless steel / aluminum joint interface.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) // A47J 36/02 A47J 36/02 A (72)発明者 原 健治 兵庫県尼崎市鶴町1番地 日新製鋼株式会 社技術研究所内 Fターム(参考) 4B055 AA50 BA13 BA14 BA22 FB02 FB04 FB05 FC08 FD10 FE10 4F100 AB04A AB10B AB13 AB31B BA02 GB08 GB48 JB02 JJ03 JL11 4K044 AA03 BA10 BC05 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // A47J 36/02 A47J 36/02 A (72) Inventor Kenji Hara 1 Tsurumachi, Amagasaki-shi, Hyogo Nisshin 4B055 AA50 BA13 BA14 BA22 FB02 FB04 FB05 FC08 FD10 FE10 4F100 AB04A AB10B AB13 AB31B BA02 GB08 GB48 JB02 JJ03 JL11 4K044 AA03 BA10 BC05

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 C:0.03質量%以下及びNb:0.
2質量%以上を含むステンレス鋼を基材とし、該ステン
レス鋼にアルミニウム又はアルミニウム合金がクラッド
されていることを特徴とする耐層間剥離性が改善された
ステンレス鋼/アルミニウムクラッド板。
1. C: 0.03% by mass or less and Nb: 0.
A stainless steel / aluminum clad plate having improved delamination resistance, wherein a stainless steel containing 2% by mass or more is used as a base material, and the stainless steel is clad with aluminum or an aluminum alloy.
JP2000085711A 2000-03-27 2000-03-27 Stainless steel/aluminum clad plate having improved delamination resistance Pending JP2001271149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000085711A JP2001271149A (en) 2000-03-27 2000-03-27 Stainless steel/aluminum clad plate having improved delamination resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000085711A JP2001271149A (en) 2000-03-27 2000-03-27 Stainless steel/aluminum clad plate having improved delamination resistance

Publications (1)

Publication Number Publication Date
JP2001271149A true JP2001271149A (en) 2001-10-02

Family

ID=18601991

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106881920A (en) * 2015-12-15 2017-06-23 宝钢建筑***集成有限公司 A kind of Sandwich steel sheet plate and its processing method
CN117966083A (en) * 2024-04-02 2024-05-03 西安理工大学 Surface boronizing method for mirror symmetry double-gradient laminated composite material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106881920A (en) * 2015-12-15 2017-06-23 宝钢建筑***集成有限公司 A kind of Sandwich steel sheet plate and its processing method
CN117966083A (en) * 2024-04-02 2024-05-03 西安理工大学 Surface boronizing method for mirror symmetry double-gradient laminated composite material
CN117966083B (en) * 2024-04-02 2024-06-04 西安理工大学 Surface boronizing method for mirror symmetry double-gradient laminated composite material

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