JP2001259359A - Exhaust gas treatment device - Google Patents
Exhaust gas treatment deviceInfo
- Publication number
- JP2001259359A JP2001259359A JP2000073387A JP2000073387A JP2001259359A JP 2001259359 A JP2001259359 A JP 2001259359A JP 2000073387 A JP2000073387 A JP 2000073387A JP 2000073387 A JP2000073387 A JP 2000073387A JP 2001259359 A JP2001259359 A JP 2001259359A
- Authority
- JP
- Japan
- Prior art keywords
- exhaust gas
- intake pipe
- solid
- gas treatment
- suction pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Gas Separation By Absorption (AREA)
- Accessories For Mixers (AREA)
- Drying Of Semiconductors (AREA)
- Treating Waste Gases (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体製造装置か
ら排出される排ガス等に含まれる有害成分の除去などに
適用される排ガス処理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust gas treatment apparatus used for removing harmful components contained in exhaust gas discharged from a semiconductor manufacturing apparatus.
【０００２】[0002]
【従来の技術】従来、半導体製造装置から排出される排
ガス等に含まれる有害成分を除去する排ガス処理装置と
しては、いわゆる「ロータリアトマイザ」として知られ
る微細気泡発生装置が知られている。この微細気泡発生
装置としては、液中に配設される回転インペラが、吸気
管の内部を貫通する回転軸の下端に連結され、液槽の上
方に配置された駆動部によって高速回転し、このとき生
じる負圧によって、気体導入口である吸気管の上端から
吸引した気体を、この吸気管の開放端から微細気泡とし
て液中に分散させる装置が知られている（特開昭６１−
３５８３２号公報）。2. Description of the Related Art Conventionally, as an exhaust gas treatment apparatus for removing harmful components contained in exhaust gas and the like discharged from a semiconductor manufacturing apparatus, a fine bubble generator known as a so-called "rotary atomizer" is known. In this microbubble generator, a rotary impeller disposed in a liquid is connected to a lower end of a rotary shaft penetrating through the inside of an intake pipe, and is rotated at a high speed by a drive unit disposed above a liquid tank. A device is known which disperses a gas sucked from an upper end of an intake pipe, which is a gas introduction port, into liquid as fine bubbles from an open end of the intake pipe by a negative pressure generated (Japanese Patent Application Laid-Open No. Sho 61-61).
35832).
【０００３】すなわち、上記した駆動部を液槽の上方に
設ける、いわゆる上部駆動式の場合、この駆動部と軸封
装置を介して上端を接続された回転軸は、吸気管の中を
貫通して、液中開放端の下方で、その下端を回転インペ
ラと接続されている。したがって、回転軸の周囲の狭い
空間が、吸引された気体の通路となるため、気体中に例
えば、水分と反応して固形物を生成し易い物質が存在す
ると、吸気管内で固形物が生成して、気体の通路を閉塞
するという問題が生じ易い。That is, in the case of a so-called upper drive type in which the above-described drive unit is provided above the liquid tank, a rotary shaft connected to the drive unit and the upper end via a shaft sealing device passes through the intake pipe. The lower end is connected to the rotary impeller below the submerged open end. Therefore, a narrow space around the rotation axis becomes a passage for the sucked gas.If, for example, a substance that easily reacts with moisture to generate a solid is present in the gas, the solid is generated in the intake pipe. Thus, the problem of blocking the gas passage is likely to occur.
【０００４】そこで、吸気管の中を貫通する回転軸を設
けることなく、液中に配設された回転インペラを、この
回転インペラの下方に設けた駆動部によって高速回転さ
せる、いわゆる、下部駆動式の微細気泡発生装置に関す
る技術が、本出願人によって既に出願されている（特願
平１１−２０２９０３）。上記技術においては、吸気管
の内部全体が気体の通路となるため、従来の上部駆動式
における場合より、固形物の生成による気体の通路の閉
塞という問題は改善されている。Therefore, a so-called lower drive type, in which a rotary impeller disposed in the liquid is rotated at a high speed by a drive unit provided below the rotary impeller without providing a rotary shaft penetrating through the intake pipe. (Japanese Patent Application No. 11-202903) has already applied for a technique relating to the microbubble generating device. In the above technique, since the entire inside of the intake pipe forms a gas passage, the problem of the blockage of the gas passage due to generation of solids is improved as compared with the conventional upper drive type.
【０００５】[0005]
【発明が解決しようとする課題】ところで、現在の半導
体製造産業では、シリコンウェハのドライエッチングや
チャンバークリーニング等の工程において、エッチング
ガスとして、CF4、CHF3、C2F6、SF6、Cl2、BCl3、HCl、
HBr、ClF3等の各種ガスが使用されている。これらの工
程から排出される排ガス中には、上記のエッチングガス
が未反応で排出されたもの、エッチングに使用された
後、HF、SiF4、SiCl4等の分解生成物に変化したもの
等、各種化合物が含まれている。これらの化合物はいず
れも有害であるため、除去装置により有害成分を除去し
た後、大気中に放出しなければならない。By the way, in the current semiconductor manufacturing industry, CF 4 , CHF 3 , C 2 F 6 , SF 6 , Cl 6 are used as etching gases in processes such as dry etching of silicon wafers and chamber cleaning. 2, BCl 3, HCl,
Various gases such as HBr and ClF 3 are used. In the exhaust gas discharged from these processes, those in which the above-mentioned etching gas was discharged without reacting, those used after etching, and those converted into decomposition products such as HF, SiF 4 , SiCl 4, etc. Contains various compounds. Since all of these compounds are harmful, they must be released to the atmosphere after removing harmful components with a removal device.
【０００６】一方、排ガス中には上記したように各種化
合物が含まれているが、中でもSiF4、BCl3は、水分の存
在下で下記の反応式に従ってSiO2、B2O3を生成する。On the other hand, the exhaust gas contains various compounds as described above. Among them, SiF 4 and BCl 3 generate SiO 2 and B 2 O 3 in the presence of moisture according to the following reaction formula. .
【０００７】[0007]
【化１】 Embedded image
【０００８】一方、高速回転する回転インペラによって
吸引された気体は、放射旋回状に液中に供給され、微細
気泡となって気液接触されるのであるが、吸気管の液中
に設けられた下部開放端（吸引ガス出口）は、激しい渦
流状の水又は薬液から構成される吸収液と常に接触する
状態となる。On the other hand, the gas sucked by the rotating impeller which rotates at a high speed is supplied into the liquid in a radially swirling manner and comes into gas-liquid contact as fine bubbles, but is provided in the liquid in the intake pipe. The lower open end (suction gas outlet) is in a state of being constantly in contact with an absorbing liquid composed of a violent swirling water or a chemical liquid.
【０００９】したがって、上記した半導体製造工程から
排出される排ガスを微細気泡発生装置の処理ガスとした
場合、たとえ、回転インペラを下部駆動式として、吸気
管の内部全体を排ガス通路としても、吸収液の一部は、
液中における吸気管の開放端から巻きあがり、あるいは
ハネ上がって、吸気管の内壁を湿らせることとなる。そ
の場合、吸収液によって湿った吸気管の内壁には、上記
反応式に従って生成したSiO2、B2O3が固体となって付着
し、あるいはこれら以外の若干の固形物も付着して、や
がてその量が増えてくると排ガスの流入を妨げ、ついに
は、吸気管を閉塞させる事態となる。Therefore, when the exhaust gas discharged from the above-described semiconductor manufacturing process is used as the processing gas for the fine bubble generator, even if the rotary impeller is driven downward and the entire interior of the intake pipe is used as the exhaust gas passage, the absorption liquid can be used. Some of the
Winding or splashing from the open end of the intake pipe in the liquid will wet the inner wall of the intake pipe. In that case, SiO 2 and B 2 O 3 generated according to the above reaction formula become solid and adhere to the inner wall of the intake pipe moistened by the absorbent, or some other solid matter also adheres, and eventually. When the amount increases, the flow of exhaust gas is hindered, and eventually the intake pipe is closed.
【００１０】そこで、上記特願平１１−２０２９０３に
おいては、吸気管の内壁の排ガス導入部近傍あるいは開
放端の近傍等に付着したSiO2、B2O3等の固形物を除去す
るために吸気管に水供給手段を設け、水の持つ溶解力、
水勢等を利用して、固形物を除去する微細気泡発生装置
が提案されている。Therefore, in Japanese Patent Application No. 11-202903, the intake air is removed in order to remove solid substances such as SiO 2 and B 2 O 3 attached near the exhaust gas introduction portion or near the open end of the inner wall of the intake pipe. A water supply means is provided in the pipe to dissolve water,
There has been proposed a microbubble generator that removes solids by using water force or the like.
【００１１】上記の装置においては、定期的に、あるい
は固形物がある程度付着、堆積した時点で、上記微細気
泡発生装置の運転を停止して、複数のノズルを設けた水
供給手段から、スプレイ状に水を噴射し、吸気管内に付
着した固形物を簡単に除去することができる。In the above-mentioned apparatus, the operation of the above-mentioned microbubble generator is stopped periodically, or when a certain amount of solid matter adheres and accumulates, and spraying is performed from a water supply means provided with a plurality of nozzles. Water can be easily sprayed to remove solid matter attached to the intake pipe.
【００１２】しかしながら、近年、半導体製造装置の大
型化に伴って、使用されるガスの量が増え、また、一基
の排ガス処理装置で処理される排ガスの量が増すにつ
れ、上記した固形物の吸気管内部への付着が激しくな
り、従来よりも短期間で、吸気管が閉塞するという問題
が生じている。そのため、半導体製造装置の操業を続け
ながら、かつ、微細気泡発生装置の運転を停止すること
なく、吸気管内に付着した固形物を除去する技術が望ま
れている。However, in recent years, with the increase in the size of semiconductor manufacturing equipment, the amount of gas used has increased, and as the amount of exhaust gas treated by a single exhaust gas treatment apparatus has increased, the above solid matter The adhesion to the inside of the intake pipe becomes severe, and there is a problem that the intake pipe is closed in a shorter time than before. Therefore, there is a demand for a technique for removing solid matter attached to the intake pipe while continuing operation of the semiconductor manufacturing apparatus and without stopping the operation of the microbubble generator.
【００１３】本発明は、上記した状況のもとで考え出さ
れたものであって、排ガス処理装置、特に下部駆動式微
細気泡発生装置において、水噴射を利用することなく、
吸気管内部に付着する固形物を短時間で効果的に簡単に
除去できるようにすることを課題とするものである。The present invention has been conceived under the above-mentioned circumstances, and has been developed in an exhaust gas treatment apparatus, in particular, in a lower drive type microbubble generator without using water injection.
It is an object of the present invention to effectively and easily remove solid matter adhering to the inside of an intake pipe in a short time.
【００１４】[0014]
【発明の開示】上記課題を解決するため、本発明の第１
の側面よれば、吸収液中に下部が浸漬され且つ当該吸収
液との接触により固形物を生成する成分を含む排ガスが
導入される吸気管を備える排ガス処理装置であって、上
記吸気管は、当該吸気管内で少なくともその下部開放端
の近傍において上下移動自在とされた固形物掻き落とし
部材を有する固形物除去手段を備えたことを特徴とす
る、排ガス処理装置が提供される。DISCLOSURE OF THE INVENTION In order to solve the above-mentioned problems, the first aspect of the present invention is described.
According to an aspect of the present invention, there is provided an exhaust gas treatment apparatus including an intake pipe into which an exhaust gas containing a component that generates a solid by contact with the absorbent is introduced. An exhaust gas treatment apparatus is provided, comprising: a solid removing unit having a solid scraping member movable vertically in at least a vicinity of a lower open end of the intake pipe.
【００１５】上記固形物除去手段の固形物掻き落とし部
材は、排ガスの通過を許容する構造となっているのが好
ましい。このため、本発明の好適な実施形態では、上記
固形物掻き落とし部材は、リング部材とし、周方向に間
隔をあけた複数の固定部材を介してロッド状の上下移動
部材に固定されている。上記リング部材としては、通
常、ステンレス鋼、ニッケル合金鋼、等の金属製、ある
いは、ポリ塩化ビニル、ポリエチレン、ポリプロピレン
等のプラスチック製等、強度とともに、耐腐食性にも優
れるものが用いられる。また、上記上下移動部材として
も、上記リング部材と同様に、通常、ステンレス鋼、ニ
ッケル合金鋼、等の金属製、あるいは、ポリ塩化ビニ
ル、ポリエチレン、ポリプロピレン、等のプラスチック
製等のものが用いられる。It is preferable that the solid material scraping member of the solid material removing means has a structure that allows passage of exhaust gas. For this reason, in a preferred embodiment of the present invention, the solid scraping member is a ring member, and is fixed to the rod-shaped vertical moving member via a plurality of circumferentially spaced fixing members. As the ring member, a member having excellent strength and corrosion resistance, such as a metal member such as stainless steel or nickel alloy steel, or a plastic member such as polyvinyl chloride, polyethylene, or polypropylene is usually used. Also, as the vertical moving member, similarly to the ring member, usually, a metal such as stainless steel, nickel alloy steel, or the like, or a plastic such as polyvinyl chloride, polyethylene, polypropylene, or the like is used. .
【００１６】一方、上記吸気管に用いられる材料として
は、プラスチックス、ステンレス鋼、ニッケル合金鋼等
の金属、強化ガラス等があげられる。しかし、排ガスの
成分中には水に溶解して酸性を示す成分が多いことか
ら、ポリ塩化ビニル、ポリエチレン、ポリプロピレン等
のプラスチックスを用いることが好ましい。また、吸気
管の内面をテフロン（登録商標）でコーティングをする
と生成したSiO2、B2O3等の固形物が付着し難く、さらに
付着しても掻き落とし易いという点でさらに好ましい。On the other hand, examples of the material used for the intake pipe include plastics, metals such as stainless steel and nickel alloy steel, and tempered glass. However, it is preferable to use plastics such as polyvinyl chloride, polyethylene, and polypropylene because many components of the exhaust gas dissolve in water and show acidity. Further, when the inner surface of the intake pipe is coated with Teflon (registered trademark), it is more preferable that the generated solid matter such as SiO 2 and B 2 O 3 hardly adheres and even if it adheres, it is easily scraped off.
【００１７】本発明の第２の側面は、微細気泡発生装置
として構成された排ガス処理装置を提供するものであ
り、同排ガス処理装置は、液中に配設された回転インペ
ラと、この回転インペラを高速回転させたときに生じる
負圧を利用して処理ガスを吸引する吸気管と、この吸気
管の上部に液面上方で接続された処理ガス導入配管と、
上記回転インペラを高速回転させるべく上記処理ガス導
入配管の下方に設けられた駆動手段と、上記吸気管の下
部開放端の内部に付着した固形物を除去するための固形
物除去手段と、を備えた、上記固形物除去手段が、上記
吸気管内で少なくともその下部開放端の近傍において上
下移動自在とされた固形物掻き落とし部材を有すること
を特徴としている。According to a second aspect of the present invention, there is provided an exhaust gas treatment device configured as a microbubble generating device. The exhaust gas treatment device includes a rotary impeller disposed in a liquid, and the rotary impeller. A suction pipe for sucking a processing gas by using a negative pressure generated when the is rotated at a high speed, a processing gas introduction pipe connected to an upper part of the suction pipe above the liquid surface,
Driving means provided below the processing gas introduction pipe to rotate the rotary impeller at a high speed, and solid substance removing means for removing solid substances adhered inside the lower open end of the intake pipe. Further, the solid material removing means has a solid material scraping member which is vertically movable at least in the vicinity of the lower open end in the intake pipe.
【００１８】上記回転インペラは、通常１０００〜３０
００ｒｐｍの高速で回転される。上記回転インペラの形
状としては、例えば、上端有蓋又は上下両端有蓋中空の
ロータの上面に放射状のインペラと、その外周側面に中
心線に平行な縦縞状の畝を植設したもの、あるいは中空
のロータの内部に平面視で放射状にインペラを設けたも
の等が挙げられ、特に限定されるものではない。The rotary impeller is usually 1000 to 30
It is rotated at a high speed of 00 rpm. Examples of the shape of the rotating impeller include, for example, a radial impeller on the upper surface of a hollow rotor with a top end or a hollow with upper and lower ends, and a vertical stripe-shaped ridge parallel to the center line implanted on the outer peripheral surface, or a hollow rotor. Are provided with an impeller radially in plan view, and are not particularly limited.
【００１９】[0019]
【発明の実施の形態】以下、本発明の好ましい実施の形
態について、図面を参照しつつ説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.
【００２０】図１に、本発明の好適な実施形態にかかる
下部駆動式の微細気泡発生装置（排ガス処理装置の代表
例）の概略構成図を示す。図示の微細気泡発生装置は、
吸気管１を備え、この吸気管１は、透明塩化ビニル製
（例えば、内径６０ｍｍ、全長９６０ｍｍ）で、例え
ば、内径４００ｍｍの吸収液槽２中で底面から所定の高
さ（例えば、２２５ｍｍ）に開放端３が位置するよう
に、吸収液槽２に上蓋部２ａで固定される。本実施形態
では、吸気管１内部の様子が外部から目視できるよう
に、吸収液槽２もガラスや透明塩化ビニルなどの材料で
構成して、透明としている。FIG. 1 is a schematic diagram showing a lower drive type fine bubble generator (a typical example of an exhaust gas treatment apparatus) according to a preferred embodiment of the present invention. The illustrated microbubble generator is
The intake pipe 1 is made of transparent vinyl chloride (for example, an inner diameter of 60 mm and a total length of 960 mm), and has a predetermined height (for example, 225 mm) from the bottom in an absorbing liquid tank 2 having an inner diameter of 400 mm. It is fixed to the absorbent tank 2 with the upper lid 2a so that the open end 3 is located. In the present embodiment, the absorbing liquid tank 2 is also made of a material such as glass or transparent vinyl chloride and is transparent so that the inside of the intake pipe 1 can be seen from the outside.
【００２１】吸気管１の開放端３の直下には、回転イン
ペラ５が吸収液４中に配設される。開放端３と回転イン
ペラ５との間の間隔は、高速回転する回転インペラ５に
より一定の負圧が発生するよう、数ｍｍ程度に調節され
る。また、回転インペラ５は公知の軸封装置７を介し
て、回転軸６と連結され、吸収液槽２の底部の下側に設
けられたモータと歯車類から構成される駆動部８によっ
て、高速回転される。Immediately below the open end 3 of the intake pipe 1, a rotary impeller 5 is disposed in the absorbing liquid 4. The distance between the open end 3 and the rotary impeller 5 is adjusted to about several mm so that a constant negative pressure is generated by the rotary impeller 5 rotating at high speed. The rotating impeller 5 is connected to the rotating shaft 6 via a known shaft sealing device 7, and is driven at a high speed by a driving unit 8 including a motor and gears provided below the bottom of the absorbent tank 2. Rotated.
【００２２】図示しない半導体製造装置からの排ガスＡ
は、排ガス導入配管９から、吸気管１と排ガス導入配管
９の接続部（排ガス導入部）１０を経て、回転インペラ
５の高速回転によって生じる負圧によって吸気管１内に
導入され、開放端３から吸収液４中に微細気泡として分
散される。排ガス導入配管９には、吸気管１内の負圧を
測定するためのマノメータ１１が設けられている。Exhaust gas A from a semiconductor manufacturing apparatus (not shown)
Is introduced into the intake pipe 1 from the exhaust gas introduction pipe 9 through a connection portion (exhaust gas introduction section) 10 between the intake pipe 1 and the exhaust gas introduction pipe 9 by the negative pressure generated by the high-speed rotation of the rotary impeller 5, and the open end 3 Is dispersed as fine bubbles in the absorbing solution 4. The exhaust gas introducing pipe 9 is provided with a manometer 11 for measuring a negative pressure in the intake pipe 1.
【００２３】吸収液槽２には、常に一定量の新しい吸収
液Ｂが吸収液供給口から補充され、排ガスを吸収した後
の吸収液４は、徐々にオーバーフローして気液分離槽１
２に導かれる。気液分離槽１２で吸収液４と分離した処
理後の排ガスＣは、排ガス出口から排出され、また、気
液分離した後の吸収液は廃液Ｄとして、図示しない廃液
処理装置に送られる。The absorbing liquid tank 2 is constantly replenished with a constant amount of new absorbing liquid B from the absorbing liquid supply port, and the absorbing liquid 4 after absorbing the exhaust gas gradually overflows to the gas-liquid separating tank 1.
It is led to 2. The treated exhaust gas C separated from the absorbent 4 in the gas-liquid separation tank 12 is discharged from the exhaust gas outlet, and the absorbent after gas-liquid separation is sent as a waste liquid D to a waste liquid treatment device (not shown).
【００２４】また、吸気管１内には、常に一定量の窒素
ガスＥが、窒素導入管１３から排ガスＡとともに吸気管
１に導入される構成となっている。この窒素ガスＥは、
半導体製造装置側、あるいは微細気泡発生装置側のトラ
ブルにより発生する不測の事態に備えて、吸収液４が半
導体製造装置側に逆流しないように、常に、吸気管１内
に入り込もうとする吸収液４を押し下げる保安用の役目
を果たしている。さらに窒素ガスＥは、例えば、定期的
な点検、整備等を行った後、吸気管１の乾燥用としても
利用される。In the intake pipe 1, a constant amount of nitrogen gas E is always introduced into the intake pipe 1 together with the exhaust gas A from the nitrogen introduction pipe 13. This nitrogen gas E
In preparation for an unexpected situation caused by a trouble on the semiconductor manufacturing device side or the microbubble generating device side, the absorbing solution 4 that always tries to enter the intake pipe 1 so that the absorbing solution 4 does not flow back to the semiconductor manufacturing device side. It plays a role of security for pushing down. Further, the nitrogen gas E is also used for drying the intake pipe 1 after performing, for example, periodic inspection and maintenance.
【００２５】一方、吸気管１の内部に設けられた固形物
除去手段Ｘの下端には、図２（ａ）及び（ｂ）にその詳
細を示すように、固形物掻き落とし部材としてのリング
部材１５が複数の固定部材１６を介してロッドの形態の
上下移動部材１４に固定されている。図２（ｂ）に示す
ように、固定部材１６は周方向に相互に間隔をおいた状
態で放射状に延びている。上下移動部材１４の上部は、
上部軸封装置１７を介して外部に突き出ており、この突
き出し部分を手動又は機械駆動により上下させることに
より、固形物除去手段Ｘを上下させ、吸気管１の下部内
周面に付着した固形物を水又はアルカリ性の薬液から構
成される吸収液４の中へ落下させる。On the other hand, as shown in FIGS. 2A and 2B, a ring member as a solid scraping member is provided at the lower end of the solid removing means X provided inside the intake pipe 1. 15 is fixed to the vertically moving member 14 in the form of a rod via a plurality of fixing members 16. As shown in FIG. 2B, the fixing members 16 extend radially at intervals from one another in the circumferential direction. The upper part of the vertical moving member 14
The projecting portion is protruded to the outside through the upper shaft sealing device 17, and the protruding portion is moved up and down manually or mechanically to raise and lower the solid matter removing means X, and the solid matter adhered to the lower inner peripheral surface of the intake pipe 1. Is dropped into the absorbing solution 4 composed of water or an alkaline chemical solution.
【００２６】既述したように、微細気泡発生装置の運転
を連続して行うと、主として開放端３の近傍にSiO2、B2
O3等の固形物が付着する。固形物の付着量を、例えば透
明塩化ビニル製の吸気管１及び透明な吸収液槽２の外部
からの目視により、掻き落としの時期を判断すると、例
えば手動で上下移動部材１４の上部における上記突き出
し部分を操作して、上下移動部材１４の下方端に固定さ
れているリング部材１５を上下させ、付着した固形物を
掻き落として吸収液４の中へ落下させることができる。
この際、リング部材１５は、その外周部を、上記吸気管
１の内面に近接又は接触して位置するように設けられて
いるため、効率的に固形物掻き落とし作業を行うことが
できる。リング部材１５と上下移動部材１４との固定
は、周方向に相互に間隔をあけた複数の固定部材１６を
介して行っているので、固形物掻き落とし作業中も吸気
管１への排ガス導入を継続することができ、排ガス処理
を中断する必要はない。As described above, when the operation of the microbubble generator is continuously performed, SiO 2 , B 2
Solid matter such as O 3 adheres. When the timing of the scraping is determined by visually observing the amount of solid matter adhered, for example, from the outside of the suction pipe 1 made of transparent vinyl chloride and the transparent absorbing liquid tank 2, for example, the protrusion at the upper part of the vertical moving member 14 is manually made. By operating the portion, the ring member 15 fixed to the lower end of the vertically moving member 14 is moved up and down, and the attached solid matter can be scraped off and dropped into the absorbing liquid 4.
At this time, since the ring member 15 is provided so that the outer peripheral portion thereof is located close to or in contact with the inner surface of the intake pipe 1, it is possible to efficiently scrape off solids. Since the fixing between the ring member 15 and the vertically moving member 14 is performed through the plurality of fixing members 16 spaced from each other in the circumferential direction, the exhaust gas is introduced into the intake pipe 1 even during the work of scraping off solids. It can be continued and there is no need to interrupt exhaust gas treatment.
【００２７】以上のようにして、固形物の掻き落とし操
作が終了した後は、固形物除去手段Ｘは開放端３の若干
上方に位置させてもよいし、吸気管１と排ガス導入配管
９の接続部（排ガス導入部）１０よりも上方に引き上げ
てもよい。ただし、吸気管１内に流れる排ガスの抵抗と
ならないという点からは、排ガス導入部１０より上方に
引きあげる方が好ましい。After the operation of scraping off solids as described above, the solids removing means X may be located slightly above the open end 3 or the intake pipe 1 and the exhaust gas introduction pipe 9 You may pull up above the connection part (exhaust gas introduction part) 10. However, from the viewpoint that the resistance of the exhaust gas flowing in the intake pipe 1 does not become a resistance, it is preferable to pull the exhaust gas upward from the exhaust gas introduction unit 10.
【００２８】以上の使用例では、固形物の付着を目視に
より判定する場合について述べたが、排ガス導入配管９
に設けられた負圧を測定するマノメータ１１の読みから
判定してもよい。この場合、圧力が上がる（大気圧に近
くなる）と吸気管１内の固形物の付着量が増えてきたも
のと判断されるから、固形物除去手段Ｘを、手作業又は
機械的手段によって上下させ、固形物を掻き落とす。機
械的手段による場合は、マノメータ１１が設定圧力にな
った時点でカム機構を動作させる手段等を採用し、固形
物除去手段Ｘを上下させる方法を採用すればよい。ま
た、予め、負圧と吸気管１内を流れる排ガスの流量の関
係を知っておけば、マノメータ１１が所定の圧力になっ
た時点で、上記カム機構を動作させる等、上記一連の操
作を自動的に行うことも可能である。In the above example of use, the case where the adhesion of solid matter is visually judged has been described.
The determination may be made from the reading of the manometer 11 that measures the negative pressure provided in the. In this case, when the pressure increases (approaches the atmospheric pressure), it is determined that the amount of solid matter adhered in the intake pipe 1 has increased. Therefore, the solid matter removing means X is moved up and down manually or mechanically. And scrape off the solids. In the case of using mechanical means, a method of operating the cam mechanism when the manometer 11 reaches the set pressure may be employed, and a method of moving the solid removing means X up and down may be employed. Further, if the relationship between the negative pressure and the flow rate of the exhaust gas flowing in the intake pipe 1 is known in advance, the above-described series of operations such as operating the cam mechanism when the manometer 11 reaches a predetermined pressure can be performed automatically. It is also possible to perform it.
【００２９】なお、固形物除去手段Ｘに含まれるリング
部材に替えて、図３（ａ）に示す円錐状の形状の部材、
図３（ｂ）に示す円盤状の形状の部材、等が使用可能で
ある。これらの形状を有する部材を用いた場合、排ガス
の通過が容易となるように、排ガスの通過断面に部分的
にガス通過口を設けておくことが好ましい。また、リン
グ部材、円錐状部材、円盤状部材等は、円周部が連続し
ているもののみに限られず、円周部に切り欠きを設けた
もの等も本発明の技術範囲に含まれる。It should be noted that, instead of the ring member included in the solid removing means X, a conical member shown in FIG.
A disk-shaped member shown in FIG. 3B can be used. When a member having these shapes is used, it is preferable to provide a gas passage opening partially in a passage section of the exhaust gas so that the passage of the exhaust gas is facilitated. Further, the ring member, the conical member, the disk-shaped member and the like are not limited to those having a continuous circumferential portion, and those having a cutout in the circumferential portion are also included in the technical scope of the present invention.
【００３０】[0030]
【発明の効果】以上述べたように、本発明によれば、吸
気管の内部に設けられた固形物除去手段を上下するだけ
で、吸気管の開放端近傍に付着した固形物を簡単に吸収
液中へ掻き落とすことができる。しかも、これらの操作
は、微細気泡発生装置の運転を止めることなくできるの
で、半導体製造装置の長期連続操業が可能となる、とい
う優れた効果がある。As described above, according to the present invention, the solid matter adhering to the vicinity of the open end of the intake pipe can be easily absorbed only by raising and lowering the solid matter removing means provided inside the intake pipe. Can be scraped into the liquid. Moreover, since these operations can be performed without stopping the operation of the microbubble generator, there is an excellent effect that the semiconductor manufacturing apparatus can be operated continuously for a long period of time.
【図１】本発明の一実施形態に係る微細気泡発生装置を
示す概略構成図である。FIG. 1 is a schematic configuration diagram showing a fine bubble generation device according to an embodiment of the present invention.
【図２】（ａ）は上記微細気泡発生装置における固形物
除去手段の断面図であり、（ｂ）は同固形物除去手段の
平面図である。FIG. 2A is a cross-sectional view of a solid removing unit in the above-described fine bubble generator, and FIG. 2B is a plan view of the solid removing unit.
【図３】（ａ）は本発明に係る他の固形物除去手段の断
面図であり、（ｂ）はさらに別の固形物除去手段の形態
を示す断面図である。FIG. 3 (a) is a cross-sectional view of another solid matter removing means according to the present invention, and FIG. 3 (b) is a cross-sectional view showing still another solid matter removing means.
１ 吸気管 ３ 開放端 ４ 吸収液 ５ 回転インペラ ８ 駆動部 ９ 排ガス導入配管 １１ マノメータ １３ 窒素導入配管 １４ 上下移動部材 １５ 固形物掻き落とし部材 １６ 固定部材 Ａ 排ガス Ｂ 補充用新吸収液 Ｃ 処理後排ガス Ｄ 廃液 Ｅ 保安用窒素ガス Ｘ 固形物除去手段 DESCRIPTION OF SYMBOLS 1 Intake pipe 3 Open end 4 Absorbing liquid 5 Rotating impeller 8 Drive unit 9 Exhaust gas introduction pipe 11 Manometer 13 Nitrogen introduction pipe 14 Vertical moving member 15 Solid scraping member 16 Fixed member A Exhaust gas B Replenishment liquid for replenishment C Exhaust gas after treatment D Waste liquid E Security nitrogen gas X Solid removal means
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｂ０１Ｆ 15/00 Ｂ０１Ｄ 53/34 １２０Ａ ５Ｆ０４５ Ｈ０１Ｌ 21/205 ＺＡＢ 21/3065 Ｈ０１Ｌ 21/302 Ｎ Ｆターム(参考） 4D002 AA18 AA22 AA24 AA26 AC10 BA02 CA01 CA06 DA35 EA13 GA02 GA03 GB04 GB20 HA03 4D020 AA10 BA23 BB03 BC06 CB02 CB04 CB27 DA01 DA02 DB04 4G035 AB17 4G037 DA15 EA02 5F004 AA13 BC08 CA09 DB03 DB13 5F045 EB06 EC07 EG07 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B01F 15/00 B01D 53/34 120A 5F045 H01L 21/205 ZAB 21/3065 H01L 21/302 NF term (Reference) 4D002 AA18 AA22 AA24 AA26 AC10 BA02 CA01 CA06 DA35 EA13 GA02 GA03 GB04 GB20 HA03 4D020 AA10 BA23 BB03 BC06 CB02 CB04 CB27 DA01 DA02 DB04 4G035 AB17 4G037 DA15 EA02 5F004 AA13 BC08 CA09 DB03 EB07 5
Claims (4)
液との接触により固形物を生成する成分を含む排ガスが
導入される吸気管を備える排ガス処理装置であって、上
記吸気管は、当該吸気管内で少なくともその下部開放端
の近傍において上下移動自在とされた固形物掻き落とし
部材を有する固形物除去手段を備えたことを特徴とす
る、排ガス処理装置。1. An exhaust gas treatment apparatus including an intake pipe into which an exhaust gas containing a component that produces a solid by contact with the absorbent is introduced, the lower part of the exhaust pipe being immersed in the absorbent. An exhaust gas treatment apparatus comprising: a solid substance removing means having a solid substance scraping member movable vertically in at least a vicinity of a lower open end of the intake pipe.
過を許容する構造となっている、請求項１に記載の排ガ
ス処理装置。2. The exhaust gas treatment apparatus according to claim 1, wherein the solid scraping member has a structure that allows exhaust gas to pass therethrough.
材であり、周方向に間隔をあけた複数の固定部材を介し
てロッド状の上下移動部材に固定されている、請求項２
に記載の微細気泡の発生装置。3. The solid substance scraping member is a ring member, and is fixed to a rod-shaped vertical moving member via a plurality of circumferentially spaced fixing members.
A device for generating microbubbles according to claim 1.
回転インペラを高速回転させたときに生じる負圧を利用
して処理ガスを吸引する吸気管と、この吸気管の上部に
液面上方で接続された処理ガス導入配管と、上記回転イ
ンペラを高速回転させるべく上記処理ガス導入配管の下
方に設けられた駆動手段と、上記吸気管の下部開放端の
内部に付着した固形物を除去するための固形物除去手段
と、を備えた排ガス処理装置であって、上記固形物除去
手段は、上記吸気管内で少なくともその下部開放端の近
傍において上下移動自在とされた固形物掻き落とし部材
を有する、排ガス処理装置。4. A rotary impeller disposed in a liquid, an intake pipe for sucking a processing gas by using a negative pressure generated when the rotary impeller is rotated at a high speed, and a liquid level above the intake pipe. A processing gas introduction pipe connected above, a driving means provided below the processing gas introduction pipe for rotating the rotary impeller at a high speed, and a solid substance adhering to the inside of a lower open end of the suction pipe is removed. Solid matter removing means for removing the solid matter, wherein the solid matter removing means comprises a solid scraping member which is vertically movable at least in the vicinity of its lower open end in the intake pipe. An exhaust gas treatment device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000073387A JP2001259359A (en) | 2000-03-16 | 2000-03-16 | Exhaust gas treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000073387A JP2001259359A (en) | 2000-03-16 | 2000-03-16 | Exhaust gas treatment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001259359A true JP2001259359A (en) | 2001-09-25 |
| JP2001259359A5 JP2001259359A5 (en) | 2007-03-15 |
Family
ID=18591639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000073387A Pending JP2001259359A (en) | 2000-03-16 | 2000-03-16 | Exhaust gas treatment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001259359A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100429133B1 (en) * | 2001-11-28 | 2004-04-29 | 동부전자 주식회사 | Impeller of a slurry storage tank |
| JP2004330123A (en) * | 2003-05-09 | 2004-11-25 | Sumitomo Seika Chem Co Ltd | Exhaust gas treatment apparatus and exhaust gas treatment method using the same |
| JP2012166185A (en) * | 2011-02-09 | 2012-09-06 | China Steel Corp | Gas-liquid mixing nozzle device |
| CN110871028A (en) * | 2018-10-15 | 2020-03-10 | 齐秀琴 | Gas purifier |
| CN113102431A (en) * | 2021-04-29 | 2021-07-13 | 洛阳市中心医院（郑州大学附属洛阳中心医院） | Anesthesia department is with anesthesia waste gas pump drainage device |
-
2000
- 2000-03-16 JP JP2000073387A patent/JP2001259359A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100429133B1 (en) * | 2001-11-28 | 2004-04-29 | 동부전자 주식회사 | Impeller of a slurry storage tank |
| JP2004330123A (en) * | 2003-05-09 | 2004-11-25 | Sumitomo Seika Chem Co Ltd | Exhaust gas treatment apparatus and exhaust gas treatment method using the same |
| JP2012166185A (en) * | 2011-02-09 | 2012-09-06 | China Steel Corp | Gas-liquid mixing nozzle device |
| CN110871028A (en) * | 2018-10-15 | 2020-03-10 | 齐秀琴 | Gas purifier |
| CN113102431A (en) * | 2021-04-29 | 2021-07-13 | 洛阳市中心医院（郑州大学附属洛阳中心医院） | Anesthesia department is with anesthesia waste gas pump drainage device |
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