JP2001250798A - Method and apparatus for dividing material along scribing line - Google Patents
Method and apparatus for dividing material along scribing lineInfo
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- JP2001250798A JP2001250798A JP2000060240A JP2000060240A JP2001250798A JP 2001250798 A JP2001250798 A JP 2001250798A JP 2000060240 A JP2000060240 A JP 2000060240A JP 2000060240 A JP2000060240 A JP 2000060240A JP 2001250798 A JP2001250798 A JP 2001250798A
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- Prior art keywords
- marking line
- load
- resilient means
- line
- marking
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は新規なケガキ線で材
料を分割する方法及び装置に関する。詳しくは、半導体
結晶基板等の対象となる材料をケガキ線に沿って応力を
集中させて、ケガキ線に沿って正確に材料を分割し、ク
ラックなどの発生を減少させる技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for dividing a material by a new marking line. More specifically, the present invention relates to a technique for concentrating stress on a target material, such as a semiconductor crystal substrate, along a marking line, accurately dividing the material along the marking line, and reducing the occurrence of cracks and the like.
【０００２】[0002]
【従来の技術】分割しようとする材料、例えば、半導体
結晶基板等の分割対象材料にスクライブライン、例え
ば、ダイヤモンドカッターによるケガキ線を形成し、該
ケガキ線に沿って分割する方法がある。2. Description of the Related Art There is a method of forming a scribe line, for example, a marking line using a diamond cutter on a material to be divided, for example, a material to be divided such as a semiconductor crystal substrate, and dividing the material along the marking line.
【０００３】例えば、図３に示すように、分割対象材料
ａにスクライブラインｂを形成し、分割対象材料ａのス
クライブラインｂを境にした一方の部分ａ′のスクライ
ブラインｂに近接した部分をクランパーｃによって挟着
支持し、スクライブラインｂを境にした他方の部分ａ″
にスクライブラインｂが形成された面の側から荷重ｄを
かけて、分割対象材料ａをスクライブラインｂに沿って
分割する方法や、図４に示すように、スクライブライン
ｂを形成した分割対象材料ａのスクライブラインｂを形
成した面と反対側の面ｅを粘着シートｆに貼り付け、分
割対象材料ａのスクライブラインｂを境にした２つの部
分ａ′及びａ″をそれぞれ反対の方向、すなわち、矢印
ｇ′、ｇ″方向に延伸し、分割対象材料ａをスクライブ
ラインｂに沿って分割する方法がある。For example, as shown in FIG. 3, a scribe line b is formed in a material to be divided a, and a portion of the portion a 'adjacent to the scribe line b of the material to be divided a is adjacent to the scribe line b. The other part a ″ supported by the clamper c and sandwiched by the scribe line b
A load d is applied from the side of the surface on which the scribe line b is formed to divide the material to be divided a along the scribe line b, or as shown in FIG. The surface e opposite to the surface on which the scribe line b is formed is affixed to the adhesive sheet f, and the two portions a ′ and a ″ bordering the scribe line b of the material to be divided a are in opposite directions, that is, , Arrows g ′ and g ″ to divide the material a to be divided along the scribe line b.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上記した従
来の分割方法にあっては、それぞれにおいてかけた荷重
による応力のスクライブラインｂに沿った部分への集中
が弱く、応力が分割対象材料ａの面内で分散し、分割対
象材料ａに著しい負担をかけるので、クラックｈやズレ
が発生し、また、半導体の特性上必要となる良好なヘキ
開断面を得ることができず、そのため、歩留まりが悪
く、また、良好な品質も得られない等の問題があった。In the above-described conventional dividing method, however, the stress caused by the load applied to each of them is weakly concentrated on the portion along the scribe line b, and the stress is less than that of the material a to be divided. Since it is dispersed in the plane and places a remarkable load on the material a to be divided, cracks h and deviations occur, and it is not possible to obtain a good cleaved cross-section required for the characteristics of the semiconductor. There were problems such as poor quality and poor quality.
【０００５】そこで、本発明は、ケガキ線に沿って応力
を集中させて、ケガキ線に沿って正確に材料を分割し、
クラックなどの発生を減少させることを課題とする。[0005] Therefore, the present invention concentrates stress along the marking line to accurately divide the material along the marking line,
It is an object to reduce the occurrence of cracks and the like.
【０００６】[0006]
【課題を解決するための手段】本発明ケガキ線で材料を
分割する方法は、上記した課題を解決するために、材料
のケガキ線を形成した面と反対側の面のケガキ線に近い
部分を所定の荷重の弾発手段で、また、ケガキ線に遠い
部分を上記弾発手段より低荷重の弾発手段で支持し、ケ
ガキ線を形成した面のケガキ線から離間した部分に荷重
をかけるようにしたものである。According to the present invention, there is provided a method of dividing a material by a marking line, in order to solve the above-mentioned problem, to reduce a portion of the material on the opposite side to the marking line on the surface opposite to the marking line. A predetermined load of the resilient means, and a portion far from the marking line is supported by a resilient means having a lower load than the resilient means, and a load is applied to a portion of the surface on which the marking line is formed, which is separated from the marking line. It was made.
【０００７】従って、本発明ケガキ線で材料を分割する
方法にあっては、材料に与えられた荷重による応力は、
弾発手段の作用により、ケガキ線に近い部分で高く、ケ
ガキ線から遠い部分で低くなり、これにより応力がケガ
キ線に沿った部分に集中し、応力の分散によるクラック
やズレの発生が防止され、また、良好なヘキ開断面が得
られ、歩留まり及び品質が向上する。Therefore, in the method of dividing a material by the marking wire of the present invention, the stress due to the load applied to the material is
Due to the action of the resilient means, it is high in the part near the marking line and low in the part far from the marking line, whereby the stress is concentrated on the part along the marking line, preventing the occurrence of cracks and deviations due to the dispersion of stress. Also, a good open section is obtained, and the yield and quality are improved.
【０００８】また、本発明ケガキ線で材料を分割する装
置は、ケガキ線を形成された材料のケガキ線を境にした
一方の部分を固定支持する固定部材と、上記材料のケガ
キ線を境にして他方の部分のケガキ線が形成された面と
反対側の面を支持する支持部材と、上記支持部材の材料
載置面と反対側の面の上記固定部材に近い部分を支持す
る所定の荷重の弾発手段と、上記支持部材の材料載置面
と反対側の面の上記固定部材に遠い部分を支持する上記
弾発手段より低荷重の弾発手段と、上記材料の上記支持
部材に支持された側の部分に支持部材の方に向かって荷
重をかける荷重手段とを備えたものである。Further, the present invention provides an apparatus for dividing a material with a marking line, comprising: a fixing member for fixing and supporting one part of the material having the marking line formed by the marking line; A support member for supporting a surface of the other portion opposite to the surface on which the marking line is formed, and a predetermined load for supporting a portion of the support member on the opposite side to the material mounting surface and close to the fixing member. Resilient means, a resilient means having a lower load than the resilient means for supporting a portion of the surface of the support member opposite to the surface on which the material is placed, which is far from the fixing member, and a support member for supporting the material. And a load means for applying a load toward the support member on the part on the side of the support member.
【０００９】従って、本発明ケガキ線で材料を分割する
装置にあっては、荷重手段により与えられる荷重による
応力は、弾発手段の作用により、ケガキ線に近い部分で
高く、ケガキ線から遠い部分で低くなり、これにより応
力がケガキ線に沿った部分に集中し、応力の分散による
クラックやズレの発生が防止され、また、良好なヘキ開
断面が得られ、歩留まり及び品質が向上する。Therefore, in the apparatus for dividing a material with a marking line according to the present invention, the stress caused by the load applied by the load means is high at a portion near the marking line and at a portion far from the marking line by the action of the resilient means. The stress is concentrated on the portion along the marking line, thereby preventing the occurrence of cracks and deviations due to the dispersion of the stress. In addition, a good open cross section is obtained, and the yield and quality are improved.
【００１０】別の本発明ケガキ線で材料を分割する装置
は、材料のケガキ線が形成された面と反対側の面のケガ
キ線に近い部分を支持する所定の荷重の弾発手段と、上
記材料のケガキ線が形成された面と反対側の面のケガキ
線に遠い部分を支持する上記弾発手段より低荷重の弾発
手段と、上記材料のケガキ線が形成された側の面にほぼ
上記弾発手段の方向へ荷重をかける荷重手段とを備えた
ものである。[0010] Another apparatus for dividing a material by a marking line according to the present invention comprises: a resilient means having a predetermined load for supporting a portion of the material on the side opposite to the surface on which the marking line is formed, the portion being close to the marking line; A resilient means having a lower load than the resilient means supporting a portion farther from the marking line on the surface opposite to the surface on which the marking line of the material is formed; Load means for applying a load in the direction of the resilient means.
【００１１】従って、この別の本発明ケガキ線で材料を
分割する装置にあっても、荷重手段により与えられる荷
重による応力は、弾発手段の作用により、ケガキ線に近
い部分で高く、ケガキ線から遠い部分で低くなり、これ
により応力がケガキ線に沿った部分に集中し、応力の分
散によるクラックやズレの発生が防止され、また、良好
なヘキ開断面が得られ、歩留まり及び品質が向上する。Therefore, even in the apparatus for dividing a material by the marking line of the present invention, the stress caused by the load applied by the load means is high in a portion close to the marking line due to the action of the resilient means, and the marking line is high. The stress is concentrated in the area along the marking line, which prevents cracks and deviations due to the stress distribution.Also, a good open cross section is obtained, improving the yield and quality. I do.
【００１２】[0012]
【発明の実施の形態】以下に、本発明ケガキ線で材料を
分割する方法及び装置の実施の形態を添付図面を参照し
て説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method and an apparatus for dividing a material by a marking line according to the present invention will be described below with reference to the accompanying drawings.
【００１３】図１に示すものは、例えば、半導体結晶基
板等の分割対象材料１の表面１ａに例えば、ダイヤモン
ドカッターによるケガキ線であるスクライブライン２を
形成し、支持部材であるクランパー３のクランプ部３ａ
によって上記分割対象材料１のスクライブライン２を境
にした一方の部分１′のスクライブライン２に近接した
部分を挟着保持し、スクライブライン２を境にした他方
の部分１″の裏面１ｂを支持板４の上に載置し、該支持
板４のスクライブライン２に近い側を所定の荷重のスプ
リング（弾発手段）５Ａで支持し、支持板４のスクライ
ブライン２から遠い部分を上記スプリング５Ａより低荷
重のスプリング（弾発手段）５Ｂで支持する。In FIG. 1, a scribe line 2 which is, for example, a marking line formed by a diamond cutter is formed on a surface 1a of a material 1 to be divided, such as a semiconductor crystal substrate, and a clamp portion of a clamper 3 which is a support member. 3a
This sandwiches and holds a portion of the part 1 'adjacent to the scribe line 2 on the scribe line 2 of the material 1 to be divided, and supports the back surface 1b of the other portion 1 "on the scribe line 2. The support plate 4 is placed on the plate 4, and a side of the support plate 4 near the scribe line 2 is supported by a spring (spring means) 5A having a predetermined load, and a portion of the support plate 4 far from the scribe line 2 is the spring 5A. It is supported by a lower load spring (spring means) 5B.
【００１４】その状態で、分割対象材料１の他方の部分
１″に上方から、すなわち、スクライブライン２を形成
した面１ａの側から図示しない荷重手段により図中矢印
の方向に荷重を加える。In this state, a load is applied to the other portion 1 ″ of the material 1 to be divided from above, that is, from the side of the surface 1a on which the scribe line 2 is formed, by a load means (not shown) in the direction of the arrow in the figure.
【００１５】これによって、上記荷重による応力が分割
対象材料１内に生じる。すなわち、上記荷重を反対側か
ら支えるスプリング５Ａ、５Ｂの作用により、より低荷
重のスプリング５Ｂによって支えられているスクライブ
ライン２から遠い部分では低応力が、また、より高荷重
のスプリング５Ａで支えられているスクライブライン２
に近い部分では高応力が生じ、この結果スクライブライ
ン２に沿って効果的に応力が集中し、クラックやズレが
生ずること無しにスクライブライン２に沿ってきれい
に、すなわち、良好なヘキ開断面をもって分割される。
そのため、歩留まりや品質が向上する。As a result, a stress due to the load is generated in the material 1 to be divided. That is, due to the action of the springs 5A and 5B that support the load from the opposite side, low stress is supported in a portion far from the scribe line 2 supported by the lower-load spring 5B, and also supported by the higher-load spring 5A. Scribe line 2
High stress is generated in a portion close to the scribe line, and as a result, the stress is effectively concentrated along the scribe line 2 and divided along the scribe line 2 without cracks or displacements, that is, with a good open section. Is done.
Therefore, yield and quality are improved.
【００１６】従って、例えば、サファイヤ基板のよう
に、分割のために高荷重を必要とし、スクライブ分割、
すなわち、ケガキ線による分割が困難とされている分割
対象材料に対してもスクライブ分割が可能となる。Therefore, for example, as in the case of a sapphire substrate, a high load is required for division, and scribe division,
That is, scribe division can be performed even on a division target material that is difficult to divide by a marking line.
【００１７】図２に示したものは、例えば、半導体結晶
基板等の分割対象材料１の表面１ａに例えば、ダイヤモ
ンドカッターによるケガキ線であるスクライブライン２
を形成し、該分割対象材料１の裏面１ｂに粘着シート６
を貼着する。FIG. 2 shows, for example, a scribe line 2 which is a marking line formed by a diamond cutter on a surface 1a of a material 1 to be divided such as a semiconductor crystal substrate.
Is formed on the back surface 1b of the material 1 to be divided.
Affix.
【００１８】そして、粘着シート６が貼着された分割対
象材料１の裏面１ｂをスプリング５、５、・・・によっ
て支持する。すなわち、スクライブライン２を境にした
２つの部分１′、１″、それぞれの部分の裏面１ｂのス
クライブライン２に近い部分を所定の荷重のスプリング
５Ａ、５Ａで支持し、スクライブライン２から遠い部分
を上記スプリング５Ａ、５Ａより低荷重のスプリング５
Ｂ、５Ｂで支持する。Then, the back surface 1b of the material to be divided 1 to which the adhesive sheet 6 is adhered is supported by springs 5, 5,. That is, the two portions 1 ', 1 "bordering the scribe line 2, the portions of the back surface 1b of each portion close to the scribe line 2 are supported by springs 5A, 5A of a predetermined load, and the portions far from the scribe line 2. The spring 5A having a lower load than the springs 5A and 5A
B, 5B.
【００１９】そして、分割対象材料１の表面、すなわ
ち、スクライブライン２が形成された面１ａの側から図
中矢印で示す方向に、すなわち、裏面１ｂ方向に、且
つ、２つの部分１′、１″をスクライブライン２を境に
離間させる方向に図示しない荷重手段によって荷重をか
ける。Then, from the surface of the material 1 to be divided, that is, the surface 1a on which the scribe line 2 is formed, in the direction indicated by the arrow in the figure, that is, in the direction of the back surface 1b, and the two portions 1 ', 1'"" Is applied by a load means (not shown) in a direction in which the "" is separated from the scribe line 2 as a boundary.
【００２０】これによって、上記荷重による応力が分割
対象材料１内に生じる。すなわち、上記荷重を反対側か
ら支えるスプリング５Ａ、５Ａ、５Ｂ、５Ｂの作用によ
り、より低荷重のスプリング５Ｂ、５Ｂによって支えら
れているスクライブライン２から遠い部分では低応力
が、また、より高荷重のスプリング５Ａ、５Ａで支えら
れているスクライブライン２に近い部分では高応力が生
じ、この結果スクライブライン２に沿って効果的に応力
が集中し、クラックやズレが生ずること無しにスクライ
ブライン２に沿ってきれいに、すなわち、良好なヘキ開
断面をもって分割される。そのため、歩留まりや品質が
向上する。As a result, a stress due to the load is generated in the material 1 to be divided. That is, due to the action of the springs 5A, 5A, 5B, and 5B that support the load from the opposite side, low stress is applied to a portion far from the scribe line 2 supported by the lower load springs 5B and 5B, and higher load is applied. High stress is generated in a portion near the scribe line 2 supported by the springs 5A, 5A, and as a result, stress is effectively concentrated along the scribe line 2, and the stress is applied to the scribe line 2 without generating cracks and displacement. Along the way, it is split with a good open section. Therefore, yield and quality are improved.
【００２１】なお、上記した実施の形態において、弾発
手段としてコイル状のスプリングを示したが、弾発手段
はコイルスプリングに限定されるものではない。また、
弾発手段として、より高荷重スプリング５Ａとより低荷
重スプリング５Ｂの２種類のスプリングを示したが、３
種類以上のスプリングを使用しても構わないし、また、
無段階で各部分の荷重が変化するものを使用しても構わ
ない。In the above embodiment, a coil spring is shown as the resilient means, but the resilient means is not limited to a coil spring. Also,
Two types of springs, a higher-load spring 5A and a lower-load spring 5B, have been shown as spring means.
You can use more than two kinds of springs,
It is also possible to use one in which the load of each part changes steplessly.
【００２２】また、本発明分割方法及び装置はサファイ
ヤ基板のようなスクライブ分割が困難な材料の分割に使
用して好適である旨を述べたが、本発明方法や装置はス
クライブ分割が比較的容易な材料、例えば、ガリウム砒
素（ＧａＡｓ）基板等の分割に用いても有効である。Also, while the method and apparatus of the present invention have been described as being suitable for use in dividing a material such as a sapphire substrate which is difficult to scribe, the method and apparatus of the present invention are relatively easy to scribe. It is also effective when used for dividing a material such as a gallium arsenide (GaAs) substrate.
【００２３】その他、上記した実施の形態において示し
た各部の形状乃至構造は、何れも本発明を実施するに際
して行う具体化のほんの一例を示したものに過ぎず、こ
れらによって、本発明の技術的範囲が限定的に解釈され
るようなことがあってはならないものである。In addition, the shapes and structures of the respective parts shown in the above-described embodiments are merely examples of the specific embodiments to be carried out when carrying out the present invention. The scope should not be construed as limiting.
【００２４】[0024]
【発明の効果】以上に記載したところから明らかなよう
に、本発明ケガキ線で材料を分割する方法は、対象とな
る材料に形成したケガキ線に沿って応力を加え該ケガキ
線に沿って材料を分割する材料分割方法であって、材料
のケガキ線を形成した面と反対側の面のケガキ線に近い
部分を所定の荷重の弾発手段で、また、ケガキ線に遠い
部分を上記弾発手段より低荷重の弾発手段で支持し、ケ
ガキ線を形成した面のケガキ線から離間した部分に荷重
をかけることを特徴とする。As is apparent from the above description, the method of dividing a material with a marking line according to the present invention applies a stress along the marking line formed on the target material and applies the material along the marking line. A part close to the marking line on the surface opposite to the surface on which the marking line is formed by means of a predetermined load resilient means, and a part far from the marking line by the resilient means. It is characterized in that it is supported by a resilient means having a lower load than the means, and a load is applied to a portion of the surface on which the marking line is formed, which is separated from the marking line.
【００２５】従って、本発明ケガキ線で材料を分割する
方法にあっては、材料に与えられた荷重による応力は、
弾発手段の作用により、ケガキ線に近い部分で高く、ケ
ガキ線から遠い部分で低くなり、これにより応力がケガ
キ線に沿った部分に集中し、応力の分散によるクラック
やズレの発生が防止され、また、良好なヘキ開断面が得
られ、歩留まり及び品質が向上する。Therefore, in the method of dividing a material by the marking wire according to the present invention, the stress caused by the load applied to the material is:
Due to the action of the resilient means, it is high in the part near the marking line and low in the part far from the marking line, whereby the stress is concentrated on the part along the marking line, preventing the occurrence of cracks and deviations due to the dispersion of stress. Also, a good open section is obtained, and the yield and quality are improved.
【００２６】請求項２に記載した発明にあっては、ケガ
キ線を境にして一方の部分を固定し、他方の部分を上記
弾発手段で支持すると共に荷重をかけるようにしたの
で、簡単な構成で、ケガキ線に沿った部分に応力を集中
させることができる。According to the second aspect of the present invention, one part is fixed with the marking line as a boundary, and the other part is supported by the resilient means and a load is applied. With this configuration, stress can be concentrated on a portion along the marking line.
【００２７】請求項３に記載した発明にあっては、ケガ
キ線を境にして両側の部分をそれぞれ上記弾発手段で支
持すると共に荷重をかけるようにしたので、簡単な構成
で、ケガキ線に沿った部分に応力を集中させることがで
きる。According to the third aspect of the present invention, since both sides of the marking line are supported by the resilient means and a load is applied to the marking line, the marking line has a simple structure. The stress can be concentrated on the portion along the line.
【００２８】本発明ケガキ線で材料を分割する装置は、
ケガキ線を形成された材料のケガキ線を境にした一方の
部分を固定支持する固定部材と、上記材料のケガキ線を
境にして他方の部分のケガキ線が形成された面と反対側
の面を支持する支持部材と、上記支持部材の材料載置面
と反対側の面の上記固定部材に近い部分を支持する所定
の荷重の弾発手段と、上記支持部材の材料載置面と反対
側の面の上記固定部材に遠い部分を支持する上記弾発手
段より低荷重の弾発手段と、上記材料の上記支持部材に
支持された側の部分に支持部材の方に向かって荷重をか
ける荷重手段とを備えたことを特徴とする。The apparatus for dividing a material with a marking wire according to the present invention comprises:
A fixing member for fixing and supporting one portion of the material having the marking line as a boundary, and a surface opposite to the surface of the material having the marking line as the other side. A supporting member for supporting the supporting member, a resilient means of a predetermined load for supporting a portion of the surface of the supporting member opposite to the material mounting surface near the fixing member, and a side opposite to the material mounting surface of the supporting member. A resilient means having a lower load than the resilient means for supporting a portion of the surface far from the fixing member, and a load for applying a load toward the support member on a portion of the material supported by the support member Means.
【００２９】従って、本発明ケガキ線で材料を分割する
装置にあっては、荷重手段により与えられる荷重による
応力は、弾発手段の作用により、ケガキ線に近い部分で
高く、ケガキ線から遠い部分で低くなり、これにより応
力がケガキ線に沿った部分に集中し、応力の分散による
クラックやズレの発生が防止され、また、良好なヘキ開
断面が得られ、歩留まり及び品質が向上する。Therefore, in the apparatus for dividing a material with a marking line according to the present invention, the stress due to the load applied by the load means is high at a portion near the marking line and at a portion far from the marking line due to the action of the resilient means. The stress is concentrated on the portion along the marking line, thereby preventing the occurrence of cracks and deviations due to the dispersion of the stress. In addition, a good open cross section is obtained, and the yield and quality are improved.
【００３０】また、別の本発明ケガキ線で材料を分割す
る装置は、材料のケガキ線が形成された面と反対側の面
のケガキ線に近い部分を支持する所定の荷重の弾発手段
と、上記材料のケガキ線が形成された面と反対側の面の
ケガキ線に遠い部分を支持する上記弾発手段より低荷重
の弾発手段と、上記材料のケガキ線が形成された側の面
にほぼ上記弾発手段の方向へ荷重をかける荷重手段とを
備えたことを特徴とする。Further, another apparatus for dividing a material with a marking line according to the present invention comprises a resilient means having a predetermined load for supporting a portion near the marking line on a surface of the material opposite to the surface on which the marking line is formed. A resilient means having a lower load than the resilient means for supporting a portion of the material opposite to the surface on which the marking line is formed, which is far from the marking line, and a surface on the side on which the marking line of the material is formed. And a load means for applying a load substantially in the direction of the resilient means.
【００３１】従って、この別の本発明ケガキ線で材料を
分割する装置にあっても、荷重手段により与えられる荷
重による応力は、弾発手段の作用により、ケガキ線に近
い部分で高く、ケガキ線から遠い部分で低くなり、これ
により応力がケガキ線に沿った部分に集中し、応力の分
散によるクラックやズレの発生が防止され、また、良好
なヘキ開断面が得られ、歩留まり及び品質が向上する。Therefore, even in the apparatus for dividing a material by the marking wire of the present invention, the stress caused by the load applied by the load means is high in a portion close to the marking wire due to the action of the resilient means, and the marking wire is high. The stress is concentrated in the area along the marking line, which prevents cracks and deviations due to the stress distribution.Also, a good open cross section is obtained, improving the yield and quality. I do.
【図１】本発明ケガキ線で材料を分割する方法及び装置
の実施の形態を示す概略側面図である。FIG. 1 is a schematic side view showing an embodiment of a method and an apparatus for dividing a material by a marking line according to the present invention.
【図２】本発明ケガキ線で材料を分割する方法及び装置
の別の実施の形態を示す概略側面図である。FIG. 2 is a schematic side view showing another embodiment of a method and an apparatus for dividing a material by a marking line according to the present invention.
【図３】従来のケガキ線で材料を分割する方法を示す概
略側面図である。FIG. 3 is a schematic side view showing a conventional method for dividing a material by a marking line.
【図４】従来のケガキ線で材料を分割する別の方法を示
す概略側面図である。FIG. 4 is a schematic side view showing another method of dividing a material by a conventional marking line.
１…分割対象材料（材料）、１ａ…ケガキ線を形成した
面、１ｂ…ケガキ線をを形成した面と反対側の面、１′
…ケガキ線を境にした一方の部分、１″…ケガキ線を境
にした他方の部分、２…スクライブライン（ケガキ
線）、３…クランパー（固定手段）、４…支持板（支持
手段）、５Ａ…より高荷重のスプリング（高荷重の弾発
手段）５Ｂ…より低荷重のスプリング（低荷重の弾発手
段）1 ... material to be divided (material), 1a ... surface on which the marking line is formed, 1b ... surface opposite to the surface on which the marking line is formed, 1 '
.., One part bordered by the scribe line, 1 ″: the other part bordered by the scribe line, 2—scribe line (marked line), 3—clamper (fixing means), 4—support plate (support means), 5A: Higher load spring (high load resilient means) 5B: Lower load spring (low load resilient means)
Claims (5)
って応力を加え該ケガキ線に沿って材料を分割する材料
分割方法であって、 材料のケガキ線を形成した面と反対側の面のケガキ線に
近い部分を所定の荷重の弾発手段で、また、ケガキ線に
遠い部分を上記弾発手段より低荷重の弾発手段で支持
し、 ケガキ線を形成した面のケガキ線から離間した部分に荷
重をかけることを特徴とするケガキ線で材料を分割する
方法。1. A material dividing method for applying a stress along a marking line formed on a target material to divide the material along the marking line, the surface being opposite to the surface on which the marking line of the material is formed. The part close to the marking line is supported by a resilient means of a predetermined load, and the part far from the marking line is supported by resilient means having a lower load than the resilient means, and is separated from the marking line on the surface on which the marking line is formed. A method of dividing a material with a scribe line, wherein a load is applied to a portion that has been cut.
し、 他方の部分を上記弾発手段で支持すると共に荷重をかけ
ることを特徴とする請求項１に記載のケガキ線で材料を
分割する方法。2. The material is divided by the scribe line according to claim 1, wherein one part is fixed with the scribe line as a boundary, and the other part is supported by the resilient means and a load is applied. how to.
れ上記弾発手段で支持すると共に荷重をかけることを特
徴とする請求項１に記載のケガキ線で材料を分割する方
法。3. The method according to claim 1, wherein both sides of the marking line are supported by the resilient means and a load is applied.
境にした一方の部分を固定支持する固定部材と、 上記材料のケガキ線を境にして他方の部分のケガキ線が
形成された面と反対側の面を支持する支持部材と、 上記支持部材の材料載置面と反対側の面の上記固定部材
に近い部分を支持する所定の荷重の弾発手段と、 上記支持部材の材料載置面と反対側の面の上記固定部材
に遠い部分を支持する前記弾発手段より低荷重の弾発手
段と、 上記材料の上記支持部材に支持された側の部分に支持部
材の方に向かって荷重をかける荷重手段とを備えたこと
を特徴とするケガキ線で材料を分割する装置。4. A fixing member for fixing and supporting one portion of the material having the marking line formed by the marking line, and a surface of the other portion having the marking line formed by the marking line of the material. A support member for supporting a surface opposite to the fixing member; and a resilient means of a predetermined load for supporting a portion of the surface opposite to the material mounting surface of the support member, the portion being close to the fixing member. A resilient means having a lower load than the resilient means for supporting a portion of the surface opposite to the mounting member, the part being farther from the fixing member; and a portion of the material on the side supported by the support member toward the support member. And a load means for applying a load.
の面のケガキ線に近い部分を支持する所定の荷重の弾発
手段と、 上記材料のケガキ線が形成された面と反対側の面のケガ
キ線に遠い部分を支持する上記弾発手段より低荷重の弾
発手段と、上記材料のケガキ線が形成された側の面にほ
ぼ上記弾発手段の方向へ荷重をか ける荷重手段とを備えたことを特徴とするケガキ線で材
料を分割する装置。5. A resilient means having a predetermined load for supporting a portion near the marking line on a surface opposite to the surface on which the marking line is formed on the material, and a side opposite to the surface on which the marking line on the material is formed. A resilient means having a lower load than the resilient means supporting the portion of the surface far from the marking line, and a load for applying a load substantially in the direction of the resilient means on the surface on which the marking line of the material is formed; Means for dividing a material by a marking line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000060240A JP2001250798A (en) | 2000-03-06 | 2000-03-06 | Method and apparatus for dividing material along scribing line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000060240A JP2001250798A (en) | 2000-03-06 | 2000-03-06 | Method and apparatus for dividing material along scribing line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001250798A true JP2001250798A (en) | 2001-09-14 |
Family
ID=18580585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000060240A Pending JP2001250798A (en) | 2000-03-06 | 2000-03-06 | Method and apparatus for dividing material along scribing line |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001250798A (en) |
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| JP2001179732A (en) | Scribing apparatus |