JP2001237266A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001237266A5 JP2001237266A5 JP2000045689A JP2000045689A JP2001237266A5 JP 2001237266 A5 JP2001237266 A5 JP 2001237266A5 JP 2000045689 A JP2000045689 A JP 2000045689A JP 2000045689 A JP2000045689 A JP 2000045689A JP 2001237266 A5 JP2001237266 A5 JP 2001237266A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000045689A JP2001237266A (en) | 2000-02-23 | 2000-02-23 | Semiconductor chip and its mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000045689A JP2001237266A (en) | 2000-02-23 | 2000-02-23 | Semiconductor chip and its mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001237266A JP2001237266A (en) | 2001-08-31 |
| JP2001237266A5 true JP2001237266A5 (en) | 2007-01-11 |
Family
ID=18568229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000045689A Pending JP2001237266A (en) | 2000-02-23 | 2000-02-23 | Semiconductor chip and its mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001237266A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5151053B2 (en) * | 2006-03-30 | 2013-02-27 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
| JP5533367B2 (en) * | 2010-07-07 | 2014-06-25 | 日本電気株式会社 | Electronic component mounting structure and mounting method |
| US10274270B2 (en) | 2011-10-27 | 2019-04-30 | Applied Materials, Inc. | Dual zone common catch heat exchanger/chiller |
| CN104508843B (en) * | 2012-04-20 | 2017-04-26 | 伦斯勒理工学院 | Method for assembling one row of light emitting diode bare chips on substrate |
| JP6334945B2 (en) * | 2014-02-17 | 2018-05-30 | スタンレー電気株式会社 | Semiconductor light emitting device, semiconductor light emitting element, and method for manufacturing semiconductor light emitting device |
| JP2016018966A (en) * | 2014-07-11 | 2016-02-01 | スタンレー電気株式会社 | Semiconductor optical element and element dispersion solution |
| JP2018503986A (en) * | 2015-07-14 | 2018-02-08 | ゴルテック．インク | Micro light emitting diode transport method, manufacturing method, micro light emitting diode device, and electronic apparatus |
| KR102260638B1 (en) * | 2019-09-26 | 2021-06-04 | 엘지전자 주식회사 | Self assembly device for semiconductor light emitting device |
| WO2021084783A1 (en) * | 2019-10-31 | 2021-05-06 | アルディーテック株式会社 | Semiconductor chip integrated device manufacturing method, semiconductor chip integrated device, semiconductor chip integrated device assembly, semiconductor chip ink, and semiconductor chip ink ejection device |
| JP6842783B1 (en) * | 2019-10-31 | 2021-03-17 | アルディーテック株式会社 | Manufacturing method of micro LED display and micro LED display |
-
2000
- 2000-02-23 JP JP2000045689A patent/JP2001237266A/en active Pending